CABLE BUSHING STYLEPRS SERIESSanitary RTD Sensorse-mail:**************For latest product manuals: Shop online at User’s GuideGENERAL DESCRIPTIONThe Omega PRS series sensors are designed for use in Sanitary Clean-In-Place (CIP) systems. They are supplied standard with 1-1/2" 16AMP Style flanges so they can be assembled to like style piping connections. Other connection sizes and styles are available.These sensors are supplied with 100 ohm Platinum RTD (Resistance Temperature Detectors) elements that meet the resistance vs. temperature characteristics and Class A requirements of IEC-60751. Equations for calculating resistance vs. temperature, temperature vs. resistance and Class A tolerances are included below. See the back side of this Instruction Manual for a Resistance vs. Temperature table.PROCESS CONNECTION:M-4913-C Instruction Manual for Cable Bushing Style Sanitary RTDSensorsResistance Vs. Temperature Table: (Resistance Values Stated in Ohms)Temperature °C0123456789 -5080.3279.9279.5279.1378.7378.3377.9377.5477.1476.74 -4084.2883.8883.4883.0982.6982.3081.9081.5081.1180.71 -3088.2287.8387.4487.0486.6586.2585.8685.4685.0784.67 -2092.1691.7791.3790.9890.5990.1989.8089.4189.0188.62 -1096.0995.6995.3094.9194.5294.1393.7393.3492.9592.55 100.0099.6199.2298.8398.4498.0497.6597.2696.8796.48 0100.00100.39100.78101.17101.56101.95102.34102.73103.12103.51 10103.90104.29104.68105.07105.46105.85106.24106.63107.02107.40 20107.79108.18108.57108.96109.35109.73110.12110.51110.90111.29 30111.67112.06112.45112.83113.22113.61114.00114.38114.77115.15 40115.54115.93116.31116.70117.08117.47117.86118.24118.63119.01 50119.40119.78120.17120.55120.94121.32121.71122.09122.47122.86 60123.24123.63124.01124.39124.78125.16125.54125.93126.31126.69 70127.08127.46127.84128.22128.61128.99129.37129.75130.13130.52 80130.90131.28131.66132.04132.42132.80133.18133.57133.95134.33 90134.71135.09135.47135.85136.23136.61136.99137.37137.75138.13 100138.51138.88139.26139.64140.02140.40140.78141.16141.54141.91 110142.29142.67143.05143.43143.80144.18144.56144.94145.31145.69 120146.07146.44146.82147.20147.57147.95148.33148.70149.08149.46 130149.83150.21150.58150.96151.33151.71152.08152.46152.83153.21 140153.58153.96154.33154.71155.08155.46155.83156.20156.58156.95 150157.33157.70158.07158.45158.82159.19159.56159.94160.31160.68 160161.05161.43161.80162.17162.54162.91163.29163.66164.03164.40 170164.77165.14165.51165.89166.26166.63167.00167.37167.74168.11 180168.48168.85169.22169.59169.96170.33170.70171.07171.43171.80 190172.17172.54172.91173.28173.65174.02174.38174.75175.12175.49 200175.86176.22176.59176.96177.33177.69178.06178.43178.79179.16 210179.53179.89180.26180.63180.99181.36181.72182.09182.46182.82 220183.19183.55183.92184.28184.65185.01185.38185.74186.11186.47 230186.84187.20187.56187.93188.29188.66189.02189.38189.75190.11 240190.47190.84191.20191.56191.92192.29192.65193.01193.37193.74 250194.10194.46194.82195.18195.55195.91196.27196.63196.99197.35 260197.71198.07198.43198.79199.15199.51199.87200.23200.59200.95For Determining Resistance from Temperature (0°C and above):R t = R0(1 + A t + B t2)where:R t = Sensor Resistance at Temperature (°C) R0 = Sensor resistance at 0°C= (100 Ohms Nominal)A = 3.9083 x 10-3 °C-1B = -5.775 x 10-7 °C-2For Determining Temperature From Resistance (0°C and above):t = [sqrt(A2-4B(1-R t/R0))-A]/2B = °C where:t = Temperature at Sensor Resistance R t A, B, R0 and R t per aboveClass A Tolerance = ± (0.15 + 0.002t) = °C With t = temperature in °C regardless to signOMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. T his affords our customers the latest in technology and engineering. OMEGA is a trademark of OMEGA ENGINEERING, INC.© Copyright 2018 OMEGA ENGINEERING, INC. All rights reserved. This document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.M4913-C/0418DISCLAIMERIf the unit malfunctions, it must be returned to the factory for evaluation. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANTY does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current, heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s control. Components in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided b y OMEGA, either verb al or written. OMEGA warrants only that the parts manufactured b y the company will b e as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND WHATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED WARRANTIES INCLUDING ANY WARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence, indemnification, strict liab ility or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY / DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damagewhatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS / INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RET URNING ANY PRODUCT(S) TO OMEGA, PURCHASER MUST OBTAIN AN AUTHORIZED RETURN (AR) NUMBER FROM OMEGA’S CUST OMER SERVICE DEPART MENT (IN ORDER T O AVOID PROCESSING DELAYS). T he assigned AR number should then be marked on the outside of the return package and on any correspondence.T he purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1. P urchase Order number under which the product was PURCHASED,2. M odel and serial number of the product under warranty, and 3. R epair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS, consult OMEGA for cur-rent repair charges. Have the following information available BEFORE contacting OMEGA:1. Purchase Order number to cover the COST of the repair,2. Model and serial number of the product, and3. R epair instructions and/or specific problems relative to the product.U.S.A.Omega Engineering, Inc.Headquarters:Toll-Free: 1-800-826-6342 (USA & Canada only)Customer Service: 1-800-622-2378 (USA & Canada only) Engineering Service: 1-800-872-9436 (USA & Canada only) Tel: (203) 359-1660 Fax: (203) 359-7700e-mail:**************For Other Locations Visit /worldwide***********************The information contained in this document is believed to be correct, but OMEGA accepts no liability for any errors it contains, and reserves the right to alter specifications without notice.。
AlphaScreen®SureFire®STAT3 (p-Tyr705) Assay KitsManualAssay Points Catalog #500TGRS3S50010 000TGRS3S10K50 000TGRS3S50KFor Research Use OnlyResearch Reagents for Research Purposes OnlyGeneral Information on the AlphaScreen® SureFire® p-STAT3 assayThe AlphaScreen® SureFire® p-STAT3 assay is used to measure the phosphorylation of endogenous STAT3αand STAT3βin cellular lysates. The assay is an ideal system for the screening of both modulators of receptor activation (e.g. agonists and antagonists) as well as agents acting intracellularly, such as small molecule inhibitors of upstream events. The assay will measure STAT3 phosphorylation by either cloned or endogenous receptors, and can be applied to primary cells.This assay eliminates the need for laborious techniques, such as Western blotting or conventional ELISA. It is a homogeneous assay, in that no sample washing steps are required, which allows for minimal handling, short assay times, and robotic operation if desired. The assay utilizes the bead-based Alpha Technology, and requires an Alpha Technology-compatible plate reader.Alpha Technology AlphaScreen® SureFire® Assay PrincipleAlphaScreen® SureFire® technology allows the detection of phosphorylated proteins in cellular lysates in a highly sensitive, quantitative and user friendly assay. In these assays, sandwich antibody complexes, which are only formed in the presence of analyte, are captured by AlphaScreen donor and acceptor beads, bringing them into close proximity. The excitation of the donor bead provokes the release of singlet oxygen molecules that triggers a cascade of energy transfer in the Acceptor beads, resulting in the emission of light at 520-620nm.Kit-Specificity informationThis assay kit contains antibodies which recognize the phospho-Tyr705-epitope, and a distal epitope on STAT3αand STAT3β. The proteins detected by this kit correspond to GenBank Accessions NP_644805 and NP_998827.These antibodies recognize STAT3 of human, mouse and rat origin. Other species should be tested on a case-by-case basis.Kit ContentsKit Size500 points10,000 points50,000 pointsLysis buffer (5X) 1 x 10 mL 4 x 60 mL 3 x 400 mL Activation buffer 1 x 2 mL 1 x 60 mL 1 x 300 mL Reaction buffer 1 x 2.6 mL 1 x 45 mL 1 x 225 mL Dilution buffer 1 x 1.5 mL1 x 25 mL2 x 60 mLPositive Control Lysate 1 tube to be re-dissolved in 250 µL H 2O Negative Control Lysate1 tube to be re-dissolved in 250 µL H 2OStorage conditions upon receiptThe kit buffers e.g. 5X Lysis buffer, Activation buffer and Reaction buffer should be stored at 4°C. DO NOT freeze the kit buffers – the Reaction buffer contains antibodies and freeze/thaw cycles can lead to a loss of activity.Materials Required But Not ProvidedThe AlphaScreen SureFire assay kits are optimized to work with AlphaScreen Protein A general IgG detection beads. These are available separately from PerkinElmer. The AlphaScreen Protein A general IgG detection kits contain a biotinylated rabbit IgG control, which can be used to test the instrument settings and bead performance.ItemSuggested source Catalog # Size Protein A general IgG detection kit(contains the Acceptor and Donor Beads) PerkinElmer Inc. 6760617C 6760617M 6760617R 500 pt 10,000 pt 50,000 pt Proxiplate™-384 Plus, white, shallow well assay platePerkinElmer Inc. 6008280 6008289 50/box 200/box Optiplate™-384 Plus, white, assay plate PerkinElmer Inc. 6007290 6007299 50/box 200/box TopSeal-A 384, clear adhesive sealing film PerkinElmer Inc. 6050185100/boxEnvision® or Enspire® Alpha-readerPerkinElmer Inc.--Buffer preparation and subsequent storage conditions5X Lysis bufferStore 5X Lysis buffer at 4°C. For assay, dilute 5-fold in water immediately prior to use. Discard unused buffer. Activation bufferPrecipitation will occur during storage 4°C. To re-dissolve, warm to 37°C and mix. Alternatively, Activation buffer can be stored at room temperature with no loss in activity.Reaction buffer*Keep on ice while in use. Do not freeze.Once diluted discard unused reaction buffer. AlphaScreen ® Protein A IgG KitStore at 4°C in the dark.Acceptor Mix(Reaction buffer + Activation buffer +AlphaScreen ® Acceptor beads)Immediately prior to use, dilute Activation buffer B 5-fold in Reaction buffer (e.g. take 98 μL Activation buffer and dilute in 392 μL Reaction buffer).Dilute Acceptor beads 50-fold in Acceptor mix (e.g. add10 μL Acceptor beads to 490 μL of premixed Reactionbuffer + Activation buffer).The Acceptor mix should be used immediately for best results. Excess mix should be discarded.Donor Mix**(Dilution buffer + AlphaScreen ®Donor beads)Immediately prior to use, dilute Donor beads 20-fold in Dilution buffer (e.g. add 10 μL Don or beads to 190 μLDilution buffer).The Donor mix should be used immediately for best results. Excess mix should be discarded.Assay Control lysateAfter reconstitution in 250 μL water, lysates should be frozen at -20°C in single use aliquots and used within 1 month.* Do not vortex the Reaction buffer, as vigorous mixing can damage some antibodies. ** Prepare and use Donor Mix under low-light conditions.Control Lysate informationControl lysates are prepared from A431 cells (ATCC #CRL-1555) at a concentration of approximately 1 mg/mL. The controls are supplied lyophilized, and should be reconstituted in either dd H 2O or MilliQ® H 2O. Once reconstituted, lysates should be stored frozen in single use aliquots.Negative Lysate: Prepared from A431 cells treated with EGF receptor inhibitor (2 μM AG1478)for 2 hours prior to lysis.Positive Lysate: Prepared from A431 cells treated with 200 ng/mL EGF for 10 minutes.p-STAT3 AlphaScreen® SureFire® Assay ProtocolsA. 2-Plate Assay - assay protocol for adherent cellsCell Seeding1. Seed cell s (200 μL of cells for 96 well plates, 50 μL for 384 well plates) in tissue culture plates. Incubate at 37°C overnight in serum-containing media.Cell Treatment2. Remove culture media, and stimulate the cells with 50 μL agonists prepared in serum-free media (25 µL for 384-well plates). (If testing antagonists, prior to stimulation remove culture medium and replace with 50 μL serum-free media containing antagonists (25 µL for 384-well plates)). Return cells to 37°C incubator for desired time. 1 hour is often sufficient for signal transduction inhibitors, and 5 minutes for receptor agonists.Note: Peptidic agonists and antagonists can often stick to plastic surfaces. To minimize this effect, dilute in serum-free media containing a suitable carrier protein (e.g. 0.1% IgG free BSA - Jackson Immunoresearch Cat #001-000-161).Lysate Preparation5. To lyse cells, remove medium from wells, and add freshly prepared 1X Lysis Buffer(50-100 μL fora 96 well plate, 25 μL for a 384 well plate). Agitate on a plate shaker (~350 rpm) for 10 minutes at room temperature.6. Take 4 μL of the lysate and transfer to a 384-well Proxiplate™ for assay. (Add 4 μL Control lysates to separate wells if required).SureFire Assay7. Add 5 μL of Acceptor Mix to wells. Seal plate with Topseal-A adhesive film, and incubate for 2 hours at room temperature.8. Add 2 μL of Donor Mix to wells under subdued light. Seal plate with Topseal-A adhesive film, and cover plate with foil. Incubate for 2 hours at room temperature.Note: Longer incubation may give greater sensitivity. Plates can be incubated overnight if required.9. Read plate on an Alpha Technology-compatible plate reader, using standard AlphaScreen settings.B. 1 Plate Assay - assay protocol for non-adherent cells, and for high-throughput applications. Note: the larger volumes required using this assay will result in achieving less assay points per kit. Cell Seeding1. Harvest cells by centrifugation, and re-suspend cells in HBSS at a suitable cell density. We recommend 107cells/mL as a starting point. Seed 4 μL of cells/well into a 384-well culture plate.2. If using test agents/inhibitors, add 2 μL/well of 4X inhibitors prepared in HBSS.Note: Peptidic agonists and antagonists can often stick to plastic surfaces. To minimize this effect, dilute in serum-free media containing a suitable carrier protein (e.g. 0.1% IgG free BSA - Jackson Immunoresearch Cat #001-000-161).3. Return cells to incubator at 37°C for 1-2 hours.Cell Treatment4. Stimulate cells with agonists by addition of 2 μL/well of 4X agonist stock in HBSS containing 0.1% BSA. The final volume in the wells should be 8 μL. (if no antagonists were used in step 2, stimulate the cells with 4 μL/well of 2X agonist, to give a final volume in the wells of 8 μL.)Lysate Preparation5. To lyse the cells, add 2 μL/well 5X Lysis buffer.(Add 10 μL control lysates to separate wells if required)SureFire Assay6. Add 8 μL of Acceptor Mix to wells. Seal plate with Topseal-A adhesive film, and incubate for 2 hours at room temperature.7. Add 3 μL of Donor Mix to wells under subdued light. Seal plate with Topseal-A adhesive film, and cover plate with foil. Incubate for 2 hours at room temperature.Note: Longer incubation may give greater sensitivity. Plates can be incubated overnight if required.8. Read plate on an Alpha Technology-compatible plate reader, using standard AlphaScreen settings.Representative DataWestern blot analysis (35 μg protein/lane) of phospho-STAT3 in lysates generated from either unstimulated (-) or IL6-stimulated (+) THP-1 cells, or the AlphaScreen SureFire assay (3.5 μg protein/well), using the standard 2-plate protocol.THP-1 cells (ATCC Cat# TIB-202) were harvested from growing flasks, resuspended in HBSS, and seeded at 25K cells/well in 384-well microplates. Cells were incubated for 2 hours at 37°C, and stimulated with IL-6 for 10 minutes at room temperature (left) or pre-treated with JAK inhibitor I for 2 hours at 37°C, then stimulated with IL-6 (right). Cells were lysed with 5X Lysis buffer with shaking at RT for 10 minutes, and analyzed for phospho-STAT3 using the standard 1-plate protocol.Frequently Asked Questions & TroubleshootingFor comprehensive information on assay optimization and troubleshooting, please refer to the following resources:▪ Guide to AlphaScreen® SureFire ® assay optimization ▪ AlphaScreen® SureFire ® user guideTo download these resources, and other related technical information, visit /category/alpha-surefire-kitsFor general information on AlphaScreen® SureFire ® assays, visit - +Customer CareTo contact the customer care team, please visit /ServiceCallFor more information regarding related AlphaScreen® SureFire® products andprotocols refer to:PerkinElmer web site: TGR BioSciences website: FOR RESEARCH USE ONLY. NOT FOR USE IN DIAGNOSTIC PROCEDURES.This product is not for resale or distribution except by authorized distributors.LIMITED WARRANTY: PerkinElmer, Inc. warrants that, at the time of shipment, the products sold by it are free from defects in material and workmanship and conform to specifications which accompany the product. PerkinElmer Inc. makes no other warranty, express or implied with respect to the products, including any warranty of merchantability or fitness for any particular purpose. Notification of any breach of warranty must be made within 60 days of receipt unless provided in writing by PerkinElmer Inc. No claim shall be honored if the customer fails to notify PerkinElmer Inc. within the period specified. The sole and exclusive remedy of the customer for any liability of PerkinElmer Inc. of any kind including liability based upon warranty (express or implied whether contained herein or elsewhere), strict liability contract or otherwise is limited to the replacement of the goods or the refunds of the invoice price of goods. PerkinElmer Inc. shall not in any case be liable for special, incidental or consequential damages of any kind.。
Infinity Station (T003P) Infinity (T003)Vigtige bemærkningerFI7900Ensimmäinen painosCopyright © 2013 ASUSTeK COMPUTER INC. Kaikki oikeudet pidätetään.Tämän käyttöoppaan osia tai siinä kuvattuja tuotteita ja ohjelmistoja ei saa monistaa, siirtää, jäljentää, tallentaa hakujärjestelmään tai kääntää millekään kielelle missään muodossa tai millään tavalla, lukuun ottamatta dokumentaatiota, jonka ostaja on säilyttänyt varmistustarkoituksessa, ilman ASUSTeK COMPUTER INC: n (“ASUS”) erikseen myöntämää, kirjallista lupaa.Tuotetakuuta tai -huoltoa ei jatketa, jos (1) tuotetta on korjattu, muokattu tai muunneltu, ellei sellainen korjaus, muokkaus tai muuntelu ole ASUKSEN kirjallisesti valtuuttama, tai (2) tuotteen sarjanumero puuttuu tai on turmeltu.ASUS TARJOAA TÄMÄN KÄYTTÖOPPAAN “SELLAISENAAN” ILMAN MINKÄÄNLAISTA SUORAA TAI EPÄSUORAA TAKUUTA, MUKAAN LUKIEN MUTTA EI AINOASTAANEPÄSUORAT TAKUUT TAI KAUPATTAVUUSEDELLYTYKSET TAI SOVELTUVUUS TIETTYYN KÄYTTÖÖN. ASUS, SEN JOHTAJAT, TOIMIHENKILÖT, TYÖNTEKIJÄT TAI EDUSTAJAT EIVÄT MISSÄÄN TAPAUKSESSA OLE VASTUUSSA MISTÄÄN EPÄSUORISTA, ERITYISISTÄ, SATUNNAISISTA TAI VÄLILLISISTÄ VAHINGOISTA (MUKAAN LUKIEN LIIKEVOITON MENETYKSET, LIIKETOIMINNAN MENETYKSET, HYÖDYN TAI DATAN MENETYKSET, LIIKETOIMINNAN KESKEYTYKSET YMS.), VAIKKA ASUS:LLE OLISI ILMOITETTU, ETTÄ TÄMÄN KÄYTTÖOPPAAN TAI TUOTTEEN VIAT TAI VIRHEET SAATTAVAT AIHEUTTAA KYSEISIÄ VAHINKOJA.TÄSSÄ KÄYTTÖOPPAASSA ESITELLYT TEKNISET TIEDOT JA INFORMAATIO ON TUOTETTU AINOASTAAN INFORMAATIOKÄYTTÖÖN, JA NE VOIVAT MUUTTUA MILLOIN TAHANSA ILMAN ENNAKKOVAROITUSTA, JOTEN NE EIVÄT OLE ASUS:N SITOUMUKSIA. ASUS EI OTA MINKÄÄNLAISTA VASTUUTA KÄYTTÖOPPAASSA MAHDOLLISESTI ESIINTYVISTÄ VIRHEISTÄ, MUKAAN LUKIEN SIINÄ KUVATUT TUOTTEET JA OHJELMISTOT.Tässä käyttöoppaassa mainitut tuotteet ja yritysnimet saattavat olla yritystensä rekisteröityjä tavaramerkkejä tai tekijänoikeuksia, ja niitä käytetään ainoastaan omistajan avuksi tunnistamiseen tai selittämiseen ilman loukkaustarkoitusta.Declaration Date: 08/03/2013Year to begin affixing CE marking:2013Signature :__________Signature :__________。
YD-702J-6637JProduct SpecificationsSUPER SLIM 3.5 FLOPPY DISK DRIVE12.7mm HEIGHT2.0/1.6/1.0 MB 3MODE TYPEFDZ-529022 REV.A4FDZ-529022 REV.A4Revisions Month/ Year RevisionReason for RevisionRevised Pages Oct., 1999Rev. A 1st editionJan., 2000Rev. A1Delete optional connector (NON-ZIF TYPE)P11Apr., 2000Rev. A2Screw fastening torque changeP13Jul., 2001Rev. A3Additional of specification (Non operating shock)P3,4Aug, 2003Rev. A4Added to comments on restrictions of liability and high safety use. Drawing adjustment.P2,12This product specification describes the YD-702J series double-sided, 3.5 floppy disk drive for portable applications.(1) I n this manual, the term “drive” refers to the YD-702J series double-sided,3.5 floppy disk drive. The term “disk” refers to the 3.5 floppy disk.z This specification may be revised without prior notice.Make sure to check the revision number when placing an order.zUnauthorized duplication of this document is prohibited.For the usage of this product for High Safety useThis product is assumed for general uses, such as an object for general office work, personal and home use, and is not designed or manufactured supposing for High safety use. Make sure not to use this product without taking measures to ensure the safety required for the high safety use.High Safety Use means the use that requires extremely high security (see examples), and that accompanies a serious danger for the life and body directly, if security cannot be ensured.*Nuclear control, airplane flight control, air traffic control, mass transportation operation control, life support,weapon launch control, etc.This product specification is subject to change without notice.Chapter 1. IntroductionThese specifications pertain to the YD-702J series of 3.5”, super slim, 5-volt single power supply, double-sided micro floppy disk drives.The YD-702J series has been designed for 3.5 (90mm) floppy disk.1. Super-sliminessWith a 12.7mm height and a weight of 158g, the YD-702J drive is approximately half the size and weight of current 3.5 floppy disk drives (compare with Y-E DATA’s YD-702D).2. Low Power ConsumptionA standard power consumption of 1.15W during operation and 15mW during standby allows for battery-driven operation.3. High PerformanceA direct drive brush less motor is used to guarantee high performance.4. Shock ResistanceShock-absorbing teeth built directly into the head carriage assembly have raised shock resistance to 980.7m/s2 {100G}(11ms half-sine wave)and 2157.5m/s2 {220G}(2ms half-sine wave).FDZ-529022 REV. A4FDZ-529022 REV.A4- 4 -Chapter 2. Product Specifications 2.1 Performance Item 2.0MB Mode 1.6MB Mode 1.0MB Mode Capacityz Unformatted z Formatted 1)Sectors/Track 2)Sectors/Track 3)Sectors/Track Recording Density (bits/mm){BPI}Track Density (tracks/mm){TPI}Cylinders Tracks Encoding Method Rotational Speed (min -1){RPM}Transfer Rate Latency(Average)Access Time z Average z Track to Track z Settling Time z Turn Around Time Motor Start Time2.0Mbytes 18: 1474.6kBytes 686.4{17434}5.315{135}80 Cylinders 160 Tracks MFM 300500 kbits/s 100 ms 94 ms 3 ms 15 ms 4 ms 0.5sec 1.6Mbytes 26: 1025.0kBytes 15: 1182.7kBytes 8: 1261.6kBytes 558.4{14184}5.315{135}77 Cylinders 154 Tracks MFM 360500 kbits/s 83 ms 91 ms 3 ms 15 ms 4 ms 0.5 ms 1.0Mbytes 16: 655.4kBytes 9: 737.3kBytes 5: 819.2kBytes 343.2{8717}5.315{135}80 Cylinders 160 Tracks MFM 300250 kbits/s 100 ms 94 ms 3 ms 15 ms 4 ms 0.5sec Table 2.1 Performance2.2 Physical Specifications 2.3 Reliability and Maintenance MTBF PM*MTTR Component Life Error Rates ●Soft Errors ●Hard Errors ●Seek Errors 30,000POH None 30 minutes 5years or 20,000POH 1 per 109 bits read 1 per 1012 bits read 1 per 106 seek operations Table 2.3 Reliability * Preventive maintenance Note: Non-operating shock and vibration values are the same as above with or without disk in the drive.Signal Connector DC Power Requirements Power Consumption Environment● OperatingTemperature Relative Humidity Maximum Wet Bulb Vibration Shock● Non operatingTemperature storageTransportationRelative HumidityVibrationShockMechanical DimensionsWidthHeightDepthWeightSafety ApprovalsFFC Connector1mm pitch, 26pinIncluding DC power lineRefer to figure 4.2Refer to Table 3.8.1.15W TYP5°C to 50°C (note 1)20% to 80%29°C 9.8m/s 2{1G}(10-200Hz)4.9m/s 2{0.5G}(200-500Hz)58.8m/s 2{6G}(11ms half-sine wave)-40°C to 60°C -40°C to 65°C No condensation 19.6m/s 2{2G}(10-500Hz)980.7m/s 2{100G}(11ms half-sine wave)2157.5m/s 2 {220G}(2ms half-sine wave)96.0mm 12.7mm 130mm 158g(TYP)UL, CSA, TÜV, CE Mounting Recommendations See figure 5.2Table 2.2 Physical SpecificationsNotes:1. Depending on the mounting orientation, drive performance may be affected at maximum temperatures. Please mount the drive to ensure that the temperature at the diskette jacket does not exceed that outlined in the media specifications.FDZ-529022 REV.A4- 5 -Chapter 3. InterfaceRefer to figure 3.6 for all interface connections.3.1 Interface Signals 3.1.1 Input signalsThe YD-702J has input lines as shown below.All lines are active (true) when “Low”(1)(2)(3)(4)(5)(6)(7)(8)DRIVE SELECT 0MOTOR ON DIRECTION SELECT STEP WRITE DATA WRITE GATE SIDE ONE SELECT MODE SELECT Table 3.1 Input Signals 3.1.1.1 DRIVE SELECT 0With the exception of the MOTOR ON signal, all the interface signals become valid when the DRIVE SELECT signal is set to low level.3.1.1.2 MOTOR ONWhen “MOTOR ON” is “Low” and a disk is inserted into the drive, the spindle motor will start. The spindle motor operates regardless of “DRIVE SELECT”. However if the disk is removed, the spindle motor will immediately stop.3.1.1.3 DIRECTION SELECTThis line determines the direction of read/write heads movement when the “STEP” line is pulsed.“HIGH” level Out(away from the center of the disk)“LOW” level In(toward the center of the disk)Table 3.2. DIRECTION SELECTAny change on this line must be done at least 1 usec.before the leading edge of the step pulse, and at least 1 usec. after the trailing edge of the step pulse.Refer to figure 8 for the timing information.3.1.1.4 STEPThis signal moves the read/ write heads in the direction defined by the “DIRECTION SELECT” signal.The access motion is initiated on each “LOW” to “HIGH”level transition, in other words, with the trailing edge of the signal pulse. In a seek operation, an 18 ms delay following the last “STEP” pulse is required for settling time before any read/write operation can be initiated.After direction switching, minimum 4 ms delay is required before initiating the next seek operation.Change of step pulse period during seek operation is not recommended for seek error.Refer to figure 1 for timing.Fig.3.1 Step3.1.1.5 WRITE DATAThe “WRITE DATA” line provides the data to be written on the disk. Each transition from “High” to “Low” onthe line causes the current through the read/ write heads to be reversed, thereby writing a data bit. This line is enabled when the “WRITE GATE” line is “Low” active.Refer to figures 3.2 and 3.11 for the timing information.FM RecordingMFM RecordingFig.3.2 WRITE DATA Notes:1.2.0 / 1.6 MB 1.0MB a 2.00us±10ns 4.00us±20ns b3.00us±15ns 6.00us±30ns c4.00us±20ns 8.00us±40ns d 150-1100ns 150-2100ns2. All timings indicate the values without write pre-compensation.3. The write precompensation value in 2.0MB is 125 ns on all tracks, and in other capacities as below:Capacity 2.0MB 1.6MB 1.0MB WPC value 125 ns 0-125 ns 0-250 ns4. The recommended condition during read operation is to not input “WRITE DATA”.3.1.1.6 WRITE GATEA “Low” active level on this line allows “WRITE DATA” to be written on the disk. A “High” inactive level enables read data logic and stepping logic. Refer to figure 3.11 for the timing information. Activation of “DRIVE SELECT”and “MOTOR ON”, changing “SIDE ONE SELECT” and/or activation of “STEP” must be delayed at least the values indicated (see the following READ RECOVERY TIME table 3.3) following deactivation of “WRITE GATE”because the erase heads remain active during this period.Capacity 2.0MB 1.6MB 1.0MB RRT MIN 650 us 590us 1000 us Table 3.3 Read Recovery TimeC C C Cdca C DDDC ca b dC: Clock D: Data3msMIN1usMINFDZ-529022 REV.A4- 6 -3.1.1.7 SIDE ONE SELECTThis line defines which side of a two sided disk will be used for reading or writing. A “High” level on this line selects the read/write head on side 0 surface on the disk. A “Low”level on this line selects the read/write head on the side 1surface. When switching heads, a 100 usec. delay is required before any read or write operation can be initiated.3.1.1.8 MODE SELECTThe YD-702J series has an internal circuit that performs the switching of the drive’s three (2.0/1.6/1.0MB) capacity modes.Please refer to below.Capacity Mode Switching Method Specifications3 Mode(2.0/1.6/1.0MB)Automatic Switching withInterface SignalThe drive is in 1.0MB mode with double density media and independent of the “MODE SELECT” signal (J1-13).If high-density media is inserted with the “MODE SELECT” signal is “LOW” when the drive is in 1.6MB mode.If high-density media is inserted with the “MODE SELECT” signal is “HIGH” when the drive is in 2.0MB mode.Table 3.4 MODE SELECT Notes:(1)To switch capacity mode is effected by a signal level on the “MODE SELECT” signal.(2)It is necessary to wait 0.5 sec. before executing a read/write operation after motor revolution speed is switched for capacity mode change. :READ DATA”, ”INDEX”, signals are inhibited to output during this term.Fig.3.3 Capacity Mode SwitchingFDZ-529022 REV.A4- 7 -3.1.2 Output signalsOutput signals are shown below. All lines are active when the “DRIVE SELECT” signal is “Low”.(1)TRACK 00(2)INDEX(3)HD(High: HD)(4)WRITE PROTECT (5)READ DATA (6)READY(7)DISK CHANGE Table 3.5 Output Signals 3.1.2.1 TRACK 00A “Low” active level on this line indicates that the read /write heads are positioned at track 00(the outermost track). The line goes “High” inactive when the heads are positioned elsewhere. Refer to Fig.3.8 for the timing information.3.1.2.2 INDEXOne index pulse is output at each revolution of the disk when the drive is ready to read/write. Normally this signal is at “High” level, and makes the transition to “Low” level when a pulse is generated. This signal is inhibited to output during seek and not ready. The controller should detect “INDEX” with the leading edge of the transition rather than with the signal level.Fig.3.4 INDEX3.1.2.3 WRITE PROTECTA “Low” active level on this line indicates that a disk with a write protect notch is loaded. During normal operation the drive will prevent writing when a protected disk has been inserted.3.1.2.4 READ DATAThis line provides the “READ DATA”(clock and data together) as detected by the drive electronics. Normally this signal is “High” level and becomes “Low” level for each flux reversal. The transition from “High” to “Low”level should be used for separation of data bits from read data. This signal is inhibited to output during seek and not ready. The different value between the leading edge of each bit pulse and its nominal position is below note 2.Timing characteristics are shown in figure 3.10.FM RecordingMFM RecordingFig.3.5 READ DATANotes:1.2.0/1.6MB 1.0MBa 2.00us NOM 4.00us NOM.b 3.00us NOM. 6.00us NOM.c 4.00us NOM.8.00us NOM.d 150-1100ns150-2100ns2.Capacity 2.0/1.6MB 1.0MB Difference±350ns±700ns3.1.2.5 DISK CHANGEThe “DISK CHANGE” signal indicates that the disk has been removed. This signal becomes “Low” after power has been applied to the drive and the disk has been removed.This signal remains active until the following conditions have satisfied:(1) A disk is correctly inserted;(2) A drive has been selected and a step pulse has been applied.C D C Cdca C DD D C ca b dC: Clock D: Data(166.7ms ±1.5%)200.0ms ±1.5%1~8msFDZ-529022 REV.A4- 8 -Fig.3.6 Interface Connection 3.1.3 Interface CircuitsThe YD-702J series uses open collector drivers as output line drivers, and TTL level gates as input line receivers.The input of each receiver is terminated in 20 k ohms pulled up to Vcc (+5V). Input/output circuit electrical specifications are as shown below.Inactive “High” Level 2.0 V to Vcc Active “Low” Level 0 to 0.8 V Input Impedance 20 k ohms pulled up to Vcc Table 3.6 Input Circuit Electrical Specifications Inactive “High” Level Open Active“Low” Level0 to 0.4VSink current: 6mA MAXTable 3.7 Output Circuit Electrical SpecificationsThe illustration below shows the recommended controller interface circuit.Fig 3.7 Interface CircuitTo connect the drives to the host system via a daisy chain,an FFC (Flexible Flat Cable) connection cable must be used. Refer to section 4.1.2 for this cable’s specifications.Also, because an FFC cable (as opposed to a conventional flat cable) is used, 2 FFC connectors are required in the host system.Caution: In the case where multiple drivers are connected in a daisy chain, it is forbidden to leave any drive unpowered.Each drive should receive power from the host system.3.1.3.2 Host System Terminal ResistorBecause the line driver of the drive is an open collector output, please use a terminal resistor (1k~5.6k Ω) on the host system side.Cable length 500mm MAXFDZ-529022 REV.A4- 9 -3.1.4 Timing3.1.4.1 Track 00 TimingFig.3.8 Track 00 Timing 3.1.4.2 Seek TimingIn order to reduce the peak current, we recommended that no seek operation be performed for 0.2 secondsafter motor start. Figure 3.9 shows the preferred timing.Fig.3.9 Seek Timing3.1.4.3 Read TimingNote:Capacity 2.0MB 1.6MB 1.0MB X us MIN 650 us 590 us 1000 usFig.3.10 Read Timing 3.1.4.4 Write TimingNote:Capacity 2.0MB 1.6MB 1.0MB X us MIN 650 us 590 us 1000 us Y us MAX4 us 4 us 8 usFig.3.11 Write TimingDIRECTlO STEP TRACK 002.9ms MAX 17us MAXMOTOR ONONDRlVEDIRECTlON SELECTSTEP0.5us MIN 1us MIN1us MIN1us MIN200 ms MIN3 ms MIN4 ms MIN3 ms MINONDRlVEMOTOR ONSTEPSIDE ONEREAD DATA (VALID)WRITE GATE500 ms MAX 18 ms MAX 100us MAX 100us MAXXus MAXVALIDVALIDONDRlVEWRITE GATEWRITE DATAMOTOR ONSTEPSIDE ONE500 ms MIN 18 ms MINYus MAX Yus MAX100us MIN Xus MINXus MINXus MINFDZ-529022 REV.A4- 10 -3.2 Power Interface3.2.1 P ower Supply Specifications VoltageOperating Mode TYP(mA)MAX(mA)Stand by 35Read 230350Write 230350+5VDC ±10%(Ripple: 100 mVp-p MAX)Seek550750Motor Start650740Peak Seek550830Table 3.8 Power Supply SpecificationsNotes:(1) “MAX” values reflect measurement taken at maximum voltage; “TYP” values reflect measurement taken at nominal voltage.(2) “Standby” refers to the state where all input signals are inactive.(3) “Read” and “Write” refer to the state where the heads are at track 40, side 1 and the In Use Lamp is on.(4) “Seek” refers to the average current with the drive continuously seeking at 3 ms and the spindle motor rotating.(5) When the spindle motor starts, “Motor Start” current will continue for approximately 200 ms.(6) Peak current of “Seek” refers to the state of maximum seek current when the spindle motor is rotating and the heads are stepping at 6 ms.The above specifications must be met when voltages are measured at power connector on PWB.3.2.2 C urrent Waveform5 V DC (TYP)MOTOR STARTSTAND BYSTAND BYSEE READ READ WRlTE[mA]1000800600400200Fig.3.12 Current WaveformChapter 4. Physical InterfaceThis drive is connected to the host system by one type of connectors.The cable connections are illustrated in figure4.1 Signal Connector and cable (J1/P1)4.1.1 J1 Signal ConnectorThe J1 Signal connector is 26pin FFC connector located at the rear of the drive.Standard:ZIF TYPE (SMK Model CFP5126-0501 or equivalent)Unit: mm Fig 4.2 J1 Signal Connector Dimensions 4.1.2 P1 CableA P1 cable connector is used to connect the J1 signal connector to the system interface.Recommended PartsFFC: •Sumitomo Electric Industries LTD’s ”sumi”card SMCD-26•Eikura Communication’s ET-C100-264.1.3 Frame GroundThe internal circuit ground on the PWB has beenconnected with the frame for shielding purposes. Theframe ground of the system will be connected to thesignal ground through the drive when the drive isinstalled into the system.The frame ground and signal ground of the systemhave to be connected except the drive.Otherwise the drive ought to be floated from the frameground of the system.4.2 Connector Pin Assignments4.2.1. Signal Connector Pin AssignmentsSignal Pin#Signal name24678910111213141618202224261,3,515~25(Odd No. pins)INDEXDRIVE SELECT 0DISK CHANGEN.C.READYHD (High: HD)MOTOR ONN.C.DIRECTION SELECTMODE SELECTSTEPWRITE DATAWRITE GATETRACK 00WRITE PROTECTREAD DATASIDE ONE SELECT+5VGNDTable 4.1 Signal Connector Pins4.3 TerminatorsAll input lines on the drive are terminated with non-removable resistors of 20k ohms.Hostsystem Drive 0Fig 4.1 Cable ConnectionsDrive 1P1J1P1J1Chapter 5. DiagramsFig.5.1 Mechanical DimensionsRecommended angle of the drive when the drive is installed is less than +30 degrees.Fig.5.2 Recommended Mounting21+/-0.490+/-0.210.91.712.7+/-0.22.5+/-0.2M2.6 tapped holes for installation depth 2.2Max(Each side x2)Eject buttonDisk LED(OPTION)2632.51196+/-0.2126+/-0.4Eject button position5+/-1 (Disk inserted)0.6+/-0.6 (Disk ejected)21+/-0.490+/-0.22.5+/-0.22729.696+/-0.2Signal connector(units:mm)Pin 1insertion32.5NOTES 1) GENERAL TOLERANCES ARE +/-0.596+/-0.2Tapping FaceZ( x4)Z 90.7+/-0.53.6+/-0.53.6+/-0.593.4+/-0.52.6+/-0.53.6+/-0.545.45+/-0.345.45+/-0.396+/-0.221+/-0.42.5+/-0.55+/-0.50+/-0.345.1 Caution on Mounting1)Mounting screws should be tightened by 0.2Nm{2kgf-cm} in torque.2)Mounting bracket is recommended not to make contact with the drive except the mounting spots, and should notbe designed that any portion on the drive except the mounting spots is pressed and/or crushed.3)Recommended to fasten the drive at 3 mounting spots with screws (4 spots available).4)Mounting bracket should be provided structure to absorb strain.5)The drive should be separated or shielded from noise sources. Do not strain the drive. Do not install the drive inlarge electromagnetic fields. Otherwise, failure may result.Not to exceed 5 mm Depth to be at exceed 0.5 mmSide mounting plateSide Mounting(Example 1)FDDFDDFDDThickness not exceed 1 mm Depth to be at exceed 0.5 mmSide mounting plateThickness not exceed 1 mmSide mounting plateThickness not exceed 1 mmFig.5.3 Caution on Mounting Washer dimensionsDiameter not to exceed 5 mm Thickness to be at least 0.5 mmNot to exceed 5 mm Side Mounting(Example 2)Side Mounting(Example 3)5.2 Caution on handling1)Strong vibration and shock can damage the drive. Itmay cause an error. Do not use or store the drive under such conditions.2)We recommend handling the drive on side frame,portion of mounting spots, of the drive as well as possible. If you handle like pressing the top or the bottom of the drive, it may cause damage of heads and PWB.3)Do not disassemble the drive by yourself because ofan adjusted product. If you do so, we can not assure you of adjusted accuracy.Chapter 6. Other Functional Characteristics6.1 Standby ModeThe YD-702J includes standby mode to reduce the load on the host system power supply when the drive is not actually in use. When the spindle motor stops, power to the read/write and spindle motor control systems is cut off, and power to the stepper is cut off when the stepper is not seeking.As a result of this built in power conservation, when all the interface input signals are inactive, typical drive power consumption is 15mW.6.2 In UseThe IN USE lamp will turn on when DRIVE SELECT is at low level and turn off when it is high.6.3 Mask Function“READ DATA” and “INDEX” signals are inhibited to output during seek (includes 18 ms MAX after the last step pulse) and not ready (500 ms MAX after motor start).6.4 Automatic Motor On/OffWhen the disk is inserted or removed, the spindle motor is controlled as follows:1)When the disk is inserted, the spindle motor willstart to rotate regardless of the “MOTOR ON” signal condition. The spindle motor will stop approximately 400 ms later if the “MOTOR ON” signal is not active, but will continue to rotate if it is active.2)When the disk is removed, the spindle motor willstop.。
