MPXV53G中文资料

WORD下载可编辑CAV/5U分米波电视激励器用户手册技术资料精心整理WORD下载可编辑技术资料精心整理WORD下载可编辑目录目录。

3 警告。

5 保修。

6 介绍。

7 手册内容。

7 触电救护。

9第一章产品介绍。

13 1．1 简介。

14 1．2 技术指标。

16 1．3 方框图。

18第二章安装。

19 2．1 设备安装。

20 2．2 初装要点。

20 2．3 测试接口。

21 2．4 RS232接口。

21 2．5 操作显示菜单介绍。

22 2．6 保护门限，告警及其设置。

24 2．7 改频步骤。

24 2．8 预防措施。

25 前面板。

26 后面板。

27第三章图表。

29 ATP150A CAV/5U 接线图。

30技术资料精心整理WORD下载可编辑MTF0096AR0 放大模块元件清单。

31 ATP150A CAV/5U 元件清单。

32 SCH0291AR0（主板）。

33- 音频处理电路。

34 - 视频处理电路。

35 - 视频予校正电路。

36 - 音/视频调制电路。

37 - 中频载频振荡电路。

38 - 中频予校正电路。

39 - 中频校正电路。

40 - 上变频电路。

41 - 电源电路。

42 - 校正调试点。

48 - 外部AGC 设置。

58SCH0123AR1（控制板和显示）。

59-调试要点。

62 SCH0136AR0（IV-V波段 VCO器）。

63-调试要点。

63 MTG0050AR0（40Ddb UHF 滤波器）。

66-调试步骤。

66 SCH0300AR0（接口板）。

69 SCA0302AR0（5W 放大模块）。

71 SCA0311AR0（2W 放大模块）。

72E0004 （S-150-24 开关电源）。

73 技术资料精心整理WORD下载可编辑提示本手册所描述的产品在设计和生产中都采用了对用户的保护措施。

在安装，维护和调试时需要关机。

使用者须采取的预防措施为避免高压伤害，操作时请穿着专用衣服，戴保护手套。

注意事项零件清单附在相关电原理图后面，标明每一项的参数、说明以及常用类型。

5MP Camera User ManualSKU: 202-04561. GeneralThe OKdo 5MP Camera is a low-cost wider Field View camera module, designed for the whole Raspberry Pi series(P4/Pi3 B+/PI3 A+/PI3/PI ZERO/PI ZERO W/CM3+/CM3). The OKdo 5MP Camera has a 5M Pixel sensor, and connects via a ribbon cable to the CSI connector on the Raspberry Pi.Plug and Play device, driver-free. Supports all Raspberry Pi original camera tools, such as raspistill, raspivid etc.2. Features1. The OKdo 5MP Camera is a low-cost wider field view camera module that designed for Raspberry Pi 4, Pi 3 B+, Pi 3, Pi 2, Pi B+, Pi A, Pi Zero/Zero W. Comes with both ribbon cable sizes for compatibility with classic Raspberry Pi and Zero.2.Connects to the CSI connector of Raspberry Pi directly. High bandwidth communication from the camera module to the Raspberry pi.3.Sensor type: On-board OmniVision OV5647[6] Color CMOS QSXGA (5-megapixel); Video: 1080p at 30 fps with codec H.264 (AVC).4.Lens Feature: 2.8 Focal Length. F/NO: 2.2. Field Of view: D=90° H=74°. Element: 4G+IR. CRA: 10°. Relative Illumination: 52%. Focal distance is adjustable.5.Plug and Play device, driver-free for all raspberry pi boards, no need to install extra software.3.Hardware Description 3.1 Overview3.2 Size3.3 Wiring4.Software Description4.1Load imagePrepare a capacity of more than 8GB TF card and a card reader. Load the image file on to the SD card, using the instructions provided on the Raspberry Pi website for Linux, Mac or PC:https:///documentation/installation/installing-images/README.md Raspbian Raspberry Pi OS Image download:https:///downloads/If your Raspberry Pi OS is not the latest version. Y ou can use below command update. sudo apt-get updatesudo apt-get upgrade4.2Enable Camera(1) Open the raspi-config tool when you first set up your Raspberry Pi:sudo raspi-config(2)Select ‘Interfacing Options’ → ‘Camera’. and then enable camer and reboot.4.3Take Photos(1)take a picture name ‘test’.raspistill -o test.jpg(2)take a picture name ‘test’ with resolution 640*480raspistill -o test.jpg -w 640 -h 480(3)take a picture name ‘test’ after 10 seconds(10000ms).raspistill -t 10000 -o test.jpg(4)Take a picture name ‘test’ with PNG format(raw date) . If will take more time to save. raspistill -o test.png -e png4.4Take H.264 Video(1)take a 10s(10000ms) video name ‘test’.raspivid -o test.h264 -t 10000(2)take a 10s(10000ms) video name ‘test’ with resolution 1280*720.raspivid -o test.h264 -t 10000 -w 1280 -h 7204.5ReferenceThe OKdo 5MP Camera can be used in the same way as a standard Pi camera.For more information, please refer to below link:https:///en/projects/getting-started-with-picamerahttps:///forums/viewforum.php?f=43&sid=7b94c5651e50c2fc2af0a049 066cdfda。

50kPaOn-Chip TemperatureCompensated &Calibrated Silicon Pressure SensorsThe MPXM2053device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output —directly proportional to the applied pressure.The sensor is a single,monolithic silicon diaphragm with the strain gauge and a thin--film resistor network integrated on--chip.The chip is laser trimmed for precise span and offset calibration and temperature compensation.Features•Temperature Compensated Over0°C to +85°C •Available in Easy--to--Use Tape &Reel •Ratiometric to Supply Voltage •Gauge Ported &Non Ported Options Application Examples •Pump/Motor Controllers •Robotics •Level Indicators •Medical Diagnostics •Pressure Switching•Non--Invasive Blood Pressure MeasurementFigure 1shows a block diagram of the internal circuitry on the stand--alone pressure sensor chip.Figure 1.Temperature Compensated Pressure Sensor SchematicV out+V out--VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSUREThe differential voltage output of the sensor is directly proportional to the differential pressure applied.The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1)relative to the vacuum side (P2).Similarly,output voltage increases as increasing vacuum is applied to the vacuum side (P2)relative to the pressure side (P1).Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.MPXM2053Rev.2,10/2004Technical DataMPXM2053SERIESMAXIMUM RATINGS(NOTE)Rating Symbol Value Unit Maximum Pressure(P1>P2)P max200kPa Storage Temperature T stg--40to+125°C Operating Temperature T A--40to+125°C NOTE:Exposure beyond the specified limits may cause permanent damage or degradation to the device.OPERATING CHARACTERISTICS(V S=10Vdc,T A=25°C unless otherwise noted,P1>P2)Characteristic Symbol Min Typ Max Unit Pressure Range(1)P OP0—50kPa Supply Voltage(2)V S—1016Vdc Supply Current I o— 6.0—mAdc Full Scale Span(3)V FSS38.54041.5mV Offset(4)V off--1.0— 1.0mV Sensitivity∆V/∆P—0.8—mV/kPa Linearity(5)—--0.6—0.4%V FSS Pressure Hysteresis(5)(0to50kPa)——±0.1—%V FSS Temperature Hysteresis(5)(--40°C to+125°C)——±0.5—%V FSS Temperature Effect on Full Scale Span(5)TCV FSS--2.0— 2.0%V FSS Temperature Effect on Offset(5)TCV off--1.0— 1.0mV Input Impedance Z in1000—2500ΩOutput Impedance Z out1400—3000ΩResponse Time(6)(10%to90%)t R— 1.0—ms Warm--Up——20—ms Offset Stability(7)——±0.5—%V FSS NOTES:1.1.0kPa(kiloPascal)equals0.145psi.2.Device is ratiometric within this specified excitation range.Operating the device above the specified excitation range may induce additionalerror due to device self--heating.3.Full Scale Span(V FSS)is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at theminimum rated pressure.4.Offset(V off)is defined as the output voltage at the minimum rated pressure.5.Accuracy(error budget)consists of the following:•Linearity:Output deviation from a straight line relationship with pressure,using end point method,over the specifiedpressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range,after the temperature iscycled to and from the minimum or maximum operating temperature points,with zero differential pressureapplied.•Pressure Hysteresis:Output deviation at any pressure within the specified range,when this pressure is cycled to and from theminimum or maximum rated pressure,at25°C.•TcSpan:Output deviation at full rated pressure over the temperature range of0to85°C,relative to25°C.•TcOffset:Output deviation with minimum rated pressure applied,over the temperature range of0to85°C,relativeto25°C.6.Response Time is defined as the time for the incremental change in the output to go from10%to90%of its final value when subjected toa specified step change in pressure.7.Offset stability is the product’s output deviation when subjected to1000hours of Pulsed Pressure,Temperature Cycling with Bias Test. MPXM2053SERIESMPXM2053SERIESLINEARITYLinearity refers to how well a transducer’s output follows the equation:V out =V off +sensitivity x P over the operating pressure range.There are two basic methods for calculating nonlinearity:(1)end point straight line fit (see Figure 2)or (2)a least squares best line fit.While a least squares fit gives the “best case”linearity error (lower numerical value),the calculations required are burdensome.Conversely,an end point fit will give the “worst case”error (often more desirable in error budget calculations)and the cal-culations are more straightforward for the user.Freescale Semiconductor’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.Figure 2.Linearity Specification ComparisonPRESSURE (%FULLSCALE)ON--CHIP TEMPERATURE COMPENSATION and CALIBRATIONFigure 3shows the minimum,maximum and typical output characteristics of the MPXM2053series at 25°C.The output is directly proportional to the differential pressure and is es-sentially a straight line.A silicone gel isolates the die surface and wire bonds from the environment,while allowing the pressure signal to be transmitted to the silicon diaphragm.Figure 3.Output versus Pressure DifferentialO U T P U T (mV d c )kPa PSI40353025151050--5 1.8 3.6 5.47.2520ORDERING INFORMATIONNo Device Type OptionsCase No.MPXM2053D Non--ported1320MPXM2053DT1Non--ported,Tape and Reel 1320MPXM2053GS Ported1320A MPXM2053GST1Ported,Tape and Reel1320AMPXM2053SERIES PACKAGE DIMENSIONSPACKAGE DIMENSIONSMPXM2053SERIESNOTES MPXM2053SERIESNOTESMPXM2053SERIESInformation in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products.There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein.Freescale Semiconductor makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose,nor does FreescaleSemiconductor assume any liability arising out of the application or use of any product or circuit,and specifically disclaims any and all liability,including without limitation consequential orincidental damages.“Typical”parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.All operating parameters,including “Typicals”,must be validated for each customer application by customer’s technical experts.Freescale Semiconductor does not convey anylicense under its patent rights nor the rights of others.Freescale Semiconductor products are not designed,intended,or authorized for use as components in systems intended for surgical implant into the body,or other applications intended to support or sustain life,or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur.Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application,Buyer shall indemnify and hold Freescale Semiconductor and its officers,employees,subsidiaries,affiliates,and distributors harmless against all claims,costs,damages,and expenses,and reasonable attorney fees arising out of,directly or indirectly,any claim of personal injury or death associated with such unintended or unauthorized use,even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.Freescale t and the Freescale logo are trademarks of Freescale Semiconductor,Inc.All other product or service names are the property of their respective owners.©Freescale Semiconductor,Inc.2004.All rights reserved.How to Reach Us:Home Page: E--mail:support@USA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center,CH3701300N.Alma School Road Chandler,Arizona 85224+1--800--521--6274or +1--480--768--2130support@Europe,Middle East,and Africa:Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 781829Muenchen,Germany +441296380456(English)+46852200080(English)+498992103559(German)+33169354848(French)support@Japan:Freescale Semiconductor Japan Ltd.Technical Information Center3--20--1,Minami--Azabu,Minato--ku Tokyo 106--0047,Japan0120191014or +81334403569support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center 2Dai King StreetTai Po Industrial Estate Tai Po,N.T.,Hong Kong +80026668080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P .O.Box 5405Denver,Colorado 802171--800--441--2447or 303--675--2140Fax:303--675--2150LDCForFreescaleSemiconductor@MPXM2053Rev.210/2004。

万能播放器Cor‎e Player‎万能播放器Cor‎e Player‎CorePla‎e r堪称手机平台‎上最强大的媒体播‎放器！在H.26‎4上，CoreP‎l aer显示出了‎它最拿手的本领，‎相同的视频Cor‎e Plaer在C‎P U利用率只有8‎0%的情况下，都‎可以流畅的播放大‎场面240 32‎0 H.264编‎码的视频，没有一‎点点跳帧现象。

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USER MANUALOMX-3GSDI-CAT53GSDI Extender Over IP Via Single UTP Cat5e/6e/7Ocean Matrix812 Kings Highway ·Saugerties, NY 124773GSDI ExtenderThe Ocean Matrix OMX-3GSDI-CAT5 extends 3GSDI signal transmis-sion beyond the standard distance for Cat5e/6e/Cat7 cable. Consisting of a transmitter and a receiver, this system delivers full 3GSDI signal up to 394 feet over a single UTP Cat5e/6e/Cat7 network cable supporting SD-SDI, HD-SDI and 3G-SDI signal input and resolutions up to1920x1080@60Hz.IR signal transmission allows for remote control of the source at a secondary location using IR extension cables.Includes∙ One transmitter∙ One receiver∙ Two 5VDC/2A power adapters∙ One IR blaster extension cable, connects to transmitter∙ One IR receiver extension cable, connects to receiver SpecificationsSupported Resolutions SD-SDI 480i@60Hz, 576i@50HzHD-SDI 720p@50/60Hz,1080i@50/60Hz,1080p@24/25/30Hz3GSDI 1080p@50/60HzSDI Signal Format SD-SDI, HD-SDI, 3GSDISDI Rate 270Mb/s，1.485Gb/s，2.97Gb/sNetwork Cable UTP Cat5e/6e/7Transmission Range 1080p resolution up to 394 ft (120m) over Cat6IR Remote Control Supports 20-60kHz standard IR remote controlsPower Supply 5VDC/2APower Consumption Transmitter 6W, Receiver 6WWorking Temperature 32°F - 140°F (0Ԩ- 60Ԩ)Dimensions (LxWxH) 5.4 x 4.1 x 0.9 (138 x 105 x 23.8mm) TX & RXWeight Transmitter 6.4 oz Receiver 6.43 oz (182g /180g)Installation Requirements1. SDI source device such as a video camera, media player,monitoring equipment or computer.2. SDI display device such as an SDTV, HDTV, or projector with SDIinput port.3. UTP/STP Cat5e/6 network cable in accordance with the IEEE-568Bwiring standard up to 394 feet/120m.Installation Safety1. Identify the receiver and the transmitter in order to make properconnections during installation.2. Do not hot plug/swap when in operation.3. Use 5VDC power supply only.IR User Guide1. Plug the IR blaster extension cable into the IR-out port of the Trans-mitter TX.2. Plug the the IR receiver extension cable into the IR-IN port of theReceiver RX.3. Place the emitter of the IR blaster as close as possible to the IRreceiver of the signal source device.4. Direct the IR remote controller of the signal source device towardsthe IR receiver (connected to the RX of HDMI extender), to remote control source media playback.TransmitterReceiverRear of Both Units6RX Power Input 5VDC 7RX Reset Button 8RX Signal Input11 TX & RX Power Status Indicator 12 TX & RX Data Transmission Indicator 13TX & RX Network Connection Indicator1 TX Power Input 5VDC2 TX Reset Button 3TX Signal Output10RXSDI Signal Output9 RX IR Extension Cable Port 4 TX IR Blaster Extension Cable Port 5TX SDI Signal InputInstallation ProceduresCat5/6 Network Cable—follow the IEEE-568B wiring standard:1. White/Orange2. Orange3. White/Green4. BlueCONNECTIONTransmission distance up to 394 ft (120m) over single Cat6TroubleshootingDisplay shows “Waiting for Connection”∙ Ensure power supply is firmly connected. Display shows “Signal Loss”∙ Check signal input of the TX.∙Connect the signal source directly to the display device to ensure there is a signal output. Change the signal source if necessary.Degraded video signal∙ Check cable lengths between the TX to the switch, the switch to RX.∙ Ensure the connection between each level is within required ranges.∙ Press the RESET button on the TX/RX front panel. ∙Ensure all connections are secure.5. White/Blue6. Green7. White/Brown 8. BrownOcean Matrix812 Kings Highway Saugerties NY 12477SAFETY PRECAUTIONS1. To prevent fire or shock hazard, do not expose this equipment to highhumidity and/or dust. Do not use in an unprotected outdoor installation nor any area classified as overly damp or wet.2. The temperature for installation should be kept between 32°F to 140°F(0°C to 60°C). Avoid direct sunlight exposure or extreme changes of temperature over a short period of time.3. Do not disassemble the unit or place it on an unstable base.4. Do not drop the unit and avoid heavy impact.5. This unit should not be permanently installed unless proper ventilation isprovided. Any enclosure openings must not be blocked or covered as they protect the unit from overheating.6. Before cleaning, turn off the power and unplug the unit from all connec-tions. Use a damp cloth. Do not use liquid cleaners nor aerosol cleaners.7. Do not overload outlets and extension cords as this may result in a risk offire or electric shock.8. Enclosure entry is dangerous. Never push objects of any kind, includingliquids, into this unit through openings as they may touch dangerous voltage points or short-out parts that could result in a fire or electric shock. 9. Do not attempt to open or service this unit yourself as opening or removingcovers may expose you to dangerous voltage and other hazards.10. T here are no user-serviceable parts inside the unit. If the unit requiresservice contact your authorized dealer, or an authorized repair service company.。

MPX5100Rev 10, 05/2005Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and CalibratedThe MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachiningtechniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Maximum Error over 0° to 85°C•Ideally suited for Microprocessor or Microcontroller-Based Systems •Patented Silicon Shear Stress Strain Gauge•Available in Absolute, Differential and Gauge Configurations •Durable Epoxy Unibody Element •Easy-to-Use Chip Carrier Option Typical Applications•Patient Monitoring •Process Control •Pump/Motor Control •Pressure Switching ORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series OrderNumber Device MarkingUNIBODY PACKAGE (MPX5100 SERIES)Basic Elements Absolute 867MPX5100A MPX5100A Differential867MPX5100D MPX5100D Ported Elements Differential Dual Ports 867C MPX5100DP MPX5100DP Absolute, Single Port867B MPX5100AP MPX5100AP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867F MPX5100GSX MPX5100D Gauge, Axial Port, SMT 482A MPXV5100GC6U MPXV5100G Gauge, Axial Port, DIP 482C MPX5V100GC7U MPXV5100G Gauge, Dual Port, SMT1351MPXV5100DPMPXV5100MPX5100/MPXV5100SERIESINTEGRATED PRESSURE SENSOR0 to 100 kpa (0 to 14.5 psi)15 to 115 kPa (2.2 to 16.7 psi)0.2 to 4.7 V Output PIN NUMBER (1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3GND 7N/C 4V OUT8N/CPIN NUMBER (1)1.Pins 4, 5, and 6 are internal deviceconnections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1V OUT 4N/C 2GND 5N/C 3V S6N/CMPX5100SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTABLE 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P MAX 400kPa Storage Temperature T STG -40° to +125°C °C Operating TemperatureT A-40° to +125°C°CTABLE 2. Operating Characteristics (V S = 5.0 V DC , T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A 1.0.1 kPa (kiloPascal) equals 0.145 psi.P OP015——100115kPaSupply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25V DC Supply CurrentI O —7.010mAdc Minimum Pressure Offset (3) (0 to 85°C)@ V S = 5.0 V 3.Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.V OFF 0.0880.200.313V DC Full Scale Output (4)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.587 4.700 4.813V DC Full Scale Span (5)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS — 4.500—V DC Accuracy (6)6.Accuracy (error budget) consists of the following:•Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimumor maximum rated pressure at 25°C.•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOffset:Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C.———±2.5%V FSS Sensitivity V/P —45—mV/kPa Response Time (7)t R — 1.0—ms Output Source Current at Full Scale Output I O+—0.1—mAdc Warm-Up Time (8)——20—ms Offset Stability (9)——±0.5—%V FSSV SSensing ElementV OUTGain Stage # 2and Ground Reference Shift CircuitryPins 1 and 5 through 8 are NO CONNECTS for small outline packages GNDThin Film Temperature Compensation and Gain Stage # 1Pins 4, 5, and 6 are NO CONNECTS for unibody packagesMPX5100SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGFigure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPX5100 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 2. Output Vs. Pressure DifferentialFigure 3. Cross Sectional Diagrams (Not to Scale)Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D inputof a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)7.Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when sugected to a specified step change in pressure.8.Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.O u t p u t V o l t a b e (V )543MAX102030405060708090100210110S p a n R a n g e (T y p )O u t p u t R a n g e (T y p )OffsetPressure (kPa)(Typ)MINTYPV out = V S *(0.009*P+0.04)± (Pressure Error * Temperature Factor * 0.009 * V S V S = 5.0 V ± 0.25 Vdc PE = 2.5TM = 1TEMP = 0 to 85°CFluorosilicone Gel Die Coat Wire BondLead FrameDieEpoxy PlasticCaseDifferential/Gauge ElementDie BondFluorosilicone GelDie Coat Wire BondLead FrameDieStainless Steel Metal CoverEpoxy PlasticCase Die BondAbsolute ElementStainless Steel Metal Cover470 pFVs+5.0 V0.01 µF GNDV OUT1.0 µFIPSOUTPUTMPX5100SensorsTransfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value:V OUT = VS (P x 0.009 + 0.04)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100D/MPX5100G/MPXV5100G SeriesTemp Multiplier4.03.02.00.01.0-40-2020406014012010080- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.Pressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100120Pressure Error (max)0 to 100 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100D/MPX5100G/MPXV5100G SeriesMPX5100SensorsTransfer Function (MPX5100A)Nominal Transfer Value:V OUT = V S (P x 0.009 + 0.095)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100A Temp Multiplier 4.03.02.00.01.0-40-2020406013012010080140- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.SeriesPressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100130Pressure Error (max)15 to 115 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100A SeriesMPX5100SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressuresensor is designed to operate with positive differential pressure applied, P1 > P2.The Pressure (P1) side may be identified by using Table 3 below.INFORMATION FOR USING THE SMALL OUTLINE PACKAGEMINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solderFigure5. Small Outline Package FootprintTABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEPart NumberCase TypePressure (P1) Side IdentifierMPX5100A, MPX5100D 867Stainless Steel Cap MPX5100DP867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPX5100GSX 867F Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP1351Side with Part MarkingPACKAGE DIMENSIONSCASE 482A-01ISSUE ASMALL OUTLINE PACKAGECASE 482C-03ISSUE BSMALL OUTLINE PACKAGEMPX5100 SensorsPACKAGE DIMENSIONSCASE 867-08ISSUE NUNIBODY PACKAGECASE 867B-04ISSUE FUNIBODY PACKAGEMPX5100SensorsPACKAGE DIMENSIONSCASE 867C-05ISSUE FUNIBODY PACKAGECASE 867F-03ISSUE DUNIBODY PACKAGEMPX5100SensorsPACKAGE DIMENSIONSCASE 1351-01ISSUE OSMALL OUTLINE PACKAGEMPX5100SensorsNOTESMPX5100 SensorsFreescale Semiconductor11How to Reach Us:Home Page:E-mail:support@USA/Europe or Locations Not Listed: Freescale SemiconductorTechnical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130 support@Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbHTechnical Information CenterSchatzbogen 781829 Muenchen, Germany+44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@Japan:Freescale Semiconductor Japan Ltd.HeadquartersARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong+800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P.O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150 LDCForFreescaleSemiconductor@ Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved.MPX5100 Rev. 10 05/2005。

MPX5010Rev 11, 01/2007Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2007. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and CalibratedThe MPX5010/MPXV5010G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advancedmicromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features• 5.0% Maximum Error over 0° to 85°C•Ideally Suited for Microprocessor or Microcontroller-Based Systems•Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over –40° to +125°C •Patented Silicon Shear Stress Strain Gauge•Available in Differential and Gauge Configurations•Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples •Hospital Beds •HVAC•Respiratory Systems •Process ControlORDERING INFORMATIONDevice Type Options Case No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV5010G SERIES)Basic Elements Gauge, Element Only, SMT 482MPXV5010G6U Rails MPXV5010G Gauge, Element Only, DIP 482B MPXV5010G7U Rails MPXV5010G Ported Elements Gauge, Axial Port, SMT 482A MPXV5010GC6U Rails MPXV5010G Gauge, Axial Port, DIP 482C MPXV5010GC7U Rails MPXV5010GGauge, Axial Port, SMT 482A MPXV5010GC6T1Tape & ReelMPXV5010GGauge, Side Port, SMT 1369MPXV5010GP Trays MPXV5010G Gauge, Dual Port, SMT 1351MPXV5010DP Trays MPXV5010GUNIBODY PACKAGE (MPX2202 SERIES)Basic ElementDifferential 867MPX5010D —MPXV5010D Ported Elements Differential, Gauge 867C MPX5010DP —MPXV5010DP Gauge 867B MPX5010GP —MPXV5010GPGauge, Axial 867E MPX5010GS —MPXV5010D Gauge, Axial PC Mount 867F MPX5010GSX —MPXV5010DMPX5010MPXV5010G SERIESUNIBODY PACKAGE PIN NUMBERS (1)1.Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1V out 4N/C 2Gnd 5N/C 3V S6N/CSMALL OUTLINE PACKAGEPIN NUMBERS (1)1.Pins 1, 5, 6, 7, and 8 are internal deviceconnections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4V out8N/CMPX5010SensorsFigure 1. Fully Integrated Pressure Sensor SchematicSensing ElementThin Film Temperature Compensationand Gain Stage #1Gain Stage #2and Ground Reference Shift CircuitryV SV outGNDPins 1 and 5 through 8 are NO CONNECTS for surface mount packagePins 4, 5, and 6 are NO CONNECTS for unibody packageTable 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P max 75kPa Storage Temperature T stg –40 to +125°C Operating TemperatureT A–40 to +125°CMPX5010SensorsTable 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.P OP 0—10kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25Vdc Supply CurrentI o — 5.010mAdc Minimum Pressure Offset (3)(0 to 85°C)@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.V off0.20.425VdcFull Scale Output (4)(0 to 85°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO4.475 4.7 4.925VdcFull Scale Span (5)(0 to 85°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS4.275 4.5 4.725VdcAccuracy (6)(0 to 85°C)6.Accuracy (error budget) consists of the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from theminimum or maximum rated pressure, at 25°C.•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to25°C.•Variation from Nominal:T he variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS , at 25°C.———±5.0%V FSS Sensitivity V/P —450—-mV/kPa Response Time (7)7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (8)8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-ms Offset Stability (9)9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.——±0.5—-%V FSSTable 3. Mechanical CharacteristicsCharacteristicsTyp Unit Weight, Basic Element (Case 867) 4.0grams Weight, Basic Element (Case 482)1.5gramsMPX5010SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGThe performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPX5010 and MPXV5010G series pressure sensor operating characteristics, and internal reliability andqualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects onsensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of amicroprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 2. Cross-Sectional Diagram SOP(not to scale)Figure 3. Recommended Power Supply Decouplingand Output Filtering(For additional output filtering, please refer toApplication Note AN1646.)Figure 4. Output versus Pressure DifferentialFluoro Silicone Gel Die CoatWire Bond DieP1Stainless Steel CapThermoplasticCaseDie BondDifferential SensingElementP2+5 V1.0 µF0.01 µF470 pFGNDV sV outIPSOUTPUTLead FrameDifferential Pressure (kPa)O u t p u t (V )5.04.54.03.53.02.52.01.51.00.5001234567891110TYPICALMINMAXTransfer Function:V out = V S *(0.09*P+0.04) ± ERROR V S = 5.0 VdcTEMP = 0 to 85°CMPX5010SensorsNominal Transfer Value:V out = V S x (0.09 x P + 0.04)± (Pressure Error x Temp. Factor x 0.09 x V S )V S = 5.0 V ± 0.25 VdcTransfer Function (MPX5010, MPXV5010G)MPX5010, MPXV5010G SERIESTemp Multiplier–4030 to 851+1253Temperature in °C4.03.02.00.01.0–40–2020406014012010080Temperature Error FactorNOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.Temperature Error BandPressure Error (Max)Pressure Error Band0 to 10 (kPa)±0.5 (kPa)Pressure (kPa)0.50.40.2–0.3–0.4–0.501234567890.30.1–0.2–0.110Pressure Error (kPa)MPX5010SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressuresensor is designed to operate with positive differential pressure applied, P1 > P2.The Pressure (P1) side may be identified by using the table below:MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correctfootprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. SOP Footprint (Case 482)Part NumberCase TypePressure (P1)Side IdentifierMPX5010D 867Stainless Steel Cap MPX5010DP 867C Side with Part Marking MPX5010GP 867B Side with Port Attached MPX5010GS 867E Side with Port Attached MPX5010GSX 867F Side with Port Attached MPXV5010G6U 482Stainless Steel Cap MPXV5010G7U 482B Stainless Steel Cap MPXV5010GC6U/T1482A Side with Port Attached MPXV5010GC7U 482C Side with Port Attached MPXV5010GP 1369Side with Port Attached MPXV5010DP1351Side with Part Marking0.66016.760.060 TYP 8X 1.520.100 TYP 8X 2.540.100 TYP 8X 2.540.3007.62inch mmSCALE 2:1PACKAGE DIMENSIONSCASE 482-01ISSUE OSMALL OUTLINE PACKAGECASE 482A-01ISSUE ASMALL OUTLINE PACKAGEMPX5010 SensorsPACKAGE DIMENSIONSCASE 482B-03ISSUE BSMALL OUTLINE PACKAGECASE 482C-03ISSUE BSMALL OUTLINE PACKAGEMPX5010SensorsPACKAGE DIMENSIONSCASE 867-08ISSUE NUNIBODY PACKAGEMPX5010 SensorsPACKAGE DIMENSIONSMPX5010SensorsPACKAGE DIMENSIONSMPX5010 SensorsPACKAGE DIMENSIONSCASE 867C-05ISSUE FUNIBODY PACKAGECASE 867E-03ISSUE DUNIBODY PACKAGEMPX5010SensorsPACKAGE DIMENSIONSCASE 867F-03ISSUE DUNIBODY PACKAGEMPX5010 SensorsPACKAGE DIMENSIONSMPX5010SensorsPACKAGE DIMENSIONSMPX5010 SensorsPACKAGE DIMENSIONSMPX5010SensorsPACKAGE DIMENSIONSMPX5010 SensorsMPX5010 Rev. 11How to Reach Us:Home Page:Web Support:/supportUSA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot RoadTempe, Arizona 85284+1-800-521-6274 or +1-480-768-2130 /supportEurope, Middle East, and Africa:Freescale Halbleiter Deutschland GmbHTechnical Information CenterSchatzbogen 781829 Muenchen, Germany+44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)/supportJapan:Freescale Semiconductor Japan Ltd.HeadquartersARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong+800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P.O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150 LDCForFreescaleSemiconductor@ Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2007. All rights reserved.。

MPX5050Rev 9, 05/2007Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2007. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and CalibratedThe MPX5050/MPXV5050G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advancedmicromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Maximum Error over 0° to 85°C•Ideally suited for Microprocessor or Microcontroller-Based Systems •Temperature Compensated Over –40° to +125°C •Patented Silicon Shear Stress Strain Gauge •Durable Epoxy Unibody Element •Easy-to-Use Chip Carrier OptionORDERING INFORMATIONDevice Type OptionsCase No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV5050G SERIES)Ported ElementSide Port 1369MPXV5050GP Trays MPXV5050G Dual Port 1351MPXV5050DP Trays MPXV5050G Axial Port482A MPXV5050GC6U TraysMPXV5050G482A MPXV5050GC6T1Tape & Reel MPXV5050GUNIBODY PACKAGE (MPX5050 SERIES)BasicElement Differential 867MPX5050D—MPX5050D Ported ElementDifferential Dual Ports 867C MPX5050DP —MPX5050DP Gauge867B MPX5050GP—MPX5050GPMPX5050 MPXV5050G SERIESINTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi)0.2 to 4.7 V OutputSMALL OUTLINE PACKAGEPIN NUMBERS (1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4V out8N/CUNIBODY PACKAGE PIN NUMBERS (1)1.Pins 4, 5, and 6 are internal deviceconnections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1V out 4N/C 2Gnd 5N/C 3V S6N/CMPX5050SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTable 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P max 200kPa Storage Temperature T stg –40° to +125°°C Operating TemperatureT A–40° to +125°°CSensing ElementThin Film Temperature Compensationand Gain Stage #1Gain Stage #2and Ground Reference Shift CircuitryV SV outGNDPins 4, 5, and 6 are NO CONNECTS for Unibody DevicePins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package DeviceMPX5050SensorsTable 2. . Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.P OP 0—50kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25Vdc Supply CurrentI o —7.010mAdc Minimum Pressure Offset (3)(0 to 85°C)@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.V off0.0880.20.313VdcFull Scale Output (4)(0 to 85°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO4.587 4.7 4.813VdcFull Scale Span (5)(0 to 85°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS— 4.5—VdcAccuracy (6)(0 to 85°C)6.Accuracy (error budget) consists of the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from theminimum or maximum rated pressure at 25°C.•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOffset:Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.•Variation from Nominal:T he variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C.———±2.5%V FSS Sensitivity V/P —90—-mV/kPa Response Time (7)7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I o+—0.1—-mAdc Warm-Up Time (8)8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-ms Offset Stability (9)9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.——±0.5—-%V FSSMPX5050SensorsFigure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability andqualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 2. Output versus Pressure DifferentialFigure 3. Cross-Sectional Diagram(not to scale)Figure 4. Recommended Power Supply Decouplingand Output Filtering(For additional output filtering, please refer toApplication Note AN1646.)Table 3. Mechanical CharacteristicsCharacteristicsTyp Unit Weight, Basic Element (Case 867) 1.8grams Weight, Basic Element (Case 1369) 3.376grams Weight, Basic Element (Case 482A)gramsDifferential Pressure (kPa)O u t p u t (V )5.04.54.03.53.02.52.01.51.00.500510152025303540455550Transfer Function:V out = V S *(0.018*P+0.04) ± ERROR V S = 5.0 VdcTEMP = 0 to 85°C TYPICALMINMAX+5 V1.0 μF0.01 μF470 pFGNDV sV outIPSOUTPUTFluoro Silicone Gel Die CoatWire BondDieP1Stainless Steel Metal CoverLead FrameDie BondEpoxy Plastic CaseP2Differential/Gauge ElementMPX5050SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressuresensor is designed to operate with positive differential pressure applied, P1 > P2.The Pressure (P1) side may be identified by using the table below:Nominal Transfer Value:V out = V S (P x 0.018 + 0.04)± (Pressure Error x Temp. Factor x 0.018 x V S )V S = 5.0 V ± 0.25 VdcTransfer FunctionMPX5050/MPXV5050G SERIESTemp Multiplier –403 0 to 851 +1253Temperature in °C4.03.02.00.01.0–40–2020406014012010080Temperature Error FactorNOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.Temperature Error BandPressure Error (Max)Pressure Error Band0 to 50 (kPa)±1.25 (kPa)Error Limits for PressurePressure (in kPa)3.02.01.0–1.0–2.0–3.00.0102030405060P r e s s u r e E r r o r (k P a )Part NumberCase TypePressure (P1) Side IdentifierMPX5050D 867Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369Side with Port Attached MPXV5050DP 1351Side with Part Marking MPXV5050GC6U/T1482AVertical Port AttachedPACKAGE DIMENSIONSCASE 867-08ISSUE NUNIBODY PACKAGECASE 867C-05ISSUE FUNIBODY PACKAGEMPX5050SensorsPACKAGE DIMENSIONSMPX5050 SensorsPACKAGE DIMENSIONSMPX5050SensorsPACKAGE DIMENSIONSMPX5050 SensorsPACKAGE DIMENSIONSMPX5050SensorsPACKAGE DIMENSIONSMPX5050 SensorsPACKAGE DIMENSIONSMPX5050SensorsCASE 482A-01ISSUE ASMALL OUTLINE PACKAGEMPX5050 SensorsMPX5050 Rev 9How to Reach Us:Home Page:Web Support:/supportUSA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. 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三星德仪等处理器规格表三星处理器型号制造工艺CPU架构核心频率GPU内存基带出货时间代表机型S5L890090nmARM11412MHzPowerVR MBX-LiteeDRAM——2007年iPhone、iPhone 3GS5PC10065nmA8667-833MHzPowerVR SGX535LPDDR2DDR2——2009年iPhone 3GSExynos 311045nmA81.2GHzPowerVR SGX540200MHz单通道LPDDR1/2、DDR2——2010年三星i9000、S8500、Google Nexus S、魅族M9 Exynos 347528nm HKMG1.3GHzMali-400 MP4450MHzLPDDR3——2015年Galaxy J1/J2/On5/On8/Folder、Galaxy Tab A 2016 Exynos 421045nm双核A91.2-1.4GHzMali-400266MHzLPDDR2、DDR2/3——2011年三星Galaxy S II、Galaxy Note、魅族MX(第一版) Exynos 421232nm HKMG1.5GHzMali-400440MHzLPDDR2、DDR2/3——2011年魅族MX(第二版)、Galaxy S4 ZoomExynos 441232nm HKMG四核A91.4GHz、1.6GHzMali-400 MP4440MHz双通道LPDDR2/DDR2/DDR3-800——2012年1.4GHz：Galaxy S III、联想K860、四核版魅族MX1.6GHz：Galaxy Note II、魅族MX2Exynos 525032nm HKMG双核A151.7GHzMali-T604 MP4533MHz双通道LPDDR3-800——2012年Q3Galaxy Mega 6.3、Chromebook XE303C12、Google Nexus 10、Arndale Board、Huins ACHRO 5250 Exynos、Freelander PD800 HD、Voyo A15、惠普Chromebook 11、三星HomesyncExynos 526028nm HKMG双核A15+四核A71.7+1.3GHzMali-T624 MP4600MHz双通道LPDDR3-800——2014年Q2Galaxy Note 3 Neo、Samsung Galaxy K Zoom、蓝魔S97、Rexnos Rex-RedExynos 541028nm HKMG四核A15+四核A71.6+1.2GHzPowerVR SGX544MP3480/533MHz双通道LPDDR3-800——2013年Q2Galaxy S4、魅族MX3、中兴Grand S II TD、Hardkernel ODROID-XU、iBerry CoreX8 3GExynos 542028nm HKMG四核A15+四核A71.9+1.3GHzMali-T628 MP6533MHz双通道LPDDR3e-933——2013年Q3Chromebook 2 11.6寸、Galaxy Note 3、Galaxy Note 10.1 (2014)、Galaxy Note Pro 12.2寸、Galaxy Tab Pro 12.2/10.1寸、Galaxy Tab S 8.4寸、Galaxy Tab S 10.5寸、Arndale Octa BoardExynos 542228nm HKMG四核A15+四核A72.1+1.5GHzMali-T628 MP6533MHz双通道LPDDR3/DDR3-933——2014年Q2Galaxy S5、Odroid XU3/XU3-Lite/XU4、Rexnos Rex-Red Exynos 543020nm HKMG四核A15+四核A71.8+1.3GHzMali-T628 MP6600MHz双通道LPDDR3/3e-1066——2014年Q3Galaxy Alpha (SM-G850F)、Galaxy A8、Galaxy A7、魅族MX4 ProExynos 543320nm HKMG四核A57+四核A531.9+1.3GHzMali-T760 MP8700MHz双通道LPDDR3-825LTE Cat.62014年Q4Galaxy Note 4、Galaxy Note Edge、Galaxy Tab S2、Galaxy A8VEExynos 580028nm HKMG四核A15+四核A72.0+1.3GHzMali-T628 MP6双通道LPDDR3-9332014年Q2Chromebook 2 13.3寸Exynos 742014nm LPE四核A57+四核A532.1+1.5GHzMali-T760 MP8782MHz64-bit双通道LPDDR4-1533LTE Cat.92015年Q2Galaxy S6、Galaxy S6 Edge、Galaxy S6 Active、Galaxy S6 Edge+、Galaxy Note 5、魅族PRO 5Exynos 758020nm HKMG八核A531.5GHzMali-T720 MP2668MHz双通道LPDDR3-933LTE Cat.42015年Q2Galaxy J7、Galaxy S5 Neo、Galaxy View、Galaxy A5 (2016),Exynos 787014nm HKMG八核A531.7GHzMali-T830 MP?双通道LPDDR3-933LTE Cat.62015年Q2Galaxy J7 (2016)Exynos 889014nm LPP四核M1+四核A532.6+1.5GHzMali-T880 MP12650MHz64-bit双通道LPDDR4-1800LTE Cat.12(下载/Cat.13(上传)2016年3月Galaxy S7、Galaxy S7 Edge联发科处理器型号制造工艺CPU架构核心频率GPU内存基带出货时间代表机型MT651665nm单核ARM9416MHz————GSM2009年Windows Mobile手机MT6573/651365nm单核ARM11650MHzPowerVR SGX531281MHz——MT6513：GSMMT6573：3G HSPA 2011年佳域G1、O+ 8.2 Android MT6515/657540nm单核A91GHzPowerVR SGX531522MHz——MT6515：GSMMT6575：3G HSPA2012年天语W686、联想A66、LG Optimus L4 II/Optimus L5 II MT6577/6577T40nm双核A91/1.2GHzPowerVR SGX 531 Ultra522MHz——3G HSPA+2012年联想P770、中兴Grand XMT657228nm双核A71.2GHzMali-400 MP1500MHz单通道LPDDR2-266HSPA+/TD-SCMDA2013年6月宏碁Iconia B1-72/Liquid Z3/Liquid Z5、华为AscendY320/Y330/Y511/Y600、联想A316i/A319、LG G50/G60、OPPO Joy/Neo 3、中兴Blade G Lux/Blade Q/Blade Q Maxi/Blade Q Mini/Fit 4G/Kis 3 MaxMT6572M28nm双核A71.0GHzMali-400 MP1400MHz单通道LPDDR2-266HSPA+/TD-SCMDA2014年宏碁Liquid Z200、HTC Desire 210/华为Ascend Y220、LG L20/L30、中兴V795LMT658928nm四核A71.2GHzPowerVR SGX544 MP286Hz单通道LPDDR2-533LPDDR2/3HSPA+/TD-SCMDA2013年3月宏碁Liquid E2/E3/E3 Duo Plus、明基F3、金立ElifeE3/GPad G3、华为Ascend G700、联想A820/A830/LePhone S750/P780/S820/S920、OPPO Mirror R819、索尼Xperia C、TCL S860、vivo X1S/Y19t、中兴Grand X Quad/N986/U956/V987MT6589M28nm四核A71.2GHzPowerVR SGX544 MP156MHz单通道LPDDR2-533LPDDR2/3HSPA+/TD-SCMDA2013年7月金立CTRL V4、海信HS-U970、华为G610sMT658228nm四核A71.3GHzMali-400 MP2500MHz单通道LPDDR2/3-533HSPA+/TD-SCDMA2013年Q3宏碁Liquid E700/Jade、金立CTRL V4S/M2/PioneerP3/Pioneer P4/V185、HTC Desire 320/316t/816G、华为荣耀3C/Holly、联想A680/A859/A889/S650/S850/S860/S930/A5000/A5500、OPPO Find 5 Mini/R1、索尼Xperia E4/Xperia E4 Dual、vivo Y11i/Y13/Y15/Y17w/Y20/Y22MT6582M28nm四核A71.3GHzMali-400 MP2400MHz单通道LPDDR2/3-533HSPA+/TD-SCDMA2014年Q1HTC Desire 310、联想A328/A526/A536/A606/A628T/A850/A880/S660、Oppo R2001 YoYo、中兴Blade L2MT659228nm HPM八核A72.0GHzMali-450 MP4700MHz单通道LPDDR2-533/LPDDR3-666HSPA+/TD-SCDMA2013年Q4红米Note、宏碁Liquid X1、酷派9976A/F1 8297/Great God F2、金立Elife E7 mini/Elife S5.5、HTC Desire 616w、华为荣耀3X/3X Pro、联想黄金斗士A8/A850+/S898T+/S939、Vivo X3S/X5/X6MT6592M28nm HPM八核A71.4GHzMali-450 MP4600MHz单通道LPDDR2-533/LPDDR3-666HSPA+/TD-SCDMA2014年红米Note、联想A916/S898T+/黄金斗士S8(加持版)、TCL 么么哒/P728MMT659128nm HPM六核A71.5GHzMali-450 MP4700MHz单通道LPDDR2/3HSPA+/TD-SCDMA2014年Q1金立GPad G5、Nibiru H1CMT659528nm HPM八核A72.2+1.7GHzPowerVR 6200600MHz双通道LPDDR3-933移动/联通双4G2014年Q1魅族MX4、阿尔卡特Onetouch D820 MT6595M28nm HPM八核A72.0+1.5GHzPowerVR 6200450MHz双通道LPDDR3-933移动/联通双4G2014年Q1酷派大神X7、联想Vibe X2-CU、Zopo ZP999 MT6595T28nm HPM八核A72.5+1.7GHzPowerVR 6200600MHz双通道LPDDR3-933移动/联通双4G2014年Q1MT6732/6732M28nm HPM四核A531.5/1.3GHzMali-T760MP2500/?MHz单通道LPDDR3-800LTE Cat.42013年Q4索尼Xperia E4gMT6735/6735M28nm HPM四核A531.3/1.0GHzMali-T720 MP2600/400MHz单通道LPDDR3-640LTE Cat.42014年Q3联想Vibe P1m/A2010、魅族M2、宏碁Liquid Z530、华为畅享5、酷派Note 3/Note 3 Lite、金立M5MT6737/6737M/6737T四核A531.3/1.1/1.5GHzMali-T860 MP1400MHz单通道LPDDR3-533 LTE Cat.4VoLTE2016年Q2MT673828nm四核A531.5GHzMali-T860 MP1400MHz单通道LPDDR3-533 LTE Cat.42016年MT675028nm HPC+八核A531.5GHzMali-T860 MP2400MHz单通道LPDDR3-667 LTE Cat.6双载波聚合/VolTE 2016年Q2MT6752/6752M28nm HPM八核A531.7/1.5GHzMali-T720 MP2单通道LPDDR3-800LTE Cat.42014年Q3金立S7、联想Vibe S1/K3 Note/P70/A7000、魅族魅蓝Note、索尼Xperia C4/C4 Dual/C5 Ultra/C5 Ultra Dual、HTC One E9s/Desire 820s、Vivo X6/X6 PlusMT675328nm八核A531.5GHzMali-T720 MP3700MHz单通道LPDDR3-800LTE Cat.42015年Q3华为畅享5S、联想K4 Note/A7010、魅族魅蓝Note 2、酷派Note 3Helio P10 MT675528nm HPC+八核A532GHzMali-T860 MP2700MHz单通道LPDDR3-933LTE Cat.6双载波聚合2015年Q4联想K5 Note、索尼Xperia XAHelio X10 MT679528nm HPC+八核A532.2GHzPowerVR G6200700MHz单通道LPDDR3-667LTE Cat.42014年Q4小米红米Note 2/3、乐视乐1S、魅族魅蓝Metal、金立E8、索尼Xperia M5/M5 Dual、HTC One M9+/E9+Helio P20 MT675x16nm FFC八核A532.3GHzMali-T880 MP2900MHz双通道LPDDR4x-1600 LTE Cat.6双载波聚合2016年Q3Helio X20 MT679728nm HPC+双核A72+四核A53+四核A532.3+2+1.4GHzMali-T880 MP4780MHz双通道LPDDR3-933LTE Cat.6双载波聚合2016年Q1乐视超级手机2、360奇酷F4、OPPO R9 Helio X25 MT6797T28nm HPC+双核A72+四核A53+四核A532.5+2+1.4GHzMali-T880 MP4850MHz双通道LPDDR3-933LTE Cat.6双载波聚合2016年Q1魅族PRO 6Helio X30 MT679x16nm FFC四核A72+双核A72+双核A53+双核A532.5+2+1.5+1GHzMali-T880 MP4900MHz双通道LPDDR4x-1600 LTE Cat.10双载波聚合2016年Q4华为处理器型号制造工艺CPU架构核心频率GPU内存基带出货时间代表机型K3V1(Hi3611)130nm单核ARM9E800MHz——————2009年Babiken Vefone V1、Ciphone 5 (C5)、T5355、IHTC HD-2、华为UMPCK3V2 (Hi3620)40nm四核A91.5GHz16核Vivante GC4000 480MHz64位双通道LPDDR2——2012年华为MediaPad 10 FHD、Ascend D2 (U9510)/P6S/P2/Mate、荣耀2(U9508)、联想A376、STREAM X (GSL07S)K3V2E28nm四核A91.5GHz16核Vivante GC4000480MHz64位双通道LPDDR2——2013年华为荣耀3麒麟91028nm HPM四核A91.6GHzMali-450 MP4533MHz32位单通道LPDDR3LTE Cat.42014年H1华为MediaPad X1/M1、P6 S、荣耀3C 4G、惠普Slate 7 VoiceTab Ultra麒麟910T28nm HPM四核A91.8GHzMali-450 MP4700MHz32位单通道LPDDR3LTE Cat.42014年H1华为Ascend P7 麒麟92028nm HPM四核A15+四核A7 1.7+1.3GHzMali-T624 MP4600MHz32位单通道LPDDR3-1600 LTE Cat.62014年H2华为荣耀6麒麟92528nm HPM四核A15+四核A7 1.8GHzMali-T62832位单通道LPDDR3-1600LTE Cat.62014年Q3华为Mate 7、荣耀6 Plus 麒麟92828nm HPM四核A15+四核A72GHzMali-T628MP464位双通道LPDDR3 LTE Cat.62014年Q3华为荣耀6至尊版麒麟62028nm八核A531.2GHzMali-450 MP4700MHz64位双通道LPDDR3 LTE Cat.42015年Q1华为P8青春版、荣耀4X/4C、G Play Mini 麒麟93028nm HPC八核A532.0+1.5GHzMali-T628 MP464位双通道LPDDR3-1600LTE Cat.62015年Q1华为P8、MediaPad X2/M2麒麟93528nm HPC八核A532.2+1.5GHzMali-T628 MP464位双通道LPDDR3-1600LTE Cat.62015年Q1华为P8 MAX、荣耀7、Mate S 麒麟95016nm FFC四核A72+四核A532.3+1.8GHzMali-T880 MP4900MHz64位双通道LPDDR4双卡LTE Cat.62015年Q4华为P9 MAX、Mate 8苹果处理器型号制造工艺CPU架构核心频率GPU内存基带出货时间代表机型APL009890nm单核ARM11412MHzPowerVR MBX Lite103MHz16位单通道LPDDR-133——2007年6月iPhone、iPod touch、iPhone 3G ALP027865nm单核ARM11412-533MHzPowerVR MBX Lite103-133MHz32位单通道LPDDR-133——2008年9月iPod touch 2、iPod nano 4 ALP029865nm单核A8600MHzPowerVR SGX535150MHz32位单通道LPDDR-200——2009年6月iPhone 3GSAPL229845nm单核A8600-800MHz PowerVR SGX535150-200MHz32位单通道LPDDR-200——2009年9月iPod touch 3A4(APL0398)45nm单核A8800MHz-1GHz PowerVR SGX535200-250MHz32位双通道LPDDR-200——2010年3月iPhone 4、iPad、iPod touch 4、Apple TV 2 A5(APL0498)45nm双核A9800MHz-1GHzPowerVR SGX54 MP2200-250MHz32位双通道LPDDR2-800——2011年3月iPhone 4S、iPad 2A5(APL2498)32nm HKMG双核A9800MHz-1GHzPowerVR SGX543 MP2200-250MHz32位双通道LPDDR2-800——2012年3月iPad 2 (iPad2,4)、iPod touch 5、iPad mini、Apple TV 3(单核)A5(APL7498)32nm HKMG单核A9?PowerVR SGX543 MP2200-250MHz332位双通道LPDDR2-800——2013年3月AppleTV 3,2A5X(APL5498)45nm双核A91GHzPowerVR SGX543 MP4250MHz332位双通道LPDDR2-800——2012年3月iPad 3A6(APL0598)32nm HKMG双核Swift1.3GHzPowerVR SGX543 MP3266MHz32位双通道LPDDR2-1066——2012年9月iPhone 5、iPhone 5C A6X(APL5598)32nm KHMG双核Swift1.4GHzPowerVR SGX554 MP4266MHz32位双通道LPDDR2-1066——2012年10月iPad 4A7(APL0698/5698)28nm HKMG双核Cyclone1.3GHzPower VR G6430 MP4450MHz64位双通道LPDDR3-1600——2013年9-10月iPhone 5S、iPad mini 2/3、iPad Air(1.4GHz)A8(APL1011)20nm HKMG双核Typhoon1.1-1.5GHzPowerVR GX6450 MP4450MHz64位双通道LPDDR3-1600——2014年9月iPhone 6、iPhone 6 Plus、iPod touch 6、iPad mini 4、Apple TV 4A8X(APL1012)20nm HKMG三核Typhoon1.5GHzPowerVR GXA6850 MP8450MHz64位双通道LPDDR3-1600——2014年10月iPad Air 2A9(APL0898/1022)14/16nm FinFET双核Twist1.85GHzPowerVR GT7600 MP10450MHz64位双通道LPDDR4-3200——2015年9月iPhone 6S、iPhone 6S Plus A9X(APL1021)16nm FinFET双核Twist2.26GHzPowerVR 7XT MP1264位双通道LPDDR4-3200——2015年11月iPad ProIntel处理器型号制造工艺CPU架构核心频率GPU内存基带出货时间代表机型Atom Z242032nm单核双线程1.2GHz PowerVR SGX540400MHz32位双通道LPDDR2-800——2013年Q1 Liquid C1Atom Z246032nm单核双线程1.3-1.6GHzPowerVR SGX540400MHz32位双通道LPDDR2-800——2012年Q2联想K800、中兴Grand X IN Atom Z248032nm单核双线程1.3-2GHzPowerVR SGX540400MHz32位双通道。

5833中⽂资料Designed to reduce logic supply current, chip size, and system cost, the UCN5833A/EP integrated circuits offer high-speed operation for thermal printers. These devices can also be used to drive multi-plexed LED displays or incandescent lamps within their 125 mA peak output current rating. The combination of bipolar and MOS technolo-gies gives BiMOS II smart power ICs an interface flexibility beyond the reach of standard buffers and power driver circuits.These 32-bit drivers have bipolar open-collector npn Darlington outputs, a CMOS data latch for each of the drivers, a 32-bit CMOS shift register, and CMOS control circuitry. The high-speed CMOS shift registers and latches allow operation with most microprocessor-based systems at data input rates above 3.3 MHz. Use of these drivers with TTL may require input pull-up resistors to ensure an input logic high.The UCN5833A is supplied in a 40-pin dual in-line plastic package with 0.600" (15.24 mm) row spacing. At an ambient temperature of +75°C, all outputs of the DlP-packaged device will sustain 50 mA continuously. For high-density applications, the UCN5833EP is available. This 44-lead plastic chip carrier (quad pack) is intended for surface-mounting on solder lands with 0.050" (1.27 mm) centers.CMOS serial data outputs permit cascading for applications requiring additional drive lines.FEATURESI To 3.3 MHz Data Input Rate I 30 V Minimum Output Breakdown I Darlington Current-Sink Outputs I Low-Power CMOS Logic and LatchesBiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERAlways order by complete part number:Part Number Package UCN5833A 40-Pin DIP UCN5833EP 44-Lead PLCCData Sheet 26185.16A*58335833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000SERIAL DATA IN POWER STROBE OUT OUT OUT OUT OUT OUT 123456OUT7OUT 8OUT 9OUTOUT OUTOUT OUTLOGIC SUPPLY OUT OUT Dwg. No. A-13,051TYPICAL OUTPUT DRIVERSUBOUT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Copyright ? 1986, 1995, Allegro MicroSystems, Inc.5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERTRUTH TABLEL = Low Logic Level H = High Logic Level X = Irrelevant P = Present State R = Previous StateELECTRICAL CHARACTERISTICS at T A = +25°C, V DD = 5 V (unless otherwise noted).Limits CharacteristicSymbol Test Conditions Min.Max.Units Output Leakage Current I CEX V OUT = 30 V, T A = 70°C —10µA Collector-Emitter V CE(SAT)l OUT = 50 mA — 1.2V l OUT = 100 mA— 1.7V Input VoltageV IN(1) 3.5 5.3V V IN(0)-0.3+0.8V Input Currentl IN(1)V IN = 5.0 V — 1.0µA l IN(0)V IN = 0 V —-1.0µA Serial Output VoltageV OUT(1)I OUT = -200 µA 4.5—V V OUT(0)I OUT = 200 µA—0.3V Supply Currentl DD One output ON, l OUT = 100 mA — 1.0mA All outputs OFF—50µA Output Rise Time t r l OUT = 100 mA, 10% to 90%—500ns Output Fall Timet fl OUT = 100 mA, 90% to 10%—500nsNOTE: Positive (negative) current is defined as going into (coming out of) the specified device pin.Saturation Voltage5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000TIMING CONDITIONS(V DD = 5.0 V, Logic Levels are V DD and Ground)A.Minimum Data Active Time Before Clock Pulse(Data Set-Up Time)..........................................................................75 ns B.Minimum Data Active Time After Clock Pulse(Data Hold Time).............................................................................75 ns C.Minimum Data Pulse Width ................................................................150 ns D.Minimum Clock Pulse Width...............................................................150 nsE.Minimum Time Between Clock Activation and Strobe.......................300 nsF.Minimum Strobe Pulse Width .............................................................100 nsG.Typical Time Between Strobe Activation andOutput Transition ...........................................................................500 nsDwg. No. A-12,276ASerial Data present at the input is transferred to the shift register on the logic “0” to logic “1” transition of the CLOCK input pulse. On succeeding CLOCK pulses, the registers shift data information towards the SERIAL DATA OUTPUT. The SERIAL DATA must appear at the input prior to the rising edge of the CLOCK input waveform.Information present at any register is transferred to its respective latch when the STROBE is high (serial-to-parallel conversion). The latches will continue to accept new data as long as the STROBE is held high. Applications where the latches are bypassed (STROBE tied high) will require that the OUTPUT ENABLE input be low during serial data entry.When the OUTPUT ENABLE input is low, all of the output buffers are disabled (OFF) without affecting the information stored in the latches or shift register. With the OUTPUT ENABLE input high, the outputs are controlled by the state of the latches.CLOCK DATA INSTROBE NOUTPUT ENABLEOUT5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERNOTES:1.Exact body and lead configuration at vendor’s option within limits shown.2.Lead spacing tolerance is non-cumulative.3.Lead thickness is measured at seating plane or below.UCN5833ADimensions in Inches (controlling dimensions)Dimensions in Millimeters (for reference only)123Dwg. MA-003-40 mm20421123Dwg. MA-003-40 in2045833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000UCN5833EPDimensions in Inches (controlling dimensions)Dimensions in Millimeters (for reference only)Dwg. MA-005-44A mm0.53340Dwg. MA-005-44A in0.021740NOTES:1.Exact body and lead configuration at vendor’s option within limits shown.2.Lead spacing tolerance is non-cumulative.5833BiMOS II 32-BITSERIAL-INPUT,LATCHED DRIVERThe products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. 5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000POWERINTERFACE DRIVERSFunctionOutput Ratings*Part Number ?SERIAL-INPUT LATCHED DRIVERS8-Bit (saturated drivers)-120 mA 50 V?58958-Bit 350 mA 50 V 58218-Bit 350 mA 80 V 58228-Bit 350 mA 50 V?58418-Bit 350 mA 80 V?58428-Bit (constant-current LED driver)75 mA 17 V 62758-Bit (DMOS drivers)250 mA 50 V 65958-Bit (DMOS drivers)350 mA 50 V?6A5958-Bit (DMOS drivers)100 mA 50 V 6B59510-Bit (active pull-downs)-25 mA 60 V 5810-F and 6809/1012-Bit (active pull-downs)-25 mA 60 V 5811 and 681116-Bit (constant-current LED driver)75 mA 17 V 627620-Bit (active pull-downs)-25 mA 60 V 5812-F and 681232-Bit (active pull-downs)-25 mA 60 V 5818-F and 681832-Bit100 mA 30 V 583332-Bit (saturated drivers)100 mA 40 V 5832PARALLEL-INPUT LATCHED DRIVERS4-Bit350 mA 50 V?58008-Bit -25 mA 60 V 58158-Bit350 mA 50 V?58018-Bit (DMOS drivers)100 mA 50 V 6B2738-Bit (DMOS drivers)250 mA 50 V 6273SPECIAL-PURPOSE DEVICESUnipolar Stepper Motor Translator/Driver 1.25 A 50 V?5804Addressable 8-Bit Decoder/DMOS Driver 250 mA 50 V6259Addressable 8-Bit Decoder/DMOS Driver 350 mA 50 V?6A259Addressable 8-Bit Decoder/DMOS Driver 100 mA 50 V 6B259Addressable 28-Line Decoder/Driver 450 mA30 V6817*Current is maximum specified test condition, voltage is maximum rating. See specification for sustaining voltagelimits.Negative current is defined as coming out of (sourcing) the output.Complete part number includes additional characters to indicate operating temperature range and package style. Internal transient-suppression diodes included for inductive-load protection.。