DS3232MZ+TRL;DS3232MZ+;中文规格书,Datasheet资料

云系列DAM3232单WIFI版说明书V1.0北京聚英翱翔电子有限责任公司2017年10月目录一、产品特点 (1)二、产品功能 (1)三、版本说明 (1)四、主要参数 (1)五、接口说明 (2)1、引脚说明 (2)六、通讯接线说明 (4)1、WIFI连接 (4)2、WiFi复位说明 (5)3、架构说明 (5)七、快速使用说明 (6)八、输入输出接线 (6)1、有源开关量接线示意图 (6)2、无源开关量接线示意图 (7)3、继电器接线说明 (7)4、模拟量接线示意图 (7)九、设备参数及工作模式配置 (8)1、网络配置 (8)2、设备地址 (9)3、波特率的读取与设置 (9)4、工作模式 (9)5、点动功能 (9)十、设备唯一ID号 (10)1、扫描二维码获取 (10)十一、开发资料说明 (10)1、通讯协议说明 (10)2、Modbus寄存器说明 (10)3、指令生成说明 (13)4、指令列表 (13)5、指令详解 (16)十二、常见问题与解决方法 (22)十三、技术支持联系方式 (22)一、产品特点●DC12V/24V（默认12V）；●继电器输出触点隔离；●485通信光电隔离；●通讯接口支持RS485或RS232、无线WIFI通讯；●通信波特率：2400,4800,9600,19200,38400（可以通过软件修改，默认9600）；●通信协议：支持标准modbus-RTU/TCP/ASCLL协议；●可以设置0-255个设备地址；●具有闪开、闪断功能，可以在指令里边带参数、操作继电器开一段时间自动关闭；●具有频闪功能，可以控制器继电器周期性开关。

二、产品功能●三十二路继电器控制；●三十二路（或16路）光耦隔离输入，可以接无源触点和DC5-24V电压；●十六路模拟量（4-20mA/0-10V/0-5V）输入；●定时控制----年月日时分秒自定义设置时间控制，可循环；●输出互锁----自定义输出通道与输出通道之间的互锁关系；●开关量联动----手动开关或开关量触发设备与控制输出联动；●场景控制-----自定义完整的逻辑控制触发条件；●70组规则设定----多达70组规则条件设定，满足各种逻辑要求。

EVALUATION KIT AVAILABLE For pricing, delivery, and ordering information, please contact Maxim Directat 1-888-629-4642, or visit Maxim’s website at www.maxim .General DescriptionThe D S3232 is a low-cost temperature-compensatedcrystal oscillator (TCXO) with a very accurate, tempera-ture-compensated, integrated real-time clock (RTC) and236 bytes of battery-backed SRAM. Additionally, theDS3232 incorporates a battery input and maintains accu-rate timekeeping when main power to the device is inter-rupted. The integration of the crystal resonator enhancesthe long-term accuracy of the device as well as reducesthe piece-part count in a manufacturing line. The DS3232is available in commercial and industrial temperatureranges, and is offered in an industry-standard 20-pin,300-mil SO package.The RTC maintains seconds, minutes, hours, day, date,month, and year information. The date at the end of themonth is automatically adjusted for months with fewerthan 31 days, including corrections for leap year. Theclock operates in either the 24-hour or 12-hour formatwith an AM/PM indicator. Two programmable time-of-day alarms and a programmable square-wave outputare provided. Address and data are transferred seriallythrough an I2C bidirectional bus.A precision temperature-compensated voltage refer-ence and comparator circuit monitors the status of V CCto detect power failures, to provide a reset output, andto automatically switch to the backup supply when nec-essary. Additionally, the RST pin is monitored as apushbutton input for generating a µP reset.ApplicationsServers Utility Power MetersTelematics GPSFeatures♦Accuracy ±2ppm from 0°C to +40°C♦Accuracy ±3.5ppm from -40°C to +85°C♦Battery Backup Input for ContinuousTimekeeping♦Operating Temperature RangesCommercial: 0°C to +70°CIndustrial: -40°C to +85°C♦236 Bytes of Battery-Backed SRAM♦Low-Power Consumption♦Real-Time Clock Counts Seconds, Minutes,Hours, Day, Date, Month, and Year with Leap YearCompensation Valid Up to 2099♦Two Time-of-Day Alarms♦Programmable Square-Wave Output♦Fast (400kHz) I2C Interface♦3.3V Operation♦Digital Temp Sensor Output: ±3°C Accuracy♦Register for Aging Trim♦RST Input/Output♦300-Mil, 20-Pin SO Package♦Underwriters Laboratories RecognizedExtremely Accurate I2C RTC withIntegrated Crystal and SRAM19-5337; Rev 5; 7/10Ordering InformationPin ConfigurationDS3232Extremely Accurate I 2C RTC with Integrated Crystal and SRAMABSOLUTE MAXIMUM RATINGSRECOMMENDED OPERATING CONDITIONSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC , V BAT , 32kHz, SCL, SDA, RST ,INT /SQW Relative to Ground.............................-0.3V to +6.0V Junction-to-Ambient Thermal Resistance (θJC ) (Note 1)..55.1°C/W Junction-to-Case Thermal Resistance (θJC ) (Note 1)..........24°C/W Operating Temperature Range(noncondensing).............................................-40°C to +85°CJunction Temperature......................................................+125°C Storage Temperature Range...............................-40°C to +85°C Lead Temperature (soldering, 10s).................................+260°C Soldering Temperature (reflow, 2 times max)....................+260°C(See the Handling, PC Board Layout, and Assembly section.)ELECTRICAL CHARACTERISTICSNote 1:Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial .DS32322Maxim IntegratedExtremely Accurate I 2C RTC withIntegrated Crystal and SRAMELECTRICAL CHARACTERISTICS (continued)ELECTRICAL CHARACTERISTICSDS32323Maxim IntegratedExtremely Accurate I 2C RTC with Integrated Crystal and SRAMAC ELECTRICAL CHARACTERISTICSPOWER-SWITCH CHARACTERISTICSDS32324Maxim IntegratedDS3232Extremely Accurate I2C RTC withIntegrated Crystal and SRAMPushbutton Reset TimingPower-Switch Timing5 Maxim IntegratedExtremely Accurate I 2C RTC with Integrated Crystal and SRAMData Transfer on I 2C Serial BusNote 2:Limits at -40°C are guaranteed by design and not production tested.Note 3:All voltages are referenced to ground.Note 4:I CCA —SCL clocking at max frequency = 400kHz.Note 5:Current is the averaged input current, which includes the temperature conversion current.Note 6:The RST pin has an internal 50k Ω(nominal) pullup resistor to V CC .Note 7:After this period, the first clock pulse is generated.Note 8:A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V IH(MIN)of the SCL signal)to bridge the undefined region of the falling edge of SCL.Note 9:The maximum t HD:DAT needs only to be met if the device does not stretch the low period (t LOW ) of the SCL signal.Note 10:A fast-mode device can be used in a standard-mode system, but the requirement t SU:DAT ≥250ns must then be met. Thisis automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t R(MAX)+ t SU:DAT = 1000 + 250 = 1250ns before the SCL line is released.Note 11:C B —total capacitance of one bus line in pF.Note 12:Minimum operating frequency of the I 2C interface is imposed by the timeout period.Note 13:The parameter t OSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of0V ≤V CC ≤V CC(MAX) and 2.3V ≤V BAT ≤3.4V.Note 14:This delay only applies if the oscillator is enabled and running. If the EOSC bit is 1, t REC is bypassed and RST immediatelygoes high.WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.DS32326Maxim IntegratedExtremely Accurate I 2C RTC withIntegrated Crystal and SRAMSTANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGEV CC (V)S U P P L Y C U R R E N T (n A )5.34.84.32.83.33.850100150125752502.3SUPPLY CURRENT vs. SUPPLY VOLTAGEV BAT (V)S U P P L Y C U R R E N T (n A )5.34.84.32.83.33.880090010009508507507002.3SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (μA )806040-20200.7000.8000.9000.600-40FREQUENCY DEVIATION vs. TEMPERATURE vs. AGINGTEMPERATURE (°C)F R E Q U E N C Y D E V I A T I O N (p p m )806040-20020*******-5-15-25-3575655545-45-40Typical Operating Characteristics(V CC = +3.3V, T A = +25°C, unless otherwise noted.)DELTA TIME AND FREQUENCYvs. TEMPERATURETEMPERATURE (°C)D E L T A F R E Q U E N C Y (p p m )D E L T A T I M E (M I N /Y E A R )80705060-10010203040-30-20-180-160-140-120-100-80-60-40-20020-200-80-60-40-200-100-40DS32327Maxim IntegratedExtremely Accurate I2C RTC withIntegrated Crystal and SRAMBlock DiagramDetailed Description The D S3232 is a serial RTC driven by a temperature-compensated 32kHz crystal oscillator. The TCXO pro-vides a stable and accurate reference clock, and maintains the RTC to within ±2 minutes per year accu-racy from -40°C to +85°C. The TCXO frequency output is available at the 32kHz pin. The RTC is a low-power clock/calendar with two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW provides either an interrupt signal due to alarm conditions or a square-wave output. The clock/cal-endar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The internal registers are accessible though an I2C bus interface.A temperature-compensated voltage reference and comparator circuit monitors the level of V CC to detectDS32328Maxim IntegratedExtremely Accurate I2C RTC with Integrated Crystal and SRAMpower failures and to automatically switch to the back-up supply when necessary. The RST pin provides an external pushbutton function and acts as an indicator of a power-fail event. Also available are 236 bytes of gen-eral-purpose battery-backed SRAM.Operation The block diagram shows the main elements of the D S3232. The eight blocks can be grouped into four functional groups: TCXO, power control, pushbutton function, and RTC. Their operations are described sep-arately in the following sections.32kHz TCXO The temperature sensor, oscillator, and control logic form the TCXO. The controller reads the output of the on-chip temperature sensor and uses a lookup table to determine the capacitance required, adds the aging correction in AGE register, and then sets the capaci-tance selection registers. New values, including changes to the AGE register, are loaded only when a change in the temperature value occurs. The tempera-ture is read on initial application of V CC and once every 64 seconds (default, see the description for CRATE1 and CRATE0 in the control/status register) afterwards.DS32329Maxim IntegratedPower Control This function is provided by a temperature-compensat-ed voltage reference and a comparator circuit that monitors the V CC level. When V CC is greater than V PF, the part is powered by V CC. When V CC is less than V PF but greater than V BAT, the DS3232 is powered by V CC. If V CC is less than V PF and is less than V BAT, the device is powered by V BAT. See Table 1.BATthe device, the oscillator does not start up and no tem-perature conversions take place until V CC exceeds V PF or until a valid I2C address is written to the part. After the first time V CC is ramped up, the oscillator starts up and the V BAT source powers the oscillator during power-down and keeps the oscillator running. When the DS3232 switches to V BAT, the oscillator may be dis-abled by setting the EOSC bit.V BAT Operation There are several modes of operation that affect the amount of V BAT current that is drawn. While the device is powered by V BAT and the serial interface is active, active battery current, I BATA, is drawn. When the serial interface is inactive, timekeeping current (I BATT), which includes the averaged temperature conversion current, I BATTC, is used (refer to Application Note 3644: Power Considerations for Accurate Real-Time Clocks for details). Temperature conversion current, I BATTC, is specified since the system must be able to support the periodic higher current pulse and still maintain a valid voltage level. D ata retention current, I BATTDR, is the current drawn by the part when the oscillator is stopped (EOSC= 1). This mode can be used to mini-mize battery requirements for times when maintaining time and date information is not necessary, e.g., while the end system is waiting to be shipped to a customer.Pushbutton Reset Function The DS3232 provides for a pushbutton switch to be con-nected to the RST output pin. When the DS3232 is not in a reset cycle, it continuously monitors the RST signal for a low going edge. If an edge transition is detected, the D S3232 debounces the switch by pulling the RST low.After the internal timer has expired (PB DB), the D S3232 continues to monitor the RST line. If the line is still low, the DS3232 continuously monitors the line looking for a rising edge. Upon detecting release, the D S3232 forces the RST pin low and holds it low for t RST.The same pin, RST, is used to indicate a power-fail con-dition. When V CC is lower than V PF, an internal power-fail signal is generated, which forces the RST pin low. When V CC returns to a level above V PF, the RST pin is held low for t REC to allow the power supply to stabilize. If the oscillator is not running (see the Power Control section) when V CC is applied, t REC is bypassed and RST immediately goes high.Assertion of the RST output, whether by pushbutton or power-fail detection, does not affect the internal opera-tion of the DS3232.Real-Time Clock With the clock source from the TCXO, the RTC provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automati-cally adjusted for months with fewer than 31 days, includ-ing corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The clock provides two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW pin either generates an interrupt due to alarm condition or outputs a square-wave signal and the selection is controlled by the bit INTCN.SRAM The D S3232 provides 236 bytes of general-purpose battery-backed read/write memory. The I2C address ranges from 14h to 0FFh. The SRAM can be written or read whenever V CC or V BAT is greater than the mini-mum operating voltage.Address Map Figure 1 shows the address map for the DS3232 time-keeping registers. During a multibyte access, when the address pointer reaches the end of the register space (0FFh), it wraps around to location 00h. On an I2C START or address pointer incrementing to location 00h, the current time is transferred to a second set of regis-ters. The time information is read from these secondary registers, while the clock may continue to run. This eliminates the need to reread the registers in case the main registers update during a read.I2C Interface The I2C interface is accessible whenever either V CC or V BAT is at a valid level. If a microcontroller connected to the D S3232 resets because of a loss of V CC or otherExtremely Accurate I2C RTC withIntegrated Crystal and SRAMDS323210Maxim Integrated分销商库存信息:MAXIMDS3232S#DS3232SN#DS3232S#T&R DS3232SN#T&R。

DESCRIPTIONs Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supplys 235KBps Transmission Rate Under Load s 1µA Low-Power Shutdown with Receivers Active (SP3222E )s Interoperable with RS-232 down to +2.7V power sources Enhanced ESD Specifications: ±15kV Human Body Model±15kV IEC1000-4-2 Air Discharge ±8kV IEC1000-4-2 Contact DischargeThe SP3222E/3232E series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222E/3232E series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222E/3232E series to deliver true RS-232performance from a single power supply ranging from +3.3V to +5.0V. The SP3222E/3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/3232E devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA.SELECTION TABLEL E D O M s e i l p p u S r e w o P 232-S R s r D e v i r 232-S R sr e v i e c e R l a n r e t x E st n e n o p m o C nw o d t u h S L T T a S -3e t t f o .o N s n i P 2223P S V 5.5+o t V 0.3+224s e Y s e Y 02,812323P S V5.5+o t V 0.3+224oN oN 61RE T E M A R A P .N I M .P Y T .X A M ST I N U SN O I T I D N O C S C I T S I R E T C A R A H C C D tn e r r u C y l p p u S 3.00.1A m T ,d a o l o n B M A 52+=o V ,C C C V 3.3=tn e r r u C y l p p u S n w o d t u h S 0.101µA,D N G =N D H S T B M A 52+=o V ,C C C V3.3+=S T U P T U O R E V I E C E R D N A S T U P N I C I G O L W O L d l o h s e r h T c i g o L t u p n I 8.0V 2e t o N ,N D H S ,N E ,N I x T H G I H d l o h s e r h T c i g o L t u p n I 0.24.2V V C C 2e t o N ,V 3.3=V C C 2e t o N ,V 0.5=t n e r r u C e g a k a e L t u p n I 10.0±0.1±µA ,N D H S ,N E ,N I x T T B M A 52+=o C t n e r r u C e g a k a e L t u p t u O 50.0±01±µA d e l b a s i d s r e v i e c e r W O L e g a t l o V t u p t u O 4.0V I T U O A m 6.1=H G I H e g a t l o V t u p t u O V C C 6.0-V C C 1.0-VI T U O Am 0.1-=S T U P T U O R E V I R D gn i w S e g a t l o V t u p t u O 0.5±4.5±Vk 3Ω,s t u p t u o r e v i r d l l a t a d n u o r g o t d a o l T B M A 52+=o Cec n a t s i s e R t u p t u O 003ΩV C C T ,V 0=-V =+V =T U O =+V 2t n e r r u C t i u c r i C -t r o h S t u p t u O 53±07±06±001±A m A m V T U O V 0=V T U O =+V51tn e r r u C e g a k a e L t u p t u O 52±µAV T U O =+V ,V 21C C de l b a s i d s r e v i r d ,V 5.5o t V 0=NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.ABSOLUTE MAXIMUM RATINGSThese are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device.V CC ................................................................-0.3V to +6.0V V+ (NOTE 1)................................................-0.3V to +7.0V V- (NOTE 1)................................................+0.3V to -7.0V V+ + |V-| (NOTE 1)....................................................+13V I CC (DC V CC or GND current).................................±100mAInput VoltagesTxIN, EN .....................................................-0.3V to +6.0V RxIN.............................................................................±25V Output VoltagesTxOUT.....................................................................±13.2V RxOUT..............................................-0.3V to (V CC + 0.3V)Short-Circuit DurationTxOUT...............................................................Continuous Storage Temperature.................................-65°C to +150°C Power Dissipation Per Package20-pin SSOP (derate 9.25mW/o C above +70o C).....750mW 18-pin PDIP (derate 15.2mW/o C above +70o C)....1220mW 18-pin SOIC (derate 15.7mW/o C above +70o C)...1260mW 20-pin TSSOP (derate 11.1mW/o C above +70o C)..890mW 16-pin SSOP (derate 9.69mW/o C above +70o C).....775mW 16-pin PDIP (derate 14.3mW/o C above +70o C)....1150mW 16-pin Wide SOIC (derate 11.2mW/o C above +70o C)900mW 16-pin TSSOP (derate 10.5mW/o C above +70o C)..850mW 16-pin nSOIC (derate 13.57mW/°C above +70°C)..1086mWSPECIFICATIONSUnless otherwise noted, the following specifications apply for V CC = +3.0V to +5.0V with T AMB = T MIN to T MAXR E T E M A R A P .N I M .P Y T .X A M ST I N U SN O I T I D N O C S T U P N I R E V I E C E R e g n a R e g a t l o V t u p n I 51-51+V W O L d l o h s e r h T t u p n I 6.08.02.15.1V V C C V 3.3=V C C V 0.5=H G I H d l o h s e r h T t u p n I 5.18.14.24.2V V C C V 3.3=V C C V0.5=s i s e r e t s y H t u p n I 3.0V ec n a t s i s e R t u p n I 357k ΩS C I T S I R E T C A R A H C G N I M I T e t a R a t a D m u m i x a M 021532s p b k R L k 3=ΩC ,L g n i h c t i w s r e v i r d e n o ,F p 0001=y a l e D n o i t a g a p o r P r e v i r D 0.10.1µs µs t L H P R ,L K 3=ΩC ,L F p 0001=t H L P R ,L K 3=ΩC ,L F p 0001=y a l e D n o i t a g a p o r P r e v i e c e R 3.03.0µs t L H P C ,T U O x R o t N I x R ,L F p 051=t H L P C ,T U O x R o t N I x R ,L Fp 051=e m i T e l b a n E t u p t u O r e v i e c e R 002s n e m i T e l b a s i D t u p t u O r e v i e c e R 002s n w e k S r e v i r D 001005s n t |L H P t -H L P T ,|B M A 52=o C we k S r e v i e c e R 0020001s n t |L H P t -H L P |et a R w e l S n o i g e R -n o i t i s n a r T 03/V µsV C C R ,V 3.3=L K 3=ΩT ,B M A 52=o ,C V 0.3+o t V 0.3-m o r f n e k a t s t n e m e r u s a e m V0.3-o t V 0.3+r o SPECIFICATIONS (continued)Unless otherwise noted, the following specifications apply for V CC = +3.0V to +5.0V with T AMB = T MIN to T MAX .Typical Values apply at V CC = +3.3V or +5.0V and T AMB = 25o C.NOTE 2: Driver input hysteresis is typically 250mV.Capacitance for the SP3222 and the SP3232SP3222 and the SP3232Transmitting Data for the SP3222 and the SP3232TYPICAL PERFORMANCE CHARACTERISTICSUnless otherwise noted, the following performance characteristics apply for V CC = +3.3V, 235kbps data rates, all drivers loaded with 3k Ω, 0.1µF charge pump capacitors, and T AMB = +25°C.DESCRIPTIONThe SP3222E/3232E transceivers meet the EIA/TIA-232 and V.28/V.24 communication proto-cols and can be implemented in battery-pow-ered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222E/3232E devices all feature Sipex's proprietary on-board charge pump circuitry that generates 2x V CC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that re-quire true RS-232 performance. The SP3222E/3232E series have drivers that operate at a typi-cal data rate of 235Kbps fully loaded.The SP3222E and SP3232E are 2-driver/2-re-ceiver devices ideal for portable or hand-held applications. The SP3222E features a 1µA shutdown mode that reduces power consump-tion and extends battery life in portable systems.Its receivers remain active in shutdown mode,allowing external devices such as modems to be monitored using only 1µA supply current.THEORY OF OPERATIONThe SP3222E/3232E series are made up of three basic circuit blocks: 1. Drivers, 2. Receivers,and 3. the Sipex proprietary charge pump.DriversThe drivers are inverting level transmitters that convert TTL or CMOS logic levels to ±5.0V EIA/TIA-232 levels inverted relative to the in-put logic levels. Typically, the RS-232 output voltage swing is ±5.5V with no load and at least ±5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.The drivers typically can operate at a data rate of 235Kbps. The drivers can guarantee a data rate of 120Kbps fully loaded with 3K Ω in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software.The slew rate of the driver output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Para-graph 5). The transition of the loaded output from HIGH to LOW also meets the monotonic-ity requirements of the standard.The SP3222E/3232E drivers can maintain high data rates up to 240Kbps fully loaded. Figure 8shows a loopback test circuit used to test the RS-232 drivers. Figure 9 shows the test results of the loopback circuit with all drivers active at 120Kbps with RS-232 loads in parallel with 1000pF capacitors. Figure 10 shows the test results where one driver was active at 235Kbps and all drivers loaded with an RS-232 receiver in parallel with a 1000pF capacitor. A solid RS-232 data transmission rate of 120Kbps provides compatibility with many designs in personal computer peripherals and LAN applications.The SP3222E driver's output stages are turned off (tri-state) when the device is in shutdown mode. When the power is off, the SP3222E device permits the outputs to be driven up to ±12V. The driver's inputs do not have pull-up resistors. Designers should connect unused inputs to V CC or GND.In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3222E device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with V+ pulled down to V CC and V- pulled to GND. The time required to exit shutdown is typically 100µs.Connect SHDN to V CC if the shutdown mode is not used. SHDN has no effect on RxOUT or RxOUTB. As they become active, the two driver outputs go to opposite RS-232 levels where one driver input is HIGH and the other LOW. Note that the drivers are enabled only when the magnitude of V- exceeds approximately 3V.ReceiversThe receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. All receivers have an inverting tri-state output. These receiver outputs (RxOUT) are tri-stated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222E/3232E driver and receiver outputs can be found in Table 2.Since receiver input is usually from a transmis-sion line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, a 5k Ω pulldown resistor to ground will commit the output of the receiver to a HIGH state.Charge PumpThe charge pump is a Sipex –patented design (5,306,954) and uses a unique approach com-pared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (V CC ) over the +3.0V to +5.5V range.In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 6 and 7).In applications that are sensitive to power-sup-ply noise, decouple V CC to ground with a capaci-tor of the same value as charge-pump capacitor C1. Physically connect bypass capacitors as close to the IC as possible.The charge pumps operate in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pumps are enabled. If the output voltage exceed a magnitude of 5.5V, the charge pumps are disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows.Phase 1— V SS charge storage — During this phase of the clock cycle, the positive side of capacitors C 1and C 2 are initially charged to V CC . C l + is then switched to GND and the charge in C 1– is trans-ferred to C 2–. Since C 2+ is connected to V CC , the voltage potential across capacitor C 2 is now 2times V CC .Phase 2— V SS transfer — Phase two of the clock con-nects the negative terminal of C 2 to the V SS storage capacitor and the positive terminal of C 2to GND. This transfers a negative generated voltage to C 3. This generated voltage is regu-lated to a minimum voltage of -5.5V. Simulta-neous with the transfer of the voltage to C 3, the positive side of capacitor C 1 is switched to V CC and the negative side is connected to GND.Phase 3— V DD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C 1 produces –V CC in the negative terminal of C 1, which is applied to the negative side of capacitor C 2. Since C 2+ is at V CC , the voltage potential across C 2 is 2 times V CC .Table 2. Truth Table Logic for Shutdown and Enable ControlN D H S N E T U O x T T U O x R 00e t a t s -i r T e v i t c A 01e t a t s -i r T e t a t s -i r T 10e v i t c A e v i t c A 11ev i t c A et a t s -i r TPhase 4— V DD transfer — The fourth phase of the clock connects the negative terminal of C 2 to GND,and transfers this positive generated voltage across C 2 to C 4, the V DD storage capacitor. This voltage is regulated to +5.5V. At this voltage,the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C 4, the positive side of capacitor C 1 is switched to V CC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the opera-tional conditions for the internal oscillator are present.Since both V + and V – are separately generated from V CC ; in a no–load condition V + and V – will be symmetrical. Older charge pump approaches that generate V – from V + will show a decrease in the magnitude of V – compared to V + due to the inherent inefficiencies in the design.The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating.ESD ToleranceThe SP3222E/3232E series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15kV without damage nor latch-up.There are different methods of ESD testing applied:a) MIL-STD-883, Method 3015.7b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconduc-tors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’spotential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 17. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence.The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage.The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2is shown on Figure 18. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage.Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.Figure 14. Charge Pump WaveformsThe Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.The circuit models in Figures 17 and 18 represent the typical ESD testing circuits used for all three methods. The C S is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through R S, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage.Figure 17. ESD Test Circuit for Human Body ModelFigure 18. ESD Test Circuit for IEC1000-4-2Figure 19. ESD Test Waveform for IEC1000-4-230AI ¥0A15At=30nst ¥t=0nsFor the Human Body Model, the current limiting resistor (R S ) and the source capacitor (C S ) are 1.5k Ω an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (R S )and the source capacitor (C S ) are 330Ω an 150pF,respectively.The higher C S value and lower R S value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.Device Pin Human Body IEC1000-4-2Tested Model Air Discharge Direct Contact LevelDriver Outputs ±15kV ±15kV ±8kV 4Receiver Inputs ±15kV±15kV±8kV4Table 3. Transceiver ESD Tolerance LevelsPACKAGE:PLASTIC SHRINKPACKAGE:PLASTICDUAL–IN–LINE (NARROW)PACKAGE:PLASTICPACKAGE:PLASTICSMALL OUTLINE (SOIC)(NARROW)DIMENSIONSin inches (mm) Minimum/Maximum Symbol16 Lead20 Lead D0.193/0.2010.252/0.260(4.90/5.10)(6.40/6.60)e0.026 BSC0.026 BSC(0.65 BSC)(0.65 BSC)PACKAGE:PLASTIC THINSMALL OUTLINE(TSSOP)ORDERING INFORMATIONModel Temperature Range Package Type SP3222ECA.............................................0˚C to +70˚C..........................................20-Pin SSOP SP3222ECP.............................................0˚C to +70˚C............................................18-Pin PDIP SP3222ECT.............................................0˚C to +70˚C...........................................18-Pin SOIC SP3222ECY.............................................0˚C to +70˚C........................................20-Pin TSSOP SP3222EEA............................................-40˚C to +85˚C........................................20-Pin SSOP SP3222EEP............................................-40˚C to +85˚C..........................................18-Pin PDIP SP3222EET............................................-40˚C to +85˚C.........................................18-Pin SOIC SP3222EEY............................................-40˚C to +85˚C......................................20-Pin TSSOP SP3232ECA.............................................0˚C to +70˚C..........................................16-Pin SSOP SP3232ECP.............................................0˚C to +70˚C............................................16-Pin PDIP SP3232ECT.............................................0˚C to +70˚C..................................16-Pin Wide SOIC SP3232ECN.............................................0˚C to +70˚C.........................................16-Pin nSOIC SP3232ECY.............................................0˚C to +70˚C........................................16-Pin TSSOP SP3232EEA............................................-40˚C to +85˚C........................................16-Pin SSOP SP3232EEP............................................-40˚C to +85˚C..........................................16-Pin PDIP SP3232EET............................................-40˚C to +85˚C................................16-Pin Wide SOIC SP3232EEN............................................-40˚C to +85˚C.......................................16-Pin nSOIC SP3232EEY............................................-40˚C to +85˚C......................................16-Pin TSSOP。

D L P -2232M S PLEAD FREEUSB / MICROCONTROLLER MODULEThe DLP-2232MSP combines the same USB interface used in the DLP-2232H and the DLP-1232H modules with a Texas Instruments microcontroller to form a rapid development tool. TheMSP430F2618 microcontroller is preprogrammed with basic functionality for accessing the port pins and can be reprogrammed with user firmware via a 10-pin header using a device programmer (purchased separately).FEATURES:• Send/receive data over a high-speed USB 2.0 interface to a host computer• 32 digital I/O lines (8 can be configured as A/D inputs; 2 can be configured as D/A outputs) plus the 8-bit data bus available for interfacing to user electronics• Texas Instruments 16-bit RISC architecture processor with 116K bytes FLASH ROM, 8K bytes RAM, a multi-channel,12-bit A/D converter and dual, 12-bit D/A converters• “Token I/O” code preprogrammed into the MSP430F2618’s FLASH memory for basic port pin input/output capability including access to the A/D and D/A converters• The FLASH memory can be easily erased and reprogrammed utilizing a user-supplied compatible programmer• No in-depth knowledge of USB is required as all USB protocols are handled automatically by the on-board FT2232H and its support circuitry• Royalty-free device drivers eliminate the need for USB driver development in most cases • USB bulk or isocronous data-transfer modes• Required 5V supply can be taken directly from the USB port or supplied by user electronics • USB 1.1 and USB 2.0 compatible• USB VID, PID, serial number and product-description strings stored in an on-board EEPROM memory• Royalty-Free Virtual COM Port (VCP) Drivers for:- Windows 2000, Server 2003 and Server 2008- Windows XP and XP 64 bit- Windows Vista and Vista 64 bit- Windows 7- Windows CE 4.2-, 5.0- and 5.2-based OS- MAC OS-X- Linux (tested using kernel 2.6.32)•Royalty-Free D2XX Direct Drivers (USB drivers + DLL S/W interface) for:- Windows 2000, Server 2003 and Server 2008- Windows XP and XP 64 bit- Windows Vista and Vista 64 bit- Windows 7- Windows CE 4.2-, 5.0- and 5.2-based OSOS-X-MAC- Linux (tested using kernel 2.6.32)APPLICATION AREAS:• Prototype development•USB ISDN and ADSL modems•USB interface for digital cameras•USB interface for MP3 players•High-speed USB instrumentation•USB smart-card readers•Set top box (STB) PC-USB interface•USB hardware modems•USB wireless modems•USB bar code readers1.0 GENERAL DESCRIPTIONThe DLP-2232MSP provides a cost-effective, microcontroller-based method of interfacing an electronic peripheral to a host computer via USB.To send data from the peripheral to the host computer, the microcontroller simply writes thebyte-wide data into the FT2232H when TXE# is low. If the FT2232H’s transmit buffer fills up or is busy storing the previously written byte, it will take TXE# high in order to stop further data from being written until some of the FIFO data has been transferred over USB to the host.When the host sends data to the peripheral over USB, the FT2232H will take RXF# low to let the microcontroller know that at least one byte of data is available. The microcontroller then reads the data until RXF# goes high indicating that no more data is available to be read.By using FTDI’s Virtual COM Port Drivers, the peripheral looks like a standard COM port to the application software. Commands to set the baud rate are ignored--the FT2232H always transfers data at its fastest rate regardless of the application’s baud-rate setting. The latest versions of the drivers are available for download from DLP Design’s website at .2.0 DRIVER SOFTWAREFTDI's VCP (Virtual COM Port) driver-executable files are provided royalty free on the condition that they are used only with designs incorporating an FTDI device (i.e. the FT2232H on theDLP-2232MSP). The latest version of the drivers can be downloaded from or .The VCP driver download file is a combined set of drivers for Windows 7, Windows Vista and Windows 2000/XP. Unzip the file to a blank floppy disk or folder on your PC. (The drivers can coexist on the same floppy disk or folder since the INF files determine which set of drivers to load for each operating system version.) Once loaded, the VCP drivers allow the application software running on your host PC to communicate with the DLP-2232MSP as though it were connected to a COM(RS-232) port.In addition to VCP drivers, FTDI's D2XX direct drivers offer an alternative solution to the VCP drivers that allow application software to interface with the DLP-2232MSP using a DLL instead of a Virtual COM Port. The architecture of the D2XX drivers consists of a Windows WDM driver that communicates with the device via the Windows USB stack and a DLL that interfaces the application software (written in VC++, C++ Builder, Delphi, VB, etc.) to the WDM driver. An INF installation file, uninstaller program and D2XX Programmer’s Guide complete the package.The D2XX direct drivers add support for simultaneous access and control of multiple FT2232H devices. The extended open function (FT_OpenEx) allows the device to be opened by either its product description or serial number, both of which can be programmed to be unique. The list devices function (FT_ListDevices) allows the application software to determine which devices are currently available for use, again by product description or by serial number.Download FTDI Application Notes AN232-03, AN232-05, AN232-06 and AN232-07 for detailed instructions on how to install and remove the drivers.3.0 EEPROM WRITE UTILITYThe DLP-2232MSP has the option to accept manufacturer-specific information that is written into on-board EEPROM memory. Parameters that can be programmed include the VID and the PID identifiers, the manufacturer's product string or a serial number.MPROG is an EEPROM serializer and testing utility from FTDI for the FT2232H device. MPROG is based on the new D2XX drivers and will work on Windows 7, Windows Vista and Windows 2000/XP platforms. You must install the latest release of the CDM drivers in order to run this application. (Refer to the MPROG User’s Guide for details on the program’s use.)4.0 QUICK START GUIDEThis guide requires the use of a Windows 7/Vista/2000/XP PC that is equipped with a USB port.1. Download the WHQL-certified CDM device drivers from either or. Unzip the drivers onto a blank floppy disk or into a folder on the hard drive.Note: The DLP-2232MSP can be configured to receive its operating power from the USB port or from user electronics. Pins 24 and 25 or the barrel jack allow for this configuration. (Refer to the Pinout Description in the next section for details on the DLP-2232MSP electrical interface.)**The board will not operate until a power source has been connected.**2. Connect the DLP-2232MSP board to the PC via a standard A-B, 6-foot USB cable. This actioninitiates the loading of the USB drivers. When prompted, select the folder where the CDM device drivers were stored in Step 1. Windows will then complete the installation of the device drivers for the DLP-2232MSP board. The next time the DLP-2232MSP board is attached, the host PC will immediately load the correct drivers without any prompting. Reboot the PC if prompted to do so.The DLP-2232MSP is shipped with default VID, PID, etc. values programmed into the EEPROM memory. You only need to run MPROG if you want to change the default values.At this point, the DLP-2232MSP is ready for use. Note that the DLP-2232MSP will appearnon-responsive if data sent from the host PC is not read from the FT2232H device by theMSP430F2618 microcontroller. The token firmware with which the DLP-2232MSP comes preloaded will read data sent by the host by default. Custom user firmware should also follow this protocol. 5.0 TOKEN I/OThe MSP430F2618 microcontroller on the DLP-2232MSP comes preprogrammed with firmware that provides rudimentary access to the port pins via either the VCP or DLL drivers. Features include the ability to read and write individual port pins.The firmware in the DLP-2232MSP also provides access to the MSP430F2618’s A/D converter, D/A converter and communications. Commands sent to the Token I/O firmware must adhere to a specific communications protocol. Each command sequence contains the following information:Byte 0: Number of bytes in command sequenceByte 1: CommandByte 2…n: Parameter/data bytesFor example, setting Port Pin P1.1 high would require the following string of bytes:0x04, 0x30, 0x11, 0x00, 0x01Definition of the Bytes:0x04 – Number of bytes in command0x30 – Command for digital port pin access0x11 – Affected port pin0x00 – Set port pin to output0x01 – Desired state of port pinThe port pins equate to hexadecimal numeric constants as defined here:PORT 1:0x10 = P1.0 MSP430F2618 Pin 12, DLP-2232MSP module Pin J1.120x11 = P1.1 MSP430F2618 Pin 13, DLP-2232MSP module Pin J1.13PORT 2:0x20 = P2.0 MSP430F2618 Pin 20, DLP-2232MSP module Pin J1.140x21 = P2.1 MSP430F2618 Pin 21, DLP-2232MSP module Pin J1.160x22 = P2.2 MSP430F2618 Pin 22, DLP-2232MSP module Pin J1.180x23 = P2.3 MSP430F2618 Pin 23, DLP-2232MSP module Pin J1.200x24 = P2.4 MSP430F2618 Pin 24, DLP-2232MSP module Pin J1.190x25 = P2.5 MSP430F2618 Pin 25, DLP-2232MSP module Pin J1.170x26 = P2.6 MSP430F2618 Pin 26, DLP-2232MSP module Pin J1.150x27 = P2.7 MSP430F2618 Pin 27, DLP-2232MSP module Pin J1.21PORT 3:0x30 = P3.0 MSP430F2618 Pin 20, DLP-2232MSP module Pin J1.390x31 = P3.1 MSP430F2618 Pin 21, DLP-2232MSP module Pin J1.410x32 = P3.2 MSP430F2618 Pin 22, DLP-2232MSP module Pin J1.370x33 = P3.3 MSP430F2618 Pin 23, DLP-2232MSP module Pin J1.380x34 = P3.4 MSP430F2618 Pin 24, DLP-2232MSP module Pin J1.360x35 = P3.5 MSP430F2618 Pin 25, DLP-2232MSP module Pin J1.40PORT 5:0x50 = P5.0 MSP430F2618 Pin 44, DLP-2232MSP module Pin J1.430x51 = P5.1 MSP430F2618 Pin 45, DLP-2232MSP module Pin J1.450x52 = P5.2 MSP430F2618 Pin 46, DLP-2232MSP module Pin J1.440x53 = P5.3 MSP430F2618 Pin 2, DLP-2232MSP module Pin J1.460x54 = P5.4 MSP430F2618 Pin 48, DLP-2232MSP module Pin J1.470x55 = P5.5 MSP430F2618 Pin 49, DLP-2232MSP module Pin J1.480x56 = P5.6 MSP430F2618 Pin 50, DLP-2232MSP module Pin J1.500x57 = P5.7 MSP430F2618 Pin 51, DLP-2232MSP module Pin J1.49PORT 6:0x60 = P6.0/A0 MSP430F2618 Pin 59, DLP-2232MSP module Pin J1.20x61 = P6.1/A1 MSP430F2618 Pin 60, DLP-2232MSP module Pin J1.30x62 = P6.2/A2 MSP430F2618 Pin 61, DLP-2232MSP module Pin J1.40x63 = P6.3/A3 MSP430F2618 Pin 2, DLP-2232MSP module Pin J1.50x64 = P6.4/A4 MSP430F2618 Pin 3, DLP-2232MSP module Pin J1.70x65 = P6.5/A5 MSP430F2618 Pin 4, DLP-2232MSP module Pin J1.80x66 = P6.6/A6/DAC0 MSP430F2618 Pin 5, DLP-2232MSP module Pin J1.90x67 = P6.7/A7/DAC1 MSP430F2618 Pin 6, DLP-2232MSP module Pin J1.10The source code for the Token I/O firmware (developed using the CCS C compiler) is available as a free download upon purchase and receipt of the hardware. Example Visual C++ source code developed using Microsoft Visual C for communicating with the DLP-2232MSP via the Token I/O firmware is also available for download. (The Windows source code also contains the port pin definitions listed above.)5.1 TOKEN I/O COMMAND SET0x27 – Ping – Host NotificationLength: 2 BytesParameters: NoneReturns: 1 Byte: ASCII “S” or hex 0x53Function:This function returns an ASCII ‘S’ to tell the host that the module is up and running Example:0x02, 0x27 – Causes the module to return a 0x53 to the host0x28 – Flash LED – Toggle the LEDLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x28Function:This function will cause the module’s green LED to flash brieflyExample:0x02, 0x28 – Causes the LED to toggle briefly0x29 – LED On/OffLength: 3 BytesParameters: 1 Byte: 0=Turn LED Off; 1=Turn LED OnReturns: 1 Byte: command echo acknowledgement=0x29Function:This function will turn the module’s green LED on or offExample:0x03, 0x29, 0x01 - Turns on the LED0x30 – Digital I/O Read/WriteLength: 4 or 5 BytesParameters: 2 or 3 Bytes:1. Port Selection – Select the desired MSP430F2618 port pin (refer to the port listunder the previous section)2. Port Direction: 1=Input; 0=Output3. Port Value if Byte 2 specifies OutputReturns: 2 Bytes for Input=Value on port pin; command echo acknowledgement=0x301 byte for Output=command echo acknowledgement=0x30Function:This function will read from or write to the selected port pinExample:0x04, 0x30, 0x60, 0x00, 0x01 – Sets Port 6 Pin 0 high0x40 – A/D ConversionLength: 3 BytesParameters:Mode: 0=Single conversion, 1=Continuous conversions (~1 per second)Note: Setting the ADC mode to continuous (1) starts an infinite loop. The ADCwill perform a conversion approximately once a second and report the result tothe host. To exit, break the code using the debugger or reset the module. Returns: 2 Bytes: The 12-bit voltage data; MSB firstFunction:This function will enable A/D conversion on the selected channel and ADC, pause 10uS, perform the A/D conversion and then return 2 bytes to the host (MSB first).Command 0x42 must have been previously called to configure the desired analogchannel as an A/D input, and 0x43 / 0x44 must have been called to configure thevoltage reference.Example:0x3, 0x40 0x00 – Performs the A/D conversion and, using ADC0, returns 2 bytes of data0x41 – Disable A/DLength: 3 BytesParameters: 0=ADC0, 1=ADC1Returns: 1 Byte: command echo acknowledgement=0x41Function:This function disables the specified A/D converterExample:0x3, 0x41 0x01 – Disables A/D Converter 10x42 – Select A/D InputLength: 3 BytesParameters:0x00=Select input A0 (P6.0)0x01=Select input A1 (P6.1)0x02=Select input A2 (P6.2)0x03=Select input A3 (P6.3)0x04=Select input A4 (P6.4)0x05=Select input A5 (P6.5)0x06=Select input A6 (P6.6)0x07=Select input A7 (P6.7)0x08=Select internal input Veref+0x09=Select internal input Vref-/Veref-0x0A=Select internal temperature diode0x0B=Select internal input (Avcc – Avss)/2Returns: 1 Byte: command echo acknowledgement=0x42Function:This function selects the analog input to be used by the specified A/D converter Example:0x3, 0x42 0x03 – Selects analog input A30x43 – External ReferenceLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x43Function:This function sets the A/D and D/A references to be externalExample:0x2, 0x43 – Select External Voltage Reference0x44 – Internal ReferenceLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x44Function:This function sets the A/D and D/A references to be internal; use command 0x50 to select the Internal Voltage Reference valueExample:0x2, 0x44 – Select Internal Voltage Reference0x50 – Select Internal Reference SourceLength: 3 BytesParameters:0=+1.5V, 1=+2.5VReturns: 1 Byte: command echo acknowledgement=0x50Function:This function sets the A/D and D/A internal voltage reference valuesExample:0x3, 0x50 0x00 – Select Internal Voltage Reference of +1.5V0x60 – D/A OutputLength: 5 BytesParameters: 3 Bytes:1. 0=DAC0 output on Port A6; 1=DAC1 output on Port A72. 0x0n (n=MSB 4 bits of 12-bit DAC output value)3. 0xmm (mm=LSB 8 bits of 12-bit DAC output value)Returns: 1 Byte: command echo acknowledgement=0x60Function:This function selects the D/A converter and specifies the output valueExample:0x5, 0x60 0x00 0x01 0x23 – Select DAC 0 to output value 0x123; the actual voltage depends upon the reference selected0x61 – Disable D/ALength: 3 BytesParameters: 0=DAC0; 1=DAC1Returns: 1 Byte: command echo acknowledgement=0x61Function:This function disables the specified D/A converterExample:0x3, 0x61 0x00 – Disables D/A converter 00x70 – UART LoopbackThis command configures UART 1 to loop back any bytes received on its input port to its transmit output port. Port B on the FT2232H must be set to UART mode with a baud rate of 115200. Once set any bytes sent through Port B of the FT2232H will be echoed back. This command initiates an infinite loop in which all bytes sent are looped back. To exit, break the code using the debugger or reset the module.Length: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x70(After a command is sent, subsequent bytes sent to the UART via FT2232HPort B will be echoed back)Function:This function configures UART 1 to loop back received bytesExample:0x2, 0x70 – UART 1 loopback enabledTABLE 1: DLP-2232MSP PINOUT DESCRIPTION1252650PIN # DESCRIPTION1 GROUND2 P6.0/A0 (I/O)Port 6 Pin 0 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 03 P6.1/A1 (I/O) Port 6 Pin 1 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 14 P6.1/A2 (I/O) Port 6 Pin 2 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 25 P6.3/A3 (I/O) Port6 Pin 3 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 36 GROUND7 P6.3/A4 (I/O) Port 6 Pin 4 connected to the MSP430F2618 Digital I/O P6.4 and Analog Input 48 P6.3/A5 (I/O) Port 6 Pin 5 connected to the MSP430F2618 Digital I/O P6.5 and Analog Input 59 P6.3/A6/DAC0 (I/O) Port 6 Pin 6 connected to the MSP430F2618 Digital I/O P6.6, Analog Input 6 and D/A output DAC010 P6.3/A7/DAC1 (I/O) Port 6 Pin 7 connected to the MSP430F2618 Digital I/O P6.7, Analog Input 7 and D/A output DAC0111 GROUND12 P1.0 (I/O) Port 1 Pin 0 connected to the MSP430F2618 Digital I/O P1.013 P1.1 (I/O) Port 1 Pin 1 connected to the MSP430F2618 Digital I/O P1.114 P2.0 (I/O) Port 2 Pin 0 connected to the MSP430F2618 Digital I/O P2.015 P2.6 (I/O) Port 2 Pin 6 connected to the MSP430F2618 Digital I/O P2.616 P2.1 (I/O) Port 2 Pin 1 connected to the MSP430F2618 Digital I/O P2.117 P2.5 (I/O) Port 2 Pin 5 connected to the MSP430F2618 Digital I/O P2.518 P2.2 (I/O) Port 2 Pin 2 connected to the MSP430F2618 Digital I/O P2.219 P2.4 (I/O) Port 2 Pin 4 connected to the MSP430F2618 Digital I/O P2.420 P2.3 (I/O) Port 2 Pin 3 connected to the MSP430F2618 Digital I/O P2.321 P2.7 (I/O) Port 2 Pin 7 connected to the MSP430F2618 Digital I/O P2.722 SWVCC (Out) Power from EXTVCC (Pin 24) controlled via Pin 60 (PWREN#) of theFT2232H and Q1 MOSFET power switch; R8 and C24 control the power-up rate to help limit inrush current23 GROUND24 EXTVCC (In) Use for applying main power (4.4-5.25 volts) to the module; connect to PORTVCC if the module is to be powered by the USB port (typical configuration)25 PORTVCC (Out) Power from USB port—Connect to EXTVCC if the module is to be powered by the USB port (typical configuration); 500mA is the maximum current available to the DLP-2232MSP and target electronics if the USB device is configured for high power26 GROUND27 DB0 (I/O) Line 0 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO28 DB1 (I/O) Line 1 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO29 DB2 (I/O) Line 2 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO30 DB3 (I/O) Line 3 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO31 DB4 (I/O) Line 4 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO32 DB5 (I/O) Line 5 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO33 DB6 (I/O) Line 6 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO34 DB7 (I/O) Line 7 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO35 GROUND36 P3.4 (I/O) Port 3 Pin 4 connected to the MSP430F2618 Digital I/O P3.437 P3.2 (I/O) Port 3 Pin 2 connected to the MSP430F2618 Digital I/O P3.238 P3.3 (I/O) Port 3 Pin 3 connected to the MSP430F2618 Digital I/O P3.339 P3.0 (I/O) Port 3 Pin 0 connected to the MSP430F2618 Digital I/O P3.040 P3.5 (I/O) Port 3 Pin 5 connected to the MSP430F2618 Digital I/O P3.541 P3.1 (I/O) Port 3 Pin 1 connected to the MSP430F2618 Digital I/O P3.142 GROUND43 P5.0 (I/O) Port 5 Pin 0 connected to the MSP430F2618 Digital I/O P5.044 P5.2 (I/O) Port 5 Pin 2 connected to the MSP430F2618 Digital I/O P5.245 P5.1 (I/O) Port 5 Pin 1 connected to the MSP430F2618 Digital I/O P5.146 P5.3 (I/O) Port 5 Pin 3 connected to the MSP430F2618 Digital I/O P5.347 P5.4 (I/O) Port 5 Pin 4 connected to the MSP430F2618 Digital I/O P5.448 P5.5 (I/O) Port 5 Pin 5 connected to the MSP430F2618 Digital I/O P5.5分销商库存信息: DLP-DESIGNDLP-2232MSP。

M ICROCIRCUIT SL3232E,INTERFACE TRANSCEIVER OF THE SERIAL DATA OF THE STANDARD RS-232T he interface transceiver of the serial data of the standard RS -232 SL3232E with the single supply voltage and bipolar output voltage of the transmitter, formed by means of the built-in voltage multiplication oscillator at four external capacitances, equal to 0.1 uF, corresponding to the standards of EIA/TIA-232E, V.28, is intended for application in the contemporary high efficiency computing systems with the wide range of the supply voltage, fast response electron devices with the high reliability of the exchange information among the remote objects.Performed functions, composition and structure:Microcircuit contains 2 transmitters and 2 receivers of the serial data of the standard RS-232. The microcircuit supply voltage range isfrom 3.0 to 5.5 V.Тruth TablePinningC2+V+С1+C1-C2-V-TXOUT2RXIN2SOP-16Functional electric circuitTTL/CMOS inputs TTL/CMOS outputs RS-232 inputs RS-232 outputsC4С1 – capacitor with capacitance of 0.1 uF ±10 % at U CC= 3.3 V ± 10% and 0.047 uF ± 10 % UF at U CC = 5.0 V ± 10%С2, С4, С5– capacitors with capacitance of 0.1 uF ±10 % at U CC= 3.3 V ± 10% and 0.33 ± 10 % uF at U CC = 5.0 V ± 10%С3 – capacitor with capacitance of 0.1 uF ± 10 %SL3232E Electric Parameters (С1=0.047 UF, С2-С4 = 0.33 uF at Ucc = 5.0 V ±10%, C1-C4 = 0.1 uF atTime chart of the receiver's input and output signalsOLOHOLOHTime chart of the transmitter's input and output signalsTXINTXOUTOLOHStructural switch-on digram of microcircuits in operationTTL/CMOSinputsTTL/CMOSoutputsRS-232inputsRS-232ouputs C4。

3232芯片3232芯片是一种常用的集成电路（IC）芯片，由原产地德国的恩智浦半导体公司（NXP）研发和生产。

它属于高性能通用专用IC，主要应用在无线通讯、工业自动化、家电、消费电子等领域。

3232芯片采用32位ARM Cortex-M3架构，配备了多个外设和接口，包括通用串行总线（USB）、通用异步收发器（UART）和串行外设接口（SPI）等。

这些外设和接口的丰富功能使得3232芯片能够灵活地与其他设备进行通信和连接。

3232芯片拥有较高的运算速度和存储容量，可实现高效的数据处理和存储管理。

它的运行频率可达80MHz，可支持多种存储器类型，包括闪存（Flash）和随机存取存储器（RAM）。

这些特性使得3232芯片能够处理复杂的算法和大量的数据，满足不同应用场景的需求。

除了高性能和丰富的外设与接口，3232芯片还具有低功耗和较高的故障容忍能力。

它采用了低功耗设计，在不影响性能的情况下降低了功耗消耗，延长了电池寿命。

同时，它还具备较高的抗干扰能力和稳定性，能够在恶劣环境下稳定运行。

在无线通讯领域，3232芯片可应用于蓝牙、Wi-Fi和ZigBee等无线通信协议。

它可以作为通信模块的核心控制单元，实现数据的传输和处理。

在工业自动化领域，3232芯片可用于控制系统的设计与开发，实现自动控制和监测。

在家电和消费电子领域，3232芯片可以应用于电视、手机和智能家居设备等产品中，提供高性能和丰富功能的支持。

综上所述，3232芯片是一款功能强大、性能稳定的集成电路芯片。

其高性能、丰富的外设与接口、低功耗和较高的故障容忍能力使得它在无线通讯、工业自动化、家电和消费电子等领域有着广泛的应用前景。

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)MAX3232CD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDB ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDBE4ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDBG4ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDBR ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDBRE4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDBRG4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDWR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CDWRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232CPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232ID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDB ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDBE4ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)MAX3232IDBG4ACTIVE SSOP DB1680Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDBR ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDBRE4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDBRG4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDWE4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDWR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDWRE4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IDWRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMAX3232IPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF MAX3232:•Enhanced Product:MAX3232-EPNOTE:Qualified Version Definitions:•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant MAX3232CDBR SSOPDB 162000330.016.48.2 6.6 2.512.016.0Q1MAX3232CDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX3232CDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX3232CPWR TSSOPPW 162000330.012.4 6.9 5.6 1.68.012.0Q1MAX3232IDBR SSOPDB 162000330.016.48.2 6.6 2.512.016.0Q1MAX3232IDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX3232IDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX3232IPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) MAX3232CDBR SSOP DB162000346.0346.033.0 MAX3232CDR SOIC D162500333.2345.928.6 MAX3232CDWR SOIC DW162000346.0346.033.0 MAX3232CPWR TSSOP PW162000346.0346.029.0 MAX3232IDBR SSOP DB162000346.0346.033.0 MAX3232IDR SOIC D162500333.2345.928.6 MAX3232IDWR SOIC DW162000346.0346.033.0MAX3232IPWR TSSOP PW162000346.0346.029.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time 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32mz晶振规格
32mz晶振规格是一种常见的电子元件，用于电子设备中的时钟和计时功能。

它的主要作用是提供稳定的时钟信号，确保设备的正常运行。

我们来介绍一下晶振的基本原理。

晶振是一种利用晶体的谐振特性产生稳定振荡信号的元件。

32mz表示晶振的频率为32兆赫兹，也就是每秒钟振荡32百万次。

这种高频率的振荡信号可以被电子设备用来进行精确的计时和同步操作。

在电子设备中，晶振通常与微控制器或时钟芯片一起使用。

微控制器是一种集成了处理器、存储器和输入输出接口的芯片，它负责控制设备的各种功能。

而时钟芯片则负责生成和管理设备的时钟信号。

晶振的工作原理是基于晶体的压电效应。

当施加电场或机械应力时，晶体会产生电荷分布的变化，从而产生电压。

这个电压会导致晶体内部原子的位移，形成机械振荡。

而当晶体的振荡频率达到谐振频率时，振荡会变得特别稳定。

晶振的稳定性是指其振荡频率的变化程度。

高质量的晶振具有较低的频率漂移和相位噪声，能够提供更精确的时钟信号。

这对于需要高精度计时的应用非常重要，比如无线通信、卫星导航和科学实验等领域。

除了频率稳定性外，晶振还有其他一些重要的规格。

例如，它的工
作电压范围、电流消耗、启动时间和温度特性等。

这些规格会直接影响到晶振的适用场景和性能表现。

总的来说，32mz晶振规格是一种常见的电子元件，用于提供稳定的时钟信号。

它在电子设备中扮演着重要的角色，确保设备的正常运行。

通过理解晶振的原理和规格，我们可以更好地应用它，提高电子设备的性能和可靠性。

专芯发展•用芯服务•创芯未来产品特点●300µA 供电电流●确保最大120Kbps 数据传输率●确保最小3V/µs 压摆率●增强的ESD 规范：•IEC61000-4-2标准中±15kV 空气放电标准•IEC61000-4-2标准中±8kV 接触放电标准●可使用SOP-16和TSSOP-16封装产品应用●电池供电设备●掌上设备●周边设备●数据通信设备产品概述CBM3232是一种基于EIA/TIA-232标准和V.28/V.24标准的通讯接口，其供电电压为3.3V、具有低功耗需求，高数据传输率能力。

CBM3232有两个接收器和一个驱动器。

该设备可以确保以RS-232标准输出电平水平的情况下以120Kbps 数据传输率运行。

典型应用包括笔记本计算机、轻型便携掌上电脑、电池供电的设备、手持式设备、电子周边设备和打印机。

专芯发展•用芯服务•创芯未来目录产品特点..........................................................................................................................................1产品应用..........................................................................................................................................1产品概述..........................................................................................................................................1目录..................................................................................................................................................2引脚配置..........................................................................................................................................3引脚描述..........................................................................................................................................3绝对最大额定参数..........................................................................................................................4电气特性..........................................................................................................................................5逻辑输入电气特性..........................................................................................................................5发送电气特性..................................................................................................................................5应用电路..........................................................................................................................................7电容值(µF).....................................................................................................................................7典型运行特性..................................................................................................................................8静电保护..........................................................................................................................................9封装尺寸及结构............................................................................................................................12SOP-16......................................................................................................................................12TSSOP-16..................................................................................................................................13包装/订购信息.. (14)引脚配置引脚描述绝对最大额定值符号参数值单位V CC供电电压-0.3至6V V+复合终端电压(VCC-0.3)至7VV-反向终端电压0.3至-7VV++|V-|13V T IN发送器输入电压范围-0.3至6VR IN接收器输入电压范围±25V T OUT发送器输出电压范围±13.2V R OUT接收器输出电压范围-0.3to(VCC+0.3)VT a工作温度-40至85℃Ts储存温度-65至150℃t SHORT发送器输出短路接地时间持续*超出上述绝对最大额定值可能会导致器件永久性损坏。

DAM-3232说明书一、 模块功能概述随着PC产业的不断发展，USB接口正在逐渐替代老式PC的各种低速外围接口然而目前工业环境中许多重要的设备仍然使用RS-485/RS-422接口界面设计，因此许多用户使用USB到RS-485/RS-422转换器来实现PC机与RS-485/RS-422设备之间的数据传输。

DAM-3232是一款通用的USB/RS-485/422转换器，无需外加电源、兼容USB、RS-422、RS-485标准，能够将单端的USB信号转换为平衡差分的RS-422或RS-485信号，提供每线浪涌保护功率，以及各种原因在线路上产生的浪涌电压并且极小的极间电容保证了RS-485/RS-422接口的高速传输，RS-422 、RS-485端通过DAM-CONVERT及DB9公头的连接器连接。

转换器内部带有零延时自动收发转换， 独有的I/O电路自动控制数据流方向，而不需任何握手信号(如RTS、DTR等)无需跳线设置实现全双工(RS-422)、半双工(RS-485)模式转换，即插即用。

确保适合一切现有的通信软件和接口硬件。

DAM-3232接口转换器可以为点到点、点到多点的通信提供可靠的连接，点到多点每台转换器可允许连接32个RS-422或RS-485接口设备，数据通讯速率300-921600bps，支持的通讯方式有USB到RS-422、USB到RS-485转换。

二、 模块结构及接线端子三、 模块主要性能指标标准：符合USBV1.1、EIA RS-485、RS-422标准USB信号：VCC、DATA+、DATA-、GND、FGRS-485信号：T/R+、T/R-、GNDRS-422信号：T/R+、T/R-、RXD+、RXD-、GND工作方式：异步工作、点对点或多点、2线半双工、4线全双工 方向控制：采用数据流向自动控制技术，自动判别和控制数据传输方向波特率：300-921600bps，自动侦测串口信号速率负载能力：支持点到多点，每台转换器可允许连接32个RS-485或RS-422接口设备传输距离：RS-485/422端5000米（9600bps时），USB口不超过5米接口保护：浪涌保护、±15000V静电保护接口形式：USB端A类接口母头，DB9公头的连接器连接传输介质：双绞线或屏蔽线传输速率：921600bps到300M、38400bps到2.4KM、9600bps 到5KM外形尺寸：55mmX36mmX18mm使用环境：-25℃到70℃，相对湿度为5％到95％传输距离：0-5000米（921600bps-9600bps）支持Windows95/98/2000/xp、IMAG四、 连接器和信号RS-485/RS-422输出信号及接线端子引脚分配DB9针形输出信号RS-422全双工接线 RS-485半双工接线1 T/R+ 数据发送正端(A+) 数据正端(A+)2 T/R- 数据发送负端(B-) 数据负端(B-)3 RXD+ 数据接收正端(A+) 空4 RXD- 数据接收负端(B-) 空5 GND 地线地线6 N/A7 N/A8 N/A9 N/A五、 硬件安装及应用安装DAM-3232接口转换器前请先仔细阅读产品说明书，将产品所配的通信电缆接入USB接口端，本产品采用USB/DB-9、通用连接器为输入/输出接口无需跳线设置自动实现RS-485或RS-422通信方式，可使用双绞线或屏蔽线，连接、拆卸非常方便。

sp3232中文资料_数据手册_参数SP3222E/SP3232ETrue +3.0V to +5.5V RS-232 TransceiversThe SP3222E/SP3232E series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222E/SP3232E series has a high-efficiency, charge-pump power supply that requires only 0.1μF capaci -tors in 3.3V operation. This charge pump allows the SP3222E/SP3232E series to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222E/SP3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/SP3232E devices are over +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where thedevices' driver outputs and charge pumps are disabled. During shutdown, the supply current fal ls to less than 1μA.FEATURES■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ Minimum 120kbps Data Rate Under Full Load ■ 1μA Low Power Shutdown with Receivers active (SP3222E )■ Interoperable with RS-232 down to a +2.7V power source ■ Enhanced ESD Specifications: +15kV Human Body Model +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact DischargeDESCRIPTIONSELECTION TABLENow Available in Lead Free Packaging V-C1+V+C1-C2+C2-EN R2IN T2OUT nSOICMODELPower SuppliesRS-232 Drivers RS-232 Receivers External Components Shutdown TTL 3-State # of Pins SP3222E +3.0V to +5.5V 22 4 Capacitors Yes Yes 18, 20SP3232E +3.0V to +5.5V224 CapacitorsNoNo16Note: See page 6 for other pinoutsNOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in theoperation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device.V CC .......................................................-0.3V to +6.0V V+ (NOTE 1).......................................-0.3V to +7.0V V- (NOTE 1)........................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...........................................+13V I CC (DC V CC or GND current).........................+100mAInput VoltagesTxIN, EN, SHDN...........................-0.3V to Vcc + 0.3V RxIN...................................................................+15V Output Voltages TxOUT.............................................................+13.2VRxOUT, .......................................-0.3V to (V CC +0.3V)Short-Circuit DurationTxOUT....................................................Continuous Storage Temperature......................-65°C to +150°CUnless otherwise noted, the following specifications apply for V CC = +3.0V to +5.5V with T AMB = T MIN to T MAX ,Power Dissipation per package20-pin SSOP (derate 9.25mW/o C above +70o C)..............750mW 18-pin SOIC (derate 15.7mW/o C above +70o C)..............1260mW 20-pin TSSOP (derate 11.1mW/o C above +70o C).............890mW 16-pin SSOP (derate 9.69mW/o C above +70o C)...............775mW 16-pin PDIP (derate 14.3mW/o C above +70o C)...............1150mW 16-pin Wide SOIC (derate 11.2mW/o C above +70o C)........900mW 16-pin TSSOP (derate 10.5mW/o C above +70o C)..............850mW 16-pin nSOIC (derate 13.57mW/o C above +70o C)...........1086mWELECTRICAL CHARACTERISTICSPARAMETERMIN.TYP .MAX.UNITSCONDITIONSDC CHARACTERISTICS Supply Current0.3 1.0mA no load, V CC = 3.3V,T AMB = 25o C, TxIN = GND or V CC Shutdown Supply Current1.010μASHDN = GND, VCC = 3.3V,T AMB = 25o C, TxIN = Vcc or GND LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW 0.8V TxIN, EN, SHDN, Note 2Input Logic Threshold HIGH 2.0Vcc V Vcc = 3.3V, Note 2Input Logic Threshold HIGH 2.4Vcc V Vcc = 5.0V, Note 2Inp ut Leakage Current +0.01+1.0μA TxIN, EN, SHDN,T AMB = +25o C, V IN = 0V to V CCOutput Leakage Current +0.05+10μA Receivers disabled, V OUT = 0V to V CC Output Voltage LOW 0.4V I OUT = 1.6mA Output Voltage HIGH V CC -0.6V CC -0.1VI OUT = -1.0mADRIVER OUTPUTS Output Voltage Swing+5.0+5.4VAll driver outputs loaded with 3k? to GND, T AMB = +25o C ABSOLUTE MAXIMUM RATINGSUnless otherwise noted, the following specifications apply for V CC = +3.0V to +5.5V with T AMB = T MIN to T MAX , Typical values apply at V CC = +3.3V or +5.0V and T AMB = 25°C.ELECTRICAL CHARACTERISTICSPARAMETERMIN.TYP .MAX.UNITSCONDITIONSDRIVER OUTPUTS (continued)Output Resistance300V CC = V+ = V- = 0V, T OUT =+2V Output Short-Circuit Current +35+60mA V OUT = 0VOutput Leakage Current +25μAV CC = 0V or 3.0V to 5.5V, V OUT = +12V, Drivers disabled RECEIVER INPUTS Input Voltage Range -15+15V Input Threshold LOW 0.6 1.2V Vcc = 3.3V Input Threshold LOW 0.81.5V Vcc = 5.0V Input Threshold HIGH 1.52.4V Vcc =3.3V Input Threshold HIGH 1.8 2.4V Vcc = 5.0VInput Hysteresis 0.3V Input Resistance357k?TIMING CHARACTERISTICS Maximum Data Rate 120235kbps R L = 3k?, C L = 1000pF, one driver switching Driver Propagation Delay, t PHL 1.0μs R L = 3k?, C L = 1000pF Driver Propagatio n Delay, t PLH 1.0μs R L = 3k?, C L = 1000pF Receiver Propagation Delay, t PHL0.3μs Receiver input to Receiver output, C L = 150pF Receiver Propagation Delay, t PLH 0.3μs Receiver input to Receiver output, C L = 150pFReceiver Output Enable Time 200ns Receiver Output Disable Time 200ns Driver Skew 100500ns | t PHL - t PLH |, T AMB = 25°C Receiver Skew2001000ns | t PHL - t PLH |Transition-Region Slew Rate30V/μsVcc = 3.3V, R L = 3k?, C L = 1000pF, T AMB = 25°C,measurements taken from -3.0V to +3.0V or +3.0V to -3.0V NOTE 2: Driver input hysteresis is typically 250mV.Unless otherwise noted, the following performance characteristics apply for V CC = +3.3V, 120kbps data rate, all drivers loaded with 3k?, 0.1μF charge pump capacitors, and T AMB = +25°C.Figure 2. Slew Rate vs Load Capacitance for the SP3222E and SP3232EFigure 1. Transmitter Output Voltage vs LoadCapacitance for the SP3222E and SP3232E Figure 3. Supply Current VS. Load Capacitance when Transmitting DataTYPICAL PERFORMANCE CHARACTERISTICSNAME FUNCTIONPIN NUMBERSP3222E SP3232E SOIC SSOPTSSOPEN Receiver Enable. Apply Logic LOW for normal operation.Apply logic HIGH to disable the receiver outputs (high-Z state)11-C1+Positive terminal of the voltage doubler charge-pump capacitor221V++5.5V output generated by the charge pump332 C1-Negative terminal of the voltage doubler charge-pump capacitor443 C2+Positive terminal of the inverting charge-pump capacitor554 C2-Negative terminal of the inverting charge-pump capacitor665 V--5.5V output generated by the charge pump776 T1OUT RS-232 driver output.151714T2OUT RS-232 driver output.887R1IN RS-232 receiver input141613R2IN RS-232 receiver input998R1OUT TTL/CMOS receiver output131512R2OUT TTL/CMOS receiver output10109T1IN TTL/CMOS driver input121311T2IN TTL/CMOS driver input111210 GND Ground161815VCC+3.0V to +5.5V supply voltage171916SHDN Shutdown Control Input. Drive HIGH for normal device operation.Drive LOW to shutdown the drivers (high-Z output) and the on-board power supply1820-N.C.No Connect-11, 14-PIN FUNCTIONTable 1. Device Pin DescriptionPINOUTFigure 5. Pinout Configuration for the SP3232EThe SP3222E/SP3232E transceivers meet the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be imple-mented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222E/SP3232E devices feature Exar's proprietary on-board charge pumpcircuitry tha t generates ±5.5V for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require true RS-232 performance. The SP3222E/SP3232E devices can operate at a typical data rate of 235kbps when fully loaded.The SP3222E and SP3232E are 2-driver/2- receiver devices ideal for portable or hand-held applications. The SP3222E features a 1μA shutdown mode that reduces power consumption and extends battery life in por-table systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1μA supply current.THEORY OF OPERATIONThe SP3222E/SP3232E series is made up of three basic circuit blocks:1. Drivers2. Receivers3. The Exar proprietary charge pumpDriversThe drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground with-out degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +/-3.7V with supply voltages as low as 2.7V.The drivers can guarantee a data rate of 120kbps fully loaded with 3k? in parallelwith 1000pF, ensuring compatability withPC-to-PC communication software.The slew rate of the driver is internally limitedto a maximum of 30V/μs in order t o meet theEIA standards (EIA RS-232D 2.1.7, Para-graph 5). The transition of the loaded outputfrom HIGH to LOW also meet the monotonic-ity requirements of the standard.Figure 8 shows a loopback test circuitused to test the RS-232 Drivers. Figure9 shows the test results of the loopbackcircuit with all drivers active at 120kbpswith RS-232 loads in parallel with a1000pF capacitor. Figure 10 shows thetest results where one driver was activeat 235kbps and all drivers loaded with anRS-232 receiver in parallel with 1000pFcapacitors. A solid RS-232 data transmis-sion rate of 120kbps provides compatibilitywith many designs in personal computerperipherals and LAN applications.The SP3222E driver's output stages areturned off (tri-state) when the device is inshutdown mode. When the power is off, theSP3222E device permits the outputs to be driven up to +/-12V. The driver's inputs donot have pull-up resistors. Designers shouldconnect unused inputs to Vcc or GND.In the shutdown mode, the supply currentfalls to less than 1μA, where SHDN = LOW.When the SP3222E device is shut down,the device's driver outputs are disabled (tri-stated) and the charge pumps are turned offwith V+ pulled down to Vcc and V- pulled toGND. The time required to exit shutdown istypically 100μs. Connect SHDN to Vcc if theshutdown mode is not used.ReceiversThe Receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. The SP3222E receivers have an inverting tri-state output. These receiver outputs (RxOUT) are tri-stated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222E driver and receiver outputs can be found in Table 2.Since receiver input is usually from a trans -mission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, an internal 5k? pulldown resistor to ground will commit the output of the receiver to a HIGH state.Table 2. SP3222E Truth Table Logic for Shutdown and Enable ControlCircuitCharge PumpThe charge pump is an Exar-patended design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain sym -metrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages of +/-5.5V regardless of the input voltage (Vcc) over the +3.0V to +5.5V range.Figure 9. Loopback Test results at 120kbpsSHDN EN TxOUT RxOUT 00Tri-state Active 01Tri-state Tri-state 10Active Active 11ActiveTri-stateIn most circumstances, decoupling the power supply can be achieved adequately using a 0.1μF bypass capacitor at C5 (refer to figures 6 and 7). In applications that are sensitive to power-supply noise, decouple Vcc to ground with a capacitor of the same value as charge-pump capacitor C1. Physi -cally connect bypass capcitors as close to the IC as possible.The charge pump operates in a discontinu-ous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pump is enabled. If the output voltages exceed a magnitude of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shift-ing. A description of each phase follows.Phase 1 — V SS charge storage — During this phase of the clock cycle, the positive side of capaci -tors C 1 and C 2 are initially charged to V CC . C l +is then switched to GND and the charge in C 1– is transferredto C 2–. Since C 2+ is con-nected to V CC , the voltage potential across capacitor C 2 is now 2 times V CC .Phase 2—V SS transfer —Phase two of the clock connects the negative terminal of C 2 to the V SS storage capacitor and the positive terminal of C 2 to GND. This transfers a negative gener-ated voltage to C 3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the volt-age to C 3, the positive side of capacitor C 1 is switched to V CC and the negative side is connected to GND.Phase 3— V DD charge storage — The third phase of the clock is identical to the first phase —the charge transferred in C 1 produces –V CC in the negative terminal of C 1, which is applied to the negative side of capacitor C 2. Since C 2+ is at V CC , the voltage potential across C 2 is 2 times V CC .Phase 4— V DD transfer — The fourth phase of the clock connects the negative terminal of C 2 to GND, and transfers this positive generated voltage across C 2 to C 4, the V DD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the in -ternal oscillator is disabled. Simultaneous with the transfer of the voltage to C 4, the positive side of capacitor C 1 is switched to V CC and the negative side is con-nected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present.Since both V + and V – are separately gener -ated from V CC , in a no–load condition V + and V – will be symmetrical. Older charge pump approaches that generate V – from V + will show adecrease in the magnitude of V – compared to V + due to the inherent inefficiencies in the design.The clock rate for the charge pump typically operates at greater than 250kHz. The exter -nal capacitors can be as low as 0.1μF with a 16V breakdown voltage rating.Figure 13. Charge Pump WaveformsESD TOLERANCEThe SP3222E/SP3232E series incorpo-rates ruggedized ESDcells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up.There are different methods of ESD testing applied:a) MIL-STD-883, Method 3015.7b) IEC61000-4-2 Air-Dischargec) IEC61000-4-2 Direct ContactThe Human Body Model has been the generally accepted ESD testing method for semi-conductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 16. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manu-facturing areas where the ICs tend to be handled frequently.The IEC-61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human pres-ence. The premise with IEC61000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC61000-4-2 is shown on Figure 17. There are two methodswithin IEC61000-4-2, the Air Discharge method and the Contact Discharge method.With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situ-ations such as hand held systems, the ESD charge can be directly discharged to theFigure 16. ESD Test Circuit for Human Body ModelDEVICE PIN HUMAN BODY IEC61000-4-2 TESTED MODEL AirDischarge Direct Contact LevelDriver Outputs +15kV +15kV +8kV4Receiver Inputs +15kV+15kV+8kV4equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.The circuit models in Figures 16 and 17 rep-resent the typical ESD testing circuit used for all three methods. The C S is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through R S , the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. For the Human Body Model, the current limiting resistor (R S ) and the source capacitor (C S ) are 1.5k? an 100pF, respectively. For IEC-61000-4-2, the current limiting resistor (R S ) and the source capacitor (C S ) are 330? an 150pF, respectively .Figure 18. ESD Test Waveform for IEC61000-4-2Figure 17. ESD Test Circuit for IEC61000-4-2Table 3. Transceiver ESD Tolerance Levelst = 0nst = 30ns0A15A30AI →t →The higher C S value and lower R S value in the IEC61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.PACKAGE: 20 PIN SSOPPACKAGE: 16 PIN SSOPPACKAGE: 16 PIN PDIPPACKAGE: 16 PIN WSOIC。

DS32kHz32.768kHz Temperature-CompensatedCrystal OscillatorGENERAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) with an output frequency of 32.768kHz. This device addresses applications requiring better timekeeping accuracy, and can be used to drive the X1 input of most Dallas Semiconductor real-time clocks (RTCs), chipsets, and other ICs containing RTCs. This device is available in commercial (DS32kHz) and industrial (DS32kHz-N) temperature versions.APPLICATIONSGPS Receivers TelematicsNetwork Timing and Synchronization in Servers, Routers, Hubs, and Switches Automatic Power MetersFEATURESAccurate to ±4 Minutes/Year (-40°C to +85°C) Accurate to ±1 Minute/Year (0°C to +40°C) Battery Backup for Continuous Timekeeping V BAT Operating Voltage: 2.7V to 5.5V with V CCGroundedV CC Operating Voltage: 4.5V to 5.5V Operating Temperature Range:0°C to +70°C (Commercial) -40°C to +85°C (Industrial)No Calibration Required Low-Power ConsumptionSurface Mountable Using BGA Package UL RecognizedORDERING INFORMATIONPARTTEMP RANGEPIN-PACKAGETOP MARK*DS32KHZ/DIP 0ºC to +70ºC 14 DIP DS32KHZ DS32KHZN/DIP -40ºC to +85ºC 14 DIPDS32KHZ-N DS32KHZS 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZS# 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZSN -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZSN# -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZ/WBGA 0ºC to +70ºC 36 BGA DS32KHZ DS32KHZN/WBGA-40ºC to +85ºC36 BGADS32KHZ-N#Denotes a RoHS-compliant device that may include lead that is exempt under the RoHS requirements. The lead finish is JESD97 category e3, and is compatible with both lead-based and lead-free soldering processes.*A “#” anywhere on the top mark denotes a RoHS-compliant device. An “N” denotes an industrial device.PIN CONFIGURATIONSABSOLUTE MAXIMUM RATINGSVoltage Range on Any Pin Relative to Ground………………………………………………………………-3.0V to +7.0V Operating Temperature Range (Noncondensing)Commercial:…………………………………………………………………………………………………..0°C to +70°CIndustrial:……………………………………………………………………………………………………-40°C to +85°CStorage Temperature Range………………………………………………………………………………….-40°C to +85°C Soldering Temperature (BGA, SO)……………………….See the Handling, PC Board Layout, and Assembly section. Soldering Temperature, Leads (DIP)……………………………………………………..+260°C for 10 seconds (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications isnot implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.RECOMMENDED DC OPERATING CONDITIONS(T A = -40°C to +85°C) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Power-Supply Voltage V CC(Note2) 4.5 5.0 5.5 VBattery Voltage V BAT(Notes 2, 3) 2.7 3.0 3.5,5.5VDC ELECTRICAL CHARACTERISTICS(Over the operating range, unless otherwise specified.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITSActive Supply Current I CC V BAT = 0V or2.7V ≤ V BAT≤3.5V(Notes 3, 4)150 220 μABattery Input-Leakage Current I BATLKG V CC MIN≤ V CC≤ V CC MAX -50 +50 nAHigh Output Voltage (V CC) V OH I OH = -1.0mA (Note 2) 2.4 VLow Output Voltage V OL I OL = 2.1mA (Note 2) 0.4 VHigh Output Voltage (V BAT) V OH I OH = -0.1mA (Note 2) 2.4 VBattery Switch Voltage V SW(Note 2) V BAT V(V CC = 0V, T A = -40°C to +85°C.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Active Battery Current I BAT V BAT = 3.3V (Notes 4, 5, 6) 1 4 μABattery Current DuringTemperature MeasurementI BATCNV V BAT = 3.3V (Notes 4, 5, 7) 450 μANote 1:Limits at -40°C are guaranteed by design and are not production tested.Note 2:All voltages are referenced to ground.Note 3:V BAT must be no greater than 3.5V when the device is used in the dual-supply operating modes.Note 4:Typical values are at +25°C and 5.0V V CC, 3.0 V BAT, unless otherwise indicated.Note 5:These parameters are measured under no output load conditions.Note 6:This current is the active-mode current sourced from the backup supply/battery.Note 7: A temperature conversion lasts 122ms (typ) and occurs on power-up and then once every 64 seconds.AC TIMING CHARACTERISTICS(Over the operating range, unless otherwise specified.)PARAMETER SYMBOLCONDITIONSMINTYPMAXUNITSOutput Frequency f OUT32.768kHz0°C to +40°C -2.0 +2.0Frequency Stability vs. Temperature ∆f/f O-40°C to +85°C or0°C to +70°C-7.5 +7.5ppmDuty Cycle t W/t 45 50 55 % Cycle Time t CYC(Note 8) 30.518 μsHigh/Low Time t H/t L(Note8) 15.06 μsRise Time t R(Note 8) 200 nsFall Time t F(Note8) 60 ns Oscillator Startup Time t OSC(Note 8) 1 secondsFrequency Stability vs. Operating Voltage ∆f/VV CC = 5.0V orV BAT = 3.0V, V CC = 0V(Notes 4, 9)+2.5 ppm/VCrystal Aging (First Year) ∆f/f O(Notes 4, 10) ±1.0 ppmNote 8:These parameters are measured using a 15pF load.Note 9:Error is measured from the nominal supply voltage of whichever supply is powering the device.Note 10:After reflow.TYPICAL OPERATING CHARACTERISTICSPIN DESCRIPTIONPINSO BGA DIPNAME FUNCTION1 C4, C5, D4, D5 12 32kHz 32.768kHz Push-Pull Output2 C2, C3, D2, D3 13 V CC Primary Power Supply3–12, 15, 16 A7, A8, B7, B8,C7, C8, D7, D81, 6–11, 14 N.C. No Connection (Must be grounded)13 All remainingballs4 GNDGround14 A4, A5, B4, B5 5 V BAT +3V Nominal Supply Input. Used to operate the device when V CC is absent.Figure 2. Delta Time and Frequency vs. TemperatureFUNCTIONAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) that outputs a 32,768Hz square wave. While the DS32kHz is powered by either supply input, the device measures the temperature every 64 seconds and adjusts the output frequency. The device requires four pins for operation: V CC, GND, V BAT, and 32kHz. (See Figure 4 for connection schemes.) Power is applied through V CC and GND, while V BAT is used to maintain the 32kHz output in the absence of power. Once every 64 seconds, the DS32kHz measures the temperature and adjusts the output frequency. The output is accurate to ±2ppm (±1 min/yr) from 0°C to +40°C and to ±7.5ppm (±4 min/year) from -40°C to 0°C and from +40°C to +85°C.The DS32kHz is packaged in a 36-pin ball grid array (BGA). It also is available in a 16-pin 0.300” SO and a 14-pin encapsulated DIP (EDIP) module.The additional PC board space required to add the DS32kHz as an option for driving a RTC is negligible in many applications (see Figure 6) Therefore, adding the DS32kHz to new designs and future board revisions allows the use of the DS32kHz where applications require improved timekeeping accuracy.Figure 3. Block DiagramOPERATIONThe DS32kHz module contains a quartz tuning-fork crystal and an IC. When power is first applied, and when the device switches between supplies, the DS32kHz measures the temperature and adjusts the crystal load to compensate the frequency. The power supply must remain at a valid level whenever a temperature measurement is made, including when V CC is first applied. While powered, the DS32kHz measures the temperature once every 64 seconds and adjusts the crystal load.The DS32kHz is designed to operate in two modes. In the dual-supply mode, a comparator circuit, powered by V CC, monitors the relationship between the V CC and V BAT input levels. When V CC drops below a certain level compared to V BAT, the device switches over to V BAT (Figure 4A). This mode uses V CC to conserve the battery connected to V BAT while V CC is applied.In the single-supply mode, V CC is grounded and the unit is powered by V BAT. Current consumption is less than V CC, because the comparator circuit is unpowered (Figure 4B).Figure 4A shows how the DS32kHz should be connected when using two power supplies. V CC should be between 4.5V and 5.5V, and V BAT should be between 2.7V and 3.5V. Figure 4B shows how the DS32kHz can be used when only a single-supply system is available. V CC should be grounded and V BAT should then be held between 2.7V and 5.5V. The V BAT pin should be connected directly to a battery. Figure 4C shows a single-supply mode where V CC is held at +5V. See the frequency stability vs. operating voltage for information about frequency error vs. supply voltage.Figure 4. Power-Supply ConnectionsFigure 5 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the interchangeable option. Using this connection scheme and the recommended layout provides a solution, which requires no hardware modifications. Only one device should be used at a time, and both layouts should be located very close together if the recommended layout is not used.The DS32kHz I CC and I BAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the I CC and I BAT currents significantly and increase the current consumption of the RTC as well. Figure 6 shows one circuit that can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary depending on the RTC used. However, values of 1.0MΩ and 100pF are recommended as a starting point. R2 is used to shift the input waveform to the proper level. The recommended value for R2 is 33kΩ.Figure 5. DS32kHz ConnectionsFigure 6. DS32kHz and RTC ConnectionsRELATED APPLICATION NOTES(Go to /RTCapps to find these application notes and more.)Application Note 58: Crystal Considerations with Dallas Real-Time ClocksApplication Note 701: Using the DS32kHz with Dallas RTCsHANDLING, PC BOARD LAYOUT, AND ASSEMBLYThese packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent damage to the crystal.Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All N.C. (no connect) pins must be connected to ground.The BGA package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow temperature (≥230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed 40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that the internal crystal is not exposed to temperatures above 150°C.Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications.PACKAGE INFORMATION(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information,o to /DallasPackInfo.)gPACKAGE TYPE DOCUMENT NUMBER THETA-J A(°C/W)THETA-J C(°C/W)14-pin Encapsulated DIP 56-G0001-00216-pin SO (300 mils) 56-G4009-00173 23 36-pin BGA 56-G6023-00143.9 18.48 of 8Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim In tegrated P roducts, 120 S an Gabriel D rive, Sun nyvale, CA94086 408-737-7600。