Design Systems Ops

Cadence Design Systems, Inc. netrev 15.2 Wed Dec 11 15:56:47 2013(C) Copyright 2002 Cadence Design Systems, Inc.------ Directives ------RIPUP_ETCH FALSE;RIPUP_SYMBOLS ALWAYS;MISSING SYMBOL AS ERROR FALSE;SCHEMA TIC_DIRECTORY 'D:\Cadence\work\saw board\allegro';BOARD_DIRECTORY '';OLD_BOARD_NAME 'D:\Cadence\work\saw board\pcb\1234.brd';NEW_BOARD_NAME 'D:\Cadence\work\saw board\pcb\1234.brd';CmdLine: netrev -$ -5 -i D:\Cadence\work\saw board\allegro -u -y 1 D:\Cadence\work\saw board\pcb\#Taaaaaa05960.tmp------ Preparing to read pst files ------Starting to read D:/Cadence/work/saw board/allegro/pstchip.datFinished reading D:/Cadence/work/saw board/allegro/pstchip.dat (00:00:00.00)Starting to read D:/Cadence/work/saw board/allegro/pstxprt.datFinished reading D:/Cadence/work/saw board/allegro/pstxprt.dat (00:00:00.01)Starting to read D:/Cadence/work/saw board/allegro/pstxnet.datFinished reading D:/Cadence/work/saw board/allegro/pstxnet.dat (00:00:00.01)------ Oversights/Warnings/Errors ------#1 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_C0402_1UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_C0402_1UF' is missing pin '2'.#2 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_C0402_0.047UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_C0402_0.047UF' is missing pin '2'.#3 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_C0402_10UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_C0402_10UF' is missing pin '2'.#4 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_C0402_0.47UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_C0402_0.47UF' is missing pin '2'.#5 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_C0402_4.7UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_C0402_4.7UF' is missing pin '2'.#6 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_0_C0402_0.1UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_0_C0402_0.1UF' is missing pin '2'.#7 ERROR(305) Device/Symbol check error detected.Symbol 'C0402' for device 'CAP NP_0_C0402_0.01UF' is missing pin '1'.Symbol 'C0402' for device 'CAP NP_0_C0402_0.01UF' is missing pin '2'.#8 ERROR(305) Device/Symbol check error detected.Symbol 'HOLE113' for device 'RCA JACK_HOLE113_RCA JACK' is missing pin '2'.#9 ERROR(305) Device/Symbol check error detected.Symbol 'TO_92' for device 'IGT6D10_TO_92_S8550' has extra pin '4'.Symbol 'TO_92' for device 'IGT6D10_TO_92_S8550' has extra pin '5'.Symbol 'TO_92' for device 'IGT6D10_TO_92_S8550' is missing pin '2'.Symbol 'TO_92' for device 'IGT6D10_TO_92_S8550' is missing pin '1'.#1 W ARNING(304) Device/Symbol check warning detected.Symbol 'R0402' for device 'R2_R0402_330R' not found in PSMPATH or must be "dbdoctor"ed.#2 W ARNING(304) Device/Symbol check warning detected.Symbol 'R0402' for device 'R2_R0402_100K' not found in PSMPATH or must be "dbdoctor"ed.#3 W ARNING(304) Device/Symbol check warning detected.Symbol 'R0402' for device 'R_0_R0402_4.7K' not found in PSMPATH or must be "dbdoctor"ed.#4 W ARNING(304) Device/Symbol check warning detected.Symbol 'R0402' for device 'R_0_R0402_DNI' not found in PSMPATH or must be "dbdoctor"ed.#5 W ARNING(304) Device/Symbol check warning detected.Symbol 'R0402' for device 'R_0_R0402_0R' not found in PSMPA TH or must be "dbdoctor"ed.#6 W ARNING(304) Device/Symbol check warning detected.Symbol 'SWITCH' for device 'SW SPST_SWITCH_SW SPST' has extra pin '3'.Symbol 'SWITCH' for device 'SW SPST_SWITCH_SW SPST' has extra pin '4'.Symbol 'SWITCH' for device 'SW SPST_SWITCH_SW SPST' has extra pin '5'.Symbol 'SWITCH' for device 'SW SPST_SWITCH_SW SPST' has extra pin '6'.#7 W ARNING(304) Device/Symbol check warning detected.Symbol 'SWITCH4P' for device 'SW SPST_SWITCH4P_SW SPST' not found in PSMPATH or must be "dbdoctor"ed.#8 W ARNING(304) Device/Symbol check warning detected.Symbol 'TO263_5' for device 'LT1529_TO263_5_LT1529' not found in PSMPATH or must be "dbdoctor"ed.#10 ERROR(305) Device/Symbol check error detected.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '32'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '33'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '34'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '35'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '36'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '37'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '38'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '39'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '40'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '41'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '42'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '43'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '44'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '45'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '46'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' has extra pin '47'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '3'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '1'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '16'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '4'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '5'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '6'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '7'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '8'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '9'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '10'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '11'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '12'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '13'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '14'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' is missing pin '2'.Symbol 'DIP2_54MM1HEADER16' for device 'LCD1602_DIP2_54MM1HEADER16_LCD1' ismissing pin '15'.#11 ERROR(305) Device/Symbol check error detected.Symbol 'BEEP' for device 'BEEP1_BEEP_BEEP' has extra pin '9'.Symbol 'BEEP' for device 'BEEP1_BEEP_BEEP' has extra pin '10'.Symbol 'BEEP' for device 'BEEP1_BEEP_BEEP' is missing pin '1'.Symbol 'BEEP' for device 'BEEP1_BEEP_BEEP' is missing pin '2'.#12 ERROR(305) Device/Symbol check error detected.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '1'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '2'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '3'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '4'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '5'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '6'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '7'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '8'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '9'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '10'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '11'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '12'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '13'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '14'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '15'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '16'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '17'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '18'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '19'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' has extra pin '20'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '25'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '26'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '24'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '23'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '29'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '30'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '33'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '34'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '35'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '36'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '21'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '22'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '27'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '28'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '37'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '38'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '39'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '40'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing pin '32'.Symbol 'DIP2_54MM2HEADER10' for device 'P13_DIP2_54MM2HEADER10_P13' is missing#13 ERROR(305) Device/Symbol check error detected.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '1'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '2'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '3'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '4'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '5'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '6'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '7'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '8'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '9'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '10'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '11'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '12'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '13'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extraSymbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '15'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '16'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '17'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '18'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '19'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' has extra pin '20'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '49'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '52'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '53'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '59'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '60'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '50'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '58'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '56'.pin '57'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '54'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '55'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '42'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '41'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '45'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '44'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '43'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '47'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '46'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '48'.Symbol 'DIP2_54MM2HEADER10' for device 'P14_DIP2_54MM2HEADER10_P14' is missing pin '51'.#14 ERROR(305) Device/Symbol check error detected.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '1'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '2'.pin '3'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '4'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '5'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '6'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '7'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '8'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '9'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '10'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '11'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '12'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '13'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '14'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '15'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '16'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '17'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '18'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '19'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' has extra pin '20'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '76'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '77'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '61'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '64'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '65'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '62'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '63'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '66'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '67'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '68'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '69'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missingpin '72'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '73'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '75'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '74'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '79'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '80'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '78'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '71'.Symbol 'DIP2_54MM2HEADER10' for device 'P15_DIP2_54MM2HEADER10_P15' is missing pin '70'.#9 W ARNING(304) Device/Symbol check warning detected.Symbol 'SOT223' for device 'AMS1117_SOT223_AMS1117-5' has extra pin '4'.Note: SECTION property definition created------ Library Paths ------MODULEPATH = F:\PCBENV\FOOTPRINT\PSMPATH = F:\PCBENV\FOOTPRINT\PADPATH = F:\PCBENV\FOOTPRINT\------ Summary Statistics ------#15 ERROR(102) Run stopped because errors were detectednetrev run on Dec 11 15:56:47 2013DESIGN NAME : 'MAIN 'PACKAGING ON Apr 6 2004 19:58:38COMPILE 'logic'CHECK_PIN_NAMES OFFCROSS_REFERENCE OFFFEEDBACK OFFINCREMENTAL OFFINTERFACE_TYPE PHYSICALMAX_ERRORS 500MERGE_MINIMUM 5NET_NAME_CHARS '#%&()*+-./:=>?@[]^_`|'NET_NAME_LENGTH 24OVERSIGHTS ONREPLACE_CHECK OFFSINGLE_NODE_NETS ONSPLIT_MINIMUM 0SUPPRESS 20W ARNINGS ON15 errors detectedNo oversight detected9 warnings detectedcpu time 0:00:18elapsed time 0:00:00。

SOLIDWORKS SOLIDWORKS Flow SimulationDassault Systèmes SolidWorks Corporation175 Wyman StreetWaltham, MA 02451 U.S.A.© 1995-2021, Dassault Systemes SolidWorks Corporation, a Dassault Systèmes SE company, 175 Wyman Street, Waltham, Mass. 02451 USA. All Rights Reserved.The information and the software discussed in this document are subject to change without notice and are not commitments by Dassault Systemes SolidWorks Corporation (DS SolidWorks).No material may be reproduced or transmitted in any form or by any means, electronically or manually, for any purpose without the express written permission of DS SolidWorks.The software discussed in this document is furnished under a license and may be used or copied only in accordance with the terms of the license. All warranties given by DS SolidWorks as to the software and documentation are set forth in the license agreement, and nothing stated in, or implied by, this document or its contents shall be considered or deemed a modification or amendment of any terms, including warranties, in the license agreement.For a full list of the patents, trademarks, and third-party software contained in this release, please go to the Legal Notices in the SOLIDWORKS documentation.Restricted RightsThis clause applies to all acquisitions of Dassault Systèmes Offerings by or for the United States federal government, or by any prime contractor or subcontractor (at any tier) under any contract, grant, cooperative agreement or other activity with the federal government. The software, documentation and any other technical data provided hereunder is commercial in nature and developed solely at private expense. The Software is delivered as "Commercial Computer Software" as defined in DFARS 252.227-7014 (June 1995) or as a "Commercial Item" as defined in FAR 2.101(a) and as such is provided with only such rights as are provided in Dassault Systèmes standard commercial end user license agreement. Technical data is provided with limited rights only as provided in DFAR 252.227-7015 (Nov. 1995) or FAR 52.227-14 (June 1987), whichever is applicable. The terms and conditions of the Dassault Systèmes standard commercial end user license agreement shall pertain to the United States government's use and disclosure of this software, and shall supersede any conflicting contractual terms and conditions. If the DS standard commercial license fails to meet the United States government's needs or is inconsistent in any respect with United States Federal law, the United States government agrees to return this software, unused, to DS. The following additional statement applies only to acquisitions governed by DFARS Subpart 227.4 (October 1988): "Restricted Rights - use, duplication and disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(l)(ii) of the Rights in Technical Data and Computer Software clause at DFARS 252-227-7013 (Oct. 1988)."In the event that you receive a request from any agency of the U.S. Government to provide Software with rights beyond those set forth above, you will notify DS SolidWorks of the scope of the request and DS SolidWorks will have five (5) business days to, in its sole discretion, accept or reject such request. Contractor/ Manufacturer: Dassault Systemes SolidWorks Corporation, 175 Wyman Street, Waltham, Massachusetts 02451 USA.Document Number: PMT2243-ENGContents IntroductionAbout This Course . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Course Design Philosophy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Using this Book . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Lessons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2About the Training Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Windows. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3User Interface Appearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Conventions Used in this Book . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Use of Color . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4More SOLIDWORKS Training Resources. . . . . . . . . . . . . . . . . . . . . . 4Local User Groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Lesson 1:Creating a SOLIDWORKS Flow Simulation ProjectObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Case Study: Manifold Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Model Preparation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Internal Flow Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7External Flow Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Manifold Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Lids. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Lid Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Manual Lid Creation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9iContents SOLIDWORKS SimulationiiAdding a Lid to a Part File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Adding a Lid to an Assembly File . . . . . . . . . . . . . . . . . . . . . . . . 10 Checking the Geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Internal Fluid Volume. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Invalid Contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Project Wizard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Dependency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Exclude Cavities Without Flow Conditions. . . . . . . . . . . . . . . . . 21 Adiabatic Wall . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Roughness. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Computational Domain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Mesh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Load Results Option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Monitoring the Solver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Goal Plot Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Warning Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Post-processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Scaling the Limits of the Legend . . . . . . . . . . . . . . . . . . . . . . . . . 38 Changing Legend Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Orientation of the Legend, Logarithmic Scale . . . . . . . . . . . . . . . 38 Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Exercise 1: Air Conditioning Ducting . . . . . . . . . . . . . . . . . . . . . . . . 52Lesson 2:MeshingObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Case Study: Chemistry Hood . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Project Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Computational Mesh. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64Basic Mesh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64Initial Mesh. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64Geometry Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65Minimum Gap Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65Minimum Wall Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65Result Resolution/Level of Initial Mesh. . . . . . . . . . . . . . . . . . . . . . . 68Manual Global Mesh Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 70Control Planes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Exercise 2: Square Ducting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84Exercise 3: Thin Walled Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91Exercise 4: Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97Exercise 5: Meshing Valve Assembly . . . . . . . . . . . . . . . . . . . . . . . 102Boundary Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102SOLIDWORKS Simulation Contents Lesson 3:Thermal AnalysisObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103Case Study: Electronics Enclosure. . . . . . . . . . . . . . . . . . . . . . . . . . 104Project Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104Fans. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111Fan Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111Perforated Plates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113Free Area Ratio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119Exercise 6: Materials with Orthotropic Thermal Conductivity . . . . 120Exercise 7: Electric Wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Lesson 4:External Transient AnalysisObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133Case Study: Flow Around a Cylinder. . . . . . . . . . . . . . . . . . . . . . . . 134Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135Reynolds Number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135External Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135Transient Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137Turbulence Intensity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137Solution Adaptive Mesh Refinement . . . . . . . . . . . . . . . . . . . . . . . . 138Two Dimensional Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138Computational Domain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139Calculation Control Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139Finishing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140Refinement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140Solving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140Saving. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140Drag Equation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142Unsteady Vortex Shedding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144Time Animation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149Exercise 8: Electronics Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150iiiContents SOLIDWORKS Simulation Lesson 5:Conjugate Heat TransferObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161Case Study: Heated Cold Plate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162Project Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162Conjugate Heat Transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163Real Gases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163Goals Plot in the Solver Window. . . . . . . . . . . . . . . . . . . . . . . . 166Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168Exercise 9: Heat Exchanger with Multiple Fluids . . . . . . . . . . . . . . 169 Lesson 6:EFD ZoomingObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173Case Study: Electronics Enclosure. . . . . . . . . . . . . . . . . . . . . . . . . . 174Project Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174EFD Zooming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174EFD Zooming - Computational Domain . . . . . . . . . . . . . . . . . . 177Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 Lesson 7:Porous MediaObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185Case Study: Catalytic Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . 186Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186Associated Goal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187Porous Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Porosity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Permeability Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Matrix and Fluid Heat Exchange . . . . . . . . . . . . . . . . . . . . . . . . 189Specific area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Dummy Bodies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192Design Modification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201Exercise 10: Channel Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Lesson 8:Rotating Reference FramesObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209Rotating Reference Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210Part 1: Averaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210Case Study: Table Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 ivSOLIDWORKS Simulation ContentsNoise Prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217Broadband Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217Part 2: Sliding Mesh. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218Case Study: Blower Fan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218Tangential Faces of Rotors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220Time Step . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223Part 3: Axial Periodicity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228Exercise 11: Ceiling Fan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229Boundary Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229Computational Domain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Lesson 9:Parametric StudyObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231Case Study: Piston Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232Parametric Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233Steady State Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233Parametric Study. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235Part 1: Goal Optimization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236Input Variable Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237Target Value Dependence Types . . . . . . . . . . . . . . . . . . . . . . . . 238Output Variable Initial Values . . . . . . . . . . . . . . . . . . . . . . . . . . 239Running Optimization Study . . . . . . . . . . . . . . . . . . . . . . . . . . . 239Part 2: Design Scenario. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243Part 3: Multi parameter Optimization. . . . . . . . . . . . . . . . . . . . . . . . 246Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250Exercise 12: Variable Geometry Dependent Solution . . . . . . . . . . . 251Boundary Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252 Lesson 10:Free SurfaceObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253Case Study: Water Tank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254Free Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254Volume of Fluid (VOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261Exercise 13: Water Jet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262Theoretical Results. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268Exercise 14: Dam-Break Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269Experimental Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276References. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276vContents SOLIDWORKS Simulation Lesson 11:CavitationObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277Case Study: Cone Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278Cavitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 Lesson 12:Relative HumidityObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283Relative Humidity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284Case Study: Cook House . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 Lesson 13:Particle TrajectoryObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291Case Study: Hurricane Generator. . . . . . . . . . . . . . . . . . . . . . . . . . . 292Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292Particle Trajectories - Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . 292Particle Study - Physical Settings. . . . . . . . . . . . . . . . . . . . . . . . 297Particle Study - Wall Condition . . . . . . . . . . . . . . . . . . . . . . . . . 298Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299Exercise 15: Uniform Flow Stream. . . . . . . . . . . . . . . . . . . . . . . . . 300 Lesson 14:Supersonic FlowObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305Supersonic Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306Case Study: Conical Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306Drag Coefficient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307Shock Waves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 Lesson 15:FEA Load TransferObjectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313Case Study: Billboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314Problem Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318 vi。

Lecture 9: Sequential Logic ILecture 9: Sequential Logic ILecture 9: Sequential Logic ILecture 9: Sequential Logic ITime borrowing is the ability for critical logic that nominally operates in one cycle or half-cycle to use time left by non-critical logic in an adjacent half-cycle or cycle. Some sequen-tial elements support time borrowing, while others do not. Latching methods which sup-port time borrowing have numerous advantages. They are easier to design because logic can be balanced between cycles or half-cycles. If there is insufficient time at the end of a cycle for an entire gate, systems using time borrowing can apply the remaining time to logic in another cycle, while systems without time borrowing waste the time. Finally, time borrowing helps compensate for inaccuracies in modeling or variations in processing that make some cycles longer and some shorter than predicted because the long cycles can bor-row some of the slack from the short cycles.In addition to these sources of overhead, all synchronous systems operating off a fixed fre-quency clock pay environmental and manufacturing margins. Manufacturing margins occur because a part is only sold at specific frequencies; for example, if a chip is sold in 800 MHz and 1 GHz speed bins, a part that operates at up to 970 MHz must be sold in the 800 MHz bin. Environmental margins occur because the chip must be able to operate at its rated frequency under worst case voltage and temperature, while in an actual system the true environment is likely to be better. These margins can be reduced if the clock fre-quency can be arbitrarily adjusted. Manufacturing margin can be minimized by selling the chip at exactly its worst case operating frequency. Environmental margin can also be reduced by measuring on-chip temperature and voltage and adaptively changing the fre-quency. All of these techniques require accurate knowledge of the worst-case path and good tracking with the worst-case path delay, which can be a difficult problem.3.2 Analysis of Latching TechniquesManufacturing and environmental margins apply to all latching techniques, so will not be considered further. Let’s examine how other sources of overhead impact cycle time.Flip-flops require the data input to settle a setup time before the earliest a skewed clock might arrive. The output becomes valid a propagation delay after the latest a skewed clock might arrive. Therefore, the cycle time is:t cycle = t logic + t d->q + t setup + t skew(EQ 1) Transparent latches are better because they can use time borrowing to hide overhead. Datamust be designed to arrive at the latch t setup + t skew before the falling edge of the latch clock. However, this time is not wasted; instead the next half-cycle can begin using the result as soon as it arrives. Thus, in a system constructed entirely of 2-phase transparent latches:t cycle = t logic + t d1->q1 + t d2->q2(EQ 2)where t d1->q1 and t d2->q2 are the delays of the two static latches. Remember that a flip-flop is just two back-to-back latches, so the propagation delay of a flip-flop is comparable to the propagation delay of two latches.Lecture 9: Sequential Logic IAlso, additional time borrowing is useful in transparent latch systems to balance logic between phases and compensate for uncertainty in delays.Pulsed latch systems have pros and cons relative to transparent latches. The biggest advan-tage is that now only a single latch is used, reducing the propagation delay. The data must arrive at least t setup + t skew before the falling edge of the pulse. If the pulse is wide enough, the pulsed latch will be transparent when the data arrives and there is no wasted time. If the pulse is narrower than this window, there is extra overhead. A wide pulse is also bene-ficial to allow limited amounts of time borrowing. Unfortunately, a wide pulse also increases the number of min-delay problems in which short paths must be padded. The cycle time of a pulsed-latch system is:t cycle = t logic + t d->q + max{0, t setup + t skew - t pulsewidth}(EQ 3) 3.3 RecommendationsFlip-flops were once popular because they are conceptually simplest. As cycle times are getting shorter, the overhead of flip-flops is too large and they have gone out of favor. Thus, the two main contenders are transparent latches and pulsed latches.Transparent latches can eliminate all overhead except their propagation delay. They also allow nearly half a cycle of time borrowing. Pulsed latches can be even faster because only a single latch delay is introduced. However, hiding the setup time and clock skew requires a relatively wide pulse. Such a pulse leads to min-delay problems, as will be seen. Pulsed latches also provide very little time borrowing.Designers willing to do extensive min-delay checking are beginning to favor pulsed latches. Other designers prefer the safety and time borrowing of transparent latches. Fast systems can be built with either technique.4.0 Min-DelayIf there is little logic in a cycle, the clock starting the cycle is skewed early, and the clock ending the cycle is skewed late, data can race through the cycle and be clocked into the next clocked element all in one cycle. This is bad.The contamination delay through logic in a flop-based system must be at least:t cd = t skew + t hold - t cd-flop(EQ 4) The min-delay constraints on 2-phase logic depend how much the phases may overlap. Academic designs often use non-overlapping clock phases to eliminate min-delay prob-lems. Unfortunately, this requires either distributing two phases around the entire chip or building complex clock generators, so high-performance industrial designs usually clock the logic with true and complementary versions of a global clock with nominal 50% duty cycle. For such systems, the contamination delay constraint is the same as for flop-based systems:Lecture 9: Sequential Logic ILecture 9: Sequential Logic ILecture 9: Sequential Logic I。

IBM Engineering Systems Design Rhapsody Kit for DO-178B/CPlease first read document"Rhapsody Kit for DO-178B-C Overview.pdf".It describes the content of the "IBM Engineering Systems Design Rhapsody Kit for DO-178B/C".Version 1.14License AgreementNo part of this publication may be reproduced, transmitted, stored in a retrieval system, nor translated into any human or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written permission of the copyright owner, BTC Embedded Systems AG.The information in this publication is subject to change without notice, and BTC Embedded Systems AG assumes no responsibility for any errors which may appear herein. No warranties, either expressed or implied, are made regarding Rhapsody software including documentation and its fitness for any particular purpose.TrademarksIBM® Engineering Systems Design Rhapsody®, IBM® Engineering Systems Design Rhapsody® ‐ Automatic Test Generation Add On, and IBM® Engineering Systems Design Rhapsody® ‐ TestConductor Add On are registered trademarks of IBM Corporation.All other product or company names mentioned herein may be trademarks or registered trademarks of their respective owners.© Copyright 2000-2020 BTC Embedded Systems AG. All rights reserved.。

ADS常用单词advanced [əd'vɑ:nst] adj. 高级的；先进的；晚期的；年老的v. 前进；增加；上涨（advance的过去式和过去分词形式）design [di'zain] vt. 设计；计划；构思n. 设计；图案vi. 设计system ['sistəm] n. 系统；制度，体制；方法choose [tʃu:z] vt. 选择，决定vi. 选择，挑选enter ['entə] vt. 进入；开始；参加vi. 进去；参加，登场n. [计]回车；输入technology [tek'nɔlədʒi] n. 工艺；术语；技术directory [di'rektəri] n. 目录；工商名录；姓名地址录adj. 指导的；咨询的alphanumeric [,ælfənju:'merik] adj. [计] 字母数字的invalid ['invəli:d] adj. 无效的；有病的；残废的n. 病人；残废者vt. 使伤残；使退役vi. 变得病弱；因病而奉命退役guide [ɡaid] n. 指南；向导；入门书vt. 带领；引导；操纵vi. 担任向导WLAN 无线局域网Bluetooth 蓝牙技术RF System：射频系统mixer ['miksə] n. 搅拌器；混频器；混合器oscillator ['ɔsileitə] n. [电子] 振荡器；摆动物；动摇的人passive ['pæsiv] adj. 被动的，消极的；被动语态circuit ['sə:kit] n. 电路，回路；环道；一圈；巡回vi. 环行vt. 绕回…环行Passive Circuits 被动电路phased [feizd] adj. 定相的Phased Locked Loop 锁相环amplifier ['æmplifaiə] n. 放大器，扩大器；扩音器simulation [,simju'leiʃən] n. 模拟；仿真；模仿；假装device [di'vais] n.元件；装置；策略；图案characterization [,kærəktərai'zeiʃən] 英汉翻译n. 特性描述；描述display [,dis'plei] n. 显示；炫耀vt. 显示；陈列；表现template ['templit] n. 模板，样板electronic [ilek'trɔnik] adj. 电子的notebook ['nəutbuk] n. 笔记本，笔记簿；手册momentum [məu'mentəm] n. 动力；动量；冲力；势头network ['netwə:k] n. 网络；网状物；广播网synthesis ['sinθisis] n. 综合，合成；综合体verification [verifi'keiʃən] n. 确认，查证；核实size [saiz] n. 大小；尺寸adj. 一定尺寸的vt. 依大小排列RFIC：射频集成电路browser ['brauzə] n.浏览书本的人；[电脑]浏览器archive ['ɑ:kaiv] n. 档案馆；档案文件vt. 把…存档template ['templit] n. 模板，样板hierarchy ['haiə,rɑ:ki] n. 层级；等级制度layout ['leiaut]n. 布局；设计；安排；陈列instrument ['instrumənt] n. 仪器；器械；工具；手段；乐器curve [kə:v] n. 曲线；弯曲；曲线图表vt. 使弯曲；弯adj. 弯曲的；曲线形的transient ['trænziənt] adj. 短暂的；路过的n. 瞬变现象；过往旅客；候鸟parameter [pə'ræmitə] n. 参数；参量；系数sweep [swi:p] vt. 扫除；扫描；打扫n. 打扫，扫除；范围；全胜noise [nɔiz] n. 响声；杂音；噪音vt. 谣传band [bænd] n. 带；松紧带；传送带；乐队；一帮vi. 联合；聚焦vt. 使团结GENESYS：通用工程系统archive ['ɑ:kaiv] n. 档案馆；档案文件vt. 把…存档directory [di'rektəri] n. 目录；工商名录；姓名地址录adj. 指导的；咨询的startup ['sta:tʌp]n. 启动；开办f ilter [filtə] vi. 慢慢传开；滤过；渗入n. 滤波器；过滤器；滤光器；筛选vt. 过滤；渗透；用过滤法除去bandpass ['bændpɑ:s] n. 带通，通频带amplifier ['æmplifaiə] n. 放大器，扩大器；扩音器polar ['pəulə] adj. 极地的；两极的；正好相反的n. [数]极面；极线domain [dəu'mein] n. 领域；产业；地产；[计]域名parameter [pə'ræmitə] n. 参数；参量；系数frequency ['frikwənsi] n. 频率；频繁conversion [kən'və:ʃən] n. 转换；变换；改变信仰；兑换kit [kit] n. 工具箱；成套工具vt. 装备vi. 装备guide [ɡaid] n. 指南；向导；入门书vt. 带领；引导；操纵vi. 担任向导hide [haid] vt. 隐藏；隐瞒；鞭打vi. 隐藏n. 躲藏处；躲藏；兽皮install [in'stɔ:l] vt. 任命；安装；安顿setup ['setʌp] n. 设置；装备；组织；计划；机构；调整configuration [kən,fiɡju'reiʃən]n. 配置；结构；外形layout ['leiaut] n. 布局；设计；安排；陈列lumped [lʌmpt] adj. 集中的；总集的；成块的component [kəm'pəunənt] adj. 组成的，构成的n. 成分；元件；组件artwork ['ɑ:twə:k] n. 艺术品；美术品；插图source [sɔ:s] n. 来源；原始资料；水源controlled [kən'trəuld] adj. 受约束的；克制的；受控制的v. 控制；指挥；约束（control的过去式)domain [dəu'mein] n. 领域；产业；地产；[计]域名modulate ['mɔdjuleit] 英汉翻译vt. 调节；调整；（信号）调制vi. 调制；转调transient ['trænziənt] adj. 短暂的；路过的n. 瞬变现象；过往旅客；候鸟channel ['tʃænəl] vt. 引导，开导；形成河道n. 海峡；频道；通道instrument ['instrumənt] n. 仪器；器械；工具；手段；乐器probe [prəub] n. 探针；调查vi. 调查；探测vt. 探查；用探针探测algorithmic [,ælɡə'riðmik] 英汉翻译adj. 算法的；规则系统的circuit ['sə:kit] n. 电路，回路；环道；一圈；巡回vi. 环行vt. 绕回…环行microstrip ['maikrəustrip] n. 微波传输带impedance [im'pi:dəns] n. [电]阻抗matching ['mætʃiŋ] adj. 相配的；相称的；一致的n. 匹配v. 使…相配（match的ing形式）。

Control System Toolbox设计和分析控制系统产品概览1:56Control System Toolbox™为系统地分析、设计和调节线性控制系统提供行业标准算法和工具。

您可以将您的系统指定为传递函数、状态空间、零极点增益或频率响应模型。

通过交互式工具和命令行函数（如阶跃响应图和波特图），您可以实现时域和频域中系统行为的可视化效果。

可以使用自动PID 控制器调节、波特回路整形、根轨迹方法、LQR/LQG 设计及其他交互式和自动化方法来调节补偿器参数。

您可以通过校验上升时间、超调量、稳定时间、增益和相位裕度及其他要求来验证您的设计。

Control System ToolboxDesign and analyze control systemsProduct Overview1:56Control System Toolbox™ provides industry-standard algorithms and tools for systematically analyzing, designing, and tuning linear control systems. You can specify your system as a transfer function, state-space, pole-zero-gain, or frequency-response model. Interactive tools and command-line functions, such as step response plot and Bode plot, let you visualize system behavior in time domain and frequency domain. You can tune compensator parameters using automatic PID controller tuning, Bode loop shaping, root locus method, LQR/LQG design, and other interactive and automated techniques. You can validate your design by verifying rise time, overshoot, settling time, gain and phase margins, and other requirements.简介Control System Toolbox™为系统地分析、设计和调节线性控制系统提供行业标准算法和工具。