最新印制电路词汇-形状与尺寸

PCB专业术语pcb专业术语一、综合词汇1、印制电路：printedcircuit2、印制线路：printedwiring3、印制板：printedboard8、印制板装配：printedboardassembly9、板：board10、单面印制板：single-sidedprintedboard(ssb)11、双面印制板：double-sidedprintedboard(dsb)12、多层印制板：mulitlayerprintedboard(mlb)13、多层印制电路板：mulitlayerprintedcircuitboard14、多层印制线路板：mulitlayerpritedwiringboard15、刚性印制板：rigidprintedboard16、刚性单面印制板：rigidsingle-sidedprintedborad17、刚性双面印制板：rigiddouble-sidedprintedborad18、刚性多层印制板：rigidmultilayerprintedboard19、挠性多层印制板：flexiblemultilayerprintedboard20、挠性印制板：flexibleprintedboard21、挠性单面印制板：flexiblesingle-sidedprintedboard22、挠性双面印制板：flexibledouble-sidedprintedboard23、挠性印制电路：flexibleprintedcircuit(fpc)24、挠性印制线路：flexibleprintedwiring25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齐平印制板：flushprintedboard29、金属芯印制板：metalcoreprintedboard30、金属基为印制板：metalbaseprintedboard31、多重布线印制板：mulit-wiringprintedboard32、陶瓷印制板：ceramicsubstrateprintedboard33、导电胶印制板：electroconductivepasteprintedboard34、模塑电路板：moldedcircuitboard35、模压印制板：stampedprintedwiringboard36、顺序层压多层印制板：sequentially-laminatedmulitlayer37、散线印制板：discretewiringboard38、微线印制板：microwireboard39、积层印制板：buile-upprintedboard40、积层多层印制板：build-upmulitlayerprintedboard(bum)41、积层抖印制板：build-upflexibleprintedboard42、表面层再分电路板：surfacelaminarcircuit(slc)43、埋入凸块连印制板：b2itprintedboard44、多层膜基板：multi-layeredfilmsubstrate(mfs)45、层间全内导通多层印制板：alivhmultilayerprintedboard46、有载芯片板：chiponboard(cob)47、掩埋电阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、键盘板夹心板：copper-invar-copperboard53、动态挠性板：dynamicflexboard54、静态挠性板：staticflexboard55、可断拼板：break-awayplanel56、电缆：cable57、挠性扁平电缆：flexibleflatcable(ffc)58、薄膜开关：membraneswitch59、混合电路：hybridcircuit60、厚膜：thickfilm61、厚膜电路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合电路：thinfilmhybridcircuit64、互连：interconnection65、导线：conductortraceline66、齐平导线：flushconductor67、传输线：transmissionline68、跨交：crossover79、导电图形：conductivepattern80、非导电图形：non-conductivepattern81、字符：legend82、标志：mark二、基材：1、基材：basematerial2、层压板：laminate3、覆金属箔基材：metal-cladbadematerial4、覆以铜箔层压板：copper-cladlaminate(ccl)9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate10、金属基覆铜层压板：metalbasecopper-cladlaminate11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bondingsheet15、预浸导电片：preimpregnatedbondingsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：laminateforadditiveprocess18、预制内层覆箔板：masslaminationpanel19、内层芯板：corematerial20、催化剂板材：catalyzedboard,coatedcatalyzedlaminate21、涂胶催化剂层压板：adhesive-coatedcatalyzedlaminate22、涂胶并无急层压板：adhesive-coateduncatalyzedlaminate23、导电层：bondinglayer24、导电膜：filmadhesive25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm26、无支撑胶粘剂膜：unsupportedadhesivefilm27、覆盖层：coverlayer(coverlay)28、增强板材：stiffenermaterial29、铜箔面：copper-cladsurface30、去铜箔面：foilremovalsurface31、层压板面：uncladlaminatesurface32、基膜面：basefilmsurface33、胶粘剂面：adhesivefaec34、原始光洁面：platefinish35、粗面：mattfinish36、横向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates42、环氧玻璃布纸无机覆以铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆以铜箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰亚胺玻璃布覆以铜箔板：polyimidewovenglassfabriccopper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、共聚四乙烯玻璃纤维覆以铜箔板：teflon/fiberglasscopper-cladlaminates49、超薄型层压板：ultrathinlaminate50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates51、紫外线阻挡型覆铜箔板：uvblockingcopper-cladlaminates三、基材的材料1、a阶树脂：a-stageresin2、b阶树脂：b-stageresin3、c阶树脂：c-stageresin4、环氧树脂：epoxyresin5、酚醛树脂：phenolicresin6、聚酯树脂：polyesterresin7、聚酰亚胺树脂：polyimideresin8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin9、丙烯酸树脂：acrylicresin10、三聚氰胺甲醛树脂：melamineformaldehyderesin11、多官能环氧树脂：polyfunctionalepoxyresin12、溴化环氧树脂：brominatedepoxyresin13、环氧酚醛：epoxynovolac14、氟树脂：fluroresin15、硅树脂：siliconeresin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphouspolymer19、结晶现象：crystallinepolamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosettingresin24、热塑性树脂：thermoplasticresin25、感光性树脂：photosensitiveresin26、环氧当量：weightperepoxyequivalent(wpe)27、环氧值：epoxyvalue28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curingagent32、阻燃剂：flameretardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiatedpolyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimidefilm(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、共聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(fep)40、进一步增强材料：reinforcingmaterial41、玻璃纤维：glassfiber42、e玻璃纤维：e-glassfibre43、d玻璃纤维：d-glassfibre44、s玻璃纤维：s-glassfibre45、玻璃布：glassfabric46、非缝纫：non-wovenfabric47、玻璃纤维垫：glassmats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weftyarn52、经纱：warpyarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：threadcount57、织物组织：weavestructure58、平纹组织：plainstructure59、坏布：greyfabric60、稀松织物：wovenscrim61、弓纬：bowofweave62、断经：endmissing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fisheye68、毛圈长：featherlength69、厚薄段：mark70、裂缝：split71、捻度：twistofyarn72、浸润剂含量：sizecontent73、浸润剂残留量：sizeresidue74、处理剂含量：finishlevel75、浸润剂：size76、偶联剂：couplintagent77、处置织物：finishedfabric78、聚酰胺纤维：polyarmidefiber79、聚酯纤维非织布：non-wovenpolyesterfabric80、浸渍绝缘纵纸：impregnatinginsulationpaper。

第三讲PCB术语1、印制电路：在绝缘基材上按预定设计形成的印制元件或印制线路以及两者接合的导电图形。

2、印制线路：在绝缘基材上形成的导电图形，用于元器件之间的连接，但不包括印制元件。

3、预浸材料：由纤维增强材料浸渍热固性树脂后固化至B阶的片状材料。

4、B阶树脂：某些热固性树脂反应的中间阶段，加热时能软化，但不会完全熔解或熔融，此时它与某些溶剂接触能溶胀或部分溶解。

5、纵向/ 横向：层压板机械强度较高的方向。

纸、铜箔、塑料薄膜、玻璃布等片状材料的长度方向，与连续生产时前进的方向一致。

6、增强材料：加入塑料中能使塑料制品的机械强度显著提高的材料，一般为织物或非织物状态的纤维材料。

7、玻璃布：在织布机上将两组互相垂直的玻璃纤维纱交叉编织而成的织物。

8、环氧树脂：含有两个或两个以上环氧基团的，能与多种类型固化剂反应而交联的一类树脂。

9、固化剂：加入树脂中能使树脂聚合而固化的催化剂或反应剂，它是固化树的化学组成部分。

10、阻燃剂：为了止烯显著减小或延缓火焰曼延而加入材料中或涂覆在材料表面的物质。

11、内部识别标志：印在基材表层增强材料上的重复出现的制造厂代号标志，代号字母或数字竖立方向指向增强材料的纵向，阻燃级用红色，非阻燃级用其它色。

12、镀覆孔：孔辟镀覆金属的孔。

同义金属化孔。

13、导通孔：用于印制板不同层中导线之间电气互连的一种镀覆孔。

14、元件孔：将元件引线端固定于印制板并实现电气连接的孔。

15、安装孔：机械安装PCB或机械固定元件于PCB上所使用的孔。

16、孔位：孔中心的的尺寸位置。

17、连接盘（PAD）：用于电气连接、元件固定或两者兼备的那部分导电图形。

18、印制插头：靠近印制板边缘，与板边连接器配合的一系列印制接融片。

19、角标：在pcb照相底片图上拐角处的标志。

20、传输线：由导线和绝缘材料组成，具有可控电气特性的载送信号的电路，用于传输高频信号或窄脉冲信号。

21、特性阻抗：传输波中电压与电流的比值，即在传输线的任一点对传输波产生的阻抗。

一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish 36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure 59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring 34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing document．tion37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan。

印制电路中英文词汇—形状与尺寸精品好文档，推荐学习交流印制电路中英文词汇—形状与尺寸五、形状与尺寸： 1、导线（通道）：conduction (track) 2、导线（体）宽度：conductor width 3、导线距离：conductor spacing 4、导线层：conductorlayer 5、导线宽度/间距：conductor line/space 6、第一导线层：conductor layer No.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、V形盘：V-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：landpattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (PTH)31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacingplated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed boardassembly drawing 52、参考基准：datum referan仅供学习与交流，如有侵权请联系网站删除谢谢1。

22、 连接盘图形：land pattern 23、 连接盘网格阵列：land grid array 24、 孔环：annular ring 25、元件孔：component hole 26、 安装孔：mounting hole 27、 支撑孔：supported hole 28、 非支撑孔：unsupported hole 29、 导通孔：via 30、 镀通孔：plated through hole (PTH) 31、 余隙孔：access hole 32、 盲孔：blind via (hole) 33、 埋孔：buried via hole 34、 埋/盲孔：buried /blind via 35、 任意层内部导通孔：any layer inner via hole (ALIVH) 36、 全部钻孔：all drilled hole 37、 定位孔：toaling hole 38、 无连接盘孔：landless hole 39、 中间孔：interstitial hole 40、 无连接盘导通孔：landless via hole 41、 引导孔：pilot hole 42、ห้องสมุดไป่ตู้端接全隙孔：terminal clearomee hole 43、 准表面间镀覆孔：quasi-interfacing plated-through hole 44、 准尺寸孔：dimensioned hole 45、 在连接盘中导通孔：via-in-pad 46、 孔位：hole location
47、 孔密度：hole density 48、 孔图：hole pattern 49、 钻孔图：drill drawing 50、 装配图：assembly drawing 51、 印制板组装图：printed board assembly drawing 52、 参考基准：datum referan tips:感谢大家的阅读，本文由我司收集整编。仅供参阅！

一综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printed board(MLB)多层印制电路板：mulitlayer printed circuit board多层印制线路板：mulitlayer prited wiring board刚性印制板：rigid printed board刚性单面印制板：rigid single-sided printed borad刚性双面印制板：rigid double-sided printed borad刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board挠性印制板：flexible printed board挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 齐平印制板：flush printed board金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board积层印制板：buile-up printed board积层多层印制板：build-up mulitlayer printed board (BUM) 积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入凸块连印制板：B2it printed board多层膜基板：multi-layered film substrate(MFS)层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB)埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board静态挠性板：static flex board可断拼板：break-away planel电缆：cable挠性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor传输线：transmission line跨交：crossover板边插头：edge-board contact增强板：stiffener基底：substrate基板面：real estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern非导电图形：non-conductive pattern字符：legend标志：mark二基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL)单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：double-sided copper-clad laminate 复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate 金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 基体材料：basis material预浸材料：prepreg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy glass substrate加成法用层压板：laminate for additive process预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzed board ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric film无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay)增强板材：stiffener material铜箔面：copper-clad surface去铜箔面：foil removal surface层压板面：unclad laminate surface基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size panel酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer双晶现象：dimorphism共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin热塑性树脂：thermoplastic resin感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent (WPE)环氧值：epoxy value双氰胺：dicyandiamide粘结剂：binder胶粘剂：adesive固化剂：curing agent阻燃剂：flame retardant遮光剂：opaquer增塑剂：plasticizers不饱和聚酯：unsatuiated polyester聚酯薄膜：polyester聚酰亚胺薄膜：polyimide film (PI)聚四氟乙烯：polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP) 增强材料：reinforcing material玻璃纤维：glass fiberE玻璃纤维：E-glass fibreD玻璃纤维：D-glass fibreS玻璃纤维：S-glass fibre玻璃布：glass fabric非织布：non-woven fabric玻璃纤维垫：glass mats纱线：yarn单丝：filament绞股：strand纬纱：weft yarn经纱：warp yarn但尼尔：denier经向：warp-wise纬向：weft-wise, filling-wise织物经纬密度：thread count织物组织：weave structure平纹组织：plain structure坏布：grey fabric稀松织物：woven scrim弓纬：bow of weave断经：end missing缺纬：mis-picks纬斜：bias折痕：crease云织：waviness鱼眼：fish eye毛圈长：feather length厚薄段：mark裂缝：split捻度：twist of yarn浸润剂含量：size content浸润剂残留量：size residue处理剂含量：finish level浸润剂：size偶联剂：couplint agent处理织物：finished fabric聚酰胺纤维：polyarmide fiber聚酯纤维非织布：non-woven polyester fabric 浸渍绝缘纵纸：impregnating insulation paper 聚芳酰胺纤维纸：aromatic polyamide paper 断裂长：breaking length吸水高度：height of capillary rise湿强度保留率：wet strength retention白度：whitenness陶瓷：ceramics导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ED copper foil)压延铜箔：rolled copper foil退火铜箔：annealed copper foil压延退火铜箔：rolled annealed copper foil (RA copper foil)薄铜箔：thin copper foil涂胶铜箔：adhesive coated foil涂胶脂铜箔：resin coated copper foil (RCC)复合金属箔：composite metallic material载体箔：carrier foil殷瓦：invar箔（剖面）轮廓：foil profile光面：shiny side粗糙面：matte side处理面：treated side防锈处理：stain proofing双面处理铜箔：double treated foil四设计原理图：shematic diagram逻辑图：logic diagram印制线路布设：printed wire layout布设总图：master drawing可制造性设计：design-for-manufacturability计算机辅助设计：computer-aided design.(CAD)计算机辅助制造：computer-aided manufacturing.(CAM)计算机集成制造：computer integrat manufacturing.(CIM)计算机辅助工程：computer-aided engineering.(CAE)计算机辅助测试：computer-aided test.(CAT)电子设计自动化：electric design automation .(EDA)工程设计自动化：engineering design automaton .(EDA2)组装设计自动化：assembly aided architectural design. (AAAD)计算机辅助制图：computer aided drawing计算机控制显示：computer controlled display .(CCD) 布局：placement布线：routing布图设计：layout重布：rerouting模拟：simulation逻辑模拟：logic simulation电路模拟：circit simulation时序模拟：timing simulation模块化：modularization布线完成率：layout effeciency机器描述格式：machine descriptionm format .(MDF) 机器描述格式数据库：MDF databse设计数据库：design database设计原点：design origin优化（设计）：optimization (design)供设计优化坐标轴：predominant axis表格原点：table origin镜像：mirroring驱动文件：drive file中间文件：intermediate file制造文件：manufacturing documentation队列支撑数据库：queue support database元件安置：component positioning图形显示：graphics display比例因子：scaling factor扫描填充：scan filling矩形填充：rectangle filling填充域：region filling实体设计：physical design逻辑设计：logic design逻辑电路：logic circuit层次设计：hierarchical design自顶向下设计：top-down design自底向上设计：bottom-up design线网：net数字化：digitzing设计规则检查：design rule checking走（布）线器：router (CAD)网络表：net list计算机辅助电路分析：computer-aided circuit analysis 子线网：subnet目标函数：objective function设计后处理：post design processing (PDP)交互式制图设计：interactive drawing design费用矩阵：cost metrix工程图：engineering drawing方块框图：block diagram迷宫：moze元件密度：component density巡回售货员问题：traveling salesman problem自由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧几里德距离：euclidean distance网络：network阵列：array段：segment逻辑：logic逻辑设计自动化：logic design automation分线：separated time分层：separated layer定顺序：definite sequence五形状与尺寸：导线（通道）：conduction (track)导线（体）宽度：conductor width 导线距离：conductor spacing导线层：conductor layer导线宽度/间距：conductor line/space 第一导线层：conductor layer No.1 圆形盘：round pad方形盘：square pad菱形盘：diamond pad长方形焊盘：oblong pad子弹形盘：bullet pad泪滴盘：teardrop pad雪人盘：snowman padV形盘：V-shaped pad环形盘：annular pad非圆形盘：non-circular pad隔离盘：isolation pad非功能连接盘：monfunctional pad 偏置连接盘：offset land腹（背）裸盘：back-bard land盘址：anchoring spaur连接盘图形：land pattern连接盘网格阵列：land grid array孔环：annular ring元件孔：component hole安装孔：mounting hole支撑孔：supported hole非支撑孔：unsupported hole导通孔：via镀通孔：plated through hole (PTH) 余隙孔：access hole盲孔：blind via (hole)埋孔：buried via hole埋/盲孔：buried /blind via任意层内部导通孔：any layer inner via hole (ALIVH) 全部钻孔：all drilled hole定位孔：toaling hole无连接盘孔：landless hole中间孔：interstitial hole无连接盘导通孔：landless via hole引导孔：pilot hole端接全隙孔：terminal clearomee hole准表面间镀覆孔：quasi-interfacing plated-through hole 准尺寸孔：dimensioned hole在连接盘中导通孔：via-in-pad孔位：hole location孔密度：hole density孔图：hole pattern钻孔图：drill drawing装配图：assembly drawing印制板组装图：printed board assembly drawing参考基准：datum referan。

印製電路術語總匯（中英文）一、綜合辭彙1、印製電路：printed circuit2、印製線路：printed wiring3、印製板：printed board4、印製板電路：printed circuit board (pcb)5、印製線路板：printed wiring board(pwb)6、印製元件：printed component7、印製接點：printed contact8、印製板裝配：printed board assembly9、板：board10、單面印製板：single-sided printed board(ssb)11、雙面印製板：double-sided printed board(dsb)12、多層印製板：mulitlayer printed board(mlb)13、多層印製電路板：mulitlayer printed circuit board14、多層印製線路板：mulitlayer prited wiring board15、剛性印製板：rigid printed board16、剛性單面印製板：rigid single-sided printed borad17、剛性雙面印製板：rigid double-sided printed borad18、剛性多層印製板：rigid multilayer printed board19、撓性多層印製板：flexible multilayer printed board20、撓性印製板：flexible printed board21、撓性單面印製板：flexible single-sided printed board22、撓性雙面印製板：flexible double-sided printed board23、撓性印製電路：flexible printed circuit (fpc)24、撓性印製線路：flexible printed wiring25、剛性印製板：flex-rigid printed board, rigid-flex printed board26、剛性雙面印製板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、剛性多層印製板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齊平印製板：flush printed board29、金屬芯印製板：metal core printed board30、金屬基印製板：metal base printed board31、多重佈線印製板：mulit-wiring printed board32、陶瓷印製板：ceramic substrate printed board33、導電膠印制板：electroconductive paste printed board34、模塑電路板：molded circuit board35、模壓印製板：stamped printed wiring board36、順序層壓多層印製板：sequentially-laminated mulitlayer37、散線印製板：discrete wiring board38、微線印製板：micro wire board39、積層印製板：buile-up printed board40、積層多層印製板：build-up mulitlayer printed board (bum)41、積層撓印製板：build-up flexible printed board42、表面層合電路板：surface laminar circuit (slc)43、埋入凸塊連印製板：b2it printed board44、多層膜基板：multi-layered film substrate(mfs)45、層間全內導通多層印製板：alivh multilayer printed board46、載晶片板：chip on board (cob)47、埋電阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、鍵盤板夾心板：copper-invar-copper board53、動態撓性板：dynamic flex board54、靜態撓性板：static flex board55、可斷拼板：break-away planel56、電纜：cable57、撓性扁平電纜：flexible flat cable (ffc)58、薄膜開關：membrane switch59、混合電路：hybrid circuit60、厚膜：thick film61、厚膜電路：thick film circuit62、薄膜：thin film63、薄膜混合電路：thin film hybrid circuit64、互連：interconnection65、導線：conductor trace line66、齊平導線：flush conductor67、傳輸線：transmission line68、跨交：crossover69、板邊插頭：edge-board contact70、增強板：stiffener71、基底：substrate72、基板面：real estate73、導線面：conductor side75、焊接面：solder side76、印製：printing77、網格：grid78、圖形：pattern79、導電圖形：conductive pattern80、非導電圖形：non-conductive pattern81、字元：legend82、標誌：mark二、基材：1、基材：base material2、層壓板：laminate3、覆金屬箔基材：metal-clad bade material4、覆銅箔層壓板：copper-clad laminate (ccl)5、單面覆銅箔層壓板：single-sided copper-clad laminate6、雙面覆銅箔層壓板：double-sided copper-clad laminate7、複合層壓板：composite laminate8、薄層壓板：thin laminate9、金屬芯覆銅箔層壓板：metal core copper-clad laminate10、金屬基覆銅層壓板：metal base copper-clad laminate11、撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film12、基體材料：basis material13、預浸材料：prepreg14、粘結片：bonding sheet15、預浸粘結片：preimpregnated bonding sheer16、環氧玻璃基板：epoxy glass substrate17、加成法用層壓板：laminate for additive process18、預製內層覆箔板：mass lamination panel19、內層芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、塗膠催化層壓板：adhesive-coated catalyzed laminate22、塗膠無催層壓板：adhesive-coated uncatalyzed laminate23、粘結層：bonding layer24、粘結膜：film adhesive25、塗膠粘劑絕緣薄膜：adhesive coated dielectric film26、無支撐膠粘劑膜：unsupported adhesive film27、覆蓋層：cover layer (cover lay)28、增強板材：stiffener material30、去銅箔面：foil removal surface31、層壓板面：unclad laminate surface32、基膜面：base film surface33、膠粘劑面：adhesive faec34、原始光潔面：plate finish35、粗面：matt finish36、縱向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛紙質覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、環氧紙質覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、環氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates42、環氧玻璃布紙複合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、環氧玻璃布玻璃纖維複合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates45、聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates46、雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、環氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates49、超薄型層壓板：ultra thin laminate50、陶瓷基覆銅箔板：ceramics base copper-clad laminates51、紫外線阻擋型覆銅箔板：uv blocking copper-clad laminates三、基材的材料1、a階樹脂：a-stage resin2、b階樹脂：b-stage resin3、c階樹脂：c-stage resin4、環氧樹脂：epoxy resin5、酚醛樹脂：phenolic resin6、聚酯樹脂：polyester resin7、聚酰亞胺樹脂：polyimide resin8、雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin9、丙烯酸樹脂：acrylic resin10、三聚氰胺甲醛樹脂：melamine formaldehyde resin11、多官能環氧樹脂：polyfunctional epoxy resin12、溴化環氧樹脂：brominated epoxy resin13、環氧酚醛：epoxy novolac14、氟樹脂：fluroresin15、矽樹脂：silicone resin16、矽烷：silane17、聚合物：polymer18、無定形聚合物：amorphous polymer19、結晶現象：crystalline polamer20、雙晶現象：dimorphism21、共聚物：copolymer22、合成樹脂：synthetic23、熱固性樹脂：thermosetting resin24、熱塑性樹脂：thermoplastic resin25、感光性樹脂：photosensitive resin26、環氧當量：weight per epoxy equivalent (wpe)27、環氧值：epoxy value28、雙氰胺：dicyandiamide29、粘結劑：binder30、膠粘劑：adesive31、固化劑：curing agent32、阻燃劑：flame retardant33、遮光劑：opaquer34、增塑劑：plasticizers35、不飽和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亞胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增強材料：reinforcing material41、玻璃纖維：glass fiber42、e玻璃纖維：e-glass fibre43、d玻璃纖維：d-glass fibre44、s玻璃纖維：s-glass fibre45、玻璃布：glass fabric46、非織布：non-woven fabric47、玻璃纖維墊：glass mats48、紗線：yarn49、單絲：filament50、絞股：strand51、緯紗：weft yarn52、經紗：warp yarn53、但尼爾：denier54、經向：warp-wise55、緯向：weft-wise, filling-wise56、織物經緯密度：thread count57、織物組織：weave structure58、平紋組織：plain structure59、壞布：grey fabric60、稀鬆織物：woven scrim61、弓緯：bow of weave62、斷經：end missing63、缺緯：mis-picks64、緯斜：bias65、折痕：crease66、雲織：waviness67、魚眼：fish eye68、毛圈長：feather length69、厚薄段：mark70、裂縫：split71、撚度：twist of yarn72、浸潤劑含量：size content73、浸潤劑殘留量：size residue74、處理劑含量：finish level75、浸潤劑：size76、偶聯劑：couplint agent77、處理織物：finished fabric78、聚酰胺纖維：polyarmide fiber79、聚酯纖維非織布：non-woven polyester fabric80、浸漬絕緣縱紙：impregnating insulation paper81、聚芳酰胺纖維紙：aromatic polyamide paper82、斷裂長：breaking length83、吸水高度：height of capillary rise84、濕強度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、導電箔：conductive foil88、銅箔：copper foil89、電解銅箔：electrodeposited copper foil (ed copper foil)90、壓延銅箔：rolled copper foil91、退火銅箔：annealed copper foil92、壓延退火銅箔：rolled annealed copper foil (ra copper foil)93、薄銅箔：thin copper foil94、塗膠銅箔：adhesive coated foil95、塗膠脂銅箔：resin coated copper foil (rcc)96、複合金屬箔：composite metallic material97、載體箔：carrier foil98、殷瓦：invar99、箔（剖面）輪廓：foil profile100、光面：shiny side101、粗糙面：matte side102、處理面：treated side103、防銹處理：stain proofing104、雙面處理銅箔：double treated foil四、設計1、原理圖：shematic diagram2、邏輯圖：logic diagram3、印製線路佈設：printed wire layout4、佈設總圖：master drawing5、可製造性設計：design-for-manufacturability6、電腦輔助設計：computer-aided design.(cad)7、電腦輔助製造：computer-aided manufacturing.(cam)8、電腦集成製造：computer integrat manufacturing.(cim)9、電腦輔助工程：computer-aided engineering.(cae)10、電腦輔助測試：computer-aided test.(cat)11、電子設計自動化：electric design automation .(eda)12、工程設計自動化：engineering design automaton .(eda2)13、組裝設計自動化：assembly aided architectural design. (aaad)14、電腦輔助製圖：computer aided drawing15、電腦控制顯示：computer controlled display .(ccd)16、佈局：placement17、佈線：routing18、布圖設計：layout19、重布：rerouting20、模擬：simulation21、邏輯類比：logic simulation22、電路類比：circit simulation23、時序模擬：timing simulation24、模組化：modularization25、佈線完成率：layout effeciency26、機器描述格式：machine descriptionm format .(mdf)27、機器描述格式資料庫：mdf databse28、設計資料庫：design database29、設計原點：design origin30、優化（設計）：optimization (design)31、供設計優化坐標軸：predominant axis32、表格原點：table origin33、鏡像：mirroring34、驅動文件：drive file35、中間檔：intermediate file36、製造檔：manufacturing documentation37、佇列支撐資料庫：queue support database38、元件安置：component positioning39、圖形顯示：graphics dispaly40、比例因數：scaling factor41、掃描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、實體設計：physical design45、邏輯設計：logic design46、邏輯電路：logic circuit47、層次設計：hierarchical design48、自頂向下設計：top-down design49、自底向上設計：bottom-up design50、線網：net51、數位化：digitzing52、設計規則檢查：design rule checking53、走（布）線器：router (cad)54、網路表：net list55、電腦輔助電路分析：computer-aided circuit analysis56、子線網：subnet57、目標函數：objective function58、設計後處理：post design processing (pdp)59、互動式製圖設計：interactive drawing design60、費用矩陣：cost metrix61、工程圖：engineering drawing62、方塊框圖：block diagram63、迷宮：moze64、元件密度：component density65、巡迴售貨員問題：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈頓距離：manhatton distance70、歐幾裏德距離：euclidean distance71、網路：network72、陣列：array73、段：segment74、邏輯：logic75、邏輯設計自動化：logic design automation76、分線：separated time77、分層：separated layer78、定順序：definite sequence五、形狀與尺寸：1、導線（通道）：conduction (track)2、導線（體）寬度：conductor width3、導線距離：conductor spacing4、導線層：conductor layer5、導線寬度/間距：conductor line/space6、第一導線層：conductor layer no.17、圓形盤：round pad8、方形盤：square pad9、菱形盤：diamond pad10、長方形焊盤：oblong pad11、子彈形盤：bullet pad12、淚滴盤：teardrop pad13、雪人盤：snowman pad14、v形盤：v-shaped pad15、環形盤：annular pad16、非圓形盤：non-circular pad17、隔離盤：isolation pad18、非功能連接盤：monfunctional pad19、偏置連接盤：offset land20、腹（背）裸盤：back-bard land21、盤址：anchoring spaur22、連接盤圖形：land pattern23、連接盤網格陣列：land grid array24、孔環：annular ring25、元件孔：component hole26、安裝孔：mounting hole27、支撐孔：supported hole28、非支撐孔：unsupported hole29、導通孔：via30、鍍通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意層內部導通孔：any layer inner via hole (alivh)36、全部鑽孔：all drilled hole37、定位孔：toaling hole38、無連接盤孔：landless hole39、中間孔：interstitial hole40、無連接盤導通孔：landless via hole41、引導孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面間鍍覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在連接盤中導通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔圖：hole pattern49、鑽孔圖：drill drawing50、裝配圖：assembly drawing51、印製板組裝圖：printed board assembly drawing52、參考基準：datum referance54、基準尺寸：reference dimension55、參考尺寸：reaerence dimension56、直接量定尺寸：direct dimensioning57、基準圖：datum feature58、基準邊：reference edge59、導線設計距離：design space of conductor60、導線設計寬度：design width of conductor61、中心距：center to center spacing62、線寬/間距：conductor width/space63、節距：pitch64、精細節距：fine pitch65、層：layer66、層間距：layer-to-layer spacing67、邊距：edge spacing68、外形線：trim line69、截面積：crossection area70、真實值表測量：truth table test71、準確位置：true position tolerance72、精確位置：accuracy73、精確位置誤差：cumulative tolerance74、精確度：accuracy75、累積誤差：cumulative tolerance76、焊墊：footprint77、外層：external layer78、內層：internal layer79、接地層：ground plane80、接地層隔離：ground plane clearance81、電壓層：voltage plane82、電源層隔離：voltage plane clearance83、電源層：power plane, bus plane84、導通網路：basic grid85、導通網格：track grid86、導通孔網格：via grid87、連通盤網格：pad (land) grid88、定位偏差：positional tolerance89、對準靶標：bornb sight90、梳狀圖形：comb pattern91、對準標記：register mark92、散熱層：heat sink plane六、電氣互連1、表面間連接：interlayer connection2、層間連接：interlayer connection3、內層連接：innerlayer connection4、非功能表面連接：nonfunctional interfacial connection5、跨接線：jumper wire6、節（交）點：node7、附加線：haywire8、端接（點）：terminal9、連接線：terminated line10、端接：termination11、連接端：pad, land12、貫穿連接：through connection13、支線：stub14、印製插頭：tab15、鍵槽：keying slot16、連接器：connector17、板邊連接器：edge board connector18、連接器區：connector area19、直角板邊連接器：right angle edge connector20、偏槽口：polarizing slot21、偏置端接區：offset terminal area22、接地：ground23、端接隔離（空環）：terminal clearance24、連通性：continuity25、連接器接觸：connector contact26、接觸面積：contact area27、接觸間距：contact spacing28、接觸電阻：contact resistance29、接觸尺寸：contact size30、元件引腿（腳）：component lead31、元件插針：component pin32、最小電氣間距：minimum electrical spacing33、導電性：conductivity34、邊卡連接器：card-edge connector35、插卡連接器：card-insertion connector36、載流量：current-carrying capacity37、蹯徑：path38、最短路徑：shortest path39、關鍵路徑：critical path40、倒角：miter41、串推：daisy chain42、斯坦納樹：steiner tree43、最小生成樹：minimum spanning tree (MST)44、瓶頸寬度：necked width45、短叉長度：spur length46、短柱長度：stub length47、曼哈頓路徑：manhattan path48、連接度（性）：connectivity七、其他1、主面：primary side2、輔面：secondary side3、支撐面：supporting plane4、信號：signal5、信號導線：signal conductor6、信號地線：signal ground7、信號速率：signal rate8、信號標準化：signal standardization9、信號層：signal layer10、寄生信號：spurious signal11、串擾：crosstalk12、電容：capacitance13、電容耦合：capacitive coupling14、電磁干擾：electromagnetic interference15、電磁遮罩：electromangetic shielding16、噪音：noise17、電磁相容性：electromagnetic compatbility18、特性阻抗：impedance19、阻抗匹配：impedance match20、電感：inductance21、延遲：delay22、微帶線：microstrip23、帶狀線：stripline24、探測點：probe point25、開窗口：cross hatching26、跨距：span27、共面性（度）：coplanarity28、埋入電阻：buried resistance29、黃金板：golden board30、芯板：core board31、薄基芯：thin core32、非均衡傳輸線：unbalanced transmission line33、閥值：threshold34、極限值：threshold limit value(TLV)35、散熱層：heat sink plane36、熱隔離：heat sink plane37、導通孔堵塞：via filiing38、波動：surge39、卡板：card40、卡板盒/卡板櫃：card cages/card racks41、薄型多層板：thin type multilayer board42、埋/盲孔多層板：43、模組：module44、單晶片模組：single chip module (SCM)45、多晶片模組：multichip module (MCM)46、多晶片模組層壓基板：laminate substrate version of multichip module (MCM-L)47、多晶片模組陶瓷基數板：ceramic substrate version o fmultichip module (MCM-C)48、多晶片模組薄膜基板：deposition thin film substrate version of multilayer module (MCM-D)49、嵌入凸塊互連技術：buried bump interconnection technology (B2 it)50、自動測試技術：automatic test equipment (ATE)51、芯板導通孔堵塞：core board viafilling52、對準標記：alignment mark53、基準標記：fiducial mark54、拐角標記：corner mark55、剪切標記：crop mark56、銑切標記：routing mark57、對位元標記：registration mark58、縮減標記：reduvtion mark59、層間重合度：layer to layer registration60、狗骨結構：dog hone61、熱設計：thermal design62、熱阻：thermal resistance。

印制电路词汇－形状与尺寸 1、导线（通道）：conduction (track) 2、导线（体）宽度：conductor width 3、导线距离：conductor spacing 4、导线层：conductor layer 5、导线宽度/间距：conductorline/space 6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mountinghole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via(hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminalclearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。

印制线路板PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayerprinted board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-cladlaminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxyvalue28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。

印制电路板的尺寸和形状
根据整机的总体结构确定所用PCB电路板的尺寸。

因SMT 和电路板尺寸比较小，为更适合于自动化生产，往往采用多块组合成一块大板，俗称“邮票”板。

1、邮票板可由多块同样的电路板组成，或由多块不同的PCB电路板组成。

2、根据表面组装设备情况决定邮票板的最大外形尺寸。

3、邮票板的定位孔设计成一个圆形和一个槽形，槽形孔的宽度尺寸和圆形孔的直径相等，而长度比宽度尺寸至少大0.5mm。

4、圆形定位孔直径由组装设备的定位销决定，一般为3mm，定位孔内壁不允许有电镀层。

5、邮票板上各PCB电路板之间由具有一定强度又不易折断的连接筋支撑。

综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid V alue)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr)Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图.Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法. Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱.Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法. Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数. Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂.Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜.Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板.Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记.Counterboring方型扩孔.Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样.Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕试验. Crosshatching十字交叉区.Crosslinking, Crosslinkage交联,架桥.Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力.Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像.Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板.Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数. Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路, 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序). Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金(现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉(1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination V oid压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材).Parting Agent脱膜剂.Passivation钝化,钝化外理.Passive Device (Component)被动组件(零件)Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.。

印制线路板术语中英对照版AAccelerate Aging ——加速老化，使用人工的方法，加速正常的老化过程。

Acceptance Quality Level (AQL) ——一批产品中最大可以接受的缺陷数目，通常用于抽样计划。

Acceptance Test ——用来测定产品可以接受的试验，由客户与供应商之间决定。

Access Hole ——在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。

Annular Ring ——是指保围孔周围的导体部分。

Artwork ——用于生产“Artwork Master”“production Master”,有精确比例的菲林。

Artwork Master ——通常是有精确比例的菲林，其按1：1的图案用于生产“Production Master”。

BBack Light ——背光法，是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。

假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。

Base Material ——绝缘材料，线路在上面形成。

（可以是刚性或柔性，或两者综合。

它可以是不导电的或绝缘的金属板。

）。

Base Material thickness ——不包括铜箔层或镀层的基材的厚度。

Bland Via ——导通孔仅延伸到线路板的一个表面。

Blister ——离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。

Board thickness 是——指包括基材和所有在上面形成导电层在内的总厚度。

Bonding Layer ——结合层，指多层板之胶片层。

CC-Staged Resin ——处于固化最后状态的树脂。

印制电路朮语(国家标准)TERMS FOR PRINTED CIRCITS1.主题内容与适用范围1-1本标准规定了印制电路技朮的常用朮语及其定义.1-2本标准适用于印制电路用基材,印制电路设计与制造,检验与印制板装联及有关领域.2.一般朮语2.1 印制电路 PRINTED CIRCUIT在绝缘基材上,按预定设计形成的印制组件或印制线路以及两者结合的导电图形.2.2 印制线路 PRINTED WIRING在绝缘基材上形成的导电图形,用于元器件之间的连结,但不包括印制组件.2.3 印制板 PRINTED BOARD印制电路或印制线路成品板的通称.它包括刚性,挠性和刚挠性结合的单面双面和多层印制板等.2.4 单面印制板SINGLE-SIDED PRINTED BOARD仅一面上有导电图形的印制板.2.5 双面印制板DOUBLE-SIDED PRINTED BOARD两面均有导电图形的印制板.2.6 多层印制板MULTILAYER BPRINTED BOARD由多于两层导电图形与绝缘材料交替粘接在一起,且层间导电图形互连的印制板.本朮语包括刚性和挠性多层印制板以及刚性与挠性结合的多层印制板.2.7 刚性印制板RIGID PRINTED BOARD用刚性基材制成的印制板.2.8 刚性单面印制板RIGID SINGLE-SIDED PRINTED BOARD用刚性基材制成的单面印制板.2.9 刚性双面印制板RIGID DOUBLE-SIDED PRINTED BOARD用刚性基材制成的双面印制板.2.10 刚性多层印制板RIGID MULTILAYER PRINTED BOARD用刚性基材制成的多层印制板.2.11 挠性印制板FLEXIBLE PRINTING BOARD用挠性基材制成的印制板.可以有或无挠性覆盖层.2.12 挠性单面印制板FLEXIBLE SINGLE-SIDED PRINTING BOARD用挠性基材制成的单面印制板.2.13挠性双面印制板FLEXIBLE DOUBLE-SIDED PRINTING BOARD用挠性基材制成的双面印制板.2.14挠性多层印制板FLEXIBLE MULTILAYER PRINTING BOARD用挠性基材制成的多层印制板.它的不同区域可以有不同的层数和厚度,因此具有不同的挠性.2.15 刚挠印制板FLEXI-RIGID PRINTED BOARD利用挠性基材并在不同区域与刚性基材结合而制成的印制板.在刚挠接合区,挠性基材与刚性基材上的导电图形通常都要进行互连.2.16 刚挠双面印制板FLEXI-RIGID DOUBLE-SIDED PRINTED BOARD在挠性和刚性基材及其结合区的两面均有导电图形的双面印制板.2.17 刚挠多层印制板FLEXI-RIGID MULTILAYER PRINTED BOARD在挠性和刚性基材及其结合区的两面均有导电图形的多层印制板.2.18 齐平印制板FLUSH PRINTED BOARD导电图形的外表面和基材的外表面处于同一平面的印制板.2.19 金属芯印制板METAL CORE PRINTED BOARD用金属芯基材制成的印制板.2.20 母板 MOTHER BOARD可以装联一块或多块印制板组装件的印制板.2.21 背板 BACK PLANE一面有连接插针(例如用于绕接),另一面通常有连接器插座,用于点间电气互连的装置.点间电气互连可以是印制电路.同义词:印制底板.2.22 多重布线电路板MULTI-WIRING PRINTED BOARD在绝缘基材上布设多层绝缘导线,用粘接剂固定,并由镀覆孔互连的多层印制板.2.23 陶瓷印制板CERAMIC SUBSTRATE PRINTED BOARD以陶瓷为基材的印制板.2.24 印制组件 PRINTED COMPONET用印制方法制成的组件(如:印制电感,电容,电阻,传输线等),它是印制电路导电图形的一部分.2.25 网格 GRID两组等距离平行直线正交而成的网络.它用于元器件在印制板上的定位;连接,其连接点位于网格的交点上.2.26 组件面 COMPONET SIDE安装有大多数元器件的一面.2.27 焊接面 SOLDER SIDE通孔安装印制板与元器件相对的一面.2.28 印制 PRINTING用任一种方法在表面上复制图形的方法.2.29 导线 CONDUCTOR导电图形中的单条导电通路.2.30 导线面 CONDUCTOR SIDE单面印制板有导电图形的一面.2.31 齐平导线 FLUSH CONDUCTOR导线外表面与相邻绝缘基材表面处于同一平面的导线.2.32 图形 PATTERN印制板的导电材料与非(和)导电材料的构形,还指在有关照相底版和图纸上的相应构形.2.33 导电图形 CONDUCTIVE PATTEN印制板的导电材料形成的图形.2.34 非导电图形 NON-CONDUCTIVE PATTEN印制板的非导电材料形成的图形.2.35 字符 LEGEND印制板上主要用来识别组件位置和方向的字母,数字,符号和图形,以便装连和更换组件.2.36 标志 MARK用产品号,修定版次,生产厂厂标等识别印制板的一种标记.3 基材3.1 种类和结构3.1.1 基材 BASE MATERIAL可在其上形成导电图形的绝缘材料.基材可以是刚性或挠性的,也可以是不覆金属箔的或覆金属箔的.3.1.2 覆金属箔基材METAL-CLAD BASE MATERIAL在一面或两面覆有金属箔的基材,包括刚性和挠性,简称覆箔基材.3.1.3 层压板 LAMINATE由一层或两层预浸材料叠合后,经加热加压粘结成型的板状材料.3.1.4 覆铜箔层压板 COPPER-CLAD LAMINATE在一面或两面覆有铜箔的层压板,用于制作印制板,简称覆铜板.3.1.5 单面覆铜箔层压板SINGLE-SIDED COPPER-CLAD LAMINATE仅一面覆有铜箔的覆铜箔层压板.3.1.6 双面覆铜箔层压板 DOUBLE-SIDED COPPER-CLADLAMINATE两面均覆有铜箔的覆铜箔层压板.3.1.7 复合层压板 COMPOSITE LAMENATE含有两种或多种不同种类或结构的增强材料的层压板.例如以玻璃纤维非织布为芯,玻璃布为面构成的环氧层压板.3.1.8 薄层压板 THIN LAMINATE厚度小于0.8mm的层压板.3.1.9 金属芯层覆铜箔层压板 METAL CORE COPPER-CLADLAMINATE由内部有一层金属板为芯的基材构成的覆铜箔层压板.3.1.10 预浸材料 PREPREG由纤维增强材料浸渍热固性树脂后固化至B阶的片状材料.3.1.11 粘结片 BONDING SHEET具有一定粘结性能的预浸材料或其它胶膜材料,用来粘结多层印制板的各分离层.3.1.12 挠性覆铜箔绝缘箔膜 FLEXIBLE COPPER-CLAD DIELETRICFILM在一面或两面覆有铜箔的挠性绝缘薄模.铜箔和绝缘薄膜之间可用或不用粘胶剂,用于制作挠性印制板.3.1.13 涂胶粘剂绝缘薄膜ADHESIVE COATED DIELETRIC FILM在一面或两面涂粘胶剂,固化至B阶的挠性绝缘薄膜,简称涂胶薄膜.在挠性印制板制造中,单面的用作覆盖层;双面的当作粘结层.3.1.14 无支撑膜粘剂UNSUPPORED ADHESIVE FILM涂覆在防粘层上形成的薄膜状B阶粘胶剂,在挠性和刚挠多层印制板制造中用作粘接层.3.1.15 加层法用层压板LAMINATE FOR ADDITIVE PROCESS加层法印制板用的层压板,不用覆金属箔.该板经过涂粘胶剂,加催化剂或其它特殊处理,其表面具有化学曾积金属的性能.3.1.16 预制内层覆铜板MASS LAMINATION PANEL多层印制板的一种半制品.它是层压大量预蚀刻的,带拼图的C阶内层板和B阶层与铜箔而形成的层压板,通常集中在基材厂生产.同义词:半制成多层印制板(SEMI-MANUFCTUREDMUTILAYER PRINTED BOARD PANEL)3.1.17 铜箔面 COPPER-CLAD SURFACE覆铜箔层压板的铜箔表面.3.1.18 去铜箔面FOIL REMOV AL SURFACE覆铜箔层压板除去铜箔后的绝缘基板表面.3.1.19 层压板面UNCLAD LAMINATE SURFACE单面覆箔板的不覆铜箔的层压板表面.3.1.20 基膜面BASE FILM SURFACE挠性单面覆箔绝缘薄膜不覆箔的一面.3.1.21 胶粘剂面使用了胶粘剂的覆铜箔层压板的去铜箔面.亦指加成法中层压板镀覆前的胶粘剂涂覆面.3.1.22 原始光洁面 PLATE FINISH覆铜板从层压机中取出来未经后续工序整饰的金属箔表面,即与层压膜板直接接触形成的原始表面.3.1.23 (粗化)面 MATT FINISH覆箔板金属箔表面的原始光洁面经研磨(如擦刷或细膜料浆处理)增大了表面积的表面.3.1.24 纵向LENGTH WISE DIRECTION;MACHINE DIRECTION层压板机械强度较高的方向.纸铜箔塑料薄膜玻璃布等片状材料的长度方向,与材料连续生产时前进的方向一致.3.1.25 横向CROSS WISE DIRECTION层压板机械强度最低的方向.纸铜箔塑料薄膜玻璃布等片状材料的宽度方向,与纵向垂直.3.1.26 剪切板 CUT-TOSIZE PANEL经过切割的长宽小于制造厂标准尺寸的覆铜箔.3.2 原材料3.2.1 导电箔 CONDUCTIVE FOIL覆盖于基材的一面或两面上,供制作导电图形的金属箔.3.2.2 电解铜箔ELECTRODEPOSITED COPPER FOIL用电陈积法制成的铜箔.3.2.3 压延铜箔ROLLED COPPER FOIL用辊压法制成的铜箔.3.2.4 退火铜箔ANNEALED COPPER FOIL经退火处理改善了延性和韧性的铜箔.3.2.5 光面 SHINY SIDE电解铜箔的光亮面.3.2.6 粗糙面 MATTE SIDE电解铜箔较粗糙的无光泽面,即生产时不附在阴极筒的一面.3.2.7 处理面 TREATED SIDE铜箔经粗化氧化或镀锌镀黄铜等处理后提高了对基材粘结力的一面或两面.3.2.8 防锈处理 STAIN PROOFING铜箔经抗氧化剂等处理使不易生锈.3.2.9 薄铜箔THIN COPPER FOIL厚度小于18um的铜箔.3.2.10 涂胶铜箔ADHESIRE COATED FOIL粗糙面涂有粘胶剂的铜箔,可提高对基材的粘结性.3.2.11 增强材质 REINFORCING MATERIAL加入塑料中能使塑料制品的机械强度明显提高的填料,一般为织状或非织状态的纤维材料.3.2.12 E玻璃纤维 E-GLASS FIBRE电绝缘性能优良的钙铝硼硅酸盐玻璃纤维,适用于电绝缘材料.碱金属氧化物含量不大于0.8%,通称无碱玻璃纤维.3.2.13 D玻璃纤维 D-GLASS FIBRE用低介电常数玻璃拉制而成的玻璃纤维,其介电常数及介质损耗因数都小于E玻璃纤维.3.2.14 S玻璃纤维 S-GLASS FIBRE由硅铝镁玻璃制成的玻璃纤维,其新生态强度比E玻璃县维高25%以上.又称高强度玻璃纤维.3.2.15 玻璃布 GLASS FABRIC在织布机上将两组互相垂直的玻璃纤维纱交叉编织而成的织物.3.2.16 非织布 NON-WOVEN FABRIC纤维不经纺纱制造而乱放置成网,成层,粘合而成的薄片状材料,含或不含粘合剂.3.2.17 经向 WARP-WISE机织物的长度方向,即经排;列方向,与织物在织机上前进方向一致. 3.2.18 纬向 WEFT-WISE;FILLING-WISE机织物的宽度方向,即纬纱排列方向,与经向垂直.3.2.19 织物经纬密度 THREAD COUNT织物经向或纬向单位长度的纱线根数. 经向单位长度内的纬向纱线根数称纬密; 纬向单位长度内的经向纱线根数称经密.3.2.20 织物组织 WEA VE STRUCTRUE机织物中经纱和纬纱相互交织的形式.3.2.21 平纹组织 PLAIN WEA VE经纱与纬纱每隔一根纱交错一次,由二根经纱和二根纬纱组成一个单位组织循环的织物组织.正反面的特征基本相同,断裂强度较大.3.2.22 浸润剂 SIZE在玻璃纤维拉制过程中,为保护纤维表面和有利于纺织加工而施加于其上的物价,通常需先除去才能用于制作层压板.3.2.23 偶联剂 COUPLING AGENT能在玻璃纤维和树脂基体的界面建立和促进更强结合的物质,其分子的一部分能与玻璃纤维形成化学键,另一部分能与树脂发生化学反应.3.2.24 浸渍绝缘纸IMPREGNATING INSULATION PAPER具有电绝缘性能的不施胶的中性木纤维纸或棉纤维纸,可以是本色的半漂白的或漂白的,用于制作绝缘层压板.3.2.25 聚芳先胺纤维纸AROMATIC POLYAMIDE PAPER一种耐高温合成纤维植,由聚芳先胺短切纤维和澄析纤维在造纸机上混合抄造而成,亦称芳纶纸.可用作层压板增强材料,涂胶后可作作挠性印制板的覆盖层和粘结片.3.2.26 聚脂纤维非织布NON-WOVEN POLYESTER FABRIC由聚脂纤维制成的非织布,又称涤纶非织布.3.2.27 断裂长 BREAKING LENGTH宽度一致的纸条本身重量将纸断裂时所需之长度,由拉伸强度和很衡湿处理后试样重量计算得出.3.2.28 吸水高度HEIGHT OF CAPLLARY RISE将垂直悬挂的纸条下端浸入水中,以规定时间内在纸条上由于毛细管作用而上升的高度表示.3.2.29 湿强度保留率WET STRENGTH RETENTION纸在湿态时具有的强度与同一试样在干态时强度之比.3.2.30 白度 whiteness纸的洁白程度,亦称亮度.因光谱紫蓝区457nm蓝光反光率与肉眼对白度的感受较一致,故常用的白度仪是测量蓝光反射率来表示白度.3.2.31 多官能环氧树脂polyfunctional epoxy resin环氧官能团大于2的环氧树脂,固化后有高的玻璃化温度,如线型酚醛多官能环氧树脂,二苯胺基甲烷和环氧氯丙烷反应产物.3.2.32 溴化环氧树脂brominated epoxy resin含稳定溴化组分的环氧树脂,固化物有阻燃性,是由低分子环氧树脂与溴化双酚A反应而成的中等分子量树脂.3.2.33 A阶树脂A-STAGE RESIN某些热固性树脂制造的早期阶段,呈液态或加热后呈液态,此时在某些液体中仍能溶解.3.2.34 B阶树脂B-STAGE RESIN某些热固性树脂反应的中间阶段,加热时能软化,但不能完全溶解或熔融,此时它与某些溶剂接触能溶涨或部分溶解.3.2.35 C阶树脂C-STAGE RESIN某些热固性树脂反应的最后阶段,此时它实际上是不溶或不熔的.3.2.36 环氧树脂 EPOXY RESIN含有两个或两个以上环氧基团的,能与多种类型固化剂反应而交联的一类树脂.3.2.37 酚醛树脂 PHENOLIC RESIN由酚类和醛类化和物缩聚制得的聚合物.3.2.38 聚脂树脂 POLYESTER RESIN主链链节含有脂键的聚合物,由饱和的二元酸或二元醇缩合聚合而得的为热塑性的聚脂,如聚对苯甲酸乙二醇(PETP),常制成聚脂膜.3.2.39 不饱合聚脂UNSATURATED POLYESTER聚合物分子链上既含有脂键,又含有碳-碳不饱和键的一类聚脂,能与不饱合单体或预聚体发生化学反应而交联固化.3.2.40 丙希酸树脂 ACRYLIC RESIN以丙烯酸或丙烯酸衍生物为单体聚合制得的一类聚合物, 如丙希酸脂.3.2.41 三聚氰胺甲醛树脂MELAMINE FORMALDEHYDE RESIN由三聚氰胺与甲醛聚制的一种胺氰树脂.3.2.42 聚四氟乙烯 POLYTETRAFLUOETYLENE(PTFE)以四氟乙烯为单体具聚合制得的聚合物.3.2.43 聚先亚胺树脂POLYIMIDE RESIN主链上含有先亚胺基团(-C-N-C-)的聚合物,如常制成薄膜的聚均苯四先二苯迷亚胺,制作耐高温层压板的主链上除先亚胺基外还有仲胺基的聚先胺亚胺.3.2.44 双马来先亚胺三秦树脂BISMALEIMIDE-TRIAZINE RESINE聚氰酸脂(又称三秦A树脂)预聚物与双马来先亚胺经化学反应制得的树脂,简称BT树脂.3.2.45 聚全氟乙烯丙烯薄膜(FEP) PERFLOURINATEDETHYLENE-PROPOLENE COPOLYMER FILM由四氟乙烯和六氟丙烯共聚物制成的薄膜,简称FEP薄膜.3.2.46 环氧单量(WPE)WEIGHT PER EPOXY EQUIV ALENT含一摩尔环氧基团的树脂克数,是表示环氧树脂环氧基含量的一种方式.3.2.47 环氧值 EPOXY V ALUE每一百克环氧树脂中含有环氧基团的摩尔数,是表示环环氧树脂官能度的一种方式.3.2.48 双氰胺 DICYANDIAMIDE环氧树脂的一种潜伏性固化剂,为白色粉末.固化物有良好的粘结强度和电绝缘性,常用于环氧玻璃布层压板.3.2.49 粘结剂 BINDER用于层压板将增强材料结合在一起的的连续相,粘结剂可以热固性或热塑性树脂,通常在加工时发生形态变化.3.2.50 胶粘剂 ADHESIVE能将材料通过表面附着而粘结在一起的物质.3.2.51 固化剂 CURING AGENT加入树脂中能使树脂聚合而固化的催化剂或反应剂称固化剂,它是固化树脂的化学组成部分.3.2.52 阻燃剂 FLAME RETARDANT为了止燃显著减小或延缓火焰漫延而加入材料中或涂附在材料表面的物质.3.2.53 粘结增强处理BOND ENHANCING TREATMENT改善金属箔表面与相邻材料层之间结合力的处理.3.2.54 复合金属箔COMPOSITE METALLIC MATERIAL由两种金属箔通过冶金结合而形成的金属箔.例如铜-殷钢-铜(又名覆铜殷钢),用于制作改善散热性能的金属芯印制板.3.2.55 载体箔 CARRIER FOIL薄铜箔的金属载体.3.2.56 固化时间 CURING TIME热固性树脂组分在固化时从受热开始至达到C阶的时间.3.2.57 处理织物 FINISHED FABRIC经处理提高了与树脂兼容性的织物.3.2.58 箔(剖面)轮廓 FOIL PROFILE金属箔由制造和增强处理形成的粗糙外形.3.2.59 遮光剂 OPAQUER加入树脂体系使层压板不透明的材料.通过反射光或透射光用肉眼都不能看到增强材料纱或织纹.3.2.60 弓纬BOW OF WEA VE纬纱以弧形处于织物宽度方向的一种织疵.3.2.61 断经 END MISSING织物中因废纱拆除而断裂的很小的一段经纱.3.2.62 缺纬 MIS-PICKS因纬纱缺漏造成的布面组织从一边到另一边的缺损.3.2.63 纬斜 BIAS织物上的纬莎倾斜,不与经纱垂直.3.2.64折痕 CREASE玻璃布因折叠或起皱处受压而形成的凸痕.3.2.65 云织 WA VINESS在不等张力下织成的布,妨碍了纬纱的均匀排布,从而产生交错的后薄段.3.2.66 鱼眼 FISH EYE织物上阻碍树脂浸渍的小区域可因树脂体系织物或处理造成3.2.67 毛圈长 FEATHER LENGTH从织物的最边上一根经纱边缘至纬纱的边端的距离.3.2.68 厚薄段 MARK织物整个宽度上由于纬纱过密或过稀造成的偏厚或偏薄的片段.3.2.69 裂缝 SPLIT因折叠和折皱使纬纱或经纱断裂形成织物开口.3.2.70 捻度TWIST OF YARN纱线沿轴向一定长度内的捻回数,一般以捻/米表示.2.3.71 浸润剂含量 SIZE CONTENT在规定条件下测得的玻璃纤维原纱或制品的浸润剂含量,以质量百分率表示.3.2.72 浸润剂残留量 SIZE RESIDUE含纺织型浸润剂的玻璃纤维经焙烧工艺处理后残存在纤维上的碳含量. 以质量百分率表示.3.2.73 处理剂含量 FINISH LEVEL玻璃布上附着的有机物含量,包含浸润剂残留和被覆的偶联剂量.3.2.74 胚布 GREY FABRIC从织机上取下来未经处理的玻璃步.3.2.75 稀松织物 WOVEN SCRIM经纱间隔和纬纱间隔较宽带有网孔的玻璃纤维布.3.3 制造3.3.1 浸渍 IMPREGNATING用树脂浸透增强材料并包含树脂.3.3.2 凝胶体 GEL热固性树脂从液态转变到固态过程中产生的凝胶状固态,它是固化反应的一种中间阶段.3.3.3 适用期 POT LIFE加了催化剂溶剂或其它组份的热固性树脂体系以及单组分树脂体系,能够够保持其适用工艺特性的期限.3.3.4 覆箔 CLAD将金属箔覆盖并粘合在基材表面上.3.3.5叠层 LAYUP为了准备层压而把多张预浸材料和铜箔层叠起来.3.3.6 层压 LAMILATING将两层或多层预浸材料加热加压结合在一起形成硬质板材的工艺.3.3.7 复合 LAMINATNG用胶粘剂将两层或多层相同或不同的片状材料粘合在一起形成复合箔状材料的工艺.亦称”复合”.3.3.8接触压力 KISS PRESSURE仅稍大于使材料相互接触所需的压力.3.3.9 高压压制 HIGH-PRESSURE MOULDING压力大于1400Kpa的压制过程.3.3.10 低压压制 10W-PRESSURE MOULDING从接触压力至1400Kpa压力的压制过程.3.3.11 压板间距 DAYLIGHT液压机打开时定压板和动压板之间的距离.多层压机的压板间距为相邻两压板间的距离.3.3.12.脱模剂RELEASE AGENT涂覆于模板表硕防止压制材料粘模的物质.3.3.13.防粘膜 RELEASE FILM防止树指与模板粘结或粘住材料表面所用的隔离薄膜.3.3.14.压垫材料 CUSHION在层压过程中使用的起均化传热速度,缓冲温度和改善平行度作用的薄片材料.3.3.15.放气 DEGASSING在压制压层板和多层印制板的过程中,通过瞬间降压加压,使气体排出的操作.亦能在减压与加热时,自印制板组装件排出气体.3.3.16.压板.PRESS LPATEN层压机的平整加热板,用来传递热量和压力至层压模板和叠层.3.3.17.层压模板LAMINATE MOULDING PLATE表面拋光的金属板,供压制层板时用作模板.3.3.18. 压制周期MOULDIONG CYCLE在层压机上完成一次压板压制全过程所需用的时间.3.3.19.内部识别标志INTERNAL IDENTIFICATION MARK印在基材表层增强材料上的重复出现的制造厂代号标志,代号字母或数字竖立方向指向增强材料的纵向,阴燃级用红色,非阻燃级用其它色.3.3.20.后固化POST CURE补充的高温处理,通常加压或不加压,以使材料完全固化并改进最终性能.4.设计4.1.原理图SCHEMATIC DIAGRAM借助图解符号示出特定电路安排的电气连接,各个组件和所完成功能的图.4.2.逻辑图LOGIC DIAGRAM用逻辑符号和补充标记描绘多状态器件实现逻辑功能的图.示出详细的控制和信号流程,但不一珲示出点与点的连接.4.3.印制线路布设PRINTED WIRING LAYOUR为了制订文件和制备照相底图,详细描述印制板基材.电气组件和机械组件的物理尺寸及位置,以及电气互连各组件的导线布线的设计图.4.4.布设总图MASTER DRAWING表示印制板所有要索的适当尺寸范围和网格位置的一种文件.包括导电图形和非导电图形的构形,各种也的大小,类型及位置,以及说明要制造的产品必需的其它信息.4.5.照相底图ARTWORK MASTER用来制作照相原版或生产底版的比例精确的图形结构.4.6.工程图ENGINEERING DRAWING用图标或文字或两者表示,说明一项最终产品的物理要求和功能要求的文件.4.7.印制板组装图PRINTED BOARD ASSEMBLY DRAWING说明刚性或挠性印制板上要装联的单独制造的各种组件以及结合这些组件实现特定功能所需资料的一种文件.4.8.组件密度COMJPONENT DENSITY印制板上单位面积的组件数量.4.9.孔密度HOLE DENSITY印制板中单位面积的孔数量.4.10.组装密度PACKAGING DENSITY单位体积所含功能组件(各种元器件,互连组件,机械零件)的数量.通常以定性术语如高,中,低来表示.4.11.表面间连接INTERFACIAL CONNECTION连接印制板相对两表面上的导电图形的导体,如镀覆孔或贯穿导线. 4.12.层间连接INTERLAYER CONNECTION多层印制板不同层的层的导电图形之间的电气连接.4.13.镀覆孔PLATED THROUGH HOLE孔壁镀覆金属的孔.用于内层或外层导电图形之间或内外层导电图形之间的连接.同义词:金属化孔.4.14.导通孔 VIA用于印制板不同层中导线之间电气互连的一种镀覆孔.4.15.盲孔BLIND VIA仅延伸到印制板一个表面的导通孔.4.16.埋孔BURIED VIA未延伸到印制板表面的导通孔.4.17.无连接盘孔LANDLESS HOLE没有连接盘的镀覆孔4.18.组件孔COMPONENT HOLE将组件接线端(包括组件引线和引脚)固定于印制板并实现电气连接的孔.4.19.安装孔MOUNTING HOLE机械安装印制板或机械固定组件于印制板上所使用的孔.4.20.支撑孔SUPPORTED HOLE其内表面用电镀或其它方法加固的孔.4.21.非支撑孔UNSUPPORTED HOLE没有用电镀层或其它导电材料加固的孔.4.22.隔离孔CLEARANCE HOLE多层印制板某层导电图形上,与镀覆孔同轴但孔径更大的一种孔.4.23.余隙孔ACCESS HOLE阴焊层,挠性印制板的覆盖层以及多层印制板的逐连层中的一个孔或一系列.孔它使该印制板有关联的连接盘完全露出.4.24.注尺寸孔DIMENSIONED HOLE印制板中由物理尺寸或坐标值定位的孔,它一不定位于规定的网格交点上.4.25.孔位HOLE LOCATION孔中心的尺寸位置.4.26.孔图HOLE PATTEM印制板中,所有的孔相对于参考基准点的排列图形.4.27.连接盘LAND用于电气连接,组件固定或两者兼备的那部份导电图形.同义词:焊盘PAD4.28.偏置连接盘OFFSET LAND一种不与有关联的组件孔直接连接的连接盘.4.29.非功能连接盘NONFUNCTIONAL LAND内层或外层上不与该层的导电图形相连接的连接盘.4.30.连接盘图形LAND PATGTERN用于安装,互连和测试特定组件的连接盘组合.4.31.盘趾ANCHORING SPUR挠性印制板上,连接盘延伸至覆盖层下的部分.用于啬连接盘与基材的牢固度.4.32.孔环ANNULAR RING完全环绕孔的那部分导电图形.4.33.导线(体)层 CONDUCTOR LAYER在基材的任一面上形成的全部导电图形,包括接地层和电源层.同义词:电路层CIRCUIT LAGER4.34.第一导线层CONDUCTOR LAYER NO.1在主面上或邻近主面有导电图形的印制板的第一层.4.35.内层INTERNAL LAYER完全夹在多层印制板中间的导电图形.4.36.外层EXTERNAL LAYER多层印制板表面上的导电图形.4.37.层间距LAYER-TO-LAYER SPACING多层印制板中相邻导线层之间的绝缘材料厚度.4.38.信号层SIGNAL PLANE用来传送信号而不是起接地或其它恒定电压作用的导线层.也称信号面.4.39.接地GROUND电路回归,屏蔽或散热的公共参考点.4.40.接地层GROUND PLANE用作电路回归,屏蔽或散热的公共参考导体层或部份体层.通常是具有适当接地层隔离的金属薄层.同义词:接地面4.41.接地层隔离GROUND LPANE CLEARANCE接地层上孔周围蚀刻掉的使接地层与孔隔离开的绝缘部分.4.42.电源层VOLTAGE PLANE印制板内,外层不处于地电位的一层导线或导体.同义词:电源面.4.43.电源层隔离VOLTAGE PLANE CLEARANCE电源层的镀覆孔或非镀覆孔周围被蚀刻掉的部分,使孔与电源层隔离开来.4.44.散热层HEAT SINK PLANE印制板内或印制板上的薄金属层,使组件产生的热量易于散发.同义词:散热面.4.45.热隔离HEAT SHIELD大面积导电图形上组件孔周围被蚀刻的部分.它使在焊接时因截面过分散热而产生虚焊点的可能性减少.4.46.主面PRIMARY SIDE布设总图上规定的装联构件面,通常是最复杂或装组件最多的一面.4.47.辅面SECONDARY SIDE与主面相对的装联构件面,在组件插入式安装技术中同焊接面.4.48.支撑面SUPPOORTING PLANE装联构件的一部分,用以提供机械支撑,制约温度引起的变形,导热及提供某种电性能的一种平面结构.可以在装联构件的内部或外部.4.49.基准尺寸BASIC DIMENSION描述印制板的导线,连接盘或孔的精确位置所用的理论数值.以这些理论值为基础,通过尺寸偏差,注释或特征控制符号来确定允许的尺寸变化.4.50.中心距CENTER TO CENTER SPACING印制板任一层上,相邻导线,连接盘,接触件等中心线之间的标称距离. 4.51.导线设计间距DESIGN SPACING OF CONDUCTOR布设总图上绘出或注明的相邻导线边缘之间的间距.4.52.导线设计宽度DESIGN WIDTH OF CONDUCTOR布设总图上绘出或注明的导线宽度.4.53.导线间距CONDUCTOR SPACING导线层中相邻导线边缘(不是中心到中心)之间的距离.4.54.边距EDGE SPACING邻近印制板边缘的导电图形或组件本体离印制板边缘的距离.4.55.节距PITCH等宽和等间距的相邻导线中心到中心的标称距离.通常由相邻导线的基准边进行测量.4.56.跨距SPAN第一根导线基准边到最后一根导线基准边的距离.4.57.板边连接器EDGE-BOARD CONNECTOR专门为了与印制板边缘的印制接触片进行可拔插互连而设计的连接器.4.58.直角板边连接器RIGHT-ANGLE EDGE CONNECTOR连接端子向外与印制板导线面成直角,与印制板边缘的导线相端接的一种连接器.4.59.连接器区CONNECTOR AREA印制板上供外部电气连接用的那部分印制线路.4.60.印制插头EDGE BOARD CONTACT靠近镊制板边缘,与板边连接器配合的一系打印制接触片.4.61.印制接触片PRINTED CONTACT作为接触系统一部分的导电图形.4.62.接触面积CONTACT AREA导电图形与连接器之间产生电气接触的公共面积.4.63.组件引线CONPONENT LEAD从组件延伸出的作为机械连接或电气连接的单股或多股金属导线,或者已成型的导线.4.64.组件插脚COMPONENT PIN难以再成型的组件引线.若要成型则导致损坏.4.65.非菜单面间连接NONFUNCTIONAL INTERFACIAL CONNECTION双面印制板中的一种镀覆孔.它把印制板一面上的导线连接到另一面的。

一综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component 印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printed board(MLB)多层印制电路板：mulitlayer printed circuit board多层印制线路板：mulitlayer printed wiring board刚性印制板：rigid printed board 刚性单面印制板：rigidsingle-sided printed borad刚性双面印制板：rigiddouble-sided printed borad刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board挠性印制板：flexible printed board挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board齐平印制板：flush printed board 金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board 积层印制板：build-up printed board积层多层印制板：build-up mulitlayer printed board (BUM) 积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入击块连印制板：B2it printed board多层膜基板：multi-layered film substrate(MFS)层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB) 埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board 静态挠性板：static flex board 可断拼板：break-away plane电缆：cable挠性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor 传输线：transmission line跨交：crossover板边插头：edge-board contact 增强板：stiffener基底：substrate基板面：real estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern 非导电图形：non-conductive pattern字符：legend标志：mark二基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL)单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film基体材料：basis material预浸材料：pre-preg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy glass substrate函成法用层压板：laminate for additive process预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzedboard ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric film无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay) 增强板材：stiffener material铜箔面：copper-clad surface 去铜箔面：foil removal surface 层压板面：unclad laminate surface 基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size panel酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 三基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer 双晶现象：dimorphism 共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin 热塑性树脂：thermoplastic resin 感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent (WPE)环氧值：epoxy value双氰胺：dicyandiamide粘结剂：binder胶粘剂：adesive固化剂：curing agent阻燃剂：flame retardant遮光剂：opaquer增塑剂：plasticizers不饱和聚酯：unsatuiated polyester聚酯薄膜：polyester聚酰亚胺薄膜：polyimide film (PI) 聚四氟乙烯：polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylene copolymer film (FEP)增强材料：reinforcing material 玻璃纤维：glass fiberE玻璃纤维：E-glass fibreD玻璃纤维：D-glass fibreS玻璃纤维：S-glass fibre玻璃布：glass fabric非织布：non-woven fabric玻璃纤维垫：glass mats纱线：yarn单丝：filament绞股：strand纬纱：weft yarn经纱：warp yarn但尼尔：denier经向：warp-wise纬向：weft-wise, filling-wise 织物经纬密度：thread count 织物组织：weave structure 平纹组织：plain structure坏布：grey fabric稀松织物：woven scrim弓纬：bow of weave断经：end missing缺纬：mis-picks纬斜：bias折痕：crease云织：waviness鱼眼：fish eye毛圈长：feather length厚薄段：mark裂缝：split捻度：twist of yarn浸润剂含量：size content浸润剂残留量：size residue 处理剂含量：finish level浸润剂：size偶联剂：couplint agent处理织物：finished fabric聚酰胺纤维：polyarmide fiber 聚酯纤维非织布：non-woven polyester fabric浸渍绝缘纵纸：impregnating insulation paper聚芳酰胺纤维纸：aromatic polyamide paper断裂长：breaking length 吸水高度：height of capillary rise湿强度保留率：wet strength retention白度：whitenness陶瓷：ceramics导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ED copper foil)压延铜箔：rolled copper foil退火铜箔：annealed copper foil 压延退火铜箔：rolled annealed copper foil (RA copper foil)薄铜箔：thin copper foil涂胶铜箔：adhesive coated foil 涂胶脂铜箔：resin coated copper foil (RCC)复合金属箔：composite metallic material载体箔：carrier foil殷瓦：invar箔（剖面）轮廓：foil profile光面：shiny side粗糙面：matte side处理面：treated side防锈处理：stain proofing双面处理铜箔：double treated foil四设计原理图：shematic diagram逻辑图：logic diagram印制线路布设：printed wire layout布设总图：master drawing可制造性设计：design-for-manufacturability计算机辅助设计：computer-aided design.(CAD) 计算机辅助制造：computer-aided manufacturing.(CAM)计算机集成制造：computer integrat manufacturing.(CIM)计算机辅助工程：computer-aided engineering.(CAE)计算机辅助测试：computer-aided test.(CAT)电子设计自动化：electric design automation .(EDA)工程设计自动化：engineering design automaton .(EDA2)组装设计自动化：assembly aided architectural design. (AAAD)计算机辅助制图：computer aided drawing计算机控制显示：computer controlled display .(CCD)布局：placement布线：routing布图设计：layout重布：rerouting模拟：simulation逻辑模拟：logic simulation电路模拟：circit simulation时序模拟：timing simulation模块化：modularization布线完成率：layout effeciency 机器描述格式：machine descriptionm format .(MDF)机器描述格式数据库：MDF databse设计数据库：design database 设计原点：design origin优化（设计）：optimization (design)供设计优化坐标轴：predominant axis表格原点：table origin镜像：mirroring驱动文件：drive file中间文件：intermediate file制造文件：manufacturing documentation队列支撑数据库：queue support database元件安置：component positioning图形显示：graphics dispaly比例因子：scaling factor扫描填充：scan filling矩形填充：rectangle filling填充域：region filling实体设计：physical design逻辑设计：logic design逻辑电路：logic circuit层次设计：hierarchical design 自顶向下设计：top-down design 自底向上设计：bottom-up design线网：net数字化：digitzing设计规则检查：design rule checking走（布）线器：router (CAD)网络表：net list计算机辅助电路分析：computer-aided circuit analysis 子线网：subnet目标函数：objective function设计后处理：post design processing (PDP)交互式制图设计：interactive drawing design费用矩阵：cost metrix工程图：engineering drawing 方块框图：block diagram迷宫：moze元件密度：component density 巡回售货员问题：traveling salesman problem自由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧几里德距离：euclidean distance网络：network阵列：array段：segment逻辑：logic逻辑设计自动化：logic design automation分线：separated time分层：separated layer定顺序：definite sequence五形状与尺寸：导线（通道）：conduction (track) 导线（体）宽度：conductor width 导线距离：conductor spacing 导线层：conductor layer导线宽度/间距：conductorline/space第一导线层：conductor layer No.1圆形盘：round pad方形盘：square pad菱形盘：diamond pad长方形焊盘：oblong pad子弹形盘：bullet pad泪滴盘：teardrop pad雪人盘：snowman padV形盘：V-shaped pad环形盘：annular pad非圆形盘：non-circular pad隔离盘：isolation pad非凾能连接盘：mon-functional pad偏置连接盘：offset land腹（背）裸盘：back-bard land 盘址：anchoring spaur连接盘图形：land pattern连接盘网格阵列：land grid array 孔环：annular ring元件孔：component hole安装孔：mounting hole支撑孔：supported hole非支撑孔：unsupported hole导通孔：via镀通孔：plated through hole (PTH)余隙孔：access hole盲孔：blind via (hole)埋孔：buried via hole埋/盲孔：buried /blind via任意层内部导通孔：any layerinner via hole (ALIVH)全部钻孔：all drilled hole定位孔：toaling hole无连接盘孔：landless hole中间孔：interstitial hole无连接盘导通孔：landless via hole引导孔：pilot hole端接全隙孔：terminal clearomee hole准表面间镀覆孔：quasi-interfacing plated-through hole准尺寸孔：dimensioned hole在连接盘中导通孔：via-in-pad 孔位：hole location孔密度：hole density孔图：hole pattern钻孔图：drill drawing装配图：assembly drawing印制板组装图：printed board assembly drawing参考基准：datum referanAssembly line组装线 Layout 布置图 Conveyer流水线物料板Rivet table拉钉机 Rivet gun 拉钉枪 Screw driver起子Electric screw driver电动起子 Pneumatic screw driver气动起子worktable 工作桌 OOBA开箱检查 fit together组装在一起fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板 barcode条码barcode scanner条码扫描器 fuse together熔合 fuse machine热熔机repair修理 operator作业员 QC 品管 supervisor 课长 ME制造工程师 MT制造生技 cosmetic inspect外观检查 inner parts inspect内部检查 thumb screw大头螺丝 lbs. inch镑、英寸 EMI gasket导电条front plate前板 rear plate后板 chassis 基座 bezel panel 面板power button电源按键 reset button重置键 Hi-pot test of SPS高源高压测试 sheet metal parts 冲件 plastic parts塑胶件 SOP制造作业程序material check list物料检查表 work cell工作间电源电压接拉键carton纸箱 sub-line支线 left fork叉车personnel resource department 人力资源部 production department生产部门 planning department企划部 QC Section品管科 stamping factory冲压厂 painting factory烤漆厂 molding factory成型厂common equipment常用设备 uncoiler and straightener 整平机punching machine 冲床robot机械手hydraulic machine油压机lathe车床planer |'plein| 刨床miller铣床grinder磨床driller??床linear cutting线切割electrical sparkle电火花welder电焊机staker=reviting machine铆合机position职务president董事长general manager总经理 special assistant manager特助factory director厂长 department director部长deputy manager | =vice manag er副理 section supervisor课长deputy section supervisor =vice section superisor副课长group leader/supervisor组长 line supervisor线长 assistant manager助理 to move, to carry, to handle 搬运 be put in storage入库pack packing凿装 to apply oil 擦油 to file burr 锉毛刺final inspection终检 to connect material接料 to reverse material 翻料wet station沾湿台 Tiana天那水 cleaning cloth抹布 to load material上料 to unload material卸料 to return material/stock t o退料scraped |'skræpid|报废 scrape ..v.刮;削 deficient purchase来料不良manufacture procedure制程 deficient manufacturing proc edure制程不良 oxidation |' ksi'dei n|氧化 scratch刮伤 dents压痕 defective upsiding down抽芽不良 defective to staking铆合不良embedded lump镶块 feeding is not in place 送料不到位stamping-missing漏冲 production capacity生产力education and training教育与训练 proposal improvement提案改善spare parts=buffer备件 forklift叉车 trailer=long vehicle拖板车compound die合模 die locker锁模器 pressure plate=plate pinch 压板bolt螺栓 name of a department部门名称 administration/general affair s dept总务部 automatic screwdriv er电动启子 thickness gauge 厚薄规 gauge(or jig)治具 power wire电源线 buzzle蜂鸣器 defective product lab el不良标签 identifying sheet list标示单screwdriver holder起子插座 pedal踩踏板 stopper阻挡器flow board流水板 hydraulic hand-jack油压板车 forklift叉车pallet栈板 glove(s)手套 glove(s) with exposed finger s割手套 thumb大拇指 forefinger食指 mid-finger 中指 ring finger无名指little finger小指 band-aid创可贴 iudustrial alcohol工业酒精alcohol container沾湿台 head of screwdriver起子头sweeper扫把 mop拖把 vaccum cleaner吸尘器rag 抹布 garbage container灰箕 garbage can垃圾箱garbage bag垃圾袋 chain链条 jack升降机 production line 流水线chain链条槽 magnetizer函磁器 lamp holder灯架to mop the floor拖地 to clean the floor扫地 to clean a table擦桌子air pipe 气管 packaging tool 打凿机 packaging打凿missing part漏件 wrong part 错件 excessive defects过多的缺陷critical defect极严重缺陷 major defect主要缺陷minor defect次要缺陷 not up to standard不合规格dimension/size is a little bigger 尺寸偏大(小) cosmetic defect 外观不良slipped screwhead/slippery scre w head螺丝滑头slipped screwhead/shippery scr ew thread滑手speckle斑点 mildewed=moldy=mouldy 发霉 rust生锈deformation变形 burr(金属)flash(塑件)毛边 poor staking 铆合不良excesssive gap间隙过大 grease/oil stains油污 inclusion杂质painting peel off脏污 shrinking/shrinkage缩水 mixed color杂色scratch划伤 poor processing 制程不良 poor incoming part事件不良fold of packaging belt打凿带折皱painting make-up补漆 discoloration羿色 water spots水渍polishing/surface processing表面处理 exposed metal/bare metal金属裸露 lack of painting烤漆不到位 safety安全 quality品质 delivery deadline交货程 die repair模修enterprise plan = enterprise ex pansion projects企划QC品管 die worker模工 production, to produce生产equipment设备 to start a press开机 stop/switch off a press关机classification整理 regulation整顿 cleanness清扫 conservation 清洁 culture教养 qualified products, up-to-g rade products良品defective products, not up-to-gr ade products不良品waste废料 board看板 feeder 送料机 sliding rack滑料架defective product box不良品箱 die change 换模 to fix a die装模to take apart a die拆模 to repair a die修模 packing material凿材basket蝴蝶竺 plastic basket胶isolating plate baffle plate; barr icade隔板 carton box纸箱to pull and stretch拉深to put material in place, to cut material, to input落料to impose lines压线 to compress, compressing 压缩character die字模 to feed, feeding送料 transportation运输(be)qualfied, up to grade合格 not up to grade, not qualifi ed不合格material change, stock change 材料变更 feature change 特性变更evaluation评估 prepare for, make preparati ons for 准备parameters参数 rotating speed, revolution转速manufacture management制造管理 abnormal handling异常处理production unit生产单位 lots of production生产批量steel plate钢板 roll material卷料 manufacture procedure制程operation procedure作业流程 to revise, modify修订to switch over to, switch---to th row--over switching over切换engineering, project difficulty 工程瓶颈 stage die工程模automation自动化 to stake, staking, reviting铆合add lubricating oil函润滑油 shut die架模 shut height of a die架模高度analog-mode device类模器die lifter举模器 argon welding 氩焊vocabulary for stamping模具专业英语[分享] 模具述语一、入水：gate进入位：gate location 水口大水口：edge gate 细水口： pin-point gate水口大小：gate size 转水口：switching runner/gate唧嘴口径：sprue diameter二、流道: runner热流道：hot runner,hot manifold 热嘴冷流道: hot sprue/cold runner唧嘴直流: direct sprue gate 圆形流道：round(full/half runner流道电脑分析：mold flow analysis 流道平衡:runner balance热嘴：hot sprue 热流道板：hot manifold发热管：cartridge heater 探针: thermocouples插头：connector plug 插座： connector socket 密封/封料： seal三、运水：water line塑胶管：plastic tube 快速接头：jiffy quick connector plug/socke r四、模具零件：mold components三板模：3-plate mold 二板模：2-plate mold边钉/导边：leader pin/guide pin 边司/导套：bushing/guide bushing中托司：shoulder guide bushing 中托边L：guide pin顶针板：ejector retainner plate 托板：support plate螺丝： screw 管钉：dowel pin 开模槽：ply bar scot内模管位：core/cavity inter-lock 顶针：ejector pin司筒：ejector sleeve 司筒针：ejector pin movable core,return core core puller扣机（尼龙拉勾）：nylon latch lock 斜顶：lifter模胚（架）： mold base 上内模：cavity insert下内模：core insert 行位（滑块）： slide镶件：insert 压座/斜鸡：wedge 耐磨板/油板：wedge wear plate 压条：plate 撑头: support pillar 唧嘴： sprue bushing挡板：stop plate 定位圈：locating ring 锁扣：latch扣鸡：parting lock set 推杆：push bar 栓打螺丝：S.H.S.B 顶板：eracuretun 活动臂：lever arm 分流锥：spure sperader水口司:bush 垃圾钉：stop pin 隔片：buffle弹弓柱：spring rod 弹弓:die spring 中托司：ejector guide bush针：pin 销子：dowel pin波子弹弓：ball catch 喉塞: pipe plug 锁模块：lock plate斜顶：angle from pin 斜顶杆：angle ejector rod尼龙拉勾：parting locks 活动臂：lever arm复位键、提前回杆：early return bar 气阀：valves斜导边：angle pin 术语：terms承压平面平衡：parting surface support balance 模排气：parting line venting回针碰料位：return pin and cavity interferen ce模总高超出啤机规格：mold base shut hight顶针碰运水：water line interferes withejector pin料位出上/下模：part from cavith (core) side 模胚原身出料位：cavity direct cut on A-plate,core direct cut on B-plate.不准用镶件： Do not use (core/cavity) i nsert用铍铜做镶件： use beryllium copper inser t初步（正式）模图设计：preliinary (final) mold design反呵：reverse core 弹弓压缩量：spring compressed length 稳定性好：good stability,stable 强度不够：insufficient rigidity均匀冷却：even cooling 扣模：sticking热膨胀：thero expansion 公差：tolorance 铜公(电极）：copper electrode常用塑料英语缩略语[分享]英文简称英文全称中文全称ABA Acrylonitrile-butadiene-acr ylate 丙烯腈/丁二烯/丙烯酸酯ABS Acrylonitrile-butadiene-styr ene 丙烯腈/丁二烯/苯乙烯共聚物AES Acrylonitrile-ethylene-styre ne 丙烯腈/乙烯/苯乙烯共聚物AMMA Acrylonitrile/methyl Met hacrylate 丙烯腈/甲基丙烯酸甲酯共聚物ARP Aromatic polyester 聚芳香酯AS Acrylonitrile-styrene resin 丙烯腈-苯乙烯树脂ASA Acrylonitrile-styrene-acryla te 丙烯腈/苯乙烯/丙烯酸酯共聚物CA Cellulose acetate 醋酸纤维塑料CAB Cellulose acetate butyrate 醋酸-丁酸纤维素塑料CAP Cellulose acetate propionat e 醋酸-丙酸纤维素CE Cellulose plastics, general 通用纤维素塑料CF Cresol-formaldehyde 甲酚-CMC Carboxymethyl cellulose 羧甲基纤维素CN Cellulose nitrate 硝酸纤维素CP Cellulose propionate 丙酸纤维素CPE Chlorinated polyethylene 氯化聚乙烯CPVC Chlorinated poly(vinyl chl oride) 氯化聚氯乙烯CS Casein 酪蛋白CTA Cellulose triacetate 三醋酸纤维素EC Ethyl cellulose 乙烷纤维素EMA Ethylene/methacrylic acid 乙烯/甲基丙烯酸共聚物EP Epoxy, epoxide 环氧树脂EPD Ethylene-propylene-diene 乙烯-丙烯-二烯三元共聚物EPM Ethylene-propylene polym er 乙烯-丙烯共聚物EPS Expanded polystyrene 发泡ETFE Ethylene-tetrafluoroethyle ne 乙烯-四氟乙烯共聚物EVA Ethylene/vinyl acetate 乙烯-醋酸乙烯共聚物EVAL Ethylene-vinyl alcohol 乙烯-乙烯醇共聚物FEP Perfluoro(ethylene-propyle ne) 全氟（乙烯-丙烯）塑料FF Furan formaldehyde 呋喃甲醛HDPE High-density polyethylen e plastics 高密度聚乙烯塑料HIPS High impact polystyrene 高冲聚苯乙烯IPS Impact-resistant polystyren e 耐冲击聚苯乙烯LCP Liquid crystal polymer 液晶聚合物LDPE Low-density polyethylene plastics 低密度聚乙烯塑料LLDPE Linear low-density polye thylene 线性低密聚乙烯LMDPE Linear medium-density polyethylene 线性中密聚乙烯零件英语零件类punch冲头 insert入块(嵌入件) deburring punch压毛边冲子groove punch压线冲子 stamped punch字模冲子round punch圆冲子 special shape punch异形冲子bending block折刀 roller滚轴 baffle plate挡块located block定位块 supporting block for loca tion 定位支承块air cushion plate气垫板 air-cushion eject-rod气垫顶杆trimming punch切边冲子 stiffening rib punch = sting er 函强筋冲子ribbon punch压筋冲子 reel-stretch punch卷圆压平冲子guide plate定位板 sliding block 滑块 sliding dowel block滑块固active plate活动板 lower sliding plate下滑块板upper holder block上压块 upper mid plate上中间板spring box弹簧箱 spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板 bushing block衬套cover plate盖板 guide pad导料块塑件&模具相关英文compression molding压缩成型 flash mold溢流式模具plasitive mold挤压式模具 split mold分割式模具cavity型控母模 core模心公模 taper锥拔 leather cloak仿皮革 shiver饰纹 flow mark流痕 welding mark溶合痕 post screw insert螺纹套筒埋值 self tapping screw自攻螺丝striper plate脱料板 piston活塞 cylinder汽缸套chip细碎物 handle mold手持式模具移转成型用模具encapsulation molding低压封装成型射出成型用模具 two plate两极式（模具） well type蓄料井insulated runner绝缘浇道方式 hot runner热浇道runner plat浇道模块 valve gate阀门浇口band heater环带状的电热器 spindle阀针spear head刨尖头 slag well冷料井cold slag冷料渣 air vent排气道welding line熔合痕 eject pin 顶出针 knock pin顶出销return pin回位销反顶针 sleave套筒 stripper plateinsert core放置入子 runner stripper plate浇道脱料板guide pin导销 eject rod (bar)（成型机）顶业捧subzero深冷处理 three plate 三极式模具runner system浇道系统 stress crack应力电裂orientation定向 sprue gate射料浇口，直浇口nozzle射嘴 sprue lock pin料头钩销(拉料杆)slag well冷料井 side gate侧浇口edge gate侧缘浇口 tab gate 搭接浇口 film gate薄膜浇口flash gate闸门浇口 slit gate缝隙浇口 fan gate扇形浇口 dish gate因盘形浇口 diaphragm gate隔膜浇口 ring gate环形浇口subarine gate潜入式浇口 tunnel gate隧道式浇口 pin gate针点浇口Runner less无浇道 (sprue less)无射料管方式long nozzle延长喷嘴方式 sprue浇口;溶渣冲压英语stamping, press冲压 punch press, dieing out pre ss冲床uncoiler & strainghtener整平机 feeder送料机rack, shelf, stack料架 cylinder 油缸robot机械手 taker取料机 conveyer belt输送带transmission rack输送架 top stop上死点 bottom stop下死点one stroke一行程 inch寸动 to continue, cont.连动to grip(material)吸料 location lump, locating piece , block stop 定位块reset复位 smoothly顺利 dent 压痕 scratch刮伤 deformationfilings铁削 to draw holes抽孔 inquiry, search for查寻to stock, storage, in stock库存 receive领取approval examine and verify审核 processing, to process函工delivery, to deliver 交货 to return delivenry to.to send delinery back to retrn of goods退货registration登记 registration card登记卡to control管制 to put forward and hand i n提报safe stock安全库存 acceptance = receive验收to notice通知 application form for purchas e请购单consume, consumption消耗 to fill in填写abrasion磨损 reverse angle = chamfer character die字模 to collect, to gather收集failure, trouble故障 statistics 统计 demand and supply需求career card履历卡 to take apart a die卸下模具to load a die装上模具 to tight a bolt拧紧螺栓to looser a bolt拧松螺栓 to move away a die plate 移走模板easily damaged parts易损件 standard parts标准件breaking.(be)broken,(be)cracke d 断裂 to lubricate润滑common vocabulary for die eng ineering模具工程常用词汇die 模具 figure file, chart file 图档cutting die, blanking die冲裁模 progressive die, follow (-on) die 连续模模 punched hole冲孔 panel board镶块 to cutedges=side cut=side scrap切边 to bending 折弯 to pull, to stretch拉伸 Line streching, line pulling线拉伸 engraving, to engrave刻印 upsiding down edges翻边 to stake铆合designing, to design设计 design modification设计变化die block模块 folded block折弯块sliding block滑块 location pin 定位销 lifting pin顶料销die plate, front board模adding block垫块 stepping bar垫条upper die base上模座 lower die base下模座upper supporting blank上承板 upper padding plate blank 上垫板spare dies模具备品 spring 弹簧 bolt螺栓击版印刷术语英语翻译摆版imposition 根据装订形式和套印方法的要求，将单块或联块印版按一定规范排列。

Copper-clad surface
铜箔面
Foil removal surface
去铜箔面
Length wise direction
纵向
cross wise direction
横向
Core material
内层芯材
2.2基材的材料
A-stage resin
A阶树脂
B-stage resin
B阶树脂
Job traveller
工作流程单
4.2照相底版制作
Artwork
照相底图
Phototool
照相底版
Artwork master
照相原版
Working master
工作原版
Production master
生产底版
Photographic film
照相底片
Silver film
银盐底片
Diazo film
Flexible printed circuit board
挠性印制电路板
Flex-rigid printed circuit board
挠性印制电路板
Build-up printed board
积层印制板
Surface laminar circuit (SLC)
表面层合电路板
B2it printd board
circuit board (SSB)
单面印制电路板
double-sided printed
circuit board (SSB)
双面印制电路板
Multilayer printed
circuit board (MLB)
多层印制电路板
Rigid printed circuit board