UPC2744GS-E1中文资料

UPC4574G2-E1中⽂资料The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.DATA SHEETDocument No. G15977EJ4V0DS00 (4th edition)Date Published March 2004 N CP(K) Printed in JapanThe mark shows major revised points.1987DESCRIPTIONThe µPC4574 is an ultra low noise, high slew rate quad operational amplifier specifically designed for audio, instrumentation, and communication circuits. The low noise and high frequency capabilities make it ideal for preamps and active filters for instrumentation and professional audio.FEATURESUltra low noise High slew rate Wide bandwidthInternal frequency compensationORDERING INFORMATIONPart NumberPackageµPC4574C µPC4574C(5) 14-pin plastic DIP (7.62 mm (300)) 14-pin plastic DIP (7.62 mm (300)) µPC4574G2 µPC4574G2(5) 14-pin plastic SOP (5.72 mm (225)) 14-pin plastic SOP (5.72 mm (225))EQUIVALENT CIRCUIT (1/4 Circuit)I I I NVVPIN CONFIGURATION (Top View)OUT 4I I4I N4V ?I N3I I3OUT 3OUT 1I I1I N1V +I N2I I2OUT 2PC4574C, 4574C(5), 4574G2, 4574G2(5)µData Sheet G15977EJ4V0DS2ABSOLUTE MAXIMUM RATINGS (T A = 25°C)Parameter SymbolRatings Unit Voltage between V +and V ? Note1V +V0.3 to +36VDifferential Input Voltage V ID ±30 V Input VoltageNote2V IV ??0.3 to V ++0.3 V Output VoltageNote3V OV ??0.3 to V + +0.3VC Package Note4570 mW Power Dissipation G2 PackageNote5P T 550 mW Output Short Circuit DurationNote610 sec Operating Ambient Temperature T A ?20 to +80 °C Storage TemperatureT stg55 to +125°CNotes 1. Reverse connection of supply voltage can cause destruction.2. The input voltage should be allowed to input without damage or destruction. Even during the transition periodof supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics.3. This specification is the voltage which should be allowed to supply to the output terminal from externalwithout damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics.4. Thermal derating factor is –7.6 mW/°C when ambient temperature is higher than 50°C.5. Thermal derating factor is –5.5 mW/°C when ambient temperature is higher than 25°C.6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 andNote 5.RECOMMENDED OPERATING CONDITIONSParameter Symbol MIN. TYP. MAX. UnitSupply Voltage V ± ±4 ±16 V Output Current I O±10 mASource Resistance R S 50k ?Capacitive Load (A V = +1)C L 100 pFµPC4574C, µPC4574G2±Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.8.This current flows irrespective of the existence of use.Data Sheet G15977EJ4V0DS 3µPC4574C(5), µPC4574G2(5)±Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.8.This current flows irrespective of the existence of use.4Data Sheet G15977EJ4V0DSMEASUREMENT CIRCUITFig.1 Total Harmonic Distortion Measurement CircuitnFig.3 Flat Noise Measurement Circuit (FLAT+JIS A)V O = 40 dB x V n100 V n =V O40 dBData Sheet G15977EJ4V0DS 5Data Sheet G15977EJ4V0DS6TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25°C, TYP.) T A - Operating Ambient Temperature - ?CPOWER DISSIPATIONP T - T o t a l P o w e r D i s s i p a t i o n - m W800600400200020*********20406080100120110010 k 1 M 1 k 10100 k 10 Mf - Frequency - HzOPEN LOOP FREQUENCY RESPONSEA V - O p e n L o o p V o l t a g e G a i n - d BV ± = ±15 V202040608021.510.50?0.5?1?1.5?2T A - Operating Ambient Temperature - ?CINPUT OFFSET VOLTAGEV I O - I n p u t O f f s e t V o l t a g e - m V= ±15 VV ±each 5 samples data806040200?20550530510490470450T A - Operating Ambient Temperature - ?CINPUT BIAS CURRENTI B - I n p u t B i a s C u r r e n t - n A= ±15 VV ±f - Frequency - HzLARGE SIGNAL FREQUENCY RESPONSE V o m - O u t p u t V o l t a g e S w i n g - V p -p 01020301001 k 10 k 100 k 1 M 10 MV = ±15 V±R L = 10 k ?I O - Output Current - mAOUTPUT CURRENT LIMITV O - O u t p u t V o l t a g e - V±±5±10±15T A - Operating Ambient Temperature - ?CSUPPLY CURRENTI C C - S u p p l y C u r r e n t - m A12963204020060800V = ±15 V±SUPPLY CURRENTI C C - S u p p l y C u r r e n t - m A12963±10±20V - Supply Voltage - V±Data Sheet G15977EJ4V0DS7COMMON MODE INPUT VOLTAGE RANGE V I C M - C o m m o n M o d e I n p u t V o l t a g e R a n g e - V 20100±10±20V - Supply Voltage - V±VOLTAGE FOLLOWER PULSE RESPONSE V O - O u t p u t V o l t a g e - V10551002468t - Time - sµV = ±15 V ±A V = 1R L = 2 k ?INPUT NOISE VOLTAGE (FLAT + JIS A)V n - I n p u t N o i s e V o l t a g e - V r .m .s .1001010.1101001 k10 k100 kR S - Source Resistance - ?V = ±15 V±µf - Frequency - HzINPUT EQUIVALENT NOISE VOLTAGE DENSITY e n - I n p u t E q u i v a l e n t N o i s e V o l t a g e D e n s i t y - n V / H z20468100 1 k10 k 100 k10±R S = 100 VTOTAL HARMONIC DISTORTIONT H D - T o t a l H a r m o n i c D i s t o r t i o n - %10.0010.010.10.000110100 1 k10 k 100 kf - Frequency - HzV = ±15 V ±V O = 3 V r.m.s.A V = 1R L = 2 k ?Data Sheet G15977EJ4V0DS8PACKAGE DRAWINGS (Unit: mm)14-PIN PLASTIC DIP (7.62 mm (300))ITEM MILLIMETERS A 19.22±0.22.14 MAX.F I J D 1.32±0.12G 3.6±0.3C B 2.54 (T.P.)0.50±0.10R 0~15°H 0.51 MIN.K 7.62 (T.P.)L 6.4±0.23.554.3±0.2N 0.25NOTES1. Each lead centerline is located within 0.25 mm ofits true position (T.P.) at maximum material condition.2. ltem "K" to center of leads when formed parallel.P14C-100-300B1-3M 0.25+0.10?0.05Data Sheet G15977EJ4V0DS9ITEM B C I 14-PIN PLASTIC SOP (5.72 mm (225))D E G H J PMILLIMETERS 1.27 (T.P.)1.42 MAX.A 10.2±0.264.4±0.10.1±0.10.426.5±0.21.49+0.08?0.071.1±0.163°+7°?3°NOTEEach lead centerline is located within 0.1 mm ofits true position (T.P.) at maximum material condition.F 1.59+0.21?0.2K L M N 0.6±0.20.170.10.10+0.08?0.07S14GM-50-225B, C-6RECOMMENDED SOLDERING CONDITIONSThe µPC4574 should be soldered and mounted under the following recommended conditions.For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative.For technical information, see the following website.Semiconductor Device Mount Manual (/doc/015a7dda76a20029bd642de6.html/pkg/en/mount/index.html)Type of Surface Mount DeviceµPC4574G2, 4574G2(5): 14-pin plastic SOP (5.72 mm (225))Process ConditionsSymbol Infrared Ray Reflow Peak temperature: 230°C or below (Package surface temperature),Reflow time: 30 seconds or less (at 210°C or higher),Maximum number of reflow processes: 1 time.IR30-00-1Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),Reflow time: 40 seconds or less (at 200°C or higher),Maximum number of reflow processes: 1 time.VP15-00-1Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,Maximum number of flow processes: 1 time,Pre-heating temperature: 120°C or below (Package surface temperature).WS60-00-1Partial Heating Method Pin temperature: 300°C or below,Heat time: 3 seconds or less (Per each side of the device).–Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or thedevice will be damaged by heat stress.Type of Through-hole DeviceµPC4574C, 4574C(5): 14-pin plastic DIP (7.62 mm (300))Process ConditionsWave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less.Partial Heating Method Pin temperature: 300°C or below,Heat time: 3 seconds or less (per each lead).Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.Data Sheet G15977EJ4V0DS10The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of N EC Electronics products. N ot all products and/or types are available in every country. Please check with an N EC Electronics sales representative for availability and additional information.No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific".The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application."Standard":Computers, office equipment, communications equipment, test and measurement equipment, audioand visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. 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SN74AHCT1G125SINGLE BUS BUFFER GATE WITH 3ĆSTATE OUTPUTSCLS378L − AUGUST 1997 − REVISED JUNE 2005D Operating Range of 4.5 V to 5.5 V D Max t pd of 6 ns at 5 V D Low Power Consumption, 10-µA Max I CCD ±8-mA Output Drive at 5 VD Inputs Are TTL-Voltage Compatible D Latch-Up Performance Exceeds 250 mA Per JESD 1732451OE V CC Y A GND DBV PACKAGE(TOP VIEW)DCK PACKAGE(TOP VIEW)32451OEV CC YAGND 32451OE V CC Y A GND DRL PACKAGE (TOP VIEW)See mechanical drawings for dimensions.description/ordering informationThe SN74AHCT1G125 is a single bus buffer gate/line driver with 3-state output. The output is disabled whenthe output-enable (OE) input is high. When OE is low, true data is passed from the A input to the Y output.To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.ORDERING INFORMATIONT A PACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING ‡Reel of 3000SN74AHCT1G125DBVR SOT (SOT-23) − DBVReel of 250SN74AHCT1G125DBVT B25_°°Reel of 3000SN74AHCT1G125DCKR −40C to 85C SOT (SC-70) − DCKReel of 250SN74AHCT1G125DCKT BM_SOT (SOT-553) − DRL Reel of 4000SN74AHCT1G125DRLR BM_†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines areavailable at /sc/package.‡The actual top-side marking has one additional character that designates the assembly/test site.FUNCTION TABLEINPUTSOUTPUT OEA Y LH H LL L H X Zlogic diagram (positive logic)A YOE124Copyright 2005, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.SN74AHCT1G125SINGLE BUS BUFFER GATEWITH 3ĆSTATE OUTPUTSCLS378L − AUGUST 1997 − REVISED JUNE 2005absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†Supply voltage range, V CC−0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Input voltage range, V I (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output voltage range, V O (see Note 1) −0.5 V to V CC+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Input clamp current, I IK(V I< 0) −20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output clamp current, I OK(V O< 0 or V O > V CC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, I O(V O= 0 to V CC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous current through V CC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Package thermal impedance, θJA (see Note 2):DBV package 206°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DCK package 252°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DRL package 142°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.The input and output voltage ratings may be exceeded if the input and output current ratings are observed.2.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditions (see Note 3)MIN MAX UNITV CC Supply voltage 4.5 5.5VV IH High-level input voltage2VV IL Low-level input voltage0.8VV I Input voltage0 5.5VV O Output voltage0V CC VI OH High-level output current−8mAI OL Low-level output current8mA∆t/∆v Input transition rise or fall rate20ns/V T A Operating free-air temperature−4085°C NOTE 3:All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)CC T A = 25°CPARAMETER TEST CONDITIONS VMIN TYP MAXMIN MAX UNITV I OH = −50 m A 4.4 4.5 4.4OH IOH = −8 mA 4.5 V3.94 3.8VV I OL = 50 m A0.10.1OL IOL = 8 mA 4.5 V0.360.44VI I V I = 5.5 V or GND0 V to 5.5 V±0.1±1m AI OZ V O = V CC or GND 5.5 V±0.25±2.5m AI CC V I = V CC or GND,I O = 0 5.5 V110m A∆I CC‡One input at 3.4 V,Other input at V CC or GND 5.5 V 1.35 1.5mAC i V I = V CC or GND 5 V41010pFC o V O = V CC or GND 5 V10pF ‡This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or V CC.SN74AHCT1G125SINGLE BUS BUFFER GATE WITH 3ĆSTATE OUTPUTSCLS378L − AUGUST 1997 − REVISED JUNE 2005switching characteristics over recommended operating free-air temperature range,V CC = 5 V ±0.5 V (unless otherwise noted) (see Figure 1)FROM TO LOAD T A = 25°C PARAMETER(INPUT)(OUTPUT)CAPACITANCE MIN TYP MAX MIN MAX UNIT t PLH3.8 5.51 6.5t PHLA Y C L = 15 pF 3.8 5.51 6.5ns t PZH3.6 5.116t PZLOE Y C L = 15 pF 3.6 5.116ns t PHZL 4.6 6.818t PLZOE Y C = 15 pF 4.6 6.818ns t PLH5.37.518.5t PHLA Y C L = 50 pF 5.37.518.5ns t PZH5.17.118t PZLOE Y C L = 50 pF 5.17.118ns t PHZL 6.18.8110t PLZ OE Y C = 50 pF 6.18.8110nsoperating characteristics, V CC = 5 V, T A = 25°CPARAMETERTEST CONDITIONS TYP UNIT C pd Power dissipation capacitance No load, f = 1 MHz 14pFSN74AHCT1G125SINGLE BUS BUFFER GATE WITH 3ĆSTATE OUTPUTSCLS378L − AUGUST 1997 − REVISED JUNE 2005PARAMETER MEASUREMENT INFORMATION50% V CC 3 V3 V 0 V0 Vt h t suVOLTAGE WAVEFORMSSETUP AND HOLD TIMESData Inputt PLH t PHL t PHL t PLH V OH V OH V OL V OL 3 V 0 V 50% V CC50% V CC Input Out-of-Phase Output In-Phase Output Timing Input 50% V CC VOLTAGE WAVEFORMSPROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTS OutputControlOutput Waveform 1S1 at V CC (see Note B)OutputWaveform 2S1 at GND(see Note B)V OL V OH t PZLt PZHt PLZ t PHZ ≈V CC 0 V 50% V CCV OL + 0.3 V 50% V CC ≈0 V 3 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGt PLH /t PHL t PLZ /t PZLt PHZ /t PZHOpen Drain Open V CC GND V CCTEST S13 V 0 V t w VOLTAGE WAVEFORMS PULSE DURATION Input NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics:PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤3 ns, t f ≤ 3 ns.D.The outputs are measured one at a time, with one input transition per measurement.E.All parameters and waveforms are not applicable to all devices.From Output Under Test C L (see Note A)LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTSS1V CC R L = 1 k ΩGND From OutputUnder TestC L (see Note A)Test Point LOAD CIRCUIT FORTOTEM-POLE OUTPUTS OpenV OH − 0.3 V 1.5 V 1.5 V 1.5 V1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V Figure 1. Load Circuit and Voltage WaveformsPACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.Addendum-Page 1(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN74AHCT1G125 :•Automotive: SN74AHCT1G125-Q1NOTE: Qualified Version Definitions:•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defectsAddendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHCT1G125DBVR SOT-23DBV 53000180.09.2 3.17 3.23 1.37 4.08.0Q3SN74AHCT1G125DBVR SOT-23DBV 53000178.09.2 3.3 3.2 1.55 4.08.0Q3SN74AHCT1G125DBVR SOT-23DBV 53000180.08.4 3.23 3.17 1.37 4.08.0Q3SN74AHCT1G125DBVT SOT-23DBV 5250178.09.0 3.23 3.17 1.37 4.08.0Q3SN74AHCT1G125DBVT SOT-23DBV 5250178.09.2 3.3 3.2 1.55 4.08.0Q3SN74AHCT1G125DCKR SC70DCK 53000180.09.2 2.3 2.55 1.2 4.08.0Q3SN74AHCT1G125DCKR SC70DCK 53000178.09.2 2.4 2.4 1.22 4.08.0Q3SN74AHCT1G125DCKT SC70DCK 5250178.09.0 2.4 2.5 1.2 4.08.0Q3SN74AHCT1G125DCKT SC70DCK 5250180.09.2 2.3 2.55 1.2 4.08.0Q3SN74AHCT1G125DCKT SC70DCK 5250178.09.2 2.4 2.4 1.22 4.08.0Q3SN74AHCT1G125DRLR SOTDRL 54000180.08.4 1.98 1.780.69 4.08.0Q3SN74AHCT1G125DRLR SOT DRL 54000180.09.5 1.78 1.780.69 4.08.0Q3*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74AHCT1G125DBVR SOT-23DBV53000205.0200.033.0SN74AHCT1G125DBVR SOT-23DBV53000180.0180.018.0SN74AHCT1G125DBVR SOT-23DBV53000202.0201.028.0SN74AHCT1G125DBVT SOT-23DBV5250180.0180.018.0SN74AHCT1G125DBVT SOT-23DBV5250180.0180.018.0SN74AHCT1G125DCKR SC70DCK53000205.0200.033.0SN74AHCT1G125DCKR SC70DCK53000180.0180.018.0SN74AHCT1G125DCKT SC70DCK5250180.0180.018.0SN74AHCT1G125DCKT SC70DCK5250205.0200.033.0SN74AHCT1G125DCKT SC70DCK5250180.0180.018.0SN74AHCT1G125DRLR SOT DRL54000202.0201.028.0SN74AHCT1G125DRLR SOT DRL54000184.0184.019.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. 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目录1产品概述 (1)背景信息 (1)J2534 (1)车辆接口 (2)2产品介绍 (3)前面板 (3)顶面板 (4)底面板 (5)通电 (5)技术参数 (6)配件 (7)故障排查 (8)3驱动安装与网络配置 (9)驱动安装 (9)固件升级 (11)4使用J2534设备编程 (13)5合规信息 (15)6保修服务 (17)一年有效保修 (17)服务流程 (17)1产品概述背景信息目前市场上新一代车辆都配备大量车载电脑以完成不同特定任务，以致无需笔记本电脑即可进行汽车诊断和维修的时代即将过去。

常见的车载电脑包括发动机控制模块、变速箱控制模块、燃油喷射控制模块、防抱死制动系统、车身控制模块，以及其他众多控制模块。

用于管理从电动门锁到事故数据的每个电子控制系统。

每一个车载电脑都在工厂通过软件编程使其执行特定任务。

例如，发动机控制模块的软件中包含几百乃至几千个参数，用于控制火花，燃料，空转，巡航，排放量，油耗和驾驶性能。

同样，变速箱控制模块中也有用于控制变速器和变矩器工作的软件。

有时，在车辆运出之后，制造商仍会发布软件更新以改进排放量、油耗和驾驶性能，或用于修复原软件中引起特定保修问题的故障。

更新软件是一种积极主动的修复方式，因为可以在用户反馈或注意到问题之前将其解决。

这些模块中的软件更新通常被称为Flash编程。

对于新车代理商来说，Flash编程相对简单，因为他们的维修技术员与制造商有联系，配备昂贵的专业维修工具来进行编程。

对于独立的修理厂来说这是一个更大的挑战，因为大多数修理厂都会维修不止一种型号的车辆。

他们要操作几十个不同制造商的维修工具，这大大增加了其工作的复杂程度，成本和所需的操作培训。

J25342000年，美国环保局在监管汽车排放问题之后决定采取措施，要求美国汽车工程师学会制定一项相关排放标准，J2534由此应运而生。

J2534是一项强制性的规定，要求在美国销售车辆的汽车制造商都必须遵循。

为适用于所有车型，最初的J2534后又更新为J2534-1。

T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsXUSL4E14F031NXUSL type 4 - Finger protection - Std sensingrange - Hp = 310 mm, R=14mmProduct availability: Non-Stock - Not normally stocked in distribution facilityMainRange of product Preventa Safety detection Product or component typeSafety light curtain type 4Device short name XUSL4EOutput type2 safety outputs OSSD solid-state PNP arc suppres-sion)Product specific applica-tionFor finger protection [R] Resolution 0.55 in (14 mm)[Sn] nominal sensing distance3.28…19.69 Ft (1…6 m) by cabling 0.00…9.84 ft (0…3 m) by cabling [Hp] Height protected 12.20 in (310 mm)Number of beams 30Type of start / restart Manual Automatic External Device Moni-toring (EDM)Selected by wiringComplementaryDetection system Transmitter-receiver system Response time 5.5 msKit compositionAdjustable mounting bracket(s)1 receiver(s)1 transmitter(s)1 user guide with certificate of conformity on CD-ROM [EAA] effective aperture angle 2.5 ° at 3 mEmissionIR LED 0.000037402 in (950 nm)[Us] rated supply voltage 24 V DC +/- 20 %SupplyPower supply IEC 61496-1Power supply IEC 60204-1[Ie] rated operational current 2 ACurrent consumption42 mA no-load transmitter 83 mA no-load receiver 42 mA transmitter900 mA with maximum load receiver Output current limits 0.4 A safety outputs OSSD Output voltage 24 V Output circuit type DC Maximum voltage drop <0.5 VLocal signalling 1 multi-colour LED transmitter 2 dual colour LEDs receiverElectrical connection 1 male connector M12 5 pins transmitter 1 male connector M12 8 pins receiverFunction availableTestMuting through external safety module XPSLCMUT1160LED display of operating modes and faults Marking CEMaterialAluminium casingPolycarbonate front panel Polypropylene end caps Housing colourRed RAL 3000Fixing mode By fixing bracketsNet weight 1.54 lb(US) (0.7 kg)Offer type Standard distanceEnvironmentDirectives89/336/EEC - electromagnetic compatibility2002/95/EC - RoHS directive98/37/EEC - machinery89/655/EEC - work equipment2002/96/EC - WEEE directiveProduct certifications CULusCETÜVSafety level (correctly wired)Type 4 IEC 61496-1SIL 3 IEC 61508SILCL 3 IEC 62061Category 4 EN/ISO 13849-1PL = e EN/ISO 13849-1Optical characteristic Resistance to light disturbance EN/IEC 61496-2Mission time20 year(s)Safety reliability data PFHd = 1.27E-8 1/h IEC 61508Ambient air temperature for operation-10…55 °C (14…131 °F)-4…131 °F (-20…55 °C)Ambient air temperature for storage-31…158 °F (-35…70 °C)-25…70 °C (-13…158 °F)Relative humidity0…95 % without condensationIP degree of protection IP65IP67Shock resistance10 gn 16 ms IEC 61496-1Vibration resistance0.35 +/- 0.05 mm 10…55 Hz)IEC 61496-1Ordering and shipping detailsCategory22455 - LIGHT CURTAINS - XUSLDiscount Schedule DS2GTIN00785901735632Package weight(Lbs) 1.58 kg (3.49 lb(US))Returnability YesCountry of origin ITOffer SustainabilitySustainable offer status Green Premium productREACh Regulation REACh DeclarationEU RoHS Directive Pro-active compliance (Product out of EU RoHS legal scope)EU RoHS Decla-rationToxic heavy metal free YesMercury free YesRoHS exemption information YesEnvironmental Disclosure Product Environmental ProfileCircularity Profile End Of Life InformationContractual warrantyWarranty18 monthsDimensions Drawings DimensionsBrackets DimensionsMounting and Clearance Mounting and Clearance(1)Insert(2)Bracket(3)Washer(4)Spring washer(5)NutConnections and SchemaWiring DiagramsTransmitter Connections(1)+24 Vdc(2)Configuration_0(3)0 Vdc(4)Configuration_1(5)FEReceiver Connections(1)OSSD1(2)+ 24 V(3)OSSD2(4)Configuration_A(5)K1_K2 Feeback/Restart(6)Configuration_B(7)0 Vdc(8)FEReceiver Configurations and Operating ModesAutomatic Start/RestartWithout External Device Monitoring (EDM) feedback loopWith External Device Monitoring (EDM) feedback loopManual Start/RestartWithout External Device Monitoring (EDM) feedback loop(1)RestartWith External Device Monitoring (EDM) feedback loop(1)RestartConnecting to a Safety Interface1 :Click on Download & Documents2 :Click on Application solutionsTo have all connection schematics concerning our safety module, select "download and document" and download the file "Safety lightcurtains association with safety interfaces"。

Toothed belt axis units ELGEThis product is also available as a modular mechanical systemToothed belt axis ELGR-TB2d Internet: /catalogue/...Subject to change – 2023/01Toothed belt axis units ELGEKey featuresAt a glancePlug and work with the Simplified Motion SeriesThe simplicity of pneumatics is now combined for the first time with the advantages of electric automation thanks to the Simplified Motion Series.These integrated drives are the perfect solution for all users who are looking for an electric alternative for very simple movement and positioning tasks between two mechanical end positions, but don't want the commissioning process for traditional electric drive systems that can often be quite complex. There is no need for any software since operation is simply based on the "plug and work" principle. Digital I/O (DIO) and IO-Link are always automatically included – a product with two types of control as standard.IntegratedEasyStandardisedConnectedThe integrated electronics in the drive are at the heart of the Simplified Motion Series.For commissioning, simply set all rele-vant parameters directly on the drive:• Speed and force• Reference end position and cushioning• Manual operationElectrical connection via M12 plug design• Power (4-pin): power supply for the motor• Logic (8-pin): control signal, sensor signal and power for the integrated electronicsUse of extended functions possible via IO-Link:• Remote configuration of motion parameters• Copy and backup function for transferring parameters• Read function for extended p rocess parameters• Freely definable intermediate positionThe functions of the Simplified Motion Series Basic profile for movement between two end positions: Extended motion profile for simplified press-fitting and clamping functions: v v• • Proximity switches are required in order to implement any intermediate positions.• With the intermediate position that can be freely configured via IO-Link, movements can be stopped at a freely defined point between the end positions, without the need for proximity switches or external stops32023/01 – Subject to changed Internet: /catalogue/...Toothed belt axis units ELGEKey featuresAt a glance• Without external servo drive: all the necessary electronic components are combined in the integrated drive • Two control options integrated as standard: digital I/O and IO-Link• Complete solution for simple movements between mechanical end positions• Simplified commissioning: all parameters can be manually set directly on the drive • No special expertise required for commissioning• End-position feedback similar to that of a conventional proximity switch is integrated as standard • Choice of motor mounting position on four sides•Cost-optimised design for tasks that require simpler yet highly cost-efficient solutions with a service life of 5000 kmThe products in the Simplified Motion Series Electric cylinder unit EPCE Electric cylinder unit EPCSElectric cylinder unit with parallelmotor mounting EPCSMini slide unit EGSS-BS-KFMini slide unit with parallel motor mounting EGSS-BS-KFSpindle axis unit ELGS-BS-KFSpindle axis unit with parallel motor mounting ELGS-BS-KFToothed belt axis unit ELGS-TB-KF Toothed belt axis unit ELGE Rotary drive unit ERMSModular and flexible with motor, motor mounting kit and servo driveThis product is also available within the Optimised Motion Series as toothed belt axis ELGR-TB:Toothed belt axes for tasks that require simpler yet highly cost-efficient solutions in cost-optimised design with a long service life. Ideal for pick & place tasks and for transporting small loads of less than 15 kg.• 1 driven slide, freely movable slides can be added as an option • Extended guide, additional mounting options • Free choice of flexible motor mounting on 4 sides• Guide variants: recirculating ball bearing guide for moderate loads or plain-bearing guide for low loads • Modular: individual combinations with motor, motor mounting kit and servo driveToothed belt axis units ELGEPeripherals overview1)Proximity switches are optional and only required in order to sense any intermediate positions.4d Internet: /catalogue/...Subject to change – 2023/01Toothed belt axis units ELGE Peripherals overviewMotor attachment variants[AT] Top[AD] Underneath[AL] Left[AR] RightControl elements[1] Pushbutton actuators for parameterisation and controlPossible combinations with Festo drivesElectric cylinder EPCO on toothed belt axis unit ELGEaa5 2023/01 – Subject to change d Internet: /catalogue/...Toothed belt axis units ELGE Type codes6d Internet: /catalogue/...Subject to change – 2023/0172023/01 – Subject to changed Internet: /catalogue/...Toothed belt axis units ELGEDatasheet-N- Size35-T-Stroke length 50 ... 800 mm1)2)It is not possible to reach the maximum speed of 1.2 m/s with strokes < 250 mm.Adjustable in increments of 10%Unchangeable parameterToothed belt axis units ELGEDatasheet1) At max. feed force8d Internet: /catalogue/...Subject to change – 2023/0192023/01 – Subject to changed Internet: /catalogue/...Toothed belt axis units ELGEDatasheet10d Internet: /catalogue/...Subject to change – 2023/01Toothed belt axis units ELGEDatasheetMaterialsSectional view12345Toothed belt axis units ELGE DatasheetPin allocationPower supply Logic interfacePlug PlugToothed belt axis units ELGEDatasheetLoad valuesThe indicated forces and t orques refer to the centre of the guide. The point of application of force is the point where the centre of the guide and the longi-tudinal centre of the slide intersect.These values must not be exceeded during dynamic operation. Special at -tention must be paid to the decelera-tion phase.H- -NoteIf the axis is subjected to two or more of the indicated forces and torques simulta-neously, the following equation must be satisfied in addition to the indicated maximum loads:Calculating the load comparison factor:F 1/M 1 = dynamic value F 2/M 2 = maximum valueFor a guide system to have a service life of 5000 km, the load comparison factor must have a value of fv š 1, based on the maximum permissible forces and torques for a service life of 5000 km.This formula can be used to calculate a guide value.The engineering software "Electric Motion Sizing" is available for more precise calculations a ffff vvvv =�FFFF yyyy 1�FFFF yyyy 2+|FFFF zzzz 1|FFFF zzzz 2+|MMMM xxxx 1|MMMM xxxx 2+�MMMM yyyy 1�MMMM yyyy 2+|MMMM zzzz 1|MMMM zzzz 2≤1Toothed belt axis units ELGEDatasheetCalculating the service lifeThe service life of the guide depends on the load. To be able to make a statement as to the service life of the guide, the graph below plots the load comparison factor fv against the service life.These values are only theoretical. You must consult your local Festo contact for a load comparison factor fv greater than 1.Load comparison factor fv as a function of service life lExample:A user wants to move an x kg load. Using the formula (a page 4) gives avalue of 1.5 for the load comparison factor fv. According to the graph, the guide would have a service life of approx. 1500 km. Reducing the acceleration reduces the My and Mz values. A load comparison factor fv of 1 now gives a service life of 5000 km.Service life of the motorThe service life of the motor at nominal power is 20000 h.Toothed belt axis units ELGEDatasheetSizing exampleApplication data:• Payload: 2 kg• Mounting position: horizontal• Motor mounting position: axial• Stroke: 600 mm• Max. permitted positioning time: 1 s (one direction)Step 1: Selecting the size from the table a page 7Horizontal l = 50 mml = 100 mml = 200 mml = 300 mml = 400 mml = 500 mml = 600 mml = 700 mml = 800 mma Max. speed level for payload: level 9a Min. positioning time for 600 mm at level 9: 0.75 sResultThe application can be implemented using ELGE-TB-35-600. A minimum positioning time (one direction) of 0.75 s is achieved. Longer positioning times can be selected at any time using a lower speed level.Toothed belt axis units ELGEDatasheetMass m as a function of speed level vSize 35HorizontalNote:The lines represent the maximum values. The lower speed levels can be set at any time.Positioning time t as a function of speed level v and stroke l Size 35l = 50 mm l = 100 mm l = 200 mm l = 300 mm l = 400 mm l = 500 mm l = 600 mm l = 700 mm l = 800 mmFeed force F as a function of force level F1ELGE-TB-352nd moments of areaRecommended deflection limitsAdherence to a maximum deflection of 0.5 mm is recommended so as not to impair the functionality of the axes. Greater deformation can result in increased friction, greater wear and reduced service life.Toothed belt axis units ELGE DatasheetToothed belt axis units ELGE DatasheetToothed belt axis units ELGE Ordering dataToothed belt axis units ELGE Ordering dataToothed belt axis units ELGEAccessoriesProfile mounting MUE (order code MA)Material:Anodised aluminium RoHS-compliantSensor bracket EAPM-…-SHS, switch lug EAPM-…-SLS (order code SA/SB)Material:Switch lug: Galvanised steelSensor bracket: Anodised wrought aluminium alloy RoHS-compliantEAPM-L4-SHSEAPM-L4-SLS212023/01 – Subject to changed Internet: /catalogue/...Toothed belt axis units ELGEAccessories1) Packaging unit2) 2 centring sleeves included in the scope of delivery of the axisH- -NoteProximity switches are optional and only required in order to sense any intermediate positions.Toothed belt axis units ELGEAccessories22d Internet: /catalogue/...Subject to change – 2023/01。

商品编码部件产品名称Q1对应编码Q1对应配件名称CPUSPT0CPU0002H Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4809v2(6C,105W,1.9GHz)Processor Option Kit BCX305XeonE7-4809v2(1.9GHz/6c)/6.4GT/12ML3 SPT0CPU0002I Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4820v2(8C,105W,2.0GHz)Processor Option Kit BCX306XeonE7-4820v2(2.00GHz/8c)/7.2GT/16ML3 SPT0CPU0002J Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4830v2(10C,105W,2.2GHz)Processor Option Kit BCX307XeonE7-4830v2(2.2GHz/10c)/7.2GT/20ML3 SPT0CPU0002K Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4850v2(12C,105W,2.4GHz)Processor Option Kit BCX308XeonE7-4850v2(2.3GHz/12c)/7.2GT/24ML3 SPT0CPU0002L Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4860v2(12C,130W,2.6GHz)Processor Option Kit BCX309XeonE7-4860v2(2.6GHz/12c)/8.0GT/30ML3 SPT0CPU0002M Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4870v2(15C,130W,2.3GHz)Processor Option Kit BCX310XeonE7-4870v2(2.3GHz/15c)/8.0GT/30ML3 SPT0CPU0002N Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4880v2(15C,130W,2.5GHz)Processor Option Kit BCX311XeonE7-4880v2(2.5GHz/15c)/8.0GT/37.5ML3 SPT0CPU0002O Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4890v2(15C,155W,2.8GHz)Processor Option Kit BCX312XeonE7-4890v2(2.8GHz/15c)/8.0GT/37.5ML3 SPT0CPU0002P Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8857v2(12C,130W,3.0GHz)Processor Option Kit XeonE7-8857v2-Xeon3_8.0G_30M_12CSPT0CPU0002Q Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8850v2(12C,105W,3.0GHz)Processor Option Kit BCX437XeonE7-8850v2-Xeon2.3_7.2G_24M_12C SPT0CPU0002R Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8870v2(15C,130w,2.3GHz)Processor Option Kit XeonE7-8870v2-Xeon2.3_8.0G_30M_15CSPT0CPU0002S Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8891v2(10C,155W,3.2GHz)Processor Option Kit XeonE7-8891v2-Xeon3.2_8G_37.5M_10CSPT0CPU0002T Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8893v2(6C,155W,3.4GHz)Processor Option Kit XeonE7-8893v2-Xeon3.4_8G_37.5M_6CSPT0CPU0002U Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4809v3(8C,115W,2.0GHz)Processor Option Kit BCX377XeonE7-4809v3(2.0GHz/8c)/6.4GT/20ML3 SPT0CPU0002V Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4820v3(10C,115W,1.9GHz)Processor Option Kit BCX376XeonE7-4820v3(1.9GHz/10c)/6.4GT/25ML3 SPT0CPU0002W Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4830v3(12C,115W,2.1GHz)Processor Option Kit BCX375XeonE7-4830v3(2.1GHz/12c)/8.0GT/30ML3 SPT0CPU0002X Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4850v3(14C,115W,2.2GHz)Processor Option Kit BCX374XeonE7-4850v3(2.2GHz/14c)/8.0GT/35ML3 SPT0CPU0002Y Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8860v3(16C,140W,2.2GHz)Processor Option Kit BCX373XeonE7-8860v3(2.2GHz/16c)/9.6GT/40ML3 SPT0CPU00030Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8870v3(18C,140W,2.1GHz)Processor Option Kit BCX372XeonE7-8870v3(2.1GHz/18c)/9.6GT/45ML3 SPT0CPU00032Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8880v3(18C,150W,2.3GHz)Processor Option Kit BCX371XeonE7-8880v3(2.3GHz/18c)/9.6GT/45ML3 SPT0CPU00033Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8890v3(18C,165W,2.5GHz)Processor Option Kit BCX370XeonE7-8890v3(2.5GHz/18c)/9.6GT/45ML3 SPT0CPU0002Z Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8867v3(16C,165W,2.5GHz)Processor Option Kit BCX369XeonE7-8867v3(2.5GHz/16c)/9.6GT45ML3 SPT0CPU00034Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8891v3(10C,165W,2.8GHz)Processor Option Kit BCX368XeonE7-8891v3(2.8GHZ/10c)/9.6GT/45ML3 SPT0CPU00035Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8893v3(4C,140W,3.2GHz)Processor Option Kit BCX367XeonE7-8893v3(3.2GHz/4c)/9.6GT/45ML3 SPT0CPU00003Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2609v3(6C,85W,1.9GHz)Processor Option Kit BCX323E5-2609v3(1.9GHz/6c)/6.4GT/15ML3SPT0CPU00004Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2620v3(6C,85W,2.4GHz)Processor Option Kit BCX324E5-2620v3(2.4GHz/6c)/8GT/15ML3SPT0CPU00005Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2630v3(8C,85W,2.4GHz)Processor Option Kit BCX325E5-2630v3(2.4GHz/8c)/8GT/20ML3SPT0CPU00006Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2637v3(4C,135W,3.5GHz)Processor Option Kit E5-2637v3(3.5GHz/4c)/9.6GT/15ML3SPT0CPU00007Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2640v3(8C,90W,2.6GHz)Processor Option Kit BCX326E5-2640v3(2.6GHz/8c)/8GT/20ML3SPT0CPU00008Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2643v3(6C,135W,3.4GHz)Processor Option Kit BCX339E5-2643v3(3.4GHz/6c)/9.6GT/20ML3SPT0CPU00009Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2650v3(10C,105W,2.3GHz)Processor Option Kit BCX327E5-2650v3(2.3GHz/10c)9.6GT/25ML3SPT0CPU00010Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2660v3(10C,105W,2.6GHz)Processor Option Kit BCX328E5-2660v3(2.6GHz/10c)9.6GT/25ML3 SPT0CPU00011Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2667v3(8C,135W,3.2GHz)Processor Option Kit E5-2667v3(3.2GHz/8c)9.6GT/20ML3SPT0CPU00012Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2670v3(12C,120W,2.3GHz)Processor Option Kit BCX329E5-2670v3(2.3GHz/12c)9.6GT/30ML3 SPT0CPU00013Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2680v3(12C,120W,2.5GHz)Processor Option Kit BCX330E5-2680v3(2.5GHz/12c)9.6GT/30ML3 SPT0CPU00015Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2690v3(12C,135W,2.6GHz)Processor Option Kit BCX331E5-2690v3(2.6GHz/12c)9.6GT/30ML3 SPT0CPU00016Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2695v3(14C,120W,2.3GHz)Processor Option Kit BCX333E5-2695v3(2.3GHz/14c)9.6GT/35ML3 SPT0CPU00017Inspur NF5280M4Inbbb Xeon E5-2697v3(14C,145W,2.6GHz)Processor Option Kit BCX334E5-2697v3(2.6GHz/14c)9.6GT/35ML3SPT0CPU00018Inspur NF5280M4Inbbb Xeon E5-2698v3(16C,135W,2.3GHz)Processor Option Kit BCX335E5-2698v3(2.3GHz/16c)9.6GT/40MLSPT0CPU00019Inspur NF5280M4Inbbb Xeon E5-2699v3(18C,145W,2.3GHz)Processor Option Kit E5-2699v3(2.3GHz/18c)9.6GT/45ML3SPT0CPU00014Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2683v3(14C,120W,2.0GHz)Processor Option Kit E5-2683v3(2.0GHz/14C)/9.6GT/35ML3 BCX438XeonE3-1220V5(3.0GHZ)/8M/4CBCX439XeonE3-1230V5(3.40GHZ)/8M/4CBCX440XeonE3-1240V5(3.50GHZ)/8M/4CBCX441XeonE3-1240LV5(2.10GHZ)/8M/4CBCX442XeonE3-1260LV5(2.90GHZ)/8M/4CBCX443XeonE3-1270V5(3.60GHZ)/8M/4CBCX444XeonE3-1280V5(3.70GHZ)/8M/4CBCX445i3-6320(3.9GHz)/4M/2CBCX446i3-6300T(3.3GHz)/4M/2CBCX447i3-6300(3.8GHz)/4M/2CBCX448i3-6100T(3.2GHz)/3M/2CBCX449i3-6100(3.7GHz)/3M/2CBCX450G4520(3.0GHz)/3M/2CBCX451G4500T(3.0GHz)/3M/2CBCX452G4500(3.5GHz)/3M/2CBCX453G4400(3.3GHz)/3M/2CBCX322E5-2603v3(1.6GHz/6c)/6.4GT/15ML3BCX401E5-2603v4(1.7GHz/6c)/6.4GT/15ML3BCX402E5-2609v4(1.7GHz/8c)/6.4GT/20ML3BCX403E5-2620v4(2.1GHz/8c)/8GT/20ML3BCX406E5-2630v4(2.2GHz/10c)/8GT/25ML3BCX408E5-2640v4(2.4GHz/10c)/8GT/25ML3BCX412E5-2650v4(2.2GHz/12c)9.6GT/30ML3BCX414E5-2660v4(2.0GHz/14c)9.6GT/35ML3 BCX416E5-2680v4(2.4GHz/14c)9.6GT/35ML3 BCX419E5-2690v4(2.6GHz/14c)9.6GT/35ML3 BCX404E5-2623v4(2.6GHz/4c)8.0GT/10ML3 BCX407E5-2637v4(3.5GHz/4c)/9.6GT/15ML3 BCX409E5-2643v4(3.4GHz/6c)/9.6GT/20ML3 BCX415E5-2667v4(3.2GHz/8c)9.6GT/25ML3 BCX417E5-2683v4(2.1GHz/16c)/9.6GT/40ML3 BCX420E5-2695v4(2.1GHz/18c)9.6GT/45ML3 BCX422E5-2697v4(2.3GHz/18c)9.6GT/45ML3 BCX421E5-2697Av4(2.6GHz/16c)9.6GT/40ML3 BCX423E5-2698v4(2.2GHz/20c)9.6GT/50ML BCX424E5-2699v4(2.2GHz/22c)9.6GT/55ML3 BCX405E5-2630LV4(1.8GHz/10c)8.0GT/25ML3 BCX411E5-2650LV4(1.7GHz/14c)9.6GT/35ML3 BCX410E5-2648LV4(1.8GHz/14c)9.6GT/35ML3 BCX413E5-2658V4(2.3GHz/14c)9.6GT/35ML3 BCX418E5-2687WV4(3.0GHz/12c)9.6GT/35ML3 BCX425XeonE7-4809v4(2.1GHz/8C)/6.4GT/20ML3 BCX426XeonE7-4820v4(2.0GHz/10C)/6.4GT/25ML3 BCX427XeonE7-4830v4(2.0GHz/14C)/8.0GT/35ML3 BCX428XeonE7-4850v4(2.1GHz/16C)/8.0GT/40ML3 BCX429XeonE7-8860v4(2.2GHz/18C)/9.6GT/45ML3 BCX430XeonE7-8855v4(2.1GHz/14C)/8.0GT/35ML3 BCX431XeonE7-8867v4(2.4GHz/18C)/9.6GT/45ML3 BCX432XeonE7-8870v4(2.1GHz/20C)/9.6GT/50ML3 BCX433XeonE7-8880v4(2.2GHz/22C)/9.6GT/55ML3 BCX434XeonE7-8890v4(2.2GHz/24C)/9.6GT/60ML3 BCX435XeonE7-8891v4(2.8GHz/10C)/9.6GT/60ML3 BCX436XeonE7-8893v4(3.2GHz/4C)/9.6GT/60ML3 DDR3内存SPT0MEM00006Inspur32GB DDR3L-1600LRDIMM SPT0MEM00007Inspur16GB DDR3-1866RDIMMSPT0MEM00008Inspur16GB DDR3-1600RDIMMSPT0MEM00009Inspur16GB DDR3L-1600RDIMMSPT0MEM0000A Inspur8GB DDR3-1600RDIMMSPT0MEM0000B Inspur8GB DDR3L-1600RDIMMSPT0MEM0000C Inspur4GB DDR3-1600RDIMMSPT0MEM0000D Inspur4GB DDR3L-1600RDIMMDDR4内存DDR4内存BMD1558G_DDR4_UDIMM-EUBMD15616G_DDR4_UDIMM-EUSPT0MEM00002Inspur8GB DDR4-2133MHz(1Rx4)RDIMM BMD1418G RDIMM DDR4内存SPT0MEM00001Inspur16GB DDR4-2133MHz(2Rx4)RDIMM BMD14216G RDIMM DDR4内存SPT0MEM00003Inspur16GB DDR4-2133MHz(1Rx4)RDIMMSPT0MEM00004Inspur32GB DDR4-2133MHz(2Rx4)RDIMM BMD14332G LRDIMM DDR4内存SPT0MEM00005Inspur32GB DDR4-2133MHz(4Rx4)LRDIMM3.5寸企业级SATA（含托架及包装）3.5寸企业级SATA（含托架及包装）SPT0STG35007Inspur3.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0231TB SATA（企业级）SPT0STG35001Inspur3.5"2TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0422TB SATA（企业级）SPT0STG35006Inspur3.5"3TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0703TB SATA（企业级）SPT0STG35005Inspur3.5"4TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0834TB SATA（企业级）SPT0STG35003Inspur3.5"6TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT1076TB SATA（企业级）SPT0STG35002Inspur3.5"8TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive8TB SATA（企业级）2.5寸企业级SATA（含托架及包装）2.5寸企业级SATA（含托架及包装）SPT0STG25006Inspur2.5"500GB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT062500GB SATA 2.5"（企业级）SPT0STG25005Inspur2.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0611TB SATA 2.5"（企业级）SPT0STG25004Inspur2.5''2TB7.2K Enterprise SATA6Gbps Hot Swap HardDrive2TB SATA 2.5"（企业级）2.5寸SAS（含托架及包装）2.5寸SAS（含托架及包装）7,200RPM7,204RPMSPT0STG25S03Inspur2.5"1TB7.2K Enterprise SAS12Gbps Hot Swap Hard Drive BSA0531TB SAS硬盘2.5"SPT0STG25S05Inspur2.5"1TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0531TB SAS硬盘2.5"SPT0STG25S01Inspur2.5"2TB7.2K Enterprise SAS12Gbps Hot Swap Hard Drive2TB SAS硬盘2.5"10,000RPM10,004RPMSPT0STG25001Inspur2.5"1.2TB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA0841.2T热插拔SAS硬盘(1万转)2.5" SPT0STG25002Inspur2.5"1.2TB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S02Inspur2.5"1.8TB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA1091.8T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0E Inspur2.5"300GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA023300G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0G Inspur2.5"300GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA023300G热插拔SAS硬盘(1万转)2.5"SPT0STG25S08Inspur2.5"600GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S09Inspur2.5"600GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S04Inspur2.5"900GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA057900G热插拔SAS硬盘(1万转)2.5"SPT0STG25S06Inspur2.5"900GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA057900G热插拔SAS硬盘(1万转)2.5"15,000RPM15,004RPMSPT0STG25S0D Inspur2.5"300GB15K Enterprise SAS12Gbps Hot Swap Hard Drive BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S0F Inspur2.5"300GB15K Enterprise SAS6Gbps Hot Swap Hard Drive BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S07Inspur2.5"600GB15K Enterprise SAS12Gbps Hot Swap Hard Drive BSA108600G热插拔SAS硬盘(1万5千转)2.5"日立SPT0STG25003Inspur2.5"600GB15K Enterprise SAS6Gbps Hot Swap Hard Drive600G热插拔SAS硬盘(1万5千转)2.5"日立3.5寸SAS（含托架及包装）3.5寸SAS（含托架及包装）SPT0STG35S09Inspur3.5"1TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive TYP0231TB SAS硬盘SPT0STG35S08Inspur3.5"2TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0762TB SAS硬盘SPT0STG35S05Inspur3.5"2TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive BSA0762TB SAS硬盘SPT0STG35S07Inspur3.5"3TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive TCP0493TB SAS硬盘SPT0STG35S04Inspur3.5"3TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive TCP0493TB SAS硬盘SPT0STG35S06Inspur3.5"4TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA1064TB SAS硬盘SPT0STG35S03Inspur3.5"4TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive BSA1064TB SAS硬盘SPT0STG35S01Inspur3.5"6TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive6TB SAS硬盘3.5寸硬盘托架，2.5寸SAS硬盘7,200RPM7,204RPMSPT0STG25S0N Inspur2.5"1TB7.2K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA0531TB SAS硬盘2.5"SPT0STG25S0P Inspur2.5"1TB7.2K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA0531TB SAS硬盘2.5"SPT0STG25S0H Inspur2.5"2TB7.2K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray2TB SAS硬盘2.5"10,000RPM10,004RPMSPT0STG25S0K Inspur2.5"1.2TB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0M Inspur2.5"1.2TB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0J Inspur2.5"1.8TB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA1091.8T热插拔SAS硬盘(1万转)2.5"SPT0STG25S11Inspur2.5"300GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA023300G热插拔SAS硬盘(1万转)2.5" SPT0STG25S13Inspur2.5"300GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA023300G热插拔SAS硬盘(1万转)2.5" SPT0STG25S0T Inspur2.5"600GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0V Inspur2.5"600GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0Q Inspur2.5"900GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA057900G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0R Inspur2.5"900GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA057900G热插拔SAS硬盘(1万转)2.5"15,000RPM15,004RPMSPT0STG25S0Z Inspur2.5"300GB15K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S12Inspur2.5"300GB15K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S0S Inspur2.5"600GB15K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA108600G热插拔SAS硬盘(1万5千转)2.5"日立SPT0STG25S0U Inspur2.5"600GB15K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray600G热插拔SAS硬盘(1万5千转)2.5"日立3.5寸云盘和归档盘（含托架及包装）3.5寸云盘和归档盘（含托架及包装）SPT0STG3500A Inspur3.5"4TB7.2K Cloud Storage SATA6Gbps Hot Swap Hard Drive4T云盘（7200转）V03ZVSPT0STG3500E Inspur3.5"4TB5.9K Cloud Storage SATA6Gbps Hot Swap Hard Drive4T云盘（5900转）_W0CCP0B0000060053.5寸硬盘托架，2.5寸企业级SATA3.5寸硬盘托架，2.5寸企业级SATASPT0STG25008Inspur2.5"2TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray2TB SATA 2.5"（企业级）SPT0STG25009Inspur2.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray1TB SATA 2.5"（企业级）SPT0STG2500A Inspur2.5"500GB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray500GB SATA 2.5"（企业级）PCIE SSD卡PCIE SSD卡BHD025400G MLC SSD PCIe接口BHD026600G MLC SSD PCIe接口BHD024800G MLC SSD PCIe接口BHD0231.2T MLC SSD PCIe接口BHD0272.4T MLC SSD PCIe接口其他硬盘及组件其他硬盘及组件BHE00264G SATA-DOM硬盘BHD02880G MLC SSD 2.5BHD029120G MLC SSD 2.5BHD004160G MLC SSD 2.5BHD030240G MLC SSD 2.5BHD010300G MLC SSD 2.5BHD016480G MLC SSD 2.5BHD009600G MLC SSD 2.5BHD019800G MLC SSD 2.5TYP004500GB SATA（桌面级）BPT0201T SATA（桌面级）BSA012300G热插拔SAS硬盘(1万5千转)RAID卡RAID卡SPT0POC00R06Inspur SAS3008iMR12Gbps PCIe Adapter BSS012INSPUR八通道高性能SAS3008卡IMR（可选Raid key)SPT0THR00K02Inspur RAID5Upgrate key for SAS3008iMR12Gbps PCIe Adapter BSS013INSPUR八通道高性能3008Raid KeySPT0POC00R02Inspur RAID1GB9271-8i6Gbps PCIe Adapter by Avago BRE028八通道SAS高性能RAID-9271（1G缓存)SPT0THR00D02Inspur iBBU09Battery Backup Unit Upgrade for RAID2208MR,9271-8i PCIe Adapter BDC020八通道SAS高性能RAID-9271电池SPT0THR00D05Inspur Supercapacitor Upgrade for RAID2208MR,9271-8i PCIe Adapter BDC022八通道SAS高性能RAID-9271缓存断电保护模块SPT0THR00K03Inspur RAID CacheCade Pro2.0Key for2208MR,3108MR,9271-8i,9361-8i BRE032RAID卡功能模块-CacheCade模块SPT0POC00R0G Inspur RAID2GB PM806012Gbps PCIe Adapter BDC027INSPUR八通道高性能SAS RAID卡RS0820P(2G缓存)SPT0THR00D01Inspur Supercapacitor for RAID PM8060(1GB,2GB)PCIe Adapter by Adaptec BRE038INSPUR八通道高性能SAS RS0810P缓存断电保护模块SPT0POC00R09Inspur RAID1GB9361-8i12Gbps PCIe Adapter by Avago BRE034八通道SAS高性能RAID-9361（1G缓存)SPT0THR00D03Inspur Supercapacitor Upgrade for RAID1GB9361-8i PCIe Adapter by LSI BDC026八通道SAS高性能RAID-9361（1G缓存)缓存断电保护模块SPT0POC00R08Inspur RAID2GB9361-8i12Gbps PCIe Adapter by Avago BRD036八通道SAS高性能RAID-9361（2G缓存)SPT0THR00D04Inspur Supercapacitor Upgrade for RAID9361-8i(2GB),3108MR(2GB,4GB)by LSI BDC025八通道SAS高性能RAID-9361（2G缓存)缓存断电保护模块SPT0POC00R07Inspur RAID4GB9364-8i12Gbps PCIe Adapter by Avago BRD037八通道SAS高性能LSI RAID-9364（4G缓存+缓存断电保护模块）SPT0POC00R0A Inspur RAID4GB3108MR12Gbps PCIe Adapter BRE040INSPUR八通道高性能SAS RAID卡RS0840L3(4G缓存)电源电源SPT0PSU00001Inspur CRPS800W Platinum Hot Swap Power SupplySPT0PSU00002Inspur CRPS1200W Platinum Hot Swap Power SupplySPT0PSU00003Inspur CRPS550W Platinum Hot Swap Power SupplySPT0PSU00004Inspur CRPS800W Titanium Hot Swap Power SupplySPT0PSU00005Inspur CRPS800W-48VDC Hot Swap Power SupplySPT0PSU00006Inspur CRPS800W336VDC Hot Swap Power SupplyBDY096300W电源适用于NP3020M4BDY097550W白金电源适用于NP3020M4光纤通道连接配件光纤通道连接配件SPT0POC00B01Inspur LPe1250Single Port8Gb Fibre Channel HBA by Emulex TAF019光纤通道HBA卡,FC8Gb,单端口,LC接口SPT0POC00B02Inspur LPe12002Dual Port8Gb Fibre Channel HBA by Emulex TAF021光纤通道HBA卡,FC8Gb,双端口,LC接口SPT0POC00B05Inspur QLE2560Single Port8Gb Fibre Channel HBA by Qlogic TAF019光纤通道HBA卡,FC8Gb,单端口,LC接口SPT0POC00B06Inspur QLE2562Dual Port8Gb Fibre Channel HBA by Qlogic TAF021光纤通道HBA卡,FC8Gb,双端口,LC接口SPT0POC00B03Inspur LPe16000B Single Port16Gb Fibre Channel HBA by Emulex TAF028光纤通道HBA卡,FC16Gb,单端口,LC接口SPT0POC00B07Inspur QLE2670Single Port16Gb Fibre Channel HBA by Qlogic TAF028光纤通道HBA卡,FC16Gb,单端口,LC接口SPT0POC00B04Inspur LPe16002B Dual Port16Gb Fibre Channel Adapter by Emulex TAF029光纤通道HBA卡,FC16Gb,双端口,LC接口转接卡转接卡BKZ013PCI-E转接卡套件（NF8460M3）PCI-E转接卡套件（NF8460M4）网卡及远程管理卡网卡及远程管理卡SPT0POC00W01Inspur I350PCIe1Gb2Port Base-T Ethernet Adapter BNT004双口千兆网卡（RJ45接口）SPT0POC00W02Inspur I350PCIe1Gb4Port Base-T Ethernet Adapter BNT010四口千兆网卡（RJ45接口）SPT0POC00W06Inspur I350PCIe1Gb4Port SPF Ethernet Adapter BNT042四口千兆网卡（光纤接口）SPT0POC00W07Inspur82599ES PCIe10Gb1Port with Multi-mode SFP+module Ethernet Adapter单口万兆网卡（光纤接口含多模模块）SPT0POC00W09Inspur MCX312B-XCCT PCIe10Gb2Port SFP+Ethernet Adapter BNT009双口万兆网卡（光纤接口）SPT0POC00W08Inspur82599ES PCIe10Gb2Port with Multi-mode SFP+module Ethernet Adapter双口万兆网卡（光纤接口含多模模块）SPT0POC00W0J Inspur X710PCIe x8+x110Gb2Port SFP+Ethernet Daughter Card出厂前升级INSPUR双口万兆FLOM网卡（光纤接口），不含光模块SPT0POC00W0H Inspur82599ES PCIe x8+x110Gb1Port SFP+Ethernet Adapter BNT034INSPUR单口万兆网卡（光纤接口），不含光模块SPT0POC00W0K Inspur CX3PCIe x8+110Gb1Port SFP+Ethernet Adapter BNT034INSPUR单口万兆网卡（光纤接口），不含光模块SPT0POC00W0G Inspur82599ES PCIe x8+x110Gb2Port SFP+Ethernet Adapter BNT035INSPUR双口万兆网卡（光纤接口），不含光模块SPT0POC00W0L Inspur CX3PCIe x8+110Gb2Port SFP+Ethernet AdapterSPT0THR00S01Inspur1Gb Single-Mode SPF+Optical Module INSPUR千兆网卡光模块（单模，搭配INSPUR万兆网卡使用）SPT0THR00S02Inspur1Gb Multi-Mode SFP+Optical Module INSPUR千兆网卡光模块（多模，搭配INSPUR万兆网卡使用）SPT0THR00S03Inspur10Gb Single-Mode SFP+Optical Module BNT036INSPUR万兆网卡光模块（单模，搭配INSPUR万兆网卡使用）SPT0THR00S04Inspur10Gb Multi-Mode SFP+Optical Module BNT037INSPUR万兆网卡光模块（多模，搭配INSPUR万兆网卡使用）SPT0POC00W0A Inspur T580-SO-CR PCIe40Gb2Port QSFP+Ethernet Adapter BNT039双口40GbE网卡光纤接口，不含光模块，需搭配40G网卡线缆使用SPT0POC00W03Inspur X540PCIe10Gb2Port Base-T Ethernet Adapter BNT030双口万兆网卡（RJ45接口）SPT0POC00W04Inspur I350PCIe x8+11Gb4Port Base-T Ethernet Adapter出厂前升级INSPUR四口千兆网卡（RJ45接口）SPT0POC00W05Inspur X540PCIe x8+110Gb2Port Base-T Ethernet Adapter INSPUR双口万兆网卡（RJ45接口）BNT002单口千兆网卡（光纤接口）BNT005双口千兆网卡（光纤接口）BNT008单口万兆网卡（光纤接口）BNT040双口40GbE CNA网卡光纤接口，不含光模块，需搭配40G网卡线缆使用BNT04140G网卡线缆，15米Infiniband card Infiniband cardSPT0POC00C01Inspur MCX353A-FCBT56Gb1Port with QSFP Module InfiniBand Adapter TAF027HCA卡(单口IB卡56GB)SPT0POC00C02Inspur MCX353A-FCBT56Gb2Port with QSFP Module InfiniBand Adapter HCA卡(双口IB卡56GB)软驱、光驱、刻录机软驱、光驱、刻录机BHU001U盘软驱MGQ002标准DVDBCD006DVD刻录机BCD017USB DVD刻录机BCD026SLIM DVD刻录机显卡显卡BXK039显卡K420（显存1G）BXK040显卡K620（显存2G）BXK041显卡K2200（显存4G）显示器显示器BOV01419.5寸液晶显示器BOV00921.5寸液晶显示器BOV01523.6寸液晶显示器RACK机柜及组件RACK机柜及组件BOG022浪潮42U标准服务器机柜（无PDU）/2000mm×1100mm×600mm（H×D×W）BPK0396口PDU国标万用插口/10ABPK03821口PDU国标万用插口/32ABTP00140公斤机柜托盘BTP002100公斤机柜托盘BOK001键盘B0M001鼠标BOQ008四合一切换器17寸液晶8口/USBBOQ009四合一切换器17寸液晶16口/USBBOQ0018口切换器BOQ00516口切换器其他其他BPT002配件，背板_INSPUR_SAS_2.5X8BPT017硬盘模组_2.5×8BPT003配件，背板_INSPUR_SAS12G_4X3.5BPT004配件，背板_INSPUR_SAS12G_8X2.5BPT008配件，SAS线BPT010配件，风扇BPT011配件，硬盘托架_2.5寸BPT012配件，硬盘托架_3.5寸BPT013配件，包装箱BPT014配件，电源线BPT015配件，服务器用户手册及睿捷服务器套件光盘BPL001NF5270M42U前面板V08WY0208000B014SPT0BKD00001Inspur Milestone42U3.5"x4Drive Backplane Kit SPT0BKD00002Inspur Milestone42U Rear2.5"x2Drive Backplane Kit SPT0BKD00003Inspur Milestone42U2.5"x8Drive Backplane Kit。

Keysight U2741A USB模块化数字万用表用户指南声明版权声明© Keysight Technologies 2008-2017根据美国和国际版权法，未经 Keysight Technologies 事先允许和书面同意，不 得以任何形式（包括电子存储和检索或翻译为其他国家或地区语言）复制本手册中的任何内容。

手册部件号U2741-90007版本2017 年 3 月 1 日，第 9 版印刷地区：马来西亚印刷发布者：Keysight TechnologiesBayan Lepas Free Industrial Zone, 11900 Penang, Malaysia技术许可本文档中描述的硬件和/或软件仅在得到许可的情况下提供并且只能根据此类许可的条款进行使用或复制。

符合性声明可以从 Web 上下载本产品以及其他 Keysight 产品的符合性声明。

请访问 /go/conformity。

然后，可以按产品编号进行搜索，查找最新的符合性声明。

美国政府权利本软件属于联邦政府采购法规（“FAR”）2.101 定义的“商用计算机软件”。

按照FAR 12.212 和 27.405-3 以及国防部FAR 补充条款（“DFARS”）227.7202，美国政府根据向公众提供商用计算机软件的一般条款获得本软件。

同样，Keysight 根据其标准商业许可证向美国政府客户提供本软件，该许可证包含在其最终用户许可协议 (EULA) 中，可以在以下位置找到该许可协议的副本：/find/sweula。

EULA 中所述的许可证阐述了美国政府在使用、修改、分发或披露本软件方面的专属权利。

除了其他事项之外，EULA及其所述的许可证不要求或不允许Keysight：(1) 提供通常不会向公众提供的与商用计算机软件或商用计算机软件文档相关的技术信息；或者 (2) 让与或以其他方式提供的政府权利超过通常向公众提供的有关使用、修改、复制、发布、执行、显示或披露商用计算机软件或商用计算机软件文档方面的权利。

稳压1117，RT9173、RT9199、W83310、RT9181、UP6103•1.三端稳压器117降压1117，3.3代表类型（3.3V输出）ADJ，可调节•开关电源工作原理：PWM 芯片控制 MOS 的高速开关来调节电压，当开关打开时电压上升，而关闭时则电压下降，电感电容组成 LC 储能电路。

通过高速切换 MOS 的开和关，控制 MOS 导通时间来控制电压的准位。

如图 T代表一个周期，T1 为开启状态，T2 为关闭状态，只要控制 T1 和 T2 的时间就可以控制电压的高低。

通过给负载馈电的时间改变供电电压当K闭合，则小灯泡获得12V电压；当K断开，小灯泡获得0V电压。

若K闭合1秒，断开一秒，重复动作1分钟，则在1分钟内小灯泡获得的平均电压：1分钟/（1开+1关）*12V=6.0V。

改变导通和截止的时间比例（占空比）就可以改变小灯泡获得的平均电压。

但这个电压不连续。

为了获得一个持续的电压。

电路加入滤波器件。

通常由窜连电感和并联的滤波电路来实现。

即上管导通下管闭合。

电感及电容端电压不能突变的特性使得上下管的导通给电感及电容提供了源源不断的电压经由电路构成回路，提供稳定的电流。

• 478主板平台内存供电一般比较器+场效应管的方式。

775以上的内存供电采用PWM方式供电。

供电芯片通常有RT9202、RT9214、RT9218等•RT9202引脚定义采用 12V 和 5V 供电的 RT9202 工作流程：1：5V 给 5 脚供电，5V 给上管供电，12V 经过 R4 给 1 脚供电，5V 经过 R1 给 7 脚供电；2：2 脚 UGATE 驱动上管导通；3：上管给电感 L2 和电容 C3 充电；4：当 L2 和 C3 成的储能电路电压经过 R2 和 R3 分压反馈给 FB 脚电压超过 0.8V 时，RT9202 关闭上管打开下管5：下管导通构成储能电路的放电回路，当电路经过分压后反馈给 FB 的电压低于 0.8V 时，RT9202 控制关闭下管打开上管，继续充电；6：2-5 循环。

FOXBORO ®The FBM214 HART ® Communication Input Interface Module provides eight input channels, each accepting a 4 to 20mA analog signal or a digital HART signal superimposed on a 4 to 20 mA analog input signal.FEATURESKey features of the FBM214 module are:Eight analog input channels, each accepting oneof the following inputs:•Standard 4 to 20 mA analog sensor signal •Digital HART Frequency Shift Keying (FSK) signal superimposed on a 4 to 20 mA analog input signal.FSK modem dedicated to each input channel forbi-directional digital communications with a HART field deviceAnalog to digital conversion of each of the 4to20mA input signals from the HART devicesSupport for the HART universal commandsnecessary to interface the field device with the I/A Series ® system databaseGalvanic isolation of the group of 8 inputchannels from ground and module logicCompact, rugged design suitable for enclosure inClass G3 (harsh) environmentsHigh accuracy achieved by sigma-delta dataconversions for each channelTermination Assemblies (TAs) for locally orremotely connecting field wiring to the FBM214Termination Assemblies for per channel internallyand/or externally loop powered transmitters.PSS 21H-2Z14 B4 Page 2OVERVIEWThe FBM214 HART Communication Input Interface Module contains eight 4to20mA group isolated analog input channels. The FBM214 supports any mix of standard 4to20mA devices and HART devices.The FBM214 serves as a HART communications field device host, enabling the I/A Series system to request and receive two digital messages per second from the field device. The message pass-through capability can be used to support HART universal, common practice, and device-specific commands, but not the burst communication mode. These commands are implemented using the Intelligent Field Device Configurator (IFDC — refer toPSS 21S-8A3 B3 for details).The FBM214 provides a common isolated power supply to power all eight channels. Optionally, the channels can be powered by an external power supply. However, when a common external power supply is used with two or more channels, a Cable Balun module is required to prevent channel cross talk.COMPACT DESIGNThe FBM214 has a compact design, with a rugged extruded aluminum exterior for physical protection of the circuits. Enclosures specially designed for mounting the FBMs provide various levels of environmental protection, up to harsh environments per ISA Standard S71.04.HIGH ACCURACYFor high accuracy, the module incorporates a Sigma-Delta converter which can provide new analog input values for each channel every 100 milliseconds.VISUAL INDICATORSLight-emitting diodes (LEDs) incorporated into the front of the module provide visual indication of the module’s operational status, and communication activity on the channels.EASY REMOVAL/REPLACEMENTThe module can be removed/replaced without removing field device termination cabling, power, or communications cabling.FIELDBUS COMMUNICATIONA Fieldbus Communication Module or a Control Processor interfaces the redundant 2 Mbps module Fieldbus used by the FBMs. The FBM214 module accepts communication from either path (A or B) of the redundant 2 Mbps fieldbus – should one path fail or be switched at the system level, the module continues communication over the active path.The use of an external power supply common to two or more loops requires a Cable Balun Module to maintain communication signal line balance.MODULAR BASEPLATE MOUNTINGThe module mounts on a modular baseplate which accommodates up to four or eight FBMs. The modular baseplate is either DIN rail mounted or rack mounted, and includes signal connectors for redundant fieldbus, redundant independent dc power, and termination cables.TERMINATION ASSEMBLIESField input signals connect to the FBM subsystem via DIN rail mounted TAs. The TAs used with theFBM214 are described in “TERMINATION ASSEMBLIES AND CABLES” on page8.PSS 21H-2Z14 B4Page 3CABLE BALUN MODULEThe Cable Balun module is used to maintain digital communication line balance for HART Transmitter to FBM loops that are powered from a common external power supply. This powering effectively connects one line of each loop together. Without the Baluns, in each loop so powered, the common connection at the external power supply, would cause near end crosstalk at the system end of the loop wiring cable. Loops using FBM internal power source do not require Baluns.The Cable Balun module contains multiple Baluns. One Balun segment is interconnected in each loop powered from an external power supply per the diagram above. There is one Cable Balun module.Figure 1. Cable Balun Module Cable Balun ModuleModule Model ModulePart No.No. of Balunsin the ModuleCBM-4P0903SV4PSS 21H-2Z14 B4Page 4FUNCTIONAL SPECIFICATIONSField Device ChannelsVERSION SUPPORTEDHART Protocol v6INTERFACE8 group-isolated channelsCOMMUNICATION TO THE DEVICEPoint-to-point, master/slave, asynchronous, half-duplex, at 1200 baud.ERROR CHECKINGParity on each byte, and one CRC check byte.SPEED2 messages per secondFASTEST ALLOWED ECB BLOCK PERIOD500 msecMAXIMUM DISTANCE (FBM214 TO FIELDDEVICE)Meets HART FSK physical layer specificationHCF_SPEC-54, Revision 8.1 [up to 3030 m(10000ft)](1).COMPLIANCE VOLTAGE18 V dc minimum at 20.5 mACURRENT INPUTSSense Resistor61.9 Ω nominalTotal Input Resistance280 Ω minimumAccuracy (Includes Nonlinearity)±0.03% of full scaleTemperature Coefficient50 ppm/ºCResolution15 bitsUpdate Rate100 msIntegration Time500 msCommon Mode Rejection>100 db at 50 or 60 HzNormal Mode Rejection>35 db at 50 or 60 HzMAXIMUM LOOP RESISTANCE280 Ω (not including the field device)(2)LOOP POWER SUPPLY PROTECTIONEach channel is galvanically group isolated,current limited and voltage regulated. All inputsare limited by their design to less than 30 mA. Ifthe current limit circuit shorts out, the current islimited to about 85 mA.FBM INPUT IMPEDANCE280 Ω minimumFBM INTERNAL POWER FOR FIELD DEVICE24 V dc ±10% common power supply for allchannels. Loop load limited to one device perchannel.ISOLATIONThe channels are not galvanically isolated fromeach other, but are galvanically isolated (bothoptical and transformer isolation) as a group from ground and module logic. Inputs use an internal FBM isolated power supply for field power. Themodule withstands, without damage, a potential of 600 V ac applied for one minute between the group-isolated channels and earth (ground).CAUTIONThis does not imply that these channels areintended for permanent connection tovoltages of these levels. Exceeding the limitsfor input voltages, as stated elsewhere in thisspecification, violates electrical safety codesand may expose users to electric shock. Fieldbus CommunicationCommunicates with its associated FCM or FCP via the redundant 2 Mbps module FieldbusHEAT DISSIPATION4 W (maximum)(1)The maximum allowable distance decreases when the loop is operated through an intrinsic safety barrier. The maximum distance ofthe field device from the FBM is a function of compliance voltage, wire gauge and voltage drop at the device.(2)In an intrinsic safety application, if a zener barrier is used between the FBM and the field device, the power supply must be set at24V dc +5%, -1%. There are no specific constraints with the use of galvanic barriers.PSS 21H-2Z14 B4Page 5 FUNCTIONAL SPECIFICATIONS (CONTINUED)Power RequirementsINPUT VOLTAGE RANGE (REDUNDANT)24V dc ±5%CONSUMPTION7 W (maximum)Regulatory ComplianceELECTROMAGNETIC COMPATIBILITY (EMC) European EMC Directive 89/336/EECMeets:EN 50081-2 Emission standardEN 50082-2 Immunity standardEN 61326 Annex A (Industrial Levels) CISPR 11, Industrial Scientific and Medical(ISM) Radio-frequency Equipment -Electromagnetic Disturbance Characteristics- Limits and Methods of MeasurementMeets Class A LimitsIEC 61000-4-2 ESD ImmunityContact 4 kV, air 8 kVIEC 61000-4-3 Radiated Field Immunity10 V/m at 80 to 1000 MHzIEC 61000-4-4 Electrical FastTransient/Burst Immunity2 kV on I/O, dc power and communicationlinesIEC 61000-4-5 Surge Immunity2kV on ac and dc power lines; 1kV on I/Oand communications linesIEC 61000-4-6 Immunity to ConductedDisturbances Induced by Radio frequencyFields10 V (rms) at 150 kHz to 80 MHz on I/O,dc power and communication linesIEC 61000-4-8 Power Frequency MagneticField Immunity30 A/m at 50 and 60 HzPRODUCT SAFETY (FBM AND CABLE BALUN) Underwriters Laboratories (UL) for U.S. andCanadaUL/UL-C listed as suitable for use inUL/UL-C listed Class I, Groups A-D;Division 2; temperature code T4 enclosurebased systems. These modules are also ULand UL-C listed as associated apparatus forsupplying non-incendive communicationcircuits for Class I, Groups A-D hazardouslocations when connected to specifiedI/A Series® processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Wherepower is supplied by the FBM,communications circuits also meet therequirements for Class2 as defined inArticle725 of the National Electrical Code(NFPA No.70) and Section 16 of theCanadian Electrical Code (CSA C22.1).Conditions for use are as specified in theI/A Series DIN Rail Mounted SubsystemUser’s Guide (B0400FA).European Low Voltage Directive 73/23/EECand Explosive Atmospheres (ATEX) directive94/9/ECCENELEC (DEMKO) certified as EEx nA IICT4 for use in CENELEC certified Zone 2enclosure certified as associated apparatusfor supplying non-incendive field circuits forZone 2, Group IIC, potentially explosiveatmospheres when connected to specifiedI/A Series processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Also,see Table1 on page9.Calibration RequirementsCalibration of the module or termination assembly is not required.PSS 21H-2Z14 B4Page 6ENVIRONMENTAL SPECIFICATIONS(3)OperatingTEMPERATUREModule-20 to +70°C (-4 to +158°F)Termination AssemblyPVC-20 to +50°C (-4 to +122°F)PA-20 to +70°C (-4 to +158°F) RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +3,000m (-1,000 to +10,000ft)StorageTEMPERATURE-40 to +70°C (-40 to +158°F)RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +12,000m (-1,000 to +40,000ft) ContaminationSuitable for use in Class G3 (Harsh) environments as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65, Class III. Vibration7.5 m/S2 (0.75 g) from 5 to 500 Hz(3)The environmental limits of this module may be enhanced by the type of enclosure containing the module. Refer to the applicableProduct Specification Sheet (PSS) which describes the specific type of enclosure that is to be used.PSS 21H-2Z14 B4Page 7 PHYSICAL SPECIFICATIONSMountingMODULEFBM214 mounts on a modular baseplate. Thebaseplate can be mounted on a DIN rail(horizontally or vertically), or horizontally on a19-inch rack using a mounting kit. Refer toPSS21H-2W6B4 for details.TERMINATION ASSEMBLYThe TA mounts on a DIN rail and accommodates multiple DIN rail styles including 32mm (1.26in) and 35mm 1.38in).MassMODULE284 g (10 oz) approximateTERMINATION ASSEMBLYCompression181 g (0.40 lb) approximateRing Lug249 g (0.55 lb) approximateDimensions – ModuleHEIGHT102 mm (4 in)114 mm (4.5 in) including mounting lugsWIDTH45 mm (1.75 in)DEPTH104 mm (4.11 in)Dimensions – Termination AssemblySee page10.Part NumbersFBM214 MODULEP0922VTTERMINATION ASSEMBLIESSee “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” on page8. Termination CablesCABLE LENGTHSUp to 30 m (98 ft)CABLE MATERIALSPolyurethane or Hypalon®/XLPTERMINATION CABLE TYPEType 1 – See Table2 on page9.CABLE CONNECTION – TA25-pin male D-subminiatureConstruction – Termination AssemblyMATERIALPolyvinyl Chloride (PVC), compressionPolyamide (PA), compressionPVC, ring lugFAMILY GROUP COLORGreen – communicationTERMINAL BLOCKS3 tiers, 8 positionsField Termination ConnectionsCOMPRESSION-TYPE ACCEPTED WIRINGSIZESSolid/Stranded/AWG0.2 to 4 mm2/0.2 to 2.5 mm2/24 to 12 AWGStranded with Ferrules0.2 to 2.5 mm2 with or without plastic collarRING-LUG TYPE ACCEPTED WIRING SIZES#6 size connectors (0.375 in (9.5 mm))0.5 to 4 mm2/22 AWG to 12 AWGPSS 21H-2Z14 B4Page 8TERMINATION ASSEMBLIES AND CABLESField input signals connect to the FBM subsystem via DIN rail mounted Termination Assemblies, which are electrically passive.TAs for the FBM214 are available in the following forms: Compression screw type using Polyvinyl Chloride(PVC) materialCompression screw type using Polyamide (PA) material Ring lug type using PVC material.See the following “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” for a list of TAs used with the FBM214.The FBM214 provides sufficient loop resistance to allow use of the HART Hand-Held Terminal, or PC20 Intelligent Field Device Configurator (PSS 2A-1Z3 E).A removable termination cable connects the DIN railmounted TA to the FBM via a field connector on the baseplate in which the FBM is installed. Termination cables are available in the following materials: PolyurethaneHypalon XLP .Termination cables are available in a variety of lengths, up to 30 meters (98feet), allowing the Termination Assembly to be mounted in either theenclosure or in an adjacent enclosure. See Table 2 for a list of termination cables used with the TAs forthe FBM214.FUNCTIONAL SPECIFICATIONS – TERMINATION ASSEMBLIESFBM Type Input SignalTA Part NumberTermination TA Cable TACertification PVC (a)(a)PVC is polyvinyl chloride rated from -20 to +50°C (-4 to +122°F).PA is Polyamide rated from -20 to +70°C (-4 to +158°F).PA (a)Type (b)(b) C = TA with compression terminals; RL = TA with ring lug terminals.Type (c)(c)See Table 2 for cable part numbers and specifications.Type (d)(d)See Table 1 for Termination Assembly certification definitions.FBM2148 input channels, 4 to 20mA analog signal, alone or with HART signal superimposedP0916BX P0926EA P0926TD CRL11, 2PSS 21H-2Z14 B4Page 9Table 1. Certification for Termination AssembliesType Certification (a)(a)All TAs are UL/UL-C listed to comply with applicable ordinary location safety standards for fire and shock hazards. Hazardous locationtypes comply with ATEX directive for II 3 G use. They also comply with the requirements of the European Low Voltage Directive. All listings/certifications require installation and use within the constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA) and the conditions stated in UL and DEMKO reports.Type 1TAs are UL/UL-C listed as suitable for use in Class I; Groups A-D; Division 2 temperature code T4 hazardous locations. They are CENELEC (DEMKO) certified EEx nA IIC T4 for use in Zone 2 potentially explosive atmospheres.Type 2TAs are UL/UL-C listed as associated apparatus for supplying non-incendive field circuits Class I; Groups A-D; Division 2 hazardous locations when connected to specified DIN rail mounted FBMs and field circuits meeting entity parameter constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA). They are also CENELEC (DEMKO) certified as associated apparatus for supplying field circuits for Group IIC, Zone 2 potentially explosive atmospheres. Field circuits are also Class 2 limited energy (60 V dc, 30 V ac, 100 VA or less) if customer-supplied equipment meets Class 2 limits.Table 2. Cables Types and Part NumbersCable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)Cable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)0.5 (1.6)P0916DA P0916VA 10.0 (32.8) P0916DE P0916VE 1.0 (3.2) P0916DB P0916VB 15.0 (49.2) P0916DF P0916VF 2.0 (6.6)P0931RM P0931RR 20.0 (65.6) P0916DG P0916VG 3.0 (9.8) P0916DC P0916VC 25.0 (82.0) P0916DH P0916VH 5.0 (16.4)P0916DDP0916VD30.0 (98.4)P0916DJP0916VJ(a)P/PVC is polyurethane outer jacket and semi-rigid PVC primary conductor insulation.(b)H/XLPE is Hypalon outer jacket and XLPE (cross-linked polyethylene) primary conductor insulation.PSS 21H-2Z14 B4Page 10DIMENSIONS – NOMINALRELATED PRODUCT SPECIFICATION SHEETSCompression Termination AssemblyRing Lug Termination Assembly(a) Overall width – for determining DIN rail loading.(b) Height above DIN rail (add to DIN rail height for total).PSS NumberDescriptionPSS 21H-2W1 B3DIN Rail Mounted FBM Subsystem OverviewPSS 21H-2W2 B3DIN Rail Mounted FBM Equipment, Agency CertificationsPSS 21H-2Z14 B4Page 11PSS 21H-2Z14 B4 Page 12IPS Corporate Headquarters 5601 Granite Parkway Suite 1000 Plano, TX 75024United States of AmericaFoxboro Global Client Support Inside U.S.: 1-866-746-6477 Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.Facsimile: 1-508-549-4999Invensys, Foxboro, I/A Series and the IPS Logo are trademarks of Invensys plc, its subsidiaries, and affiliates. All other brand names may be trademarks of their respective owners.Copyright 2002-2010 Invensys Systems, Inc.All rights reservedMB 21A Printed in U.S.A. 0210。

数据手册DS0207A_C01A产品综述SDG7000A 系列双通道任意波形发生器，最大带宽1 GHz，具备5 GSa/s数-模采样率和14-bit 垂直分辨率，能够产生最高2.5 GSa/s采样率的逐点任意波和最大500 MSymbol/s的矢量信号，同时还具备连续波、脉冲信号、噪声、PRBS码型和16-bit数字总线等多种信号生成的能力，并提供调制、扫频、脉冲串和双通道复制、相加、互相调制等复杂信号的生成能力，是一款高端多功能波形发生器。

其输出支持差分/单端切换，最大可提供±24 V的输出范围，并且在高频输出下仍然能保证较大的幅度，可在一定应用范围内节省外接功放，满足更广泛的需求。

特性与优点⏹双通道差分/单端模拟输出，16-bit LVDS/LVTTL数字总线输出⏹ 5 GSa/s数-模转换器采样率，14-bit垂直分辨率⏹最高输出频率1 GHz⏹可输出0.01 Sa/s ~ 2.5 GSa/s采样率的逐点任意波，最大存储深度512 Mpts，提供分段编辑和播放的功能⏹可输出最高500 MSymbol/s符号率的矢量信号⏹可输出最小脉宽1 ns，最小沿500 ps的低抖动脉冲，上升/下降沿独立精细可调，脉宽精细可调⏹可输出1 mHz ~ 1 GHz带宽的高斯噪声⏹可输出最高312.5 Mbps的PRBS码型⏹数字总线可输出最高1 Gbps的数字信号⏹提供多种模拟/数字调制，提供扫频和脉冲串功能⏹增强的双通道操作功能：通道间跟踪、耦合和复制功能；双通道叠加功能；支持通道间互为调制源⏹24 Vpp模拟输出能力叠加±12 V直流偏置，最大可提供±24V（48 V）的输出范围⏹硬件频率计功能⏹5英寸电容式触摸显示屏，分辨率800x480；支持外接鼠标和键盘操作；内建的WebServer 支持通过网页控制仪器⏹丰富的接口：USB Host、USB Device (USBTMC)、LAN（VXI-11/Telnet/Socket）、外调制/频率计输入、参考时钟输入、参考时钟输出、Marker输出、Trigger In/Out等⏹支持SCPI 远程控制命令，良好适配各种自动化集成测试系统SDG7000A任意波形发生器数据手册型号和主要参数SDG7000A任意波形发生器数据手册设计特色多功能信号发生器SDG7000A是一款集多种信号发生器功能于一体的产品。

D a t a S h e e t -2020.02SDS1000X-E Series Digital OscilloscopeProduct overviewSIGLENT’s new SDS1000X-E Super Phosphor Oscilloscopes feature two channel and four channel models. The two channel model is available with a 200 MHz analog bandwidth, a single ADC with 1 GSa/s maximum sample rate, and a single memory module with 14 Mpts of sample memory. The four channel scope is available in 100 and 200 MHz models and incorporates two 1 GSa/s ADCs and two 14 Mpts memory modules. When all channels are enabled, each channel has sample rate of 500 MSa/s and a standard record length of 7 Mpts. When only a single channel per ADC is active, the maximum sample rate is 1 GSa/s and the maximum record length is 14 Mpts. For ease-of-use, the most commonly used functions can be accessed with its user-friendly front panel design.The SDS1000X-E series employs a new generation of SPO (Super-Phosphor Oscilloscope) technology that provides excellent signal fidelity and performance. The system noise is also lower than similar products in the industry. It comes with a minimum vertical input range of 500 uV/div, an innovative digital trigger system with high sensitivity and low jitter , and a waveform capture rate of 400,000 frames/sec (sequence mode). The SDS1000X-E also employs a 256-level intensity grading display function and a color temperature display mode not found in other models in this class. SIGLENT’s latest oscilloscope offering supports multiple powerful triggering modes including serial bus triggering. Serial bus decoding for IIC, SPI, UART , CAN, LIN bus types are included. The X-E models also include History waveform recording, and sequential triggering that enable extended waveform recording and analysis. Another powerful addition is the new 1 million points FFT math function that gives the SDS1000X-E very high frequency resolution when observing signal spectra. The new digital design also includes a hardware co-processor that delivers measurements quickly and accurately without slowing acquisition and front-panel response. The features and performance of SIGLENT’s new SDS1000X-E cannot be matched anywhere else in this price class.The four channel series support even more functions, including: searching and navigating, on-screen Bode plot, 16 digital channels (Option), an external USB powered 25 MHz AWG module (Option), a USB WIFI adapter (Option), and an embedded application that allows remote control via web browser .Key Features100 MHz, 200 MHz bandwidth modelsTwo channel series have one 1 GSa/s ADC, four channel series have two 1 GSa/s ADCs. When all channels are enabled, each channel has a maximum sample rate of 500 MSa/s. When a single channel per ADC is active, it has sample rate of 1 GSa/sThe newest generation of SPO technology• Waveform capture rate up to 100,000 wfm/s (normal mode), and 400,000 wfm/s (sequence mode)• Supports 256-level intensity grading and color display modes • Record length up to 14 Mpts • Digital trigger systemIntelligent trigger: Edge, Slope, Pulse Width, Window, Runt, Interval, Time out (Dropout), PatternSerial bus triggering and decoding (Standard), supports protocols IIC, SPI, UART , CAN, LINVideo trigger , supports HDTVLow background noise with voltage scales from 500 μV/div to 10 V/div10 types of one-button shortcuts, supports Auto Setup, Default, Cursors, Measure, Roll, History, Display/Persist, Clear Sweep, Zoom and PrintSegmented acquisition (Sequence) mode, divides the maximum record length into multiple segments (up to 80,000), according to trigger conditions set by the user , with a very small dead time segment to capture the qualifying event.History waveform record (History) function, maximum recorded waveform length is 80,000 frames.Automatic measurement function for 38 parameters as well as Measurement Statistics, Zoom, Gating, Math, History and Reference functions1 Mpts FFT, four-channel series support Peaks, Markers, a variety of numbers Math and measurement functions use all sampled data points (up to 14 Mpts)Math functions (FFT , addition, subtraction, multiplication,division, integration, differential, square root)Preset key can be customized for user settings or factory “defaults”Security Erase modeHigh Speed hardware based Pass/Fail functionMSO, 16 digital channels (four channel series only, option)Bode plot, Measuring Power Supply Control Loop Response (four-channel series only)Search and navigate (four channel series only)USB AWG module (four channel series only, option)USB WIFI adapter (four channel series only, option)Web Browser based control (four channel series only)Large 7 inch TFT -LCD display with 800 * 480 resolutionMultiple interface types: USB Host, USB Device (USB-TMC), LAN, Pass / Fail, Trigger OutSupports SCPI remote control commandsSupports web control and virtual panel for both PC and mobile terminals Web update rate of up-to 10times/s provides nearly real-time updating with SDS1000X-E(four channel series only)Supports Multi-language display and embedded online helpVXI-11+SCPI, Telnet(Port 5024)+SCPI and Socket(Port 5025)+SCPI programming over LANSDS1000X-E Series Digital OscilloscopeModels and key SpecificationFunction & Characteristics• 7 -inch TFT -LCD display with 800 * 480 resolution• Most commonly used functions are accessible using 10 different one-button operation keys: Auto Setup, Default, Cursor , Measure, Roll, History, Persist, Clear Sweep, Zoom, Print7 inch TFT-LCD display and 10 one-button menusFront panel of the four channel series Front panel of the two channel seriesSDS1000X-E Series Digital OscilloscopeWhen all channels are enabled, each channel has a maximum sample rate of 500 MSa/s. When a single channel per pair is active, that channel has sample rate of 1 GSa/s256 -Level Intensity Grading and Color Temperature DisplayRecord Length of up to 14 Mpts (single channel/pair mode), 7 Mpts/CH (two channels/pair mode)Waveform Capture Rate up to 400,000 wfm/sThe four channel series has two 1 GSa/s ADC chips (channel 1 and 2 share one, channel 3 and 4 share another), so that each channel can achieve sample rates up to 500 MSa/s and work on bandwidths of 200 MHz when all channels are enabled.SPO display technology provides fast refresh rates. The resulting intensity-graded trace is brighter for events that occur with more frequency and dims when the events occur with less frequency.The color temperature display is similar to the intensity-graded trace function, but the trace occurrence is represented by different colors (color “temperature”) as opposed to changes in the intensity of one color . Red colors represents the more frequent events, while blue is used to mark points that occur lest frequently.With a waveform capture rate of up to 400,000 wfm/s (sequence mode), the oscilloscope can easily capture the unusual or low-probability events.Using hardware-based Zoom technologies and max record length of up to 14 Mpts, users are able to oversample to capture for longer time periods at higher resolution and use the zoom feature to see more details withineach signal.Function & CharacteristicsSDS1000X-E Series Digital OscilloscopeTrue measurement to 14 M points Serial Bus Decoding Function (Standard)Gate and Zoom MeasurementHistory Waveforms (History) Mode and Segmented Acquisition (Sequence)SDS1004X-E can measure all sampled data points up to 14 Mpts. This ensures the accuracy of measurements while the math co-processor decreases measurement time and increases ease-of-use.SDS1000X-E displays the decoding through the events list. Bus protocol information can be quickly and intuitively displayed in a tabular format.Through Gate and Zoom measurement, the user can specify an arbitrary interval of waveform data analysis and statistics. This helps avoid measurement errors that can be caused by invalid or extraneous data,Playback the latest triggered events using the history function. Segmented memory collection will store trigger events into multiple (Up to 80,000) memory segments, each segment will store triggeredwaveforms and timestamp of each frame.1 M point used to calculate the FFTHardware-Based High Speed Pass/ Fail functionThe SDS1000X-E utilizes a hardware-based Pass/Fail function, performing up to 40,000 Pass / Fail decisions each second. Easily generate userfor long-term signal monitoring or automated production line testing.The new math co-processor enables FFT analysis of incoming signals using up to 1 M samples per waveform. This provides high frequency resolution with a fast refresh rate. The FFT function also supports a variety of window functions so that it can adapt to different spectrum measurement needs. Four-channel series support Peaks, Markers, a variety of numbers.SDS1000X-E Series Digital OscilloscopeSearch and Navigate (four channel series only)Customizable Default Key 16 Digital Channels/MSO (four channel series only, option)The current parameters of the oscilloscope can be preset to Default Keythrough the Save menu.Bode Plot (four channel series only)SDS1000X-E can control the USB AWG module or control an independent SIGLENT SDG instrument, scan a devices amplitude and phase frequency response, and display the data as a Bode Plot. There is also a Vari-level Mode for accurately measuring Power Supply Control Loop Response (PSRR). It can also show the result lists, and exportthe data to a USB disk.16 digital channels enables users to acquire and trigger on thewaveforms then analyze the pattern, simultaneously with one instrument.SDS1000X-E Series Digital OscilloscopeUSB WIFI Adapter (four channel series only, option)USB 25 MHzAWGModule (fourchannel series only, option)Real-time update screen in web page (four channel Web control (four channel series only)WiFi control of instrumentation can provide a convenient and safe method of configuring and collecting data. This new feature works with a SIGLENT approved WiFi adapter to provide wireless control and communications with SIGLENT 4 channel scopes. The adapter must be supplied by Siglent to ensure working.The four channel series supports a USB 25 MHz function/arbitrary waveform generator that is operated from the USB host connection. Functions include Sine, Square, Ramp, Pulse, Noise, DC and 45 built-in waveforms. The arbitrary waveforms can be accessed and edited by the SIGLENT EasyWave PC software.With 100 Mbps LAN connection, the web page can update the waveforms at a rate of up to 10 times/s. The new information on SDS1000X-E can be updated to web page in real-time, including waveform data and measurements. When viewed on a PC, the screen can be displayed in full screen mode. With this feature and a PC VGA interface, you can easily use a projector or other video display device to deliver the With the new embedded web server, users can control the SDS1xx4X-E USB WIFI Adapterfrom a simple web page. This provides wonderful remote troubleshooting and monitoring capabilities. The web page has PC and mobile styles that include an embedded virtual control panelscreen information to a larger audience.SDS1000X-E Series Digital OscilloscopeComplete ConnectivitySDS1000X -E supports USB Host, USB Device (USB -TMC), LAN(VXI -11), Pass/Fail and Trigger OutBack panel of the four channel seriesBack panel of the two channel seriesSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital OscilloscopeSDS1000X-E Series Digital Oscilloscope Probes and AccessoriesFacebook: SiglentTech。

版本号：A/01压敏电阻承认书APPROVED SHEET FOR VARISTOR规格型号Part No.HEL 14D751K级别Class K 普通型 K SeriesUL认证号UL File No.E324904CSA认证号CSA File No.215101VDE认证号VDE File No.40037512CQC认证号CQC File No.CQC04001010845 (5D)CQC04001010847 (7D)CQC04001010846 (10D)CQC04001010844 (14D)CQC04001010848 (20D)(各规格压敏电阻对应的安规认证参见本承认书第14页)广东鸿志电子科技有限公司地址：广东省汕头市龙湖区浦江路6号GUANGDONG HONGZHI ELECTRONICS TECHNOLOGY CO., LTD.No.6 Pujiang Rd., Longhu district, Shantou City, Guangdong Province, China TEL: +86-754-88831426 ext. 0 / +86-754-88784177 / +86-754-89659651FAX: +86-754-88888417E-mail:*****************/****************一、 特殊要求和变更记录 (3)二、 HEL产品规格型号说明 (4)三、 尺寸和电性能 (5)四、 产品结构、材料及制造工艺流程 (6)五、 浪涌电流冲击级别 (7)六、 脉冲降额曲线图和伏安特性图、温度降额曲线 (8)七、 HEL压敏电阻技术术语及安全可靠性…………………………………………………… 9～13八、 安规认证 (14)九、 包装方法及储存条件…………………………………………………………………… 15～18十、 使用注意事项....................................................................................... 19～21十一、附录1：关于压敏电阻不同标准中浪涌冲击条款的简要说明 (22)十二、附录2：压敏电阻选型原则与方法 (23)十三、附录3：第三方检测报告……………………………………………………………… 24～37十四、附录：体系证书 (38)（承认书其它页内容与此表不一致时，以此表为准）HEL产品规格型号说明产品外型尺寸和电性能一、产品尺寸二、产品电性能型号规格压敏电压最大允许使用电压最大限制电压通流容量静态功率能量耐量静态电容量（参考值）V1mA(V)AC(V)DC(V)V50A(V)Imax(8/20μs)(A)In(15次)(8/20μs)(A)（W）(10/1000μs)（J）1kHz(PF)HEL 14D751K750（675～825）4606151,24045003,0000.6158260产品结构、材料及制造工艺流程（一）产品结构图（二）材料（三）制造工艺流程材料主要成分 化学式CAS No.瓷片ZnO, Bi 2O 3, Co 2O 3等1314-13-2内电极金属导电材料/焊锡Sn, Ag,Cu 7440-31-5导线Fe, Cu,Sn7439-89-63包封层环氧树脂C 21H 24O 4或有机硅树脂H 4Si9003-36-5 / 67763-03-5浪涌电流冲击级别Remark: the Impluse voltage testing standards(1.2/50μs) with 40 times are only applicable to the products whichwith the varistor voltage more than 430V.脉冲降额曲线图和伏安特性图温度降额曲线最大连续交流电压或最大连续直流电压降额曲线安规认证包装方法及储存条件 Packaging methods and storage conditions 一、编带包装方法 Taping Packaging Method（一）插件编带包装方式 Plug-in taping packaging method外箱尺寸Carton size：540mm×350mm×300mm注：内盒*即为最小包装Note:The inner box packing is the smallest package（二）平脚编带包装方式 Flat foot taping packaging外箱尺寸 Carton size：355mm×350mm×365mmNote:The Reel packing is the smallest package二、散装包装方式 Bulk Packin外箱尺寸 Carton size：435mm×280mm×200mm注：内盒*即为最小包装Note:The inner box packing is the smallest package三、储存条件 storage conditions储存条件 Storage conditions温度 temperature: -40℃～+125℃湿度 humidity: < 65%RH推荐条件 Recommended storage conditions温度 temperature:-10℃～+45℃湿度 humidity: < 55%RH插件编带尺寸 Plug-in Tape Packing平脚编带尺寸 Flat Knitting Tape Packing使用注意事项 Precautions for use附录1：关于压敏电阻不同标准中浪涌冲击条款的简要说明附录2：压敏电阻选型原则与方法附录3：第三方检测报告（一）赛宝实验室年度确认检测报告 完整版（二）国网检测报告 封面(完整版共28页）（三）RoHS测试报告 首页(完整版共7页）（四）Reach测试报告 首页(完整版共19页）（需要详细报告请与业务员联系）（需要详细报告请与业务员联系）（需要详细报告请与业务员联系）（需要详细报告请与业务员联系）（需要详细报告请与业务员联系）（需要详细报告请与业务员联系）附录4：体系证书。

第三方信息由 Dell EMC 提供给您。

用户指南光纤信道适配器QLE2740-DEL 、QLE2740L-DEL 、QLE2742-DEL 、QLE2742L-DEL和 QME2742-DEL用户指南—光纤信道适配器QLE274x-DEL, QLE274x L-DEL, QME2742-DEL文档修订历史修订版 A，2016 年 3 月 21 日修订版 B，2016 年 4 月 19 日修订版 C，2017 年 2 月 1 日修订版 D，2017 年 8 月 24 日修订版 E，2017 年 12 月 19 日修订版 F，2018 年 4 月 13 日更改受影响的章节添加了对 QME2742-DEL 32Gb 光纤信道夹层卡的整篇文档支持添加了对 Windows 2008 R2 SP1 的支持第 xii 页上“Windows”添加了对 RHEL7.5, SLES 15 的支持；删除了对第 xii 页上“Linux”RHEL 6.6, 6.9, 7.2, 7.3 和 SLES 11 SP4 的支持添加了对 ESXi 6.5 U2 和 ESXi 6.7 的支持第 xiii 页上“VMware”添加了 ESXi 6.7第 14 页上“安装 ESXi 6.7, 6.5 和 6.0 U2 光纤信道驱动程序”第 15 页上“使用 esxcli 为现有 ESXi 6.7, 6.5 或 6.0U2/U3 更新现有驱动程序或安装新驱动程序”第 23 页上“在 ESXi 6.7, 6.5 或 6.0 U2/U3 主机上安装 CIM 提供程序”添加了 SLES 15第 13 页上“构建 SLES 12 和 SLES 15 的驱动程序”添加了VM-ID 配置第 28 页上“配置 VM-ID”更新了从 Cavium 网站下载 Superinstaller 的说明。

第 109 页上“通过 Cavium 网站安装代理”目录简介读者对象. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .viii用户指南的内容 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .viii相关材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ix说明文件惯例 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ix功能与特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi 功能说明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi主要功能 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xii支持的操作系统. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiiWindows. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiiLinux. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiiVMware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiiiCitrix XenServer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii1硬件安装硬件和软件要求 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1安全预防措施 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1安装前检查表 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2PCIe 总线插槽注意事项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2安装适配器. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3连接到 SAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2驱动程序安装和配置Windows 驱动程序安装和配置. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4在 GUI 中运行 Dell Update Package. . . . . . . . . . . . . . . . . . . . . . . . . .5从命令行运行 Dell Update Package . . . . . . . . . . . . . . . . . . . . . . . . . .10示例 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Linux 驱动程序安装和配置. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11安装概览 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11安装 Linux 光纤信道驱动程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11构建 7.x的驱动程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12构建 SLES 12 和 SLES 15 的驱动程序 . . . . . . . . . . . . . . . . . . .13VMware 驱动程序安装和配置. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14安装概览 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14安装 ESXi 6.7, 6.5 和 6.0 U2 光纤信道驱动程序. . . . . . . . . . . . . . . . .14使用 esxcli 为现有 ESXi 6.7, 6.5 或 6.0 U2/U3 更新现有驱动程序或安装新驱动程序. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15验证已安装的驱动程序的版本. . . . . . . . . . . . . . . . . . . . . . . . . . .15安装 QConvergeConsole VMware vCenter Server 插件. . . . . . . . . . .16安装软件包的内容. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16安装 QConvergeConsole VMware vCenter Server 插件 . . . . . .17注销手动安装的插件. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22卸载 QConvergeConsole VMware vCenter Server 插件 . . . . . .22安装 QLogic 适配器 CIM 提供程序. . . . . . . . . . . . . . . . . . . . . . .23卸载 QLogic 适配器 CIM 提供程序. . . . . . . . . . . . . . . . . . . . . . .26安装. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27卸载 QConvergeConsole VMware vCenter Server 插件 . . . . . .28配置 VM-ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .283光纤信道配置更新 Dell 固件. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30通过双击运行固件更新 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30从命令行运行固件更新 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32使用Fast!UTIL 进行自定义配置. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33配置设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34适配器设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34可选引导设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36还原默认设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37原始 NVRAM 数据 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37高级适配器设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37扫描光纤设备. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39光纤磁盘公用程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39环回数据测试. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39选择适配器. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39退出Fast!UTIL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39设置光纤信道适配器参数 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40使用 QConvergeConsole GUI 设置光纤信道适配器参数. . . . . . . . . . .40使用交互式 QConvergeConsole CLI 设置光纤信道适配器参数. . . . . .40使用非交互式 QConvergeConsole CLI 设置光纤信道适配器参数. . . .40配置目标持久性绑定. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41使用 QConvergeConsole GUI 配置持久性绑定. . . . . . . . . . . . . . . . . .41使用交互式 QConvergeConsole CLI 配置持久性绑定. . . . . . . . . . . . .42使用非交互式 QConvergeConsole CLI 配置持久性绑定 . . . . . . . . . . .42配置引导设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42使用 QConvergeConsole GUI 配置引导设备. . . . . . . . . . . . . . . . . . . .43使用交互式 QConvergeConsole CLI 配置引导设备. . . . . . . . . . . . . . .43使用非交互式 QConvergeConsole CLI 配置引导设备. . . . . . . . . . . . .43使用 BIOS 配置引导设备. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43配置虚拟端口 (NPIV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44使用 QConvergeConsole GUI 配置 NPIV . . . . . . . . . . . . . . . . . . . . . .44使用交互式 QConvergeConsole CLI 配置 NPIV . . . . . . . . . . . . . . . . .44使用非交互式 QConvergeConsole CLI 配置 NPIV . . . . . . . . . . . . . . .44配置 NPIV 服务质量. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45按带宽设置 QoS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46按优先级设置 QoS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48配置光纤信道驱动程序参数 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49使用 QConvergeConsole GUI 配置光纤信道驱动程序参数. . . . . . . . .50使用交互式 QConvergeConsole CLI 配置光纤信道驱动程序参数. . . .50使用非交互式 QConvergeConsole CLI 配置光纤信道驱动程序参数. . .50使用 QConvergeConsole VMware vCenter Server 插件配置光纤信道驱动程序参数 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51配置选择性 LUN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51配置 OoOFR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51使用 QCC GUI 配置 OoOFR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51使用交互式 QCC CLI 配置 OoOFR. . . . . . . . . . . . . . . . . . . . . . . . . . .51使用非交互式 QCC CLI 配置 OoOFR . . . . . . . . . . . . . . . . . . . . . . . . .52配置 UEFI 驱动程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52设置 FA-PWWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59从适配器设置 FA-PWWN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59使用 QConvergeConsole GUI 设置 FA-PWWN . . . . . . . . . . . . .60使用 QConvergeConsole CLI 设置 FA-PWWN. . . . . . . . . . . . . .61使用 QConvergeConsole VMware 插件设置 FA-PWWN . . . . . .63从 Brocade 交换机设置 FA-PWWN. . . . . . . . . . . . . . . . . . . . . . . . . . .64从交换机设置 FA-PWWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64从交换机设置静态 FA-PWWN . . . . . . . . . . . . . . . . . . . . . . . . . .64配置和验证 FA-BLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65从适配器配置 FA-BLD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65使用 QConvergeConsole GUI 启用主机总线适配器端口 BIOS和结构分配的引导 LUN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65使用 QConvergeConsole CLI 配置适配器和引导设备 . . . . . . . .67在 Brocade 交换机中配置一个区域. . . . . . . . . . . . . . . . . . . . . . .68验证 FA-BLD 是否正常工作. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69适配器端限制. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70使用结构分配的引导 LUN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71在 QConvergeConsole GUI 中使用结构分配的引导 LUN . . . . . . . . . .71在交互式 QConvergeConsole CLI 中使用结构分配的引导 LUN . . . . .71使用非交互式 QConvergeConsole CLI 来采用结构分配的引导 LUN. . .71使用 QConvergeConsole 插件来采用结构分配的引导 LUN . . . . . . . .72运行诊断 — 光纤信道 Ping 和路由追踪 . . . . . . . . . . . . . . . . . . . . . . . . . . . .73使用拓扑地图 Ping 和查看路由踪迹 . . . . . . . . . . . . . . . . . . . . . . . . . .73运行光纤信道 CT Ping 测试. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74从 QConvergeConsole GUI 运行光纤信道 CT Ping. . . . . . . . . .74从 QConvergeConsole CLI 运行光纤信道 CT Ping . . . . . . . . . .75从 QConvergeConsole VMware 插件运行光纤信道 CT Ping. . .76光纤信道路由追踪 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76配置 CS_CTL QoS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78 CS_CTL QoS 功能 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78为启动器和目标端口启用 CS_CTL QoS 模式 . . . . . . . . . . . . . . . . . . .79为每个端口验证及确认 CS_CTL 模式设置 . . . . . . . . . . . . . . . . . . . . .79在 QConvergeConsole GUI 中从适配器的端口创建虚拟端口 . . . . . . .79在 QConvergeConsole GUI 中设置虚拟端口的 QoS 优先级. . . . . . . .81配置端对端 CS_CTL QoS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81在交换机上配置 CS_CTL QoS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82在存储设备上配置 CS_CTL QoS. . . . . . . . . . . . . . . . . . . . . . . . . . . . .83更改 QoS 优先级. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83在 Windows 中更改优先级 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83在 VMware ESXi 中更改优先级 . . . . . . . . . . . . . . . . . . . . . . . . .85配置 FDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 Brocade 交换机 FOS CLI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 Brocade 结构特性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89 FDMI 增强支持 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90启用 QLogic 前向纠错 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91 FEC 流程概览 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91启用 QLogic FEC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92运行扩展链路服务命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93链路电缆信号灯扩展链路服务命令 . . . . . . . . . . . . . . . . . . . . . . . . . . .93读取诊断参数扩展链路服务命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93A故障排除光纤信道诊断 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96使用 QConvergeConsole GUI 的光纤信道诊断. . . . . . . . . . . . . . . . . .96使用交互式 QConvergeConsole CLI 的光纤信道诊断. . . . . . . . . . . . .98使用非交互式 QConvergeConsole CLI 的光纤信道诊断 . . . . . . . . . . .98光纤信道故障排除流程图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99使用诊断端口 (D_Port) 进行故障排除. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100在 Brocade 光纤信道 16G 或 32G 交换机上配置 D_Port . . . . . . . . . .101从 Brocade 光纤信道 16G 或 32G 交换机检查 D_Port 结果 . . . . . . . .102使用 QConvergeConsole GUI 验证 D_Port 模式. . . . . . . . . . . . . . . . .103使用交互式 QConvergeConsole CLI 验证 D_Port 模式. . . . . . . . . . . .104使用非交互式 QConvergeConsole CLI 验证 D_Port 模式. . . . . . . . . .104使用 QConvergeConsole 插件验证 D_Port 模式. . . . . . . . . . . . . . . . .105B规格物理特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106电源要求. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106标准规格. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107接口规格. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107环境规格. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107 C QConvergeConsole GUIQConvergeConsole GUI 简介 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108下载 QConvergeConsole 说明文件 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109下载与安装管理代理. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109通过 Cavium 网站安装代理 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109使用内置代理安装程序来安装代理 . . . . . . . . . . . . . . . . . . . . . . . . . . .110安装 QConvergeConsole GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110在 Windows 环境下安装 QConvergeConsole . . . . . . . . . . . . . . . . . . .110在 Linux 环境下安装 QConvergeConsole . . . . . . . . . . . . . . . . . . . . . .111以无提示模式安装 QConvergeConsole. . . . . . . . . . . . . . . . . . . . . . . .113 QConvergeConsole 帮助系统的内容 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113D规章信息保修 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115规章和符合性信息. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115激光安全, FDA 公告 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115机构认证 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116EMI 和 EMC 要求. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116产品安全符合性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117简介本介绍章节提供了所涵盖模型的列表，介绍了本指南的目标受众和内容，列出了相关文档和文档约定，介绍了产品的功能和特性，并且列出了支持的操作系统。