SHARP夏普EL-2128V_(中、英、日文说明书)
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iWnn IME © OMRON SOFTWARE Co., Ltd. 2009-2010 All Rights Reserved.2简介目录简介 (1)第 1 章:入门 (9)您的手机 (9)附件 (11)安装 SIM 卡、电池和microSD卡 (11)SIM 卡 (12)电池 (12)SD卡 (14)为电池充电 (15)使用耳机 (15)打开或关闭手机 (16)第 2 章:基本介绍 (17)主屏幕 (17)解锁界面 (17)主页界面 (18)主页界面视图 (19)主页界面管理 (19)小工具界面 (20)小工具界面管理 (20)设置壁纸 (21)状态栏图标 (22)查看通知图标详细信息 (24)调整音量 (24)目录3第 3 章:通话 (26)拨打电话 (26)接听电话 (27)结束通话 (28)第 4 章:文字输入 (29)键盘视图 (30)基本输入 (31)输入选项 (31)全键盘模式/数字键盘模式 (31)设置输入法 (32)更改输入法 (32)第 5 章:通讯录 (33)添加联系人 (33)搜索联系人 (34)导入联系人 (34)导出联系人 (35)常用联系人 (36)第 6 章:信息和电子邮件 (37)文字信息 (37)创建和发送文字信息 (37)接收和管理信息 (39)多媒体信息 (42)创建和发送多媒体信息 (42)语音信息 (44)4目录首次设置电子邮件帐户 (45)添加电子邮件帐户 (46)访问电子邮件帐户 (46)编写和发送电子邮件 (47)接收电子邮件 (48)阅读和回复电子邮件 (48)管理电子邮件文件夹 (49)自定义电子邮件设置 (50)第 7 章:浏览器 (52)基本导航 (53)浏览器设置 (57)第 8 章:连接 (59)WLAN (59)蜂窝数据网络 (61)启动数据连接 (62)蓝牙 (63)第 9 章:多媒体应用程序 (65)相机 (65)拍摄图片 (65)查看拍摄的图片 (66)相机设置 (67)摄像机 (68)拍摄视频 (68)视频播放 (69)摄像机设置 (70)目录5查看图库中的图片 (71)使用图库中的图片 (72)编辑图库中的图片 (73)播放图库中的视频 (73)调用相机拍照 (73)音乐播放器 (74)音乐播放器屏幕 (74)播放音乐 (76)播放选项 (76)删除音乐库歌曲 (77)第 10 章:应用程序 (78)浏览器 (80)计算器 (80)日历 (81)相机 (82)时钟 (82)通讯录 (84)电子邮件 (84)文件管理器 (85)管理文件和文件夹 (85)图库 (86)信息 (86)音乐 (86)记事本 (87)点心新闻 (88)电子书 (89)设置 (90)6目录录音机 (91)第 11 章:管理手机 (92)手机设置 (92)无线和网络 (92)通话设置 (93)声音和显示 (93)位置和安全 (94)应用程序 (95)帐户与同步 (95)隐私权 (95)SD卡和手机内存 (96)搜索 (96)语言和键盘 (96)日期和时间 (96)设置向导 (97)关于手机 (97)基本设置 (98)日期和时间 (98)显示设置 (98)铃声设置 (99)无线设置 (100)保护手机 (101)启用或禁用 SIM 卡 PIN码 (101)重设手机 (102)备份与恢复 (103)目录7售后服务智能注册功能说明 (104)安全预防措施和使用条件 (105)索引 (111)8目录第 1 章:入门1.1您的手机1.听筒2.触摸屏3.返回键 - 按它可以返回到上一个菜单。
丨丨夏普F1CL使用说明书●复印:原稿字面朝上放好,按一下“复印”键,就可以复印出●发传真:原稿字面朝上放好,拨通对方的传真号,听到对方给的信号后,按一下“传真”给对方信号。
●收传真:听到电话响后或通完话,提起电话按一下“传真”键给对方信号。
●自动接收:留守灯不亮为自动接收。
留守灯亮为手动接收。
●振铃次数:登录—3011—输入次数—传真键—停止键返回。
●关日语:登录—3022—停止键返回。
●时间设定:登录—11—输入正确的年月日时间—传真键—停止键返回。
●音频设定:登录—142—停止键返回。
●录制留守提示:应答/消去键2次—数字1—提起电话—传真键—开始录音—录完挂电话。
●删去留守提示:应答/消去键3次—数字键1—传真键。
●将留守提示转入留守:按留守键—按#。
●留守灯亮时振铃次数:登录—2082—输入次数—传真键—停止返回。
●留守灯灭时振铃次数:登录—3011—输入次数—传真键—停止返回。
●通话录音:在通话的过程中按一下“再生/录音”键。
●播放留言或录音:按一下“再生/录音”键●删去留言或录音:按一下“应答/消去”键●扫描:取下扫描器,按一下复印键,然后压住原件匀速移动,扫描完后按一下停止键,先别放回机上,灯灭后等下会自动打印出来。
再装回●主机拨打子机:提起电话—内线/保留键—按数字键1(看是几号子机,2号就是2)。
●子机拨打主机:内线/保留键—数字键0.●子机接收传真:子机接通后按子机上”机能”键给信号特殊设定:接收自动缩小设定(节约用纸):登录----3191登录----3192为等倍比例接收放大复印:放好原稿---按"选择"键一次(功能键左边)----按复印缩小复印:放好原稿---按"选择"键两次(功能键左边)----按复印黑白反转复印:放好原稿---按"选择"键三次(功能键左边)----按复印。
REFERENCE1. ApplicationThis specification applies to the outline and characteristics of photocoupler Model No. PC817series(Lead-Free Type).2. Outline Refer to the attached sheet, page 4.3. Ratings and characteristics Refer to the attached sheet, page 5, 6.4. Reliability Refer to the attached sheet, page 7.5. Outgoing inspection Refer to the attached sheet, page 8.6. Supplement 6.1 Isolation voltage shall be measured in the following method.(1) Short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) The dielectric withstanding tester with zero-cross circuit shall be used. (3) The wave form of applied voltage shall be a sine wave.(It is recommended that the isolation voltage be measured in insulation oil.)6.2 Package specifications Refer to the attached sheet, page 9, 10.6.3 Business dealing name ("○" mark indicates business dealing name of ordered product)Ordered product Business dealing nameRank mark Ic (mA) PC817XNNSZ2B with or without2.5 to 30 PC817X1NSZ2B A 4.0 to 8.0 PC817X2NSZ2B B 6.5 to 13 PC817X3NSZ2B C 10 to 20PC817X4NSZ1BD15 to 306.4 This Model is approved by UL. (Under preparation).Approved Model No. : PC817 UL file No. : E643806.5 This Model is approved by CSA. (Under preparation).Approved Model No. : PC817 CSA approved mark " " shall be indicated on minimum unit package.6.6 This product is not designed against irradiation.This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode.6.7 ODS materialsThis product shall not contain the following materials.Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFC S , Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)6.8 Specified brominated flame retardantsSpecified brominated flame retardants (PBB and PBDE) are not used in this device at all.Test conditions I F =5mAV CE =5V Ta=25℃6.9Compliance with each regulation(1) The RoHS directive(2011/65/EU)This product complies with the RoHS directive(2011/65/EU) .Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls(PBB)and polybrominated diphenyl ethers(PBDE)(2) Content of six substances specified in Management Methods for Control of Pollution Caused by ElectronicInformation Products Regulation (Chinese : 电子信息产品污染控制管理办法).Marking Styles for the Names and Contents of the Hazardous SubstancesCategoryHazardous SubstancesLead(Pb)Mercury(Hg)Cadmium(Cd)Hexavalentchromium(Cr6+)Polybrominatedbiphenyls(PBB)Polybrominateddiphenyl ethers(PBDE)Photocoupler ○○○○○○This table is prepared in accordance with the provisions of SJ/T 11364.○:Indicates that said hazardous substance contained in all of the homogeneous materials for this part isbelow the limit requirement of GB/T 265727. NotesPrecautions for photocouplers :Attachment-1(Notice)The contents described herein are subject to change without notice for improvement since this product is under development.2. Outline3. Ratings and characteristics3.1 Absolute maximum ratings Ta=25℃Parameter Symbol Rating UnitInput *1 Forward current I F50 mA *2 Peak forward current I FM 1 A Reverse voltage V R 6 V *1 Power dissipation P 70 mWOutputCollector-emitter voltage V CEO80 V Emitter-collector voltage V ECO 6 V Collector current I c50 mA *1 Collector power dissipation P c150 mW *1 Total power dissipation P tot200 mW Operating temperature T opr-30 to +100 ℃Storage temperature T stg-55 to +125 ℃*3 Isolation voltage V iso(rms) 5 kV *4 Soldering temperature T sol270 ℃3.2 Electro-optical characteristics Ta=25℃Parameter Symbol Condition MIN. TYP. MAX. UnitInput Forward voltage V F I F=20mA - 1.2 1.4 V Peak forward voltage V FM I FM=0.5A - - 3.0 V Reverse current I R V R=4V - - 10 μA Terminal capacitance C t V=0, f=1kHz - 30 250 pFOutput Dark current I CEO V CE=50V, I F=0 - - 100 nA Collector-emitter breakdown voltage BV CEO I c=0.1mA I F=0 80 - - V Emitter-collector breakdown voltage BV ECO I E=10μA, I F=0 6 - - VTransfer charac- teristics Collector current I c I F=5mA, V CE=5V 2.5 - 30 mA Collector-emitter saturation voltage V CE(sat)I F=20mA I c=1mA - 0.1 0.2 V Isolation resistance R ISO DC500V 40 to 60%RH 5×10101011- ΩFloating capacitance C f V=0, f=1MHz - 0.6 1.0 pFCut-off frequency f cV CE=5V, I c=2mAR L=100Ω, -3dB- 80 - kHzRise time tr VCE=2V I c=2mAR L=100Ω- 4 18 μs Fall time t f- 3 18 μs*1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. *2 Pulse width≦100μs, Duty ratio : 0.001 (Refer to Fig. 5)*3 AC for 1 min, 40 to 60%RH*4 For 10 s(Fig.1) Forward currentvs. Ambient temperature(Fig.3) Collector power dissipationvs. Ambient temperature(Fig.4) Total power dissipation vs. Ambient temperature(Fig.2) Diode power dissipation vs. Ambient temperature5040 30 20 10 00 25 75 100 -30 50 F o r w a r d c u r r e n t I F (m A )Ambient temperature Ta (℃) 125 0 0 25 75 100 20 40 60 80100 -30 50 70D i o d e p o w e r d i s s i p a t i o n P (m W )Ambient temperature Ta (℃) 125-25-25200 150 100 50 0 0255075100-30 Ambient temperature Ta (℃)C o l l e c t o r p o w e r d i s s i p a t i o n P c (m W )125250 0 025 50 75 10050 100 150 200 -30 T o t a l p o w e r d i s s i p a t i o n P t o t (m W )Ambient temperature Ta (℃)125250 -25-255555(Fig.5) Peak forward current vs. Duty ratioTa = 25℃1020 50 100 200 500 1000 2000 10-3 101010-2 -10 P e a k f o r w a r d c u r r e n t I F M (m A )Duty ratioPulse width ≦ 100μs4. ReliabilityThe reliability of products shall satisfy items listed below.Confidence level : 90% L TPD : 10 or 20Test Items Condition Failure JudgmentCriteriaSamples (n)Defective (C)Solderability 245±3ºC, 5s *2 n=11, C=0Soldering heat(Flow soldering) 270ºC, 10 sV F >U×1.2I R >U×2I CEO >U×2I C <L×0.7V CE(sat) >U×1.2U: Upper specification limitL: Lower specification limit n=11, C=0(Soldering by hand) 400ºC, 3 sTerminal strength(Tension)W eight: 5N 5 s/each terminal n=11, C=0Terminal strength(Bending) *3W eight: 2.5N 2 times/each terminal n=11, C=0Mechanical shock 15km/s2, 0.5ms3 times/±X, ±Y, ±Z directionn=11, C=0V ariable frequency vibration 100 to 2000 to 100Hz/4 min 200m/s24 times/X, Y, Z directionn=11, C=0Temperature cycling 1 cycle –55 ºC to +125 ºC(30 min) (30 min)20 cycles testn=22, C=0High temp. and highHumidity storage+85ºC, 85%RH, 1000h n=22, C=0 High temp. storage +125 ºC, 1000h n=22, C=0 Low temp. storage -55 ºC, 1000h n=22, C=0Operation life I F=50mA, P tot=200mWTa=25 ºC, 1000hn=22, C=0*1 Test method, conforms to EIAJ ED 4701.*2 The product whose not-soldered area is more than 5% for all of the dipped area,and/or whose pinholes or voids are concentrated on one place shall be judged defect. *3 Terminal bending direction is shown below.θθ5. Outgoing inspection5.1 Inspection items(1) Electrical characteristicsV F, I R, I CEO, V CE(sat), I c, R ISO, V iso(2) Appearance5.2 Sampling method and Inspection levelNote 1) Thickness : 0.5±0.2mm2) Process with applying antistatic treatment.3) Unless otherwise specified tolerances shall be ±0.5mm.(However except for deformation due to the stopper in sleeve.)6.2 Package specification6.2.2 Package method(1) MAX. 100pcs. of products shall be packaged in a sleeve ① and both of sleeve edges shall be fixed by stoppers ②. (2) MAX. 25 sleeves (Product : 2500pcs.) above shall be packaged in inner case ③. and sealed by tape ④. (3) The label ⑤ shall be put on the top of the inner bag.(4) Max 2 bags(product : 5000pcs) above shall be packaged in packing case ⑥, and put a cushioning material ⑦ inside. (5) The label ⑨ shall be put on the side of the packing case.(6) Case shall be closed with the lid and enclosed with kraft tape ⑧.6.2.3 Sleeve package ① outline dimensions(Unit :mm)10/106.2.4 Packing outer case outline dimensionsStopper ② Storage conditionPackaged products shall be stored at the temperature 5 to 30℃ and the humidity 70%RH or lessaway from direct sunlight.Precautions for Photocouplers1 Cleaning(1) Solvent cleaning : Solvent temperature 45℃or lessImmersion for 3 min or less(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output,cleaning time, PCB size or device mounting condition etc. Please test it in actual using conditionand confirm that any defect doesn't occur before starting the ultrasonic cleaning.(3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcoholWhen the other solvent is used, there are cases that the packaging resin is eroded.Please use the other solvent after thorough confirmation is performed in actual using condition.2. Circuit design2.1 The LED used in the Photocoupler generally decreases the light emission power by operation.In case of long operation time, please design the circuit in consideration of the degradationof the light emission power of the LED. (50%/5years)2.2 There are cases that the deviation of the CTR and the degradation of the relative light emission powerof the LED increase when the setting value of I F is less than 1.0mA. Please design the circuit in consideration of this point.3. Precautions for Soldering(1) In the case of flow soldering (Whole dipping is possible)It is recommended that flow soldering should be at 270℃or less for 10 s or less(Pre-heating : 100 to 150℃, 30 to 80s).(2 times or less)(2) In the case of hand solderingWhat is done on the following condition is recommended.( 2 times or less)Soldering iron temperature : 400℃or lessTime : 3s or less(3) Other precautionsDepending on equipment and soldering conditions (temperature, Using solder etc.),the effect to the device and the PCB is different.Please confirm that there is no problem on the actual use conditions in advance.Attachment-1。