集成电路(外文翻译)
- 格式:doc
- 大小:118.00 KB
- 文档页数:22
集成电路介绍集成电路是20世纪60年代发展起来的一种半导体器件,它的英文名称为Integrated Circuites,缩写为IC。
它是以半导体晶体材料为基片,经加工制造,将元件、有源器件和互连线集成在基片内部、表面或基片之上,执行某种电子功能的微型化电路。
随着科学技术的迅速发展和对数字电路不断增长的应用要求,集成电路生产厂家积极采用新技术、改进设计方案和生产工艺,沿着提高速度、降低功耗、缩小体积的方向作不懈努力,不断推出各种型号的新产品。
仅几十年时间,数字电路就从小规模、中规模、大规模发展到超大规模、巨大规模。
集成电路的种类相当多,集成电路按制作工艺来分可分为三大类,即半导体集成电路,膜集成电路及混合集成电路。
目前世界上生产最多、应用最广的就是半导体集成电路。
半导体集成电路又可分为DDL(二极管-二极管逻辑)集成电路、DTL (二极管-三极管逻辑)集成电路、HTL高电压(二极管-三极管逻辑)集成电路、TTL(三极管-三极管逻辑)集成电路、ECL(射极偶合逻辑或电流开关逻辑)集成电路和CMOS(互补型金属氧化物半导体逻辑)集成电路。
目前应用最广泛的数字电路是TTL电路和CMOS电路。
TTL电路以双极型晶体管为开关元件,所以又称双极型集成电路。
根据应用领域的不同,它分为54系列和74系列,前者为军品,一般工业设备和消费类电子产品多用后者。
74系列数字集成电路是国际上通用的标准电路。
其品种分为六大类:74××(标准)、74S ××(肖特基)、74LS××(低功耗肖特基)、74AS××(先进肖特基)、74ALS××(先进低功耗肖特基)、74F××(高速)、其逻辑功能完全相同。
它具有速度高、驱动能力强等优点,但其功耗较大,集成度相对较低。
MOS电路又称场效应集成电路,它的主要优点是输入阻抗高、功耗低、抗干扰能力强且适合大规模集成。
integrated circuits division -回复标题:深入探索集成电路division:原理、发展与未来一、引言集成电路(Integrated Circuit,简称IC)是现代电子技术的核心组成部分,它的出现和发展极大地推动了信息技术的进步。
集成电路的division,即集成电路的设计、制造、应用和研究等多个方面,构成了一个复杂而精密的系统。
本文将逐步解析集成电路division的各个方面,以期为读者提供全面的理解。
二、集成电路的基本原理集成电路是一种将大量微小的晶体管、电阻、电容等电子元件集成在一块半导体材料上的微型电子设备。
其基本原理主要包括以下几点:1. 半导体材料:集成电路主要使用硅作为基础材料,因其具有良好的电学性能和易于加工的特点。
2. 晶体管:晶体管是集成电路中的基本单元,它可以放大电信号或者用作开关控制电流。
3. 集成设计:通过光刻、蚀刻等工艺,将多个晶体管和其他电子元件集成在一块半导体芯片上,形成复杂的电路系统。
三、集成电路的发展历程集成电路的发展历程可以大致分为以下几个阶段:1. 第一代集成电路:1958年,杰克·基尔比发明了世界上第一个集成电路,它包含了几个晶体管和电阻。
2. 第二代集成电路:60年代末,随着制造技术的进步,集成电路的集成度大大提高,单个芯片上可以集成数百个元件。
3. 大规模集成电路和超大规模集成电路:70年代和80年代,集成电路进入了大规模和超大规模时代,单个芯片上的元件数量达到数十万甚至数百万。
4. 现代集成电路:进入21世纪,集成电路的发展趋势是向更高集成度、更低功耗、更快速度和更小尺寸的方向发展。
四、集成电路的制造过程集成电路的制造过程是一个复杂而精密的过程,主要包括以下步骤:1. 单晶硅片制备:首先需要制备出纯净的单晶硅片。
2. 光刻:在硅片上涂覆光刻胶,然后通过曝光和显影,形成电路图案。
3. 蚀刻:通过化学或物理方法,将未被光刻胶保护的部分蚀刻掉,形成电路结构。
Integrated circuitFrom Wikipedia, the free encyclopediaAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate ("chip") of semiconductor material, normally silicon. This can be made much smaller than a discrete circuit made from independent components.Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of producing integrated circuits.ICs can be made very compact, having up to several billion transistors and other electronic components in an area the size of a fingernail. The width of each conducting line in a circuit can be made smaller and smaller as the technology advances; in 2008 it dropped below 100 nanometers and in 2013 it is expected to be in the tens of nanometers.ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuit's mass productioncapability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized integrated circuits in place of designs using discrete transistors.There are two main advantages of ICs over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. As of 2012, typical chip areas range from a few square millimeters to around 450 mm2, with up to 9 million transistors per mm2.Among the most advanced integrated circuits are the microprocessors or "cores", which control everything from computers and cellular phones to digital microwave ovens. Digital memory chips and application-specific integrated circuits (ASIC)s are examples of other families of integrated circuits that are important to the modern information society. While the cost of designing and developing a complex integrated circuit is quite high, when spread across typically millions of production units the individual IC cost is minimized. The performance of ICs is high because the small size allows short traces which in turn allows low power logic (such as CMOS) to be used at fast switching speeds.ICs have consistently migrated to smaller feature sizes over the years, allowing more circuitry to be packed on each chip. This increased capacity per unit area can be used to decrease cost and/or increase functionality—see Moore's law which, in its modern interpretation, states that the number of transistors in an integrated circuit doubles every two years. In general, as the feature size shrinks, almost everything improves—the cost per unit and the switching power consumption go down, and the speed goes up. However, ICs with nanometer-scale devices are not without their problems, principal among which is leakage current (see subthreshold leakage for a discussion of this), although these problems are not insurmountable and will likely be solved or at least ameliorated by the introduction of high-k dielectrics. Since these speed and power consumption gains are apparent to the end user, there is fierce competitionamong the manufacturers to use finer geometries. This process, and the expected progress over the next few years, is well described by the International Technology Roadmap for Semiconductors (ITRS).In current research projects, integrated circuits are also developed for sensoric applications in medical implants or other bioelectronic devices. Particular sealing strategies have to be taken in such biogenic environments to avoid corrosion or biodegradation of the exposed semiconductor materials. As one of the few materials well established in CMOS technology, titanium nitride (TiN) turned out as exceptionally stable and well suited for electrode applications in medical implants.Integrated circuits can be classified into analog, digital and mixed signal (both analog and digital on the same chip). Digital integrated circuits can contain anywhere from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, and micro controllers, work using binary mathematics to process "one" and "zero" signals.Analog ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, and mixing. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch.ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such mixed-signal circuits offer smaller size and lower cost, but must carefully account for signal interference. Modern electronic component distributors often further sub-categorize the huge variety of integrated circuits now available:In the 1980s, programmable logic devices were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a single chip to be programmed to implement different LSI-type functions such as logic gates, adders and registers. Current devices called field-programmable gate arrays can now implement tens of thousands of LSI circuits in parallel and operate up to 1.5 GHz.The techniques perfected by the integrated circuits industry over the last three decades have been used to create very small mechanical devices driven by electricity using a technology known as microelectromechanical systems. These devices are used in a variety of commercial and military applications. Example commercial applications include DLP projectors, inkjet printers, and accelerometers used to deploy automobile airbags.In the past, radios could not be fabricated in the same low-cost processes as microprocessors. But since 1998, a large number of radio chips have been developed using CMOS processes. Examples include Intel's DECT cordless phone, or Atheros's 802.11 card.Future developments seem to follow the multi-core multi-microprocessor paradigm, already used by the Intel and AMD dual-core processors. Rapport Inc. and IBM started shipping the KC256 in 2006, a 256-core microprocessor. Intel, as recently as February–August 2011, unveiled a prototype, "not for commercial sale" chip that bears 80 cores. Each core is capable of handling its own task independently of the others. This is in response to the heat-versus-speed limit that is about to be reached using existing transistor technology (see: thermal design power). This design provides a new challenge to chip programming. Parallel programming languages such as the open-source X10 programming language are designed to assist with this task.。
集成电路中英文对照表A天线,安培BPA带通放大A.ADJ自动调整BPF带通滤波器ABC自动亮度控制BRIGHT亮度ABL自动亮度限制BRIGHTNESS亮度AC交流BROWN棕色ACC自动色度控制BUFFER缓冲器ACK自动消色BURST色同步信号ACOFF交流关机B/W黑/白ADD地址C色度(信号),电容ADJ调节,调整CAD计算机辅助设计AERIEL天线,安培CAM计算机辅助制造AFAMP音频放大器CANCELLER消除器AFC自动频率控制CASTLE沙堡AFT自动频率调整CATV天线电视AGC自动增益控制C-BAND C-波段AM调幅CCD电荷藕合器件AMP放大器CCTV闭路电视AMPLITUDE副度CD光盘APC自动相位控制,比较CENTER中央,中心AND与,与门CH频道,同道ATT衰减,衰减器CHG充电ATTENUATOR衰减器CHROMA色度信号AUDIO音频放大器CLAMP箝位AUTO自动CLAMPER箝位电路AUDIO-SLECT自动选择CLEAR消除器A V音,视频CLOCK时钟A V-IN音.视频输入COIL线圈A VR自动电压调整COIN符合B蓝色COLLECTOR集电极BAND波段COL彩色BAND-FILTER带通滤波器COLOR彩色BASE基极COLOR-DEM彩色,色度解调BASEBAND基带COMPENSATE补偿BASS低音CON对比度BASSAY加重低音CONTRASY对比度BBD斗链延迟器件CONT控制BD反相二极管CONTROL控制BDV击穿电压CONTROLLED被控,受控BEAM电子束流CONVERTER变换器BEAT差拍COR较正BEL-FILTER钟形滤波器COUNT-DOWN分频器BEMF反电动势CPU中央处理器BF反馈CRT显像管BFO反馈振荡器CTV彩色电视机BIAS偏置CUT-OFF截止,切断,关机BLACK黑色CVBS复合全电视信号BLACK-STRETCH黑电平扩展,延伸DAC数模转换器BLANKING消隐DAGC延迟式自动增益控制BLK消隐DAMPING阻尼BLUE蓝色DARK黑暗,暗的BOARD板DATA数据,资料DB分贝FM-DISCRI调频鉴频器DC直流,直接藕合FOCUS聚焦DECODE®解码器FORCED强制的DEFEAT失效,无输出FRAME帧DEFL偏转FREQUENCY频率DEGAUSSER消磁器FREQ-ADJ频率调整DELAY延迟FUNC功能,作用DEMOD解调器FSC色副载波频率DEMONSTRATE演示FUSE保险丝DEMODULATOR解调器G绿色DET检波GAIN增益DETECTOR检波器GATE门,选通DEVIDER除法器GB国标DG微分增益GENERATOR发生器DIFF微分,差动GND地DIFFER-AMP差动放大器GP门控脉冲DIP双列直插塑料封装GREEN绿色DIS放电H行.水平DISCR鉴频器HALF-TONE半色调控制D.L延迟线HAR谐波DLY延迟H.BLK行消隐DOWN向下H.COIN行同步DP微分相位H.DRIVE行推动DRAM动态随机存取存储器HEATER灯丝DRIVE激励,驱动HF高频DRIVER激励器,驱动级HFA高频放大器DY偏转线圈HF-AMP高频放大器EARTH接地,地线HFC高频扼流器ECHO混响,回声HI-Q高品质因数EHT超高压HFO高频振荡器EHV超高压H-LOCK行锁定EMITTER发射极HOLD同步,保持ENCODE编码HOLD-IN同步,保持ENCODER编码器HOR行,水平的E2PROM电可擦可编程只读存储器H.COUNTDOWN行分频器EVEN偶数HOR DRIVER行推动器,驱动器EXT外接HOR.OSC行振荡器E/W东/西(枕较)HP高通,大功率FB反馈H.PARABOLA行抛物波F频率HPF高通滤波器FAST快速HTR灯丝FBL快速消隐HUE色.色彩.色调FBP快速消隐脉冲HVPS高压电源FBT行输出变压器HW半波FEED.BACK反馈HZ赫兹FIG图IAGC瞬时动做的自动增益控制FILTER滤波器IA VC瞬时动做的自动音量控制FILP-FLOP双稳态触发器IC集成电路FLY.BACK逆程I2C>BUS I2C总线FM调频ID识别,鉴别FM.DET调频检波IDENT识别,鉴别IF中频LOCK锁定IFAMP中频放大器LOCK IN锁住,同步IFT中频变压器LOOP环路IMMR维修,修理LOOPER斩波器IMPULSE脉冲LOW低,弱的IN英寸LPF低通病滤波器INPUT输入LSO行稳定振荡器INH反时钟方向的ISP行同步脉冲INSERTION插入MAIN主板INSTL安装MAINT维修,保养INT内.内部的MANUAL手动INTERGRTON集成,积分MARK符号INTERFACE接口,接口电路MASK屏蔽掩膜INTERLACING隔行扫描MATCH匹配INTERMEDATE中间,中频MATRIX矩阵INTAG积分,集成MATRIXER矩阵变换电路INTMT间断的MAX最大INVTR变换器MBF调制器带通滤波器I/O输入,输出M-D调制_解调IQ.DEMOD IQ信号解调MEMORY记忆.存储器ISOLATOR绝缘体.隔离器MHZ兆赫兹JUMP,飞线MIC话筒,麦克风JUNC连接器.连接点MIX混频,混合JUNGLE混合式MIXER混频器K-BAND K.波段MODE模式.状态KEY键MODULATOR调制器带通滤波器KEY-BOARD键盘MODULE模块.组件KEY.CODER键盘编码器MONITOR监视器KILLER消色器MONOCHROME单色的KINE电视显像管MONOSTABLE单稳态KP键控脉冲MOS金属氧化物半导体KEY.PULSE键控脉冲MOSFET场效应管L(CH)左声道,左通道MOST晶体管LAYOUT布线.电路布局MP维修点LED发光二极管MPL维修部分清单LIGHT发光二极管MPO最大功率输出LINEAR线性MRR维护.更换LEVEL电频,水平MSB最高位L.C.R电感.电容.电阻MULTSTANDARD多制式LD激光视盘MULTI.SYSTEM多制式LFA|低频放大器MULTI-TAP多抽头,插头MUSIC音乐MUTE静音LFF|LFO低频振荡器MVB多频振荡器LIMITER限幅器MVC手动音亮调节LINEAR线.线路MVS最小视频信号LINE.WIDTH行幅.线宽NAND与非门LIST目录.一览表NB窄频带LIVC低输入变换器NBFM窄带调频LIVCR低输入变换器及稳压器NC空脚.不接LOAD负载.输入加载NEG负的.负极行NEW新的PCB印刷电路板NF负反馈PCM脉冲编码调制NOISE噪声PD电位器NORTH北方PEAK峰值NOT非PP峰峰值NOT.GATE非门PEAKED>AMP峰值放大器NR噪声抑制PEAK_DET峰值检波器NTC-UNIT负温度系数元件PEM脉冲编码调制NTSC NTSC制式PF皮法拉NTI电路杂音干扰PHASE相位O输出PHASE>DET相位检波OC开路PHASE.CONTROL相位控制OCB过载断路器PHASE.SHIFTER移相器OCL无耦合电容输出电路PHASOR彩色信息矢量OSC周期变化的彩色顺序PHILIPS飞利浦ODD奇数.单数PHONIC声音的,有声的ODD-EVEN奇偶的PIF图像中频IC集成电路资料]:专业术语常用名词缩写中英文对照A:Actuator执行器A:Amplifier放大器A:Attendance员工考勤A:Attenuation衰减AA:Antenna amplifier开线放大器AA:Architectural Acoustics建筑声学AC:Analogue Controller模拟控制器ACD:Automatic Call Distribution自动分配话务ACS:ACCess Control System出入控制系统AD:Addressable Detector地址探测器ADM:Add/Drop Multiplexer分插复用器ADPCM:Adaptive Differential ulse Code Modulation自适应差分脉冲编码调制AF:Acoustic Feedback声反馈AFR:Amplitude/Frequency Response幅频响应AGC:Automati Gain Control自动增益控制AHU:Air Handling Unit空气处理机组A-I:Auto-iris自动光圈AIS:Alarm InDICation Signal告警指示信号AITS:Acknowledged Information Transfer Service确认操作ALC:Automati Level Control自动平衡控制ALS:Alarm Seconds告警秒ALU:Analogue Lines Unit模拟用户线单元AM:Administration Module管理模块AN:ACCess Network接入网ANSI:American National Standards Institute美国国家标准学会APS:Automatic Protection Switching自动保护倒换ASC:Automati Slope Control自动斜率控制ATH:Analogue Trunk Unit模拟中继单元ATM:Asynchrous Transfer Mode异步传送方式AU-PPJE:AU Pointer Positive Justification管理单元正指针调整AU:Administration Unit管理单元AU-AIS:Administrative Unit Alarm InDICation SignalAU告警指示信号AUG:Administration Unit Group管理单元组AU-LOP:Loss of Administrative Unit Pointer AU指针丢失AU-NPJE:AU Pointer Negative Justification管理单元负指针调整AUP:Administration Unit Pointer管理单元指针AVCD:Auchio&Video Control Device音像控制装置AWG:American Wire Gauge美国线缆规格BA:Bridge Amplifier桥接放大器BAC:Building Automation&Control net建筑物自动化和控制网络BAM:Background Administration Module后管理模块BBER:Background BLOCk Error Ratio背景块误码比BCC:B-channel Connect ControlB通路连接控制BD:Building DistributorBEF:Buiding Entrance Facilities建筑物入口设施BFOC:Bayonet Fibre Optic Connector大口式光纤连接器BGN:Background Noise背景噪声BGS:Background SOund背景音响BIP-N:Bit Interleaved Parity N code比特间插奇偶校验N位码B-ISDN:Brand band ISDN宽带综合业务数字网B-ISDN:Broad band-Integrated Services Digital Network宽带综合业务数字网BMC:Burst Mode Controller突发模式控制器BMS:Building Management System智能建筑管理系统BRI:Basic Rate ISDN基本速率的综合业务数字网BS:Base Station基站BSC:Base Station Controller基站控制器BUL:Back up lighting备用照明C/S:Client/Server客户机/服务器C:Combines混合器C:Container容器CA:Call ACCounting电话自动计费系统CATV:Cable Television有线电视CC:Call Control呼叫控制CC:Coax cable同轴电缆CCD:Charge coupled devices电荷耦合器件CCF:Cluster Contril Function簇控制功能CD:Campus Distributor建筑群配线架CD:Combination detector感温,感烟复合探测器CDCA:Continuous Dynamic Channel Assign连续的动态信道分配CDDI:Copper Distributed Data合同缆分布式数据接口CDES:Carbon dioxide extinguisbing system二氧化碳系统CDMA:Code Division Multiplex ACCess码分多址CF:Core Function核心功能CFM:Compounded Frequency Modulation压扩调频繁CIS:Call Information System呼叫信息系统CISPR:Internation Special Conmittee On Radio Interference国际无线电干扰专门委员会CLNP:Connectionless Network Protocol无连接模式网络层协议CLP:Cell Loss Priority信元丢失优先权CM:Communication Module通信模块CM:Configuration Management配置管理CM:Cross-connect Matrix交叉连接矩阵CMI:Coded Mark Inversion传号反转码CMISE:Common Management Information Service公用管理信息协议服务单元CPE:Convergence protocol entity会聚协议实体CR/E:Card reader/Encoder(Ticket reader)卡读写器/编码器CRC:Cyclic Redundancy Check循环冗佘校验CRT:Cathode Ray Tabe显示器,监视器,阴极射线管CS:Convergence service会聚服务CS:Cableron Spectrum旧纳档块化技术CS:Ceiling Screen挡烟垂壁CS:Convergence Sublayer合聚子层CSC:Combined Speaker Cabinet组合音响CSCW:Computer supported collaborative work计算机支持的协同工作CSES:Continuius Severely Errored Second连续严重误码秒CSF:Cell Site Function单基站功能控制CTB:Composite Triple Beat复合三价差拍CTD:Cable Thermal Detector缆式线型感温探测器CTNR:carrier to noise ratio载波比CW:Control Word控制字D:Directional指向性D:Distortion失真度D:Distributive分布式DA:Distribution Amplifier分配的大器DBA:Database Administrator数据库管理者DBCSN:Database Control System Nucleus数据库控制系统核心DBOS:Database Organizing System数据库组织系统DBSS:Database Security System数据库安全系统DC:Door Contacts大门传感器DCC:Digital Communication Channel数字通信通路DCN:Data Communication Network数据通信网DCP-I:Distributed Control Panel-Intelligent智能型分散控制器DCS:Distributed Control System集散型控制系统DDN:Digital Data Network数字数据网DDS:Direct Dignital Controller直接数字控制器DDW:Data Describing Word数据描述字DECT:Digital Enhanced Cordless Telecommunication增强数字无绳通讯DFB:Distributed Feedback分布反馈DID:Direct Inward Dialing直接中继方式,呼入直拨到分机用户DLC:Data Link Control Layer数据链路层DLI:DECT Line InterfaceDODI:Direct Outward Dialing One一次拨号音DPH:DECT PhoneDRC:Directional Response Cahracteristics指向性响应DS:Direct SOund直正声DSP:Digital signal Processing数字信号处理DSS:Deiision Support System决策支持系统DTMF:Dual Tone Multi-Frequency双音多频DTS:Dual-Technology SenSOr双鉴传感器DWDM:Dense Wave-length Division Multiplexing密集波分复用DXC:Digital Cross-Connect数字交叉连接E:Emergency lighting照明设备E:Equalizer均衡器E:Expander扩展器EA-DFB:Electricity AbSOrb-Distributed Feedback电吸收分布反馈ECC:Embedded Control Channel嵌入或控制通道EDFA:Erbium-Doped Fiber Amplifier掺饵光纤放大器EDI:Electronic Data Interexchange电子数据交换EIC:Electrical Impedance Characteristics电阻抗特性EMC:Electro Magnetic Compatibiloty电磁兼容性EMI:Electro Magnetic Interference电磁干扰EMS:Electromagnetic Sensitibility电磁敏感性EN:Equivalent Noise等效噪声EP:Emergency Power应急电源ES:Emergency SOoket应急插座ES:Evacuation Sigvial疏散照明ESA:Error SecondA误码秒类型AESB:ErrorSecondB误码秒类型BESD:Electrostatic Discharge静电放电ESR:Errored Second Ratio误码秒比率ETDM:Electrical Time Division Multiplexing电时分复用ETSI:European Telecommunication Standards Institute欧洲电信标准协会F:Filter滤波器FAB:Fire Alarm Bell火警警铃FACU:Fire Alarm Contrlol Unit火灾自动报警控制装置FC:Failure Count失效次数FC:Frequency Converter频率变换器FCC:Fire Alarm System火灾报警系统FCS:Field Control System现场总线FCU:Favn Coil Unit风机盘管FD:Fire Door防火门FD:Flame Detector火焰探测器FD:Floor DistributorFD:Frequency Dirsder分频器FDD:Frequency Division Dual频分双工FDDI:Fiberdistributed Data Interface光纤缆分布式数据接口。
集成电路(integrated circuit)是一种微型电子器件或部件。
采用一定的工艺,把一个电路中所需的晶体管、二极管、电阻、电容和电感等元件及布线互连一起,制作在一小块或几小块半导体晶片或介质基片上,然后封装在一个管壳内,成为具有所需电路功能的微型结构;其中所有元件在结构上已组成一个整体,使电子元件向着微小型化、低功耗和高可靠性方面迈进了一大步。
它在电路中用字母“IC”表示。
集成电路发明者为杰克·基尔比(基于硅的集成电路)和罗伯特·诺伊思(基于锗的集成电路)。
当今半导体工业大多数应用的是基于硅的集成电路。
定义集成电路(Integrated Circuit,简称IC)是20世纪60年代初期发展起来的一种新型半导体器件。
它是经过氧化、光刻、扩散、外延、蒸铝等半导体制造工艺,把构成具有一定功能的电路所需的半导体、电阻、电容等元件及它们之间的连接导线全部集成在一小块硅片上,然后焊接封装在一个管壳内的电子器件。
其封装外壳有圆壳式、扁平式或双列直插式等多种形式。
编辑本段特点集成电路或称微电路(microcircuit)、微芯片(microchip)、芯片(chip)在电子学中是一种把电路(主要包括半导体装置,也包括被动元件等)小型化的方式,并通常制造在半导体晶圆表面上。
前述将电路制造在半导体芯片表面上的集成电路又称薄膜(thin-film)集成电路。
另有一种厚膜(thick-film)混成集成电路(hybrid integrated circuit)是由独立半导体设备和被动元件,集成到衬底或线路板所构成的小型化电路。
本文是关于单片(monolithic)集成电路,即薄膜集成电路。
集成电路具有体积小,重量轻,引出线和焊接点少,寿命长,可靠性高,性能好等优点,同时成本低,便于大规模生产。
它不仅在工、民用电子设备如收录机、电视机、计算机等方面得到广泛的应用,同时在军事、通讯、遥控等方面也得到广泛的应用。
集成电路的英文简称大写集成电路的英文简称大写为IC,即Integrated Circuit。
以下是集成电路相关的内容:一、什么是集成电路集成电路是将许多电子部件集成在一块半导体芯片上的电路。
它具有体积小、功耗低、性能稳定等优点,广泛应用于电子设备中。
二、集成电路的分类1. 按照集成度分类:(1)SSI(Small Scale Integration),小规模集成电路;(2)MSI(Medium Scale Integration),中规模集成电路;(3)LSI(Large Scale Integration),大规模集成电路;(4)VLSI(Very Large Scale Integration),超大规模集成电路。
2. 按照工艺分类:(1)Bipolar工艺,双极型工艺;(2)CMOS工艺,互补金属氧化物半导体工艺;(3)BiCMOS工艺,双极型和CMOS混合工艺。
3. 按照用途分类:(1)数字集成电路,用于数字信号处理;(2)模拟集成电路,用于模拟信号处理;(3)混合集成电路,数字和模拟信号处理均可。
三、集成电路的应用领域1. 通信领域:移动通信、宽带网络、卫星通信、光纤通信等;2. 计算机领域:CPU、内存控制芯片、芯片组等;3. 汽车电子领域:车载导航、车载娱乐、车辆控制等;4. 家电领域:智能家居、电视机、音响、制冷空调等;5. 医疗领域:检测仪器、医疗器械、假肢等;6. 工业控制领域:自动化生产线、智能工厂等。
四、集成电路产业的发展趋势1. 小型化、高集成度;2. 功能多样化、高性能;3. 高可靠、低功耗、低成本;4. 异构集成、自适应;5. 数据中心、云计算、人工智能等新兴领域的出现。
五、集成电路发展中的挑战和机遇1. 次微米工艺下的瓶颈;2. 人工智能等新领域的机遇;3. 新产业的竞争与合作。
六、结语集成电路是现代电子产业中的关键技术之一,其发展对于电子产业的发展具有重要意义。
集成电路的英文:integrated circuit简称:IC集成电路的定义IC就是半导体元件产品的统称。
包括:1.集成电路板(integrated circuit,缩写:IC);2.二、三极管;3.特殊电子元件。
再广义些讲还涉及所有的电子元件,象电阻,电容,电路版/PCB版,等许多相关产品。
集成电路产业发展与变革自1958年美国德克萨斯仪器公司(TI)发明集成电路(IC)后,随着硅平面技术的发展,二十世纪六十年代先后发明了双极型和MOS型两种重要的集成电路,它标志着由电子管和晶体管制造电子整机的时代发生了量和质的飞跃,创造了一个前所未有的具有极强渗透力和旺盛生命力的新兴产业集成电路产业。
回顾集成电路的发展历程,我们可以看到,自发明集成电路至今40多年以来,"从电路集成到系统集成"这句话是对IC产品从小规模集成电路(SSI)到今天特大规模集成电路(ULSI)发展过程的最好总结,即整个集成电路产品的发展经历了从传统的板上系统(System-on-board)到片上系统(System-on-a -chip)的过程。
在这历史过程中,世界IC产业为适应技术的发展和市场的需求,其产业结构经历了三次变革。
第一次变革:以加工制造为主导的IC产业发展的初级阶段。
70年代,集成电路的主流产品是微处理器、存储器以及标准通用逻辑电路。
这一时期IC制造商(ID M)在IC市场中充当主要角色,IC设计只作为附属部门而存在。
这时的IC设计和半导体工艺密切相关。
IC设计主要以人工为主,CAD系统仅作为数据处理和图形编程之用。
IC产业仅处在以生产为导向的初级阶段。
第二次变革:Foundry公司与IC设计公司的崛起。
80年代,集成电路的主流产品为微处理器(MPU)、微控制器(MCU)及专用IC(ASIC)。
这时,无生产线的IC设计公司(Fabless)与标准工艺加工线(Foundry)相结合的方式开始成为集成电路产业发展的新模式。
Integrated Circuits集成电路The Integrated CircuitDigital logic and electronic circuits derive their functionality from electronic switches called transistor. (数字逻辑和电子电路由称为晶体管的电子开关得到它们的(各种)功能。
)Roughly speaking, the transistor can be likened to an electronically controlled valve whereby ener gy applied to one connection of the valve enables energy to flow between two other connections .By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops ar e formed. Transistors, in turn, are made from semiconductors. (粗略地说,晶体管好似一种电子控制阀,由此加在阀一端的能量可以使能量在另外两个连接端之间流动。
通过多个晶体管的组合就可以构成数字逻辑模块,如与门和触发电路等。
而晶体管是由半导体构成的。
)Consult a periodic table of elements in a college chemistry textbook, and you will locate semicon ductors as a group of elements separating the metals and nonmetals.They are called semiconduct ors because of their ability to behave as both metals and nonmetals.(查阅大学化学书中的元素周期表,你会查到半导体是介于金属与非金属之间的一类元素。
集成电路概念什么是集成电路集成电路(Integrated Circuit,简称IC)是指在一个芯片上集成了多个电子元件(如晶体管、电阻器、电容器等)及其相互连接的电路。
通过将各个电子元件静止地安装在单个半导体片上,集成电路能够在极小的空间内实现大量的电子功能。
集成电路的发明使得电子设备变得更加小巧、高效、可靠。
集成电路的演进DTL和TTL电路早期的数字电路多采用离散元件的组合实现,如二极管、晶体管、电阻、电容等。
其中,数字转换器就是由大量的二极管和晶体管组成,体积庞大、功耗高、可靠性差。
后来,出现了扩散技术、烧结技术和高速缓冲技术,推动了数字电路的发展。
MOS和CMOS电路20世纪60年代,MOS(Metal-Oxide-Semiconductor)技术得到了广泛应用。
相比于DTL和TTL电路,MOS电路在功耗和集成度上有了显著的改进。
后来,结合MOS 技术和CMOS(Complementary Metal-Oxide-Semiconductor)技术的发展,使得集成电路在功耗、速度和可靠性上都有了重大突破。
VLSI和超大规模集成电路20世纪70年代,VLSI(Very Large Scale Integration)技术的出现使得集成度进一步提高。
VLSI技术允许数百个到数十亿个晶体管集成在一个芯片上,极大地提升了集成电路的功能和效率。
从此,计算机技术、通信技术、消费电子等领域迎来了飞速的发展。
ULSI和超超大规模集成电路随着半导体工艺的不断进步,集成度再次得到提高。
20世纪90年代,ULSI (Ultra Large Scale Integration)技术的出现使得集成电路上能容纳数十亿到数万亿个晶体管,并逐渐发展到超超大规模集成电路(GSI,Giga-scale Integration)的阶段。
这使得现代电子设备如智能手机、平板电脑等能够在极小的体积内实现强大的功能。
集成电路的分类根据功能、结构和工艺的不同,集成电路可以分为多种类型。
【集成电路(IC)】电子专业术语英汉对照加注解电子专业英语术语★rchitecture(结构):可编程集成电路系列的通用逻辑结构。
★ASIC(Application Specific Integrated Circuit-专用集成电路):适合于某一单一用途的集成电路产品。
★ATE(Automatic Test EQUIPment-自动测试设备):能够自动测试组装电路板和用于莱迪思ISP 器件编程的设备。
★BGA(Ball Grid Array-球栅阵列):以球型引脚焊接工艺为特征的一类集成电路封装。
可以提高可加工性,减小尺寸和厚度,改善了噪声特性,提高了功耗管理特性。
★Boolean Equation(逻辑方程):基于逻辑代数的文本设计输入方法。
★Boundary Scan Test(边界扫描测试):板级测试的趋势。
为实现先进的技术所需要的多管脚器件提供了较低的测试和制造成本。
★Cell-Based PLD(基于单元的可编程逻辑器件):混合型可编程逻辑器件结构,将标准的复杂的可编程逻辑器件(CPLD)和特殊功能的模块组合到一块芯片上。
★CMOS(Complementary Metal Oxide Semiconductor-互补金属氧化物半导体):先进的集成电路★加工工艺技术,具有高集成、低成本、低能耗和高性能等特征。
CMOS 是现在高密度可编程逻辑器件(PLD)的理想工艺技术。
★CPLD(Complex Programmable Logic Device-复杂可编程逻辑器件):高密度的可编程逻辑器件,包含通过一个中央全局布线区连接的宏单元。
这种结构提供高速度和可预测的性能。
是实现高速逻辑的理想结构。
理想的可编程技术是E2CMOS?。
★Density (密度):表示集成在一个芯片上的逻辑数量,单位是门(gate)。
密度越高,门越多,也意味着越复杂。
★Design Simulation(设计仿真):明确一个设计是否与要求的功能和时序相一致的过程。
集成电路(integrated circuit)是一种微型电子器件或部件。
采用一定的工艺,把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起,制作在一小块或几小块半导体晶片或介质基片上,然后封装在一个管壳内,成为具有所需电路功能的微型结构;其中所有元件在结构上已组成一个整体,使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。
它在电路中用字母IC表示。
集成电路发明者为杰克▪基尔比(基于锗(Ge)的集成电路)和罗伯特▪诺伊思(基于硅(Si)的集成电路)。
当今半导体工业大多数应用的是基于硅的集成电路。
集成电路,英文为Integrated Circuit,缩写为IC;顾名思义,就是把一定数量的常用电子元件,如电阻、电容、晶体管等,以及这些元件之间的连线,通过半导体工艺集成在一起的具有特定功能的电路。
是20世纪50年代后期一60年代发展起来的一种新型半导体器件。
它是经过氧化、光刻、扩散、外延、蒸铝等半导体制造工艺,把构成具有一定功能的电路所需的半导体、电阻、电容等元件及它们之间的连接导线全部集成在一小块硅片上,然后焊接封装在一个管壳内的电子器件。
其封装外壳有圆壳式、扁平式或双列直插式等多种形式。
集成电路技术包括芯片制造技术与设计技术,主要体现在加工设备,加工工艺,封装测试,批量生产及设计创新的能力上。
为什么会产生集成电路?我们知道任何发明创造背后都是有驱动力的,而驱动力往往来源于问题。
那么集成电路产生之前的问题是什么呢?我们看一下1942年在美国诞生的世界上第一台电子计算机,它是一个占地150平方米、重达30吨的庞然大物,里面的电路使用了17468只电子管、7200只电阻、10000只电容、50万条线,耗电量150千瓦。
显然,占用面积大、无法移动是它最直观和突出的问题;如果能把这些电子元件和连线集成在一小块载体上该有多好!我们相信,有很多人思考过这个问题,也提出过各种想法。
典型的如英国雷达研究所的科学家达默,他在1952年的一次会议上提出:可以把电子线路中的分立元器件,集中制作在一块半导体晶片上,一小块晶片就是一个完整电路,这样一来,电子线路的体积就可大大缩小,可靠性大幅提高。
Integrated circuit (IC)IntroducionIntegrated circuit also called microelectronic circuit or chip an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices (e.g., transistors and diodes) and passive devices (e.g., capacitors and resistors) and their interconnections are built up on a thin substrate of semiconductor material (typically silicon). The resulting circuit is thus a small monolithic “chip,” which may be as small as a few square centimetres or only a few square millimetres. The individual circuit components are generally microscopic in size.Integrated circuits have their origin in the invention of the transistor in 1947 by William B. Shockley and his team at the American Telephone and Telegraph Company's Bell Laboratories. Shockley's team (including John Bardeen and Walter H. Brattain) found that, under the right circumstances, electrons would form a barrier at the surface of certain crystals, and they learned to control the flow of electricity through the crystal by manipulating this barrier. Controlling electron flow through a crystal allowed the team to create a device that could perform certain electrical operations, such as signal amplification, that were previously done by vacuum tubes. They named this device a transistor, from a combination of the words transfer and resistor (see photograph). The study of methods of creating electronic devices using solid materials became known as solid-state electronics. Solid-state devices proved to bemuch sturdier, easier to work with, more reliable, much smaller, and less expensive than vacuum tubes.Using the same principles and materials, engineers soon learned to create other electrical components, such as resistors and capacitors. Now that electrical devices could be made so small, the largest part of a circuit was the awkward wiring between the devices.In 1958 Jack Kilby of Texas Instruments, Inc., and Robert Noyce of Fairchild Semiconductor Corporation independently thought of a way to reduce circuit size further. They laid very thin paths of metal (usually aluminum or copper) directly on the same piece of material as their devices. These small paths acted as wires. With this technique an entire circuit could be “integrated” on a single piece of sol id material and an integrated circuit (IC) thus created. ICs can contain hundreds of thousands of individual transistors on a single piece of material the size of a pea. Working with that many vacuum tubes would have been unrealistically awkward and expensive. The invention of the integrated circuit made technologies of the Information Age feasible. ICs are now used extensively in all walks of life, from cars to toasters to amusement park rides.Basic IC typesAnalog versus digital circuitsAnalog, or linear, circuits typically use only a few components and are thus some of the simplest types of ICs. Generally, analog circuits are connected to devices that collect signals from the environment or send signals back to theenvironment. For example, a microphone converts fluctuating vocal sounds into an electrical signal of varying voltage. An analog circuit then modifies the signal in some useful way—such as amplifying it or filtering it of undesirable noise. Such a signal might then be fed back to a loudspeaker, which would reproduce the tones originally picked up by the microphone.Another typical use for an analog circuit is to control some device in response to continual changes in the environment. For example, a temperature sensor sends a varying signal to a thermostat, which can be programmed to turn an air conditioner, heater, or oven on and off once the signal has reached a certain value.A digital circuit, on the other hand, is designed to accept only voltages of specific given values. A circuit that uses only two states is known as a binary circuit. Circuit design with binary quantities, “on” and “off” representing 1 and 0 (i.e., true and false), uses the logic of Boolean algebra. The three basic logic functions—NOT, AND, and OR—together with their truth tables are given in the figure. (Arithmetic is also performed in the binary number system employing Boolean algebra.) These basic elements are combined in the design of ICs for digital computers and associated devices to perform the desired functions.Microprocessor circuitsMicroprocessors are the most complicated ICs. They are composed of millions of transistors that have been configuredas thousands of individual digital circuits, each of which performs some specific logic function. A microprocessor is built entirely of these logic circuits synchronized to each other.Just like a marching band, the circuits perform their logic function only on direction by the bandmaster. The bandmaster in a microprocessor, so to speak, is called the clock. The clock is a signal that quickly alternates between two logic states. Every time the clock changes state, every logic circuit in the microprocessor does something. Calculations can be made very quickly, depending on the speed (“clock frequency”) of the microprocessor.Microprocessors contain some circuits, known as registers, that store information. Registers are predetermined memory locations. Each processor has many different types of registers. Permanent registers are used to store the preprogrammed instructions required for various operations (such as addition and multiplication). Temporary registers store numbers that are to be operated on and also the result. Other examples of registers include the “program counter,” the “stack pointer,” and the “address” register.Microprocessors can perform millions of operations per second on data. In addition to computers, microprocessors are common in video game systems, televisions, cameras, and automobiles.Memory circuitsMicroprocessors typically have to store more data than can be held in a few registers. This additional information isrelocated to special memory circuits. Memory is composed of dense arrays of parallel circuits that use their voltage states to store information. Memory also stores the temporary sequence of instructions, or program, for the microprocessor. Manufacturers continually strive to reduce the size of memory circuits—to increase capability without increasing space. In addition, smaller components typically use less power, operate more efficiently, and cost less to manufacture.Digital signal processorsA signal is an analog waveform—anything in the environment that can be captured electronically. A digital signal is an analog waveform that has been converted into a series of binary numbers for quick manipulation. As the name implies, a digital signal processor (DSP) processes signals digitally, as patterns of 1s and 0s. For instance, using an analog-to-digital converter, commonly called an A-to-D or A/D converter, a recording of someone's voice can be converted into digital 1s and 0s. The digital representation of the voice can then be modified by a DSP using complex mathematical formulas. For example, the DSP algorithm in the circuit may be configured to recognize gaps between spoken words as background noise and digitally remove ambient noise from the waveform. Finally, the processed signal can be converted back (by a D/A converter) into an analog signal for listening. Digital processing can filter out background noise so fast that there is no discernible delay and the signal appears to be heard in “real time.” For instance, such processing enables “live” televisionbroadcasts to focus on a quarterback's signals in an American gridiron football game. DSPs are also used to produce digital effects on live television. For example, the yellow marker lines displayed during the football game are not really on the field; a DSP adds the lines after the cameras shoot the picture but before it is broadcast. Similarly, some of the advertisements seen on stadium fences and billboards during televised sporting events are not really there.Application-specific ICsAn application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternate instructions.Radio-frequency ICsRadio-frequency ICs (RFICs) are rapidly gaining importance in cellular telephones and pagers. RFICs are analog circuits that usually run in the frequency range of 900 MHz to 2.4 GHz (900 million hertz to 2.4 billion hertz). They are usually thought of as ASICs even though some may be configurable for several similar applications. Most semiconductor circuits that operate above 500 MHz cause the electronic components and their connecting paths to interferewith each other in unusual ways. Engineers must use special design techniques to deal with the physics of high-frequency microelectronic interactions.Microwave monolithic ICsA special type of RFIC is known as a microwave monolithic IC (MMIC). These circuits run in the 2.4- to 20-GHz range, or microwave frequencies, and are used in radar systems, in satellite communications, and as power amplifiers for cellular telephones.Just as sound travels faster through water than through air, electron velocity is different through each type of semiconductor material. Silicon offers too much resistance for microwave-frequency circuits, and so the compound gallium arsenide (GaAs) is often used for MMICs. Unfortunately, GaAs is mechanically much less sound than silicon. It breaks easily, so GaAs wafers are usually much more expensive to build than silicon wafers.Basic semiconductor designAny material can be classified as one of three types: conductor, insulator, or semiconductor. A conductor (such as copper or salt water) can easily conduct electricity because it has an abundance of free electrons. An insulator (such as ceramic or dry air) conducts electricity very poorly because it has few or no free electrons. A semiconductor (such as silicon or gallium arsenide) is somewhere between a conductor and aninsulator. It is capable of conducting some electricity, but not much.Basic semiconductor designDoping siliconMost ICs are made of silicon, which is abundant in ordinary beach sand. Pure crystalline silicon, as with other semiconducting materials, has a very high resistance to electrical current at normal room temperature. However, with the addition of certain impurities, known as dopants, the silicon can be made to conduct usable currents. In particular, the doped silicon can be used as a switch, turning current off and on as desired.The process of introducing impurities is known as doping or implantation. Depending on a dopant's atomic structure, the result of implantation will be either an n-type (negative) or a p-type (positive) semiconductor. An n-type semiconductor results from implanting dopant atoms that have more electrons in their outer (bonding) shell than silicon, as shown in the figure. The resulting semiconductor crystal contains excess, or free, electrons that are available for conducting current. A p-type semiconductor results from implanting dopant atoms that have fewer electrons in their outer shell than silicon. The resulting crystal contains “holes” in its bonding structure where electrons would normally be located. In essence, such holes can move through the crystal conducting positive charges.Basic semiconductor designThe p-n junctionA p-type or an n-type semiconductor is not very useful on its own. However, joining these opposite materials creates what is called a p-n junction. A p-n junction forms a barrier to conduction between the materials. Although the electrons in the n-type material are attracted to the holes in the p-type material, the electrons are not normally energetic enough to overcome the intervening barrier. However, if additional energy is provided to the electrons in the n-type material, they will be capable of crossing the barrier into the p-type material—and current will flow. This additional energy can be supplied by applying a positive voltage to the p-type material,as shown in the figure. The negatively charged electrons will then be highly attracted to the positive voltage across the junction.A p-n junction that conducts electricity when energy is added to the n material is called forward-biased because the electrons move forward into the holes. If voltage is applied in the opposite direction—a positive voltage connected to the n side of the junction—no current will flow. The electrons in the n material will still be attracted to the positive voltage, but the voltage will now be on the same side of the barrier as the electrons. In this state a junction is said to be reverse-biased. Since p-n junctions conduct electricity in only one direction, they are a type of diode. Diodes are essential building blocks of semiconductor switches.Basic semiconductor designField-effect transistorsBringing a negative voltage close to the centre of a long strip of n-type material will repel nearby electrons in the material and thus form holes—that is, transform some of the strip in the middle to p-type material. This change in polarity utilizing an electric field gives the field-effect transistor its name. (See animation.) While the voltage is being applied, there will exist two p-n junctions along the strip, from n to p and then from p back to n. One of the two junctions will always be reverse-biased. Since reverse-biased junctions cannot conduct, current cannot flow through the strip. The field effect can be used to create a switch (transistor) to turn current off and on, simply by applying and removing a small voltage nearby in order to create or destroy reverse-biased diodes in the material.A transistor created by using the field effect is called a field-effect transistor (FET).The location where the voltage is applied is known as a gate. The gate is separated from the transistor strip by a thin layer of insulation to prevent it from short-circuiting the flow of electrons through the semiconductor from an input (source) electrode to an output (drain) electrode. Similarly, a switch can be made by placing a positive gate voltage near a strip of p-type material. A positive voltage attracts electrons and thus forms a region of n within a strip of p. This again creates two p-n junctions, or diodes. As before, one of the diodes will always be reverse-biased and will stop current from flowing. FETs are good for building logic circuits because they require only a small current during switching. No current is required for holding the transistor in an on or off state; a voltage willmaintain the state. This type of switching helps preserve battery life. A field-effect transistor is called unipolar (from “one polarity”) because the main conduction method is either holes or electrons, not both.Basic semiconductor designEnhancement mode FETsThere are two basic types of field-effect transistors. The type described previously is a depletion mode FET, since a region is depleted of its natural charge. The field effect can also be used to create what is called an enhancement mode FET by enhancing a region to appear similar to its surrounding regions.An n-type enhancement mode FET is made from two regions of n-type material separated by a small region of p. As this FET naturally contains two p-n junctions—two diodes—it is normally switched off. However, when a positive voltage is placed on the gate, the voltage attracts electrons and creates n-type material in the middle region, filling the gap that was previously p-type material, as shown in the animation. The gate voltage thus creates a continuous region of n across the entire strip, allowing current to flow from one side to the other. This turns the transistor on. Similarly, a p-type enhancement mode FET can be made from two regions of p-type material separated by a small region of n. The gate voltage required for turning on this transistor is negative. Enhancement mode FETs switch faster than depletion mode FETs because they require a change only near the surface under the gate, rather than all the way through the material, as shown in the figure.Basic semiconductor designComplementary metal-oxide semiconductorsRecall that placing a positive voltage at the gate of an n-type enhanced mode FET will turn the switch on. Placing the same voltage at the gate of a p-type enhanced mode FET will turn the switch off. Likewise, placing a negative voltage at the gate will turn the n-type off and the p-type on. These FETs always respond in opposite, or complementary, fashion to a given gate voltage. Thus, if the gates of an n-type and a p-type FET are connected, any voltage applied to the common gate will operate the complementary pair, turning one on and leaving the other off. A semiconductor that pairs n- and p-type transistors this way is called a complementary metal-oxide semiconductor (CMOS). Because complementary transistor pairs can quickly switch between two logic states, CMOSs are very useful in logic circuits. In particular, because only one circuit is on at any time, CMOSs require less power and are often used for battery-powered devices, such as in digital cameras, and for the special memory that holds the date, time, and system parameters in personal computers.Basic semiconductor designBipolar transistorsBipolar transistors simultaneously use holes and electrons to condu ct, hence their name (from “two polarities”). Like FETs, bipolar transistors contain p- and n-type materials configured ininput, middle, and output regions. In bipolar transistors, however, these regions are referred to as the emitter, the base, and the collector. Instead of relying, as FETs do, on a secondary voltage source to change the polarity beneath the gate (the field effect), bipolar transistors use a secondary voltage source to provide enough energy for electrons to punch through the reverse-biased base-collector junction (see figure). As the electrons are energized, they jump into the collector and complete the circuit. Note that even with highly energetic electrons, the middle section of p-type material must be extremely thin for the electrons to pass through both junctions.Designing ICsAll ICs use the same basic principles of voltage (V), current (I), and resistance (R). In particular, equations based on Ohm's law, V = IR, determine many circuit design choices. Design engineers must also be familiar with the properties of various electronic components needed for different applications.Designing ICsAnalog designAs mentioned earlier, an analog circuit takes an infinitely variable real-world voltage or current and modifies it in some useful way. The signal might be amplified, compared with another signal, mixed with other signals, separated from other signals, examined for value, or otherwise manipulated. For the design of this type of circuit, the choice of every individualcomponent, size, placement, and connection is crucial. Unique decisions abound—for instance, whether one connection should be slightly wider than another connection, whether one resistor should be oriented parallel or perpendicular to another, or whether one wire can lie over the top of another. Every small detail affects the final performance of the end product. When integrated circuits were much simpler, component values could be calculated by hand. For instance, a specific amplification value (gain) of an amplifier could typically be calculated from the ratio of two specific resistors. The current in the circuit could then be determined, using the resistor value required for the amplifier gain and the supply voltage used. As designs became more complex, laboratory measurements were used to characterize the devices. Engineers drew graphs of device characteristics across several variables and then referred to those graphs as they needed information for their calculations. As scientists improved their characterization of the intricate physics of each device, they developed complex equations that took into account subtle effects that were not apparent from coarse laboratory measurements. For example, a transistor works very differently at different frequencies, sizes, orientations, and placements. In particular, scientists found parasitic components (unwanted effects, usually resistance and capacitance) that are inherent in the way the devices are built.Designing ICsDigital designSince digital circuits involve millions of times as manycomponents as analog circuits, much of the design work is done by copying and reusing the same circuit functions, especially by using digital design software that contains libraries of prestructured circuit components. The components available in such a library are of similar height, contain contact points in predefined locations, and have other rigid conformities so that they fit together regardless of how the computer configures a layout. While SPICE is perfectly adequate for analyzing analog circuits, with equations that describe individual components, the complexity of digital circuits requires a less-detailed approach. Therefore, digital analysis software ignores individual components for mathematical models of entire preconfigured circuit blocks (or logic functions).Whether analog or digital circuitry is used depends on the function of a circuit. The design and layout of analog circuits are more demanding of teamwork, time, innovation, and experience, particularly as circuit frequencies get higher, though skilled digital designers and layout engineers can be of great benefit in overseeing an automated process as well. Digital design emphasizes different skills from analog design.集成电路(IC)引言集成电路也称为微电子电路或芯片的电子元件,作为一个单元,其中微型有源器件(如晶体管和二极管)和无源器件(例如,电容器和电阻器)和他们的互连是建立在制造薄基板的半导体材料(通常是硅)。
什么是集成电路和它的分类集成电路(Integrated Circuit,简称IC)是现代电子技术中的一项重要成果,也是电子设备发展的基础。
它是将数百至数十亿个电子器件以及被连接的元件封装在一个非常小的半导体芯片上,并且在芯片上完成电子器件的制造、连接和组合。
在集成电路中,电子器件可以是晶体管、二极管、电阻器等,它们的功能是通过电流或电压进行控制和传输。
集成电路的分类通常可以根据不同的标准进行,下面将从不同的角度对集成电路进行分类。
一、按集成度分类1. 小规模集成电路(Small Scale Integration,简称SSI):SSI通常指电路规模在10至100个晶体管之间的集成电路。
这种集成电路主要用于一些简单而又特定的功能模块,如门电路、触发器等。
2. 中规模集成电路(Medium Scale Integration,简称MSI):MSI 是指电路规模在100至1000个晶体管之间的集成电路。
这类集成电路主要用于一些功能较为复杂的模块,如计数器、暂存器等。
3. 大规模集成电路(Large Scale Integration,简称LSI):LSI一般指电路规模在1000至1万个晶体管之间的集成电路。
这类集成电路可以实现更复杂的功能,如微处理器、存储器等。
4. 超大规模集成电路(Very Large Scale Integration,简称VLSI):VLSI是指电路规模在1万至100万个晶体管之间的集成电路。
这类集成电路拥有更高的综合集成度,可以实现更为复杂的功能,如系统芯片、ASIC芯片等。
5. 超超大规模集成电路(Ultra Large Scale Integration,简称ULSI):ULSI是指电路规模在100万个晶体管以上的集成电路。
这类集成电路能够实现更加复杂和多样化的功能需求,如高性能处理器、高容量存储器等。
二、按功能分类1. 数字集成电路(Digital Integrated Circuit):数字集成电路中的电子器件用于处理离散的数字信号,通过逻辑门实现二进制数据的处理和运算。
集成电路概念集成电路(Integrated Circuit,简称IC)是指将多个电子元件(如晶体管、电容、电阻等)集成在一块半导体晶片上的技术和产品。
它是现代电子技术中不可或缺的核心部分,广泛应用于各个领域,包括计算机、通信、医疗、汽车等。
一、集成电路的发展历程1. 单片集成电路(SSI)时代在20世纪60年代初,集成电路的概念首次被提出。
当时的集成电路规模非常小,只能容纳几个晶体管和一些基本元件。
这种集成电路应用于数字和模拟电路中,比如逻辑门、多谐振荡器等。
虽然产能有限,但在计算机和通信设备中得到了广泛应用。
2. 中片集成电路(MSI)时代20世纪60年代中期,集成电路的规模有了进一步的提升,可以容纳几十到几百个晶体管。
这种规模的集成电路可以实现更复杂的功能,如计数器、移位寄存器等。
随着制造工艺的改进,中片集成电路的产能逐渐增加。
3. 大片集成电路(LSI)时代到了20世纪70年代,集成电路的规模进一步扩大,达到数千个晶体管。
这种集成电路被广泛应用于计算机的存储器和控制单元,使得计算机性能得到了显著提升。
通信和工业领域也开始采用LSI集成电路。
4. 超大片集成电路(VLSI)时代从20世纪80年代开始,集成电路的规模进一步增大,可以容纳上百万个晶体管。
这种规模的集成电路被称为超大片集成电路。
VLSI技术的出现,使得计算机的性能和功能进一步提升,也推动了数字电子产品的发展。
5. 超大规模集成电路(ULSI)时代随着制造工艺的不断进步,集成电路的规模继续增大。
到了20世纪90年代,超大规模集成电路已经可以容纳数十亿个晶体管,实现了复杂的计算和控制功能。
这种规模的集成电路被广泛应用于计算机的微处理器和存储器等核心部件。
二、集成电路的分类根据应用领域和功能,集成电路可以分为几个主要类型:1. 数字集成电路(Digital Integrated Circuit,简称DIC):用于处理和传输数字信号的集成电路。
集成电路芯片集成电路(Integrated Circuits,简称IC)是由多种电子器件(如晶体管、电阻、电容等)和其它电子元件(如电阻、电容等)集成在一片半导体晶片上的电路系统。
它是现代电子技术的核心之一,广泛应用于计算机、通信、家电、汽车、医疗设备等各个领域。
集成电路的发展始于20世纪50年代,当时的电子元器件还非常庞大和笨重,导致设备复杂,体积庞大,功耗高。
为了解决这些问题,人们开始研究如何将多个电子元器件集成在一张小片上,从而诞生了集成电路。
集成电路的出现极大地提高了电子设备的性能、稳定性和可靠性,使得设备更小巧、便携和高效。
集成电路工艺主要包括模拟集成电路和数字集成电路两大类。
模拟集成电路主要用于信号的处理和放大,具有较高的精度和灵敏度。
模拟集成电路的制造过程主要包括掩膜制作、光刻、腐蚀、沉积等步骤。
其中掩膜制作是模拟集成电路的关键步骤,它通过光刻技术将设计好的芯片图案映射到硅片上,形成各种电子元件的结构。
腐蚀和沉积过程则用于形成电子元件的结构。
数字集成电路主要用于逻辑运算和存储,广泛应用于计算机和通信领域。
数字集成电路的制造过程主要包括沉积、光刻、腐蚀、离子注入、扩散、电镀、热压连接等步骤。
其中离子注入是数字集成电路的关键步骤,它通过注入不同的杂质离子改变半导体材料的导电性能,从而实现逻辑运算和存储功能。
随着科技的进步和需求的不断增长,集成电路的发展也在不断演进。
在制造工艺方面,人们正在研究开发更小巧、更高性能、更低功耗的集成电路。
在应用领域方面,人们正在探索如何将集成电路应用于人工智能、物联网、新能源等领域。
总之,集成电路作为现代电子技术的核心之一,对于推动社会和经济的发展起着重要作用。
相信随着技术的不断进步,集成电路的应用领域和性能将会越来越广泛和先进。
集成电路介绍集成电路是20世纪60 年代发展起来的一种半导体器件,它的英文名称为Integrated Circuites,缩写为IC。
它是以半导体晶体材料为基片,经加工制造,将元件、有源器件和互连线集成在基片内部、表面或基片之上,执行某种电子功能的微型化电路。
随着科学技术的迅速发展和对数字电路不断增长的应用要求,集成电路生产厂家积极采用新技术、改进设计方案和生产工艺,沿着提高速度、降低功耗、缩小体积的方向作不懈努力,不断推出各种型号的新产品。
仅几十年时间,数字电路就从小规模、中规模、大规模发展到超大规模、巨大规模。
集成电路的种类相当多,集成电路按制作工艺来分可分为三大类,即半导体集成电路,膜集成电路及混合集成电路。
目前世界上生产最多、应用最广的就是半导体集成电路。
半导体集成电路又可分为DDL (二极管-二极管逻辑)集成电路、DTL (二极管-三极管逻辑)集成电路、HTL 高电压(二极管-三极管逻辑)集成电路、TTL (三极管—三极管逻辑)集成电路、ECL (射极偶合逻辑或电流开关逻辑)集成电路和CMOS (互补型金属氧化物半导体逻辑)集成电路。
目前应用最广泛的数字电路是TTL 电路和CMOS 电路。
TTL 电路以双极型晶体管为开关元件,所以又称双极型集成电路。
根据应用领域的不同,它分为54 系列和74系列,前者为军品,一般工业设备和消费类电子产品多用后者。
74 系列数字集成电路是国际上通用的标准电路。
其品种分为六大类:74XX(标准)、74SXX(肖特基)、74LS XX(低功耗肖特基)、74AS XX(先进肖特基)、74ALSXX(先进低功耗肖特基)、74F XX(高速)、其逻辑功能完全相同。
它具有速度高、驱动能力强等优点,但其功耗较大,集成度相对较低。
MOS 电路又称场效应集成电路,它的主要优点是输入阻抗高、功耗低、抗干扰能力强且适合大规模集成。
特别是其主导产品CMOS 集成电路有着特殊的优点,如静态功耗几乎为零,输出逻辑电平可为VDD或VSS,上升和下降时间处于同数量级等,因而CMOS集成电路产品已成为集成电路的主流之一。
Integrated circuit (IC)IntroducionIntegrated circuit also called microelectronic circuit or chip an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices (e.g., transistors and diodes) and passive devices (e.g., capacitors and resistors) and their interconnections are built up on a thin substrate of semiconductor material (typically silicon). The resulting circuit is thus a small monolithic “chip,” which may be as small as a few square centimetres or only a few square millimetres. The individual circuit components are generally microscopic in size.Integrated circuits have their origin in the invention of the transistor in 1947 by William B. Shockley and his team at the American Telephone and Telegraph Company's Bell Laboratories. Shockley's team (including John Bardeen and Walter H. Brattain) found that, under the right circumstances, electrons would form a barrier at the surface of certain crystals, and they learned to control the flow of electricity through the crystal by manipulating this barrier. Controlling electron flow through a crystal allowed the team to create a device that could perform certain electrical operations, such as signal amplification, that were previously done by vacuum tubes. They named this device a transistor, from a combination of the words transfer and resistor (see photograph). The study of methods of creating electronic devices using solid materials became known as solid-state electronics. Solid-state devices proved to bemuch sturdier, easier to work with, more reliable, much smaller, and less expensive than vacuum tubes.Using the same principles and materials, engineers soon learned to create other electrical components, such as resistors and capacitors. Now that electrical devices could be made so small, the largest part of a circuit was the awkward wiring between the devices.In 1958 Jack Kilby of Texas Instruments, Inc., and Robert Noyce of Fairchild Semiconductor Corporation independently thought of a way to reduce circuit size further. They laid very thin paths of metal (usually aluminum or copper) directly on the same piece of material as their devices. These small paths acted as wires. With this technique an entire circuit could be “integrated” on a single piece of sol id material and an integrated circuit (IC) thus created. ICs can contain hundreds of thousands of individual transistors on a single piece of material the size of a pea. Working with that many vacuum tubes would have been unrealistically awkward and expensive. The invention of the integrated circuit made technologies of the Information Age feasible. ICs are now used extensively in all walks of life, from cars to toasters to amusement park rides.Basic IC typesAnalog versus digital circuitsAnalog, or linear, circuits typically use only a few components and are thus some of the simplest types of ICs. Generally, analog circuits are connected to devices that collect signals from the environment or send signals back to theenvironment. For example, a microphone converts fluctuating vocal sounds into an electrical signal of varying voltage. An analog circuit then modifies the signal in some useful way—such as amplifying it or filtering it of undesirable noise. Such a signal might then be fed back to a loudspeaker, which would reproduce the tones originally picked up by the microphone.Another typical use for an analog circuit is to control some device in response to continual changes in the environment. For example, a temperature sensor sends a varying signal to a thermostat, which can be programmed to turn an air conditioner, heater, or oven on and off once the signal has reached a certain value.A digital circuit, on the other hand, is designed to accept only voltages of specific given values. A circuit that uses only two states is known as a binary circuit. Circuit design with binary quantities, “on” and “off” representing 1 and 0 (i.e., true and false), uses the logic of Boolean algebra. The three basic logic functions—NOT, AND, and OR—together with their truth tables are given in the figure. (Arithmetic is also performed in the binary number system employing Boolean algebra.) These basic elements are combined in the design of ICs for digital computers and associated devices to perform the desired functions.Microprocessor circuitsMicroprocessors are the most complicated ICs. They are composed of millions of transistors that have been configuredas thousands of individual digital circuits, each of which performs some specific logic function. A microprocessor is built entirely of these logic circuits synchronized to each other.Just like a marching band, the circuits perform their logic function only on direction by the bandmaster. The bandmaster in a microprocessor, so to speak, is called the clock. The clock is a signal that quickly alternates between two logic states. Every time the clock changes state, every logic circuit in the microprocessor does something. Calculations can be made very quickly, depending on the speed (“clock frequency”) of the microprocessor.Microprocessors contain some circuits, known as registers, that store information. Registers are predetermined memory locations. Each processor has many different types of registers. Permanent registers are used to store the preprogrammed instructions required for various operations (such as addition and multiplication). Temporary registers store numbers that are to be operated on and also the result. Other examples of registers include the “program counter,” the “stack pointer,” and the “address” register.Microprocessors can perform millions of operations per second on data. In addition to computers, microprocessors are common in video game systems, televisions, cameras, and automobiles.Memory circuitsMicroprocessors typically have to store more data than can be held in a few registers. This additional information isrelocated to special memory circuits. Memory is composed of dense arrays of parallel circuits that use their voltage states to store information. Memory also stores the temporary sequence of instructions, or program, for the microprocessor. Manufacturers continually strive to reduce the size of memory circuits—to increase capability without increasing space. In addition, smaller components typically use less power, operate more efficiently, and cost less to manufacture.Digital signal processorsA signal is an analog waveform—anything in the environment that can be captured electronically. A digital signal is an analog waveform that has been converted into a series of binary numbers for quick manipulation. As the name implies, a digital signal processor (DSP) processes signals digitally, as patterns of 1s and 0s. For instance, using an analog-to-digital converter, commonly called an A-to-D or A/D converter, a recording of someone's voice can be converted into digital 1s and 0s. The digital representation of the voice can then be modified by a DSP using complex mathematical formulas. For example, the DSP algorithm in the circuit may be configured to recognize gaps between spoken words as background noise and digitally remove ambient noise from the waveform. Finally, the processed signal can be converted back (by a D/A converter) into an analog signal for listening. Digital processing can filter out background noise so fast that there is no discernible delay and the signal appears to be heard in “real time.” For instance, such processing enables “live” televisionbroadcasts to focus on a quarterback's signals in an American gridiron football game. DSPs are also used to produce digital effects on live television. For example, the yellow marker lines displayed during the football game are not really on the field; a DSP adds the lines after the cameras shoot the picture but before it is broadcast. Similarly, some of the advertisements seen on stadium fences and billboards during televised sporting events are not really there.Application-specific ICsAn application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternate instructions.Radio-frequency ICsRadio-frequency ICs (RFICs) are rapidly gaining importance in cellular telephones and pagers. RFICs are analog circuits that usually run in the frequency range of 900 MHz to 2.4 GHz (900 million hertz to 2.4 billion hertz). They are usually thought of as ASICs even though some may be configurable for several similar applications. Most semiconductor circuits that operate above 500 MHz cause the electronic components and their connecting paths to interferewith each other in unusual ways. Engineers must use special design techniques to deal with the physics of high-frequency microelectronic interactions.Microwave monolithic ICsA special type of RFIC is known as a microwave monolithic IC (MMIC). These circuits run in the 2.4- to 20-GHz range, or microwave frequencies, and are used in radar systems, in satellite communications, and as power amplifiers for cellular telephones.Just as sound travels faster through water than through air, electron velocity is different through each type of semiconductor material. Silicon offers too much resistance for microwave-frequency circuits, and so the compound gallium arsenide (GaAs) is often used for MMICs. Unfortunately, GaAs is mechanically much less sound than silicon. It breaks easily, so GaAs wafers are usually much more expensive to build than silicon wafers.Basic semiconductor designAny material can be classified as one of three types: conductor, insulator, or semiconductor. A conductor (such as copper or salt water) can easily conduct electricity because it has an abundance of free electrons. An insulator (such as ceramic or dry air) conducts electricity very poorly because it has few or no free electrons. A semiconductor (such as silicon or gallium arsenide) is somewhere between a conductor and aninsulator. It is capable of conducting some electricity, but not much.Basic semiconductor designDoping siliconMost ICs are made of silicon, which is abundant in ordinary beach sand. Pure crystalline silicon, as with other semiconducting materials, has a very high resistance to electrical current at normal room temperature. However, with the addition of certain impurities, known as dopants, the silicon can be made to conduct usable currents. In particular, the doped silicon can be used as a switch, turning current off and on as desired.The process of introducing impurities is known as doping or implantation. Depending on a dopant's atomic structure, the result of implantation will be either an n-type (negative) or a p-type (positive) semiconductor. An n-type semiconductor results from implanting dopant atoms that have more electrons in their outer (bonding) shell than silicon, as shown in the figure. The resulting semiconductor crystal contains excess, or free, electrons that are available for conducting current. A p-type semiconductor results from implanting dopant atoms that have fewer electrons in their outer shell than silicon. The resulting crystal contains “holes” in its bonding structure where electrons would normally be located. In essence, such holes can move through the crystal conducting positive charges.Basic semiconductor designThe p-n junctionA p-type or an n-type semiconductor is not very useful on its own. However, joining these opposite materials creates what is called a p-n junction. A p-n junction forms a barrier to conduction between the materials. Although the electrons in the n-type material are attracted to the holes in the p-type material, the electrons are not normally energetic enough to overcome the intervening barrier. However, if additional energy is provided to the electrons in the n-type material, they will be capable of crossing the barrier into the p-type material—and current will flow. This additional energy can be supplied by applying a positive voltage to the p-type material,as shown in the figure. The negatively charged electrons will then be highly attracted to the positive voltage across the junction.A p-n junction that conducts electricity when energy is added to the n material is called forward-biased because the electrons move forward into the holes. If voltage is applied in the opposite direction—a positive voltage connected to the n side of the junction—no current will flow. The electrons in the n material will still be attracted to the positive voltage, but the voltage will now be on the same side of the barrier as the electrons. In this state a junction is said to be reverse-biased. Since p-n junctions conduct electricity in only one direction, they are a type of diode. Diodes are essential building blocks of semiconductor switches.Basic semiconductor designField-effect transistorsBringing a negative voltage close to the centre of a long strip of n-type material will repel nearby electrons in the material and thus form holes—that is, transform some of the strip in the middle to p-type material. This change in polarity utilizing an electric field gives the field-effect transistor its name. (See animation.) While the voltage is being applied, there will exist two p-n junctions along the strip, from n to p and then from p back to n. One of the two junctions will always be reverse-biased. Since reverse-biased junctions cannot conduct, current cannot flow through the strip. The field effect can be used to create a switch (transistor) to turn current off and on, simply by applying and removing a small voltage nearby in order to create or destroy reverse-biased diodes in the material.A transistor created by using the field effect is called a field-effect transistor (FET).The location where the voltage is applied is known as a gate. The gate is separated from the transistor strip by a thin layer of insulation to prevent it from short-circuiting the flow of electrons through the semiconductor from an input (source) electrode to an output (drain) electrode. Similarly, a switch can be made by placing a positive gate voltage near a strip of p-type material. A positive voltage attracts electrons and thus forms a region of n within a strip of p. This again creates two p-n junctions, or diodes. As before, one of the diodes will always be reverse-biased and will stop current from flowing. FETs are good for building logic circuits because they require only a small current during switching. No current is required for holding the transistor in an on or off state; a voltage willmaintain the state. This type of switching helps preserve battery life. A field-effect transistor is called unipolar (from “one polarity”) because the main conduction method is either holes or electrons, not both.Basic semiconductor designEnhancement mode FETsThere are two basic types of field-effect transistors. The type described previously is a depletion mode FET, since a region is depleted of its natural charge. The field effect can also be used to create what is called an enhancement mode FET by enhancing a region to appear similar to its surrounding regions.An n-type enhancement mode FET is made from two regions of n-type material separated by a small region of p. As this FET naturally contains two p-n junctions—two diodes—it is normally switched off. However, when a positive voltage is placed on the gate, the voltage attracts electrons and creates n-type material in the middle region, filling the gap that was previously p-type material, as shown in the animation. The gate voltage thus creates a continuous region of n across the entire strip, allowing current to flow from one side to the other. This turns the transistor on. Similarly, a p-type enhancement mode FET can be made from two regions of p-type material separated by a small region of n. The gate voltage required for turning on this transistor is negative. Enhancement mode FETs switch faster than depletion mode FETs because they require a change only near the surface under the gate, rather than all the way through the material, as shown in the figure.Basic semiconductor designComplementary metal-oxide semiconductorsRecall that placing a positive voltage at the gate of an n-type enhanced mode FET will turn the switch on. Placing the same voltage at the gate of a p-type enhanced mode FET will turn the switch off. Likewise, placing a negative voltage at the gate will turn the n-type off and the p-type on. These FETs always respond in opposite, or complementary, fashion to a given gate voltage. Thus, if the gates of an n-type and a p-type FET are connected, any voltage applied to the common gate will operate the complementary pair, turning one on and leaving the other off. A semiconductor that pairs n- and p-type transistors this way is called a complementary metal-oxide semiconductor (CMOS). Because complementary transistor pairs can quickly switch between two logic states, CMOSs are very useful in logic circuits. In particular, because only one circuit is on at any time, CMOSs require less power and are often used for battery-powered devices, such as in digital cameras, and for the special memory that holds the date, time, and system parameters in personal computers.Basic semiconductor designBipolar transistorsBipolar transistors simultaneously use holes and electrons to condu ct, hence their name (from “two polarities”). Like FETs, bipolar transistors contain p- and n-type materials configured ininput, middle, and output regions. In bipolar transistors, however, these regions are referred to as the emitter, the base, and the collector. Instead of relying, as FETs do, on a secondary voltage source to change the polarity beneath the gate (the field effect), bipolar transistors use a secondary voltage source to provide enough energy for electrons to punch through the reverse-biased base-collector junction (see figure). As the electrons are energized, they jump into the collector and complete the circuit. Note that even with highly energetic electrons, the middle section of p-type material must be extremely thin for the electrons to pass through both junctions.Designing ICsAll ICs use the same basic principles of voltage (V), current (I), and resistance (R). In particular, equations based on Ohm's law, V = IR, determine many circuit design choices. Design engineers must also be familiar with the properties of various electronic components needed for different applications.Designing ICsAnalog designAs mentioned earlier, an analog circuit takes an infinitely variable real-world voltage or current and modifies it in some useful way. The signal might be amplified, compared with another signal, mixed with other signals, separated from other signals, examined for value, or otherwise manipulated. For the design of this type of circuit, the choice of every individualcomponent, size, placement, and connection is crucial. Unique decisions abound—for instance, whether one connection should be slightly wider than another connection, whether one resistor should be oriented parallel or perpendicular to another, or whether one wire can lie over the top of another. Every small detail affects the final performance of the end product. When integrated circuits were much simpler, component values could be calculated by hand. For instance, a specific amplification value (gain) of an amplifier could typically be calculated from the ratio of two specific resistors. The current in the circuit could then be determined, using the resistor value required for the amplifier gain and the supply voltage used. As designs became more complex, laboratory measurements were used to characterize the devices. Engineers drew graphs of device characteristics across several variables and then referred to those graphs as they needed information for their calculations. As scientists improved their characterization of the intricate physics of each device, they developed complex equations that took into account subtle effects that were not apparent from coarse laboratory measurements. For example, a transistor works very differently at different frequencies, sizes, orientations, and placements. In particular, scientists found parasitic components (unwanted effects, usually resistance and capacitance) that are inherent in the way the devices are built.Designing ICsDigital designSince digital circuits involve millions of times as manycomponents as analog circuits, much of the design work is done by copying and reusing the same circuit functions, especially by using digital design software that contains libraries of prestructured circuit components. The components available in such a library are of similar height, contain contact points in predefined locations, and have other rigid conformities so that they fit together regardless of how the computer configures a layout. While SPICE is perfectly adequate for analyzing analog circuits, with equations that describe individual components, the complexity of digital circuits requires a less-detailed approach. Therefore, digital analysis software ignores individual components for mathematical models of entire preconfigured circuit blocks (or logic functions).Whether analog or digital circuitry is used depends on the function of a circuit. The design and layout of analog circuits are more demanding of teamwork, time, innovation, and experience, particularly as circuit frequencies get higher, though skilled digital designers and layout engineers can be of great benefit in overseeing an automated process as well. Digital design emphasizes different skills from analog design.集成电路(IC)引言集成电路也称为微电子电路或芯片的电子元件,作为一个单元,其中微型有源器件(如晶体管和二极管)和无源器件(例如,电容器和电阻器)和他们的互连是建立在制造薄基板的半导体材料(通常是硅)。
IC的基本知识与基本术语第一節IC发展与基本术语一.IC的起源与发展史IC(Intergrated circuit),即我们目前所说的集成电路。
集成电路是一种至少具有一个电子电路功能的电路。
它由相互连接排列着的主动组件及被动组件组成,且它们间用半导体基片连接,或者采用兼容处理技术将它们沉积在半导体基片上,其英文缩写词为IC.其英文亦称为INTERGRATEDSEMICONDUCTOR (集成半导体)IC是电子工业高速发展的必然产物。
电子工业的发展基本的规律是运转低速至运转高速,体积大而笨重转向体积轻巧,功能弱小转向功能强大,由仿真电路转向数字电路等特点。
例如:世界上第一台计算器是由几千只不同规格的电子管组合,体积大约为现有的一座两层民房,它们的出现虽然具有划时代的意义,但由于其功能耗大,电路运转不稳定,故障率高,运算速度不高(计算功能约在几百次/秒),很受到人们的怀疑。
但随着技术的提高,电子计算器已经发展到目前的586水平,功耗体积明显减小,功能大大加强(计算能力约在十万次/秒以上),并具有故障率低等明显优点,已经称为人们日常工作中不可缺少的伙伴。
最初的电子电路是由一个或几个相关回路连接以达到一个特定的功能,并且采用传统元器件,由于质量功耗等原因,很大程度地限制了使用范围,并且对电流地要求很高。
随着半导体组件的出现,电子电路变得简单了,并且晶体管的出现,使模块电路(即为某一功能而设计成成品的电路)成为现实,这种模块化电路成为IC的前身。
半导体工业的发展是极为迅速的,在一个硅片机体上封装的模块电路越来越多(以PN结为计数点)。
目前的技术芯片的细度已经达到0.08mm的水平,即1平方厘米上可有1.56*1010个PN结。
因此,可以看到,功能强大的硅芯片产生了,但体积却大大减小了,也带来了电子工业从地到天的巨大飞跃。
由于硅片在继续加大细度的工作是艰巨的,因此,人们也在寻求其它方式来替代硅芯片。
如用蛋白质合成的神经元(又称生物计算器)等,但硅芯片以其独特的优点(体积小,功能大,稳定性高)而继续在电子工业中扮演重要角色。
学号:10034020321毕业设计外文翻译学院计算机与电子信息学院专业电气工程及其自动化班级电气10-3班学生赖景来指导教师罗如山(讲师)设计时间2014年03月24日至2014年06月27日Integrated circuit (IC) IntroducionIntegrated circuit also called microelectronic circuit or chip an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices (e.g., transistors and diodes) and passive devices (e.g., capacitors and resistors) and their interconnections are built up on a thin substrate of semiconductor material (typically silicon). The resulting circuit is thus a small monolithic “chip,” which may be as small as a few square centimetres or only a few square millimetres. The individual circuit components are generally microscopic in size.Integrated circuits have their origin in the invention of the transistor in 1947 by William B. Shockley and his team at the American Telephone and Telegraph Company's Bell Laboratories. Shockley's team (including John Bardeen and Walter H. Brattain) found that, under the right circumstances, electrons would form a barrier at the surface of certain crystals, and they learned to control the flow of electricity through the crystal by manipulating this barrier. Controlling electron flow through a crystal allowed the team to create a device that could perform certain electrical operations, such as signal amplification, that were previously done by vacuum tubes. They named this device a transistor, from a combination of the words transfer and resistor (see photograph). The study of methods of creating electronic devices using solid materials became known as solid-state electronics. Solid-state devices proved to be much sturdier, easier to work with, more reliable, much smaller, and less expensive than vacuum tubes.Using the same principles and materials, engineers soon learned to create other electrical components, such as resistors and capacitors. Now that electrical devices could be made so small, the largest part of a circuit was the awkward wiring between thedevices.In 1958 Jack Kilby of Texas Instruments, Inc., and Robert Noyce of Fairchild Semiconductor Corporation independently thought of a way to reduce circuit size further. They laid very thin paths of metal (usually aluminum or copper) directly on the same piece of material as their devices. These small paths acted as wires. With this technique an entire circuit could be “integrated” on a single piece of solid material and an integrated circuit (IC) thus created. ICs can contain hundreds of thousands of individual transistors on a single piece of material the size of a pea. Working with that many vacuum tubes would have been unrealistically awkward and expensive. The invention of the integrated circuit made technologies of the Information Age feasible. ICs are now used extensively in all walks of life, from cars to toasters to amusement park rides.Basic IC typesAnalog versus digital circuitsAnalog, or linear, circuits typically use only a few components and are thus some of the simplest types of ICs. Generally, analog circuits are connected to devices that collect signals from the environment or send signals back to the environment. For example, a microphone converts fluctuating vocal sounds into an electrical signal of varying voltage. An analog circuit then modifies the signal in some useful way—such as amplifying it or filtering it of undesirable noise. Such a signal might then be fed back to a loudspeaker, which would reproduce the tones originally picked up by the microphone.Another typical use for an analog circuit is to control some device in response to continual changes in the environment. For example, a temperature sensor sends a varying signal to a thermostat, which can be programmed to turn an air conditioner, heater, or oven on and off once the signal has reached a certain value.A digital circuit, on the other hand, is designed to acceptonly voltages of specific given values. A circuit that uses only two states is known as a binary circuit. Circuit design with binary quantities, “on” and “off” representing 1 and 0 (i.e., true and false), uses the logic of Boolean algebra. The three basic logic functions—NOT, AND, and OR—together with their truth tables are given in the figure. (Arithmetic is also performed in the binary number system employing Boolean algebra.) These basic elements are combined in the design of ICs for digital computers and associated devices to perform the desired functions.Microprocessor circuitsMicroprocessors are the most complicated ICs. They are composed of millions of transistors that have been configured as thousands of individual digital circuits, each of which performs some specific logic function. A microprocessor is built entirely of these logic circuits synchronized to each other.Just like a marching band, the circuits perform their logic function only on direction by the bandmaster. The bandmaster in a microprocessor, so to speak, is called the clock. The clock is a signal that quickly alternates between two logic states. Every time the clock changes state, every logic circuit in the microprocessor does something. Calculations can be made very quickly, depending on the speed (“clock frequency”) of the microprocessor.Microprocessors contain some circuits, known as registers, that store information. Registers are predetermined memory locations. Each processor has many different types of registers. Permanent registers are used to store the preprogrammed instructions required for various operations (such as addition and multiplication). Temporary registers store numbers that are to be operated on and also the result. Other examples of registers include the “program counter,” the “stack pointer,” and the “address” register.Microprocessors can perform millions of operations per secondon data. In addition to computers, microprocessors are common in video game systems, televisions, cameras, and automobiles.Memory circuitsMicroprocessors typically have to store more data than can be held in a few registers. This additional information is relocated to special memory circuits. Memory is composed of dense arrays of parallel circuits that use their voltage states to store information. Memory also stores the temporary sequence of instructions, or program, for the microprocessor. Manufacturers continually strive to reduce the size of memory circuits—to increase capability without increasing space. In addition, smaller components typically use less power, operate more efficiently, and cost less to manufacture.Digital signal processorsA signal is an analog waveform—anything in the environment that can be captured electronically. A digital signal is an analog waveform that has been converted into a series of binary numbers for quick manipulation. As the name implies, a digital signal processor (DSP) processes signals digitally, as patterns of 1s and 0s. For instance, using an analog-to-digital converter, commonly called an A-to-D or A/D converter, a recording of someone's voice can be converted into digital 1s and 0s. The digital representation of the voice can then be modified by a DSP using complex mathematical formulas. For example, the DSP algorithm in the circuit may be configured to recognize gaps between spoken words as background noise and digitally remove ambient noise from the waveform. Finally, the processed signal can be converted back (by a D/A converter) into an analog signal for listening. Digital processing can filter out background noise so fast that there is no discernible delay and the signal appears to be heard in “real time.” For instance, such processing enables “live” television broadcasts to focus on a quarterback's signals in an Americangridiron football game. DSPs are also used to produce digital effects on live television. For example, the yellow marker lines displayed during the football game are not really on the field;a DSP adds the lines after the cameras shoot the picture but before it is broadcast. Similarly, some of the advertisements seen on stadium fences and billboards during televised sporting events are not really there.Application-specific ICsAn application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternate instructions.Radio-frequency ICsRadio-frequency ICs (RFICs) are rapidly gaining importance in cellular telephones and pagers. RFICs are analog circuits that usually run in the frequency range of 900 MHz to 2.4 GHz (900 million hertz to 2.4 billion hertz). They are usually thought of as ASICs even though some may be configurable for several similar applications. Most semiconductor circuits that operate above 500 MHz cause the electronic components and their connecting paths to interfere with each other in unusual ways. Engineers must use special design techniques to deal with the physics of high-frequency microelectronic interactions.Microwave monolithic ICsA special type of RFIC is known as a microwave monolithic IC (MMIC). These circuits run in the 2.4- to 20-GHz range, ormicrowave frequencies, and are used in radar systems, in satellite communications, and as power amplifiers for cellular telephones.Just as sound travels faster through water than through air, electron velocity is different through each type of semiconductor material. Silicon offers too much resistance for microwave-frequency circuits, and so the compound gallium arsenide (GaAs) is often used for MMICs. Unfortunately, GaAs is mechanically much less sound than silicon. It breaks easily, so GaAs wafers are usually much more expensive to build than silicon wafers.Basic semiconductor designAny material can be classified as one of three types: conductor, insulator, or semiconductor. A conductor (such as copper or salt water) can easily conduct electricity because it has an abundance of free electrons. An insulator (such as ceramic or dry air) conducts electricity very poorly because it has few or no free electrons. A semiconductor (such as silicon or gallium arsenide) is somewhere between a conductor and an insulator. It is capable of conducting some electricity, but not much.Basic semiconductor designDoping siliconMost ICs are made of silicon, which is abundant in ordinary beach sand. Pure crystalline silicon, as with other semiconducting materials, has a very high resistance to electrical current at normal room temperature. However, with the addition of certain impurities, known as dopants, the silicon can be made to conduct usable currents. In particular, the doped silicon can be used as a switch, turning current off and on as desired.The process of introducing impurities is known as doping or implantation. Depending on a dopant's atomic structure, the result of implantation will be either an n-type (negative) or a p-type (positive) semiconductor. An n-type semiconductor results fromimplanting dopant atoms that have more electrons in their outer (bonding) shell than silicon, as shown in the figure. The resulting semiconductor crystal contains excess, or free, electrons that are available for conducting current. A p-type semiconductor results from implanting dopant atoms that have fewer electrons in their outer shell than silicon. The resulting crystal contains “holes”in its bonding structure where electrons would normally be located. In essence, such holes can move through the crystal conducting positive charges.Basic semiconductor designThe p-n junctionA p-type or an n-type semiconductor is not very useful on its own. However, joining these opposite materials creates what is called a p-n junction. A p-n junction forms a barrier to conduction between the materials. Although the electrons in the n-type material are attracted to the holes in the p-type material, the electrons are not normally energetic enough to overcome the intervening barrier. However, if additional energy is provided to the electrons in the n-type material, they will be capable of crossing the barrier into the p-type material—and current will flow. This additional energy can be supplied by applying a positive voltage to the p-type material,as shown in the figure. The negatively charged electrons will then be highly attracted to the positive voltage across the junction.A p-n junction that conducts electricity when energy is added to the n material is called forward-biased because the electrons move forward into the holes. If voltage is applied in the opposite direction—a positive voltage connected to the n side of the junction—no current will flow. The electrons in the n material will still be attracted to the positive voltage, but the voltage will now be on the same side of the barrier as the electrons. In this state a junction is said to be reverse-biased. Since p-n junctions conduct electricity in only one direction, they are a type of diode. Diodes are essential building blocks ofsemiconductor switches.Basic semiconductor designField-effect transistorsBringing a negative voltage close to the centre of a long strip of n-type material will repel nearby electrons in the material and thus form holes—that is, transform some of the strip in the middle to p-type material. This change in polarity utilizing an electric field gives the field-effect transistor its name. (See animation.) While the voltage is being applied, there will exist two p-n junctions along the strip, from n to p and then from p back to n. One of the two junctions will always be reverse-biased. Since reverse-biased junctions cannot conduct, current cannot flow through the strip. The field effect can be used to create a switch (transistor) to turn current off and on, simply by applying and removing a small voltage nearby in order to create or destroy reverse-biased diodes in the material. A transistor created by using the field effect is called a field-effect transistor (FET).The location where the voltage is applied is known as a gate. The gate is separated from the transistor strip by a thin layer of insulation to prevent it from short-circuiting the flow of electrons through the semiconductor from an input (source) electrode to an output (drain) electrode. Similarly, a switch can be made by placing a positive gate voltage near a strip of p-type material. A positive voltage attracts electrons and thus forms a region of n within a strip of p. This again creates two p-n junctions, or diodes. As before, one of the diodes will always be reverse-biased and will stop current from flowing. FETs are good for building logic circuits because they require only a small current during switching. No current is required for holding the transistor in an on or off state; a voltage will maintain the state. This type of switching helps preserve battery life. A field-effect transistor is called unipolar (from “one polarity”) because the main conduction method is either holes or electrons, not both.Basic semiconductor designEnhancement mode FETsThere are two basic types of field-effect transistors. The type described previously is a depletion mode FET, since a region is depleted of its natural charge. The field effect can also be used to create what is called an enhancement mode FET by enhancing a region to appear similar to its surrounding regions.An n-type enhancement mode FET is made from two regions of n-type material separated by a small region of p. As this FET naturally contains two p-n junctions—two diodes—it is normally switched off. However, when a positive voltage is placed on the gate, the voltage attracts electrons and creates n-type material in the middle region, filling the gap that was previously p-type material, as shown in the animation. The gate voltage thus creates a continuous region of n across the entire strip, allowing current to flow from one side to the other. This turns the transistor on. Similarly, a p-type enhancement mode FET can be made from two regions of p-type material separated by a small region of n. The gate voltage required for turning on this transistor is negative. Enhancement mode FETs switch faster than depletion mode FETs because they require a change only near the surface under the gate, rather than all the way through the material, as shown in the figure.Basic semiconductor designComplementary metal-oxide semiconductorsRecall that placing a positive voltage at the gate of an n-type enhanced mode FET will turn the switch on. Placing the same voltage at the gate of a p-type enhanced mode FET will turn the switch off. Likewise, placing a negative voltage at the gate will turn the n-type off and the p-type on. These FETs always respond in opposite, or complementary, fashion to a given gate voltage. Thus, if the gates of an n-type and a p-type FET are connected, any voltage applied to the common gate will operate the complementary pair,turning one on and leaving the other off. A semiconductor that pairs n- and p-type transistors this way is called a complementary metal-oxide semiconductor (CMOS). Because complementary transistor pairs can quickly switch between two logic states, CMOSs are very useful in logic circuits. In particular, because only one circuit is on at any time, CMOSs require less power and are often used for battery-powered devices, such as in digital cameras, and for the special memory that holds the date, time, and system parameters in personal computers.Basic semiconductor designBipolar transistorsBipolar transistors simultaneously use holes and electrons to conduct, hence their name (from “two polarities”). Like FETs, bipolar transistors contain p- and n-type materials configured in input, middle, and output regions. In bipolar transistors, however, these regions are referred to as the emitter, the base, and the collector. Instead of relying, as FETs do, on a secondary voltage source to change the polarity beneath the gate (the field effect), bipolar transistors use a secondary voltage source to provide enough energy for electrons to punch through the reverse-biased base-collector junction (see figure). As the electrons are energized, they jump into the collector and complete the circuit. Note that even with highly energetic electrons, the middle section of p-type material must be extremely thin for the electrons to pass through both junctions.Designing ICsAll ICs use the same basic principles of voltage (V), current (I), and resistance (R). In particular, equations based on Ohm's law, V = IR, determine many circuit design choices. Design engineers must also be familiar with the properties of various electronic components needed for different applications.Designing ICsAnalog designAs mentioned earlier, an analog circuit takes an infinitely variable real-world voltage or current and modifies it in some useful way. The signal might be amplified, compared with another signal, mixed with other signals, separated from other signals, examined for value, or otherwise manipulated. For the design of this type of circuit, the choice of every individual component, size, placement, and connection is crucial. Unique decisions abound—for instance, whether one connection should be slightly wider than another connection, whether one resistor should be oriented parallel or perpendicular to another, or whether one wire can lie over the top of another. Every small detail affects the final performance of the end product. When integrated circuits were much simpler, component values could be calculated by hand. For instance, a specific amplification value (gain) of an amplifier could typically be calculated from the ratio of two specific resistors. The current in the circuit could then be determined, using the resistor value required for the amplifier gain and the supply voltage used. As designs became more complex, laboratory measurements were used to characterize the devices. Engineers drew graphs of device characteristics across several variables and then referred to those graphs as they needed information for their calculations. As scientists improved their characterization of the intricate physics of each device, they developed complex equations that took into account subtle effects that were not apparent from coarse laboratory measurements. For example, a transistor works very differently at different frequencies, sizes, orientations, and placements. In particular, scientists found parasitic components (unwanted effects, usually resistance and capacitance) that are inherent in the way the devices are built.Designing ICsDigital designSince digital circuits involve millions of times as many components as analog circuits, much of the design work is done by copying and reusing the same circuit functions, especially by using digital design software that contains libraries of prestructured circuit components. The components available in such a library are of similar height, contain contact points in predefined locations, and have other rigid conformities so that they fit together regardless of how the computer configures a layout. While SPICE is perfectly adequate for analyzing analog circuits, with equations that describe individual components, the complexity of digital circuits requires a less-detailed approach. Therefore, digital analysis software ignores individual components for mathematical models of entire preconfigured circuit blocks (or logic functions).Whether analog or digital circuitry is used depends on the function of a circuit. The design and layout of analog circuits are more demanding of teamwork, time, innovation, and experience, particularly as circuit frequencies get higher, though skilled digital designers and layout engineers can be of great benefit in overseeing an automated process as well. Digital design emphasizes different skills from analog design.集成电路(IC)集成电路也称为微电子电路或芯片的电子元件,作为一个单元,其中微型有源器件(如晶体管和二极管)和无源器件(例如,电容器和电阻器)和他们的互连是建立在制造薄基板的半导体材料(通常是硅)。