GDW3001A说明书封面

Dimensions: [mm]sectional drawing A-AScale - 2:17447452222744745222274474522227447452222T e m p e r a t u r eT T T 7447452222Cautions and Warnings:The following conditions apply to all goods within the product series of WE-TI of Würth Elektronik eiSos GmbH & Co. KG:General:•This electronic component was designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The customer is responsible for the functionality of their own products. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. Potting:•If the product is potted in the costumer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects. Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•Applying currents with audio-frequency signals might result in audible noise due to the magnetostrictive material properties. •Due to heavy weight of the components, strong forces and high accelerations might have the effect to damage the electrical connection or to harm the circuit board and will void the warranty.•Please be aware that products provided in bulk packaging may get bent and might lead to derivations from the mechanical manufacturing tolerances mentioned in our datasheet, which is not considered to be a material defect.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODTRi001.0072019-08-05DIN ISO 2768-1mDESCRIPTIONWE-TI Radial Leaded Wire WoundInductor ORDER CODE7447452222SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODTRi001.0072019-08-05DIN ISO 2768-1mDESCRIPTIONWE-TI Radial Leaded Wire WoundInductor ORDER CODE7447452222SIZE/TYPE BUSINESS UNIT STATUS PAGE。

LBI-39051A MAINTENANCE MANUALMDXPOWER AMPLIFIER BOARDS19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)DESCRIPTIONThe Power Amplifier Board (A4) used in the MDX radio is housed in a cavity running parallel to the side of the radio main casting assembly. Refer to the com-bination manual for a complete mechanical layout of the radio.The PA Board amplifies the driver output from the RF Board (approximately 13 watts) to a level of ap-proximately 40 watts, over the frequency range of 403-512 MHz. There are no tuning adjustments on the board.The board consist of a single stage RF power amplifier. Also included on the board are two multi-pin connectors used to distribute non-amplifier related signals in the radio. Two SMB connectors are used to apply drive to and take RF output from the amplifier. The 403-512 MHz range of frequencies is covered by three groups of PA Boards:19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)CIRCUIT ANALYSISThe driver output from the RF Board (13 watts, 50 ohms impedance) is matched to the base of transistor Q1 by capacitors C10, C11, C15 and a 50 ohm microstrip. Inductor L2 provides a bias return for class "C" operation.A network consisting of capacitor C19 and resistor R1 en-hances stability.Once the drive is amplified to approximately 45 watts by Q1, it is matched back up to 50 ohms by capaci-tors C7, C8, C12, C13/C17, C5/C18, C6 and the 50 ohm microstrip. Capacitor C4 is a DC blocking capacitor, which keeps DC voltage from appearing at the amplifier output.Supply voltage (A+) is applied to the collector of power transistor Q1 through a network consisting of induc-tor L1 and capacitors C1, C2, C3, C14 and C16. In addi-tion to enhancing stability, these components also prevent RF from getting onto the A+ line.The amplifier output is fed back to the radio RF Board where it passes through the antenna switch, low pass filter and directional coupler before being applied to the antenna connector.Supply voltage (A+) is applied through 6-pin connector J4 by feedthru capacitor assembly Z903. Other non-amplifier related signals are routed through the PA Board for distribution to other boards in the radio. These include A+, switched A+, relay and volume/squelch HI. A wiring harness plugs into connector J3 for this purpose.LBI-390512SERVICE NOTESThis amplifier can be easily checked without re-moving it from the radio. RF input (at connector J1) and output (at connector J2) impedances are 50 ohms.Remover all power from the radio when servicing the PA Board. The radio power switch does not remove A+ power from the board.There are 12 chip mica capacitors on this PA Board. If any are removed, replace them with a new part since they are easily damaged. Apply them in the exact positions shown in the outline diagram. Failure to do this will have an adverse effect on amplifier gain, bandwidth and efficiency.PA TRANSISTOR REPLACEMENT1.Remove the two retaining screws securing PA transis-tor Q1 to the chassis assembly.2.Unsolder the six leads of the transistor and remove itfrom the printed wire board. Be careful not to damage the board.3.Remove all excess solder from the board near Q1 andclean the board to allow the new transistor to be posi-tioned properly. Refer to the Figure and trim the newtransistor leads (if required) to the same lead lengthsof the transistor just removed.4.Apply silicon grease to the back of the replacementtransistor and place the transistor in the mounting cut-out. Make sure that the base and collector leads are not reversed.5.Replace the transistor mounting screws, leaving themloose at this time. Align the leads on the transistor be-ing replaced with the microstrip. Position each lead so that a maximum amount of lead is in contact with the microstrip. Tighten each mounting screw to 4 ±1 inch-pounds.6."Tin" the 6 transistor leads and then using 2% silversolder. Solder each lead to the printed wire board. 7.Torque the mounting screws to 6 inch-pounds. Re-move any flux left on the circuit board.PA TRANSISTOR LEAD IDENTIFICATIONCopyright© April 1994, Ericsson GE Mobile Communications Inc.PARTS LIST LBI-390513POWER AMPLIFIER BOARD 19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)*COMPONENTS ADDED, DELECTED OR CHANGED BY PRODUCTION CHANGESLBI-39051 OUTLINE DIAGRAM4COMPONENT SIDEPower Amplifier Board19D904792G1, G2 & G3(19D904792, Rev. 2)(19D904690, Component Side, Rev. 3)SCHEMATIC DIAGRAM LBI-390515Power Amplifier19D904792G1, G2 & G3(19D904791, Rev. 0)LBI-390516Printed in U.S.A. Ericsson GE Mobile Communications Inc.Mountain View Road • Lynchburg Virginia 24502。

■Features■Outline Dimension●Top view white LED (3.0 x 1.4 x 0.8mm)● Super high brightness of surface mount LED ● Lead frame package with individual 2 pins●Compatible to IR reflow soldering.■Applications●General lighting ●Decoration lighting●Indicator2, Anode 1, CathodeUnit:mmTolerances: ±0.1mm21Top ViewBack ViewSide View■Absolute Maximum Rating (Ta=25℃)■DirectivityItemSymbolValue UnitDC Forward Current I F 30 mA Pulse Forward Current* I FP 100mA Reverse V oltage V R 5 V Power Dissipation P D 110 mWOperating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40~ +85 ℃Lead Soldering TemperatureTsol260℃/5sec-*Pulse width Max 0.1ms, Duty ratio max 1/10■Electrical -Optical Characteristics(Ta=25(Ta=25℃℃)V F (V)I R (µA) Iv(mcd)CCT2θ1/2(deg)Min. Typ. Max. Max. Min.Typ. Max.Min. Typ. Max. Typ.Part NumberColorI F =20mAV R =5V I F =20mAOSW33014C1AWhiteW ■2.93.1 3.6 10 2000 - 3000 5000K - 6000K 120 OSM53014C1A Warm White M ■2.93.13.6102000-3000 2800K-3500K120Note: * Vf tolerance: ±0.05V* Luminous flux measurement allowance is:±10%LED & Application Technologies■Rank* Correspondence Table of Luminous Flux – Intensity■Chromaticity DiagramLED & Application Technologies*Bin Range of Chromaticity Coordinates (OSW33014C1A)LED & Application TechnologiesCodeX1 Y1 X2 Y2 X3 Y3 X4 Y4 D06 0.3221 0.3523 0.3324 0.3612 0.3324 0.3520 0.3224 0.3420D09 0.3224 0.3430 0.3324 0.3520 0.3323 0.3429 0.3228 0.3336 D12 0.3228 0.3336 0.3323 0.3429 0.3323 0.3337 0.3231 0.3243 D15 0.3231 0.3243 0.3323 0.3337 0.3322 0.3245 0.3234 0.3149 E03 0.3324 0.3612 0.3470 0.3738 0.3461 0.3637 0.3324 0.3520 E05 0.3324 0.3520 0.3461 0.3637 0.3452 0.3536 0.3323 0.3429 E07 0.3323 0.3429 0.3452 0.3536 0.3442 0.3435 0.3323 0.3337 E090.33230.33370.34420.34350.34330.33340.33220.3245*Bin Range of Chromaticity Coordinates (OSM53014C1A)*If color binning is required, only one color group is allowed for each chip within a reel. Chromaticity coordinate groups are measured with an accuracy of ±0.01 *Color coordinate is derived from the CIE 1931 chromaticity.*Bin rank of VFWhiteRank (I F =20mA)88T-999 AAA BBB DC Forward Voltage(v)2.9-3.23.2-3.43.4-3.6*Forward voltage is measured with an accuracy of ±0.1V.LED & Application TechnologiesCodeX1 Y1 X2 Y2 X3 Y3 X4 Y4 G04 0.4160 0.4199 0.4373 0.4302 0.4313 0.4166 0.4112 0.4067G06 0.4112 0.4067 0.4313 0.4166 0.4252 0.4030 0.4063 0.3936 G08 0.4063 0.3936 0.4252 0.4030 0.4192 0.3893 0.4015 0.3804 G10 0.4015 0.3804 0.4192 0.3893 0.4131 0.3757 0.3966 0.3672 H04 0.4373 0.4302 0.4518 0.4354 0.4453 0.4216 0.4313 0.4166 H05 0.4518 0.4354 0.4689 0.4408 0.4614 0.4265 0.4453 0.4216 H07 0.4313 0.4166 0.4453 0.4216 0.4387 0.4077 0.4252 0.4030 H08 0.4453 0.4216 0.4614 0.4265 0.4539 0.4123 0.4387 0.4077 H10 0.4252 0.4030 0.4387 0.4077 0.4322 0.3939 0.4192 0.3893 H11 0.4387 0.4077 0.4539 0.4123 0.4463 0.3980 0.4322 0.3939 H13 0.4192 0.3893 0.4322 0.3939 0.4256 0.3800 0.4131 0.3757 H14 0.43220.39390.44630.39800.43880.38370.42560.3800■Typical Electro-Optical Characteristics CurvesLED & Application TechnologiesRELIABILITY TEST REPORTCLASSIFICATIONTEST TIME TEST CONDTION OPERATION LIFE If:20mA Ta:25+5TEST ITME=1000HRS(-24HRS,+72HRS) HIGHTEMPERTURE HIGH HUMIDITYSTORAGER.H:90~95% Ta:65+5℃TEST ITME=240HRS(+2HRS)HIGH TEMPERTURE STORAGETa:105+5℃TEST ITME=500HRS(-24HRS,+48HRS) ENDURANCE TESTLOWTEMPERTURESTORAGETa:-55+5℃TEST ITME=500HRS(-24HRS,+48HRS) TEMPERTURE CYCLING105℃~25℃~-55℃~25℃ 60min 10min 60min 10min 20cyclesTHERMAL SHOCK105℃~-55℃ 10min 10min 10cyclesSOLDER RESISTANCE Ta:260+5℃ TEST ITME=10+1sec ENVIRONMENTAL TESTSOLDERABILITYTa:230+5℃TEST ITME=5+1secJUDGMENT CRITERIA OF FALURE FOR THE RELIABILITYMEASURING ITMESYMBOLCONDITIONSFAILUERLUMINOUS INTENSITY IV IF=20mA IV<0.5*INITIALV ALUEFORWARD VOLTAGEVFIF=20mA VF>1.2*INITIALV ALUEREVERSE CURRENT IR Vr=5V IR>2*SPECLED & Application Technologies■Recommended Reflow Soldering ProfileSurface mounting conditionIn automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.Soldering reflow-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for reflow soldering.-In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices.-Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method.LED & Application Technologies3) Manual soldering.- Lead solderMax. 300℃for max. 3sec, and only one time. - Lead-free solderMax. 350℃for max. 3sec, and only one time.- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method use the nitrogen reflow method.- After LEDs have been soldered, repairs should not be done. As repair is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not.- Reflow soldering should not be done more than two times.LED & Application Technologies■Package ModelLoaded Quantity 4000 pcs. Per ReelReel PartLED & Application Technologies。

AIG-300 Series Hardware User’s ManualVersion 1.0, September 2021/product© 2021 Moxa Inc. All rights reserved.AIG-300 Series Hardware User’s Manual The software described in this manual is furnished under a license agreement and may be used only in accordancewith the terms of that agreement.Copyright Notice© 2021 Moxa Inc. All rights reserved.TrademarksThe MOXA logo is a registered trademark of Moxa Inc.All other trademarks or registered marks in this manual belong to their respective manufacturers.DisclaimerInformation in this document is subject to change without notice and does not represent a commitment on the part of Moxa.Moxa provides this document as is, without warranty of any kind, either expressed or implied, including, but not limited to, its particular purpose. Moxa reserves the right to make improvements and/or changes to this manual, or to the products and/or the programs described in this manual, at any time.Information provided in this manual is intended to be accurate and reliable. However, Moxa assumes no responsibility for its use, or for any infringements on the rights of third parties that may result from its use.This product might include unintentional technical or typographical errors. Changes are periodically made to the information herein to correct such errors, and these changes are incorporated into new editions of the publication.Technical Support Contact Information/supportMoxa AmericasToll-free: 1-888-669-2872 Tel: +1-714-528-6777 Fax: +1-714-528-6778Moxa China (Shanghai office) Toll-free: 800-820-5036Tel: +86-21-5258-9955 Fax: +86-21-5258-5505Moxa EuropeTel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99Moxa Asia-PacificTel: +886-2-8919-1230 Fax: +886-2-8919-1231Moxa IndiaTel: +91-80-4172-9088 Fax: +91-80-4132-1045Table of Contents1.Introduction ...................................................................................................................................... 1-1Model Descriptions .............................................................................................................................. 1-2 Package Checklist ............................................................................................................................... 1-2 Product Features ................................................................................................................................ 1-3 Product Specifications ......................................................................................................................... 1-3 2.Hardware Introduction...................................................................................................................... 2-1Appearance ........................................................................................................................................ 2-2 AIG-301-AZU-LX ......................................................................................................................... 2-2AIG-301 US, EU, AP, and CN Models .............................................................................................. 2-3 Dimensions ........................................................................................................................................ 2-4 AIG-301-AZU-LX ......................................................................................................................... 2-4AIG-301 US, EU, AP, and CN Models .............................................................................................. 2-4 LED Indicators .................................................................................................................................... 2-5 Reboot .............................................................................................................................................. 2-5 Reset to Default ................................................................................................................................. 2-5 Real-time Clock .................................................................................................................................. 2-5 Installation Options ............................................................................................................................. 2-6 DIN-rail Mounting ........................................................................................................................ 2-6Wall Mounting (optional) .............................................................................................................. 2-6 3.Hardware Connection Description ..................................................................................................... 3-1Wiring Requirements ........................................................................................................................... 3-2 Connecting the Power .................................................................................................................. 3-2Grounding the Unit ...................................................................................................................... 3-3 Connecting to the Network ................................................................................................................... 3-3 Connecting to a USB Device ................................................................................................................. 3-3 Connecting to Serial Ports .................................................................................................................... 3-3 Inserting the microSD Card .................................................................................................................. 3-4 Connecting to the Console Port ............................................................................................................. 3-4 Connecting the CAN Port ..................................................................................................................... 3-4 Connecting the Digital Inputs and Digital Outputs ................................................................................... 3-5 Inserting the SIM Card ........................................................................................................................ 3-5 Installing the Wi-Fi Module (US, EU, AP, and CN models only) .................................................................. 3-5 Connecting the Antennas ..................................................................................................................... 3-9 A.Regulatory Approval Statements ....................................................................................................... A-11Introduction The AIG-300 Series advanced IIoT gateways are designed for Industrial IoT applications, especially for distributed and unmanned sites in harsh operating environments. ThingsPro Edge and Azure IoT Edge software are preloaded and seamlessly integrated with the AIG-300 Series to enable easy, reliable, yet secure sensor-to-cloud connectivity for data acquisition and device management using the Azure Cloud solution. With the use of the ThingsPro Proxy utility, the device provisioning process is easier than ever. Thanks to the robust OTA function, you never have to worry about system failure during software upgrades. With the secure boot function enabled, you can enable the booting process of AIG-300 Series to prevent malicious software injection.The following topics are covered in this chapter:❒Model Descriptions❒Package Checklist❒Product Features❒Product SpecificationsModel DescriptionsThe AIG-300 Series includes the following models:•AIG-301-T-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -40 to 85°C operating temperature •AIG-301-T-US-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, USA LTE band support, ThingsPro Edge and Azure IoT Edge software, -40 to70°C operating temperature•AIG-301-T-EU-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Europe LTE band, ThingsPro Edge and Azure IoT Edge software, -40 to 70°Coperating temperature•AIG-301-T-AP-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Asia Pacific LTE band, ThingsPro Edge and Azure IoT Edge software, -40 to 70°Coperating temperature•AIG-301-T-CN-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -40 to 70°C operatingtemperature•AIG-301-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -20 to 85°C operating temperature •AIG-301-US-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, USA LTE band support, ThingsPro Edge and Azure IoT Edge software, -20 to70°C operating temperature•AIG-301-EU-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Europe LTE band, ThingsPro Edge and Azure IoT Edge software, -20 to 70°Coperating temperature•AIG-301-AP-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Asia Pacific LTE band, ThingsPro Edge and Azure IoT Edge software, -20 to 70°Coperating temperature•AIG-301-CN-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -20 to 70°C operatingtemperatureNOTE The CN model does not come with the LTE module preinstalled. We have tested the model with the Quectel EC20 R2.1 LTE module and recommend operating the LTE module in the -20 to 65°C temperature range.Contact Moxa’s distributor in China for more information.Package ChecklistThe package contains the following items:•AIG-300 Series advanced IIoT gateway•Power jack•DIN-rail mounting kit•Quick installation guide (printed)•Warranty cardNOTE Notify your sales representative if any of the above items are missing or damaged.NOTE The console cable is not included in the package; you need to purchase it separately.Product Features•Simplifies data acquisition and device management via the ThingsPro Edge software.•Seamless integration with ThingsPro Edge and Azure IoT Edge enables easy, reliable, yet secure cloud connectivity.•Supports easy device-provisioning with the ThingsPro Proxy utility.•Provides robust OTA function to prevent system failure during software upgrades.•Equipped with secure boot to prevent malicious software-injection attacks.Product SpecificationsNOTE The latest specifications for Moxa's products can be found at https://.2Hardware Introduction The AIG-300 Series devices are compact and rugged, making them suitable for industrial applications. The LED indicators allow you to monitor device performance and quickly identify issues, and the multiple ports can be used to connect a variety of devices. The AIG-300 Series comes with a reliable and stable hardware platform that lets you devote the bulk of your time to application development. In this chapter, we provide basic information about the device’s hardware and its various components.The following topics are covered in this chapter:❒AppearanceA IG-301-AZU-LXA IG-301 US, EU, AP, and CN Models❒DimensionsA IG-301-AZU-LXA IG-301 US, EU, AP, and CN Models❒LED Indicators❒Reboot❒Reset to Default❒Real-time Clock❒Installation OptionsD IN-rail MountingW all Mounting (optional)Appearance AIG-301-AZU-LXTop Panel ViewFront Panel ViewBottom Panel ViewAIG-301 US, EU, AP, and CN ModelsNOTE The CN model does not come with the LTE module preinstalled. Contact Moxa’s distributor in China for more information.Top Panel ViewFront Panel ViewBottom Panel ViewDimensionsAIG-301-AZU-LXAIG-301 US, EU, AP, and CN ModelsLED IndicatorsThe function of each LED is described in the table below: LED Name Status Function PWR1/PWR2 Green Power is on OffNo power SIM Green SIM2 is in use Yellow SIM1 is in useUSR Green/Yellow Green: System is operating normallyYellow: System is initializing and running initial boot-up process L1/L2/L3YellowCellular signal strength L1+L2+L3: Strong L2+L3: Normal L3: WeakW1/W2/W3YellowWLAN signal strength W1+W2+W3: Strong W2+W3: Normal W3: WeakLAN1/LAN 2 (RJ45 connector)GreenSteady on 100 Mbps Ethernet linkBlinking Data is being transmitted or received Yellow Steady on 1000 Mbps Ethernet linkBlinkingData is being transmitted or receivedOff No Ethernet connection or 10 Mbps Ethernet linkRebootTo reboot the device, press the function (FN) button for 1 second.Reset to DefaultPress and hold the function (FN) button between 7 to 9 seconds to reset the device to the factory default settings. When the reset button is held down, the USR LED will blink once every second and become steady after 7 to 9 seconds. Release the button within this period to load the factory default settings.Real-time ClockThe real-time clock is powered by a non-chargeable battery. We strongly recommend that you do not replace the lithium battery without help from a qualified Moxa support engineer. If you need to change the battery, contact the Moxa RMA service team.Installation OptionsDIN-rail MountingThe aluminum DIN-rail attachment plate is already attached to the product’s casing. To mount the device on to a DIN rail, make sure that the stiff metal spring is facing upwards and follow these steps.1.Pull down the bottom slider of the DIN-rail bracket located at theback of the unit2.Insert the top of the DIN rail into the slot just below the upperhook of the DIN-rail bracket.tch the unit firmly on to the DIN rail as shown in theillustrations below.4.Push the slider back into place.Wall Mounting (optional)The device can be mounted on to a wall using a wall-mounting kit as shown in the following illustrations.The optional wall-mounting kit is not included in the product package and should be purchased separately.Follow these steps to mount the device on to a wall:Step 1Use four screws to fasten the wall-mounting brackets on the left panel of the device.Step 2Use another four screws to mount the device on a wall or a cabinet.NOTE •Test the screw head and shank size by inserting the screws into one of the keyhole shaped apertures of the wall-mounting plates before attaching the plate to the wall.•Do not drive the screws in all the way—leave a space of about 2 mm to allow room for sliding the wall mount panel between the wall and the screws.3 Hardware Connection DescriptionIn this chapter, we describe how to connect the AIG-300 to a network and other devices.The following topics are covered in this chapter:❒Wiring RequirementsC onnecting the PowerG rounding the Unit❒Connecting to the Network❒Connecting to a USB Device❒Connecting to Serial Ports❒Inserting the microSD Card❒Connecting to the Console Port❒Connecting the CAN Port❒Connecting the Digital Inputs and Digital Outputs❒Inserting the SIM Card❒Installing the Wi-Fi Module (US, EU, AP, and CN models only)❒Connecting the AntennasWiring RequirementsIn this section, we describe how to connect various devices to the AIG-300. Be sure to read and follow these common safety precautions before proceeding with the installation of any electronic device:• Use separate paths to route wiring for power and devices. If power wiring and device wiring paths mustcross, make sure the wires are perpendicular at the intersection point.NOTEDo not run signal or communication wiring and power wiring in the same wire conduit. To avoid interference, wires with different signal characteristics should be routed separately.• You can use the type of signal transmitted through a wire to determine which wires should be keptseparate. The rule of thumb is that wiring that shares similar electrical characteristics can be bundled together.• Keep input wiring and output wiring separate.• When necessary, it is strongly advised that you label wiring to all devices in the system.Connecting the PowerConnect the power jack (in the package) to the DC terminal block (located on the top panel), and then connect the power adapter. It takes about 3 minutesfor the system to boot up. Once the system is ready, the power LEDs will light up. Both models support dual power inputs for redundancy.Grounding the UnitThere is a grounding connector on the top panel of the device. Use this connector to connect a well-grounded mounting surface, such as a metal panel. Grounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI).Connecting to the NetworkThe Ethernet ports are located on the front panel of the device. The pin assignments for the Ethernet ports are shown in the following figure. If you are using your own cable, make sure that the pin assignments on the Ethernet cable connector match the pin assignments on the Ethernet port.Pin 10/100 Mbps1000 Mbps 1 Tx+ TRD(0)+ 2 Tx- TRD(0)- 3Rx+ TRD(1)+ 4 – TRD(2)+ 5 – TRD(2)- 6 Rx- TRD(1)- 7 – TRD(3)+ 8–TRD(3)-Connecting to a USB DeviceThe device comes with a USB port located on the lower part of the front panel, allowing users to connect to a device with an USB interface. The USB port uses a type-A connector.Connecting to Serial PortsThe serial ports can be configured by software for RS-232, RS-422, or RS-485. The pin assignments for the ports are shown in the following table:PinRS-232RS-422/RS-485 4wRS-485 2w1 – TxD-(A) –2 RxD TxD+(B) –3 TxD RxD+(B) Data+(B)4 DTR RxD-(A) Data-(A)5 GND GND GND6 DSR – –7 RTS – – 8CTS––Inserting the microSD CardThe device comes with a microSD socket for storage expansion. The microSD socket is located on the lower part of the front panel. To install the card, remove the screw and the protection cover to access the socket, and then insert the microSD card into the socket directly. You will hear a click when the card is in place. To remove the card, push the card in before releasing it.Connecting to the Console PortThe console port is an RS-232 port located on the top panel and can be connected to a 4-pin pin header cable. You can use this port for debugging or firmware upgrade.Pin Signal 1 TxD 2 RxD 3NC 4GNDConnecting the CAN PortThere is a CAN port in DB9 interface, located on the bottom panel. Refer to the figure on the left for detailed pin definitions.PinDefinition1 –2 CAN_L 3CAN_GND4 –5 (CAN_SHLD)6 (GND)7 CAN_H8 – 9(CAN_V+)Connecting the Digital Inputs and Digital OutputsThere are four digital inputs and four digital outputs on the top panel. Refer to the figure on the left for detailed pin definitions.Inserting the SIM CardThe device comes with a SIM card socket that allows users to install two SIM cards for cellular communication. Step 1Remove the screw on the SIM card holder cover located on the bottom panel of the device.Step 2Insert the SIM card into the socket.Make sure you insert in the right direction. To remove the SIM card, press the SIM card in to release and then you can pull out the SIM card.Installing the Wi-Fi Module (US, EU, AP, and CN models only)The optional Wi-Fi wireless module is not included in the product package and should be purchased separately. The Wi-Fi wireless module package contains the following items: • 1 x Wi-Fi module• 1 x thermal pad (25 x 10 x 1 mm) • 2 x black screws (M2.5 x 4 mm)• 2 x bronze spacers (M/F M3 x 4/M3 x 5 mm) • 1 x insulation pad • 1 x heatsinkNOTENotify your sales representative if any of the above items are missing or damaged.Follow these steps to install the Wi-Fi module for the device.1.Loosen the four screws on the right panel of your computer.2.Remove the right-side cover to expose the Mini-PCIe socket.The Wi-Fi socket is located beside the cellular module socket.3.Remove the plastic sheet on the thermal pad and stick the thermal pad on the metal surface asindicated.4.Insert the wireless module card into the socket at an angle.5.Push down the wireless module card and secure it by fastening the two black screws (M2.5x4 mm).6.Remove the plastic protection covers on the antenna connectors.7.Connect the #W1 SMA cable to the Main connector and the #W2 SMA cable to the Aux connector on thewireless module card installed.8.Stick the insulation tape on the connectors.9.Remove the two silver screws (M3x6 mm) and keep them for later use.10.Fasten the two bronze screws on to the screws on the board.11. Remove the plastic sheet on the thermal pad of the heat sink, install the heat sink pad on the module,and secure the heat sink with the two silver screws (M3 x 6 mm).12. Put back the right cover of the computer and secure it with screws.Connecting the AntennasThere are two cellular antenna connectors (C1 and C2) on the front panel ofthe device. In addition, a GPS connector is provided for the GPS module. Allthree connectors are of SMA type. Connect the antennas to these connectorsas shown below.There are two Wi-Fi antenna connectors (W1 and W2) on the top panel ofthe device. Connect the antennas on the connectors as shown below. BothW1 and W2 connectors are of RP-SMA type.A Regulatory Approval StatementsThis device complies with part 15 of the FCC Rules. Operation is subject to the followingtwo conditions: (1) This device may not cause harmful interference, and (2) this devicemust accept any interference received, including interference that may cause undesiredoperation.Class A: FCC Warning! This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonableprotection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at their own expense.European Community。

奥维300W（室内型）发射机产品说明书移动多媒体广播（CMMB）发射机产品说明书300W（室内型）发射机产品说明书300W（室内型）发射机AW603A-TSM55XX08奥维通信股份有限公司目录1.产品简介 (2)2.原理框图 (3)3模块介绍 (4)4.技术指标 (5)5.通用技术要求 (7)1.产品简介奥维300W发射机可适用于CMMB，DVB-T，ATSC以及DTMB 等多种标准，及应用于数字电视单频网（SFN）和多频网（MFN），具有单向放大数字电视下行链路信号的功能，可有效扩展数字信号覆盖的范围。

本款产品特点：●数字化的全固态功率放大电路设计技术；功放模块：采用的LDMOS晶体管BLF888A。

BLF888A是恩智浦半导体(NXP Semiconductors)推出的目前市场上功能最强大的LDMOS广播发射机晶体管，支持470-860MHz完整超高频带CMMB/DTMB/DVB-T信号，单管平均输出功率120W，效率可达31%以上。

21dB高增益、出色的线性度和耐用性（驻波比VSWR＞40:1）使BLF888A 成为CMMB/DTMB/DVB-T等高级数字发射机应用的理想选择。

●每个功放单元都集成自动电平控制（ALC）系统，确保功放单元输出功率稳定度优于±2%。

●采用单激励器配置，可根据客户需求和当地组网情况配置不同品牌激励器。

●可配置IP模块，使发射机具备IP转换功能。

●大功率高选择性的输出带通滤波器可安装于机柜内部。

大大节省安装空间●分配器和合成器采用宽带化设计，插损小，平衡性好。

●精确的监控系统，提供可靠的功放工作信息和适时的过热、过载、过激励和过流保护。

●提供实时监控和报警功能。

监控内容包括：设备工作状态、参数配置和接口工作状态等。

报警内容包括：数据输入数据异常、10MHz时钟输入信号异常、1pps时钟输入信号异常、TOD输入信号异常和设备故障等，发生异常情况时，给出报警指示。

0805 (2012) 1.1t0805 (2012) 1.1tFEATURES:•Package: PCB / CHIP Top View LED •Forward Current: 20mA •Forward Voltage (typ.): 3.1V•Luminous Intensity (typ.): 300mcd @20mA •Colour: Warm White •CCT (typ.): 2400K •Viewing Angle: 140° •Materials: −Die: InGaN−Resin: Epoxy (Yellow Diffused) •Operating Temperature: -40~+85°C •Storage Temperature: -40~+85°C •Grouping Parameters: −Forward voltage −Luminous intensity −CIE Chromaticity•Soldering Methods: Reflow soldering •MSL Level: acc. to JEDEC Level 3•Packing: 8mm tape with max.3000/reel, ø180mm (7’’)N0W11S04APPLICATIONS:• LED Display • Indicator • Traffic Display•Decoration LightingRelease Date: 28 June 2023 Version: A1.1PRODUCT DATASHEET ► PCB / CHIP LED► 0805 (2012) 1.1t ► Warm White (2400K)CHARACTERISTICS:Absolute Maximum Characteristics (Ta=25°C)1.Luminous intensity (I V) ±15%, Forward Voltage (V F) ±0.1V, Viewing angle(2θ1/2) ±5%OUTLINE DIMENSION:Package Dimension:1.All dimensions are in millimetre (mm).2.Tolerance ±0.2mm, unless otherwise noted. Recommended Soldering Pad Dimension:1.Dimensions are in millimetre (mm).2.Tolerance ±0.1mm with angle tolerance ±0.5°.BINNING GROUPS:Forward Voltage Classifications (I F = 20mA):I FExample Group Name on Label:•Gnb2 20 = g (3.1~3.4V) ► N (250~320mcd) ►B2 (X(0.5160~0.5360)/Y(0.4490~0.4980) ►20 (IF=20mA)CIE CHROMATICITY DIAGRAM:YXChromaticity Coordinates Classifications (I F = 20mA):1 2 3 4X Y X Y X Y X Y A1 0.4960 0.5170 0.4960 0.5470 0.5160 0.5280 0.5160 0.4980 A2 0.4960 0.4870 0.4960 0.5170 0.5160 0.4980 0.5160 0.4680 A3 0.4960 0.4570 0.4960 0.4870 0.5160 0.4680 0.5160 0.4380 B1 0.5160 0.4980 0.5160 0.5280 0.5360 0.5090 0.5360 0.4790 B2 0.5160 0.4680 0.5160 0.4980 0.5360 0.4790 0.5360 0.4490 B3 0.5160 0.4380 0.5160 0.4680 0.5360 0.4490 0.5360 0.4190 C1 0.5360 0.4790 0.5360 0.5090 0.5560 0.4900 0.5560 0.4600 C2 0.5360 0.4490 0.5360 0.4790 0.5560 0.4600 0.5560 0.4300 C3 0.5360 0.4190 0.5360 0.4490 0.5560 0.4300 0.5560 0.4000ELECTRO-OPTICAL CHARACTERISTICS: Relative Spectral DistributionForward Current v.s. Forward Voltage RelativeIntensity(2mA)ForwardVoltage(V)Wavelength (nm) Forward Current (mA) Directive RadiationRECOMMENDED SOLDERING PROFILE:Lead-free Solder:Note:1.Recommend reflow temperature 245°C. The maximum soldering temperature should belimited to 260°C.2.Maximum reflow soldering: 2 times.3.Before, during, and after soldering, should not apply stress on the components and PCBboard.PACKING SPECIFICATION:Reel Dimension:Max.3000pcs/reelPRECAUTIONS OF USE:Storage:It is recommended to store the products in the following conditions:•Humidity: 60% R.H. Max.•Temperature: 5°C~30°C (41°F ~86°F).Shelf life in sealed bag: 12 months at 5°C~30°C and <60% R.H.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp-proof box with descanting agent <10% R.H. and apply baking before use.Baking:It is recommended to bake the LED before soldering if the pack has been unsealed for longer than 24hrs.The suggested baking conditions are as followings:•60±3°C x 24hrs and <5%RH, taped / reel package.It’s normal to see slight color fading of carrier (light yellow) after baking in process.Testing Circuit:Must apply resistor(s) for protection (over currentproof).Cleaning:Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED carrier / package. Avoid putting any stress force directly on to the LED lens.ESD (Electrostatic Discharge):Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing the LED all time. All devices, equipment, machinery, work tables, and storage racks must be properly grounded.In the events of manual working in process, make sure the devices are well protected from ESD at any time.REVISION RECORD:。

广州市东裕光电科技有限公司GUANGZHOU TONYU TECHNOLOGY CO., LTD产品规格书SPECIFICATION客户名称CUSTOMER产品名称PRODUCTION 发光二极管LED LAMP产品型号MODEL DY-202SDRD/SN-A1(EL)(HF)版本号VERSION NO A1.0地址(Add)：广东省广州市番禺区石基镇海涌路3号10号厂房2楼电话(Tel)：************传真(Fax)：************邮箱(E-mail)：************网址(Net)：客户确认CUSTOMER CONFIRMATION审核CHECKED BY编制PREPARED BY 汪建新陈少龙DY-202SDRD/SN-A1(EL)(HF)产品描述Descriptions⚫F3红发红，发光二极管。

产品特性Features⚫多种视角的使用(Choice of various viewing angles)⚫引脚间距2.54mm (2.54mm Lead spacing)⚫可在磁带和卷轴(Available on tape and reel )⚫无铅(Pb free)⚫符合RoHS要求(This product itself will remain within RoHS compliant version)产品应用Applications⚫电视机(TV set)⚫监测(Monito)⚫电话(Telephone)⚫电脑(Computer)包装方式Packing Quantity Specification⚫袋装：1000PCS/袋，4袋/小盒，10小盒/箱(1000PCS/1Bag，4Bags/1Box，10Boxes/1Carton)一、外形图Outline dimensions ：单位 Unit 公差 Tolerance 芯片材料 Die material 发光颜色 Emission color 胶体颜色 Lens colormm ±0.25mm InGaN Red Red DiffusedNotes: 1. All dimensions are in mm, tolerance is ±0.25 unless otherwise noted.2. An epoxy meniscus way extend about 1.5mm down the leads.3. Burr around bottom of epoxy may be 0.5mm Max.※备注：承认书之编号和型号可用于查询，客户如有需要，请提供相应的编号和型号。

Typical Features◆Wide input voltage range:85-265VAC/120-380VDC◆No-load power consumption≤≤0.5W◆Transfer efficiency（typ.87%）◆Switching frequency:65KHz◆Protection:Short Circuit,Over Current◆Isolation voltage:2500Vac◆Plastic case,conform to UL94V-0Class◆PCB mountingApplication FieldFA24-220SXXG3N3Series-----a compact size,high efficient power converter offered by Aipu.It features universal input voltage,DC and AC dual-use,low ripple,low temperature rise,low power consumption, high efficiency,high reliability,safer isolation,with good EMC performance.EMC and Safety standard meet international EN55032,IEC/EN61000.It widely used in power,industrial,instrument,smart home applications.For harsh EMC environment,the application circuit in the datasheet is strongly recommended.Typical Product ListPart No.Output SpecificationMax.Capacitive LoadRipple&Noise20MHz（Max）Efficiency@Full Load220Vac(Typical) Power Voltage1Current1Voltage2Current2（W）Vo1（V）Io1（m A）Vo2（V）Io2（m A）u F mVp-p%FA24-220S12G3N32412.02000--200015085 FA24-220S15G3N32415.01600--20008086 FA24-220S24G3N324241000--80010087 Note1:Ripple&Noise of FA24-220S15G3N3,FA24-220S24G3N3should be tested with EMC solution recommended circuit,please see photo1at back.Note2:Due to space limitations,above is only a part of our product list,please contact our sales team for more items.Note3:.”*”is model under developing.Note4:The typical output efficiency is based on that product is full loaded and burned-in after half an hour.Note5:The fluctuation range of full load efficiency(%,TYP)is±2%,full load output efficiency=total output power/module’s input power.Input SpecificationItem Operating Condition Min.Typ.Max.UnitInput Voltage Range AC Input85220265VAC DC Input120310380VDCInput Frequency Range-475063HzInput Current 115VAC//250mA 220VAC//150Surge Current 115VAC//10 220VAC//20Leakage Current-0.5mA TYP/230VAC/50HzExternal fuserecommended value-2A-5A/250VAC slow-fusing Hot plug-UnavailableRemote control terminal-UnavailableOutput SpecificationItem Operating Condition Min.Typ.Max.UnitVoltage Accuracy Full input voltagerangeAny loadVo1--±2.0%Vo2---%Line Regulation Nominal Load Vo1--±2.0% Vo2---%Load RegulationNominal inputVoltage20%~100%loadVo1--±2.0%Vo2---%No load power consumption Input115VAC--0.5W Input220VAC--Minimum loadSingle Output0--% Positive Negative Dualoutput commongrounded---% Positive Negative Dualoutput isolated---Turn-on Delay Time Nominal input voltage,fullload-300-mSPower-off Holding Time Input115VAC(full load)-65-mS Input220VAC(full load)--Output Overshooting Full input voltage range(full load)--10%Dynamic Response 25%~50%~25%50%~75%~50%Overshoot range（%）：≤±5%%Recovery time（mS）：≤5.0mS mSShort Circuit Protection Input full voltage range Continuous,Self-recovery Hiccup Drift Coefficient--±0.03%-%/℃Over Current Protection Input220VAC≥120%Io,Self-recovery HiccupRipple&Noise Vo=12.0V≤150mV Vo=15.0V≤80mVVo=24.0V≤100Note:Ripple&Noise is tested by Twisted Pair Method,details please see Ripple&Noise Test at back. General SpecificationsItem Operating Condition Min.Typ.Max.Unit Switching Frequency-606570KHz Operating Temperature--40-+75℃Storage Temperature--40-+85Relative Humidity-10-90%RHIsolation Voltage Input-Output,Test1min,leakage current≤5mA2500--VACInsulation Resistance Input-Output@DC500V100--MΩMTBF-≥300,000H@25℃Vibration-10-55Hz,10G,30Min,alongX,Y,ZClass of Case Material-UL94V-0EMC CharacteristicsTotal Item Sub Item Test Standard ClassEMC EMICE CISPR22/EN55032CLASS B（see recommended circuit Photo2）RE CISPR22/EN55032CLASS B（see recommended circuit Photo2）EMSRS IEC/EN61000-4-310V/m Perf.Criteria BCS IEC/EN61000-4-63Vr.m.s Perf.Criteria BESD IEC/EN61000-4-2Contact±4KV/Air±8KV Perf.Criteria BSurge IEC/EN61000-4-5±1KV Perf.Criteria B（see recommendedcircuit Photo2）EFT IEC/EN61000-4-4±2KV Perf.Criteria BVoltage dips,shortinterruptions and voltagevariations immunityIEC/EN61000-4-110%~70%Perf.Criteria BPacking DimensionPacking Code L x W x HG339.0x25.0x22.0mmPin DefinitionPin-out12345Single（S）AC(N)AC(L)GND NP+VoNote:If the definition of pin is not in accordance with the model selection manual,please refer to the label on actual item. Ripple&Noise Test:(Twisted Pair Method20MHZ bandwidth)Test Method:(1)12#twisted pair to connect,Oscilloscope bandwidth set as20MHz,100M bandwidth probe,terminated with0.1uFpolypropylene capacitor and10uF high frequency lowresistance electrolytic capacitor in parallel,oscilloscope set asSample pattern.(2)Input terminal connect to power supply,output terminalconnect to electronic load through jig plate,Use30cm±2cmsampling line.Power line selected from correspondingdiameter wire with insulation according to the flow of outputcurrent.Product Characteristic CurveNote1:Input Voltage should be derated base on Input Voltage Derating Curve when it is85~100VAC/240~265VAC/120~140VDC/340~380VDC.2:Our product is suitable to use under natural air cooling environment,if use it under closed condition,please contact with us. Typical EMC Circuit and Recommended Spec1.Typical Application CircuitPart No.CE1L1CE2TVS1FA24-220S12G3N3NC2uH470uF/16V SMBJ14.0AFA24-220S15G3N3220uF/25V5uH220uF/25V SMBJ17.0A*FA24-220S24G3N3220uF/35V5uH220uF/35V SMBJ26.0ANote:Output filter capacitor C2is electrolytic capacitor,recommend high frequency low resistor electrolytic capacitor,for capacity and current low,please refer to the technical specifications provided by each manufacturer.C2capacitor withstand voltage should derate to80%,capacitor C1is ceramic capacitor,to filter high frequency noise,recommended0.1uF/50V/1206.TVS1tube is a recommend component to protect post-circuit if converter fails.Recommend to external FUSE,Model:3.15A/250V, slow fusing.2.EMC solution recommended circuitPhoto2,EMC for higher requirement circuitComponent Products Module ValueFUSE 3.15A/250Vac 3.15A/250Vac,slow-fusing,necessaryNTC5D-95D-9MOV10D561K10D561KCX10.47uF/275Vac0.47uF/275VacL1 6.8uH/3.0A 6.8uH/3.0A H inductorLF2UU9.830mH min30mH/3.0ANote:1.The product should be used under the specification range,otherwise it will cause permanent damage to it.2.Product’s input terminal should connect to fuse;3.If the product is not worked under the load range(below the minimum load or beyond the load range),we cannot ensure that the performance of product is in accordance with all the indexes in this manual;4.Unless otherwise specified,data in this datasheet are tested under conditions of Ta=25℃,humidity<75%when inputting nominal voltage and outputting rated load(pure resistance load);5.All index testing methods in this datasheet are based on our Company’s corporate standards6.The performance indexes of the product models listed in this manual are as above,but some indexes of non-standard model products will exceed the above-mentioned requirements,please directly contact our technician for specific information;7.We can provide customized product service;8.The product specification may be changed at any time without prior notice.。

DescriptionThe G-1 Wash moving head is the ideal companion for the G-1 Beam, and is designed for any type of outdoor event and smaller venues in need of small moving wash lights with high output, uniform colors from a distance and color calibration to match other SGM fixtures. The G-1 Wash offers high contrast levels and extreme brightness in a small physical footprint at a low power consumption. The G-1 Wash can be ordered with or without batteries, installed with a remotebase, or without any base at all.Features and benefitsBattery-driven IP65 color LED moving head19 RGBW LEDs and a 8.5º beam angleContinuous pan movement, built-in macro effects DMX, RDM and 100% wireless (power and control) Extremely bright with full color mixing Ultra-high-speed strobe effectPractically maintenance-free and silent performance Flicker-free / Programmable scenesCertifications & classifications240º(0.95in)8024SpecificationOptical Data LED expected lifetime50,000 hoursLens8.5°Lens angle8.5 °Lightsource 19 LEDs total, 4 Red, 4 Green, 4 Blue, 7 White (5.700K)Photometric Beam angle(s)8° (with 8.5°)Color temperature range2000K - 10000KEfficacy38 lm/WLux @ 10m549 luxLux @ 3m5078 luxLux @ 5m2194 luxMaximum Beam Angle8 °Maximum Field Angle8.5 °Physical Color options Black - RAL 9004Custom color - Any RALWhite - RAL 9010IP class IP65Material AluminiumPC/ASAPlasticRubberSteelNet dimensions219 x 382 x 255 mmNet dimensions inches8.6 x 15.1 x 10 inchesNet weight8.9 kg (19.6 lbs)Features Built-in macro effects50 macrosDimming ElectronicPan EndlessPan modes360°360° Shortest path540°Continues CCWContinues CWEndlessStrobe Ultra-high-speed strobe effectsTilt240°Electrical AC power, max.90 - 264V 50/60HzAC Power, nominal100 - 240V 50/60HzDC power, nominal24 VDCElectrical Protection Overload protection with automatic recoverMax Inrush Current 230VAC35 AMax power consumption55 WPower Supply Unit Auto-ranging electronic switch-modeStandby power consumption7 WTypical power consumption40 WProgramming and Control16-bit control Dimmer, pan and tiltCabled DMX 5 pin XLR input/outputDMX channels13DMX modes1Protocol CRMX, W-DMX™ G2, W-DMX™ G3, W-DMX™ G4, W-DMX™ G4S USITT DMX512ARDM ANSI E1.20Setting and addressing Control panelOLED graphical display / 4 buttonsRDM ANSI E1.20Standalone modeStandalone mode8 Internal Standalone Programs9 Internal Pan/Tilt PresetsWireless DMX Lumen Radio with RDM Connections DMX data in/out IP65 XLR 5-pin cable, 0,2 m (7.8 in)IP65 XLR 5-pin connector, MalePower Power input connectorInstallation Mounting point 2 quarter-turn locking points for one Omega bracketOrientation AnyRigging possibilities Hanging (Omega Bracket included) or ceiling/wall mount (optional)Safety features 2 attachment points for safety wireMinimum distance to combutiblematerials: 0.3 meter (11 in).Thermal Cooling PassiveHumidity (max.)98 %Temperature range, Operating-40°C to 50°CTemperature range, Start-up-20°C to 50°CTemperature range, Storage-20°C to 25°CThermal Protection Automatic overtemperature protectionIncluded items Included items 2 m power cable1 Omega bracket with quater-turnfastenersSafety instructions and installationquick guideBattery Battery capacity (non-stop) 6 - 8 hoursBattery capacity (typical use)12 - 14Battery charge time up to 100%12 - 16 hoursBattery charge time up to 75%8 - 12 hoursBattery Option YESBattery status Battery level indicatorBattery type Lithium-Ion batteryMemory effect 85% battery capacity after 500 full charge cyclesConforms To CE - 2014/30/EU: EMC Directive EN 55103-1EN 55103-2EN 55015EN 61547EN 61000-3-2EN 61000-3-3CE - 2014/35/EU: Low VoltageDirectiveEN 60598-1EN 60598-2-17EN 62471EN 60529RoHS2 Directive2011/65/EUUL UL Std. 1573NOTES:Due to continuous improvements and innovations, specifications may change without notice.LEDs' expected lifetime provided by manufacturer and obtained under manufacturer’s test conditions.Zoom range defined as a minimum beam angle to a maximum field angle.Photometric measurements obtained with Goniometer Scan / SGM Illumination Lab 1.6.0.0.Lumen output in pixel products is calculated.Mail ***************** Website 。

PMW3000电动机保护控制器使用说明书博耳（宜兴）电力成套有限公司Boer (Yixing) Power System Co., Ltd目录第一章概述 01.1 概述 01.2 产品特点 0第二章技术指标 (2)2.1 环境要求指标 (2)2.2 技术参数 (2)2.3 精度指标 (2)2.4 接口参数 (3)2.5 绝缘电阻及介质强度 (3)2.6 机械性能 (4)2.7 抗电磁干扰（EMC）性能 (4)2.8 安装方式 (4)第三章产品结构 (5)3.1 硬件结构 (5)3.2 主控单元 (6)第四章产品功能 (9)4.1 装置功能表 (9)4.2 测量功能 (10)4.3 模拟量输出功能 (11)4.4 开关量输入 (12)4.5 开关量输出 (12)4.6 通讯接口 (12)4.7 辅助保护功能 (13)4.8 开关量控制功能 (19)4.9 装置告警 (19)4.10 事件记录功能 (19)4.11 PT、CT变比设置 (20)第五章人机界面操作说明 (21)5.1 装置面板布置图 (21)5.2 键盘说明 (21)5.3 信号灯指示说明 (22)5.4 显示菜单说明 (23)第六章用户调试细则 (34)6.1 通电前检查项目 (34)6.2 通电检查项目 (34)6.3 模拟保护试验 (35)第七章定值一览表 (36)附录A PMW3001原理接线图 (40)附录B PMW3001端子接线图 (41)附录C PMW3001外形尺寸 (42)附录D PMW3001实物图 (45)1.1 概述PMW3001电动机保护控制器是一种数字式智能型电动机保护控制设备，直接针对一台低压电动机设计，能够完成一台低压电动机的测量、控制及辅助保护功能，具有很高的性能价格比。

PMW3001电动机保护控制器集保护、电量测量、电能计量、操作控制、诊断维护、报警输出、模拟量输出等多种功能于一体，同时可选配2个独立的RS-485通讯接口，满足双网（包括冗余）配置，并实现遥测、遥信、遥控等功能。

绝缘电阻测试仪使用说明书一、操作方法（500V，≥30MΩ）1、将仪器的电源插头接上AC220V。

按下电源开关至ON位置，预热10分钟，即可正常测试。

2、选择好适当的测试电压（500V）。

3、注意“TEST”灯是否处于熄灭状态，确保接线柱上不带电，接上被测件，按下“TEST”按钮，仪器即可对被测件充电并测量。

4、测试完毕后按下“RESET”键或测试时间到仪器自动复位后，才可取下被测件。

5、重复上述步骤，进行下一次测量。

二、使用注意事项1、本测试仪在电源开启后即可使用，但为了保证精度请预热10分钟以上。

2、连接被测物体时，必须保证处于复位状态，即TEST灯灭时，以防高压电击。

3、在测量100MΩ以上时，测量线最好用屏蔽。

接线时要将仪器前面板上的接地柱与被测件的机壳或外壳相连。

4、尽量避免测量过小的电阻，或将两测试夹相短接。

接地电阻测试仪使用说明书（I=10A，≤0.1Ω）一、操作方法1、仪器配备一副（两组）测试线，红粗线接红色电流接线柱，红细线接红色电阻接线柱，黑粗线接黑色电流接线柱，黑细线接黑色电阻接线柱。

2、将仪器的电源插头接上AC220V。

按下电源开关至ON位置，各个窗口数码管亮。

3、电流调节旋钮逆时针旋至零位。

4、测试前，选择好量程。

5、两组测试线的夹子相互短路。

6、手动测试（1）、“定时”开关关闭。

（2）、确定2-5步骤无误后，按“启动”按钮，“测试”灯亮，调节“电流调节”旋钮并观察电流显示窗口显示电流值至所需电流值。

（）（3）、按下“预置/测试”键，调节报警预置电位器，至所需电阻值。

（4）、按下“复位”按钮，切断电流输出，同时调节“电流调节”旋钮至最小。

将测试线夹在被测物的测试点上。

（5）、按下“启动”旋钮，“测试”灯亮，同时调节“电流调节”旋钮至所需电流值，接着读下电阻显示窗口显示的电阻值。

当被测物电阻值大于预值电阻值时，仪器会发出生光报警，反之，则不报警。

只要按下“复位”按钮停止测试，“测试”灯灭，取下测试线以备下次再测。

前言感谢客户购置杭州威格电子科技有限公司的产品，为了方便、安全、正确地使用本产品，敬请用户在操作之前详细阅读本说明书的全部内容。

本说明书适用于：GDW3001A电参数测量仪。

本说明书若有不全面的地方，恳请用户直接与本公司技术部联系。

本说明书部分内容随着产品的不断完善和升级会有所改变，恕不另行通知。

安全注意事项：在使用本仪器过程中必须注意下列事项，否则可能危及安全。

1、勿在易燃易爆性的环境中使用本产品2、勿在工作时打开机箱3、接地端子必须直接与大地相接4、供电系统电源AC220V±22V，50Hz，保险丝0.5A标志说明：本仪器前后面板和主要符号标志说明如下：电源开关接通电源开关断开PF/Hz 在功率、功率因素与频率间转换HOLD 锁存键SETUP 设定键∧设定数值增加>设定位右移．设置/取消小数点CHA A相（V、A、W、PF、Hz）CHB B相（V、A、W、PF、Hz）CHC C相（V、A、W、PF、Hz）∑平均电压、平均电流、总功率、总功率因数ALL V A，B，C相电压，总功率因数ALL A A，B，C相电流，总功率因数ALL W A，B，C相功率，总功率因数3L/4L 三线或四线切换第一章概述GDW3001A数字电参数测量仪是一种利用数字采样技术对信号进行分析处理的智能型仪表。

测量信号为45Hz~65Hz交流工频信号。

它的工作过程如下：1.将被测信号转化成适当幅值的电信号；2.以远大于被测信号的频率将此信号分割成离散信号；3.利用高速AD转换器将离散信号转换成数字量；4.利用微处理器对采集到的数字量进行计算；5.将最终计算的结果以数字的形式显示出来。

与传统指针式仪表相比，数字式电参数测量仪具有以下优点：1. 所测信号数值为真有效值；2. 直接数字显示，可以减小人为的读数误差；3. 对于波形失真的信号同样适用；4. 用一台仪器可以测量多个参数；5. 易于实现智能化，可以与计算机连接。