MAX4733ETA中文资料

M A X471M A X472的中文资料大全(总4页)-本页仅作为预览文档封面，使用时请删除本页-MAX471/MAX472的特点、功能美国美信公司生产的精密高端电流检测放大器是一个系列化产品，有MAX471/MA X472、 MAX4172/MAX4173等。

它们均有一个电流输出端，可以用一个电阻来简单地实现以地为参考点的电流/电压的转换，并可工作在较宽电压内。

MAX471/MAX472具有如下特点：●具有完美的高端电流检测功能；●内含精密的内部检测电阻（MAX471）；●在工作温度范围内，其精度为2%；●具有双向检测指示，可监控充电和放电状态；●内部检测电阻和检测能力为3A，并联使用时还可扩大检测电流范围；●使用外部检测电阻可任意扩展检测电流范围（MAX472）；●最大电源电流为100μA；●关闭方式时的电流仅为5μA；●电压范围为3～36V；●采用8脚DIP/SO/STO三种封装形式。

MAX471/MAX472的引脚排列如图1所示，图2所示为其内部功能框图。

表1为MAX471/MAX472的引脚功能说明。

MAX471的电流增益比已预设为500μA/A，由于2kΩ的输出电阻（ROUT）可产生1V/A的转换，因此±3A时的满度值为3V.用不同的ROUT电阻可设置不同的满度电压。

但对于MAX471，其输出电压不应大于VRS+。

对于MAX472，则不能大于。

MAX471引脚图如图１所示，MAX472引脚图如图２所示。

MAX471/MAX472的引脚功能说明引脚名称功能MAX471MAX47211SHDN关闭端。

正常运用时连接到地。

当此端接高电平时，电源电流小于5μA2，3-RS+内部电流检测电阻电池（或电源端）。

“+”仅指示与SIGN输出有关的流动方向。

封装时已将2和3连在了一起-2空脚-3RG1增益电阻端。

通过增益设置电阻连接到电流检测电阻的电池端44GND地或电池负端55SIGN集电极开路逻辑输出端。

♦These diodes are also available in DO-41 case with the type designation 1N4728 … 1N4764.MECHANICAL DATACase:MELF Glass Case Weight:approx. 0.25 gMAXIMUM RATINGSRatings at 25°C ambient temperature unless otherwise specified.Dimensions are in inches and (millimeters)Characteristics at Tamb = 25 °CSYMBOLMIN.TYP .MAX.UNITThermal Resistance R thJA ––170(1)°C/W Junction to Ambient Air Forward Voltage V F––1.2Voltsat I F = 200 mANOTES:(1) Valid provided that electrodes are kept at ambient temperatureSYMBOL VALUE UNITZener Current (see Table “Characteristics”)Power Dissipation at T amb = 25°C P tot 1.0(1)Watts Junction Temperature T j 150°C Storage Temperature RangeT S– 65 to +150°C12/16/98ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified.Type NominalZenervoltage(3)atI ZTV Z(V)TestcurrentI ZT(mA)Maximum Zener impedance(1)Maximumreverse leakage currentZ ZTat I ZT(Ω)Z ZK(Ω)atI ZK(mA)I R(µA)at V R(V)SurgecurrentatT A= 25°CI R(mA)Maximumregulatorcurrent(2)I ZM(mA)ZM4728 3.37610400 1.0100 1.01380276 ZM4729 3.66910400 1.0100 1.01260252 ZM4730 3.9649400 1.050 1.01190234 ZM4731 4.3589400 1.010 1.01070217 ZM4732 4.7538500 1.010 1.0970193 ZM4733 5.1497550 1.010 1.0890178 ZM4734 5.6455600 1.010 2.0810162 ZM4735 6.2412700 1.010 3.0730146 ZM4736 6.837 3.5700 1.010 4.0660133 ZM47377.534 4.07000.510 5.0605121 ZM47388.231 4.57000.510 6.0550110 ZM47399.128 5.07000.5107.0500100 ZM4740102577000.25107.645491 ZM4741112387000.2558.441483 ZM4742122197000.2559.138076 ZM47431319107000.2559.934469 ZM47441517147000.25511.430461 ZM47451615.5167000.25512.228557 ZM47461814207500.25513.725050 ZM47472012.5227500.25515.222545 ZM47482211.5237500.25516.720541 ZM47492410.5257500.25518.219038 ZM4750279.5357500.25520.617034 ZM4751308.54010000.25522.815030 ZM4752337.54510000.25525.113527 ZM4753367.05010000.25527.412525 ZM475439 6.56010000.25529.711523 ZM475543 6.07015000.25532.711022 ZM475647 5.58015000.25535.89519 ZM475751 5.09515000.25538.89018 ZM475856 4.511020000.25542.68016 ZM475962 4.012520000.25547.17014 ZM476068 3.715020000.25551.76513 ZM476175 3.317520000.25556.06012 ZM476282 3.020030000.25562.25511 ZM476391 2.825030000.25569.25010 ZM4764100 2.535030000.25576.0459NOTES:(1) The Zener impedance is derived from the 1KH Z AC voltage which results when an AC current having an RMS value equal to 10% of the Zener current (I ZT or I ZK)is superimposed on I ZT or I ZK. Zener impedance is measured at two points to insure a sharp knee on the breakdown curve and to eliminate unstable units(2) Valid provided that electrodes at a distance of 10mm from case are kept at ambient temperature(3) Measured under thermal equilibrium and DC test conditionsZM4728...ZM4764。

1N4728A - 1N4761A1.0W ZENEDIODENote: 1. Valid provided that leads are kept at T L @ 50°C with lead length = 9.5mm (3/8”) from case.2. EC Directive 2002/95/EC (RoHS) revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied where applicable,see EU Directive Annex Notes 5 and 7.Mechanical Data·1.0 Watt Power Dissipation · 3.3V - 75V Nominal Zener Voltage ·Standard V Z Tolerance is 5%·Lead Free Finish, RoHS Compliant (Note 2)·Case: DO-41·Case Material: Glass. UL Flammability Classification Rating 94V-0·Moisture Sensitivity: Level 1 per J-STD-020C ·Terminals: Finish ¾ Sn96.5Ag3.5. Solderable per MIL-STD-202, Method 208·Polarity: Cathode Band ·Marking: Type Number·Weight: 0.35 grams (approximate)FeaturesElectrical Characteristics @ T A = 25°C unless otherwise specifiedNotes: 3. Measured under thermal equilibrium and dc (I ZT) test conditions.4. The Zener impedance is derived from the 60 Hz ac voltage which results when an ac current having an rms value equal to10% of the Zener current (I ZT or I ZK) is superimposed on I ZT or I ZK. Zener impedance is measured at two points to insure asharp knee on the breakdown curve and to eliminate unstable units.Notes: 5. *Add "-A" or "-T" to the appropriate type number in Table 1. Example: 6.2V Zener = 1N4735A-A for ammo pack. 6. For packaging details, visit our website at /datasheets/ap02008.pdf00.20.40.60.81.004080120160200P , T O T A L P O W E R D I S S I P A T I O N (W )d T , AMBIENT TEMPERATURE ( C)A Fig.1 Power Dissipation vs Ambient Temperature0250515202530l, Lead Length (mm)Fig. 2 Typical Thermal Resistance vs. Lead Length10200501001501101001000110100V , ZENER VOLTAGE (V)Z Fig. 4 Typical Zener Impedance vs. Zener Voltage1101001000102030405060C ,D I O DE C A P A C I T A N C E (pF )j V , ZENER VOLTAGE (V)Z Fig.3, Junction Capacitance vs Zener Voltagef = 1MHz T = 25CA V = 0V R V = 2V R V = 5V R V = 20VR V = 30VR Ordering Information(Note 6)IMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.。

MAX3222/MAX3232/MAX3237/MAX32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容________________________________________________________________Maxim Integrated Products119-0273; Rev 7; 1/07MegaBaud和UCSP是Maxim Integrated Products, Inc.的商标。

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M A X 3222/M A X 3232/M A X 3237/M A X 32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 1:V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V.V CC ...........................................................................-0.3V to +6V V+ (Note 1)...............................................................-0.3V to +7V V- (Note 1)................................................................+0.3V to -7V V+ + V- (Note 1)...................................................................+13V Input VoltagesT_IN, SHDN , EN ...................................................-0.3V to +6V MBAUD...................................................-0.3V to (V CC + 0.3V)R_IN.................................................................................±25V Output VoltagesT_OUT...........................................................................±13.2V R_OUT....................................................-0.3V to (V CC + 0.3V)Short-Circuit DurationT_OUT....................................................................ContinuousContinuous Power Dissipation (T A = +70°C)16-Pin TSSOP (derate 6.7mW/°C above +70°C).............533mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C)....696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)........762mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)...842mW 18-Pin SO (derate 9.52mW/°C above +70°C)..............762mW 18-Pin Plastic DIP (derate 11.11mW/°C above +70°C)..889mW 20-Pin SSOP (derate 7.00mW/°C above +70°C).........559mW 20-Pin TSSOP (derate 8.0mW/°C above +70°C).............640mW 28-Pin TSSOP (derate 8.7mW/°C above +70°C).............696mW 28-Pin SSOP (derate 9.52mW/°C above +70°C).........762mW 28-Pin SO (derate 12.50mW/°C above +70°C).....................1W Operating Temperature RangesMAX32_ _C_ _.....................................................0°C to +70°C MAX32_ _E_ _ .................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX3222/MAX3232/MAX3237/MAX32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容_______________________________________________________________________________________3TIMING CHARACTERISTICS—MAX3222/MAX3232/MAX3241(V CC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)ELECTRICAL CHARACTERISTICS (continued)(V CC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)M A X 3222/M A X 3232/M A X 3237/M A X 32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容4________________________________________________________________________________________________________________________________________________________________典型工作特性(V CC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ω, T A = +25°C, unless otherwise noted.)-6-5-4-3-2-101234560MAX3222/MAX3232TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )20003000100040005000246810121416182022150MAX3222/MAX3232SLEW RATEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs )20003000100040005000510152025303540MAX3222/MAX3232SUPPLY CURRENT vs. LOAD CAPACITANCEWHEN TRANSMITTING DATALOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )20003000100040005000TIMING CHARACTERISTICS—MAX3237(V CC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:MAX3222/MAX3232/MAX3241: C1–C4 = 0.1µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF tested at 5.0V ±10%.MAX3237: C1–C4 = 0.1µF tested at 3.3V ±5%; C1–C4 = 0.22µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF tested at 5.0V ±10%.Note 3:Transmitter input hysteresis is typically 250mV.MAX3222/MAX3232/MAX3237/MAX32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容_______________________________________________________________________________________5-7.5-5.0-2.502.55.07.50MAX3241TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )2000300010004000500046810121416182022240MAX3241SLEW RATEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs )20003000100040005000510152025303545400MAX3241SUPPLY CURRENT vs. LOADCAPACITANCE WHEN TRANSMITTING DATALOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )20003000100040005000-7.5-5.0-2.502.55.07.50MAX3237TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )200030001000400050000102030504060700MAX3237SLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )500100015002000-7.5-5.0-2.502.55.07.50MAX3237TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )5001000150020001020304050600MAX3237SUPPLY CURRENT vs.LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )200030001000400050000246810120MAX3237SLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )2000300010004000500010302040506070MAX3237SKEW vs. LOAD CAPACITANCE(t PLH - t PHL )LOAD CAPACITANCE (pF)1000150050020002500____________________________________________________________________典型工作特性(续)(V CC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ω, T A = +25°C, unless otherwise noted.)M A X 3222/M A X 3232/M A X 3237/M A X 32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容6_________________________________________________________________________________________________________________________________________________________________引脚说明MAX3222/MAX3232/MAX3237/MAX32413.0V至5.5V、低功耗、1Mbps、真RS-232收发器，使用四只0.1µF外部电容_______________________________________________________________________________________7_______________________________详细说明双电荷泵电压转换器MAX3222/MAX3232/MAX3237/MAX3241的内部电源由两路稳压型电荷泵组成，只要输入电压(V CC )在3.0V至5.5V范围以内，即可提供+5.5V (倍压电荷泵)和-5.5V (反相电荷泵)输出电压。

MAX3000中文资料General DescriptionThe MAX3000E/MAX3001E/MAX3002–MAX3012 8-channel level translators provide the level shifting neces-sary to allow data transfer in a multivoltage system.Externally applied voltages, V CC and V L , set the logic lev-els on either side of the device. Logic signals present on the V L side of the device appear as a higher voltage logic signal on the V CC side of the device, and vice-versa.The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012feature an EN input that, when low, reduces the V CC and V L supply currents to <2μA. The MAX3000E/MAX3001E also have ±15kV ESD protection on the I/O V CC side for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps. The MAX3001E operates at a guaranteed data rate of 4Mbps. The MAX3002–MAX3012 operate at a guaranteed data rate of 20Mbps over the entire specified operating voltage range.The MAX3000E/MAX3001E/MAX3002–MAX3012 accept V L voltages from +1.2V to +5.5V and V CC voltages from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. The MAX3000E/MAX3001E/MAX3002–MAX3012 are available in 20-pin UCSP? and 20-pin TSSOP packages.ApplicationsCellphonesSPI? and MICROWIRE? Level Translation Low-Voltage ASIC Level Translation Smart Card Readers Cellphone Cradles Portable POS SystemsPortable Communication Devices Low-Cost Serial Interfaces GPSTelecommunications EquipmentFeatureso Guaranteed Data Rate Options230kbps (MAX3000E)4Mbps (MAX3001E)20Mbps (MAX3002–MAX3012)o Bidirectional Level Translation(MAX3000E/MAX3001E/MAX3002/MAX3003)o Unidirectional Level Translation (MAX3004–MAX3012)o Operation Down to +1.2V on V Lo ±15kV ESD Protection on I/O V CC Lines (MAX3000E/MAX3001E)o Ultra-Low 0.1μA Supply Current in Shutdown o Low Quiescent Current (<10μA)o UCSP and TSSOP PackagesMAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ Maxim Integrated Products1Ordering Information19-2672; Rev 1; 10/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .UCSP is a trademark of Maxim Integrated Products, Inc.SPI is a trademark of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor.*Future product—contact factory for availability.Ordering Information continued at end of data sheet.Pin Configurations and Functional Diagrams appear at endof data sheet.M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 2___________________________________________________________________ ____________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Th ese are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.All Voltages Referenced to GNDV CC ...........................................................................-0.3V to +6V V L...........................................................................................-0.3V to +6V I/O V CC_......................................................-0.3V to (V CC + 0.3V)I/O VL_...........................................................-0.3V to (V L + 0.3V)EN, EN A/B...............................................................-0.3V to +6V Short-Circuit Duration I/O V L_, I/O V CC_to GND .......Continuous Continuous Power Dissipation (T A = +70°C)20-Pin TSSOP (derate 7.0mW/°C above +70°C).........559mW 20-Pin UCSP (derate 10mW/°C above +70°C)............800mW Operating Temperature RangesMAX3001EAUP .............................................-40°C to +125°C MAX300_EE_P.................................................-40°C to +85°C MAX30_ _E_P ..................................................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range ............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICSMAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ _______________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +1.65V to +5.5V, V L = +1.2V to V CC , EN = V L (MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = V L or 0(MAX3003), T= T to T . Typical values are at V = +1.65V, V = +1.2V, and T = +25°C.) (Notes 1, 2)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 4________________________________________________________________ _______________________TIMING CHARACTERISTICSNote 2:For normal operation, ensure that V L < (V CC + 0.3V). During power-up, V L > (V CC + 0.3V) does not damage the device.MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ _______________________5TIMING CHARACTERISTICS (continued)(V CC = +1.65V to +5.5V, V L = +1.2V to V CC , EN = V L (MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = V L or 0(MAX3003), T= T to T . Typical values are at V = +1.65V, V = +1.2V, and T = +25°C.) (Note s 1, 2)Note 3:V CC from device 1 must equal V CC of device 2; V L from device 1 must equal V L of device 2.M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 6___________________________________________________________________ ____________________TIMING CHARACTERISTICS —MAX3002–MAX3012MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ _______________________7Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)2000150010005000-4010-15356085TEMPERATURE (°C)V L S U P P L Y C U R R E N T (μA )V L SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)0200060004000800010,0001.52.53.02.03.54.05.05.5SUPPLY VOLTAGE (V)V C C S U P P L Y C U R R E N T (μA )V CC SUPPLY CURRENT vs. SUPPLY VOLTAGE (DRIVING I/O V L , V L = 1.8V) 01002003004005006001.52.52.03.03.54.04.55.5V L SUPPLY CURRENT vs. SUPPLY VOLTAGE(DRIVING I/O V L , V L = 1.8V)SUPPLY VOLTAGE (V)V L S U P P L Y C U R R E N T (μA )05001500100020002500-4010-15356085TEMPERATURE (°C)V C C S U P P L Y C U R R E N T (μA )V CC SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)0204060100104050203060708090100CAPACITIVE LOAD (pF)V L S U P P L Y C U R R E N T (μA )V L SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)020001000400030006000500070001030402050608090100CAPACITIVE LOAD (pF)V C C S U P P L Y C U R R E N T (μA )V CC SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )90807060503020500100015002000010100MAX3000ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 8___________________________________________________________________ ____________________Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)0102030405060103020405060708090100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3001ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)64201030204050CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3002–MAX3012RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)050010001500200010206080100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3000ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)304050900102030405060103020405060708090100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3001ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)43211020152530CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3002–MAX3012RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)100300400500104050203060708090100CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3000EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ _______________________9Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)100200300400500600103020405060708090100CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3000EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)03961215CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )1030204050MAX3001EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)013245CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s)1020152530MAX3002–MAX3012PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)1μsMAX3000E RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 230kbps) GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc19I/O V CC_2V/div 40nsMAX3001E RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 4Mbps) GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc20I/O V CC_2V/div 10nsMAX3002–MAX3012 RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 20Mbps)GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc21I/O V CC_2V/div 0105201525301030204050CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3001EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)428610121020152530CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s ) MAX3002–MAX3012PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 10__________________________________________________________________ ____________________Pin DescriptionMAX3000E/MAX3001E/MAX3002MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators______________________________________________________________________________________11Pin Description (continued)MAX3003M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 12__________________________________________________________________ ____________________Pin Description (continued)MAX3004–MAX3012MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ ______________________13______________________________________________T estCircuits/Timing DiagramsFigure 1a. Driving I/O V L Figure 1b. Timing for Driving I/O V LFigure 2a. Driving I/O V CCFigure 2b. Timing for Driving I/O V CCM A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 14________________________________________________________________ _______________________________________________________T est Circuits/Timing Diagrams (continued)Figure 3. Propagation Delay from I/O V L to I/O V CC After ENFigure 4. Propagation Delay from I/O V CC to I/O V L After ENMAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ES D-Protected, 0.1μA,35Mbps, 8-Channel Level Translators________________________________________________________________ ______________________15Detailed DescriptionThe MAX3000E/MAX3001E/MAX3002–MAX3012 logic-level translators provide the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V CC and V L , set the logic levels on either side of the device. Logicsignals present on the V L side of the device appear as a higher voltage logic signal on the V CC side of the device, and vice-versa.The MAX3000E/MAX3001E/MAX3002/MAX3003 are bidirectional level translators allowing data translation in either direction (V L ?V CC ) on any single data line.The MAX3004–MAX3012 unidirectional level translators level shift data in one direction (V L →V CC or V CC →V L ) on any single data line. The MAX3000E/MAX3001E/MAX3002–MAX3012 accept V L from +1.2V to +5.5V. All devices have V CC ranging from +1.65V to +5.5V, mak-ing them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012 feature an output enable mode that reduces V CC supply current to less than 2μA, and V L supply current to less than 2μA when in shutdown. The MAX3000E/MAX3001E have ±15kV E SD protection on the V CC side for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps; the MAX3001E oper-ates at a guaranteed data rate of 4Mbps and the MAX3002–MAX3012 are guaranteed with a data rate of 20Mbps of operation over the entire specified operating voltage range.Level TranslationFor proper operation, ensure that +1.65V ≤V CC ≤+5.5V,+1.2V ≤V L ≤+5.5V, and V L ≤V CC . During power-up sequencing, V L ≥V CC does not damage th e device.During power-supply sequencing, when V CC is floating and V L is powering up, up to 10mA current can be sourced to each load on the V L side, yet the device does not latch up.The maximum data rate also depends heavily on the load capacitance (see the Typical Operating Characteristics ), outputimpedance of the driver, and the operational voltage range (see the Timing Characteristics ).Input Driver RequirementsThe MAX3001E/MAX3002–MAX3012 architecture is based on a one-shot accelerator output stage. See Figure 5. Accelerator output stages are always in three-state except when there is a transition on any of the translators on the input side, either I/O V L or I/O V CC .Then, a short pulse is generated during which the accel-erator output stages become active and charge/dis-charge the capacitances at the I/Os. Due to its bidirectional nature, both input stages become active during the one-shot pulse. This can lead to some current feeding into the external source that is driving the trans-lator. However, this behavior helps to speed up the tran-sition on the driven side.For proper operation, the driver has to meet the follow-ing conditions: 50?maximum output impedance and 20mA minimum output current (for 20Mbps versions),400?maximum output impedance and 4mA minimum output current (for 4Mbps versions), 1k ?maximum out-put impedance and 1mA minimum output current (for 230kbps versions). Figure 6 shows a typical input cur-rent vs. input voltage.Enable Output Mode (EN, EN A/B)The MAX3000E/MAX3001E/MAX3002 and the MAX3004–MAX3012 feature an EN input, and the MAX3003 has an EN A/B input. Pull EN low to set the MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012s ’ I/O V CC 1through I/O V CC 8 in three-state output mode, while I/O V L 1 through I/O V L 8 have internal 6k ?pulldown resis-tors. Drive EN to logic high (V L ) for normal operation. For the MAX3003,pull EN A/B low to place channels 1B through 4B in active mode, while channels 1A through 4A are in three-state mode. Drive EN A/B to logic high (V L ) to enable channels 1A through 4A, while channels 1B through 4B remain in three-state mode.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The I/O V CC lines have extra protection against static discharge. Maxim ’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, three-state output mode, and powered down. After an ESD event, Maxim ’s E versions keep working without latchup, whereas competing products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways. The I/O V CC lines of the MAX3000E/MAX3001E are char-acterized for protection to ±15kV using the Human Body Model.M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators 16__________________________________________________________________ ____________________ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 7a shows the Human Body Model and Figure 7b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the test device through a 1.5k ?resistor.Machine ModelThe Machine Model for ESD tests all pins using a 200pFstorage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Applications InformationPower-Supply DecouplingTo reduce ripple and the chance of transmitting incor-rect data, bypass V L and V CC to ground with a 0.1μF capacitor. T o ensure full ±15kV ESD protection, bypass V CC to ground with a 1μF capacitor. Place all capaci-tors as close to the power-supply inputs as possible.I 2C Level TranslationFor I 2C level translation for I 2C applications, please refer to the MAX3372E –MAX3379E/MAX3390E –MAX3393E datasheet.Unidirectional vs. Bidirectional LevelTranslatorThe MAX3000E/MAX3001E/MAX3002/MAX3003 can also be used to translate signals without inversion.These devices provide the smallest solution (UCSP package) for unidirectional level translation without inversion.Figure 5. MAX3001E/MAX3002–MAX3012 Simplified Functional Diagram (1 I/O Line)MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level Translators17Selector Guide**See Table 1.Table 1. Data RateM A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level TranslatorsMAX3000E/MAX3001E/MAX3002 Functional Diagram MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1μA,35Mbps, 8-Channel Level TranslatorsMAX3003 Functional Diagram。

Si4731-DEMOS I4731 演示板使用手册1. 特性⏹支持全球范围内的所有FM频带, 76–108 MHz⏹支持全球范围内的所有AM频带, 520–1710 kHz⏹自动搜索 / 全频带扫描⏹同时支持48个 FM 和48个 AM 电台存储⏹FM 无线数据服务 (RDS) 解码功能 (Pi Pty Ps RT CT AF 显示)⏹根据RDS信息自动调整时间/日期⏹自动切换备选频率(AF)⏹自动检测并设置AM 步长⏹单电池（最低电压0.9 V）或三节电池工作模式⏹可调整的参数包括：● 信道步长● 自动搜索有效台时SNR/RSSI 参考门限值● 软静音的 SNR/RSSI参考门限值● 信道滤波器带宽● 立体声和单声道的混合度门限值● 频带的上下端限制● 预加重(50 us or 75 us)● AM 步长检测判断的门限值⏹立体声指示⏹带静音功能的音量控制功能⏹AM/FM 信道频率显示及信道信号质量显示⏹电池电压显示⏹万年历功能⏹ 3 x 4 矩阵键盘控制接口⏹ 数字健直接输入电台频率功能2. 产品简介3. 产品简介这套 Skyworks Si4731 演示板所实现的AM/FM 收音机设计方案具有大量的增强特性，这些特性充分展示了Skyworks 的AM/FM 及MCU 芯片的强大功能。

Si4731芯片采用20 管脚的3 x 3mm QFN封装，这与 Skyworks 的所有具有FM 接收，发射及收发功能的Si47xx 系列兼容。

主控芯片采用 Skyworks的内部带振荡器和DC-DC 的C8051F930 MCU。

显示部分采用了一款79 x 101的点阵型LCD，能够显示包括RDS信息在内的各种信息。

整个演示板可由3节AAA电池供电或者一节AA电池通过C8051F930 MCU内部的dc-dc转换器供电。

SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Si4731-DEMO2SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•4. DescriptionFigure 1 and Figure 2 shows the physical layout of the board with key components indicated.Figure 1.Si4731-DEMO Board Top Side in Calendar ModeFigure 2.Si4731-DEMO Board Bottom SideU3J5Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 3Power:S14: 3 cell / 1 cell selection S15: Power on / offAudio connectors:J14: Audio input (unused)J15: Audio headphone output Antenna selections:J1: FM whip antenna connectorJ2: FM SMA connector for FM conductive testing J3: AM SMA connector for AM conductive testing J4: AM air loop antenna wire connector J5: JTAG connectorT1: Transformer for AM air loop operation (not shown)JP1: FM antenna input selectionJP2: AM signal input selectionJP3: AM antenna type selectionOpen: AM ferrite loop stick antenna Short: AM air loop antenna JP4: FM PCB antenna selectionShort: Embedded PCB trace as FM short antenna for Si4704/05/1x/2x Open: No PCB short antennaMain components:LCD: 79x101 dot matrix LCDU1: Skyworks Solutions Si4731 AM/FM/RDS tuner U2: Audio amplifierU3: Skyworks Solutions C8051F930 MCU U4: LDOControl interface:Reset Key: Reset buttonKeyPad: 3x4 matrix buttons for human interface1-2: FM SMA (J2)1-3: FM whip antenna (J1)1-4: FM headphone (J15)4211-2: AM ferrite loop stick 1-3: AM air loop (J4)1-4: AM SMA (J3)341Si4731-DEMO4SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•5. OperationThis section describes the operating modes of the Si4731-DEMO board. The board provides two major modes of operation: Calendar and AM/FM radio.5.1. Calendar ModeUpon power on, the board automatically enters the Calendar Mode and displays the following information:⏹ Year-month-day ⏹ Hour-minute ⏹ Day of the week ⏹ Battery voltageThe demo board display in Calendar Mode is illustrated in Figure 1.In Calendar Mode, the SET/9 key is used to enter the setup menu. The M+/3 and M-/7 keys are used to select different adjustable items (hour, minutes, year, day, month). The UP/4 and DOWN/8 keys are used to set the value for each selected item.The Calendar Mode date and time can also be set automatically with RDS Current Time (CT) information from a broadcast radio station as described in the following section.5.2. AM/FM Radio ModeFrom Calendar Mode, the POWER button is used to enter AM/FM Radio Mode which displays the following information:1.Signal SNR indicator2.Signal RSSI indicator3.Band frequency indicator4.Battery voltage indicator5.Band frequency unit indicator6.Stereo/mono indicator7.Volume indicator8.Band indicator9.RDS informationThe demo board display in AM/FM Radio Mode is illustrated in Figure 3 and Figure 4:Figure 3.LCD Display in FM Radio Mode712345689Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 5Figure 4.LCD Display in AM Radio Mode5.2.1. Band SelectionIn Radio Mode, the BANDS/0 key is used to switch between the AM and FM bands.5.2.2. Time/Date Auto SetMany radio stations broadcast RDS data including clock/time CT information. The AM/FM demo board can capture this information to automatically set the time and date. In FM Mode, when RDS CT information is received, the CT indicator will be displayed. The MEM/AL/1 button can be used to update the calendar date and time with the CT information. CT information is not available on all radio stations and is normally sent only once per minute.5.2.3. Alternative Frequency (AF) SwitchingThe AM/FM demo board monitors RDS for alternate frequency (AF) information. When RDS alternative frequency information is received, the AF indicator will be displayed. If the signal quality of the currently tuned station degrades, the radio will automatically change to one of the alternative frequency stations.5.2.4. Tune/SeekIn Radio Mode, pressing the UP/4 or DOWN/8 button for less than 0.5s will tune the frequency by the preset step size. Holding the button for longer than 0.5 s but less than 3 s will perform a station seek.5.2.5. ScanIn Radio Mode, the MSCAN/5 button is used to scan for all valid stations in the selected band and will automatically save them into preset selections. After a scan operation, the M+/3 and M-/7 keys will cycle through the preset station list. Scan operation can be aborted by pressing MSCAN/5 again, or by pressing the UP/4 or DOWN/8 key.5.2.6. Parameter SettingsIn Radio Mode, the SET/9 key is used to select the parameter setup menu as illustrated in Figure 5 and Figure 6.The M+/3 or M-/7 keys will cycle through the available items in the menu. The UP/4 or DOWN/8 keys are used to set the desired value for each item. Select “Yes” under “Factory Def” to go back to the factory default settings for all items.1324758Si4731-DEMO6SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Figure 5.LCD Display in FM Setup MenuFigure 6.LCD Display in AM Setup Menu5.2.7. Digit KeysIn Radio Mode, the FUNC/DIGIT key is used to switch the keypad to digital input mode. A “Dig” indicator is displayed in this mode and all keys marked with a digit are used to input a channel frequency. A frequency is considered valid if it lies within the band limits. If a non-valid frequency is entered, the closest band limit will be entered and displayed.5.2.8. VolumeThe VOL+/2 or VOL–/6 keys are used to adjust the volume up or down. The board audio output will be muted when volume is at the lowest setting.5.2.9. AM Channel Spacing Auto SetIn AM Mode, the MEM/AL/1 key will automatically detect and set the channel spacing to either 9 or 10kHz. The detection criterion determines which channel spacing results in more valid stations during a band scan. The number for the detection threshold is adjustable as described in Table 2. This operation can be aborted by pressingthe MEM/AL/1 key again.Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 76. Human interfaceThere are 12 keys for controlling the demo board as shown in Figure 7:Figure7.Human Interface KeysEach key can have a different function under each operating condition:⏹ Calendar/Powerdown Mode: Radio function is disabled. LCD displays Calendar. Buttons can be used to settime, etc.⏹ Radio AM/FM Mode: Tuner IC works in powerup mode (FM or AM). Radio function is enabled. LCD displaysthe radio station parameters. Buttons are used to adjust radio settings.⏹Digital Input Mode : Tuner IC works in powerup mode (FM or AM). Radio function is enabled. LCD displaysthe radio station parameters. The buttons are used for direct digit input of station frequencies.The functions of the buttons are summarized in Table 1:Table 1. Key Function DescriptionButton/Mode Calendar ModeTuner Off Radio AM/FM ModeTuner OnMEM/AL/1None FM Mode: Used to adjust calendar using received RDS CT.AM Mode: Used to automatically detect and set the channel spacing.POWER Enable radio Disable radio function and enter calendar mode.(Radio parameters will be saved to Flash).SET Enter calendar setupmenuEnter radio setup menu. (Parameter list in Table 2)BANDSNoneChange between FM and AM band.Note:Combination keying is entered and exited from Radio Mode by pressing and holding the SET key then pressing theBANDS key. A combination of the SET and the MSCAN keys will cycle through the available display items.Si4731-DEMO8SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•The FM and AM radio parameters which can be configured from setup menu are listed below in Table 2.UP/DOWNHold Time < 0.5s In setup menu, change the current calendar item by onestep.In setup menu, change the current parameter by one step.In radio mode, tune up or down by one step.0.5s <Hold Time < 3s Perform a station seek.Hold Time > 3s Fast parameter setting Fast parameter setting.MSCAN NoneScan for all valid stations and save them to presets.M+/ M– In setup menu, select next calendar item.In setup menu, select next adjustable item.In radio mode, tune to the next preset station.Vol+ / Vol–< 3s NoneIncrease or decrease volume 1 step.> 3sQuickly increase or decrease volume.FUNC/DIGIT None Shift the keyboard between normal function and digital input mode.Combination keyingNone A: Radio IC version B: Firmware version C: Varactor reading D: AGC statusTable 2. Radio Configuration ParametersFM ParameterAM ParameterSpacing: 50/100/200kHz Default: 100kHz Spacing: 1/9/10kHz Default: 9 kHzRSSI Seek: 0–127dBµV Default: 20dBµV RSSI Seek: (0–63dBµV Default: 25dBµV SNR Seek: 0–127 dB Default: 03dBSNR Seek: 0–63dB Default: 05dBPre-emphasis: 50 or 75µs Default: 75µsPre-emphasis: 00 disable, 50µs Default: 00Band High Threshold: Max 108MHz Default:107.90MHzBand High Threshold: Max 1710kHz Default:1710kHzTable 1. Key Function Description (Continued)Button/Mode Calendar Mode Tuner Off Radio AM/FM ModeTuner OnNote:Combination keying is entered and exited from Radio Mode by pressing and holding the SET key then pressing theBANDS key. A combination of the SET and the MSCAN keys will cycle through the available display items.Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 9Band Low Threshold: min 76MHz Default: 87.50MHzBand Low Threshold: min 520 kHz Default: 522kHzChannel Filter: 00/40/60/80/100kHz Default: 00 (Auto)Channel Filter: 1/2/3/4/6 kHz Default: 2kHz RClock: 0: AFC disable 32763~32773Default: 32768RClock: 0 AFC disable 32763~32773Default: 32768Smute Rate: 0–255Default: 64Smute Rate: 0–255Default: 64Smute SNR: 0–15dB Default: 4dBSmute SNR: 0–63dB Default: 10dBSmute Attenuation: (0–31dB)Default: 16dBSmute Attenuation: 0–63dB Default: 16dB Blend Mono: 0–127dBµV Default: 30dBµVSmute Slop: 1–5Default: 2Blend Stereo: 0–127dBuV Default: 49dBuV Set Factory Default: on/off Default:offAGC Override: on/off Default: off AM Channel Spacing Detection Threshold: 1,2,3,4,5,6 Default = 2AGC Index: 0–26Default : 0Set Factory Default: on/off Default:off RDS/RBDS Default: RBDSTable 2. Radio Configuration Parameters (Continued)Si4731-DEMO7. Bill of Materials⏹ C8051F930 MCU with 64kB Flash program memory, 4kB RAM, and built-in dc-dc converter⏹ AM/FM receiver IC Si4731 with external 32768Hz crystal oscillator support⏹ ST7588T LCD driver IC⏹ LM4910 Audio amplifier IC⏹ See Table3 for details.Table 3. Si4731 Demo Board Bill of MaterialsItem Qty Reference Description Value13C1, C16, C29 CAP,SM,0603,X7R0.47µF22C4, C13CAP,SM,0603,X7R 4.7µF38C15, C23-28, C41 CAP,SM,0603,X7R1µF46C10, C14, C19, C37, C39–40 CAP,SM,0603,X7R0.1µF54C2 ,C3, C21–22 CAP,SM,0603,X7R22pF62C8, C12 CAP,SM,0603,X7R220pF72C11, C18 CAP,SM,0603,X7R820pF83C5–7 CAP,SM,0603,X7R100pF94C17, C38, C44, C46 CAP,SM,0603,X7R1nF108C32–36, C54–C55 ,C43 CAP,SM,0603,X7R NP113C30 ,C45, C53 RES,SM,06030R121C9 CAP,SM,1210,tantalum100µF/6.3V 131C31 CAP,SM,1210,tantalum220µF/4V 144R1–2, R3 ,R25 RES,SM,06030R 1511R7, R27, R29–32, R34, R36–39 RES,SM,060310kW162R5, R11 RES,SM,060312kW174R20, R22–23, R28 RES,SM,06031kW182R4,R6 RES,SM,06035k6192R8, R10 RES,SM,06036k8 203R9, R16–17 RES,SM,06032kW212R18–19 RES,SM,0603100R 225R15, R21 ,R24, R26 ,R35 RES,SM,0603NP 231R12 RES,SM,06034k7 243R13–14, R33 RES,SM,0603100k 254B1–4 FERRITE BEAD,SM,08052k5/100M 261L1 IND,SM,0603120nH10SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 11271L2 IND,SM,0603270nH 282L3–4 RES,SM,06030R 291U1 Si47xx, MLP20-3MM Si47xx 301U2LM4910,SOP8 LM4910MA 311U4REGLATOR,SOT23 XC62FP3002MR 321U3C8051F920/30-GQ,LQFP32 C8051F920/30-GQ331D1DIODE,SM,ESD,SOT23BAV99 342D2–4DIODE,SM,ESD,SOT23CM1214-01ST/SO351Q1TRANSISTOR NPN SOT232N3904361T1 MW AIR LOOP ANTENNA TRANS -FORMERSLMWTF01371J5 CONN,TH,2X10,HDR381J4 Wire holder 392Y1–2 Crystal32.768kHz 402J14–15 Stereo earphone jack 3.5mm 412JP3–4 CONN,TH,1X2,HDR CONN,TH,1X2,HDR 422JP1–2 CONN,TH,1X4,HDR CONN,TH,1X4,HDR 434J10–13 CONN,TH,1X5,HDR CONN,TH,1X5,HDR441J1 BNC_VERTICAL BNC for whip 452J2-3 SMA_VERTICALSMA for FM/AM461S14SLIDE SWITCH With 3 Double Pole Double Throw Switches inside 471S15Single Pole Double Throw Switch4813S1–13 Button Switch491LCD1 LCD101*79 dots 501ANT2 MW ferrite antenna 220µH 511ANT3 MW loop antenna 10–20µH 521BAT2Battery BOX ,AAA*3 SIZE 531BAT1Battery BOX ,AA SIZEDC–DC Power Block Circuit Part List 541L5IND,SM,10080.68µH 551C42CAP ,SM,0603,X7R4.7µFTable 3. Si4731 Demo Board Bill of Materials (Continued)Si4731-DEMO12SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•8. SchematicsF i g u r e 8.S i 4731-D E M O B o a r d S c h e m a t i c —R a d i o a n d A u d i o P o r t i o n sCopyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. 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高频信号发生器_______________概述MAX038是一种只需极少外围电路就能实现高 频、高精度输出三角波、锯齿波、正弦波、方波 和脉冲波的精密高频函数发生器芯片。

内部提供 的2.5V 基准电压和一个外接电阻和电容可以控制 输出频率范围在0.1Hz 到20MHz 。

占空比可在较大 的范围内由一个±2.3V的线性信号控制变化，便 于进行脉冲宽度调制和产生锯齿波。

频率调整和 频率扫描可以用同样的方式实现。

占空比和频率 控制是独立的。

通过设置2个TTL 逻辑地址引脚合适的逻辑电 平，能设定正弦波，方波或三角波的输出。

所有 波形的输出都是峰-峰值为±2VP -P 的信号。

低阻 抗输出能力可以达到±20mA。

____________________________性能o 频率调节范围：0.1Hz 到20MHzo 三角波, 锯齿波, 正弦波, 方波和脉冲波 o 频率和占空比独立可调 o 频率扫描范围：350：1 o 可控占空比：15%到85% o 低阻抗输出缓冲器： 0.1Ω o 低失真正弦波： 0.75% o 低温度漂移： 200ppm/°C______________型号信息TTL 逻辑地址引脚SYNC 从内部振荡器输出占 空比固定为50%的信号，不受其它波占空比的影 响，从而同步系统中其它振荡器。

内部振荡器 允许被连接着相位检波器输入端（PDI ）的外部 TTL 时钟同步。

型号 MAX038CPP MAX038CWP MAX038C/D MAX038EPP MAX038EWP工作温度 0°C 到 +70°C 0°C 到 +70°C 0°C 到 +70°C -40°C 到 +85°C -40°C 到 +85°C引脚--封装 20 Plastic DIP 20 SO Dice* 20 Plastic DIP 20 SO.__________________应用精密函数信号发生器 压控振荡器 频率调制器*Contact factory for dice specifications.__________________引脚图脉宽调制器 锁相环 频率合成器FSK 发生器（正弦波和方波）________________________________________________________________ Maxim Integrated Products1For free samples & the latest literature: , or phone 1-800-998-8800. For small orders, phone 408-737-7600 ext. 3468MAX038高频信号发生器图1. 内部结构及基本工作电路_______________ 详细说明MAX038是一种高频函数信号发生器，它可以使 用最少的外部元件而产生低失真正弦波，三角波， 锯齿波，方波（脉冲波）。

General DescriptionThe MAX4731/MAX4732/MAX4733 low-voltage, dual,single-pole/single-throw (SPST) analog switches oper-ate from a single +2V to +11V supply and handle Rail-to-Rail ®analog signals. These switches exhibit low leakage current (0.1nA) and consume less than 0.5nW (typ) of quiescent power, making them ideal for battery-powered applications.When powered from a +3V supply, these switches fea-ture 50Ω(max) on-resistance (R ON ) with 3.5Ω(max)matching between channels, and 9Ω(max) flatness over the specified signal range.The MAX4731 has two normally open (NO) switches,the MAX4732 has two normally closed (NC) switches,and the MAX4733 has one NO and one NC switch. The MAX4731/MAX4732/MAX4733 are available in a 9-bump chip-scale package (UCSP™) and an 8-pin µMAX package. The tiny UCSP occupies a 1.52mm ✕1.52mm area and significantly reduces the required PC board area.ApplicationsBattery-Powered Systems Audio/Video-Signal RoutingLow-Voltage Data-Acquisition Systems Cell PhonesCommunications Circuits PDAsFeatureso 1.52mm ✕1.52mm UCSP Package o Guaranteed On-Resistance (R ON )25Ω(max) at +5V 50Ω(max) at +3Vo On-Resistance Matching3Ω(max) at +5V 3.5Ω(max) at +3Vo Guaranteed <0.1nA Leakage Current at T A = +25°Co Single-Supply Operation from +2.0V to +11V o TTL/CMOS-Logic Compatible o -108dB Crosstalk (1MHz)o -72dB Off-Isolation (1MHz)o Low Power Consumption: 0.5nW (typ)o Rail-to-Rail Signal HandlingMAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP________________________________________________________________Maxim Integrated Products 1Ordering Information19-2645; Rev 0; 10/02For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Pin Configurations/Functional Diagrams/Truth TablesNote:Requires special solder temperature profile described in the Absolute Maximum Ratings section.**UCSP reliability is integrally linked to the user’s assemblymethods, circuit board material, and environment. See the UCSP Reliability section of this data sheet for more information.UCSP is a trademark of Maxim Integrated Products, Inc.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.*Future product—contact factory for availability.M A X 4731/M A X 4732/M A X 473350ΩDual SPST Analog Switches in UCSP 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS —Single +3V Supply(V+ = +3V ±10%, V IH = +2.0V, V IL = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V+ = +3V, T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All Voltages Referenced to GND)V+...........................................................................-0.3V to +12V IN_, COM_, NO_, NC_ (Note 1)....................-0.3V to (V+ + 0.3V)Continuous Current (any pin)...........................................±10mA Peak Current (any pin, pulsed at 1ms, 10% duty cycle)...±20mA Continuous Power Dissipation (T A = +70°C)8-Pin µMAX (derate 4.5mW/°C above +70°C).............362mW 9-Bump UCSP (derate 4.7mW/°C above +70°C).........379mWOperating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Maximum Junction Temperature.....................................+150°C Lead Temperature (soldering, 10s).................................+300°C Bump Temperature (soldering, Note 2)Infrared (15s)...............................................................+220°C Vapor Phase (60s).......................................................+215°CNote 1:Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current tomaximum current rating.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.MAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS —Single +3V Supply (continued)(V+ = +3V ±10%, V IH = +2.0V, V IL = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V+ = +3V, T A = +25°C.)(Notes 3, 4)M A X 4731/M A X 4732/M A X 473350ΩDual SPST Analog Switches in UCSPELECTRICAL CHARACTERISTICS —Single +5V Supply(V+ = +5V ±10%, V IH = +2.0V, V IL = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V+ = +5V, T A = +25°C.)MAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP_______________________________________________________________________________________5Note 3:The algebraic convention, where the most negative value is a minimum and the most positive value a maximum, is used in this data sheet.Note 4:UCSP parts are 100% tested at +25°C only, and guaranteed by design over temperature. µMAX parts are 100% tested at+85°C and +25°C and guaranteed by design over temperature.Note 5:∆R ON = R ON(MAX)- R ON(MIN).Note 6:UCSP on-resistance matching between channels and on-resistance flatness guaranteed by design.Note 7:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over thespecified analog signal range.Note 8:Guaranteed by design.Note 9:Off-Isolation = 20 log 10(V NO_/V COM_), V NO_= output, V COM_= input to off switch.Note 10:Between any two switches.ELECTRICAL CHARACTERISTICS —Single +5V Supply(V+ = +5V ±10%, V IH = +2.0V, V IL = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V+ = +5V, T A = +25°C.)(Notes 3, 4)M A X 4731/M A X 4732/M A X 473350ΩDual SPST Analog Switches in UCSP 6_______________________________________________________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)ON-RESISTANCE vs. V COMV COM (V)R O N (Ω)864210203040500010ON-RESISTANCE vs. V COM (V+ = +2.5V)V COM (V)R O N (Ω)2.01.51.00.51015202530502.5ON-RESISTANCE vs. V COM (V+ = +3.0V)V COM (V)R O N (Ω)2.01.51.00.51015202530050 3.02.5ON-RESISTANCE vs. V COM(V+ = +5.0V)V COM (V)R O N (Ω)432148121620005ON/OFF-LEAKAGE CURRENTvs. TEMPERATURETEMPERATURE (°C)O N /O F F -L E A K A G E C U R R E N T (p A )604020-2011010010000-4080CHARGE INJECTION vs. V COMV COM (V)C H A R G E I N J E C T I O N (p C )432151015202530354045005SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (n A )8060-20020400.51.01.52.02.53.03.54.00-40LOGIC THRESHOLD VOLTAGE vs. SUPPLY VOLTAGEV+ (V)L O G I C T H R E S H O L D V O L T A G E (V )108640.51.01.52.02.53.002TURN-ON/OFF TIME vs. SUPPLY VOLTAGEV+ (V)t O N /O F F (n s )864204060801001200210Applications InformationOperating Considerations forHigh-Voltage SupplyThe MAX4731/MAX4732/MAX4733 operate to +11V with some precautions. The absolute maximum rating for V+ is +12V (referenced to G ND). When operating near this region, bypass V+ with a minimum 0.1µF capacitor to ground as close to the IC as possible.Logic LevelsThe MAX4731/MAX4732/MAX4733 are TTL compatible when powered from a single +5V supply. When pow-ered from other supply voltages, the logic inputs shouldIN1 and IN2 should be driven low to 0V and high to 11V. With a +3.3V supply, IN1 and IN2 should be dri-ven low to 0V and high to 3.3V. Driving IN1 and IN2 rail-to-rail minimizes power consumption.Analog Signal LevelsAnalog signals that range over the entire supply volt-age (G ND to V+) pass with very little change in R ON (see Typical Operating Characteristics ). The bidirec-tional switches allow NO_, NC_, and COM_ connec-tions to be used as either inputs or outputs.MAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP_______________________________________________________________________________________7Pin DescriptionTypical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)TURN-ON/OFF TIME vs. TEMPERATURETEMPERATURE (°C)t O N /O F F (n s )6040-202010203040506070800-4080FREQUENCY RESPONSEFREQUENCY (Hz)L O S S (d B )100M10M1M100k-100-80-60-40-200-12010k1GTOTAL HARMONIC DISTORTIONvs. FREQUENCYFREQUENCY (Hz)T H D (%)10k1k 1000.0010.010.110.000110100kM A X 4731/M A X 4732/M A X 4733Power-Supply Sequencing andOvervoltage ProtectionCAUTION: Do not exceed the absolute maximum ratings. Stresses beyond the listed ratings can cause permanent damage to the devices.Proper power-supply sequencing is recommended for all CMOS devices. Always apply V+ before applying analog signals, especially if the analog signal is not current limited. If this sequencing is not possible, and if the analog inputs are not current limited to <20mA, add a small-signal diode, D1, as shown in Figure 1. If the analog signal can dip below G ND, add D2. Adding protection diodes reduces the analog signal range to a diode drop (about 0.7V) below V+ (for D1), and to a diode drop above ground (for D2). Leakage is unaffect-ed by adding the diodes. On-resistance increases slightly at low supply voltages. Maximum supply volt-age (V+) must not exceed +11V.Adding protection diodes causes the logic thresholds to be shifted relative to the power-supply rails. The most significant shift occurs when using low supply voltages (+5V or less). With a +5V supply, TTL compatibility is not guaranteed when protection diodes are added.Driving IN1 and IN2 all the way to the supply rails (i.e.,to a diode drop higher than the V+ pin, or to a diode drop lower than the GND pin) is always acceptable.Protection diodes D1 and D2 also protect against some overvoltage situations. Using the circuit in Figure 1, no damage results if the supply voltage is below the absolute maximum rating (+12V) and if a fault voltage up to the absolute maximum rating (V+ + 0.3V) is applied to an analog signal terminal.UCSP Package ConsiderationFor general UCSP package information and PC layout considerations, please refer to the Maxim Application Note, “Wafer-Level Chip-Scale Packages.”UCSP ReliabilityThe chip-scale package (UCSP) represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user ’s assembly methods, circuit board material,and usage environment. The user should closely review these areas when considering a UCSP. Performance through Operation Life Test and Moisture Resistance is equal to conventional package technology as the wafer-fabrication process primarily determines it.However, this form factor may not perform equally to a packaged product through traditional mechanical relia-bility tests.Mechanical stress performance is a greater considera-tion for a UCSP. UCSP solder joint contact integrity must be considered since the package is attached through direct solder contact to the user ’s PC board.Testing done to characterize the UCSP reliability perfor-mance shows that it is capable of performing reliably through environmental stresses. Results of environmen-tal stress test and additional usage data and recom-mendations are detailed in the UCSP application note,which can be found on Maxim ’s website at .50ΩDual SPST Analog Switches in UCSP 8_______________________________________________________________________________________Figure 1. Overvoltage Protection Using External Blocking DiodesTest Circuits/Timing DiagramsMAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP_______________________________________________________________________________________9Test Circuits/Timing Diagrams (continued)M A X 4731/M A X 4732/M A X 473350ΩDual SPST Analog Switches in UCSP 10______________________________________________________________________________________Figure 5. Off-Isolation/On-Channel BandwidthPin Configurations/Functional Diagrams/Truth Tables (continued)Chip InformationTRANSITOR COUNT: 68PROCESS: CMOSTest Circuits/Timing Diagrams (continued)MAX4731/MAX4732/MAX473350ΩDual SPST Analog Switches in UCSP______________________________________________________________________________________11Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 4731/M A X 4732/M A X 473350ΩDual SPST Analog Switches in UCSP Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2002 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

V CC to GND ............................................................-0.3V to +6VV+ to GND (Note 1).................................................-0.3V to +7VV- to GND (Note 1)..................................................+0.3V to -7VV+ + |V-| (Note 1) ................................................................+13VInput VoltagesT_IN, EN , SHDN , MBAUD to GND .....................-0.3V to +6VR_IN to GND ...................................................................±25VOutput VoltagesT_OUT to GND .............................................................±13.2VR_OUT, R_OUTB(MAX3237E/MAX3241E) ......................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND .....................ContinuousContinuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C) ........571mW16-Pin TSSOP (derate 9.4mW/°C above +70°C) .....754.7mW16-Pin TQFN (derate 20.8mW/°C above +70°C) ...1666.7mW16-Pin Wide SO (derate 9.52mW/°C above +70°C) ...762mW18-Pin Wide SO (derate 9.52mW/°C above +70°C) ...762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C) ........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C) ......1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C) ......879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C) ........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C) ........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) ........1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C) ....1026mW 32-Pin TQFN (derate 33.3mW/°C above +70°C) ......2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C) ........1010mW Operating Temperature Ranges MAX32_ _EC_ _ .................................................0°C to +70°C MAX32_ _EE_ _ .............................................-40°C to +85°C Storage Temperature Range ............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Bump Reflow Temperature (Note 2) Infrared, 15s ................................................................+200°C Vapor Phase, 20s ........................................................+215°C (V CC = +3V to +5.5V, C1–C4 = 0.1μF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.PARAMETER CONDITIONSMIN TYP MAX UNITS DC CHARACTERISTICS (V CC = +3.3V or +5V, T A = +25°C)Supply Current SHDN = V CC , no load MAX3222E, MAX3232E, MAX3241E, MAX3246E0.31mAMAX3237E0.5 2.0Shutdown Supply CurrentSHDN = GND 110µA SHDN = R_IN = GND, T_IN = GND or V CC (MAX3237E)10300nA LOGIC INPUTSInput Logic LowT_IN, EN , SHDN , MBAUD 0.8V Input Logic HighT_IN, EN , SHDN , MBAUD V CC = +3.3V 2.0V V CC = +5.0V 2.4Transmitter Input Hysteresis0.5V Input Leakage Current T_IN, EN , SHDNMAX3222E, MAX3232E, MAX3241E, MAX3246E ±0.01±1µA T_IN, SHDN , MBAUD MAX3237E (Note 5)918 Integrated │ 2MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers Absolute Maximum RatingsStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Electrical Characteristicsa high-impedance state when the device is in shutdown mode (SHDN = GND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s transmit-ter inputs have a 400kΩ active positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud Operation For higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operatingmode (MBAUD = V CC ), the MAX3237E transmitters guar-antee a 1Mbps data rate with worst-case loads of 3kΩ inparallel with 250pF for +3.0V < V CC < +4.5V. For +5V±10% operation, the MAX3237E transmitters guarantee a1Mbps data rate into worst-case loads of 3kΩ in parallelwith 1000pF.RS-232 Receivers The receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs. Drive EN high to place the receiver(s) into a high-imped-ance state. Receivers can be either active or inactive inshutdown (Table 1).Figure 1. Slew-Rate Test CircuitsDetailed DescriptionDual Charge-Pump Voltage Converter The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E’s internal power supply consists of a regu-lated dual charge pump that provides output voltagesof +5.5V (doubling charge pump) and -5.5V (invertingcharge pump) over the +3.0V to +5.5V V CC range. Thecharge pump operates in discontinuous mode; if theoutput voltages are less than 5.5V, the charge pumpis enabled, and if the output voltages exceed 5.5V, thecharge pump is disabled. Each charge pump requires aflying capacitor (C1, C2) and a reservoir capacitor (C3,C4) to generate the V+ and V- supplies (Figure 1).RS-232 Transmitters The transmitters are inverting level translators that convert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compliant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data ratewith worst-case loads of 3kΩ in parallel with 1000pF,providing compatibility with PC-to-PC communicationsoftware (such as LapLink™). Transmitters can be paral -leled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forced intoLapLink is a trademark of Traveling Software.Integrated │ 9MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers。

© 2000 Fairchild Semiconductor Corporation DS006361June 1986Revised March 2000DM74LS32 Quad 2-Input OR GateDM74LS32Quad 2-Input OR GateGeneral DescriptionThis device contains four independent gates each of which performs the logic OR function.Ordering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection Diagram Function TableY = A + B H = HIGH Logic Level L = LOW Logic LevelOrder Number Package NumberPackage DescriptionDM74LS32M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow DM74LS32SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide DM74LS32NN14A14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WideInputs OutputA B Y L L L L H H H L H HHH 2D M 74L S 32Absolute Maximum Ratings (Note 1)Note 1: The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings.The “Recommended Operating Conditions” table will define the conditions for actual device operation.Recommended Operating ConditionsElectrical Characteristicsover recommended operating free air temperature range (unless otherwise noted)Note 2: All typicals are at V CC = 5V, T A = 25°C.Note 3: Not more than one output should be shorted at a time, and the duration should not exceed one second.Switching Characteristicsat V CC = 5V and T A = 25°CSupply Voltage 7V Input Voltage7VOperating Free Air Temperature Range 0°C to +70°C Storage Temperature Range−65°C to +150°CSymbol ParameterMin Nom Max Units V CC Supply Voltage4.7555.25V V IH HIGH Level Input Voltage 2V V IL LOW Level Input Voltage 0.8V I OH HIGH Level Output Current −0.4mA I OL LOW Level Output Current 8mA T AFree Air Operating Temperature70°CSymbol ParameterConditionsMinTyp Max Units (Note 2)V I Input Clamp Voltage V CC = Min, I I = −18 mA −1.5V V OH HIGH Level V CC = Min, I OH = Max 2.73.4VOutput Voltage V IH = Min V OLLOW Level V CC = Min, I OL = Max0.350.5Output VoltageV IL = MaxVI OL = 4 mA, V CC = Min 0.250.4I I Input Current @ Max Input Voltage V CC = Max, V I = 7V 0.1mA I IH HIGH Level Input Current V CC = Max, V I = 2.7V 20µA I IL LOW Level Input Current V CC = Max, V I = 0.4V −0.36mA I OS Short Circuit Output Current V CC = Max (Note 3)−20−100mA I CCH Supply Current with Outputs HIGH V CC = Max 3.1 6.2mA I CCLSupply Current with Outputs LOWV CC = Max4.99.8mAR L = 2 k ΩSymbol ParameterC L = 15 pFC L = 50 pFUnitsMinMax Min Max t PLH Propagation Delay Time 311415ns LOW-to-HIGH Level Output t PHLPropagation Delay Time 311415ns HIGH-to-LOW Level OutputDM74LS32Physical Dimensions inches (millimeters) unless otherwise noted14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 NarrowPackage Number M14A 4D M 74L S 32Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M14D5DM74LS32 Quad 2-Input OR GatePhysical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WidePackage Number N14AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。