MAX20021,MAX20022数据资料

西门子马保配置说明西门子马保配置说明1，通过专用的电缆把电脑和马保连接起来，打开“SIMOCODE ES”软件。

2，打开软件点击“在线”，该COM口，是把编程电缆接上之后可以在电脑“设备管理器”里面可以查看到。

之后点击“OK”就可以把马保“在线”在线的状态在界面右下角可以查看到。

（如下图）在线之后可以看到（如下图）的界面：界面简单说明：3，通过左侧的选项来选择需要配置的参数：A)配置马保的型号版本转向等参数：（Device Configuration）马保的型号选择“SIMOCODE pro S”版本默认为“V1.0”就可以了，“Current Measurement”的选择是根据抽屉里面安装的与马保配套的电流检测装置（在装置上面有标识出来的）（如图：10-100A），之后就需要把“Operator Panel”的选项勾选上，“Application ( Contrel Function )”如果是单向风机就勾选“Direct Starter”；如果是正反转风机就勾选“Reversing Starter”。

B)电机控制（Motor Protection——Overload/Unbalance/stall）“Set Carrent Is 1”——设置马保的保护额定电流（额定电流的值需要根据生产一次图纸里面每个回路的计算电流值进行设置）。

“Cooling Down Period”——跳闸冷却时间设置成为“120 S”（120秒）。

这个是马保跳闸之后需要等待120秒之后才可以进行马保恢复和启动。

“Response at Pre-Warning Level（I>115%Is）”——预警级别的响应，就是在运行电流值超过115%的时候会进行预报警。

这个选项需要选择“disabled”（不使能该项功能）。

“Unbalance Protection——Response”——电压不平衡保护（即缺相），在电压不平衡超过40%的时候会出现的动作“Response”选项选择“tripping”（跳闸），即：当出现40%电压不平衡的时候会执行跳闸动作。

Step7-数据类型详细说明总结汇总STEP7中的基本数据类型⑴位（BOOL）位数据的数据类型为BOOL（布尔）型，在软件编程中BOOL 变量的值1和0常用英语词TURE（真）和FALSE（假）来表示，对应二进制数中的“1”和“0”，常用于开关量的逻辑运算，存储空间为1位。

⑵字节（BYTE）字节数据长度为8位，数据格式为B#16#，B代表BYTE，表示数据长度为一个字节（8位），＃16＃表示十六进制，取值范围为B#16#0～B#16#FF。

⑶字（WORD）字数据长度为16位，这种数据可采用4种方法进行描述。

二进制：二进制的格式为2＃，如2＃101，取值范围为2＃0～2＃1111_1111_1111_1111，书写时每4位可用下划线隔开，也可直接表示为2＃111111111111。

十六进制：十六进制的格式为W＃16＃，W代表WORD，表示数据长度为16位，＃16＃表示十六进制，数据取值范围为W ＃16＃0～W＃16＃FFFF。

BCD码：BCD码的格式为C＃，取值范围为C＃0～C＃999。

BCD码是用4位二进制表示1位十进制数，4位二进制中的0000～1001组合分别表示十进制中的0～9，4位二进制中的1010～1111组合放弃不用。

BCD码的最高4位用来表示符号，十六位BCD码的取值范围为－999～+999。

在STEP7的数据格式中，BCD码的取值只取正值，与最高4位的符号无关。

无符号十进制数：无符号十进制数的格式为B＃（×，×），取值范围为B＃（0，0）～B＃（255，255），无符号十进制数是用十进制的0～255对应二进制数中的0000_0000～1111_1111（8位），16位二进制数就需要两个0～255的数来表示，例如：B#（12，254）＝2＃0000_1100_1111_111012 254上面4种数据都是描述一个长度位16位的二进制数，无论你使用哪种方式都可以。

5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments IncorporatedProduct FolderSample &BuyTechnical Documents Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016MAX2025-V Dual RS-232Line Driver and Receiver With ±15-kV ESD Protection1Features•Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28Standards•ESD Protection for RS-232Bus Pins:±15-kV Human-Body Model•Operates at 5-V V CC Supply •Operates Up to 120kbit/s•Two Drivers and Two Receivers•Latch-Up Performance Exceeds 100mA Per JESD 78,Class II2Applications•Battery-Powered Systems •Notebooks •Laptops•Palmtop PCs•Hand-Held Equipment3DescriptionThe MAX202device consists of two line drivers,two line receivers,and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins,including GND).The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector.The charge pump and four small external capacitors allow operation from a single 5-V supply.The device operates at data signaling rates up to 120kbit/s and a maximum of 30-V/µs driver output slew rate.Device Information (1)PART NUMBER PACKAGE BODY SIZE (NOM)MAX202CD MAX202ID SOIC (16)9.90mm ×3.91mm MAX202CDW MAX202IDW SOIC WIDE (16)10.30mm ×7.50mm MAX202CPW MAX202IPWTSSOP (16)5.00mm x 4.40mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Block Diagram2MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics .............................................67Parameter Measurement Information ..................78Detailed Description . (8)8.1Overview...................................................................88.2Functional Block Diagram.. (8)8.3Feature Description...................................................88.4Device Functional Modes (8)9Application and Implementation (10)9.1Application Information............................................109.2Typical Application.. (10)10Power Supply Recommendations .....................1311Layout . (13)11.1Layout Guidelines ................................................1311.2Layout Example. (13)12Device and Documentation Support (14)12.1Receiving Notification of Documentation Updates 1412.2Community Resources..........................................1412.3Trademarks...........................................................1412.4Electrostatic Discharge Caution............................1412.5Glossary................................................................1413Mechanical,Packaging,and OrderableInformation (14)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision E (April 2007)to Revision F Page•Added ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device and Documentation Support section,andMechanical,Packaging,and Orderable Information section..................................................................................................1•Removed the Ordering Information table;see POA at the end of the data sheet .................................................................1•Changed values in the Thermal Information table to align with JEDEC standards (4)C1+ V CC V+ GND C1± DOUT1C2+ RIN1C2± ROUT1V ± DIN1DOUT2 DIN2RIN2ROUT23MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DW,or PW Package 16-Pin SOIC or TSSOPTop ViewPin FunctionsPINI/O DESCRIPTION 1C1+—Positive lead of C1capacitor2V+O Positive charge pump output for storage capacitor only 3C1–—Negative lead of C1capacitor 4C2+—Positive lead of C2capacitor 5C2–—Negative lead of C2capacitor6V–O Negative charge pump output for storage capacitor only 7DOUT2O RS-232line data output (to remote RS-232system)8RIN2I RS-232line data input (from remote RS-232system)9ROUT2O Logic data output (to UART)10DIN2I Logic data input (from UART)11DIN1I Logic data input (from UART)12ROUT1O Logic data output (to UART)13RIN1I RS-232line data input (from remote RS-232system)14DOUT1O RS-232line data output (to remote RS-232system)15GND —Ground16V CC—Supply voltage,connect to external 5-V power supply4MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltages are with respect to network GND.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT Supply voltage,V CC (2)–0.36V Positive charge pump voltage,V+(2)V CC –0.314V Negative charge pump voltage,V–(2)–140.3V Input voltage,V I Drivers –0.3V++0.3V Receivers ±30Output voltage,V ODrivers V––0.3V++0.3VReceivers–0.3V CC +0.3Short-circuit duration,D OUTContinuousOperating junction temperature,T J 150°C Storage temperature,T stg –65150°C (1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNITV (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)Pins 7,8,13,and 14±15000V All other pins±2000Charged-device model (CDM),per JEDEC specification JESD22-C101(2)±1500(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted (1);see Figure 10)MINNOMMAX UNIT Supply voltage4.555.5V V IH Driver high-level input voltage (D IN )2V V IL Driver low-level input voltage (D IN )0.8V V I Driver input voltage (D IN )0 5.5V Receiver input voltage –3030T A Operating free-air temperatureMAX202C 070°CMAX202I–4085(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report.6.4Thermal InformationTHERMAL METRIC (1)MAX202UNITD (SOIC)DW (SOIC)PW (TSSOP)16PINS 16PINS 16PINS R θJA Junction-to-ambient thermal resistance 76.276.8101°C/W R θJC(top)Junction-to-case (top)thermal resistance 36.839.636.4°C/W R θJB Junction-to-board thermal resistance 33.941.545.9°C/W ψJT Junction-to-top characterization parameter 6.712.6 2.7°C/W ψJB Junction-to-board characterization parameter33.640.945.3°C/W5MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated (1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings,and not more than one output should be shorted at a time.6.5Electrical Characteristicsover recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAX UNIT I CC Supply currentNo load,V CC =5V815mADRIVER SECTIONV OH High-level output voltage D OUT at R L =3k Ωto GND,D IN =GND 59V V OL Low-level output voltage D OUT at R L =3k Ωto GND,D IN =V CC –5–9V I IH High-level input current V I =V CC 0200µA I IL Low-level input current V I at 0V0–200µA I OS (3)Short-circuit output current V CC =5.5V,V O =0V±10±60mA r O Output resistance V CC ,V+,and V–=0V,V O =±2V 300ΩRECEIVER SECTIONV OH High-level output voltage I OH =–1mA 3.5V CC –0.4V V OL Low-level output voltageI OL =1.6mA 0.4V V IT+Positive-going input threshold voltage V CC =5V,T A =25°C 1.7 2.4V V IT–Negative-going input threshold voltage V CC =5V,T A =25°C0.8 1.2V V hys Input hysteresis (V IT+–V IT–)0.20.51V r i Input resistanceV I =±3V to ±25V357k Ω(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Pulse skew is defined as |t PLH –t PHL |of each channel of the same device.6.6Switching Characteristicsover recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAXUNITDRIVER SECTIONMaximum data rateC L =50pF to 1000pF,R L =3k Ωto 7k ΩoneD OUT switching,see Figure 6120kbit/s t PLH(D)Propagation delay time,low-to high-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t PHL(D)Propagation delay time,high-to low-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t sk(p)Pulse skew (3)C L =150to 2500pF,R L =3k Ωto 7k Ω,see Figure 7300ns SR(tr)Slew rate,transition regionC L =50to 1000pF,R L =3k Ωto 7k Ω,V CC =5V,see Figure 63630V/µsRECEIVER SECTION (SEE Figure 8)t PLH(R)Propagation delay time,low-to high-level output C L =150pF 0.510µs t PHL(R)Propagation delay time,high-to low-level output C L =150pF 0.510µs t sk(p)Pulse skew (3)C L =150pF300ns6MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated6.7Typical Characteristicsat T A =25°C (unless otherwise noted)TEST CIRCUITVOLTAGE WAVEFORMS50%50%–3 V3 V1.5 V1.5 VOutputInputV OL V OHt PHL (R)t PLH (R)OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V 3 VOutputInputV OLV OHt PLH (D)t PHL (D)50%50%1.5 V1.5 VRS-232OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V3 VOutputInputV OLV OH t PLH (D)RS-232Outputt PHL (D)A)1.5 V1.5 V3 V –3 V3 V –3 VSR(tf) =6 Vt or t PHL(D PLH(D))7MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 6.Driver Slew RateA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 7.Driver Pulse SkewA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 8.Receiver Propagation Delay Times5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments Incorporated8MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated8Detailed Description8.1OverviewThe MAX202device is a dual driver and receiver that includes a capacitive voltage generator using four capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply.Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.These receivers have shorted and open fail safe.The receiver can accept up to ±30-V inputs and decode inputs as low as ±3V.Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels.Outputs are protected against shorts to ground.8.2Functional Block Diagram8.3Feature Description8.3.1PowerThe power block increases and inverts the 5-V supply for the RS-232driver using a charge pump that requires four 0.1-µF external capacitors.8.3.2RS-232DriverTwo drivers interface standard logic levels to RS-232levels.The driver inputs do not have internal pullup resistors.Do not float the driver inputs.8.3.3RS-232ReceiverTwo Schmitt trigger receivers interface RS-232levels to standard logic levels.Each receiver has an internal 5-k Ωload to ground.An open input results in a high output on ROUT.8.4Device Functional Modes8.4.1V CC Powered by 5-VThe device is in normal operation when powered by 5V.8.4.2V CC UnpoweredWhen MAX202is unpowered,it can be safely connected to an active remote RS-232device.DIN1DOUT1RIN1ROUT1DIN2DOUT2RIN2ROUT29MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated Device Functional Modes (continued)8.4.3Truth TablesTable 1and Table 2list the function for each driver and receiver (respectively).(1)H =high level,L =low levelTable 1.Function Table forEach Driver (1)INPUT DIN OUTPUT DOUTL H HL(1)H =high level,L =low level,Open =input disconnected or connected driver offTable 2.Function Table forEach Receiver (1)INPUT RIN OUTPUT ROUTL H H L OpenHFigure 9.Logic Diagram (Positive Logic)CBYPASS = 0.1F,m C10.1F,m 6.3 VCopyright © 2016,Texas Instruments Incorporated10MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationFor proper operation,add capacitors as shown in Figure 10.Pins 9through 12connect to UART or general purpose logic lines.RS-232lines on pins 7,8,13,and 14connect to a connector or cable.9.2Typical ApplicationA.C3can be connected to V CC or GND.B.Resistor values shown are nominal.C.Nonpolarized ceramic capacitors are acceptable.If polarized tantalum or electrolytic capacitors are used,they must be connected as shown.Figure 10.Typical Operating Circuit and Capacitor Values9.2.1Design Requirements •V CC minimum is 4.5V and maximum is 5.5V.•Maximum recommended bit rate is 120kbps.RVHBM MAX202 SLLS576F–JULY2003–REVISED SETPEMBER2016 Typical Application(continued)9.2.2Detailed Design Procedure9.2.2.1Capacitor SelectionThe capacitor type used for C1through C4is not critical for proper operation.The MAX202requires0.1-µF capacitors.Capacitors up to10µF can be used without harm.Ceramic dielectrics are suggested for the0.1-µF capacitors.When using the minimum recommended capacitor values,make sure the capacitance value does not degrade excessively as the operating temperature varies.If in doubt,use capacitors with a larger(for example, 2×)nominal value.The capacitors'effective series resistance(ESR),which usually rises at low temperatures, influences the amount of ripple on V+and V–.Use larger capacitors(up to10µF)to reduce the output impedance at V+and V–.Bypass V CC to ground with at least0.1µF.In applications sensitive to power-supply noise generated by the charge pumps,decouple V CC to ground with a capacitor the same size as(or larger than)the charge-pump capacitors(C1to C4).9.2.2.2ESD ProtectionMAX202devices have standard ESD protection structures incorporated on all pins to protect against electrostatic discharges encountered during assembly and handling.In addition,the RS-232bus pins(driver outputs and receiver inputs)of these devices have an extra level of ESD protection.Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of±15-kV when powered down.9.2.2.3ESD Test ConditionsStringent ESD testing is performed by TI based on various conditions and procedures.Please contact TI for a reliability report that documents test setup,methodology,and results.9.2.2.4Human-Body Model(HBM)The HBM of ESD testing is shown in Figure11.Figure12shows the current waveform that is generated during a discharge into a low impedance.The model consists of a100-pF capacitor,charged to the ESD voltage of concern,and subsequently discharged into the device under test(DUT)through a1.5-kΩresistor.Figure11.HBM ESD Test Circuit1001502005001.51.00.50.0I -AD U T MAX202SLLS576F –JULY 2003–REVISED SETPEMBER Typical Application (continued)Figure 12.Typical HBM Current Waveform9.2.3Application Curve120kbit/s,1-nF loadFigure 13.Driver and Receiver Loopback SignalMAX202 SLLS576F–JULY2003–REVISED SETPEMBER201610Power Supply RecommendationsThe V CC voltage must be connected to the same power source used for logic device connected to DIN and ROUT pins.V CC must be between4.5V and5.5V.11Layout11.1Layout GuidelinesKeep the external capacitor traces short.This is more important on C1and C2nodes that have the fastest rise and fall times.For best ESD performance,make the impedance from MAX202ground pin to the ground plane of the circuit board as low as e wide metal and multiple vias on both sides of ground pin.11.2Layout ExampleFigure14.MAX202Circuit Board LayoutMAX202SLLS576F–JULY2003–REVISED 12Device and Documentation Support12.1Receiving Notification of Documentation UpdatesTo receive notification of documentation updates,navigate to the device product folder on .In the upper right corner,click on Alert me to register and receive a weekly digest of any product information that has changed.For change details,review the revision history included in any revised document.12.2Community ResourcesThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 2(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant MAX202CDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202CDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202CPWR TSSOPPW 162000330.012.4 6.9 5.6 1.68.012.0Q1MAX202IDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202IDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202IPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) MAX202CDR SOIC D162500333.2345.928.6 MAX202CDWR SOIC DW162000367.0367.038.0 MAX202CPWR TSSOP PW162000367.0367.035.0 MAX202IDR SOIC D162500333.2345.928.6 MAX202IDWR SOIC DW162000367.0367.038.0MAX202IPWR TSSOP PW162000367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2016,Texas Instruments Incorporated。

数控系统代码信息大全，花了三天时间整理的做数控系统的朋友们福利来啦，这篇文章汇聚了大量数控系统代码信息，大家研究数控系统的可以收藏啦。

FANUC车床G代码FANUC铣床G代码FANUC M指令代码SIEMENS铣床 G代码SIEMENS802S/CM 固定循环SIEMENS802DM/810/840DM 固定循环SIEMENS车床 G 代码D刀具刀补号F进给率(与G4 一起可以编程停留时间)GG功能(准备功能字)G0快速移动G1直线插补G2顺时针圆弧插补G3逆时针园弧插补G33恒螺距的螺纹切削G4快速移动G63快速移动G74回参考点G75回固定点G17(在加工中心孔时要求)G18*Z/X平面G40刀尖半径补偿方式的取消G41调用刀尖半径补偿, 刀具在轮廓左侧移动G42调用刀尖半径补偿, 刀具在轮廓右侧移动G500取消可设定零点偏置G54第一可设定零点偏置G55第二可设定零点偏置G56第三可设定零点偏置G57第四可设定零点偏置G58第五可设定零点偏置G59第六可设定零点偏置G53按程序段方式取消可设定零点偏置G70英制尺寸G71*公制尺寸G90*绝对尺寸G91增量尺寸G94*进给率F，单位毫米/分G95主轴进给率F，单位毫米/转I插补参数I1圆弧插补的中间点K1圆弧插补的中间点L子程序名及子程序调用M辅助功能M0程序停止M1程序有条件停止M2程序结束M30M17M3主轴顺时针旋转M4主轴逆时针旋转M5主轴停M6更换刀具N副程序段P子程序调用次数RET子程序结束S主轴转速,在G4 中表示暂停时间T刀具号X坐标轴Y坐标轴Z坐标轴AR圆弧插补张角CALL循环调用CHF倒角，一般使用CHR倒角轮廓连线CR圆弧插补半径GOTOB向后跳转指令GOTOF向前跳转指令RND圆角支持参数编程SIEMENS 801、802S/CT、 802SeT 固定循环LCYC82 钻削，沉孔加工LCYC83 深孔钻削LCYC840 带补偿夹具的螺纹切削LCYC84 不带补偿夹具的螺纹切削LCYC85 镗孔LCYC93 切槽循环LCYC95 毛坯切削循环LCYC97 螺纹切削SIEMENS 802D、810D/840D 固定循环CYCLE71 平面铣削CYCLE82 中心钻孔YCLE83 深孔钻削CYCLE84 刚性攻丝CYCLE85 铰孔CYCLE86 镗孔CYCLE88 带停止镗孔CYCLE93 切槽CYCLE94 退刀槽形状E..FCYCLE95 毛坯切削CYCLE97 螺纹切削HNC车床G代码HNC铣床G代码*G0001 定位 (快速移动)G01直线切削G02顺时针切圆弧G03逆时针切圆弧G0400 暂停G0716 虚轴指定G0900 准停校验*G1702 XY 面赋值G18XZ 面赋值G19YZ 面赋值G2008 英寸输入*G21毫米输入G22脉冲当量G2403 镜像开*G25镜像关G2800 返回到参考点G29由参考点返回*G4007 取消刀具直径偏移G41刀具直径左偏移G42刀具直径右偏移G4308 刀具长度 + 方向偏移G44刀具长度 - 方向偏移*G49取消刀具长度偏移*G5004 缩放关G51缩放开G5200 局部坐标系设定G53直接机床坐标系编程*G5414 工件坐标系1选择G55工件坐标系2选择G56工件坐标系3选择G57工件坐标系4选择G58工件坐标系5选择G59工件坐标系6选择G6000 单方向定位*G6112 精确停止校验方式G64连续方式G6805 旋转变换*G69旋转取消G7309 高速深孔钻削循环G74左螺旋切削循环G76精镗孔循环*G80取消固定循环G81中心钻循环G82反镗孔循环G83深孔钻削循环G84右螺旋切削循环G85镗孔循环G86镗孔循环G87反向镗孔循环G88镗孔循环G89镗孔循环*G9003 使用绝对值命令G91使用增量值命令G9200 设置工件坐标系*G9414 每分钟进给G95每转进给*G9810 固定循环返回起始点G99返回固定循环R点支持参数与宏编程HNC M指令M00 程序停M01 选择停止M02 程序结束(复位)M03 主轴正转 (CW)M04 主轴反转 (CCW)M05 主轴停M06 换刀M07 切削液开M09 切削液关M98 子程序调用M99 子程序结束KND100铣床G代码G00 01定位 (快速移动)G01直线切削G02顺时针切圆弧G03逆时针切圆弧G04 00暂停G1702XY 面赋值G18XZ 面赋值G19YZ 面赋值G28 00 机床返回原点G29从参考点返回*G40 07取消刀具直径偏移G41刀具直径左偏移G42刀具直径右偏移*G43 08 刀具长度 + 方向偏移*G44刀具长度 - 方向偏移G49取消刀具长度偏移*G53 14 机床坐标系选择G54 工件坐标系1选择G55 工件坐标系2选择G56 工件坐标系3选择G57工件坐标系4选择G58 工件坐标系5选择G59工件坐标系6选择G73 09 高速深孔钻削循环G74 左螺旋切削循环G76 精镗孔循环*G80 取消固定循环G81钻孔循环（点钻）G82 钻孔循环（镗阶梯孔）G83 深孔钻削循环G84 攻丝循环G85 镗孔循环G86 钻孔循环G87反向镗孔循环G88镗孔循环G89镗孔循环*G90 03 使用绝对值命令G91 使用增量值命令G92 00 设置工件坐标系*G9810固定循环返回起始点*G99返回固定循环R点KND100车床G代码G00 01定位 (快速移动)G01直线切削G02顺时针切圆弧 (CW，顺时钟)G03逆时针切圆弧 (CCW，逆时钟)G04 00暂停 (Dwell)G10偏移值设定G20 06英制输入G21公制输入G27 00检查参考点返回G28参考点返回G29从参考点返回G31跳跃机能G32 01切螺纹G36 X轴自动刀偏设定G37Z轴自动刀偏设定G40 07取消刀尖半径偏置G41刀尖半径偏置 (左侧) G42刀尖半径偏置 (右侧) G50 00坐标系设定G54工件坐标系G55---G59工件坐标系G70 00 精加工循环G71内外径粗切循环G72台阶粗切循环G73成形重复循环G74端面深孔加工循环G75外圆、内圆切削循环G76切螺纹循环G90 01(内外直径)切削循环G92切螺纹循环G94(台阶) 切削循环G96 12恒线速度控制G97恒线速度控制取消G98 05每分钟进给率G99 每转进给率KND100 M指令M代码说明M00程序停M01选择停止M02程序结束(复位)M03主轴正转 (CW)M04主轴反转 (CCW)M05主轴停M06换刀M08切削液开M09切削液关M10卡紧M11松开M32润滑开M33润滑关M98子程序调用M99子程序结束GSK980车床G代码G代码组别功能G0001定位（快速移动）*G01直线插补（切削进给）G02圆弧插补CW（顺时针）G03圆弧插补CCW（逆时针）G0400暂停，准停G28返回参考点G3201螺纹切削G5000坐标系设定G65宏程序命令G7000精加工循环G71外圆粗车循环G72端面粗车循环G73封闭切削循环G74端面深孔加工循环G75外圆，内圆切槽循环01外圆，内圆车削循环G92螺纹切削循环端面切削循环G9602恒线速开G97恒线速关*G9803每分进给G99每转进给支持参数与宏编程GSK980T M指令M代码说明M03主轴正转M04主轴反转M05主轴停止M08冷却液开M09冷却液关（不输出信号）M32润滑开M33润滑关（不输出信号）M10备用M11备用尖（不输出信号）M00程序暂停，按'循环起动'程序继续执行M30程序结束，程序返回开始GSK928 TC/TE G代码G代码功能G00定位（快速移动）*G01直线插补（切削进给）G02圆弧插补CW（顺时针）G03圆弧插补CCW（逆时针）G32攻牙循环G33螺纹切削G71外圆粗车循环G72端面粗车循环G74端面深孔加工循环G75外圆，内圆切槽循环G90外圆，内圆车削循环G92螺纹切削循环G94外圆内圆锥面循环G22局部循环开始G80局部循环结束*G98每分进给G99每转进给G50设置工件绝对坐标系G26X、Z轴回参考G27X轴回参考点G29Z轴回参考点支持参数与宏编程GSK928 TC/TE M指令M代码说明M03主轴正转M04主轴反转M05主轴停止M08冷却液开M09冷却液关（不输出信号）M32润滑开M33润滑关（不输出信号）M10备用M11备用尖（不输出信号）M00程序暂停，按'循环起动'程序继续执行M30程序结束，程序返回开始GSK990M G代码G代码组别解释G0001定位 (快速移动)G01直线切削G02顺时针切圆弧G03逆时针切圆弧G0400暂停G1702XY 面赋值G18XZ 面赋值G19YZ 面赋值G2800机床返回原点G29从参考点返回*G4007取消刀具直径偏移G41刀具直径左偏移G42刀具直径右偏移*G4308刀具长度 + 方向偏移*G44刀具长度 - 方向偏移G49取消刀具长度偏移*G5314机床坐标系选择G54工件坐标系1选择G55工件坐标系2选择G56工件坐标系3选择G57工件坐标系4选择G58工件坐标系5选择G59工件坐标系6选择G7309高速深孔钻削循环G74左螺旋切削循环G76精镗孔循环*G80取消固定循环G81钻孔循环（点钻）G82钻孔循环（镗阶梯孔）G83深孔钻削循环G84攻丝循环G85镗孔循环G86钻孔循环G87反向镗孔循环G88镗孔循环G89镗孔循环*G9003使用绝对值命令G91使用增量值命令G9200设置工件坐标系*G9810固定循环返回起始点*G99返回固定循环R点GSK990M M指令M代码说明M00程序停M01选择停止M02程序结束(复位)M03主轴正转 (CW)M04主轴反转 (CCW)M05主轴停M06换刀M08切削液开M09切削液关M10卡紧M11松开M32润滑开M33润滑关M98子程序调用M99子程序结束GSK928MA G代码G代码解释G00定位 (快速移动)G1直线切削G02顺时针切圆弧G03逆时针切圆弧G04延时等待G17XY 面赋值G18XZ 面赋值G19YZ 面赋值G28机床返回原点G29从参考点返回*G40取消刀具直径偏移G41刀具直径左偏移G42刀具直径右偏移*G43刀具长度 + 方向偏移*G44刀具长度 - 方向偏移G49取消刀具长度偏移*G53机床坐标系选择G54工件坐标系1选择G55工件坐标系2选择G56工件坐标系3选择G57工件坐标系4选择G58工件坐标系5选择G59工件坐标系6选择G73高速深孔钻削循环G74左螺旋切削循环G80取消固定循环G81钻孔循环（点钻）G82钻孔循环（镗阶梯孔）G83深孔钻削循环G84右旋攻牙循环G85镗孔循环G86钻孔循环G89*G90使用绝对值命令G91使用增量值命令G92设置浮动坐标系*G98固定循环返回起始点*G99返回固定循环R点G10 G11圆凹槽内粗铣G12 G13全圆内精铣G14 G15外圆精铣G22系统参数运算（模态）G23判参数值跳转G27机械零点检测G28经中间点快速定位到程序G31快速返回R基准面G34 G35矩形凹槽内精铣G38 G39GSK928MA M指令M指令解释M0程序停止。