印制电路板DFM设计技术要求

可制造的设计(DFM)就是板子设计的一种技术,这种技术使用现有的工艺与设备、可以合理的成本生产板子。

可制造的设计的好处就是可以获得良好的质量、缩短生产周期、降低的劳动成本与材料成本、重复设计的次数削减。

耗用上百万美元的最快捷的方法来设计SMT,而最后的设计结果并不一定能够实现使用现有的设备进行组装、返修与测试。

可制造性的设计最基本的问题就就是生产能力的问题,因此也就是成本的问题。

其在降低印制电路组装的缺陷中起到了关键作用。

人们清楚地瞧到,仅靠制造工程师就是不能够控制与降低印制电路组装成本的,所以,人们对可制造的设计(DFM)越来越重视。

在降低成本方面,印制电路板的设计人员也起到关键作用。

将设计直接转到制造工程师的日子已一去不复返了,如果确实曾经存在这种现象的话。

每个公司都需要有其自己独特的DFM。

某些指南就是有关设备与工艺方面的指南,而并不适用于所有的制造设施。

有关选择元件方面的问题,DFM的主要部分也就是各公司持有各自独特的方案。

还有一些指南就是通用指南,因此,适用于每个公司。

IPC-SM-782就是结合通用指南的一个很好的起点。

不过,应注意的就是IPC -SM-782主要就是一份焊盘图形标准文献——DFM的一个子系统。

据SMT组装分承包商说,由于设计就是由OEM来完成的,所以她们确实对设计没有再实施什么控制,这已就是司空见惯的事了。

然而,基本上就是正确的,不过,不应该这样。

例如;一般来说,满足DFM要求的产品报价应高于没有达到DFM要求的那些产品的报价。

当然,这应引起OEM注意。

此外,应对OEM进行免费的DFM知识的培训。

遗憾的就是,并不就是每个分承包商都有内部的DFM,因此,实际上没有准备任何DFM来帮助与提供给OEM。

1 DFM组织结构实施连续设计的传统方法,从逻辑设计人员或电路设计人员到物理设计人员(CAD 布局)乃至制造与最后的测试工程进行了考察,就是不适用的,因为每个工程师在评估与选择替代产品时都就是独立地进行决策。

印制电路板DFM设计技术要求印制电路板（Printed Circuit Board，简称PCB）是电子元器件之中的一种，也是电子元器件之间的载体。

PCB的设计、制造和组装技术是电子行业中十分重要的一环。

随着电子工业的不断发展和进步，对PCB的制造质量和生产效率的要求也越来越高，因此PCB的设计、制造和组装技术也不断得到了改进和提高。

其中，DFM（Design For Manufacturability）技术是印制电路板设计的关键之一。

本文将详细介绍印制电路板DFM设计技术要求。

一、DFM技术的定义DFM技术是一种针对被生产制造过程加工和装配的设计，目标是在最少的成本、最高的效率和最重要的质量的情况下，尽可能地简化或消除制造过程和工具的不必要的复杂性。

在PCB设计中DFM就是通过一定的设计手段，在实现电子电路功能的基础上，尽可能降低制造成本，提高生产效率，保证制造质量等方面的设计技术。

二、DFM技术要求（一）考虑PCB的制造过程DFM技术要求将PCB的制造过程作为设计的重点，考虑制造过程中可能会出现的问题和难点并加以解决。

例如，在PCB的布线中，需要考虑布线的直线性，减少布线的绕线，控制布线的宽度和位置，避免出现布线打短路等问题，这些问题都需要在PCB设计阶段考虑到，并通过专业软件进行优化和处理。

（二）考虑PCB的制造成本DFM技术要求PCB设计师在设计PCB时，从成本的角度出发，从材料、制造过程、组装工艺等方面考虑如何降低生产成本。

例如，对PCB的阻焊层采用一面阻一面焊的方法，可以避免由于一面焊死或者控制不准而造成的流量不均和短路问题，在一定程度上减少制造成本。

（三）考虑PCB的制造工艺DFM技术要求PCB设计师要充分了解PCB制造工艺，对制造过程中的工艺进行分析和研究，从而能够更好地将设计与制造工艺相结合。

例如，在PCB的厚铜箔制造中，必须要充分考虑铜箔的厚度和表面处理方式，以及厚铜箔加工过程中的机械力、加热温度、压力等因素，从而能够保证在加工生产过程中制造出符合要求的厚铜箔。

SMT-PCBA可制造性工艺设计(DFM)规范1. 目的产品总成本 60%取决于产品的最初设计 ; 75％的制造成本取决于设计说明和设计规范 ; 70－80％的生产缺陷是由于设计原因造成的。

故为了规范新产品在设计初始各个阶段的可制造性评审，让评审有据可循，确保新产品符合生产的效率、成本、品质等各方面的要求，缩短新品研发周期，提升产品质量及竞争力制定此规范文件。

2. 适用范围适用于SMT所有新产品各个开发阶段的可制造性设计评审。

3. 参考资料IPC-A-610F， Acceptability of Electronic Assemblies 电子组装件的可接受性条件IPC2221， Generic Standard on Printed Board design印刷电路板设计通用标准IPC-7351—表面贴装设计和焊盘图形标准通用要求4. 名词解释1、SMT(Surface Mounting Technology)表面贴装技术，指用自动贴装设备将表面组装元件/器贴装到PCB表面规定位置的一种电子装联技术。

2、THT:ThroughHoleTechnology(THT)通孔插装技术3、PCB(Printed Circuit Board)指在印刷电路基板上，用铜籍布置的电路。

4、PCBA(Printed Circuit Board Assembly)指采用表面组装技术完成装配的电路板组装件5、SMD(Surface Mounting Device)表面贴装元件，它不同于以前的通孔插装部品，而是贴装在PC的表面。

6、SOP(Small Out-line Package)它是在长方形BODY两侧，具有约8~40pin左右的Lead的表面装IC,Lead Pitch有0.5mm,0.65mm,0.8mm,1.27mm等。

7、QFP(Quad Flat Package)它是在正方形或长方形BODY四周具有约100~250Pin左右Lead的表面实装用IC,LeadPitch有0.4mm,0.5mm,0.65mm,0.8mm等。

若美印制电路板DFM通用技术要求为了明确PCB板的制作要求，更好的实现CAD与CAM的沟通，更好的实现DFM的共同目标，更好的缩短产品制造周期，降低生产成本，提高产品品质，减少PCB板制作问题，提高产品准确可靠性，方便后工序SMT的生产操作。

特制定此要求。

1 文件接收要求各式格式的GERBER文件，各种版本的PROTEL，PADS文件，要含完整的线路图，阻焊图，丝印图，分孔图，外形图，钻孔图,连片图（含孔的属性，大小，机械层次分明，连片方式及标准的数据显示）。

2 线路板制作信息要求制作要求要含板材，板厚，铜箔厚度，阻焊油颜色，字符颜色，表面工艺处理,阻抗要求,环保要求，特殊要求（如：高TG板材）等信息。

（最好请附上板的用途，例如在高温下作业的PCB，考虑用耐高温的高TG板材，特殊要求应在附件上显示）如客户不提供任何制作要求,我司会将此板当常规板制作,板材为FR4,94V-0,厚度1.6MM,表面铜厚1OZ,阻焊油颜色为深绿色,字符颜色为白色,表面处理为OSP.3 PCB结构要求3.1 结构PCB文件中的安装孔、定位孔、拼板邮票孔、散热孔等一般情况请在机械层，Board line和钻孔层（NC数据层）标示。

4板材要求PCB双面、多层常用的板材为FR-4玻纤板，板厚有0.4MM、0.6MM、0.8MM、1.0MM、1.2MM、1.6MM、2.0MM等5印制导线要求5.1 布局a)印制导线布局,成品铜厚为1OZ的，最优线宽、线距大于0.125mm(5mil) 高密线路可考虑线宽线距为0.1MM(4mil) ,线到焊盘、焊盘与焊盘大于等于0.15MM(6miL)，线到铜皮距大于等于0.2mm(8mil)。

导线距边要大于0.4MM(16mil)，距安装孔，定位孔大于0.4MM(16mil)。

为了保证板在电镀时板面与孔铜的均匀性，尽量要在板内空白区铺铜箔，尽可能不在板内放置独立线与独立孔，避免在电镀过程中引起烧板，影响成品线宽和孔径大小达不到要求。

可制造得设计（ＤFM)就是板子设计得一种技术，这种技术使用现有得工艺与设备、可以合理得成本生产板子.可制造得设计得好处就是可以获得良好得质量、缩短生产周期、降低得劳动成本与材料成本、重复设计得次数削减.耗用上百万美元得最快捷得方法来设计ＳMT,而最后得设计结果并不一定能够实现使用现有得设备进行组装、返修与测试。

可制造性得设计最基本得问题就就是生产能力得问题，因此也就是成本得问题。

其在降低印制电路组装得缺陷中起到了关键作用。

人们清楚地瞧到，仅靠制造工程师就是不能够控制与降低印制电路组装成本得，所以,人们对可制造得设计（DFM)越来越重视。

在降低成本方面，印制电路板得设计人员也起到关键作用。

将设计直接转到制造工程师得日子已一去不复返了，如果确实曾经存在这种现象得话.每个公司都需要有其自己独特得ＤFＭ.某些指南就是有关设备与工艺方面得指南，而并不适用于所有得制造设施.有关选择元件方面得问题,DＦM得主要部分也就是各公司持有各自独特得方案。

还有一些指南就是通用指南,因此,适用于每个公司。

ＩPC-SＭ—78２就是结合通用指南得一个很好得起点。

不过,应注意得就是IPC-SＭ—７82主要就是一份焊盘图形标准文献—-DFＭ得一个子系统。

据ＳMT组装分承包商说，由于设计就是由ＯEＭ来完成得,所以她们确实对设计没有再实施什么控制,这已就是司空见惯得事了。

然而，基本上就是正确得,不过，不应该这样。

例如;一般来说,满足DＦＭ要求得产品报价应高于没有达到DFM要求得那些产品得报价。

当然，这应引起OEM注意。

此外，应对OEM进行免费得D ＦＭ知识得培训。

遗憾得就是,并不就是每个分承包商都有内部得DFＭ，因此，实际上没有准备任何DＦM来帮助与提供给OEM。

1 DFM组织结构实施连续设计得传统方法，从逻辑设计人员或电路设计人员到物理设计人员（ＣAＤ布局)乃至制造与最后得测试工程进行了考察，就是不适用得,因为每个工程师在评估与选择替代产品时都就是独立地进行决策。

印制电路板DFM设计技术要求印制电路板( PCB) 是现代电子技术中不可或缺的一部分，由于其良好的稳定性，可靠性，成本效益和可复制性等特点，已经成为众多电子设备的基础。

印制电路板的DFM（Design for Manufacturing）设计技术要求是保证印制电路板质量、成本和交付时间的关键因素之一。

本文将深入探讨印制电路板DFM 设计技术要求。

1. PCB DFM 设计的优点印制电路板DFM设计技术要求是为了减少设计周期、成本、尽早确定缺陷、确保质量、减少生产中的错误和优化时间等目的而设计的。

以下是PCB DFM设计的优点：- 帮助设计者及早发现PCB 错误，并提供解决方案。

-推动设计和制造团队在设计阶段进行更紧密的合作，以加速PCB 制造过程- 把印刷电路板正式制造之前的成本降到最低- 降低PCB 制造过程的不良率、修复成本、废品率和退货率2. PCBDFM 设计的技术要求2.1 PCB板设计PCB板的设计是DFM设计的重要部分。

一个好的PCB板设计不仅可以提高电子设备性能，而且可以确保工艺的成功实施。

PCB板设计必须满足以下要求：- 确定最终PCB尺寸和定位孔的位置。

- 检查层的数量、材料和厚度。

- 确定通孔、配线宽度、间距和最小孔径。

- 确定最终元件的实际放置位置和方向。

2.2 PCB 布局设计在PCB 布局设计中，标准PCBA 规则应该得到应用，例如: PCB 布局应与产品的产品设计多丈量共而规划。

2.2.1元器件布局元器件布局的良好设计能使电路运作更加稳定可靠，这里的要求如下：- 元器件应该尽可能的紧凑布置。

- 元器件布局应该符合最佳电路设计规则和"防雷"设计规则，并实施正确的设计电磁兼容性（EMC）战略。

- 保证元器件之间的间距不太大或太小，保证元器件之间的空间不太大或太小。

2.2.2 设计元器件包括邻近元件的距离元器件之间的间距应保持合理，以避免两个元器件之间的电磁干扰。

印制电路板dfm通用技术要求（General specification for printedcircuit board DFM）General specification for printed circuit board DFMThis standard specifies the general requirements for design for manufacturing single sided printed circuit board, including materials, dimensions and tolerances, printed wires and pads, metal holes, holes, mounting holes, coating, coating, character and mark. As designers of printed boards, design a single, double sided (Single/Double, sided, board) reference:1 General requirements1.1. This standard serves as a general requirement for PCB design, specifications for PCB design and manufacturing, and effective communication between CAD and CAM.1.2 we shall give priority to the design drawings and documents as the basis for production in the process of documentation.2 PCB material2.1 substratePCB substrate is usually made of epoxy glass cloth covered with copper plate, that is FR4. (including single panel)2.2 copper foilA) more than 99.9% of electrolytic copper;B) double plate surface copper foil thickness more than 35 m (1OZ); special requirements, specified in the drawings or documents.3, PCB structure, size and tolerance3.1 structure(a) the design elements that constitute the PCB shall be described in the design drawings. The appearance shall be uniformly expressed by Mechanical 1, layer (priority) or Keep out layer. If used in the design document at the same time, the general keep out layer is used for shielding without opening, and mechanical 1 is used to represent the forming.(b) in the design drawings for opening long SLOT holes or hollow out, with Mechanical 1 layer draw the corresponding shape can.3.2 plate thickness toleranceFinished plate thickness0.4~1.0mm1.1~2.0mm2.1~3.0mmtolerance+ 0.13MM+ 0.18mm+ 0.2mm3.3 dimensional tolerancesPCB the overall dimensions shall comply with the requirements of the design drawings. When the drawings are not specified, the overall dimension tolerance is + 0.2mm. (except for V-CUT products)3.4 flatness (warpage) tolerancesThe flatness of PCB shall be in accordance with the design drawings. When the drawings are not specified, follow the followingFinished plate thickness0.4~1.0mm1.0~3.0mmWarpageSMT = 0.7%; SMT = 1.3%SMT = 0.7%; SMT = 1%4 printed wiring and pads4.1 layoutA) the layout, line width and line spacing of printed wires and pads shall be specified in accordance with the design drawings. But we will have the following treatment: appropriate according to process requirements for line width, PAD ring width compensation, single panel general, we will try to increase PAD, in order to strengthen the reliability of customer welding.(b) when the design line spacing is not up to the technical requirements (too closely affecting performance and Manufacturability), we shall adjust the design specifications according to the pre system design.C) we advise customers to design single and double boards in principle. The diameter of through hole (VIA) is more than 0.3mm, the outer diameter is more than 0.7mm, the distance between lines is 8mil, and the line width is above 8mil. To minimize the production cycle, reduce manufacturing difficulties.D) our minimum drilling tool is 0.3, the product is about 0.15mm. The minimum line spacing is 6mil. The minimum line width is 6mil. (but the manufacturing cycle is longer and the cost is higher)4.2 wire width toleranceInternal control standard for width tolerance of printed wiring is + 15%4.3 mesh processing(a) in order to avoid foaming and heating of copper surface when wave soldering occurs, the PCB plate is bent due to thermal stress, and the large copper surface is recommended to be laid in a grid form.B) the grid spacing is larger than 10mil (less than 8mil), the grid width is greater than or equal to 10mil (less than 8mil).4.4 heat shield (Thermal pad) processingOn the ground of large area (electric), often with components of the legs are connected to the connecting legs, both electrical properties and process requirements, made of cross flower pad (heat insulation plate), the possibility of resulting weld point due to excessive heat in the welding section is greatly reduced.5 aperture (HOLE)5.1 definition of metallization (PHT) and non metallization (NPTH)A) our company defaults to the non-metallic hole as follows:When the client sets up the Kong Fei metallization property in the Protel99se advanced properties (plated tab removed from the Advanced menu), we default to a non-metallic hole.When the customer directly uses the keep, out, layer ormechanical 1 layers of arc to indicate the drilling (no more separate holes) in the design document, we will accept the non-metallic hole as the default.When the customer placed the word "NPTH" near the hole, we are responsible for the non - metallization of the hole.When the customer explicitly calls for the corresponding aperture non - metallization (NPTH) in the design notice, they are processed according to the customer's requirements.(b) in addition to the above conditions, the components, holes, mounting holes, and through holes shall be metallized.5.2 hole size and tolerance(a) the PCB element holes and mounting holes in the design drawings assume the final product aperture size. The aperture tolerance is usually + 3mil (0.08mm);B) the through hole (that is VIA hole) we usually control it as follows: the negative tolerance is not required, and the positive tolerance is less than + 3mil (0.08mm).5.3 thicknessThe average thickness of the copper plated layer of metallized hole is not less than 20 m, and the thinnest is no less than 18 mu m.5.4 hole roughnessPTH hole wall roughness is controlled in less than 32um5.5 PIN hole problemA) our CNC milling machine positioning pin is 0.9mm minimum, and the positioning of the three PIN holes should be triangular.(b) when the customer has no special requirement and the design bore bore is less than 0.9mm, we will add the PIN hole at the appropriate position of the blank wireless channel or the big copper surface in the board.Design of 5.6 SLOT hole (slot)A) it is recommended that the SLOT hole be drawn with Mechanical1 layer (Keep, out, layer). It can also be expressed as a continuous hole, but the holes should be of the same size and the center of the hole is on the same horizontal line.B) our smallest slot knife is 0.65mm.C) when the SLOT hole is used to shield and avoid creepage between the high and low pressure, it is suggested that the diameter is above 1.2mm to facilitate processing.6 solder layer6.1 coating parts and defectsA) the solder coating shall be applied to the PCB surface exceptthe solder pads, MARK points, test points, etc..(b) if a customer uses a disk represented by FILL or TRACK, a corresponding size graph must be drawn on the solder resist (Solder, mask) layer to indicate the presence of tin at the site.(I strongly recommend that there be no non PAD form before design)(c) if the solder needs to be cooled on a large copper sheet or sprayed on an online bar, a corresponding size pattern must also be painted on the mask (Solder) layer to indicate the presence of tin.6.2 adhesionThe adhesion of the solder resist is required by level 2 of IPC-A-600F in the United states.6.3 thicknessThe thickness of the solder resist conforms to the following table:Line surfaceLine cornerSubstrate surfaceMore than 10 mMore than 8 m20~30 mu m7 characters and etch marks7.1 basic requirementsA) the characters of PCB should be designed by word height 30mil, word width 5MIL, character spacing 4mil or more, so as not to affect the differentiability of text.B) etching (metal) characters should not be bridged with wires and to ensure adequate electrical clearance. General design according to word height 30mil, word width 7mil above design.(c) when the customer characters are not clearly defined, our company will adjust the proportion of characters according to the technical requirements of our company.D) when there is no clear customer, we will in the silk printing layer is the proper position of our printed trademark, material number and cycle according to the requirements of our technology.7.2 PAD\SMT processing on textDisc (PAD) can be a silkscreen logo, in order to avoid. When the customer has the design of PAD\SMT, our company will do proper movement processing, the principle is that it does not affect the identity of its identification and device.The concept of 8 layers and the processing of MARK pointsLayer designEight1 double panel, we default to the top (ie Top, layer) for the face, topoverlay screen layer characters are positive.8.2, single panel to top (Top, layer) painted circuit layer (Signal layer), it means that the line is facing the face.8.3, single panel to the bottom (Top, layer) painted circuit layer (Signal layer), that the layer is a perspective line.Design of MARK points8.4 when the customer has a surface mount (SMT) for the board file, it should be placed MARK at the point of Mark, and the circle diameter is 1.0mm.8.5 when the customer has no special requirements, we put an arc of F1.5mm on the Solder Mask layer to represent the flux free to enhance the identifiability.8.6 when the customer is a splicing board file surface patch process side did not put MARK, our general in the process of edge position of the diagonal median plus a MARK point; when the customer is a splicing board file has no surface patch technology, is generally required to communicate with thecustomer need to add MARK.9 about V-CUT (cut V groove)9.1 V cut panels do not leave a gap between the board and the board. However, attention should be paid to the distance between the conductor and the center line of the V cut. Generally, the conductor spacing on both sides of the V-CUT line should be more than 0.5mm, that is to say, in the single block plate, the conductor should be more than 0.25mm from the edge of the plate.9.2 V-CUT line representation method is: general shape for keep out layer (Mech 1) layer said, then the plate needs V cut place, only with keep out layer (Mech 1) layer painted, and preferably in the board connection mark V-CUT words.9.3, as shown in the following figure, the residual depth of the general V cut is 1/3, the thickness of the plate, and in accordance with the customer's residual thickness requirements can be adjusted appropriately.9.4, V cut products after breaking apart, because glass fiber yarn has been a "marathon" phenomenon, the size will be slightly worse, individual products will be larger than 0.5mm.9.5, V-CUT knife can only go straight line, can not go curve and fold line, and can be more than 0.8mm thick board thickness.10 surface treatment processWhen the customer has no special requirement, our surface treatment defaults to hot air leveling (HAL). (tin: 63 tin, /37 lead)General technical requirements above DFM (single sided part) for our customers in the design of PCB file for reference, and hope to reach a consensus on the above, CAD and CAM in order to achieve better communication, better design for manufacturability (DFM) of the common goal, better shorten product manufacturing cycle, reduce production cost.。

深圳市博敏电子有限公司PCB制程能力及设计规范建议PCB设计规范建议本文所描述参阅背景为深圳市博敏电子有限公司PCB工艺制程、控制能力；所描述之参数为客户PCB 设计的建议值；建议PCB设计最好不要超越文件中所描述的最小值，否则无法加工或带来加工成本过高的现象。

一、前提要求1、建议客户提供生产文件采用GERBER File ，避免转换资料时因客户设计不够规范或我司软件版本的因素造成失误，从而诱发品质问题。

2、建议客户在转换Gerber File 时采用“Gerber RS-274X”、“2：5”格式输出，以确保资料精度；有部分客户在输出Gerber File时采用3：5格式，此方式会造成层与层之间的重合度较差，从而影响PCB的层间精度；3、倘若客户有Gerber File 及PCB资料提供我司生产时，请备注以何种文件为准；4、倘若客户提供的Gerber File为转厂资料，请在邮件中给予说明，避免我司再次对资料重新处理、补偿，从而影响孔径及线宽的控制范围；二、资料设计要求：三、制程能力四、Protel设计注意1、层的定义1.1、层的概念1.1.1、单面板以顶层（Top layer）画线路层（Signal layer）,则表示该层线路为正视面。

1.1.2、单面板以底层（bottom layer）画线路层（Signal layer），则表示该层线路为透视面。

我司建议尽量以1.2方式来设计单面板。

1.1.3、双面板我司默认以顶层（即Top layer）为正视面，topoverlay丝印层字符为正。

1.2、多层板层叠顺序：1.2.1、在protel99/99SE及以上版本以layer stack manager为准（如下图）。

1.2.2、在protel98以下版本需提供层叠标识。

因protel98无层管理器，如当同时使用负性电地层（Plane1）和正性（Mid layer1）信号层时，无法区分内层的叠层顺序。