聚合物微器件超声波成形与封接技术(王晓东,罗怡等编著)思维导图
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大连理工大学研究生试卷系别:机械工程学院课程名称:微制造与微机械电子系统学号:21304203姓名:纪潇考试时间:2014年1 月13 日聚合物微纳器件超声波焊接技术研究现状纪潇(大连理工大学大连116024)摘要:随着聚合物材料在MEMS领域越来越广泛的应用,由聚合物材料制作的聚合物微纳器件的封接将成为MEMS制造中的关键技术。
传统聚合物微纳器件封接方式存在各种弊端与局限性,而由于自身的诸多优点,近年在国内外MEMS研究领域得到不断发展和应用的超声波焊接技术,将是解决聚合物微器件联接问题的有效技术途径。
本文对聚合物微纳器件超声焊接技术进行简要介绍并综述其研究现状与发展趋势。
关键词:聚合物微纳器件;超声焊接Ultrasonic Welding Technology of Polymer Micro-nano Devices:the Present StatusJI Xiao(Dalian University of Technology,Dalian,116024)Abstract:As the polymer material is used in the MEMS field more widely, sealing the polymer micro-nano devices produced by polymer materials will become a key technology in MEMS manufacture. There are various disadvantages and limitations of conventional sealing methods of polymer micro-nano devices. Owing to many merits of the Plastic ultrasonic welding technology, the novel approach has gained unceasing development and application in the MEMS research field in recent years, and will become an effective technological approach to solve the present problem of the bonding for polymer micro-nano components. This paper gives a brier introduction to the ultrasonic welding technology of polymer micro-nano devices and overviews of its current situation and development trend.Key words:Polymer micro-nano devices;ultrasonic welding0 背景微机电系统(Micro Electro Mechanical System,MEMS)是指可批量制作的,集微型机构、微型传感器、微型执行器以及信号处理和控制电路、直至接口、通信和电源等于一体的微型器件或系统。