X射线萤光光谱仪(XRF)检验规范分解

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AG-0801-M006-F2 Rev.:A1Amendment RecordsAG-0801-M006-F3 Rev.:A1目錄Content一、目的Purpose二、適用範圍Scope三、樣品檢測條件及方法Test condition & method for sample四、零件及產品測試原則Testing Rule五、測試方法Test Method六、注意事項Attention item七、附件Attachment1.XRF測試零件及產品類別之有害物質限值表限值表EHS threshold value of component type for XRF test2.拆解治工具管理流程The management process for disassembly tools of the component.3. XRF治工具季驗證紀錄表(AT-0801-M427-F1)The record of disassembly tools in quarter inspection by XRF (AT-0801-M427-F1).目的:Purpose本規範在建立進料之XRF檢驗標準,以確保品質合乎既定之標準。

The purpose of this program is to establish the specification of the XRF inspection for incoming materials to assure the quality of materials and comply with specified criteria.一、適用範圍:Scope適用於各大類零件之檢驗。

Apply to all types of materials.二、樣品檢測條件及方法:Test condition & method1.分析方法分為檢量線法及FP法,說明如下:Test methods can be separated to the method of calibration curve and FP method.1.1. 檢量線法:對應於XRF之分析條件為”Cd, Pb, Hg, Br, Cr.bcc”,適用之材質為塑料、紙張、木材及Mg, Al, Si 較輕元素)為主材質之樣品。

Method of calibration curve: The method is used for plastic, paper, wood and somematerials mainly composing of Mg, Al, and Si. The analys is condition is ”Cd, Pb, Hg, Br, Cr.bcc”.1.2. FP法:對應於XRF之分析條件為”metal 2.bfb”,適用之材質為金屬(較重元素)為主材質之樣品。

FP method: The method is used for some materials mainly composing of heavy metal.The analysis condition is ”metal 2.bfb” .四、零件及產品測試原則:Testing Rule1.金屬及塑料共存者: 平鋪於測試台並裁切至適當尺寸測試之。

The sample composed of metallic and plastic materials: Cut the sample to be suitablesize in the test platform.2.形狀凹凸不平者:測試點過高(超過0.5cm)時須拆解樣品,再取平整面測試(約1cm×1cm)。

The surface not bumpy: Separate the sample while the test point is higher than testplatform (0.5 cm).3.條狀金屬線者: 依其縱方向排列於測試台測試之。

The metallic sample shaped into bar type : Arrange it vertically in test platform.4.鮮豔紅、黃、橙色者: 應優先量測(如油墨、塑膠類、PVC等)。

The sample painted by brightly red, yellow and orange color: Measure the point first(such as ink, plastic and PVC).五、測試方法:Test Method: Method 1:1.DIP 類測試方法:以檢量線法測試。

DIP: test by the method of calibration curve.1.1.本體大於1cm 時:以本體為主並包括部分接腳進行測試(請參閱圖1) 。

Sample size > 1 cm: Focus on body and includes partial terminal (Refer to figure 1). 1.2.本體小於1cm 時:包含本體及接腳測試(請參閱圖2)。

Sample size < 1 cm: Including the whole body and terminal (Refer to figure 2).Method 2:以檢量線法測試。

Test by the method of calibration curve.2.SMD 類:分為長(L),寬(W),高(H)<2mm 類及其他尺寸類。

SMD : Divide sample into two types, one is Length (L), width (W), or height (H)<2mm, and another is other dimension 。

2.1.長(L),寬(W),高(H)<2mm :裝滿1/2樣品杯測試(請參閱圖3)。

Length (L), width (W), or height (H) <2mm: Fill up the 1/2 test cup with samples. (ReferDIP 類 DIP type本體包含接腳之影像視窗圖 The test image including body and partial terminal.縱方向平鋪於測試台 Put the sample in test platform vertically圖2 DIP 類(本體<1cm)量測流程Figure 1 The test procedure for DIP type(sample size > 1 cm)DIP 類 DIP type縱方向平鋪於測試台Put the sample in test platform vertically本體含接腳之影像視窗圖 The test image including body and partial terminal.圖1 DIP 類(本體>1cm)量測流程Figure 1 The test procedure for DIP type(sample size > 1 cm)to figure 3)2.1.其他尺寸類:以pad 或接腳為優先量測面(請參閱圖4)。

Other dimension: Focus on pad or terminal. (Refer to figure 3)Method 3:以檢量線法測試。

Test by the method of calibration curve.3.PCB 類:測試點以涵蓋pad 、文字、印刷線路為優先選擇,否則應依序分開測試(請參閱圖5)。

PCB: Test the pad 、word 、printed line by the method of calibration curve. (Refer to figure 5)Method 4:4.電感,變壓器類:Inductor and Transformer:4.1.DIP 類:分為漆包線外露(純金屬材質)所組成及外覆塑料之零件之兩種。

DIP: Divide into two types, one is Enamel-insulated wire that is obvious to display; and空樣品杯Φ=2.7cmTest Cup填裝1/2樣品杯 Fill up 1/2 cup with samples含pad 之影像視窗圖Test image including pad其他尺寸類 Other DimensionL ,W ,H<2mm 類 L ,W ,H<2mm typePCB 板PCB 圖3 SMD 類填裝於1/2樣品杯之流程 Figure 3 Procedure for fill up 1/2 cup with SMDtype圖4 測試含pad 面之SMD 類Figure4 Procedure for SMD type includingpad圖5 含pad 、文字、印刷線路點之PCB 板測試部位Figure 5 Test point including pad 、word 、printed line for PCB偵測點之影像視窗圖Test imageanother is covered with plastic.4.1.1.漆包線外露之零件:FP 法測試(請參閱圖6)。

Enamel-insulated wire is obvious to display: test by FP method (Refer to figure 6) 4.1.2.外覆塑料之零件:本體以檢量線法測試,接腳以FP 法測試(請參閱圖7)。

The inductor with the plastic jacket: Test the body by the method of calibration curve, and the terminal by FP test method separately (Refer to figure 7)4.2.SMD 類:SMD type:4.2.1.長(L),寬(W),高(H)<5mm :裝滿1/2樣品杯測試,並使用檢量線法。

Length (L), width (W), or height (H) <5mm: Fill up the 1/2 test cup with samples, and then test by the method of calibration curve.4.2.2.長(L),寬(W),高(H)任一邊>5mm ,則量測方式分為:Any side on length (L), width (W), or height (H) >5mm: The test methods as the followings,4.2.2.1.漆包線外露之零件:FP 法測試(請參閱圖8)。