PS7212-1A中文资料
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FEATURES•DESIGNED FOR AC/DC SWITCHING APPLICATIONS •IDEAL FOR ANALOG SIGNAL CONTROL APPLICATIONS •LOW LED OPERATING CURRENT:I F = 2 mA •LOW OFFSET VOLTAGE •SMALL PACKAGE:6 Pin DIPDESCRIPTIONPS7112-1A and PS7112L-1A are solid state relays containing a GaAs LED on the light emitting side (input side) and MOSFETs on the output side.APPLICATIONS•VOICE TELEPHONY •AUDIO EQUIPMENT •AUDIO INSTRUMENTATIONPART NUMBERPS7112-1A, PS7112L-1ASYMBOLSPARAMETERSUNITS MINTYP MAX V F Forward Voltage, I F = 10 mA V 1.21.4I R Reverse Current, V R = 5 VµA 5.0I LOFF Off-State Leakage Current, V D = 100 V µA0.031C OUT Output Capacitance, VD = 0 V, f = 1 MHz 57I Fon LED On-state Current, I L = 200 mAmA 2.0R ON1On-State Resistance, I F = 10 mA, I L = 10 mAΩ 3.0 6.0R ON2I F = 10 mA, I L = 200 mA, t ≤ 10 ms t ON Turn-on Timems 0.10.4 I F = 10 mA, V O = 5 V, PW ≥ 10 ms t OFF Turn-off Timems 0.030.2I F = 10 mA, V O = 5 V, PW ≥ 10 ms R I-O Isolation Resistance, V I-O = 1.0 kV DC Ω109C I-OIsolation Capacitance, V = 0 V, f = 1 MHzpF1.1D i o d eELECTRICAL CHARACTERISTICS (T A = 25 °C)M O S F E T C o u p l e d1. Test Circuit for Switching Time:PS7112-1A, PS7112L-1AFPulseInputV O monitorV LV California Eastern LaboratoriesSYMBOLS PARAMETERS UNITS RATINGSDiode I F Forward Current (DC)mA 50V R Reverse Voltage V 5P D Power Dissipation mW 50I FP Peak Foward Current 2A 1MOSFETV L Break Down VoltageV 100I LContinuous Load Current 3Connection A mA200Connection B 250Connection C 400I LP Pulse Load Current 4(AC/DC Connection)mA 400P DPower Dissipation mW 560Coupled BV Isolation Voltage 5V R.M.S .1500P T Total Power DissipationmW 610T OP Operating Temperature °C -40 to +80T STGStorage Temperature°C-40 to +100ABSOLUTE MAXIMUM RATINGS 1 (TA = 25°C)Notes:1.Operation in excess of any one of these parameters may result in permanent damage.2. PW = 100 µs, Duty Cycle = 1 %3.Conditions: I F ≥ 2 mA. The following tupes of load connections are available:4.PW = 100 ms, 1 shot.5. AC voltage for 1 minute at T A = 25 °C, RH = 60 % between input and output.PS7112-1A, PS7112L-1AOUTLINE DIMENSIONS (Units in mm)PS7112-1APS7112L-1ASYMBOLS PARAMETERSUNITSMIN TYP MAX I F LED Operating Current mA 21020V F LED Off VoltageV00.5RECOMMENDEDOPERATING CONDITIONS (T A = 25°C)PART NUMBERPS7112-1A,PS7112L-1A PIN CONNECTIONSPIN CONNECTIONS123654123654123654123654I LI LI L I L I LI L I LL LL L ++_++Connection AConnection BConnection CV L (AC/DC)V L (DC)V L (DC)V L (DC)PART NUMBER PACKAGE PACKING STYLE PS7112-1A 6-pin DIPMagazine case 50 pcsPS7112L-1A PS7112L-1A-E3Embossed Tape 1000 pcs/reelPS7112L-1A-E4ORDERING INFORMATION1. LED Anode2. LED Cathodee3. NC4. MOSFET Drain5. MOSFET Source6. MOSFET DrainMAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATUREM a x i m u m F o r w a r d C u r r e n t , I F (m A )Ambient Temperature, T A (°C)Ambient Temperature, T A (°C)F o r w a r d V o l t a g e , V F (V )NORMALIZED ON-STATE RESISTANCEvs. AMBIENT TEMPERATUREAmbient Temperature, T A (°C)N o r m a l i z e d O n -S t a t e R e s i s t a n c e , R O NMAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATUREM a x i m u m L o a d C u r r e n t , I L (m A )On-State Resistance, R ON (Ω)O u t p u t C a p a c i t a n c e , C O U T (p F )ON-STATE RESISTANCE DISTRIBUTIONSupply Voltage, V CC (V)N u m b e r (p c s )Ambient Temperature, T A (°C)OUTPUT CAPACITANCE vs. SUPPLY VOLTAGEFORWARD VOLTAGE vs.AMBIENT TEMPERATURETYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7112-1A, PS7112L-1A100806040200025-255075100300250150502001000025-2550751001.61.41.21.00.8025-25507510025020015010050020406080100120Normalized to 1.0at T A = 25 °C I F = 10 mA I L = 10 mA3.02.52.01.51.00.50-2525507510030251520105OFF-STATE LEAKAGE CURRENTvs. SUPPLY VOLTAGEO f f -S t a t e L e a k a g e C u r r e n t , I L O F F (A )Supply Voltage, V CC (V)Turn-on Time, t ON (ms)T u r n -o n T i m e , t O N (m s )TURN-ON TIME DISTRIBUTIONForward Current, I F (mA)N u m b e r (p c s )TURN-ON TIMEvs. FORWARD CURRENTLOAD CURRENT vs. LOAD VOLTAGEL o a d C u r r e n t , I L (m A )Load Voltage, V L (V)T u r n -o f f T i m e , t O F F (m s )Forward Current, I F (mA)TURN-OFF TIMEvs. FORWARD CURRENTTYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7112-1A, PS7112L-1ATurn-off Time, t OFF (ms)TURN-OFF TIME DISTRIBUTIONN u m b e r (p c s )10-910-810-710-610-510-310-4V O = 5 V8.06.04.02.0010203040V O = 5 V0.50.40.30.10.20102030403025152010500.100.050.15302515201050.020.06NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATUREN o r m a l i z e d T u r n -o n T i m e , t O NAmbient Temperature, T A (°C)NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATUREN o r m a l i z e d T u r n -o f f T i m e , t O F FAmbient Temperature, T A (°C)TYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7112-1A, PS7112L-1ATAPING SPECIFICATIONS (Units in mm)OUTLINE AND DIMENSIONS (REEL)Packaging : 1000 pcs/reelOUTLINE AND DIMENSIONS (TAPE)Normalized to 1.0at T A = 25 °C I F = 10 mA V CC = 5 V R L = 500 Ω3.02.52.01.51.00.50.0-250255075100Normalized to 1.0at T A = 25 °C I F = 10 mA V CC = 5 V R L = 500 Ω3.02.52.01.51.00.50.0-25025*******TAPING DIRECTIONPS7112L-1A-E3PS7112L-1A-E4PS7112-1A, PS7112L-1ARECOMMENDED SOLDERING CONDITIONS(1) Infrared reflow soldering •Peak reflow temperature235 °C or below (package surface temperature)•Time of temperature higher than 210 °C 30 seconds or less •Number of reflows Two•FluxRosin flux containing small amount of chlorine(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)Recommended Temperature Profile of Infrared Reflow(2) Dip soldering •Temperature 260 °C or below (molten solder temperature)•Time10 seconds or less •Number of times One•FluxRosin flux containing small amount of chlorine(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)(3) Cautions •FluxesAvoid removing the residual flux with freon-based cleaning solvent.Time (s)P a c k a g e S u r f a c e T e m p e r a t u r e T (˚C )EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-027924-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: 07/27/2001DATA SU BJECT TO CHANGE WITHOUT NOTICE分销商库存信息:CELPS7112-1A PS7112L-1A。
FEATURES• 2 CHANNEL TYPE:(1a + 1a output)•DESIGNED FOR AC/DC SWITCHING LINE CHANGER •SMALL PACKAGE:8 pin DIP •LOW OFFSET VOLTAGE•LOW LED OPERATING CURRENT:(I F = 2 mA)•SURFACE MOUNT AVAILABLE:PS7141-2ADESCRIPTIONPS7141-2A and PS7141L-2A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOSFETs on the output side. They are suitable for analog signal control because of their low offset and high linearity.APPLICATIONS•EXCHANGE EQUIPMENT •MEASUREMENT EQUIPMENT •FA/OA EQUIPMENTPART NUMBERPS7141-2A, PS7141L-2ASYMBOLSPARAMETERSUNITS MINTYP MAX V F Forward Voltage, I F = 10 mA V 1.21.4I R Reverse Current, VR = 5 V µA 5.0I LOFF Off-State Leakage Current,V D = 400 VµA 0.03 1.0C OUT Output Capacitance, VD = 0 V, f = 1 MHz pF/ch 65IFonLED On-state Current, I L = 150 mA mA2.0On-State Resistance,R on1I F = 10 mA, I L = 10 mAΩ2030R on2I F = 10 mA, I L = 150 mA, t ≤ 10 ms 1625t ON Turn-on Time 1I F = 10 mA, V O = 5 V, PW ≥ 10 msms 0.35 1.0t OFF Turn-off Time 10.060.2R I-O Isolation Resistance, V I-O = 1.0 kV Ω109C I-OIsolation Capacitance, V = 0 V, f = 1 MHzpF/ch1.1D i o d e C o u p l e dELECTRICAL CHARACTERISTICS (T A = 25 °C)M O S F E TPS7141-2A, PS7141L-2ANote:1. Test Circuit for Switching Time:Pulse InputInput MonitorV O Monitor V LCalifornia Eastern Laboratories元器件交易网SYMBOLS PARAMETERSUNITSMIN TYP MAX I F LED Operating Current mA 21020V F LED Off VoltageV00.5SYMBOLS PARAMETERS UNITS RATINGSDiode I F Forward Current (DC)mA 50V R Reverse Voltage V 5.0P D Power Dissipation mW/ch 50I FP Peak Foward Current 2A 1MOSFETV L Break Down VoltageV 400I L Continuous Load Current mA 150I LPPulse Load Current 3AC/DC Connection mA 300P DPower DissipationmW/ch375Coupled BV Isolation Voltage 4Vr.m.s.1500P T Total Power Dissipation mW 850T A Operating Ambient Temp.°C -40 to +80T STG Storage Temperature °C -40 to +100ABSOLUTE MAXIMUM RATINGS 1 (T A = 25°C)RECOMMENDED OPERATING CONDITIONS (T A = 25°C)Notes:1.Operation in excess of any one of these parameters may result in permanent damage.2.PW = 100 µs, Duty Cycle = 1 %.3.PW = 100 ms, 1 shot.4.AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output.PS7141-2A, PS7141L-2APART NUMBERPS7141-2A,PS7141L-2A OUTLINE DIMENSIONS (Units in mm)PS7141-2APS7141L-2APIN CONNECTION (Top View)PS7141-2A, PS7141L-2A1. LED Anode12. LED Cathode13. LED Anode24. LED Cathode25. MOSFET 26. MOSFET 27. MOSFET 18. MOSFET 1PART NUMBER PACKAGE PACKING STYLE PS7141-2A 8 PIN DIPMagazine case 50 pcsPS7141L-2A PS7141L-2A-E3Embossed Tape 1000 pcs/reelPS7141L-2A-E3ORDERING INFORMATION-0.05元器件交易网MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATUREM a x i m u m F o r w a r d C u r r e n t , I F (m A )Ambient Temperature, T A (°C)Supply Voltage, V CC (V)F o r w a r d V o l t a g e , V F (V )OFF-STATE LEAKAGE CURRENTvs. SUPPLY VOLTAGEAmbient Temperature, T A (°C)O f f -S t a t e L e a k a g e C u r r e n t , I L O F F (A )MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATUREM a x i m u m L o a d C u r r e n t , I L (m A )Load Voltage, V L (V)O u t p u t C a p a c i t a n c e , (p F )LOAD CURRENT vs.LOAD VOLTAGESupply Voltage, V CC (V)L o a d C u r r e n t , I L (m A )Ambient Temperature, T A (°C)OUTPUT CAPACITANCE vs. SUPPLY VOLTAGEFORWARD VOLTAGE vs.AMBIENT TEMPERATURETYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7141-2A, PS7141L-2A100806040200025-25507510030020010001.81.61.41.21.00.8025-25507510020015010050020406080100120010*******40050010-910-810-710-610-5元器件交易网NORMALIZED ON-STATE RESISTANCEvs. AMBIENT TEMPERATUREN o r m i a l i z e d O n -S t a t e R e s i s t a n c e , R O NAmbient Temperature, T A (°C)Turn-on Time, T ON (ms)T u r n -o n T i m e , t O N (m s )TURN-ON TIME DISTRIBUTIONForward Current, I F (mA)N u m b e r (p c s )TURN-ON TIMEvs. FORWARD CURRENTON-STATE DISTRIBUTIONN u m b e r (p c s )On-State Resistance, R ON (Ω)T u r n -o f f T i m e , t O F F (m s )Forward Current, I F (mA)TURN-OFF TIMEvs. FORWARD CURRENTTYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7141-2A, PS7141L-2A3.02.52.01.51.00.50.0-25025*******Normalized to 1.0at T A = 25 °C,I F = 10 mA,I L= 10 mA12108642051015202530V O = 5 V0.300.250.200.150.100.050510********302515201052021TURN-OFF TIME DISTRIBUTION3025152010500.30.4N u m b e r (p c s )Turn-on Time, T OFF (ms)302515201050.040.08元器件交易网NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATUREN o r m a l i z e d T u r n -o n T i m e , t O NAmbient Temperature, T A (°C)NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATUREN o r m a l i z e d T u r n -o f f T i m e , t O F FAmbient Temperature, T A (°C)TYPICAL PERFORMANCE CURVES (T A = 25 °C)PS7141-2A, PS7141L-2ANormalized to 1.0at T A = 25 °C,I F = 10 mA,V O = 5V3.02.52.01.51.00.50.0-252550751003.02.52.01.51.00.50.0-25255075100TAPING SPECIFICATIONS (Units in mm)OUTLINE AND DIMENSIONS (REEL)Notes:1. Packaging : 1000 pcs/reelOUTLINE AND DIMENSIONS (TAPE)TAPING DIRECTION PS7141L-2A-E3PS7141L-2A-E4元器件交易网EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279Internet: 10/30/2001RECOMMENDED SOLDERING CONDITIONS(1) Infrared reflow soldering •Peak reflow temperature235 °C or below (package surface temperature)•Time of temperature higher than 210 °C 30 seconds or less •Number of reflows Two•FluxRosin flux containing small amount of chlorine(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)Recommended Temperature Profile of Infrared Reflow(2) Dip soldering•Temperature 260 °C or below (molten solder temperature)•Time10 seconds or less •Number of times One•FluxRosin flux containing small amount of chlorine(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)(3) Cautions •FluxesAvoid removing the residual flux with freon-based cleaning solvent.Time (s)P a c k a g e S u r f a c e T e m p e r a t u r e T (˚C )PS7141-2A, PS7141L-2ALife Support ApplicationsThese NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.元器件交易网。
Pushbutton Switch A30Easy mounting and removal of Switch Unit.Increase wiring ef ficiency with three-row mounting Array of Switch Blocks.Finger protection mechanism on Switch Unitprovided as a standard feature.Mounted using either open-type (fork-type) orclosed-type (round-type) crimp terminals.IP65 oil resistance (non-lighted models)IP65 (lighted models)EN60947-5-1206207Protruding guard Pushbutton Switches (Lighted Models)A30L-GRound Protruding Full Shippedas a set which includes the Pushbutton, Lamp (lighted models only), and Switch.Non-lighted Models (Round)Momentary operation (self-resetting)Alternate operation Illumination colorFlat type following letters into thebox j.(y )G (green)W (white)Protruding typeB (black)S S O C208S S O C209210Pushbuttons, Lamps, and Switches can be ordered separately . Combinations that are not available as sets can be created using individual Units. Also, store the parts as spares for maintenance and repairs.Non-lighted ModelsPushbutton Lighted Models without Voltage Reduction Unit Lighted Models with Voltage Reduction Unit Pushbutton PushbuttonLamp Lamp Incandescent lamp LED lamp LED lamp SwitchSwitch (without V oltage Reduction Unit)Switch (with V oltage Reduction Unit)214RatingsContacts (Standard Load)Note: 1.The rated current shown was tested at JIS C4520 conditions. The ratings given are for the following test conditions, based on JISC4505.Ambient temperature: 20$2_CAmbient humidity: 65$5%Operating frequency: 20 operations/min.2.Minimum applicable load is 10 mA at 5 VDC.Contacts (Microload)LED LampNote:Ratings in parentheses show rated current for blue LEDs.Super-bright LED Lamp Incandescent Lamp Low-voltage Lighting。
EL7202C EL7212C EL7222CJanuary1996RevB Note All information contained in this data sheet has been carefully checked and is believed to be accurate as of the date of publication however this data sheet cannot be a‘‘controlled document’’ Current revisions if any to these specifications are maintained at the factory and are available upon your request We recommend checking the revision level before finalization of your design documentation1994Elantec IncFeaturesIndustry standard driverreplacementImproved response timesMatched rise and fall timesReduced clock skewLow output impedanceLow input capacitanceHigh noise immunityImproved clocking rateLow supply currentWide operating voltage rangeApplicationsClock line driversCCD DriversUltra-sound transducer driversPower MOSFET driversSwitch mode power suppliesClass D switching amplifiersUltrasonic and RF generatorsPulsed circuitsOrdering InformationPart No Temp Range Pkg OutlineEL7202CN b40 C to a85 C8-Pin P-DIP MDP0031EL7202CS b40 C to a85 C8-Pin SO MDP0027EL7212CN b40 C to a85 C8-Pin P-DIP MDP0031EL7212CS b40 C to a85 C8-Pin SO MDP0027EL7222CN b40 C to a85 C8-Pin P-DIP MDP0031EL7222CS b40 C to a85 C8-Pin SO MDP0027General DescriptionThe EL7202C EL7212C EL7222C ICs are matched dual-driv-ers ICs that improve the operation of the industry standardDS0026clock drivers The Elantec Versions are very high speeddrivers capable of delivering peak currents of2 0amps intohighly capacitive loads The high speed performance is achievedby means of a proprietary‘‘Turbo-Driver’’circuit that speedsup input stages by tapping the wider voltage swing at the out-put Improved speed and drive capability are enhanced bymatched rise and fall delay times These matched delays main-tain the integrity of input-to-output pulse-widths to reduce tim-ing errors and clock skew problems This improved performanceis accompanied by a10fold reduction in supply currents overbipolar drivers yet without the delay time problems commonlyassociated with CMOS devices Dynamic switching losses areminimized with non-overlapped drive techniquesConnection DiagramsEL7222CEL7212C7202–27202–1Complementary DriversInverting DriversEL7202C7202–3Non-Inverting DriversManufactured under U S Patent Nos 5 334 883 5 341 0472T D i s 3 3 i n7202–4Simplified7202–5 3Typical Performance CurveMax Power Derating Curves7202–6Switch Threshold vs Supply Voltage7202–7Input Current vs Voltage 7202–8Peak Drive vs Supply Voltage7202–9Quiescent Supply Current 7202–10‘‘ON’’Resistance vs Supply Voltage7202–114Typical Performance Curve ContdAverage Supply Current vsVoltage and Frequency7202–12Average Supply Currentvs Capacitive Load7202–13 Rise Fall Time vs Load7202–14Rise Fall Time vs Supply Voltage7202–155Typical Performance Curve ContdPropagation Delay vs Supply Voltage7202–16Rise Fall Time vs Temperature7202–17Delay vs Temperature7202–186EL7212Macro Model7202–20EL7212model input lgnd l lVsupply l l lVout subckt M72122367V11231 6R113151k R214155k R51112100C115343 3pF D11413dmod X1131123comp1X21612153comp1sp 67163spmod sn 73163snmod g1110130938m model dmod dmodel spmod vswitch ron 43roff 42meg von 41voff 41 5 model snmod vswitch ron 44roff 42meg von 43voff 42 ends M7212subckt comp1out inp inm vsse1out vss table (v(inp)1v(inm)) 5000 4(0 0)(3 2 3 2)Rout out vss 10meg Rinp inp vss 10meg Rinm inm vss 10meg ends comp17T D i s 3 6i nE L 7202C E L 7212C J a n u a r y 1996R e v BGeneral DisclaimerSpecifications contained in this data sheet are in effect as of the publication date shown Elantec Inc reserves the right to make changes in the circuitry or specifications contained herein at any time without notice Elantec Inc assumes no responsibility for the use of any circuits described herein and makes no representations that they are free from patent infringementElantec Inc 1996Tarob Court Milpitas CA 95035Telephone (408)945-1323(800)333-6314Fax (408)945-9305European Office 44-71-482-4596WARNING Life Support PolicyElantec Inc products are not authorized for and should not be used within Life Support Systems without the specific written consent of Elantec Inc Life Support systems are equipment in-tended to support or sustain life and whose failure to perform when properly used in accordance with instructions provided can be reasonably expected to result in significant personal injury or death Users contemplating application of Elantec Inc products in Life Support Systems are requested to contact Elantec Inc factory headquarters to establish suitable terms conditions for these applications Elantec Inc ’s warranty is limited to replace-ment of defective components and does not cover injury to per-sons or property or other consequential damagesPrinted in U S A8。
STT721金属探测仪操作手册控制器型号:DMD721软件版本:V7.21A5手册版本:V2.10沈阳斯达特电子科技有限公司特别说明:本手册是沈阳斯达特电子科技有限公司生产的STT721型金属探测仪的专用操作手册,不能用于指导其他类似设备的操作。
本手册已经过专业人员校核,但难免会有疏漏,本公司会定期对手册进行修订,如有更新恕不另行通知。
版权声明:本操作手册的著作权属于沈阳斯达特电子科技有限公司所有,在未经本公司允许的情况下,任何单位和个人不得以任何方式对本手册的部分或全部内容擅自进行增删、改编、节录、翻译、改写和翻印,更不可提供给第三方,如有违反者将承担赔偿责任,本公司保留所有权利。
沈阳斯达特电子科技有限公司地址:沈阳市沈北新区蒲河路83号电话:86-024-********服务热线:4006007751传真:86-024-********E-mail:stt114@网址:目录目录1手册介绍 (1)1.1概要 (1)1.2手册中使用的警示标志 (1)2安全使用 (2)2.1概要 (2)2.2安全事项 (2)2.3操作人员要求 (2)2.4操作安全 (3)3设备概述 (4)3.1产品用途和特点 (4)3.2检测原理 (4)3.3产品命名规则 (4)3.4特征参数 (5)3.5产品外观 (5)3.6基本灵敏度曲线 (6)4安装调试 (13)4.1安装注意事项 (13)4.2传感器无金属区规定 (13)4.3传感器的安装 (15)4.4输送机安装 (17)4.5电缆连接 (17)4.6噪声干扰抑制 (22)5操作说明 (23)I目录II 5.1内容概要 (23)5.2控制面板 (23)5.3密码说明 (24)5.4菜单结构列表 (24)5.5上电启动 (25)5.6系统菜单 (26)5.6.1子菜单组1:状态参数S (29)5.6.2子菜单组2:产品参数P (31)5.6.3子菜单组3:报警记录 (33)5.6.4子菜单组4:参数处理 (34)5.6.5子菜单组5:配置参数C (36)6常见故障 (41)6.1电源板P3端子 (41)6.2电源板P2端子 (41)6.3主控板P3端子 (41)6.4控制器上电 (42)7快速设定 (46)7.1控制器上电默认状态 (46)7.2控制器快速设定 (46)8包装运输 (48)9开箱及检验 (48)10控制器电气接线图 (49)1手册介绍11手册介绍1.1概要本手册包含正确安装和使用STT721型金属探测仪需要的所有信息,用于指导厂家技术人员完成初始安装和调试,指导操作者正确使用,指导技术人员定期检查、维护和排除故障。
PRELIMINARY DATA SHEETThe information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.©1999Document No. P14571EJ1V0DS00 (1st edition)Date Published October 1999 NS CP(K)Printed in JapanDESCRIPTIONThe PS7213-1A is a low on-state resistance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side.It is suitable for PLC, etc. because of its large continuous load current and low on-state resistance.FEATURES•Low on-state resistance (R on = 2.0 Ω TYP.)•Large continuous load current (I L = 300 mA)• 1 channel type (1 a output)•Designed for AC/DC switching line changer•Small and thin package (4-pin SOP, Height = 2.1 mm)•High isolation voltage (BV = 1 500 Vr.m.s.)•Low offset voltage•Ordering number of taping product: PS7213-1A-E3, E4, F3, F4APPLICATIONS•Measurement equipment •FA equipment2Preliminary Data Sheet P14571EJ1V0DS00ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise specified)Parameter Symbol Ratings UnitDiode Forward Current (DC)I F50mAReverse Voltage V R 5.0VPower Dissipation P D50mWPeak Forward Current *1I FP1AMOS FET Break Down Voltage V L100VContinuous Load Current I L300mAPulse Load Current *2I LP0.6A(AC/DC Connection)Power Dissipation P D300mWIsolation Voltage *3BV 1 500Vr.m.s.Total Power Dissipation P T350mWOperating Ambient Temperature T A−40 to +85°CStorage Temperature T stg−40 to +100°C*1PW = 100 µs, Duty Cycle = 1 %*2PW = 100 ms, 1 shot*3AC voltage for 1 minute at T A = 25 °C, RH = 60 % between input and outputRECOMMENDED OPERATING CONDITIONS (T A = 25 °C)Parameter Symbol MIN.TYP.MAX.UnitLED Operating Current I F21020mALED Off Voltage V F00.5VELECTRICAL CHARACTERISTICS (T A = 25 °C)Parameter Symbol Conditions MIN.TYP.MAX.Unit Diode Forward Voltage V F I F = 10 mA 1.2 1.4V Reverse Current I R V R = 5 V 5.0µA MOS FET Off-state Leakage Current I Loff V D = 60 V 1.0µA Coupled LED On-state Current I Fon I L = 300 mA 2.0mA On-state Resistance R on1I F = 10 mA, I L = 10 mA 2.0 3.0ΩR on2I F = 10 mA, I L = 300 mA, t ≤ 10 msTurn-on Time t on I F = 10 mA, V O = 5 V, PW ≥ 10 ms0.6 2.0msTurn-off Time t off0.030.2Isolation Resistance R I-O V I-O = 1.0 kV DC109ΩIsolation Capacitance C I-O V = 0 V, f = 1 MHz0.5pFPreliminary Data Sheet P14571EJ1V0DS003CAUTIONWithin this device there exists GaAs (Gallium Arsenide) material which is aharmful substance if ingested. Please do not under any circumstances break thehermetic seal.• The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.• No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual propertyrights of third parties by or arising from use of a device described herein or any other liability arising from useof such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or otherintellectual property rights of NEC Corporation or others.• Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits,software, and information in the design of the customer's equipment shall be done under the full responsibilityof the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons orproperty arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.• NEC devices are classified into the following three quality grades:"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on acustomer designated "quality assurance program" for a specific application. The recommended applications ofa device depend on its quality grade, as indicated below. Customers must check the quality grade of each devicebefore using it in a particular application.Standard: Computers, office equipment, communications equipment, test and measurement equipment,audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robotsSpecial: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disastersystems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support)Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, lifesupport systems or medical equipment for life support, etc.The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.M7 98. 8。
PROGRAMMABLE DIGITAL DELAY TIMERDESCRIPTION:The LS7211 and LS7212 are CMOS integrated circuits for generating digitally programmable delays. The delay is controlled by 8 binary weighted inputs, WB0 - WB7, in con-junction with an applied clock or oscillator frequency. The programmed time delay manifests itself in the Delay Output (OUT) as a function of the Operating Mode selected by the Mode Select inputs A and B: One-Shot, Delayed Operate,Delayed Release or Dual Delay. The time delay is initiated by a transition of the Trigger Input (TRIG).I/O DESCRIPTION:MODE SELECT Inputs A & B (Pins 1 & 2)The 4 operating modes are selected by Inputs A and B according to Table 1TABLE 1. MODE SELECTION A B MODE 0 0 One-Shot (OS)0 1 Delayed Operate (DO)1 0 Delayed Release (DR)1 1 Dual Delay (DD)Each input has an internal pull-up resistor of about 500k Ω. One-Shot Mode (OS)A positive transition at the TRIG input causes OUT to switch low without delay and starts the delay timer. At the end of the programmed delay timeout, OUT switches high.If a delay timeout is in progress when a positive transition occurs at the TRIG input, the delay timer will be restarted.A negative transition at the TRIG input has no effect.Delayed Operate Mode (DO)A positive transition at the TRIG input starts the delay tim-er. At the end of the delay timeout, OUT switches low. A negative transition at the TRIG input causes OUT to switch high without delay. OUT is high when TRIG is low.Delayed Release Mode (DR)A negative transition at the TRIG input starts the delay tim-er. At the end of the delay timeout, OUT switches high. A postive transition at the TRIG input causes OUT to switch low without delay. OUT is low when TRIG is high.Dual Delay Mode (DD)A positive or negative transition at the TRIG input starts the delay timer. At the end of the delay timeout, OUT switches to the logic state which is the inverse of the TRIG input. If a delay timeout is in progress when a transition occurs at the TRIG input, the delay timer is restarted.7211-110503-1123456789101112131415161718LSILS7211OUTV DD (+V)A BTRIG RC/CLOCK RCS/CLKSPSCLS RESET V SS (-V)WB0WB1WB2WB3WB4WB5WB6WB7123456789101112131415161718LSILS7212OUTV DD (+V)A BTRIG XTLI/CLOCKXTLO PSCLS RESET V SS (-V)WB0WB1WB2WB3WB4WB5WB6WB7FIGURE 1PIN ASSIGNMENT - TOP VIEWNovember 2003LSI/CSILSI Computer Systems, Inc. 1235 Walt Whitman Road, Melville, NY 11747 (631) 271-0400 FAX (631) 271-0405LS7211-7212FEATURES:• 8-bit programmable delay from microseconds to days• On chip oscillator (RC or Crystal) or external clock time base • Selectable prescaler for real time delay generation based on 50Hz/60Hz time base or 32.768kHz watch crystal • Four operating modes • Reset input for delay abort• Low quiescent and operating current • Direct relay drive• +4V to +18V operation (V DD - V SS )• LS7211, LS7212 (DIP); LS7211-S, LS7212-S (SOIC) - See Figure 1U L®A38007211-012703-3ABSOLUTE MAXIMUM RATINGS: (All voltages referenced to V SS )SYMBOL VALUEUNIT DC Supply Voltage V DD +19V Voltage (Any Pin)V IN V SS - 0.3 to V DD + 0.3V Operating Temperature T A -20 to +85°C Storage Temperature T STG -65 to +150°C Characteristic SYMBOLV DD Unit Condition Min Max Min Max Min Max Supply Voltage V DD - 4.018.0 4.018.0 4.018.0V -4.032-27-20-µA Supply Current I DD10.0190-160-110-µA with the clock off18.0560-437-330-µA Input Voltages: 4.0- 1.0- 1.0- 1.0V Trigger Low V TL 10.0- 3.0- 3.0- 3.0V -18.0- 5.8- 5.8- 5.8V 4.0 3.0- 3.0- 3.0-V Trigger High V TH10.0 6.6- 6.6- 6.6-V -18.011.0-11.0-11.0-V 4.0 1.5- 1.5- 1.5-V Trigger Hysteresis 10.0 3.0- 3.0- 3.0-V -18.0 4.8- 4.8- 4.8-V 4.0- 1.2- 1.2- 1.2V All other inputs, Low V IL 10.0- 4.1- 4.1- 4.1V -18.0-7.2-7.2-7.2V 4.0 2.1- 2.1- 2.1-V All other inputs, High V IH 10.0 5.3- 5.3- 5.3-V -18.09.3-9.3-9.3-V Input Currents: 4.0- 2.6- 2.0- 1.5µA PSCLS Low I PL 10.0-22.0-17.0-13.0µA Input at V SS 18.0-70.0-54.0-41.0µA 4.0- 5.8- 4.4- 3.4µA PSCLS High I PH 10.0-26.0-20.0-15.2µA Input at V DD 18.0-82.0-63.0-48.0µA 4.0- 2.0- 1.6- 1.3µA A, B LowI ML 10.0-37.0-28.0-22.0µA Input at V SS 18.0-132.0-101.0-77.0µA A, B HighI MH --100-100-200nA Input at V DD All other inputs, Low I IL --100-100-200nA Input at V SS 4.0- 4.6- 3.5- 2.7µA All other inputs, High I IH10.0-33.0-25.0-19.0µA Input at V DD18.0-121.0-93.0-71.0µA Output Current: 4.023.0-18.0-13.0-mA OUT Sink I OSNK 10.043.0-33.0-25.0-mA Vo = +0.5V 18.056.0-43.0-32.0-mA 4.0 2.6- 2.0- 1.5-mA OUT SourceI OSRC10.07.8- 6.0- 4.5-mA Vo = V DD - 0.5V18.011.5-8.8- 6.5-mA-20°C +25°C+85°C ELECTRICAL CHARACTERISTICS (Voltages referenced to Vss)t。
LMP7721多功能评估板使用说明1 引言LMP7721评估板提供了一个平台,用来测试LMP7721放大器的性能和输入偏流。
利用芯片内保护驱动器和一个封装外引脚将放大器的输入与电源和输出引脚相隔离,优化LMP7721放大器获得极低的输入偏流,典型值为3fA。
图1为LMP7721评估板。
图1 LMP7721评估板2评估板的清洗2.1清洗材料和工具(1) 新鲜的异丙醇(“外用酒精”或“IPA”)。
(2) 将酸刷子的刷毛修剪至1cm(将刷毛向手柄内推或剪短刷毛)。
(3) 一次性低皮棉湿巾(小号“低尘擦拭纸”)。
(4) 压缩空气(喷雾喷粉罐或空气枪)。
(5) 热风枪,〜200℃(吹风机通常不够热,但可以使用)。
2.2清洗步骤(1)按正常的清洗程序清洗电路板以消除焊剂、指纹以及其他主要污染物(水洗)。
(2) 用一双钳子或镊子按住板子,缓慢移动板子到热风枪前面一两分钟,以蒸发掉任何剩余的水分(距离喷嘴处不小于5cm)。
(3) 让板子冷却到室温,用新鲜、干净的异丙醇清洗板子且浸泡数秒钟。
(4) 立即用酸刷擦洗电路板,特别是周围区域以及U1引脚和RS焊盘之间。
像“裸露”区域和保护线路区域等关键区域应该清洁、擦洗彻底。
用小毛巾快速擦拭整个板子和吸收掉大部分的多余酒精。
不要忘了电路板的底部也要擦洗。
(5) 用新鲜的酒精再次冲洗以上区域,用一条新的小毛巾快速擦拭过量的酒精。
然后,立即用压缩空气吹干剩余的酒精,不要用水。
水分会在SMT设备下隐藏。
(注:SMT表面组装技术)(6)吹完板子后,立即用新鲜的小毛巾擦拭以除去残留的任何酒精残留物。
用新的小毛巾擦拭板子顶部和板子底部。
(7) 重复步骤2,用加热枪以消除剩余的多余酒精。
如果有任何白色残留物,重复步骤2。
如果白点依然存在,所用酒精被水污染。
(8) 在不使用时,存放板子在一个密封的容器中。
可以用干燥剂包裹板子。
如果干燥剂不可用,换两汤匙干生米用无尘纸包裹也可。
3防护装置和保护罩防护装置是分微微安培电流设计中的重要概念。
光耦pc817应用电路pc817是常用的线性光藕,在各种要求比较精密的功能电路中常常被当作耦合器件,具有上下级电路完全隔离的作用,相互不产生影响。
<光耦pc817应用电路图>当输入端加电信号时,发光器发出光线,照射在受光器上,受光器接受光线后导通,产生光电流从输出端输出,从而实现了“电-光-电”的转换。
普通光电耦合器只能传输数字信号(开关信号),不适合传输模拟信号。
线性光电耦合器是一种新型的光电隔离器件,能够传输连续变化的模拟电压或电流信号,这样随着输入信号的强弱变化会产生相应的光信号,从而使光敏晶体管的导通程度也不同,输出的电压或电流也随之不同。
PC817光电耦合器不但可以起到反馈作用还可以起到隔离作用。
\\当输入端加电信号时,发光器发出光线,照射在受光器上,受光器接受光线后导通,产生光电流从输出端输出,从而实现了“电-光-电”的转换。
普通光电耦合器只能传输数字信号(开关信号),不适合传输模拟信号。
线性光电耦合器是一种新型的光电隔离器件,能够传输连续变化的模拟电压或电流信号,这样随着输入信号的强弱变化会产生相应的光信号,从而使光敏晶体管的导通程度也不同,输出的电压或电流也随之不同。
PC817光电耦合器不但可以起到反馈作用还可以起到隔离作用。
光耦的测量:用数字表测二极管的方法分别测试两边的两组引脚,其中仅且仅有一次导通的,红表笔接的为阳极,黑表笔接的为阴极(指针表相反)。
且这两脚为低压端,也就是反馈信号引入端。
在正向测试低压端时,再用另一块万用表测试另外高压端两只脚,接通时,红表笔所接为C极,黑表笔接为E极。
当断开低压端的表笔时,高压端的所接万用表读数应为无穷大。
同理:只要在反馈端加一定的电压,高压端就应能导通,反之,该器件应为损坏。
光耦能否代用,主要看其CTR参数值是否接近。
测量的实质就是:就是分别去测发光二极管和3极管的好坏。
另外一种测量说法:用两个万用表就可以测了。
光电耦合器由发光二极管和受光三极管封装组成。
PART NUMBER PS2701A-1 SYMBOLS PARAMETERS UNITS MIN TYP MAX V F Forward Voltage, I F = 5 mA V 1.2 1.4I R Reverse Current, V R = 5 V µA 5 C t Terminal Capacitance, V = 0, f = 1 MHz pF 10I CEO Collector to Emitter Current, I F = 0 mA , V CE = 70 nA 100CTR Current Transfer Ratio 1, I F = 5 mA, V CE = 5 V % 50300 V CE (sat) Collector Saturation Voltage, I F = 10 mA, IC = 2 mA V 0.13 0.3 R I-O Isolation Resistance, V IN-OUT = 1 k V DC Ω 1011C I-O Isolation Capacitance, V = 0, f = 1 MH Z pF 0.4 t r Rise Time 2, V CC = 5 V, I C = 2 mA, R L = 100 Ω µs 5 t f Fall Time 2, V CC = 5 V, I C = 2 mA, R L = 100 Ω µs 7 Notes:1. CTR rank2. Test Circuit for Switching Time N: 50 to 300 % P: 150 to 300%L: 100 to 300 % M: 50 to 150 %NEC's HIGH ISOLATION VOLTAGESOP PHOTOCOUPLERFEATURES• HIGH ISOLATION VOLTAGE BV: 3.75 k V r.m.s.• SOP (SMALL OUT-LINE PACKAGE)• HIGH SPEED SWITCHING t r = 5 µs TYP , t f = 7 µs TYP• ORDERING NUMBER OF TAPING PRODUCTPS2701A-1-F3, F4DESCRIPTIONNEC's PS2701A-1 is an optically coupled isolator con t ain i ng a GaAs light emitting diode and a NPN silicon phototransis-tor. This device is mounted in a plastic SOP (Small Outline Package) for high density applications and has a shield effect to cut off ambient light.PS2701A-1ELECTRICAL CHARACTERISTICS (T A = 25°C)D i o d eT r a n s i s t o r C o u p l e d APPLICATIONS• HYBRID IC• MEASURING INSTRUMENTS • POWER SUPPLY• TELEPHONE/TELEGRAPH LINE RECEIVER • PROGRAMMABLE LOGIC CONTROLLERSCalifornia Eastern Laboratories元器件交易网PS2701A-1ANotes:1.Operation in excess of any one of these parameters may result in permanent damage.2.AC voltage for 1 minute at T A = 25 °C, RH = 60 % between input and ouput.ABSOLUTE MAXIMUM RATINGS 1 (T A = 25°C)TYPICAL PERFORMANCE CURVES (T A = 25 °C)DIODE POWER DISSIPATION vs.AMBIENT TEMPERATURED i o d e P o w e r D i s s i p a t i o n , P D (m W )Ambient Temperature, T A (°C) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURET r a n s i s t o r P o w e r D i s s i p a t i o n , P C (m W )Ambient Temperature , T A (°C) COLLECTOR CURRENT vs.COLLETOR TO EMITTER VOLTAGEF o r w a r d C u r r e n t , I F (m A )Collector to Emitter Voltage, V CE (V) C o l l e c t o r C u r r e n t , I C (m A )Collector Saturation Voltage, V CE (sat ) (V)COLLECTOR CURRENT vs.COLLECTOR SATURATION VOLTAGESYMBOLS PARAMETERSUNITS RATINGS PS2701A-1DiodeI F Forward Current (DC)mA 30V R Reverse VoltageV 6∆P D/ ºC Power Dissipation Derating mW/Ch 0.8P D Power Dissipation mW 80I F P Peak Forward Current(PW = 100 µs, Duty Cycle 1%)A0.5TransistorV CEOCollector to Emitter Voltage (I C = 1mA, I B = 0)V 70V ECO Emitter to Collector Voltage (I E = 100µA, I B = 0)V 5I C Collector CurrentmA 30∆P C/ºC Power Dissipation Derating mW/ºC 1.5P C Power Dissipation mW 150CoupledBV Isolation Voltage 2V r.m.s.3750T STG Storage Temperature °C -55 to +150T AOperating Ambient°C-55 to +1000.8 mW/ º C100806040200025507510012500501001502001.5mW ºC255075100125246810510152025301010.1元器件交易网COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATUREC o l l e c t o r t o E m i t t e rD a r k C u r r e n t , I CE O (n A )Ambient Temperature, T A (°C)CURRENT TRANSFER RATIO vs. FORWARD CURRENTC u r r e n t T r a n s f e r R a t i o , C T R (%)Forward Current, I F (mA)N o r m a l i z e d O u t p u t C u r r e n t , C T RAmbient Temperature, T A ( °C)NORMALIZED CURRENT TRANSFER RATIOvs. AMBIENT TEMPERATURESWITCHING TIME vs.LOAD RESISTANCES w i t c h i n g T i m e ,t (µs )Load Resistance, R L (Ω) SWITCHING TIME vs.LOAD RESISTANCES w i t c h i n g T i m e ,t (µs )Load Resistance, R L (Ω) FORWARD CURRENT vs. FORWARD VOLTAGEF o r w a r d C u r r e n t , I F (m A )Forward Voltage, V F (V)TYPICAL PERFORMANCE CURVES (T A = 25 °C)PS2701A-110000100010010102550751003002502001501005000.010.11101001.210.80.60.40-75-50-2502550751000.2100.111010010010001000010001001011101001.51.41.31.21.11.00.90.80.7元器件交易网PS2701A-1TYPICAL PERFORMANCE CURVES (T A = 25 °C)Frequency f, (KHz)N o r m a l i z e d G a i n , G vTime, HrC T R , (R e l a t i v e V a l u e )FREQUENCY RESPONSELONG TERM CTR DEGRADATIONOUTLINE DIMENSIONS(Units in mm)A Business Partner of NEC Compound Semiconductor Devices, Ltd.10/13/2003Life Support ApplicationsThese NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.PS2701A-1TOP VIEW1. Anode2. Cathode3. Emitter4. Collector10101010ORDERING INFORMATIONPART NUMBER PACKAGEPACKAGE STYLE PS2701A-1Magazine case 100 pcsPS2701A-1PS2701A-1-F3Embossed Tape 3500 pcs/reel PS2701A-1-F4PS2701A-1-V Magazine case 100 pcsPS2701A-1PS2701A-1-V-F3Embossed Tape 3500 pcs/reelPS2701A-1-V-F4元器件交易网。
123413141516RXIRISGNDBUSL1RIDDSTCVBBUSL2D PACKAGE(TOP VIEW)567101112VSVDDRXTXISCPF89BA TTXTSS721A SLAS222B–APRIL1999–REVISED NOVEMBER2010METER-BUS TRANSCEIVERCheck for Samples:TSS721AFEATURES•Meter-Bus Transceiver(for Slave)MeetsStandard EN1434-3•Receiver Logic With Dynamic LevelRecognition•Adjustable Constant-Current Sink via Resistor•Polarity Independent•Power-Fail Function•Module Supply Voltage Switch• 3.3-V Constant Voltage Source•Remote Powering•Up to9600Baud in Half Duplex for UARTProtocol•Slave Power Support–Supply From Meter-Bus via Output VDD–Supply From Meter-Bus via Output VDD orFrom Backup Battery–Supply From Battery–Meter-Bus Active forData Transmission OnlyDESCRIPTIONTSS721A is a single chip transceiver developed for Meter-Bus standard(EN1434-3)applications.The TSS721A interface circuit adjusts the different potentials between a slave system and the Meter-Bus master.The connection to the bus is polarity independent and supports full galvanic slave isolation with optocouplers.The circuit is supplied by the master via the bus.Therefore,this circuit offers no additional load for the slave battery.A power-fail function is integrated.The receiver has dynamic level recognition,and the transmitter has a programmable current sink.A3.3-V voltage regulator,with power reserve for a delayed switch off at bus fault,is integrated.Table1.ORDERING INFORMATION(1)(2)T A PACKAGE ORDERABLE PART NUMBER 0°C to70°C SOIC–D Reel of2500TSS721ADR(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIweb site at .(2)Package drawings,thermal data,and symbolization are available at /packaging.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©1999–2010,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.BAT RIDDSTCVS VDD VBPF BUSL1 TXGND RIS BUSL2 TXIRX RXI SCTSS721ASLAS222B–APRIL1999–REVISED FUNCTIONAL DESCRIPTIONFigure1.Functional SchematicTable2.Terminal FunctionsTERMINALDESCRIPTIONNAME NO.BUSL21Meter-BusVB2Differential bus voltage after rectifierSTC3Support capacitorRIDD4Current adjustment inputPF5Power fail outputSC6Sampling capacitorTXI7Data output invertedTX8Data outputBAT9Logic level adjustVS10Switch for bus or battery supply outputVDD11Voltage regulator outputRX12Data inputRXI13Data input invertedRIS14Adjust input for modulation currentGND15GroundBUSL116Meter-Bus2Submit Documentation Feedback Copyright©1999–2010,Texas Instruments IncorporatedProduct Folder Link(s):TSS721AVBBUSL1BUSL2V TV V TXV I SC C = 30 pF typ BUSL1-BUSL2V = 25V ,f = 1 MHzB meas I =SCdisharge I SCcharge40 (typ)TSS721ASLAS222B –APRIL 1999–REVISED NOVEMBER 2010Data Transmission,Master to SlaveThe mark level on the bus lines V BUS =MARK is defined by the difference of BUSL1and BUSL2at the slave.It is dependent on the distance of Master to Slave,which affects the voltage drop on the wire.To make the receiver independent,a dynamic reference level on the SC pin is used for the voltage comparator TC3(see Figure 2).Figure 2.Data Transmission,Master to SlaveA capacitor C SC at pin SC is charged by a current I SCcharge and is discharged with a current I SCdischarge where:(1)This ratio is necessary to run any kind of UART protocol independent of the data contents.(for example,if an 11-bit UART protocol is transmitted with all data bits at 0and only the stop bit at 1).There must be sufficient time to recharge the capacitor C SC .The input level detector TC3detects voltage modulations from the master,V BUS =SPACE/MARK conditions,and switches the inverted output TXI and the non-inverted output TX.Copyright ©1999–2010,Texas Instruments Incorporated Submit Documentation Feedback3Product Folder Link(s):TSS721AVBBUSL1GNDBUSL2R RISRISRX RXI V I BUSV RXIV RXI = I + I MC MS CS3I MC )RIS W V =Voltage on pin RIS R = Programming resistor I = Programmable current I = Modulation currentI = Modulation supply current (220 µA typ)RIS RIS CS3MC MS R =RIS=V RIS I CS3V RISI –I MC MSTSS721ASLAS222B –APRIL 1999–REVISED NOVEMBER 2010Data Transmission,Slave to MasterThe device uses current modulation to transmit information from the slave to the master while the bus voltage remains constant.The current source CS3modulates the bus current and the master detects the modulation.The constant current source CS3is controlled by the inverted input RXI or the non-inverted input RX.The current source CS3can be programmed by an external resistor R RIS .The modulation supply current I MS flows in addition to the current source CS3during the modulation time.Figure 3.Data Transmission,Slave to MasterBecause the TSS721A is configured for half-duplex only,the current modulation from RX or RXI is repeated concurrently as ECHO on the outputs TX and TXI.If the slave,as well as the master,is trying to send information via the lines,the added signals appear on the outputs TX and TXI,which indicates the data collision to the slave (see Figure 1).The bus topology requires a constant current consumption by each connected slave.To calculate the value of the programming resistor R RIS ,use the formula shown in Figure 4.Figure 4.Calculate Programming Resistor R RIS4Submit Documentation FeedbackCopyright ©1999–2010,Texas Instruments IncorporatedProduct Folder Link(s):TSS721AR= 25 RID VRIDDISTC= 25VRIDDI+ ISTC_use IC1I(BUS34567(V)STC812TSS721A SLAS222B–APRIL1999–REVISED NOVEMBER2010 Slave Supply,3.3VThe TSS721A has an internal3.3-V voltage regulator.The output power of this voltage regulator is supplied by the storage capacitor C STC at pin STC.The storage capacitor C STC at pin STC is charged with constant current I STC_use from the current source CS1.The maximum capacitor voltage is limited to REF1.The charge current I STC has to be defined by an external resistor at pin RIDD.The adjustment resistor R RIDD can be calculated using Equation2.(2)Where,I STC=current from current source CS1I STC_use=charge current for support capacitorI CI=internal currentV RIDD=voltage on pin RIDDR RIDD=value of adjustment resistorThe voltage level of the storage capacitor C STC is monitored with comparator TC1.Once the voltage V STC reaches V VDD_on,the switch S VDD connects the stabilized voltage V VDD to pin VDD.VDD is turned off if the voltage V STC drops below the V VDD_off level.Voltage variations on the capacitor C STC create bus current changes(see Figure5).Figure5.Single Mode Bus LoadAt a bus fault the shut down time of VDD(t off)in which data storage can be performed depends on the system current I VDD and the value of capacitor C STC.See Figure6,which shows a correlation between the shutdown of the bus voltage V BUS and V DD_off and t off for dimensioning the capacitor.The output VS is meant for slave systems that are driven by the bus energy,as well as from a battery should the bus line voltage fail.The switching of VS is synchronized with VDD and is controlled by the comparator TC1.An external transistor at the output VS allows switching from the Meter-Bus remote supply to battery.Copyright©1999–2010,Texas Instruments Incorporated Submit Documentation Feedback5Product Folder Link(s):TSS721AV V V V V V STCVDDoffoff STC VDD CI1V –V t =C I +I TSS721ASLAS222B –APRIL 1999–REVISED NOVEMBER 2010Power On/OffFigure 6.Power On/Off TimingPower Fail FunctionBecause of the rectifier bridge BR at the input,BUSL1,and BUSL2,the TSS721A is polarity independent.The pin VB to ground (GND)delivers the bus voltage V VB less the voltage drop over the rectifier BR.The voltage comparator TC2monitors the bus voltage.If the voltage V VB >V STC +0.6V,then the output PF =1.The output level PF =0(power fail)provides a warning of a critical voltage drop to the microcontroller to save the data immediately.6Submit Documentation FeedbackCopyright ©1999–2010,Texas Instruments IncorporatedProduct Folder Link(s):TSS721ATSS721A SLAS222B–APRIL1999–REVISED NOVEMBER2010ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range(unless otherwise noted)V MB Voltage,BUSL1to BUSL2±50VRX and RXI–0.3V to5.5VV I Input voltage rangeBAT–0.3V to5.5VT J Operating junction temperature range–25°C to150°CT A Operating free-air temperature range–25°C to85°CT STG Storage temperature range–65°C to150°C Power derating factor,junction to ambient8mW/°C RECOMMENDED OPERATING CONDITIONS(1)MIN MAX UNITReceiver10.842V MB Bus voltage,|BUSL2–BUSL1|VTransmitter1242VB(receive mode)9.3V I Input voltage VBAT(2) 2.5 3.8R RIDD RIDD resistor1380kΩR RIS RIS resistor100ΩT A Operating free-air temperature–2585°C(1)All voltage values are measured with respect to the GND terminal unless otherwise noted.(2)V BAT(max)≤V STC–1VELECTRICAL CHARACTERISTICS(1)over operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ΔV BR Voltage drop at rectifier BR I BUS=3mA 1.5VVoltage drop at currentΔV CS1R RIDD=13kΩ 1.8V source CS1R RIDD=13kΩ3V STC=6.5V,I BUS BUS current mAI MC=0mA R=30kΩ 1.5RIDDΔI BUS BUS current accuracyΔV BUS=10V,I MC=0mA,R RIDD=13kΩto30kΩ2%I CC Supply current V STC=6.5V,I MC=0mA,V BAT=3.8V,R RIDD=13kΩ(2)650µAV STC=6.5V,I MC=0mA,V BAT=3.8V,R RIDD=13kΩ,I CI1CI1current350µAV BUS=6.5V,RX/RXI=off(2)I BAT BAT current–0.50.5µAI BAT+I VDD BAT plus VDD current V BUS=0V,V STC=0V–0.50.5µAV VDD VDD voltage–I VDD=1mA,V STC=6.5V 3.1 3.4VR VDD VDD resistance–I VDD=2to8mA,V STC=4.5V5ΩV DD=on,VS=on 5.6 6.4V STC STC voltage V DD=off,VS=off 3.8 4.3VI VDD<I STC_use 6.57.5R RIDD=30kΩ0.65 1.1I STC_use STC current V STC=5V mAR RIDD=13kΩ 1.85 2.4V RIDD RIDD voltage R RIDD=30kΩ 1.23 1.33VV VS VS voltage V DD=on,I VS=–5µA V STC–0.4V STC VR VS VS resistance V DD=off0.31MΩV VB=V STC+0.8V,I PF=–100µA V BAT–0.6V BATV PF PF voltage V STC=6.5V V VB=V STC+0.3V,I PF=1µA00.6VV VB=V STC+0.3V,I PF=5µA00.9(1)All voltage values are measured with respect to the GND terminal,unless otherwise noted.(2)Inputs RX/RXI and outputs TX/TXI are open,I CC=I CI1+I CI2Copyright©1999–2010,Texas Instruments Incorporated Submit Documentation Feedback7Product Folder Link(s):TSS721ATSS721ASLAS222B–APRIL1999–REVISED ELECTRICAL CHARACTERISTICS(1)(continued)over operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT t on Turn-on time C STC=50µF,Bus voltage slew rate:1V/µs3sRECEIVER SECTION ELECTRICAL CHARACTERISTICS(1)over operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITMARK MARK–V T See Figure2V–8.2 5.7V SC SC voltage V VB VI SCcharge SC charge current V SC=24V,V VB=36V–15–40µA–0.033×I SCdischarge SC discharge current V SC=V VB=24V0.3µAI SCchargeHigh-level output voltage V BAT–V OH I TX/I TXI=–100µA(see Figure2)V BAT V (TX,TXI)0.6I TX/I TXI=100µA00.5Low-level output voltageV OL V (TX,TXI)I=1.1mA0 1.5TXI TXTX,TXI current V TX=7.5,V VB=12V,V STC=6V,V BAT=3.8V10µAI TXI(1)All voltage values are measured with respect to the GND terminal,unless otherwise noted.TRANSMITTER SECTION ELECTRICAL CHARACTERISTICS(1)over operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I MC MC voltage R RIS=100Ω11.519.5mAR RIS=100Ω 1.4 1.7V RIS RIS voltage VR RIS=1000Ω 1.5 1.8V BAT–V IH High-level input voltage(RX,RXI)See Figure3,see(2) 5.5V0.8V IL Low-level input voltage(RX,RXI)See Figure300.8VV RX=V BAT=3V,V VB=V STC=0V-0.50.5I RX RX currentµAV RX=0V,V BAT=3V,V STC=6.5V-10-40V RXI=V BAT=3V,V VB=V STC=0V1040I RXI RXI currentµAV RXI=V BAT=3V,V STC=6.5V1040(1)All voltage values are measured with respect to the GND terminal,unless otherwise noted.(2)V IH(max)=5.5V is valid only when V STC>=6.5V.8Submit Documentation Feedback Copyright©1999–2010,Texas Instruments IncorporatedProduct Folder Link(s):TSS721AMeter-BusC - system stabilising capacitor C - support capacitor C - sampling capacitorC - stabilising capacitor (100 nF)C :C >= 4:1SSC STC SC VDD STC VDD R - slave-current adjustment resistor R - modulation-current resistor RL1,RL2 - protection resistorsR - discharge resistor (100 k recommended)RIDD RIS load W TSS721ASLAS222B –APRIL 1999–REVISED NOVEMBER 2010APPLICATION INFORMATIONNOTE:Transistor T1should be a BSS84.Figure 7.Basic Application Circuit Using Support Capacitor C STC >50µFFigure 8.Basic Application Circuit for Supply From BatteryCopyright ©1999–2010,Texas Instruments Incorporated Submit Documentation Feedback9Product Folder Link(s):TSS721ATSS721ASLAS222B–APRIL1999–REVISED Meter-Bus NOTE:R DSon of the transistor T1(BSS84)at low battery voltage must be considered during application design.Figure9.Basic Applications for Different Supply ModesFigure10.Basic Optocoupler Application10Submit Documentation Feedback Copyright©1999–2010,Texas Instruments IncorporatedProduct Folder Link(s):TSS721A18-Dec-2015 PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. 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1. General DescriptionThis EPROM-Based 8-bit micro-controller uses a fully static CMOS technology process to achieve higher speed and smaller size with the low power consumption and high noise immunity. On chip memory includes 4K words of ROM, and 192 bytes of static RAM.2. FeaturesThe followings are some of the features on thehardware and software:Fully CMOS static design8-bit data busOn chip EPROM size: 4.0 K wordsInternal RAM size: 192 bytes37 single word instructions14-bit instructions8-level stacksOperating voltage: 2.5 V ~ 5.5 V (PRD Disable)4.5 V ~5.5 V (PRD Enable)Operating frequency: DC ~ 20 MHzThe most fast execution time is 200 ns under 20 MHz in all single cycle instructions except thebranch instructionAddressing modes include direct, indirect and relative addressing modesPower-on ResetPower edge-detector ResetPower range-detector ResetSleep Mode for power savingCapture, Compare, PWM module7 interrupt sources:-External INT pin-TMR0 timer, TMR1 timer, TMR2 timer-A/D conversion completion-Port B<7:4> interrupt on change-CCP1A/D converter module:-8 analog inputs multiplexed into one A/Dconverter-10-bit resolutionTMR0: 8-bit real time clock/counterTMR1: 16-bit real time clock/countTMR2: 8-bit clock/counter (internal)5 types of oscillator can be selected byprogramming option:RC-Low cost RC oscillatorLFXT-Low frequency crystal oscillatorXTAL-Standard crystal oscillatorHFXT-High frequency crystal oscillatorIRC-Internal 8MHz RC oscillatorOn-chip RC oscillator based Watchdog Timer(WDT)18/20 I/O pins with their own independent direction control3. ApplicationsThe application areas of this MDT10P7212 range from appliance motor control and high speed auto-motive to low power remote transmitters/receivers, pointing devices, and telecommunications processors, such as Remote controller, small instruments, chargers, toy, automobile and PC peripheral … etc.4. Pin AssignmentPE2/AIC7 1 24 PE1/AIC6PA0/AIC0 2 23 PE0/AIC5PA1/AIC1 3 22 PC2/CCP1 PA2/AIC2 4 21 PC1/T1OSC1 PA3/AIC3 5 20 PC0/T1OSC2 PA5/AIC4 6 19 PC4 PA4/T0CKI/VPP 7 18 PC3 VSS 8 17 VDD PB0 9 16 PB7 PB1 10 15 PB6 PB2 11 14 PB5PB3 12 13 PB4PE2/AIC7 1 24 PE1/AIC6PA0/AIC0 2 23 PE0/AIC5PA1/AIC1 3 22 PC2/CCP1 PA2/AIC2 4 21 PC1/T1OSC1 PA3/AIC3 5 20 PC0/T1OSC2 PA5/AIC4 6 19 OSC1 PA4/T0CKI/VPP 7 18 OSC2 VSS 8 17 VDD PB09 16 PB7 PB110 15 PB6 PB211 14 PB5PB312 13 PB4MDT10P7212K11 (SKINNY) MDT10P7212K12 (SKINNY) MDT10P7212S11 (SOP) MDT10P7212S12 (SOP)5. Order informationDevice ROM (words)RAM(bytes)I/OA/D (10 bits)Timer (8/16) CCP INRC (8Mhz)PackageMDT10P7212K11 4K 192 22 8-channel 2/1 1 Yes SKINNY MDT10P7212S11 4K 192 22 8-channel 2/1 1 Yes SOP MDT10P7212K12 4K 192 20 8-channel 2/1 1 No SKINNY MDT10P7212S12 4K 192 20 8-channel2/11NoSOP6. Pin Function DescriptionPin Name I/O Function DescriptionPA0~PA3, PA5I/OPort A, TTL input level Analog input channelPA4/T0CKI/VPPI/OReal Time Clock/Counter, Schmitt Trigger input levels Open drain output, Vpp input when programmingPB0~PB7I/OPort B, TTL input level/PB0: External interrupt input, PB4~PB7: Interrupt on pin changePC0~PC2 I/O Port C, Schmitt Trigger input levels OSC1/PC4I, I/OOscillator Input/external clock input PC4 in IRC modePin Name I/O Function DescriptionOSC2/PC3 O, I/O Oscillator Output/in RC mode, the CLKOUT pin has 1/4 frequencyof CLKINPC3 in IRC modePE0~PE2 I/O Port E, Schmitt Trigger input levelsAnalog input channelPowersupplyVDDGroundVSS7. Memory Map(A) Register MapAddress DescriptionBANK000 Indirect Addressing Register01 RTCC02 PCL03 STATUS04 MSRA05 PortB06 PortC07 PortE09 Port0A PCHLAT0B INTS0C PIFB10E TMR1L0F TMR1H10 T1STA11 TMR212 T2STA15 CCP1L16 CCP1HAddress Description17 CCP1CTL1E ADRESH, The ADRESH register is not a writable register.1F ADS020~7F General purpose registerBANK101 TMRA05 CPIOB06 CPIOC07 CPIOE09 CPIO0C PIEB10D PIEB20E PSTA12 T2PER1E ADRESL, The ADRESL register is not a writable register.1F ADS1A0~FF General purpose register(1) IAR (Indirect Address Register): R00(2) RTCC (Real Time Counter/Counter Register): R01(3) PC (Program Counter): R02, R0A(4) STATUS (Status register): R03Bit Symbol Functionbit0 C Carry1 HC Half Carry bitbit2 Z Zero3 /PF Power down Flag bit4 /TF WDT Timer overflow Flag bit5 RBS0 Register Bank Select bit0: 00h~7Fh (Bank0)1: 80h~FFh (Bank1)7-6 -- General purpose bit(5) MSR (Memory Bank Select Register): R04(6) PORT A: R05PA5~PA0, I/O Register(7) PORT B: R06PB7~PB0, I/O Register(8) PORT C: R07PC4~PC0, I/O Register(9) PORT E: R09PE2~PE0, I/O Register(10) PCHLAT: R0A(11) INTS (Interrupt Status Register): R0BBit Symbol Function0 RBIF PORT B change interrupt flag, Set when PB <7:4> inputs change1 INTF Set when INT interrupt occurs2 TIF Set when TMR0 overflowsBit Symbol Function3 RBIE 0: Disable PB change interrupt1: Enable PB change interrupt4 INTS 0: Disable INT interrupt1: Enable INT interrupt5 TIS 0: Disable TMR0 interrupt1: Enable TMR0 interrupt6 PEIE 0: Disable all peripheral interrupt1: Enable all peripheral interrupt7 GIS 0: Disable global interrupt1: Enable global interrupt(12) PIFB1 (Peripheral Interrupt Flag Bit): R0CBit Symbol Function0 TMR1IF TMR1 interrupt flag0: TMR1 did not overflow1: TMR1 overflowed1 TMR2IF TMR2 interrupt flag0: No TMR2 to T2PER match occurred1: TMR2 to T2PER match occurred2 CCP1IF CCP1 interrupt flag0: No TMR1 capture/compare occurred1: A TMR1 capture/compare occurred 5~3 -- Unimplemented, read as ‘0’6 ADIF A/D interrupt flag0: A/D conversion is not complete1: A/D conversion completed7 -- Unimplemented, read as ‘0’(13) TMR1L: R0EThe LSB of the 16-bit TMR1(14) TMR1H: R0FThe MSB of the 16-bit TMR1(15) T1STA: R10Bit Symbol FunctionTMR1ON0: Stop TMR1 1: Enable TMR11TMR1CLK 0: Internal clock (Fosc/4)1: External clock from pin PC02/T1SYNCTMR1CLK = 10: Synchronize external clock 1: Do not synchronize external clock TMR1CLK = 0 This bit is ignored3T1OSCEN 0: TMR1 Oscillator is shut off1: TMR1 Oscillator is enable5~4 T1CKPS1 ~T1CKPS0 1 1 = 1:8 Prescale value1 0 = 1:4 Prescale value0 1 = 1:2 Prescale value0 0 = 1:1 Prescale value7~6 --Unimplemented, read as ‘0’(16) TMR2: R11 TMR2 register(17) T2STA: R12Bit SymbolFunction1~0 T2CKPS1 ~T2CKPS0 0 0 = Prescaler is 10 1 = Prescaler is 41 x = Prescaler is 162TMR2ON0: TMR2 is off 1: TMR2 is on7~3 --Unimplemented, read as ‘0’(18) CCP1L: R15Capture/Compare/PWM LSB(19) CCP1H: R16Capture/Compare/PWM MSB(20) CCP1CTL: R17 Bit SymbolFunction3~0 CCP1M3 ~ CCP1M00 0 0 0: CCP1 off0 1 0 0: Capture1 mode, every falling edge 0 1 0 1: Capture1 mode, every rising edge 0 1 1 0: Capture1 mode, every 4th rising edge 0 1 1 1: Capture1 mode, every 16th rising edge 1 0 0 0: Compare1 mode, set output on match 1 0 0 1: Compare1 mode, clear output on match1 0 1 0: Compare1 mode, generate software interrupt on match 1 0 1 1: Compare1 mode, trigger special event 1 1 x x: PWM1 mode5~4 PWM1LSB These bits are the two LSBs of the PWM1 duty cycle7~6 --Unimplemented, read as ‘0’(21) ADRESH: R1EA/D result register high byte, The ADRESH register is not a writable register.(22) ADS0 ( A/D Status Register ): R1F Bit Symbol FunctionADRUN0: A/D converter module is shut off and consumes no operating current 1: A/D converter module is operating1 -- Unimplemented, read as ‘0’2GO/DONEB 0: A/D conversion not in progress1: A/D conversion in progress5~3 CHS2~0 000: AIC0 001: AIC1 010: AIC2 011: AIC3 100: AIC4 101: AIC5 110: AIC6 111: AIC77~6 ASCS1~0 00: fosc/2 01: fosc/8 10: fosc/32 11: f RC (*Note)*Note: determined by OSC mode, HF: fosc/32, XT: fosc/8, RC: fosc/2, LF: fosc/2(23) TMR (Time Mode Register): R81Bit Symbol FunctionPrescaler Value RTCC rate WDT rate2~0 PS2~0 0 0 00 0 10 1 00 1 11 0 01 0 11 1 01 1 11 : 21 : 41 : 81 : 161 : 321 : 641 : 1281 : 2561 : 11 : 21 : 41 : 81 : 161 : 321 : 641 : 1283 PSC Prescaler assignment bit 0: RTCC1: Watchdog Timer4 TCE RTCC signal edge0: Increment on low-to-high transition on RTCC pin 1: Increment on high-to-low transition on RTCC pin5 TCS RTCC signal set0: Internal instruction cycle clock 1: Transition on RTCC pin6 IES Interrupt edge select0: Interrupt on falling edge on PB0 1: Interrupt on rising edge on PB07 PBPH PORTB7~0 pull-hi0: PORTB7~0 pull-hi are enable 1: PORTB7~0 pull-hi are disable(24) CPIO A (Control Port I/O Mode Register): R85 =“0”, I/O pin in output mode=“1”, I/O pin in input mode(25) CPIO B (Control Port I/O Mode Register): R86 =“0”, I/O pin in output mode=“1”, I/O pin in input mode(26) CPIO C (Control Port I/O Mode Register): R87 =“0”, I/O pin in output mode=“1”, I/O pin in input mode(27) PIEB1: R8CBit Symbol Function0 TMR1IE TMR1 interrupt enable bit0: Disable TMR1 interrupt1: Enable TMR1 interrupt1 TMR2IE TMR2 interrupt enable bit0: Disable TMR2 interrupt1: Enable TMR2 interrupt2 CCP1IE CCP1 interrupt enable bit0: Disable CCP1 interrupt1: Enable CCP1 interrupt5~3 -- Unimplemented, read as ‘0’6 ADIE A/D interrupt enable bit0: Disable A/D interrupt1: Enable A/D interrupt7 -- Unimplemented, read as ‘0’(28) PSTA: R8EBit Symbol Function0 PRDB 0: Power range-detector Reset occurred1: No Power range-detector Reset Occurred1 PORB 0: Power on Reset occurred1: No Power on Reset occurred7~2 -- Unimplemented, read as ‘0’(29) T2PER: R92Timer2 period(30) ADRESL: R9EA/D result register low byte, The ADRESL register is not a writable register.(31) ADS1 ( A/D Status Register ): R9FBit Symbol Function2~0 PAVM2~0 0 0 0: PA0~3, PA5, PE0~2 = analog input, VREF = VDD0 0 1: PA0~2, PA5, PE0~2 = analog input, VREF = PA30 1 0: PA0~3, PA5 = analog input, PE0~2 = digital I/O, VREF = VDD0 1 1: PA0~2, PA5 = analog input, PE0~2 = digital I/O, VREF = PA31 0 0: PA0, 1, 3 = analog input, PA2, 5, PE0~2 = digital I/O, VREF = VDD 1 0 1: PA0, 1 = analog input, PA2, 5, PE0~2 = digital I/O, VREF = PA31 1 x: PA0~3, 5, PE0~2 = digital I/O6~3 -- Unimplemented, read as ‘0’Bit Symbol Function7 ADFM A/D result format select0: Left justified, bit 5~0 of ADRESL are read as “0”1: Right justified, bit 7~2 of ADRESH are read as “0”(32) Configurable options for EPROM (Set by writer)Oscillator TypeRC OscillatorHFXT OscillatorXTAL OscillatorLFXT OscillatorWatchdog Timer controlWatchdog timer disable all the timeWatchdog timer enable all the timePower-range controlPower-range disablePower-range enableOscillator-start Timer control0ms75msPower-edge Detect Security statePED Disable Security DisablePED Enable Security Enable(B) Program MemoryAddress Descriptionmemory000-FFF Program000 The starting address of power on, external reset or WDT time-out resetvector004 Interrupt8. Reset Condition for all RegistersReset,Register Address Power-OnWDT Reset Wake-up from SLEEPPower range detectorResetIAR 00h N/A N/A N/A RTCC 01h xxxx xxxx uuuu uuuu uuuu uuuuPC 0Ah,02h 0000 0000 0000 0000 0000 0000 PC+1STATUS 03h 0001 1xxx 000# #uuu 000# #uuuMSR 04h xxxx xxxx uuuu uuuu uuuu uuuuPORT A 05h --xx xxxx --uu uuuu --uu uuuuPORT B 06h xxxx xxxx uuuu uuuu uuuu uuuuPORT C 07h xxxx xxxx uuuu uuuu uuuu uuuu PCHLAT 0Ah ---0 0000 ---0 0000 ---u uuuuINTS 0Bh 0000 000x 0000 000u uuuu uuuuPIFB1 0Ch -000 0000 -000 0000 -uuu uuuuTMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuuTMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuuT1STA 10h --00 0000 --uu uuuu --uu uuuuTMR2 11h 0000 0000 0000 0000 uuuu uuuuT2STA 12h ---- -000 ---- -uuu ---- -uuuCCP1L 15h xxxx xxxx uuuu uuuu uuuu uuuuCCP1H 16h xxxx xxxx uuuu uuuu uuuu uuuuCCP1CTL 17h --00 0000 --00 0000 --uu uuuuADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuuADS0 1Fh 0000 00-0 0000 00-0 uuuu uu-uTMR 81h 1111 1111 1111 1111 uuuu uuuuCPIOA 85h --11 1111 --11 1111 --uu uuuuCPIOB 86h 1111 1111 1111 1111 uuuu uuuuCPIOC 87h 1111 1111 1111 1111 uuuu uuuuPIEB1 8Ch -000 0000 -000 0000 -uuu uuuuPSTA 8Eh ---- --0u ---- --uu ---- --uuT2PER 92h 1111 1111 1111 1111 1111 1111ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuuADS1 9Fh 0--- -000 0--- -000 u--- -uuuNote : u=unchanged, x=unknown, - =unimplemented, read as “0”#=value depends on the condition of the following tableCondition Status: bit 4 Status: bit 3 PSTA: bit 1 PSTA: bit 0 WDT reset (not during SLEEP) 0 1 u uWDT reset during SLEEP 0 0 u uPower-onreset 1 1 0 x Power-rangereset 1 1 u 0 Note : u=unchanged, x=unknown, - =unimplemented, read as “0”9. Instruction SetInstruction Code MnemonicOperands Function OperatingStatus010000 00000000 NOP No operation None010000 00000001 CLRWT Clear Watchdog timer 0→WT TF, PF 010000 00000010 SLEEP Sleep mode 0→WT, stop OSC TF, PF 010000 00000011 TMODE Load W to TMODE register W→TMODE None 010000 00000100 RET Return from subroutine Stack→PC None 010000 00000rrr CPIO R Control I/O port register W→CPIO r None 010001 1rrrrrrr STWR R Store W to register W→R None 011000 trrrrrrr LDR R, t Load register R→t Z 111010 iiiiiiii LDWI I Load immediate to W I→W None 010111 trrrrrrr SWAPR R, t Swap halves register [R(0~3) ↔R(4~7)]→t None 011001 trrrrrrr INCR R, t Increment register R + 1→t Z 011010 trrrrrrr INCRSZ R, t Increment register, skip if zero R + 1→t None 011011 trrrrrrr ADDWR R, t Add W and register W + R→t C, HC, Z011100 trrrrrrr SUBWR R, t Subtract W from register R ﹣W→t or (R+/W+1→t)C, HC, Z 011101 trrrrrrr DECR R, t Decrement register R ﹣1→t Z 011110 trrrrrrr DECRSZ R, t Decrement register, skip if zero R ﹣1→t None 010010 trrrrrrr ANDWR R, t AND W and register R ∩W→t Z 110100 iiiiiiii ANDWI i AND W and immediate i ∩W→W Z 010011 trrrrrrr IORWR R, t Inclu. OR W and register R ∪W→t Z 110101 iiiiiiii IORWI i Inclu. OR W and immediate i ∪W→W Z 010100 trrrrrrr XORWR R, t Exclu. OR W and register R ♁W→t Z 110110 iiiiiiii XORWI i Exclu. OR W and immediate i ♁W→W Z 011111 trrrrrrr COMR R, t Complement register /R→t Z 010110 trrrrrrr RRR R, t Rotate right register R(n) →R(n-1),C→R(7), R(0)→CCInstruction Code MnemonicOperands Function OperatingStatus010101 trrrrrrr RLR R, t Rotate left register R(n)→r(n+1),C→R(0), R(7)→CC 010000 1xxxxxxx CLRW Clear working register 0→W Z 010001 0rrrrrrr CLRR R Clear register 0→R Z 0000bb brrrrrrr BCR R, b Bit clear 0→R(b) None 0010bb brrrrrrr BSR R, b Bit set 1→R(b) None 0001bb brrrrrrr BTSC R, b Bit Test, skip if clear Skip if R(b)=0 None 0011bb brrrrrrr BTSS R, b Bit Test, skip if set Skip if R(b)=1 None 100nnn nnnnnnnn LCALL n Long CALL subroutine n→PC, PC+1→Stack None 101nnn nnnnnnnn LJUMP n Long JUMP to address n→PC None 110111 iiiiiiii ADDWI i Add immediate to W W+i→W C,HC,Z 110001 iiiiiiii RTWI i Return, place immediate to W Stack→PC,i→W None 111000 iiiiiiii SUBWI i Subtract W from immediate i-W→W C,HC,Z 010000 00001001 RTFI Reture from interrupt Stack→PC,1→GIS None Note :W : Working register b : Bit positionWT :Watchdogtimer t:TargetTMODE : TMODE mode register 0 : Working registerCPIO : Control I/O port register 1 : General registerTF : Timer overflow flag R : General register addressPF : Power loss flag C : Carry flagPC : Program Counter HC : Half carryOSC :Oscillator Z:ZeroflagInclu. : Inclusive ‘∪’ / : ComplementExclu. : Exclusive ‘♁’ x:Don’tcare AND : Logic AND ‘∩’ i : Immediate data ( 8 bits )n:Immediateaddress。
TSS721A技术资料总结一,芯片简介TSS721A是一种用于仪表总线的收发器集成芯片,其内含的接口电路可以调节仪表总线结构中主从机的电平,可通过光耦等隔离器件与总线连接,通过数据收发器由总线供电。
芯片封装采用DIP16封装,将整个数据发送功能集成于一体,内部功能框图如图1所示,管脚功能介绍如下:图11,满足国际EN1434-3标准2,具有动态电平识别的接收电流3,通过限流电阻可调接收电流4,无极性连接5,放掉电功能6,可提供3.3.V稳压源7,支持远程供电,从机可由总线或电池供电8,半双工下可达9600 Baud rate9,支持UART协议,只在数据传输时总线有效二,管脚功能三,数据传输模式MBUS传输原理1,主——>从此模式下采用电压调制传输数据,总线电流保持不变。
即主机发送的数据码流是一种电压脉冲序列,用+36V标识逻辑‘1’,用+24V标识逻辑‘0’。
在稳态时,线路将保持‘1’状态。
如图2所示:图2总线电压Vbus=MARK(标识值)是由从机BUSL1和BUSL2间压差定义的,连接在管脚SC上的电容Csc的充放电流是不同的,存在以下关系:I SCcharge =ISCdischarge/40这个比例关系是独立于数据内容运行任意UART协议所必须的条件(例如传输采用11位UART协议,当所有数据只有停止位是1.其他都是0),必须有足够的时间对电容Csc进行再充电,内部电压比较器TC3检测来自主机的调制电压,并根据电压VBUS=SPACE(空值)或MARK(标识值)来开关正端输出TX和反向端输出TXI,输出数据给从机。
2,从——>主在此模式下使用总线电流调制传输据,总线电压保持不变,即从机发送的数据码流是一种电流脉冲序列,通常用1.5mA表示逻辑‘1’,当传输‘0’时,由从机控制使电流值增加到11~20mA。
在稳态时,线路值持续‘1’状态,当从机接收信号时,其电流应处于稳态‘1’,在接收信号时,其电压值的变化所导致的电流变化不应超过0.2%/V。
DATA SHEETThe information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.©1998, 1999Document No. P13927EJ4V0DS00 (4th edition)Date Published October 1999 NS CP(K)Printed in JapanThe mark • shows major revised points.DESCRIPTIONThe PS7212-1A is a solid state relay containing GaAs LEDs on the light emitting side (input side) and normally open (N.O.) contact MOS FETs on the output side.It is suitable for analog signal control because of its low offset and high linearity.FEATURES•Small and thin package (4-pin SOP, Height = 2.1 mm)• 1 channel type (1 a output)•Low LED operating current (I F = 2 mA)•Designed for AC/DC switching line changer •Low offset voltage•Ordering number of taping product: PS7212-1A-E3, E4, F3, F4APPLICATIONS•Laptop PC, PDA •Modem card •Telephone, FAX •Measurement equipment2Data Sheet P13927EJ4V0DS00ORDERING INFORMATIONPart Number Package Packing Style Application Part Number*1PS7212-1A4-pin SOP Magazine case 100 pcs PS7212-1APS7212-1A -E3Embossed Tape 900 pcs/reelPS7212-1A -E4PS7212-1A -F3Embossed Tape 3 500 pcs/reelPS7212-1A -F4*1 For the application of the Safety Standard, following part number should be used.ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise specified)Parameter Symbol Ratings UnitDiode Forward Current (DC)I F50mAReverse Voltage V R 5.0VPower Dissipation P D50mWPeak Forward Current *1I FP1AMOS FET Break Down Voltage V L100VContinuous Load Current I L200mAPulse Load Current*2I LP400mA(AC/DC Connection)Power Dissipation P D300mWIsolation Voltage *3BV 1 500Vr.m.s.Total Power Dissipation P T350mWOperating Ambient Temperature T A−40 to +80°CStorage Temperature T stg−40 to +100°C*1PW = 100 µs, Duty Cycle = 1 %*2PW = 100 ms, 1 shot*3AC voltage for 1 minute at T A = 25 °C, RH = 60 % between input and outputData Sheet P13927EJ4V0DS003Data Sheet P13927EJ4V0DS004RECOMMENDED OPERATING CONDITIONS (T A = 25 °C)ParameterSymbol MIN.TYP.MAX.Unit LED Operating Current I F 21020mA LED Off VoltageV F0.5VELECTRICAL CHARACTERISTICS (T A = 25 °C)ParameterSymbol ConditionsMIN.TYP.MAX.Unit DiodeForward Voltage V F I F = 10 mA 1.21.4VReverse CurrentI R V R = 5 V 5.0µA MOS FETOff-state Leakage Current I Loff V D = 100 V 0.03 1.0µA Output CapacitanceC out VD = 0 V, f = 1 MHz 57pFCoupledLED On-state Current I Fon I L = 200 mA2.0mA On-state ResistanceR on1I F = 10 mA, I L = 10 mA3.06.0ΩR on2I F = 10 mA, I L = 200 mA, t ≤ 10 ms Turn-on Time*1t on I F = 10 mA, V O = 5 V, PW ≥ 10 ms0.35 1.0msTurn-off Time*1t off 0.080.2Isolation Resistance R I-O V I-O = 1.0 kV DC 109ΩIsolation CapacitanceC I-OV = 0 V, f = 1 MHz0.5pF*1Test Circuit for Switching TimeV LI FPulse InputInput monitormonitorV OData Sheet P13927EJ4V0DS005TYPICAL CHARACTERISTICS (T A = 25 °C, unless otherwise specified)–250255075100100806040020Ambient Temperature T A (˚C)M a x i m u m F o r w a r d C u r r e n t I F (m A )MAXIMUM FORWARD CURRENT vs.AMBIENT TEMPERATUREAmbient Temperature T A (˚C)F o r w a r d V o l t a g e V F (V )AMBIENT TEMPERATUREFORWARD VOLTAGE vs.Ambient Temperature T A (˚C)M a x i m u m L o a d C u r r e n t I L (m A )MAXIMUM LOAD CURRENT vs.AMBIENT TEMPERATUREf = 1 MHz204060801201001251007550025Applied Voltage V D (V)O u t p u t C a p a c i t a n c e C o u t (p F )OUTPUT CAPACITANCE vs.APPLIED VOLTAGE–25025*******150250300200501000LOAD CURRENT vs. LOAD VOLTAGELoad Voltage V L (V)L o a d C u r r e n t I L (m A )Applied Voltage VD (V)O f f -s t a t e L e a k a g e C u r r e n t I L o f f(A )OFF-STATE LEAKAGE CURRENT vs.APPLIED VOLTAGE10101010101010Data Sheet P13927EJ4V0DS006515203025100.50.40.30.20.10TURN-OFF TIME vs. FORWARD CURRENTForward Current I F (mA)T u r n -o f f T i m e t o f f(m s )Turn-off Time t off (ms)N u m b e r (p c s )TURN-OFF TIME DISTRIBUTION515202510302.52.01.51.00.50TURN-ON TIME vs. FORWARD CURRENTForward Current I F (mA)T u r n -o n T i m e t o n (m s )Turn-on Time t on (ms)N u m b e r (p c s )TURN-ON TIME DISTRIBUTIONNormalized to 1.0 at T A = 25 ˚C,I F = 10 mA, I L = 10 mA–25025********.02.52.01.00.00.51.5Ambient Temperature T A (˚C)N o r m a l i z e d O n -s t a t e R e s i s t a n c e R o nNORMALIZED ON-STATE RESISTANCE vs.AMBIENT TEMPERATUREON-STATE RESISTANCE DISTRIBUTIONN u m b e r (p c s )On-state Resistance R on (Ω)V O = 5 VV O = 5 V0.080.100.06Data Sheet P13927EJ4V0DS007Normalized to 1.0 at T A = 25 ˚C,I F = 10 mA, V O = 5 VNormalized to 1.0 at T A = 25 ˚C,I F = 10 mA, V O = 5 V–25025********.02.52.01.00.00.51.5Ambient Temperature T A (˚C)N o r m a l i z e d T u r n -o n T i m e t o nNORMALIZED TURN-ON TIME vs.AMBIENT TEMPERATURE–25025*******3.02.52.01.00.00.51.5Ambient Temperature T A (˚C)N o r m a l i z e d T u r n -o f f T i m e t o f fNORMALIZED TURN-OFF TIME vs.AMBIENT TEMPERATURERemark The graphs indicate nominal characteristics.TAPING SPECIFICATIONS (in millimeters)8Data Sheet P13927EJ4V0DS00Data Sheet P13927EJ4V0DS009Data Sheet P13927EJ4V0DS0010RECOMMENDED SOLDERING CONDITIONS(1) Infrared reflow soldering •Peak reflow temperature235 °C (package surface temperature)•Time of temperature higher than 210 °C 30 seconds or less •Number of reflows Two•FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)P a c k a g e S u r f a c e T e m p e r a t u r e T (˚C )Time (s)Recommended Temperature Profile of Infrared Reflow(2) Dip soldering •Temperature 260 °C or below (molten solder temperature)•Time10 seconds or less •Number of times One•FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)(3) Cautions •FluxesAvoid removing the residual flux with freon-based and chlorine-based cleaning solvent.[MEMO]Data Sheet P13927EJ4V0DS0011CAUTIONWithin this device there exists GaAs (Gallium Arsenide) material which is aharmful substance if ingested. 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Customers must check the quality grade of each devicebefore using it in a particular application.Standard: Computers, office equipment, communications equipment, test and measurement equipment,audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robotsSpecial: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disastersystems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support)Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, lifesupport systems or medical equipment for life support, etc.The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.M7 98. 8。