LME49811TB中文资料

⽤LME49810制作⾼性能功率放⼤器距离第⼀篇⽂章发表已有好长⼀段时间了（因⼥⼉出⽣），现在我的⼩⼥⼉已经1岁多，所以我的制作和研究⼜可以继续了。

在第⼀篇⽂章中，曾推荐了⼀款采⽤国半⾼性能驱动芯⽚LME49810的功放。

这块芯⽚的性能已经在不同负载下测量过。

得出的建议是，驱动级必须要为输出级提供⾜够的驱动电流，输出级由此选择 ON（安森美）的NJL3281D/1302D。

这对管⼦由于内含偏置⼆极管，具有同时实现热补偿功能，因此传统的Vbe倍乘器就可以取消了。

在本⽂中主要介绍电源部分的设计及如何借助仪器监测功放的THD（总谐波失真加噪声）指标、如何⽤频谱分析的⽅法来调整功放的静态电流⾄最佳值，最后部分是功放的性能测试结果，其中包括了THD测试、IMD测试和⽅波测试。

⼀、电源设计本功放设计在8Ω负载上⾄少有120W输出。

这样，每个输出级晶体管将分担1.9A的有效值电流（本功放使⽤了两对管⼦）。

从NJL3281D/1302D的资料可知，其V ce的线性⼯作区的最⼩值是5V，这样要满⾜满功率输出，电源电压(V+、V-)⾄少要达到49V，其计算如下：P out＝120(W)＝I 2out×8＝V 2out /8Iout＝ 120/8= 15≈3.87(A)V +=V - ＝ 120×8× 2+5≈49(V)电源部分电路如图1所⽰。

V+ 及V-在满功率输出状态起码要49V，加上变压器的损耗和纹波，我们选择了未经稳压的±55V，此时变压器次级电压为交流39V。

桥堆中的⼆极管在⼤电流状态下会有约1V的压降，同时我们也必须考虑市电电压的变化，这样，就需要⼀个双0~42V次级电压绕组的变压器，且次级必须要能提供4A的有效值电流。

如果你希望在4Ω负载上得到翻倍的输出功率，就必须要有⼀个满⾜8A电流的变压器！光有⼤变压器还不⾏，⼤⽔塘式电容也是必要的。

我使⽤了两个桥堆（B1、B2）来组成双桥全波整流，这样DC 0V 也包含在整流回路中。

February 2007LME49740Quad High Performance, High Fidelity Audio Operational AmplifierGeneral DescriptionThe LME49740 is part of the ultra-low distortion, low noise,high slew rate operational amplifier series optimized and fully specified for high performance, high fidelity bining advanced leading-edge process technology with state-of-the-art circuit design, the LME49740 audio opera-tional amplifiers deliver superior audio signal amplification for outstanding audio performance. The LME49740 combines extremely low voltage noise density (2.7nV/√HZ) with van-ishingly low TH D+N (0.00003%) to easily satisfy the most demanding audio applications. To ensure that the most chal-lenging loads are driven without compromise, the LME49740has a high slew rate of ±20V/μs and an output current capa-bility of ±26mA. Further, dynamic range is maximized by an output stage that drives 2k Ω loads to within 1V of either power supply voltage and to within 1.4V when driving 600Ω loads.The LME49740's outstanding CMRR(120dB), PSRR(120dB),and V OS (0.1mV) give the amplifier excellent operational am-plifier DC performance.The LME49740 has a wide supply range of ±2.5V to ±17V.Over this supply range the LME49740’s input circuitry main-tains excellent common-mode and power supply rejection, as well as maintaining its low input bias current. The LME49740is unity gain stable. The Audio Operational Amplifier achieves outstanding AC performance while driving complex loads with values as high as 100pF.The LME49740 is available in 14–lead narrow body SOIC and 14–lead plastic DIP. Demonstration boards are available for each package.Key Specifications■ Power Supply Voltage Range ±2.5V to ±17V■ THD+N (A V = 1, V OUT = 3V RMS , f IN = 1kHz)R L = 2k Ω0.00003% (typ) R L = 600Ω0.00003% (typ)■ Input Noise Density 2.7nV/√Hz (typ)■ Slew Rate±20V/μs (typ)■ Gain Bandwidth Product 55MHz (typ)■ Open Loop Gain (R L = 600Ω)140dB (typ)■ Input Bias Current 10nA (typ)■ Input Offset Voltage 0.1mV (typ)■ DC Gain Linearity Error0.000009%Features■Easily drives 600Ω loads■Optimized for superior audio signal fidelity ■Output short circuit protection■PSRR and CMRR exceed 120dB (typ)■SOIC and DIP packagesApplications■Ultra high quality audio amplification ■High fidelity preamplifiers ■High fidelity multimedia■State of the art phono pre amps■High performance professional audio■High fidelity equalization and crossover networks ■High performance line drivers ■High performance line receivers ■High fidelity active filters© 2007 National Semiconductor Corporation LME49740 Quad High Performance, High Fidelity Audio Operational AmplifierTypical Application20210502FIGURE 1. Passively Equalized RIAA Phono PreamplifierConnection Diagram20210501Order Number LME49740MA See NS Package Number — M14A Order Number LME49740NA See NS Package Number — N14A 2L M E 49740Absolute Maximum Ratings (Notes 1, 2)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.Power Supply Voltage (V S = V + - V -)36VStorage Temperature −65°C to 150°CInput Voltage(V-) - 0.7V to (V+) + 0.7VOutput Short Circuit (Note 3)Continuous Power DissipationInternally LimitedESD Susceptibility (Note 4)2000V ESD Susceptibility (Note 5)200V Junction Temperature 150°CThermal Resistance θJA (MA)107°C/W θJA (NA)74°C/WTemperature RangeT MIN ≤ T A ≤ T MAX –40°C ≤ T A ≤ 85°C Supply Voltage Range±2.5V ≤ V S ≤ ± 17VElectrical Characteristics(Notes 1, 2)The following specifications apply for V S = ±15V, R L = 2k Ω, f IN = 1kHz,and T A = 25C, unless otherwise specified.SymbolParameterConditionsLME49740Units (Limits)Typical Limit (Note 6)(Notes 7, 8)THD+NTotal Harmonic Distortion + NoiseA V = 1, V OUT = 3V RMSR L = 2k Ω R L = 600Ω0.000030.000030.00009% (max)% (max)IMD Intermodulation Distortion A V = 1, V OUT = 3V RMSTwo-tone, 60Hz & 7kHz 4:10.00005 % (max)GBWP Gain Bandwidth Product 5545MHz (min)SR Slew Rate±20±15V/μs (min)FPBWFull Power BandwidthV OUT = 1V P-P , –3dBreferenced to output magnitude at f = 1kHz10MHzt sSettling timeA V = 1, 10V step, C L = 100pF 0.1% error range 1.2μs e nEquivalent Input Noise Voltagef BW = 20Hz to 20kHz 0.340.65μV RMSEquivalent Input Noise Density f = 1kHz f = 10Hz 2.76.4 4.7 nV /√Hz nV /√Hz i n Current Noise Density f = 1kHz f = 10Hz 1.63.1 pA /√Hz pA /√HzV OSOffset Voltage±0.1±0.7mV (max)ΔV OS /ΔTemp Average Input Offset Voltage Drift vsTemperature40°C ≤ T A ≤ 85°C0.2 μV/°C PSRR Average Input Offset Voltage Shift vsPower Supply Voltage ΔV S = 20V (Note 9)120110dB (min)ISO CH-CH Channel-to-Channel Isolation f IN = 1kHz f IN = 20kHz 118112 dB dB I BInput Bias Current V CM = 0V1072nA (max)ΔI OS /ΔTemp Input Bias Current Drift vs Temperature –40°C ≤ T A ≤ 85°C 0.1 nA/°C I OS Input Offset CurrentV CM = 0V1165nA (max)V IN-CM Common-Mode Input Voltage Range +14.1–13.9(V+)–2.0(V-)+2.0V (min)V (min)CMRR Common-Mode Rejection –10V<V CM <10V 120110dB (min)Z INDifferential Input Impedance30 k ΩCommon Mode Input Impedance –10V<V CM <10V1000 M ΩA VOLOpen Loop Voltage Gain–10V<V OUT <10V, R L = 600Ω140 dB (min)–10V<V OUT <10V, R L = 2k Ω140 dB (min)–10V<V OUT <10V, R L = 10k Ω140125dB (min)3LME49740SymbolParameterConditionsLME49740Units (Limits)Typical Limit (Note 6)(Notes 7, 8)V OUTMAX Maximum Output Voltage Swing R L = 600Ω±13.6±12.5V (min)R L = 2k Ω±14.0 V (min)R L = 10k Ω±14.1 V (min)I OUT Output Current R L = 600Ω, V S = ±17V ±26±23mA (min)I OUT-CC Short Circuit Current+30–38 mA mAR OUT Output Impedancef IN = 10kHz Closed-Loop Open-Loop 0.0113ΩΩC LOAD Capacitive Load Drive Overshoot 100pF 16 %I STotal Quiescent CurrentI OUT = 0mA18.520mA (max)Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Note 2:Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.Note 3:Amplifier output connected to GND, any number of amplifiers within a package.Note 4:Human body model, 100pF discharged through a 1.5k Ω resistor.Note 5:Machine Model ESD test is covered by specification EIAJ IC-121-1981. A 200pF cap is charged to the specified voltage and then discharged directly into the IC with no external series resistor (resistance of discharge path must be under 50Ω).Note 6:Typical specifications are specified at +25ºC and represent the most likely parametric norm.Note 7:Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).Note 8:Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.Note 9:PSRR is measured as follows: V OS is measured at two supply voltages, ±5V and ±15V. PSRR = |20log(ΔV OS /ΔV S )|. 4L M E 49740Typical Performance CharacteristicsTHD+N vs Output Voltage V CC = 15V, V EE = –15V, R L = 2k Ω20210515THD+N vs Output Voltage V CC = 17V, V EE = –17V, R L = 2k Ω20210516THD+N vs FrequencyV CC = 15V, V EE = –15V, R L = 2k Ω, V OUT = 3V RMS 20210511THD+N vs FrequencyV CC = 17V, V EE = –17V, R L = 2k Ω, V OUT = 3V RMS20210513THD+N vs FrequencyV CC = 15V, V EE = –15V, R L = 600Ω, V OUT = 3V RMS 20210512THD+N vs FrequencyV CC = 17V, V EE = –17V, R L = 600Ω, V OUT = 3V RMS20210514LME49740IMD vs Output VoltageV CC = 15V, V EE = –15V, R L = 2k Ω20210553IMD vs Output VoltageV CC = 17V, V EE = –17V, R L = 2k Ω20210554PSRR+ vs Frequency V CC = 15V, V EE = –15V,R L = 2k Ω, V RIPPLE = 200mVpp20210559PSRR- vs FrequencyV CC = 15V, V EE = –15V, R L = 2k ΩR L = 2k Ω, V RIPPLE = 200mVpp20210560CMRR vs FrequencyV CC = 15V, V EE = –15V, R L = 2k Ω20210552Crosstalk vs Frequency V CC = 15V, V EE = –15V, R L = 2k Ω20210519 6L M E 49740Output Voltage vs Supply VoltageRL= 2kΩ, THD+N = 1%20210518Output Voltage vs Load ResistanceTHD+N = 1%20210517Supply Current vs Supply VoltageRL= 2kΩ, THD+N = 1%20210507Full Power Bandwidth vs Frequency20210520Gain Phase vs Frequency20210551Voltage Noise Density vs Frequency20210557LME49740Small-Signal Transient ResponseA V = 1, C L = 100pF20210556Large-Signal Transient ResponseA V = 1, C L = 100pF20210555 8L M E 49740Application InformationDISTORTION MEASUREMENTSThe vanishingly low residual distortion produced by LME49740 is below the capabilities of all commercially avail-able equipment. This makes distortion measurements just slightly more difficult than simply connecting a distortion me-ter to the amplifier’s inputs and outputs. The solution, how-ever, is quite simple: an additional resistor. Adding this resistor extends the resolution of the distortion measurement equipment.The LME49740’s low residual distortion is an input referred internal error. As shown in Figure 2, adding the 10Ω resistor connected between the amplifier’s inverting and non-inverting inputs changes the amplifier’s noise gain. The result is that the error signal (distortion) is amplified by a factor of 101. Al-though the amplifier’s closed-loop gain is unaltered, the feed-back available to correct distortion errors is reduced by 101, which means that measurement resolution increases by 101. To ensure minimum effects on distortion measurements, keep the value of R1 low as shown in Figure 2.This technique is verified by duplicating the measurements with high closed loop gain and/or making the measurements at high frequencies. Doing so produces distortion compo-nents that are within the measurement equipment’s capabili-ties. This datasheet’s THD+N and IMD values were generat-ed using the above described circuit connected to an Audio Precision System Two Cascade.20210562FIGURE 2. THD+N and IMD Distortion Test Circuit LME49740Application HintsThe LME49740 is a high speed op amp with excellent phase margin and stability. Capacitive loads up to 100pF will cause little change in the phase characteristics of the amplifiers and are therefore allowable.Capacitive loads greater than 100pF must be isolated from the output. The most straightforward way to do this is to put a resistor in series with the output. This resistor will also pre-vent excess power dissipation if the output is accidentally shorted.Noise Measurement Circuit20210527Complete shielding is required to prevent induced pick up from external sources. Always check with oscilloscope for power line noise.Total Gain: 115 dB at f = 1 kHzInput Referred Noise Voltage: e n = V O /560,000 (V)RIAA Preamp Voltage Gain,RIAA Deviation vs Frequency V IN = 10mV, A V = 35.0dB, f = 1kHz20210528Flat Amp Voltage Gain vs Frequency V O = 0dB, A V = 80.0dB, f = 1kHz20210529 10L M E 49740Typical ApplicationsNAB Preamp20210530A V = 34.5F = 1 kHz E n = 0.38 μV A WeightedNAB Preamp Voltage Gain vs FrequencyV IN = 10mV, A V = 34.5dB, f = 1kHz20210531Balanced to Single Ended Converter 20210532V O = V1–V2Adder/Subtracter20210533V O = V1 + V2 − V3 − V4Sine Wave Oscillator20210534LME49740Second Order High Pass Filter(Butterworth)20210535Illustration is f= 1 kHzSecond Order Low Pass Filter(Butterworth)20210536Illustration is f= 1 kHzState Variable Filter20210537 12LME4974AC/DC Converter202105382 Channel Panning Circuit (Pan Pot)20210539Line Driver20210540Tone Control20210541LME4974020210542RIAA Preamp20210503A v = 35 dB E n = 0.33 μV S/N = 90 dB f = 1 kHz A WeightedA Weighted, V IN = 10 mV @f = 1 kHz 14L M E 49740Balanced Input Mic Amp20210543Illustration is:V0 = 101(V2 − V1)LME4974010 Band Graphic Equalizer20210544fo (Hz)C 1C 2R 1R 2320.12μF 4.7μF 75k Ω500Ω640.056μF 3.3μF 68k Ω510Ω1250.033μF 1.5μF 62k Ω510Ω2500.015μF 0.82μF 68k Ω470Ω5008200pF 0.39μF 62k Ω470Ω1k 3900pF 0.22μF 68k Ω470Ω2k 2000pF 0.1μF 68k Ω470Ω4k 1100pF 0.056μF 62k Ω470Ω8k 510pF 0.022μF 68k Ω510Ω16k330pF0.012μF51k Ω510ΩNote 10:At volume of change = ±12 dB Q = 1.7 Reference: “AUDIO/RADIO HANDBOOK”, National Semiconductor, 1980, Page 2–61 16L M E 49740LME49740 Revision HistoryRev Date Description1.002/28/07Initial WEB release.Physical Dimensions inches (millimeters) unless otherwise notedDual-In-Line Package Order Number LME49740MA NS Package Number M14ADual-In-Line Package Order Number LME49740NA NS Package Number N14A18L M E 49740LME49740NotesL M E 49740 Q u a d H i g h P e r f o r m a n c e , H i g h F i d e l i t y A u d i o O p e r a t i o n a l A m p l i f i e rTHE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF TH E CONTENTS OF TH IS PUBLICATION AND RESERVES TH E RIGH T TO MAKE CH ANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITH OUT NOTICE. NO LICENSE, WH ETH ER EXPRESS,IMPLIED, ARISING BY ESTOPPEL OR OTH ERWISE, TO ANY INTELLECTUAL PROPERTY RIGH TS IS GRANTED BY TH IS DOCUMENT.TESTING AND OTH ER QUALITY CONTROLS ARE USED TO TH E EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WH ERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR TH EIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS TH AT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WH ATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO TH E SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCH ANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGH T OR OTH ER INTELLECTUAL PROPERTY RIGHT.LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders.Copyright© 2007 National Semiconductor CorporationFor the most current product information visit us at National Semiconductor Americas Customer Support Center Email:new.feedback@ Tel: 1-800-272-9959National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530-85-86Email: europe.support@ Deutsch Tel: +49 (0) 69 9508 6208English Tel: +49 (0) 870 24 0 2171Français Tel: +33 (0) 1 41 91 8790National Semiconductor Asia Pacific Customer Support Center Email: ap.support@National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507Email: jpn.feedback@ Tel: 81-3-5639-7560。

值得一做的LME49830TB功放DIY全程记录LME49830TB这个线路很好，十分稳定绝不自激。

自认为精简的是没有用的或起反作用的。

试音条件简陋，音源：电脑无损音频文件，安桥SE90声卡。

音箱：天音发烧级6寸落地，高低音均为英国博声单元。

主观听觉良好，信噪比极高。

高音纤细，铁三角碰钟等细微的极高音清晰可辨丝丝入耳。

中高音明亮不燥人声亲切细腻即所谓“口水满地”，因中高音比较完美而人声乐器定位比较清楚。

中低音强劲有力弹性十足，收放自如。

大音量重低音感觉有些收不住，也可能是由于供电电压比较低，因试机用散热器仅1.6KG电流也没有调大，单管100ma左右，放大器功率不够大且电源只用一组的缘故，这个问题比较容易解决。

感觉还是低音太重，也可能是我听音偏好，喜欢听女声。

耦合电容用魏玛4.7uf MKP10两个并联与一个4.7uf均有此问题。

减少耦合电容容量可以缓解，耦合电容1uf低音已经很满意了，我用的是ERO-MKP-0.36两个并联为0.72uf，爱好音乐的友人来做客帮忙试听也认为低音已经够足。

为什么可以用这么小？也许是我的音源与音箱的原因需要耦合电容小？不知。

耦合电容挺关键，应反复更换调试。

试机时推动与末级均用一组供电，两个变压器。

电源电原理图与实际接线图，见图：断开图中叉处，变成一个变压器把推动与末级共用一组电源。

由末级供电通过两个二极管连接到推动级供电（虚线处）试听也没感觉有什么不妥，信噪比一样的高，夜深人静的时候离音箱喇叭很近也听不到任何噪音，也许是我早过花甲真的耳背了？另外，我用自耦变压器与调压器配合将末级供电电压调到50V推动级调到55V感觉更好，控制力更强。

前边已经说了C1耦合电容问题，再说C2输入旁路。

我试用82P、180P、220P、330P没有太大改变，最后选用180P银云母。

C3偏置电路电容，有的电路用到最大0.1uf也有用20P的，我实验可以不接也没有发现有什么不妥，国半的原文说明是“不带补偿的偏置电路只是在LME49830的偏置引脚之间连接一个电阻或电位器和一到两个电容器”K1058/J162是负温度系数音响专用管，就可以不加温补，可是国半他不说明白数值让你猜。

LME49810LME49810 200V Audio Power Amplifier Driver with Baker ClampLiterature Number: SNAS391B芯天下--/September 2007 LME49810200V Audio Power Amplifier Driver with Baker ClampGeneral DescriptionThe LME49810 is a high fidelity audio power amplifier driver designed for demanding consumer and pro-audio applica-tions. Amplifier output power may be scaled by changing the supply voltage and number of power transistors. The LME49810’s minimum output current is 50mA. When using a discrete output stage the LME49810 is capable of delivering in excess of 300 watts into a single-ended 8Ω load.Unique to the LME49810 is an internal Baker Clamp. This clamp insures that the amplifier output does not saturate when over driven. The resultant “soft clipping” of high level audio signals suppresses undesirable audio artifacts gener-ated when conventional solid state amplifiers are driven hard into clipping.The LME49810 includes thermal shutdown circuitry that ac-tivates when the die temperature exceeds 150°C. The LME49810’s mute function, when activated, mutes the input drive signal and forces the amplifier output to a quiescent state.Key Specifications■ Wide operating voltage range±20V to ±100V ■ Slew Rate50V/μs (typ)■ Output Drive Current60mA (typ)■ PSRR (f = DC)110dB (typ)■ THD+N (f = 1kHz)0.0007 (typ)Features■Very high voltage operation■Output clamp logic output■Thermal shutdown and mute■Customizable external compensation■Scalable output powerApplications■Guitar amplifiers■Powered studio monitors■Powered subwoofers■Pro audio■Audio video receivers■High voltage industrial applicationsBoomer® is a registered trademark of National Semiconductor Corporation.Tru-GND is a trademark of National Semiconductor Corporation.© 2007 National Semiconductor LME49810 200V Audio Power Amplifier Driver with Baker ClampTypical Application20216772FIGURE 1. LME49810 Audio Amplifier Schematic 2L M E 49810Connection DiagramTB Package20216702Top ViewOrder Number LME49810TBSee NS Package Number TB15AN = National LogoU = Fabrication plant codeZ = Assembly plant codeXY = 2 Digit date codeTT = Die traceabilityTB = Package codePin DescriptionsPin Pin Name Description1ClpFlag Baker Clamp Clip Flag Output2Mute Mute Control3GND Device Ground4IN+Non-Inverting Input5IN–Inverting Input6Comp External Compensation Connection7NC No Connect, Pin electrically isolated8Osense Output Sense9NC No Connect, Pin electrically isolated10–VEENegative Power Supply11BiasMNegative External Bias Control12BiasPPositive External Bias Control13Sink Output Sink14Source Output Source15+VCCPositive Power Supply LME498101894EML20216708FIGURE 2. LME49810 Simplified Schematic 4Absolute Maximum Ratings (Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage |V+| + |V-|200V Differential Input Voltage±6VCommon Mode Input Range0.4VEE to 0.4VCCPower Dissipation (Note 3)4W ESD Susceptibility (Note 4)1kV ESD Susceptibility (Note 5)200V Junction Temperature (TJMAX) (Note 9)150°C Soldering InformationT Package (10 seconds)260°C Storage Temperature–40°C to +150°C Thermal Resistance θJA73°C/W θJC4°C/WOperating RatingsTemperature RangeTMIN≤ TA≤ TMAX−40°C ≤ T A≤ +8 5°CSupply Voltage±20V ≤ VSUPPLY≤ ±100VElectrical Characteristics VCC = +100V, VEE= –100V (Notes 1, 2)The following specifications apply for IMUTE = 100μA, unless otherwise specified. Limits apply for T A = 25°C, C C = 10pF, and A V =29dB.Symbol Parameter ConditionsLME49810Units(Limits) Typical(Note 6)Limits(Notes 7, 8)ICCQuiescent Power Supply Current V CM = 0V, V O = 0V, I O = 0A1118mA (max)IEEQuiescent Power Supply Current V CM = 0V, V O = 0V, I O = 0A13mA (max)THD+N Total Harmonic Distortion + Noise No Load, BW = 30kHzVOUT= 30VRMS, f = 1kHz0.0007% (max)A V Open Loop Gainf = DCf = 1kHz, VIN= 1mVRMS12088dBdBVOMOutput Voltage Swing THD+N = 0.05%, f = 1kHz67.5V RMSV NOISE Output NoiseBW = 30kHz,A-weighted5034150μVμV (max)IOUTOutput Current Current from Source to Sink Pins6050mA (min)I MUTE Current into Mute Pin To activate the amplifier10050200μA (min)μA (max)SR Slew Rate VIN= 1VP-P,f = 10kHz square Wave50V/μs(min)V OS Input Offset Voltage VCM= 0V, IO= 0mA13mV (max)I B Input Bias Current VCM= 0V, IO= 0mA100200nA (max)PSRR Power Supply Rejection Ratio f = DC, Input Referred110105dB (min)V CLIP Baker Clamp Clipping VoltageClip OutputSource pinSink pin97.2–96.495.5–95.5V (max)V (min)VBCBaker Clamp Flag Output Voltage I FLAG = 4.7mA0.4VVBABias P&M Pin Open Voltage BiasP - BiasM10VIBIASBias Adjust Function Current 2.8mALME49810Note 1:All voltages are measured with respect to the GND pin unless otherwise specified.Note 2:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance.Note 3:The maximum power dissipation must be derated at elevated temperatures and is dictated by T JMAX , θJC , and the ambient temperature, T A . The maximum allowable power dissipation is P DMAX = (T JMAX - T A ) / θJC or the number given in Absolute Maximum Ratings, whichever is lower. For the LME49810, T JMAX = 150°C and the typical θJC is 4°C/W. Refer to the Thermal Considerations section for more information.Note 4:Human body model, 100pF discharged through a 1.5k Ω resistor.Note 5:Machine Model, 220pF - 240pF discharged through all pins.Note 6:Typicals are measured at +25°C and represent the parametric norm.Note 7:Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).Note 8:Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.Note 9:The maximum operating junction temperature is 150°C.Note 10:Data taken with Bandwidth = 30kHz, A V = 29dB, C C = 10pF, and T A = 25°C except where specified. 6L M E 49810LME4981020216709FIGURE 3. LME49810 Test Circuit Schematic (DC Coupled)Typical Performance Characteristics(Note 10)THD+N vs Frequency +V CC = –V EE = 20V, V O = 5V20216744THD+N vs Frequency +V CC = –V EE = 20V, V O = 10V20216745THD+N vs Frequency +V CC = –V EE = 50V, V O = 14V 20216746THD+N vs Frequency +V CC = –V EE = 50V, V O = 20V20216747THD+N vs Frequency +V CC = –V EE = 100V, V O = 14V 20216748THD+N vs Frequency +V CC = –V EE = 50V, V O = 30V20216749 8L M E 49810THD+N vs Output Voltage +V CC = – V EE = 50V, f = 20Hz 20216757THD+N vs Output Voltage +V CC = –V EE = 100V, f = 20Hz20216755THD+N vs Output Voltage +V CC = –V EE = 50V, f = 1kHz 20216753THD+N vs Output Voltage +V CC = – V EE = 100V, f = 1kHz20216754THD+N vs Output Voltage +V CC = –V EE = 50V, f = 20kHz 20216758THD+N vs Output Voltage +V CC = –V EE = 100V, f = 20kHz20216756LME49810THD+N vs Output Voltage +V CC = –V EE = 20V, f = 20Hz 20216751THD+N vs Output Voltage +V CC = –V EE = 20V, f = 1kHz20216750THD+N vs Output Voltage +V CC = –V EE = 20V, f = 20kHz 20216752Closed Loop Frequency Response +V CC = –V EE = 50V, V IN = 1V RMS20216735Closed Loop Frequency Response +V CC = –V EE = 100V, V IN = 1V RMS20216736PSRR vs Frequency +V CC = –V EE = 100V,No Filters, Input referred, V RIPPLE = 1V RMS on V CC pin20216726L M E 49810PSRR vs Frequency +V CC = –V EE = 100V,No Filters, Input referred, V RIPPLE = 1V RMS on V EE pin20216727Mute Attenuation vs I MUTE+V CC = –V EE = 100V20216724Output Voltage vs Supply Voltage20216725Slew Rate vs Compensation Capacitor+V CC = –V EE = 100V, V IN = 1.2V P 10kHz squarewave20216728Supply Current vs Supply Voltage 20216741Input Offset Voltage vs Supply Voltage20216737LME49810Open Loop Gain and Phase Margin+V CC = –V EE = 100V 20216738CMRR vs Frequency +V CC = –V EE = 100V20216722Noise Floor+V CC = –V EE = 50V, V IN = 0V 20216742Noise Floor+V CC = –V EE = 100V, V IN = 0V20216743Baker Clamp Flag Output+V CC = –V EE = 100V, V IN = 4V RMS , f IN = 20kHzCh1: Output, Ch2: CLPFLAG Output20216734L M E 49810Application InformationMUTE FUNCTIONThe mute function of the LME49810 is controlled by the amount of current that flows into the MUTE pin. LME49810typically requires 50μA to 100μA of mute current flowing in order to be in “play” mode. This can be done by connecting a reference voltage (V MUTE ) to the MUTE pin through a resistor (R M ). The following formula can be used to calculate the mute current.I MUTE = (V MUTE -0.7V) / (R M +10k Ω) (A)(1)The 10k Ω resistor value in Equation 1 is internal. Please refer to Figure 2, LME49810 Simplified Schematic, for additional details. For example, if a 5V voltage is connected through a 33k Ω resistor to the MUTE pin, then the mute current will be 100μA, according to Equation 1. Consequently, R M can be changed to suit any other reference voltage requirement. The LME49810 will enter Mute mode if I MUTE is less than 1μA which can be accomplished by shorting the MUTE pin to ground or by floating the MUTE pin. It is not recommended that more than 200μA flow into the MUTE pin because dam-age to LME49810 may occur and device may not function properly.BAKER CLAMP AND CLAMP FLAG OUTPUTThe LME49810 features a Baker Clamp function with corre-sponding CLPFLAG output pin. The clamp function keeps all transistors in linear operation when the output goes into clip-ping. In addition, when the output goes into clipping, a logic low level appears at the CLPFLAG pin. The CLPFLGAG pin can be used to drive an LED or some other visual display as shown by Figure 1. The value of logic low voltage varies and depends on I FLAG . For example, if I FLAG is 4.7mA then a volt-age (V BC ) of 0.4V will appear at the CLPFLAG output pin. The smooth response of the Baker Clamp and the corresponding CLPFLAG logic output is shown in the scope photo below:20216740+V CC = -V EE = 100V, V IN = 4V RMS , f IN = 1kHz, R C = 1k ΩCh1: Output, Ch2: CLPFLAG Output The CLPFLAG pin can source up to 10mA, and since the CLPFLAG output is an open collector output as shown by Figure 2, LME49810 Simplified Schematic, it should never be left to float under normal operation. If CLPFLAG pin is not used, then it should be connected through a resistor to a ref-erence voltage so that I FLAG is below 10mA. For example, a resistor of 1k can be used with a 5V reference voltage. This will give the I FLAG of 4.7mA. In a typical LED setup, if +5Vreference voltage is not available, the following circuit using a Zener diode can be used to power the CLPFLAG pin from the higher supply voltage rails of the LME49810. The power dissipation rating of R Z will need to be at-least ½W if using a 5V Zener Diode. Alternately, the following basic formula can be used to find the proper power rating of R Z : P DZ = (V CC -V Z )2/R Z (W). This formula can also be used to meet the design requirements of any other reference voltage that the user de-sires.20216770THERMAL PROTECTIONThe LME49810 has a thermal protection scheme to prevent long-term thermal stress of the device. When the temperature on the die exceeds 150°C, the LME49810 goes into thermal shutdown. The LME49810 starts operating again when the die temperature drops to about 145°C, but if the temperature again begins to rise, shutdown will occur again above 150°C.Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will cause the device to cycle between the thermal shut-down temperature limits of 150°C and 145°C. This greatly reduces the stress imposed on the IC by thermal cycling,which in turn improves its reliability under sustained fault con-ditions. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen so that thermal shutdown is not activated during normal ing the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the De-termining the Correct Heat Sink section.POWER DISSIPATIONWhen in “play” mode, the LME49810 draws a constant amount of current, regardless of the input signal amplitude.Consequently, the power dissipation is constant for a given supply voltage and can be computed with the equation P DMAX = I CC * (V CC – V EE ). For a quick calculation of P DMAX ,approximate the current to be 11mA and multiply it by the total supply voltage (the current varies slightly from this value over the operating range).DETERMINING THE CORRECT HEAT SINKThe choice of a heat sink for a high-power audio amplifier is made entirely to keep the die temperature at a level such that the thermal protection circuitry is not activated under normal circumstances.The thermal resistance from the die to the outside air, θJA (junction to ambient), is a combination of three thermal resis-tances, θJC (junction to case), θCS (case to sink), and θSA (sink to ambient). The thermal resistance, θJC (junction to case), of the LME49810 is 4°C/W. Using Thermalloy Thermacote ther-mal compound, the thermal resistance, θCS (case to sink), is about 0.2°C/W. Since convection heat flow (power dissipa-tion) is analogous to current flow, thermal resistance is anal-ogous to electrical resistance, and temperature drops areLME49810analogous to voltage drops, the power dissipation out of the LME49810 is equal to the following:P DMAX = (T JMAX −T AMB ) / θJA(2)where T JMAX = 150°C, T AMB is the system ambient tempera-ture and θJA = θJC + θCS + θSA .20216771Once the maximum package power dissipation has been cal-culated using Equation 2, the maximum thermal resistance,θSA , (heat sink to ambient) in °C/W for a heat sink can be calculated. This calculation is made using Equation 3 which is derived by solving for θSA from Equation 2.θSA = [(T JMAX −T AMB )−P DMAX (θJC +θCS )] / P DMAX(3)Again it must be noted that the value of θSA is dependent upon the system designer's amplifier requirements. If the ambient temperature that the audio amplifier is to be working under is higher than 25°C, then the thermal resistance for the heat sink, given all other things are equal, will need to be smaller.PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components is required to meet the design targets of an application. The choice of external component values that will affect gain and low frequency re-sponse are discussed below.The overall gain of the amplifier is set by resistors R F and R i for the non-inverting configuration shown in Figure 1. The gain is found by Equation 4 below given R i = R IN and R F = R S .A V = R F / R i (V/V)(4)For best Noise performance, lower values of resistors are used. A value of 243 is commonly used for R i and setting the value for R F for desired gain. For the LME49810 the gain should be set no lower than 10V/V. Gain settings below 10V/V may experience instability.The combination of R i and C i (see Figure 1) creates a high pass filter. The gain at low frequency and therefore the re-sponse is determined by these components. The -3dB point can be determined from Equation 5 shown below:f i = 1 / (2πR i C i ) (Hz)(5)If an input coupling capacitor (C IN ) is used to block DC from the inputs as shown in Figure 1, there will be another high pass filter created with the combination of C IN and R IN . The resulting -3dB frequency response due to the combination of C IN and R IN can be found from equation 6 shown below:f IN = 1 / (2πR IN C IN ) (Hz)(6)For best audio performance, the input capacitor should not be used. Without the input capacitor, any DC bias from the source will be transferred to the load. The feedback capacitor (C i ) is used to set the gain at DC to unity. Because a large value is required for a low frequency -3dB point, the capacitoris an electrolytic type. An additional small value, high quality film capacitor may be used in parallel with the feedback re-sistor to improve high frequency sonic performance. If DC offset in the output stage is acceptable without the feedback capacitor, it may be removed but DC gain will now be equal to AC gain.COMPENSATION CAPACITORThe compensation capacitor (C C ) is one of the most critical external components in value, placement and type. The ca-pacitor should be placed close to the LME49810 and a silver mica type will give good performance. The value of the ca-pacitor will affect slew rate and stability. The highest slew rate is possible while also maintaining stability through out the power and frequency range of operation results in the best audio performance. The value shown in Figure 1 should be considered a starting value with optimization done on the bench and in listening testing. Please refer to Slew Rate vs.C C Graph in Typical Performance Characteristics for de-termining the proper slew rate for your particular application.SUPPLY BYPASSINGThe LME49810 has excellent power supply rejection and does not require a regulated supply. However, to eliminate possible oscillations all op amps and power op amps should have their supply leads bypassed with low-inductance capac-itors having short leads and located close to the package terminals. Inadequate power supply bypassing will manifest itself by a low frequency oscillation known as “motorboating”or by high frequency instabilities. These instabilities can be eliminated through multiple bypassing utilizing a large elec-trolytic capacitor (10μF or larger) which is used to absorb low frequency variations and a small ceramic capacitor (0.1μF) to prevent any high frequency feedback through the power sup-ply lines. If adequate bypassing is not provided the current in the supply leads which is a rectified component of the load current may be fed back into internal circuitry. This signal causes low distortion at high frequencies requiring that the supplies be bypassed at the package terminals with an elec-trolytic capacitor of 470μF or more.OUTPUT STAGE USING BIPOLAR TRANSISTORSWith a properly designed output stage and supply voltage of ±100V, an output power up to 500W can be generated at 0.05% THD+N into an 8Ω speaker load. With an output cur-rent of several amperes, the output transistors need substan-tial base current drive because power transistors usually have quite low current gain—typical h fe of 50 or so. To increase the current gain, audio amplifiers commonly use Darlington style devices. Power transistors should be mounted together with the V BE multiplier transistor on the same heat sink to avoid thermal run away. Please see the section Biasing Tech-nique and Avoiding Thermal Runaway for additional infor-mation.BIASING TECHNIQUES AND AVOIDING THERMAL RUNAWAYA class AB amplifier has some amount of distortion called Crossover distortion. To effectively minimize the crossover distortion from the output, a V BE multiplier may be used in-stead of two biasing diodes. The LME49810 has two dedicat-ed pins (BIAS M and BIAS P ) for Bias setup and provide a constant current source of about 2.8mA. A V BE multiplier nor-mally consists of a bipolar transistor (Q MULT , see Figure 1) and two resistors (R B1 and R B2, see Figure 1). A trim pot can also be added in series with R B1 for optional bias adjustment. A properly designed output stage, combine with a V BE multiplier,L M E 49810can eliminate the trim pot and virtually eliminate crossover distortion. The V CE voltage of Q MULT (also called BIAS of the output stage) can be set by following formula:V BIAS = V BE (1+R B2/R B1) (V)(7)When using a bipolar output stage with the LME49810 (as in Figure 1), the designer must beware of thermal runaway.Thermal runaway is a result of the temperature dependence of V BE (an inherent property of the transistor). As temperature increases, V BE decreases. In practice, current flowing through a bipolar transistor heats up the transistor, which lowers the V BE . This in turn increases the current gain, and the cycle re-peats. If the system is not designed properly this positive feedback mechanism can destroy the bipolar transistors used in the output stage. One of the recommended methods of preventing thermal runaway is to use the same heat sink on the bipolar output stage transistor together with V BE multiplier transistor. When the V BE multiplier transistor is mounted to the same heat sink as the bipolar output stage transistors, it tem-perature will track that of the output transistors. Its V BE is dependent upon temperature as well, and so it will draw more current as the output transistors heat up, reducing the bias voltage to compensate. This will limit the base current into the output transistors, which counteracts thermal runaway. An-other widely popular method of preventing thermal runaway is to use low value emitter degeneration resistors (R E1 and R E2). As current increases, the voltage at the emitter also in-creases, which decreases the voltage across the base andemitter. This mechanism helps to limit the current and coun-teracts thermal runaway.LAYOUT CONSIDERATION AND AVOIDING GROUND LOOPSA proper layout is virtually essential for a high performance audio amplifier. It is very important to return the load ground,supply grounds of output transistors, and the low level (feed-back and input) grounds to the circuit board common ground point through separate paths. When ground is routed in this fashion, it is called a star ground or a single point ground. It is advisable to keep the supply decoupling capacitors of 0.1μF close as possible to LME49810 to reduce the effects of PCB trace resistance and inductance. Following the general rules will optimize the PCB layout and avoid ground loops problems:a) Make use of symmetrical placement of components.b) Make high current traces, such as output path traces, as wide as possible to accomodate output stage current require-ment.c) To reduce the PCB trace resistance and inductance, same ground returns paths should be as short as possible. If pos-sible, make the output traces short and equal in length.d) To reduce the PCB trace resistance and inductance,ground returns paths should be as short as possible.e) If possible, star ground or a single point ground should be observed. Advanced planning before starting the PCB can improve audio performance.LME49810Demo Board Schematic20216707FIGURE 4. LME49810 Test demo board schematicL M E 49810Demonstration Board Layout20216704Silkscreen Layer20216706Top Layer LME4981020216703Bottom LayerL M E 49810LME49810 Revision HistoryRev Date Description1.005/24/07Initial WEB release.1.0105/29/07Few text edits.1.0209/17/07Edited curve 20216724.Physical Dimensions inches (millimeters) unless otherwise notedTO–247 15–Lead Package Order Number LME49810TB NS Package Number TB15A 20L M E 49810LME49810 NotesNotesL M E 49810 200V A u d i o P o w e r A m p l i f i e r D r i v e r w i t h B a k e r C l a m pTHE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF TH E CONTENTS OF TH IS PUBLICATION AND RESERVES TH E RIGH T TO MAKE CH ANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITH OUT NOTICE. NO LICENSE, WH ETH ER EXPRESS,IMPLIED, ARISING BY ESTOPPEL OR OTH ERWISE, TO ANY INTELLECTUAL PROPERTY RIGH TS IS GRANTED BY TH IS DOCUMENT.TESTING AND OTH ER QUALITY CONTROLS ARE USED TO TH E EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WH ERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR TH EIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS TH AT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WH ATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO TH E SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCH ANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGH T OR OTH ER INTELLECTUAL PROPERTY RIGHT.LIFE SUPPORT POLICYNATIONAL ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN L IFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders.Copyright© 2007 National Semiconductor CorporationFor the most current product information visit us at National Semiconductor Americas Customer Support Center Email:new.feedback@ Tel: 1-800-272-9959National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530-85-86Email: europe.support@ Deutsch Tel: +49 (0) 69 9508 6208English Tel: +49 (0) 870 24 0 2171Français Tel: +33 (0) 1 41 91 8790National Semiconductor Asia Pacific Customer Support Center Email: ap.support@National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507Email: jpn.feedback@ Tel: 81-3-5639-7560IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and Automotive /automotiveMicrocontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omapWireless Connectivity /wirelessconnectivityTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。

Important Notes and WarningsMicron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-ment if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron.Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micronproducts are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications.Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo-nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-mental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product.Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-vironmental damages will result from failure of any semiconductor component.Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative.General Notes and DescriptionDescriptionThe DDR4 SDRAM is a high-speed dynamic random-access memory internally config-ured as an eight-bank DRAM for the x16 configuration and as a 16-bank DRAM for the8Gb: x8, x16 Automotive DDR4 SDRAM Important Notes and WarningsFigure 169: WRITE Burst Operation, WL = 19 (AL = 10, CWL = 9, BL8)T0T1T2T9T10T11Command DQCK_t CK_cDQS_t,DQS_cT21T17T18T19T20T23T22Bank GroupAddress Address Notes: 1.BL8, WL = 19, AL = 10 (CL - 1), CWL = 9, Preamble = 1t CK.2.DI n = data-in from column n .3.DES commands are shown for ease of illustration; other commands may be valid atthese times.4.BL8 setting activated by either MR0[1:0] = 00 or MR0[1:0] = 01 and A12 = 1 duringWRITE command at T0.5.CA parity = Disable, CS to CA latency = Disable, Read DBI = Disable.WRITE Operation Followed by Another WRITE OperationFigure 170: Consecutive WRITE (BL8) with 1t CK Preamble in Different Bank GroupCommand DQ CK_t CK_cDQS_t,DQS_cBank GroupAddress Address Notes: 1.BL8, AL = 0, CWL = 9, Preamble = 1t CK.2.DI n (or b ) = data-in from column n (or column b ).。

Eaton 167706Eaton Moeller series xEffect - FRCmM-NA RCCB. Residual currentcircuit breaker (RCCB), 40A, 4p, 30mA, type G/A, UL, 110VGeneral specificationsEaton Moeller series xEffect - FRCmM-NA RCCB167706FRCMM-40/4/003-G/A-NA-110401508164247280 mm71 mm70 mm0.32 kg RoHS conformUL 1053ÖVE E 8601 IEC/EN 61008 EN45545-2 IEC 61373Additionally protects against special forms of residual pulsating DC which have not been smoothed.Product Name Catalog NumberModel CodeEAN Product Length/Depth Product Height Product Width Product Weight Compliances Certifications Catalog Notes40 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.7035-35 °CMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.DIN railQuick attachment with 2 latch positions for DIN-rail IEC/EN 6071540 ADoes not apply, since the entire switchgear needs to be evaluated.0.03 A100 V AC - 210 V AC, 94 V AC - 132 V AC (UL)Meets the product standard's requirements.Short time-delayed8 ms delay at 60 Hz10 ms delay at 50 HzInterlocking device500 A eaton-rcd-application-guide-br019003en-en-us.pdfUL 1053 DIN Rail RCCBEaton's Volume 4—Circuit Protectioneaton-xeffect-industrial-switchgear-range-catalog-ca003002en-en-us.pdf eaton-xeffect-frcmm-na-rccb-catalog-ca003019en-en-us.pdfDA-DC-03_FRCmeaton-circuit-breaker-xeffect-frcmm-na-rccb-dimensions.epsMA180503312DA-CD-f9_ul1053_4pDA-CS-f9_ul1053_4pEaton Specification Sheet - 167706eaton-circuit-breaker-xeffect-frcmm-rccb-wiring-diagram-002.eps eaton-xeffect-frcmm-rccb-wiring-diagram-002.jpgRated operational current for specified heat dissipation (In) 10.11 Short-circuit ratingRAL-numberPermitted storage and transport temperature - min10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityMounting MethodAmperage Rating10.2.5 LiftingRated fault current - maxTest circuit range10.2.3.1 Verification of thermal stability of enclosures Tripping timeFitted with:Rated residual making and breaking capacity Application notesBrochuresCatalogsCertification reports DrawingsInstallation instructions mCAD model Specifications and datasheets Wiring diagramsFrequency rating50 Hz / 60 Hz10.8 Connections for external conductorsIs the panel builder's responsibility.Fault current rating30 mATerminal protectionFinger and hand touch safe, DGUV VS3, EN 50274Special featuresFRCmM-NA-110Residual current circuitbreakersType G/A (ÖVE E 8601)Sensitivity typePulse-current sensitiveAmbient operating temperature - max40 °CHeat dissipation per pole, current-dependent3.275 WClimatic proofing25-55 °C / 90-95% relative humidity according to IEC 60068-2Built-in depth70.5 mmShort-circuit ratingMax. admissible back-up fuse: 63 A gG/gL, 70 A class J fuse (UL)FeaturesResidual current circuit breakerAdditional equipment possibleLifespan, electrical4000 operationsTerminal capacity (cable)M5 (with cross-recessed screw as defined in EN ISO 4757-Z2, PZ2)Connectable conductor cross section (solid-core) - min1.5 mm²Contact position indicator colorRed / green10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Number of polesFour-poleTerminal capacity (solid wire)1.5 mm² - 35 mm²Ambient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.Rated short-circuit strength5 kA (UL, as per CSA)10 kA with back-up fuse10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Used withFRCmM-NA-110Type G/A (�VE E 8601)Residual current circuit breakersMounting positionAs requiredEquipment heat dissipation, current-dependent13.1 W10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.ApplicationSwitchgear for 110-V systems10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage rating (IEC/EN 60947-2)110/190 VVoltage typeACTerminal capacity (stranded cable)16 mm² (2x)Leakage current typeAFrame45 mmBuilt-in width (number of units)70 mm (4 SU)Terminals (top and bottom)Lift terminalsAmbient humdity range5 - 95 %Impulse withstand current3 kA (8/20 μs) surge-proofWidth in number of modular spacings410.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Lifespan, mechanical10000 operationsStatus indicationWhite / blue10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max35 mm²Degree of protectionIP20, IP40 with suitable enclosureIP20Rated short-time withstand current (Icw)10 kAOvervoltage tested - max530 VPollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min 1.5 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.FunctionsShort-time delayed trippingVoltage rating (UL)208/120 V, 60 HzConnectable conductor cross section (multi-wired) - max 16 mm²TypeCurrent test marks as perinscriptionMaximum operatingtemperature is 75 °C:Starting at 40 °C, the max.permissible continuouscurrent decreases by 2.5%for every 1 °CThe maximum operatingcurrent of back-up fuse mustnot exceed the residualcurrent circuit breaker'srated operational current10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Eaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia3 kA60 °C40 A gG/gL0.03 A 22 mA190 V440 VSurge current capacity Permitted storage and transport temperature - max Admissible back-up fuse overload - max Rated fault current - min Pick-up current Rated operational voltage (Ue) - max Rated insulation voltage (Ui)。

LME知识大全概况伦敦金属交易所(London Metal Exchange,LME)是一家有着125年历史的世界最大的基础金属期货交易市场，其年交易额达2万多亿美元。

世界上大部分的重要矿业公司和金属生产商、商业和投资银行以及许多与金属贸易相关的公司和制造厂商都是伦敦金属交易所的会员。

LME,SHFE以及SMM是有色金属行业的三大知名机构，其中SHFE全称为shanghai futures exchange（上海期货交易所），SMM的全称为shanghai metals market（上海现货行情）。

LME历史交易所成立伊始，只交易铜和大锡。

当时英国对铜和锡的需求很大，需要大量从智利和马来亚（现在的马来西亚和印度尼西亚）。

为了避免价格起落的风险和船运途中的其他风险，交易所确定以三个月为标准交割日期（因当时从马来亚和智利海运至英国一般需要三个月时间）。

截至到2004年，交易所走过了127个春秋。

随着历史的发展，交易所适时适势地逐步增加了新的交易品种和修改交割商品的品质。

1981年铜的标准提高至高级铜(high grade)，1986年又提高至目前仍然执行的A级铜标准(Grade A)。

1989年6月份，LME把大锡的交割标准提高到目前的99.85%。

1920年交易所正式引进铅锌。

在此之前为非正式交易。

铅的交割标准从开始交易至今基本没有改变。

锌锭从引入交易所后几经提高交割质量，1986年正式确定为99.995%.1978年伦敦金属交易所正式引入原铝交易，交割质量标准为99.50%，1987年提高至目前的交割质量99.7%。

1979年引入镍商品，1992年，铝合金，1999年5月，白银。

但白银目前基本为OCT交易，非LME正式交易。

2000年4月10日，在铜、铝、镍、铅、锌、锡六个商品的基础上创立了LMEX－伦敦金属交易所期货指数。

指数交易不能进行实物交割，与股指市场一样。

LME会员（经纪公司）1、会员的构成伦敦金属交易所的会员由7种会员构成，呈阶梯式分布：具体为：1、Ring Dealing,2. Associate Broker Clearing,3. Associate Trade clearing,4. Associate Broker,5. Associate trade,6, 7, only for individual and honorary member.目前伦敦金属交易所拥有11个圈内会员－即正式会员。

A forgotten military standard that saves weeks of work(by providing free project management templates)Nobody loves to write documentation, but with age and experience, IT project managers usually come to accept that it can be useful sometimes, even necessary. In healthy doses.Now, if you're doing small to medium software projects, the US military might not be your usual place to turn to for inspiration. But in one case, back in '94, they did create something truly wonder-, power-, and useful. (Then they've thrown it away and replaced it with a complex and much less useful hybrid IEEE and ISO monster. But there's an interesting twist -- more on that later.)This gem is inspirationally called "MIL-STD-498".It was created to fix the problems with an older standard (the DOD 2167A, if you need to know), for example its insistence on using the waterfall model, or requiring huge demonstration events that stopped development for weeks. (People unofficially called those "dog & pony shows".)MIL-STD-498 can help you if you are a developer dealing with clients, but also if you're a project manager dealing with suppliers. I personally had used it in both situations.By the end of this article, you'll be proficient enough in it to brag about it. And to know how to use it for various purposes when the need arises the next time.So, why is MIL-STD-498 so cool and unique?1. It's in the public domain, so you're free to use it. Unlike IEEE or ISO standards, which you'd have to buy.Like the Internet RFCs, it's out there. Actually, it's right here (zip download).I had an assistant convert the templates (called "DIDs", Data Item Descriptions) to friendly clean HTML (with nested header levels and without messy formatting), so you can easily use it with any word processor. The original Word-97 files even MS Office doesn't seem to read correctly anymore.2. It's completely self-sufficient. It invokes no other standard. It'sstand-alone.Some standards get entangled with others by invoking various other standards, requiring you to include, import (and often buy) documents that belong to those other standards, not only resulting in a chaotic mess, but also making it hard to initially estimate how big the work of documentation will be.3. It is essentially a collection of document templates. And not only a table of contents (although that already would be a great free project management template), but also "help" paragraphs explaining what to include, how to approach the topic, what to reference, etc.Even if you're not doing full-blown documentation, these project management templates ("DIDs") are useful as checklists.4. It's compatible with the latest. You might be thinking, "ok, but still, an outdated standard? Why should I even care?" But, you have to know that the MIL-STD-498 later got "civilized" as J-STD-016, which became part of the current IEEE/EIA 12207 (which also includes, but is not the same as ISO 12207, just to demonstrate how chaotic it can get in the world of standards). So, basically, if you work with MIL-STD-498, you're creating documents that perfectly fit into the modern 12207! (Which, by the way, doesn't have document templates for you, even if you buy it. Just saying.)5. It's quite flexible. The creators of the standard have understood that projects come in various shapes, sizes, and colors. So, the MIL-STD-498can officially be customized to the project. They call it "tailoring", andthey've even written a full guide on how to do it officially. But in most cases, if you're not a DoD supplier, just feel free to leave out the parts you feel are not important for your project (for example, the part about how the item is supposed to work when there are enemy explosions nearby.)Also, it allows the use of electronic tools instead of written word, when appropriate. Its thinking is that the point is that you have the stuff, not that it must be written in a word processor.6. It supports multiple program strategies. It clearly says that there are three ways of doing projects: "Grand design" (also known as, waterfall), "Incremental" (which most Agile projects do), and even "Evolutionary" (which includes exploratory projects like prototypes).So, how does one actually use it?Well, there's the 344 pages long "Application and ReferenceGuide" (Part1, Part2), and the 99-page strong "Overview and Tailoring Guide". Or, you can start using the templates (the "DIDs") right away just after reading this short introduction from me.(I'm listing the documents in the order they usually get written. Of course, certain projects might be different. Or you just need one template to document one aspect -- feel free to.)Request For Quotation phaseOCD - Operational Concept Description. This describes in the client's language what the project is about, what is wrong with thecurrent situation, how will the system improve it. If you're adeveloper, it's best used as a checklist for questioning the client aboutthe project details; if you're a project manager, use it as a template towrite a very good description of your planned project for thesuppliers.(Pro tip: As a purchaser, you get lower prices if your description is well thought out, and not vague. The developers' biggest risk factor isactually you: They know how they can program, but they don't know how difficult you are. A good, concise project description shows that you have already had put ample thought into the project, which is a good sign, and they don't have to pad the estimates just in case you turn out to be the Client From Hell Who Orders A Car But Actually Needs A Submarine.)∙SDP - Software Development Plan. It just describes the very basics of how the development will happen: languages, tools, source control, trouble ticketing, change management, testing, validation, phases,timetable, etc. It's best used as a checklist of things that should go intoa contract.These two are usually enough for an initial ballpark price quoting phase. There's one more that has to be done before contracting - just so it's clear for everyone what is the acceptance criteria:∙STP - Software Test Plan. It describes in general how and where the testing (especially the acceptance testing) will happen, without goinginto details on individual tests. (Those come later in the unfortunatelynamed STD document.)Now when the project is about to start, proceed to the next ones:System design phase∙SSS - System/Subsystem Specification and SRS - Software Requirement Specification. There can be only one SSS, but if needed, there can be an SRS for each Subsystem. (I usually only do thissub-document thing if the different subsystems are the responsibilities of different suppliers.) The SSS and SRS are basically the same anddiffer only in minor wording -- in theory, the SSS might containhardware descriptions too, while the SRS can only describe software. The SSS (and maybe SRSes) is how one describes the architecture of the system. This is best done in cooperation (in "Joint Application Design", or JAD sessions, if you want a military-sounding buzzword) between the client and the developer. Use it as a template.∙IRS - Interface Requirement Specification. Only needed if the system will connect to one or more external systems. Best used as achecklist of what to collect from (usually) third parties. (One canrarely dictate the format of third party documentation.)The SSS (or SRS) and the IRS should contain enough information that the software development can actually be done. It should start now. The following documents are to be done during the development: Development phase∙SSDD - System/Subsystem Design Description (or SDD - Software Design Description) and IDD - Interface Design Description. These describe the evolving, and in the end the final design of the systemand the subsystems and the interfaces. These are basicallycounterparts with the Specifications:SSS - SSDDSRS - SDDIRS - IDDThe templates that end in "S" (as in Specification) are supposedly written (or at least, the information is given) by the customer; while the ones ending in "DD" (as in "Design Description"), are written by the developer.This might sound nitpicking at first, but actually, it's very important, because MIL-STD-498 does away with the usual thinking that the customer says "what" to do, and the developer decides "how" to do things. It says that if it's in the Specifications then the developer must comply with it, doesn't matter if it's a "what" or a "how"; on the other hand, if something is not in the specification (be that a "what" or "how"), then it's up to the developer, but should be documented in the "DD"-s. See how beautiful the separation of responsibilities is?This separation fits both knowledgeable and less experienced customers, since they can specify as much or as less as they wish, or can.∙DBDD - Database Design Description. Just what it sounds. Actually, this one is often better done with a "create table, create index, etc"SQL script or with one of the fancy database design tools than in atext editor. (That's what MIL-STD-498's spirit says: Don't you dare to copy the SQL into the documentation just to make it look thick. Justgive me the file.)∙STD - Software Test Description. This well-named template describes the information missing from the STP (the Test Plan) --namely, the individual tests. Best used as a checklist, the teststhemselves can usually be best described in a spreadsheet format. Tests should cover every important functionality of the system, and also don't forget that tests are needed for two purposes: 1) to check functionality, and 2) to test against possible attacks.In my experience, tests are best written both by the customer and the developer separately, and then merged together. (There will be overlaps that need to be reconciled, but there will also be interesting differences in approach.) Also, I find it best if test descriptions are written once at thebeginning of the development, then retouched and expanded again as the end is nearing (and in between if the development is long enough or is separated to phases).Test descriptions are a very good way to find hidden requirements. Don't miss the opportunity, early in the process.Testing phase∙STR - Software Test Report. This is basically the output of doing the STDs according to the STP. Best read once for scraping ideas, andactually done by adding check marks and notes to a copy of the STDspreadsheet.Manuals∙SUM - Software user manual. Very good template. Use it. (And don't forget, it's best to document by user functions, not by features.But this is just my advice, it's not in the standard.) Can be omitted ifthere is no user interface.∙SIOM - Software Input/Output Manual. It's best used as a template for documenting APIs. Omit if there is no API.∙SCOM - Software Center Operator Manual. A template to document the operation of the system. It's to be done if someone else will do the hosting.Delivery phase∙SPS - Software Product Specification. Best used as a checklist of things expected to be delivered.∙SVD - Software Version Description. This is basically a "change log"template. Use when delivering changes to a system already inoperation.Rarely used DIDsTemplates that are rarely used -- at least in my line of work:∙STrP - Software Transition Plan. It describes how to transfer the support functions to the customer's internal support agency. It wouldbasically be a knowledge base for user support personnel.∙COM - Computer Operation Manual. Well, unless you're developinga whole new computer. In that case, you should totally use this one.∙CPM - Computer Programming Manual. I guess it's a useful starting point if your software has it's own programming language.FSM - Firmware Support Manual. I suppose it's useful for embedded systems. Which I haven't done lately.ConclusionIf you are a military supplier, or intent on doing this the "perfect" way, then definitely read the two big manuals. And the Appendices. And tailor the documents by the book.But just by having the above information in your head (or in your browser), and having access to these templates, I'll say that you're already 85% of the way. Most "normal" project managers, even with relatively big projects, will never need to know more about MIL-STD-498 than this. Insert it into your own process.I wish that you use this little gem with success - and start to hate doing documentation just a little less. :)。

TABLE OF CONTENTSSection Page SAFETY INSTRUCTIONS:2 INTRODUCTIONMachine Specifications3Functions,Tooling,Drive3&4 Picture of Heavy Duty Portable Mill4Illustration of Heavy Duty Portable Mill5 MACHINE SET-UPAssembly Procedure6Installing Motor6&7 Hydraulic Power Set Up7 MACHINE OPERATIONHole Drilling,Boring,and Chamfering8Resurfacing and Milling9Machine Maintenance,Record of Use10 APPENDIX:PARTS/DIAGRAMSHeavy Duty Portable Mill11Servo Drive12Heavy Duty Portable Mill Quill Housing13SAFETY INSTRUCTIONS•Wear protective clothing,including safety glasses and steel toe boots.•DO NOT allow loose clothing or long hair near machine operations.•Keep work site and machine e brush to remove chips.DO NOT use hands or air hose.•Ensure adequate clearance around pipe before mounting milling machine.•Support machining surface for total machine weight.•DO NOT rush the job.Read this manual and understand the operating procedure beforeattempting any cutting operation.Call our toll freenumber(1-800-328-1488)if any problems arise.•Before connecting the hoses to the machine,be sure the following components are tightly secured:slide,tool bits,motor mount,and vertical feedsupport angle bracket.•Be sure the mill is completely secured to the work surface before starting the machine.•During actual machine operation,DO NOT touch or rest your hand on or near any moving parts orsharp edges.•Disconnect air hose or hydraulic power source BEFORE dismounting lathe from pipe.•NEVER MOVE MACHINE WHILE CONNECTED TO AIR OR HYDRAULIC SUPPLY.ALWAYS turnoff control valve and disconnect hoses BEFOREattempting to move the machine.INTRODUCTIONGeneral DescriptionMactech Heavy Duty Portable Mills are designed tomake on-site,close tolerance machining costeffective.Our mills can be clamped,bolted,ormagnetically attached directly onto the workpiece andmounted in any direction.Infinitely variable powerfeed is available on the vertical feed slide assembly. MACHINE SPECIFICATIONSCapabilities&FunctionsCapabilities•Drilling•Chamfering•Boring•TappingFunctionsMactech Heavy Duty Portable Mill are used toperform gamma plug installation,stud removal,thermoweld installation,and numerous other millingjobs.The milling machine can machine steel and various alloys,stainless steel,aluminum,copper-nickel,nickel-copper-iron,and bronze.ToolingHigh speed tool steel bits,drill bits and milling bits ordifferent sizes are available for most machiningoperations.Mactech stocks many standard tool bitconfigurations.Frame ComponentsThe milling head assembly feeds verticallyalong the cast iron feed support angle bracketinto the work piece.The bracked is attachedto the steel base plates,which can bepositioned for precise alignment.Both theextra and super duty models include additionalbracket supports.Vertical SlideThe slide is made of cast iron,comprised of ways andsaddles with adjustable gibs,and a full length feedscrew.Drive Assembly•In-Line Air Drive(97RPM max),also includes air caddy.•Hydraulic drive(137RPM max).Mactech Heavy Duty Portable MillView of Heavy Duty Portable Mill powered by hydraulic drive.Hand crank provides vertical feed.Reference No.Part Description No.1Tool Bit No.2Quill No.3Motor Mount No.4Hydraulic Motor No.5Vertical Slide Support &Bracket No.6Vertical Slide Support &Saddle No.7Steel Base Plates Model:Weight Travel HD Mill220lbs Vertical Travel 6”EHD Mill262lbs Vertical Travel 12”SHD Mill306lbs Vertical Travel 18”Air/Hydraulic Drive25lbs Servo Drive 25lbs 1234567MACHINE SET-UPRead SAFETY INSTRUCTIONS on Page1.Assembly ProcedureClear worksite of all obstructions and clean area.Assemble aluminum base components(if needed)and installon working surface(see below).Installation on Curved Surface(In-Line Pipe):1.Attach aluminum saddle to steel base by wrappingchains around pipe.Note:Have partner hold base while connectingchains around pipe.2.Square and level base to pipe surface(if necessary).3.Attach cast iron vertical support bracket and slide tothe steel base.4.Square and level base(if necessary).Installation on Flat Surface:1.Attach vertical support bracket to steel base and/or flatsurface(bolt,tack weld,clamp,or magnetically attach).2.Square and level base.Installing MotorCAUTION!Control Valve must be turned OFF beforeinstallation of motor.1.Insert motor so that keyed shaft aligns with the quillkeyway.Tighten motor mount screws.2.With control valve off,connect hoses to power supply/airsupply.Test run motor to check speed.HYDRAULIC POWER SUPPLY SET-UP**NOTE:See“Mactech Hydraulic Power Supply Handbook”for further information.1.Select230or460outlet.See inside electric controlbox for directions on how to change voltageconnections.**CAUTION:All electrical work must be performedby a qualified electrician.2.Connect hoses to couplings(#7).3.With pendant knob(#4)off and control lever(#5)neutral,turn off main switch.4.While viewing direction indicator(#2),turn on pendantknob.Shaft should spin in the direction of the arrow.If not,turn off pendant knob and main switch,changewiring rotation,and re-attempt step#3.When spinningproperly,the power supply is ready to use.SP ECIFIED COMPONENTS1.Main Switch(Control2.Motor Direction Indicator3.Hydraulic Fluid Reservoir4.Pendant On/Off Knob5.Pendant Control Lever6.Pressure Release Lever7.Couplings,Female/Male8.Fluid Sight GlassHydraulic Power Supply&Remote ControlMACHINE OPERATIONRead SAFETY INSTRUCTIONS on Page1.Note:The hand crank should offer some resistance while turning.If it is too loose or tight,the jam nuts may beslightly adjusted.Do not allow“slop”in the slides.Drilling and Sawing Holes1.Follow Set-Up procedures.Attach air or hydraulicsupply to the motor while control valve is OFF.Insertdrill chuck into quill and secure.Insert center drill bit,regular drill bit,spade bit or hole saw into chuck andsecure.Open control valve slowly to check functionand speed.e control valve to control cutting speed.To avoidchatter,do not allow saddles to extend beyondsupporting slides.If chatter vibration occurs,reducespeed.If tool bit(s)chip or become dull,replacee coolant when possible.CAUTION!The cutting operation is continuousuntil terminated by the operator.To stop machineduring cutting,back bit away from material,thenclose control valve.This will reduce tool pressureand potential gouging.3.Close control valve to stop motor.Disconnecthoses.Back tool to FULL OUT POSITION.Boring HolesFollow above procedures,with following exception:Replace drill chuck with boring bar and bit.If desired,use dial indicator for precise hole alignment. Chamfering HolesFollow above procedures,with following exception:Replace drill chuck with boring bar and angledchamfering tool.If desired use dial indicator for precisehole alignment.Step cut to desired depth and chamfer.Tapping HolesFollow above procedure,with following exception:Replace drill bit with tapping e dial indicator forprecise hole alignment.Facing Flat Surfaces(longitudinal and cross slides required)1.Follow drilling set-up procedures,but replace drillchuck with facing mill or fly cutter and bit.Opencontrol valve slowly to check function and speed.2.Turn crank on vertical slide to bring bit down tosurface.To avoid chatter,do not allow saddles toextend beyond supporting slides.e control valve to control cutting speed.If chatteror vibration occurs,reduce speed.If tool bit(s)chip orbecome dull,replace e coolant whenpossible.CAUTION!The cutting operation is continuousuntil terminated by the operator.To stopmachining process during cutting,back bit away frommaterial,then close control valve.This will reducetool pressure and potential gouging.4.Close control valve to stop motor.Disconnect hoses.Back tool to FULL OUT POSITION.Milling Flat Surfaces(longitudinal and cross slides required)Follow above procedures,with following exception:Replace cutter with tool shank holder and end mill oranother appropriate tool.Operation CompletionClose control valve.Disconnect air or hydraulicsupply.To remove portable mill follow set-updirections in reverse.MACTECH HEAVY DUTY PORTABLE MILLMACTECH Heavy Duty Portable Mill Operating Manual 10Machine MaintenancePrevent corrosion by cleaning machineexterior witha solvent,then apply rust inhibitors and store in a dry area.Grease internal gears regularly,depending on use.NOTE:Mactech recommends sendingthe machine to our service facility after every 250machininghours for inspection and tune-up(nominal fee applies).•RECORD OF MACHININGDate Hours Date Hours Date Hours TOTAL TOTAL TOTAL Parts InformationUse the attachedparts diagrams to order replacement parts.When ordering parts please include the following information:type of machine,serial number,contact person,phone/fax number,shipping address,date of purchase,and paymentinformation.。