DL-5345-XT中文资料

1-101HT-13/4 (5 mm) Low Profile LED Lamps Technical DataFeatures• High Intensity• Low Profile: 5.8 mm (0.23in.) Nominal• T-13/4 Diameter Package • Diffused and Non-diffused Types• General Purpose Leads• IC Compatible/Low Current Requirements• Reliable and RuggedDescriptionThe HLMP-335X/-336X Series are Gallium Arsenide Phosphide on Gallium Phosphide HighEfficiency Red Light Emitting Diodes.The HLMP-345X/-346X Series are Gallium Arsenide Phosphide on Gallium Phosphide Yellow Light Emitting Diodes.The HLMP-355X/-356X Series are Gallium Phosphide Green Light Emitting Diodes.The Low Profile T-13/4 package provides space savings and is excellent for backlighting applications.Package DimensionsHLMP-335X Series HLMP-336X Series HLMP-345X Series HLMP-346X Series HLMP-355X Series HLMP-356X Series5964-9295E1-1021-103Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3350 2.1 3.5mcdI F = 10 mA 3351 5.47.0(Figure 8)33658.610.0336613.818.02θ1/2Including Angle Between Half 335050Deg.Note 1 (Figure 11)Luminous Intensity Points335150336545336645λPEAK Peak Wavelength 635nm Measurement at Peak (Figure 1)λd Dominant Wavelength 626nm Note 2∆λ1/2Spectral Line Halfwidth 40nm τs Speed of Response 90ns C Capacitance 11pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage1.92.4V I F = 10 mA (Figure 7)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy145lm/WNote 3High Efficiency Red HLMP-335X/-336X Series Notes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Figure 8. Relative Luminous Intensity vs. Forward Current.Figure 7. Forward Current vs.Forward Voltage.Figure 9. Relative Efficiency(Luminous Intensity per Unit Current)vs. Peak Current.1-104Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 11. Relative Luminous Intensity vs. Angular Displacement.Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3450 2.2 4.0mcdI F = 10 mA 34515.710.0(Figure 13)3465 5.712.034669.218.02θ1/2Including Angle Between Half 345050Deg.Note 1 (Figure 16)Luminous Intensity Points345150346545346645λPEAK Peak Wavelength 583nm Measurement at Peak (Figure 1)λd Dominant Wavelength 585nm Note 2∆λ1/2Spectral Line Halfwidth 36nm τs Speed of Response 90ns C Capacitance 15pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage2.02.4V I F = 10 mA (Figure 12)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy500lm/WNote 3Yellow HLMP-345X/-346X SeriesNotes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.1-105Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 16. Relative Luminous Intensity vs. Angular Displacement.Figure 13. Relative Luminous Intensity vs. Forward Current.Figure 14. Relative Efficiency(Luminous Intensity per Unit Current)vs. Peak Current.Figure 12. Forward Current vs.Forward Voltage.605040302010V – FORWARD VOLTAGE – V FI – F O R W A R D C U RRE N T – m AF1-106Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3553 1.6 3.2mcdI F = 10 mA 3554 6.710.0(Figure 18)35674.27.0356810.615.02θ1/2Including Angle Between Half 355350Deg.Note 1 (Figure 21)Luminous Intensity Points355450356740356840λPEAK Peak Wavelength 565nm Measurement at Peak (Figure 1)λd Dominant Wavelength 569nm Note 2∆λ1/2Spectral Line Halfwidth 28nm τs Speed of Response 500ns C Capacitance 18pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage2.12.7V I F = 10 mA (Figure 17)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy595lm/WNote 3Green HLMP-355X/-356X SeriesNotes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Figure 17. Forward Current vs.Forward Voltage.Figure 19. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Figure 18. Relative Luminous Intensity vs. Forward Current.1-107Figure 20. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 21. Relative Luminous Intensity vs. Angular Displacement.。

Latitude 5540用户手册4 2023注意、小心和警告:“注意”表示可帮助您更好地使用产品的重要信息。

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章 1: Latitude 5540的视图 (8)右 (8)左侧 (9)顶部 (10)正面 (11)背面 (12)底部 (12)服务编号 (12)电池电量和状态指示灯 (13)章 2: 设置 Latitude 5540 (14)章 3: Latitude 5540 的规格 (16)尺寸和重量 (16)处理器 (16)芯片组 (17)操作系统 (18)内存 (18)外部端口 (19)内部插槽 (19)以太网 (19)无线模块 (20)WWAN 模块 (20)音频 (21)存储 (22)介质卡读卡器 (22)键盘 (22)键盘功能键 (23)摄像头 (24)触控板 (24)电源适配器 (25)电池 (26)显示屏 (27)指纹读取器（可选） (28)传感器 (28)GPU —集成 (29)GPU —独立 (29)外部显示屏支持 (29)硬件安全性 (29)智能卡读卡器 (30)非接触式智能卡读卡器 (30)接触式智能卡读卡器 (31)操作和存储环境 (32)戴尔支持政策 (32)目录3Dell Optimizer 戴尔智能调优软件 (33)章 4: 拆装计算机内部组件 (34)安全说明 (34)拆装计算机内部组件之前 (34)安全防范措施 (35)静电放电— ESD 保护 (35)ESD 现场服务工具包 (36)运输敏感组件 (36)拆装计算机内部组件之后 (36)BitLocker (37)建议工具 (37)螺钉列表 (37)Latitude 5540的主要组件 (38)章 5: 卸下和安装客户可更换部件 (CRU) (41)SIM 卡托盘（可选） (41)卸下 SIM 卡托盘（可选） (41)安装 SIM 卡托盘（可选） (42)基座护盖 (43)卸下底座护盖 (43)安装底座护盖 (45)无线网卡 (48)卸下 WLAN 卡 (48)安装 WLAN 卡 (49)WWAN 卡（可选） (50)卸下 4G WWAN 卡（可选） (50)安装 4G WWAN 卡（可选） (51)卸下 5G WWAN 卡（可选） (53)安装 5G WWAN 卡（可选） (54)内存模块 (55)卸下内存模块 (55)安装内存模块 (56)固态驱动器 (57)卸下插槽 1 中的 M.2 2230 固态硬盘 (57)在插槽 1 中安装 M.2 2230 固态硬盘 (58)卸下插槽 1 中的 M.2 2280 固态硬盘 (59)在插槽 1 中安装 M.2 2280 固态硬盘 (60)卸下插槽 2 中的 M.2 2230 固态硬盘 (61)在插槽 2 中安装 M.2 2230 固态硬盘 (62)风扇 (63)卸下风扇 (63)安装风扇 (63)章 6: 卸下和安装现场可更换部件 (FRU) (65)电池 (65)锂离子电池预防措施 (65)4目录组件内框架 (69)卸下组件内框架 (69)安装组件内框架 (70)扬声器 (72)卸下扬声器 (72)安装扬声器 (73)币形电池 (74)卸下钮扣电池 (74)安装钮扣电池 (75)散热器 (76)卸下散热器（独立 GPU） (76)安装散热器（独立 GPU） (77)卸下散热器（集成 GPU） (78)安装散热器（集成 GPU） (79)系统板 (80)卸下系统主板 (80)安装系统主板 (83)电源按钮 (86)卸下电源按钮 (86)安装电源按钮 (87)电源按钮，带可选的指纹读取器 (88)卸下带可选指纹读取器的电源按钮 (88)安装带可选指纹读取器的电源按钮 (89)键盘 (90)卸下键盘 (90)安装键盘 (92)显示屏部件 (94)卸下显示屏组件 (94)安装显示屏组件 (97)显示屏挡板 (99)卸下显示屏挡板 (99)安装显示屏挡板 (99)显示屏面板 (100)卸下显示屏面板 (100)安装显示屏面板 (103)摄像头模块 (106)卸下摄像头模块 (106)安装摄像头模块 (107)显示屏转轴 (108)卸下显示屏转轴 (108)安装显示屏转轴 (109)显示屏后盖 (110)卸下显示屏后盖 (110)安装显示屏后盖 (111)显示屏线缆 (112)卸下显示屏线缆 (112)安装显示屏线缆 (113)传感器板 (114)目录5指纹读取器（可选） (116)卸下指纹读取器（可选） (116)安装指纹读取器（可选） (117)智能卡读卡器 (119)卸下智能卡读卡器 (119)安装智能卡读卡器 (119)虚拟 SIM 卡插槽填充挡片 (120)卸下虚拟 SIM 卡插槽填充挡片 (120)安装虚拟 SIM 卡插槽填充挡片 (121)掌托部件 (122)卸下掌托组件 (122)安装掌托组件 (124)章 7: 软件 (126)操作系统 (126)驱动程序与下载 (126)章 8: BIOS 设置 (127)进入 BIOS 设置程序 (127)导航键 (127)一次性启动菜单 (127)系统设置选项 (128)更新 BIOS (138)在 Windows 中更新 BIOS (138)在 Linux 和 Ubuntu 环境中更新 BIOS (138)在 Windows 环境中使用 USB 驱动器更新 BIOS (138)从 F12 一次性启动菜单更新 BIOS (139)系统密码和设置密码 (139)分配系统设置密码 (140)删除或更改现有的系统设置密码 (140)清除 CMOS 设置 (141)清除 BIOS（系统设置）和系统密码 (141)章 9: 故障排除 (142)处理膨胀锂离子电池 (142)找到戴尔计算机的服务编号或快速服务代码 (142)Dell SupportAssist 启动前系统性能检查诊断程序 (142)运行 SupportAssist 启动前系统性能检查 (143)内置自检 (BIST) (143)M-BIST (143)液晶屏电源导轨测试 (L-BIST) (143)液晶屏内置自检 (BIST) (144)系统诊断指示灯 (144)恢复操作系统 (145)实时时钟 (RTC) 重置 (145)备份介质和恢复选项 (146)Wi-Fi 重启 (146)6目录耗尽剩余弱电（执行硬重置） (146)章 10: 获取帮助和联系戴尔 (147)目录7Latitude 5540的视图右1.microSD 卡插槽针对 microSD 卡进行读取和写入。

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目录组件标识 (8)前面板组件 (8)前面板 LED 指示灯和按钮 (10)UID 按钮功能 (13)前面板 LED 指示灯电源故障代码 (13)Systems Insight 显示屏 LED 指示灯 (14)Systems Insight 显示屏组合 LED 指示灯说明 (15)后面板组件 (17)后面板 LED 指示灯 (17)主板组件 (19)系统维护开关说明 (20)DIMM 标签识别 (21)DIMM 插槽位置 (22)NVDIMM 识别 (22)NVDIMM 二维码 (23)识别 NVDIMM LED 指示灯 (24)NVDIMM-N LED 指示灯组合 (24)NVDIMM 功能 LED 指示灯运行模式 (24)处理器、散热片和插槽组件 (25)驱动器 (25)SAS/SATA 驱动器组件和 LED 指示灯 (26)NVMe SSD LED 指示灯定义 (26)uFF 驱动器组件和 LED 指示灯 (28)风扇托架编号 (29)驱动器盒识别 (29)驱动器托架编号 (31)驱动器托架编号：Smart Array 控制器 (31)驱动器托架编号：SAS 扩展卡 (33)驱动器托架编号：NVMe 驱动器 (35)uFF 驱动器托架编号 (36)转接卡组件 (37)带集成备用电池装置组件和 LED 指示灯的 HPE Flex 插槽电源 (41)检查备用电池电量 (41)HPE 12G SAS 扩展卡端口编号 (42)HPE Smart Array P824i-p MR Gen10 控制器 (42)操作 (44)打开服务器电源 (44)关闭服务器电源 (44)从机架中拉出服务器 (44)从机架中卸下服务器 (45)使用理线臂固定电缆 (45)卸下检修面板 (46)安装检修面板 (47)卸下风扇笼 (47)安装风扇笼 (48)卸下隔气罩或中板驱动器笼 (48)安装隔气罩 (50)卸下转接卡笼 (51)3卸下转接卡插槽空闲挡板 (52)卸下硬盘驱动器空闲挡板 (53)松开理线臂 (53)找到 Systems Insight 显示屏 (53)设置 (55)HPE 支持服务 (55)设置服务器 (55)运行要求 (58)空间要求与通风要求 (58)温度要求 (59)电源要求 (59)电气接地要求 (59)将直流电源线连接到直流电源 (59)服务器警告和注意事项 (60)机架警告 (61)静电释放 (61)服务器包装箱内物品 (62)安装硬件选件 (62)POST 屏幕选项 (62)安装或部署操作系统 (62)注册服务器 (62)硬件选件安装 (63)产品规格说明简介 (63)简介 (63)在安全挡板中安装风扇过滤器 (63)安装挡板和挡板锁 (64)电源供电选件 (64)热插拔电源计算 (64)安装冗余热插拔电源 (64)驱动器选件 (65)驱动器准则 (65)支持的驱动器托架 (66)安装热插拔 SAS 或 SATA 驱动器 (66)安装 NVMe 驱动器 (67)安装 uFF 驱动器和 SCM 驱动器托盘 (68)安装 M.2 驱动器 (69)风扇选件 (70)安装高性能风扇 (71)内存选件 (72)DIMM 和 NVDIMM 安装信息 (72)HPE SmartMemory 速度信息 (73)安装 DIMM (73)HPE 16GB NVDIMM 选件 (74)NVDIMM 支持的服务器要求 (74)安装 NVDIMM (74)为 NVDIMM 配置服务器 (76)NVDIMM 清理 (76)NVDIMM 移动准则 (77)HPE 可扩展持久性内存（仅限 CTO） (77)控制器选件 (78)安装存储控制器 (78)在配置的服务器中安装 HPE Smart Array P824i-p MR Gen10 控制器 (79)4阵列和控制器配置 (80)安装通用介质托架 (81)驱动器笼选件 (83)安装前 8NVMe SSD Express 托架驱动器笼 (83)安装前 6SFF SAS/SATA + 2NVMe Premium 驱动器笼 (85)安装通风标签 (87)在盒 1 中安装前 8SFF SAS/SATA 驱动器笼 (88)在盒 2 中安装前 8SFF SAS/SATA 驱动器笼 (90)安装前 2SFF NVMe/SAS/SATA Premium 驱动器笼 (92)安装中板 4LFF SAS/SATA 驱动器笼 (95)在主转接卡或辅助转接卡中安装后 2SFF SAS/SATA 驱动器笼 (98)在电源上方安装后 2SFF SAS/SATA 驱动器笼 (100)安装后 3LFF SAS/SATA 驱动器笼 (103)转接卡和转接卡笼选件 (104)安装主转接卡和辅助转接卡 (105)安装第三转接卡 (106)安装辅助转接卡笼 (107)安装第三转接卡笼 (108)安装 2NVMe slimSAS 转接卡选件 (111)安装 8NVMe slimSAS 转接卡选件 (112)扩展槽 (113)支持的 PCIe 外形尺寸 (113)安装扩展卡 (114)安装 12G SAS 扩展卡 (116)安装加速器或 GPU (118)安装入侵检测开关 (122)安装 Smart Storage 电池 (123)安装后串行端口接口 (125)安装 Systems Insight 显示屏 (127)安装 FlexibleLOM 适配器 (129)安装 1U 或高性能散热片 (131)安装处理器 (133)HPE Trusted Platform Module 2.0 Gen10 选件 (136)概述 (136)HPE Trusted Platform Module 2.0 准则 (136)安装并启用 HPE TPM 2.0 Gen10 套件 (136)安装 Trusted Platform Module 卡 (137)启用 Trusted Platform Module (139)保留恢复密钥/密码 (140)布线 (141)HPE ProLiant Gen10 DL 服务器存储布线准则 (141)布线图 (141)电缆布线：适用于 SFF 的前 2SFF 驱动器选件 (143)电缆布线：适用于 LFF 的前 2SFF 驱动器选件 (144)电缆布线：前 2SFF 驱动器选件（3 位置电缆） (145)电缆布线：前 8SFF 驱动器选件 (146)电缆布线：前 8SFF NVMe/SAS premium 驱动器选件 (148)电缆布线：前 8SFF NVMe 驱动器选件 (148)电缆布线：适用于 SFF 的前 2SFF NVMe 驱动器选件 (150)电缆布线：适用于 LFF 的前 2SFF NVMe 驱动器选件 (151)电缆布线：中间板 4LFF 驱动器选件 (151)电缆布线：后 3LFF 驱动器选件 (152)电缆布线：后 2SFF 驱动器选件 (152)电缆布线：HPE 12G SAS 扩展卡到控制器 (153)5电缆布线：Smart Array P824i-P 控制器 (154)电缆布线：Systems Insight 显示屏 (156)软件和配置实用程序 (158)服务器模式 (158)产品规格说明简介 (158)Active Health System Viewer (158)Active Health System (159)Active Health System 数据收集 (159)Active Health System 日志 (159)HPE iLO 5 (159)iLO 联合 (160)iLO服务端口 (160)iLO RESTful API (161)RESTful Interface Tool (161)iLO Amplifier Pack (161)Integrated Management Log (161)Intelligent Provisioning (161)Intelligent Provisioning 操作 (162)管理安全性 (162)适用于 Windows 和 Linux 的 Scripting Toolkit (163)UEFI System Utilities (163)选择引导模式 (163)安全引导 (164)启动嵌入式 UEFI Shell (164)HPE Smart Storage Administrator (165)HPE MR Storage Administrator (165)StorCLI (166)USB 支持 (166)外置 USB 功能 (166)支持冗余 ROM (166)安全性和安全优势 (166)使系统保持最新状态 (166)更新固件或系统 ROM (166)Service Pack for ProLiant (167)更新 System Utilities 中的固件 (168)从 UEFI 嵌入式 Shell 中更新固件 (168)联机刷新组件 (169)驱动程序 (169)软件和固件 (169)支持的操作系统版本 (169)HPE Pointnext 产品 (169)主动通知 (170)故障排除 (171)NMI 功能 (171)故障排除资源 (171)更换电池 (172)安全、保修和法规信息 (173)安全和管制标准 (173)6保修信息 (173)法规信息 (173)白俄罗斯、哈萨克斯坦、俄罗斯标记 (173)土耳其 RoHS 材料内容声明 (174)乌克兰 RoHS 材料内容声明 (174)规格 (175)环境规格 (175)机械规格 (175)电源规格 (176)HPE 500 瓦 Flex 插槽铂金级热插拔低卤电源 (177)HPE 800 瓦 Flex 插槽白金级热插拔低卤电源 (177)HPE 800 瓦 Flex 插槽超钛金级热插拔低卤电源 (178)HPE 800 瓦 Flex 插槽通用热插拔低卤电源 (179)HPE 800 瓦 Flex 插槽 -48 伏直流热插拔低卤电源 (180)HPE 800 瓦 Flex 插槽可扩展持久型内存电源 (181)HPE 1600 瓦 Flex 插槽白金级热插拔低卤电源 (181)支持信息和其他资源 (183)获取 Hewlett Packard Enterprise 支持 (183)获取更新 (183)客户自行维修 (184)远程支持 (184)保修信息 (184)法规信息 (184)文档反馈 (185)7组件标识前面板组件SFF 前面板组件编号说明1盒 1（可选驱动器或通用介质托架）2盒 2（可选驱动器）3盒 3 驱动器 1-84序列号标签拉片或可选Systems Insight 显示屏5iLO 服务端口6USB 3.0 端口通用介质托架组件编号说明1USB 2.0 端口2视频显示端口3光驱（可选）4驱动器（可选）8组件标识12 驱动器 LFF 前面板组件编号说明1驱动器托架8 驱动器 LFF 机型前面板组件编号说明1驱动器（可选）2LFF 电源开关模块3驱动器托架LFF 电源开关模块组件组件标识9编号说明1光驱2序列号标签拉片3USB 3.0 端口4iLO 服务端口5视频显示端口前面板 LED 指示灯和按钮SFF 前面板 LED 指示灯和按钮编号说明状态1开机/待机按钮和系统电源 LED 指示灯*绿色常亮 = 系统已启动绿色闪烁（1 Hz/周每秒）= 正在执行开机过程琥珀色常亮 = 系统处于待机状态熄灭 = 未通电†2运行状况 LED 指示灯*绿色常亮 = 正常绿色闪烁（1 赫兹/周每秒）= 正在重新引导 iLO 琥珀色闪烁 = 系统性能下降红色闪烁（1 Hz/周每秒）= 系统出现严重问题**续10组件标识3网卡状态 LED 指示灯*绿色常亮 = 链接到网络上绿色闪烁（1 Hz/周每秒）= 具有网络活动熄灭 = 没有网络活动4UID 按钮/LED 指示灯*蓝色常亮 = 已激活闪烁蓝色：• 1 Hz/周每秒 = 正在进行远程管理或固件升级• 4 Hz/周每秒 = 已启动 iLO 手动重新引导序列•8 Hz/周每秒 = 正在进行 iLO 手动重新引导序列熄灭 = 已停用*当此表中所述的 4 个 LED 指示灯同时闪烁时，表示发生电源故障。

特 征• 全集成MIL-STD-1553接口终端• 灵活的处理器/存储器接口 • 标准的4K ×16以及可选的 12K ×16或8K ×17RAM • 可选的RAM 奇偶产生/校验 • 自动BC 重试• 可编程的BC 间隔定时 • BC 帧自动重复• 灵活的RT 数据缓存 • 可编程的非法化 • 可任选的消息监控器 • 同时制RT/监控器模式通道A 通道B 参见命名信息以获得可用的存储器图1 ACE 模块图表1注：注1到注6适用于接收器差分电阻及差分电容的说明⑴该说明包括接收器及发送器（在内部是连在一起的）⑵阻抗的测试是直接在BU-65170/61580××混合器的管脚TX/RX A(B)及TX/RX A(B)之间进行的。

⑶假定混合器所有的电源及地输入端都被连接。

⑷该说明适用于上电及非上电两种情况⑸该说明假定是2V rms的平衡、差分、正旋输入的情况，适用频率范围是75KHz到1MHz。

⑹所给的最小电阻及最大电容参数在整个工作范围内都是满足要求的，但未经在整个工作范围内测试。

⑺假定共模电压的频率范围是直流到2MHz，在短截线一侧的隔离变压器的管脚上（直接耦合或变压器耦合）测得，以混合器的地为参考点。

使用的变压器必须是DDC推荐的或能提供相同的最小CMRR（共模抑制比）的其它变压器。

⑻对最小消息间间隔定时来说，其典型值在软件的控制下可以增加到（65535us 减去消息本身的时间），其单位增量是1us。

⑼是软件可编程的（4个选项），包括RT-to-RT暂停（发送指令的中间奇偶位到发送RT状态的中间同步位之间的时间）。

⑽是对+5V逻辑及收发器而言的，对通道A及通道B来说，是+5V。

⑾是从指令字的中间奇偶位过零点开始到RT状态字的中间同步位过零点为止进行测量的。

⑿对BU-65171、BU-61581、及BU-61586的说明与对BU-65170、BU-61580、及BU-61585的说明是分别完全相同的。

MIL -DTL - 5541F铝和铝合金的化学转化膜1.范围范围。

此规格涉及通过与表面爲铝和铝合金的化学转化材料反应而组成的化学转化膜。

分类。

化学转化膜有如下类型和等级。

类型。

化学转化膜有如下类型(见3.1)：类型I—包含六价铬的组成物类型II—无六价铬的组成物1.2.2 等级。

通过于铝和铝合金化学反应贰组成的材料有如下等级（见6.1和6.4）等级1A—爲最大限度保护防止喷涂的或者未喷涂处的腐蚀、等级3—爲保护防止需低电性阻值处的腐蚀2. 适用文件2.1 大意：此部分所列文件在本说明的第三和第四部分都有详细列明。

本部分不包含此说明中其他章节所引用的文件，推荐的附加信息文件以及用作事例的文件。

爲确保此清单的完整性已作出很多努力，文件使用者应注意，必须满足章节3或4引用文件的要求，不管这些文件有没有在此列明。

2.2 政府文件2.2.1 规格和标准。

以下规格和标准组成本文件的一部分。

除非特别指定，这些文件的问题引用在恳请或合同中。

联邦标准FED-STD-141--- 喷涂、油漆、涂漆和其他相关材料：检验、抽验和测试的方法国防部标准MIL-PRF-23377 --- 涂底漆：环氧基树脂，高固形化MIL-DTL-81706--- 用于涂覆铝及铝合金的化学转化膜MIL-PRF-85582--- 涂底漆：环氧基树脂，waterborne( 这些文件的副本可以在网站/quicksearch或者 在线查看，或者也可以从位于PA19111-5094费城4D大厦700罗宾逊大街的标准文件预定服务台索取)2.3 非政府出版物。

以下规格和标准组成本文件的一部分。

除非特别指定，这些文件的问题引用在恳请或合同中。

美国材料试验协会ASTM-B117 ---- 盐雾试验仪器操作ASTM-D3359--- 胶带附着力测试（这些文件副本可以从位于PA19428-2959 ,west conshohocken,ASTM 获得或者从网站http: //了解）美国质量协会（ASQ）ASQ-Z 1.4 --- 通过属性进行程序，抽样及台板检验（此文件副本可从位于美国密尔沃基市的美国质量协会获得或从网站了解到。

“经久耐用...轻松连接。

”欧盟联系人Cognitive LLCNordstrasse 5Weimar 99427Germany包装清单:将电源连接到 DLXi:如果不提供电源，请选择具有以下规格的电源：UL 认证，NEC 2 类电源，输入额定 100-240 Vac，1.5/0.8 A，50/60 Hz；额定输出 24 Vdc，3.125 A，最低 75 瓦。

环境温度工作范围：5-40摄氏度。

电源连接器为 3 针 DIN 型。

访问 > 支持 > 驱动程序和下载以查找最新的打印机驱动程序、软件和文档。

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警告!:按照顺序或严重执行步骤 3 和 4 上电打印机和电源可能会发生电气损坏，从而使保修失效。

ATTENTION:Suivez les étapes 3 et 4 de mise sous tension dans l’ordre ou sérieusementdes dommages électriques pourraient survenir à l’imprimante et à l’alimentation annulant la garantie.PrintheadPaper spindleLabel rollDrive roller123ON/OFF switch装载介质:警告!: ATTENTION!:对于热敏打印机（DBDxx-xxxx-xxx），请参阅本指南的“连接数据线”部分。

对于热转印打印机（DBDxx-xxxx-xxx），请参阅本指南的“装载色带”部分。

图中所示为热转印（TT）型。

为了清楚直观，图中打印机的介质盖已被取下。

装载色带（热转印打印机）：松开打印头注意：色带头上的文字应当朝向下方正对打印机。

Transmitter Optical, Electrical CharacteristicsParameter Symbol Min Typ Max Unit Note Input differential impedance R in100ΩDifferential data input swing V in PP 1001200mVTransmit Disable Input High V oltage 2.0VTransmit Disable Input Low V oltage 0.8 VTransmit Fault OutputHighV oltage 2.0VTransmit Fault Output LowV oltage 0.8 VTransmit Disable Assert Time 0.14 5 µsOptical Transmit Power P O-9.5-3 dBm Average Power Extinction Ratio ER 9 dBOutput Spectrum Width(RMS) ∆λ 4 nmReceiver Optical, Electrical CharacteristicsParameter Symbol Min Typ Max Unit Note Single ended data output swing V out PP 200 800 mVReceiver Loss of Signal Output2 VV oltage -highReceiver Loss of Signal Output0.8 VV oltage -lowSensitivity Sen -20 dBm BER<1E-10 Maximum Input Power P inMAX-3 dBmSignal detect Range -30 -21 dBmSignal detect-Hysteresis 0.5 dBAbsolute Maximum RatingsParameter Symbol Min Max Unit Note Storage Temperature T S-40 +85 ℃Operating Temperature T O0 +70 ℃Power Supply V oltage V CC-0.5 6.0 VTop of board Bottom of boardPin Assignment:Pin NameDescription1 VEET Transmitter Ground2 TXFAULT Transmitter Fault.3 TXDIS Transmitter Disable.4 MOD_DEF(2) SDA Serial Data Signal5 MOD_DEF(1) SCL Serial Clock Signal6 MOD_DEF(0) Grounded within the module.7 Rate SelectNo connection required8 LOS Loss of Signal indication. Logic 0 indicates normal operation. 9 VEER Receiver Ground 10 VEER Receiver Ground 11 VEER Receiver Ground 12 RD- Receiver Inverted DATA out. 13 RD+ Receiver Non-inverted DATA out. 14 VEER Receiver Ground 15 VCCR Receiver Power Supply 16 VCCT Transmitter Power Supply 17 VEET Transmitter Ground18 TD+ Transmitter Non-Inverted DATA in. 19 TD- Transmitter Inverted DATA in. 20VEETTransmitter GroundTransmitter SectionThe transmitter sectionconsists of 1310nm FPlaser in an eye safe opticalsubassembly (OSA) whichmates to the fiber cable.The laser OSA is driven bya LD driver IC whichconverts differential inputLVPECL logic signals intoan analog laser drivingcurrent.TX-FAULTTX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩ resistor on the host board. Pull up voltage between 2.0V and VccT, R+0.3V. When high, output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.When sensing an improper power level in the laser driver, the SFP sets this signal high and turns off the laser. TX-FAULT can be reset with the TX-DISABLE line. The signal is in TTL level.TX-DISABLETX disable is an input that is used to shut down the transmitter optical output. It is pulled up within the module with a 4.7 – 10 KΩ resistor. Its states are: Low (0 – 0.8V): Transmitter on; (>0.8, < 2.0V): Undefined; High (2.0 – 3.465V): Transmitter Disabled; Open: Transmitter Disabled. The TX-DISABLE signal is high (TTL logic “1”) to turn off the laser output. The laser will turn on when TX-DISABLE is low (TTL logic “0”).TD-/+These are the differential transmitter inputs. They are AC-coupled, differential lines with 100Ω differential termination inside the module. The AC coupling is done inside the module and is thus not required on the host board. The inputs will accept differential swings of 500 – 2400 mV (250 – 1200 mV single-ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single-ended) be used for best EMI performance.Receiver SectionThe receiver utilizes an InGaAs PIN photodiode mounted together with a trans-impedance preamplifier IC in an OSA. This OSA is connected to a circuit providing post-amplification quantization, and optical signal detection.RX-LOSLOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩresistor. Pull up voltage between 2.0V and VccT, R+0.3V. When high, this output indicates the received optical power is below the worst-case receiver sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.The RX-LOS is high (TTL logic “1”) when there is no incoming light from the companion transceiver. This signal is normally used by the system for the diagnostic purpose. The signal is operated in TTL level.RD-/+These are the differential receiver outputs. They are AC coupled 100Ω differential lines which should be terminated with 100 Ω(differential) at the user SERDES. The AC coupling is done inside the module and is thus not required on the host board. The voltage swing on these lines will be between 370 and 2000 mV differential (185 – 1000 mV single ended) when properly terminated.Recommended Interface CircuitDimensions are in millimeters. All dimensions are ±0.1mm unless otherwise specified. (unit:mm).Statement:Genuine-optical company has the ultimate explanation authority to the content of the product material, if there have some modifies, we’re sorry for can’t give a notice.Users should for our company on their one's own uses performance should having prove going on of products, our company is not responsible for performance of user's products . Any standard , agreement that this text quotes are only for referential use, do not do the basis of examining the quality of the products , whether the products are qualified to produce factory's test stone to fix with our company.Version: V2.1Publishing Date: 2005-04-28Contact Information:Address: Huagong Tech BDG, Science &Technology Region of Hust,Donghu High-Tech Zone, Wuhan Hubei, P.R.ChinaPost Code: 430223Tel: +86-27-87180097Website: 。

DTS634/DSS633-F型三相电子式电能表使用说明书ZTY0.464.212浙制00000205号浙江正泰仪器仪表有限责任公司二0一二年四月1．概述DTS634、DSS633(LED)型三相电子式有功电能表是我公司生产的一种新型电子式电能表，符合GB/T17215.321-2008 《交流点测量设备特殊要求第21部分：静止式有功电能表（1级和2级）》标准；采用先进的SMT生产工艺设计、制作，用于计量三相有功总电能、分相有功电能；具有断相指示功能、红外和485通讯功能，通讯规约符合DL/T645-1997 《电能表通讯规约》要求。

具有计量准确、稳定性好和抗干扰能力强的优点。

1.1 型号名称及代表意义1.2 产品特点1.2.1 本产品的结构设计合理美观，生产工艺性好，安装维护方便；1.2.2 能准确计量三相有功总电量，分相有功电量，通过数码管进行轮显显示；1.2.3 电能表的电路设计合理，全部采用性能稳定、功耗低的工业级元器件，具有很好的抗干扰能力；1.2.4 具有红外和RS485两种通讯功能，可以存储和抄收电量；1.2.5 电能脉冲信号以无源方式输出，可供电表校验或抄表。

2. 工作原理本机采用三相专用计量芯片，其内部原理框图如图1所示：图1通过电阻分压网络和电流互感器分别对三相输入电压信号和电流信号进行采样，而后送到电能计量芯片，内部经过A/D转换和乘法器电路进行乘法运算，完成被计量电能的瞬时功率测量；再通过“数字/频率”转换器，输出与被计量电能平均功率成比例的频率脉冲信号，该脉冲信号可供外部校验或抄表。

2.2数据处理单元三路（三相四线）或二路（三相三线）电能计量单元的电能量通过SPI口输出到CPU芯片，CPU芯片在系统软件（电能表程序）的指令下进行数据处理、分相计量，并与存储器之间进行数据存储，显示驱动电路根据内部命令驱动LED数码管即时的进行数据显示；内部存储器上的部分数据可通过红外和RS485两种方式将数据输出。

FEATURES•Dot Matrix Replacement for DL3416•0.270" 5x7 Dot Matrix Characters•128 Special ASCII Characters for English, German, Italian, Swedish, Danish, and Norwe-gian Languages•Wide Viewing Angle: X Axis 50° Maximum, Y Axis ±75° Maximum•Close Vertical Row Spacing, 0.800" Centers •Fast Access Time, 110 ns at 25°C•Full Size Display for Stationary Equipment •Built-in Memory•Built-in Character Generator•Built-in Multiplex and LED Drive Circuitry •Each Character Independently Accessed •TTL Compatible, 5 Volt Power, V IH=2.0 V,V IL=0.8 V•Independent Cursor Function•Memory Clear Function•Display Blank Function for Blinking and Dim-ming•End-Stackable, 4-character Package •Intensity Coded for Display Uniformity •Extended Operating Temperature Range:–40°C to +85°C•Wave SolderableSee Appnotes 18, 19, 22, and 23 for additionalinformation.DESCRIPTIONThe DLR/DLO/DLG3416 is a four character 5x7 dot matrix display module with a built-in CMOS integrated circuit. This display is a “drop-in” replace-ment for the DL3416.The integrated circuit contains memory, ASCII ROM decoder, multiplexing circuitry and drivers. Data entry is asynchronous and can be random. A dis-play system can be built using any number of DLX3416s since each charac-ter can be addressed independently and will continue to display the character last stored until replaced by another.System interconnection is very straightforward. The least significant two address bits (A0, A1) are normally connected to the like-named inputs of all displays in the system. With four chip enables, four displays (16 characters) can easily be interconnected without a decoder.Data lines are connected to all DLX3416s directly and in parallel, as is the write line (WR). The display will then behave as a write-only memory.The cursor function causes all dots of a character position to illuminate at half brightness. The cursor is not a character, and when removed the previ-ously displayed character will reappear.The DLX3416 has several features superior to competitive devices. True “blanking” allows the designer to dim the display for more flexibility of dis-play presentation. Finally the CLR clear function will clear the cursor RAM and the ASCII character RAM simultaneously.The character set consists of 128 special ASCII characters for English, Ger-man, Italian, Swedish, Danish, and Norwegian.All products are subjected to out-going AQL’s of 0.25% for brightness match-ing, visual alignment and dimensions, 0.065% for electrical and functional. Dimensions in inches (mm).270(6.86).790(20.07)±.010(.25).600 (15.24)±.020 (.51)at SeatingPlane340 (8.64).100 (2.54)±.015 (38)at Seating Plane.157 (.40)±.007 (.18).175(4.45)PartNo.Pin 1IndicatorEIA Date Code.160 (4.06) ±.020 (.51)DLX3416SIEMENSZ.145 (3.68) ±.015 (.38)at Seating PlaneYYWW.260 (6.60)±.007 (.18)1.300 (33.02) max.020 (.51) x .012(.30)Leads 22 pl.LuminousIntensity Code.325(8.26)RED DLR3416 HIGH EFFICIENCY RED DLO3416GREEN DLG3416.270" 4-character 5 x 7 Dot MatrixAlphanumeric Intelligent Displaywith Memory/Decoder/Drive元器件交易网Maximum RatingsDC Supply Voltage....................–0.5 V to +7.0 Vdc Input Voltage, Respect to GND(all inputs).......................–0.5 V to V CC +0.5 Vdc Operating Temperature..................-40°C to +85°C Storage Temperature-....................40°C to +100°C Relative Humidity at 85°C(non-condensing).........................................85% Maximum Solder Temperature,0.063" (1.59 mm) belowSeating Plane, t<5 sec.............................260 °COptical CharacteristicsSpectral Peak WavelengthRed ..................................................660 nm typ. HER ..................................................630 nm typ. Green ...............................................565 nm typ. Character Height0.270" (6.86 mm)Time Averaged Luminous Intensity(1)at V CC=5 V Red............................................60 µcd/LED typ. HER..........................................120 µcd/LED typ. Green.......................................140 µcd/LED typ. Dot to Dot Intensity Matchingat V CC=5 V.......................................1.8:1.0 max. LED to LED Hue Matching(Green only) at V CC=5 V...................±2 nm max. Viewing Angle (off normal axis)Horizontal ...........................................±50° max. Vertical . .............................................±75° max. Note 1: Peak luminous intensity values can be calculated by multiplying these values by 7.Figure 1. Top viewFigure 2. Timing characteristics, Write Cycle waveformsPin Function Pin Function1CE1 Chip Enable12GND2CE2 Chip Enable13NC3CE3 Chip Enable14BL Blanking4CE4 Chip Enable15NC5CLR Clear16D0 Data Input6V CC17D1 Data Input7A0 Digit Select18D2 Data Input8A1 Digit Select19D3 Data Input9WR Write20D4 Data Input10CU Cursor Select21D5 Data Input11CUE Cursor Select22D6 Data Input22 21 20 1918 17 16 15 14 13 121 2 3 4 5 6 7 8 9 10 11digit 3 digit 2 digit 1 digit 0T ds T dhT WT accT ahT asT cehT cuhT cesT cusT clrd2.0 V0.8 V CE1, CE2CE3, C34CU, CLRA0, A1D0-D6WR2.0 V0.8 V2.0 V0.8 V2.0 V0.8 V Note: These waveforms are not edge triggered.DC CharacteristicsParameter–40°C +25°C+55°CUnits Conditions Min.Typ. Max.Min.Typ. Max.Min.Typ. Max.I CC 80 dots on150190135165118150mA V CC=5 VI CC Cursor170140125mA V CC=5 VI CC Blank 2.8 4.0 2.3 3.0 2.0 2.5mA V CC=5 V, BL=0.8 VI IL (all inputs)30601202550100204080µA V IN=0.8 V, V CC=5 VV IH (all inputs) 2.0 2.0 2.0V V CC=5 VV IL (all inputs)0.80.80.8V V CC=5 VV CC 4.5 5.0 5.5 4.5 5.0 5.5 4.5 5.0 5.5V元器件交易网AC Characteristics Guaranteed Minimum Timing Parameters at V CC =5.0 V ± 0.5 VNote: 1. T ACC =Set Up Time + Write Time + Hold Time.Loading DataSetting the chip enable (CE1, CE2, CE3, CE4) to their true state will enable loading. The desired data code (D0-D6) and digit address (A0, A1) must be held stable during the write cycle for storing new data.ParameterSymbol –40 ° C +25 ° C +85 ° C Units Chip Enable Set Up Time T CES 000ns Address Set Up Time T AS 101010ns Cursor Set Up Time T CUS 101010ns Chip Enable Hold Time T CEH 000ns Address Hold Time T AH 203040ns Cursor Hold Time T CUH 203040ns Clear Disable Time T CLRD 111 µ s Write Time T W 607090ns Data Set Up Time T DS 203050ns Data Hold Time T DH 203040ns Clear Time T CLR 111 µ s Access TimeT ACC90110140nsData entry may be asynchronous and random. Digit 0 is defined as right hand digit with A1=A2=0.To clear the entire internal four-digit memory hold the clear (CLR) low for 1 µ s. All illuminated dots will be turned off within one complete display multiplex cycle, 1 msec minimum. The clear function will clear both the ASCII RAM and the cursor RAM. Loading CursorSetting the chip enables (CE1, CE2, CE3, CE4) and cursor select (CU) to their true state will enable cursor loading. A write (WR) pulse will now store or remove a cursor into the digit location addressed by A0, A1, as defined in data entry. A cursor will be stored if D0=1 and will removed if D0=0. The cursor (CU) pulse width should not be less than the write (WR) pulse or errone-ous data may appear in the display.If the cursor is not required, the cursor enable signal (CUE) may be tied low to disable the cursor function. For a flashing cursor, simply pulse CUE. If the cursor has been loaded to any or all positions in the display, then CUE will control whether the cursor(s) or the characters will appear. CUE does not affect the con-tents of cursor memory.Typical Loading Data State TableX=don’t careLoading Cursor State TableX=don’t care s =all dots onBL CE1CE2CE3CE4CUE CU WR CLR A1A0D6D5D4D3D2D1D0Digit 3210 H X X X X L X H H previously loaded display G R E Y H L X X X L X X H X X X X X X X X X G R E Y H X L X X L X X H X X X X X X X X X G R E Y H X X H X L X X H X X X X X X X X X G R E Y H X X X H L X X H X X X X X X X X X G R E Y H X X X X L X H H X X X X X X X X X G R E Y H H H L L L H L H L L H L L L H L H G R E E H H H L L L H L H L H H L H L H L H G R U E H H H L L L H L H H L H L L H H L L G L U E H H H L L L H L H H H L L L L L H L B L U E L X X X X X X H H X X L blank display H H H L L L H L H H H L L L L HHHGLUEH X X X X L X X L clears character display HHHLLLHLHXXsee character code see character setBL CE1CE2CE3CE4CUE CU WR CLR A1A0D6D5D4D3D2D1D0Digit 3210 H X X X X L X H H previously loaded display B E A R H X X X X H X H H display previously stored cursors B E A R H H H L L H L L H L L X X X X X X H B E A s H H H L L H L L H L H X X X X X X H B E s s H H H L L H L L H H L X X X X X X H B s s s H H H L L H L L H H H X X X X X X H s s s s H H H L L H L L H H L H L L L H L L s E s s H X X X X L X H H disable cursor display B E A R H H H L L L L L H H H X X X X X XLB E A R HXXXXHXHHdisplay stored cursorsBEss元器件交易网Display BlankingBlank the display by loading a blank or space into each digit of the display or by using the (BL) display blank input.Setting the (BL) input low does not affect the contents of either data or cursor memory. A flashing display can be achieved by pulsing (BL). A flashing circuit can be constructed using a 555 a stable multivibrator. Figure 3 illustrates a circuit in which vary-ing R2 (100K~10K) will have a flash rate of 1 Hz~10 Hz.Figure 3. Flashing circuit using a 555Figure 3a. Flashing (blanking) timing555TimerR14.7 K Ω R2100 K Ω C40.01 µFC310 µFV CC =5.0 VTo BL Pin on Display12348765Blanking Pulse Width ≈50% Duty Factor500 ms2 Hz Blanking Frequency10~~~~The display can be dimmed by pulsing (BL) line at a frequency sufficiently fast to not interfere with the internal clock. The dim-ming signal frequency should be 2.5 KHz or higher. Dimming the display also reduces power consumption.An example of a simple dimming circuit using a 556 is illus-trated in Figure 4. Adjusting potentiometer R3 will dim the dis-play by changing the blanking pulse duty cycle.Figure 4. Flashing circuit using a 555Figure 4a. Flashing (blanking) timing555TimerR14.7 K Ω R2100 K Ω C40.01 µFC310 µFV CC =5.0 VTo BL Pin on Display12348765Blanking Pulse Width ≈50% Duty Factor500 ms2 Hz Blanking Frequency10~~~~Figure 5. Internal block diagram3 2 1 0DisplayRows 0 to 6Timing and Control LogicRow Control Logic& Row DriversRow DecoderRAM Read LogicRAM MemoryROM7 Bit ASCII CodeColumn DataD6D5D4D3D2D1D04480 bitsCUEOSC128Counter 7CounterColumn Enable Latches and Column DriversL a t c h e sC o l u m nD e c o d e rWR A0A1Write 4 X 7 bitColumns 0 to 19Address Lines÷÷BL128 X 35 Bit ASCIICharacter Decode Cursor Memory 4 X 1 bitCursor Memory Bits 0 to 3DecoderAddressCharacter SetFigure 6. Typical schematic, 16-character systemASCIICODE D0D1D2D3000001000101002110030010410105011061110700018100190101A1101B0011C1011D0111E1111F0001111001100110101010101234567D6D5D4HEX 1. High=1 level. 2. Low=0 level. 3. Upon power up, device will initialize in a random state.A 3A 2D0-DL +V GNDBLD15 D12 D11 D8 D7 D4 D3 D0CLR WR CU CUE A 1A 0714G N DG N DG N D+V+V+V +VG N DC E 1C E 2C E 3C E 4C E 1C E 2C E 3C E 4C E 1C E 2C E 3C E 4C E 1C E 2C E 3C E 4Design ConsiderationsFor details on design and applications of the DLX3416 using standard bus configurations in multiple display systems, or par-allel I/O devices, such as the 8255 with an 8080 or memory mapped addressing on processors such as the 8080, Z80, 6502, or 6800, refer to Appnote 15 in the current Siemens Opto-electronics Data Book.Electrical and Mechanical ConsiderationsVoltage Transient SuppressionWe recommend that the same power supply be used for the display and the components that interface with the display to avoid logic inputs higher than V CC. Additionally, the LEDs may cause transients in the power supply line while they change dis-play states. The common practice is to place .01 mF capacitors close to the displays across V CC and GND, one for each dis-play, and one 10 mF capacitor for every second display.ESD ProtectionThe silicon gate CMOS IC of the DLX3416 is quite resistant to ESD damage and capable of withstanding discharges greater than 2 KV. However, take all the standard precautions, normal for CMOS components. These include properly grounding per-sonnel, tools, tables, and transport carriers that come in contact with unshielded parts. If these conditions are not, or cannot be met, keep the leads of the device shorted together or the parts in anti-static packaging.Soldering ConsiderationsThe DLX3416 can be hand soldered with SN63 solder using a grounded iron set to 260°C.Wave soldering is also possible following these conditions: Pre-heat that does not exceed 93°C on the solder side of the PC board or a package surface temperature of 85°C. Water soluble organic acid flux (except carboxylic acid) or resin-based RMA flux without alcohol can be used.Wave temperature of 245°C ±5°C with a dwell between 1.5 sec. to 3.0 sec. Exposure to the wave should not exceed tempera-tures above 260°C for five seconds at 0.063" below the seating plane. The packages should not be immersed in the wave. Post Solder Cleaning ProceduresThe least offensive cleaning solution is hot D.I. water (60°C) for less than 15 minutes. Addition of mild saponifiers is acceptable. Do not use commercial dishwasher detergents.For faster cleaning, solvents may be used. Carefully select any solvent as some may chemically attack the nylon package. Maximum exposure should not exceed two minutes at elevated temperatures. Acceptable solvents are TF (trichorotribluore-thane), TA, 111 Trichloroethane, and unheated acetone. Note: Acceptable commercial solvents are: Basic TF, Arklone, P. Genesolv, D. Genesolv DA, Blaco-Tron TF, Blaco-Tron TA, and Freon TA.Unacceptable solvents contain alcohol, methanol, methylene chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since many commercial mixtures exist, contact a solvent vendor for chemical composition information. Some major solvent manu-facturers are: Allied Chemical Corportation, Specialty Chemical Division, Morristown, NJ; Baron-Blakeslee, Chicago, IL; Dow Chemical, Midland, MI; E.I. DuPont de Nemours & Co., Wilm-ington, DE.For further information refer to Siemens Appnotes 18 and 19. An alternative to soldering and cleaning the display modules is to use sockets. Standard pin DIP sockets .600" wide with0.100" centers work well for single displays. Multiple display assemblies are best handled by longer SIP sockets or DIP sockets when available for uniform package alignment. Socket manufacturers are Aries Electronics, Inc., Frenchtown, NJ; Garry Manufacturing, New Brunswich, NJ; Robinson-Nugent, New Albany, IN; and Samtec Electronic Hardware, New Albany, IN.For further information refer to Siemens Appnote 22.Optical ConsiderationsThe 0.270" high characters of the DLX3416 gives readability up to eight feet. Proper filter selection enhances readability over this distance.Filters enhance the contrast ratio between a lit LED and the character background intensifying the discrimination of differ-ent characters. The only limitation is cost. Take into consider-ation the ambient lighting environment for the best cost/benefit ratio for filters.Incandescent (with almost no green) or fluorescent (with almost no red) lights do not have the flat spectral response of sunlight. Plastic band-pass filters are an inexpensive and effective way to strengthen contrast ratios.The DLR3416 is a standard red display and should be matched with long wavelength pass filter in the 600 nm to 620 nm range. The DLO3416 is a high efficiency red display and should be matched with a long wavelength pass filter in the 470 nm to 590 range. The DLG3416 should be matched with a yellow-green band-pass filter that peaks at 565 nm. For displays of multiple colors, neutral density gray filters offer the best compromise. Additional contrast enhancement is gained by shading the dis-plays. Plastic band-pass filters with built-in louvers offer the next step up in contrast improvement. Plastic filters can be improved further with anti-reflective coatings to reduce glare. The trade-off is fuzzy characters. Mounting the filters close to the display reduces this effect. Take care not to overheat the plastic filter by allowing for proper air flow.Optimal filter enhancements are gained by using circular polar-ized, anti-reflective, band-pass filters. Circular polarizing further enhances contrast by reducing the light that travels through the filter and relfects back off the display to less than 1%. Several filter manufacturers supply quality filter materials. Some of them are: Panelgraphic Corporation, W. Caldwell, NJ; SGL Homalite, Wilmington, DE; 3M Company, Visual Products Division, St. Paul, MN; Polaroid Corporation, Polarizer Division, Cambridge, MA; Marks Polarized Corporation, Deer Park, NY, Hoya Optics, Inc., Fremont, CA.One last note on mounting filters: recessing displays and bezel assemblies is an inexpensive way to provide a shading effect in overhead lighting situations. Several Bezel manufacturers are: R.M.F. Products, Batavia, IL; Nobex Components, Griffith Plas-tic Corp., Burlingame, CA; Photo Chemical Products of Califor-nia, Santa Monica, CA; .E.E.-Atlas, Van Nuys, CA.Refer to Siemens Appnote 23 for further information.元器件交易网。