IRF9230资料
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IRF9230
Semelab plc. Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.Prelim. 9/9639.95 (1.573)max.17.15 (0.675)16.64 (0.655)30.40 (1.197)30.15 (1.187)26.67 (1.050)max.11.18 (0.440)10.67 (0.420)124.09 (0.161)3.84 (0.151)dia.2 plcs.20.32 (0.800)18.80 (0.740)dia.7.87 (0.310)6.99 (0.275)12.07 (0.475)11.30 (0.445)1.78 (0.070)1.52 (0.060)1.09 (0.043)0.97 (0.038)dia.2 plcs.VGSGate – Source VoltageIDContinuous Drain Current(VGS= 0 , Tcase= 25°C)IDContinuous Drain Current(VGS= 0 , Tcase= 100°C)IDMPulsedDrain Current 1PDPower Dissipation @ Tcase= 25°CLinear Derating FactorEASSingle Pulse Avalanche Energy 2IARAvalanche Current 2EARRepetitive Avalanche Energy 2dv/dtPeak Diode Recovery 3TJ, TstgOperating and Storage Temperature RangeTLLead Temperature 1.6mm (0.63”) from case for10 sec.MECHANICAL DATADimensions in mm (inches)P–CHANNELPOWER MOSFET
ABSOLUTE MAXIMUM RATINGS (Tcase= 25°C unlessotherwise stated)FEATURES• HERMETICALLY SEALED TO–3 METALPACKAGE• SIMPLE DRIVE REQUIREMENTS• SCREENING OPTIONS AVAILABLETO–3 Metal PackagePin 1 – GatePin 2 – SourceCase – Drain
Notes1) Pulse Test: Pulse Width ≤300µs, δ≤2%2) @ VDD= –50V , L ≥2.3mH , RG= 25Ω, Peak IL= –6.5A , Starting TJ= 25°C3) @ ISD≤–6.5A , di/dt ≤–100A/µs , VDD≤BVDSS, TJ≤150°C , Suggested RG= 7.5ΩVDSS–200VID(cont)–6.5ARDS(on)0.8Ω
±20V–6.5A–4A–28A75W0.6W/°C66mJ–6.5A7.5mJ–5V/ns–55 to +150°C300°C元器件交易网www.cecb2b.comIRF9230
Semelab plc. Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.Prelim. 9/96ParameterTest ConditionsMin.Typ.Max.Unit–200–0.20.800.92–2–42–25–250–100100700200408310.87.05.0175010010080–6.5–28–6.04004Negligible5.0131.670.1230VGS= 0ID= –1mAReference to 25°CID= –1mAVGS= 10VID= –4AVGS= 10VID= –6.5AVDS= VGSID= –250mAVDS≥–15VIDS= –4AVGS= 0VDS= 0.8BVDSSTJ= 125°CVGS= –20VVGS= 20VVGS= 0VDS= –25Vf = 1MHzVGS= –10VID= –6.5AVDS= 0.5BVDSSVDD= –100VID= –6.5ARG= 7.5ΩIS= –6.5ATJ= 25°CVGS= 0IF= –6.5ATJ= 25°Cdi/ dt≤–100A/µsVDD≤–50VELECTRICAL CHARACTERISTICS (Tcase= 25°C unless otherwise stated)Drain – Source Breakdown VoltageTemperature Coefficient of Breakdown VoltageStatic Drain – Source On–StateResistance 1Gate Threshold VoltageForward Transconductance 1Zero Gate Voltage Drain CurrentForward Gate – Source LeakageReverse Gate – Source LeakageInput CapacitanceOutput CapacitanceReverse Transfer CapacitanceTotal Gate ChargeGate – Source ChargeGate – Drain (“Miller”) ChargeTurn–On Delay TimeRise TimeTurn–Off Delay TimeFall TimeContinuous Source CurrentPulse Source Current 2Diode Forward Voltage 1Reverse Recovery Time 1Reverse Recovery ChargeForward Turn–On TimeVV/°CΩVS (É)µAnApFnCnsAVnsµCnH°C/WBVDSS∆BVDSS∆TJRDS(on)VGS(th)gfsIDSSIGSSIGSSCissCossCrssQgQgsQgdtd(on)trtd(off)tfISISMVSDtrrQrrtonLDLSRθJCRθCSRθJASTATIC ELECTRICAL RATINGS
Notes1) Pulse Test: Pulse Width ≤300ms, δ≤2%2) Repetitive Rating – Pulse width limited by maximum junction temperature.DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance (measured from 6mm down drain lead to centre of die)Internal Source Inductance (from 6mm down source lead to source bond pad)Thermal Resistance Junction – CaseThermal Resistance Case – SinkThermal Resistance Junction – AmbientPACKAGE CHARACTERISTICSTHERMAL CHARACTERISTICS元器件交易网www.cecb2b.com