Practical Applications of Semiconductor Reliability ModelingLori E. Bechtold, Boeing Commercial Airplanes
Florian Molière, PhD, Airbus Group Innovations
David A. Sunderland, PhD, Boeing Space & Intelligence Systems
Bahig Tawfellos, Honeywell Aerospace
Key Words: Physics-of-Failure, Predictions, Semiconductor Reliability
SUMMARY & CO CLUSIO S
A practical methodology for modeling the reliability of deep submicron (<90 nm) semiconductor microcircuits provides timely and needed information for the integration of commercial off the shelf (COTS) electronics in airborne and high reliability applications.
（1）Designing and assuring customer confidence in airborne high reliability applications becomes more challenging as electronics technologies develop rapidly and commercial application demands drive the increasing use of faster, more integrated, higher density commercial off the shelf (COTS) electronics. （2）Use of COTS electronics provides advantages of greater computational power, with higher manufacturing volumes driving better quality control. COTS also introduce the new problem of life-limited semiconductors [1]. Outdated adequately support reliable aerospace system design [2].
The Semiconductor Reliability project, that launched in April 2013 by the Aerospace Vehicle Systems Institute (A VSI) under the Authority for Expenditure (AFE) 83, （3）developed a practical approach to modeling the random and wearout failure mechanisms of deep sub-micron (<90nm) microcircuits. Unlike prior physics of failure approaches, the methodology was kept simple and was implemented in a spreadsheet. （4）This spreadsheet is provided free of charge to R&M practitioners to help promote understanding and common usage of the methodology. （5）Recipients of the spreadsheet are expected to provide feedback to the A VSI team in return. The project also encourages microcircuit device suppliers to provide reliability information in some form, （6）either by using the spreadsheet or directly providing the cumulative defect fraction (CDF) of their product in theapplication environments.
When microcircuit device suppliers provide test data results for their products, the spreadsheet is used to scale the results from test to usage environments.（7）The methodology developed by A VSI differs from traditional Arrhenius methods in that scaling is not only based on temperature but also on voltage, current and frequency. （8）Models of time dependent dielectric breakdown (TDDB), hot carrier injection (HCI), negative bias temperature instability (NBTI) and electromigration (EM) are used to gain an accurate reliability assessment for technologies sensitive to these mechanisms.
（9）This paper describes the A VSI reliability research project,the semiconductor microcircuit reliability models, andcommercial and provides examples of the application of these models to support reliable avionics systems design.
I TRODUCTIO
（10）COTS microcircuit wearout has become a major concern for both military/aerospace (mil/aero) integrators and avionics equipment manufacturer companies (OEMs) . （11）By contrast with packaging reliability issues, microcircuit wearoutelectronics degradations cannot be easily addressed and revealed by means of the typical qualification tests performed on equipment. （12）This is because equipment qualification tests mainly accelerate environmental tresses (thermal cycle vibration, moisture) without the necessary functional constraints required to bring to light the life limited semiconductor issues. In this sense, wearout concerns have to be addressed in an early design phase at the sub-assembly level (Figure 1) through component selection methodologies like the one proposed in this paper.
（13）Designing for high reliability applications is a challenge that requires multi-level collaboration to assure vertical integration of the requirements and information flow necessary for design. （14）Figure 2 illustrates the flow of information between members of the supply chain, showing generally the downward flow of requirements and upward flow of analysis and test data needed to design systems to meet the requirements.
（15）Mil/aero integrators design aircraft and other platforms for commercial and military applications. （16）All companies in this market segment face the common need to use the best available COTS electronics in high reliability applications. （17）Airborne high reliability mil/aero applications generally experience greater environmental stresses than ground based commercial applications. （18）They drive reliability requirements in the context of thermal profiles, thermal cycling and vibration environments down to their suppliers, the avionics OEMs.（19）Avionics OEMs must find architecture solutions and trade multiple and often conflicting requirements.
The avionics OEMs procure electronics devices from the microcircuit device suppliers and must understand how the device will operate in the required environments. （20）Mitigation measures at the avionics OEM level include adequately derating the device in the context of thermal profiles, thermal cycling, vibration, voltage and frequency, and assuring adequate architecture redundancy to guarantee reliability and safety requirements are met throughout the unit life.
The microcircuit device suppliers must provide avionics OEMs with enough information and substantiating data so the OEM can make good design decisions while using their devices in electronics modules. The avionics OEM must provide the mil/aero integrators with enough information and substantiating data for them to use the modules in an airborne platform that meets their customer requirements for high functionality, safety and reliability over the operational lifetimes of the equipment.
（21）The AFE 83 project aims to break down communication barriers between
these market segments to improve practical semiconductor reliability assessments. （22）AFE 83 is working in collaboration with 与...合作microcircuit device suppliers to develop a practicable methodology for predicting the reliability of integrated circuit semiconductors for high reliability applications. It is developing a simple reliability prediction methodology for random failure rate and the time to intrinsic.（23）The random failure rate portion of the model is similar to MIL-HDBK-217 models [3], because it is scaled with device complexity复杂性and use conditions. （24）The physics of failure semiconductor wearout models developed in prior A VSI projects [4] are used as a starting point and will be modified based on the inputs from semiconductor suppliers.
2 A VSI
A VSI is a research cooperative that addresses issues impacting the aerospace community through international collaborative research conducted by industry, government and academia.（25）（翻译）Members combine their resources and talents to organize and conduct research projects directly benefiting the member organizations and often benefiting the aerospace industry as a whole.（26）A VSI provides a voice for their membership to jointly influence standards, processes and technologies related to aerospace industry.
A VSI has invested over a decade of research into electronics reliability, including deep sub-micron (<130nm) semiconductor wearout mechanisms, atmospheric radiation effects and the integration of physics of failure methods into reliability predictions. In 2010, A VSI reliability roadmap project, AFE 74, engaged a broad community of reliability subject matter experts to develop a consensus based Reliability Prediction Technology Roadmap. The Roadmap identified many gaps in reliability prediction capability to support the application needs identified by the stakeholders.（27）The stakeholders require a methodology that results in timely,accurate and necessary information to support design engineering processes that build customer confidence in product reliability. Semiconductor reliability modeling was identified as a high priority by the roadmap project[5].
3 APPLICATIO S
Aerospace applications often require a 20-30 year service life, while COTS electronics usually are designed for shorter market cycles. while COTS electronics usually are designed for high performance and low cost, consequently long termreliability is less of a concern. This leaves less incentive for COTS suppliers to address the need for extended life by applying mitigation measures for these failure mechanisms. If “design for reliability”measures have been applied within the microcircuit, these may be proprietary or not fully understood by the user, so will not figure in the user’s reliability modeling. By focusing at the part level, the AFE 83 spreadsheet allows these mitigation measures to be included by the supplier
Avionics systems are designed to rigorous high standards of safety and reliability, with growing processing demands of advanced navigation, guidance and communication systems. High functional density and high speed processing to support the growing avionics systems requirements is enabled through the use of COTS electronics with deep sub-micron (<90 nm) integrated circuit (IC) technologies.
Airborne environments are generally harsher than ground based applications. Each flight cycle induces vibration combined with a thermal cycle in many electronics, especially those in partially protected areas such as the electronics bay.
（28）Flight environments are harsh on electronics and electronic packaging, due to extremes of temperature, frequent thermal cycling, moisture, vibration, pressure, and atmospheric radiation. （29）In aviation applications, reliability needs can be higher as application conditions become worse.
The effect of temperature on reliability may be seen in Fig.3. （30）This chart, provided by Xilinx, is an example of one type of result that could come out of the spreadsheet. Here Xilinx has used an internal tool, described in [6], to compute time to an acceptable percent failure for each of three distinct intrinsic wearout failure mechanisms, as well as the net lifetime value considering all three. They then plotted the result versus use temperature.（31）（翻译）.The AFE 83 spreadsheet similarly can provide the user with calculations of reliability at multiple temperatures, which can be convolved with the application’s temperature vs. time profile (e.g., Fig. 4 for commercial avionics) to enable mission analysis or decisions on whether to provide a more protected environment for the electronics. [7]
（32）The results of such reliability calculations are intended to provide reasonable inputs to estimates of system-level reliability. （33）Aggregated, part-level reliability parametric data can be used to compute a reliability estimate at the circuit board, line replaceable unit, or subsystem level. This is based on the system designer’s understanding of the intended operation of the system and the environment in which it is intended to operate.
While the proposed methodology is more involved than traditional reliability estimation methods, it may not be necessary to analyze every device in a given unit. （34）For many,conservative estimates will be adequate to meet random failure rate targets, and combination of older technology and limited stress will suggest that wearout life is adequate. The practical understanding of the inner relationship between the effects of the wearout failure mechanisms within a part may be controversial. The source of controversy is whether such effects can be treated as competing effects or if it is more accurate to model them as enhancing each other. （35）Asimplifying assumption in the spreadsheet is that the mechanisms are independent, and that the cumulative failure fractions may be combined numerically without correcting for an interaction between them.
Figure 5 shows a sample flow diagram of the decision process an equipment manufacturer may use to determine the application of these analyses or equivalent. （36）It is important to note that if a component is expected to experience early wearout it must have the dominant wearout mechanisms accounted for in a prediction or the results will be misleading.
（37）Figure 6 shows another approach to system level analysis where the traditional random failure reliability prediction (Mean Time Between Failures) is normalized to a Mean Life,so that it can be compared with the Geometric Mean Life the wearout of each small geometry part over the usage profile.[8] The Avionics OEM can then understand whether the small geometry part will be a key driver in their ability to meet the MTBF requirement.
EM, TDDB, HCI and NBTI have been identified as dominant failure mechanisms for complementary metal-oxide semiconductors (CMOS) [9]. Models for these mechanisms were developed by various researchers and studied during the A VSI projects AFE 17, 71 and 71s1 and validated [10]. They have also been presented in detail in a previous RAMS paper [11], and are summarized here.
The AFE 83 spreadsheet offers models for all four mechanisms, based on equations (1)-(4).
T2 is the test temperature in K.
These equations differ in some ways from traditional forms [12] to make the independent variables those directly controllable by the IC user, (e.g. for EM we use voltage as a proxy for current density.) （38）In addition, alternate forms of voltage acceleration models are provided in the spreadsheet,for different technologies.The failure mechanism AF models for TDDB, EM, HCI and NBTI provide an assessment at the feature level within the logic circuitry of an IC. The effects of these mechanisms become more pronounced as feature sizes shrink and functional density increases. （39）A recent study of field failures of communications technology semiconductors found that failures due to these effects are increasing, in a way similar to Moore’s Law [13] [14]. （40）Models have been developed for NBTI; however as semiconductor feature sizes continue to reduce Positive Bias Temperature Instability (PBTI) may become an issue and models will need to be developed.
A traditional approach is to use the Arrhenius model to scale test data to usage
environments using empirically derived activation energy factors. （41）It does not consider the relying on a generalized temperaturewere developed by various researchers and studied during the related failure rate model. [15] The models provided in the spreadsheet offer a more detailed failure characterization, the ability to consider multiple failure mechanisms and to directly model voltage and frequency effects as well as thermal effects.
5 RELIABILITY PREDICTIO OF SEMICO DUCTORS
In any practical reliability analysis the best data available is used, and this is also true for use of the AFE 83 spreadsheet.Due to budget and time constraints and possibly the limited availability of COTS vendor data, analyses are sometimes performed with less than ideal data precision. The ideal strategy is to seek the best data first then fall back on other sources. The following is the prioritized order for finding data and analyzing semiconductor microcircuits:
1. Ideal–Supplier provides all the necessary reliability in the usage environments and considering operational stresses
2. Second best –Supplier provides some test information, and the user adjusts it to usage conditions using AFE 83 spreadsheet
3. Third best –If no test data is available, the user runsIn (1)-(4), their own set of tests and uses AFE 83 spreadsheet to are the acceleration perform prediction
4.Fourth option –When no information is available, a factors for T DDB, EM, HCI and NBTI, respectively, prediction can be performed using AFE 83 spreadsheet defaults .
The AFE 83 spreadsheet PoF models are used to start the conversation with semiconductor supplier companies about what is needed for the analysis. A potential approach is to have semiconductor manufacturers take the spreadsheet develop it to accurately model their particular product line, and provide it on a webpage for use by reliability engineers applying their product in an electronic system.
The prototype spreadsheet has assumed numerical values in places where the device-specific parameters are unknown.The spreadsheet is a starting point and not the final solution is used as a basis for how semiconductors are modeled.Participants and partners in this project will need to describe the methodology for estimating reliability with key objectives of identifying the data needed from device manufacturers and thatdefining the method for integrating the data into a usable result. This is accomplished through guidelines which are to be published as a deliverable of AFE83.
The AFE 83 spreadsheet includes a wearout prediction model and assessment based on the four mechanisms from AFE 71s1. An initial slope factor 2 provides an example of how a Weibull analysis may characterize wearout. Although initial parametric model input values are offered in the spreadsheet, the actual parameters of the model will be provided by semiconductor suppliers, or used by them to perform wearout reliability assessment for their customers.
一语言点
（1）designing 和assuring 都是动词的ing形式作形容词来修饰customer。
（2）With引导的成份作greater computational power的伴随状语。
（3）To后面引导的成份修饰practical approach。
（4）To help引导的成份作为前面的目的状语。
（5）该句中的固定用法provide sth to sb “向某人提供某物”，in return “反过来”。
（6）该句中的固定用法either....or....意味“或者....或者....”。
（7）该句中的固定用法Not only....but also...意为“不但.....而且....”,based on 意为“以...为根据”。
（8）该句中的sensitive to意为“对....反应灵敏的”，除本文中的意思外还有“对....体恤的”；“对.....易生气的，易被惹怒的”；“对.....敏感的，过敏的”等。
（9）该句中的to support 的部分为不定式做目的状语。
（10）该句中的concern for 意为“考虑，担心......”，另外固定用法both...and...表示“两者都”。
（11）该句中的by contrast with 意为“与...相反”。
（12）该句中的This is because +句子表示“这是因为......”。
（13）该句designing for 动名词短语作主语。
（14）Showing为动词show的ing形式，为illustrates伴随状语。
（15）两个and均为并列连词，第一个连接的是aircraft和other platform，第二个连接的是commercial和military app;ication。
（16）in引导的借此短语作为定语修饰electronics。
（17）该句应用了比较句型“greater.....than....”。
（18）该句中的drive.....down....意为“降低........”
（19）该句中同样有两个均为并列连词，第一个连接find和trade，第二个与must并列。
（20)at引导的成份为借此短语做定语修饰主语，同样include引导的借此短语作为定语修饰OEM level。
（21)该句中的aims to 意为“目的在于做某事”，同意的用法有aim at doing sth，break down意为“打破”。
（22)该句中的in collaboration with 意为“与......合作”。
（23)该句中的because作为连词，连接原因从句；另外scaled...with...意为“缩放”。
（24)该句中的in piror...意为“在...之前”；另外based on 意为“以...为根据”。
（25)该句中的combine...and...意为“将...与...结合”；另外as a whole意为“作为一个整体”。
（26)该句中的provide sth for sb 意为“向某人提供某物”。
（27)该句中的result in 意为“导致...”；另外confidence in意为“对某方面有信心”；该句中的语法为that引导的是定语从句先行词为engineering processes 。
（28)该句中的due to...意为“由于，因为”，另外语法有当多个共同词性的词语并列时and放在最后一个成份之前。
（29)该句中的as 意为“随着”即引导的为方式状语。
（30)该句中的provided动词的过去时作形容词修饰chart；另外that引导的为定语从句，先行词result；同时固定短语come out of意为“由....产生”另有意思为“从...中出来”。
（31)该句中有两个语法点，其一，which引导为定语从句，先行词为multiple temperature ；其二，whether引导的为条件状语从句。
（32)该句中的be intended to do sth 意为“打算做某事”。
（33)该句中的aggregated意为“全体的”修饰data，另外be used to do sth 意为“被用来做某事”。
（34)该句中的be adequate to意为“对...来说是足够的”。
（35)该句中有两个that他们都是用来引导表语从句的，在结构上是并列的，如果两个that都引导定语从句，则第一个可以省略，第二个一定不能省略。
（36)该句中的固定句型it is important to do sth 意为“做某事非常的重要”另外be expected to do sth 意为“被期望做某事”。
（37）该句中的so that意为“因此”；另外be compared with 意为“与...相比”。
（38）该句中的in addition意为“另外”，与此同意的借此短语还有in addition to。
（39）该句中的in a way 意为“以某种方式”。
（40）该句中的however表转折，as意为“随着”。
（41）该句中的rely on 意为“依靠，依赖”；该句中应注意It does not 即专业英语中不能使用缩写。
二、翻译
1、（8）Models of time dependent dielectric breakdown (TDDB), hot carrier injection (HCI), negative bias temperature instability (NBTI) and electromigration (EM) are used to gain an accurate reliability assessment for technologies sensitive to these mechanisms.
TDDB、HCI、和EM模式被用来获得对这些机制反应灵敏的技术的准确的可靠性评估。
2、（9）This paper describes the A VSI reliability research project,the semiconductor microcircuit reliability models, and commercial and provides examples of the application of these models to support reliable avionics systems design.
这篇论文描述的是A VSI可靠性研究工程、微电路半导体的可靠性模
式和商业，并且提供了一些应用这些模式的例子来支持可靠的航空电子系统的设计。
3、（21）（翻译）The AFE 83 project aims to （目的在于做某事，同意的用法有aim at doing sth）break down(打破) communication barriers between these market segments to improve practical semiconductor reliability 可靠性assessments（评估，评价）.
这个AFE83工程目的在于打破这些市场环节的交流障碍来提高实际的半导体可靠性评估。
4、（25）Members combine their resources and talents to organize and conduct research projects directly benefiting the member organizations and often benefiting the aerospace industry as a whole.
研究员门结合他们的资源和聪明才智组织和指挥研究工程，使研究员直接受益，同时经常使航空航天工业作为一个整体来受益。
5、（31）The AFE 83 spreadsheet similarly can provide the user with calculations of reliability at multiple temperatures, which can be convolved with the application’s temperature vs. time profile (e.g., Fig. 4 for commercial avionics) to enable mission analysis or decisions on whether to provide a more protected environment for the electronics. [7] AFE 83电子表格同样可以为用户提供计算的可靠性在多个温度,可使卷与应用程序的温度与时间剖面(如。,图4为商业航空电子设备),使任务分析或决定是否提供更多的保护环境的电子产品。
1.This electron beam sweeps across each line at a uniform rate，then flies back to scan another line directly below the previous one and so on，until the horizontal lines into which it is desired to break or split the picture have been scanned in the desired sequence． 电子束以均匀的速率扫描每一行，然后飞速返回去扫描下一行，直到把被扫描的图像按所希望的顺序分割成行。 2.The technical possibilities could well exist，therefore，of nation-wide integrated transmission network of high capacity，controlled by computers，interconnected globally by satellite and submarine cable，providing speedy and reliable communications throughout the word 因此，在技术上完全可能实现全国性的集成发送网络。这种网络容量大，由计算机控制，并能通过卫星和海底电缆实现全球互联，提供世界范围的高速、可靠的通信。 3.Transit time is the primary factor which limits the ability of a transistor to operate at high frequency． 渡越时间是限制晶体管高频工作能力的主要因素 4.The intensity of sound is inversely proportional to the square of the distance measured from the source of the sound. 声强与到声源的距离的平方成反比。 5.The attenuation of the filter is nearly constant to within 0.5 dB over the entire frequency band． 该滤波器的衰减近于恒定, 整个频带内的变化在0.5 dB以内。 6.At present, the state of most semiconductor device technology is such that the device design and process technology must be supplemented by screening and inspection procedures, if ultimate device reliability is to be obtained and controlled． 目前, 大多数半导体器件的技术尚未十分完善, 以至若要获得并控制器件最终的可靠性, 就必须辅以筛选和检验, 以弥补设计和工艺技术之不足 7.Bandwidth of transistor amplifiers vary from about 250 MHz in the L band to 1000 MHz in the X band． 晶体管放大器的带宽在L波段约为250 MHz, 在X波段为1000 MHz。 8.The output of the differential amplifier is fed to the circuit’s output stage via an offset-compensation network, which causes the op-amp’s output to center at zero volts. The output stage takes the form of a complementary emitter follower, and provides a low-impedance output. 差动放大级的输出通过一个失调补偿网络与输出级相连, 目的是使运放的输出以0 V为中心。输出级采用互补的射极跟随器的形式以使输出阻抗很低 9.Because of the very high open-loop voltage gain of the op-amp, the output is driven into positive saturation (close to +V) when the sample voltage goes slightly above the reference voltage, and driven into negative saturation (close to-V) when the sample voltage goes slightly below the reference voltage. 由于运放的开环电压增益很高, 当取样电压略高于参考电压时, 输出趋向于正向饱和状态(接近+V)。当取样电压低于参考电压时, 输出趋向于负向饱和状态(接近-V)。 10.If the signal source were direct connected instead of capacitor coupled, there would be a low resistance path from the base to the negative supply line, and this would affect the circuit bias conditions. 如果信号源和电路不是用电容耦合而是直接相连，从基极到负电源线就会一个低阻通路，并且这将影响到电路偏置状态 11.The differential amplifier has a high-impedance (constant-current)“tail”to give it a high input impedance and a high degree of common-mode signal rejection. It also has a high-impedance collector (or drain) load, to give it a large amount of signal-voltage gain (typically about 100 dB). 差动放大极有一个高阻抗的“尾巴”（恒流源）以提供高输入阻抗和对共模信号的深度抑制，同时，它还具有一个高阻抗和集电极或漏极负载以提供高的信号电压增益（典型的数据是100dB). 12.On the other hand, a DC negative-logic system, as in Figure 3.6(b), is one which designates the more negative voltage state of the bit as the 1 level and the more positive as the 0 level. 另一方面, 如图3.6(b)所示, 把比特的较低的电压状态记为1电平, 较高的电压状态记为0电平, 这样的系统称为直流负逻辑系统。 13.For example, to represent the 10 numerals (0, 1, 2, …, 9) and the 26 letters of the English alphabet would require 36
各个学科名称英文翻译 哲学Philosophy 马克思主义哲学Philosophy of Marxism 中国哲学Chinese Philosophy 外国哲学Foreign Philosophies 逻辑学Logic 伦理学Ethics 美学Aesthetics 宗教学Science of Religion 科学技术哲学Philosophy of Science and Technology 经济学Economics 理论经济学Theoretical Economics 政治经济学Political Economy 经济思想史History of Economic Thought 经济史History of Economic 西方经济学Western Economics 世界经济World Economics 人口、资源与环境经济学Population, Resources and Environmental Economics 应用经济学Applied Economics 国民经济学National Economics 区域经济学Regional Economics 财政学（含税收学）Public Finance (including Taxation) 金融学（含保险学）Finance (including Insurance) 产业经济学Industrial Economics 国际贸易学International Trade 劳动经济学Labor Economics 统计学Statistics 数量经济学Quantitative Economics 中文学科、专业名称英文学科、专业名称 国防经济学National Defense Economics 法学Law 法学Science of Law 法学理论Jurisprudence 法律史Legal History 宪法学与行政法学Constitutional Law and Administrative Law 刑法学Criminal Jurisprudence 民商法学(含劳动法学、社会保障法学) Civil Law and Commercial Law (including Science of Labour Law and Science of Social Security Law ) 诉讼法学Science of Procedure Laws 经济法学Science of Economic Law 环境与资源保护法学Science of Environment and Natural Resources Protection Law 国际法学(含国际公法学、国际私法学、国际经济法学、) International law (including International Public law, International Private Law and International Economic Law) 军事法学Science of Military Law
Professional English for Industrial Engineering Chapter1 Unit3翻译 姓名： 专业：工业工程 班级： 学号： 完成日期：2015-10-31
Chapter 1 Unit 3 Academic Disciplines of Industrial Engineering 五大主要工程学科和它们的发展 在美国，有五个主要工程学科（土木、化学、电工、工业、机械），它们是早在第一次世界大战时就出现的工程分支学科。这些进步是世界范围内发生的工业革命的一部分，并且在技术革命的开始阶段仍在发生。 随着第二次世界大战的发展导致了其他工程学科的发展，比如核工程，电子工程，航空工程，甚至是电脑工程。太空时代导致了航空工程的发展。最近对环境的关注使得环境工程和生态工程也得到了发展。这些更新的工程学科经常被认为是专长学科包含“五大”学科，即土木，化学，电工，工业，和机械工程里的一种或多种。 和美国的情况不同，工业工程在中国属于第一层级管理科学和工程学科下面的第二级别的学科。 IE学科的开端 学科后来演变成工业工程学科是最初在机械工程系被作为特殊课程教的。首个工业工程的分部在1908年的宾夕法尼亚州大学和雪城大学被建立。（在宾夕法尼亚州的项目是短期存在的，但是它在1925年又重建了）一个在普渡大学的机械工程的IE选科在1911年被建立。一个更完整的工业工程学院项目的历史可能在资料中被找到。 在机械工程部有一个IE选科的实践是主要的模式直到第二次世界大战的结束，并且分离出来的IE部在整个上个世纪里的文理学院和综合大学里被建立。 早在第二次世界大战的时候，在工业工程方面，只有很少的毕业生水平的研究。一旦分开的学部建立之后，学士和博士级别的项目开始出现。 现代IE的教育—分支学科 今天，与过去相比，工业工程对于不同的人来说意味着不同的东西。实际上，一个发展一个突出的现代工业工程的方法是通过获得在它的分支学科和它怎么联系到其他领域的理解。如果在分支学科和工业工程相关联的领域之间有清楚的
Lesson eight 第八课 Ⅱ.翻译句子，并注意remain和above的词类和词义 2. In this case the voltage applied must remain unchanged. 在这种情况下，那个应用电压必须保持不变 4. If you take 3 from 8, 5 remain. 如果从8中拿走3，剩5. 6. The above property was discovered by Faraday. 法拉第发现以上性质。 8. Lenz states that the self-induced emf impedes any change of current and tends to support the former current value. The above is known as Lenz’s law. 楞茨陈述自感电动势阻止电流的变化而保持先前电流的值。上面就是我们所知的楞 次定律。 Ⅲ.翻译句子，注意some的词义 2. That radio receiver weighs some five kilograms. 那个无线接收器重五公斤。 4. Some element in the substance is not known. 物质中的一些元素是人们不知道的。 Ⅳ.翻译句子，注意句中one 的不同用法和词义。 2. This concept was discussed in Chapter One. 这个概念在第一张讨论过。 4. No one can lift this equipment. 没人能举起这件设备。 6. This chapter will deal with one of the three functions of a turning circuit. 这章我们将介绍螺旋电路三个功能中的一个。 8. Before one studies a system, it is necessary to define and discuss some important terms. 在研究一个系统之前，确定且讨论一些重要的术语是有必要的。 Ⅴ.画出句中的名词从句，说明其种类，并将句子译成汉语。 2. These experiments do not show which particles. 这些实验不能显示他们的粒子结构。 4. The operating point is determined by how much bias is used. 操作要点是被用多少偏压决定的。 6. It is not important how this voltage is produced. 这个电压是怎么产生的并不重要。 8. It may be questioned whether this approach is the best for the physicist. 这种方式最适合于医生可能会被质疑。 10. This ball may be used to determine whether that body is charged. 这个球可能用于检测是否身体是带电的。 12. It is known that charged particles emit electromagnetic waves whenever they are accelerated. 众所周知的当电子被加速他们就会发射电磁波。 14. The value of this factor determines how fast the amplitude of the current
SPE 121762 完井中新微乳型原油破乳剂的实验室和现场研究 摘要 在石油工业中，水和油的乳化形成了一个持续的生产问题，受到了大量的技术的关注。在有利于环保的基础上，我们利用一种新的微乳型破乳剂(ME-DeM)对水包油（o/w）乳液的破乳效果进行测试。本产品测试了一系列的原油，已被证明相比于其他破乳剂更具有商业效用(DeM)。结果表明在现场试验中，本产品能对破乳效果产生明显的改善，更多的实地研究正在筹备之中。 绪论 乳液的形成与稳定 油水乳液已经成为石油工业研究课题之一，因为它关系到先关的操作问题，而且需要考虑生产，回收，输送，运输和提炼程序中的费用。一个非常好的名叫“一个国家的艺术审查” 并有关于原油乳液的总结是由Sunil Kokai提出的（Kokai 2002年）。乳状液，可定义为结合两个或两个以上的混容液体彼此不会轻易的分离开来单独存在，它以胶体大小或更大的小液滴形式存在，可导致高抽水成本。如果水分散在连续的油相中，被称为油包水型（w/o）乳状液；如果油分散在连续的水相中，则被称为水包油型（o/w）乳状液。如果没有稳定的油水界面，就没有乳状液的热力学稳定。液滴的聚集会导致不稳定的乳液(Holmberg, et al. 2007)。然而油水界面处的部分聚集会使界面更加稳定从而阻碍油水各自之间的聚并（破乳）进程。材料如自然形成或注射的表面活性剂，聚合物，无机固体以及蜡，可使界面更稳定。乳化形成过程也受到流体混合，剪切，湍流，扩散，表面活性剂聚集（Miller 1988），空间位阻稳定（非离子表面活性剂），温度和压力的影响。在被驱散的液滴周围，表面活性剂可以形成多层次的层状液晶的增长。 当流体滤液或注射液与储层液体混合，或当产出液的PH变化是，则会产生乳状液。沥青质，树脂和蜡的组成和浓度(Lissant 1988, Auflem 2002, Sifferman 1976, Sifferman 1980)是影响乳状液形成和稳定的因素。在含有大量的沥青质的油中，沥青则会作为表面活性剂来促进乳状液的形成而且很难被破坏。表面活性剂的使用可提高乳状液的热力学稳定性，并减少界面张力。但研究得出的结论是，乳状液的稳定性不是完全依赖于页面张力值，还有个因素是界面膜性能(Berger, et al.1988, Posano, et al. 1982)，并表明虽然降低界面张力有利于乳状液的稳定，但如果界面张力过低则可能导致不稳定的形成。表面活性剂，聚合物和吸附粒子可以建立强大的界面膜。增加界面膜的稳定性也产生更大的表
哲学Philosophy 马克思主义哲学Philosophy of Marxism 中国哲学Chinese Philosophy 外国哲学Foreign Philosophies 逻辑学Logic 伦理学Ethics 美学Aesthetics 宗教学Science of Religion 科学技术哲学Philosophy of Science and Technology 经济学Economics 理论经济学Theoretical Economics 政治经济学Political Economy 经济思想史History of Economic Thought 经济史History of Economic 西方经济学Western Economics 世界经济World Economics 人口、资源与环境经济学Population, Resources and Environmental Economics 应用经济学Applied Economics 国民经济学National Economics 区域经济学Regional Economics 财政学（含税收学）Public Finance (including Taxation) 金融学（含保险学）Finance (including Insurance) 产业经济学Industrial Economics 国际贸易学International Trade 劳动经济学Labor Economics 统计学Statistics 数量经济学Quantitative Economics 中文学科、专业名称英文学科、专业名称 国防经济学National Defense Economics 法学Law 法学Science of Law 法学理论Jurisprudence 法律史Legal History 宪法学与行政法学Constitutional Law and Administrative Law 刑法学Criminal Jurisprudence 民商法学(含劳动法学、社会保障法学) Civil Law and Commercial Law (including Science of Labour Law and Science of Social Security Law ) 诉讼法学Science of Procedure Laws
《工业工程专业英语》 课文翻译 专业：工业工程 学号：11208401 姓名： 指导教师：赵，， 2014年12月
4.2 ERP系统的发展过程 现在，ERP系统无处不在，不仅应用在大型业务中，目前还由运营商们改良后应用在中小企业中。我们需要通过理解ERP系统及其当前体系结构的历史和发展来说明其发展变迁的成果。ERP的优点和缺点会影响它对市场的渗透，系统供应商已经为ERP的推动做好了市场定位和总体策略方面的准备。ERP系统在新的世纪中的应用和发展将依赖于其对客户关系管理、供应链管理一起其他拓展功能的扩充，还有与网络应用的结合。 简介 由微电子、电脑硬件和软件系统驱动的信息和交流的前所未有的增长影响了各种组织的电脑应用的方方面面。同时，公司环境与职能部门日益结合，需要为决策提供越来越多的内部功能数据流，包括及时有效的产品部件的供给、库存管理、清算账目、人力资源以及产品和服务分配等。在这样的条件下，组织管理者需要一个有效的信息系统来降低成本并优化物流，从而提高竞争力。无论是大企业还是中小企业，大家一致认为在复杂的全球化竞争中，及时获得正确的信息的能力能够给企业带来巨大的回报。 从19世纪80年代末到90年代初开始的新的软件系统作为企业资源规划应用在复杂的大型商业企业中从而在工业界中被人们所周知。这种复杂而昂贵，强力而专有的系统供不应求，而且需要根据企业的需求量身定制。很多情况下，ERP实施人员要企业重新设计他们的商业流程来调节软件模型中的物流，从而得到整个企业的数据流。与旧的、传统的自我内部设计的企业专门系统不同，这种软件解决方案结合了多种模型的商业附加包，在需要的时候可以作为附件添加到系统中或者从中删除。 电脑性能的显著提高以及网络给ERP的供应商和设计者们带来的前所未有的挑战，打破了企业与客户定制的隔阂，还包含超出企业内部网络的合作，外部系统需要通过网络来无缝连接。供应商已经许诺了许多的附加功能包，他们中的一些人已经在市场上表现出对这些挑战的接受态度。将产品不断再设计以及在ERP市场中推出新产品和方案是一个永不终止的过程。ERP运营商和客户以及认识到了将其附件按照开放的原则设计，提供可互换的模型，以及容许更简单的定制和客户交流的必要性。 ERP系统定义 企业资源规划系统或企业系统是业务管理软件系统目前，包括模块配套功能区，如计划，制造，销售，市场营销，分销，会计，金融，人力资源管理，项目管理，库存管理，服务，维修，运输和电子商务，架构软件便于模块的透明集成，提供企业内的所有功能之间信息。在运输和电子商务。该架构软件便于模块的透明集成，提供数据流包括良好的企业内的所有功能之间的信息以及与合作公司与通过更换或重新设计实现一个单一的集成系统，其大多是不兼容的传统信息系统。美国生产与库存管理协会（2001）这样定义了ERP系统：“针对物资资源管理、人力资源管理、财务资源管理、信息资源管理集成一体化的企业管理软件。”我们从出版物中摘录了几种定义来更好的解释这个概念：“ERP包含了一个商业软件包，它可以通过企业的财务、清算、人力资源、供应链和客户信息来使数据流无缝结合”（Davenport，1998）。“ERP是将一个组织中的财务和其他信息以及基于信息的流程整合在一起的信息配置系统。”（K&VH,2000）。“一个数据库、一个应用和一个贯穿整个企业的统一界面”（Tadjer，1998）。“ERP系统是为了运作一个组织的业务方便的集成和实时计划、生产，以及客户反馈而设计的基于电脑的系统（OLeary，2001）”。 ERP系统的发展
果粒橙 图解:译文“蓝色” Unit 6 The Principle of PCM PCM原理 Pcm is dependent on three separate operations, sampling, quantizing, and coding. Many different schemes for performing these three functions have evolved during recent years, and we shall describe the main ones. In these descriptions we shall see how a speech channel of telephone quality may be conveyed as a series of amplitude values, each value being represented, that is, coded as a sequence of 8 binary digits. Furthermore, we shall prove that a minimum theoretical sampling frequency of order 6.8 kilohertz(khz) is required to convey a voice channel occupying the range 300 HZ to 3.4 Khz. Practical equipments, however, normally use3 a sampling rate of 8 khz, and if 8-digits per sample value are used, the voice channel becomes represented by a stream of pulses with a repetition rate of 64khz. Fig .1-1 illustrates the sampling, quantizing, and coding processes. PCM的构成依赖于三个环节，即采样、量化和编码。近年来，人们对这三个环节的实现提出了许多不同的方案，我们将对其中的一些主要的方案进行讨论。在这些讨 论中，我们会看到话路中的语声信号是如何转换成幅值序列的，而每个幅值又被编码，即以8位二进制数的序列表示。而且，我们将证明，为了转换频率范围为300HZ— 3.4KHZ的话路信号，理论上最小采样频率须为6.8khz。但是，实际设备通常用8khz 的采样速率，而如果每个样值用8位码的话，则话路是由一个重复速率为64khz的脉 冲流来表示的。图1-1表示了采样、量化、编码的过程。 Reexamination of our simple example shows us that the speech signal of maximum frequency 3.4khz has been represented by a signal of frequency 64khz. However, if only 4-digits per sample value had been used, the quality of transmission would drop, and the repetition rate of the pulses would be reduced to 32khz. Thus the quality of transmission is dependent on the pulse repetition rate, and for digital communication systems these two variables may be interchanged most efficiently. 让我们再研究一下上面提到的简单例子。可以看出，最高频率为3.4khz的话音信号适用64khz的（脉冲流）信号来表示的。但是，如果每个样值中用4位（码）表示，则传输质量会下降，而脉冲的重复速率也将减小到32khz。因而传输质量是取决于脉 冲重复速率的。对于数字通信系统，这两个量之间极明显的互相影响着。 Digital transmission provides a powerful method for overcoming noisy environments. Noise can be introduced into transmission patch in many different ways : perhaps via a nearby lightning strike, the sparking of a car ignition system, or the thermal low-level noise within the communication equipment itself. It is the relationship of the true signal to the noise signal, known as the signal-to-noise ratio, which is of the most interest to the communication engineer.Basically, if the signal is very large compared to the noise level, then a perfect message can take place; however, this is not always the case. For example, the signal received from a
3-D seismic survey (D: dimension:) 三维地震勘探 5-spot pattern n.五点井网Abandon v.（油井）报废，废弃Abandon well n.废井Acid wash n.酸洗 Acidization n.酸化（作用）Acidization n.酸化（作用） Acidize v.酸化Additive n.添加剂 Agent n.试剂，媒介Alkane n.烷烃，链烷烃 Analytic solution n.解析解Anisotropic a.各向异性的，非均质的Annular a.环形的Annular mist flow n.环雾流 Annulus n.环形空间，环空Anticline n.背斜 API standards n.美国石油协会标准Aromatic n.芳香族，芳香族环烃；a. 芳香的 Artifical lift n.人工举升Artificial lift n.人工举升 Artificial water drive n.人工注水驱Asphaltene n.沥青烯 Asphaltic a.含沥青的，沥青质的；n.沥青质Associated a.伴生的 Attribute n.属性，特征，标志Baffle n.隔板；v.阻碍，挫折Barefoot completion n.裸眼完井Barite n.重晶石 Barrel n.桶Barrier n.隔层 Bbl (blue barrel) Bean n.油嘴，节流器 Belt cover n.皮带盖Bentonite n.膨润土，斑脱岩 Bit n.钻头Black-oil simulator n.黑油模拟器Blender truck n.混砂车Blow out v.井喷 Blowout n.井喷Blowout preventer (BOP) n.防喷器Borehole n.井眼Bottom hole n.井下 Collapse v.坍塌，倒塌Collar n.钻铤 Compaction n.压实作用Compaction n.压实（作用），挤压Completion n.完井，完成，结束Compress v.压缩 Compressor n.压缩机Concentration n.浓度；集中Condensate n.凝析油Condensate n.凝析油 Conductor casing n.导管Conductor casing n.导管 Conductor hole n.导管孔Conductor pipe n.导管 Cone n.圆锥，（锥形）牙轮Configuration n.构造 Connate a.原生的，共生的Connate water n.原生水，共生水Contaminant n.杂质，污染物Continuous lift n.连续气举 Core n.岩心Core n.岩心 Core holder n.岩心夹持器Core slug n.岩心塞 Coring bit n.取芯钻头Corrode v.腐蚀 Corrode v.腐蚀，侵蚀；锈蚀Corrosion n.腐蚀 Corrosion n.腐蚀Corrosive a.腐蚀的；n.腐蚀剂Corrosive a.腐蚀的；n.腐蚀剂Counterbalance n.平衡（块）；v.使平衡，抵消 Counterweight n.平衡块Crack v.裂开 Crank n.曲柄，摇把Crown block n.钻台 Crumble v.坍塌，破碎Crust n.地壳 Curve n.曲线Cutting/chips n.钻屑
合肥工业大学各学院、专业名称及其英文翻译仪器科学与光电工程学院School of Instrument Science and Opto-electronic Engineering 1、测控技术与仪器Measurement & Control Technology and Instrument 2、光信息科学与技术 Optic Information Science & Technology 机械与汽车工程学院 School of Machinery and Automobile Engineering 3、车辆工程 Vehicles Engineering 4、工业工程 Industrial Engineering 5、工业设计 Industry Design 6、过程装备与控制工程 Process Equipment & Control Engineering 7、机械设计制造及其自动化 Machine Design & Manufacture & Its Automation 8、交通工程 Transportation Engineering 9、热能与动力工程Thermal Energy & Power Engineering 材料科学与工程学院 School of Material Science and Engineering 10、金属材料工程 Metal Materials Engineering 11、材料物理Materials Physics 12、无机非金属材料工程 Inorganic Non-metallic Materials Engineering 13、材料成型及控制工程 Material Forming & Control Engineering 电气与自动化工程学院 School of Electric Engineering and Automation 14、电气工程及其自动化 Electric Engineering and Automation 15、生物医学工程 Biomedical Engineering 16、自动化 Automation 计算机与信息学院 School of Computer and Information 17、计算机科学与技术 Computer Science & Technology 18、电子信息工程 Electronic Information Engineering 19、电子信息科学与技术 Electronic Information Science & Technology 20、通信工程 Communications Engineering 21、信息安全Information Security 化学工程学院 School of Chemical Engineering 22、高分子材料与工程 Macromolecule Material and Engineering 23、化学工程与工艺Chemical Engineering and Technics 24、制药工程 Pharmacy Engineering 25、应用化学 Applied Chemistry 土木建筑工程学院 School of Civil Engineering 26、给排水工程Water Supply & Drainage Engineering 27、工程力学 Engineering Mechanics 28、水利水电工程 Hydraulic and Hydro-Power Engineering 29、土木工程 Civil Engineering 30、建筑环境与设备工程 Architectural Environment & Equipment Engineering 建筑 与艺术学院 School of Architecture and Arts 31、城市规划 Urban Planning 32、建筑 学 Architecture 33、艺术设计 Artistic Design 资源与环境学院 School of Resources and Environment 34、地理信息系统 Geographic Information System 35、环境工程
第一章 IE中的角色 工业工程是新兴的经典和新颖的将计算解决复杂和系统性的问题，在今天的高度科技世界职业之一。，特别是在中国快速发展的经济和其作为世界制造业中心的演技，为IE浏览器的需求将增加，并不断扩大和迫切。 生产系统或服务系统，包括输入，转换和输出。通过改造，增加值的增加，系统的效率和效益都有所提高。转化过程中所使用的技术和管理科学以及它们的组合依靠。 管理生产系统的服务体系，是一个具有挑战性和复杂的，行为科学，计算机和信息科学，经济，以及大量的主题有关的基本原则和技术，生产和服务系统的技术。 对于IE毕业生的需求 工业工程课程设计准备的学生，以满足未来中国的经济和和谐社会建设的挑战。许多即毕业生（IES），事实上，设计和运行现代制造系统和设施。其他选择从事服务活动，如健康，?ìcare交付，金融，物流，交通，教育，公共管理，或咨询等。 为IE毕业生的需求比较旺盛，每年增长。事实上，对于非法入境者的需求大大超过供给。这种需求/供给不平衡是为IE大于其他任何工程或科学学科，并预计在未来多年存在。因此，over165大学或学院于2006年在中国开设了IE浏览器程序。 教科书的目标 这本教科书的主要目的是引入系统化的理论和先进的技术和方法，工业工程，以及他们的英语表达有关科目。教科书的另一个目的是加强和改进学生，AOS与工业工程专业英语文献的阅读和理解能力。 工程与科学 怎么这两个词，?úindustrial，?ùand，?úengineering，?ùget相结合，形成长期，?úindustrial工程，非盟是什么？工业工程和其他工程学科之间的关系，企业管理，社会科学？为了了解工业工程的作用，在今天，AOS经济和知识为基础的的时代，它是有利于学习，希望在IE的演变历史的发展，有许多半途而废写历史发展的工程。治疗本单位是短暂的，因为我们的利益，在审查工程发展的意义，尤其是作为一个专业工业工程的，更完整的历史参考。工程与科学发展并行，相辅相成的方式，虽然他们是电机始终以同样的速度，而科学是有关基本知识的追求，工程与科学知识的应用关注问题的解决方案，并，?úbetter生活的追求，?ù.Obviously，知识不能被应用，直到它被发现的，一经发现，将很快投入使用，在努力解决问题，工程在新知识的地方，提供反馈，以科学因此，科学和工程工作在手的手。 工程应用 - 工具 虽然“科学”和“工程”各有特色，为不同学科，在某些情况下，?úscientist，非盟和?úengineer，非盟可能是同一个人。这是在更早的时候，尤其是当有很少沟通的基本知识的手段。发现知识的人也把它用。 当然，我们也想到如此出色的成绩，在埃及的金字塔，中国长城，罗马的建设项目，等等，当我们回顾早期的工程成就。这些都涉及一个令人印象深刻的应用程序的基本知识。 正如根本，但是，不作为众所周知的成就。斜面，弓，螺旋状，水车，帆，简单的杠杆，以及许多其他方面的发展都非常希望在工程师，AO努力提供更好的生活。 工程的基础 几乎所有的工程发展到1800年之前与物理现象：如克服摩擦，起重，储存，搬运，构造，紧固后的发展，关注与化学和分子现象：如电力，材料，热加工工艺性能，燃烧，和其他的化学过程。 几乎所有的工程发展的基本原则是在数学方面取得的进展。，准确地测量距离，角度，重量和时间的程序进行了细化，实现了更大的成就。
A business survives and thrives on information: information within the organization and information changed with suppliers, customers,and regulators. Moreover, the information needs to be consistent, accessible, and at the right location. We consider information in four forms-voice, data, image, and video-and the implications of distributed requirements. The term voice communications refers primarily to telephone related communications. By far the most common form of communication in any organization and for most personnel is direct telephone conversation. The telephone has been a basic tool of business for decades. Telephone communications has recently been enhanced by a variety of computer-based services, including voice mail and computerized telephone exchange systems. V oice mail provides the ability to send, forward , and reply to voice messages nonsimultaneously , and it has become a cost-efficient tool even for many midsize organizations. It provides saving on answering machines and services as well as more responsive service to customers and suppliers. Advances have also been made in computerized telephone exchange systems, including in-house digital private branch exchanges(PBX) and Centrex systems provided by the local telephone company. These new systems provide a host of features, including call forwarding, call waiting, least-cost routing of long-distance calls, and a variety of accounting and auditing features. The term data communications is sometimes used to refer to virtually any form of information transfer other than voice. It is sometimes convenient to limit this term to information in the form of text(such as reports, memos, and other documents) and numerical data(such as accounting files). The rapid changes in technology have created fresh challenges for management in making effective use of data communications. We will briefly outline the changes in technology in transmission, networks, and communications software that present the manager with new powerful business tools but also the necessity of making choices among complex alternatives. 一个企业生存和蓬勃发展的信息：在改变与供应商，客户和监管机构的组织和信息的信息。此外，对信息的需求是一致的，访问，并在合适的位置。我们认为，在四种形式的语音，数据，图像，视频和分布式需求的影响的信息。 长期的语音通信，主要是指以电话相关的通讯。迄今为止最常见的沟通形式中的任何组织和大多数工作人员是直接的电话交谈。电话已几十年来的基本的业务工具。电话通讯最近已加强各种以计算机为基础的服务，包括语音邮件和程控电话交换系统。语音信箱提供的能力，发送，转发和回复语音邮件nonsimultaneously，它已成为一个成本效益的工具，甚至许多中小型组织。提供节省答录机和服务，以及更快捷的服务客户和供应商。程控电话交换系统，包括内部数字专用分支交换机（PBX）和本地电话公司提供的Centrex系统也取得了进展。这些新系统提供主机的功能，包括呼叫转接，呼叫等待，长途电话的最低成本路由，各种会计和审计功能。 长期的数据通信有时被用来指几乎任何其他信息传输比语音形式。有时可以很方便限制这个术语在文本形式的信息（如报告，备忘录和其他文件）和数字数据（如会计档案）。已创建管理新的挑战，在有效地利用数据通信技术的迅速变化。我们将简要概述在传输技术的变化，网络和通信软件，经理提出新的强大的商业工具，但也使复杂的替代品之间的选择的必要性。