01 Lattice Design Book
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Programming CablesUser’s GuideFeatures•Support for all Lattice programmable products–1.2 V to 3.3 V programming (HW-USBN-2B)–1.2 V to 5 V programming (All other cables)–Ideal for design prototyping and debugging•Connect to multiple PC interfaces–USB (v.1.0, v.2.0)–PC Parallel Port•Easy-to-use programming connectors•Versatile flywire, 2 x 5 (.100”) or 1 x 8 (.100”) connectors•6 feet (2 meters) or more of programming cable length (PC to DUT)•Lead-free/RoHS compliant constructionFigure 1. USB Cable – HW-USBN-2BProgramming CablesLattice Programming Cable products are the hardware connection for in-system programming of all Lattice devices. After completion of the logic design and creation of a programming file with the Lattice Diamond®, ispLEVER® Clas-sic or PAC-Designer® software, the Lattice Diamond Programmer, or Lattice's ispVM™ System software is used to control the programming of devices directly on the PC board. No additional components are required to program a device.After you complete your logic design and create a programming file with the Lattice Diamond/ispLEVER Classic development tools, you can use Diamond Programmer or ispVM™ System software ispVM™ System software or Diamond Programmer to program devices on your board. The ispVM System/Diamond Programmer software auto-matically generates the appropriate programming commands, programming addresses and programming data based on information stored in the programming file and parameters you set in Diamond Programmer/ispVM Sys-tem. Programming signals are then generated from the USB or parallel port of a PC and directed through the Pro-gramming Cable to the device. No additional components are required for programming.Diamond Programmer/ispVM System software is included with all Lattice design tool products and is available for download from the Lattice web site at .Programming Cable Pin DefinitionsThe functions provided by the Programming cables correspond with available functions on Lattice programmable devices. Since some devices contain different programming features, the specific functions provided by the Pro-gramming cable may depend on the selected target device. ispVM System/Diamond Programmer software will automatically generate the appropriate functions based on the selected device. See Table 1 for an overview of the Programming cable functions.Table 1. Programming Cable Pin DefinitionsProgramming Cable Pin NameProgramming CablePin TypeDescriptionVCCProgramming VoltageInputConnect to V CC or V CCJ plane of the target device. T ypical I CC = 10mA. Y our board design supplies the power for V CC . Note: This may not be the same as a target device’s V CCO plane.SDO/TDO Test Data Output Input Used to shift data out via the IEEE1149.1 (JT AG) programming standard.SDI/TDITest Data InputOutput Used to shift data in via the IEEE1149.1 programming standard.ispEN/Enable/PROG/SN EnableOutput Enable device to be programmed.SN = SSPI Chip select for HW-USBN-2B TRST Test Reset Output Optional IEEE 1149.1 state machine reset. DONE DONEInput DONE indicates status of configuration MODE/TMS Test Mode Select Input Output Used to control the IEEE1149.1 state machine.GND GroundInput Connect to ground plane of the target device SCLK/TCK Test Clock Input Output Used to clock the IEEE1149.1 state machineINIT Initialize Input Indicates that ORCA ® device is ready for configuration.I2C: SCL 1I2C SCL Output Provides the I2C signal SCL I2C: SDA 1I2C SDA Output Provides the I2C signal SDA.5V Out 15V OutOutputProvides a 5V signal for the iCEprog M1050 Programmer.1.Only found on the HW-USBN-2B cable.Figure 2. Programming Cable In-System Programming Interface for the PC (HW-USBN-2B)11.Requires Diamond Programmer 3.1 or laterFigure 3. Programming Cable In-System Programming Interface for the PC (HW-USB-1A or HW-USB-2A)1ttice PAC-Designer® software does not support programming with USB cables. To program ispPAC devices with these cables, use the Dia-mond Programmer/ispVM System software.Figure 4. Programming Cable In-System Programming Interface for the PC (HW-DLN-3C and Equivalents)11.HW7265-DL3, HW7265-DL3A, HW-DL-3B, HW-DL-3C and HW-DLN-3C are functionally equivalent products.Figure 5. Programming Cable In-System Programming Interface for the PC (pDS4102-DL2 or pDS4102-DL2A)Figure 6. Programming Cable In-System Programming Interface for the PC (HW7265-DL2 or HW7265-DL2A)1.For reference purposes, the 2x10 connector on the HW7265-DL2 or HW7265-DL2A is equivalent to Tyco 102387-1. This will interface tostandard 100-mil spacing 2x5 headers, or a 2x5 keyed, recessed male connector such as the 3M N2510-5002RB.Programming SoftwareDiamond Programmer and ispVM System for Classic devices is the preferred programming management soft-ware tool for all Lattice devices and download cables. The latest version of Lattice Diamond Program-mer or ispVM System software is available for download from the Lattice web site at /software. Target Board Design ConsiderationsA 4.7K pull-down resistor is recommended on the TCK connection of the target board. This pull-down is recom-mended to avoid inadvertent clocking of the TAP controller induced by fast clock edges or as V CC ramps up. This pull-down is recommended for all Lattice programmable families.The I2C signals SCL and SDA are open drain. A 2.2K pull-up resistor to VCC is required on the target board.For Lattice device families that feature low power, it is recommended to add a 500 ohm resistor between V CCJ and GND during the programming interval when a USB Programming cable is connected to a very low power board design. A FAQ is available that discusses this in more depth at:/en/Support/AnswerDatabase/2/2/0/2205The JTAG programming port speed may need to be governed when using the Programming cables connected to customer PCBs. This is especially important when there is long PCB routing or with many daisy-chained devices. The Lattice programming software can adjust the timing of TCK applied to the JTAG programming port from the cable. This low-precision port setting of TCK depends on many factors, including the PC speed and the type of cable used (parallel port, USB or USB2). This software feature provides an option to slow the TCK for debug or noisy environments. A FAQ is available that discusses this in more depth at:/en/Support/AnswerDatabase/9/7/974.aspxThe USB Download Cable can be used to program Power Manager or ispClock products with Lattice programming software. When using the USB cable with the Power Manager I devices, (POWR604, POWR1208, POWR1208P1), you must slow do TCK by a factor of 2. A FAQ is available that discusses this in more depth at:/en/Support/AnswerDatabase/3/0/306.aspxProgramming Flywire and Connection ReferenceRefer to T able 2 when connecting a flywire download cable to systems that use the 1x8-position or 2x5-position connectors. For newer Lattice FPGA families, a 1x10 connector used in conjunction with the Programming USB cable adds support for the DONE and INITN signals. Both of these signals are inputs to the cable, and can be used to help verify device configuration.Table 2. Flywire Conversion ReferenceFunction FlywireCableWireLabel1x10Connector1x8Connector2x5ConnectorV CC1Red VCC116 TDO/SO/SPI_SO Brown TDO227TDI/SI/SPI_SI Orange TDI335 ispEN2/Enable/PROGRAMN/SN/SPI_SS_B Y ellow ispEN/PROG4410 TRST3/CRESET_B Green TRST/DONE559 TMS/MODE Purple TMS663 GND Black GND77 4 (2 and 8) TCK4/SCLK/CCLK/SPI_SCK White TCK881 DONE3Green TRST/DONE9INITN/CDONE Blue INITN10I2C SCL5, 6Y ellow/White I2C: SCLI2C SDA5,6Green/White I2C: SDATable 3 lists the recommend pin connections. Please contact Lattice technical support for information on unlisted devicefamilies.(e-mail:***************************).Table 3. Recommended Pin ConnectionsDevice FamilyTDITDOTMSTCKispEN/P ROG 1,6TRST 2/D ONE 3,6INITN 3,6VCCGNDSCLSDAECP5™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeECP3™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeECP2M™/LatticeECP2™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeECP™/LatticeEC™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeXP2™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeXP™Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A LatticeSC™/LatticeSCM™Mandatory Mandatory MandatoryMandatory Optional Optional Optional Mandatory Mandatory N/A N/A iCE40™/iCE40LM/iCE40 Ultra™Mandatory Mandatory N/A Mandatory MandatoryRecom-mended Recom-mended Mandatory Mandatory N/A N/A MachXO2™/MachXO3™Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory Optional Optional MachXO™Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ORCA ®/FPSC Mandatory Mandatory Mandatory Mandatory Optional Optional Optional Mandatory Mandatory N/A N/A ispXPGA®Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ispXPLD™Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ispMACH ®4000Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ispMACH/ispLSI® 5000Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A MACH ®4A4Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ispGDX2™Mandatory Mandatory Mandatory Mandatory N/A N/A N/A Mandatory Mandatory N/A N/A ispClock™Mandatory Mandatory Mandatory Mandatory N/A N/A5N/A Mandatory Mandatory N/A N/A Platform Manager™Mandatory Mandatory Mandatory Mandatory N/A Optional 5N/A Mandatory Mandatory N/A N/A Power Manager/Power Manager II Mandatory Mandatory Mandatory Mandatory N/A Optional 5N/A Mandatory Mandatory N/A N/A ispPAC ®MandatoryMandatoryMandatoryMandatoryN/AN/AN/AMandatoryMandatoryN/AN/A1. Refer to the Programming Cable ispEN Pin section below for detailed information on connecting the ispEN/ENABLE pin.2. Refer to the Programming Cable TRST Pin section below for detailed information on connecting the TRST pin.3. The DONE and INITN signals are only available on the Programming USB cable. These signals are inputs to the cable and can be used to help verify deviceconfiguration.4. Please refer to the device data sheet. Not all packages have the ENABLE or TRST pin.5.When using P AC-Designer ® software to program ispPAC devices, do not connect this pin.6.When using these connections, be sure to select the correct settings in the Cable and I/O Port Setup dialog in the ispVM System/Diamond Programmer soft-ware.5V Output 5Red/White5V Out1.For devices that have a V CCJ pin, the V CCJ must be connected to the cable’s V CC, and a 0.1µF decoupling capacitor is required on V CCJ close to the device. Please refer to the device data sheet to determine if the device has a V CCJ pin.2.For older Lattice ISP devices, a 0.01µF decoupling capacitor is required on ispEN/ENABLE of the target board.3.The TRST and DONE pin is multiplexed on the Programming USB cable. If the device TRST signal is available on the board, connect the USB flywire TRST/DONE wire to TRST. If the device DONE signal is available on the board (or if both TRST and DONE are available), con-nect the USB flywire TRST/DONE wire to DONE. Please make sure the correct setting is selected in ispVM/Diamond Programmer (Options, Cable and I/O Port Setup). This will tell ispVM/Diamond Programmer whether the TRST/DONE cable is used as a TRST or a DONE signal.4.A 4.7K pull-down resister is recommended on TCK of the target board.5.Only on the HW-USB2N-2B cable6.Open drain signals. External pull-up ~2.2KOhm resistor to VCC is required.Table 2. Flywire Conversion Reference (Continued)FunctionFlywire Cable Wire Label 1x10 Connector1x8 Connector2x5 ConnectorConnecting the Programming CableThe target board must be un-powered when connecting, disconnecting, or reconnecting the Programming Cable. Always connect the Programming Cable’s GND pin (black wire), before connecting any other JTAG pins. Failure to follow these procedures can result in damage to the target programmable device.Programming Cable TRST PinConnecting the board TRST pin to the cable TRST pin is not recommended. Instead, connect the board TRST pin to Vcc. If the board TRST pin is connected to the cable TRST pin, instruct ispVM/Diamond Programmer to drive the TRST pin high as follows:1.Select the Options menu item.2.Select Cable and I/O Port Setup.3.Check the TRST/Reset Pin Connected checkbox.4.Select the Set High radio button.If the proper option is not selected, the TRST pin will be driven low by ispVM/Diamond Programmer. Consequently, the BSCAN chain will not work because the chain will be locked into RESET state.Programming Cable ispEN PinThe following pins should be grounded:•BSCAN pin of the 2000VE devices•ENABLE pin of MACH4A3/5-128/64, MACH4A3/5-64/64 and MACH4A3/5-256/128 devices.However, the user has the option of having the BSCAN and ENABLE pins driven by the ispEN pin from the cable. In this case, ispVM/Diamond Programmer must be configured to drive the ispEN pin low as follows:1.Select the Options menu item.2.Select Cable and I/O Port Setup.3.Check the ispEN/BSCAN Pin Connected checkbox.4.Select the Set Low radio button.Table 4.Feature HW-USBN-2B HW-USBN-2A HW-USB-2A HW-USB-1A HW-DLN-3CHW7265-DL3,HW7265-DL3A,HW-DL-3B,HW-DL-3C HW7265-DL2HW7265-DL2A PDS4102-DL2PDS4102-DL2AUSB X X X XPC-Parallel X X X X X X 1.2 V Support X X X1.8 V Support X X X X X X X X2.5-3.3 V Support X X X X X X X X X X 5.0 V Support X X X X X X X X X 2x5 Connector X X X X X X X1x8 Connector X X X X X X X Flywire X X X X X XLead-freeConstruction X X XAvailable for order X XProgramming Cable Feature SummaryEach Programming Cable ships with two small connectors that help you keep the flywires organized. The following manufacturer and part number is one possible source for equivalent connectors:•1x8 Connector (e.g. Samtec SSQ-108-02-T-S)•2x5 Connector (e.g. Samtec SSQ-105-02-T-D)The Programming Cable flywire or headers are intended to connect to standard 100-mil spacing headers (pins spaced 0.100 inch apart). Lattice recommends a header with length of 0.243 inches or 6.17 mm. Though, headers of other lengths may work equally well.Ordering InformationDescription Ordering PartNumberChina RoHS Environment-Friendly Use Period (EFUP)Programming cable (USB). Contains 6' USB cable, flywire connectors,8-position (1x8) adapter and 10-position (2x5) adapter, lead-free, RoHScompliant construction.HW-USBN-2BProgramming cable (PC only). Contains parallel port adapter, 6' cable,flywire connectors, 8-position (1x8) adapter and 10-position (2x5) adapter,lead-free, RoHS compliant construction.HW-DLN-3CNote: Additional cables are described in this document for legacy purposes only, these cables are no longer produced. The cables currently available for order are fully equivalent replacement items.Technical Support Assistancee-mail:***************************Internet:Revision HistoryDate Version Change SummaryJanuary 201524.7Updated Programming Cable Pin Definitions section.— In Table 1, Programming Cable Pin Definitions, ispEN/Enable/PROGchanged to ispEN/Enable/PROG/SN and its description revised.— Updated Figure 2, Programming Cable In-System ProgrammingInterface for the PC (HW-USBN-2B).Updated Programming Cable ispEN Pin section.In T able 4, Programming Cable Feature Summary, HW-USBN-2Bmarked as available for order.Updated Ordering Information section. HW-USBN-2A changed to HW-USBN-2BJuly 201424.6Changed document title to Programming Cables User’s GuideChanged ispDOWNLOAD Cables to Programming Cables.Updated Target Board Design Considerations section. Updated FAQlink on ispVM tool control of TCK duty cycle and/or frequency.Updated Table 3, Recommended Pin Connections. Added ECP5,iCE40LM, iCE40 Ultra, and MachXO3 device families.Updated Technical Support Assistance information.October 201224.5Added iCE40 configuration port pin names to the Flywire ConversionReference table.Added iCE40 information to Recommended Cable Connections table.February 201224.4Updated document with new corporate logo.November 201124.3Document transferred to user’s guide format.Added Figure USB Cable – HW-USBN-2A.Updated Recommend Cable Connections table for MachXO2 devices.Updated Target Board Design Considerations section.Added Appendix A.October 200924.2Added information related to the physical specifications of the flywireconnectors.July 200924.1Added Target Board Design Considerations text section.Added Programming Flywire and Connection Reference section head-ing.——Previous Lattice releases.Appendix A. Troubleshooting the USB Driver InstallationIt is essential that you install the drivers before connecting your PC to the USB cable. If the cable is connected before installing the drivers, Windows will try to install its own drivers that may not work.If you have attempted to connect the PC to the USB cable without first installing the appropriate drivers, or have trouble communicating with the Lattice USB cable after installing the drivers, following the steps below:1.Plug in the Lattice USB cable. Choose Start > Settings > Control Panel > System. In the System Propertiesdialog box, click the Hardware tab and Device Manager button. Under Universal Serial Bus controllers, you should see Lattice USB ISP Programmer. If you do not see this, look for the Unknown Device with the yellow flag.2.Double click on the Unknown Device icon.3.Click Reinstall Driver.4.Select Browse for driver software on your computer.For Lattice EzUSB DriverFor FTDI FTUSB Driver5.Browse to the isptools\ispvmsystem directory for the Lattice EzUSB driver or the isptools\ispvmsystem\Drivers\FTDIUSBDriver directory for the FTDI FTUSB driver. For Diamond installations, browse tolscc/diamond/data/vmdata/drivers. Click Next.6.Select Install this Driver software anyway. The system will update the driver.7.Click Close and finish installing the USB driver. Under Control Panel >System >Device Manager > Univer-sal Serial Bus Controllers should include the following:For the Lattice EzUSB Driver: Lattice USB ISP Programmer device installed.For the FTDI FTUSB Driver: USB Serial Converter A and Converter B devices installed.If you are experiencing problems or need additional information, contact Lattice Technical Support.。
PRODUCT SELECTOR GUIDE2012FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLSCONTENTS■A dvanced Packaging (4)■F PGA Products (6)■CPLD Products (8)■Power Management and Clock Management Products (8)■Intellectual Property and Reference Designs (10)■Development Kits and Evaluation Boards (14)■P rogramming Hardware (18)■FPGA and CPLD Design Software (19)■PAC-Designer® Design Software (19)Page 2Affordable InnovationLattice Semiconductor is committed to delivering value through innovative low cost, low power solutions.We’re innovating every day to drive down costs and deliver greater value. From cost sensitive consumerelectronics to leading edge communications equipment, designers are using Lattice products in a growingnumber of applications. We’ve shipped over a billion devices to customers worldwide and we understandthat we must deliver cost effective solutions and excellent service in order to succeed.Low Density and Ultra-Low Density FPGAsWe are committed to providing design engineers with the low cost and low power solutions they needto implement their designs quickly, easily and affordably. Lattice FPGA solutions offer unique features,low power, and excellent value for FPGA designs. Our low density LatticeECP3™ family is comprisedof the lowest power, SERDES-enabled FPGAs in the market today, and is ideally suited for deploymentin high volume cost- and power-sensitive wireless and wireline infrastructure, video camera and displayapplications. Our ultra-low density, low cost and low power iCE40™ and MachXO2™ FPGA familiesare ideal for applications ranging from glue logic and bridging to instant-on system control and flexibleI/O expansion. From mobile handsets to leading-edge telecommunications infrastructure, Lattice offerssolutions that minimize cost and power while maximizing value.Power Management and Clock ManagementOur Platform Manager™, Power Manager II and ispClock™ mixed signal product families feature acombination of programmable logic and programmable analog circuitry that allows system designersto reduce system cost and design time. These innovative products provide a fast and easy solution forintegrating a wide range of power and clock management functions within a single integrated circuit. Theseproducts can replace numerous discrete components, reducing cost and conserving board space, whileproviding users with additional design flexibility and time-to-market benefits.Software and Intellectual PropertyOur Lattice Diamond® development tool suite, iCEcube2™ design software, PAC-Designer software, and IPcore program allow design engineers to easily customize our devices for their unique system requirements.Lattice Diamond software tools enable users to synthesize a design, perform analysis, debug, anddownload a logic configuration to our FPGA devices, while iCEcube2 software supports our iCE40 family ofFGPAs. PAC-Designer software is used in the design of our mixed signal products.Our IP core program, LatticeCORE™, provides pre-tested, reusable functions, allowing designers to focuson their unique system architectures. These IP cores provide industry-standard functions including PCIExpress, DDR, Ethernet, CPRI, Serial RapidIO 2.1, SPI4, and embedded microprocessors. In addition, anumber of independent IP providers have teamed with Lattice to offer additional high quality, reusable IPcores. Partners are selected for their industry leadership, high development standards, and commitment tocustomer support.Page 3Page 4Organic Flip Chip BGAFine Pitch BGA1704-BallOrganic fcBGA 42.5 x 42.5 mm 3.25 mm height 1.00 mm pitch1020-BallOrganic fcBGA Revision 233 x 33 mm 3.25 mm height 1.00 mm pitch1152-Ball fpBGA 1156-Ball fpBGA 35 x 35 mm 2.60 mm height 1.00 mm pitc h900-Ball fpBGA 31 x 31 mm 2.60 mm height 1.00 mm pitch672-Ball fpBGA 27 x 27 mm 2.60 mm height 1.00 mm pitch484-Ball fpBGA 23 x 23 mm 2.60 mm height 1.00 mm pitch324-Ball ftBGA 19 x 19 mm 1.70 mm height 1.00 mm pitch256-Ball ftBGA 17 x 17 mmOption 1: 1.55 mm height Option 2: 2.10 mm height Option 3: 1.70 mm height 1.00 mm pitch 256-Ball caBGA 14 x 14 mm 1.70 mm height 0.80 mm pitch332-Ball caBGA 17 x 17 mm 2.00 mm height 0.80 mm pitch208-Ball ftBGA 17 x 17 mm 1.55 mm height 1.00 mm pitch256-Ball fpBGA 17 x 17 mm 2.10 mm height1.00 mm pitchFine Pitch BGAChip Array BGANote: Packages shown actual size. Height specification is max.Page 5208-Pin PQFP 28 x 28 mm (body)4.10 mm height 0.50 mm pitch176-Pin TQFP 24 x 24 mm (body)1.60 mm height 0.50 mm pitch144-Pin TQFP 20 x 20 mm (body)1.60 mm height 0.50 mm pitch100-Pin VQFP 14 x 14 mm (body)1.2 mm height 0.50 mm pitch100-Pin TQFP 128-Pin TQFP 14 x 14 mm (body)1.6 mm height0.50 mm pitch (100 TQFP)0.40 mm pitch (128 TQFP )44-Pin TQFP10 x 10 mm (body)1.20 mm height 1.60 mm height 0.80 mm pitch 48-Pin TQFP 7 x 7 mm (body)1.20 mm height 1.60 mm height0.50 mm pitchVQFP/TQFP/PQFP64-Pin QFNS 9 x 9 mm1.00 mm height 0.50 mm pitch 100-Ball csBGA 8 x 8 mm1.35 mm height 0.50 mm pitch132-Ball csBG A 8 x 8 mmOption 1: 1.35 mm heightOption 2: 1.00 mm height (iCE40)0.50 mm pitch 184-Ball csBG A 8 x 8 mm1.35 mm height 0.50 mm pitch284-Ball csBGA 12 x 12 mm 1.00 mm height 0.50 mm pitch 328-Ball csBGA 10 x 10 mm 1.50 mm height 0.50 mm pitch 132-Ball ucBGA 6 x 6 mm1.00 mm height 0.40 mm pitch 25-Ball WLCSP2.5 x 2.5 mm 0.62 mm height 0.40 mm pitch84-Pin QFNS 7 x 7 mm1.00 mm height 0.50 mm pitch 48-Pin QFNS 7 x 7 mm1.00 mm height 0.50 mm pitch144-Ball csBGA 7 x 7 mm1.10 mm height 0.50 mm pitch 64-Ball ucBGA 4 x 4 mm1.00 mm height 0.40 mm pitch 32-Pin QFNS 5 x 5 mm1.00 mm height 0.50 mm pitch 32-Pin QFN 5 x 5 mm0.60 mm height 0.50 mm pitch 56-Ball csBGA 6 x 6 mm1.35 mm height 0.50 mm pitch 81-Ball csBGA 5 x 5 mm1.00 mm height 0.50 mm pitch 225-Ball ucBGA 7 x 7 mm1.00 mm height 0.40 mm pitch 24-Pin QFNS 4 x 4 mm1.00 mm height 0.50 mm pitch64-Ball csBGA 5 x 5 mm1.10 mm height 0.50 mm pitch121-Ball csBGA 6 x 6 mm1.00 mm height 0.50 mm pitch 121-Ball ucBGA 5 x 5 mm1.00 mm height 0.40 mm pitch 81-Ball ucBGA 4 x 4 mm1.00 mm height 0.40 mm pitch 49-Ball ucBGA 3 x 3 mm1.00 mm height 0.40 mm pitch 36-Ball ucBGA2.5 x 2.5 mm 1.00 mm height0.40 mm pitchQFNS / QFNChip Scale BGAUltra Chip Scale BGAWafer Level Chip ScaleNote: Packages shown actual size. Height specification is max.NEWiCE40™Page 6Page 71) Pb-free only.ispClock ProductsPage 8Platform Manager and Power Manager II Device Selector Guide* ispPAC-POWR1014A OnlyPage 9LatticeCORE IP CoresThe following is a partial listing of LatticeCORE IP, for a complete listing of IP cores from Lattice and its 3rd party partners, please go to /ip.1. LatticeSCM™ MACO®-based IP cores are not included in this table.Page 10IP SuitesLattice IP Suites provide many of the functions required to develop a total solution for common FPGA applications. In addition, multipleLattice FPGA families are supported with each IP Suite, so designers can develop solutions across multiple Lattice families, taking advantage of the best features of each. The following table summarizes which IP cores are included in each IP Suite, and which FPGA families are supported.Page 11Page 12Page 13Page 14Features- Power connections and power sources - ispVM™ programming support- On-board and external reference clock sources• Available on Windows and Linux platforms • Software and IP with a 60-day license (Windows or Linux)• Variety of demos • USB download cable• Comprehensive Image Processing IP Library • On-board Broadcom ® Broadreach™ PHY Enables IP over Coax• On-board FTDI Chip provides easy programming via low cost USB cable- Gigabit Ethernet MAC Demo using Mico32- DDR3 Memory Controller Demo• Available on Windows and Linux platforms • USB A to USB B (Mini) Cable for FPGA Programming via a PC• 12V AC Power Adapter and International Plug Adapters•QuickSTART GuideFeaturesFeaturesFeaturesLatticeECP3 Versa Development KitHDR-60 Video Camera Development KitLatticeECP3 PCI Express Development KitLatticeXP2 Brevia2 Development Kit• LatticeECP3 PCI Express x1/x4 Solutions Board- PCI Express x1 and x4 edge connector interfaces- On-board Boot Flash- Both Serial SPI Flash and Parallel Flash via MachXO programming bridge - Shows interoperation with a highperformance DDR2 memory component - Switches, LEDs, displays for demo purposes- Input connection for lab-power supply• FPGA-based Image Signal Processing• Fully Production-Ready HDR Camera Design • 1080p Capable @ 60 frames per second• Supports up to 16 Megapixel Sensors • Supports up to two sensors simultaneously • Full 60fps in streaming mode needs no external frame buffer• Fast Auto Exposure Instantly Adjust to Changing Light• Greater than 120 dB High Dynamic Range (HDR) Performance• Direct HDMI/DVI output from FPGA • Extremely Low-Latency• The LatticeECP3 Versa Evaluation Board:- PCI Express 1.1 x1 Edge Connector Interface- Two Gigabit Ethernet Ports (RJ45)- 4 SMA Connectors for SERDES Access - USB Mini for FPGA Programming- LatticeECP3 FPGA: LFE3-35EA-FF484- 64 Mbit Serial Flash memory - 1 Gbit DDR3 Memory- 14-segment alpha-numeric display - Switches and LEDs for demos - SERDES Eye Quality Demo - 4 PCI Express Demos• LatticeXP2 FPGA: LFXP2-5E-6TN144C • 2 Mbit SPI Flash Memory • 1 Mbit SRAM• Programmed via included mini-USB Cable • 2x20 and 2x5 Expansion Headers• Push buttons for General Purpose I/O and Reset• 4-bit DIP Switch for user-defined inputs • 8 Status LEDs for user-defined outputsDevelop PCIe-based platforms using a low-cost, low-power SERDES-basedFPGA with proprietary and Lattice provided designs.A fully production ready High Dynamic Range (HDR) camera, designed to fit into commercially available camera housings. Supports full 1080p resolution at 60 frames per second in streaming mode through the FPGA, without the need for an external frame buffer.Industry’s lowest cost platform for design-ing PCI Express and Gigabit Ethernet based systems. The kit includes free demos and reference designs.Easy-to-use, low-cost platform for evaluat-ing and designing with LatticeXP2 FPGAs.Page 15FeaturesFeaturesiCEblink40 Evaluation KitMachXO2 Pico Development KitMachXO2 Control Development Kit• Two versions:- High Performance: iCE40HX1K-VQ100 - Low Power: iCE40LP1K-QN84• Powered by USB input• 1Mbit SPI PROM (enough for two iCE40HX1K images using WarmBoot)• Four capacitive-touch buttons (requires FPGA logic)• Four user LEDs• Dual PMOD header compatible with Digilent PMOD boards (6x2 header)• MachXO2 LCMXO2-1200ZE• 4-character 16-segment LCD display • 4 capacitive touch sense buttons • 1 Mbit SPI Flash• I 2C temperature sensor• Current and voltage sensor circuits • Expansion header for JTAG, I 2C• Standard USB cable for device programming and I 2C communication• RS-232/USB & JTAG/USB interface• RoHS-compliant packaging and process• MachXO2 LCMXO2-4000HC• Power Manager II ispPAC-POWR1014A • 128Mbit LPDDR memory, 4Mbit SPI Flash • Current and voltage sensor circuits • SD memory card socket • Microphone• Audio Amplifier and Delta-Sigma ADC• Up to two DVI sources and one DVI output.• Up to two Display Inputs (7:1 LVDS) and one Display Output (7:1 LVDS)• Audio output channel• Expansion header for JTAG, SPI, I 2C and PLD I/Os.• 3.33 MHz oscillator (can be modified to support 33.33 MHz or 333 kHz)• 1.2V and 3.3V power supplies• All iCE40HX1K I/O available on headers or 0.1” through-holes• Watch battery• QuickSTART Guide• LEDs & switches• Standard USB cable for device programming • RS-232/USB & JTAG/USB interface• RoHS-compliant packaging and process • AC adapter (international plugs)• QuickSTART Guide31, 2012. Standard list price: $39.MachXO Control Development Kit FeaturesMachXO Pico Dev. Kit & MachXO Control Dev. Kit• Preloaded Control SoC Demo • MachXO LCMXO2280• Power Manager II ispPAC-POWR1014A• 2Mbit SPI Flash & 1Mbit SRAM • I 2C temperature sensor • Current and voltage sensor circuits • On-board fan • Interface to 16 x 2 LCD panel*• SD memory and Compact Flash memory card sockets*• Audio output channel• Expansion header for SPI & I 2C • LEDs & switches• Standard USB cable for device programming and I 2C communication • RS-232/USB & JTAG/USB interface • 3” x 1” prototyping area • RoHS-compliant packaging and process * LCD panel and SD/Compact Flash memory not included in the development kit MachXO Mini Development Kit Features• MachXO PLD: LCMXO2280C-4TN144C• 2 Mbit SPI Flash memory • 1 Mbit SRAM• I 2C temperature sensor • USB mini jack sockets for power, JTAG programming, and RS-232 debugging • 2X16 header for off-board expansion provides access to top and right side MachXO banks• Push-buttons for sleep mode and reset• 4-bit DIP switch to user-defined inputs • ADC/DAC circuit • Sleep circuit• 8 LEDs for user-defined outputs• RoHS-compliant packaging and process• Two USB connector cables • QuickSTART GuidePage 16FeaturesFeaturesFeaturesPower Manager II Hercules Development KitProcessorPM Development KitPlatform Manager Development Kit• The Standard Edition Hercules DevelopmentKit features the following:- Preloaded Board Digital ManagementDemo- Hercules Standard Edition eval board- Power Manager II ispPAC-POWR1220AT8 and MachXOLCMXO2280 PLD• The Advanced Edition Hercules DevelopmentKit features the following:- Preloaded Board Digital ManagementDemo- Hercules Advanced Edition evaluationboard with CompactPCI headers- Power Manager II ispPAC-POWR1220AT8 and MachXOLCMXO2280 PLD- Backplane accessory evaluation boardand power supply for live hot-swap• AC adapter (international plugs)• USB Connector Cable• RoHS-compliant packaging and process• Pre-configured Processor Support Demo• ProcessorPM-POWR605• Power Manager II POWR6AT6• 3.3V, 2.5V, and 1.8V supply rails• LEDs• Slide potentiometer• 2x14 expansion header• USB mini jack socket (program/power)• 2 Push-Buttons• Preloaded Power Management Demo• LPTM10-12107, Platform Manager, 208-ballftBGA package• 35mm slide pots to emulate supply railvariations• Pads for user I/O, LED, and switches• JTAG and I2C interface headers• USB Cable• 4-Bit DIP Switch• JTAG and I2C Header Landings• RoHS-compliant packaging and process• USB connector cable• QuickSTART Guide• AC adapter with international plugs• Programmable with ispVM System software• QuickSTART GuideVersatile, ready to use hardware platformsfor evaluating and designing with PowerManager II devices. A Standard and Ad-vanced Edition of each kit is available.Versatile, ready-to-use hardware platformfor evaluating and designing with Proces-sorPM power management devices.A versatile, ready-to-use hardware plat-form for evaluating and designing withPlatform Manager devices.Features:Breakout Board Evaluation Kits•Preprogrammed with hardware test programLCMXO2-1200ZE-1TG144C PLD (MachXO2Breakout Board), LCMXO2280C-FTN256CPLD (MachXO2280 Breakout Board),POWR1014A-02TN48I (POWR1014ABreakout Board), or LC4256ZE-TN144C CPLD(ispMACH 4256ZE Breakout Board)• LEDs•Expansion Header LandingsBreakout Board Evaluation Kits for selectMachXO2, MachXO, ispMACH 4000ZE,Power Manager II devices offer convenienthardware evaluations by providing easyhand-access to PLD I/Os.•Prototyping Area•USB Mini Jack Socket (Program/Power)•JTAG Header Landing•RoHS-compliant packaging and process•USB connector cableFeaturesispMACH 4000ZE Pico Development Kit• Pre-programmed Pico Power Demo• ispMACH 4000ZE device(LC4256ZE-5MN144C)• Power Manager II device(ispPAC-POWR6AT6-01SN32I)• LCD panel• USB mini jack socket for power, JTAGprogramming, and I2C interface• 2X15 header landing for off-board expansionprovides access to LC4256ZE GPIOs,POWR6AT6 VMON inputs, I2C, and JTAG chain• Push-button for global reset• 4-bit DIP switch to user-defined inputs• 3.3V and 2.5V supply rails• Current and voltage sensor circuits• Battery or USB power source• RoHS-compliant packaging and process• Marked for CE, China RoHS Environmental-Friendly Use Period (EFUP) and WasteElectrical and Electronic Equipment (WEEE)Directives• One USB connector cable• QuickSTART GuideBattery-powered, low-cost platform toaccelerate the evaluation of ispMACH4000ZE CPLDs.Page 17Programming HardwarePage 18PAC-Designer — Mixed-Signal Design SoftwarePage 19Technical SupportUSA & Canada: 1-800-LATTICE (528-8423)For other locations: +1-503-268-8001PLDTechnicalandSoftware:***************************MixedSignal:***********************Additionally, customers can receive technical support for Lattice’s Programmable Logic Products from our Asia based applications group, by contacting Lattice Asia applications during the hours of 8:30 a.m. to 5:30 p.m. Beijing Time (CST) +0800 UTC (Chinese and English language only).Asia: +86-21-52989090********************************Corporate HeadquartersLattice Semiconductor Corporation 5555 Northeast Moore CourtHillsboro, Oregon 97124-6421 USA Telephone: +1-503-268-8000Facsimile: +1-503-268-8347Web: Software LicensingEmail:************************Web: /licensing/index.cfmCopyright © 2012 Lattice Semiconductor Corporation. All brand names or product names are trademarks or registered trademarks of their respective holders. Lattice Semiconductor Corporation, L Lattice Semiconductor Corporation (logo), L (stylized), L (design), Lattice (design), Lattice Diamond, LSC, E 2CMOS, FlashBAK, flexiFLASH, flexiMAC, flexiPCS, FreedomChip, GAL, GDX, Generic Array Logic, HDL Explorer, iCE40, iCEblink, iCEcube2, IPexpress, ISP , ispATE, ispClock, ispDOWNLOAD, ispGAL, ispGDS, ispGDX, ispGDXV, ispGDX2, ispGENERATOR, ispJTAG, ispLeverCORE, ispLSI, ispMACH, ispPAC, ispTURBO, ispVIRTUAL MACHINE, ispVM, ispXP , ispXPGA, ispXPLD, LatticeCORE, LatticeECP3, LatticeECP2, LatticeECP2M, LatticeECP , LatticeECP-DSP , LatticeMico, LatticeMico8, LatticeMico32, LatticeSC, LatticeSCM, LatticeXP , LatticeXP2, MACH, MachXO, MachXO2, MACO, ORCA, PAC, PAC-Designer, PAL, Performance Analyst, Platform Manager, ProcessorPM, PURESPEED, Reveal, Silicon Forest, Speedlocked, Speed Locking, sysCLOCK, sysCONFIG, sysDSP , sysHSI, sysI/O, sysMEM, The Simple Machine for Complex Design, TransFR, UltraMOS, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. ISP is a service mark of Lattice Semiconductor Corporation.October 2012 • Order #: I0211K。
书本封面上有一只茶壶,茶壶的壶嘴和把手在同样一边,如果你倒茶,你很有可能就把自己烫伤。
诺曼告诉你,生活艰难,往往是「坏设计」惹的祸。
读懂交互,首先得读懂人对设计的需求。
正如乔布斯所说,设计不只是外表和感觉,设计是产品如何运作。
设计师的终极目的在于做出好用的产品,而不仅仅是好看。
2.《点石成金》Don’t Make Me T hink ——Steve Krug“这本书的特点,首先是短小精悍,200页的篇幅,一点都不会罗嗦,一个中午,或许临睡前,甚至在飞机上,上下班途中,你就有可能把它一口气读完(怕最有可能的是拿到书以后就爱不释手地读下去了)。
”其中讲Web可用性三大定律,第一条便是——别让我思考。
3.《写给大家看的设计书》T he Non-Designer’s Design Book ——Robin Williams交互设计师必须学习基本的排版知识,没有审美无法成为设计师。
在这个创意无处不在的时代,你必须让自己成为一名设计师。
在Robin Williams看来,设计其实很简单。
全书围绕C.R.A.P (对比、重复、对齐和亲密性)这四个原则,用简洁通俗、幽默生动的文笔讲述灵活地运用这些原则能够带来多大的改变和亲眼可见的好处。
除此之外,还科普了颜色与字体的一些基础知识,使得全书更加完整。
用户体验与UX进阶书籍1.《用户体验的要素》T he Elements of User Experience ——Jesse James Garrett如果你需要的是一本教你“怎样做(How-to-do)”的书,有很多很多讨论如何建设网站的书,这本不是;如果你需要的是一本关于技术的书,在这里你找不到一行代码;如果你想在这本书里找答案,相反,这本书说的是“如何提出正确的问题”。
这本书将告诉你,在你阅读其他书籍的之前,你需要提前了解什么。
如果你需要一个大的概念,如果你需要了解用户体验设计师所做出的决策的环境,这本书很适合你。
设计书籍英文作文范文高中Design Books: A Treasure Trove of Inspiration and Knowledge。
Design books are a treasure trove of inspiration and knowledge for designers, students, and enthusiasts alike. They offer a glimpse into the creative process, showcase the best design work from around the world, and provide insights into the latest trends and techniques.One of the most popular design books is "The Elements of Style" by William Strunk Jr. and E.B. White. Thisclassic guide to writing has been a favorite of writers and editors for over a century. It provides clear and concise rules for writing, from grammar and punctuation to style and usage.Another must-read for designers is "Thinking with Type" by Ellen Lupton. This book explores the art and science of typography, from the history of letterforms to the latestdigital techniques. It is a comprehensive guide to the design and use of type, and includes practical tips and examples.For those interested in graphic design, "The Non-Designer's Design Book" by Robin Williams is a great place to start. This book introduces the basic principles of design, such as contrast, alignment, and proximity, and shows how they can be applied to create effective designs. It also covers topics such as color theory, typography, and layout."Designing Brand Identity" by Alina Wheeler is an essential resource for anyone involved in branding and marketing. This book covers everything from creating a brand strategy to designing a logo and developing a brand voice. It includes case studies and examples from some of the world's most successful brands."Interaction of Color" by Josef Albers is a groundbreaking book on color theory and perception. It explores how colors interact with each other and how theycan be used to create different moods and effects. It includes exercises and experiments that allow readers to explore color for themselves.Finally, "The Design of Everyday Things" by Don Norman is a classic book on user-centered design. It explores how people interact with everyday objects and how design can make them more usable and enjoyable. It covers topics such as affordances, feedback, and mental models.In conclusion, design books are an invaluable resource for anyone interested in design. They offer a wealth of knowledge and inspiration, and can help designers improve their skills and stay up-to-date with the latest trends and techniques. Whether you are a student, a professional designer, or simply an enthusiast, there is a design book out there for you.。
设计书籍英文作文英文:When it comes to designing a book, there are several things to consider. First and foremost, the cover design is crucial. A book cover is the first thing a potential reader sees, and it needs to be eye-catching and memorable. Thetitle and author name should also be prominent and easy to read.Another important aspect of book design is the layout. The text should be easy to read, with appropriate font size and spacing. Chapter headings and subheadings should be clearly defined, and any images or illustrations should be placed strategically throughout the book.In addition, the overall design should reflect the tone and content of the book. For example, a book about aserious topic may have a more subdued color scheme and font, while a book aimed at children may have bright colors andplayful illustrations.中文:设计一本书时,有几个方面需要考虑。
©LATTICE SEMICONDUCTOR CORPORATIONPage 1Achieving Timing ClosureJohn LiAgenda•Timing closure的概念•Timing closure的步骤•采用合适的Coding Style •进行适当的综合约束•管脚锁定•实施Lattice constrains •Map•布局布线•控制place and route •Floorplanning the design©LATTICE SEMICONDUCTOR CORPORATIONPage 2Timing closure的概念•当前FPGA的设计规模越来越大,复杂程度日益增加,同时要求系统的Perfromace也越来越高。
•获得Timing目标越来越困难.•设计者必须采用各种技术提升系统性能以满足设计的Timing要求.©LATTICE SEMICONDUCTOR CORPORATIONPage 3Timing closure procedure• 1.采用合适的coding style • 2.进行适当的综合约束• 3.管脚锁定• 4.实施Lattice constrains • 5.Map• 5.布局布线•7.控制place and route •8.Floorplanning the design©LATTICE SEMICONDUCTOR CORPORATIONPage 4关于提升FPGA系统性能,工程师最容易想到的方法就是通过进行综合约束、布局布线约束、和其他的优化技术提升系统性能,当然这些都是设计过程中所必需的,但所有这些优化方法对于系统性能的提升都是有限的,系统的性能最终还是取决于工程师的设计(coding style),其中同步设计是最重要的一点. 下面讨论一些具体的coding 技术,合理的运用这些coding技术能够尽可能的减小两级寄存器之间的延时从而获得更高的系统速度.-通用的coding style--Hierarchical Coding---Team Based的设计:多个工程师可以同时参与到一个复杂设计中来。
设计书籍英文作文素材英文:Designing a book is a complex and creative process that requires attention to detail and a deep understanding of the subject matter. As a writer, I know firsthand the importance of a well-designed book in capturing thereader's attention and conveying the intended message.One of the key elements of book design is the cover. A book cover should be eye-catching and visually appealing, while also conveying the tone and content of the book. For example, if I were designing a book about travel, I might choose a cover image of a beautiful landscape or an iconic landmark to draw the reader in.Another important aspect of book design is the layout. The layout should be easy to read and visually appealing, with appropriate use of font, spacing, and images. For example, if I were designing a cookbook, I would make sureto include plenty of high-quality photos of the dishes, along with clear and easy-to-follow instructions.In addition to the cover and layout, book design also involves decisions about paper quality, binding, and other physical attributes. These details may seem small, but they can have a big impact on the overall reading experience.Overall, designing a book is a challenging but rewarding process that requires a combination of creativity and attention to detail. A well-designed book can make all the difference in capturing the reader's attention and conveying the intended message.中文:设计一本书是一个复杂而富有创意的过程,需要关注细节并对主题有深入的了解。
第一章可编程逻辑技术简介第1章 可编程逻辑技术简介本章主要带领初学者了解一般性可编程设计技术。
本章在引入FPGA/CPLD基本概念的基础上,重点论述了FPGA/CPLD的完整设计流程,并对FPGA/CPLD常用开发工具加以简介,最后展望了FPGA/CPLD设计技术的新发展。
本章主要内容如下:•可编程逻辑设计技术简介;•FPGA/CPLD的基本结构;•FPGA/CPLD的设计流程;•FPGA/CPLD的常用开发工具;•下一代可编程逻辑设计技术展望。
1.1 可编程逻辑设计技术简介本节在讨论可编程逻辑器件发展简史的基础上简述目前常用的可编程逻辑器件的分类。
1.1.1 可编程逻辑器件发展简史随着微电子设计技术与工艺的发展,数字集成电路从电子管、晶体管、中小规模集成电路、超大规模集成电路(VLSIC)逐步发展到今天的专用集成电路(ASIC)。
ASIC的出现降低了产品的生产成本,提高了系统的可靠性,缩小了设计的物理尺寸,推动了社会的数字化进程。
但是ASIC因其设计周期长,改版投资大,灵活性差等缺陷制约着它的应用范围。
硬件工程师希望有一种更灵活的设计方法,根据需要,在实验室就能设计、更改大规模数字逻辑,研制自己的ASIC并马上投入使用,这是提出可编程逻辑器件的基本思想。
可编程逻辑器件随着微电子制造工艺的发展取得了长足的进步。
从早期的只能存储少量数据,完成简单逻辑功能的可编程只读存储器(PROM)、紫外线可擦除只读存储器(EPROM)和电可擦除只读存储器(E2PROM),发展到能完成中大规模的数字逻辑功能的可编程阵列逻辑(PAL)和通用阵列逻辑(GAL),今天已经发展成为可以完成超大规模的复杂组合逻辑与时序逻辑的复杂可编程逻辑器件(CPLD)和现场可编程逻辑器件第1章 可编程逻辑技术简介2 (FPGA )。
随着工艺技术的发展与市场需要,超大规模、高速、低功耗的新型FPGA/CPLD 不断推陈出新。
新一代的FPGA 甚至集成了中央处理器(CPU )或数字处理器(DSP )内核,在一片FPGA 上进行软硬件协同设计,为实现片上可编程系统(SOPC ,System On Programmable Chip )提供了强大的硬件支持。
1.1.2 可编程逻辑器件分类广义上讲,可编程逻辑器件是指一切通过软件手段更改、配置器件内部连接结构和逻辑单元,完成既定设计功能的数字集成电路。
目前常用的可编程逻辑器件主要有简单的逻辑阵列(PAL/GAL )、复杂可编程逻辑器件(CPLD )和现场可编程逻辑阵列(FPGA )等3大类。
(1) PAL/GALPAL 是Programmable Array Logic 的缩写,即可编程阵列逻辑;GAL 是Generic Array Logic 的缩写,即通用可编程阵列逻辑。
PAL/GAL 是早期可编程逻辑器件的发展形式,其特点是大多基于E 2CMOS 工艺,结构较为简单,可编程逻辑单元多为与、或阵列,可编程单元密度较低,仅能适用于某些简单的数字逻辑电路。
虽然PAL/GAL 密度较低,但是它们一出现即以其低功耗、低成本、高可靠性、软件可编程、可重复更改等特点引发了数字电路领域的巨大振动。
虽然目前较复杂的逻辑电路一般使用CPLD 甚至FPGA 完成,但是对应很多简单的数字逻辑,GAL 等简单的可编程逻辑器件仍然被大量使用。
目前国内外很多对成本十分敏感的设计都在使用GAL 等低成本可编程逻辑器件,越来越多的74系列逻辑电路被GAL 取代。
GAL 等器件发展至今已经近20年了,新一代的GAL 以功能灵活、小封装、低成本、重复可编程、应用灵活等优点仍然在数字电路领域扮演者重要的角色。
目前比较大的GAL 器件供应商主要是Lattice 半导体。
(2) CPLD可编程逻辑设计技术简介3 CPLD 是Complex Programmable Logic Device 的缩写,即复杂的可编程逻辑器件。
Altera 曾将自己的CPLD 器件称为EPLD (Enhanced Programmable LogicDevice ),即增强型可编程逻辑器件。
其实EPLD 和CPLD 属于同等性质的逻辑器件,目前Altera 为了遵循称呼习惯,已经将其EPLD 统称为CPLD 。
CPLD 是在PAL 、GAL 的基础上发展起来的,一般也采用E 2CMOS 工艺,也有少数厂商采用Flash 工艺,其基本结构由可编程I/O 单元、基本逻辑单元、布线池和其他辅助功能模块构成。
CPLD 可实现的逻辑功能比PAL 、GAL 有了大幅度的提升,一般可以完成设计中较复杂、较高速度的逻辑功能,如接口转换、总线控制等。
CPLD 的主要器件供应商有Lattice 、Altera 和Xilinx 等。
(3) FPGAFPGA 是Filed Programmable Gate Array 的缩写,即现场可编程逻辑阵列。
FPGA 是在CPLD 的基础上发展起来的新型高性能可编程逻辑器件,它一般采用SRAM 工艺,也有一些专用器件采用Flash 工艺或反熔丝(Anti-Fuse )工艺等。
FPGA 的集成度很高,其器件密度从与数万系统门到数千万系统门不等,可以完成极其复杂的时序与组合逻辑电路功能,适用于高速、高密度的高端数字逻辑电路设计领域。
FPGA 的基本组成部分有可编程输入/输出单元、基本可编程逻辑单元、嵌入式块RAM 、丰富的布线资源、底层嵌入功能单元、内嵌专用硬核等。
FPGA 的主要器件供应商有Lattice 、Altera 、Xilinx 和Actel等。
第1章 可编程逻辑技术简介4 1.2 FPGA/CPLD 的基本结构本节在讨论FPGA 与CPLD 的通用结构的基础上,比较两者的异同,加深读者对这两种最通用的可编程逻辑器件的认识。
1.2.1 FPGA 的基本结构简化的FPGA 基本由6部分组成,分别为可编程输入/输出单元、基本可编程逻辑单元、嵌入式块RAM 、丰富的布线资源、底层嵌入功能单元和内嵌专用硬核等,如图1-1所示。
图1-1 可编程逻辑器件的结构原理图每个单元的基本概念介绍如下。
(1) 可编程输入/输出单元。
输入/输出(Input/Output )单元简称I/O 单元,它们是芯片与外界电路的接口部分,完成不同电气特性下对输入/输出信号的驱动与匹配需求。
为了使FPGA有更灵活的应用,目前大多数FPGA 的I/O 单元被设计为可编程模式,即通过FPGA/CPLD 的基本结构5 软件的灵活配置,可以适配不同的电气标准与I/O 物理特性;可以调整匹配阻抗特性,上下拉电阻;可以调整输出驱动电流的大小等。
可编程I/O 单元支持的电气标准因工艺而异,不同器件商不同器件族的FPGA支持的I/O 标准也不同,一般说来,常见的电气标准有LVTTL 、LVCMOS 、SSTL 、HSTL 、LVDS 、LVPECL 和PCI 等。
值得一提的是,随着ASIC 工艺的飞速发展,目前可编程I/O 支持的最高频率越来越高,一些高端FPGA 通过DDR 寄存器技术,甚至可以支持高达2Gbps 的数据速率。
(2) 基本可编程逻辑单元基本可编程逻辑单元是可编程逻辑的主体,可以根据设计灵活地改变其内部连接与配置,完成不同的逻辑功能。
FPGA 一般是基于SRAM 工艺的,其基本可编程逻辑单元几乎都是由查找表(LUT ,Look Up Table )和寄存器(Register )组成的。
FPGA 内部查找表多为4输入,查找表一般完成纯组合逻辑功能。
FPGA 内部寄存器结构相当灵活,可以配置为带同步/异步复位或置位、时钟使能的触发器(FF ,Flip Flop ),也可以配置成为锁存器(Latch )。
FPGA 一般依赖寄存器完成同步时序逻辑设计。
一般来说,比较经典的基本可编程单元的配置是一个寄存器加一个查找表,但是不同厂商的寄存器和查找表的内部结构有一定的差异,而且寄存器和查找表的组合模式也不同。
一般的概念是,将1个Register 与1个LUT 组合起来,称为1个LE(Logic Element ,逻辑单元)或LC (Logic Cell ,逻辑单元)。
Lattice 的底层逻辑单元叫PFU (Programmable Function Unit ,可编程功能单元),它由8个第1章 可编程逻辑技术简介6 LE 构成;Xilinx 可编程逻辑单元叫Slice ,它是由上下两个LE 构成;Altera某些FPGA 将10个LE 组合起来,称为逻辑阵列模块(LAB ,Logic ArrayBlock )。
不论PFU 、Slice 还是LAB ,它们中除了LE 外,还配有进位链、控制信号、局部互联线资源、级联链等连线与控制资源,从而通过组合完成复杂的组合与时序逻辑。
学习底层配置单元的LUT 和Register 比率的一个重要意义在于器件选型和规模估算。
很多器件手册上用器件的ASIC 门数或等效的系统门数表示器件的规模。
但是由于目前FPGA 内部除了基本可编程逻辑单元外,还包含有丰富的嵌入式RAM 、PLL 或DLL ,专用Hard IP Core (硬知识产权功能核)等,这些功能模块也会等效出一定规模的系统门,所以用系统门权衡基本可编程逻辑单元的数量是不准确的,常常混淆设计者。
比较简单科学的方法是用器件的Register 或LUT 的数量衡量(一般来说两者比率为1:1)。
例如,Xilinx 的Spartan-III 系列的XC3S1000有15360个LUT ,而Lattice 的EC 系列LFEC15E 也有15360个LUT ,所以这两款FPGA 的可编程逻辑单元数量基本相当,属于同一规模的产品。
同样道理,Altera 的Cyclone 器件族的EP1C12的LUT 数量是12060个,就比前面提到的两款FPGA 规模略小。
需要说明的是,器件选型是一个综合性问题,需要将设计的需求、成本压力、规模、速度等级、时钟资源、I/O 特性、封装、专用功能模块等诸多因素综合考虑。
(3) 嵌入式块RAMFPGA/CPLD 的基本结构7 目前大多数FPGA 都有内嵌的块RAM (Block RAM )。
FPGA 内部嵌入可编程RAM 模块,大大地拓展了FPGA 的应用范围和使用灵活性。
FPGA 内嵌的块RAM 一般可以灵活配置为单口RAM (SPRAM ,Single Port RAM )、双口RAM (DPRAM ,Double Ports RAM )、伪双口RAM (Pseudo DPRAM )、CAM(Content Addressable Memory )、FIFO (First In First Out )等常用存储结构。