HLMP-Q106GG012中文资料
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BH5000网络化实时监测诊断系统 ====使用指南 ====版本:V4.6.0.4北京博华信智科技发展有限公司2014年 04月目录1前言 .................................................................................................................. 1 1.1标识 (2)1.2BH5000网络化实时监测系统概 ................................................................... 2 1.2.1实时监测系统功能 .......................................................................................... 2 1.2.2实时监测系统特性 (3)1.3BH5000客户端软件概述 (4)2客户端软件的安装和配置 .............................................................................. 5 2.1客户端软件的安装 (5)2.2客户端软件的配置 (7)3基本操作指南 ................................................................................................ 10 3.1系统登录 ........................................................................................................ 10 3.2界面总览 ........................................................................................................ 10 3.3菜单栏 ............................................................................................................ 11 3.4快捷工具栏 .................................................................................................... 13 3.5功能模块抽屉式菜单栏 ................................................................................ 14 3.6导航栏 ............................................................................................................ 15 3.7绘图工具栏 .................................................................................................... 15 3.8操作页 ............................................................................................................ 16 3.9信息页 ............................................................................................................ 16 3.10图谱操作 ........................................................................................................ 17 3.10.1图谱新增毫秒显示 ........................................................................................ 17 3.10.2游标 ................................................................................................................ 17 3.10.3标注 ................................................................................................................ 17 3.10.4同步标注 ........................................................................................................ 18 3.10.5标点 ................................................................................................................ 18 3.10.6趋势操作 ........................................................................................................ 19 3.10.7复位 ................................................................................................................ 19 3.10.8打印 ................................................................................................................ 20 3.10.9保存图形 ........................................................................................................ 20 3.10.10切换 ................................................................................................................ 21 3.10.11显示报警线 .................................................................................................... 22 3.10.12纵坐标自动调整 ............................................................................................ 22 3.10.13锁定坐标 ........................................................................................................ 23 3.10.14手动修改坐标 (23)3.10.15图谱放大,关联更新 (24)3.10.16滚轮放大 (24)3.10.17自定义图谱布局 (25)3.10.18三维图谱 (26)3.10.19双击时间戳画图 (27)3.11设备树显示报警 ............................................................................................ 27 3.12设备树启停车状态显示 ................................................................................ 27 3.13设备树显示断网状态 .................................................................................... 28 3.14设备切换 ........................................................................................................ 28 3.15背景提示图 .................................................................................................... 29 3.16服务器状态切换 .. (30)3.17设备采集状态设置 (33)4旋转机械专用图谱 ........................................................................................ 34 4.1机组概貌图 .................................................................................................... 34 4.2振动监测 ........................................................................................................ 35 4.3振动历史比较图 ............................................................................................ 37 4.4单多值棒图 .................................................................................................... 38 4.5轴心轨迹 ........................................................................................................ 39 4.6轴心位置 ........................................................................................................ 42 4.7启停车图形 .................................................................................................... 43 4.8综合分析 ........................................................................................................ 45 4.9运行状态图 .................................................................................................... 49 4.10其它参数趋势图 ............................................................................................ 51 4.11全频谱 ............................................................................................................ 52 4.12二维全息谱图 ................................................................................................ 53 4.13三维全息谱图 ................................................................................................ 54 4.14旋转报警查询 (55)4.15现场动平衡 (57)5临时在线专用图谱 ........................................................................................ 59 5.1机组概貌图 .................................................................................................... 59 5.2动平衡响应分析 ............................................................................................ 59 5.3试车分析 ........................................................................................................ 60 5.4振动监测 ........................................................................................................ 62 5.5振动历史比较图 ............................................................................................ 62 5.6单多值棒图 (62)5.7轴心轨迹 (63)5.8轴心位置 ........................................................................................................ 63 5.9综合分析 ........................................................................................................ 63 5.10运行状态图 .................................................................................................... 63 5.11其他参数趋势图 ............................................................................................ 63 5.12旋转报警查询 ................................................................................................ 63 5.13全频谱图 ........................................................................................................ 63 5.14二维全息谱图 ................................................................................................ 63 5.15三维全息谱图 ................................................................................................ 63 5.16现场动平衡 (64)5.17倒谱图 (64)6往复机械专用图谱 ........................................................................................ 64 6.1机组概貌图 .................................................................................................... 64 6.2运行状态图 .................................................................................................... 65 6.3历史比较图 .................................................................................................... 67 6.4单值棒图 ........................................................................................................ 68 6.5活塞杆沉降 /偏摆监测 .................................................................................. 70 6.6活塞杆轨迹图 ................................................................................................ 71 6.7振动监测 ........................................................................................................ 72 6.8多参数分析 .................................................................................................... 74 6.9示功图 ............................................................................................................ 75 6.10综合监测 ........................................................................................................ 76 6.11其它参数趋势图 ............................................................................................ 77 6.12往复报警查询 ................................................................................................ 79 6.13应力监测 (80)6.14冲击诊断 (81)7风电专用图谱 ................................................................................................ 83 7.1机组概貌图 .................................................................................................... 83 7.2趋势分析 ........................................................................................................ 84 7.3冲击诊断 ........................................................................................................ 86 7.4转子类故障诊断 ............................................................................................ 89 7.5倒谱图 ............................................................................................................ 90 7.6单多值棒图 .................................................................................................... 92 7.7其它参数趋势图 ............................................................................................ 93 7.8风电报警查询 (94)8机泵专用图谱 ................................................................................................ 95 8.1机组概貌图 .................................................................................................... 96 8.2趋势分析 ........................................................................................................ 97 8.3冲击诊断 ........................................................................................................ 98 8.4转子类故障诊断 .......................................................................................... 101 8.5倒谱图 .......................................................................................................... 103 8.6单多值棒图 .................................................................................................. 104 8.7其它参数趋势图 (105)8.8机泵报警查询 (106)9在线报告报表 .............................................................................................. 108 9.1监测诊断报告 .............................................................................................. 108 9.2机组月报表 .................................................................................................. 110 9.3厂级报表 ...................................................................................................... 113 9.4振动参数报表 .............................................................................................. 113 10案例库模块 .................................................................................................. 115 10.1案例录入 ...................................................................................................... 115 10.1.1添加案例 ...................................................................................................... 117 10.1.2修改案例 ...................................................................................................... 121 10.1.3取消案例 ...................................................................................................... 121 10.2案例查询 ...................................................................................................... 121 10.2.1案例查询 ...................................................................................................... 122 10.2.2导出word .................................................................................................... 122 10.3案例审核 ...................................................................................................... 123 10.3.1案例查询 ...................................................................................................... 123 10.3.2修改案例 ...................................................................................................... 124 10.3.3审核案例 ...................................................................................................... 124 10.4检维修记录管理 .......................................................................................... 125 10.4.1添加检维修记录 .......................................................................................... 126 10.4.2修改检维修记录 .......................................................................................... 126 10.4.3删除检维修记录 .......................................................................................... 126 10.4.4导出word .................................................................................................... 127 10.5开停车记录管理 .......................................................................................... 127 10.5.1查询原始开停车记录 .................................................................................. 127 10.5.2添加开停车记录 .......................................................................................... 128 10.5.3修改开停车记录 (128)10.5.4删除开停车记录 .......................................................................................... 128 10.5.5开停车记录查询 (129)10.6基于案例诊断 (129)10.6.1诊断条件 (129)10.6.2相似度判断 .................................................................................................. 129 11系统维护和系统故障诊断 .......................................................................... 130 11.1客户端无法登陆 .......................................................................................... 130 11.2客户端看不到概貌图 .................................................................................. 131 11.3客户端提示请选择测点 .............................................................................. 131 11.4添加图谱出错 .............................................................................................. 131 11.5客户端查看不到历史数据库或不保存历史数据 ...................................... 131 11.6客户端图谱单位不正确 .............................................................................. 132 11.7客户端测点缸号不正确 .............................................................................. 132 11.8客户端不报警 .............................................................................................. 132 12附录 .............................................................................................................. 132 12.1旋转机械振动机理和诊断方法 .................................................................. 133 12.1.1机械设备振动监测的主要参数和定义 ...................................................... 133 12.1.2机械设备振动分析常用手段 . (138)1前言状态监测与故障诊断是在设备运行中或在基本不拆卸的情况下, 通过各种手段,掌握设备的运行状态,判定设备产生故障的部位和原因,并预测、预报设备未来的运行状态。
Agilent Subminiature High Performance TS AlGaAs Red LED Lamps Data SheetFeatures•Subminiature flat top package Ideal for backlighting and light piping applications•Subminiature dome package Diffused dome for wide viewing angleNon-diffused dome for high brightness•Wide range of drive currents500 µA to 50 mA •Ideal for space limited Applications •Axial leads•Available with lead configurations for surface mount and through hole PC board mountingDescriptionFlat Top PackageThe HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens toprovide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Dome PackagesThe HLMP-Qxxx Series dome lamps, for use as indicators, use a tinted, diffused lens to provide a wide viewing angle with high on-off contrast ratio. High brightness lamps use anuntinted, nondiffused lens to provide a high luminous inten-sity within a narrow radiation pattern.Lead ConfigurationsAll of these devices are made by encapsulating LED chips onaxial lead frames to form molded epoxy subminiature lamppackages. A variety of package configuration options isavailable. These include special surface mount lead configura-tions, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead BendOptions for Subminiature LED Lamps data sheet.TechnologyThese subminiature solid state lamps utilize a highly optimized LED material technology,transparent substrate aluminum gallium arsenide (TS AlGaAs).This LED technology has a very high luminous efficiency,capable of producing high light output over a wide range of drive currents (500 µA to 50mA). The color is deep red at a dominant wavelength of 644nm deep red. TS AlGaAs is a flip-chip LED technology, dieattached to the anode lead and wire bonded to the cathode lead.Available viewing angles are 75°, 35°, and 15°.HLMP-P106/P156HLMP-Q102/Q152HLMP-Q106/Q156Device Selection GuideViewing Angle Deep Red Typical Iv Typical IvPackage Description 2 q1/2R d = 644 nm I F = 500 µa I F = 20 mA Package Outline Domed, Diffused Tinted,35HLMP-Q102100BStandard CurrentDomed, Diffused Tinted,35HLMP-Q1522BLow CurrentDomed, Nondiffused15HLMP-Q106400BUntinted, Standard CurrentDomed, Nondiffused15HLMP-Q1567BUntinted, Low CurrentFlat Top, Nondiffused,75HLMP-P106130AUntinted, Standard CurrentFlat Top, Nondiffused75HLMP-P1562AUntinted, Low CurrentOrdering InformationHLMX-XXXX-X X X X XPackagingOptionColor BinSelectionMax. Iv BinMin. Iv Bin4 x 4 Prod.PartNumberFigure 1. Proper right angle mounting to a PC board to prevent protruding anode tab from shorting to cathode c onnection.Package Dimensions A) Flat Top LampsB) Diffused and Nondiffused Dome LampsNO. CATHODE DOWN.YES. ANODE DOWN.* REFER TO FIGURE 1 FOR DESIGN CONERNS.2.082.34(0.082)(0.092)2.082.34(0.082)(0.092)0.53 (0.021)2.211.96(0.087)(0.077)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.Absolute Maximum Ratings at T A = 25°CParameters TitleDC Forward Current[1]50 mAPeak Forward Current[2]300 mAAverage Forward Current[2,3]30 mATransient Forward Current (10 µs Pulse)[4]500 mAPower Dissipation100 mWReverse Voltage 5 VJunction Temperature110°COperating Temperature-55°C to +100°CStorage Temperature-55°C to +100°CLead Soldering Temperature260°C for 5 seconds[1.6 mm (0.063 in.) from body]Reflow Soldering Temperature260°C for 20 secondsNotes:1. Derate linearly as shown in Figure 6.2. Refer to Figure 7 to establish pulsed operating conditions.3. Maximum IAVG at f = 1 kHz, DF = 10%.4. The transient peak current is the maximum non-recurring peak current the device can withstandwithout damaging the LED die and wire bonds. It is not recommended that the device beoperated at peak currents above the Absolute Maximum Peak Forward Current.Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle LuminousI V (mcd)f V (mlm)Wavelength Wavelength2q1/2Efficacy Part Number@ 20 mA[1]@ 20 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q106-R00xx1004002806546441585Q102-N00xx25100-6546443585P106-Q00xx631302806546447585Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle Luminous Part Number I V (mcd)f V (mlm)Wavelength Wavelength2f1/2Efficacy (Low Current)@ 0.5 mA[1]@ 0.5 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q156-H00xx 2.5710.56546441585Q152-G00xx 1.62-6546443585P156-EG0xx0.63210.56546447585 Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. f v is the total luminous flux output as measured with an integrating sphere.3. The dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the color of the device.4. q1/2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity.5. Radiant intensity, I v, in watts/steradian, may be calculated from the equation I v = I v/h v, where I v is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Electrical Characteristics at T A = 25°CCapacitanceSpeed of Response Forward Voltage Reverse Breakdown C (pF)t s (ns)Part V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Number @ I F = 20 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL MP-Typ. M ax.Min. Typ.Typ.R q J-PIN (°C/W)Typ.Q106 1.9 2.45202017045Q102 1.9 2.45202017045P1061.92.45202017045Electrical Characteristics at T A = 25°C Part CapacitanceSpeed of Response Number Forward Voltage Reverse Breakdown C (pF)t s (ns)(Low V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Current)@ I F = 0.5 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL M P-Typ. M ax.M in. Typ.Typ.R q J-PIN (°C/W)Typ.Q156 1.6 1.95202017045Q152 1.6 1.95202017045P1561.61.95202017045Figure 5. Relative efficiency vs. peak forward current.Figure 7. Maximum average current vs. peak forward current.Figure 6. Maximum forward DC current vs.ambient temperature. Derating based on T J MAX = 110°C.ηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )53000.0I PEAK – PEAK FORWARD CURRENT – mA 102050100212000.10.20.30.40.50.60.70.80.91.01.11.2Figure2. Relative intensity vs. wavelength.Figure 4. Relative luminous intensity vs. DC forward current.Figure 3. Forward current vs. forward voltage.R E L A T I V E I N T E N S I T Y 600100010-3WAVELENGTH – nm70050010-210-11.0R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )20.50.01I F – DC FORWARD CURRENT – mA51020502.42.01.00.20.10.0510.5I F – F O R W A R D C U R R E N T – m A1.03.5300201V F – FORWARD VOLTAGE – V1.52.02.53.02001005010520.5I A V G = A V E R A G E F O R W A R D C U R R E N T – m AI PEAK – PEAK FORWARD CURRENT – mAI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CN O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 8. HLMP-Q106/-Q156.N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 9. HLMP-Q102/-Q152N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 10. HLMP-P106/-P156.Intensity Bin LimitsBin Min.Max.E0.63 1.25F 1.00 2.00G 1.60 3.20H 2.50 5.00J 4.008.00K 6.3012.50L10.0020.00M16.0032.00N25.0050.00P40.0080.00Q63.00125.00R100.00200.00S160.00320.00T250.00500.00U400.00800.00V630.001250.00W1000.002000.00X1600.003200.00Y2500.005000.00Color Bin LimitsPackage Bin Min.Max.Red0Full DistributionMechanical Option00Straight Leads, Bulk Packaging, Quantity of 500 Parts11Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel 12Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts14Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel 21Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel22Yoke Leads, Bulk Packaging, Quantity of 500 Parts24Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel31Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel32Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts34Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Note:All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5930-2437EJanuary 18, 20055989-1711EN。
120KVA 机型6脉冲和12脉冲的技术差别6脉冲指以6个可控硅(晶闸管)组成的全桥整流,由于有6个开关脉冲对6个可控硅分别控制,所以叫6脉冲整流。
一般三相电使用6脉冲整流时,由于晶闸管只在交流电压波形幅值大于直流母线电压时才导通,输入电流不连续呈脉冲状,谐波含量很高,不加额外的滤波方式如无源滤波(电感)、有源滤波(PFC )时,输入反馈回电网的谐波电流总THD 超过30%,即总谐波电流含量超过总电流的33%,有可能造成配电线缆、变压器发热,空气开关误动作,发电机喘振等。
6脉冲整流原理图和电流电压效果图:加入无源滤波器即校正电感后,才可将输入电流谐波含量降至10%左右。
但这仅仅是满载情况下的指标。
实际上,越是轻载情况,6脉冲整流器的输入谐波电流含量就越大,比如50%负载情况下,6脉冲整流器的输入谐波电流总含量超过56%;25%负载情况下,则超过78%。
也就是说,谐波的绝对值基本不随负载量的减轻而减少。
12脉冲是指在原有6脉冲整流的基础上,在输入端增加移相变压器后在增加一组6脉冲整流器,使直流母线电流由12个可控硅整流完成,因此又称为12脉冲整流。
它使整流器导通角大幅增加,输入电流更平滑,谐波电流含量减少,一般可达到10%左右,在增加无源电感滤波后,输入谐波电流可降至4%以下。
而且,即使轻载工作,其良好的输入电流特性也不会大幅下降。
比如50%负载情况下,12脉冲整流器的输入谐波电流总含量<12%;25%负载情况下,则<15%。
可以有效减少谐波的绝对值。
12脉冲整流UPS 原理如下图:自动旁路移相变压器L+L-电池开关内置手动维修旁路UPS 1电池SCRSCR6脉冲整流器6脉冲整流器UPS 中有并联冗余的2个6脉冲整流器,所以,其工作时即使有一个整流器故障,也不会影响UPS 正常工作,提高了UPS 系统的故障容错能力。
由于使用了全功率的移相变压器和6脉冲整流器,所以同厂家的12脉冲整流器的UPS 比6脉冲整流器的UPS 体积、重量都要大至少1/3。
基于集成电路应力测试认证的失效机理内容列表AEC-Q100 基于集成电路应力测试认证的失效机理附录1:认证家族的定义附录2:Q100设计、架构及认证的证明附录3:邦线测试的塑封开启附录4:认证计划和结果的最低要求附录5:决定电磁兼容测试的零件设计标准附录6:决定软误差测试的零件设计标准附件AEC-Q100-001 邦线切应力测试AEC-Q100-002 人体模式静电放电测试AEC-Q100-003 机械模式静电放电测试AEC-Q100-004 集成电路闩锁效应测试AEC-Q100-005 可写可擦除的永久性记忆的耐久性、数据保持及工作寿命的测试 AEC-Q100-006 热电效应引起的寄生闸极漏电流测试AEC-Q100-007 故障仿真和测试等级AEC-Q100-008 早期寿命失效率(ELFR)AEC-Q100-009 电分配的评估AEC-Q100-010 锡球剪切测试AEC-Q100-011 带电器件模式的静电放电测试AEC-Q100-012 12V系统灵敏功率设备的短路可靠性描述感谢任何涉及到复杂技术的文件都来自于各个方面的经验和技能,为此汽车电子委员会由衷承认并感谢以下对该版文件有重要贡献的人:固定会员:准会员:特邀会员:其他支持者:注意事项AEC文件中的材料都是经过了AEC技术委员会所准备、评估和批准的。
AEC文件是为了服务于汽车电子工业,无论其标准是用在国内还是国际上,都可排除器件制造商和采购商之间各方面的不一致性,推动产品的提高和可交换性,还能帮助采购商在最小的时间耽搁内选择和获得来自那些非AEC成员的合适的产品。
AEC文件并不关注其采纳的内容是否涉及到专利、文章、材料或工艺。
AEC 没有认为对专利拥有者承担责任,也没有认为要对任何采用AEC文件者承担义务。
汽车电子系统制造商的观点主要是AEC文件里的信息能为产品的说明和应用提供一种很完美的方法。
如果没有在本文件见到所陈述的要求,就不能声称与本文件具有一致性。
HPMLDL系列服务器hpML系列服务器HP ProLiant ML110G7(C8R00A)参数规格差不多参数产品类型工作组级产品类别塔式产品结构4U处理器CPU类型奔腾双核CPU型号奔腾双核G860CPU频率3GHzHP ProLiant ML330 G6(600911-AA1)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核HP ProLiant ML330 G6(B9D22A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600 CPU型号Xeon E5606CPU频率 2.13GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存8MB总线规格QPI 4.8GT/sHP ProLiant ML330 G6(600911-AA1)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核HP ProLiant ML350 G6(638180-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5606CPU频率 2.13GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存8MB总线规格QPI 4.8GT/sCPU核心四核CPU线程四线程数主板HP ProLiant ML350 G6(600431-AA5)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核CPU线程八线程数HP ProLiant ML350 G6(594869-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核CPU线程八线程数HP ProLiant ML310e Gen8(686146-AA5)参数规格差不多参数产品类型企业级产品类别塔式产品结构4U处理器CPU类型Intel 至强E3-1200 v2 CPU型号Xeon E3-1220 v2CPU频率 3.1GHz标配CPU1颗数量最大CPU4颗数量制程工艺22nm三级缓存8MB总线规格DMI 5GT/sHP ProLiant ML310e Gen8(686147-AA5)参数规格差不多参数产品类型企业级产品类别塔式产品结构4U处理器CPU类型Intel 至强E3-1200 v2 CPU型号Xeon E3-1240 v2CPU频率 3.4GHz智能加速主3.8GHz频标配CPU1颗数量最大CPU4颗数量制程工艺22nm三级缓存8MBHP ProLiant ML350e Gen8(C3Q10A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2403CPU频率 1.8GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3Q08A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2407CPU频率 2.2GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3Q09A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2420CPU频率 1.9GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存15MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3F91A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2430CPU频率 2.2GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存15MB总线规格QPI 6.4GT/sHP ProLiant ML350p Gen8(646675-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2600 CPU型号Xeon E5-2609CPU频率 2.4GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350p Gen8(668271-AA5)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2600 CPU型号Xeon E5-2620CPU频率2GHz智能加速主2.5GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm。
14Honeywell/Commercial Switch&Sensor 霍尼韦尔商业开关与传感器特点侧接收塑料封装TTL/LSTTL/CMOS 兼容反向逻辑输出线性或旋转编码器应用分辨率为0.229mm具有灵敏度温度补偿机械结构上和光谱上与SEP8506和SEP8706LED 相匹配HLC2701专为感测机械运动的速度和方向而设计。
应用包括旋转编码器或线位移编码器。
特别适用于光学鼠标中的编码器。
探测器为单片集成电路包括两个非常靠近的光电二极管、放大器和施密特触发器输出单元。
输出为NPN 集电极带10K Ω上拉电阻,可直接驱动TTL 负载。
探测器中具有灵敏度温度补偿电路,来补偿由于温度变化LED输出功率的漂移。
集成电路封装在一个模压不透光的黑色塑料壳中,可以透射红外能量,而阻挡可见光的透射。
集成电路的敏感区每个宽0.203mm,高0.381mm ,间隔0.0254mm,中心到中心的间隔为0.203mm ,外部边缘到边缘的距离为0.432mm 。
电参数参数供电电压导通辐射阈值迟滞供电电流高电平输出电压(A 和B)低电平输出电压(A 和B)输出上升时间和下降传播延迟,低-高,高-低符号Vcc E eT HYST Icc V OH V OL t r ,t f t PLH , t PHL 最小值 4.5 0.05 2.4典型值 28 100 5最大值 5.5 2.0 7.0 0.4 单位V mW/cm2 % mA V V ns µs 测试条件Vcc=5V Vcc=5.25V Vcc=5V,I OH =0,Ee=0Vcc=5V,I OL =1.6mA,Ee=2.0mW/cm2Vcc=5V,R L =1Kohm Vcc=5V,R L =1Kohm 功能框图外形尺寸图,单位为英寸(毫米)SUNSTAR传感与控制/TEL:0755-********FAX:0755-********E-MAIL:**************SUNSTAR自动化/TEL:0755-********FAX:0755-********E-MAIL:**************公司由传感器销售部、仪表销售部、工程部和总务部四个部组成。
XeniumX710CTX710GRYTwice the reach, twice the performanceThe Philips Xenium X710 has two active SIM card slots so you can use separate lines for different groups of contacts. Together with its extra-long life battery, you will get twice the reach and performance from this phone when on the road.Maximize your mobilityDual SIMAlways on, always connectedUp to 1 month of standby timeUp to 8.5 hours of talk timeMaximize your Multimedia Experience3 Megapixel autofocus cameraVideo capture and playback in MPEG4 and H263 formatEnjoy Bluetooth stereo musicHigh-quality integrated FM radioMicroSD memory card slot for extra memory/ data storageHighlights Dual SIM, dual coverageEnjoy the dual benefits of having 2 mobile phone lines for different communications needs. Your mobile phone can have 2 SIM cards with 2 GSM connections at the same time - it's like having 2 phones in 1! Plus, enjoy wider mobile coverage on the move. Up to 8.5 hours talk timeThe phone can support up to 8.5 hours talk time on a single charge.3 Megapixel autofocus cameraCapturing memorable moments clearly is assimple as point and shoot. The autofocus worksautomatically when you press thecamera button halfway. Simply press the buttonall the way in order to capture a clear, sharpimage.SpecificationsPicture/DisplayMain Display Colors: 262KDiagonal screen size (inch): 2.4 inchMain Display Resolution: 240x320 pixelMain Display Technology: TFTSoundRingers: MP3 ringer, Polyphonic (64 tones), Voice memo ringerEqualizer settings: Classical, Pop, Rock, Bass, Normal, TrebleVideo PlaybackCompression formats: MPEG4, H.263, 3GP Frame rate (fps): 30Resolution (pxl): 176x144, 352x288Video RecordingCompression formats: MPEG4, 3GP, H.263 Frame rate: 15 fpsResolution (pxl): 176x144, 352x288Audio PlaybackAudio supported formats: ADPCM, AMR, Midi, MP3, SP-Midi, AAC, WAV, AAC+, WMAAudio CapturingVoice recording: Yes, AMRStill Picture PlaybackPicture Compression Format: BMP, GIF, GIF (87a & 89a), JPEG, PNG, WBMPPicture Enhancement: Flip photos, Frames & Icons, Rotate, Picture editorRotation: 90 degree steps Still Picture CapturingCamera: IntegratedImage sensor type: CMOSPreview frame rate: 30 frames/secondPicture file format: JPEGPicture Mode: Normal, Night mode, Self-timermode, Multi-shotPicture resolution: VGA (640x480), QVGA(320x240), 2M (1600x1200), 3M (2048x1536)Special effects preview mode: Grey scale,Sepia, Embossed, Blackboard, Whiteboard,Color invert, Contrast, Copper carving, Grayinvert, NormalWhite balance: Automatic, Cloudy,Incandescent, Fluorescent, Daylight, Tungsten,ManualPicture quality: Normal, High, LowStorage MediaMemory Card Types: Micro SDMemory management: Memory statusUser memory: 20 MBMaximum memory card capacity: 8 GBMultimedia ApplicationsMemory Card Access: SD card slotConnectivityBluetoothHeadset: Via mini USB connectorModem Capabilities: GPRSSynchronisation PC organizer: Lotus Notes,MS OutlookWireless connections: BluetoothBluetooth profiles: A2DP, Handsfree, Headset,Object push profile, File transfer profilePC Link: USB 1.1ConvenienceButtons and controls: 4-way navigation keyand enter, Camera key, Side keys, Soft keysCall Management: Call Cost, Call on Hold,Call Time, Call Waiting*, Caller ID*,Conference Call, Emergency Call, Microphonemute, Missed Calls, Multi-party call, ReceivedCalls, FirewallClock/Version: Analogue, Digital,International clockEase of Navigation: Animated Color MatrixEase of Use: Hands free mode, Hot Keys, In-flight mode, Keypad Lock, Screen SaverDigital Clock, Softkeys, Vibra Alert, Dual SIMcardsGames and applications: Alarm Clock,Calculator, Java MIDP 2.0, Stopwatch,Agenda, Calendar, Fantasy Kingdom game,International converter, My Card, Photo Editor,Sudoku gameLanguage available: T9 input: English,French, Russian, TurkishLanguage available: UI: French, Hungarian,Romanian, Russian, Turkish, EnglishMultimedia: FM RadioPersonal Info Management: Daylight saving,Time Zone, Vcard Exchange, Task listVolume controlEmbedded Games: 2Personalisation/Customization:Downloadable Animated GIF, DownloadablePicture, Downloadable Ringtones, ScreenSaver, WallpaperVibratorAccessoriesStandard Package Includes: Battery, CD ROM(Mobile Phone Tools), Charger, Handset,International Guarantee, SAR informationleaflet, Stereo Headset, User Manual, USBdata cableOptional accessories: 1GB SD cardGreen SpecificationsPackaging material: CartonUser manual: Recycled paperDimensionsAntenna: IntegratedForm Factor: Candy barHandset color: Black GreyHandset dimensions: 113.6 x 49.1 x 16.9mmHandset weight: 114g (without battery)* Specification indicated based on initial full batterycharge tested in laboratories with Bluetooth switchedoff. Actual performance is dependent on networkservice provider and usage.© 2019 Koninklijke Philips N.V.All Rights reserved.Specifications are subject to change without notice. Trademarks are the property of Koninklijke Philips N.V. or their respective owners.Issue date 2019‑10‑23 Version: 5.0.112 NC: 8670 000 52275 EAN: 87 12581 48080 6。
q100电源芯片引脚功能参数Q100电源芯片是一种具有多种功能的集成电路,用于提供电源管理和电源转换功能的解决方案。
它可以在各种应用中使用,例如移动设备、消费电子产品和工业设备等。
电源芯片的引脚功能参数如下:1. VIN(供电输入):该引脚用于连接输入电源,通常为直流电压。
VIN可以连接电池、电源适配器或其他电源。
它是电源芯片的主要供电来源。
2. VOUT(供电输出):该引脚用于输出电源,通常为所需的稳定电压。
VOUT的电压通常由电源芯片内部的电压调节电路稳定产生,以满足其他组件的电源需求。
3. GND(地):该引脚用于连接电源芯片和其他组件的地线。
地线是电路中的参考电平,用于确保信号正确地传输。
4. EN(使能):该引脚用于控制电源芯片的开关状态。
通过使能引脚的高电平或低电平,可以控制芯片的工作或关闭。
5. PG(电源好):该引脚用于指示电源的状态,通常用于检测电源输出是否正常。
当电源芯片输出稳定且正常时,PG引脚会产生高电平;否则,会产生低电平或无效电平。
6. FB(反馈):该引脚用于反馈电源芯片输出电压的稳定度。
通过调整反馈电压,可以调节输出电压的稳定性。
7. UVLO(欠压锁定):该引脚用于检测输入电压是否低于指定阈值。
当输入电压低于欠压锁定阈值时,电源芯片将自动关闭输出,以避免对负载产生不稳定的供电。
8. OT(过温保护):该引脚用于检测芯片温度是否达到指定阈值。
当温度过高时,电源芯片将自动关闭输出,以保护芯片和其他元件免受损坏。
9. SS(软启动):该引脚用于控制电源芯片的启动时间和斜率。
通过调整软启动电路,可以实现平稳的电源启动,减少启动时的电流冲击。
10. PGND(功率地):该引脚是电源芯片供电系统的地线。
这些引脚功能参数提供了电源芯片的基本功能,可以支持高效、稳定和可靠的电源管理。
通过合理配置这些引脚,可以满足各种应用的电源需求,并提供保护机制,确保系统的正常运行和可靠性。
q100电源芯片引脚功能参数
Q100电源芯片是一种具有高效率和低功耗的集成电路,用于
电源管理和电源转换的应用。
它的引脚功能参数包括:
1. Vin:输入电压引脚,用于连接电源输入。
2. GND:接地引脚,用于连接电源的地。
3. Vout:输出电压引脚,用于连接电源芯片的电源输出。
4. EN:使能引脚,用于控制电源芯片的工作状态,通常通过
给EN引脚提供高电平来使能电源芯片。
5. FB:反馈引脚,用于调整输出电压。
通常通过与电压分压
电阻网络相连,将一定比例的输出电压反馈给芯片,以实现对输出电压的调节。
6. PG:输出电压监测引脚,用于检测输出电压的情况。
通常
通过给PG引脚提供一个电平,表示输出电压稳定或者异常。
7. SS:软起动引脚,用于控制电源芯片的软起动时间。
通常
通过给SS引脚提供一个时间常数来设置软起动时间。
8. BST:上电源引脚,用于连接输入电容。
通常通过给BST
引脚提供电压来为电源芯片提供额外的电源支持。
这些参数可以根据具体的电源芯片型号和应用需求来有所不同,
以上只是一些常见的功能参数。
在使用Q100电源芯片时,应参考数据手册中的详细说明和推荐应用电路设计。
在哪里可以找到过程测量和控制所需的各种产品?当然是OMEGA!网上订购:温度M U热电偶、RTD和热敏电阻探头、连接器、面板以及组件M U线材:热电偶、RTD和热敏电阻M U校准器和冰点基准M U记录仪、控制器和过程监测器M U红外线高温计压力、应变和作用力M U传感器和应变计M U称重传感器和压力表M U位移传感器M U仪表和配件流量/液位M U转子流量计、气体质量流量计和流量积算器M U空气流速指示器M U涡轮/叶轮系统M U累加器和配料控制器pH值/电导率M U p H电极、测试仪和配件M U台式/实验室仪表M U控制器、校准器、模拟器和泵M U工业pH值和电导率测量设备数据采集M U基于通信的采集系统M U数据记录系统M U无线传感器、发射器和接收器M U信号调节器M U数据采集软件加热器M U加热电缆M U筒式和带状加热器M U浸没式和带式加热器M U柔性加热器M U实验室加热器环境监测和控制M U计量和控制仪表M U折射计M U泵和管道M U空气、土壤和水监测器M U工业给水和废水处理M U p H值、电导率和溶解氧仪表M5685/0418电子邮件: ************** 索取最新的产品手册: DP606A/DP612A通用6/12通道¼ DIN面板仪表用户指南目录章节................................................................................ 页码第1节简介 (1)第2节安装和操作条件 (2)第3节安装说明 (3)第4节接线说明 (4)4.1 后面板示意图 (4)4.2 连接电源线路 (5)4.3 连接报警线路 (6)4.4 连接通信线路 (7)4.5 连接输入线路 (7)第5节导航 (8)5.1 运行模式 (8)5.2 锁定分区 (9)5.3 清除报警 (9)5.4 检查设定值 (9)5.5 功能选择模式 (9)5.6 重置默认值 (9)5.7 功能选择模式 (10)5.8 功能1 - 输入密码 (11)5.9 功能2 - 设置活动分区 (11)5.10 功能3和4 - 设置高低设定值 (12)5.11 功能5 - Modbus地址 (13)5.12 功能6 - 设置扫描时间 (13)5.13 功能7 - 设置设备配置 ....................................................... 14-155.14 功能8 - 启用/禁用密码 (16)5.15 功能9 - 校准 (16)5.16 功能A/B - 报警继电器功能 (17)5.17 功能C/D - 标度 (18)5.18 功能F - 串行配置 (19)第6节串行接口 (20)6.1 Modbus功能 (20)6.2 数据格式 (21)6.3 多寄存器读取 (21)6.4 多寄存器写入 (22)6.5 请求数据包大小 (22)目录章节................................................................................ 页码第7节 Modbus寄存器赋值 (23)7.1 系统寄存器 (23)7.2 温度寄存器 (24)7.3 状态寄存器 (24)7.4 分区寄存器 (25)7.5 用户校准 (26)7.6 枚举值 (26)7.7 传感器类型 (26)7.8 RTD类型 (26)7.9 热电偶类型 (27)7.10 传感器状态 (27)7.11 系统状态 (27)7.12 过程单位 (28)7.13 报警类型 (28)7.14 报警状态 (28)7.15 设置切换 (28)第8节规格 (29)8.1 报警继电器 (29)8.2 输入精度 (30)第9节认证信息 (31)图和表图................................................................................... 页码图1 侧面和面板开孔图 (3)图2 DP606A/DP612A:后面板连接 (4)图3 主电源连接 (5)图4 继电器连接 (6)图5 3线RTD接线图 (7)图6 前面板示意图 (8)图7 过程输入标度 (18)表................................................................................... 页码表1 后面板连接 (4)表2 9针输入电源/继电器接线汇总 (5)表3 连接通信线路 (7)表4 功能代码 (10)表5 设备配置 (14)表6 报警继电器配置 (17)表7 串行端口配置 (19)表8 Modbus功能 (20)表9 多寄存器写入 (22)表10 数据包大小 (22)表11 系统寄存器 (23)表12 温度寄存器 (24)表13 传感器状态寄存器 (24)表14 分区寄存器 (25)表15 用户校准 (26)表16 输入精度 (30)第1节 - 简介DP606A/DP612A显示仪表提供了一种灵活且易用的6区或12区、4位数温度和过程测量解决方案,并采用坚固的¼ DIN铝质外壳。
h10g-12说明书产品名称:H10G-12 说明书1. 产品概述H10G-12 是一款高性能电子设备,具有先进的功能和可靠的性能。
此说明书将为您提供产品的详细信息和使用指导。
2. 产品特点- 高性能处理器:H10G-12 配备了先进的处理器,为用户提供卓越的运行速度和响应能力。
- 大容量存储:H10G-12 提供大容量存储空间,让您存储和管理大量数据和文件。
- 独立显卡:H10G-12 配备独立显卡,可实现流畅的图形显示和高清视频播放。
- 多种连接选项:H10G-12 支持多种连接选项,包括USB、HDMI、以太网等,便于您与其他设备进行数据传输和共享。
3. 产品使用3.1 开始使用- 打开包装箱,将 H10G-12 取出。
- 连接适配器和电源线,将电源线插入插座并连接至设备,接通电源。
- 按下开机按钮启动 H10G-12。
3.2 界面和功能H10G-12 的界面简洁直观,功能齐全。
您可以通过触摸屏或键盘鼠标操作,实现各项功能和设置。
3.3 数据存储和管理H10G-12 的大容量存储空间能够满足您的数据存储需求。
您可以使用内置文件管理器对文件进行管理和组织。
3.4 连接和传输H10G-12 支持多种连接选项,您可以通过USB接口将设备连接至其他外部设备,进行数据传输和共享。
您还可以通过HDMI接口将H10G-12 连接至显示器或电视机,享受高清画质。
4. 安全使用须知- 在使用 H10G-12 时,请确保环境通风良好,并避免长时间过度使用。
- 使用适配器时,请使用原装适配器并避免过度拉扯电源线。
- 避免将 H10G-12 暴露在过高或过低的温度环境中。
- 在长时间不使用时,请将 H10G-12 关机并断开电源。
5. 保修和售后服务H10G-12 享有一定的保修期限,详细的保修条款和注意事项请查看随附的保修卡。
如需售后服务或技术支持,请联系我们客服部门,我们将尽力为您解决问题。
重要提示:本文仅为产品说明书,不包含任何网址、超链接和电话联系方式。
GLOBAL SERVICE NETWORKNorgren is a leading world manufacturer and supplier of pneumatic solutions, offering a comprehensive range of pneumatic components and automation systems via a global sales and service network which covers 70 countries worldwide. The company is a principal member of the diverse and internationallysuccessful £1.4 billion IMI Group.a subsidiary of IMI plcCodeThe Roundel, ‘Norgren’ and ‘IMI’ are registered trade marks. IMI Norgren Limited 1998. Due to our policy of continued development, Norgren reserve the right to change specifications without prior notice.FM20822ActuatorsPneumatic control and process valvesAir preparationFittings and accessoriesHandling componentsHandling systemsAUSTRALIATe l : + 61 3 9213 0800Fa x : + 61 3 9213 0890AUSTRIATe l : + 43 2236 63 520Fa x : + 43 2236 63 520 20BELGIUM AND LU X E M B U R GTe l : + 32 2 376 60 20Fa x : + 32 2 376 26 34BRAZILTe l : + 55 11 522 1066Fa x : + 55 11 523 2259C A N A D ATe l : + 1 905 625 4060Fa x : + 1 905 625 8273CHINATe l : + 86 21 648 57935Fa x : + 86 21 649 56042CZECH REPUBLIC NorthTe l : + 42 0446 2010Fax: + 42 0446 2010SouthTe l : + 42 06296 33404Fax: + 42 06296 33404D E N M A R KTe l : + 45 44 91 41 66Fa x : + 45 44 91 15 60FRANCETe l : + 33 1 60 05 92 12Fa x : + 33 1 60 06 08 52GERMANY &EASTERN EUROPE Te l : + 49 28 02 490Fa x : + 49 28 02 49356H O N G KO N GTe l : + 85 2 2492 7608Fa x : + 85 2 2498 5878H U N G A RYTe l : + 36 1 284 9000Fa x : + 36 1 284 8980IRELA N DTe l : + 35 318 300 288Fa x : + 35 318 300 082ITALYTe l : + 39 039 60 631Fa x : + 39 039 60 63 301J APA NTe l : + 81 6 876 8913Fa x : + 81 6 876 8929M A LAYSIATe l : + 60 3 5219 255Fa x : + 60 3 5212 889M E X I C OTe l : + 52 5 565 7521Fa x : + 52 5 565 7072N E T H E R LA N D STe l : + 31 20 682 2751Fa x : + 31 20 682 0983NEW ZEALA N DTe l : + 64 9 579 0189Fa x : + 64 9 526 3397N O R WAYTe l : + 47 67 90 82 01Fa x : + 47 67 97 06 24SINGAPORETe l : + 65 862 1811Fa x : + 65 862 1916/7SLOVENIATe l : + 38 661 573 688Fa x : + 38 661 571 212SPAINTe l : + 34 3 731 0000Fa x : + 34 3 783 0838S W E D E NTe l : + 46 46 19 67 50Fa x : + 46 45 15 25 95SWITZERLA N DTe l : + 41 71 973 82 00Fa x : + 41 71 973 82 01U KTe l : + 44 1543 265 000Fa x : + 44 1543 265 811USATe l : + 1 303 794 2611Fa x : + 1 303 795 9487Automotive Division GERMANYTe l : + 49 61 22 9093 0Fa x : + 49 61 22 9093 99I TALYTe l : + 39 11 95 710 43Fa x : + 39 11 95 72 715PACIFIC/SOUTH AMERICATe l : + 1 810 294 9500Fa x : + 1 810 294 7830U KTe l : + 44 1543 405300Fax: + 44 1543 405350USATe l : + 1 810 294 9500Fa x : + 1 810 294 9715Norgren market companies worldwideTelephone: (01202) 480 303Fax: (01202) 480 808Email:sales @coulton .comR27: Precision Pressure Regulator200: Handwheel Operated 230: Lever Operated 232: Plunger Operated 234:Pneumatic Relay236: Pneumatic Relay with manual biasRNC: 0.14 - 2 bar rangeRNF: 0.14 - 4 bar range RNL:0.14 - 8 bar range G: G1/4Please quote the following part numbers when ordering eg R27 230 RNFG is a lever operated 0.14 - 4 bar unit.Control stem - double start threads to allow high resolution• DEAD-END APPLICATIONS - the R27 is designed to control pressure under forward and relief flowconditions. This makes it ideal for use with actuators and closed volumes.• PRECISION - with accuracies of 0.02%, sensitivity better than 0.3mbar (0.005psi) and hysteresis and repeatability less than 0.05%, this regulator provides precision control under the most adverse operating conditions.• STABILITY - the integrated measuring capsule, a sophisticated barometric measuring element, offers extreme stability under all operating conditions.• SIMPLE DESIGN - the R27’s uncomplicated design is effective and reliable, providing accuracy and precision in thousands of applications around the globe.The R27 Pr e c i s i o n Pr e s s u re Re g u l a t o rSt a b i l i t y P r e c i si o nPrecision pressure control, a requirement in many industrial applications, is often complicatedby changes in supply pressure, flow and ambient temperature. The R27 precision regulator is designed to give stable and accurate pressure control under conditions of flow and zero flow (dead end). Using proven instrumentation technology the R27 can add a degree of precision toany application imaginable using more traditional regulation solutions.Speci fication at a glanceOutput pressure See product selector Max supply pressure 10 bar (140 psig)Air supplyOil free, dry air or other gases, filtered to 25 micronsFlow capacity Up to 300 l/min (10 scfm). Response time Less than 0.2 seconds for 50% load change Hysteresis and Repeatability Less than 0.05% at mid-range Sensitivity Better than 0.3mbar (0.005psi)Temperature effect Better than +/-1% change of full span between -20C and +70CWeatherproof IP65Vibration effect Unaffected by moderate vibration Mounting orientation Any, integral mounting nut suppliedPneumaticallybalanced, servo controlled poppet valve design - high flow under forward and relief conditionsLow volume pilot chamber -has small constant bleed to ensure responsiveness under dead end conditionsBeryllium copper capsule - responds to any pressure variation to give output stability regardless of flow or supply pressure variationProduct Selection。
海乐无线遥控开关相关产品介绍产品产品类别与分类技术指示注意事项类别:机械式跷板遥控开关分类:1)单极性制跷板开关(即单火线取电,可控硅控制,功率单路200W)2)双极性制跷板开关(即零火线取电,继电器控制,功率单路1000W)产品型号分类:HL-001~HL-003纯白色HLB-001~HLB-003带电镀中框HLC-001~HLC-003纯灰色以上几个型号,只是面板不一样,但电路板是一样的,客户可跟厂家联系单购电路板部份配件,这样可减少进货成本1、最大负载电流:5A(注:如接并联多个节能灯,电流可能会超过5A)2、使用寿命:100,0000次操作3、工作电压:交流180~250V/50HZ/60HZ4、工作频率:315MHZ5、标准外观尺寸:86*86*35MM6、温度环境:0~80度:相对湿度小于等于95%7、待机电流:220V 30UA,待机功耗小于等于0.0066W8、遥控距离:视遥控器而定,详情请跟客服联系9、安装接线:单线制开关与普通开关完全一样,不需接零线,可以很方便的进行更换和安装,双线制开关需要接零线,但稳定性与使用寿命相当高,不会出现关灯后闪烁现像。
10、负载功率:单线制开关:单路阻性负载小于等于200W,感性和容性负载小于等于80W;双线制开关:单路阻性负载小于等于1000W,感性和容性负载小于等于400W(注:乌丝灯,白炽灯为阻性负载;节能灯,荧光灯分别为容性与感性负载)单极性制开关如果接电感式的日光灯,需要换一个带电容的启辉器才能使开关正常工作,详情请看附件:遥控开关小知识与单比线制开关电路图类别:单极性制触摸屏无线遥控开关(此产品只有单火线的,没有零火线的)分类:1)1000W触1、最大负载电流:5A(注:如接并联多个节能灯,电流可能会超过5A)2、使用寿命:100,0000次操作3、工作电压:交流180~250V/50HZ/60H此产品有一个特点:开关通电后,面板上对应的按扭摸无线遥控开关(继电器控制,总功率1000W)2)200W触摸无线遥控开关(可控制控制,单路功率200W)产品型号分类:分为纯白面板,喷灰面板,电镀面板分为浅灰色与香槟色,量大可做其他色种。
电阻模型参数R 电阻倍率因子TC1 线性温度系数TC2 二次温度系数电容模型参数C 电容倍率因子VC1 线性电压系数VC2 二次电压系数TC1 线性温度系数TC2 二次温度系数电感模型参数L 电感倍率因子IL1 线性电流系数IL2 二次电流系数TC1 线性温度系数TC2 二次温度系数二极管模型参数IS 饱和电流RS 寄生串联电阻N 发射系数TT 渡越时间CJO 零偏压PN结电容VJ PN结自建电势M PN结剃度因子EG 禁带宽度XT1 IS的温度指数FC 正偏耗尽层电容系数BV 反向击穿电压(漆点电压)IBV 反向击穿电流(漆点电流)KF 闪烁躁声系数AF 闪烁躁声指数双极晶体管(三极管)IS 传输饱和电流EG 禁带宽度XTI(PT)IS的温度效应指数BF 正向电流放大系数NF 正向电流发射系数V AF(V A)正向欧拉电压IKF (IK)正向漆点电流ISE(C2)B-E漏饱和电流NE B-E漏饱和电流BR 反向电流放大系数NR 反向电流发射系数V AR(VB)正想欧拉电压IKR 反向漆点电流ISC C4 B-C 漏饱和电流NC B-C漏发射系数RB 零偏压基极电阻IRB 基极电阻降致RBM/2时的电流RE 发射区串联电阻RC 集电极电阻CJE 零偏发射结PN结电容VJE PE 发射结内建电势MJE ME 集电结剃度因子CJC 零偏衬底结PN结电容VJC PC 集电结内建电势MJC MC 集电结剃度因子XCJC Cbe 接至内部Rb的内部CJS CCS 零偏衬底结PN结电容VJS PS 衬底结构PN结电容MJS MS 衬底结剃度因子FC 正偏势垒电容系数TF 正向渡越时间XTF TF随偏置变化的系数VTF TF随VBC变化的电压参数ITF 影响TF的大电流参数PTF 在F=1/(2派TF)Hz时超前相移TR 反向渡越时间XTB BF和BR的温度系数KF I/F躁声系数AF I/F躁声指数Is=14.34f 反向饱和电流。
Agilent Subminiature High Performance TS AlGaAs Red LED Lamps Data SheetFeatures•Subminiature flat top package Ideal for backlighting and light piping applications•Subminiature dome package Diffused dome for wide viewing angleNon-diffused dome for high brightness•Wide range of drive currents500 µA to 50 mA •Ideal for space limited Applications •Axial leads•Available with lead configurations for surface mount and through hole PC board mountingDescriptionFlat Top PackageThe HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens toprovide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Dome PackagesThe HLMP-Qxxx Series dome lamps, for use as indicators, use a tinted, diffused lens to provide a wide viewing angle with high on-off contrast ratio. High brightness lamps use anuntinted, nondiffused lens to provide a high luminous inten-sity within a narrow radiation pattern.Lead ConfigurationsAll of these devices are made by encapsulating LED chips onaxial lead frames to form molded epoxy subminiature lamppackages. A variety of package configuration options isavailable. These include special surface mount lead configura-tions, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead BendOptions for Subminiature LED Lamps data sheet.TechnologyThese subminiature solid state lamps utilize a highly optimized LED material technology,transparent substrate aluminum gallium arsenide (TS AlGaAs).This LED technology has a very high luminous efficiency,capable of producing high light output over a wide range of drive currents (500 µA to 50mA). The color is deep red at a dominant wavelength of 644nm deep red. TS AlGaAs is a flip-chip LED technology, dieattached to the anode lead and wire bonded to the cathode lead.Available viewing angles are 75°, 35°, and 15°.HLMP-P106/P156HLMP-Q102/Q152HLMP-Q106/Q156Device Selection GuideViewing Angle Deep Red Typical Iv Typical IvPackage Description 2 q1/2R d = 644 nm I F = 500 µa I F = 20 mA Package Outline Domed, Diffused Tinted,35HLMP-Q102100BStandard CurrentDomed, Diffused Tinted,35HLMP-Q1522BLow CurrentDomed, Nondiffused15HLMP-Q106400BUntinted, Standard CurrentDomed, Nondiffused15HLMP-Q1567BUntinted, Low CurrentFlat Top, Nondiffused,75HLMP-P106130AUntinted, Standard CurrentFlat Top, Nondiffused75HLMP-P1562AUntinted, Low CurrentOrdering InformationHLMX-XXXX-X X X X XPackagingOptionColor BinSelectionMax. Iv BinMin. Iv Bin4 x 4 Prod.PartNumberFigure 1. Proper right angle mounting to a PC board to prevent protruding anode tab from shorting to cathode c onnection.Package Dimensions A) Flat Top LampsB) Diffused and Nondiffused Dome LampsNO. CATHODE DOWN.YES. ANODE DOWN.* REFER TO FIGURE 1 FOR DESIGN CONERNS.2.082.34(0.082)(0.092)2.082.34(0.082)(0.092)0.53 (0.021)2.211.96(0.087)(0.077)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.Absolute Maximum Ratings at T A = 25°CParameters TitleDC Forward Current[1]50 mAPeak Forward Current[2]300 mAAverage Forward Current[2,3]30 mATransient Forward Current (10 µs Pulse)[4]500 mAPower Dissipation100 mWReverse Voltage 5 VJunction Temperature110°COperating Temperature-55°C to +100°CStorage Temperature-55°C to +100°CLead Soldering Temperature260°C for 5 seconds[1.6 mm (0.063 in.) from body]Reflow Soldering Temperature260°C for 20 secondsNotes:1. Derate linearly as shown in Figure 6.2. Refer to Figure 7 to establish pulsed operating conditions.3. Maximum IAVG at f = 1 kHz, DF = 10%.4. The transient peak current is the maximum non-recurring peak current the device can withstandwithout damaging the LED die and wire bonds. It is not recommended that the device beoperated at peak currents above the Absolute Maximum Peak Forward Current.Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle LuminousI V (mcd)f V (mlm)Wavelength Wavelength2q1/2Efficacy Part Number@ 20 mA[1]@ 20 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q106-R00xx1004002806546441585Q102-N00xx25100-6546443585P106-Q00xx631302806546447585Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle Luminous Part Number I V (mcd)f V (mlm)Wavelength Wavelength2f1/2Efficacy (Low Current)@ 0.5 mA[1]@ 0.5 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q156-H00xx 2.5710.56546441585Q152-G00xx 1.62-6546443585P156-EG0xx0.63210.56546447585 Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. f v is the total luminous flux output as measured with an integrating sphere.3. The dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the color of the device.4. q1/2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity.5. Radiant intensity, I v, in watts/steradian, may be calculated from the equation I v = I v/h v, where I v is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Electrical Characteristics at T A = 25°CCapacitanceSpeed of Response Forward Voltage Reverse Breakdown C (pF)t s (ns)Part V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Number @ I F = 20 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL MP-Typ. M ax.Min. Typ.Typ.R q J-PIN (°C/W)Typ.Q106 1.9 2.45202017045Q102 1.9 2.45202017045P1061.92.45202017045Electrical Characteristics at T A = 25°C Part CapacitanceSpeed of Response Number Forward Voltage Reverse Breakdown C (pF)t s (ns)(Low V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Current)@ I F = 0.5 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL M P-Typ. M ax.M in. Typ.Typ.R q J-PIN (°C/W)Typ.Q156 1.6 1.95202017045Q152 1.6 1.95202017045P1561.61.95202017045Figure 5. Relative efficiency vs. peak forward current.Figure 7. Maximum average current vs. peak forward current.Figure 6. Maximum forward DC current vs.ambient temperature. Derating based on T J MAX = 110°C.ηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )53000.0I PEAK – PEAK FORWARD CURRENT – mA 102050100212000.10.20.30.40.50.60.70.80.91.01.11.2Figure2. Relative intensity vs. wavelength.Figure 4. Relative luminous intensity vs. DC forward current.Figure 3. Forward current vs. forward voltage.R E L A T I V E I N T E N S I T Y 600100010-3WAVELENGTH – nm70050010-210-11.0R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )20.50.01I F – DC FORWARD CURRENT – mA51020502.42.01.00.20.10.0510.5I F – F O R W A R D C U R R E N T – m A1.03.5300201V F – FORWARD VOLTAGE – V1.52.02.53.02001005010520.5I A V G = A V E R A G E F O R W A R D C U R R E N T – m AI PEAK – PEAK FORWARD CURRENT – mAI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CN O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 8. HLMP-Q106/-Q156.N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 9. HLMP-Q102/-Q152N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 10. HLMP-P106/-P156.Intensity Bin LimitsBin Min.Max.E0.63 1.25F 1.00 2.00G 1.60 3.20H 2.50 5.00J 4.008.00K 6.3012.50L10.0020.00M16.0032.00N25.0050.00P40.0080.00Q63.00125.00R100.00200.00S160.00320.00T250.00500.00U400.00800.00V630.001250.00W1000.002000.00X1600.003200.00Y2500.005000.00Color Bin LimitsPackage Bin Min.Max.Red0Full DistributionMechanical Option00Straight Leads, Bulk Packaging, Quantity of 500 Parts11Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel 12Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts14Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel 21Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel22Yoke Leads, Bulk Packaging, Quantity of 500 Parts24Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel31Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel32Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts34Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Note:All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5930-2437EJanuary 18, 20055989-1711EN。