IHSM-3825中文资料

IR Receiver Modules for Remote Control SystemsTSOP382.., TSOP384.. Vishay SemiconductorsMECHANICAL DATA Pinning:1 = OUT,2 = GND,3 = V S FEATURES•Very low supply current•Photo detector and preamplifier in one package •Internal filter for PCM frequency•Improved shielding against EMI•Supply voltage: 2.5 V to 5.5 V•Improved immunity against ambient light•Insensitive to supply voltage ripple and noise •Component in accordance to RoH S 2002/95/EC and WEEE 2002/96/ECDESCRIPTIONThe TSOP382.., TSOP384.. series are miniaturized receivers for infrared remote control systems. A PIN diode and a preamplifier are assembled on a lead frame, the epoxy package acts as an IR filter.The demodulated output signal can be directly decoded by a microprocessor. The TSOP382.. is compatible with all common IR remote control data formats. The TSOP384.. is optimized to suppress almost all spurious pulses from energy saving fluorescent lamps but will also suppress some data signals.This component has not been qualified according to automotive specifications.BLOCK DIAGRAM APPLICATION CIRCUIT19026PARTS TABLECARRIER FREQUENCY STANDARD APPLICATIONS (AGC2/AGC8)VERY NOISY ENVIRONMENTS (AGC4) 30 kHz TSOP38230TSOP3843033 kHz TSOP38233TSOP3843336 kHz TSOP38236TSOP3843638 kHz TSOP38238TSOP3843840 kHz TSOP38240TSOP3844056 kHz TSOP38256TSOP38456TSOP382.., TSOP384..IR Receiver Modules for Remote Control SystemsVishay SemiconductorsNote(1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condtions for extended periods may affect the device reliability.Note (1)T amb = 25°C, unless otherwise specifiedTYPICAL CHARACTERISTICST amb = 25°C, unless otherwise specifiedFig. 1 - Output Active LowFig. 2 - Pulse Length and Sensitivity in Dark AmbientABSOLUTE MAXIMUM RATINGS (1)PARAMETER TEST CONDITIONSYMBOLVALUE UNIT Supply voltage (pin 3)V S - 0.3 to + 6.0V Supply current (pin 3)I S 3mA Output voltage (pin 1)V O - 0.3 to (V S + 0.3)V Output current (pin 1)I O 5mA Junction temperatureT j 100°C Storage temperature range T stg - 25 to + 85°C Operating temperature range T amb - 25 to + 85°C Power consumption T amb ≤ 85°C P tot 10mW Soldering temperaturet ≤ 10 s, 1 mm from case T sd260°CELECTRICAL AND OPTICAL CHARACTERISTICS (1)PARAMETER TEST CONDITION SYMBOL MIN.TYP.MAX.UNIT Supply current (pin 3)E v = 0, V S = 3.3 V I SD 0.270.350.45mA E v = 40 klx, sunlightI SH 0.45mA Supply voltage V S 2.55.5V Transmission distance E v = 0, test signal see fig. 1,IR diode TSAL6200,I F = 250 mA d 45m Output voltage low (pin 1)I OSL = 0.5 mA, E e = 0.7 mW/m 2,test signal see fig. 1V OSL 100mV Minimum irradiance Pulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig. 1E e min.0.150.35mW/m 2Maximum irradiance t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig. 1E e max.30W/m 2DirectivityAngle of half transmission distanceϕ1/2± 45degE eV O V VTSOP382.., TSOP384..Vishay SemiconductorsIR Receiver Modules for Remote Control SystemsFig. 3 - Output FunctionFig. 4 - Output Pulse DiagramFig. 5 - Frequency Dependence of ResponsivityFig. 6 - Sensitivity in Bright AmbientFig. 7 - Sensitivity vs. Supply Voltage DisturbancesFig. 8 - Sensitivity vs. Electric Field DisturbancesE eV O V V OL0.00.20.40.60.81.01.20.70.9 1.1 1.3f/f 0 - Relati v e Fre qu ency16925E /E - R e l. R e s p o n s i v i t y e m i n.eTSOP382.., TSOP384.. IR Receiver Modules forRemote Control SystemsVishay SemiconductorsFig. 9 - Max. Envelope Duty Cycle vs. Burst Length Fig. 10 - Sensitivity vs. Ambient Temperature Fig. 11 - Relative Spectral Sensitivity vs. WavelengthFig. 12 - Horizontal DirectivityFig. 13 - Vertical Directivity Fig. 14 - Sensitivity vs. Supply VoltageTSOP382.., TSOP384..Vishay SemiconductorsIR Receiver Modules for Remote Control SystemsSUITABLE DATA FORMATThe TSOP382.., TSOP384.. series are designed to suppress spurious output pulses due to noise or disturbance signals.Data and disturbance signals can be distinguished by the devices according to carrier frequency, burst length and envelope duty cycle. The data signal should be close to the band-pass center frequency (e.g. 38 kH z) and fulfill the conditions in the table below.When a data signal is applied to the TSOP382.., TSOP384..in the presence of a disturbance signal, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. Some examples of disturbance signals which are suppressed are:•DC light (e.g. from tungsten bulb or sunlight)•Continuous signals at any frequency•Strongly or weakly modulated noise from fluorescent lamps with electronic ballasts (see figure 15 or figure 16)Fig. 15 - IR Signal from Fluorescent Lampwith Low ModulationFig. 16 - IR Signal from Fluorescent Lampwith High ModulationNoteFor data formats with short bursts please see the datasheet for TSOP381.., TSOP383..0101520Time (ms)16920I R S i g n a l50101520Time (ms)16921I R S i g n a l10TSOP382..TSOP384..Minimum burst length10 cycles/burst 10 cycles/burst After each burst of lengtha minimum gap time is required of10 to 70 cycles ≥ 10 cycles 10 to 35 cycles ≥ 10 cycles For bursts greater thana minimum gap time in the data stream is needed of 70 cycles > 4 x burst length35 cycles> 10 x burst lengthMaximum number of continuous short bursts/second 18001500Compatible to NEC code yes yes Compatible to RC5/RC6 code yes yes Compatible to Sony codeyes no Compatible to Thomson 56 kHz codeyes yes Compatible to Mitsubishi code (38 kHz, preburst 8 ms, 16 bit)yes no Compatible to Sharp codeyesyesSuppression of interference from fluorescent lampsMost common disturbance signals are suppressedEven extreme disturbance signals are suppressedTSOP382.., TSOP384..IR Receiver Modules forVishay SemiconductorsRemote Control SystemsPACKAGE DIMENSIONS in millimetersTSOP382.., TSOP384..Vishay Semiconductors IR Receiver Modules forRemote Control SystemsOZONE DEPLETING SUBSTANCES POLICY STATEMENTIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operating systems withrespect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively.2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency(EPA) in the USA.3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

Document Number: 34018For technical questions, contact: magnetics@Revision: 04-Feb-111High Current, Surface Mount InductorsIHSM-3825Vishay DaleFEATURES•Flame retardant encapsulant (UL 94 V-0)•Completely encapsulated winding provides superior environmental protection and moisture resistance•High current unit in surface mount package printed with model, inductance value and date code•Compatible with infrared or conventional reflow soldering methods•Pick and place compatible•Compliant to RoHS Directive 2002/95/ECAPPLICATIONSExcellent power line noise filters, filters for switchingregulated power supplies, DC/DC converters, SCR and triac controls and RFI suppression.ELECTRICAL SPECIFICATIONSInductance: Measured at 1 V with no DC current Inductance Tolerance: ± 15 %Inc remental Current: The typical current at which the inductance will be decreased by 5 % from its initial zero DC valueOperating Temperature: - 55 °C to + 125 °C (no load);- 55 °C to + 85 °C (at full rated current)MECHANICAL SPECIFICATIONSCore: High resistivity ferrite core Encapsulant: EpoxyTerminals: 100 % Sn over NiSTANDARD ELECTRICAL SPECIFICATIONSIND.AT 1 kHz (μH)DCR MAX.( )RATED CURRENT MAX.(A)INCREMENTAL CURRENT APPROX.(A)1.00.015 5.11 4.411.20.016 4.93 4.111.50.017 4.63 3.661.80.022 4.27 3.222.20.031 3.61 2.622.70.038 3.18 2.403.30.045 2.94 2.133.90.062 2.57 2.054.70.083 2.17 1.935.60.091 2.08 1.796.80.101 1.94 1.628.20.118 1.83 1.5010.00.126 1.74 1.3612.00.170 1.50 1.2615.00.228 1.29 1.1118.00.306 1.13 1.0522.00.336 1.050.9627.00.3890.980.8633.00.4400.920.7539.00.4900.860.7247.00.6460.740.6856.00.8450.650.6468.0 1.0400.610.5882.0 1.2400.560.51100.0 1.4400.480.42120.0 2.1800.450.40150.0 2.9000.380.37180.0 3.2800.360.33220.0 3.6500.340.28270.0 4.4000.290.26330.0 5.0700.270.23390.0 5.9000.230.20470.07.6700.220.19560.08.8500.210.17680.010.200.180.15820.011.580.170.141000.012.970.160.13PART MARKING- Model- Inductance value - Date codeDESCRIPTIONIHSM-3825 3.9 μH± 15 %ERe3MODELINDUCTANCE VALUEINDUCTANCE TOLERANCEPACKAGE CODEJEDEC LEAD (Pb)-FREE STANDARDGLOBAL PART NUMBERIHSM3825ER3R 9L PRODUCT FAMILYSIZEPACKAGE CODEINDUCTANCEVALUETOL.Legal Disclaimer Notice VishayDisclaimerALL PRODU CT, PRODU CT SPECIFICATIONS AND DATA ARE SU BJECT TO CHANGE WITHOU T NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyVishay Intertechnology, Inc. hereb y certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.Revision: 12-Mar-121Document Number: 91000分销商库存信息:VISHAYIHSM3825EB221L IHSM3825PJ181L IHSM3825PJ221L IHSM3825RE151L IHSM3825RE181L IHSM3825RE221L IHSM3825EB1R0L IHSM3825EB1R2L IHSM3825EB1R5L IHSM3825EB2R7L IHSM3825EB3R3L IHSM3825EB4R7L IHSM3825EB5R6L IHSM3825EB8R2L IHSM3825PJ1R0L IHSM3825PJ1R2L IHSM3825PJ1R5L IHSM3825PJ1R8L IHSM3825PJ2R2L IHSM3825PJ2R7L IHSM3825PJ3R3L IHSM3825PJ3R9L IHSM3825PJ4R7L IHSM3825PJ5R6L IHSM3825PJ6R8L IHSM3825PJ8R2L IHSM3825RE1R0L IHSM3825RE1R2L IHSM3825RE1R5L IHSM3825RE2R2L IHSM3825RE3R3L IHSM3825RE3R9L IHSM3825RE4R7L IHSM3825RE5R6L IHSM3825RE6R8L IHSM3825RE8R2L IHSM3825EB101L IHSM3825EB470L IHSM3825PJ101L IHSM3825PJ121L IHSM3825PJ470L IHSM3825PJ560L IHSM3825PJ680L IHSM3825PJ820L IHSM3825RE101L IHSM3825RE470L IHSM3825RE680L IHSM3825RE820L IHSM3825PJ1R5K IHSM3825PJ3R3K IHSM3825PJ3R9K IHSM3825PJ4R7K IHSM3825PJ5R6K IHSM3825PJ6R8K IHSM3825PJ8R2K IHSM3825RE3R3K IHSM3825EB100L IHSM3825EB120L IHSM3825EB150L IHSM3825EB180L IHSM3825EB220L IHSM3825EB330L IHSM3825PJ100L IHSM3825PJ120L IHSM3825PJ150L IHSM3825PJ180L IHSM3825PJ220L IHSM3825PJ270L IHSM3825PJ330L IHSM3825PJ390L IHSM3825RE100L IHSM3825RE120L IHSM3825RE150L IHSM3825RE180L IHSM3825RE220L IHSM3825RE270L IHSM3825RE330L IHSM3825PJ100K IHSM3825PJ180K IHSM3825EB102L IHSM3825PJ102L IHSM3825PJ681L IHSM3825RE102L IHSM3825EB391L IHSM3825EB471L IHSM3825EB561L IHSM3825PJ271L IHSM3825PJ331L IHSM3825PJ471L IHSM3825PJ561L IHSM3825RE331L IHSM3825RE471L IHSM3825PJ102K IHSM3825RE102K。

第一部分RS232/485/422通信模块说明黑金AN3845模块专门为工业现场应用设计的RS232/485/422通信模块。

它包含一路RS232接口，2路RS485和2路RS422通信接口。

配合开发板实现RS232、485和422的数据远程传输和通信。

RS232、485和422接口分别采用MAX3232、MAX3485和MAX3490芯片作为电平转换芯片。

模块留有一个40针的排母用于连接开发板，RS232接口为一个标准的DB9串口公座，通过串口线直接连接电脑或者其他设备；RS485和RS422接口采用接线端子跟外部连接，超远距离传输可达上千米，另外RS485和RS422接口部分带有正负15KV的ESD 防护功能。

AN3845模块实物照片如下：AN3845通信模块正面图1.1 AN3485模块的参数说明以下为AN3485通信模块的详细参数:RS232接口●一路标准的DB9公座串行接口；●使用MAX3232作为RS232和TTL电平的转换；●传输率高达120Kbps数据通讯速率RS485接口●两路RS485接口，采用3线的接线端子；●使用MAX3485作为RS485和TTL的电平转换;●工业级设计，抗干扰能力超强，同时采用有效的防雷设计;●具有120欧匹配电阻，插上跳线帽即可使能匹配电阻，长距离传输时建议短接。

●支持多机通讯，允许接在最多128个设备的总线上●传输率高达500Kbps数据通讯速率。

RS422接口●两路RS422接口，采用5线的接线端子；●使用MAX3490作为RS422和TTL的电平转换;●工业级设计，抗干扰能力超强，同时采用有效的防雷设计;●具有120欧匹配电阻，插上跳线帽即可使能匹配电阻，长距离传输时建议短接。

●支持多机通讯，允许接在最多128个设备的总线上●传输率高达500Kbps数据通讯速率。

1.2 AN3485模块尺寸AN3485通信模块尺寸图第二部分模块功能说明2.1 RS232电路设计AN3485模块的RS232接口采用MAX3232芯片实现RS232和+3.3V TTL 电平的转换。

ICE5xSAG采用 DSO-8 封装的固定频率 PWM 控制器产品亮点• 可选进入和退出待机功率电平的增强型主动突发模式，其最低待机功率小于 100 mW• 数字降频模式，提高整体系统效率 • 借助共源共栅配置实现快速启动 • 支持频率抖动和软栅极驱动，实现低 EMI • 集成误差放大器• 具备交流输入过压保护，提供全面防护 • 无铅电镀、无卤模塑化合物，符合 RoHS 标准特性• 可选进入和退出待机功率电平的增强型主动突发模式• 数字频率降低，提高整体系统效率 • 借助共源共栅配置实现快速启动• 支持 DCM （非连续导通模式）和 CCM （连续导通模式）运行，具备斜坡补偿• 支持频率抖动和软栅极驱动，实现低 EMI • 内置数字软启动• 集成误差放大器，在非隔离反激式架构中支持直接（原边）反馈• 具备交流输入过压保护、V CC 过压、V CC 欠压、过载/开路及过温保护机制，提供全面防护• 所有保护功能均处于自动重启模式 • 受限的V CC 短接至地的充电电流应用• 适用于家用电器/白色家电、电视、电脑及服务器的辅助电源• 蓝光播放器、机顶盒和 LCD/LED 显示器产品验证完全符合 JEDEC 工业应用标准要求描述ICE5xSAG 是第五代固定频率 PWM 控制器，支持共源共栅配置，并针对离线开关模式电源进行了优化。

其共源共栅配置亦可实现快速启动。

器件通过降低频率并软化栅极驱动和频率抖动，进而在低负载和 50% 负载之间实现低 EMI 效果，并提高了效率。

产品支持主动突发模式，可选进入和退出待机功率，输出电压纹波小且可控，因此可在待机模式下具备较高的灵活性和极低功耗。

此外， ICE5xSAG 有宽的供电电压工作范围 (10.0～25.5 V)，功耗较低。

产品具备诸多保护功能，提供可调交流输入过压保护，可在故障情况下为电源系统提供全面防护。

凭借上述特性，第五代 ICE5xSAG 系列得以成为市面上用于固定频率反激式转换器的理想 PWM 控制器。

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TPS3820-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVRG4ACTIVESOT-23DBV53000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEARPACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1元器件交易网Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3824-25DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTPS3828-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3828-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

欢迎您使用本公司产品我们强烈建议您遵循下述说明：您开箱验机时，请依据订货合同和装箱清单逐一清点并核实铭牌上的品名、性能参数是否有误，检查可能因运输原因导致的缺损。

在您调试本产品前，请详细阅读使用说明书，您将在安装、运行、维修等方面得到帮助，以便您更顺利地使用本产品。

安全注意事项警告：为了避免在测试过程中发生电击事故，请按照贵公司的安全规程进行操作，并遵循以下几点原则：戴防护眼镜或面罩戴橡胶防护手套穿防护围裙或工作服只做您受过培训的维护工作避免让自己处于回路中避免接触框架及靠近金属物品，这些可能在你接触设备时接地目录第一章功能特点 (3)第二章技术参数 (4)第三章系统构成 (5)3.1设备外观 (5)3.2面板介绍 (5)3.3接线 (6)第四章软件介绍 (7)1.安装 (7)2.运行 (7)3.工具栏介绍 (7)3.1新建 (8)3.2 打开 (8)3.3 负载控制 (8)3.4数据查看 (12)3.5 关闭系统 (12)第五章保固承诺 (14)第六章标准配置 (15)第一章功能特点1)设备采用8U标准模块化设计，可安装于标准机柜，也可安装于便携箱,可实验室使用和现场测试使用。

2)负载采用新型功耗组件，功率密度高，无红热现象，电热元件均符合UL安全规格；3)负载元件标称电压230V/50Hz，单相电压接入范围AC0~255V，三相满足0~440V接入要求；4)单相整机最大功率7kW，最小步进0.01kW，三相负载满足最大带载功率22kW；5)可满足16A,32A 交流充电桩测试的要求，6)可作为单相/三相充电桩带载试验设备；7)设备具备恒流、恒阻、恒功率加载模式；8)电流调节步幅最小0.1A；9)可多台并联放电，两个模块满足63A充电桩的测试；10)可实现交流充电桩过载、过流，实现带载分合电路试验等试验项目；11)负载带有LCD全中文显示屏，可显示加载过程中的各项参数及实时测试数据。

12)主机可自动检测系统的相电压、相电流、功率因数、频率、带载时间等参数。

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TPS3820-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVRG4ACTIVESOT-23DBV53000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEARPACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1元器件交易网Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3824-25DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTPS3828-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3828-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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DESCRIPTIONThe 3823 group is the 8-bit microcomputer based on the 740 fam-ily core technology.The 3823 group has the LCD drive control circuit, an 8-channel A/ D converter, a serial interface, a watchdog timer, a ROM correc-tion function, and as additional functions.The various microcomputers in the 3823 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.FEATURES●Basic machine-language instructions (71)●The minimum instruction execution time...........................0.4 µs (at f(X IN) = 10 MHz, High-speed mode)●Memory size ROM...............................................................16 K to 60 K bytes RAM.................................................................640 to 2560 bytes ●ROM correction function..............................32 bytes ✕ 2 blocks ●Watchdog timer..............................................................8-bit ✕ 1●Programmable input/output ports.. (49)●Input ports (5)●Software pull-up/pull-down resistors (Ports P0-P7 except port P40)●Interrupts.................................................17 sources, 16 vectors(includes key input interrupt)●Key Input Interrupt (Key-on Wake-Up) (8)●Timers...........................................................8-bit ✕ 3, 16-bit ✕ 2●Serial interface............8-bit ✕ 1 (UART or Clock-synchronized)●A/D converter............10-bit ✕ 8 channels or 8-bit ✕ 8 channels ●LCD drive control circuit Bias...................................................................................1/2, 1/3 Duty...........................................................................1/2, 1/3, 1/4 Common output.. (4)Segment output (32)●Main clock generating circuits..............Built-in feedback resistor(connect to external ceramic resonator or quartz-crystal oscillator)●Sub-clock generating circuits(connect to external quartz-crystal oscillator or on-chip oscillator)●Power source voltageIn frequency/2 mode (f(X IN) ≤ 10 MHz)...................4.5 to 5.5 V In frequency/2 mode (f(X IN) ≤ 8 MHz).....................4.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/4 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In frequency/8 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/8 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/8 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In low-speed mode....................................................1.8 to 5.5 V ●Power dissipationIn frequency/2 mode...............................................18 mW (std.) (at f(X IN) = 8 MHz, Vcc = 5 V, Ta = 25 °C)In low-speed mode at X CIN................................................18 µW (std.) (at f(X IN) stopped, f(X CIN) = 32 kHz, Vcc = 2.5 V, Ta = 25 °C)In low-speed mode at on-chip oscillator..................35 µW (std.) (at f(X IN) stopped, f(X CIN) = stopped, Vcc = 2.5 V, Ta = 25 °C)●Operating temperature range..................................– 20 to 85 °C APPLICATIONSCamera, audio equipment, household appliances, consumer elec-tronics, etc.3823 GroupSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER REJ03B0146-0202Rev.2.02Jun.19.2007Table 1 Performance overviewParameter710.4 µs (Minimum instruction, f(X IN ) 10 MHz, High-speed mode)10 MHz (Maximum)16 K to 60 K bytes 640 to 2560 bytes 4-bit ✕ 1, 1-bit ✕ 1(4 pins sharing SEG)8-bit ✕ 5, 7-bit ✕ 1, 2 bit ✕ 1(16 pins sharing SEG)17 sources, 16 vectors (includes key input interrupt)8-bit ✕ 3, 16-bit ✕ 28-bit ✕ 1 (UART or Clock-synchronized)10-bit ✕ 8 channels or 8 bit ✕ 8 channels 8-bit ✕ 132 bytes ✕ 2 blocks 1/2, 1/32, 3, 4432Built-in feedback resistor(connect to external ceramic rasonator or quartz-crystal oscillator)Built-in feedback resistor(connect to external quartz-crystal oscillator or on-chip oscillator)4.5 to 5.5V 4.0 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 1.8 to 5.5VStd. 18 mW (Vcc = 5V, f(X IN ) = 8MHz, Ta = 25 °C)Std. 18 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = 32kHz, Ta = 25 °C)Std. 35 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = stopped, Ta = 25 °C)V CC 10mA -20 to 85 °C CMOS sillicon gate80-pin plastic molded LQFP/QFPNumber of basic instructions Instruction execution time Oscillation frequency Memory sizes ROM RAM Input port P34-P37, P40I/O port P0-P2, P41-P47, P5, P6, P70, P71Interrupt TimerSerial interface A/D converter Watchdog timer ROM correction function LCD drive control Bias circuitDutyCommon output Segment outputMain clock generating circuits Sub-clock generating circuits Power source voltageIn frequency/2 mode (f(X IN ) ≤ 10MHz)In frequency/2 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 10MHz)In frequency/4 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 5MHz)In frequency/8 mode (f(X IN ) ≤ 10MHz)In frequency/8 mode (f(X IN ) ≤ 8MHz)In frequency/8 mode (f(X IN ) ≤ 5MHz)In low-speed modePower dissipationIn frequency/2 mode In low-speed mode at X CINIn low-speed mode at on-chip oscillatorInput/Output Input/Output withstand voltage characteristicsOutput current Operating temperature range Device structure PackageFunctionPIN DESCRIPTIONTable 2 Pin description (1)V CC , V SS FunctionPin Name Function except a port function•LCD segment output pinsPower source •Apply voltage of power source to V CC , and 0 V to V SS . (For the limits of V CC , refer to “Recom-mended operating conditions”).V REF AV SS RESET X IN X OUTV L1–V L3COM 0–COM 3SEG 0–SEG 11P00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0 –P27/KW 7P34/SEG 12 –P37/SEG 15Analog refer-ence voltage Analog power source Reset input Clock input Clock outputLCD power sourceCommon outputSegment output I/O port P0I/O port P1I/O port P2•Reference voltage input pin for A/D converter.•GND input pin for A/D converter.•Connect to V SS .•Reset input pin for active “L”.•Input and output pins for the main clock generating circuit.•Feedback resistor is built in between X IN pin and X OUT pin.•Connect a ceramic resonator or a quartz-crystal oscillator between the X IN and X OUT pins to set the oscillation frequency.•If an external clock is used, connect the clock source to the X IN pin and leave the X OUT pin open.•This clock is used as the oscillating source of system clock.•Input 0 ≤ V L1 ≤ V L2 ≤ V L3 voltage.•Input 0 – V L3 voltage to LCD.•LCD common output pins.•COM 2 and COM 3 are not used at 1/2 duty ratio.•COM 3 is not used at 1/3 duty ratio.•LCD segment output pins.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each port to be individually programmed as either input or output.•Pull-down control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•4-bit input port.•CMOS compatible input level.•Pull-down control is enabled.•Key input (key-on wake-up) interrupt input pins•LCD segment output pinsInput port P3Table 3 Pin description (2)FunctionPin Function except a port function P40P42/INT 0,P43/INT 1P44/R X D,P45/T X D,P46/S CLK ,P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0,P55/CNTR 1P56/T OUT P57/ADT P60/AN 0–P67/AN 7P70/X COUT,P71/X CIN•1-bit Input port.•CMOS compatible input level.•7-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•2-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•φ clock output pin •Interrupt input pins•Interrupt input pins •Real time port function pins •Timer X, Y function pins •Timer 2 output pins •A/D conversion input pins •Sub-clock generating circuit I/O pins.(Connect a resonator. External clock cannot be used.)P41/φ•Serial interface function pins•A/D trigger input pinsName I/O port P4I/O port P5I/O port P6I/O port P7Input port P4•QzROM program power pinPART NUMBERINGFig. 4 Part numbering Package codeFP :PRQP0080GB-A packageHP :PLQP0080KB-A packageROM numberOmitted in the shipped in blank version.ROM/PROM size1 :4096 bytes2 :8192 bytes3 :12288 bytes4 :16384 bytes5 :20480 bytes6 :24576 bytes7 :28672 bytes8 :32768 bytesThe first 128 bites and the last 2 bytes of ROM are reserved areas ; they cannot be used.Memory typeG :QzROM versionRAM size0 :192 bytes1 :256 bytes2 :384 bytes3 :512 bytes4 :640 bytes5 :768 bytes6 :896 bytes7 :1024 bytes8 :1536 bytes9 :2048 bytesA :2560 bytesProduct M38234G6-XXX FP9 :36864 bytesA :40960 bytesB :45056 bytesC :49152 bytesD :53248 bytesE :57344 bytesF :61440 bytesCurrently products are listed below.RemarksPackage Part No.RAM size (bytes)61440(61310)49152(49022)32768(32638)24576(24446)16384(16254)ROM size (bytes) ROM size for User in ( )Table 4 List of productsM3823AGF-XXXFP M3823AGF-XXXHP M3823AGFFP M3823AGFHPM38239GC-XXXFP M38239GC-XXXHP M38239GCFP M38239GCHPM38238G8-XXXFP M38238G8-XXXHP M38238G8FP M38238G8HPM38235G6-XXXFP M38235G6-XXXHP M38235G6FP M38235G6HPM38234G4-XXXFP M38234G4-XXXHP M38234G4FP M38234G4HP2560(Note 1)2048(Note 2)1536(Note 2)768(Note 2)640(Note 2)PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-ABlank BlankBlank BlankBlank BlankBlank BlankBlank BlankNote 1: RAM size includes RAM for LCD display and ROM corrections.Note 2: RAM size includes RAM for LCD display.FUNCTIONAL DESCRIPTIONCENTRAL PROCESSING UNIT (CPU)The 3823 group uses the standard 740 family instruction set. Re-fer to the table of 740 family addressing modes and machine instructions or the 740 Family Software Manual for details on the instruction set.Machine-resident 740 family instructions are as follows:The FST and SLW instruction cannot be used.The STP , WIT, MUL, and DIV instruction can be used.The central processing unit (CPU) has six registers. Figure 6shows the 740 Family CPU register structure.[Accumulator (A)]The accumulator is an 8-bit register. Data operations such as data transfer, etc., are executed mainly through the accumulator.[Index Register X (X)]The index register X is an 8-bit register. In the index addressing modes, the value of the OPERAND is added to the contents of register X and specifies the real address.[Index Register Y (Y)]The index register Y is an 8-bit register. In partial instruction, the value of the OPERAND is added to the contents of register Y and specifies the real address.[Stack Pointer (S)]The stack pointer is an 8-bit register used during subroutine calls and interrupts. This register indicates start address of stored area (stack) for storing registers during subroutine calls and interrupts.The low-order 8 bits of the stack address are determined by the contents of the stack pointer. The high-order 8 bits of the stack ad-dress are determined by the stack page selection bit. If the stack page selection bit is “0” , the high-order 8 bits becomes “0016”. If the stack page selection bit is “1”, the high-order 8 bits becomes “0116”.The operations of pushing register contents onto the stack and popping them from the stack are shown in Figure 7.Store registers other than those described in Table 4 with program when the user needs them during interrupts or subroutine calls.[Program Counter (PC)]The program counter is a 16-bit counter consisting of two 8-bit registers PC H and PC L . It is used to indicate the address of the next instruction to be executed.Fig. 6 740 Family CPU register structureAAccumulator b7b7b7b7b0b7b15b0b7b0b0b0b0XIndex register X YIndex register Y SStack pointer PC LProgram counter PC HN V T B D I Z CProcessor status register (PS)Carry flag Zero flagInterrupt disable flag Decimal mode flag Break flagIndex X mode flag Overflow flag Negative flag[Processor status register (PS)]The processor status register is an 8-bit register consisting of 5 flags which indicate the status of the processor after an arithmetic operation and 3 flags which decide MCU operation. Branch opera-tions can be performed by testing the Carry (C) flag , Zero (Z) flag, Overflow (V) flag, or the Negative (N) flag. In decimal mode, the Z, V, N flags are not valid.•Bit 0: Carry flag (C)The C flag contains a carry or borrow generated by the arithmetic logic unit (ALU) immediately after an arithmetic operation. It can also be changed by a shift or rotate instruction.•Bit 1: Zero flag (Z)The Z flag is set if the result of an immediate arithmetic operation or a data transfer is “0”, and cleared if the result is anything other than “0”.•Bit 2: Interrupt disable flag (I)The I flag disables all interrupts except for the interrupt generated by the BRK instruction.Interrupts are disabled when the I flag is “1”.•Bit 3: Decimal mode flag (D)The D flag determines whether additions and subtractions are executed in binary or decimal. Binary arithmetic is executed when this flag is “0”; decimal arithmetic is executed when it is “1”.Decimal correction is automatic in decimal mode. Only the ADC and SBC instructions can be used for decimal arithmetic.•Bit 4: Break flag (B)The B flag is used to indicate that the current interrupt was generated by the BRK instruction. The BRK flag in the processor status register is always “0”. When the BRK instruction is used to generate an interrupt, the processor status register is pushed onto the stack with the break flag set to “1”.•Bit 5: Index X mode flag (T)When the T flag is “0”, arithmetic operations are performed between accumulator and memory. When the T flag is “1”, direct arithmetic operations and direct data transfers are enabled between memory locations.•Bit 6: Overflow flag (V)The V flag is used during the addition or subtraction of one byte of signed data. It is set if the result exceeds +127 to -128. When the BIT instruction is executed, bit 6 of the memory location operated on by the BIT instruction is stored in the overflow flag.•Bit 7: Negative flag (N)The N flag is set if the result of an arithmetic operation or data transfer is negative. When the BIT instruction is executed, bit 7 of the memory location operated on by the BIT instruction is stored in the negative flag.Table 6 Set and clear instructions of each bit of processor status registerSet instruction Clear instruction C flagSECCLCZ flag––I flagSEICLID flagSEDCLDB flag––T flagSETCLTV flag–CLVN flag––Real time port function output A/D conversion inputA/D trigger inputDiagram No.Related SFRs Input/Output Name Pin Non-Port Function I/O Format Table 7 List of I/O port functionP00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0–P27/KW 7P34/SEG 12–P37/SEG 15P40P41/φP42/INT 0,P43/INT 1P44/R X D P45/T X D P46/S CLK P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0Port P0Port P1Port P2Port P3Port P4Input/output,individual portsInput/output,individual bits InputInputInput/output,individual bitsCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input level CMOS compatible input levelCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input levelCMOS 3-state output LCD segment outputKey input (key-on wake-up) interrupt inputLCD segment outputφ clock outputX CIN frequency signal outputExternal interrupt inputSerial I/O function input/outputExternal interrupt input Timer X function I/O Timer Y function input Timer 2 function output PULL register A Segment output enable registerPULL register AInterrupt control register 2PULL register ASegment output enable registerPULL register Bφ output control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BSerial I/O control register Serial I/O status register UART control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BTimer X mode register PULL register BTimer X mode register PULL register BTimer Y mode register PULL register BTimer 123 mode register PULL register B A/D control registerPULL register A CPU mode register (1)(2)(3)(4)(6)(5)(2)(8)(7)Port P5(9)(2)Input/output,individual bits(10)P55/CNTR 1(11)(12)(13)(12)(14)P56/T OUT P57/ADT P60/AN 0–P67/AN 7(15)P70/X COUT P71/X CIN COM 0–COM 3SEG 0–SEG 11(16)(17)(18)Input/output,individual bits Input/output,individual bits Output OutputSub-clockgenerating circuit I/O LCD common output LCD segment outputPort P6Port P7Common SegmentLCD mode registerNotes 1: For details of how to use double function ports as function I/O ports, refer to the applicable sections.2: When an input level is at an intermediate potential, a current will flow from V CC to V SS through the input-stage gate.Especially, power source current may increase during execution of the STP and WIT instructions.Fix the unused input pins to “H” or “L” through a resistor.QzROM program power pinTermination of unused pins• Termination of common pinsI/O ports:Select an input port or an output port and follow each processing method.Output ports: Open.Input ports:If the input level become unstable, through current flow to an input circuit, and the power supply currentmay increase.Especially, when expecting low consumption current(at STP or WIT instruction execution etc.), pull-up orpull-down input ports to prevent through current(built-in resistor can be used). Pull-down the P40/(V PP) pin.We recommend processing unused pins through aresistor which can secure I OH(avg) or I OL(avg).Because, when an I/O port or a pin which have anoutput function is selected as an input port, it mayoperate as an output port by incorrect operation etc.Table 8 Termination of unused pinsPinP00/SEG16–P17/SEG23 P10/SEG24–P17/SEG31 P20/KW0–P27/KW7P34/SEG12–P37/SEG15 P40/(V PP)P41/φP42/INT0P43/INT1P44/RxDP45/TxDP46/S CLKP47/S RDY/S OUTP50/INT2P51/INT3P52/RTP0P53/RTP1P54/CNTR0P55/CNTR1P56/T OUTP57/ADTP60/AN0–P67/AN7P70/X COUTP71/X CINV L3 (Note)V L2 (Note)V L1 (Note)COM0–COM3SEG0–SEG11AV SSV REFX OUTTermination 2When selecting SEG output, open.When selecting KW function, performtermination of input port.When selecting SEG output, open.–When selecting φ output, open.When selecting INT0 function,perform termination of input port.When selecting INT1 function,perform termination of input port.When selecting R X D function,perform termination of input port.When selecting T X D function,perform termination of output port.When selecting external clock input,perform termination of input port.When selecting S RDY function,perform termination of output port.When selecting INT2 function,perform termination of input port.When selecting INT3 function,perform termination of input port.When selecting RTP0 function,perform termination of output port.When selecting RTP1 function,perform termination of output port.When selecting CNTR0 input function,perform termination of input port.When selecting CNTR1 function,perform termination of input port.When selecting T OUT function,perform termination of output port.When selecting ADT function,perform termination of input port.When selecting AN function, thesepins can be opened. (A/D conversionresult cannot be guaranteed.)Do not select X CIN-X COUT oscillationfunction by program.––––––––Termination 3–––––––––When selecting internal clock output,perform termination of output port.When selecting S OUT function,perform termination of output port.––––When selecting CNTR0 output function,perform termination of output port.–––––––––––––Termination 1 (recommend)I/O portInput portInput port (pull-down)I/O portConnect to V SSConnect to V SSConnect to V SSOpenOpenConnect to V SSConnect to V CC or V SSWhen an external clock isinput to the X IN pin, leavethe X OUT pin open.Note :The termination of V L3, V L2 and V L1 is applied when the bit 3 of the LCD mode register is “0”INTERRUPTSThe 3823 group interrupts are vector interrupts with a fixed prior-ity scheme, and generated by 16 sources among 17 sources: 8external, 8 internal, and 1 software.The interrupt sources, vector addresses (1) , and interrupt priority are shown in Table 9.Each interrupt except the BRK instruction interrupt has the inter-rupt request bit and the interrupt enable bit. These bits and the interrupt disable flag (I flag) control the acceptance of interrupt re-quests. Figure 16 shows an interrupt control diagram.Notes1: Vector addresses contain interrupt jump destination addresses.2: Reset function in the same way as an interrupt with the highest priority.Table 9 Interrupt vector addresses and priorityRemarksInterrupt Request Generating Conditions At resetAt detection of either rising or falling edge of INT 0 input At detection of either rising or falling edge of INT 1 input At completion of serial interface data receptionAt completion of serial interface transmit shift or when transmis-sion buffer is empty Interrupt Source LowHigh PriorityVector Addresses (Note 1)Reset (Note 2)INT 0INT 1Serial I/O reception Serial I/O transmission Timer X Timer Y Timer 2Timer 3CNTR 0CNTR 1Timer 1INT 2INT 3Key input(Key-on wake-up)ADTA/D conversion BRK instruction1234567891011121314151617FFFD 16FFFB 16FFF916FFF716FFF516FFF316FFF116FFEF 16FFED 16FFEB 16FFE916FFE716FFE516FFE316FFE116FFDF 16FFDD 16FFFC 16FFFA 16FFF816FFF616FFF416FFF216FFF016FFEE 16FFEC 16FFEA 16FFE816FFE616FFE416FFE216FFE016FFDE 16FFDC 16At timer X underflow At timer Y underflow At timer 2 underflowAt timer 3 underflowAt detection of either rising or falling edge of CNTR 0 input At detection of either rising or falling edge of CNTR 1 input At timer 1 underflowAt detection of either rising or falling edge of INT 2 input At detection of either rising or falling edge of INT 3 input At falling of conjunction of input level for port P2 (at input mode)At falling of ADT inputAt completion of A/D conversion At BRK instruction executionNon-maskableExternal interrupt(active edge selectable)External interrupt(active edge selectable)Valid when serial interface is se-lectedValid when serial interface is se-lectedExternal interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt (Valid at falling)Valid when ADT interrupt is se-lected, External interrupt (Valid at falling)Valid when A/D interrupt is se-lectedNon-maskable software interruptAn interrupt requests is accepted when all of the following conditions are satisfied:• Interrupt disable flag.................................“0”• Interrupt disable request bit .....................“1”• Interrupt enable bit.. (1)Though the interrupt priority is determined by hardware, priority processing can be performed by software using the above bits and flag.[Transmit Buffer/Receive Buffer Register (TB/RB)] 001816The transmit buffer register and the receive buffer register are lo-cated at the same address. The transmit buffer register is write-only and the receive buffer register is read-only. If a charac-ter bit length is 7 bits, the MSB of data stored in the receive buffer register is “0”.[Serial I/O Status Register (SIOSTS)] 001916 The read-only serial I/O status register consists of seven flags (bits 0 to 6) which indicate the operating status of the serial I/O function and various errors.Three of the flags (bits 4 to 6) are valid only in UART mode.The receive buffer full flag (bit 1) is cleared to “0” when the receive buffer is read.If there is an error, it is detected at the same time that data is transferred from the receive shift register to the receive buffer reg-ister, and the receive buffer full flag is set. A write to the serial I/O status register clears all the error flags OE, PE, FE, and SE. Writ-ing “0” to the serial I/O enable bit (SIOE) also clears all the status flags, including the error flags.All bits of the serial I/O status register are initialized to “0” at reset, but if the transmit enable bit (bit 4) of the serial I/O control register has been set to “1”, the transmit shift register shift completion flag (bit 2) and the transmit buffer empty flag (bit 0) become “1”. [Serial I/O Control Register (SIOCON)] 001A16 The serial I/O control register contains eight control bits for the se-rial I/O function.[UART Control Register (UARTCON) ]001B16 The UART control register consists of four control bits (bits 0 to 3) which are valid when asynchronous serial I/O is selected and set the data format of an data transfer. One bit in this register (bit 4) is always valid and sets the output structure of the P45/T X D pin. [Baud Rate Generator (BRG)] 001C16The baud rate generator determines the baud rate for serial trans-fer.The baud rate generator divides the frequency of the count source by 1/(n + 1), where n is the value written to the baud rate genera-tor.■Notes on serial I/OWhen setting the transmit enable bit to “1”, the serial I/O transmit interrupt request bit is automatically set to “1”. When not requiring the interrupt occurrence synchronized with the transmission enalbed, take the following sequence.➀Set the serial I/O transmit interrupt enable bit to “0” (disabled).➁Set the transmit enable bit to “1”.➂Set the serial I/O transmit interrupt request bit to “0” after 1 or more instructions have been executed.➃Set the serial I/O transmit interrupt enable bit to “1” (enabled).。

UC1825UC2825UC3825•Compatible with Voltage or Current Mode Topologies•Practical Operation Switching Frequenciesto 1MHz•50ns Propagation Delay to Output •High Current Dual Totem Pole Outputs (1.5A Peak)•Wide Bandwidth Error Amplifier•Fully Latched Logic with Double Pulse Suppression •Pulse-by-Pulse Current Limiting•Soft Start / Max. Duty Cycle Control•Under-Voltage Lockout with Hysteresis•Low Start Up Current (1.1mA)The UC1825family of PWM control ICs is optimized for high fre-quency switched mode power supply applications.Particular care was given to minimizing propagation delays through the comparatorsand logic circuitry while maximizing bandwidth and slew rate of the error amplifier.This controller is designed for use in either cur-rent-mode or voltage mode systems with the capability for input volt-age feed-forward.Protection circuitry includes a current limit comparator with a 1Vthreshold,a TTL compatible shutdown port,and a soft start pinwhich will double as a maximum duty cycle clamp.The logic is fullylatched to provide jitter free operation and prohibit multiple pulses at an output.An under-voltage lockout section with 800mV of hysteresisassures low start up current.During under-voltage lockout,the out-puts are high impedance.These devices feature totem pole outputs designed to source and sink high peak currents from capacitive loads,such as the gate of a power MOSFET.The on state is designed as a high level.High Speed PWM ControllerFEATURESDESCRIPTIONUC1825 UC2825 UC3825ABSOLUTE MAXIMUM RATINGS(Note 1)Supply Voltage (Pins 13, 15). . . . . . . . . . . . . . . . . . . . . . . .30VOutput Current, Source or Sink (Pins 11, 14)DC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5APulse (0.5s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0AAnalog Inputs(Pins 1, 2, 7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 7V(Pin 8, 9). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 6VClock Output Current (Pin 4). . . . . . . . . . . . . . . . . . . . . . .-5mAError Amplifier Output Current (Pin 3). . . . . . . . . . . . . . . .5mASoft Start Sink Current (Pin 8). . . . . . . . . . . . . . . . . . . . .20mAOscillator Charging Current (Pin 5). . . . . . . . . . . . . . . . . .-5mAPower Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1WStorage Temperature Range. . . . . . . . . . . . . .-65°C to +150°CLead Temperature (Soldering, 10 seconds). . . . . . . . . .300°CPackage Q JA Q JCDIL-16J80-12028(2)DIL-16N90(1)45PLCC-2043-75(1)34LCC-2070-8020(2)SOIC-1650-120(1)35 THERMAL RATINGS TABLEQQELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for , R T= 3.65k, C T= 1nF,V CC = 15V, -55°C<T A<125°C for the UC1825, –40°C<T A<85°C for the UC2825, and 0°C<T A<70°C for the UC3825, T A=T O.UC1825UC3825 PARAMETERS TEST CONDITIONS UC2825MIN TOP MAX MIN TOP MAX UNITS Reference SectionOutput Voltage T O= 25°C, I O= 1mA 5.05 5.10 5.15 5.00 5.10 5.20V Line Regulation10V <V CC< 30V220220mV Load Regulation1mA < I O< 10mA520520mV Temperature Stability*T MIN< T A<T MAX0.20.40.20.4mV/°C Total Output Variation*Line, Load, Temperature 5.00 5.20 4.95 5.25V Output Noise Voltage*10Hz < f < 10kHz5050µV Long Term Stability*T J= 125°C, 1000hrs.525525mV Short Circuit Current V REF= 0V-15-50-100-15-50-100mA Oscillator SectionInitial Accuracy*T J= 2°C360400440360400440kHz Voltage Stability*10V <V CC< 30V0.220.22% Temperature Stability*T MIN< T A<T MAX55% Total Variation*Line, Temperature340460340460kHz Oscillator Section (cont.)Clock Out High 3.9 4.5 3.9 4.5V Clock Out Low 2.3 2.9 2.3 2.9V Ramp Peak* 2.6 2.8 3.0 2.6 2.8 3.0V Ramp Valley*0.7 1.0 1.250.7 1.0 1.25V Ramp Valley to Peak* 1.6 1.8 2.0 1.6 1.8 2.0V Error Amplifier SectionInput Offset Voltage1015mV Input Bias Current0.630.63µA Input Offset Current0.110.11µA Open Loop Gain1V < V O< 4V60956095dB CMRR 1.5V <V CM< 5.5V75957595dB PSRR10V <V CC< 30V8511085110dB Output Sink Current V PIN3= 1V1 2.51 2.5mA Output Source Current V PIN3= 4V-0.5-1.3-0.5-1.3mA Output High Voltage I PIN3= -0.5mA 4.0 4.7 5.0 4.0 4.7 5.0V Output Low Voltage I PIN3= 1mA00 .5 1.000.5 1.0V Unity Gain Bandwidth*3 5.53 5.5MHz Slew Rate*612612V/µsUC1825UC3825PARAMETERS TEST CONDITIONSUC2825MIN TOP MAXMINTOP MAX UNITS PWM Comparator Section Pin 7 Bias Current V PIN 7= 0V -1-5-1-5µA Duty Cycle Range080085%Pin 3 Zero DC Threshold V PIN 7= 0V 1.11.25 1.11.25V Delay to Output *50805080ns Soft-Start Section Charge Current V PIN 8= 0.5V 39203920µA Discharge Current V PIN 8= 1V 11mA Current Limit / Shutdown Section Pin 9 Bias Current 0 <V PIN 9< 4V 1510µA Current Limit Threshold 0.9 1.0 1.10.9 1.0 1.1V Shutdown Threshold 1.251.40 1.55 1.251.40 1.55V Delay to Output 50805080ns Output Section Output Low Level I OUT = 20mA0.250.400.250.40V I OUT = 200mA1.22.21.22.2V Output High Level I OUT = -20mA13.013.513.013.5V I OUT = -200mA12.013.012.013.0V Collector Leakage V C = 30V 10050010500µA Rise/Fall Time *CL = 1nF 30603060ns Under-Voltage Lockout Section Start Threshold 8.89.29.68.89.29.6V UVLO Hysteresis0.40.8 1.20.40.8 1.2V Supply Current Section Start Up Current V CC = 8V 1.1 2.5 1.1 2.5mA ICC V PIN 1, V PIN 7, V PIN 9= 0V; V PIN 2= 1V22332233mAELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for , R T = 3.65k, C T = 1nF,V CC= 15V, -55°C<T A <125°C for the UC1825, –40°C<T A <85°C for the UC2825, and 0°C<T A <70°C for the UC3825, T A =T J.UC1825 UC2825 UC3825High speed circuits demand careful attention to layout and component placement.To assure proper perfor-mance of the UC1825follow these rules:1)Use a ground plane.2)Damp or clamp parasitic inductive kick energy from the gate of driven MOSFETs.Do not allow the out-put pins to ring below ground.A series gate resistor or a shunt1Amp Schottky diode at the output pin will serve this purpose.3)Bypass V CC,V C,and V e0.1µF monolithic ceramic capacitors with low equivalent series inductance.Allow less than1cm of total lead length for each capacitor between the bypassed pin and the ground plane.4)Treat the timing capacitor,CT,like a bypass ca-pacitor.Printed Circuit Board Layout ConsiderationsUC1825UC2825 Oscillator CircuitUC3825UC1825UC2825 Forward Technique for Off-Line Voltage Mode ApplicationUC3825Constant Volt-Second Clamp CircuitOutput SectionUC1825UC2825 Open Loop Laboratory Test FixtureUC3825Design Example: 50W, 48V to 5V DC to DC Converter - 1.5MHz Clock FrequencyPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-87681012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8768101EA ACTIVE CDIP J161TBD A42N/A for Pkg Type 5962-8768101QFA ACTIVE CFP W161TBD A42N/A for Pkg Type UC1825J ACTIVE CDIP J161TBD A42N/A for Pkg Type UC1825J883B ACTIVE CDIP J161TBD A42N/A for Pkg Type UC1825L ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type UC1825L883B ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type UC1825W883B ACTIVE CFP W161TBD A42N/A for Pkg Type UC2825DW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825DW/1PREVIEW SOIC DW16Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825DW/1G4PREVIEW SOIC DW16Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825DWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825DWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825DWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR UC2825J ACTIVE CDIP J161TBD A42N/A for Pkg Type UC2825N ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU N/A for Pkg TypeUC2825NG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU N/A for Pkg TypeUC2825Q ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC2825QG3ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC2825QTR ACTIVE PLCC FN201000Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC2825QTRG3ACTIVE PLCC FN201000Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC3825DW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825DWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825DWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825DWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR UC3825J ACTIVE CDIP J161TBD A42N/A for Pkg Type UC3825N ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU N/A for Pkg TypeUC3825NG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU N/A for Pkg TypeUC3825Q ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)UC3825QG3ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC3825QTR ACTIVE PLCC FN201000Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC3825QTRG3ACTIVE PLCC FN201000Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF UC1825,UC2825,UC2825M,UC3825,UC3825M:•Space:UC1825-SPNOTE:Qualified Version Definitions:•Space-Radiation tolerant,ceramic packaging and qualified for use in Space-based applicationTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant UC2825DWTR SOICDW 162000330.016.410.8510.8 2.712.016.0Q1UC2825QTR PLCCFN 201000330.016.410.310.3 4.912.016.0Q1UC3825DWTR SOICDW 162000330.016.410.8510.8 2.712.016.0Q1UC3825QTR PLCC FN 201000330.016.410.310.3 4.912.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) UC2825DWTR SOIC DW162000346.0346.033.0 UC2825QTR PLCC FN201000346.0346.033.0 UC3825DWTR SOIC DW162000346.0346.033.0 UC3825QTR PLCC FN201000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government 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PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TPS3820-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3820-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3820-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-25DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-30DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-33DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3823-50DBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR TPS3824-25DBVRG4ACTIVESOT-23DBV53000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEARPACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1元器件交易网Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3824-25DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-30DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3824-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3825-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTPS3828-33DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-33DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TPS3828-50DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTPS3828-50DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

DESCRIPTION (CONTINUED)Functional improvements have also been implemented in this family. The UC3825 shutdown comparator is now a high-speed overcurrent comparator with a threshold of 1.2 V. The overcurrent comparator sets a latch that ensures full discharge of the soft-start capacitor before allowing a restart. While the fault latch is set, the outputs are in the low state. In the event of continuous faults, the soft-start capacitor is fully charged before discharge to insure that the fault frequency does not exceed the designed soft start period. The UC3825 CLOCK pin has become CLK/LEB. This pin combines the functions of clock output and leading edge blanking adjustment and has been buffered for easier interfacing.The UC3825A and UC3825B have dual alternating outputs and the same pin configuration of the UC3825. The UC3823APACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-87681022A ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NC 5962-8768102EA ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NC 5962-8768102V2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-8768102VEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 5962-8768102XA OBSOLETE TO-92LP28TBD Call TI Call TI5962-8768103XA OBSOLETE TO-92LP28TBD Call TI Call TI5962-89905022A ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NC 5962-8990502EA ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NC 5962-8990502VEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC UC1823AJ ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NCUC1823AJ883B ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NCUC1823AJQMLV ACTIVE CDIP J16TBD Call TI Call TI UC1823AL ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NCUC1823AL883B ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NC UC1823BJ OBSOLETE CDIP J16TBD Call TI Call TIUC1823BJ883B OBSOLETE CDIP J16TBD Call TI Call TI UC1823BL OBSOLETE LCCC FK20TBD Call TI Call TIUC1823BL883B OBSOLETE LCCC FK20TBD Call TI Call TI UC1825AJ ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NCUC1825AJ883B ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NCUC1825AJQMLV ACTIVE CDIP J16TBD Call TI Call TI UC1825AL ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NCUC1825AL883B ACTIVE LCCC FK201TBD POST-PLATE Level-NC-NC-NCUC1825ALP883B OBSOLETE TO-92LP28TBD Call TI Call TIUC1825ALQMLV ACTIVE LCCC FK20TBD Call TI Call TI UC1825BJ OBSOLETE CDIP J16TBD Call TI Call TIUC1825BJ883B OBSOLETE CDIP J16TBD Call TI Call TIUC1825BL/81047OBSOLETE TO/SOT L20TBD Call TI Call TIUC1825BL883B OBSOLETE LCCC FK20TBD Call TI Call TIUC1825BLP883B OBSOLETE TO-92LP28TBD Call TI Call TIUC2823ADW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2823ADWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2823ADWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR UC2823AJ ACTIVE CDIP J161TBD A42SNPB Level-NC-NC-NC UC2823AN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2823ANG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2823AQ ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEAR UC2823BDW ACTIVE SOIC DW1640Green(RoHS&CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)UC2823BDWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2823BJ OBSOLETE CDIP J16TBD Call TI Call TIUC2823BN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2823BNG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2825ADW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825ADWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825ADWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825ADWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825AN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2825ANG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2825AQ ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC2825BDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC2825BDWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR UC2825BJ OBSOLETE CDIP J16TBD Call TI Call TIUC2825BN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC2825BNG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC3823ADW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823ADWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823ADWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823ADWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823AN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC3823ANG4ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC3823BDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823BDWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823BDWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3823BN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)UC3825ADW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825ADWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825ADWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825AN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NCUC3825AQ ACTIVE PLCC FN2046Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC3825AQTR ACTIVE PLCC FN201000Green(RoHS&no Sb/Br)CU SN Level-2-260C-1YEARUC3825BDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825BDWTR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825BDWTRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARUC3825BN ACTIVE PDIP N1625Green(RoHS&no Sb/Br)CU NIPDAU Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

uc3845中文资料应用
时间:2015-04-15 21:12 来源:电工之家作者:编辑部
双列8脚直插式或14脚贴片塑料封装。

是高性能固定频率电流型控制器。

它们是专门设计用于脱线工作和直流一直流变换器应用的，为使用者提供了一种低成本、高效率外接元件最少的解决方案。

这些集成电路包括振荡器、温度补偿参考源、高增益误差放大器、电流检测比较器及一个适合于驱动 MOS功率场效应晶体管(PFET)的理想的高电流图腾柱输出。

芯片还包括一系列保护特性，如具有滞后特性的输入和参考电压欠压锁定保护功能，逐个周期的限流保护，用于测量单个脉冲的锁存器和一个每隔一个振荡周期封闭脉冲输出的触发器——这就使得输出占空比可以在50％～70％范围内可调。

具有16 V(开启)和10 V(关闭)的欠压输出锁定(UVLO)门限值。

特别适用于脱线工作变换器。

uCX845是为低电压应用特别制造的，它具有8．5 V(开启)和7．6 V(关闭)欠压输出锁定门限值。

其特点为
(1)电流模式工作，输出开关频率为500 kHz。

(2)输出占空比可从50％～70％调节。

(3)自动前馈补偿。

(4)逐个周期的限流保护，锁定式脉冲宽度调制(PWM)。

(5)有欠压锁定的内部调整参考源。

(6)高电流图腾柱式输出。

(7)带滞后的输入欠压锁定。

封装引脚图：
【互换兼容】
CS3845 CW3845 KA3885脚同（FA13845N）FA13845P L3845 LM3845 ST3845UC UC3845W UC3845N脚同UC3845A。

Cascadable Silicon Bipolar MMIC␣AmplifierTechnical DataFeatures•Cascadable 50 Ω Gain Block • 3 dB Bandwidth:DC to 2.6 GHz•12.0 dB Typical Gain at1.0␣GHz•Unconditionally Stable (k>1)•Low Cost Plastic Package MSA-028585 Plastic PackageDescriptionThe MSA-0285 is a high perfor-mance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a low costplastic package. This MMIC is Typical Biasing ConfigurationRVCC>7 V IN OUTdesigned for use as a general purpose 50 Ω gain block. Typical applications include narrow and broad band IF and RF amplifiers in industrial and military applications.The MSA-series is fabricated using HP’s 10 GHz f T, 25␣GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metalli-zation to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.MSA-0285 Absolute Maximum RatingsParameterAbsolute Maximum [1]Device Current60 mA Power Dissipation [2,3]325 mW RF Input Power+13 dBm Junction Temperature 150°C Storage Temperature–65 to 150°CThermal Resistance [2,4]:θjc = 95°C/WNotes:1.Permanent damage may occur if any of these limits are exceeded.2.T CASE = 25°C.3.Derate at 10.5 mW/°C for T C > 119°C.4.See MEASUREMENTS section “Thermal Resistance” for more information.G P Power Gain (|S 21|2) f = 0.1 GHz dB12.5f = 1.0 GHz 10.012.0∆G P Gain Flatness f = 0.1 to 1.6 GHzdB ±0.6f 3 dB 3 dB Bandwidth GHz2.6Input VSWR f = 0.1 to3.0 GHz 1.3:1Output VSWR f = 0.1 to 3.0 GHz 1.4:1NF 50 Ω Noise Figuref = 1.0 GHz dB 6.5P 1 dB Output Power at 1 dB Gain Compression f = 1.0 GHz dBm 4.5IP 3Third Order Intercept Point f = 1.0 GHz dBm 17.0t D Group Delay f = 1.0 GHz psec 125V d Device VoltageV 4.05.06.0dV/dTDevice Voltage Temperature CoefficientmV/°C–8.0Note:1.The recommended operating current range for this device is 18 to 40 mA. Typical performance as a function of current is on the following page.Electrical Specifications [1], T A = 25°CSymbolParameters and Test Conditions: I d = 25 mA, Z O = 50 ΩUnitsMin.Typ.Max.VSWRMSA-0285 Typical Scattering Parameters (Z O = 50 Ω, T A = 25°C, I d = 25 mA)Freq.GHzMagAngdBMagAngdBMagAngMagAng0.1.1017412.6 4.25175–18.6.1182.14–70.2.1016812.5 4.22171–18.5.1193.13–120.4.1015712.4 4.17161–18.3.1226.14–260.6.0914312.3 4.10153–18.3.1217.14–380.8.0813212.1 4.03144–18.0.12611.14–481.0.0812211.9 3.95135–17.5.13312.14–601.5.049511.4 3.70115–17.0.14216.13–852.0.0211710.6 3.4095–16.0.15817.12–1102.5.05–1739.9 3.1182–15.0.17720.12–1283.0.12–1758.9 2.7865–14.7.18519.11–1483.5.161797.9 2.4949–14.0.19914.10–1454.0.21169 6.9 2.2235–13.7.20711.10–1345.0.28139 5.0 1.779–13.0.2244.12–1186.0.41100 3.0 1.42–16–12.9.226–5.09–154A model for this device is available in the DEVICE MODELS section.S 11S 21S 12 S 22Typical Performance, T A = 25°C(unless otherwise noted)–25+25+55+85P 1 d B (d B m )G p (d B )G p (d B )TEMPERATURE (°C)Figure 4. Output Power at 1 dB Gain Compression, NF and Power Gain vs. Case Temperature, f = 1.0 GHz, I d =25mA.FREQUENCY (GHz)Figure 6. Noise Figure vs. Frequency.FREQUENCY (GHz)Figure 5. Output Power at 1 dB Gain Compression vs. Frequency.85 Plastic Package Dimensions1. Dimensions are inmm。

The A3425LK dual Hall-effect switch is an extremelytemperature-stable and stress-resistant sensor especially suited for use in digital-encoder systems in the harsh environments of automotive or industrial applications over extended temperature ranges to +150°C.Superior high-temperature performance is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. This device also eliminates the major manufacturing hurdles encountered in fine-pitch direction-detection applications,namely maintaining accurate mechanical location between the two active Hall elements. Here, the two Hall elements are photolithographically aligned to better than 1 µm, as contrasted with 100 µm or worse me-chanical location tolerance when manufactured discretely. The A3425LK is an ultra-sensitive device optimized for use with high-density ring magnets.The device includes on a single silicon chip a voltage regulator, two independent chopper-stabilized Hall-voltage generators , two small-signal amplifiers, two Schmitt triggers, and two short-circuit protected open-collector outputs to sink up to 30 mA each. An on-board regulator permits operation with supply voltages of 3.3 to 26.5 volts. With suitable output pull ups, it can be used directly with bipolar or MOS logic circuits.The A3425LK dual Hall-effect switch is supplied in a 4-pin plastic SIP for operation over a temperature range of -40°C to +150°C. A similar device, with on-chip logic processing specifically for direction detection applications, in a 5-pin SIP, is the A3422LKA.FEATURESI Two Matched Hall Switches On A Single SubstrateI 1 mm Sensor-to-Sensor Spacing I Superior Temperature Stability I Resistant to Physical Stress I Output Short-Circuit ProtectionI Operation From Unregulated Supply I Reverse Battery Protection I Solid-State ReliabilityI Integrated ESD Protection on Outputs and Supply Data Sheet 27651.20DUAL, CHOPPER-STABILIZED, ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH3425Always order by complete part number, e.g., A3425LK .3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50002Copyright © 2000, Allegro MicroSystems, Inc.23751001251501751.00.2A L L O W AB L E P AC K A G E P O W E RD I S S I P A T I O N I N W A T T SAMBIENT TEMPERATURE IN °C0.80.60.450Dwg. GH-001-1250FREE AIR, R = 177°C/W θJA-253425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH3ELECTRICAL CHARACTERISTICS over operating temperature range, each switch tested separately (unless otherwise specified).LimitsCharacteristic Symbol Test Conditions Min.Typ.Max.Units Supply Voltage Range V CC Operating, T J < 170°C 1 3.3–26.5V Output Leakage Current I OFF V OUT = 18 V, B < B RP –<1.010µA Output Saturation Voltage V OUT(SAT)I OUT = 20 mA, B > B OP –225400mV Output Current Limit I OM B > B OP30–55mA Chopping Frequency f C –340–kHz Output Rise Time t r R L = 820 Ω, C L = 10 pF –110–ns Output Fall Time t f R L = 820 Ω, C L = 10 pF –55–ns Total Supply CurrentI CCBoth outputs off, V CC ≤ 26.5 V – 3.8 6.0mA Both outputs on, V CC ≤ 26.5 V–7.510mA Reverse Battery Current I CC V RCC = -18 V– 2.015mA Zener Voltage V Z + V D I CC = 15 mA, T A = 25°C 283337V Zener Impedancez z + z DI CC = 15 mA, T A = 25°C –50100ΩNOTES:1. Supply voltage is limited by allowable package power dissipation as a function of ambient temperature.2. B OP = operate point (output turns on); B RP = release point (output turns off).3. Typical Data is at T A = +25°C and V CC = 12 V and is for design information only.MAGNETIC CHARACTERISTICS over operating supply voltage and temperature ranges, each switch tested separately (unless otherwise specified).LimitsCharacteristic Symbol Test ConditionsMin.Typ.Max.Units Operate PointB OP1–8.024G B OP2–1124G Release PointB RP1-24-11–G B RP2-24-8.0–G HysteresisB hys B OP – B RP 5.01935G Operate Differential B OP(dif)B OP1 – B OP2–-2.0±30G Release Differential B RP(dif)B RP1 – B RP2–-3.3±30G SymmetryB symB OP + B RP––±30GNOTES:1. As used here, negative flux densities are defined as less than zero (algebraic convention) and -50 G is less than +10 G.2. Typical Data is at T A = +25°C and V CC = 12 V and is for design information only.3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50004TYPICAL OPERATING CHARACTERISTICSas a function of temperatureTOTAL SUPPLY CURRENTOUTPUT SATURATION VOLTAGECHANNEL 2 SWITCH POINTSAMBIENT TEMPERATURE IN °CDwg. GH-026-7S W I T C H P O I N T I N G A U S S0510152025-25-20-15-10-5050100AMBIENT TEMPERATURE IN °C-50Dwg. GH-026-8S W I T C H P O I NT I N G A U S S05150-25257512510152025-25-20-15-10-5CHANNEL 1 SWITCH POINTS0255075100300AMBIENT TEMPERATURE IN °C200100-50Dwg. GH-029-5S A T U R A T I O N V O L T A G E I N mV150-251250S U P P L Y C U R R E N T I N m A8642025*******AMBIENT TEMPERATURE IN °C-50Dwg. GH-028-8125-251503425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH5SENSOR LOCATIONS(±0.005" [0.13 mm] die placement)Although sensor location is accurate to three sigma for a particular design, product improvements may result in small changes to sensor location.Dwg. MH-001-4TYPICAL OPERATING CHARACTERISTICS (cont'd)as a function of supply voltageOPERATE AND RELEASE DIFFERENTIALSAMBIENT TEMPERATURE IN °CDwg. GH-026-9B O P /B R P D I F F E R E N T I A L I N G A U S S0510152025-25-20-15-10-53425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50006CRITERIA FOR DEVICE QUALIFICATIONQualification Test Test Method and Test Conditions Test Length SamplesComments Biased Humidity (HAST)JESD22-A101,1000 hrs77V CC = V OUT = 3.3 VT A = 85°C, RH = 85%High-Temperature JESD22-A108,1000 hrs 77Operating Life (HTOL)T A = 150°C, T J = 165°C Accelerated HTOLT A = 170°C, T J = 180°C 168 hrs 77Autoclave, Unbiased JESD22-A102, Condition C,96 hrs 77High-Temperature MIL-STD-883, Method 1008,1000 hrs77(Bake) Storage Life T A = 170°CTemperature CycleMIL-STD-883, Method 1010,1000 cycles 77-55°C to +150°C ESD,CDF-AEC-Q100-002Pre/Post x per Test to failure,Human Body Model Reading test All leads > TBDAll Allegro sensors are subjected to stringent qualification requirements prior to being released to production.To become qualified, except for the destructive ESD tests, no failures are permitted.3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH7FUNCTIONAL DESCRIPTIONChopper-Stabilized Technique. These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency clock to reduce the residual offset voltage of the Hall element that is normally caused by device overmolding, temperature dependencies, andthermal stress. This technique produces devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. This technique will also slightly degrade the device output repeatability.The Hall element can be considered as a resistor array similar to a Wheatstone bridge. A large portion of the offset is a result of the mismatching of these resistors.The chopper-stabilizing technique cancels the mismatch-ing of the resistors by changing the direction of the current flowing through the Hall plate and Hall voltage measure-ment taps, while maintaining the Hall-voltage signal that is induced by the external magnetic flux. The signal is,then, captured by a sample-and-hold circuit.More detailed descriptions of the circuit operation can be found in: Technical Paper STP 97-10, Monolithic Magnetic Hall Sensor Using Dynamic Quadrature Offset Cancellation and Technical Paper STP 99-1, Chopper-Stabilized Amplifiers With A Track-and-Hold Signal Demodulator .Operation. The output of these devices switches low (turns on) when a magnetic field perpendicular to the Hall sensor exceeds the operate point threshold (B OP ). After turn-on, the output is capable of sinking 30 mA and the output voltage is V OUT(SAT). When the magnetic field is reduced below the release point (B RP ), the device output switches high (turns off). Note especially that release can occur when the magnetic field is removed but to ensure release, a field reversal is required. The difference in the magnetic operate and release points is the hysteresis (B hys )of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise.+—Dwg. AH-011-2O U T P U T V O L T A G EFLUX DENSITYDwg. GH-034-53425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50008Quadrature/Direction Detection. External logic circuitry can be used to determine the direction of move-ment of the magnetic field across the face of the package.For the direction signal to be appropriately updated, a quadrature relationship must be maintained between the ring magnet pole width*, the sensor-to-sensor spacing,and, to a lesser extent, the magnetic switch points. For optimal design, the sensor should be actuated with a ring magnet pole width* two times the sensor-to-sensor spacing. This will produce a sinusoidal magnetic field whose period (denoted as Τ) is then four times the sensor-to-sensor spacing. A quadrature relationship can also be maintained for a ring magnet that has a period that satis-fies the relationship n Τ/4 = 1.0 mm, where n is any odd integer. Therefore, ring magnets with pole-pair spacings equal to 4 mm (n = 1), 1.3 mm (n = 3), etc. are permitted.The response of the device to the magnetic fieldproduced by a rotating ring magnet is shown above. Note the desired phase shift between the two integrated sensors.*“Pole ” refers to a single pole (North or South)unless stated as “pole pair ” (North and South).Dwg. WH-012-1+B -B +B-BOUT E1OUT E2APPLICATIONS INFORMATIONOver-Current Protection. Current through each output transistor is sensed with a low-value (<1 Ω) on-chipaluminum resistor. The voltage drop across this resistor is fed back to control the base drive of that output. This feedback prevents the output transistor from exceeding its maximum current-density rating by limiting the output current to between 30 mA and 55 mA. In this mode, the device will come out of saturation and dissipate an in-creased amount of powerP D = V OUT x I OMwhere V OUT = V CC - (I OM x R L )and the output transistor will be thermally stressed. This stress, unless protected against, will cause the device junction temperature to rise until it fails catastrophically.Over-current limiting is intended to protect the device from transient overloads and should not imply that output short circuits are permitted.3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH9Rotated sensor for fine-pitch ring magnetsDwg. MH-024-1APPLICATIONS INFORMATION (cont'd)Power Dissipation and Junction Temperature.Operating characteristics are limited by allowable package power dissipation (P D ) as a function of ambient tempera-ture (T A ), which is defined by the maximum internal junction temperature (T J = 170°C) and the package thermal resistance (R θJA = 177°C/W).P D = (T J – T A )/R θJA = (170 – T A )/177This is shown in the graph on page 2.Actual or required package power dissipation is the sum of the two output powers (d.c. x I OUT1 x V OUT(SAT)1) +(d.c. x I OUT2 x V OUT(SAT)2) and the sensor power (I CC x V CC ).At high ambient operating temperatures (above about 120°C), it is easy to exceed the allowable package power dissipation. In this case, the output currents or the supply voltage must be reduced.Operation with Fine-Pitch Ring Magnets. For targets with a circular pitch of less than 4mm, a perfor-mance improvement can be observed by rotating the front face of the sensor subassembly (see below). This sensor rotation decreases the effective sensor-to-sensor spacing,Applications. It is strongly recommended that an external 0.01 µF bypass capacitor be connected (in close proximity to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the internal logic.The simplest form of magnet that will operate these devices is a ring magnet. Other methods of operation,such as linear magnets, are possible. Extensive applica-tions information on magnets and Hall-effect sensors is also available in the “Hall-Effect IC Applications Guide ”which can be found in the latest issue of the AllegroMicroSystems Electronic Data Book, AMS-702 or Appli-cation Note 27701, or at3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-500010Dimensions in Inches(controlling dimensions)Dimensions in Millimeters(for reference only)NOTES:1.Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point(parting line).2.Exact body and lead configuration at vendor’s option within limits shown.3.Height does not include mold gate flash.4.Recommended minimum PWB hole diameter to clear transition area is 0.035" (0.89 mm).5.Where no tolerance is specified, dimension is nominal.SURFACE-MOUNT LEAD FORM (order A3425LK-TL)°°3425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCHThis page is intentionally left blank.113425DUAL, CHOPPER-STABILIZED,ULTRA-SENSITIVE,BIPOLAR HALL-EFFECT SWITCH115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-500012The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283;5,389,889; 5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719;5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may berequired to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support appliances, devices, or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringements of patents or other rights of third parties that may result from its use.HALL-EFFECT SENSORSPartial Part Avail. Oper.Characteristics at T A = +25°C Number Temp.B OP max B RP min B hys typ Features NotesGEARTOOTH/RING MAGNET (DUAL ELEMENT) HALL-EFFECT SENSORS in order of B OP3060K/S +35-3530ac coupled3422E/L +75-7546direction detection 3059K/S +100-100130ac coupled 3056E/L +150-15050zero-speed 3058E/L +250-250200zero-speed3421E/L +280-280335direction detectionSPECIAL-PURPOSE HALL-EFFECT SENSORS 3054K/S +300+5.050unipolar switch, multiplexed 63209E ±60±5.07.7400 µW, chopper stabilized 3210E ±60±5.07.725 µW, chopper stabilized 3421E/L +280-280335direction detection 3422E/L +85-8546direction detection 3425L+24-2419dual, chopper stabilized1Operating Temperature Ranges:S = -20°C to +85°C, E = -40°C to +85°C, J = -40°C to +115°C, K = -40°C to +125°C, L = -40°C to +150°C Notes 1.Protected.6.Multiplexed two-wire sensor; after proper address, power/signal bus current indicates magnetic field condition.。

基于UC3845的反激式开关电源设计时间：2011-10-28 21:40:13来源：作者：引言反激式开关电源以其结构简单、元器件少等优点在自动控制及智能仪表的电源中得到广泛的应用。

开关电源的调节部分通常采用脉宽调制（PWM）技术，即在主变换器周期不变的情况下，根据输入电压或负载的变化来调节功率MOSFET 管导通的占空比，从而使输出电压稳定。

脉宽调制的方法很多，本文中所介绍的是一种高性能的固定频率电流型脉宽集成控制芯片UC3845。

该芯片是专为离线的直流至直流变换器应用而设计的。

其主要特点是具有内部振荡器、高精度误差比较器、逐周电流取样比较、启动电流小、大电流图腾柱输出等，是驱动MOSFET的理想器件。

1 UC3845简介UC3845芯片为SO8或SO14管脚塑料表贴元件。

专为低压应用设计。

其欠压锁定门限为8.5v（通），7.6V（断）；电流模式工作达500千赫输出开关频率；在反激式应用中最大占空比为0.5;输出静区时间从50%~70%可调；自动前馈补偿；锁存脉宽调制，用于逐周期限流；内部微调的参考源；带欠压锁定；大电流图腾柱输出；输入欠压锁定，带滞后；启动及工作电流低。

芯片管脚图及管脚功能如图1所示。

图1 UC3845芯片管脚图1脚：输出/补偿，内部误差放大器的输出端。

通常此脚与脚2之间接有反馈网络，以确定误差放大器的增益和频响。

2脚：电压反馈输入端。

此脚与内部误差放大器同向输入端的基准电压（2.5 V）进行比较，调整脉宽。

3脚：电流取样输入端。

4脚：R T/CT振荡器的外接电容C和电阻R的公共端。

通过一个电阻接Vref通过一个电阻接地。

5脚：接地。

6脚：图腾柱式PWM输出，驱动能力为土1A.7脚：正电源脚。

8脚：V ref，5V基准电压，输出电流可达50mA.2 设计方法如图2为基于U C3845反激式开关电源的电路图，虚线框内为UC3845内部简化方框图。

1）启动电压和电容的选择交流电源115VAC经整流、滤波后为一个纹波非常小的直流高压Udc,该电压根据交流电源范围往往可得到一个最大Udcmax，一和最小电压Udcmin 。