PZGLI007-品质管理-设备供应商目录 (1)

Abrasion resistance耐磨(擦)性abrasive磨料accelerated test加速试验Acceleration增速acceleration agent增速剂accelerator增速剂acceptable quality level可接收质量水平acceptance tests验收试验acid dipping弱浸蚀Activating敏化activating agent活化剂activator活化剂active devices有源器件active parts有源器件addition agent添加剂additive添加剂Additive process加成法add-on component附加元件Adhensive胶粘剂aging老化air inclusion夹杂气泡Alignment mark对准标记ALIVH任意层内部导通孔ALIVH Multilayer printd board层间全内导通多层印制板alkaline degreasing化学除油alloy plating合金电镀anti-foamer agent消泡剂any layer inner via hole任意层内部导通孔AOI自动光学检验AQL可接收质量水平Arry阵列Artwork照相底图Artwork master照相原版as received验收态assembly density组装密度A-stage resin A 阶树脂automatic optional inspection自动光学检验Auxiliary anode辅助阳极Auxiliary cathode辅助阴极B2it嵌入凸块互连技术B2it printd board埋入凸块互连印制板Backplane背板back-up垫板ball grid array球栅阵列ball grill array球栅阵列Bare board裸板barrel plating滚镀Base material基材Bendability弯曲能力bevelling倒斜边BGA球栅阵列black oxidation黑氧化bleeding渗出Blind hole盲孔Blind via盲孔blister起泡blow hole气孔bond焊（连）接Bond strength粘合强度bonding layer粘结片/粘结层Bonding sheet粘结片/粘结层Bow弓曲Break-away board可断拼板break-out破出bright dip浸亮bright plating光亮电镀brightening agent光亮剂brightener光亮剂brown oxidation棕氧化brush plating刷镀brushing磨刷B-stage resin B 阶树脂bugle hole喇叭孔Build up process积层法build-up multilayer积层式多层板Build-up printed board积层印制板build-up technology积层式技术bulge凸起BUM积层式多层板bump凸瘤Buried and blind via hole mutilayerboard埋/盲孔多层板Buried bump interconnectiontechnology嵌入凸块互连技术Buried hole埋孔Buried via埋孔Buried/ blind via埋/盲孔burr毛刺BUT积层式技术C -stage resin C 阶树脂CAD计算机辅助设计CAM计算机辅助制造Capacitance电容catalyst催化剂catalyzer催化剂Catalyzing催化CCL覆铜箔层压板chamfer倒角Chase网框chelating agent螯合剂chelating agent螯合剂chemical clearing化学清洗chemical corrosion化学腐蚀chemical polishing化学抛光Chemical resistance耐化学性Chemisorption化学吸附China Printed Circuit Association中国印制电路行业协会chip裸芯片chip carrier芯片载体chip mount technology芯片安装技术Chip on board载芯片板chip scale mounting芯片级组装chip scale package芯片级组装chip scale packaging芯片级封装chip-on-board载芯片板Clad覆箔Cleanliness清洁度cloth丝网CMT芯片安装技术CNC计算机数字控制COB载芯片板Coefficient of thermal expansion热导率collar钻套complex络和物Component density元件密度Component hole元件孔Component lead元件导向Component side元件面computer aided manufacturing计算机辅助制造computer numerical control计算机数字控制Computer-aided design计算机辅助设计Computer-aided manufacturing计算机辅助制造Conductive paste导电膏Conductive pattern导电图形Conductor导线Conductor layer导线层Conductor race line导线Conductor side导线面Conductor spacing导线间距Conductor width/space导线宽度/间距Conductor with导线宽度Coplanarity共面性（度）copper clad laminate覆铜箔层压板Copper electro plating电镀铜Copper foil铜箔Copper plating电镀铜Copper-clad laminate覆铜箔层压板Copper-clad surface铜箔面Core material内层芯材/芯板counterboring沉头孔（埋头孔）countersinking锥形孔coupon附连板CPCA中国印制电路行业协会cracking裂缝crazing微裂纹crease皱褶/褶痕cross wise direction横向Crosstalk串扰CSP芯片级封装CTE热导率Curing agent固化剂Curing time固化时间curtain coating帘幕法cutting冷冲deburring去披峰/去毛刺defect缺陷definition逼真度deionized water去离子水delamination分层delivered panel发货拼板dent压痕Desmear去钻污developer显影液developing显影Dewetting半润湿DI直接成像法Diazo film重氮底片dice裸芯片die冲模die裸芯片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric strength介电强度Dielectric withstanding voltage耐电压diluent稀释剂Dimensional stability尺寸稳定性dip coating浸涂法direct imaging直接成像法Direct plating直接电镀dishdown凹陷DIW去离子水double-sided board双面印制板double-sided printed circuit board双面印制电路板DP发货拼板drag in带进drag out带出drilling钻孔dross焊渣Dry film imaging干膜制图形Dry film photoresist干膜光致抗蚀剂Dry film solder mask阻焊干膜DSB双面印制板electrical bridging电桥接Electro migration电迁移electrochemical corrosion电化学腐蚀electrochemistry电化学Electro-deposited photoresist电沉积光致抗蚀剂Electroless copper plating化学沉铜electroless deposition无电电镀Electroless plating无电电镀electrolyte电解质electrolytic cleaning电解清洗electrolytic degreasing电解除油electrolytic solution电解液electromagnetic interference电磁干扰Electromagnetic shielding电磁屏蔽electronic manufacturing service电子制造部门electroplating电镀electropolishing电抛光Eletrodeposited copper foil电解铜箔embedded component埋入元件EMI电磁干扰EMS电子制造部门EMT电磁干扰End product最终产品entry material盖板Epoxy glass substrate环氧玻璃基板epoxy resin环氧树脂etch back凹蚀阴影etchant蚀刻剂/蚀刻液Etchback凹蚀Etching resist ink抗蚀印料Exposure曝光Fabric丝网Fatigue life疲劳寿命Fatigue limit疲劳极限Fatigue strength疲劳强度FCP倒芯片封装feed rate进给速率fiber exposure露纤维Fine pitch精细节距fine pitch devices精细节距器件fine-pitch technology精细间距技术Finishing最终修饰First article首板Fixture夹具Flame retardant阻燃剂flash闪镀flash plating闪镀Flexible printed circuit board挠性印制电路板Flex-rigid printed circuit board刚挠性印制电路板Flexural strength弯曲强度flip chip倒装芯片flip chip package倒芯片封装flip chip packaging倒芯片封装flux助焊剂foil burr铜箔毛刺Foil removal surface去铜箔面foreign material（基材内）外来物FPD精细节距器件FPT精细间距技术frame网框Full-additive process全加成法fusing fluid热熔液Gerber file Gerber文件ghost image重影Glass fabric玻璃布Glass fiber玻璃纤维glass transition temperature玻璃化温度grid网格HAL热风整平halation晕环haloing晕圈HALS热风整平hardness硬度heat cured热固化Heat resistance耐热性holding time停留时间hole breakout破环Hole cleaning洗孔Hole conditioning整孔hole counter数孔机Hole filing ink堵孔油墨Hole pull strength孔拉脱强度hole void孔壁空洞hot air levelling热风整平hot melting热熔IC集成电路Imaging成像Imaging transfer图像转移Immersion plate浸镀Impedance特性阻抗indentation压痕Indexing hole基准孔Inductance电感inner interstitial via hole内部导通孔Innerlayer connection内层连接inspection检验institute for interconnecting andpackaging electronic ciruit (US)(美国)电子电路互连与封装协会integrated circuit集成电路Interconnection互连Interfacial connection表面间连接Interlayer connection层间连接Ionic cleanliness离子清洁度Ionizable contaminant离子污染ionization电离IPC（美国）电子电路互连与封装协会IVH内部导通孔Job traveller工作流程单KGB已知好板Known good board已知好板kraft paper牛皮纸Laminate层压板laminate void层压空洞laminating层压Lamination贴膜lamination void层间空洞land连接盘Landless hole无连接盘导通孔laser direct imaging激光直接成像Laser platting激光绘图Laser plotter激光绘图机laser via hole激光钻孔Layer to layer registration层间重合度Layout布图设计Layup叠层LCD液晶显示器lead引线lead foot / lead引脚（腿）lead pitch引脚节距Legend字符Length wise direction纵向levelling agent整平剂lifted land连接盘起翘liquid crysal display液晶显示器Liquid photoresist液体光致抗蚀剂Liquid photosensitive solder resist液体光致阻焊剂Lot size/ batch批量Machinability机械加工性Mark标志Marking ink、legend ink标记印料Mask掩膜MCM多芯片模块mealing粉点measling白斑mechanical cleaning机械清洗mechanical polishing机械抛光Mentallization金属化Mesh count网目数metal electroplating金属电沉积Metal migration金属迁移microetch微蚀Microsectioning显微剖切migration迁移MLB多层印制电路板Mounting hole安装孔Multichip module多芯片模块multilayer board多层板Multilayer printed circuit board多层印制电路板nail heading钉头NC数控Negative负像Negative pattern负像图形Negative-acting resist负性抗蚀剂nick缺口node连接节点nodule结瘤Non- conductive pattern非导电图形nonconforming item不合格品nonconforming unit不合格品nonconformity不合格Nonionic contaminant非离子污染Nonwetting不润湿Non-woven fabric非织布/无纺布numerical control数字控制OEM原设备制造商off set钻面不匀opaquer遮光剂opening/daylight开档orange peel桔皮Organic contamination有机污染organic solderability preservatives有机保护剂original equipment manufacturer原设备制造商OSP有机保护剂Outgassing排气over etching过腐蚀overflow溢流Pad连接盘Panel在制板，拼板Panel plating整板电镀Panel plating process板面电镀法passivation钝化passive devices无源器件passive parts无源器件pattern图形Pattern plating图形电镀Pattern plating process图形电镀法PC过程控制PCB印制电路板Peel strength剥离强度Peelable solder mask ink可剥性防焊油墨peeling起皮Permanent resist永久性保护层PET聚酯薄膜Photo plotting光绘图Photo resist光致抗蚀剂photo via hole光致穿孔Photographic film照相底片Photoplotter光绘机Photosensitive resin感光性树脂Phototool照相底版PI聚酰亚胺薄膜pickling强浸蚀pilot hole定位孔pin hole针孔Pink ring粉红圈（环）pit麻点Pitch节距pits麻点plasma等离子体Plasma desmear等离子去钻污plasma via hole等离子穿孔Plated resist抗蚀镀层plated through hole镀通孔／金属化孔platen热压板Plating镀覆Plating line电镀线Plating resist耐电镀抗蚀剂Plating resist ink耐电镀印料Plating up电镀加厚Polyester film聚酯薄膜polyimide聚酰亚铵Polyimide film聚酰亚胺薄膜Polymer聚合物Polymerize聚合Polytetrafluoetylene聚四氟乙烯polytetrafluoetylene or teflon聚四氟乙烯（特氟隆）pores针孔porosity孔隙率Porosity test孔隙率试验Positive正像Positive pattern正像图形Positive-acting resist正性抗蚀剂post cure后固化Post plating镀后处理pot life适用期preflux预焊剂Preplating镀前处理Prepreg预浸材料press plate压模板Primary side主面Printed circuit印制电路Printed circuit board印制电路板Printed component印制元件Printed contact印制接点Printed wiring印制线路printed wiring assembly印制线路组装件printed wiring board印制线路板Printing印制Printing ink印料process control过程控制Process flow工艺流程Process window工艺范围production board成品板Production master生产底版Prototype试样板PTFE聚四氟乙烯（特氟隆）PTH镀通孔／金属化孔Pull away拉离Pull strength拉离强度Pull-off strength拉脱强度Pull-out strength拉出强度pulse plating脉冲电镀pumice power浮石粉/火山灰punching冲切PWA印制线路组装件PWB印制线路板qualification testing鉴定试验quality conformance testing质量一致性试验rack plating挂镀radio-frequency interference射频干扰RCC涂树脂铜箔Real estate基板面reflow soldering再流焊Registration mark对位标记Registration mark定位标记residue残留物resin coated copper foil涂树脂铜箔Resin content树脂含量resin flux树脂（松香）助焊剂resin recession树脂凹缩resin smear树脂钻污Resinflow树脂流动度Resist抗蚀剂resolution分辨率Reworking返工RFI射频干扰Rigid printed circuit board刚性印制电路板ring钻套rinse水洗rinsing水洗Rolled copper foil压延铜箔roller coating辊涂法Roughening粗化Routing布线routing铣切sampling inspection抽样检验sand blasting喷砂scoring刻槽scratch划痕Screen printing网版印刷Screenability网印能力scrubber磨刷机scrubbing磨刷Secondary side辅面selective plating选择性电镀Self-extinguishing自熄性Semi-additive process半加成法Sequential lamination顺序层压法Sewing hole缝纫孔shadowing凹蚀阴影Shear strength剪切强度shearing冷冲shelf life保存期Signal layer信号层Silk screen丝印网版Silver film银盐底片Single-sided printed circuit board单面印制电路板SIR表明绝缘电阻Skip printing漏印SLC表面层合电路板SMC表面组装元件smear removal去钻污SMOBC裸铜箔阻焊工艺SMT表面组装技术solder焊锡solder coat焊锡涂层solder levelling焊料整平solder mask阻焊剂Solder mask ink阻焊印料solder mask on bare copper裸铜箔阻焊工艺Solder resist阻焊剂Solder side焊接面Solderability可焊性soldering焊接solubility溶解度SPC统计过程控制specification规范spindle主轴spray coating喷涂法Squeegee刮板SSB单面印制电路板standard标准statistical process control统计过程控制Stencil网版storage life贮存期stress relief消除应力strike plating冲击镀stripper剥离液Substrate基底Substrate bending test基板弯曲试验Subtractive process减成法Supported hole支撑孔surface active agent表面活性剂Surface insulation resistance表明绝缘电阻Surface laminar circuit表面层合电路板surface mount component表面组装元件surface mount technology表面组装技术surface mounting technology表面安装技术surface tension表面张力surfactant表面活性剂sweller膨松剂Swelling溶胀swelling agent膨松剂tackiness粘着性tarnish金属变色/污化Tear strength撕裂强度Tensile strength拉伸强度Tenting掩蔽法test试验test board测试板TG玻璃化温度Thermal shock热冲击Thermal stress热应力Thermally curable热固化Thermoplastic热塑性Thermoplastic resin热塑性树脂Thermoset热固性Thermosetting resin热固性树脂Thin type multilayer board薄型多层板Thinner稀释剂tin immersion浸锡Tin-lead plating电镀锡铅tolerance容差/公差Tooling feature工艺标识Tooling feature定位特征Tooling hole定位孔Torsional strength抗扭强度Twist扭曲Ultraviolet curable紫外线固化under etch侧蚀Unsupported hole非支撑孔UV cured紫外线固化V cutＶ槽切割Via导通孔Via-in-pad在连接盘中导通孔Viscosity粘度visual examination目检visual inspection目检void空洞Warp-wise经向wave soldering波峰焊Wear resistance耐磨(损)性Weft-wise纬向Wet lamination湿法贴膜Wet process湿处理wetting润湿Wetting焊料润湿wetting agent润湿剂wetter润湿剂width/space宽度/间距working life适用期Working master工作原版wrinkle皱褶。

目录一、主管副总工作职责范围…………………………………（第2页）二、总工程师工作职责范围…………………………………（第3页）三、项目总监工作职责…………………………………（第4页）三、工程部工作职责范围…………………………………（第5页）四、工程部经理工作职责范围……………………………（第6页）五、工程部土建副经理工作职责范围………………………（第7页）六、工程部安装副经理工作职责范围………………………（第8页）七、现场项目部经理工作职责范围…………………………（第9页）八、土建工程师工作职责范围………………………………（第10页）九、电气工程师工作职责范围………………………………（第11页）十、水暖工程师工作职责范围………………………………（第12页）十一、资料员工作职责范围…………………………………（第13页）附表：现有工程管理人员岗位对照表………………………（第13页）主管副总职责1、本岗位工作对总经理、董事长负责。

2、负责组织立项论证、项目策划、可研、销售策划审核，组织设计方案审定，督导施工过程管理。

3、负责对分管副总、总工工作进行指导、安排、检查。

4、负责对工程部、计划预算部、项目部等各专业部门的工作进行指导、检查。

5、对公司有关工程方面的招标、材料、设备、施工分包、总包合同的审定。

6、负责对工程及与工程相关的预算、中间结算及竣工结算的检查审定。

7、负责组织公司办公会、职工大会及临时专题会议。

8、负责协调处理公司突发事件及其结果汇报。

9、负责对公司各部门的人员增减、调整及工资待遇建议的提出。

10、负责对本公司年度、月度工作计划的制定、督促检查。

11、协调公司各部门关系，督促检查各部门工作。

12、编写年终工作报告，提出公司发展规划。

总工程师职责1、全面负责工程项目的质量、安全、进度及造价管理。

2、负责组织立项论证、可行性研究、用地规划、建筑设计、图纸审查的协调管理工作，保证项目各阶段规划、建筑设计工作按期保质完成。