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SPECIFICA TIONSNI cDAQ™-91844-Slot, Ethernet CompactDAQ ChassisDefinitionsWarranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.•Typical specifications describe the expected performance met by a majority of the models.•Nominal specifications describe parameters and attributes that may be useful in operation. Specifications are Typical unless otherwise noted.ConditionsSpecifications are valid at 25 °C unless otherwise noted.Analog InputInput FIFO size127 samples per slotMaximum sample rate1Determined by the C Series module or modules Timing accuracy250 ppm of sample rateTiming resolution212.5 nsNumber of channels supported Determined by the C Series module or modules 1Performance dependent on type of installed C Series module and number of channels in the task.2Does not include group delay. For more information, refer to the documentation for each C Series module.Analog OutputNumber of channels supportedHardware-timed taskOnboard regeneration16Non-regeneration Determined by the C Series module or modules Non-hardware-timed task Determined by the C Series module or modules Maximum update rateOnboard regeneration 1.6 MS/s (multi-channel, aggregate)Non-regeneration Determined by the C Series module or modules Timing accuracy50 ppm of sample rateTiming resolution12.5 nsOutput FIFO sizeOnboard regeneration8,191 samples shared among channels used Non-regeneration127 samples per slotAO waveform modes Non-periodic waveform,periodic waveform regeneration mode fromonboard memory,periodic waveform regeneration from hostbuffer including dynamic updateDigital Waveform CharacteristicsWaveform acquisition (DI) FIFOParallel modules511 samples per slotSerial modules63 samples per slotWaveform generation (DO) FIFOParallel modules2,047 samples per slotSerial modules63 samples per slotDigital input sample clock frequencyStreaming to application memory System-dependentFinite0 MHz to 10 MHz2| | NI cDAQ-9184 SpecificationsDigital output sample clock frequencyStreaming from application memory System-dependentRegeneration from FIFO0 MHz to 10 MHzFinite0 MHz to 10 MHzTiming accuracy50 ppmGeneral-Purpose Counters/TimersNumber of counters/timers4Resolution32 bitsCounter measurements Edge counting, pulse, semi-period, period,two-edge separation, pulse widthPosition measurements X1, X2, X4 quadrature encoding withChannel Z reloading; two-pulse encoding Output applications Pulse, pulse train with dynamic updates,frequency division, equivalent time sampling Internal base clocks80 MHz, 20 MHz, 100 kHzExternal base clock frequency0 MHz to 20 MHzBase clock accuracy50 ppmOutput frequency0 MHz to 20 MHzInputs Gate, Source, HW_Arm, Aux, A, B, Z,Up_DownRouting options for inputs Any module PFI, analog trigger, many internalsignalsFIFO Dedicated 127-sample FIFOFrequency GeneratorNumber of channels1Base clocks20 MHz, 10 MHz, 100 kHzDivisors 1 to 16 (integers)Base clock accuracy50 ppmOutput Any module PFI terminalNI cDAQ-9184 Specifications| © National Instruments| 3Module PFI CharacteristicsFunctionality Static digital input, static digital output, timinginput, and timing outputTiming output sources3Many analog input, analog output, counter,digital input, and digital output timing signals Timing input frequency0 MHz to 20 MHzTiming output frequency0 MHz to 20 MHzDigital TriggersSource Any module PFI terminalPolarity Software-selectable for most signalsAnalog input function Start Trigger, Reference Trigger,Pause Trigger, Sample Clock,Sample Clock TimebaseAnalog output function Start Trigger, Pause Trigger, Sample Clock,Sample Clock TimebaseCounter/timer function Gate, Source, HW_Arm, Aux, A, B, Z,Up_DownModule I/O StatesAt power-on Module-dependent. Refer to the documentationfor each C Series module.Network InterfaceNetwork protocols TCP/IP, UDPNetwork ports used HTTP:80 (configuration only), TCP:3580;UDP:5353 (configuration only), TCP:5353(configuration only); TCP:31415; UDP:7865(configuration only), UDP:8473 (configurationonly)Network IP configuration DHCP + Link-Local, DHCP, Static,Link-Local3Actual available signals are dependent on type of installed C Series module.4| | NI cDAQ-9184 SpecificationsHigh-performance data streams7Data stream types available Analog input, analog output, digital input,digital output, counter/timer input,counter/timer output, NI-XNET4Default MTU size1500 bytesJumbo frame support Up to 9000 bytesEthernetNetwork interface1000 Base-TX, full-duplex; 1000 Base-TX,half-duplex; 100 Base-TX, full-duplex;100 Base-TX, half-duplex; 10 Base-T,full-duplex; 10 Base-T, half-duplex Communication rates10/100/1000 Mbps, auto-negotiated Maximum cabling distance100 m/segmentPower RequirementsCaution The protection provided by the NI cDAQ-9184 chassis can be impaired ifit is used in a manner not described in the NI cDAQ-9181/9184/9188/9191 UserManual.Note Some C Series modules have additional power requirements. For moreinformation about C Series module power requirements, refer to the documentationfor each C Series module.Note Sleep mode for C Series modules is not supported in the NI cDAQ-9184.V oltage input range9 V to 30 VMaximum power consumption515 W4When a session is active, CAN or LIN (NI-XNET) C Series modules use a total of two data streams regardless of the number of NI-XNET modules in the chassis.5Includes maximum 1 W module load per slot across rated temperature and product variations.NI cDAQ-9184 Specifications| © National Instruments| 5Note The maximum power consumption specification is based on a fully populatedsystem running a high-stress application at elevated ambient temperature and withall C Series modules consuming the maximum allowed power.Power input connector 2 positions 3.5 mm pitch mini-combicon screwterminal with screw flanges, SauroCTMH020F8-0N001Power input mating connector Sauro CTF020V8, Phoenix Contact 1714977,or equivalentPhysical CharacteristicsWeight (unloaded)Approximately 643 g (22.7 oz)Dimensions (unloaded)178.1 mm × 88.1 mm × 64.3 mm(7.01 in. × 3.47 in. × 2.53 in.) Refer to thefollowing figure.Screw-terminal wiringGauge0.5 mm 2 to 2.1 mm2 (20 AWG to 14 AWG)copper conductor wireWire strip length 6 mm (0.24 in.) of insulation stripped from theendTemperature rating85 °CTorque for screw terminals0.20 N · m to 0.25 N · m (1.8 lb · in. to2.2 lb · in.)Wires per screw terminal One wire per screw terminalConnector securementSecurement type Screw flanges providedTorque for screw flanges0.20 N · m to 0.25 N · m (1.8 lb · in. to2.2 lb · in.)If you need to clean the chassis, wipe it with a dry towel.6| | NI cDAQ-9184 SpecificationsFigure 1. NI cDAQ-9184 Dimensions30.6 mm 47.2 mm Safety VoltagesConnect only voltages that are within these limits.V terminal to C terminal30 V maximum, Measurement Category IMeasurement Category I is for measurements performed on circuits not directly connected to the electrical distribution system referred to as MAINS voltage. MAINS is a hazardous liveNI cDAQ-9184 Specifications | © National Instruments | 7electrical supply system that powers equipment. This category is for measurements of voltages from specially protected secondary circuits. Such voltage measurements include signal levels, special equipment, limited-energy parts of equipment, circuits powered by regulatedlow-voltage sources, and electronics.Caution Do not connect the system to signals or use for measurements withinMeasurement Categories II, III, or IV.Note Measurement Categories CAT I and CAT O (Other) are equivalent. These testand measurement circuits are not intended for direct connection to the MAINsbuilding installations of Measurement Categories CAT II, CAT III, or CAT IV.Environmental-20 °C to 55 °C6Operating temperature (IEC 60068-2-1and IEC 60068-2-2)Caution To maintain product performance and accuracy specifications when theambient temperature is between 45 and 55 °C, you must mount the chassishorizontally to a metal panel or surface using the screw holes or the panel mount kit.Measure the ambient temperature at each side of the CompactDAQ system 63.5 mm(2.5 in.) from the side and 25.4 mm (1.0 in.) from the rear cover of the system. Forfurther information about mounting configurations, go to /info and enterthe Info Code cdaqmounting.-40 °C to 85 °CStorage temperature (IEC 60068-2-1 andIEC 60068-2-2)Ingress protection IP 30Operating humidity (IEC 60068-2-56)10% to 90% RH, noncondensingStorage humidity (IEC 60068-2-56)5% to 95% RH, noncondensingPollution Degree (IEC 60664)2Maximum altitude5,000 mIndoor use only.6When operating the NI cDAQ-9184 in temperatures below 0 °C, you must use the PS-15 powersupply or another power supply rated for below 0 °C.8| | NI cDAQ-9184 SpecificationsHazardous LocationsU.S. (UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, AEx nA IIC T4Canada (C-UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, Ex nA IIC T4Europe (ATEX) and International (IECEx)Ex nA IIC T4 GcShock and VibrationTo meet these specifications, you must direct mount the NI cDAQ-9184 system and affix ferrules to the ends of the terminal lines.Operational shock30 g peak, half-sine, 11 ms pulse (Tested inaccordance with IEC 60068-2-27. Test profiledeveloped in accordance withMIL-PRF-28800F.)Random vibrationOperating 5 Hz to 500 Hz, 0.3 g rmsNon-operating 5 Hz to 500 Hz, 2.4 g rms (Tested in accordancewith IEC 60068-2-64. Non-operating testprofile exceeds the requirements ofMIL PRF-28800F, Class 3.)Safety and Hazardous Locations StandardsThis product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1, CSA C22.2 No. 61010-1•EN 60079-0:2012, EN 60079-15:2010•IEC 60079-0: Ed 6, IEC 60079-15; Ed 4•UL 60079-0; Ed 6, UL 60079-15; Ed 4•CSA 60079-0:2011, CSA 60079-15:2012Note For UL and other safety certifications, refer to the product label or the OnlineProduct Certification section.NI cDAQ-9184 Specifications| © National Instruments| 9Electromagnetic CompatibilityThis product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:•EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity•EN 55011 (CISPR 11): Group 1, Class A emissions•EN 55022 (CISPR 22): Class A emissions•EN 55024 (CISPR 24): Immunity•AS/NZS CISPR 11: Group 1, Class A emissions•AS/NZS CISPR 22: Class A emissions•FCC 47 CFR Part 15B: Class A emissions•ICES-001: Class A emissionsNote In the United States (per FCC 47 CFR), Class A equipment is intended foruse in commercial, light-industrial, and heavy-industrial locations. In Europe,Canada, Australia and New Zealand (per CISPR 11) Class A equipment is intendedfor use only in heavy-industrial locations.Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medicalequipment that does not intentionally generate radio frequency energy for thetreatment of material or inspection/analysis purposes.Note For EMC declarations and certifications, and additional information, refer tothe Online Product Certification section.CE ComplianceThis product meets the essential requirements of applicable European Directives, as follows:•2014/35/EU; Low-V oltage Directive (safety)•2014/30/EU; Electromagnetic Compatibility Directive (EMC)•2014/34/EU; Potentially Explosive Atmospheres (ATEX)Online Product CertificationRefer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit / certification, search by model number or product line, and click the appropriate link in the Certification column.10| | NI cDAQ-9184 SpecificationsEnvironmental ManagementNI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.For additional environmental information, refer to the Minimize Our Environmental Impact web page at /environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.Waste Electrical and Electronic Equipment (WEEE) EU Customers At the end of the product life cycle, all NI products must bedisposed of according to local laws and regulations. For more information abouthow to recycle NI products in your region, visit /environment/weee.电子信息产品污染控制管理办法（中国RoHS）中国客户National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。

Performance Guide for ViDi18-Mar-2019 16:11:24 EDTThinking about PerformanceTool and stream processing timeThroughputPerformance ToolkitApplication DesignTool ParametersNVIDIA GPU Selection and ConfigurationNVIDIA Device Branding SummaryGraphics Card RequirementsConsiderationsEstimating Run-Time PerformanceGlossary of Standard NVIDIA GPU TerminologyMultiple GPUsSystem Configuration for Multi-GPU SystemsWhat About Training Time?Thinking about PerformanceWhat performance aspect is important to you?Tool and stream processing timeIndividual tool processing time is shown in the Database Overview panel:averageThe reported time is the processing time for all of the images processed during the most recent processing.The processing time for a stream containing multiple tools is not available through the ViDi Suite GUI, and you cannot estimate it by summing the tool execution time, as it includes the time required to prepare and transmit view information between tools.When thinking about stream processing, remember that the processing of tools in a ViDi stream is always serialized when you call Stream. Process()Tool.Process() . Only one tool is ever processed at a time unless you explicitly process tools individually using .ThroughputThroughput refers to the total number of images that can be processed per unit time. If your application can process multiple streams concurrently using different threads, it may be able to improve system throughput, although individual tool processing will be slower.Performance ToolkitIn terms of increasing expense (but not efficacy):Application designTool parametersSystem configurationHardware optionsMultiple GPUsApplication DesignThe following table summarizes application design characteristics that may produce faster run-time performance. Application design choices that improve performance typically have minimal impact on the behavior of the system.Design Pattern Why it's Faster Best Bang for Buck But Watch Out ForUse a small number of tools per stream.The processing time for a singleViDi tool does vary significantlynotbased on the amount of informationthat the tool returns.For example, a single Blue tool thatis trained to find 100 differentfeatures runs at the same speed asa tool that is trained to find only asingle feature. Further, the numberof features returned makes only aminimal speed difference.Similarly, a Red tool runs at thesame speed regardless of howmany defects it finds, and a Greentool can classify into 2 classes or2000 classes at the same speed.Start building your application with asingle tool.Avoiding Image Conversions During tool operation, the imagemust be sampled for processing bythe neural network. This samplingrequires a raster (uncompressed)format image such as a bitmap.Performing this conversion takestime.Similarly, if the tool is configured touse a single-channel (grey-scale)image as input, but the suppliedimages are multi-channel colorimages, the luminance value mustbe computed for each image at runtime.Attempt to solve your applicationusing a single-channel grey-scaleimage.Some applications require colorinformation.Reduce the amount of processed data Reducing the number of processeddata by:Using a smaller ROIUsing a maskUsing as few image channels aspossibleImproves processing speed byreducing the total amount of dataprocessed.Restricted ROI ViDi tools need contextualinformation to work well – don'tconstrain the ROI too much.Downsampling is usually not needed– selecting a larger feature size canimprove speed and remove theneed for run-time downsampling.Multi-threading On systems with multiple GPUs,processing multiple streamsconcurrently allows tools to executein parallel, increasing throughput.On single-GPU systems, you canconfigure the system to allowmultiple processes to make use ofthe same GPU. This allows a higherGPU occupancy and can improvethroughput, although tool executiontime will e the --max-process-countcommand line argument to enablemultiple threads to access a singleGPU.To enable multi-process GPUaccess for a runtime applicationusing the local control's GlobalConfimethod:g()control.GlobalConfig("max_process_count=2");Processing time for an individual toolwill increase.C++ (unmanaged)Use of an unmanaged languageenvironment reduces the impact ofsystem activity on tool execution.For low-latency, high-performanceapplications, use the C++ API.Windows is not a RTOSTool ParametersTool parameter choices directly effect tool execution speed, but there is typically a tradeoff between tool speed and accuracy or robustness. Tool Parameter How it Affects Speed Best Bang for Buck But Watch Out ForFeature size At run time, ViDi tools need tosample the entire input image. Thefeature size determines the numberof samples required for a givenimage size. The larger the featuresize, the fewer the samples.O(n)2 increase in speed with largerfeature size.Larger feature sizes may cause thetool to miss features or defects.Use parameter optimization to findan optimal size.Sampling Density Similarly to feature size, thesampling density determines thenumber of samples required for agiven image size.O(n)2 increase in speed with lowersampling density.Risk of missing features or defects.Refinement Parameters The Blue and Red tools includeprocessing-time parameters thatprovide more accurate results at thecost of increasing execution time:Blue tool: PrecisionRed tool: Iterations Increasing the iteration value increases processing time linearly.Low-precision mode If your system meets certain specificrequirements (CUDA ComputeCapability 6.1 or greater), you canenable mlow-precision processingode for any ViDi tool.Enabling low-precision modeconverts any existing trained tool touse low-precision computationduring processing, and it generateslow-precision tools for all futuretraining operations until it isdisabled. (Once a tool has beenconverted to low-precision mode, itmust be retrained to disable low-precision mode.Low-precision tools can executefrom 25% to as much as 50% fasterthan normal-precision tools.Additional run-time speedimprovements for low-precision toolsare seen on systems with TuringTensor cores.Changing a tool to low-precisionmode may change the results thetool produces to a small degree.Generally high-level featureidentification, defect classification,and general classification will beunchanged, but specific feature anddefect regions and scores maychange slightly.NVIDIA GPU Selection and ConfigurationSystem configuration choices directly affect tool processing speed without affecting tool accuracy or behavior. They are the most expensive and hardest to predict the effect of.Configuration Option Why it's Faster Best Bang for Buck But Watch Out ForNVIDIA Device Type The number of CUDA cores isdirectly related to high-precisionprocessing speed and training.The number of standard Tensorcores is directly related toprocessing speed and trainingspeed.The number of Tensor coresTuringis related to processing speed in low-precision mode only. These coresdo not affect standard precisionprocessing or training speed.NVIDIA Driver ModeConsumer-grade gaming-oriented NVIDIA devices only support the WDDM device driver model. This driver is intended to supportgraphics display, not computation.Professional-grade NVIDIA cards support the TCC driver mode, which provides better performance and stability.Select a Quadro or Tesla (or selected Titan)-branded NVIDIA card.If using a GeForce-branded card, be aware that NVIDIA Geforce drivers are updated frequently and may not be compatible with ViDi. Please visit Cognex's support page for driver recommendations.Using TCC mode driver prevents the use of Video output on the GPU card; use onboard video instead.Optimized memoryViDi optimized memory, which is enabled by default, improves performance by overriding the standard NVIDA GPU memory management system.Make sure your card has at least 4GB of GPU memory.Performance improvement is not as significant for cards using the TCC driver.NVIDIA Device Branding SummaryThe following table summarizes the different NVIDIA device types.Class ConsumerProfessionalBrandingGeForceTitanQuadroTeslaVolta Architecture Cards ---Titan V GV100V100Pascal Architecture Cards GTX 1xxx Titan Xp G/GPxxx P100Turing Architecture Cards RTX 2xxx Titan RTX Quadro RTX4xxx T4Video Output Yes Yes Yes ---Price Point$1K $3K $5K $5K+TCC Driver Support --- Yes Yes Yes ECC Memory ------ YesYes Tensor CoresRTX2xxx and newer:Yes Titan V :Yes Titan RTX:Yes Quadro RTX :Yes Quadro GV100:Yes V100:Yes T4:Yes Graphics Card RequirementsNVIDIA® CUDA® enabled GPUCUDA compute capability 3.0 or higherConsiderationsWhile consumer cards and professional cards perform similarly, some considerations should be made:Heat dissipationProfessional cards are intended for continuous duty cycle use and are designed to dissipate heat effectively.SupplyProfessional cards are manufactured by NVIDIA and have a longer product cycle.Performance and ControlProfessional cards support the TCC mode drivers. This allows the GPU to run as a computing device with no display output.This means you will need a second card for display (or use the motherboard's built-in display).Estimating Run-Time PerformanceThe following numbers are an approximate guide to the potential performance increment for different card families (baseline = non-run-time TensorCore, standard mode):ViDi Operating Mode No Tensor Cores (ex GTX)Volta Tensor Cores (ex V100)Turing Tensor Cores (ex T4)Standard 100%150%150%Low-precision125%125%175%Glossary of Standard NVIDIA GPU TerminologyTerm What it isIs it important?CUDA CoreStandard NVIDIA parallel processing unit.Yes . This is the 'standard' measure of NVIDIA GPU processing – the number of CUDA cores. The more cores, the faster the ViDi processing and training.ECC Memory Error-correcting-code memoryHardware support for verifying that memory reads/writes do not contain errors.No Because of the huge number of computations involved in training andprocessing neural networks, the likelihood of a memory error affecting a tool result is very low.TCC Tesla Compute Cluster (Driver).A high-performance driver that is optimized for computational use of an NVIDIA GPU.Not supported by all cardsDisables video output from the card Provides faster training and runtime performanceDiminishes or eliminates the advantages of using ViDi optimized memoryConfigured using the nvdia-smi utilityYes . Whenever possible, customers should select cards that support the TCC driver mode, and they should enable the mode.Tensor CoreFull-precision, mixed-precision (and evt. integer math) parallel processing unit dedicated to matrix multiply operations.Yes . Starting with ViDi 3.2, ViDiautomatically takes advantage of tensor cores for faster processing and training, as long as the user has a Standard or Advanced license.TensorRTNVIDIA framework for optimizing (by using low-precision and integer math) run-time performance of TensorFlow, Caffe, and other standard framework networks running on a GPU with Tensor Cores.No: ViDi uses a proprietary network architecture that is not compatible with Tensor RT.Multiple GPUsExcept under very narrow circumstances, using multiple GPUs in a single system will not reduce ViDi tool training or processing time. What multiple GPUs do is to:can Increase system throughput when your application uses multiple threads to concurrently process images Increase training productivity, by allowing you to train multiple tools at the same timeThere is one circumstance under which multiple GPUs can be used to reduce tool processing time. If you configure your system in MultipleDevic mode, then all installed s are treated as a single . This means that only one tool can be processed at a esPerTool GPU GPU during processing time for the entire server.NoteIn comparison with other Tesla cards, the T4 is oriented toward run-time operation. It supports ViDi training and run-time, but training performance will likely be slower than a V100.In the specific case of a Red Analyze tool, the use of may speed up the tool, especially a tool with a high image-MultipleDevicesPerTool modeto-feature size ratio. However, this potential speed up comes at the expense of latency across all clients.System Configuration for Multi-GPU SystemsWhen configuring a host system for multiple GPUs, keep the following in mind:The chassis may need to provide up to 2KW of powerQuadro and Tesla cards provide better cooling configuration for multiple-card installationsMake sure that the PCIe configuration has 16 PCIe lanes available for each GPUDo not enable SLIWhat About Training Time?Reducing tool training time does not affect your performance at run time, but it can improve the productivity of your development team.ViDi training uses a mixture of CPU and GPU resources. When considering training specifically, there are three phases: computing image statistics, building the model, and then processing the image set with the newly trained model. The model building phase of training usually takes the longest, and it is an iterative process. Each iteration requires that the tool generate training data from all of the training images. If the images are in a non-BMP format, they need to be converted to BMP for each iteration.Tool training is always single-threaded and single GPU. You cannot make training faster using multiple GPUs.canUsing multiple GPUs improve your productivity because you can train multiple tools concurrently.。

Specifications are subject to change without notice.Customers should verify actual device performance in their specific applications.Electrical Characteristics Standard Resistance Range........................10 ohms to 2 megohms(see standard resistance table)Resistance Tolerance............±10 % std.(tighter tolerance available)Absolute Minimum Resistance..............................1 % or 2 ohms max.(whichever is greater)Contact Resistance Variation...........................1.0 % or 3 ohms max.(whichever is greater)AdjustabilityVoltage.....................................±0.01 %Resistance...............................±0.05 %Resolution.....................................Infinite Insulation Resistance................500 vdc.1,000 megohms min.Dielectric StrengthSea Level..................................900 vac 70,000 Feet...............................350 vac Effective Travel..................25 turns nom.Environmental Characteristics Power Rating (300 volts max.)70 °C ........................................0.5 watt 125 °C .........................................0 watt Temperature Range..................................-55 °C to +150 °C Temperature Coefficient....±100 ppm/°C Seal Test.......................85 °C Fluorinert*-STD-202 Method 10396 hours(2 % ∆TR, 10 Megohms IR)Vibration.........20 G (1 % ∆TR; 1 % ∆VR)Shock...........100 G (1 % ∆TR; 1 % ∆VR)Load Life...............1,000 hours 0.5 watt @ 70 °C(3 % ∆TR; 3 % or 3 ohms,whichever is greater, CRV)Rotational Life........................200 cycles(4 % ∆TR; 3 % or 3 ohms,whichever is greater, CRV)Physical CharacteristicsTorque .............................3.0 oz-in. max.Mechanical Stops..................Wiper idles Terminals........................Solderable pins Weight ........................................0.03 oz.Marking...........................Manufacturer’strademark, resistance code,wiring diagram, date code,manufacturer’s modelnumber and styleWiper..................................50 % ±10 %Flammability ..........................U.L. 94V-0Standard Packaging.....50 pcs. per tube Adjustment Tool..............................H-90Common Dimensions3296X3296Z (Commercial Only)Resistance Resistance (Ohms)Code 1010020200505001001012002015005011,0001022,0002025,00050210,00010320,00020325,00025350,000503100,000104200,000204250,000254500,0005041,000,0001052,000,000205Standard Resistance TableA V A I L AB L E T H R O U G H D I S T R I B U T I O N*”FLUORINERT” IS A REGISTERED TRADEMARK OF 3M CO.Popular values listed in boldface. Special resistances available.How to Order3296 W - 1 - 103 __ LFModel StyleStandard or Modified Product Indicator-1 = Standard Product Resistance CodePackaging DesignatorBlank =Tube (Standard)R =T ape and Reel (X and W Pin StylesOnly)A =Ammo Pack (X and W Pin Styles Only)TerminationsLF =100 % Tin-plated (lead free)Blank =90 % Tin / 10 % Lead-plated Consult factory for other available options.Specifications are subject to change without notice.Customers should verify actual device performance in their specific applications.SIDE ADJUST 3296X-1TOP ADJUST 3296W-11000/REEL/BOXPackaging SpecificationsMeets EIA Specification 468.REV. 06/04。

TB-09377-001-v01 | January 2019 Technical Brief09377-001-v01TABLE OF CONTENTSPowering Any Virtual Workload (1)High-Performance Quadro Virtual Workstations (3)Deep Learning Inferencing (5)Virtual Desktops for Knowledge Workers (7)Summary (8)The NVIDIA® T4 graphics processing unit (GPU), based on the latest NVIDIA Turing™architecture, is now supported for virtualized workloads with NVIDIA virtual GPU(vGPU) software. Using the same NVIDIA graphics drivers that are deployed on non-virtualized systems, NVIDIA vGPU software provides Virtual Machines (VMs) with thesame breakthrough performance and versatility that the T4 offers to a physicalenvironment.NVIDIA initially launched T4 at GTC Japan in the Fall of 2018 as an AI inferencingplatform for bare metal servers. When T4 was initially released, it was specificallydesigned to meet the needs of public and private cloud environments as their scalability requirements continue to grow. Since then there has been rapid adoption and it was recently released on the Google Cloud Platform. The T4 is the most universal graphics processing unit (GPU) to date -- capable of running any workload to drive greater data center efficiency. In a bare metal environment, T4 accelerates diverse workloads including deep learning training and inferencing. Adding support for virtual desktops with NVIDIA GRID® Virtual PC (GRID vPC) and NVIDIA Quadro® Virtual Data Center Workstation (Quadro vDWS) software is the next level of workflow acceleration.The T4 has a low-profile, single slot form factor, roughly the size of a cell phone, anddraws a maximum of 70 W power, so it requires no supplemental power connector. This highly efficient design allows NVIDIA vGPU customers to reduce their operating costs considerably and offers the flexibility to scale their vGPU deployment by installing additional GPUs in a server, because two T4 GPUs can fit into the same space as a single NVIDIA® Tesla® M10 or Tesla M60 GPU, which could consume more than 3X the power.Powering Any Virtual WorkloadFigure 1. NVIDIA Tesla GPUs for Virtualization WorkloadsThe NVIDIA T4 leverages the NVIDIA Turing™ architecture – the biggest architectural leap forward in over a decade – enabling major advances in efficiency and performance. Some of the key features provided by the NVIDIA Turing architecture include Tensor Cores for accelerating deep learning inference workflows as well as NVIDIA® CUDA®cores, Tensor Cores, and RT Cores for real-time ray tracing acceleration and batch rendering. It’s also the first GPU architecture to support GDDR6 memory, which provides improved performance and power efficiency versus the previous generation GDDR5.The T4 is an NVIDIA RTX™-capable GPU, benefiting from all of the enhancements of the NVIDIA RTX platform, including:④Real-time ray tracing④Accelerated batch rendering④AI-enhanced denoising④Photorealistic design with accurate shadows, reflections, and refractionsThe T4 is well suited for a wide range of data center workloads including:④Virtual Desktops for knowledge workers using modern productivity applications④Virtual Workstations for scientists, engineers, and creative professionals④Deep Learning Inferencing and trainingThe graphics performance of the NVIDIA T4 directly benefits virtual workstations implemented with NVIDIA Quadro vDWS software to run rendering and simulation workloads. Users of high-end applications, such as CATIA, SOLIDWORKS, and ArcGIS Pro, are typically segmented as light, medium or heavy based on the type of workflow they’re running and the size of the model/data they are working with. The T4 is a low-profile, single slot card for light and medium users working with mid-to-large sized models. T4 offers double the amount of framebuffer (16 GB) versus the previous generation Tesla P4 (8 GB) card, therefore users can work with bigger models within their virtual workstations. Benchmark results show that T4 with Quadro vDWS delivers 25% faster performance than Tesla P4 and offers almost twice the professional graphics performance of the NVIDIA Tesla M60.High-Performance Quadro Virtual WorkstationsFigure 2. T4 Performance Comparison with Tesla M60 and Tesla P4 Based on SPECviewperf13The NVIDIA Turing architecture of the T4 fuses real-time ray tracing, AI, simulation, and rasterization to fundamentally change computer graphics. Dedicated ray-tracing processors called RT Cores accelerate the computation of how light travels in 3D environments. NVIDIA Turing accelerates real-time ray tracing over the previous-generation NVIDIA® Pascal™ architecture and can render final frames for film effects faster than CPUs. The new Tensor Cores, processors that accelerate deep learning training and inference, accelerate AI-enhanced graphics features—such as denoising, resolution scaling, and video re-timing—creating applications with powerful new capabilities.Figure 3. Benefits of Real-Time Rendering with NVIDIA RTX TechnologyThe T4 with the NVIDIA Turing architecture sets a new bar for power efficiency and performance for deep learning and AI. Its multi-precision tensor cores combined with accelerated containerized software stacks from NVIDIA GPU Cloud (NGC) delivers revolutionary performance.As we are racing towards a future where every customer inquiry, every product and service will be touched and improved by AI, NVIDIA vGPU is bringing Deep Learning inferencing and training workflows to virtual machines. Quadro vDWS users can now execute inferencing workloads within their VDI sessions by accessing NGC containers. NGC integrates GPU-optimized deep learning frameworks, runtimes, libraries and even the OS into a ready-to-run container, available at no charge. NGC simplifies and standardizes deployment, making it easier and quicker for data scientists to build, train and deploy AI models. Accessing NGC containers within a VM offers even more portability and security to virtual users for classroom environments and virtual labs. Test results show that Quadro vDWS users leveraging T4 can run deep learning inferencing workloads 25X faster than with CPU-only VMs.Deep Learning InferencingFigure 4. Run Video Inferencing Workloads up to 25X Faster with T4 and Quadro vDWS vs. a CPU-only VMBenchmark test results show that the T4 is a universal GPU which can run a variety of workloads, including virtual desktops for knowledge workers accessing modern productivity applications. Modern productivity applications, high resolution and multiple monitors, and Windows 10 continue to require more graphics and with NVIDIA GRID vPC software, combined with NVIDIA Tesla GPUs, users can achieve a native-PC experience in a virtualized environment. While the Tesla M10 GPU, combined with NVIDIA GRID software, remains the ideal solution to provide optimal user density, TCO and performance for knowledge workers in a VDI environment, the versatility of the T4 makes it an attractive solution as well.The Tesla M10 was announced in Spring of 2016 and offers the best user density and performance option for NVIDIA GRID vPC customers. The Tesla M10 is a 32 GB dual-slot card which draws up to 225 W of power, therefore requires a supplemental power connector. The T4 is a low profile, 16 GB single-slot card, which draws 70 W maximum and does not require a supplemental power connector.Two NVIDIA T4 GPUs provide 32 GB of framebuffer and support the same user density as a single Tesla M10 with 32 GB of framebuffer, but with lower power consumption. While the Tesla M10 provides the best value for knowledge worker deployments, selecting the T4 for this use case brings the unique benefits of the NVIDIA Turing architecture. This enables IT to maximize data center resources by running virtual desktops in addition to virtual workstations, deep learning inferencing, rendering, and other graphics and compute intensive workloads -- all leveraging the same data center infrastructure. This ability to run mixed workloads can increase user productivity, maximize utilization, and reduce costs in the data center. Additional T4 technology enhancements include support for VP9 decode, which is often used for video playback, and H.265 (HEVC) 4:4:4 encode/decode.The flexible design of the T4 makes it well suited for any data center workload -enabling IT to leverage it for multiple use cases and maximize efficiency and utilization.It is perfectly aligned for vGPU implementations - delivering a native-PC experience for virtualized productivity applications, untethering architects, engineers and designersfrom their desks, and enabling deep learning inferencing workloads from anywhere, onany device. This universal GPU can be deployed on industry-standard servers to provide graphics and compute acceleration across any workload and future-proof the data center. Its dense, low power form factor can improve data center operating expenses while improving performance and efficiency and scales easily as compute and graphics needs grow.NoticeThe information provided in this specification is believed to be accurate and reliable as of the date provided. However, NVIDIA Corporation (“NVIDIA”) does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information. NVIDIA shall have no liability for the consequences or use of such information or for any infringement of patents or other rights of third parties that may result from its use. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NVIDIA’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the NVIDIA terms and conditions of sale for the product.TrademarksNVIDIA, the NVIDIA logo, CUDA, NVIDIA GRID, NVIDIA RTX, NVIDIA Turing, Pascal, Quadro, and Tesla are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated.Copyright© 2019 NVIDIA Corporation. All rights reserved.。

如何提高娱乐效果英语作文Improving the Entertainment Value。

Enhancing the entertainment value of any activity or event is crucial for ensuring engagement and enjoyment among participants or audiences. Whether it's writing, hosting an event, or simply engaging in recreational activities, there are several strategies one can employ to elevate the entertainment factor. Here are some effective methods:1. Engaging Content Creation: The cornerstone of entertainment lies in the content. Whether it's writing a story, creating a presentation, or organizing an event, the content should be engaging, informative, and tailored to the interests of the target audience. Utilize storytelling techniques, humor, and interactive elements to captivate the audience's attention from the outset.2. Incorporate Multimedia Elements: Adding multimediaelements such as images, videos, and audio clips can significantly enhance the entertainment value of any presentation or event. Visual and auditory stimuli not only break the monotony but also appeal to different learning styles and preferences, making the experience more immersive and enjoyable.3. Interactive Participation: Foster active participation among the audience or participants by incorporating interactive elements into the activity. This could include Q&A sessions, polls, quizzes, group discussions, or hands-on activities that encourage engagement and collaboration. Interactive participation not only keeps the audience invested but also creates a sense of involvement and ownership.4. Surprise and Variety: Injecting elements of surprise and variety can add excitement and anticipation to any entertainment experience. Introduce unexpected twists, guest speakers, performances, or activities that break the routine and keep the audience guessing. Variety ensuresthat the entertainment remains fresh and dynamic,preventing boredom or disengagement.5. Personalization and Customization: Tailor the entertainment experience to the preferences and interests of the audience whenever possible. Personalization could involve incorporating references or themes that resonate with the audience, acknowledging individual contributions or achievements, or allowing for customization options that empower participants to shape their experience.6. Quality Production Values: Pay attention to the production values of the entertainment content or event. This includes factors such as sound quality, lighting, set design, and overall presentation. Investing in high-quality production values not only enhances the aesthetic appeal but also contributes to the overall professionalism and credibility of the entertainment experience.7. Feedback and Iteration: Solicit feedback from the audience or participants following the entertainment experience and use it to iterate and improve future iterations. Pay attention to what worked well and whatcould be enhanced, and incorporate constructive feedback into the planning and execution process. Continuous improvement ensures that the entertainment remains relevant and engaging over time.In conclusion, elevating the entertainment value of any activity or event requires a combination of engaging content, interactive participation, surprise elements, personalization, quality production values, and continuous improvement based on feedback. By implementing these strategies, one can create memorable and enjoyable entertainment experiences that leave a lasting impression on the audience.。

关于虚拟舞台英语作文英文回答：Virtual stage is a fascinating concept that has revolutionized the way we experience live performances. As technology continues to advance, the possibilities forvirtual stage are endless. One of the key benefits ofvirtual stage is its ability to transport audiences to different locations without leaving the comfort of theirown homes. For example, I recently attended a virtual concert where the artist performed on a virtual stage that resembled a beautiful beach at sunset. It felt as though I was actually there, soaking in the music and the atmosphere.Another advantage of virtual stage is the flexibilityit offers to performers. They can create elaborate sets and special effects that would be impossible in a traditional live performance. This allows them to truly bring their artistic vision to life and engage with their audience in new and exciting ways. For instance, I watched a virtualtheater production where the actors seamlessly interacted with virtual elements, creating a truly immersive experience for the viewers.Furthermore, virtual stage opens up opportunities for collaboration between artists from different parts of the world. They can come together to create unique and innovative performances that blend different styles and cultures. This not only enriches the artistic landscape but also fosters a sense of global community and connection. I recently participated in a virtual dance workshop where dancers from various countries shared their techniques and choreography, resulting in a truly dynamic and diverse performance.In conclusion, virtual stage is a game-changer in the world of live performances. Its ability to transport audiences, empower performers, and facilitate global collaboration makes it an exciting and promising platform for creativity and expression.中文回答：虚拟舞台是一个迷人的概念，彻底改变了我们体验现场表演的方式。

EL ID磨削硬脆材料精密和超精密加工的新技术张飞虎 朱　波 栾殿荣 袁哲俊(　哈尔滨工业大学机械工程系　哈尔滨　150001　)文　摘　金属基超硬磨料砂轮在线电解修整(E lectrolytic In2process Dressing,简称E L ID)磨削技术是国外近年发展起来的一种硬脆材料精密和超精密加工新技术。

本文介绍了E L ID磨削技术的基本原理、工艺特点和国内外研究应用情况。

应用E L ID磨削技术,可对工程陶瓷等硬脆材料实现高效率磨削和精密镜面磨削。

关键词　精密和超精密加工,磨削,砂轮,修整EL ID Grinding A New Technology for Precision andUltraprecision Machining of Hard and Brittle MaterialsZhang Feihu Zhu Bo Luan Dianrong Yuan Zhejun(　Department of Mechanical Engineering,Harbin Institute of Technology　Harbin　150001　)Abstract　EL ID grinding which applies metal bonded grinding wheel with superhard abrasives and electrolytic in2process dressing is a newly developed technology for precision and ultraprecision machining of hard and brittle ma2 terials.In this paper the basic principle,characteristics,research and application of EL ID grinding are introduced.By EL ID,efficient grinding and mirror surface grinding of ceramics and other hard and brittle materials can be realized.K ey w ords　Precision and ultraprecision machining,Grinding,Grinding wheel,Dressing1　引言金刚石、CBN超硬磨料具有硬度高、耐磨性好等优良的切削性能,自美国GE公司1957年和1969年批量生产人造金刚石、CBN磨料以来,除少数做成刀具外,大部分都用于制造磨具。

Accelerate vMotionMigrate 23X FasterHyper-ConvergedvSphere ®Networking Done RightThe Most Efficient vSphere, NSX and VSAN-based Data Center Solutionsz VirtualizationSDNStorageMellanox Key FunctionalityMellanox Key FunctionalityMellanox Key Functionality•High Bandwidth •Low Latency •Virtual Functions •Certified SR-IOV •Inbox drivers•Physical Function •Virtual Functions •Overlay Networks •Proven deployments•RDMA Enabled •iSER Certified•Support for All-Flash devices •Inbox RoCE and iSER driversVMwareVMware provides a powerful, flexible, and secure foundation that adds agility and accelerates thetransformation to hybrid cloud and software defined data centers (SDDC). VMware helps end-users run, manage, connect and secure applications and new workloads through virtualization, Software DefinedNetworks (SDN), and virtualized storage solutions that help with the growing needs and complexity of modern infrastructure.Mellanox 10/25G Ethernet interconnect solutions enable unmatched competitive advantages in VMware environments by increasing efficiency of overall server utilization and eliminating I/O bottleneck to enable more virtual machines per server, faster migrations and speed access to storage. Explore this reference guide to learn more about how Mellanox key technologies can help improve efficiencies in your VMware environment.VMware vMotion allows themovement of virtual machines from one host to another. Deploying Mellanox high-speed Ethernet can help decrease the amount of time it takes to migrate virtual machines. The results clearly show thatincreasing from 10 to 25G in an ESXi 6 environment reduced the time to transfer a VM. Migration timedropped from 55 minutes to a little over 2 minutes, a 96%improvement. Mellanox Ethernet, RDMA, and iSER drivers are certified and ship in the box with vSphere.Reduce CapEx ExpenseVDI DeploymentsIncrease Virtual DesktopsVirtual desktop infrastructure (VDI) have similar characteristics as cloud deployment, such as high virtual machineconsolidation ratios, with typically hundreds of small to mediumsized desktops consolidated on a single host. Network performance is important for user experience as well as yielding direct CapEx and OpEx savings. Savings can grow as you move to higherperforming networks. Below is an example of CapEx savings when moving from 10 to 25GE.Hyper-Converged Infrastructure (HCI) is a demandingenvironment for networking components. HCI consists of three software components: compute virtualization, storage virtualization and management in which all three require an agile and responsive network. Deploying on 10, or better, 25G larger network pipes assists as does network adapters with offload capabilities to optimize performance and availability of synchronization and replication of virtualized workloads.CapEx Analysis: 10G vs. 25GCapEx Analysis: 10G vs. 25GScalable from a half rack to multiple racksHalf Rack 12 nodesFull Rack 24 nodesPay As You Grow10 Racks up to 240 nodesDeployment Config134411GbE link: 1GbE Transceiver125/10GbE link: QSFP to SFP+324100GbE link: QSFP to QSFP 100/40GbE link: QSFP to QSFP Why Spectrum▪ 2 switches in 1U▪Ideal storage/HCI port counts▪Zero packet loss ▪Low latency▪RoCE optimized (NVMe-oF, Spark, SMB Direct, etc.)▪NEO for network automation/visibility▪Native SDK for containers ▪Cost optimized▪Network OS alternativesProvisioning & Orchestration▪Zero-touch provisioning ▪VLAN auto-provisioning▪Migrate VMs without manual configuration▪VXLAN/DCI support for VM migration across multiple datacenters for DRMonitoring▪Performance monitoring ▪Health monitoring ▪Detailed telemetry▪Alerts and notificationsAutomated Network▪½ 19” width, 1U height ▪18x10/25GbE + 4x40/100GbE ▪57W typical (ATIS)2Spectrum SwitchesProven Higher EfficiencyIncreasing VMware EfficiencyNSX services enable east-west routing between the SDDC and north-south routing for external networks and require VXLAN segmentation which can consume CPU processes and diminish overall server efficiency. Mellanox supports VXLAN offloads to handle this processing resulting in higher throughput and over 50% reduction in CPU utilization.Accelerate NSXStorage virtualization requires an agile and responsive network. iSER accelerates workloads by using an iSCSI extensions for RDMA. Using the iSER extension lowers latencies and CPU utilization to help keep pace with I/O requirements and provides a 70% improvement in throughput and 70% reduction in latencies.VMware EVO SDDC provides a validated suite of interoperable, tested components to deliver a completely Integrated System. This comprises fully qualifiedhardware components including Mellanox switches and adapters that are pre-built and pre-racked, providing an appliance-likeexperience that makes it easy for customers to deploy, operate and support. Mellanox leverages our relationship with Cumulus Linux to extend access from Layer 2 across Layer 3 networks topologies,Deliver 3X Efficiency with iSERFully Certified with EVOAverage CPU% per 1GbE VXLAN Traffic。

有关虚拟乐队的英语作文English Answer：Virtual bands, also known as digital bands, are musical groups that exist solely in the digital realm. They are composed of virtual or computer-generated musicians and use a combination of music production software, virtual instruments, and artificial intelligence (AI) to create and perform music. Virtual bands have certain advantages over traditional physical bands, including the ability to create unique and innovative sounds, collaborate with musicians from around the world, and reduce costs associated with touring and live performances. However, they also face challenges such as the lack of physical presence and the need for advanced technical expertise.Virtual bands have gained prominence in recent years, with several notable examples achieving commercial success. One of the most famous virtual bands is Gorillaz, created by Damon Albarn and Jamie Hewlett. Gorillaz has releasedseveral albums and performed at various events, featuring collaborations with renowned musicians such as Snoop Dogg and Elton John. Other notable virtual bands include Hatsune Miku, a Japanese virtual idol who has performed live using holographic projections, and the League of Legends virtual band, a collaboration between Riot Games and Universal Music Group.The rise of virtual bands raises several questions about the future of music and the role of technology in the industry. Virtual bands offer numerous possibilities for innovation and creativity, but they also present challenges to traditional notions of musical performance and authenticity. As technology continues to advance, we can expect to see even more groundbreaking developments in the realm of virtual bands and their impact on the music industry.中文回答：虚拟乐队，也被称为数字乐队，是指只存在于数字领域的音乐团体。

Grinding technology development trendGrinding machining is important processing technology in mechanical manufacturing. With precision mechanical products, the requirement of increasing the reliability and service life, high hardness, high strength, high wear resistance, high functional new materials application increased, for grinding processing and put forward many new problems, such as material of grinding machining and surface integrity, super precision grinding and high efficiency grinding and grinding automation, etc. Problems to be solved.At present, the grinding technology is moving toward using super hard abrasives, development of precision and ultra precision grinding, high speed, high efficiency grinding technology and the development of high precision, high stiffness of the grinding machine automation direction.One. In-depth development of grinding theory and technology researchGrinding theory research is the basis for the development of grinding technology, the grinding technology and the development of practice and research provides the opportunity for grinding theory, requirement and new topic, in recent ten years, professionals engaged in the work of grinding, grinding technology and phenomenon many factors for a lot of in-depth research and achieved fruitful results.Two. Unit grinding machine high speed, high precision components manufacturing technologyHigh precision grinding machine spindle unit, feeding unit, bearing unit and auxiliary unit is the key parts and components. Spindle unit including spindle power, shaft, bearing, and frame sections, she affects the precision of the machining system, stability and application scope, its dynamic performance and stability of high performance precision ultra-precision grinding, play a key role. Feed unit including the position detection unit, Demand of feed units, therefore, flexible operation, high resolution, high positioning accuracy, not crawl and large movement range, both to have larger acceleration, and large enough thrust, high stiffness, quick dynamic response, high positioning accuracy. Machine tools supporting technology mainly refers to the supporting member of design and manufacturing technology. Auxiliary unit technology including fast clamping workpiece, high efficiency grinding fluid filtration system, machine safety devices, chip removal and the workpiece cleaning technology, spindle and grinding wheel dynamic balance technology, etc.Three. Grinding automation and intellectualizationWith mechanical manufacturing in FMS (flexible manufacturing system) andCIMS (computer integrated manufacturing system), IMS (intelligent manufacturing system) height automation development direction, the grinding automation requirements are put forward. The development of the CNC grinding machine with CNC lathe, milling machine and so on started late. In the 1980 s and 90 s is a CNC grinding machine for rapid development and entered the popularizing period of practical. In recent years, almost all kinds of grinder CNC products, CNC tool grinding machine from 3 to 10 shaft axis development. Which can realize online measurement, automatic switching of grinding wheel and the emergence of the automatic unloading workpieces milling machining center, mark CNC grinding reached a new level. Grinding CNC system development also have great progress, many special grinding CNC software and systems have been commercialized. In the 1990 s, Japan announced about intelligent grinding results. Use of monitoring information and database, adaptive optimization in grinding condition and the judgment condition of grinding, using computer simulation and virtual technology, establish a realistic virtual grinding environment, to implement the intelligent of the grinding. Continuous track the use of grinding technology, making the grinding technology has made great development.Four. Grinding process monitoring and detection technologyImplementation of intelligent computer control of grinding, grinding process is an important problem in the control room. Solve the grinding process, such as the phenomenon of signal identification, signal sampling, signal processing, feedback and compensation, need high sensitive sensor, also need to have expert system or intelligent system and the software design and other technical support.For grinding wheel wear and tear of using acoustic emission monitoring system. Because of the complexity of the grinding process, the grinding process of the monitoring system in theory and practical aspect still has many problems unsolved. Parts after the grinding size, shape and position accuracy, surface quality of the test is divided into offline and online detection.For super precision grinding and free abrasive machining high precision and low surface roughness obtained after detection, high-precision grinding on the surface of the on-line automatic detection are much harder than cars, milling, high sensitivity is the key to development of sensor technology and signal acquisition, recognition and processing technologies.Five. Software of grinding technologyHigh performance CNC grinding machine should be equipped with a complete software system. Of intelligence information processing and data input of grinding, grinding mode selection and grinding the arrangement of the order, condition of grinding, grinding wheel dressing and grinding automatically selected, the state of the grinding process simulation and virtual detection and compensation, are in softwaredesign and development of a reasonable solution.All countries in the development of expert system and intelligent system software. Expert system is a branch of artificial intelligence research, and its essence is a kind of application system. Problem solving ability with expert level in the field of grinding process system, can effectively solve complex problems in the field of grinding.磨削加工技术发展趋势磨削加工是机械制造中重要的加工工艺。

虚拟乐队英语作文简单In the heart of the digital age, the concept of a virtual band has become a reality. This innovative musical ensemble is not bound by physical presence, allowing musicians from around the globe to collaborate and create music together.The virtual band operates through the use of advanced technology, where each member can record their individual parts in their own studios. Using high-speed internet connections, these recordings are then seamlessly merged to form a cohesive piece of music. This eliminates the need for traditional rehearsals and studio sessions, making it an incredibly efficient way to produce music.One of the key benefits of a virtual band is the diversity it brings to the table. Musicians with different cultural backgrounds and musical styles can come together to create a unique blend of sounds. This fusion often results in innovative and groundbreaking music that pushes the boundaries of what is traditionally expected.Moreover, virtual bands are not limited by geographical constraints. Members can be located anywhere in the world, and yet they can still work together as if they were in the same room. This opens up a whole new world of possibilities for musicians who may not have the opportunity to travel or collaborate in person.However, there are also challenges that come with this new form of music creation. Communication can sometimes be difficult due to time zone differences and language barriers. Additionally, the lack of face-to-face interaction can make it harder to build the camaraderie that is often present in traditional bands.Despite these challenges, the virtual band is a testament to the power of technology and the limitless potential of human creativity. It is a fascinating development in the music industry that continues to evolve and inspire musicians and listeners alike. As technology advances, we can only imagine the new heights that virtual bands will reach in the future of music.。

17S705IntroductionThe 17S705 is a model of a computer processor developed by a leading technology company. This processor is specifically designed to deliver high performance and efficiency, making it suitable for a wide range of applications including gaming, multimedia, and data processing. In this document, we will explore the key features and specifications of the 17S705 processor, highlighting its advantages, and discussing its potential use cases.FeaturesThe 17S705 processor boasts several impressive features that set it apart from its competitors. Some of the prominent features include:1.High Clock Speed: The 17S705 is equipped with ahigh clock speed of 3.5 GHz, allowing for fast andresponsive computing. This makes it ideal for tasks thatrequire real-time processing, such as gaming andmultimedia editing.2.Multiple Cores: Built with multiple cores, the17S705 processor maximizes multitasking capabilities.Each core can perform independent tasks simultaneously, enhancing overall performance and efficiency.3.Advanced Architecture: The 17S705 utilizes anadvanced architecture, incorporating cutting-edgetechnologies to optimize performance. This includesfeatures such as branch prediction, speculative execution, and out-of-order execution, all of which contribute to faster and smoother operation.4.Enhanced Graphics: With integrated graphicsprocessing units (GPUs), the 17S705 processor deliversimpressive visual performance. It supports high-resolution displays and provides smooth graphics rendering, making it suitable for gaming and multimedia applications.5.Power Efficiency: The 17S705 processor isdesigned to be power-efficient, striking a balance between performance and energy consumption. This makes itsuitable for desktop computers, laptops, and other devices where power efficiency is a priority.SpecificationsLet’s dive deeper into the specifications of the 17S705 processor:1.Processor Type: 17S705 is a x86-64 processor,compatible with 64-bit operating systems.2.Number of Cores: The 17S705 processor has 8cores, allowing for efficient multitasking and parallelprocessing.3.Cache Size: It features a 12 MB L3 cache, whichhelps reduce memory access latency and improve overall system performance.4.Graphics: The integrated GPU supports DirectX 12and OpenGL 4.5, enabling smooth and high-quality graphics rendering.5.Socket Type: The 17S705 processor utilizes theAM4 socket, providing compatibility with a wide range of motherboards.6.Power Consumption: With a maximum thermaldesign power of 95 W, the 17S705 strikes a balancebetween performance and power efficiency.Use CasesThe 17S705 processor can be utilized in various scenarios. Some common use cases include:1.Gaming: With its high clock speed, advancedgraphics capabilities, and multiple cores, the 17S705processor can handle resource-intensive games with ease.It provides smooth gameplay, high frame rates, andrealistic graphics rendering.2.Multimedia Editing: The 17S705 processor’spowerful performance and integrated GPU make it ideal for multimedia editing tasks. It can effortlessly handle videorendering, image processing, and other multimedia-related tasks, reducing processing time.3.Data Processing: Thanks to its multiple cores andadvanced architecture, the 17S705 processor excels in data processing tasks. It can perform complex calculations,handle large datasets, and run multiple parallel tasksefficiently, making it suitable for data analysis and scientific computations.4.Software Development: Developers can benefitfrom the 17S705 processor’s fast proc essing speed andmultitasking capabilities. It can compile code quickly, run resource-intensive development environments, andsupport virtualization technologies.ConclusionThe 17S705 processor is a high-performance and power-efficient processor designed to cater to the demands of modern computing. Its impressive features, including high clock speed, multiple cores, advanced architecture, and enhanced graphics capabilities, make it suitable for a wide range of applications. Whether you are a gamer, multimedia professional, data analyst, or software developer, the 17S705 processor promises to deliver exceptional performance and efficiency, revolutionizing your computing experience.。

CM P 抛光液流场数值仿真周兆忠1,2　楼飞燕2　吕冰海3　袁巨龙21.浙江工业大学浙西分校,衢州,3240002.浙江工业大学,杭州,3100143.湖南大学国家高效磨削工程技术研究中心,长沙,410082摘要:建立了一种基于流体动力学的化学机械抛光模型,利用流体动力学方法推导了抛光液流场的雷诺方程,并通过计算机求解偏微分方程,对抛光过程中晶片和抛光垫之间的抛光液液体薄膜厚度以及液体薄膜压力分布进行了仿真计算。

分析了液膜厚度、晶片倾斜角和液膜负荷力、液膜压力力矩的关系,讨论了抛光载荷、抛光转速对最小液膜厚度、晶片倾斜角以及液膜压力分布的影响。

结果表明,不同抛光速度和抛光载荷下,抛光液膜厚度、液膜压力和晶片倾斜角呈现不同的分布规律。

比较仿真和实验中抛光输入参数对晶片下液膜厚度的影响曲线发现,仿真结果与实验结果的变化趋势一致,证明建立的抛光液液膜厚度及液膜压力分布模型的有效性。

关键词:化学机械抛光;抛光液膜;流场;数值模拟中图分类号:T G702 文章编号:1004—132X (2009)10—1207—06Numerical Simulation of Slurry Flow Field in Chemical Mechanical Polishing ProcessZhou Zhaozhong 1,2　Lou Feiyan 2　L üBinghai 3　Yuan J ulong 21.West Branch of Zhejiang University of Technology ,Quzhou ,Zhejiang ,3240002.Zhejiang U niversity of Technology ,Hangzhou ,3100143.National Engineering Research Center for High E fficiency Grinding ,Hunan University ,Changsha ,410082Abstract :A new hydrodynamics based model for chemical mechanical polishing was presented.In t his model ,a Reynolds equation for t he slurry flow field was deduced ,and t he t hickness and pressure dist ributio n of slurry film between wafer and polishing pad in chemical and mechanical polishing (CM P )p rocess was simulated by calculation of partial differential equations under different condi 2tions.The effect s of film t hickness and wafer gradient on t he film pressure were analyzed ,and t he in 2fluence of t he polishing load and speed on film p ressure distribution was discussed.It is shown t hat t he t hickness and pressure dist ribution of slurry film vary wit h t he wafer gradient ,polishing load and speed ,and show t he same tendency wit h t he experimental result s.The mode developed herein can be taken as an effective tool to investigate t he mechanism of t he CM P process.K ey w ords :chemical mechanical polishing ;slurry film ;flow field ;numerical simulation收稿日期:2008—12—17基金项目:国家自然科学基金资助项目(50475119,50535054);浙江省自然科学基金资助项目(Y104494,Y106590)0　引言化学机械抛光(chemical mechanical polis 2hing ,CM P )是目前半导体基片加工的主要方法,加工过程中的材料去除是化学作用和机械作用相互协调的结果[1Ο2]。

NVIDIA CONNECTX-6DX ETHERNET SMARTNIC | DATASHEET | OCT21 | 1† For illustration only. Actual products may vary.Advanced Networking and Security for the Most Demanding Cloud and Data Center WorkloadsNVIDIA ® ConnectX ®-6 Dx is a highly secure and advanced smart network interface card (SmartNIC) that accelerates mission-critical cloud and data center applications, including security, virtualization, SDN/NFV, big data, machine learning, and storage. ConnectX-6 Dx provides up to two ports of 100Gb/s or a single port of 200Gb/sEthernet connectivity and is powered by 50Gb/s (PAM4) or 25/10 Gb/s (NRZ) SerDes technology.ConnectX-6 Dx features virtual switch (vSwitch) and virtual router (vRouter) hardware accelerations delivering orders-of-magnitude higher performance than software-based solutions. ConnectX-6 Dx supports a choice of single-root I/O virtualization (SR-IOV) and VirtIO in hardware, enabling customers to best address their application needs. By offloading cloud networking workloads, ConnectX-6 Dx frees up CPU cores for business applications while reducing total cost-of-ownership.In an era where data privacy is key, ConnectX-6 Dx provides built-in inline encryption/decryption, stateful packet filtering, and other capabilities, bringing advanced security down to every node with unprecedented performance and scalability. Built on the solid foundation of NVIDIA’s ConnectX line of SmartNICs, ConnectX-6 Dx offers best-in-class RDMA over Converged Ethernet (RoCE) capabilities, enabling scalable, resilient, and easy-to-deploy RoCE solutions. For data storage, ConnectX-6 Dx optimizes a suite of storage accelerations, bringing NVMe-oF target and initiator offloads.SOLUTIONS>Cloud-native, web 2.0, hyperscale >Enterprise data centers >Cybersecurity >Big data analytics>Scale-out compute and storage infrastructure>Telco and network function virtualization (NFV) >Cloud storage>Machine learning and AI >Media and entertainmentPRODUCT SPECIFICATIONSMaximum total bandwidth200Gb/sSupported Ethernet speeds10/25/40/50/100/ 200GbE Number of network ports1/2Network interface technologies NRZ/PAM4 Host interfacePCIe Gen4.0 x16, with NVIDIA Multi-Host ™ technology DPDK message rate Up to 215Mpps Platform securityHardware root-of-trust and secure firmware update Form factors PCIe HHHL, OCP2, OCP3.0 SFF Network interfacesSFP+, QSFP+, DSFPPCIe x16 HHHL Card †OCP 3.0 Small Form Factor †OCP 2.0 Form Factor†DATASHEETNVIDIA CONNECTX-6 DXEthernet SmartNICNetwork Interface>Dual ports of 10/25/40/50/100 GbE, or a single port of 200GbEHost Interface>16 lanes of PCIe Gen4, compatible with PCIe Gen2/Gen3>Integrated PCI switch>NVIDIA Multi-Host and NVIDIA Socket Direct™Virtualization/Cloud Native>SR-IOV and VirtIO acceleration>Up to 1K virtual functions per port>8 physical functions>Support for tunneling>Encap/decap of VXLAN, NVGRE, Geneve,and more>Stateless offloads for overlay tunnels NVIDIA ASAP2 Accelerated Switching & Packet Processing>SDN acceleration for:>Bare metal>Virtualization>Containers>Full hardware offload for OVS data plane>Flow update through RTE_Flow orTC_Flower>Flex-parser: user-defined classification>Hardware offload for:>Connection tracking (Layer 4 firewall)>NAT>Header rewrite>Mirroring>Sampling>Flow aging>Hierarchical QoS>Flow-based statistics Cybersecurity>Inline hardware IPsec encryption anddecryption>AES-GCM 128/256-bit key>RoCE over IPsec>Inline hardware TLS encryption anddecryption>AES-GCM 128/256-bit key>Data-at-rest AES-XTS encryption anddecryption>AES-XTS 256/512-bit key>Platform security>Hardware root-of-trust>Secure firmware updateStateless Offloads>TCP/UDP/IP stateless offload>LSO, LRO, checksum offload>Receive side scaling (RSS) also on encapsulatedpacket>Transmit side scaling (TSS)>VLAN and MPLS tag insertion/stripping>Receive flow steeringStorage Offloads>Block-level encryption: XTS-AES 256/512-bit key>NVMe over Fabrics offloads for target machine>T10 DIF signature handover operation at wirespeed, for ingress and egress traffic>Storage protocols: SRP, iSER, NFS RDMA,SMB Direct, NVMe-oFAdvanced Timing and Synchronization>Advanced PTP>IEEE 1588v2 (any profile)>PTP hardware clock (PHC) (UTC format)>Nanosecond-level accuracy>Line rate hardware timestamp (UTCformat)>PPS in and configurable PPS out>Time-triggered scheduling>PTP-based packet pacing>Time-based SDN acceleration (ASAP2)>Time-sensitive networking (TSN)>Dedicated precision timing card optionRDMA over Converged Ethernet(RoCE)>RoCE v1/v2>Zero-touch RoCE: no ECN, no PFC>RoCE over overlay networks>Selective repeat>Programmable congestion control interface>GPUDirect®Management and Control>NC-SI, MCTP over SMBus and MCTP overPCIe—Baseboard Management Controllerinterface, NCSI over RBT in Open ComputeProject (OCP) 2.0/3.0 cards>PLDM for Monitor and Control DSP0248>PLDM for Firmware Update DSP0267>I2C interface for device control andconfigurationRemote Boot>Remote boot over Ethernet>Remote boot over iSCSI>UEFI and PXE support for x86 and ArmserversFeatures(*)Ordering InformationFor NVIDIA ordering information, please contact your NVIDIA sales representative or visit the online ConnectX-6 Dx user manuals: PCIe HHHL form factor,OCP 3.0 form factor and OCP 2.0 form factor.*This section describes hardware features and capabilities.Please refer to the driver and firmware release notes for feature availability.。

虚拟乐队的优点英语作文The Advantages of a Virtual BandIn the ever-evolving landscape of the music industry, the concept of a virtual band has emerged as a captivating and innovative approach to creating and performing music. Unlike traditional bands where members physically gather to rehearse and record, a virtual band leverages the power of technology to bring together musicians from various locations, allowing them to collaborate and produce music without the constraints of geographical barriers. This unique model offers a multitude of advantages that have the potential to transform the way we experience and consume music.One of the primary advantages of a virtual band is the ability to assemble a diverse array of talented musicians from around the world. In a traditional band setting, the pool of potential collaborators is often limited to those within the immediate vicinity or within a specific geographic region. However, with a virtual band, the talent pool expands exponentially, as musicians can be recruited from different countries, cultures, and musical backgrounds. Thisdiversity can lead to a rich tapestry of musical styles, influences, and creative perspectives, resulting in a more dynamic and innovative sound.Moreover, the virtual nature of a band allows for greater flexibility in terms of scheduling and availability. Unlike a traditional band where members must coordinate their schedules to find time for rehearsals and performances, a virtual band can accommodate the varying schedules and time zones of its members. This flexibility enables musicians to contribute their parts at their convenience, without the need for rigid rehearsal schedules or the logistical challenges of coordinating in-person sessions. This adaptability can be particularly beneficial for musicians with demanding careers or personal commitments, as it allows them to participate in the creative process without compromising their other responsibilities.Another advantage of a virtual band is the ability to leverage the latest advancements in technology to enhance the recording and production process. With the proliferation of high-quality digital audio workstations, cloud-based collaboration tools, and sophisticated recording equipment, virtual bands can create professional-grade recordings from the comfort of their own studios or home setups. This technological advantage eliminates the need for expensive studio time and allows for a more efficient and cost-effective recording process. Additionally, virtual bands can takeadvantage of advanced audio editing and mixing techniques to fine-tune their sound, achieving a level of polish and sonic quality that may be challenging to replicate in a traditional band setting.Furthermore, the virtual nature of a band can foster a more collaborative and creative environment. Without the constraints of physical proximity, band members can engage in a more asynchronous and iterative creative process. They can exchange ideas, provide feedback, and build upon each other's contributions at their own pace, leading to a more thoughtful and refined final product. This collaborative dynamic can also encourage experimentation and the exploration of new musical directions, as band members are not bound by the limitations of a shared rehearsal space or the need to coordinate live performances.Additionally, a virtual band can offer significant advantages in terms of accessibility and audience engagement. By leveraging online platforms and social media, virtual bands can reach a global audience, transcending geographic boundaries and exposing their music to a wider and more diverse fan base. This accessibility can lead to increased visibility, fan engagement, and the potential for broader commercial success. Virtual bands can also explore innovative ways of connecting with their audience, such as live-streamed performances, interactive fan experiences, and the integration of emerging technologies like virtual reality oraugmented reality.Another advantage of a virtual band is the potential for increased productivity and efficiency. Without the logistical challenges of coordinating in-person rehearsals and performances, virtual bands can dedicate more time and resources to the creative process. This can result in a more prolific output, as band members can focus on writing, recording, and refining their music without the distractions and constraints of traditional band dynamics.Furthermore, the virtual model can provide opportunities for musicians to collaborate with a larger network of artists and producers. By breaking down geographical barriers, virtual bands can tap into a global pool of creative talent, allowing them to work with a diverse range of collaborators and explore new musical directions. This cross-pollination of ideas and skills can lead to the creation of truly unique and innovative music that resonates with a wide audience.Finally, the virtual band model offers the potential for greater creative control and artistic freedom. Without the need to compromise or accommodate the preferences and limitations of physical band members, virtual bands can have a more streamlined and cohesive creative vision. This autonomy can enable them to fully realize their artistic aspirations and bring their musical visions to lifewithout the constraints of traditional band structures.In conclusion, the advantages of a virtual band are numerous and compelling. From the ability to assemble a diverse array of talented musicians to the enhanced recording and production capabilities, the virtual model offers a compelling alternative to the traditional band structure. By leveraging the power of technology, virtual bands can foster a more collaborative and creative environment, reach a global audience, and achieve greater productivity and artistic freedom. As the music industry continues to evolve, the rise of virtual bands may very well redefine the way we experience and consume music in the years to come.。

虚拟乐队英语作文高中In the realm of digital entertainment, virtual bands have emerged as a unique phenomenon that captivates audiences with their innovative approach to music and performance. Here's a composition suitable for high school students on the topic of virtual bands:The Rise of Virtual Bands: A New Era in MusicIn the past decade, the music industry has witnessed a remarkable evolution with the emergence of virtual bands. These are not just any bands; they are digital entities that have taken the concept of music to a whole new dimension. Unlike traditional bands consisting of human musicians, virtual bands are created using advanced computer graphics and artificial intelligence, offering a blend of technology and creativity.Composition of Virtual BandsVirtual bands are composed of characters that are designed with meticulous detail, often resembling humanoid figures or even fantastical beings. Each character has a distinct personality, backstory, and role within the band. They are brought to life through motion capture technology, which allows real-life musicians and actors to lend their movementsand expressions to these virtual personas.Music ProductionThe music produced by virtual bands is a result of a collaborative effort between human composers and music producers, who work alongside AI algorithms. These algorithms can generate unique melodies, harmonies, and rhythms, which are then refined and perfected by human artists. This fusion of human creativity and artificial intelligence results in a sound that is both innovative and captivating.Interactive PerformancesOne of the most exciting aspects of virtual bands is their ability to perform interactively. Through the use of augmented reality (AR) and virtual reality (VR) technologies, audiences can immerse themselves in a live concert experience from the comfort of their homes. These performances are often accompanied by visually stunning graphics and special effects that enhance the overall experience.Impact on the Music IndustryThe rise of virtual bands has had a significant impact on the music industry. They have opened up new avenues for music distribution and consumption, providing a platform forartists who may not have the opportunity to perform in traditional settings. Moreover, virtual bands have also inspired a new generation of musicians and producers to explore the intersection of music and technology.Challenges and ControversiesDespite their popularity, virtual bands have also faced their share of challenges and controversies. Critics argue that the reliance on technology may detract from the authenticity of music and the human connection that comes with live performances. However, proponents counter that virtual bands offer a new form of artistic expression that can coexist with traditional music forms.ConclusionVirtual bands represent the future of music, where technology and art converge to create a new kind of cultural experience. As technology continues to advance, it is likely that virtual bands will become more sophisticated and prevalent, offering audiences a unique and immersive way to enjoy music. The fusion of human creativity with AI and digital technology is not just a trend; it is a testament to the boundlesspotential of human ingenuity.This composition aims to provide a comprehensive overview of virtual bands, exploring their creation, impact, and the challenges they face in the evolving landscape of the music industry.。

虚拟乐团英文作文模板高中Virtual Band: A New Way of Musical Expression。

With the advancement of technology, the way we create and consume music has been revolutionized. One of the most exciting developments in the music industry is the rise of virtual bands. These bands, comprised of virtual avatars and computer-generated music, are changing the landscape of musical expression and performance.Virtual bands are a group of musicians who perform together using virtual avatars in a digital environment. These avatars are created using advanced computer graphics and animation technology, and they are capable of performing just like real-life musicians. The music created by virtual bands is often produced using digital audio workstations and virtual instruments, resulting in a unique and futuristic sound.One of the most well-known virtual bands is Gorillaz, a British band created by musician Damon Albarn and artist Jamie Hewlett. The band's virtual members, 2-D, Murdoc Niccals, Noodle, and Russel Hobbs, have gained a massive following and have released numerous successful albums. Their music combines elements of rock, hip-hop, and electronic music, and their virtual concerts have attracted fans from around the world.The concept of virtual bands opens up a world of possibilities for musical expression. With virtual avatars, musicians are not limited by physical constraints and can create fantastical and otherworldly personas for their performances. This allows for a level of creativity and experimentation that is not always possible in traditional bands. Additionally, virtual bands can easily collaborate with artists from different parts of the world, breaking down geographical barriers and creating truly global music.Furthermore, virtual bands have the potential to redefine the live music experience. While traditional concerts require extensive planning, logistics, and travel, virtual bands can perform live shows in digital environments, reaching a global audience with just a few clicks. This has the potential to make live music more accessible and inclusive,allowing fans from all over the world to experience the magic of a concert without leaving their homes.In addition to their impact on the music industry, virtual bands also have the potential to influence other forms of entertainment. With the rise of virtual reality and augmented reality technology, virtual bands could become a central part of immersive and interactive experiences. Imagine attending a virtual concert where the audience can interact with the avatars and become part of the show, creating a truly unforgettable experience.However, it is important to acknowledge the potential drawbacks of virtual bands. Some may argue that the use of virtual avatars and computer-generated music takes away from the authenticity and raw emotion of live performances. There is also the concern that virtual bands could lead to a decrease in opportunities for real-life musicians and traditional bands, as the focus shifts towards digital and virtual forms of music.In conclusion, virtual bands are a fascinating and innovative development in the music industry. They have the potential to redefine the way we create, perform, and experience music, opening up new possibilities for creativity and collaboration. While there are potential challenges and drawbacks, the rise of virtual bands represents an exciting new frontier in musical expression, and it will be fascinating to see how this trend continues to evolve in the future.。