FT24C16`FT24C08 资料完整版
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F MDCo nf i de n t i al© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page1Two-Wire Serial EEPROM32K, 64K (8-bit wide)FEATURES❑Low voltage and low power operations:FT24C32A/64A: V CC = 1.8V to 5.5V❑ Maximum Standby current < 1µA (typically 0.02µA and 0.06µA @ 1.8V and 5.5V respectively). ❑ 32 bytes page write mode.❑ Partial page write operation allowed.❑ Internally organized: 4,096 × 8 (32K), 8,192 × 8 (64K). ❑ Standard 2-wire bi-directional serial interface. ❑ Schmitt trigger, filtered inputs for noise protection. ❑ Self-timed Write Cycle (5ms maximum).❑ 800 kHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility. ❑ Automatic erase before write operation.❑ Write protect pin for hardware data protection.❑ High reliability: typically 1, 000,000 cycles endurance. ❑ 100 years data retention.❑ Industrial temperature range (-40℃ to 85℃).❑Standard 8-lead DIP/SOP/ MSOP/TSSOP/DFN and 5-lead SOT23/TSOT23 Pb-free packages.DESCRIPTIONThe FT24C32A/64A series are 32,768/65,536 bits of serial Electrical Erasable and Programmable Read Only Memory, commonly known as EEPROM. They are organized as 4096/8192 words of 8 bits (one byte) each. The devices are fabricated with proprietary advanced CMOS process for low power and low voltage applications. These devices are available in standard 8-lead DIP, 8-lead SOP, 8-lead MSOP, 8-lead TSSOP, 8-lead DFN, 5-lead SOT23, and 5-lead TSOT23 packages. A standard 2-wire serial interface is used to address all read and write functions. Our extended V CC range (1.8V to 5.5V) devices enables wide spectrum of applications.PIN CONFIGURATIONPin Name Pin Function A2, A1, A0 Device Address Inputs SDA Serial Data Input / Open Drain Output SCL Serial Clock Input WP Write Protect NC No-ConnectF MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page2All these packaging types come in Pb-free certified.VCC WP SCL SDAA2A1A0GND8L DIP 8L SOP8L TSSOP 8L MSOP 8L DFN5L SOT235L TSOT23ABSOLUTE MAXIMUM RATINGSIndustrial operating temperature: -40℃ to 85℃ Storage temperature:-50℃ to 125℃Input voltage on any pin relative to ground: -0.3V to V CC + 0.3V Maximum voltage: 8VESD Protection on all pins: >2000V* Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to the device. Functional operation of the device at conditions beyond those listed in the specification is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality .F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page3PIN DESCRIPTIONS(A) SERIAL CLOCK (SCL)The rising edge of this SCL input is to latch data into the EEPROM device while the falling edge of this clock is to clock data out of the EEPROM device. (B) DEVICE / CHIP SELECT ADDRESSES (A2, A1, A0)These are the chip select input signals for the serial EEPROM devices. Typically, these signals are hardwired to either V IH or V IL . If left unconnected, they are internally recognized as V IL . (C) SERIAL DATA LINE (SDA)SDA data line is a bi-directional signal for the serial devices. It is an open drain output signal and can be wired-OR with other open-drain output devices. (D) WRITE PROTECT (WP)The FT24C32A/64A devices have a WP pin to protect the whole EEPROM array from programming. Programming operations are allowed if WP pin is left un-connected or input to V IL . Conversely all programming functions are disabled if WP pin is connected to V IH or V CC . Read operations is not affected by the WP pin’s input level.MEMORY ORGANIZATIONThe FT24C32A/64A devices have 128/256 pages respectively. Since each page has 32 bytes, random word addressing to FT24C32A/64A will require 12/13 bits data word addresses respectively.DEVICE OPERATION(A) SERIAL CLOCK AND DATA TRANSITIONSThe SDA pin is typically pulled to high by an external resistor. Data is allowed to change only when Serial clock SCL is at V IL . Any SDA signal transition may interpret as either a START or STOP condition as described below.(B) START CONDITIONWith SCL V IH , a SDA transition from high to low is interpreted as a START condition. All valid commands must begin with a START condition.(C) STOP CONDITIONWith SCL V IH , a SDA transition from low to high is interpreted as a STOP condition. All valid read or write commands end with a STOP condition. The device goes into the STANDBY mode if it is after a read command. A STOP condition after page or byte write command will trigger the chip into the STANDBY mode after the self-timed internal programming finish (see Figure 1).(D) ACKNOWLEDGEThe 2-wire protocol transmits address and data to and from the EEPROM in 8 bit words. The EEPROM acknowledges the data or address by outputting a "0" after receiving each word. The ACKNOWLEDGE signal occurs on the 9th serial clock after each word.F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page4(E) STANDBY MODEThe EEPROM goes into low power STANDBY mode after a fresh power up, after receiving a STOP bit in read mode, or after completing a self-time internal programming operation.Figure 1: Timing diagram for START and STOP conditionsFigure 2: Timing diagram for output ACKNOWLEDGEDEVICE ADDRESSINGThe 2-wire serial bus protocol mandates an 8 bits device address word after a START bit condition to invoke a valid read or write command. The first four most significant bits of the device address must be 1010, which is common to all serial EEPROM devices. The next three bits are device address bits. These three device address bits (5th , 6th and 7th ) are to match with the external chip select/address pin states. If a match is made, the EEPROM device outputs an ACKNOWLEDGE signal after the 8th read/write bit, otherwise the chip will go into STANDBY mode. However, matching may not be needed for some or all device address bits (5th , 6th and 7th ) as noted below. The last or 8th bit is a read/write command bit. If the 8th bit is at V IH then the chip goes into read mode. If a “0” is detected, the device enters programming mode.SCLSDASTART Condition STOP ConditionData Data Valid Transition SCLData inData out START Condition ACKF MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page5WRITE OPERATIONS(A) BYTE WRITEA write operation requires two 8-bit data word address following the device address word and ACKNOWLEDGE signal. Upon receipt of this address, the EEPROM will respond with a “0” and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will again output a “0”. The addressing device, such as a microcontroller, must terminate the write sequence with a STOP condition. At this time the EEPROM enters into an internally-timed write cycle state. All inputs are disabled during this write cycle and the EEPROM will not respond until the writing is completed (figure 3). (B) PAGE WRITEThe 32K/64K EEPROM are capable of 32-byte page write.A page write is initiated the same way as a byte write, but the microcontroller does not send a STOP condition after the first data word is clocked in. The microcontroller can transmit up to 31 more data words after the EEPROM acknowledges receipt of the first data word. The EEPROM will respond with a “0” after each data word is received. The microcontroller must terminate the page write sequence with a STOP condition (see Figure 4).The lower five bits of the data word address are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. If more than 32 data words are transmitted to the EEPROM, the data word address will “roll over” and the previous data will be overwritten. (C) ACKNOWLEDGE POLLINGACKNOWLEDGE polling may be used to poll the programming status during a self-timed internal programming. By issuing a valid read or write address command, the EEPROM will not acknowledge at the 9th clock cycle if the device is still in the self-timed programming mode. However, if the programming completes and the chip has returned to the STANDBY mode, the device will return a valid ACKNOWLEDGE signal at the 9th clock cycle.READ OPERATIONSThe read command is similar to the write command except the 8th read/write bit in address word is set to “1”. The three read operation modes are described as follows: (A) CURRENT ADDRESS READThe EEPROM internal address word counter maintains the last read or write address plus one if the power supply to the device has not been cut off. To initiate a current address read operation, the micro-controller issues a START bit and a valid device address word with the read/write bit (8th ) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. The internal address word counter will then automatically increase by one. For current address read the micro-controller will not issue an ACKNOWLEDGE signal on the 18th clock cycle. The micro-controller issues a valid STOP bit after the 18th clock cycle to terminate the read operation. The device then returns to STANDBY mode (see Figure 5).(B) SEQUENTIAL READThe sequential read is very similar to current address read. The micro-controller issues a START bit and a valid device address word with read/write bit (8th ) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. Meanwhile the internally address word counter will then automatically increase by one.MDf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page6Unlike current address read, the micro-controller sends an ACKNOWLEDGE signal on the 18th clock cycle signaling the EEPROM device that it wants another byte of data. Upon receiving the ACKNOWLEDGE signal, the EEPROM will serially clocked out an 8-bit data word based on the incremented internal address counter. If the micro-controller needs another data, it sends out an ACKNOWLEDGE signal on the 27th clock cycle. Another 8-bit data word will then be serially clocked out. This sequential read continues as long as the micro-controller sends an ACKNOWLEDGE signal after receiving a new data word. When the internal address counter reaches its maximum valid address, it rolls over to the beginning of the memory array address. Similar to current address read, the micro-controller can terminate the sequential read by not acknowledging the last data word received, but sending a STOP bit afterwards instead (figure 6). (C) RANDOM READRandom read is a two-steps process. The first step is to initialize the internal address counter with a target read address using a “dummy write” instruction. The second step is a current address read.To initialize the internal address counter with a target read address, the micro-controller issues a START bit first, follows by a valid device address with the read/write bit (8th ) set to “0”. The EEPROM will then acknowledge. The micro-controller will then send two address words. Again the EEPROM will acknowledge. Instead of sending a valid written data to the EEPROM, the micro-controller performs a current address read instruction to read the data. Note that once a START bit is issued, the EEPROM will reset the internal programming process and continue to execute the new instruction - which is to read the current address (figure 7).Figure 3: Byte WriteSDA LINES T A R S BDEVICE S B /W C KW R I T FIRST WORD S BC KC KC KS B SECOND WORD S T O DATAFigure 4: Page WriteSDA LINES T A R S BDEVICE S B /W C KW R I T FIRST WORD S BC KC KC KS B SECOND WORD S T OC KFDCo ne nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page7Figure 5: Current Address ReadSDA LINES T A R S BDEVICE S B /W C KR E A DO A C KS T O DATAFigure 6: Sequential ReadDEVICE /W R E A DC KO A C KS T O DATA (N)DATA (N+1)DATA (N+2)DATA (N+3)C KC KC KFigure 7: Random ReadS T A R S BDEVICE S B /W C R E A DKO A C KS T O DATA (N)S T A R S BDEVICE S B /W C KW R I T FIRST WORD S BC KS B SECOND WORD C KSDA LINENotes: 1) * = Don’t Care bits2) # = Don’t Care bits for FT24C32F MDCo nf i de nt i© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page8Figure 8: SCL and SDA Bus TimingSCLSDA INSDA OUTAC CHARACTERISTICS1.8V2.5-5.0 VSymbolParameter Min Max Min Max Unitf SCL Clock frequency, SCL400800 kHz t LOW Clock pulse width low 1.20.9µst HIGH Clock pulse width high0.4 0.3 µs t I Noise suppression time (1)180 120 nst AA Clock low to data out valid0.3 1.2 0.2 0.9 µs t BUF Time the bus must be free before a newtransmission can start (1) 1.3 1.2 µst HD.STA START hold time0.6 0.6 µs t SU.STA START set-up time0.6 0.6 µs t HD.DAT Data in hold time 0 0 µs t SU.DAT Data in set-up time 100100nst R Input rise time (1) 0.3 0.3 µst F Input fall time (1)300 300 nst SU.STO STOP set-up time 0.6 0.6 µs t DH Date out hold time 200 50 ns t WRWrite cycle time55msEndurance (1) 25o C, Page Mode, 3.3V1,000,000Write CyclesNotes: 1. This Parameter is expected by characterization but are not fully screened by test.2. AC Measurement conditions: R L (Connects to Vcc): 1.3K ΩInput Pulse Voltages: 0.3Vcc to 0.7VccInput and output timing reference Voltages: 0.5VccF MDe nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page9DC CHARACTERISTICSSymbol Parameter Test ConditionsMin Typical Max Units V CC1 24C ××A supply V CC1.8 5.5 V I CC Supply read current V CC @ 5.0V SCL = 400 kHz 0.4 1.0 mA I CCSupply write currentV CC @ 5.0V SCL = 400 kHz2.03.0mAI SB1 Supply current V CC @ 1.8V, V IN = V CC or V SS 0.02 1.0 µA I SB2 Supply current V CC @ 2.5V, V IN = V CC or V SS 1.0 µA I SB3 Supply current V CC @ 5.0V, V IN = V CC or V SS 0.07 1.0 µAI IL Input leakage current V IN = V CC or V SS 3.0 µA I LO Output leakage current V IN = V CC or V SS3.0µA V IL Input low level -0.6V CC × 0.3V V IH Input high levelV CC × 0.7V CC + 0.5VV OL2 Output low level V CC @ 3.0V, I OL = 2.1 mA0.4 VV OL1 Output low levelV CC @ 1.8V, I OL = 0.15 mA0.2 VORDERING INFORMATIONDensity PackageTemperature RangeVcc HSF Packaging Ordering CodeRoHSTube FT24C32A-UDR-BDIP8 -40℃-85℃ 1.8V-5.5VGreenTube FT24C32A-UDG-B Tube FT24C32A-USR-B RoHSTape and Reel FT24C32A-USR-TTube FT24C32A-USG-B SOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C32A-USG-TTube FT24C32A-UMR-B RoHSTape and Reel FT24C32A-UMR-TTube FT24C32A-UMG-B 32kbitsMSOP8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C32A-UMG-TD: DIP8 S: SOP8 M: MSOP8 T: TSSOP8 L: SOT23-5 P: TSOT23-5 N: DFN8PackagingB: TubeT: Tape and Reel HSF R: RoHS G: GreenU:-40F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page10Tube FT24C32A-UTR-B RoHSTape and Reel FT24C32A-UTR-TTube FT24C32A-UTG-B TSSOP8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C32A-UTG-T RoHS Tape and Reel FT24C32A-ULR-T SOT23-5-40℃-85℃1.8V-5.5VGreen Tape and Reel FT24C32A-ULG-T RoHSTape and Reel FT24C32A-UPR-T TSOT23-5 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C32A-UPG-T RoHSTape and Reel FT24C32A-UNR-T 32kbitsDFN8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C32A-UNG-TRoHSTube FT24C64A-UDR-B DIP8 -40℃-85℃ 1.8V-5.5VGreen Tube FT24C64A-UDG-B Tube FT24C64A-USR-B RoHSTape and Reel FT24C64A-USR-TTube FT24C64A-USG-B SOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C64A-USG-TTube FT24C64A-UMR-B RoHSTape and Reel FT24C64A-UMR-TTube FT24C64A-UMG-B MSOP8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C64A-UMG-TTube FT24C64A-UTR-B RoHSTape and Reel FT24C64A-UTR-TTube FT24C64A-UTG-B TSSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C64A-UTG-T RoHSTape and Reel FT24C64A-ULR-T SOT23-5 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C64A-ULG-T RoHSTape and Reel FT24C64A-UPR-T TSOT23-5 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C64A-UPG-T RoHSTape and Reel FT24C64A-UNR-T 64kbitsDFN8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C64A-UNG-TF MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page11DIP8 PACKAGE OUTLINEDIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 3.710 4.310 0.146 0.170 A1 0.510 0.020 A2 3.200 3.600 0.126 0.142B 0.380 0.570 0.015 0.022B1 1.524(BSC ) 0.060(BSC ) C 0.204 0.360 0.008 0.014 D 9.000 9.400 0.354 0.370 E 6.200 6.600 0.244 0.260 E1 7.320 7.920 0.288 0.312 e 2.540 (BSC) 0.100(BSC ) L 3.000 3.600 0.118 0.142 E2 8.400 9.000 0.331 0.354F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page12SOP8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 1.350 1.750 0.053 0.069A1 0.100 0.250 0.004 0.010A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010D 4.700 5.100 0.185 0.200E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270 (BSC)0.050 (BSC)L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8°F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page13MSOP8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 0.820 1.100 0.320 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.65 (BSC) 0.026 (BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°F MDC o n f i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page14TSSOP8 PACKAGE OUTLINEDIMENSIONSDimensions In Millimeters Dimensions In InchesSymbolMinMax Min Max D 2.900 3.100 0.114 0.122 E4.3004.5000.1690.177b 0.190 0.300 0.007 0.012c 0.090 0.200 0.004 0.008 E1 6.250 6.550 0.246 0.258 A 1.100 0.043 A2 0.800 1.000 0.031 0.039 A1 0.020 0.150 0.001 0.006e 0.65 (BSC) 0.026 (BSC) L 0.500 0.700 0.020 0.028H 0.25 (TYP) 0.01 (TYP)θ 1°7° 1° 7°F MDCo nf i de n t i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page15SOT-23-5 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 6°F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page16TSOT-23-5 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 0.700 0.900 0.028 0.035 A1 0.000 0.100 0.000 0.004 A2 0.700 0.800 0.028 0.031 b 0.350 0.500 0.014 0.020 c 0.080 0.200 0.003 0.008 D 2.820 3.020 0.111 0.119 E 1.600 1.700 0.063 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.90 (BSC) 0.075 (BSC) L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8°F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page17DFN8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersSymbolMinNomMaxA 0.70 0.75 0.80 A1 - 0.02 0.05 b 0.18 0.25 0.03 c 0.18 0.20 0.25 D 1.902.00 2.10D2 1.50REF e 0.50BSC Nd 1.50BSC E 2.90 3.00 3.10 E2 1.60REFL 0.30 0.40 0.50 h 0.20 0.25 0.30* Information furnished is believed to be accurate and reliable. However, Fremont Micro Devices, Incorporated (BVI) assumes no responsibility for the consequences of use of such information or for any infringement of patents of other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Fremont Micro Devices, Incorporated (BVI). Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. Fremont Micro Devices, Incorporated (BVI) products are not authorized for use as critical components in life support devices or systems without express written approval of Fremont Micro Devices, Incorporated (BVI). The FMD logo is a registered trademark of Fremont Micro Devices, Incorporated (BVI). All other names are the property of their respective owners.© 2012 Fremont Micro Devices Inc. DS24C32_64-A0--page18 DMF。
ATMEL08掉电存储模块简要说明:一、尺寸:全长30mm宽15mm高10mm二、主芯片:ATMEL24C08芯片三、工作电压:直流5V四、特点:电路简单实用,接线简单。
电路支持:ATMEL24C02\ ATMEL24C04\ ATMEL24C08\ ATMEL24C16\ ATMEL24C32.适用场合:单片机学习、电子竞赛、产品开发、毕业设计。
【标注说明】【参考原理图】【PCB尺寸图】【测试程序】#include <reg52.H>#include <stdio.h>#include <absacc.h>unsigned char code table[]={ 0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90,0x40}; signed char sec=1; //定义计数值,每过1 秒,sec加1unsigned int tcnt; //定时中断次数unsigned char jd=0;unsigned char gd=0;bit write=0; //写24C08 的标志;sbit gewei=P2^6; //个位选通定义sbit shiwei=P2^5; //十位选通定义sbit baiwei=P2^7; //百位选通定义sbit qianwei=P2^4; //千位选通定义sbit P10=P1^0;sbit P11=P1^1;sbit P12=P1^2;sbit P13=P1^3;sbit P14=P1^4;sbit P15=P1^5;sbit P16=P1^6;sbit P17=P1^7;sbit P30=P3^0;sbit P31=P3^1;sbit P32=P3^2;sbit P35=P3^5;sbit jia=P2^0;sbit jian=P2^1;sbit res=P2^2;/////////24C08 读写驱动程序//////////////////// sbit scl=P3^3; // 24c08 SCLsbit sda=P3^4; // 24c08 SDAvoid delay1(unsigned char x){ unsigned int i;for(i=0;i<x;i++);;}void flash(){ ; ; }void x24c08_init() //24c08 初始化子程序{scl=1; flash(); sda=1; flash();}void start() //启动(I方C)总线{sda=1; flash(); scl=1; flash(); sda=0; flash(); scl=0; flash();} void stop() //停止(I方C)总线{sda=0; flash(); scl=1; flash(); sda=1; flash();}void writex(unsigned char j) //写一个字节{ unsigned char i,temp;temp=j;for (i=0;i<8;i++){temp=temp<<1; scl=0; flash(); sda=CY; flash(); scl=1; flash();} scl=0; flash(); sda=1; flash();}unsigned char readx() //读一个字节{unsigned char i,j,k=0;scl=0; flash(); sda=1;for (i=0;i<8;i++){flash(); scl=1; flash();if (sda==1) j=1;else j=0;k=(k<<1)|j;scl=0;}flash(); return(k);}void clock() //(I方C)线时钟{unsigned char i=0;scl=1; flash();while ((sda==1)&&(i<255))i++;scl=0; flash();}////////从24c02 的地址address 中读取一个字节数据/////unsigned char x24c08_read(unsigned char address){unsigned char i;start(); writex(0xa0);clock(); writex(address);clock(); start();writex(0xa1); clock();i=readx(); stop();delay1(10);return(i);}//////向24c02 的address 地址中写入一字节数据info///// void x24c08_write(unsigned char address,unsigned char info){EA=0;start(); writex(0xa0);clock(); writex(address);clock(); writex(info);clock(); stop();EA=1;delay1(50);}/////////////24C08 读写驱动程序完///////////////////// void Delay(unsigned int tc) //延时程序{while( tc != 0 ){unsigned int i;for(i=0; i<100; i++);tc--;}}void LED() //LED显示函数{qianwei=0; P0=0xc0; Delay(3); qianwei=1; baiwei=0; P0=0xc0; Delay(3); baiwei=1; shiwei=0; P0=table[sec/10]; Delay(3); shiwei=1; gewei=0; P0=table[sec%10]; Delay(3); gewei=1;}void t0(void) interrupt 1 using 0 //定时中断服务函数{TH0=(65536-50000)/256; //对TH0 TL0 赋值TL0=(65536-50000)%256; //重装计数初值tcnt++; //每过250ust tcnt 加一if(tcnt==1) //计满20次(1 秒)时{tcnt=0; //重新再计write=1; //1 秒写一次24C08}}void main(void){TMOD=0x01; //定时器工作在方式1ET0=1; EA=1;x24c08_init(); //初始化24C08sec=x24c08_read(2);//读出保存的数据赋于secTH0=(65536-50000)/256; //对TH0 TL0 赋值TL0=(65536-50000)%256; //使定时器0.05 秒中断一次TR0=1; //开始计时*/while(1){if(jia==0){Delay(8); while(!jia){LED();}; {sec++;if(sec==36){sec=0;}} } if(jian==0){ Delay(8); while(!jian){LED();};{sec--;if(sec<0){sec=35;}} }if(res==0){sec=0;}switch(sec){case 0:P1=0X81;P30=1;P31=1;P32=1;P35=1;break;case 1:P1=0X82;P30=1;P31=1;P32=1;P35=1;break;case 2:P1=0X84;P30=1;P31=1;P32=1;P35=1;break;case 3:P1=0X88;P30=1;P31=1;P32=1;P35=1;break;case 4:P1=0X90;P30=1;P31=1;P32=1;P35=1;break;case 5:P1=0XA0;P30=1;P31=1;P32=1;P35=1;break;case 6:P1=0X41;P30=1;P31=1;P32=1;P35=1;break;case 7:P1=0X42;P30=1;P31=1;P32=1;P35=1;break;case 8:P1=0X44;P30=1;P31=1;P32=1;P35=1;break;case 9:P1=0X48;P30=1;P31=1;P32=1;P35=1;break;case 10:P1=0X50;P30=1;P31=1;P32=1;P35=1;break;case 11:P1=0X60;P30=1;P31=1;P32=1;P35=1;break;case 12:P1=0XC1;P30=0;P31=1;P32=1;P35=1;break;case 13:P1=0XC2;P30=0;P31=1;P32=1;P35=1;break;case 14:P1=0XC4;P30=0;P31=1;P32=1;P35=1;break;case 15:P1=0XC8;P30=0;P31=1;P32=1;P35=1;break;case 16:P1=0XD0;P30=0;P31=1;P32=1;P35=1;break;case 17:P1=0XE0;P30=0;P31=1;P32=1;P35=1;break;case 18:P1=0XC1;P30=1;P31=0;P32=1;P35=1;break;case 19:P1=0XC2;P30=1;P31=0;P32=1;P35=1;break; case 20:P1=0XC4;P30=1;P31=0;P32=1;P35=1;break; case 21:P1=0XC8;P30=1;P31=0;P32=1;P35=1;break; case 22:P1=0XD0;P30=1;P31=0;P32=1;P35=1;break; case 23:P1=0XE0;P30=1;P31=0;P32=1;P35=1;break;case 24:P1=0XC1;P30=1;P31=1;P32=0;P35=1;break; case 25:P1=0XC2;P30=1;P31=1;P32=0;P35=1;break; case 26:P1=0XC4;P30=1;P31=1;P32=0;P35=1;break; case 27:P1=0XC8;P30=1;P31=1;P32=0;P35=1;break; case 28:P1=0XD0;P30=1;P31=1;P32=0;P35=1;break; case 29:P1=0XE0;P30=1;P31=1;P32=0;P35=1;break;case 30:P1=0XC1;P30=1;P31=1;P32=1;P35=0;break; case 31:P1=0XC2;P30=1;P31=1;P32=1;P35=0;break; case 32:P1=0XC4;P30=1;P31=1;P32=1;P35=0;break; case 33:P1=0XC8;P30=1;P31=1;P32=1;P35=0;break; case 34:P1=0XD0;P30=1;P31=1;P32=1;P35=0;break; case 35:P1=0XE0;P30=1;P31=1;P32=1;P35=0;break; default:break;}LED();if(write==1) //判断计时器是否计时一秒{write=0; //清零x24c08_write(2,sec); //在24c08 的地址2 中写入数据sec}}}【实物展示】。
AT24C01A/02/04/08A/16A提供1024/2048/4096/8192/16384个连续的可擦除的位,以及由每8位组成一个字节的可编程只读存储器(EEPROM),其分别提供128/256/512/1024/2048个字节。
该设备适用在许多低功耗和低电压操作的工业和商业应用中。
1引脚描述1.1串行时钟(SCL)SCL输入用于正向输出边缘时钟信号到每个EEPROM设备,以及每个设备输出的反向边缘时钟数据。
1.2串行数据(SDA)SDA引脚是用于串行数据双向传输。
该引脚为开漏输出,同时可以与其他开漏极或集电极开路器件进行线或。
1.3设备/页地址(A2,A1,A0)对于AT24C01A和AT24C02,A2、A1和A0引脚是配置器件的硬件地址输入。
一根总线上可以连接多达八个1K / 2K的设备(器件寻址部分详细讨论了器件寻址)。
AT24C04使用A2和A1引脚作为硬件地址输入,在一根总线上有4个4K 的设备可用来寻址。
A0引脚没有连接。
AT24C08A只使用A2引脚作为硬件地址输入,在一根总线上有2个8K 的设备可用来寻址。
A0和A1引脚没有连接。
AT24C16A不使用设备地址引脚,这限制了一根总线上只能挂一个设备。
A0、A1和A2引脚没有连接。
1.4写保护(WP)AT24C01A / 02 / 04 / 08A/ 16A有一个写保护引脚,提供硬件数据保护。
写保护引脚允许正常读/写操作时连接到GND。
当写保护引脚连接到VCC,写保护功能启用和操作如下表所示。
2设备操作2.1时钟和数据转换SDA引脚通常情况下拉高。
SDA引脚上的数据只能在SCL低时间段内更改,而启动条件或停止条件在SCL为高时进行。
2.2启动条件在任何其他指令之前,SDA由高变为低,且SCL为高。
2.3停止条件SDA由低变为高,且SCL为高。
在读取序列之后,执行停止命令后EEPROM进入备用电源模式。
2.4应答所有地址和数据字都是从EEPROM串行发送和接收8位字节。
1Features•Low Voltage and Standard Voltage Operation –2.7 (V CC = 2.7V to 5.5V)–1.8 (V CC = 1.8V to 5.5V)•Internally Organized 2048 x 8 (16K)•Two-Wire Serial Interface•Schmitt Trigger, Filtered Inputs for Noise Suppression •Bidirectional Data Transfer Protocol•100 kHz (1.8V, 2.5V, 2.7V) and 400 kHz (5V) Compatibility •Write Protect Pin for Hardware Data Protection •Cascadable Feature Allows for Extended Densities •16-Byte Page Write Mode•Partial Page Writes Are Allowed •Self-Timed Write Cycle (10 ms max)•High Reliability–Endurance: 1 Million Write Cycles –Data Retention: 100 Years•Automotive Grade, Extended Temperature and Lead-free/Halogen-free Devices Available•8-lead PDIP and 8-lead JEDEC SOIC Packages•Die Sales: Wafer Form, Waffle Pack and Bumped WafersDescriptionThe AT24C164 provides 16,384 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 2048 words of 8 bits each. The device’s cascadable feature allows up to eight devices to share a common two-wire bus. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C164 is available in space saving 8-lead PDIP and 8-lead JEDEC SOIC packages and is accessed via a two-wire serial interface. In addition, this device is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.Table 1. Pin ConfigurationsPin Name Function A0 - A2Address Inputs SDA Serial Data SCL Serial Clock Input WPWrite Protect8-lead PDIP 8-lead SOIC2AT24C1640105J–SEEPR–12/06Figure 1. Block DiagramAbsolute Maximum Ratings*Operating Temperature..................................–55°C to +125°C *NOTICE:Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam-age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Storage Temperature.....................................–65°C to +150°C Voltage on Any Pinwith Respect to Ground....................................–1.0V to +7.0V Maximum Operating Voltage..........................................6.25V DC Output Current........................................................5.0 mA3AT24C1640105J–SEEPR–12/06Pin DescriptionSERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device.SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices.DEVICE SELECT (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that may be hardwired or actively driven to V DD or V SS . These inputs allow the selection for one of eight possible devices sharing a common bus. The AT24C164 can be made compatible with the AT24C16 by tying A2, A1 and A0 to V SS . Device addressing is dis-cussed in detail in the device addressing section.WRITE PROTECT (WP): The write protect input, when tied low to GND, allows normal write operations. When WP is tied to V CC , all write operations are inhibited.Memory OrganizationThe AT24C164 is internally organized with 256 pages of 8 bytes each. Random word addressing requires an 11 bit data word address.4AT24C1640105J–SEEPR–12/06Note:1.This parameter is characterized and is not 100% tested.Note:1.V IL min and V IH max are reference only and are not tested.Table 2. Pin Capacitance (1)Applicable over recommended operating range from T A = 25°C, f = 1.0 MHz, V CC = +1.8V.Symbol Test ConditionMax Units Conditions C I/O Input/Output Capacitance (SDA)8pF V I/O = 0V C IN Input Capacitance (A 0, A 1, A 2, SCL)6pFV IN = 0VTable 3. DC CharacteristicsApplicable over recommended operating range from: T AI = –40°C to +85°C, V CC = +1.8V to +5.5V, T AC = 0°C to +70°C,V CC = +1.8V to +5.5V (unless otherwise noted).Symbol Parameter Test ConditionMin TypMax Units V CC1Supply Voltage 1.8 5.5V V CC2Supply Voltage 2.5 5.5V V CC3Supply Voltage 2.7 5.5V V CC4Supply Voltage4.55.5V I CC Standby Current V CC = 5.0V READ at 100 kHz 0.4 1.0mA I CC Standby Current V CC = 5.0V WRITE at 100 kHz 2.0 3.0mA I SB1Standby Current V CC = 1.8V V IN = V CC or V SS 0.6 3.0µA I SB2Standby Current V CC = 2.5V V IN = V CC or V SS 1.4 4.0µA I SB3Standby Current V CC = 2.7V V IN = V CC or V SS 1.6 4.0µA I SB4Standby Current V CC = 5.0V V IN = V CC or V SS 8.018.0µA I LI Input Leakage Current V IN = V CC or V SS 0.10 3.0µA I LO Output Leakage Current V OUT = V CC or V SS0.05 3.0µA V IL (1)Input Low Level –0.6V CC x 0.3V V IH (1)Input High LevelV CC x 0.7V CC + 0.5V V OL2Output Low Level V CC = 3.0V I OL = 2.1 mA 0.4V V OL1Output Low Level V CC = 1.8VI OL = 0.15 mA 0.2V5AT24C1640105J–SEEPR–12/06Note:1.These parameters are characterized and is not 100% tested.Table 4. AC CharacteristicsApplicable over recommended operating range from T A = –40°C to +85°C, V CC = +1.8V to +5.5V, CL = 1 TTL Gate and 100pF (unless otherwise noted).Symbol Parameter2.7-, 2.5-, 1.8-volt5.0-volt Units MinMax MinMax f SCL Clock Frequency, SCL 100400kHz t LOW Clock Pulse Width Low 4.7 1.2µs t HIGH Clock Pulse Width High 4.00.6µs t I Noise Suppression Time (1)10050ns t AA Clock Low to Data Out Valid0.1 4.50.10.9µs t BUF Time the bus must be free before a new transmission can start (1)4.7 1.2µs t HD.STA Start Hold Time 4.00.6µs t SU.STA Start Set-up Time 4.70.6µs t HD.DAT Data In Hold Time 00µs t SU.DAT Data In Set-up Time 200100ns t R Inputs Rise Time (1) 1.00.3µs t F Inputs Fall Time (1)300300ns t SU.STO Stop Set-up Time 4.70.6µs t DH Data Out Hold Time 10050ns t WRWrite Cycle Time 1010ms Endurance (1) 5.0V, 25°C, Page Mode1M 1MWrite cycles6AT24C1640105J–SEEPR–12/06Device OperationCLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-nal device. Data on the SDA pin may change only during SCL low time periods (refer to Data Validity timing diagram). Data changes during SCL high periods will indicate a start or stop condition as defined below.START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 5 on page 8).STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 5 on page 8).ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle.STANDBY MODE: The AT24C164 features a low power standby mode which is enabled: a) upon power-up and b) after the receipt of the STOP bit and the completion of any internal operations.MEMORY RESET: After an interruption in protocol, power loss or system reset, the AT24C164 can be reset by following these steps:(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create a start condition as SDA is high.7AT24C1640105J–SEEPR–12/06Figure 2. Bus TimingSCL: Serial Clock, SDA: Serial Data I/OFigure 3. Write Cycle TimingSCL: Serial Clock, SDA: Serial Data I/ONote:1.The write cycle time t WR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.Figure 4.Data Validity8AT24C1640105J–SEEPR–12/06Figure 5. Start and Stop DefinitionFigure 6.Output Acknowledge9AT24C1640105J–SEEPR–12/06Device AddressingThe AT24C164 requires an 8-bit device address word following a start condition to enable the chip for read or write operations (see Figure 7 on page 10). The most signifi-cant bit must be a one followed by the A2, A1 and A0 device select bits (the A1 bit must be the compliment of the A1 input pin signal). The next 3 bits are used for memory block addressing and select one of the eight 256 x 8 memory blocks. These bits should be considered the three most significant bits of the data word address. The eighth bit of the device address is the read/write select bit. A read operation is selected if this bit is high or a write operation is selected if this bit is low.Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state.Write OperationsBYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condi-tion. At this time the EEPROM enters an internally-timed write cycle, t WR , to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 8 on page 11).PAGE WRITE: The AT24C164 is capable of a 16-byte page write. A page write is initi-ated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 9 on page 11).The data word address lower 4 bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten.ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send-ing a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue.10AT24C1640105J–SEEPR–12/06Read OperationsRead operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read.CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. The address “roll over” during write is from the last byte of the cur-rent page to first byte of the same page.Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out.The microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 10 on page 11).RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 11 on page 11).SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequen-tial read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condi-tion (see Figure 12 on page 12).Figure 7.Device Address分销商库存信息:ATMELAT24C164-10SU-2.7AT24C164-10PU-1.8AT24C164-10PU-2.7 AT24C164-10SU-1.8。
1Serial E 2PROM© Xicor, 1991 Patents PendingCharacteristics subject to change without noticeDESCRIPTIONThe X24C16 is a CMOS 16,384 bit serial E 2PROM,internally organized 2048 X 8. The X24C16 features a serial interface and software protocol allowing operation on a simple two wire bus.The X24C16 is fabricated with Xicor’s advanced CMOS Textured Poly Floating Gate Technology.The X24C16 utilizes Xicor’s proprietary Direct Write TM cell providing a minimum endurance of 100,000 cycles and a minimum data retention of 100 years.FEATURES •2.7V to 5.5V Power Supply •Low Power CMOS—Active Read Current Less Than 1 mA —Active Write Current Less Than 3 mA —Standby Current Less Than 50 µA •Internally Organized 2048 x 8•2 Wire Serial Interface—Bidirectional Data Transfer Protocol •Sixteen Byte Page Write Mode—Minimizes Total Write Time Per Byte •Self Timed Write Cycle—Typical Write Cycle Time of 5 ms •High Reliability—Endurance: 100,000 Cycles —Data Retention: 100 Years•8 Pin Mini-DIP, 8 Pin SOIC and 14 Pin SOIC Packages16KX24C162048 x 8 BitFUNCTIONAL DIAGRAM3840 FHD F01(8) V (4) V (6) SCL 3840-1.1 7/29/96 T1/C0/D0 SH2X24C16NC A 0A 1NC A 2V SS NC1234567141312111098NC V CC TEST NC SCL SDA NCX24C16A 0A 1A 2V SS12348765V CC TEST SCL SDAX24C16PIN CONFIGURATIONPIN DESCRIPTIONS Serial Clock (SCL)The SCL input is used to clock all data into and out of the device.Serial Data (SDA)SDA is a bidirectional pin used to transfer data into and out of the device. It is an open drain output and may be wire-ORed with any number of open drain or open collector outputs.An open drain output requires the use of a pull-up resistor. For selecting typical values, refer to the Pull-Up Resistor selection graph at the end of this data sheet.Address (A 0, A 1, A 2)The A 0, A 1 and A 2 inputs are unused by the X24C16,however, they must be tied to V SS to insure proper device operation.3840 FHD F023840 FHD F03PIN NAMESSymbol Description A 0–A 2Address Inputs SDA Serial Data SCL Serial Clock TEST Hold at V SS V SS GroundV CC Supply Voltage NCNo Connect3840 PGM T01SOICDIP/SOICX24C163DEVICE OPERATIONThe X24C16 supports a bidirectional bus oriented pro-tocol. The protocol defines any device that sends data onto the bus as a transmitter, and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master will always initiate data transfers, and provide the clock for both transmit and receive operations.Therefore, the X24C16 will be considered a slave in all applications.Clock and Data ConventionsData states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are re-served for indicating start and stop conditions. Refer to Figures 1 and 2.Start ConditionAll commands are preceded by the start condition,which is a HIGH to LOW transition of SDA when SCL is HIGH. The X24C16 continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met.Figure 1. Data Validity3840 FHD F06SCLSDADATA STABLEDATA CHANGEX24C16Stop ConditionAll communications must be terminated by a stop con-dition, which is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition is also used by the X24C16 to place the device into the standby power mode after a read sequence. A stop condition can only be issued after the transmitting device has released the bus.AcknowledgeAcknowledge is a software convention used to indicate successful data transfer. The transmitting device, either master or slave, will release the bus after transmitting eight bits. During the ninth clock cycle the receiver will pull the SDA line LOW to acknowledge that it received the eight bits of data. Refer to Figure 3.The X24C16 will respond with an acknowledge after recognition of a start condition and its slave address. If both the device and a write operation have been se-lected, the X24C16 will respond with an acknowledge after the receipt of each subsequent eight bit word.In the read mode the X24C16 will transmit eight bits of data, release the SDA line and monitor the line for an acknowledge. If an acknowledge is detected and no stop condition is generated by the master, the X24C16 will continue to transmit data. If an acknowledge is not detected, the X24C16 will terminate further data trans-missions. The master must then issue a stop condition to return the X24C16 to the standby power mode and place the device into a known state.Figure 2. Definition of Start and StopSCLSDASTART BIT STOP BIT3840 FHD F07 Figure 3. Acknowledge Response From ReceiverSCL FROMMASTERDATAOUTPUTFROMTRANSMITTER189DATAOUTPUTFROMRECEIVERSTART ACKNOWLEDGE3840 FHD F084X24C165Figure 4. Slave AddressDEVICE ADDRESSINGFollowing a start condition the master must output the address of the slave it is accessing. The most significant four bits of the slave address are the device type identifier (see Figure 4). For the X24C16 this is fixed as 1010[B].The next three bits of the slave address field are the bank select bits. They are used by the host to toggle between the eight 256 x 8 banks of memory. These are, in effect,the most significant bits for the word address.The next three bits of the slave address are an extension of the array’s address and are concatenated with the eight bits of address in the word address field, providing direct access to the whole 2048 x 8 array.Following the start condition, the X24C16 monitors the SDA bus comparing the slave address being transmit-ted with its slave address (device type). Upon a correct compare the X24C16 outputs an acknowledge on the SDA line. Depending on the state of the R/W bit, the X24C16 will execute a read or write operation.WRITE OPERATIONS Byte WriteFor a write operation, the X24C16 requires a second address field. This address field is the word address,comprised of eight bits, providing access to any one of the 2048 words in the array. Upon receipt of the word address the X24C16 responds with an acknowledge, and awaits the next eight bits of data, again responding with an acknowledge. The master then terminates the transfer by generating a stop condition, at which time the X24C16begins the internal write cycle to the nonvolatile memory.While the internal write cycle is in progress the X24C16inputs are disabled, and the device will not respond to any requests from the master. Refer to Figure 5 for the address, acknowledge and data transfer sequence.3840 FHD F09Figure 5. Byte WriteBUS ACTIVITY:MASTERSDA LINE BUS ACTIVITY:X24C16S T A R T SLAVE ADDRESS SS T O P P A C KA C KA C KWORD ADDRESSDATA3840 FHD F1011A2A1A0R/WDEVICE TYPE IDENTIFIER HIGH ORDER WORD ADDRESSX24C16Page WriteFlow 1. ACK Polling Sequence Array The X24C16 is capable of a sixteen byte page writeoperation. It is initiated in the same manner as the bytewrite operation, but instead of terminating the write cycleafter the first data word is transferred, the master cantransmit up to fifteen more words. After the receipt ofeach word, the X24C16 will respond with an acknowl-edge.After the receipt of each word, the four low order addressbits are internally incremented by one. The high orderseven bits of the address remain constant. If the mastershould transmit more than sixteen words prior to gener-ating the stop condition, the address counter will “rollover” and the previously written data will be overwritten.As with the byte write operation, all inputs are disableduntil completion of the internal write cycle. Refer toFigure 6 for the address, acknowledge and data transfersequence.Acknowledge PollingThe disabling of the inputs can be used to take advan-tage of the typical 5 ms write cycle time. Once the stopcondition is issued to indicate the end of the host’s writeoperation the X24C16 initiates the internal write cycle.ACK polling can be initiated immediately. This involvesissuing the start condition followed by the slave addressfor a write operation. If the X24C16 is still busy with thewrite operation no ACK will be returned. If the X24C16has completed the write operation an ACK will bereturned and the host can then proceed with the nextread or write operation. Refer to Flow 1.Figure 6. Page Write6X24C167READ OPERATIONSRead operations are initiated in the same manner as write operations with the exception that the R/W bit of the slave address is set to a one. There are three basic read operations: current address read, random read and sequential read.It should be noted that the ninth clock cycle of the read operation is not a “don’t care.” To terminate a read operation, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during the ninth clock cycle and then issue a stop condition.Current Address ReadInternally the X24C16 contains an address counter that maintains the address of the last word accessed,incremented by one. Therefore, if the last access (either a read or write) was to address n, the next read operation would access data from address n + 1. Upon receipt of the slave address with the R/W bit set to one, the X24C16 issues an acknowledge and transmits the eight bit word. The read operation is terminated by the master;by not responding with an acknowledge and by issuing a stop condition. Refer to Figure 7 for the sequence of address, acknowledge and data transfer.Random ReadRandom read operations allow the master to access any memory location in a random manner. Prior to issuing the slave address with the R/W bit set to one, the master must first perform a “dummy” write operation. The mas-ter issues the start condition, and the slave address followed by the word address it is to read. After the word address acknowledge, the master immediately reissues the start condition and the slave address with the R/W bit set to one. This will be followed by an acknowledge from the X24C16 and then by the eight bit word. The read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition.Refer to Figure 8 for the address, acknowledge and data transfer sequence.Figure 7. Current Address ReadBUS ACTIVITY:MASTERSDA LINE BUS ACTIVITY:X24C16S TAR T SLAVE ADDRESSSS T O P PA C KDATA3840 FHD F13Figure 8. Random ReadBUS ACTIVITY:MASTERSDA LINE BUS ACTIVITY:X24C16S TAR T SLAVE ADDRESS SS T O P PA C KA C K A C KWORD ADDRESS n SLAVE ADDRESSDATA nS T A R T S3840 FHD F14X24C16Sequential ReadSequential reads can be initiated as either a current address read or random access read. The first word is transmitted as with the other read modes, however, the master now responds with an acknowledge, indicating it requires additional data. The X24C16 continues to out-put data for each acknowledge received. The read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition.The data output is sequential, with the data from address n followed by the data from n + 1. The address counter for read operations increments all address bits, allowing the entire memory contents to be serially read during one operation. At the end of the address space (address 2047), the counter “rolls over” to 0 and the X24C16 continues to output data for each acknowledge re-ceived. Refer to Figure 9 for the address, acknowledge and data transfer sequence.Figure 9. Sequential ReadFigure 10. Typical System Configuration8X24C169ABSOLUTE MAXIMUM RATINGS*Temperature Under Bias..................–65°C to +135°C Storage Temperature.......................–65°C to +150°C Voltage on any Pin withRespect to V SS ................................–1.0V to +7.0V D.C. Output Current ............................................5 mA Lead Temperature(Soldering, 10 Seconds).............................300°C *COMMENTStresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi-tions for extended periods may affect device reliability.D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified)LimitsSymbol ParameterMin.Max.Units Test Conditionsl CC1V CC Supply Current (read)1SCL = V CC x 0.1/V CC x 0.9 Levels l CC2V CC Supply Current (write)3mA @ 100 KHz, SDA = Open, All Other Inputs = GND or V CC – 0.3VI SB1(1)V CC Standby Current 150µA SCL = SDA = V CC – 0.3V, All Other Inputs = GND or V CC , V CC = 5.5V I SB2(1)V CC Standby Current 50µA SCL = SDA = V CC – 0.3V, All OtherInputs = GND or V CC , V CC = 3.3V +10%I LI Input Leakage Current 10µA V IN = GND to V CC I LO Output Leakage Current 10µA V OUT = GND to V CCV lL (2)Input Low Voltage –1.0V CC x 0.3V V IH (2)Input High Voltage V CC x 0.7V CC + 0.5V V OLOutput Low Voltage0.4VI OL = 3 mA3840 PGM T03CAPACITANCE T A = 25°C, f = 1.0 MHz, V CC = 5VSymbol ParameterMax.Units Test ConditionsC I/O (3)Input/Output Capacitance (SDA)8pF V I/O = 0V C IN (3)Input Capacitance (A 0, A 1, A 2, SCL)6pFV IN = 0V3840 PGM T05Notes:(1)Must perform a stop command prior to measurement.(2)V IL min. and V IH max. are for reference only and are not tested.(3)This parameter is periodically sampled and not 100% tested.RECOMMENDED OPERATING CONDITIONSTemperature mercial 0°C 70°C Industrial –40°C +85°C Military–55°C+125°C3840 PGM T09Supply Voltage Limits X24C16 4.5V to 5.5V X24C16–3.5 3.5V to 5.5V X24C16–33V to 5.5V X24C16–2.72.7V to 5.5V3840 PGM T1010X24C16A.C. CHARACTERISTICS LIMITS (Over the recommended operating conditions unless otherwise specified.)Read & Write Cycle Limits Symbol ParameterMin.Max.Units f SCL SCL Clock Frequency0100KHz T I Noise Suppression Time Constant at SCL, SDA Inputs 100ns t AA SCL Low to SDA Data Out Valid 0.3 3.5µs t BUF Time the Bus Must Be Free Before a 4.7µs New Transmission Can Start t HD:STA Start Condition Hold Time 4.0µs t LOW Clock Low Period 4.7µs t HIGH Clock High Period4.0µs t SU:STA Start Condition Setup Time (for a Repeated Start Condition) 4.7µs t HD:DAT Data In Hold Time 0µs t SU:DAT Data In Setup Time250ns t R SDA and SCL Rise Time 1µs t FSDA and SCL Fall Time 300ns t SU:STO Stop Condition Setup Time 4.7µst DH Data Out Hold Time300ns3840 PGM T06POWER-UP TIMINGSymbol ParameterMax.Units t PUR (4)Power-up to Read Operation 1ms t PUW (4)Power-up to Write Operation5ms3840 PGM T07Notes:(4)t PUR and t PUW are the delays required from the time V CC is stable until the specified operation can be initiated. These parametersare periodically sampled and not 100% tested.A.C. CONDITIONS OF TEST Input Pulse Levels V CC x 0.1 to V CC x 0.9Input Rise and Fall Times10 ns Input and Output Timing LevelsV CC x 0.53840 PGM T02EQUIVALENT A.C. LOAD CIRCUITWRITE CYCLE LIMITSSymbol Parameter Min.Typ.(5)Max.Units t WR (6)Write Cycle Time510ms3840 PGM T08The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/program cycle. During the write cycle, the X24C16bus interface circuits are disabled, SDA is allowed to remain high, and the device does not respond to its slave address.Write Cycle TimingGuidelines for Calculating Typical Values of Bus Pull-Up ResistorsSYMBOL TABLEMust be steadyWill be steady May change from Low to High Will change from Low to High May change from High to Low Will change from High to Low Don’t Care:Changes AllowedChanging:State Not Known N/ACenter Line is High ImpedanceOUTPUTS INPUTS WAVEFORMNotes:(5)Typical values are for T A = 25°C and nominal supply voltage (5V)(6)t WR is the minimum cycle time from the system perspective when polling techniques are not used. It is the maximum time thedevice requires to perform the internal write operation.3926 FHD F01NOTE:1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASHTYP 8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE PMAX.8-LEAD PLASTIC SMALL OUTLINE GULL WING P ACKAGE TYPE SNOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESIS IN MILLIMETERS)3926 FHD F2214-LEAD PLASTIC SMALL OUTLINE GULL WING P ACKAGE TYPE SNOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS)3926 FHD F10ORDERING INFORMATIONDeviceV CC RangeBlank = 4.5V to 5.5V 3.5 = 3.5V to 5.5V 3 = 3V to 5.5V 2.7 = 2.7V to 5.5VTemperature RangeBlank = Commercial = 0°C to +70°C I = Industrial = –40°C to +85°C M = Military = –55°C to +125°C MB = MIL-STD-883PackageP = 8-Lead Plastic DIP S8 = 8-Lead SOIC S14 = 14-Lead SOICX24C16XX-XLIMITED WARRANTYDevices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness tor any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice.Xicor, Inc assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,licenses are implied.US. PATENTSXicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967;4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694. Foreign patents and additional patents pending.LIFE RELATED POLICYIn situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence.Xicor’s products are not authorized for use as critical components in life support devices or systems.1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life,and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its satety or effectiveness.Part Mark ConventionP = 8-Lead Plastic DIP S8 = 8-Lead SOIC S14 = 14-Lead SOICBlank = 4.5V to 5.5V, 0°C to +70°C I = 4.5V to 5.5V, –40°C to +85°C B = 3.5V to 5.5V, 0°C to +70°C C = 3.5V to 5.5V, –40°C to +85°C D = 3.0V to 5.5V, 0°C to +70°C E = 3.0V to 5.5V, –40°C to +85°C F = 2.7V to 5.5V, 0°C to +70°C G = 2.7V to 5.5V, –40°C to +85°C M = 4.5V to 5.5V, –55°C to +125°CX24C16 XX。
24c16的使用方法自己把24c16 的使用结合代码整理了一遍之前看pcf 时发现其实有很多芯片和24c 系列的芯片很像,所以就不得不整理一下了,发辫以后回顾r 如果整理的不够好,请不要喷我,我是弱菜#include#include //要用到_nop_()精准延时#define uchar unsigned char#define uint unsigned intsbit scl=P2;//24c16时钟线,数据线定义sbit sda=P2;uchar code table[]={0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90};//数码管显示ucharnum,sec; //用来计时void usdelay(){_nop_();_nop_();_nop_();_nop_();_nop_();_nop_();}void delayms(uint z){uint x,y;for(x=z;x>0;x--)for(y=110;y>0;y--);}void start() //起始信号当时钟线为1,数据线有个下降沿{sda=1;usdelay();scl=1;usdelay();sda=0;usdelay();}void stop()//终止信号当时钟线为1,数据线有个上升沿{sda=0;usdelay();scl=1;usdelay();sda=1;usdelay();}void ack() //应答信号由从机发出信号为sda 由1 变为0{uchar i;scl=1;usdelay();while((sda==1)&&i //字节读scl 有下降沿读出{uchar i,k;for(i=0;i9) sec=0;TMOD=0x01;//定时器选择软件启动,工作方式为1ET0=1;//开定时器0 允许EA=1;//开总中断允许TH0=(65536-50000)/256;TL0=(65536-50000)%6;//给定时器赋初值,定时50msTR0=1;//启动定时器0while(1){if(num==20){num=0;sec++;if(sec>9)sec=0;}P3=table[sec];write_add(2,sec);}}void t0() interrupt 1{TH0=(65536- 50000)/256;TL0=(65536-50000)%6;num++;}tips:感谢大家的阅读,本文由我司收集整编。
IS24C08中⽂资料IS24C01IS24C02IS24C04IS24C08IS24C16ISSICopyright ? 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.1K-bit/2K-bit/4K-bit/8K-bit/16K-bit 2-WIRE SERIAL CMOS EEPROMAPRIL 2002DESCRIPTIONThe IS24CXX (refers to IS24C01, IS24C02, IS24C04,IS24C08, IS24C16) family is a low-cost and low voltage 2-wire Serial EEPROM. It is fabricated using ISSI’s advanced CMOS EEPROM technology and provides a low power and low voltage operation. The IS24CXX family features a write protection feature, and is available in 8-pin DIP and 8-pin SOIC packages.The IS24C01 is a 1K-bit EEPROM; IS24C02 is a 2K-bit EEPROM; IS24C04 is a 4K-bit EEPROM; IS24C08 is a 8K-bit EEPROM; IS24C16 is a 16K-bit EEPROM.The IS24C01 and IS24C02 are available in 8-pin MSOP package. The IS24C01, IS24C02, IS24C04, and IS24C08are available in 8-Pin TSSOP package.Automotive data is preliminary.FEATURESLow Power CMOS Technology–Standby Current less than 8 µA (5.5V)–Read Current (typical) less than 1 mA (5.5V)–Write Current (typical) less than 3 mA (5.5V)?Flexible Voltage Operation–Vcc = 1.8V to 5.5V for –2 version –Vcc = 2.5V to 5.5V for –3 version ?400 KHz (I 2C Protocol) Compatibility ?Hardware Data Protection–Write Protect Pin ?Sequential Read FeatureFiltered Inputs for Noise Suppression 8-pin PDIP and 8-pin SOIC packages 8-pin TSSOP (1K,2K, 4K & 8K only)8-pin MSOP (1K,2K only)Self time write cycle with auto clear 5 ms @ 2.5V Organization:–IS24C01128x8(one block of 128 bytes)–IS24C02256x8(one block of 256 bytes)–IS24C04512x8(two blocks of 256 bytes)–IS24C081024x8(four blocks of 256 bytes)–IS24C162048x8(eight blocks of 256 bytes)?Page Write BufferTwo-Wire Serial Interface–Bi-directional data transfer protocol ?High Reliability–Endurance: 1,000,000 Cycles –Data Retention: 100 YearsCommercial, Industrial and Automotive tempera-ture ranges元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.html元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?FUNCTIONAL BLOCK DIAGRAM2Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.DIS24C01IS24C02IS24C04IS24C08 IS24C16ISSIPIN DESCRIPTIONSA0-A2Address InputsSDA Serial Address/Data I/O SCL Serial Clock Input WP Write Protect Input Vcc Power Supply GNDGroundSCLThis input clock pin is used to synchronize the data transfer to and from the device.SDAThe SDA is a Bi-directional pin used to transfer addresses and data into and out of the device. The SDA pin is an open drain output and can be wire-Ored with other open drain or open collector outputs.The SDA bus requires a pullup resistor to Vcc. A0, A1, A2The A0, A1 and A2 are the device address inputs. The IS24C01 and IS24C02 use the A0, A1, and A2 for hardware addressing and a total of 8 devices may be used on a single bus system.PIN CONFIGURATION8-Pin DIP and SOIC8 Pin TSSOP (1K, 2K, 4K and 8K)8-Pin MSOP (1K, 2K)12348765A0A1A2GNDVCC WP SCL SDAThe IS24C04 uses A1 and A2 pins for hardwire addressing and a total of four devices may be addressed on a single bus system.The A0 pin is not used by IS24C04. This pin can be left floating or tied to GND or Vcc.The IS24C08 only use A2 input for hardwire addressing and a total of two devices may be addressed on a single bus system.The A0 and A1 pins are not used by IS24C08. They may be left floating or tied to either GND or Vcc.These pins are not used by IS24C16. A0 and A1 may be left floating or tied to either GND or Vcc. A2 should be tied to either GND or Vcc.WPWP is the Write Protect pin. On the 24C01, 24C02, IS24C04and 24C08, if the WP pin is tied to V CC the entire array becomes Write Protected (Read only). On the 24C16, if the WP pin is tied to Vcc the upper half array becomes Write Protected (Read only). When WP is tied to GND or left floating normal read/write operations are allowed to the device.元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?DEVICE OPERATIONThe IS24CXX family features a serial communication and supports a bi-directional 2-wire bus transmission protocol. 2-WIRE BUSThe two-wire bus is defined as a Serial Data line(SDA), and a Serial Clock Line (SCL). The protocol defines any device that sends data onto the SDA bus as a transmitter, and the receiving devices as a receiver. The bus is controlled by MASTER device which generates the SCL, controls the bus access and generates the STOP and START conditions. The IS24CXX is the SLAVE device on the bus.THE BUS PROTOCOL:--Data transfer may be initiated only when the bus is not busy--During a data transfer, the data line must remain stable whenever the clock line is high. Any changes in the data line while the clock line is high will be interpreted as a START or STOP condition.The state of the data line represents valid data when after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition.START CONDITIONThe START condition precedes all commands to the devices and is defined as a HIGH to LOW transition of SDA when SCL is HIGH. The IS24CXX monitors the SDA and SCL lines and will not respond until the START condition is met.STOP CONDITIONThe STOP condition is defined as a LOW to HIGH transition of SDA when SCL is HIGH. All operations must end with a STOP condition.ACKNOWLEDGEAfter a successful data transfer, each receiving device is required to generate an acknowledge. The Acknowledging device pulls down the SDA line.DEVICE ADDRESSINGThe MASTER begins a transmission by sending a START condition. The MASTER then sends the address of the particular slave devices it is requesting. The SLAVE address is 8 bytes.The four most significant bytes of the address are fixed as 1010 for the IS24CXX.For the IS24C16, the bytes(B2, B1 and B0) are used for memory page addressing (the IS24C16 is organized as eight blocks of 256 bytes).For the IS24C04 out of the next three bytes, B0 is for Memory Page Addressing (the IS24C04 is organized as two blocks of 256 bytes) and A2 and A1 bytes are used as device address bytes and must compare to its hard-wire inputs pins (A2 and A1). Up to four IS24C04's may be individually addressed by the system. The page addressing bytes forIS24Cxx should be considered the most significant bytes of the data word address which follows.For the IS24C08 out of the next three bytes, B1 and B0 are for memory page addressing (the IS24C08 is organized as four blocks of 256 bytes) and the A2 bit is used as device address bit and must compare to its hard-wired input pin (A2). Up to two IS24C08 may be individually addressed by the system. The page addressing bytes for IS24CXX should be considered the most significant bytes of the data word address which follows.For the IS24C01 and IS24C02, the A0, A1, and A2 are used as device address bytes and must compare to its hard-wired input pins (A0, A1, and A2) Up to Eight IS24C01 and/ or IS24C02's may be individually addressed by the system. The last bit of the slave address specifies whether a Read or Write operation is to be performed. When this bit is set to 1, a Read operation is selected, and when set to 0, a Write operation is selected.After the MASTER sends a START condition and the SLAVE address byte, the IS24CXX monitors the bus and responds with an Acknowledge (on the SDA line) when its address matches the transmitted slave address. The IS24CXX pulls down the SDA line during the ninth clock cycle, signaling that it received the eight bytes of data. The IS24CXX then performs a Read or Write operation depending on the state of the R/W bit.WRITE OPERATIONBYTE WRITEIn the Byte Write mode, the Master device sends the START condition and the slave address information(with the R/W set to Zero) to the Slave device. After the Slave generates an acknowledge, the Master sends the byte address that is to be written into the address pointer of the IS24CXX. After receiving another acknowledge from the Slave, the Master device transmits the data byte to be written into the address memory location. The IS24CXX acknowledges once more and the Master generatesthe STOP condition, at which time the device begins its internal programming cycle. While this internal cycle is in progress, the device will not respond to any request from the Master device.元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.html4Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774Rev.DIS24C01IS24C02IS24C04IS24C08 IS24C16ISSIcondition and the IS24CXX discontinues transmission. If 'n' is the last byte of the memory, then the data from location '0' will be transmitted. (Refer to Current Address Read Diagram.)RANDOM ADDRESS READSelective READ operations allow the Master device to select at random any memory location for a READ operation.The Master device first performs a 'dummy' write operation by sending the START condition, slave address and word address of the location it wishes to read. After the IS24CXX acknowledge the word address, the Master device resends the START condition and the slave address, this time with the R/W bit set to one. The IS24CXX then responds with its acknowledge and sends the data requested. The master device does not send an acknowledge but will generate a STOP condition. (Refer to Random Address Read Diagram.)SEQUENTIAL READSequential Reads can be initiated as either a Current Address Read or Random Address Read. After the IS24CXX sends initial byte sequence, the master device now responds with an ACKnowledge indicating it requires additional data from the IS24CXX. The IS24CXX continues to output data for each ACKnowledge received. The master device terminates the sequential READ operation by pulling SDA HIGH (no ACKnowledge) indicating the last data word to be read, followed by a STOP condition.The data output is sequential, with the data from address n followed by the data from address n+1, ... etc.The address counter increments by one automatically,allowing the entire memory contents to be serially read during sequential read operation. When the memory address boundary (127 for IS24C01; 255 for IS24C02; 511 for IS24C04; 1023 for IS24C08; 2047 forIS24C16) is reached,the address counter “rolls over” to address 0, and the IS24CXX continues to output data for each ACKnowledge received. (Refer to Sequential Read Operation Starting with a Random Address READ Diagram.)PAGE WRITEThe IS24CXX is capable of page-WRITE (8-byte for 24C01/02 and 16-byte for 24C04/08/16) operation. A page-WRITE is initiated in the same manner as a byte write, but instead of terminating the internal write cycle after the first data word is transferred, the master device can transmit up to N more bytes (N=7 for 24C01/02 and N=15 for 24C04/08/16). After the receipt of each data word, the IS24CXX responds immediately with an ACKnowledge on SDA line, and the three lower (24C01/24C02) or four lower (24C04/24C08/24C16) order data word address bits are internally incremented by one, while the higher order bits of the data word address remain constant. If the master device should transmit more than N+1 (N=7 for 24C01/02 and N=15 for 24C04/08/16) words, prior to issuing the STOP condition,the address counter will “roll over,” and the previously written data will be overwritten. Once all N+1 (N=7 for 24C01/02 and N=15 for 24C04/08/16) bytes are received and the STOP condition has been sent by the Master, the internal programming cycle begins. At this point, all received data is written to the IS24CXX in a single write cycle. All inputs are disabled until completion of the internal WRITE cycle. ACKNOWLEDGE POLLINGThe disabling of the inputs can be used to take advantage of the typical write cycle time. Once the stop condition is issued to indicate the end of the host's write operation, the IS24CXX initiates the internal write cycle. ACK polling can be initiated immediately. This involves issuing the start condition followed by the slave address for a write operation.If the IS24CXX is still busy with the write operation, no ACK will be returned. If the IS24CXX has completed the write operation, an ACK will be returned and the host can then proceed with the next read or write operation.READ OPERATIONREAD operations are initiated in the same manner as WRITE operations, except that the read/write bit of the slave address is set to “1”. There are three READ operation options: current address read, random address read and sequential read. CURRENT ADDRESS READThe IS24CXX contains an internal address counter which maintains the address of the last byte accessed, incremented by one. For example, if the previous operation is either a read or write operation addressed to the address location n,the internal address counter would increment to address location n+1. When the IS24CXX receives the Device Addressing Byte with a READ operation (read/write bit set to “1”), it will respond an ACKnowledge and transmit the 8-bit data word stored at address location n+1. The master will not acknowledge the transfer but does generate a STOP元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.html元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?TYPICAL SYSTEM BUS CONFIGURATIONSTART AND STOP CONDITIONS6Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?DATA VALIDITY PROTOCOL元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?PAGE WRITE8Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?SEQUENTIAL READ元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?ABSOLUTE MAXIMUM RATINGS(1)Symbol Parameter Value UnitV S Supply Voltage0.5 to +6.25VV P Voltage on Any Pin–0.5 to Vcc + 0.5VT BIAS Temperature Under Bias–40 to +85°CT STG Storage Temperature–65 to +150°CI OUT Output Current5mANotes:1.Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may causepermanent damage to the device. This is a stress rating only and functional operation of thedevice at these or any other conditions above those indicated in the operational sections ofthis specification is not implied. Exposure to absolute maximum rating conditions forextended periods may affect reliability.OPERATING RANGE(IS24C01-2, IS24C02-2, IS24C04-2 IS24C08-2, & IS24C16-2)Range Ambient Temperature V CCCommercial0°C to +70°C 1.8V to 5.5VIndustrial–40°C to +85°C 1.8V to 5.5VOPERATING RANGE(IS24C01-3, IS24C02-3, IS24C04-3, IS24C08-3, & IS24C16-3)Range Ambient Temperature V CCCommercial0°C to +70°C 2.5V to 5.5VIndustrial–40°C to +85°C 2.5V to 5.5VAutomotive–40°C to +125°C 2.7V to 5.5VNote: Automotive data is preliminary.OPERATING RANGE(IS24C01-5, IS24C02-5, IS24C04-5 IS24C08-5, & IS24C16-5)Range Ambient Temperature V CCAuromotive–40°C to +125°C 4.5V to 5.5VNote: Automotive data is preliminary.10Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?DC ELECTRICAL CHARACTERISTICSSymbol Parameter Test Conditions Min.Max.UnitV OL1Output LOW Voltage V CC = 1.8V, I OL = 0.15 mA—0.2VV OL2Output LOW Voltage V CC = 2.5V, I OL = 1.0 mA—0.4VV IH Input HIGH Voltage V CC X 0.7V CC + 0.5VV IL Input LOW Voltage–1.0V CC X 0.3VI LI Input Leakage Current V IN = V CC max.—3µAI LO Output Leakage Current—3µANotes: V IL min and V IH max are reference only and are not tested.POWER SUPPLY CHARACTERISTICSSymbol Parameter Test Conditions Min.Max.UnitI CC1Vcc Operating Current READ at 100 KHz (Vcc = 5V)— 1.0mAI CC2Vcc Operating Current WRITE at 100 KHz (Vcc = 5V)— 3.0mAI SB1Standby Current Vcc = 1.8V— 4.0µAI SB2Standby Current Vcc = 5.5V—8.0µACAPACITANCE(1,2)Symbol Parameter Conditions Max.UnitC IN Input Capacitance V IN = 0V6pFC OUT Output Capacitance V OUT = 0V8pFNotes:1.Tested initially and after any design or process changes that may affect these parameters.2.Test conditions: T A = 25°C, f = 1 MHz, Vcc = 5.0V.12Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D IS24C01IS24C02IS24C04IS24C08 IS24C16ISSIAC ELECTRICAL CHARACTERISTICS (Over Operating Range)Automotive (T A = –40°C to +125°C) 2.7V-5.5V 4.5V-5.5V Symbol Parameter Test ConditionsMin.Max.Min.Max.Unit f SCL SCL Clock Frequency 01000400KHz T Noise Suppression Time (1)—100—50ns t LOW Clock LOW Period 4.7— 1.2—µs t HIGH Clock HIGH Period4—0.6—µs t BUF Bus Free Time Before New Transmission 4.7— 1.2—µs t SU:STA Start Condition Setup Time 4.7—0.6—µs t SU:STO Stop Condition Setup Time 4.7—0.6—µs t HD:STA Start Condition Hold Time 4—0.6—µs t HD:STO Stop Condition Hold Time 4—0.6—µs t SU:DAT Data In Setup Time 200—100—ns t HD:DAT Data In Hold Time 0—0—ns t DH Data Out Hold Time SCL LOW to SDA Data Out Change 100—50—ns t AA Clock to Output SCL LOW to SDA Data Out Valid0.1 4.50.10.9µs t R SCL and SDA Rise Time(1)—1000—300ns t F SCL and SDA Fall Time (1)—300—300ns t WRWrite Cycle Time—10—10msNote:1. This parameter is characterized but not 100% tested.2. Automotive data is preliminary.AC ELECTRICAL CHARACTERISTICS (Over Operating Rnage)Commercial (T A = 0°C to +70°C) Industrial (T A = –40°C to +85°C) 1.8V-5.5V 2.5V-5.5V Symbol Parameter Test ConditionsMin.Max.Min.Max.Unit f SCL SCL Clock Frequency 01000400KHz T Noise Suppression Time (1)—100—50ns t LOW Clock LOW Period 4.7— 1.2—µs t HIGH Clock HIGH Period4—0.6—µs t BUF Bus Free Time Before New Transmission (1) 4.7— 1.2—µs t SU:STA Start Condition Setup Time 4.7—0.6—µs t SU:STO Stop Condition Setup Time 4.7—0.6—µs t HD:STA Start Condition Hold Time 4—0.6—µs t HD:STO StopCondition Hold Time 4—0.6—µs t SU:DAT Data In Setup Time 200—100—ns t HD:DAT Data In Hold Time 0—0—ns t DH Data Out Hold Time SCL LOW to SDA Data Out Change 100—50—ns t AA Clock to Output SCL LOW to SDA Data Out Valid 0.1 4.50.10.9µs t R SCL and SDA Rise Time (1)—1000—300ns t F SCL and SDA Fall Time (1)—300—300ns t WRWrite Cycle Time—10—5msNote:1. This parameter is characterized but not 100% tested.元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.html元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?AC WAVEFORMSBUS TIMINGWRITE CYCLE TIMING元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?ORDERING INFORMATIONCommercial Range: 0°C to +70°CVol tageFrequency Range Part Number Package100 KHz 1.8V IS24C01-2P300-mil Plastic DIPto 5.5V IS24C01-2G Small Outline (JEDEC STD)IS24C01-2S MSOPIS24C01-2Z TSSOP100 KHz 1.8V IS24C02-2P300-mil Plastic DIPto 5.5V IS24C02-2G Small Outline (JEDEC STD)IS24C02-2S MSOPIS24C02-2Z TSSOP100 KHz 1.8V IS24C04-2P300-mil Plastic DIPto 5.5V IS24C04-2G Small Outline (JEDEC STD)IS24C04-2Z TSSOP100 KHz 1.8V IS24C08-2P300-mil Plastic DIPto 5.5V IS24C08-2G Small Outline (JEDEC STD)IS24C08-2Z TSSOP100 KHz 1.8V IS24C16-2P300-mil Plastic DIPto 5.5V IS24C16-2G Small Outline (JEDEC STD)400 KHz 2.5V IS24C01-3P300-mil Plastic DIPto 5.5V IS24C01-3G Small Outline (JEDEC STD)IS24C01-3S MSOPIS24C01-3Z TSSOP400 KHz 2.5V IS24C02-3P300-mil Plastic DIPto 5.5V IS24C02-3G Small Outline (JEDEC STD)IS24C02-3S MSOPIS24C02-3Z TSSOP400 KHz 2.5V IS24C04-3P300-mil Plastic DIPto 5.5V IS24C04-3G Small Outline (JEDEC STD)IS24C04-3Z TSSOP400 KHz 2.5V IS24C08-3P300-mil Plastic DIPto 5.5V IS24C08-3G Small Outline (JEDEC STD)IS24C08-3Z TSSOP400 KHz 2.5V IS24C16-3P300-mil Plastic DIPto 5.5V IS24C16-3G Small Outline (JEDEC STD)14Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.htmlIS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?ORDERING INFORMATIONIndustrial Range: –40°C to +85°CVoltageFrequency Range Part Number Package100 KHz 1.8V IS24C01-2PI300-mil Plastic DIPto 5.5V IS24C01-2GI Small Outline (JEDEC STD)IS24C01-2SI MSOPIS24C01-2ZI TSSOP100 KHz 1.8V IS24C02-2PI300-mil Plastic DIPto 5.5V IS24C02-2GI Small Outline (JEDEC STD)IS24C02-2SI MSOPIS24C02-2ZI TSSOP100 KHz 1.8V IS24C04-2PI300-mil Plastic DIPto 5.5V IS24C04-2GI Small Outline (JEDEC STD)IS24C04-2ZI TSSOP100 KHz 1.8V IS24C08-2PI300-mil Plastic DIPto 5.5V IS24C08-2GI Small Outline (JEDEC STD)IS24C08-2ZI TSSOP100 KHz 1.8V IS24C16-2PI300-mil Plastic DIPto 5.5V IS24C16-2GI Small Outline (JEDEC STD)400 KHz 2.5V IS24C01-3PI300-mil Plastic DIPto 5.5V IS24C01-3GI Small Outline (JEDEC STD)IS24C01-3SI MSOPIS24C01-3ZI TSSOP400 KHz 2.5V IS24C02-3PI300-mil Plastic DIPto 5.5V IS24C02-3GI Small Outline (JEDEC STD)IS24C02-3SI MSOPIS24C02-3ZI TSSOP400 KHz 2.5V IS24C04-3PI300-mil Plastic DIPto 5.5V IS24C04-3GI Small Outline (JEDEC STD)IS24C04-3ZI TSSOP400 KHz 2.5V IS24C08-3PI300-mil Plastic DIPto 5.5V IS24C08-3GI Small Outline (JEDEC STD)IS24C08-3ZI TSSOP400 KHz 2.5V IS24C16-3PI300-mil Plastic DIPto 5.5V IS24C16-3GI Small Outline (JEDEC STD)元器件交易⽹/doc/af5937a6dd3383c4bb4cd241.html IS24C01IS24C02IS24C04IS24C08 IS24C16ISSI?ORDERING INFORMATIONAutomotive Range: –40°C to +125°CVoltageFrequency Range Part Number Package100 KHz 2.7V IS24C01-3PA300-mil Plastic DIPto 5.5V IS24C01-3GA Small Outline (JEDEC STD)IS24C01-3SA MSOPIS24C01-3ZA TSSOP100 KHz 2.7V IS24C02-3PA300-mil Plastic DIPto 5.5V IS24C02-3GA Small Outline (JEDEC STD)IS24C02-3SA MSOPIS24C02-3ZA TSSOP100 KHz 2.7V IS24C04-3PA300-mil Plastic DIPto 5.5V IS24C04-3GA Small Outline (JEDEC STD)IS24C04-3ZA TSSOP100 KHz 2.7V IS24C08-3PA300-mil Plastic DIPto 5.5V IS24C08-3GA Small Outline (JEDEC STD)IS24C08-3ZA TSSOP100 KHz 2.7V IS24C16-3PA300-mil Plastic DIPto 5.5V IS24C16-3GA Small Outline (JEDEC STD)400 KHz 4.5V IS24C01-5PA300-mil Plastic DIPto 5.5V IS24C01-5GA Small Outline (JEDEC STD)IS24C01-5SA MSOPIS24C01-5ZA TSSOP400 KHz 4.5V IS24C02-5PA300-mil Plastic DIPto 5.5V IS24C02-5GA Small Outline (JEDEC STD)IS24C02-5SA MSOPIS24C02-5ZA TSSOP400 KHz 4.5V IS24C04-5PA300-mil Plastic DIPto 5.5V IS24C04-5GA Small Outline (JEDEC STD)IS24C04-5ZA TSSOP400 KHz 4.5V IS24C08-5PA300-mil Plastic DIPto 5.5V IS24C08-5GA Small Outline (JEDEC STD)IS24C08-5ZA TSSOP400 KHz 4.5V IS24C16-5PA300-mil Plastic DIPto 5.5V IS24C16-5GA Small Outline (JEDEC STD)Note: Automotive data is preliminary.16Integrated Silicon Solution, Inc. — /doc/af5937a6dd3383c4bb4cd241.html — 1-800-379-4774 Rev.D。
24C02/24C04/24C08/24C16/24C32/24C641.2.2K4K 8K ,16K ,32K 位和64K 位串行I C 总线EEPROM3.24C02/04/08/16/32/64PROM256/512/1024/2048/4096/8192×8-bit1.8V1μA1mA 24C02/04/08/16/32/648/16/16/16/32/3224C02/04/08/16/32/648-pin PDIP8-pin SOP ●●●●●●●●●●●●SD SCL WP V CC NC A SD A SCL WP V CC 12348765NC NC NC GND SD A SCL WP V CC 12348765 ()SD A SCL WP V CC 12348765A 0A 1A 2GND C02C1621.8V~5.5V- 1mA- 1μA- 24C02, 256 X 8 (2K bits)- 24C04, 512 X 8 (4K bits) - 24C08, 1024 X 8 (8K bits) - 24C16, 2048 X 8 (16K bits)- 24C32, 4096 X 8 (32K bits)- 24C64, 8192 X 8 (64K bits)2I CI C 1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) ( 5 ms)8 (24C02)16(24C04/08/16),32字节页(24C32/64)ESD 2.5kV - 100- 100 8-pin DIP 8-pin SOP RoHS ●●●●●●●22●S D A 123487651A 2GND NC NC C A 2GND C04C082.7V)00n SOP●●SD A SCL WP V CC 12348765A 0A 1A 2GND C32SD ASCL WP V CC 12348765A 0A 1A 2GNDC6424C02/24C04/24C08/24C16/24C32/24C645. Ḛ1 ḚV 6. 乱 ヺ ԡⳈ⌕կ⬉⬉ Ⳉ⌕䕧 ⬉ ⏽V CC Ⳉ⌕䕧 ⬉ V IN V OUT T STG -0.3 ~ V CC +0.3-0.3 ~ V CC +0.3-0.3 ~ +6.5°C -65 ~ +150V °C7. 㤤 ӊヺ ԡⳈ⌕կ⬉⬉ V CC ⏽T A+855.5 1.8-40(䍙 乱 㛑Ӯ 㟈 ӊ )V V ( 㤤 ӊϟ ⦄ 㛑)SDASCL WP V CCNC /NC /NC /A0NC /NC /A1/A1NC /A2/A2/A2C16/C08/C04/C02GNDSTART STOPLOGICSERIAL CONTROLLOGICDEVICE ADDRESS COMPARATORDATA WORD ADDRESS COUNTER LOADCOMPLOADINCY DECODER HIGH VOLTAGE PUMP/TIMING ENDATA RECOVERYEEPROMSERIAL MUXX D E C O D E RDOUT/ACKNOWLEDGEDINESD ⬉ (Ҏԧ )ESD ⬉ ( )V ESD2500200V V乱⬉ 䕧 ⬉ 乱 㛑Ӯ 㟈 ӊ DOUTmA 9. Ⳉ⌕⬉⇨⡍ヺ ԡ ⬉⌕կ⬉⬉⌕I CC V CC =5V⌟䆩 ӊ100kHz 3.0䕧 Ԣ⬉ ⬉μA 3.01.0-0.6V 0.4V IN = V CC GND 0.05( ӊ˖T A = 0°C ̚ +70°C, V CC = +1.8V ̚ +5.5V ˈ䰸䴲 ⊼䞞)䕧 Ԣ⬉ ⬉ μA V IL 0.4V CC0.20.4100kHz V V CC ×0.3I SB V IN = V CC GND V OUT = V CC GND μA 䕧 ⓣ⬉⌕䕧 ⓣ⬉⌕I LI I LO V IH 䕧 催⬉ ⬉ V CC +0.5V V V VV OL3V OL2V = 2.1 mA V 10. Ѹ⌕⬉⇨⡍ ( ӊ˖T A = 0°C ̚ +70°C, V = +1.8V +5.5V, C L = 100 pF ˈ䰸䴲 ⊼䞞)ヺ ԡ䩳催⬉䩳乥⥛, SCL ⌟䆩 ӊ400V CC =1.8V 1000ns 0.050.050.60.90.6 μskHz 1.20.5540V CC =5V 0.4t LOW μs ⍜䰸 䯈 䩳ϟ䰡⊓ 䕧 䯈䱨 䯈t I t AA50t HIGH䩳Ԣ⬉ μsV CC =1.8V V CC =5V V CC =1.8V V CC =5V V CC =1.8V V CC =5V V CC =1.8V V CC =5V8. 㛮⬉( ӊ˖T A = 25°C, f = 1.0 MHz, V CC = +1.8V)pFヺ ԡ䕧 /䕧 ⬉ (SDA)C I/O 䕧 ⬉ (A0, A1, A2, SCL)C IN68 pF⌟䆩 ӊV I/O = 0V V IN = 0V1.2 㒓䞞 䯈t BUF0.5μs V CC =1.8V V CC =5V䇏1.03.0 mA m 042.0C =5.0V, I OL = 3.0 mA CC ×0.7GNDOL1V CC =3.0V, I OL =2.1mA CC =1.8V, I OL = 0.15 mA =C CC = +1.8V ̚+5.5f SCL10. Ѹ⌕⬉⇨⡍ (㓁)䕧 Ϟ 䯈 䕧 䯈0ns500.650.25ns t WRns 100ns ℶ ӊ ゟ 䯈 䕧 䯈t R t DH t F 䕧 ゟ 䯈μs ms䕧 ϟ䰡 䯈t SU.STOV CC =1.8V V CC =5V V CC =1.8V V CC =5Vμs 300100300t HD.DAT t SU.DAT 2 㒓3SCLSDA_INSDA _OUTt F t LOWt SU .STAt HD.STAt AA t DHt BUFt SU.STOt Rt HD.DAT t SU.DAT t HIGH t LOW8th BIT SCLSDAACKSTOPCONDITIONSTART CONDITIONt WR (1)t HD.STAμs 䍋 ӊ 䯈䍋 ӊ ゟ 䯈t SU.STA V CC =1.8V V CC =5V V CC =1.8V V CC =5Vμs 0.60.250.60.25ヺ ԡ ⌟䆩 ӊ ⊼ 䯈W :5 ҢϔϾ ⱘ ℶ ӊ 㟇 䚼 㒧 ⱘ 䯈DŽn 08V μ3001AHIG11.3156247A0A1A2SDA SCL WP GND V CCA2A1A024C02/32/64A2A1A0824C02/32/6424C04A2A1424C04A024C08A2224C08A0A124C1616KA2A1A0/SDA V CC10kΩSCL8WP WPWPV CC12.13. 䆺㒚 䇈24CXX I C 㒓Ӵ䕧 䆂DŽI C ϔ⾡ ǃϸ㒓І㸠䗮䆃 ˈ І㸠 㒓SDA І㸠 䩳㒓SCL DŽϸḍ㒓䛑 乏䗮䖛ϔϾϞ ⬉䰏 ⬉⑤DŽ ⱘ 㒓䜡㕂 4 ⼎4 ϸ㒓 㒓䜡㕂㒓Ϟ 䗕 ⱘ ӊ㹿⿄ 䗕 ˈ ⱘ ӊ㹿⿄ DŽ Ѹ ⱘ ӊ㹿⿄Џ ӊˈ Џ ӊ ⱘ ӊ 㹿⿄Ң ӊDŽЏ ӊѻ⫳І㸠 䩳SCL ˈ㒓ⱘ䆓䯂⢊ ǃѻ⫳START STOP ӊDŽ24CXX I C 㒓ЁЎҢ ӊ DŽ㒓 Ѣぎ䯆⢊ ҹ Ӵ䕧DŽ↣ Ӵ䕧 ѢSTART ӊˈ㒧 ѢSTOP ӊˈѠ㗙П䯈ⱘ 㡖 ≵ 䰤 ⱘˈ⬅ 㒓ϞⱘЏ ӊ DŽ ҹ 㡖˄8ԡ˅Ў ԡӴ䕧ˈ9ԡ ⬅ ѻ⫳ ㄨDŽ䍋 ℶ ӊ䩳㒓䛑Ў催 ⿄ 㒓 ぎ䯆⢊ DŽ SCL Ў催⬉ SDA ⱘϟ䰡⊓˄催 Ԣ 䍋 ӊ˄START ˈㅔ ЎS ˅ˈSDA ⱘϞ ⊓˄Ԣ 催˅ ℶ ӊ˄STOP ˈㅔ ЎP ˅DŽ 㾕 5DŽ5 䍋 ӊ ℶ ӊⱘ НV CCҪ24Cxx MPU SDASCLR PR Pϸ㒓І㸠S Ў催ㅔ ЎⱘϞ ⊓˄Ԣ 㒓І㸠 㒓SS 䍋 ӊ222ԡӴ䕧↣Ͼ 䩳㛝 Ӵ䗕ϔԡ DŽSCL Ў催 SDA 乏 〇 ˈ Ўℸ SDA ⱘ 㹿䅸Ў DŽԡӴ䕧 㾕 6DŽ6 ԡӴ䕧ㄨ㒓Ϟⱘ ↣ ϔϾ 㡖 ѻ⫳ϔϾ ㄨˈЏ ӊ 乏ѻ⫳ϔϾ ⱘ乱 ⱘ 䩳㛝 ˈ㾕 7DŽ7 I C㒓ⱘ ㄨ ԢSDA 㒓㸼⼎ ㄨˈ ㄨ㛝 䯈 〇 ⱘԢ⬉ DŽ Џ ӊ ˈ 乏 Ӵ䕧㒧 ⱘ 㒭 䗕 ˈ ϔϾ 㡖П ⱘ ㄨ㛝 䯈ϡӮѻ⫳ ㄨ ˄ϡ ԢSDA ˅DŽ䖭⾡ ϟˈ 䗕 乏䞞 SDA 㒓Ў催ҹ Џ ӊѻ⫳ ℶ ӊDŽ䗕 䕧 ⱘ䕧 ⱘЏ ӊ ⱘ䍋 ӊ289䴲 ㄨㄨㄨ 䩳㛝㒓〇䆌SDASCL2ѻ⫳ϔϾ ㄨˈЏ ӊ 乏ѻ⫳ϔԢ㒓Ӵӊ ⱘSCL 䍋 ӊS1ӊ䍋 ӊՓ㛑㢃⠛䇏 ˈEEPROM 䛑㽕∖ 8ԡⱘ ӊ ˄㾕 8˅DŽӊ ⬅"1"ǃ"0" 㒘 ˈ 4ԡ Ё ⼎ˈ Ѣ І㸠EEPROM 䛑 ϔḋⱘ Ѣ24C02/32/64ˈ䱣 3ԡA2ǃA1 A0Ў ӊ ԡˈ 乏Ϣ⹀ӊ䕧 㛮 ϔ㟈DŽ Ѣ24C04ˈ䱣 2ԡA2 A1Ў ӊ ԡˈ 1ԡЎ义 ԡDŽA2 A1 乏Ϣ⹀ӊ䕧 㛮 ϔ㟈ˈ㗠A0 ぎ㛮DŽѢ24C08ˈ䱣 1ԡA2Ў ӊ ԡˈ 2ԡЎ义 ԡDŽA2 乏Ϣ⹀ӊ䕧 㛮 ϔ㟈ˈ㗠A1 A0 ぎ㛮DŽѢ24C16ˈ ӊ ԡˈ3ԡ䛑Ў义 ԡˈ㗠A2ǃA1 A0 ぎ㛮DŽ ӊ ⱘLSB Ў䇏/ 䗝 ԡˈ催Ў䇏 ˈԢЎ DŽ㢹↨䕗 ӊ ϔ㟈ˈEEPROM 䕧 ㄨ"0"DŽ ϡϔ㟈ˈ 䖨 ⢊ DŽ8 ӊ 1010A2A1A0R/W MSBLSB1010A2A1P0R/W1010A2P1P0R/W1010P2P1P0R/Wӊ EEPROM Ԣ 㗫 ⱘ⡍⚍ˈ ӊЎ˖˄1˅⬉⑤Ϟ⬉˗˄2˅ ℶ ӊ ӏԩ 䚼 DŽ24C0424C0824C16DŽ ԡ䆂Ёѻ⫳Ё ǃ ⬉ ㋏㒳 ԡ ˈI C 㒓 䗮䖛ҹϟℹ偸 ԡ˖ ˄1˅ѻ⫳9Ͼ 䩳 DŽ˄2˅ SCL Ў催 ˈSDA гЎ催DŽ ˄3˅ѻ⫳ϔϾ䍋 ӊDŽ21. 㡖㽕∖ ӊ ACK ㄨ ˈ 8ԡⱘ DŽ 䖭Ͼ EEPROM ㄨ"0"ˈ✊ ϔϾ8ԡ DŽ 8ԡ ˈEEPROM ㄨ"0"ˈ ⴔ 乏⬅Џ ӊ 䗕 ℶ ӊ 㒜ℶ DŽℸ EEPROM 䖯 䚼 t WR ˈ 䴲 Ёˈ ℸ 䯈 䕧 䛑 Ⳉ ˈEEPROM Ӯ ㄨ˄㾕 9˅DŽ9 㡖SDA 㒓䍋 ӊM S BL S B R /W A C K M S BL S B A C KA C Kӊℶ ӊDŽ24C02/32/6413.2.图10页写24C02器件按8字节/页执行页写,24C04/08/16器件按16字节/页执行页写,24C32/64器件按32字节/页执行页写。
EEPROM AT24C08 总结:
1、引脚功能
引脚功能
引脚名称功能描述
A0-A2地址输入A2 接地芯片活动,A1 和 A0 悬空即可(无用)
SDA数据 / 地址线串行数据 / 地址线
SCL时钟线串行时钟线
WP写保护WP低电平严禁写保护(同意读写),高电平写保护(禁
止读写)
NC悬空悬空该引脚
GND地接地
VCC电源
、封装
8-lead TSSOP
8-lead SOIC
8-ball dBGA2
8-lead MAP8引脚贴片封装(以上 4 种类)
5-lead SOT235引脚贴片封装
8-lead PDIP8引脚双列直插式封装
3、功能框图
4、组织结构
总合 1024Byte (8Kbit ),由 64Page x 16Byte构成,需要10 位数据地址。
5、总线时序
6、设备地址(Device Address)
固定值器件选择器件 BLOCK选择读写操作1010A2P1P0R/W A0:选择第 1 片00: BLOCK0R:1 W:0
1:选择第 2 片01: BLOCK1
02: BLOCK2
03: BLOCK3
注意:共有4 个 BLOCK区,每个区 256Byte = 16Page x 16Byte。
DS21081D-page 12© 1996 Microchip Technology Inc.Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre-sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not autho-rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.W ORLDWIDE S ALES & S ERVICEASIA/PACIFIC China Microchip Technology Unit 406 of Shanghai Golden Bridge Bldg.2077 Yan’an Road West, Hongiao District Shanghai, Peoples Republic of China Tel: 86 21 6275 5700 Fax: 011 86 21 6275 5060 Hong Kong Microchip Technology RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T. Hong Kong Tel: 852 2 401 1200 Fax: 852 2 401 3431India Microchip Technology No. 6, Legacy, Convent Road Bangalore 560 025 India Tel: 91 80 526 3148 Fax: 91 80 559 9840Korea Microchip Technology 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku,Seoul, Korea Tel: 82 2 554 7200 Fax: 82 2 558 5934Singapore Microchip Technology 200 Middle Road #10-03 Prime Centre Singapore 188980Tel: 65 334 8870 Fax: 65 334 8850Taiwan, R.O.C Microchip Technology 10F-1C 207Tung Hua North Road Taipei, Taiwan, ROC Tel: 886 2 717 7175 Fax: 886 2 545 0139EUROPE United Kingdom Arizona Microchip Technology Ltd.Unit 6, The Courtyard Meadow Bank, Furlong Road Bourne End, Buckinghamshire SL8 5AJ Tel: 44 1628 850303 Fax: 44 1628 850178France Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy - France Tel: 33 1 69 53 63 20 Fax: 33 1 69 30 90 79Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125D-81739 Muenchen, Germany Tel: 49 89 627 144 0 Fax: 49 89 627 144 44Italy Arizona Microchip Technology SRL Centro Direzionale Colleone Pas Taurus 1Viale Colleoni 120041 Agrate Brianza Milan Italy Tel: 39 39 6899939 Fax: 39 39 689 9883JAPAN Microchip Technology Intl. Inc.Benex S-1 6F 3-18-20, Shin Yokohama Kohoku-Ku, Yokohama Kanagawa 222 Japan Tel: 81 45 471 6166 Fax: 81 45 471 61229/3/96AMERICASCorporate OfficeMicrochip Technology Inc.2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 602 786-7200 Fax: 602 786-7277Technical Support: 602 786-7627Web: AtlantaMicrochip Technology Inc.500 Sugar Mill Road, Suite 200BAtlanta, GA 30350Tel: 770 640-0034 Fax: 770 640-0307BostonMicrochip Technology Inc.5 Mount Royal AvenueMarlborough, MA 01752Tel: 508 480-9990 Fax: 508 480-8575ChicagoMicrochip Technology Inc.333 Pierce Road, Suite 180Itasca, IL 60143Tel: 708 285-0071 Fax: 708 285-0075DallasMicrochip Technology Inc.14651 Dallas Parkway, Suite 816Dallas, TX 75240-8809Tel: 972 991-7177 Fax: 972 991-8588DaytonMicrochip Technology Inc.Suite 150Two Prestige PlaceMiamisburg, OH 45342Tel: 513 291-1654 Fax: 513 291-9175Los AngelesMicrochip Technology Inc.18201 Von Karman, Suite 1090Irvine, CA 92612Tel: 714 263-1888 Fax: 714 263-1338New YorkMicrochip Technmgy Inc.150 Motor Parkway, Suite 416Hauppauge, NY 11788Tel: 516 273-5305 Fax: 516 273-5335San JoseMicrochip Technology Inc.2107 North First Street, Suite 590San Jose, CA 95131Tel: 408 436-7950 Fax: 408 436-7955TorontoMicrochip Technology Inc.5925 Airport Road, Suite 200Mississauga, Ontario L4V 1W1, CanadaTel: 905 405-6279Fax: 905 405-6253All rights reserved. © 1996, Microchip Technology Incorporated, USA. 9/96Printed on recycled paper.。
F MDCo nf i de n t i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page1Two-Wire Serial EEPROM4K, 8K and 16K (8-bit wide)FEATURES❑Low voltage and low power operations:FT24C04A/08A/16A: V CC = 1.8V to 5.5V❑ Maximum Standby current < 1µA (typically 0.02µA and 0.06µA @ 1.8V and 5.5V respectively). ❑ 16 bytes page write mode.❑ Partial page write operation allowed.❑ Internally organized: 512 x 8 (4K), 1024 x 8 (8K), 2048 x 8 (16K). ❑ Standard 2-wire bi-directional serial interface. ❑ Schmitt trigger, filtered inputs for noise protection. ❑ Self-timed Write Cycle (5ms maximum).❑ 1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility. ❑ Automatic erase before write operation.❑ Write protect pin for hardware data protection.❑ High reliability: typically 1, 000,000 cycles endurance. ❑ 100 years data retention.❑ Industrial temperature range (-40o C to 85o C).❑Standard 8-lead DIP/SOP/MSOP/TSSOP/DFN and 5-lead SOT-23/TSOT-23 Pb-free packages.DESCRIPTIONThe FT24C04A/08A/16A series are 4,096/8,192/16,384 bits of serial Electrical Erasable andProgrammable Read Only Memory, commonly known as EEPROM. They are organized as 512/1,024/2,048 words of 8 bits (1 byte) each. The devices are fabricated with proprietary advanced CMOS process for low power and low voltage applications. These devices are available in standard 8-lead DIP, 8-lead SOP, 8-lead TSSOP, 8-lead DFN, 8-lead MSOP, and 5-lead SOT-23/TSOT-23 packages. A standard 2-wire serial interface is used to address all read and write functions. Our extended V CC range (1.8V to 5.5V) devices enables wide spectrum of applications.PIN CONFIGURATIONPin Name Pin FunctionA2, A1, A0 Device Address Inputs SDA Serial Data Input / Open Drain Output SCL Serial Clock Input WP Write Protect NC No-ConnectF MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page2All these packaging types come in conventional or Pb-free certified.VCC W P SCL SDAA2A1A0G 8L DIP 8L SOP8L TSSOP W P VCCG ND FT24C04A/08A/16A 5L SOT-23SCL 8L DFN8L M SOP 5L TSO T-23ABSOLUTE MAXIMUM RATINGSIndustrial operating temperature: -40℃ to 85℃ Storage temperature:-50℃ to 125℃Input voltage on any pin relative to ground: -0.3V to V CC + 0.3V Maximum voltage: 8VESD protection on all pins: >2000V* Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to thedevice. Functional operation of the device at conditions beyond those listed in the specification is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality .F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page3PIN DESCRIPTIONS(A) SERIAL CLOCK (SCL)The rising edge of this SCL input is to latch data into the EEPROM device while the falling edge of this clock is to clock data out of the EEPROM device.(B) DEVICE / CHIP SELECT ADDRESSES (A2, A1, A0)These are the chip select input signals for the serial EEPROM devices. Typically, these signals are hardwired to either V IH or V IL . If left unconnected, they are internally recognized as V IL . FT24C04A has A0 pin as no-connect. FT24C08A has both A0 and A1 pins as no-connect. For FT24C16A, all device address pins (A0-A2) are no-connect.(C) SERIAL DATA LINE (SDA)SDA data line is a bi-directional signal for the serial devices. It is an open drain output signal and can bewired-OR with other open-drain output devices.(D) WRITE PROTECT (WP)The FT24C04A/08A/16A devices have a WP pin to protect the whole EEPROM array from programming. Programming operations are allowed if WP pin is left un-connected or input to V IL . Conversely all programming functions are disabled if WP pin is connected to V IH or V CC . Read operations is not affected by the WP pin’s input level.Table AF MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page4Device Chip Select/DeviceAddress Pins UsedNo-Connect Pins Max number of similardevices on the samebusFT24C04A A2, A1 A0 4FT24C08A A2, A1, A0 2 FT24C16A(None)A2, A1, A01MEMORY ORGANIZATIONThe FT24C04A/08A/16A devices have 32/64/128 pages respectively. Since each page has 16 bytes, random word addressing to FT24C04A/08A/16A will require 9/10/11 bits data word addresses respectively.DEVICE OPERATION(A) SERIAL CLOCK AND DATA TRANSITIONSThe SDA pin is typically pulled to high by an external resistor. Data is allowed to change only whenSerial clock SCL is at V IL . Any SDA signal transition may interpret as either a START or STOP condition as described below. (B) START CONDITIONWith SCL V IH , a SDA transition from high to low is interpreted as a START condition. All valid commands must begin with a START condition.F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page5(C) STOP CONDITIONWith SCL V IH , a SDA transition from low to high is interpreted as a STOP condition. All valid read or write commands end with a STOP condition. The device goes into the STANDBY mode if it is after a read command. A STOP condition after page or byte write command will trigger the chip into the STANDBY mode after the self-timed internal programming finish. (D) ACKNOWLEDGEThe 2-wire protocol transmits address and data to and from the EEPROM in 8 bit words. The EEPROM acknowledges the data or address by outputting a "0" after receiving each word. The ACKNOWLEDGE signal occurs on the 9th serial clock after each word. (E) STANDBY MODEThe EEPROM goes into low power STANDBY mode after a fresh power up, after receiving a STOP bit in read mode, or after completing a self-time internal programming operation.Figure 1: Timing diagram for START and STOP conditionsFigure 2: Timing diagram for output ACKNOWLEDGESCLSDASTART ConditionSTOP ConditionData Data Valid TransitionSCLData inData out START ConditionACKF MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page6DEVICE ADDRESSINGThe 2-wire serial bus protocol mandates an 8 bits device address word after a START bit condition to invoke valid read or write command. The first four most significant bits of the device address must be 1010, which is common to all serial EEPROM devices. The next three bits are device address bits. These three device address bits (5th , 6th and 7th ) are to match with the external chip select/address pin states. If a match is made, the EEPROM device outputs an ACKNOWLEDGE signal after the 8th read/write bit, otherwise the chip will go into STANDBY mode. However, matching may not be needed for some or all device address bits (5th , 6th and 7th ) as noted below. The last or 8th bit is a read/write command bit. If the 8th bit is at V IH then the chip goes into read mode. If a “0” is detected, the device enters programming mode.FT24C04A uses A2 (5th ) and A1 (6th ) device address bits. Only four FT24C04A devices can be wired-OR on the same 2-wire bus. Their corresponding chip select address pins A2 and A1 must be hard wired and coded from 00 (b) to 11 (b). Chip select address pin A0 is not used.FT24C08A uses only A2 (5th ) device address bit. Only two FT24C08A devices can be wired-OR on the same 2-wire bus. Their corresponding chip select address pin A2 must be hard-wired and coded from 0 (b) to 1 (b). Chip select address pins A1 and A0 are not used.FT24C16A does not use any device address bit. Only one FT24C16A device can be used on the on 2-wire bus. Chip Select address pins A2, A1, and A0 are not used.WRITE OPERATIONS(A) BYTE WRITEA byte write operation starts when a micro-controller sends a START bit condition, follows by a proper EEPROM device address and then a write command. If the device address bits match the chip select address, the EEPROM device will acknowledge at the 9th clock cycle. The micro-controller will then send the rest of the lower 8 bits word address. At the 18th cycle, the EEPROM will acknowledge the 8-bit address word. The micro-controller will then transmit the 8 bit data. Following an ACKNOWLDEGE signal from the EEPROM at the 27th clock cycle, the micro-controller will issue a STOP bit. After receiving the STOP bit, the EEPROM will go into a self-timed programming mode during which all external inputs will be disabled. After a programming time of T WC , the byte programming will finish and the EEPROM device will return to the STANDBY mode.(B) PAGE WRITEA page write is similar to a byte write with the exception that one to sixteen bytes can be programmed along the same page or memory row. All FT24C04A/08A/16A are organized to have 16 bytes per memory row or page.With the same write command as the byte write, the micro-controller does not issue a STOP bit aftersending the 1st byte data and receiving the ACKNOWLEDGE signal from the EEPROM on the 27th clock cycle. Instead it sends out a second 8-bit data word, with the EEPROM acknowledging at the 36th cycle. This data sending and EEPROM acknowledging cycle repeats until the micro-controller sends a STOP bit after the n 9th clock cycle. After which the EEPROM device will go into a self-timed partial or full page programming mode. After the page programming completes after a time of T WC , the devices will return to the STANDBY mode.F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page7The least significant 4 bits of the word address (column address) increments internally by one after receiving each data word. The rest of the word address bits (row address) do not change internally, but pointing to a specific memory row or page to be programmed. The first page write data word can be of any column address. Up to 16 data words can be loaded into a page. If more then 16 data words are loaded, the 17th data word will be loaded to the 1st data word column address. The 18th data word will be loaded to the 2nd data word column address and so on. In other word, data word address (column address) will “roll” over the previously loaded data. (C) ACKNOWLEDGE POLLINGACKNOWLEDGE polling may be used to poll the programming status during a self-timed internal programming. By issuing a valid read or write address command, the EEPROM will not acknowledge at the 9th clock cycle if the device is still in the self-timed programming mode. However, if the programming completes and the chip has returned to the STANDBY mode, the device will return a valid ACKNOWLEDGE signal at the 9th clock cycle.READ OPERATIONSThe read command is similar to the write command except the 8th read/write bit in address word is set to “1”. The three read operation modes are described as follows:(A) CURRENT ADDRESS READThe EEPROM internal address word counter maintains the last read or write address plus one if the power supply to the device has not been cut off. To initiate a current address read operation, the micro-controller issues a START bit and a valid device address word with the read/write bit (8th ) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. The internal address word counter will then automatically increase by one. For current address read the micro-controller will not issue an ACKNOWLEDGE signal on the 18th clock cycle. The micro-controller issues a valid STOP bit after the 18th clock cycle to terminate the read operation. The device then returns to STANDBY mode.(B) SEQUENTIAL READThe sequential read is very similar to current address read. The micro-controller issues a START bitand a valid device address word with read/write bit (8th ) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. Meanwhile the internally address word counter will then automatically increase by one. Unlike current address read, the micro-controller sends an ACKNOWLEDGE signal on the 18th clock cycle signaling the EEPROM device that it wants another byte of data. Upon receiving the ACKNOWLEDGE signal, the EEPROM will serially clocked out an 8-bit data word based on the incremented internal address counter. If the micro-controller needs another data, it sends out an ACKNOWLEDGE signal on the 27th clock cycle. Another 8-bit data word will then be serially clocked out. This sequential read continues as long as the micro-controller sends an ACKNOWLEDGE signal after receiving a new data word. When the internal address counter reaches its maximum valid address, it rolls over to the beginning of the memory array address. Similar to current address read, the micro-controller can terminate the sequential read by not acknowledging the last data word received, but sending a STOP bit afterwards instead.(C) RANDOM READRandom read is a two-steps process. The first step is to initialize the internal address counter with a target read address using a “dummy write” instruction. The second step is a current address read.To initialize the internal address counter with a target read address, the micro-controller issues a START bit first, follows by a valid device address with the read/write bit (8th ) set to “0”. The EEPROM will then acknowledge. The micro-controller will then send the address word. Again the EEPROM willacknowledge. Instead of sending a valid written data to the EEPROM, the micro-controller performs a current address readinstruction to read the data. Note that once a START bit is issued, the EEPROM will reset the internal programming process and continue to execute the new instruction - which is to read the current address.laitnedifnoCDMF© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page8F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page9Figure 8: SCL and SDA Bus TimingAC CHARACTERISTICS1.8 V2.5-5.0 V Symbol ParameterMin Max MinMax Unit f SCLClock frequency, SCL 400 1000 kHz t LOW Clock pulse width low1.20.7µst HIGH Clock pulse width high0.4 0.3 µst I Noise suppression time (1) 180 120 ns t AAClock low to data out valid 0.30.90.20.7µs t BUF Time the bus must be free before a new transmission can start (1)1.3 0.5µs t HD.STA START hold time0.6 0.25 µs t SU.STA START set-up time 0.6 0.25 µs t HD.DAT Data in hold time 0 0 µs t SU.DAT Data in set-up time100100nst R Input rise time (1)0.3 0.3 µst F Input fall time (1) 300 100 nst SU.STO STOP set-up time 0.6 0.25 µs t DH Date out hold time 50 50 ns WRWrite cycle time55msEndurance(1)25o C, Page Mode, 3.3V1,000,000Write CyclesNotes: 1. This Parameter is expected by characterization but are not fully screened by test.2. AC Measurement conditions: R L (Connects to Vcc): 1.3K ΩInput Pulse Voltages: 0.3Vcc to 0.7VccInput and output timing reference Voltages: 0.5VccF MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page10DC CHARACTERISTICSSymbol Parameter Test ConditionsMin Typical Max Units V CC1 24C A supply V CC1.8 5.5 V I CC Supply read currentV CC @ 5.0V SCL = 400 kHz0.5 1.0 mA I CCSupply write current V CC @ 5.0V SCL = 400 kHz2.03.0 mA I SB1 Supply current V CC @ 1.8V, V IN = V CC or V SS 1.0 µA I SB2 Supply current V CC @ 2.5V, V IN = V CC or V SS 1.0 µA I SB3 Supply currentV CC @ 5.0V, V IN = V CC or V SS 0.06 1.0 µA I ILInput leakagecurrentV IN = V CC or V SS 3.0 µA I LOOutput leakagecurrentV IN = V CC or V SS3.0µAV IL Input low level -0.6 V CC x 0.3 V V IHInput high levelV CC x 0.7V CC +0.5 VV OL1 Output low level V CC @ 1.8V, I OL = 0.15 mA0.2 V V OL2 Output low level V CC @ 3.0V, I OL = 2.1 mA0.4VF MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page11ORDERING INFORMATION:Density PackageTemperatureRangeVcc HSF Packaging Ordering CodeRoHSTube FT24C04A-UDR-BDIP8 -40℃-85℃ 1.8V-5.5VGreen Tube FT24C04A-UDG-B Tube FT24C04A-USR-B RoHSTape and Reel FT24C04A-USR-TTube FT24C04A-USG-B SOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C04A-USG-TTube FT24C04A-UMR-B RoHS Tape and Reel FT24C04A-UMR-TTube FT24C04A-UMG-B MSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C04A-UMG-TTube FT24C04A-UTR-B RoHSTape and Reel FT24C04A-UTR-TTube FT24C04A-UTG-B TSSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C04A-UTG-T RoHS Tape and Reel FT24C04A-ULR-T SOT23-5 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C04A-ULG-T RoHS Tape and Reel FT24C04A-UPR-T TSOT23-5 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C04A-UPG-T RoHS Tape and Reel FT24C04A-UNR-T 4kbitsDFN8 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C04A-UNG-TRoHS Tube FT24C08A-UDR-B DIP8 -40℃-85℃ 1.8V-5.5VGreen Tube FT24C08A-UDG-B Tube FT24C08A-USR-B RoHSTape and Reel FT24C08A-USR-TTube FT24C08A-USG-B 8kbitsSOP8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C08A-USG-TD: DIP8 S: SOP8 M: MSOP8 T: TSSOP8 L: SOT23-5 P: TSOT23-5 N: DFN8Packaging B: TubeT: Tape and Reel HSF R: RoHS G: GreenU:-40F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page12Density Package TemperatureRangeVcc HSF Packaging Ordering CodeTube FT24C08A-UMR-BRoHSTape and Reel FT24C08A-UMR-TTube FT24C08A-UMG-B MSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C08A-UMG-TTube FT24C08A-UTR-B RoHSTape and Reel FT24C08A-UTR-TTube FT24C08A-UTG-B TSSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C08A-UTG-T RoHSTape and Reel FT24C08A-ULR-T SOT23-5 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C08A-ULG-T RoHS Tape and Reel FT24C08A-UPR-T TSOT23-5 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C08A-UPG-T RoHS Tape and Reel FT24C08A-UNR-T 8kbitsDFN8 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C08A-UNG-TRoHS Tube FT24C16A-UDR-B DIP8 -40℃-85℃ 1.8V-5.5VGreen Tube FT24C16A-UDG-B Tube FT24C16A-USR-B RoHSTape and Reel FT24C16A-USR-TTube FT24C16A-USG-B SOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C16A-USG-TTube FT24C16A-UMR-B RoHSTape and Reel FT24C16A-UMR-TTube FT24C16A-UMG-B MSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C16A-UMG-TTube FT24C16A-UTR-B RoHS Tape and Reel FT24C16A-UTR-TTube FT24C16A-UTG-B TSSOP8 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C16A-UTG-T RoHSTape and Reel FT24C16A-ULR-T SOT23-5 -40℃-85℃ 1.8V-5.5V Green Tape and Reel FT24C16A-ULG-T RoHS Tape and Reel FT24C16A-UPR-T TSOT23-5 -40℃-85℃ 1.8V-5.5VGreen Tape and Reel FT24C16A-UPG-T RoHS Tape and Reel FT24C16A-UNR-T 16kbitsDFN8 -40℃-85℃ 1.8V-5.5VGreenTape and Reel FT24C16A-UNG-TF MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page13DIP8 PACKAGE OUTLINEDIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 3.710 4.310 0.146 0.170 A1 0.510 0.020 A2 3.200 3.600 0.126 0.142B 0.380 0.570 0.015 0.022B1 1.524(BSC ) 0.060(BSC )C 0.204 0.360 0.008 0.014D 9.000 9.400 0.354 0.370E 6.200 6.600 0.244 0.260 E1 7.320 7.920 0.288 0.312 e 2.540 (BSC) 0.100(BSC ) L 3.000 3.600 0.118 0.142 E2 8.400 9.000 0.331 0.354F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page14SOP8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 1.350 1.750 0.053 0.069A1 0.100 0.250 0.004 0.010A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010D 4.700 5.100 0.185 0.200E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270 (BSC)0.050 (BSC)L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8°F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page15MSOP8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 0.820 1.100 0.320 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.65 (BSC) 0.026 (BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°F MDCo nf i de nt i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page16TSSOP8 PACKAGE OUTLINEDIMENSIONSDimensions In MillimetersDimensions In Inches SymbolMinMax Min Max D 2.900 3.100 0.114 0.122 E4.3004.5000.1690.177b 0.190 0.300 0.007 0.012c 0.090 0.200 0.004 0.008 E1 6.250 6.550 0.246 0.258 A 1.100 0.043 A2 0.800 1.000 0.031 0.039 A1 0.020 0.150 0.001 0.006e 0.65 (BSC) 0.026 (BSC) L 0.500 0.700 0.020 0.028H 0.25 (TYP) 0.01 (TYP)θ 1°7° 1° 7°F MDCo n f i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page17SOT-23-5 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 1.050 1.250 0.041 0.049A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 6°F MDCo nf i de nt i a l© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page18TSOT-23-5 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersDimensions In InchesSymbolMin Max Min MaxA 0.700 0.900 0.028 0.035A1 0.000 0.100 0.000 0.004 A2 0.700 0.800 0.028 0.031 b 0.350 0.500 0.014 0.020 c 0.080 0.200 0.003 0.008 D 2.820 3.020 0.111 0.119 E 1.600 1.700 0.063 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.90 (BSC) 0.075 (BSC) L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8°F MDCo nf i de n t i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page19DFN8 PACKAGE OUTLINE DIMENSIONSDimensions In MillimetersSymbolMinNomMaxA 0.70 0.75 0.80A1 - 0.02 0.05 b 0.18 0.25 0.03 c 0.18 0.20 0.25 D 1.902.00 2.10D2 1.50REF e 0.50BSC Nd 1.50BSC E 2.90 3.00 3.10 E2 1.60REFL 0.30 0.40 0.50 h 0.20 0.25 0.30F MDCo nf i de n t i al© 2012 Fremont Micro Devices Inc. DS24C04_08_16-A0--page20Fremont Micro Devices (SZ) Limited* Information furnished is believed to be accurate and reliable. However, Fremont Micro Devices, Incorporated (BVI) assumes no responsibility for the consequences of use of such information or for any infringement of patents of other rights of third parties which may result from its use. No license is granted by implication orotherwise under any patent rights of Fremont Micro Devices, Incorporated (BVI). Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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