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UM11817Introduction to 18-cell slider battery pack emulatorRev. 1 — 17 February 2023User manualIntroduction to 18-cell slider battery pack emulatorIntroduction to 18-cell slider battery pack emulator 1 IntroductionThe BATT-18EMULATOR board can emulate a multi-cell battery pack that can be easily hooked-up to the evaluation boards for MC33774 18-cell battery cell controllers (BCCs):•RD33774ADSTEVB - distributed board with single MC33774•RD33774CNT3EVB - centralized board with three MC33774The user can connect the BATT-18EMULATOR board for a quick evaluation of NXP BCC ICs, or to help the users in their software development. These boards basically provide a very intuitive way:•To change the voltage across any of the 18 cells of an emulated battery pack•To change the voltage across some analog inputs of the BCC IC that are typically used as temperature sensorsFigure 1. BATT-18EMULATOR2 Getting started2.1 Kit contents/packing listThe kit contents include:•BATT-18EMULATOR, 18-cell slider battery pack emulator•25 W AC-DC adapter with +5 VDC/5 A single output - DC plug type P1J (2.1 × 5.5 × 11 mm), tuning fork type, center positive•Adapter cable DC plug 2.1 × 5.5 × 11 mm to 2.5 × 5.5 × 9.5 mmIntroduction to 18-cell slider battery pack emulator 3 Getting to know the hardware3.1 Board features•18 slider potentiometers to adjust the cells voltage between 1.2 V and 3.3 V. The maximum total voltage has been limited to 60 V.•Three cells voltage can be inverted to apply voltages from −1.2 V to −3.3 V•Maximum current capability per channel: 200 mA•Three connectors for MC33774 evaluation boards connections•Temperature sensor output voltage can vary from 0 V to +4.95 V to simulate negative temperature coefficient (NTC) sensor3.2 Board functionsThe board has been designed and optimized for the operating conditions described in Table 1 and Table 2. Usage of the board beyond these conditions can lead to malfunction and damage.Table 1. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).[1]The maximum input supply current depends on the setup: number of boards connected, cells voltage, activated cell balancing channels; seeSection 3.3.3.[1]With jumpers setting, it is possible to get negative voltages from −3.3 V to −1.2 V for cells 13, 8 and 4; see Section 3.3.4.Introduction to 18-cell slider battery pack emulator 3.3 Board functional descriptionFigure 2. BATT-18EMULATOR board elements3.3.1 DescriptionEach cell emulation is made of a 5 V to 5 V unregulated isolated DC-DC converter and an adjustable regulator. The regulator output voltage is set thanks to a voltage slider. Minimum voltage is 1.2 V and maximum is set to 3.3 V.3.3.2 Connection and configurationThe emulator board requires a 5 V DC power supply with 5 A current capability. The power supply is connected to the board via J3 a Ø2.5 mm jack connector or using the 2 mm bananas J2(+) and J1(−). The center pinis connected to the positive voltage and the ring terminal to the ground. The input of the board is 5 A fuse protected. An LED allows the user to check that the board is powered up. If the voltage is present on the jack connector but the LED is off, then check the fuse F1.Up to three evaluation boards RD33774ADSTEVB or one RD33774CNT3EVB can be connected using connectors J4, J5, and J6 with no specific order.3.3.3 Current consumptionThe slider pack should be supplied with a +5 V AC-DC adapter or with a lab supply. The required supply current depends on several parameters described below.With no board connected, the default supply current on the 5 V primary is around 500 mA [19 × 28 mA (DC-DC typ supply current)].One RD33774ADSTEVB board, communicating, no balancing activated, consumes around 10.5 mA. Then the total supply current required on the 5 V primary is around 700 mA [500 mA + (19 × 10.5 mA)].If three boards are connected, then the supply current is 500 mA + (3 × 19 × 10.5 mA) = 1 A.If cell balancing is activated, the primary current depends on the cell voltage, the balancing resistance, and the number of balancing metal-oxide-semiconductor field-effect transistor (MOSFET) activated.Introduction to 18-cell slider battery pack emulator On RD33774ADSTEVB, the balancing resistance is 22 Ω per cell balancing channel. With V cell = 3.3 V, the peak balancing current is 150 mA peak, 75 mA average assuming a 50 % duty cycle. If N cell balancing MOSFETs are activated, then N × 75 mA are added to the primary current needed. If one board is connected and all18 cell balancing MOSFETs are activated, then the total current is 700 mA + 18 × 75 mA = 2 A. Each individual channel (200 mA of current capability) has to provide 10.5 mA + 75 mA averaged or 10.5 mA + 150 mA peak. Note: The current is limited to 180 mA per channel. If several boards are connected, it is recommended toavoid to activate same cell balancing channels at the same time on all the boards.3.3.4 Cell polarity selectionThree pairs of jumpers allow the polarity to be reversed for cell polarities for cell4 (C5M − C4M), cell8(C9M − C8M) and cell13 (C14M − C13M) therefore providing voltages between −1.2 V and −3.3 V; see Table 3.Note: Jumper selections should be done prior to supplying the BATT-18EMULATOR. Adjacent cell voltages are impacted when changing the polarities.3.3.5 External voltage injectionThe three jumpers can also be used as injection points to inject voltages above slider ranges: −1.2 V < V inj <+1.2 V or 3.3 V < V inj, typically to evaluate MC33774 cell terminal measurements at very low voltage (busbars) or a high-voltage cell.As example, to inject a voltage between C5M and C4M, remove jumper J8, keep jumper J7 1-2, and connect a floating supply between J8-2 and J7-1 or 2. Do not exceed maximum ratings and keep cell voltage in the range −5 V to +5 V.3.3.6 Temperature sensor simulationA separate slider allows the variation of the voltage across the temperature sensors.The temperature sensor output voltage can vary from 0 V to +4.95 V. It can mimic the temperaturevariation from −48 °C to +200 °C of a 10 kΩ NTC sensor. This output voltage is connected to four different general‑purpose input/output (GPIO) on the MC33774 (GPIO 1, 2, 7, 8) configured as ratiometric inputs with10 kΩ pull‑up resistors to VAUX (3.3 V typ.).3.4 MC33774 board connectionsThree 32 pins connectors (JAE Electronics MX34032NF2) J4, J5, J6 are connected in parallel as perthe following schematic Figure 3. Up to three boards (for example, RD33774ADSTEVB) or one boardRD33774CNT3EVB can be connected on any of these connectors.Introduction to 18-cell slider battery pack emulator Slider cell 0 is setting the voltage between C0M (cell0M) and C1M (cell0P), slider cell 1 is setting the voltage between C1M (cell1M) and C2M (cell1P), and so on, slider cell 17 is setting the voltage between C17M(cell17M) and C17P (cell17P).C17P-PWR and GND (pin 21) are used to supply the RD33774ADSTEVB and are separated from C17P andC0M respectively to avoid any voltage drop due to the current consumption of the evaluation boards.The slide temperature sensor is connected on pin 17 to pin 20 (NTC1, 2, 7 and 8 for RD33774DSTEVB).Figure 4. BATT-18EMULATOR connected to three RD33774DSTEVBIntroduction to 18-cell slider battery pack emulator 4 SchematicFigure 5. SchemaIntroduction to 18-cell slider battery pack emulator 5 Legal information5.1 DefinitionsDraft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.5.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. 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Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP.NXP has a Product Security Incident Response Team (PSIRT) (reachableat *************) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.Introduction to 18-cell slider battery pack emulatorNXP — wordmark and logo are trademarks of NXP B.V.5.3 TrademarksNotice: All referenced brands, product names, service names, andtrademarks are the property of their respective owners.Introduction to 18-cell slider battery pack emulatorTablesTab. 1.Limiting values (4)Tab. 2.Electrical characteristics (4)Tab. 3.Cell voltage polarity selection (6)FiguresFig. 1.BATT-18EMULATOR (3)Fig. 2.BATT-18EMULATOR board elements (5)Fig. 3.Cell connector schematic ..................................7Fig. 4.BATT-18EMULATOR connected to threeRD33774DSTEVB (7)Fig. 5.Schema (8)UM11817All information provided in this document is subject to legal disclaimers.© 2023 NXP B.V. All rights reserved. User manual Rev. 1 — 17 February 202311 / 12Introduction to 18-cell slider battery pack emulatorContents1Introduction (3)2Getting started (3)2.1Kit contents/packing list (3)3Getting to know the hardware (4)3.1Board features (4)3.2Board functions (4)3.3Board functional description (5)3.3.1Description (5)3.3.2Connection and configuration (5)3.3.3Current consumption (5)3.3.4Cell polarity selection (6)3.3.5External voltage injection (6)3.3.6Temperature sensor simulation (6)3.4MC33774 board connections (6)4Schematic (8)5Legal information (9)Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.© 2023 NXP B.V.All rights reserved.For more information, please visit: Date of release: 17 February 2023。
GreenChip同步整流控制器第1版——2022年6月7日产品数据手册1 简介TEA2093TS是针对开关电源的新一代同步整流器(SR)控制器IC系列中的一员。
它包含自适应栅极驱动器，以便在任意负载下达到最高效率。
TEA2093TS是一款专门用于非对称半桥反激式和标准反激式转换器次级侧同步整流的控制器IC。
它内置用于驱动SR MOSFET的检测级和驱动器级，对次级变压器绕组的输出进行整流。
TEA2093TS可以为具有低输出电压的电池充电应用或具有高侧整流的应用生成自己的供电电压。
TEA2093TS采用绝缘硅片(SOI)工艺制成。
2 特性和优势2.1 能效特性●自适应栅极驱动器，在任意负载下达到最高效率●空载运行时的典型电源电流低于200 μA2.2 应用特性●在低至0 V的宽输出电压范围内工作●能够处理高达120 V输入电压的漏检测引脚●对低输出电压工作自供电●对不使用辅助绕组的高侧整流自供电●使用标准和逻辑电平SR MOSFET●支持USB BC、USB PD和快充应用●TSOP6封装2.3 控制特性●自适应栅极驱动器，实现导通终止时的快速关闭●带有源栅极下拉的欠压锁定(UVLO)3 应用TEA2093TS适用于反激式电源。
在此类应用中，它可以驱动外部同步整流器MOSFET，这些MOSFET取代用于对变压器次级绕组上的电压进行整流的二极管。
它可用于所有需要高效率的电源，如：●充电器●电源适配器●非对称半桥反激式电源●具有极低和/或可变输出电压的反激式电源4 订购信息表1.订购信息型号封装名称说明版本TEA2093TS/1 TSOP6 塑料小型封装；6引脚SOT4575 标示表2.标记代码型号标记代码TEA2093TS/1 TEA20936 功能框图图1. TEA2093TS 功能框图导通调节关断调节V 和I参考欠压锁定 驱动器供电节能控制使能逻辑关闭7 引脚分布信息7.1 引脚分布图2.TEA2093TS引脚分布(SOT457)7.2 引脚说明表3.引脚说明符号引脚说明CAP 1 内部供电电压的电容输入GND 2 接地XV 3 外部电源输入GATE 4 SR MOSFET的栅极驱动器输出SOURCE 5 SR MOSFET的源极检测输入DRAIN 6 SR MOSFET的漏极检测输入8 功能说明8.1 简介TEA2093TS是一款用于非对称半桥反激式和标准反激式应用中的同步整流(SR)的控制器IC。
NXP Semiconductors Document identifier: MIMXRT10601064EKBHUG User's Guide Rev. 0, 06/2020MIMXRT1060/1064 Evaluation Kit Board Hardware User's GuideContentsChapter 1 Introduction (3)1.1 Board overview (3)1.2 MIMXRT1060/1064 EVK contents (4)1.3 MIMXRT1060/1064 EVK board revision history (4)Chapter 2 Specifications (5)2.1 i.MX RT1060/1064 processor (7)2.2 Boot mode configurations (7)2.3 Power tree (8)2.4 SDRAM memory (11)2.5 SD card slot (11)2.6 Hyper flash (11)2.7 QSPI flash (11)2.8 Ethernet connector (12)2.9 USB PHY connector (12)2.10 Audio input/output connector (12)2.11 OpenSDA circuit (DAP-Link) (12)2.12 JTAG connector (12)2.13 Arduino expansion port (13)2.14 Camera module connector (14)2.15 User interface switch (14)2.16 Sensor (15)2.17 User interface LED indicator (15)2.18 LCD interface (15)Chapter 3 PCB information (16)Chapter 4 EVK design files (17)Chapter 5 EVK contents (18)Chapter 1IntroductionThis document describes MIMXRT1060/1064 Evaluation Kit (EVK) based on the i.MX RT1060/1064 processor from NXP Semiconductor. The document includes system setup, debugging, and provides detailed information on the overall design and usage of the EVK board from a hardware system.1.1Board overviewThis EVK board is a platform designed to showcase the commonly used features of the i.MX RT1060/1064 Processor in a small, low-cost package. The MIMXRT1060/1064 EVK board is an entry level development board that familiarizes the developer to the processor before investing on resources for specific designs.The features of the MIMXRT1060/1064 EVK board are listed in Board features.The features of the MIMXRT1060/1064 EVK board are listed in Table 1.Table 1.Board featuresProcessor NXP Processor MIMXRT1062DVL6AMIMXRT1064DVL6ADRAM Memory SDRAM 256 Mbit, 166 MHz IS42S16160J-6BLIDCDC MPS MP2144GJLDO UNION UM1550S-18UM1750S-00Mass Storage TF Card Slot64 Mbit Quad SPI flash512 Mbit Hyper flashDisplay Interface LCD connectorEthernet10/100 Mbit/s Ethernet connector. PHY chip: KSZ8081RNBUSB USB 2.0 OTG connectorUSB 2.0 host connectorAudio Connector 3.5 mm audio stereo headphone jackBoard-mounted microphoneLeft and right speaker out connectorsS/PDIF interface (unpopulated )Power Connector 5 V DC-jackDebug Connector JTAG 20-pin connector (SWD by default)OpenSDA with DAP-LinkSensor FXOS8700CQ: 6-Axis Ecompass (3-Axis Mag, 3-Axis Accel)(Some boards are unpopulated)Table continues on the next page...IntroductionTable 1.Board features (continued)Camera CMOS sensor interfaceCAN CAN bus connectorUser Interface Button ON/OFF, POR Reset, Reset, USER buttonLED Indicator Power Status, Reset, OpenSDA, USER LEDExpansion Port Arduino interfacePCB 3.937 inch x 5.9055 inch (10 cm x 15 cm), 4-layer board1.2MIMXRT1060/1064 EVK contentsThe MIMXRT1060/1064 EVK contains the following items:•MIMXRT1060/1064 EVK board•USB cable (Micro B)•Camera1.3MIMXRT1060/1064 EVK board revision historyEVK: Mass ProductChapter 2SpecificationsThis section provides detailed information about the electrical design and practical considerations of the EVK board. The document describes each block shown in Block diagram.The document describes each block shown in Figure 1.Figure 1.Block diagramThe overview of the MIMXRT1060 EVK board is shown in Figure 2 and Figure 3.Figure 2.Overview of the MIMXRT1060 EVK board (Front side)Figure 3.Overview of the MIMXRT1060 EVK board (Back side)2.1i.MX RT1060/1064 processorThe i.MX RT1060/1064 is a new processor family featuring NXP advanced implementation of the Arm Cortex-M7 Core. It provides high CPU performance and best real-time response. i.MX RT1060/1064 provides various memory interfaces, including SDRAM, Raw NAND flash, NOR flash, SD/eMMC, Quad SPI, HyperBus, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors. i.MX RT1060/1064 has rich audio and video features, including LCD display, basic 2D graphics, camera interface, S/PDIF, and I2S audio interface.The i.MX RT1060/1064 applications processor can be used in areas such as industrial HMI, IoT, motor control, and home appliances. The flexibility of the architecture enables it to be used in a wide variety of other general embedded applications too. The i.MX RT processor provides all interfaces necessary to connect peripherals such as WLAN, Bluetooth™, GPS, camera sensors, and multiple displays.The more detail information about i.MX RT1060/1064 can be found in the Datasheet and Reference Manual.2.2Boot mode configurationsThe device has four boot modes (one is reserved for NXP use). The boot mode is selected based on the binary value stored in the internal BOOT_MODE register.Switch (SW7-3 and SW7-4) is used to select the boot mode on the MIMXRT1060/1064 EVK board.Table 2.Boot mode pin settingsBOOT_MODE[1:0] (SW7-3 SW7-4)BOOT TypeTable continues on the next page...Table 2.Boot mode pin settings (continued)00Boot From Fuses 01Serial Downloader 10Internal Boot 11ReservedTypically, the internal boot is selected for normal boot, which is configured by external BOOT_CFG GPIOs. Table 3 shows the typical Boot Mode and Boot Device settings.Table 3.Typical boot mode and boot device settings for RT1060SW7-1SW7-2SW7-3SW7-4Boot Device OFF ON ON OFF Hyper flash OFFOFF ON OFF QSPI flash ONOFFONOFFSD cardFor more information about boot mode configuration, see the System Boot chapter of the MIMXRT1060 Reference Manual .For more information about MIMXRT1060 EVK boot device selection and configuration, see the main board schematic .Table 4.Typical boot mode and boot device settings for RT1064SW7-1SW7-2SW7-3SW7-4Boot Device OFF OFF ON OFF QSPI flash ONOFFONOFFSD card2.3Power treeA DC 5 V external power supply is used to supply the MIMXRT1060/1064 EVK board at J2, and a slide switch SW1 is used to turn the Power ON/OFF. J41 and J9 is used to supply the EVK board.Table 5 lists different J1 jumper settings for different power supply.Table 5.Jumper settings for power supply Power Supply J1 Setting J21-2J93-4J415-6The power tree is shown in the following figure.Figure 4.Power treeThe power control logic of the MIMXRT1060/1064 EVK board is shown in the Figure 5.•SNVS is powered first and then PMIC_REQ_ON is switched on to enable external DC/DC to power up other power domains.•ON/OFF button is used to switch ON/OFF PMIC_REQ_ON to control power modes.•RESET button and WDOG output are used to reset the system power.Figure 5.Power control diagramThe power rails on the board are shown in Table 6.Table 6.Power railsTable continues on the next page...Table 6.Power rails (continued)2.4SDRAM memory256 Mbit, 166 MHz SDRAM (IS42S16160J-6BLI) is used on the EVK board.2.5SD card slotThere is an SD card slot (J39) on the MIMXRT1060/1064 EVK board. J39 is the Micro SD slot for USDHC1 interface. To boot from the SD card, the boot device switch (SW7) settings should be: ON, OFF, ON, OFF, as shown in Typical boot mode and boot device settings.2.6Hyper flashOn the MIMXRT1060/1064 EVK board, there is one 512 Mbit hyper flash device. To boot from the Hyper Flash, the boot device switch (SW7) settings should be: OFF, ON, ON, OFF, as shown in Table 3. By default, this hyper flash is disabled on the EVK. To enable the onboard hyper flash, update the following settings.1.Weld resistors: R356, R361 - R366.2.Removed 0Ωresistors: R153 - R158.The boot from hyper flash only supports RT1060.2.7QSPI flashA 64 Mbit QSPI flash is used on the MIMXRT1060/1064 EVK board. If the developer wants to boot from the QSPI flash, the boot device switch (SW7) settings should be: OFF, OFF, ON, OFF, as shown in Table 3. The QSPI flash is the default onboard flash.The boot from QSPI flash only supports RT1060.2.8Ethernet connectorThere are two Ethernet Mac controllers in the MIMXRT1060/1064 processor. The Ethernet subsystem of the MIMXRT1060/1064 EVK board is provided by the KSZ8081RNB 10/100 M Ethernet Transceiver (U16) and an RJ45 (J19) with integrated magnetic.2.9USB PHY connectorMIMXRT1060/1064 contains two integrated USB 2.0 PHYs capable of connecting USB host/device systems at:•USB low-speed (LS) rate of 1.5 Mbits/s•USB full-speed (FS) rate of 12 Mbits/s•USB 2.0 high-speed (HS) rate of 480 Mbits/s2.10Audio input/output connectorThe audio codec used on the MIMXRT1060/1064 EVK board is Wolfson’s low power, high-quality stereo codec, WM8960. The MIMXRT1060/1064 EVK board includes:•one headphone interface (J12)•one onboard MIC (P1)•two speaker interfaces (J16, J17)•S/PDIF interface (J14 and J18, DNP).J12 is a 3.5 mm audio-stereo headphone jack, which supports jack detect.2.11OpenSDA circuit (DAP-Link)The OpenSDA circuit (CMSIS–DAP) is an open-standard serial and debug adapter. It bridges serial and debug communications between a USB host and an embedded target processor.CMSIS-DAP features a mass storage device (MSD) bootloader, which provides a quick and easy mechanism for loading different CMSIS-DAP applications such as flash programmers, run-control debug interfaces, serial-to-USB converters, and more.Two or more CMSIS-DAP applications can run simultaneously. For example, run-control debug application and serial-to-USB converter run in parallel to provide a virtual COM communication interface while allowing code debugging via CMSIS-DAP with single USB connection.For the MIMXRT1060/1064 EVK board, J41 is the connector between the USB host and the RT1060/1064. To update the Open SDA firmaware, press the SW8 and Power on the board. There is a disk named "MAINTENANCE". Drag/drop the new firmware to the "MAINTENANCE" and re-power the board. The firmware is updated.2.12JTAG connectorJ21 is a standard 20-pin/2.54 mm box header connector JTAG. The pin definitions are shown in Figure 6. It supports SWD by default.Figure 6.JTAG pin definitions2.13Arduino expansion portJ22 – J25 is defined as Arduino interface. Table 7 lists the pin definitions of Arduino interface. Table 7.Arduino Interface pin definitionsJ22J23UART_RX/D0A0/ADC0UART_TX/D1A1/ADC1D2/INT0A2/ADC2D3/INT1/PWM/OC2B A3/ADC3D4/T0/XCK A4/ADC4/SDAD5/TI/PWM A5/ADC5/SCLD6/AIN0/PWM/OC0AD7/AIN1/PWMJ24J25D8/CLKO/ICP1NCD9/OC1A/PWM IOREFD10/SPI_CS RESETD11/OC2A/PWM/SPI_MOSI 3.3 VD12/SPI_MISO 5 VD13/SPI_CLK GNDGND GNDAREFD14/I2C_SDAD15/I2C_SCL2.14Camera module connectori.MX RT1060/1064 supports one parallel CSI (Camera Sensor Interface). There is a camera module connector (J35) on the MIMXRT1060/1064 EVK board. The CA031C based on OV7725 and CA111C based on MT9M114 are used directly.J35 supports both MT9M114 and OV7725 camera module, but 3.3 V is a violation to MT9M114 spec 3.1 V. Itproved fine for evaluation/demo with 3.3 V supply, but in product design, it is recommended to adjust DCDC outputor add level shifter.2.15User interface switchThere are four user interface switches on the MIMXRT1060/1064 EVK board.•Power switch•ON/OFF button•Reset button•USER button2.15.1Power switchSW1 is a slide switch to control the power of the MIMXRT1060/1064 EVK board when the power supply is from J2.•Sliding the switch to the ON position connects the 5 V power supply to the evaluation board main power system.•Sliding the switch to the OFF position immediately removes all power from the board.2.15.2ON/OFF buttonSW2 is the ON/OFF button for MIMXRT1060/1064 EVK board. A short pressing in OFF mode causes the internal power management state machine to change state to ON. In ON mode, a short pressing generates an interrupt as a software-controllable power-down. An approximate 5 seconds or more pressing causes a forced OFF. However, you can disconnect both the boot mode inputs.2.15.3Reset buttonThere are two Reset buttons on the EVK board. SW3 is the power-on reset button. Pressing SW3 in the power on state forces to reset the system power except SNVS domain. The processor immediately turns off and reinitiates a boot cycle from the processor power off state. SW9 is a reset button.2.15.4USER buttonSW8 is a USER button (GPIO5-00). Pressing the USER button can produce changes in high and low levels.2.16SensorU32 on the EVK board is a 6-Axis Ecompass (3-Axis Mag, 3-Axis Accel) sensor FXOS8700CQ. The Ecompass is connected to i.MX RT1060/1064 I2C1 port.The sensor is not populated on some boards.2.17User interface LED indicatorThere are four LED status indicators on the EVK board.The functions of these LEDs include:•Main Power Supply (D3)—Green: DC 5 V main supply is normal.—Red: J2 input voltage is over 5.6 V.—Off: Board is not powered.•Reset RED LED (D21)•OpenSDA LED (D20)•USER LED (D18)2.18LCD interfaceThe enhanced Liquid Crystal Display Interface (eLCDIF) is a general-purpose display controller.The eLCDIF block supports the following:•Displays that support moving pictures and require the RGB interface mode (DOTCLK interface).The eLCDIF provides fully programmable functionality to supported interfaces:•Bus master interface to source frame buffer data for display refresh.•8/16/18/24/32 bit LCD data bus support available depending on I/O MUX options.•Programmable timing and parameters for DOTCLK LCD interfaces.To use the LCD, NXP provides an optional LCD module RK043FN02H-CT. RK043FN02H-CT has a 4.3 inches touch screen and supports a resolution of up to 480*3(RGB)*272. This module contains two FPC cables. The LCD interface is connected to J8 (A1-A40) and the CPT interface can be connected to J8 (B1-B6). You can purchase LCD modules from .PCB informationThe MIMXRT1060/1064 EVK board is uses the standard 4-layer technology. The material used is FR-4. The PCB stack-up information is shown in Table 8.Table 8.Board stack-up informationEVK design filesYou can download, the schematics, layout files, and gerber files (including Silkscreen) from /MIMXRT1060-EVK.EVK contentsThe following table lists the contents on the evaluation kit.Table 9.EVK contentsItem DescriptionEVK board EVK board with processor, memory, interfaces and so on. USB cable USB cable (Micro-B to Standard-A).Camera CA111C based on MT9M114.Power adapter, micro-SD card, and LCD module are not standard parts of the evaluation kit.How To Reach Us Home Page: Web Support: /support Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. 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The Power Architecture and word marks and the Power and logos and related marks are trademarks and service marks licensed by .© NXP B.V. 2020.All rights reserved.For more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:**********************Date of release: 06/2020Document identifier: MIMXRT10601064EKBHUG。
产品简介TRIMENSION ™ SR150和TRIMENSION SR040专为物联网用例而优化的安全超宽带(UWB)定位和测距TRIMENSION ™ SR150和TRIMENSION SR040旨在加快产品上市，专为物联网解决方案而设计，即使在电池供电的定位标签中也可实现高精度定位和安全测距。
低风险大规模批量供应商提供的标准IC完全支持与IEEE ® 802.15.4 HRP UWB 设备进行互操作符合FiRa ™认证开发标准高安全性基于IEEE 802.15.4z 的增强型超宽带测距技术集成的硬件加密加速器，提供旁路攻击防御力强大的eSE 集成，带有预加载的小程序，支持安全用例精确的定位6至8.5 GHz ，每通道500 MHz 带宽使用频道5、6、8和9，实现全球覆盖集成飞行时间(ToF)、到达时间差(TDoA)和到达角(AoA)算法支持AoA 功能的双RX(SR150) 测距精度(nLOS)：±10 cm 软件支持多达3个天线支持使用3个天线的3D 定位为搭配使用CR2032纽扣电池进行了优化(SR040)出色的信号强度Tx 峰值功率：+10.5 dBm 以上接收器噪声系数：+4 dB高Rx 灵敏度：-97 dBm @ 10% PER HPRF 模式可降低功耗，提高链路预算注：性能和功率数值仅供指示说明。
目标应用跟踪器和TDoA 标签(SR040) 无需手动操作的安全门禁定位服务锚点智能家居控制消费类电子产品支持安全交易（支付和交通运输等）的生态系统UWB定位UWB技术的精确测距和定位功能为多种用例带来了精确定位和便利性，包括安全门禁、室内定位以及支持物品跟踪和标签定位的设备到设备通信。
UWB能够以高精度安全地确定对等设备的相对位置。
使用宽带频谱意味着UWB发送信号所需的功率极低，能够以最小的干扰提供稳定的连接。
出色的精度其他无线技术（包括Wi-Fi®和蓝牙®）在理想条件下的物品定位精度大约为150 cm内，与之相比，UWB的定位精度可达到10 cm，并且覆盖同一区域所需的锚点更少。
恩智浦半导体数据手册：技术数据文件编号：IMXBMMCEC第0.2版，2019年4月MIMX8MM6DVTLZAAMIMX8MM4DVTLZAAMIMX8MM2DVTLZAAMIMX8MM5DVTLZAAMIMX8MM3DVTLZAAMIMX8MM1DVTLZAA适用于消费电子产品的i.MX 8M Mini应用处理器数据手册封装信息塑料封装FCBGA 14 x 14 mm，0.5 mm间距订购信息参见第6页的表21 i.MX 8M Mini简介i.MX 8M Mini应用处理器是能够带来最新视频和音频体验的恩智浦产品，具有最先进的特定媒体功能，采用高性能处理技术，同时优化了功耗。
i.MX 8M Mini系列处理器采用先进的四核Arm® Cortex®-A53内核，运行速度高达1.8 GHz。
一个通用型Cortex®-M4 400 MHz内核处理器用于低功耗处理。
DRAM控制器支持32位/16位LPDDR4、DDR4和DDR3L存储器。
可提供多种音频接口，包括I2S、AC97、TDM和S/PDIF。
提供许多其他接口用于连接外围设备，如USB、PCIe和以太网。
1. i.MX 8M Mini简介 (1)1.1. 功能框图 (5)1.2. 订购信息 (6)2. 模块列表 (8)2.1. 未使用的输入/输出的推荐连接 (12)i.MX 8M Mini简介表1. 特性i.MX 8M Mini简介表1. 特性（续）i.MX 8M Mini简介表1. 特性（续）注意实际功能集取决于产品型号（如表2所述）。
某些特定产品型号可能并未启用某些功能，如显示器和摄像头接口以及连接接口。
i.MX 8M Mini简介1.1 功能框图图1显示了i.MX 8M Mini应用处理器系统的功能模块。
图1. i.MX 8M Mini系统功能框图i.MX 8M Mini简介1.2 订购信息表2所示为本数据手册中包含的可订购样品型号的示例。
AN12977基于RSSI 测距的KW38/KW36定位第 0 版 — 2020 年 9 月作者：恩智浦半导体1 介绍接收信号强度指示（RSSI ）用于确定无线信号的质量。
它可以用于定位系统。
通过建立信号衰减模型，可以得到信号空间路径损耗与距离的关系。
可以使用链路损耗方程计算距离，并且可以通过将距离与软件算法相结合来评估位置。
本文档介绍了基于低功耗蓝牙RSSI 测距的定位。
它使用 Kinetis KW38 无线 MCU 实现了一个简单的三边定位系统。
应用笔记目录1 介绍 ............................................1 2 RSSI 测距 .....................................1 3 基于RSSI 测距的三遍定位 ..................3 4 本地化系统实施注意事项 .................5 5 设置和测试结果 ........................... 14 6 结论 (21)2 RSSI 测距2.1 事先定义标签 - 必须定位的未知位置的目标。
在本应用笔记中，它是一块 KW38 板。
锚点 - 固定位置的设备。
它收集 RSSI 值并将它们上传到位置计算设备。
通常，定位至少需要三个锚点。
2.2 无线信号路径损耗模型在定位系统，基于RSSI 测距，标签节点应用RSSI 测量使用已知的信号传播模型来估计从锚节点其距离。
空间无线信号路径损耗模型如图 1所示（a1c1, a1c2等为测试设备编号）。
RSSI 测距图1. 无线信号路径损耗渐变模型广泛用于对无线信号传播损耗进行建模，其表达式如下：• d 和 d 0 表示实际距离和参考距离。
• P r (d) 和 P r (d 0) 分别表示在实际距离和参考距离处接收到的RSSI (dBm)。
• n 是路径损耗指数。
• a δ 是随机噪声。
始终假定具有零均值和方差的高斯分布随机变量。
1.Product profile1.1General descriptionHigh-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages.1.2Features1.3Applications1.4Quick reference data[1]When switched from I F =10mA to I R =10mA; R L =100Ω; measured at I R =1mA.BAV99 seriesHigh-speed switching diodesRev. 05 — 20 August 2008Product data sheetTable 1.Product overviewType numberPackage ConfigurationPackageconfiguration NXPJEITA JEDEC BAV99SOT23-TO-236AB dual series small BAV99S SOT363SC-88-quadruple; 2series very small BAV99WSOT323SC-70-dual series very smallI High switching speed: t rr ≤4ns I Low capacitance: C d ≤1.5pF I Low leakage currentI Reverse voltage: V R ≤100VI Small SMD plastic packagesI High-speed switchingI Reverse polarity protectionI General-purpose switchingTable 2.Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I R reverse current V R =80V--0.5µA V R reverse voltage --100V t rrreverse recovery time[1]--4ns2.Pinning information3.Ordering information4.Marking[1]* = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in ChinaTable 3.PinningPin Description Simplified outline Graphic symbolBAV99; BAV99W1anode (diode 1)2cathode (diode 2)3cathode (diode 1),anode (diode 2)BAV99S 1anode (diode 1)2cathode (diode 2)3cathode (diode 3),anode (diode 4)4anode (diode 3)5cathode (diode 4)6cathode (diode 1),anode (diode 2)006aaa144123006aaa763123132456006aab101136254Table 4.Ordering informationType numberPackage NameDescriptionVersion BAV99-plastic surface-mounted package; 3leads SOT23BAV99S SC-88plastic surface-mounted package; 6leads SOT363BAV99WSC-70plastic surface-mounted package; 3leadsSOT323Table 5.Marking codesType numberMarking code [1]BAV99A7*BAV99S K1*BAV99WA7*5.Limiting values[1]Single diode loaded.[2]Double diode loaded.[3]T j =25°C prior to surge.[4]Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.[5]Soldering points at pins 2,3,5and 6.Table 6.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit Per diode V RRM repetitive peak reverse voltage -100V V R reverse voltage -100V I Fforward current BAV99[1]-215mA [2]-125mA BAV99S [1]-200mA BAV99W[1]-150mA [2]-130mA I FRM repetitive peak forward current-500mAI FSMnon-repetitive peak forward currentsquare wave [3]t p =1µs -4A t p =1ms -1A t p =1s-0.5A P tottotal power dissipation [1][4]BAV99T amb ≤25°C -250mW BAV99S T amb ≤85°C [5]-250mW BAV99WT amb ≤25°C-200mW Per device T j junction temperature -150°C T amb ambient temperature −65+150°C T stgstorage temperature−65+150°C6.Thermal characteristics[1]Single diode loaded.[2]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.[3]Soldering points at pins 2,3,5and 6.7.Characteristics[1]When switched from I F =10mA to I R =10mA; R L =100Ω; measured at I R =1mA.[2]When switched from I F =10mA; t r =20ns.Table 7.Thermal characteristics Symbol ParameterConditions Min Typ Max UnitR th(j-a)thermal resistance from junction to ambient in free air[1][2]BAV99--500K/W BAV99W--625K/WR th(j-sp)thermal resistance from junction to solder point BAV99--360K/W BAV99S [3]--260K/W BAV99W--300K/WTable 8.CharacteristicsT amb =25°C unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Per diode V Fforward voltageI F =1mA --715mV I F =10mA --855mV I F =50mA --1V I F =150mA-- 1.25V I Rreverse currentV R =25V --30nA V R =80V--0.5µA V R =25V; T j =150°C --30µA V R =80V; T j =150°C--50µA C d diode capacitance f =1MHz; V R =0V-- 1.5pF t rr reverse recovery time [1]--4ns V FRforward recovery voltage[2]--1.75V(1)T amb =150°C (2)T amb =85°C (3)T amb =25°C (4)T amb =−40°C(1)T amb =150°C (2)T amb =85°C (3)T amb =25°C (4)T amb =−40°CFig 1.Forward current as a function of forward voltage; typical valuesFig 2.Reverse current as a function of reverse voltage; typical valuesf =1MHz; T amb =25°CBased on square wave currents.T j =25°C; prior to surgeFig 3.Diode capacitance as a function of reverse voltage; typical valuesFig 4.Non-repetitive peak forward current as a function of pulse duration; maximum values006aab132110102103I F (mA)10−1V F (V)0 1.41.00.40.80.2 1.20.6(1)(2)(3)(4)006aab133102I R (µA)V R (V)01008040602010110−110−210−310−410−5(1)(2)(3)(4)08161240.80.60.40.2mbg446V R (V)C d (pF )mbg704101102I FSM (A)10−1t p (µs)1104103101028.Test information(1)I R =1mAInput signal: reverse pulse rise time t r =0.6ns; reverse voltage pulse duration t p =100ns; duty cycle δ=0.05Oscilloscope: rise time t r =0.35nsFig 5.Reverse recovery time test circuit and waveformsInput signal: forward pulse rise time t r =20ns; forward current pulse duration t p ≥100ns; duty cycle δ≤0.005Fig 6.Forward recovery voltage test circuit and waveformst rr(1)+ I Ftoutput signalt rt pt10 %90 %V Rinput signal V = V R + I F × R SR S = 50 ΩI FD.U.T.R i = 50 ΩSAMPLING OSCILLOSCOPEmga881t rtt p 10 %90 %Iinput signalR S = 50 ΩIR i = 50 ΩOSCILLOSCOPE1 k Ω450 ΩD.U.T.mga882V FRtoutput signalV9.Package outline10.Packing information[1]For further information and the availability of packing methods, see Section 14.[2]T1: normal taping [3]T2: reverse tapingFig 7.Package outline BAV99(SOT23/TO-236AB)Fig 8.Package outline BAV99S (SOT363/SC-88)Fig 9.Package outline BAV99W (SOT323/SC-70)04-11-04Dimensions in mm0.450.151.91.10.93.02.82.52.1 1.4 1.20.480.380.150.0912306-03-16Dimensions in mm0.250.100.30.2pin 1index1.30.652.22.0 1.351.152.21.8 1.10.80.450.1513246504-11-04Dimensions in mm0.450.151.10.82.21.82.22.0 1.351.151.30.40.30.250.10123Table 9.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package DescriptionPacking quantity 300010000BAV99SOT234mm pitch, 8mm tape and reel -215-235BAV99S SOT3234mm pitch, 8mm tape and reel -115-135BAV99WSOT3634mm pitch, 8mm tape and reel; T1[2]-115-1354mm pitch, 8mm tape and reel; T2[3]-125-16511.SolderingFig 10.Reflow soldering footprint BAV99(SOT23/TO-236AB)Fig 11.Wave soldering footprint BAV99(SOT23/TO-236AB)solder lands solder resistoccupied areasolder pastesot023_fr0.5(3×)0.6(3×)0.6(3×)0.7(3×)313.32.91.71.92Dimensions in mmsolder landssolder resist occupied areapreferred transport direction during solderingsot023_fw2.84.51.44.61.4(2×)1.2(2×)2.22.6Dimensions in mmFig 12.Reflow soldering footprint BAV99S (SOT363/SC-88)Fig 13.Wave soldering footprint BAV99S (SOT363/SC-88)solder landssolder resist occupied areasolder pastesot363_fr2.652.350.4 (2×)0.6(2×)0.5(4×)0.5(4×)0.6(4×)0.6(4×)1.51.8Dimensions in mmsot363_fwsolder landssolder resist occupied areapreferred transport direction during soldering5.31.31.31.50.31.54.52.45 2.5Dimensions in mmFig 14.Reflow soldering footprint BAV99W(SOT323/SC-70) Fig 15.Wave soldering footprint BAV99W(SOT323/SC-70)solder lands solder resistoccupied area solder pastesot323_fr2.652.350.6(3×)0.5(3×)0.55(3×)1.3251.851.3321Dimensions in mmsot323_fw3.65 2.11.425(3×)4.609(2×)2.5751.8solder landssolder resistoccupied areapreferred transportdirection during solderingDimensions in mm12.Revision historyTable 10.Revision historyDocument ID Release date Data sheet status Change notice SupersedesBAV99_SER_520080820Product data sheet-BAV99_4BAV99S_3BAV99W_4Modifications:•The format of this data sheet has been redesigned to comply with the new identityguidelines of NXP Semiconductors.•Legal texts have been adapted to the new company name where appropriate.•Section 1.1 “General description”: amended•Table 1 “Product overview”: added•Table 2 “Quick reference data”: added•Table 6 “Limiting values”: change of V RRM maximum value from 85V to 100V•Table 6 “Limiting values”: change of V R maximum value from 75V to 100V•Table 8 “Characteristics”: change of I R condition V R from 75V to 80V for T j=25°C•Table 8 “Characteristics”: change of I R maximum value from 1µA to 0.5µA for V R=80Vand T j=25°C condition•Table 8 “Characteristics”: change of I R condition V R from 75V to 80V for T j=150°C•Section 8 “Test information”: added•Figure7,8 and9: superseded by minimized package outline drawings•Section 10 “Packing information”: added•Section 11 “Soldering”: added•Section 13 “Legal information”: updatedBAV99_420011015Product specification-BAV99_3BAV99S_320010514Product specification-BAV99S_N_2BAV99W_419990511Product specification-BAV99W_313.Legal information13.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .13.2DefinitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.13.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /profile/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.Quick reference data —The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.13.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.14.Contact informationFor more information, please visit:For sales office addresses, please send an email to:salesaddresses@Document status [1][2]Product status [3]DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development.Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheetProductionThis document contains the product specification.15.Contents1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1General description. . . . . . . . . . . . . . . . . . . . . . 11.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Quick reference data. . . . . . . . . . . . . . . . . . . . . 12Pinning information. . . . . . . . . . . . . . . . . . . . . . 23Ordering information. . . . . . . . . . . . . . . . . . . . . 24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 36Thermal characteristics. . . . . . . . . . . . . . . . . . . 47Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 48Test information. . . . . . . . . . . . . . . . . . . . . . . . . 69Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 710Packing information. . . . . . . . . . . . . . . . . . . . . . 711Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1113Legal information. . . . . . . . . . . . . . . . . . . . . . . 1213.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1213.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1213.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1213.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1214Contact information. . . . . . . . . . . . . . . . . . . . . 1215Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2008.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@Date of release: 20 August 2008。
