RAMCloud Slides (Oct)

UC-8580SeriesArm Cortex-A7dual-core1GHz train-to-ground computers with4Mini PCIe expansion slots for wireless modulesFeatures and Benefits•Complies with all EN50155mandatory test items1•Supports up to3WWAN connections and2SIM card slots per cellularmodule•Supports1WLAN(IEEE802.11a/b/g/n/ac)connection•Single-panel I/O design for reduced installation space and easiermaintenance•Front-side access panel for easy maintenance•Isolated24to110VDC power input with power-ignition function suitable forvehicle applications•EN50155Tx(-40to70°C)operating temperature for harsh environments•5-year warrantyCertificationsIntroductionMoxa’s UC-8580is an innovative computing platform designed specifically for transportation applications.The UC-8580is available with one of two different types of antenna connectors.The SMA model supports all SMA type connectors.The QMA model supports TNC connectors for GPS and QMA connectors for Wi-Fi/cellular modules,and has four slots for installing wireless modules.2Three slots support4G LTE modules,and one slot supports a Wi-Fi module.Each4G LTE module has two SIM card slots,which can be used to enable redundant cellular network communications or geo-fencing SIM card selection by leveraging the built-in Wireless Manager,a Moxa software utility for cellular and Wi-Fi management.The UC-8580uses an open platform based on Debian8with Linux kernel4.1,allowing solution providers to manage software packages via Debian’s APT(Advanced Packaging Tools),or develop software applications with Moxa’s API Library and GNU C Library.The UC-8580’s single-sided I/O design is ideal for vehicle applications,which typically do not have a lot of room for installing communications devices.The UC-8580also has an access panel on the front side,allowing users to install or change wireless modules,SIM cards,or mSATA cards without removing the entire unit from the wall after being mounted.The UC-8580can be used as a communication-centric computing platform for the following applications:•Vehicle-to-ground communication gateway•TCMS T2G(train-to-ground)gateway•Mobile condition monitoring unit•Ethernet Consist Network T2G gateway•Onboard wireless automated fare collection unit1.This product is suitable for rolling stock railway applications,as defined by the EN50155standard.For a more detailed statement,click here:/doc/specs/EN_50155_Compliance.pdf2.Wireless modules are sold separately.Please contact a Moxa sales representative for details.AppearanceSMA ModelQMA ModelSpecificationsComputerCPU Armv7Cortex-A7dual-core1GHz System Memory Pre-installed1GB DDR3LSupported OS Linux Debian8(Linux kernel v4.1)Storage Slot mSATA slots x1,internal mini-PCIe socketStorage Pre-installed8GB eMMCComputer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(M12X-coded)x2 Serial Ports RS-232/422/485ports x2,software-selectable(terminal block) USB3.0USB3.0hosts x1,type-A connectorsDigital Input DIs x3Digital Output DOs x3Expansion Slots mPCIe slots x4Wi-Fi Antenna Connector UC-8580-LX/8580-T-LX/8580-T-CT-LX:RP-SMA x3UC-8580-Q-LX/8580-T-Q-LX/8580-T-CT-Q-LX:QMA x3 Cellular Antenna Connector UC-8580-LX/8580-T-LX/8580-T-CT-LX:SMA x6UC-8580-Q-LX/8580-T-Q-LX/8580-T-CT-Q-LX:QMA x6 Number of SIMs6SIM Format MiniGPS Antenna Connector UC-8580-LX/8580-T-LX/8580-T-CT-LX:SMA x1UC-8580-Q-LX/8580-T-Q-LX/8580-T-CT-Q-LX:TNC x1 Console Port RS-232(TxD,RxD,GND),4-pin header output(115200,n,8,1) Input/Output InterfaceButtons Reset buttonDigital InputsChannel-to-Channel Isolation3K VDCConnector Screw-fastened Euroblock terminalCounter Frequency25HzDry Contact On:short to GNDOff:openI/O Mode DIPoints per COM3x channelSensor Type Wet contact(NPN or PNP)Wet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage0to30VDCLED IndicatorsSystem Power x1System Ready x1Programmable x1Wireless Signal Strength Cellular/Wi-Fi x12LAN2per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDGPS InterfaceHeading Accuracy0.3degreesIndustrial Protocols NMEA0183,version4.0(V2.3or V4.1configurable),UBX,RTCM Receiver Types72-channel u-blox M8engineTime Pulse0.25Hz to10MHzVelocity Accuracy0.05msPower ParametersInput Current 1.66A@24VDC,0.36A@110VDCInput Voltage24to110VDCPower Connector M12A-coded4-pin male connectorPower Consumption40W(max.)Physical CharacteristicsHousing MetalIP Rating IP40Dimensions(with ears)270x134x88mm(10.63x5.28x3.46in)Dimensions(without ears)220x134x88mm(8.66x5.28x3.46in)Weight Product only:2,200g(4.85lb)Installation Wall mountingProtection-CT models:PCB conformal coatingEnvironmental LimitsOperating Temperature Standard Models:-25to55°C(-13to131°F)Wide Temp.Models:-40to70°C(-40to158°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kV;Signal:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFRailway EN50121-4EN50155Railway Fire Protection EN45545-2Safety EN60950-1UL60950-1Shock IEC60068-2-27,IEC61373,EN50155:2017 Vibration IEC60068-2-64,IEC61373,EN50155:2017 DeclarationGreen Product RoHS,CRoHS,WEEEWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x UC-8580Series computerCable1x4-pin header to DB9console cable Documentation1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name CPU Antenna Connector Type Operating Temp.Conformal CoatingUC-8580-LX Armv7Cortex-A7dual-core1GHzSMA-25to55°C–UC-8580-T-LX Armv7Cortex-A7dual-core1GHzSMA-40to70°C–UC-8580-T-CT-LX Armv7Cortex-A7dual-core1GHzSMA-40to70°C✓UC-8580-Q-LX Armv7Cortex-A7dual-core1GHzQMA-25to55°C–UC-8580-T-Q-LX Armv7Cortex-A7dual-core1GHzQMA-40to70°C–UC-8580-T-CT-Q-LX Armv7Cortex-A7dual-core1GHzQMA-40to70°C✓Accessories(sold separately)Wi-Fi Wireless ModulesUC-8580-WLAN33-AC3transmitter3receiver Wi-Fi card module,3SMA connectors with cablesUC-8500-WLAN33-Q-AC3transmitter3receiver Wi-Fi card module,3QMA connectors with cablesCellular Wireless ModulesUC-8500-4GCat6-Q-APAC LTE Cat.6module for North America and Europe,2QMA connectors with cables,-40to60°Coperating temperatureUC-8500-4GCat6-Q-NAMEU LTE Cat.6module for North America and Europe,2QMA connectors with cables,-40to60°Coperating temperatureUC-8580-4GCat6-NAMEU LTE Cat.6module for North America and Europe,2SMA connectors with cables,-40to60°Coperating temperaturePower AdaptersPWR-24250-DT-S1Power adapter,90to264VAC,24VDC,2.5A DC loadPower CordsPWC-C13US-3B-183Power cord with United States(US)plug,1.83mPWC-C13CN-3B-183Power cord with three-prong China(CN)plug,1.83mPWC-C13AU-3B-183Power cord with Australian(AU)plug,1.83mPWC-C13EU-3B-183Power cord with Continental Europe(EU)plug,1.83mPWC-C13JP-3B-183Power cord with Japan(JP)plug,7A/125V,1.83mPWC-C13UK-3B-183Power cord with United Kingdom(UK)plug,1.83m©Moxa Inc.All rights reserved.Updated Nov23,2022.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

Part Number 819-2500-10Revision A of April 2005Sun Microsystems, Inc. © Copyright 2005 Sun Microsystems, Inc. All rights reserved. Use is subject to license terms. Third-party software, including font technology, is copyrighted and licensed from Sun suppliers. Portions may be derived from Berkeley BSD systems, licensed from U. of CA. Sun, Sun Microsystems, Sun StorEdge, the Sun logo, and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the U.S. and in other countries. All SP ARC trademarks are used under license and are trademarks or registered trademarks of SP ARC International, Inc. in the U.S. and in other countries. U.S. Government Rights–Commercial use. Government users are subject to the Sun Microsystems, Inc. standard license agreement and applicable provisions of the FAR and its supplements.© Copyright 2005 Sun Microsystems, Inc. Tous droits réservés. Distribué par des licences qui en restreignent l'utilisation. Le logiciel détenu par des tiers, et qui comprend la technologie relative aux polices de caractères, est protégé par un copyright et licencié par des fournisseurs de Sun. Des parties de ce produit pourront être dérivées des systèmes Berkeley BSD licenciés par l'Université de Californie. Sun, Sun Microsystems, Sun StorEdge, le logo Sun, et Solaris sont des marques de fabrique ou des marques déposées de Sun Microsystems, Inc. aux États-Unis et dans d'autres pays. Toutes les marques SP ARC sont utilisées sous licence et sont des marques de fabrique ou des marques déposées de SP ARC International, Inc. aux États-Unis et dans d'autres pays.。

Product Reference ManualSKU: ABX00083DescriptionThe Arduino Nano ESP32 (with and without headers) is a Nano form factor board based on the ESP32-S3 (embedded in the NORA-W106-10B from u-blox®). This is the first Arduino board to be based fully on an ESP32, and features Wi-Fi®, Bluetooth® LE, debugging via native USB in the Arduino IDE as well as low power.The Nano ESP32 is compatible with the Arduino IoT Cloud, and has support for MicroPython. It is an ideal board for getting started with IoT development.Target areas:Maker, Debugging, IoT, MicroPythonFeaturesXtensa® Dual-core 32-bit LX7 Microprocessor Up to 240 MHz384 kB ROM512 kB SRAM16 kB SRAM in RTC (low power mode)DMA ControllerPowerOperating voltage 3.3 VVUSB supplies 5 V via USB-C® connectorVIN range is 6-21 VConnectivityWi-Fi®Bluetooth® LEBuilt-in antenna2.4 GHz transmitter/receiverUp to 150 MbpsPins14x digital (21x including analog)8x analog (available in RTC mode)SPI(D11,D12,D13), I2C (A4/A5), UART(D0/D1) Communication PortsSPII2CI2SUARTCAN (TWAI®)Low Power7 μA consumption in deep sleep mode240 μA consumption in light sleep modeRTC MemoryUltra Low Power (ULP) CoprocessorPower Management Unit (PMU)ADC in RTC mode55556778888999910101011111111121212131313131314151516Contents1 The Board1.1 Application Examples 2 ESP32 Core3 Recommended Operating Conditions4 Block Diagram5 Board Topology5.1 Front View6 NORA-W106-10B (Radio Module / MCU)6.1 Xtensa® Dual-Core 32bit LX7 Microprocessor 6.2 Wi-Fi®6.3 Bluetooth®7 System7.1 Resets 7.2 Timers 7.3 Interrupts8 Serial Communication Protocols8.1 Inter-Integrated Circuit (I2C)8.2 Inter-IC Sound (I2S)8.3 Serial Peripheral Interface (SPI)8.4 Universal Asynchronous Receiver/Transmitter (UART)8.5 Two Wire Automotive Interface (TWAI®)9 External Flash Memory 10 USB Connector 11 Power Options11.1 Power Tree 11.2 Pin Voltage 11.3 VIN Rating 11.4 VUSB11.5 Using the 3.3 V Pin 11.6 Pin Current 12 Pinout12.1 Analog (JP1)12.2 Digital (JP2)13 Mounting Holes And Board Outline161617171717174191920202014 Board Operation14.1 Getting Started - IDE14.2 Getting Started - Arduino Web Editor 14.3 Getting Started - Arduino IoT Cloud 14.4 Online Resources 14.5 Board Recovery15 Declaration of Conformity CE DoC (EU)16 Declaration of Conformity to EU RoHS & REACH 211 01/19/202117 Conflict Minerals Declaration 18 FCC Caution19 Company Information 20 Reference Documentation 21 Change Log1 The BoardNano ESP32 is a 3.3 V development board based on the NORA-W106-10B from u-blox®, a module that includes a ESP32-S3 system on a chip (SoC). This module has support for Wi-Fi® and Bluetooth® Low Energy (LE), with amplified communication through a built-in antenna. The CPU (32-bit Xtensa® LX7) support clock frequencies at up to 240 MHz and has native support for debugging via the USB-C® connector.1.1 Application ExamplesHome automation: an ideal board for automating your home, and can be used for smart switches, automatic lighting and motor control for e.g. motor controlled blinds.IoT sensors: with several dedicated ADC channels, accessible I2C/SPI buses and a robust ESP32-S3 based radio module, this board can easily be deployed to monitor sensor values.Low power designs: create battery powered applications with low power consumption, utilising the built in low power modes of the ESP32-S3 SoC.2 ESP32 CoreThe Nano ESP32 uses the Arduino Core for ESP32 boards, a derivation of Espressif's arduino-esp32 core. Rating3 Recommended Operating ConditionsSymbol Description Min Typ Max UnitV IN Input voltage from VIN pad67.021VV USB Input voltage from USB connector 4.8 5.0 5.5VT OP Operating Temperature-402585°CFunctional Overview4 Block DiagramArduino Nano ESP32 Block Diagram5 Board Topology5.1 Front ViewTop View of Arduino Nano ESP32 Ref.DescriptionM1NORA-W106-10B (ESP32-S3 SoC)J1CX90B-16P USB-C® connectorJP11x15 analog headerJP21x15 digital headerU2MP2322GQH step down converterU3GD25B128EWIGR 128 Mbit (16 MB) ext. flash memory DL1RGB LEDDL2LED SCK (serial clock)DL3LED Power (green)D2PMEG6020AELRX Schottky DiodeD3PRTR5V0U2X,215 ESD Protection6 NORA-W106-10B (Radio Module / MCU)The Nano ESP32 features the NORA-W106-10B stand alone radio module, embedding an ESP32-S3 series SoC as well as an embedded antenna. The ESP32-S3 is based on an Xtensa® LX7 series microprocessor.6.1 Xtensa® Dual-Core 32bit LX7 MicroprocessorThe microprocessor for the ESP32-S3 SoC inside the NORA-W106 module is a dual-core 32-bit Xtensa® LX7. Each core can run at up to 240 MHz and has 512 kB SRAM memory. The LX7 features:32-bit customized instruction set128-bit data bus32-bit multiplier / dividerSupport for JTAG debuggingThe LX7 has a 384 kB ROM (Read Only Memory), and 512 kB of SRAM (Static Random Access Memory). It also features an 8 kB RTC FAST and RTC SLOW memory. These memories are designed for low-power operations, where the SLOW memory can be accessed by the ULP (Ulta Low Power) coprocessor, retaining the data in deep sleep mode.6.2 Wi-Fi®The NORA-W106-10B module supports the Wi-Fi® 4 IEEE 802.11 standards b/g/n, with an output power EIRP at up to 10 dBm. The max range for this module is 500 meters.802.11b: 11 Mbit/s802.11g: 54 Mbit/s802.11n: 72 Mbit/s max at HT-20 (20 MHz), 150 Mbit/s max at HT-40 (40 MHz)6.3 Bluetooth®The NORA-W106-10B module supports Bluetooth® LE v5.0 with an output power EIRP at up to 10 dBm and data rates up to 2 Mbps. It has the option to scan and advertise simultaneously, as well as supporting multiple connections in peripheral/central mode.7 System7.1 ResetsThe ESP32-S3 has support for four levels of reset:CPU: resets CPU0/CPU1 coreCore: resets the digital system, except for the RTC peripherals (ULP coprocessor, RTC memory).System: resets the entire digital system, including the RTC peripherals.Chip: resets the entire chip.It is possible to conduct a software reset of this board, as well as obtaining the reset reason.To do a hardware reset of the board, use the onboard reset button (PB1).7.2 TimersThe Nano ESP32 has the following timers:52-bit system timer with 2x 52-bit counters (16 MHz) and 3x comparators.4x general-purpose 54-bit timers3x watchdog timers, two in main system (MWDT0/1), one in the RTC module (RWDT).7.3 InterruptsAll GPIOs on the Nano ESP32 can be configured to be used as interrupts, and is provided by an interrupt matrix. Interrupt pins are configured on an application level, using the following configurations:LOWHIGHCHANGEFALLINGRISING8 Serial Communication ProtocolsThe ESP32-S3 chip provides flexibility for the various serial protocols it supports. For example, the I2C bus can be assigned to almost any available GPIO.8.1 Inter-Integrated Circuit (I2C)Default pins:A4 - SDAA5 - SCLThe I2C bus is by default assigned to the A4/A5 (SDA/SCL) pins for retro compatibility. This pin assignment can however be changed, due to the flexibility of the ESP32-S3 chip.The SDA and SCL pins can be assigned to most GPIOs, however some of these pins may have other essential functions that prevents I2C operations to run successfully.Please note: many software libraries uses the standard pin assignment (A4/A5).8.2 Inter-IC Sound (I2S)There two I2S controllers that are typically used for communication with audio devices. There are no specific pins assigned for I2S, this can be used by any free GPIO.Using standard or TDM mode, the following lines are used:MCLK - master clockBCLK - bit clockWS - word selectDIN/DOUT - serial dataUsing PDM mode:CLK - PDM clockDIN/DOUT serial dataRead more about the I2S protocol in Espressif's Peripheral API - InterIC Sounds (I2S)8.3 Serial Peripheral Interface (SPI)SCK - D13COPI - D12CIPO - D11CS - D10The SPI controller is by default assigned to the pins above.8.4 Universal Asynchronous Receiver/Transmitter (UART)D0 / TXD1 / RXThe UART controller is by default assigned to the the pins above.8.5 Two Wire Automotive Interface (TWAI®)The CAN/TWAI® controller is used to communicate with systems using the CAN/TWAI® protocol, particularly common in the automotive industry. There are no specific pins assigned for the CAN/TWAI® controller, any free GPIO can be used.Please note: TWAI® is also known as the CAN2.0B, or "CAN classic". The CAN controller is NOT compatible with CAN FD frames.9 External Flash MemoryNano ESP32 features a 128 Mbit (16 MB) external flash, the GD25B128EWIGR (U3). This memory is connected to the ESP32 via Quad Serial Peripheral Interface (QSPI).The operating frequency for this IC is 133 MHz, and has a data transfer rate at up to 664 Mbit/s.10 USB ConnectorThe Nano ESP32 has one USB-C® port, used to power and program your board as well as sending & receiving serial communication.Note that you should not power the board with more than 5 V via the USB-C® port.11 Power OptionsPower can either be supplied via the VIN pin, or via USB-C® connector. Any voltage input either via USB or VIN is stepped down to 3.3 V using the MP2322GQH (U2) converter.The operating voltage for this board is 3.3 V. Please note that there's no 5V pin available on this board, only the VBUS can provide 5 V when the board is powered via USB.11.1 Power TreeArduino Nano ESP32 power tree.11.2 Pin VoltageAll digital & analog pins on the Nano ESP32 are 3.3 V. Do not connect any higher voltage devices to any of the pins as it will risk damaging the board.11.3 VIN RatingThe recommended input voltage range is 6-21 V.You should not attempt to power the board with a voltage outside the recommended range, particularly not higher than 21 V.The efficiency of the converter depends on the input voltage via the VIN pin. See the average below for a board operation with normal current consumption:4.5 V - >90%.12 V - 85-90%18 V - <85%This information is extracted from the MP2322GQH's datasheet.11.4 VUSBThere is no 5V pin available on the Nano ESP32. 5 V can only be provided via the VUSB, which is supplied directly from the USB-C® power source.While powering the board via the VIN pin, the VUSB pin is not activated. This means you have no option of providing 5 V from the board unless powered via USB or externally.11.5 Using the 3.3 V PinThe 3.3 V pin is connected to the 3.3 V rail which is connected to the output of the MP2322GQH step down converter. This pin is primarily used to power external components.11.6 Pin CurrentThe GPIOs on the Nano ESP32 can handle source currents up to 40 mA, and sink currents up to 28 mA. Never connect devices that draw higher current directly to a GPIO.Mechanical Information12 PinoutPinout for Nano ESP32.12.1 Analog (JP1)Pin Function Type Description1SCK NC Serial Clock2+3V3Power+3V3 Power Rail3BOOT0Mode Board Reset 04A0Analog Analog input 05A1Analog Analog input 16A2Analog Analog input 27A3Analog Analog input 38A4Analog Analog input 4 / I²C Serial Datal (SDA) 9A5Analog Analog input 5 / I²C Serial Clock (SCL) 10A6Analog Analog input 611A7Analog Analog input 712VUSB Power USB power (5V)13BOOT1Mode Board Reset 114GND Power Ground15VIN Power Voltage Input12.2 Digital (JP2)Pin Function Type Description1D12 / CIPO*Digital Controller In Peripheral Out2D11 / COPI*Digital Controller Out Peripheral In3D10Digital Chip Select4D9Digital GPIO 95D8Digital GPIO 86D7Digital GPIO 77D6Digital GPIO 68D5Digital GPIO 59D4Digital GPIO 410D3Digital GPIO 311D2Digital GPIO 212GND Power Ground13RST Internal Reset14D1/RX Digital GPIO 4 / Serial 0 Receiver (RX) 15D0/TX Digital GPIO 3 / Serial 0 Transmitter (TX) *CIPO/COPI replaces the MISO/MOSI terminology.13 Mounting Holes And Board OutlineMechanical View of Nano ESP3214 Board Operation14.1 Getting Started - IDEIf you want to program your Nano ESP32 while offline you need to install the Arduino IDE [1]. To connect the Nano ESP32 to your computer, you will need a Type-C® USB cable, which can also provide power to the board, as indicated by the LED (DL1).14.2 Getting Started - Arduino Web EditorAll Arduino boards, including this one, work out-of-the-box on the Arduino Web Editor [2], by just installing a simple plugin.The Arduino Web Editor is hosted online, therefore it will always be up-to-date with the latest features and support for all boards. Follow [3] to start coding on the browser and upload your sketches onto your board.14.3 Getting Started - Arduino IoT CloudAll Arduino IoT enabled products are supported on Arduino IoT Cloud which allows you to log, graph and analyze sensor data, trigger events, and automate your home or business.14.4 Online ResourcesNow that you have gone through the basics of what you can do with the board you can explore the endless possibilities it provides by checking exciting projects on Arduino Project Hub [4], the Arduino Library Reference [5], and the online store [6]; where you will be able to complement your board with sensors, actuators and more. 14.5 Board RecoveryAll Arduino boards have a built-in bootloader which allows flashing the board via USB. In case a sketch locks up the processor and the board is not reachable anymore via USB, it is possible to enter bootloader mode by double-tapping the reset button right after the power-up.Certifications15 Declaration of Conformity CE DoC (EU)We declare under our sole responsibility that the products above are in conformity with the essential requirements of the following EU Directives and therefore qualify for free movement within markets comprising the European Union (EU) and European Economic Area (EEA).16 Declaration of Conformity to EU RoHS & REACH 21101/19/2021Arduino boards are in compliance with RoHS 2 Directive 2011/65/EU of the European Parliament and RoHS 3 Directive 2015/863/EU of the Council of 4 June 2015 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.Substance Maximum Limit (ppm)Lead (Pb)1000Cadmium (Cd)100Mercury (Hg)1000Hexavalent Chromium (Cr6+)1000Poly Brominated Biphenyls (PBB)1000Poly Brominated Diphenyl ethers (PBDE)1000Bis(2-Ethylhexyl} phthalate (DEHP)1000Benzyl butyl phthalate (BBP)1000Dibutyl phthalate (DBP)1000Diisobutyl phthalate (DIBP)1000Exemptions : No exemptions are claimed.Arduino Boards are fully compliant with the related requirements of European Union Regulation (EC) 1907 /2006 concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH). We declare none of the SVHCs (https://echa.europa.eu/web/guest/candidate-list-table), the Candidate List of Substances of Very High Concern for authorization currently released by ECHA, is present in all products (and also package) in quantities totaling in a concentration equal or above 0.1%. To the best of our knowledge, we also declare that our products do not contain any of the substances listed on the "Authorization List" (Annex XIV of the REACH regulations) and Substances of Very High Concern (SVHC) in any significant amounts as specified by the Annex XVII of Candidate list published by ECHA (European Chemical Agency) 1907 /2006/EC.17 Conflict Minerals DeclarationAs a global supplier of electronic and electrical components, Arduino is aware of our obligations with regards to laws and regulations regarding Conflict Minerals, specifically the Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502. Arduino does not directly source or process conflict minerals such as Tin, Tantalum, Tungsten, or Gold. Conflict minerals are contained in our products in the form of solder, or as a component in metal alloys. As part of our reasonable due diligence Arduino has contacted component suppliers within our supply chain to verify their continued compliance with the regulations. Based on the information received thus far we declare that our products contain Conflict Minerals sourced from conflict-free areas.18 FCC CautionAny Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference(2) this device must accept any interference received, including interference that may cause undesired operation. FCC RF Radiation Exposure Statement:1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.2. This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment.3. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator &your body.English: User manuals for licence-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference(2) this device must accept any interference, including interference that may cause undesired operation of the device.French: Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes :(1) l’ appareil nedoit pas produire de brouillage(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.IC SAR Warning:English This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.French: Lors de l’ installation et de l’ exploitation de ce dispositif, la distance entre le radiateur et le corps est d ’au moins 20 cm.Important: The operating temperature of the EUT can’t exceed 85℃ and shouldn’t be lower than -40 ℃. Hereby, Arduino S.r.l. declares that this product is in compliance with essential requirements and other relevant provisions of Directive 201453/EU. This product is allowed to be used in all EU member states.19 Company InformationCompany name Arduino SRLCompany Address Via Andrea Appiani, 25 - 20900 MONZA Italy)20 Reference DocumentationRef LinkArduino IDE (Desktop)https:///en/Main/SoftwareArduino Web Editor(Cloud)https:///editorWeb Editor - Getting Started https:///cloud/web-editor/tutorials/getting-started/getting-started-web-editorProject Hub https:///projecthub?by=part&part_id=11332&sort=trending Library Reference https:///arduino-libraries/Online Store https:///21 Change LogDate Changes08/06/2023Release。

android slider用法
Android Slider是一个可滑动控件，允许用户通过拖动滑块来设
置数值。

在Android中，可以通过SeekBar类来实现Slider控件。

其
常见用途是在设置界面中，用于用户输入选择范围。

Slider控件可以设置最小值和最大值、当前值、初始值等属性，
并允许开发者为其添加监听器，以监听滑动事件并对滑动行为进行相
应的响应。

除了SeekBar控件之外，还有其他第三方库可以实现Slider功能，如RecyclerViewSlider、RangeSeekBar等。

这些库通常提供了更多的
自定义选项，例如自定义滑块、滑轨、slider样式等。

总之，Slider是一个常见且实用的控件，在Android开发中占据
重要的地位。

其使用也比较简单，只需要掌握SeekBar的基本用法即可。

GDRC-MP3_Player(V1.0)便携式音乐播放器(涛行MP3开发板V1.0)使用说明书版本：V1.0.0目录1、简介- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 22、操作说明- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- 33、存储介质文件存放规约- - - - - - - - - - - - - - - - - - - 114、常见问题- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 125、联系我们- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 141、简介GDRC—MP3(V1.0)是一款由南京涛行电子推出的单片机MP3设计开发和学习板，该板采用了NXP公司的低电压低功耗的LPC932A1作为控制核心，采用SD卡作为歌曲存储介质，使用音频解码专用VS1003B芯片进行音乐解码与回放。

此MP3开发板浓缩了涛行电子多年MP3软硬件设计经验，简约化设计，为便携式功能度身定做，在节约成本的同时，仍保留了高性能。

模块供电电压为3.6-9.1V，可播放高达320Kbps的MP3，WMA，WAV，MIDI格式的音乐文件。

高贵并不昂贵，您只需98元即可轻松拥有。

购买本开发板即可获得完整的电路原理图及完整的源程序，并免费奉送相关的开发工具软件，还可享受优惠价选购配套开发工具。

本开发板用的采用的型号为LPC932A1的单片机是一款MCS-51兼容的高速单片机，为2时钟的机器周期，运行速度为常见的AT89S52的6倍。

芯片内置精度为1%的RC振荡器，工作电压为2.4-3.6V，宽电压，低功耗，尤其适用于电池供电的场合。

Automotive DDR4 SDRAM MT40A2G8MT40A1G16FeaturesNotes:1.Not all options listed can be combined to define an offered product. Use the part catalog search on for available offerings.2.The ×4 device is not offered and the mode is not supported by the x8 or x16 device even tho ugh some ×4 mode descriptions exist in the data sheet.3.The UT option use based on automotive usage model. Contact Micron sales representative if you have questions.Notes:1.Refer to the Speed Bin Tables for additional details.•V DD = V DDQ = 1.2V ±60mV •V PP = 2.5V, –125mV, +250mV •On-die, internal, adjustable V REFDQ generation •1.2V pseudo open-drain I/O •Refresh time of 8192-cycle at T C temperature range:–64ms, at –40°C to 85°C–32ms, at >85°C to 95°C–16ms, at >95°C to 105°C–8ms, at >105°C to 125°C•16 internal banks (x8): 4 groups of 4 banks each•8 internal banks (x16): 2 groups of 4 banks each•8n -bit prefetch architecture•Programmable data strobe preambles•Data strobe preamble training•Command/Address latency (CAL)•Multipurpose register READ and WRITE capability•Write leveling•Self refresh mode•Low-power auto self refresh (LPASR)•Temperature controlled refresh (TCR)•Fine granularity refresh•Self refresh abort•Maximum power saving•Output driver calibration•Nominal, park, and dynamic on-die termination(ODT)•Data bus inversion (DBI) for data bus•Command/Address (CA) parity•Databus write cyclic redundancy check (CRC)•Per-DRAM addressability•Connectivity test•JEDEC JESD-79-4 compliant•sPPR and hPPR capability•AEC-Q100•PPAP submission Options 1Marking •Configuration –2 Gig x 82G8–1 Gig x 161G16•78-ball FBGA package (Pb-free) – x8–7.5mm x 11mm – Rev. F AG •96-ball FBGA package (Pb-free) – x16–7.5mm x 13mm – Rev. F TD •Timing – cycle time –0.625ns @ CL = 22 (DDR4-3200)-062E •Product certification –Automotive A •Operating temperature –Industrial (–40° ≤ T C ≤ 95°C)IT –Automotive (–40° ≤ T C ≤ 105°C)AT –Ultra-high (–40° ≤ T C ≤ 125°C)UT •Revision :F Table 1: Key Timing Parameters Speed Grade 1Data Rate (MT/s)Target CL-n RCD-n RP t AA (ns)t RCD (ns)t RP (ns)-062E 320022-22-2213.7513.7513.75Table 2: AddressingParameter2048 Meg x 81024 Meg x 16 Number of bank groups42Bank group address BG[1:0]BG0Bank count per group44Bank address in bank group BA[1:0]BA[1:0]Row addressing 128K (A[16:0])128K (A[16:0])Column addressing 1K (A[9:0]) 1K (A[9:0])Page size11KB2KBNotes:1.Page size is per bank, calculated as follows:Page size = 2COLBITS× ORG/8, where COLBIT = the number of column address bits and ORG = the number of DQ bits. Figure 1: Order Part Number ExampleExample Part Number: MT40A1G16KH-062E AAT:EContentsImportant Notes and Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 General Notes and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Industrial Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Automotive Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Ultra-high Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Definitions of the Device-Pin Signal Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Definitions of the Bus Signal Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Functional Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ball Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Ball Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 RESET and Initialization Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Power-Up and Initialization Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 RESET Initialization with Stable Power Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Uncontrolled Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Programming Mode Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Mode Register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Burst Length, Type, and Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Write Recovery (WR)/READ-to-PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 DLL RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Mode Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 DLL Enable/DLL Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Output Driver Impedance Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 ODT R TT(NOM) Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Additive Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Rx CTLE Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Write Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Termination Data Strobe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Mode Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 CAS WRITE Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Low-Power Auto Self Refresh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Dynamic ODT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Write Cyclic Redundancy Check Data Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Mode Register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Multipurpose Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 WRITE Command Latency When CRC/DM is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Fine Granularity Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Temperature Sensor Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Per-DRAM Addressability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Gear-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Mode Register 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Hard Post Package Repair Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Soft Post Package Repair Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 WRITE Preamble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55READ Preamble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 READ Preamble Training . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Temperature-Controlled Refresh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Command Address Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Internal V REF Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Maximum Power Savings Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Mode Register 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Data Bus Inversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Data Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 CA Parity Persistent Error Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 ODT Input Buffer for Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 CA Parity Error Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 CRC Error Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 CA Parity Latency Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Mode Register 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Data Rate Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V REFDQ Calibration Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V REFDQ Calibration Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V REFDQ Calibration Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 NOP Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 DESELECT Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 DLL-Off Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 DLL-On/Off Switching Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 DLL Switch Sequence from DLL-On to DLL-Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 DLL-Off to DLL-On Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Input Clock Frequency Change . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Write Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 DRAM Setting for Write Leveling and DRAM TERMINATION Function in that Mode . . . . . . . . . . . . . . . . . . . . . . . 73 Procedure Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Write Leveling Mode Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Command Address Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Low-Power Auto Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Manual Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Multipurpose Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 MPR Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 MPR Readout Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 MPR Readout Serial Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 MPR Readout Parallel Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 MPR Readout Staggered Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 MPR READ Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 MPR Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 MPR WRITE Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 MPR REFRESH Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Gear-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Maximum Power-Saving Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Maximum Power-Saving Mode Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Maximum Power-Saving Mode Entry in PDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 CKE Transition During Maximum Power-Saving Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Maximum Power-Saving Mode Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Command/Address Parity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100 Per-DRAM Addressability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107V REFDQ Range and Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111V REFDQ Step Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111V REFDQ Increment and Decrement Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112V REFDQ Target Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116Connectivity Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118Pin Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118Minimum Terms Definition for Logic Equations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119Logic Equations for a x4 Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119Logic Equations for a x8 Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120Logic Equations for a x16 Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120CT Input Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120Excessive Row Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122Post Package Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123Post Package Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123Hard Post Package Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123hPPR Row Repair - Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124hPPR Row Repair – WRA Initiated (REF Commands Allowed) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124hPPR Row Repair – WR Initiated (REF Commands NOT Allowed) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126sPPR Row Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127hPPR/sPPR/MBIST-PPR Support Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130ACTIVATE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130PRECHARGE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131REFRESH Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .132Temperature-Controlled Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134Normal Temperature Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134Extended Temperature Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134Fine Granularity Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136Mode Register and Command Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136 t REFI and t RFC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136 Changing Refresh Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .139Usage with TCR Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .139Self Refresh Entry and Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .139SELF REFRESH Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141Self Refresh Abort . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143Self Refresh Exit with NOP Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146Power-Down Clarifications – Case 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .151Power-Down Entry, Exit Timing with CAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .152ODT Input Buffer Disable Mode for Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .154CRC Write Data Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156CRC Write Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156WRITE CRC DATA Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156DBI_n and CRC Both Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157DM_n and CRC Both Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157DM_n and DBI_n Conflict During Writes with CRC Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157CRC and Write Preamble Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157CRC Simultaneous Operation Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157CRC Polynomial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157CRC Combinatorial Logic Equations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .158Burst Ordering for BL8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .159CRC Data Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .159CRC Enabled With BC4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160。

S200Series BIOS Battery FRU Kit Product Installation GuideBlue Coat Systems,Inc Upgrade Installation GuideThird Party Copyright Notices©2016Blue Coat Systems,Inc.All rights reserved.BLUE COAT,PROXYSG,PACKETSHAPER,CACHEFLOW, INTELLIGENCECENTER,CACHEOS,CACHEPULSE,CROSSBEAM,K9,DRTR,MACH5,PACKETWISE, POLICYCENTER,PROXYAV,PROXYCLIENT,SGOS,WEBPULSE,SOLERA NETWORKS,DEEPSEE,DS APPLIANCE,CONTENT ANALYSIS SYSTEM,SEE EVERYTHING.KNOW EVERYTHING.,SECURITY EMPOWERS BUSINESS,BLUETOUCH,the Blue Coat shield,K9,and Solera Networks logos and other Blue Coat logos are registered trademarks or trademarks of Blue Coat Systems,Inc.or its affiliates in the U.S.and certain other countries.This list may not be complete,and the absence of a trademark from this list does not mean it is not a trademark of Blue Coat or that Blue Coat has stopped using the trademark.All other trademarks mentioned in this document owned by third parties are the property of their respective owners.This document is for informational purposes only.BLUE COAT MAKES NO WARRANTIES,EXPRESS,IMPLIED,OR STATUTORY,AS TO THE INFORMATION IN THIS DOCUMENT.BLUE COAT PRODUCTS,TECHNICAL SERVICES,AND ANY OTHER TECHNICAL DATA REFERENCED IN THIS DOCUMENT ARE SUBJECT TO U.S.EXPORT CONTROL AND SANCTIONS LAWS, REGULATIONS AND REQUIREMENTS,AND MAY BE SUBJECT TO EXPORT OR IMPORT REGULATIONS IN OTHER COUNTRIES.YOU AGREE TO COMPLY STRICTLY WITH THESE LAWS,REGULATIONS AND REQUIREMENTS,AND ACKNOWLEDGE THAT YOU HAVE THE RESPONSIBILITY TO OBTAIN ANY LICENSES, PERMITS OR OTHER APPROVALS THAT MAY BE REQUIRED IN ORDER TO EXPORT,RE-EXPORT, TRANSFER IN COUNTRY OR IMPORT AFTER DELIVERY TO YOU.Americas:Blue Coat Systems,Inc.384Santa Trinita Ave.Sunnyvale,CA94085****************************************************************************Rest of the World:Blue Coat Systems International SARL3a Route des Arsenaux1700Fribourg,Switzerland2Blue Coat Systems,Inc Upgrade Installation Guide ContentsThird Party Copyright Notices2 Safety Warnings and Cautions5 Power and Electrical Warnings5 CAUTION5 System Access Warnings5 CAUTION5 To avoid personal injury or property damage,the following safety instructions apply whenever accessingthe inside of the product:5 CAUTION6 CAUTION6 Cooling and Airflow Warning6 Electrostatic Discharge(ESD)Warning6 CAUTION6 Remove the S200Series Top Cover8 Remove the S200Series PCIe Riser Card9 Replace the S200Series BIOS Battery10 Install the S200Series PCIe Riser Card12 Reinstall the S200Series Top Cover13 Finish the BIOS Battery Replacement14 Verify the SG-S200BIOS Battery Installation15 Verify the Appliance Time Settings173Blue Coat Systems,Inc Upgrade Installation GuideThe contents of the Blue Coat BIOS battery FRU kits are shown below.Please verify the contents of the upgrade kit before continuing with the installation.If any items are missing,please contact your Blue Coat Support contact for assist-ance.To replace the BIOS battery,Blue Coat recommends the following tools and items.4Blue Coat Systems,Inc Upgrade Installation Guide Safety Warnings and CautionsCaution:This product is designed to work with power systems having a grounded neutral.To reduce therisk of electric shock,do not plug this product into any other type of power system.Contact a qualified elec-trician if you are not sure what type of power is supplied to your building.Power and Electrical WarningsCAUTIONThe power button,indicated by the stand-by power marking,DOES NOT completely turn off the system ACpower.5V standby power is active whenever the system is plugged in.To remove power from system,youmust unplug the AC power cord from the wall outlet.If your system uses more than one AC power cord,make sure all AC power cords are unplugged before you open the chassis,or add or remove any non hot-plug components.The power supply in this product contains no user-serviceable parts.Do not open the power supply.Haz-ardous voltage,current,and energy levels are present inside the power supply.Return to manufacturer forservicing.To avoid risk of electric shock,turn off the appliance and disconnect the power cord,tele-communications systems,networks,and modems attached to the appliance before opening it.The power cord set included with the appliance meets the requirements for use in the country of purchase.Use the power cord that shipped with the appliance.If this appliance is to be used in another country,pur-chase an AC power cord set that is approved for use in that country(18AWG recommended).The power cord must be rated for the product and for the voltage and current marked on the product's elec-trical ratings label.The voltage and current rating of the cord should be greater than the voltage and currentrating marked on the product.In addition,the cross-sectional area of the wires must be a minimum of1.00mmðor18AWG or18AWG,and the length of the cords must be between1.8m(6feet)and3.6m(12feet).System Access WarningsCAUTIONTo avoid personal injury or property damage,the following safety instructions apply whenever accessing theinside of the product:n Turn off all peripheral devices connected to this product.n Turn off the system by pressing the power button to off.n Disconnect the AC power by unplugging all AC power cords from the system or wall outlet.n Disconnect all cables and telecommunication lines that are connected to the system.5Blue Coat Systems,Inc Upgrade Installation Guiden Retain all screws or other fasteners when removing access cover(s).Upon completion of accessing inside the product,refasten access cover with original screws or fasteners.n Do not access the inside of the power supply.There are no serviceable parts in the power supply.Return to manufacturer for servicing.n Power down the server and disconnect all power cords before adding or replacing any non hot-plug component.n When replacing a hot-plug power supply,unplug the power cord to the power supply being replaced before removing the power supply from the server.CAUTIONn If the server has been running,any installed processor(s)and heat sink(s)may be hot.Unless you are adding or removing a hot-plug component,allow the system to cool before opening the covers.Toavoid the possibility of coming into contact with hot component(s)during a hot-plug installation,becareful when removing or installing the hot-plug component(s).CAUTIONn To avoid injury do not contact moving fan blades.If your system is supplied with a guard over the fan, do not operate the system without the fan guard in place.Cooling and Airflow WarningCarefully route cables as directed to minimize airflow blockage and cooling problems.For proper cooling and airflow,operate the system only with the chassis covers installed.Operating the sys-tem without the covers in place can damage system parts.To install the covers:1.Check first to make sure you have not left loose tools or parts inside the system.2.Check that cables,add-in boards,and other components are properly installed.3.Attach the covers to the chassis according to the product instructions.Electrostatic Discharge(ESD)WarningCAUTIONESD can damage disk drives,boards,and other parts.We recommend that you perform all procedures at an ESD workstation.If one is not available,provide some ESD protection by wearing an antistatic wrist strap attached to chassis ground-any unpainted metal surface--on your server when handling parts.Always handle boards carefully.They can be extremely sensitive to ESD.Hold boards only by their edges.After removing a board from its protective wrapper or from the server,place the board component side up on6Blue Coat Systems,Inc Upgrade Installation Guide a grounded,static free e a conductive foam pad if available but not the board wrapper.Do notslide board over any surface7Blue Coat Systems,Inc Upgrade Installation GuideRemove the S200Series Top CoverThe S200Series top cover protects the primary system components.You must remove this panel to access the option cards,hard disk drives,and DIMMs.You must power down the appliance and take proper safety measures before opening the appliance.ALWAYS observe proper electrostatic discharge(ESD)conventions.Attach an ESDprotective wrist strap to your wrist and to the chassis.Ensure that the appliance is onan ESD-safe work surface or ground the unit appropriately.Blue Coat does notassume responsibility or liability for damage resulting from ESD.1.Remove the top cover captive thumbscrew by either using either your fingers or a screwdriver.2.Push the top cover towards the rear of the appliance then lift to remove the cover.Set the top cover aside at a safelocation.8Blue Coat Systems,Inc Upgrade Installation Guide Remove the S200Series PCIe Riser CardThe S200Series is equipped with a PCIe riser card that mounts the NIC in a horizontal position.You must remove the riser card from the appliance before you can attach a NIC.ALWAYS observe proper electrostatic discharge(ESD)conventions.Attach an ESDprotective wrist strap to your wrist and to the appliance chassis.Ensure that the appli-ance is on an ESD-safe work surface or ground the unit.Blue Coat does not assumeresponsibility or liability for damage resulting from ESD.1.Pull the release latches to unlock the riser card.Unlocking the release latches also unseats the riser card.2.Hold the edges of the riser card and lift straight up to remove from the appliance.9Blue Coat Systems,Inc Upgrade Installation GuideReplace the S200Series BIOS BatteryThe Blue Coat S200series appliances feature a replaceable CR2450BIOS battery.The battery located near the PCIe riser card and must be removed to provide safe access to the battery holder.The BIOS battery details for the S200series are shown below.ALWAYS observe proper electrostatic discharge(ESD)conventions.Attach an ESDprotective wrist strap to your wrist and to the chassis.Ensure that the appliance is onan ESD-safe work surface or ground the unit appropriately.Blue Coat does notassume responsibility or liability for damage resulting from ESD.Do not install batteries which are not explicitly supported by the appliance.Install-ation and use of unauthorized batteries might damage the appliance and will inval-idate your Blue Coat service contract!1.To remove the existing BIOS battery,release the battery by pressing the clip with the flat-blade screwdriver.Thebattery should tilt upward,slightly out of the battery holder.Remove the battery.If necessary,use the pliers to lift the battery out of the battery holder.Properly dispose of the old BIOS battery.Please recycle old and unused Blue Coat products!Visit https://www.blue-/support/support-policies/recycling-blue-coat-products for moreinformation.2.Install the new battery( +positive side up)by inserting it at an angle towards the battery holder retaining clip and10Blue Coat Systems,Inc Upgrade Installation Guide then press down to secure it.Blue Coat Systems,Inc Upgrade Installation GuideInstall the S200Series PCIe Riser CardThe S200Series is equipped with a PCIe riser card that mounts the NIC in a horizontal position.When you reinstall the riser card,take additional care to prevent scratching any board surfaces.ALWAYS observe proper electrostatic discharge(ESD)conventions.Attach an ESDprotective wrist strap to your wrist and to the appliance chassis.Ensure that the appli-ance is on an ESD-safe work surface or ground the unit.Blue Coat does not assumeresponsibility or liability for damage resulting from ESD.1.Verify that the appliance power cord is unplugged.2.Remove the appliance top cover.3.Align the PCIe riser card with the posts on the chassis and press down to seat into place.4.Lock the PCIe riser card in place by closing the two lockdown clips on riser card.Verify that the module is flat andaligned with the rest of the adjoining chassis structures before reinstalling the appliance cover.Blue Coat Systems,Inc Upgrade Installation Guide Reinstall the S200Series Top CoverThe S200Series top cover protects the primary system components.You must remove this panel to access the option cards,hard disk drives,and DIMMs.You must power down the appliance and take proper safety measures before opening the appliance.ALWAYS observe proper electrostatic discharge(ESD)conventions.Attach an ESDprotective wrist strap to your wrist and to the chassis.Ensure that the appliance is onan ESD-safe work surface or ground the unit appropriately.Blue Coat does notassume responsibility or liability for damage resulting from ESD.1.Reinstall the rear cover by sliding the panel towards the front of the appliance.2.Secure the top cover by tightening the captive screw.Blue Coat Systems,Inc Upgrade Installation GuideFinish the BIOS Battery ReplacementFinish the BIOS battery replacement by reconnecting the cables and verifying the installation.1.Reinstall the appliance cables as they were originally configured.2.Power on the appliance.Blue Coat Systems,Inc Upgrade Installation Guide Verify the SG-S200BIOS Battery InstallationLog in to your ProxySG appliance using a supported Web browser(see the SGOS Release Notes for a list of supported browsers):1.Open a Web browser.2.Disable the browser’s pop-up blocker or configure it to allow pop-ups from the appliance’s IP address.ing a secure connection,enter any IP address assigned to the appliance,followed by the HTTPS console portnumber(8082by default).For example:https://192.0.2.2:80824.Enter the user name and password you specified during configuration to access the appliance.5.Select Maintenance>System&Disks>Environment.6.Select View Sensors.Blue Coat Systems,Inc Upgrade Installation Guide7.Scroll down to+3V battery voltage and verify the status is OK.Blue Coat Systems,Inc Upgrade Installation Guide Verify the Appliance Time SettingsIf you exited from the Management Console,log back in to the appliance.1.Select Configuration>General>Clock.2.Go to Current time and verify that the time settings are accurate.If necessary,update the time settings asappropriate。

CM4680 2D Imager ModuleQuick Start GuideCM4680-EN-QS Rev aWhat is the CM4680 2D Imager ModuleThe CM4680 is an encased compact 2D imager module for fixed mount applications.The CM4680 2D imager module includes the following features:•USB interface (micro USB connector)•Exit window•Beeper•Status indicator•Mounting holes for multiple mounting positions•Sealed enclosureRequired Accessories (not provided)•Standard USB cable (USB-A to micro USB). Maximum recommended length is 3-5 meters.Additional DocumentationThe following document is available from your local Honeywell OEM representative:•N4680/CF4680/CM4680 User GuideCM4680 2D Imager Module ViewsStatus indicatorExit window Mounting holes (x10)Mounting holes (x10)BeeperUSB cableSlider to secure cableMounting holes (x10)Mounting holes (x10)Connecting to a HostBy default, the scanner is in USB serial interface.1.Remove slider from module by pressing the ends and slid-ing it off.2.Connect a standard USB cable (standard USB-A to microUSB) to the module.USB cable3.Secure the cable to the module using the slider:Place the cable through the center of the slider.Press the ends of the slider and slide it back on to the mod-ule until tight.4.Connect the USB cable to the host.5.Power-up the host.The scanner powers up, emits a series of beeps from low to high, and lighting turns on.Note:The host does not have to be powered down before plugging in the device. It can be hot plugged.ConfigurationYou can configure your scanner two ways:•Reading configuration bar codes•Using the EZConfig Cloud for Scanning toolConfiguration Bar CodesScan configuration bar codes to set up your scanner. All avail-able configuration bar codes are available in the N4680/CF4680/CM4680 User Guide. Contact your local Honeywell OEM representative for more information.EZConfig for Scanning ToolUse the EZConfig for Scanning tool to configure your scanner Online:1.Go to the Honeywell https://.2.Register (if you haven’t already), then login.3.Browse to Software > Barcode Scanners > Software > Toolsand Utilities > EZConfig for Scanning > Current anddownload the tool.4.Open EZConfig to configure your scanner.Basic SetupHere are some basic menu bar codes that may be useful for test-ing. For more setup options see the N4680/CF4680/CM4680 User Guide (available from your local Honeywell OEM represen-tative).Note:The * symbol indicates the default value.InterfaceFor USB serial interface, you must install the USB driver before connecting your scanner. You can find the most current USB driver at .USB Serial Interface *USB PC KeyboardKeyboard Country Layoutthe default keyboard is United States.United States *FrenchGermanItalianBeeper VolumeLowMediumHigh *OffPresentation ModeThe scanner LEDs remain dim and aimer off until a movement is detected, then the aimer turns on and LEDs light up to read the bar code.There are 2 types: Presentation Mode or Presentation Mode—Extended Reading Range.Presentation Mode: Optimized scan speed, limited reading range.Presentation Mode *Presentation Mode—Extended Reading Range: Optimized read-ing range, low scan speed.Presentation Mode—Extended Reading RangeMobile Phone Read ModeWhen this mode is selected, your scan engine is optimized to read barcodes from mobile phones or other LED displays.Streaming Presentation - Mobile PhoneStreaming PresentationThe scanner LEDs are on all the time (continuous) and the aimer is off until a movement is detected, then the aimer turns on to read the bar code.There are 2 types: Normal or Enhanced.Streaming Presentation—Normal: Fast scan speed, limited reading range.Streaming Presentation Mode—NormalStreaming Presentation—Enhanced: Fastest possible scan speed, slightly less reading range than Normal Streaming Pre-sentation mode.Streaming Presentation—EnhancedReset Factory DefaultsThe following bar code resets factory defaults.Mechanical DimensionsUnits are in millimeters. Tolerances: ±0.5 mm.55482813.21424.48.89.8USB cableMounting HolesUse M3 screws with a maximum depth of 5.8 mm/0.23 in. Max torque 4.5kgf.cm/3.9 lbf.in and pull out resistance 736N.Units are in millimeters. Tolerances ±0.5 mm.2030.544812.5313013.51342015174.542.54447Recommendations•Do not add an exit window over the existing exit window.•For best beeper performance, do not fully cover the beeper opening.•Be sure the cable is fitted tightly in the connector using the cable slider. The cable over mold should not be more than23 mm/0.90 in.Technical SpecificationsMechanicalDimensions28 mm x 55 mm x 48 mm(1.10 in x 2.17 in x 1.89 in])Weight50 g ±5 gInterface USB 2.0ElectricalInput Voltage 5 VDC ±0.25VStandby Current110 mAOperating Current220 mAEnvironmentalOperating Temperature-30°C to 60°C /-22°F to 140°FEnvironmentalStorage Temperature-40°C to 85°C / -40°F to 185°F Humidity 5% to 95% RH, non-condensingScanning PerformanceSensor GlobalShutterResolution640 x 480Illumination White LED IlluminationAimer625 nm visible red LEDMotion Tolerance 6 m/s maxField of View Horizontal = 40° ±1°Vertical = 30° ±1°Scan Angle Pitch = ±50°Skew = ±50°Tilt = 360°Print Contrast20%Reading Distances•Measured from the front center of the housing•25°C, 200 lux for typical, 0 lux for guaranteed •Photographic barcodes•Serial Trigger modeTypicalSymbology Near Far13 mil UPC-A 4.3 cm / 1.7 in38.5 cm / 15.2 in 10 mil Code 39 3.3 cm / 1.3 in35.5 cm / 14 in 20 mil Code 39 6.8 cm / 2.7 in74.2 cm / 29.2 in 20 mil QR Code 3.3 cm / 1.3 in36.2 cm / 14.3 inGuaranteedSymbology Near Far13 mil UPC-A 4.7 cm / 1.9 in37 cm / 14.6 in 10 mil Code 39 4.0 cm / 1.6 in33.8 cm / 13.3 in 20 mil Code 397.2 cm / 2.8 in68.3 cm / 26.9 in 20 mil QR Code 4.2 cm / 1.7 in34.2 cm / 13.5 inCustomer Support and Technical AssistanceFor customer support, contact your local Honeywell Sales Representa-tive or fill out the support form at /us/en/contact-us.Limited WarrantyFor warranty information, go to /us/en/support/ productivity/warranties.PatentsFor patent information, see /us/en/support/patents.DisclaimerHoneywell International Inc. and its affiliates, subsidiaries, and other entities forming part of Honeywell group (“HII”) reserves the right to make changes in specifications and other information contained in this document without prior notice, and the reader should in all cases con-sult HII to determine whether any such changes have been made. The information in this publication does not represent a commitment on the part of HII.Honeywell warrants goods of its manufacture as being free of defective materials and faulty workmanship during the applicable warranty period. Honeywell’s standard product warranty applies unless agreed to otherwise by Honeywell in writing; please refer to your order acknowl-edgment or consult your local sales office for specific warranty details. If warranted goods are returned to Honeywell during the period of cover-age, Honeywell will repair or replace, at its option, without charge those items that Honeywell, in its sole discretion, finds defective. The forego-ing is buyer’s sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Honeywell be liable for consequential, special, or indirect damages. While Honeywell may provide application assistance personally, through our literature and the Honeywell web site, it is buyer’s sole responsibility to determine the suit-ability of the product in the application. Specifications may changewithout notice. The information we supply is believed to be accurate and reliable as of this writing. However, Honeywell assumes no responsibility for its use.This document contains proprietary information that is protected by copyright. All rights are reserved. No part of this document may be pho-tocopied, reproduced, or translated into another language without the prior written consent of HII.Copyright 2021 Honeywell International Inc. All rights reserved.Web Address:/us/en/products/sensing-and-iot Other product names or marks mentioned in this document may be trademarks or registered trademarks of other companies and are the property of their respective owners.。

General DescriptionThe MAX17094 evaluation kit (EV kit) is a fully assem-bled and tested surface-mount PCB that provides the voltages and features required for active-matrix, thin-film transistor (TFT), liquid-crystal displays (LCDs). The EV kit contains a high-performance step-up switching regulator, a 250mA low-dropout (LDO) linear regulator,a high-speed op amp, a digitally adjustable VCOM cali-brator, and seven high-voltage level-shifting buffers for scan-driver applications.The EV kit operates from a DC supply voltage from +1.8V to +5.5V. The step-up switching regulator is con-figured for a +8V output providing at least 300mA from a +2.5V input. The positive charge pump is configured for a +21.5V output providing up to 30mA. The negative charge pump is configured for a -6.5V output providing up to 30mA. The op amp is capable of providing up to ±150mA peak and features a programmable output voltage initially configured for +3.2V. The low-voltage,low-dropout linear regulator can provide at least 250mA. The high-voltage, level-shifting scan driver buffers seven logic inputs and shifts them to a desired level to drive TFT LCD row logic.The MAX17094 EV kit demonstrates low quiescent cur-rent and high efficiency (> 85%) for maximum battery life. Operation at 1.2MHz allows the use of tiny surface-mount components. The MAX17094 thin QFN package (0.8mm max height), with low-profile external compo-nents, allows this circuit to be less than 2mm high.The MAX17094 EV kit provides an on-board I 2C/SMBus™ interface and connects to the computer through the universal serial bus (USB) port. The EV kit includes Windows ®2000/XP ®and Windows Vista ®-compatible software that provides a graphical user interface (GUI) for control of the MAX17094’s programmable features.Featureso +1.8V to +5.5V Input Rangeo Adjustable 450kHz to 1.2MHz Step-Up Switching Frequencyo Output Voltages+8V Output at 300mA (Step-Up Switching Regulator)+21.5V Output at 30mA (Positive Charge Pump)-6.5V Output at 30mA (Negative Charge Pump)+2.5V at 250mA (Linear Regulator)±150mA High-Current Op-Amp Outputo Resistor-Adjustable Switching Regulator and Op-Amp Output Rangeo Digitally Programmable Op-Amp Output Voltage o +30V to -10V High-Voltage Level-Shifting Drivers o > 85% Efficiency (Step-Up Switching Regulator)o On-Board I 2C/SMBus Interface Control through USBo Windows 2000/XP- and Windows Vista (32-Bit)-Compatible Softwareo 2mm Low-Profile Surface-Mount Components o Lead(Pb)-Free and RoHS Compliant o Fully Assembled and TestedEvaluates: MAX17094MAX17094 Evaluation Kit________________________________________________________________Maxim Integrated Products119-4451; Rev 0; 2/09For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .trademarks of Microsoft Corp.Ordering Information+Denotes lead(Pb)-free and RoHS compliant.E v a l u a t e s : M A X 17094MAX17094 Evaluation KitEvaluates: MAX17094MAX17094 Evaluation Kit_______________________________________________________________________________________3µMAX is a registered trademark of Maxim Integrated Products, Inc.E v a l u a t e s : M A X 17094Quick StartRecommended Equipment• 1.8V to 5.5V, 2A DC power supply•User-supplied Windows 2000/XP or Windows Vista PC with a spare USB port •VoltmeterNote: In the following sections, software-related items are identified by bolding. Text in bold refers to items directly from the EV kit software. Text in bold and underlined refers to items from the Windows operating system.ProcedureThe MAX17094 EV kit is fully assembled and tested.F ollow the steps below to verify board operation.Caution: Do not turn on the power supply until all connections are completed.1)Verify that a shunt is installed across jumper JU2.2)Set an external power supply to ≈+3.3V. Connectthe positive terminal of the power supply to the VIN pad. Connect the negative terminal of the power supply to the PGND pads closest to VIN.3)Turn on the power supply and verify that the step-up switching regulator output (MAIN) is +8V.4)Verify that the positive charge-pump supply (VP) isapproximately +24V.5)Verify that the negative charge-pump supply (VN) isapproximately -8.8V.6)Verify that the linear regulator output (VLOGIC) isapproximately 2.5V.7)Visit /evkitsoftware to down-load the latest version of the MAX17094 EV kit soft-ware, MAX17094Rxx.ZIP. Save the EV kit software to a temporary folder and uncompress the ZIP file.8)Install the EV kit software on your computer by run-ning the INSTALL.EXE program inside the tempo-rary folder. The program files are copied and icons are created in the Windows Start | Programs menu.9)Connect the USB cable from the PC to the EV kitboard. A Building Driver Database window pops up in addition to a New Hardware Found message when installing the USB driver for the first time. If you do not see a window that is similar to the onedescribed above after 30 seconds, remove the USB cable from the board and reconnect it.Administrator privileges are required to install the USB device driver on Windows 2000/XP/Vista.10)F ollow the directions of the Add New Hardware Wizard to install the USB device driver. Choose the Search for the best driver for your device option.Specify the location of the device driver to be C:\Program Files\MAX17094(default installation directory) using the Browse button. During device driver installation, Windows may show a warning message indicating that the device driver Maxim uses does not contain a digital signature. This is not an error condition and it is safe to proceed with instal-lation. Refer to the TROUBLESHOOTING_USB.PDF document included with the software for additional information.11)Start the MAX17094 EV kit software by opening its icon in the Start | Programs menu.12)Normal device operation is verified when MAX17094 device connected appears in the status bar on the MAX17094 EV kit main window (Figure 1).13)Verify that the output of the high-speed op amp (VCOM) is approximately +3.2V.MAX17094 Evaluation Kit 4_______________________________________________________________________________________Figure 1. MAX17094 EV Kit Software Main WindowDetailed Description of HardwareThe MAX17094 EV kit contains a high-performance step-up switching regulator, a 250mA LDO, a positive two-stage charge pump, a negative single-stage charge pump, a high-speed op amp, and seven high-voltage level-shifting buffers for scan-driver applica-tions. The EV kit operates from a DC power supply between +1.8V and +5.5V that provides at least 2A.As configured, the step-up switching regulator (VMAIN)generates a +8V output and provides at least 300mA.The step-up switching-regulator output voltage can be adjusted up to +14V with different feedback resistors (see the Output-Voltage Selection section).The GON consists of two positive charge-pump stages to generate approximately +21.5V and provides up to 30mA. The GOF F consists of a single negative charge-pump stage to generate approximately -6.5V and provides up to 30mA. Loading GON and GOF F reduces the available VMAIN current proportionally.The op-amp output (VCOM) is SMBus programmable and is configured for a +2.4V to +4V output-voltage range. VCOM can source or sink peak current up to 150mA. The output-voltage range can be reconfigured to other voltages with voltage-divider resistors R16 and R17. Refer to the Setting the VCOM Adjustment Range section in the MAX17094 IC data sheet for more details.The seven logic-level to high-voltage level-shifting buffers can buffer seven logic inputs (A2–A8) and shift them to a desired level (Y2–Y8) to drive TF T LCD row logic. Each buffer outputs the voltage on the GOFF pin (set through JU1) when its respective input is logic-low.Each buffer (Y2–Y6) outputs the voltage-on GON1 (set through JU3) when its respective input is logic-high.Similarly, Y7 and Y8 output the voltage on GON2 (set through JU4).The seven switches within SW1 are used to select logic levels on A2–A8 for testing purposes. Set each switchopen when driving A2–A8 with external logic. Use jumpers JU14–JU18 to select between capacitive loads on outputs Y2–Y8 and YDCHG for testing purposes.GOFF Power Supply (JU1)The MAX17094 EV kit incorporates jumper JU1 to pro-vide an option to supply the gate-off (GOF F ) supply.GOF F can be supplied either through the on-board negative charge pump (VN) or with an externally applied voltage at the GOF F pad. See Table 1 for jumper JU1 configuration.Enable (JU2)The MAX17094 EV kit incorporates jumper JU2 to enable/disable the IC outputs. When EN is pulled low,the DC-DC converter and op amp are disabled. The high-voltage drivers and LDO will remain active if suffi-cient voltage is available for operation. See Table 2 for jumper JU2 configuration.GON1, GON2 Power Supply (JU3, JU4)The MAX17094 EV kit incorporates jumpers JU3 and JU4 to provide an option to supply the gate-on (GON1,GON2) supplies. GON1 and GON2 can be supplied either through the on-board positive charge pump (VP)or with an externally applied voltage at the respective GON_ pad. See Table 3 for jumpers JU3 and JU4 con-figuration.Evaluates: MAX17094MAX17094 Evaluation Kit_______________________________________________________________________________________5E v a l u a t e s : M A X 17094Level-Shifter Logic-Level Inputs(JU5–JU11)The MAX17094 level-shifter inputs can be supplied either using the on-board logic or from an externally applied signal through configuration of jumpers JU5–JU11. Additionally, when using on-board logic,SW1 controls the logic levels based on its own settings.When SW1 is on, the logic input is high. When SW1 is off, the logic input is pulled low through a 100k Ωpull-down resistor. See Table 4 for jumpers JU5–JU11 con-figuration.Level-Shifter Output Loading (JU14–JU21)The MAX17094 EV kit incorporates jumpers JU14–JU21to provide loading options at the level-shifter outputs,YDCHG and Y2–Y8. See Table 5 for jumpers JU14–JU21configuration.Output-Voltage SelectionThe MAX17094 EV kit’s step-up switching-regulator out-put (VMAIN) is set to +8V by feedback resistors R2 and R3. To generate output voltages other than +8V (up to +14V), select different external voltage-divider resis-tors, R2 and R3. Note that changing the VMAIN voltage setting changes the VN and VP charge-pump output voltages. Refer to the Main Step-Up Regulator and Output-Voltage Selection sections in the MAX17094 IC data sheet for more information.Detailed Description of SoftwareThe MAX17094 device includes a calibrator used for adjusting an LCD’s backplane voltage (VCOM) in TF T LCD displays. The VCOM voltage is adjusted by con-trolling the amount of sink current from a current source connected to the POS terminal of the op amp. This is accomplished by programming the desired setting into the device’s 7-bit internal DAC. The MAX17094 sup-ports four different I 2C slave addresses; configure SW2to select between different addresses. Refer to the MAX17094 IC data sheet for further details.Loading 7-Bit DAC SettingThe DAC setting corresponds to a certain sink-current level, which in turn corresponds to a specific VCOM voltage. With the MAX17094 EV kit software, the device’s 7-bit internal DAC is configured by entering an appropriate DAC setting into the Load DAC edit box.The DAC setting can be set from 0x00 (VCOM MIM ) to 0x7F (VCOM MAX ). The DAC setting is written to the device by pressing the Load DAC button (Figure 1).Reading 7-Bit DACThe MAX17094 7-bit DAC is read by either pressing the Read DAC button or by checking the DAC polling checkbox. When checked, the software continuously reads and displays the DAC’s current setting.Access Control RegisterThe Write To group box is used to select whether volatile (WR) or nonvolatile (IVR) memory is accessed during read and write cycles involving the data register.When the WR/IVR radio button is selected, data on the data register is written to both the WR and IVR. When the WR Only radio button is selected, data on the data register is written to the WR only.Simple SMBus CommandsThere are two methods for communicating with the MAX17094: through the MAX17094 EV kit software main window (F igure 1), or through the interface win-dow available by selecting the Action | Interface Diagnostic Window menu item from the menu bar. The Maxim command module interface window (F igure 2)includes a 2-wire interface tab that allows for execu-tion of the SMBusSendByte(), SMBusReceiveByte(),and SMBusQuick()commands. See Table 6 for details regarding SMBus commands.The Command byte and Data Out combo boxes accept numeric data in binary, decimal, or hexadeci-mal. Hexadecimal numbers should be prefixed by $ or 0x. Binary numbers must be exactly eight digits. See Figure 2 for an illustration of this tool.MAX17094 Evaluation Kit 6_______________________________________________________________________________________Evaluates: MAX17094MAX17094 Evaluation Kit_______________________________________________________________________________________7Figure 2. Command Module Interface WindowTable 6. SMBus CommandsCONTROL SMBus COMMAND FORMATLoad DAC SMBusWriteByte Input the desired 7-bit DAC setting into the Data Out combo box. The 7-bit DAC value should be stored in the lower 7 bits (b6–b0) of the byte; the MSB is ignored.Read DAC SMBusReadByte Receives 8 bits from the device. The lower 7 bits correspond to the current DAC setting and the MSB is ignored.Device searchSMBusQuickSearch for device address shown in the Target Device Address combo box. The MAX17094 device address can be 50, 52, 54, or 56.E v a l u a t e s : M A X 17094MAX17094 Evaluation Kit 8_______________________________________________________________________________________Figure 3a. MAX17094 EV Kit Schematic (Sheet 1 of 3)Evaluates: MAX17094MAX17094 Evaluation Kit_______________________________________________________________________________________9Figure 3b. MAX17094 EV Kit Schematic (Sheet 2 of 3)E v a l u a t e s : M A X 17094MAX17094 Evaluation Kit 10______________________________________________________________________________________Figure 3c. MAX17094 EV Kit Schematic (Sheet 3 of 3)Evaluates: MAX17094MAX17094 Evaluation Kit______________________________________________________________________________________11Figure 4. MAX17094 EV Kit Component Placement Guide—Component SideE v a l u a t e s : M A X 17094MAX17094 Evaluation Kit12______________________________________________________________________________________Figure 5. MAX17094 EV Kit PCB Layout—Component SideMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________13©2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.Evaluates: MAX17094MAX17094 Evaluation KitFigure 6. MAX17094 EV Kit PCB Layout—Solder Side。

6-port sector antenna, 2x 698–960 and 4x 1710–2690 MHz, 65°HPBW, 3x RET with manual override.Integrated Internal Remote Electrical Tilt (RET), with independent control of electrical tilt withmanual override on all arraysOBSOLETEThis product was discontinued on: March 27, 2020General SpecificationsAntenna Type SectorBand MultibandGrounding Type RF connector inner conductor and body grounded to reflector andmounting bracketPerformance Note Outdoor usageRadome Material ASA, UV stabilizedRadiator Material Brass | Low loss circuit boardReflector Material AluminumRF Connector Interface7-16 DIN FemaleRF Connector Location BottomRF Connector Quantity, high band4RF Connector Quantity, low band2RF Connector Quantity, total6Remote Electrical Tilt (RET) InformationRET Interface8-pin DIN Female | 8-pin DIN MaleRET Interface, quantity 3 female | 3 maleInput Voltage10–30 VdcInternal RET High band (2) | Low band (1)Power Consumption, idle state, maximum 2 WPower Consumption, normal conditions, maximum13 WProtocol3GPP/AISG 2.0 (Single RET)16Page ofPage of 26DimensionsWidth 353 mm | 13.898 in Depth 209 mm | 8.228 in Length2065 mm | 81.299 in Net Weight, without mounting kit28 kg | 61.729 lbArray LayoutElectrical SpecificationsImpedance50 ohmOperating Frequency Band 1710 – 2690 MHz | 698 – 960 MHz Polarization±45°Electrical SpecificationsFrequency Band, MHz698–790790–890890–9601710–19201920–21702300–2690 Gain, dBi15.315.516.11818.419.2 Beamwidth, Horizontal,degrees68.268.8636263.362 Beamwidth, Vertical, degrees12.41110.1 5.8 5.1 4.2Beam Tilt, degrees0–100–100–100–100–100–10 USLS (First Lobe), dB181818181814Null Fill, dB-22-22-22-22-22-22Front-to-Back Ratio at 180°,dB252425293331CPR at Boresight, dB171212191615CPR at Sector, dB109.697.1 5.34 Isolation, Cross Polarization,dB252525252525 Isolation, Inter-band, dB303030303030VSWR | Return loss, dB 1.43 | 15.0 1.43 | 15.0 1.43 | 15.0 1.5 | 14.0 1.5 | 14.0 1.5 | 14.0 PIM, 3rd Order, 2 x 20 W, dBc-150-150-150-150-150-150Input Power per Port,maximum, watts300300300250250250 Electrical Specifications, BASTAFrequency Band, MHz698–790790–890890–9601710–19201920–21702300–2690 Gain by all Beam Tilts,average, dBi14.815.115.717.618.118.6Gain by all Beam TiltsTolerance, dB±0.2±0.2±0.2±0.6±0.3±0.6Gain by Beam Tilt, average, dBi 0 ° | 14.95 ° | 14.810 ° | 14.70 ° | 15.15 ° | 15.110 ° | 15.00 ° | 15.75 ° | 15.710 ° | 15.60 ° | 17.65 ° | 17.610 ° | 17.60 ° | 18.05 ° | 18.010 ° | 18.10 ° | 18.65 ° | 18.710 ° | 18.3Beamwidth, HorizontalTolerance, degrees±1.2±2±1.7±2.8±5.4±6.6Beamwidth, VerticalTolerance, degrees±0.8±0.6±0.4±0.3±0.4±0.3USLS, beampeak to 20° abovebeampeak, dB181818181818Front-to-Back Total Power at180° ± 30°, dB25.323.123.623.424.925.4CPR at Boresight, dB16131319181811108755Page of36CPR at Sector, dB11108755 Mechanical SpecificationsWind Loading @ Velocity, frontal926.0 N @ 150 km/h (208.2 lbf @ 150 km/h)Wind Loading @ Velocity, lateral355.0 N @ 150 km/h (79.8 lbf @ 150 km/h)Wind Loading @ Velocity, rear951.0 N @ 150 km/h (213.8 lbf @ 150 km/h)Wind Speed, maximum250 km/h (155 mph)Packaging and WeightsWidth, packed430 mm | 16.929 inDepth, packed325 mm | 12.795 inLength, packed2260 mm | 88.976 inWeight, gross45 kg | 99.208 lbRegulatory Compliance/CertificationsAgency ClassificationCE Compliant with the relevant CE product directivesCHINA-ROHS Above maximum concentration valueISO 9001:2015Designed, manufactured and/or distributed under this quality management system REACH-SVHC Compliant as per SVHC revision on /ProductComplianceROHS Compliant/ExemptedUK-ROHSCompliant/ExemptedIncluded ProductsT-029-GL-E–Adjustable Tilt Pipe Mounting Kit for 2.362"-4.5" (60-115mm) OD round members for panelantennas. Includes 2 clamp sets.* FootnotesPerformance Note Severe environmental conditions may degrade optimum performancePage of46Adjustable Tilt Pipe Mounting Kit for 2.362"-4.5" (60-115mm) OD roundmembers for panel antennas. Includes 2 clamp sets.Product ClassificationProduct Type Adjustable tilt mounting kitGeneral SpecificationsApplication OutdoorColor SilverDimensionsCompatible Length, maximum2850 mm | 112.205 inCompatible Length, minimum1500 mm | 59.055 inCompatible Diameter, maximum115 mm | 4.528 inCompatible Diameter, minimum60 mm | 2.362 inAntenna-to-Pipe Distance85 mm | 3.346 inBracket-to-Bracket Distance1400 mm | 55.118 inWeight, net 6 kg | 13.228 lbMaterial SpecificationsMaterial Type Galvanized steelMechanical SpecificationsMechanical Tilt0°–8°Packaging and WeightsIncluded Brackets | HardwarePackaging quantity1Regulatory Compliance/CertificationsAgency ClassificationCE Compliant with the relevant CE product directives56Page ofCHINA-ROHS Below maximum concentration valueISO 9001:2015Designed, manufactured and/or distributed under this quality management system REACH-SVHC Compliant as per SVHC revision on /ProductCompliance ROHS CompliantUK-ROHSCompliantPage of66。

USER GUIDE iDiskk Max Version:2022-08-001iPhone/iPad Flash Drives⏹Introduction for USB flash drive2in1USB flash drive3/4in1USB flash drive Ports:Lightning+USB3.0connector Lightning+USB3.0+USB C+Micro USBCompatibility:iPhone13/13pro/13pro max/12/12pro/12pro max/11/pro,X/XR/XS/XS/Max5/6/7/8,iPadair,iPad mini,iPad,Macbook(only USB port),computer iPhone13/13pro/13pro max/12/12pro/12pro max/11/pro,X/XR/XS/XS/Max5/6/7/8, Macbook(only USB port),computer,iPadair,iPad mini,iPad,Mac book,computer,Android devices.Storage volume:32/64/128/256G128/256G Apple certified:YES YESMain features:✓Automatic Photo Backup✓Plug and play(watch moviesdirectly from the flash drive)✓Watch your Videos on the Move✓USB3.0High-Speed Transfers✓Works with Most Cases ✓Automatic Photo Backup✓Plug and play(watch movies directlyfrom the flash drive)✓Watch your Videos on the Move✓USB3.0High-Speed Transfers✓Works with Most Cases✓Work with Android devicesContentsFirst use(access settings)....................................................................................................1-3 APP overview.................................................................................................................4-6 Backup Section:(One-tap backup all photos/videos)：. (7)Back Up Settlngs (8)Share single document(PDF,EXCEL,PPT etc)to the hard drive.........................................9-10◆Photos Section:Copy photos........................................................................................................11-15 Organize photos (16)Rename photos....................................................................................................17-18 Share photos........................................................................................................19-20◆Videos Section:Copy videos...........................................................................................................21-25 Organize videos.. (26)Rename videos (27)Share videos...........................................................................................................28-30◆Camera Section:T ake photos/videos and automatic backup to the flash drive Take photos...........................................................................................................31-32 Take videos...........................................................................................................33-34◆File/folder Section:Copy folders......................................................................................................35-36 Organize folders. (37)Rename folders (38)◆Settings:Overview (39)APP encryption.................................................................................................40-43 Folder encryption...........................................................................................44-46 Format.. (47)◆Q&A........................................................................................................48-501123456“1-3”）7Click for selection Browse layout Select “iPhone ”⏹Photos Section:Copy photos1.Click into photos section:2.Select photos:select all or select one by oneCopy to the flash driveShare photos to Email/Socialmedias,BluetoothDelete selectedphotosCancelChoose “External storage”3.Copy selected photos to the flash drive:3.1:Click “Copy to ”3.2:Click“Create folder”3.3:Click“Paste”Organize photosyou can go back to the folder to browse and organize the the photos:Photos will keep original information(data,name)andcan be organized by time,name or type as below:Rename photos1.Go to“File/Folder”section and click into the folder and click“More”:Share photos1.Select photos and then click icon“Share”Max quantity for photos sharing will vary by different third-party media(Facebook,Email,Instagram etc)Click for selection Browse layout Select “iPhone ”⏹Videos Section:Copy videos1.Click into Videossection:1.Select videos:select all or select one by oneDelete selectedphotos CancelCopy to the flash drive Share photos to Email/Social medias,BluetoothChoose “External storage”2.Copy selected videos to the flash drive:3.1:Click “Copy to ”3.2:Click“Create folder”3.3:Click“Paste”Organize videosyou can go back to the folder to browse and organize the the videos:Photos will keep original information(data,name)andcan be organized by time,name or type as below:Rename videosGo to“File/Folder”section and click into the folder and click“More”:Share videosSelect videos and then click icon“Share”Max quantity for photos sharing will vary by different third-party media(Facebook,Email,Instagram etc)⏹Camera Section:Take photos/videos and automatic backup to the flash drive Take photosThe photos will be automatically stored to the flash drive(iDiskk Max),you can go to “Photo”section to browse,when you try to manage them on your PC,please find the folder named as“Camera”.Take videos:The videos will be automatically stored to the flash drive(iDiskk Max),you can go to “Videos”section to browse.When you try to manage them on your PC,please find the folder named as“Camera”.1122123⏹File/folder Section:all folders can be managed here Copy folders:Transfer successfully Transfer successfullyOrganize folders:Rename folders:Settings:Password/touch ID settings/format/Back up Overview⏹App Encryption1.1Touch(Face)ID.A touch(Face)ID is request when open the iDiskk Max app next time.1.2Number Password.A number is request to enter into the APP when open the iDiskk Max next time.1.3Revise number password.Can revise the number password by set a new code(Before set up a new number password,you are supposed to enter old number password first)1.4Not start Encryption.Click not start encryption,no any password is requested when enter into the app.If you forget the password,the only way is to format the iDiskk flash driveDisk Folder Encryption.Insert6-16digital or alphabetic as password to encrypt any folder.Click File/Folder,select the file you want to encrypt44A password is requested next time when open the file which is encrypted.A password is request if close folder encryption function.If you forget the password,the only way is to format the iDiskk flash drive.。

玩转笔记本电脑的超级磁盘加速器——Intel迅盘应用从入门
到精通
afa
【期刊名称】《《微型计算机》》
【年(卷),期】2009(000)016
【摘要】初识——探知迅盘的点滴所谓迅盘，就是Intel提出的Turbo Memory，俗称硬盘加速卡、Robson卡或flash cache module，是英特尔在迅驰技术的传
统三大件处理器、芯片组和无线网卡之后，又附加的一个配件。

【总页数】6页(P138-143)
【作者】afa
【作者单位】
【正文语种】中文
【中图分类】TP332
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因版权原因，仅展示原文概要，查看原文内容请购买。

Assembly Instructions MP-A Microprocessor/System BoardIntroductionThe MP-A board is the primary logic board for the system. It is a 5 1/2” x 9" double sided plated thru hole circuit board containing the 6800 microprocessor chip, the 6830 ROM which stores the Mini-Operating system and the 6810 128 byte scratch pad memory for the ROM. There is a crystal controlled processor clockdriver and baud rate generator providing serial interface baud rates of 110, 150, 300, 600 and 1200 baud for all but the control interface which is operable at 110or 300 baud. The board also contains a power up/manual reset circuit which loadsthe ROM stored operating system when activated. Full I/0 buffering is provided for the 16 address lines and 8 bi-directional data lines with those and other interconnections made to the rest of the system thru a fifty pin connector the mother board (MP-B). +5 volt power for the board is supplied by an on board +5 volt regulator with heatsink at a total current consumption of 0.8 A typical.When the SWTPC 6800 Computer System is being assembled, work on only one board at a time. Each of the system's boards and their associated parts must not be intermixed to avoid confusion during assembly. The MOS integrated circuit supplied with this kit is susceptible to static electricity damage and for this reason has been packed with its leads impressed onto a special conductive foam or possibly wrapped in a conductive foil. In either case, do not remove the protective material until specifically told to do so later in the instructions.PC Board AssemblyNOTE: Since all of the holes on the PC board have been plated thru, it isonly necessary to solder the components from the bottom side of the board. The plating provides the electrical connection from the "BOTTOM" to the "TOP" foil of each hold. Unless otherwise noted it is important that none of the connections be soldered until all of the components of each group have been installed on the board. This makes it much easier to interchange components if a mistake is made during assembly. Be sure to use a low wattage iron (not a gun) with a small tip. Do not use acid core solder or any type of paste flux. We will not guarantee or repair any kit on which either product has been used. Use only the solder supplied withthe kit or a 60/40 alloy resin core equivalent. Remember all of the connections are soldered on the bottom side of the board only. The plated-thru holes provide the electrical connections to the top foil.( ) Before installing any parts on the circuit board, check both sides of the board over carefully for incomplete etching and foil "bridges" or "breaks".It is unlikely that you will find any but should there be one especially on the "TOP" side of the board it will be very hard to locate and correct after all of the components have been installed on the board.( ) Attach the resistors to the board. As with all other components, unless noted, use the parts list and component layout drawing to locate each partand install from the "TOP" side of the board bending the leads along the"BOTTOM" side of the board and trimming so that 1/16" to 1/8" of wireremains. Solder. You should have one lM ohm resistor left over.( ) Install all of the capacitors on the board. Be sure to orient the electrolytic capacitors correctly. The polarity is indicated on the component layout drawing. Solder.( ) Install the transistors on the board. The transistors must be turned to match the outlines on the component Layout drawing. Solder.( ) Attach crystal XTAL1 to the circuit board. It should be oriented so its length lies flat across the circuit board as shown in the outline on thecomponent layout drawing. If the crystal has long thin wire leads, they may be bent down 90 degrees at the base of the crystal so they fit into the two holes provided for the crystal on the circuit board. If the crystal has short heave wire leads, solder onto and at a 90 degree angle, the crystal's leads some heavy buss wire. The buss wire with the crystal attached may then heinserted into the board. In either case the crystal must be attached so its metal case could never inadvertently come into contact with either the foil on the circuit board or either one of its own two leads. Solder.( ) Starting from one end of the circuit board install each of the five, 10 pin Molex female edge connectors along; the lower edge of the board. Theseconnectors must he inserted from the "TOP" side of the board and must bepressed down firmly against the hoard. Make sure the body of the connectorseats firmly against the circuit board and that each pin extends completely into the holes on the circuit boars. Not being careful here will cause theboard to either wobble and/or he crooked when plugged onto the mother board.It is suggested that you solder only the two end pins of each of the fiveconnectors until all have been installed at which time if everything looksstraight and rigid you should solder the as yet unsoldered pins.( ) Insert the small nylon indexing plug into the edge connector pin indicated by the small triangular arrow on the "BOTTOM" side of the circuit board. Thisprevents the board from being accidentally plugged onto the mother boardincorrectly.( ) Install integrated circuits IC5 thru IC16 and IC18 thru IC20 on the circuit board. As each one is installed make sure it is down firmly against the board and solder only two of the leads to hold the pack in place while the otherIC’s are being inserted. Be very careful to install each in its correctposition. Do not bend the leads on the back side of the board. Doing so makes it very difficult to remove the integrated circuits should replacement ever be necessary. The semi-circle notch, dot or bar on the end of the package is used for orientation purposes and must match with the outlines shown on the component layout drawing for each of the IC's. After inserting all of theintegrated circuits go back and solder each of the as yet unsoldered pins.( ) Install integrated circuit IC17 on the circuit board. This component must be oriented so its metal face is facing the circuit board with the small metal heatsink sandwiched between the two. The heatsink and IC are secured to the circuit board with a #4-40 x 1/4" screw, lockwasher and nut. The three leads of the integrated circuit must be bent down into each of their respectiveholes and trimmed, and the heatsink must be oriented as shown in thecomponent layout drawing. Solder.( ) Attach the two zero force integrated circuit sockets to board in the ICI and IC2 positions only. The 40 pin socket goes in the IC1 position while the 24 pin socket goes in the IC2 position. Orient each socket so the corner having the projecting tab is adjacent the pin indicated by the "dot" within theintegrated circuit outline on the component layout drawing. Solder.NOTE: MOS integrated circuits are susceptible to damage by staticelectricity. Although some degree of protection is provided internally within the integrated circuits, their cost demands the utmost in care. Before opening and/or installing any MOS integrated circuits you should ground your body and all metallic tools coming into contact with the leads, thru a 1 M ohm 1/4 watt resistor(supplied with the kit). The ground must be an "earth" ground such as a water pipe, and not the circuit board ground. As for the connection to your body, attach a clip lead to your watch or metal ID bracelet. Make absolutely sure you have the 1 Meg ohm resistor connected between you and the "earth" ground, otherwise you will be creating a dangerous shock hazard. Avoid touching the leads of the integrated circuits any more than necessary when installing them, even if you are grounded. On those MOS IC's being soldered in place, the tip of the soldering iron should be grounded as well (separately from your body ground) either with or without a 1 Meg ohm resistor. Most soldering irons having a three prong line cord plug already have a grounded tip. Static electricity should be an important consideration in cold,dry environments. It is less of a problem when it is warm and humid.( ) Install MOS integrated circuits IC3 and IC4 following the precautions given in the preceding section. As it is installed, make sure it is down firmlyagainst the board before soldering all of its leads. Do not bend the leads on the back side-of the board. Doing so makes it very difficult to remove theintegrated circuit should replacement ever be necessary. The "dot" or "notch"on the end of the package is used for orientation purposes and must matchwith that shown on the component layout drawing for the IC.( ) Working from the "TOP" side of the circuit board, fill in all of the feed thru's with molten solder. The feed-thru's are those unused holes on theboard whose internal plating connects the "TOP" and "BOTTOM" circuitconnections. Filling these feed-thru's with molten solder guarantees theintegrity of the connections and increases the current handling capability.( ) Now that all of the components have been installed on the board, double check to make sure all have been installed correctly in their proper location. ( ) Check very carefully to make sure that all connections have been soldered. It is very easy to miss some connections when soldering which can really cause some hard to find problems later during checkout. Also look for solder"bridges" and "cold" solder joints which are another common problem.This completes the assembly phase for the MP-A board. Integrated circuits ICI and IC2 should not be installed until the board goes thru a preliminary checkout detailed in the System Checkout Instructions supplied with the MP-B mother board kit. The System Checkout Instruction are used after having assembled the MP-A Microprocessor/System Board, MP-B mother board, MP-C serial, control interface, and the MP-P power supply.Since the MP-A circuit board now contains MOS devices it is susceptible to damage from severe static electrical sources. One should avoid handling the board any more than necessary and when you must, avoid touching or allowing anything to come into contact with any of the conductors on the board.How It WorksThe entire 6800 Computer System is built around IC1, the 6800 Microprocessor Unit (MPU). Most of the components within the system are used to provide the clocks, buffering and decoding necessary to interface to this integrated circuit. Complete details of the operation and specifications of IC1 are contained in the 6800 Hardware section of the System Documentation Notebook and will not be repeated here.Integrated circuit IC2 is a 1024 x 8 bit read only memory (ROM) which permanently stores the computer's mini-operating system described in the Operating System section of the System Documentation Notebook. Whenever the computer systemis first powered up or when the front panel RESET switch is depressed the computer jumps to this operating system firmware (programming stored in ROM) which gives the user terminal control. Since the mini-operating system uses only 512 words of the ROM, the upper 512 words have been disabled from access and the ROM operating system addresses have been located from E000 to E1FF inclusive.The ROM stored mini-operating requires a small amount of random access memory (RAM) for operation. It uses IC3, a 128 x 8 bit static memory. What is nice here is that a large portion of the RAM memory addresses are unassigned which means many short programs such as the diagnostics can be loaded right into the operating system RAM without using any of the large MP-M static memory cards. Complete information regarding the unassigned RAM locations is contained in the Operating System section of the System Documentation Notebook.IC4 is the crystal controlled clock/baud rate generator. It produces the five baud rate clock frequencies required by the control and serial interfaces. It also generates a clock which is divided by two by half of IC20, split into twonon-overlapping phases by IC18 and IC19 buffered by transistors Q1 thru Q4 and sent onto IC1, the MPU chip. IC14 provides the buffering for each of the used outputs on baud rate generator IC4.Timer integrated circuit IC11 is responsible for generating the power up/ manual pushbutton RESET which loads the mini-operating system stored in the ROM,IC2.Half of D flip flop, IC20 is used for timed halting of the processor indirect memory access (DMA) applications.Integrated circuits ICS, IC6 and IC7 are used as non-inverting address line buffers for each of the sixteen address lines. Integrated circuits IC8 and IC9 are inverting bi-directional transceiver buffers for the system's eight bi-directional data lines. The gates feeding the enable lines of the transceiver IC's guaranteethe appropriate receive or transmit data buss buffers are enabled at the proper time.+5 VDC power for the board is supplied by voltage regulator IC17.Parts List MP-A Microprocessor/System BoardResistorsR1, R2, R4 1M ohm 1/4 watt resistorR3, R7, R12, R13 10K ohm 1/4 watt resistorR5, R6 6.8K ohm 1/4 watt resistorR8, R9, R19 1K ohm 1/4 watt resistorR10, R11 4.7K ohm 1/4 watt resistorR14, R17 10 ohm 1/4 watt resistorR15, R16 22 ohm 1/4 watt resistorR18 470 ohm 1/4 watt resistorCapacitorsC1, C2, C4, C14, C15 0.1 mfd disc. capacitorC3 100 mfd @15 VDC electrolytic capacitor C5 0.01 mfd mylar capacitorC6 0.1 mfd mylar capacitorC7 0.47 mfd tantalum capacitorC8 1000 pF polystyrene capacitorC9, C10 33 pfd polystyrene capacitorC11, C12 120 pfd polystyrene capacitorC13 1000 pfd polystyrene capacitorSemiconductorsIC-1 MC6800 MPU (MOS)IC-2 MC6830L7 ROM (MOS)IC-3 MC6810L-1 RAM (MOS)IC-4 MC14411 Baud Rate Generator (MOS)IC-5, IC-6, IC-7 DM8097 Hex Tri-State BufferIC-8, IC9 DM8835 Quad Bi-directional Transceiver IC-10 7404 Hex InverterIC-11 555 or 1455 TimerIC-12, IC-13 7400 Quad NAND gateIC-14 74L04 HP Hex InverterIC-15 DM8098 Hex Tri-State BufferIC-16 7420 Dual 4-Input MAND GateIC-17 7805 +5 VDC Voltage RegulatorIC-18 74H00 HS Quad NAND GateIC-19 74H08 HS Quad AND GateIC-20 7474 Dual "D" Flip-FlopQ1, Q2 2N5087 transistorQ3, Q4 2N5210 transistorMisc.XTAL 1 1.7971 MHz Parallel Resonant Crystal。

Instruction on Centering Phase Contrast and Dispersion Staining Condenser and Properly Achieving Koehler illuminationFor Meiji Techno America models MT6130, MT6120, MT6820, MT6830Step 1: Need to align the ring slip when using dispersion staining objective. Please find attached sim-ple manual belowStep 2: When dispersion staining objective is used, only polarizer have to engage. Analyzer must re-move from the slot.(Also check the prepared sample slide if it was expired because that can change the colour as it use reflective index 1.550 that has an expiry date.)How to get proper color with Chrysotile Sample•Make sure rotatable swing out polarizer located on the lamp house is properly made the orientation in cross polar.•Make the condenser alignment.Then you will get a right blue and magenta colour.Note: Please note that stage is not centerable, instead of the stage use two short drivers to center the ob-jective from the nosepiece. Strain free objective 10X in fix position and objectives must install in centerable nosepiece position.Note: Please refer to the Section 1.0 to center the objectives and Section 2.0 to adjust the koehler light on the next pages of this manual.1.0 Centering the ObjectivesWhen objectives are not centered, specimens may leave the field of view when rotating the stage. Perform the steps below if objectives are not centered properly:1. Before starting, make sure that the 10X objective is installed in the fixed hole of the nosepiece.This is the position that does NOT have centering screws. All objectives will be adjusted against the 10X position.2. Make sure the Bertrand Lens, the analyzer and any other sliders are clear of the optical pathand the iris on the illuminator is open all the way.3. Use a small grain or some type of target and place it in the center of the field of view with the10X objective and bring it into focus as shown below in “A”.4. Center the target by rotating the stage and evaluatng how centered the target appears.5. Once the target is centered, move to the next highest objective and insert the centering keysinto the nosepiece for that position.6. Bring the specimen again into focus and note its position in the field of view.7. Rotate the stage until the target moves farthest away from the crossline at the as shown belowin “D” (Position 1).8. Adjust the centering screws on the nosepiece until the target is midway between Position 1 andthe crossline as shown in “D”9. Rotate the stage and evaluate centricity. One may need to repeat this procedure until the targetstays in the center of the crossline when the stage is rotated (“D”).Repeat these steps for all other objectives in the nosepiece. To maintain centering, it is important that objectives be handled very gently and only touched on the knurled portion when changing objectives.2.0 Achieving Koehler Illumination• Turn on the miscroscope Power switch and set the illumination to a comfortable level.• Establish one field of view by adjusting the inter-pupillary distance of the Siedentopf viewing head.• Make sure that the Bertrand Lens, analyzer and any other sliders are clear of the optical path and that the iris diaphragm on the condenser is all the way open.• Rack up the condenser to its highest position or until the top element of the condenser is approximately 1mm below the bottom of the slide.• Place a familiar specimen on the stage. Using the 10X objective, bring the specimen into focus.• While viewing the specimen, close down the field diaphragm just enough so that the inner edge of the iris leaves are visible as shown in figure “A”.• Use the condenser focusing knob to slightly lower the condenser to bring the edge of the iris leaves into sharp focus as shown in figure “B”.• By using the two condenser centering screws, adjust the iris opening so it is centered in the middle of the field of view as shown in figure “C”.• Open up the field diaphragm so that it just clears the edge of the field of view as shown in figure “D”.After slidinging into corresponding objectivemagnification such as Dispersion 10X orU plan Phase 40X, remove one eyepiece,replace with Centering Teclescope, then usingtwo centering screws, please align the ring slitto match the phase plate of the objectives.Centering screwsPush left for10X DispersionPush right forPhase 40XTECHNO Saitama 354-0043, JapanInstruction on centering phase contrast and dispersion staining condenserTECHNOSaitama 354-0043, JapanCentering screwsPush left for 10X DispersionPush right for Phase 40XAfter slidinging into corresponding objective magnification such as Dispersion 10X or U plan Phase 40X, remove one eyepiece, replace with Centering Teclescope, then using two centering screws, please align the ring slit to match the phase plate of the objectives.。