SMT不良描述中英文对照

[replyview]不良现象中英文对照表1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONGSTAMPS)2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏(DIODE NG)4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG)5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBESWRONG)7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCEWRONG)8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REVWRONG)9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NONREV LEBEL)11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPSDEFECTIVE)13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.卷标歪斜(LABELTILT)14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTONDAMAGED)15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE)16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.锡桥(SOLDER BRIDGE) 44.零件脚长(PARTS PIN LONG) 71.缺UL卷标(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)20.异物(FOREIGNER MATERIAL) 47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED) 75.包装文件错(RACKING DOC WRONG)22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRONG)23.锡不足(SOLDER INSUFFICIENT) 50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS) 78.金手指沾胶(GLUE ON GOLDEN FINGERS)25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS) 79.垫片安装不良(WASHER UNSEATED)26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.线材安装不良(WIRE UNSEATED)27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING) 81. 立碑(TOMBSTONE)。

不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。

21.缺件(MISSING PARTS)28.脚未??(PIN NOT BENT)55.印章错误(WRONG STAMPS)2.错件(WRONG PARTS)29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺标签(MISSING LABEL) 57.二极管坏(DIODE NG)4.短路(SHORT) 31.缺序号(MISSING S/N)58.晶体管坏(TRANSISTOR NG)5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)6.线短(WIRE SHORT) 33.标签错(WRONG LABEL) 60.管装错误(TUBES WRONG)7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG)8.拐线(WIRE POOR DDRESS)35.脚太短(PIN SHORT) 62.版本错误(REV WRONG)9.冷焊(COLD SOLDER)36.J1不??(J1 DIRTY) 63.电测不良(TEST FAILURE)10.包焊(EXCESS SOLDER)37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL)11.空焊(MISSING SOLDER)38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)12.锡尖(SOLDER ICICLE)39.未测试(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)13.锡渣(SOLDER SPLASH)40.VR变形(VR DEFORMED) 67.标签歪斜(LABEL TILT)14.锡裂(SODER CRACK)41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTON DAMAGED)15.锡洞(PIN HOLE)42.PCB??曲(PCB TWIST) 69.点胶不良(POOR GLUE)16.锡球(SOLDER BALL)43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.锡桥(SOLDER BRIDGE)44.零件脚长(PARTS PIN LONG)71.缺UL标签(MISSING UL LABEL)18.滑牙(SCREW LOOSE)45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)20.异物(FOREIGNER MATERIAL)47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED)75.包装文件错(RACKING DOC WRONG)22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRONG)23.锡不足(SOLDER INSUFFICIENT)50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS)78.金手指沾胶(GLUE ON GOLDEN FINGERS)25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS)79.垫片安装不良(WASHER UNSEATED)26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT)80.线材安装不良(WIRE UNSEATED)27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING)81. 立碑(TOMBSTONE)第 1 页。

常用英语词汇与缩写：Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化AOI（Automatic optical inspection）：自动光学检查Assembly：组件ATE（Automated test equipment）：自动测试设备Bare Chip：裸芯片BGA（Ball grid array）球栅列阵Blind via：盲孔Blowholes：吹孔Bridge：锡桥Bridging：搭锡bulk feeder：散装式供料器Buried via：埋孔Chamber System：炉膛系统Chip：片状元件Circuit tester：电路测试机cleaning after soldering：焊后清洗Cold solder joint：冷焊锡点Component Check：元件检查Component density：元件密度Component Pick-Up：元件拾取Component Transport：元件传送Component：元件convection reflow soldering：热对流再流焊Copper Clad Laminates：覆铜箔层压板Copper foil：铜箔Copper mirror test：铜镜测试CSP（Chip Scale Package）：芯片规模的封装CTE（Coefficient of the thermal expansion）：温度膨胀系数Cure：烘焙固化Cursting：发生皮层Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Desoldering：卸焊Device：器件Dewetting：缩锡DIP：双列直插Downtime：停机时间Dpm（defects per million）：百万缺陷率dual wave soldering：双波峰焊Dull Joint：焊点灰暗Environmental test：环境测试Eutectic solders：共晶焊锡Excessive Paste：膏量太多FCT（Functional test）：功能测试feeder holder：供料器架feeders：供料器Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Flexibility：柔性flexible stencil：柔性金属漏版Flip chip：倒装芯片flux bubbles：焊剂气泡flying：飞片FPT（Fine-pitch technology）：密脚距技术Full liquidus temperature：完全液化温度Golden boy：金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层）Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment：中速贴装机Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂high speed placement equipment：高速贴装机hot air reflow soldering：热风再流焊ICT（In-circuit test）：在线测试In-circuit test：在线测试Insufficient Paste：膏量不足JIT（Just-in-time）：刚好准时laser reflow soldering：激光再流焊LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体Lead configuration：引脚外形Line certification：生产线确认located soldering：局部软钎焊low speed placement equipment：低速贴装机low temperature paste：低温焊膏Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Manhattan effect：曼哈顿现象melf：圆柱形元件metal stencil：金属漏版Misalignment：偏斜Modularity：模块化Movement：移位no-clean solder paste：免清洗焊膏Non-Dewetting：不沾锡Nonwetting：不熔湿的optic correction system ：光学校准系统Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备past mask：焊膏膜(漏板）paste shelf life：焊膏贮存寿命PCB（Printed circuit board）：印刷电路板Pick-and-place：拾取-贴装设备placement accuracy：贴装精度placement direction：贴装方位Placement equipment：贴装设备placement pressure：贴装压力Placement Procedure：元件放置placement speed：贴装速度PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体Poor Tack Retention：粘着力不足precise placement equipment：精密贴装机PTH （Pin Through the Hole）：通孔安装QFP（Quad Flat Package）：多引脚方形扁平封装Reflow soldering：回流焊接Repair：修理Repeatability：可重复性Rheology：流变学repeatability：重复性resolution：分辨率Rework：返工rotating deviation：旋转偏差Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体。

品质管理英语词汇大全Cosmetic Defect Terms1. Soldering Quality2.错件（WRONG PARTS）3.多件（EXCESSIVE PARTS）4.短路（SHORT）5.断路（OPEN）6.线短（WIRE SHORT）7.线长（WIRE LONG）8.拐线（WIRE POOR DDRESS）9.冷焊（COLD SOLDER）10.包焊（EXCESS SOLDER）11.空焊（MISSING SOLDER）12.锡尖（SOLDER ICICLE）13.锡渣（SOLDER SPLASH）14.锡裂（SODER CRACK）15.锡洞（PIN HOLE）16.锡球（SOLDER BALL）17.锡桥（SOLDER BRIDGE）18.滑牙（SCREW LOOSE）19.氧化（RUST）20.异物（FOREIGNER MA TERIAL）21.溢胶（EXCESSIVE GLUE）22.锡短路（SOLDER BRIDGE）23.锡不足（SOLDER INSUFFICIENT）24.极性反（WRONG POLARITY）25.脚未入（PIN UNSEATED）26.脚未出（PIN UNVISIBLE）27.脚未剪（PIN NO CUT）28.脚未弯（PIN NOT BENT）29.缺盖章（MISSING STAMP）30.缺标签（MISSING LABEL）31.缺序号（MISSING S/N）32.序号错（WRONG S/N）33.标签错（WRONG LABEL）34.标示错（WRONG MARK）35.脚太短（PIN SHORT）36.J1不洁（J1 DIRTY）37.锡凹陷（SOLDER SCOOPED）38.线序错（W/L OF WIRE）39.未测试（NO TEST）40.VR变形（VR DEFORMED）41.PCB翘皮（PCB PEELING）42.PCB弯曲（PCB TWIST）43.零件沾胶（GLUE ON PARTS）44.零件脚长（PARTS PIN LONG）45.浮件（PARTS LIFT）46.零件歪斜（PARTS TILT）47.零件相触（PARTS TOUCH）48.零件变形（PARTS DEFORMED）49.零件损坏（PARTS DAMAGED）50.零件脚脏（PIN DIRTY）51.零件多装（PARTS EXCESS）52.零件沾锡（SOLDER ON PARTS）53.零件偏移（PARTS SHIFT）54.包装错误（WRONG PACKING）55.印章错误（WRONG STAMPS）56.尺寸错误（DIMENSION WRONG）57.二极管坏（DIODE NG）58.晶体管坏（TRANSISTOR NG）59.振荡器坏（X'TL NG）60.管装错误（TUBES WRONG）61.阻值错误（IMPEDANCE WRONG）62.版本错误（REV WRONG）63.电测不良（TEST FAILURE）64.版本未标（NON REV LEBEL）65.包装损坏（PACKING DAMAGED）66.印章模糊（STAMPS DEFECTIVE）67.标签歪斜（LABEL TILT）68.外箱损坏（CARTON DAMAGED）69.点胶不良（POOR GLUE）70.IC座氧化（SOCKET RUST）71.缺UL标签（MISSING UL LABEL）72.线材不良（WIRE FAILURE）73.零件脚损坏（PIN DAMAGED）74.金手指沾锡（SOLDER ON GOLDEN FINGERS）75.包装文件错（RACKING DOC WRONG）76.包装数量错（PACKING Q'TY WRONG）77.零件未定位（PARTS UNSEATED）78.金手指沾胶（GLUE ON GOLDEN FINGERS）79.垫片安装不良（W ASHER UNSEATED）80.线材安装不良（WIRE UNSEATED）81.立碑（TOMBSTONE）SMT 不良描述中英文对照1 露底材Base material expose2 偏位Shift3 短路/连锡Short4 少锡Insufficient solder5 多锡/包焊Excess solder6 漏印Missing print7 反白Upside down8 少件Missing component9 反向Wrong orientation10 错件Wrong component11 多件/残件Extra component12 破损Damaged13 空焊No solder14 立碑Tombstoning15 锡珠Solder balls16 侧立Side termination17 零件氧化Parts oxidation18 锡尖Solder projection19 浮高Float20 翘脚Lifted lead21 PAD不上锡PAD discoloration22 针洞Pinholes23 压件Cover component24 残异物Residues25 助焊剂残留Flux residues26 少胶Insufficient glue27 溢胶Overflow glue28 误判No Fail29 其它Other30 印刷不良Print Defect31 上盖脱落/断裂Top cover missing/crack32 掉件/撞件Drop component33 内PIN翘起（缺PIN/短PIN/翘PIN）Lifted inside-pin34 版本混装Mixed edition35 线路偏移Circuit shift36 错位Error position37 脚歪/变形Lead deformed/deformation38 混料Mixed material39 胶未固化Glue not be solidified40 烫伤Scald41 堵孔Obstacle on via42 PCB白化/分层PCB Delamination43 漏洞Exposed copper44 无极性Missing polarity45 压伤Crush46 漏点胶Missing glue47 气泡Air bubble48 屏蔽架变形Shield Deformation49 屏蔽架毛刺Shield Burr50 刮伤Scraped51 弹片翘起Spring lifted52 弹片失效Spring failure53 弹片无法复位Spring can’t replace54 零件沾锡Solder on parts序号汉语意义英文翻译焊锡质量类1 冷焊cold solder2 零件偏移component shifted3 污损contamination4 坏件damaged component5 锡多excessive solder6 装插不良improper insertion7 绝缘不良insulation damaged 8 线脚长lead protrusion out of spec9 漏点胶missing glue 10 漏标示missing marking11 近似短路near short 12 无线尾no lead protruded13 翘皮peeling off 14 极性反polarity reversed15 成型不良poor preforming 16 锡桥solder bridge17 锡裂solder crack 18 锡尖solder icicle19 锡少solder insufficient 20 防焊漆胶落solder mask peeling off 21 锡渣solder spatter 22 锡洞solder void23 错件wrong partICT Fail Cause and Repair Actions1 短路Short2 零件插反Backward Part3 板丢失Board Lost4 板修复Board Repaired5 板报废Board Scrapped6 板送去分析Board Sent For Analysis7 零件损坏Broken Part8 零件缺陷Defective Part9 掉件Missing part 10 加零件Part Added11 零件修复Part Repaired 12 换零件Part Replaced13 PCB缺陷PCB Defect 14 PCB开路PCB Open15 加锡Solder Added 16 桥焊Solder Bridge17 去锡Solder RemovedSolding quality1 空焊Empty Solder2 包焊Excess Solder3 浮焊Floating Solder4 冰柱Icing5 虚焊Inveracious Soldering6 掉件，漏件Missing Component7 开路Open 8 漏焊Open Solder9 锡桥Solder Bridge 10 锡尖突出Solder Tip11 锡裂Split SolderOperational defect terms1 零件插反Backward Part2 零件损坏Broken Part3 碰伤Bumps4 异物Foreign Part5 零件错位Misaligned Part6 漏件Missing Parts (component)7 粘胶Paint Adhesion 8 刮伤Scratches9 错件Wrong PartOthers1 不正常Abnormal2 附件Accessory3 外观Apperance4 装配Assembling5 附着，贴附Attached6 弯曲Bent7 束线Bind 8 翘皮Blister/peeling9 接Bridge 10 破损Broken11 毛边Burrs 12 裂纹Chip / crack13 夹住Clip 14 污染Contamination15 腐蚀Corrosion 16 交叉Cross17 损坏Damage 18 减少Decrease19 深刮伤Deep Scratch 20 缺点Defect21 变形Deformed 22 凹痕Dent23 偏差Deviation 24 尺寸Dimension25 变色(白化) Discoloration 26 化状箱Display box 27 双重Double 28 脱落Drop , Tall off29 超过Excess 30 假焊False Solder (Cold) 31 频率Fequency 32 塞住Fill Up33 浮Float 34 异物Foreign Material 35 碎片塞Fragement 36 胶Glue37 溢胶Glue overflow 38 重Heavy39 不清楚illegible 40 不完全Incomplete41 增加Increase 42 确认Indentify43 指示灯Indicate Lamp 44 不合治具Ingagued45 未固定Insecurely 46 插配Insertion47 内部Inside 48 干扰Interference49 间断，不安定Intermittent 50 杂物Junk51 纠缠Kink 52 布置，配置Layout53 线脚Lead 54 浅音Leakage Sound55 翘起Lifted 56 轻Light57 位置Location 58 松Loose59 方向不对Misorientation 60 未镀表层Misplating61 欠缺Missing 62 混Mix63 多重Multiple 64 不良No Good (NG)65 偏心Off center 66 振荡Oscillation67 外部Outsid 68 脱漆Paint drop69 部分Partial 70 铜箔Pattem (PAD）71 太差Poor 72 凸Protrude73 残留物Residue 74 粗糙Roughness75 生锈Rust 76 LED 数字分节Segment77 陷Sink 78 滑动Slide79 脱落Slip 80 锡珠Solder Ball81 流锡Solder Flow 82 分开，分隔Sparation83 污点Stain 84 粘Stick85 薄Thickness 86 紧Tight87 透明Transparent 88 不平Uneven89 不顺Unsmooth 90 上下颠倒Upside down91 漆Varnish Paint 92 缺洞V oid (Holes)93 弱WeakSMT中英文对照1. Fundamentals of Solders and Soldering（焊料及焊接基础知识）Soldering Theory（焊接理论）Microstructure and Soldering（显微结构及焊接）Effect of Elemental Constituents on Wetting（焊料成分对润湿的影响）Effect of Impurities on Soldering（杂质对焊接的影响）2. Solder Paste Technology（焊膏工艺）Solder Powder ( 锡粉)Solder Paste Rheology（锡膏流变学）Solder Paste Composition & Manufacturing（锡膏成分和制造）3. SMT Problems Occurred Prior to Reflow（回流前SMT问题）Flux Separation（助焊剂分离)Paste Hardening（焊膏硬化）Poor Stencil Life（网板寿命问题)Poor Print Thickness（印刷厚度不理想）Poor Paste Release From Squeegee（锡膏脱离刮刀问题）Smear（印锡模糊）Insufficiency（印锡不足）Needle Clogging（针孔堵塞）Slump（塌落）Low Tack（低粘性）Short Tack Time （粘性时间短）4. SMT Problems Occurred During Reflow（回流过程中的SMT问题）Cold Joints（冷焊）Nonwetting（不润湿）Dewetting（反润湿）Leaching（浸析）Intermetallics（金属互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（桥连）V oiding（空洞）Opening（开路）Solder Balling(锡球)Solder Beading（锡珠）Spattering（飞溅）5. SMT Problems Occurred at Post Reflow Stage（回流后问题）White Residue（白色残留物）Charred Residue（炭化残留物）Poor Probing Contact（探针测接问题）Surface Insulation Resistance or Electrochemical Migration Failure（表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants （分层/ 空洞/ 敷形涂覆或包封的固化问题）6. Challenges at BGA and CSP Assembly and Rework Stage（BGA、CSP组装和翻修的挑战）Starved Solder Joint（少锡焊点）Poor Self-Alignment（自对位问题）Poor Wetting（润湿不良）V oiding（空洞）Bridging（桥连）Uneven Joint Height（焊点高度不均）Open（开路）Popcorn and Delamination（爆米花和分层）Solder Webbing（锡网）Solder Balling（锡球）7. Problems Occurred at Flip Chip Reflow Attachment（倒装晶片回流期间发生的问题）Misalignment（位置不准）Poor Wetting（润湿不良）Solder V oiding（空洞）Underfill V oiding（底部填充空洞）Bridging（桥连）Open（开路）Underfill Crack（底部填充裂缝）Delamination（分层）Filler Segregation（填充分离）Insufficient Underfilling（底部填充不充分）8. Optimizing Reflow Profile via Defect Mechanisms Analysis （回流曲线优化与缺陷机理分析）Flux Reaction（助焊剂反应）Peak Temperature（峰值温度）Cooling Stage（冷却阶段）Heating Stage（加热阶段）Timing Considerations（时间研究）Optimization of Profile（曲线优化）Comparison with Conventional Profiles（与传统曲线的比较）Discussion（讨论）Implementing Linear Ramp Up Profile(斜坡式曲线)。

不良描述中英文对照不良描述中英文对照Goods Supplement补货1.Plastic parts 塑胶部件Abrasion/划痕、Bubbles/气泡、Burrs/毛刺、Bad Plating/电镀不良、Contamination/杂质、Crack/爆裂、Combine Lines/结合线、Deformation/变形、Flow Marks/流痕、GreasyDirt/油污、Haze/雾状、Jelly/泠胶、Mold Marks/模痕、Melange Color/混色、Oppilation Hole/盲孔、Pull White/拉白、Wrong Stamping/字麦不符、Short Shots/缺料、Shrinkage/缩水、Stripped Screw/螺丝滑牙、Top White/顶白、Weld Lines/夹水纹、Wrong Dimension/尺寸不符、Wrong Texture/纹理错误、Light/发亮，Gaps裂缝、Steps 披峰、表面有手指印Surface finger prints、丝印错误Wrong printing、丝印偏移Printing slanted、丝印重影Printing double image、丝印有污点，拖尾Printing smearing、丝印不平坦（多油或少油）Printing uneven ( thin / thick )、丝印对于中心偏位Printing off centre、压痕或凹痕Press mark 或dented mark、反光或毛刺Flashing 或 burr、镜片有针孔Pin hole on lens.光泽luster/白点white dot、黑点black dot、装配不合格assembled NG、缺口Nick裂split2.Metal Parts 五金部件Abrasion/划痕、Bad Weld/焊接不良、Burrs/毛刺、Bad Plating/电镀不良、Bend angle/折弯角度、Contamination/杂质、Crack/爆裂、Deformation/变形、Dents/凹痕、Greasy Dirt/油污、Mold Marks/模痕、Missing Stamp/漏冲压、Oppilation Hole/盲孔、Pressing Marks/压痕、Rust/生锈、Wrong Stamping/字麦错误、Short Shots/缺料、Stripped Screw/螺丝滑牙、Pits/疤痕、Specks/斑点、Wrong Texture/纹理错误、Wrong Dimension/尺寸不符3.Painting partsSilkScreen parts 喷油/丝印部件Inspection Points /检查要点 :Bleeding/渗色 ,Bad Painting/喷油不良 ,Contamination/杂质 ,deviate position/偏位 ,Flow Marks/流痕 ,Missing paint/漏喷,Over Paint/肥油 ,Pits/疤痕 ,Poor Adhesion/附着力差 ,Print Words Leans/印刷字体倾斜 ,Pooring Paint/薄油,Silkscreen Haze/丝印模糊 ,Silkscreen Stamping Inconsistency/丝印字样不一致 , Scratch/划伤 ,Speck/斑点 ,Uneven Surface Oil/表面油层不均匀 ,Words Break Off/字体断开 ,Wrong Color/错误颜色 ,Wrong Texture/纹理错误 ;4.PCB 印制线路板Open/开路;Short/短路;Weave Texture/板料席纹;Foreign Residue/外来杂物;Delamination/爆板,分层;Dent/凹陷;Dent on G/F/金手指凹陷;Scratch/擦花;Misregistration/对位不正;Board Damage/板子损坏;C/M Illegible/白字不清;C/M on pad/白字上垫;Copper expoure/露铜;Solder Mask on Pad/绿油上垫;Uneven Solder Mask/绿油不平均;Solder Mask peeling off/绿油脱落;Missing Hole/漏孔;Excess Hole/多孔;Wrong Hole Size/孔径错误;Hole Breakout/崩孔;Nick Trace/线路缺口;Void on Trace/线路铜穿;Diskdown/线路不良/狗牙;Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良; Foreign matter under Solder Mask/绿油下杂物; Solder Mask skipping/不过油;Solder on Gold Finger/金手指上锡;Poor Bevelling/斜边不良;Gold Finger burrs/金手指损坏;Ping Ring/粉红圈5.Electronic parts 电子元件No AVL/没AVL;not on AVL/不在AVL上;Mfg/Mfg P/N dis-match AVL/ 与AVL不符;D/C overdue/ D/C 过期;无D/C;wrong part/错料;no reel/无卷轴;bulk packing for chip/ 散装;No dry packing(HIC change color)/ 无真空包装(防潮卡变色); No ESD packing/无防静电包装;illegible marking/印字不清,wrong marking/印字错;deformation/变型 ;micro crack/裂料;damaged part/ 烂料 ;Lead bent(PTH/SMT)/脚弯;Solder balls damaged/锡球坏wrong lead form/脚型错;wrong pitch/脚距不符;coplanar problem/平整度不良;pad(lead) oxidization/锡垫(引脚)氧化;wrong direction in tape(tray)/带中(盘中)方向错;short pins/引脚短;failed in solderability/ 焊锡不良;size(dimensions) out of specification/ 尺寸超标;function fail/ 功能不良;no tolerance/无误差范围;contamination/杂质;wrong identification for pin1/ 第1脚标识错. Broker Buy/炒料;(巻装物料)巻带前无空余巻带No blank cover tape for feeder loading 巻带粘力不足Not enough adhesive for the cover tape. 料盘变形Reel Deforming/卷带变型.。

41.PCB翘⽪（PCB PEELING） 42.PCB弯曲（PCB TWIST） 43.零件沾胶（GLUE ON PARTS） 44.零件脚长（PARTS PIN LONG） 45.浮件（PARTS LIFT） 46.零件歪斜（PARTS TILT） 47.零件相触（PARTS TOUCH） 48.零件变形（PARTS DEFORMED） 49.零件损坏（PARTS DAMAGED） 50.零件脚脏（PIN DIRTY） 51.零件多装（PARTS EXCESS） 52.零件沾锡（SOLDER ON PARTS） 53.零件偏移（PARTS SHIFT） 54.包装错误（WRONG PACKING） 55.印章错误（WRONG STAMPS） 56.尺⼨错误（DIMENSION WRONG） 57.⼆极管坏（DIODE NG） 58.晶体管坏（TRANSISTOR NG） 59.振荡器坏（X'TL NG） 60.管装错误（TUBES WRONG） 61.阻值错误（IMPEDANCE WRONG） 62.版本错误（REV WRONG） 63.电测不良（TEST FAILURE） 64.版本未标（NON REV LEBEL） 65.包装损坏（PACKING DAMAGED） 66.印章模糊（STAMPS DEFECTIVE） 67.标签歪斜（LABEL TILT） 68.外箱损坏（CARTON DAMAGED） 69.点胶不良（POOR GLUE） 70.IC座氧化（SOCKET RUST） 71.缺UL标签（MISSING UL LABEL） 72.线材不良（WIRE FAILURE） 73.零件脚损坏（PIN DAMAGED） 74.⾦⼿指沾锡（SOLDER ON GOLDEN FINGERS） 75.包装⽂件错（RACKING DOC WRONG） 76.包装数量错（PACKING Q'TY WRONG） 77.零件未定位（PARTS UNSEATED） 78.⾦⼿指沾胶（GLUE ON GOLDEN FINGERS） 79.垫⽚安装不良（WASHER UNSEATED） 80.线材安装不良（WIRE UNSEATED） 81.⽴碑（TOMBSTONE）。