Dynamics and BPS states of AdS5 supergravity with a Gauss-Bonnet term

6630B Series Single-Output, 80-100 W GPIB Power SuppliesData SheetSpeed and accuracy for test optimizationThis series of linear-regulated 80-100 W DC power supplies is designed to max-imize the throughput of DUTs through the manufacturing test process. Both programming and measurement are optimized for speed. The active downprogrammer can sink up to the full rated current of the power supply, which quickly brings the power supply output to zero volts. The 6630B series offers many advanced programmable features including stored states and status reporting. Programming is done using industry standard SCPIcommands via the GPIB or RS-232. Test system integration is further simplified by using the VXI plug&play drivers. The optional relays simplify system design and troubleshooting.The optional front panel binding posts make the 6630B series convenient on the R&D lab bench. The built-in microamp measurement system helps the engineer to easily and accurately monitor the output voltage and currentwithout a complicated test setup.• Fast, low-noise outputs• Programmable active down-programmer sinks the full rated current • Dual-range, precision low current measurement • Optional isolation and polarity reversal relays• Built-in measurements and advanced programmable features • Protection features to ensure DUT safety 1981Specifications23Agilent Models: 6631B, 6632B 6633B, 6634BTopRearSupplemental characteristics for all model numbersDC floating voltage: Output terminals can be floated up to ± 240 VDC maximum from chassis ground Remote sensing: Up to two volts dropped in each load lead. Add 2 mV to the voltage load regulation speci-fication for each one volt change in the positive output lead due to load current change.Command processing time: Average time required for the output voltage to begin to change following receipt of digital data is 4 ms for the power supplies connected directly to the GPIB. (Display disabled).Output programming response time: The rise and fall time (10/90% and 90/10%) of the output voltage is less than 2 ms (400 μs in fast mode). The output voltage change settles within 1 LSB (0.025% x rated voltage) of final value in less than 6 ms (2 ms in the fast mode).GPIB interface capabilities: IEEE-488.2, SCPI command set, and 6630A Series programming compatibilitySoftware driver: VXI plug&play Measurement time : Average time to make a voltage or current measurement is 50 ms.Input power (full load): 3.5 A, 250 W Regulatory compliance: Complies with EMC directive 89/336/EEC (ISM 1B). Size:425.5 mm W x 88.1 mm H x 364.4 mm D (16.8 in x 3.5 in x 14.3 in)Weight: Net, 12.7 kg (28 lb) net; 15.0 kg (33 lb) shipping Warranty: One yearAgilent Email Updates/find/emailupdatesGet the latest information on the products and applications you select.Agilent Channel Partnersw w w /find/channelpartners Get the best of both worlds: Agilent’s measurement expertise and product breadth, combined with channel partner convenience.For more information on AgilentTechnologies’ products, applications or services, please contact your local Agilent office. The complete list is available at:/fi nd/contactusAmericas Canada (877) 894 4414Brazil (11) 4197 3600Mexico01800 5064 800United States(800) 829 4444Asia Pacifi c Australia 1 800 629 485China 800 810 0189Hong Kong 800 938 693India 1 800 112 929Japan 0120 (421) 345Korea 080 769 0800Malaysia 1 800 888 848Singapore 180****8100Taiwan 0800 047 866Other AP Countries (65) 375 8100Europe & Middle East Belgium 32 (0) 2 404 93 40Denmark 45 45 80 12 15Finland 358 (0) 10 855 2100France 0825 010 700**0.125 €/minuteGermany 49 (0) 7031 464 6333Ireland 1890 924 204Israel 972-3-9288-504/544Italy39 02 92 60 8484Netherlands 31 (0) 20 547 2111Spain 34 (91) 631 3300Sweden0200-88 22 55United Kingdom 44 (0) 118 927 6201For other unlisted countries: /fi nd/contactusRevised: January 6, 2012Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2012Published in USA, January 26, 20125990-9303EN/find/6630Agilent Advantage Services is committedto your success throughout your equip-ment’s lifetime. To keep you competitive, we continually invest in tools andprocesses that speed up calibration and repair and reduce your cost of ownership. You can also use Infoline Web Services to manage equipment and services more effectively. By sharing our measurement and service expertise, we help you create the products that change our world./quality/find/advantageservicesOrdering informationOpt 100 87 to 106 VAC, 47 to 63 Hz Opt 120 104 to 127 VAC, 47 to 63 Hz Opt 220 191 to 233 VAC, 47 to 63 Hz Opt 230 207 to 253 VAC, 47 to 63 Hz Opt 020 Front-panel binding posts (N/A on 6631B)Opt 760 Isolation and reversal relays, only available at time of order (not available on the 6631B)Opt 8ZJ R emoves feet for use in a racked systemOpt 0L1 Full documentation on CD-ROM, and printed standard docu-mentation package. CD-ROM includes User’s Guide, Programming Guide, Service Manual and Quick Start Guide Opt 0B3 Service manual Accessoriesp/n 1494-0060 Rack slide kitE3663AC Support rails for Agilent rack cabinets1CM002A* Rack mount flange kit 88.1mm H (2U), two flange brackets: 1.75 inch hole spacing1CP001A* Rack mount flange and handle kit 88.1 mm H (2U), two brackets and front handlesApplication notes10 Practical Tips You Need to Know About Your Power Products , 5965-8239E10 Hints for Using Your Power Supply to Decrease Test Time , 5968-6359E Understanding Linear Power Supply Operation (AN1554), 5989-2291EN* Support rails required。

Interconnect routers complement IP edge and core router platforms to deliver enhanced, cost-effective IP network architectures. The 7250 IXR delivers a comprehensive set of IP/MPLS, synchronization and quality of service (QoS) capabilities. Flexible traffic management includes big buffering, per-port queuing, shaping and policing.High-density aggregationThe 7250 IXR is optimized for high-density aggregation, supporting up to 57.6 Tb/s(7250 IXR-10), 28.8 Tb/s (7250 IXR-6) or 1.6 Tb/s (7250 IXR-s) of system capacity, and is equipped with high-performance 100GE (Gigabit Ethernet), 50GE 2, 40GE, 25GE, 10GE and GE interfaces to scale networks to meet evolving traffic demands.Differentiated service supportPer-service, hierarchical queuing features support differentiated QoS, which is ideal for any-Gaggregation and fixed-mobile network convergence. These features also help industrial enterprises attain IT/OT (informational technology/operational technology) convergence by simultaneously carrying both their business and operational traffic.Nokia 7250 IXR-10/IXR-6/IXR-s Interconnect RoutersRelease 20The Nokia 7250 Interconnect Router (IXR) family addresses evolving demands driven by the cloud, 5G and the Internet of Things. The IXR-10, IXR-6 and IXR-s1 routers enable high-scale interconnectivity in data centers and across WANs and aggregation networks in service provider, enterprise and webscale environments.7250 IXR-107250 IXR-s7250 IXR-61 The 7250 IXR-10, IXR-6 and IXR-s are part of the 7250 IXR product family. Additional data sheets are available for other models in this product family.The 7250 IXR10, IXR-6 and IXR-s are referred to collectively as the 7250 IXR throughout this data sheet.2 50GE is a future software deliverable.High availabilityThe 7250 IXR sets the benchmark for high availability. The 7250 IXR-10 and IXR-6 systems support a full suite of 1+1 control, 5+1 fabric,and redundant fan and power configurations.In addition to full hardware redundancy, the robust Nokia Service Router Operating System (SR OS) supports numerous features to maximize network stability, ensuring that IP/MPLS protocols and services run without interruption. These features include innovative nonstop routing, nonstop services and stateful failover. AutomationThe 7250 IXR uses the Nokia SR OS and is managed by the Nokia Network Services Platform (NSP). The Nokia NSP offers a rich set of service management features that automate new service delivery and reduce operating cost.Standards-based software-defined networking (SDN) interfaces enable best-path computation to be offloaded to path computation elements (PCEs) such as the Nokia NSP. The 7250 IXR operates as a path computation client (PCC), collecting and reporting per-link and per-service delay, jitter and loss metrics as well as port utilization levels, for efficient path computation. Software featuresThe 7250 IXR supports, but is not limited to,the following features.Services• Point-to-point Ethernet pseudowires/virtual leased line (VLL)• Ethernet Virtual Private Network (EVPN)–Virtual Private Wire Service (EVPN-VPWS)–Virtual Private LAN Services (EVPN-VPLS):IPv4 and IPv6 support, including VirtualRouter Redundancy Protocol (VRRP)–Multihoming with single active or active/active • Multipoint Ethernet VPN services with VPLS based on Targeted Label Distribution Protocol (T-LDP) and Border Gateway Protocol (BGP)• Routed VPLS with Internet Enhanced Service (IES) or IP-VPN, IPv4 and IPv6• Ingress and egress VLAN manipulation for Layer 2 services• IP VPN (VPRN), Inter-Autonomous System (Inter-AS) Option A, B and C• IPv6 VPN Provider Edge (6VPE)Network protocols• Segment routing–Intermediate System-to-Intermediate System(SR-ISIS) and Open Shortest Path First(SR-OSPF)–Traffic engineering (SR-TE)• MPLS label edge router (LER) and label switching router (LSR) functions–Label Distribution Protocol (LDP)–Resource Reservation Protocol with trafficengineering (RSVP-TE)• BGP - Labeled Unicast (BGP-LU) (IETF RFC 3107) route tunnels• IP routing–Dual-stack Interior Gateway Protocol (IGP)–Multi-topology, multi-instance IntermediateSystem to Intermediate System (IS-IS)–Multi-instance OSPF–Multiprotocol BGP (MP-BGP)–BGP-LU support in edge, area border router(ABR) and autonomous system boundaryrouter (ASBR) roles–Usage-triggered download of BGP labelroutes to Label - Forwarding Information Base(L-FIB)–Accumulated IGP (AIGP) metric for BGP–BGP route-reflector for EVPN and IP-VPNwith VPNv4 and VPNv6 address families (AFs) • Layer 3 Multicast – base routing–Internet Group Management Protocol (IGMP)–Protocol Independent Multicast – Sparse Mode(PIM-SM), Source Specific Multicast (SSM)–Multicast Listener Discovery (MLD)• Layer 3 Multicast - VPRN (7250-IXR-s)–Next-generation multicast VPNs (NG-MVPN)–SSM with multicast LSPv4 (mLDPv4)–IGMP/MLD–IGMP/MLD on Routed VPLS Interface• Layer 2 Multicast–IGMP/MLD snoopingSDN• SR-TE LSPs, RSVP-TE LSPs–PCC initialized, PCC controlled–PCC initialized, PCE computed (7250 IXR-s)–PCC initialized, PCE controlled (7250 IXR-s)• SR-TE LSPs: PCE initialized, PCE controlled(7250 IXR-s)• Topology discovery: BGP-Link State (BGP LS) IPv4 and IPv6• Telemetry: streaming interface, service delay and jitter statisticsLoad balancing and resiliency• Nonstop routing (IXR-10 and IXR-6)• Segment routing topology independent and remote loop-free alternate (TI-LFA and rLFA)• LDP LFA• IEEE 802.3.ad Link Aggregation Group (LAG) and multi-chassis (MC) LAG• Pseudowire and LSP redundancy• IP and MPLS load balancing by equal-cost multipath (ECMP)• VRRP• Configurable polynomial and hash seed shift • Entropy label (IETF RFC 6790)• RSVP-TE Fast Reroute (FRR)• BGP Edge and Core Prefix Independent Convergence (BGP PIC)Platform• Ethernet IEEE 802.1Q (VLAN) and 802.1ad (QinQ) with 9k jumbo frames• Detailed forwarded and discarded countersfor service access points (SAPs) and network interfaces in addition to port-based statistics: per Virtual Output Queue (VoQ) packet and byte counters (7250 IXR-s)• Dynamic Host Configuration Protocol (DHCP) server for IPv4 IES, VPNv4• DHCP relay, IPv4 and IPv6, IES, IP-VPN,EVPN-VPLS• Accounting recordsQoS and traffic management• Hierarchical QoS (7250 IXR-s)–Hierarchical egress schedulers and shapersper forwarding class, SAP, network interfaceor port–Port sub-rate• Intelligent packet classification, including MAC, IPv4, IPv6 match-criteria-based classification • Granular rate enforcement with up to 32 policers per SAP/VLAN, including broadcast, unicast, multicast and unknown policers• Hierarchical policing for aggregate rate enforcement• Strict priority, weighted fair queuing schedulers • Congestion management via weighted random early discard (WRED)• Egress marking or re-markingSystem management• Network Management Protocol (SNMP)• Model-driven (MD) management interfaces–Netconf–MD CLI–Remote Procedure Call (gRPC)• Comprehensive support through Nokia NSPOperations, administration and maintenance • IEEE 802.1ag, ITU-T Y.1731: Ethernet Connectivity Fault Management for both fault detection and performance monitoring, including delay, jitter and loss tests• Ethernet bandwidth notification with egress rate adjustment• IEEE 802.3ah: Ethernet in the First Mile• Bidirectional Forwarding Detection IPv4 and IPv6• Two-Way Active Measurement Protocol (TWAMP), TWAMP Light• A full suite of MPLS OAM tools, including LSP and virtual circuit connectivity verification ping • Service assurance agent• Mirroring with slicing support:–Port–VLAN–Filter output: Media Access Control (MAC),IPv4/IPv6 filters–Local/remote• Port loopback with MAC swap• Configuration rollback• Zero Touch Provisioning (ZTP) capable (7250 IXR-s) Security• Remote Authentication Dial-In User Service (RADIUS), Terminal Access ControllerAccess Control System Plus (TACACS+), and comprehensive control-plane protection capabilities• MAC-, IPv4- and IPv6-based access control lists and criteria-based classifiers• Secure Shell (SSH)Hardware overview7250 IXR-10 and IXR-6 platformsThe 7250 IXR-10 and IXR-6 share common integrated media module (IMM) cards, control processor modules (CPMs) and power supplyunits (PSUs).Each chassis uses an orthogonal direct cross-connect architecture, with IMMs connecting in front and switch fabrics and fans connecting at the rear. The lack of a backplane, midplane or midplane connector system provides a compact chassis design, optimal cooling and easy capacity upgrades. The 7250 IXR supports a 5+1 switch fabric design for full fabric redundancy with graceful degradation. Fans and switch fabrics are separate, ensuring a complete separation of cooling from the dataplane and enabling non-service-impacting fan replacement options. The system uses a complete Faraday Cage design to ensure EMI containment, a critical requirement for platform evolution that will support next-generation application-specific integrated circuits (ASICs).7250 IXR-10 and IXR-6 control plane Control-plane performance is a key requirementin networking. Multicore CPUs with support for symmetric multiprocessing (SMP) provide leading capabilities in task distribution and concurrent processing, leveraging the hardened capabilitiesof the SR OS. This is a capability common to all platforms in the 7250 IXR product series.The 7250 IXR-10/IXR-6 supports dual-redundant CPMs for hot-standby control-plane redundancy and supports a fully distributed control infrastructure with dedicated CPUs per line card. Compared to single monolithic control plane systems, this distributed architecture provides optimized control plane processing without any detrimental impacts to the central CPM during system maintenance, IMM commissioning and heavy data loads. The distributed architecture also improves system security.Power suppliesThe 7250 IXR-10/IXR-6 platforms support 12and 6 PSUs respectively, allowing for full N+M(N is active and M is the number of protecting power supplies) power supply redundancy and full power feed redundancy. In contrast to systems with fewer power supplies, the 7250 IXR provides added headroom for power growth for system enhancements with next-generation ASICs.On the IXR-10/IXR-6, two PSU variants are available: a low-voltage DC PSU (LVDC) and a combined high-voltage DC (HVDC) and AC PSU. The PSUs are fully interchangeable between the chassis variants. The HVDC PSU option enables OPEX and CAPEX savings as a result of the power-supply and infrastructure design.The 7250 IXR-s supports two PSUs with 1+1 redundancy with support for either AC or LVDC power options.Technical specificationsTable 1. 7250 IXR6-10/IXR-6/IXR-s specificationsSystem configuration Dual hot-standby CPMs Dual hot-standby CPMs Single integrated CPM System throughput:Half duplex (HD) IMIXtraffic57.6 Tb/s28.8 Tb/s 1.6 Tb/sSwitch fabric capacity per module: Full duplex (FD) • 5.76 Tb/s• Single-stage fabric with gracefuldegradation• Separate fan tray from switch fabric• 2.88 Tb/s• Single-stage fabric with gracefuldegradation• Separate fan tray from switch fabricIntegratedCard slot throughput:FD per slot3.6 Tb/s 3.6 Tb/s n/aCard slots84n/aService interfaces n/a n/a• 6 x QSFP28/QSFP+100/40GE• 48 x SFP+/SFP 10/1GEControl interfaces Console, management, Synchronous Ethernet (SyncE)/1588, OES, BITS,Bluetooth, USB*, 1PPS, SD slot Console, management, USB, SD slotTiming and synchronization • Built-in Stratum 3E clock• ITU-T Synchronous Ethernet (SyncE)• IEEE 1588v2–Boundary clock (BC), slave clock (SC)–Profiles: IEEE 1588v2 default, ITU-T G.8275.1• Nokia Bell Labs IEEE 1588v2 algorithm• IETF RFC 5905 Network Time Protocol (NTP)• Building Integrated Timing Supply (BITS) ports (T1, E1, 2M) and pulse-persecond (1PPS) timing• Built-in Stratum 3E clock• ITU-T SyncE• ITU-T G.8262.1 eEEC• IEEE 1588v2–BC–Profile: ITU-T G.8275.1• ITU-T G.8273.2 Class B, C**• IETF RFC 5905 NTP• Support for GNSS SFPMemory buffer size Per card (see T able 2)Per card (see T able 2)8 GBRedundant hardware• Dual redundant CPMs• Switch fabric redundancy (5+1)• Power redundancy (M+N)• Fan redundancy (N+1)• Power redundancy (1+1)• Fan redundancy (5+1)Dimensions• Height: 57.78 cm (22.75 in);13 RU• Width: 44.45 cm (17.5 in)• Depth: 81.28 cm (32.0 in)Fits in standard 19-in rack • Height: 31.15 cm (12.25 in);7 RU• Width: 44.45 cm (17.5 in)• Depth: 81.28 cm (32.0 in)Fits in standard 19-in rack• Height: 4.35 cm (1.75 in);1 RU• Width: 43.84 cm (17.26 in)• Depth: 51.5 cm (20.28 in)Fits in standard 19-in rack* Future software deliverable** Class C for noise generation. Future support for RS-FEC.Power• 12 PSUs with N+M redundancy• LVDC (single feed): -40 V DC to-72 V DC• HVDC: 240 V to 400 V• AC: 200 V AC to 240 V AC,50 Hz/60 Hz• Front-bottom mounted • 6 PSUs with N+M redundancy• LVDC (single feed): -40 V DC to-72 V DC• HVDC: 240 V to 400 V• AC: 200 V AC to 240 V AC,50 Hz/60 Hz• Front-bottom mounted• 2 PSUs with 1+1redundancy• LVDC (single feed):-40 V DC/-72 V• AC: 200 V AC to 240 V AC,50 Hz/60 Hz• Rear mountedCooling• 3 trays of 3 ultra-quiet fans• Fan trays separate from switchfabric• Safety electronic breaks on removal• Front-to-back airflow• Fan filter door kit (optional)• 3 trays of 2 ultra-quiet fans• Fan trays separate from switchfabric• Safety electronic breaks on removal• Front-to-back airflow• Fan filter door kit (optional)• 6 trays of 1 ultra-quietfan each• Fan trays separate fromswitch fabric• Safety electronic breakson removal• Front-to-back airflowNormal operatingtemperature range0°C to +40°C (32°F to +104°F) sustainedShipping and storagetemperature-40°C to 70°C (-40°F to 158°F) Normal humidity5% to 95%, non-condensing Note: Throughout this table, n/a = not applicable.Optical breakout solutions available on QSFP28/QSFP+ ports:• 7210 IXR-10, IXR-6: 4 x 10GE and 4 x 25GE• 7210 IXR-s: 4 x 10GETable 2. Nokia 7250 IXR-10 and IXR-6 IMM cards36-port 100GE• 36 x 100GE QSFP28/QSFP+ 100/40GE• MACsec on all ports*• 48 GB packet buffer2-port 100GE + 48-port 10GE • 2 x 100GE QSFP28/QSFP+ 100/40GE • 48 x SFP+/SFP 10/1GE• MACsec on all ports*• 8 GB packet bufferTable 3. Platform density7250 IXR-s• 288 x 100/40GE• 384 x 10/1 GE + 16 x 100/40GE • 144 x 100/40GE• 192 x 10/1GE + 8 x 100/40GE• 6 x 100/40GE•48 x 10/1GE* Future software deliverableStandards compliance3Environmental• ATIS-0600015.03• ATT-TP-76200• ETSI EN 300 019-2-1; Storage Tests, (Class 1.2)• ETSI EN 300 019-2-2; Transportation Tests,(Class 2.3)• ETSI EN 300 019-2-3; Operational Tests, (Class 3.2)• ETSI EN 300 753 Acoustic Noise (Class 3.2)• GR-63-CORE• GR-295-CORE• GR-3160-CORE• VZ.TPR.9205• VZ.TPR.9203 (CO)Safety• AS/NZS 60950.1• CSA/UL 62368-1 NRTL• EN 62368-1 CE Mark• IEC 60529 IP20• IEC/EN 60825-1• IEC/EN 60825-2• IEC 62368-1 CB Scheme Electromagnetic compatibility• AS/NZS CISPR 32 (Class A)• ATIS-600315.01.2015• BSMI CNS13438 Class A• BT GS-7• EN 300 386• EN 55024• EN 55032 (Class A)• ES 201 468• ETSI EN 300 132-3-1• ETSI EN 300 132-2 (LVDC)• ETSI EN 300 132-3 (AC)• FCC Part 15 (Class A)• GR-1089-CORE• ICES-003 (Class A)• IEC 61000-3-2• IEC 61000-3-3• IEC CISPR 24• IEC CISPR 32 (Class A)• IEC 61000-6-2• IEC 61000-6-4• IEC/EN 61000-4-2 ESD• IEC/EN 61000-4-3 Radiated Immunity• IEC/EN 61000-4-4 EFT• IEC/EN 61000-4-5 Surge• IEC/EN 61000-4-6 Conducted Immunity • IEC/EN 61000-4-11 Voltage Interruptions • ITU-T L.1200• KCC Korea-Emissions & Immunity(in accordance with KN32/35)• VCCI (Class A)Directives, regional approvals and certifications • DIRECTIVE 2011/65/EU RoHS• DIRECTIVE 2012/19/EU WEEE• DIRECTIVE 2014/30/EU EMC• DIRECTIVE 2014/35/EU LVD• MEF CE 3.0 compliant• NEBS Level 3–Australia: RCM Mark–China RoHS: CRoHS–Europe: CE Mark–Japan: VCCI Mark–South Korea: KC Mark–Taiwan: BSMI Mark3 System design intent is according to the listed standards. Refer to product documentation for detailed compliance status.7Data sheetAbout NokiaWe create the technology to connect the world. Powered by the research and innovation of Nokia Bell Labs, we serve communications service providers, governments, large enterprises and consumers, with the industry’s most complete, end-to-end portfolio of products, services and licensing.From the enabling infrastructure for 5G and the Internet of Things, to emerging applications in digital health, we are shaping the future of technology to transformthe human experience. Nokia operates a policy of ongoing development and has made all reasonable efforts to ensure that the content of this document is adequate and free of material errors and omissions. Nokia assumes no responsibility for any inaccuracies in this document and reserves the right to change, modify, transfer, or otherwise revise this publication without notice.Nokia is a registered trademark of Nokia Corporation. Other product and company names mentioned herein may be trademarks or trade names of their respective owners. © 2020 NokiaNokia OyjKaraportti 3FI-02610 Espoo, Finland。

DS-2XS6A46G1/P-IZS/C36S804 MP ANPR Bullet Solar Power 4G Network Camera KitIt can be used in the areas that are not suitable for laying wired network and electric supply lines, or used for the scenes that feature tough environment and have high demanding for device stability. It can be used for monitoring the farms, electric power cables, water and river system, oil pipelines and key forest areas.It also can be used in the temporary monitoring scenes, such as the large-scale competitions, the sudden public activity, the temporary traffic control and the city construction.Empowered by deep learning algorithms, Hikvision AcuSense technology brings human and vehicle targets classification alarms to front- and back-end devices. The system focuses on human and vehicle targets, vastly improving alarm efficiency and effectiveness.⏹ 80 W photovoltaic panel, 360 Wh chargeable lithium battery⏹ Clear imaging against strong back light due to 120 dB trueWDR technology⏹ Focus on human and vehicle targets classification based ondeep learning⏹Support battery management, battery display, batteryhigh-low temperature protection, charge-dischargeprotection, low-battery sleep protection and remotewakeup ⏹ LTE-TDD/LTE-FDD/WCDMA/GSM 4G wireless networktransmission, support Micro SIM card⏹Water and dust resistant (IP66) *The Wi-Fi module of this product only supports AP mode on Channel 11, and does not support other modes and channels.FunctionRoad Traffic and Vehicle DetectionWith embedded deep learning based license plate capture and recognition algorithms, the camera alone can achieve plate capture and recognition. The algorithm enjoys the high recognition accuracy of common plates and complex-structured plates, which is a great step forward comparing to traditional algorithms. Blocklist and allowlist are available for plate categorization and separate alarm triggering.SpecificationCameraImage Sensor 1/1.8" Progressive Scan CMOSMax. Resolution 2560 × 1440Min. Illumination Color: 0.0005 Lux @ (F1.2, AGC ON), B/W: 0 Lux with light Shutter Time 1 s to 1/100,000 sLensLens Type Auto, Semi-auto, ManualFocal Length & FOV 2.8 to 12 mm, horizontal FOV 107.4° to 39.8°, vertical FOV 56° to 22.4°, diagonal FOV 130.1° to 45.7°8 to 32 mm, horizontal FOV 40.3° to 14.5°, vertical FOV 22.1° to 8.2°, diagonal FOV 46.9° to 16.5°Iris Type Auto-irisLens Mount All In One LensAperture 2.8 to 12 mm: F1.2, 8 to 32 mm: F1.6 DORIDORI 2.8 to 12 mm:Wide: D: 60.0 m, O: 23.8 m, R: 12.0 m, I: 6.0 m Tele: D: 149.0 m, O: 59.1 m, R: 29.8 m, I: 14.9 m 8 to 32 mm:Wide: D: 150.3 m, O: 59.7 m, R: 30.1 m, I: 15.0 m Tele: D: 400 m, O: 158.7 m, R: 80 m, I: 40 mIlluminatorSupplement Light Type IRSupplement Light Range 2.8 to 12 mm: Up to 30 m 8 to 32 mm: Up to 50 mSmart Supplement Light Yes VideoMain Stream Performance mode:50 Hz: 25 fps (2560 × 1440, 1920 × 1080, 1280 × 720) 60 Hz: 30 fps (2560 × 1440, 1920 × 1080, 1280 × 720) Proactive mode:50 Hz: 12.5 fps (2560 × 1440, 1920 × 1080, 1280 × 720) 60 Hz: 15 fps (2560 × 1440, 1920 × 1080, 1280 × 720)Sub-Stream Performance mode:50 Hz: 25 fps (640 × 480, 640 × 360) 60 Hz: 30 fps (640 × 480, 640 × 360) Proactive mode:50 Hz: 12.5 fps (640 × 480, 640 × 360) 60 Hz: 15 fps (640 × 480, 640 × 360)Third Stream 50 Hz: 1 fps (1280 × 720, 640 × 480) 60 Hz: 1 fps (1280 × 720, 640 × 480)Video Compression Main stream: H.264/H.265Sub-stream: H.264/H.265/MJPEGThird Stream: H.265/H.264*Performance mode: main stream supports H.264+, H.265+Video Bit Rate 32 Kbps to 8 MbpsH.264 Type Baseline Profile, Main Profile, High ProfileH.265 Type Main ProfileBit Rate Control CBR/VBRScalable Video Coding (SVC) H.264 and H.265 encodingRegion of Interest (ROI) 4 fixed regions for main streamAudioAudio Compression G.711/G.722.1/G.726/MP2L2/PCM/MP3/AAC-LCAudio Bit Rate 64 Kbps (G.711ulaw/G.711alaw)/16 Kbps (G.722.1)/16 Kbps (G.726)/32 to 192 Kbps (MP2L2)/8 to 320 Kbps (MP3)/16 to 64 Kbps (AAC-LC)Audio Sampling Rate 8 kHz/16 kHz/32 kHz/44.1 kHz/48 kHzEnvironment Noise Filtering YesNetworkSimultaneous Live View Up to 6 channelsAPI Open Network Video Interface (Profile S, Profile G, Profile T), ISAPI, SDK, ISUP, OTAPProtocols TCP/IP, ICMP, HTTP, HTTPS, FTP, DHCP, DNS, DDNS, RTP, RTSP, RTCP, NTP, UPnP, SMTP, SNMP, IGMP, 802.1X, QoS, IPv6, UDP, Bonjour, SSL/TLS, WebSocket, WebSocketsUser/Host Up to 32 users3 user levels: administrator, operator, and userSecurity Password protection, complicated password, HTTPS encryption, 802.1X authentication (EAP-TLS, EAP-LEAP, EAP-MD5), watermark, IP address filter, basic and digest authentication for HTTP/HTTPS, WSSE and digest authentication for Open Network Video Interface, RTP/RTSP over HTTPS, control timeout settings, TLS 1.2, TLS 1.3Network Storage NAS (NFS, SMB/CIFS), auto network replenishment (ANR)Together with high-end Hikvision memory card, memory card encryption and health detection are supported.Client Hik-Connect (proactive mode also supports), Hik-central ProfessionalWeb Browser Plug-in required live view: IE 10+Plug-in free live view: Chrome 57.0+, Firefox 52.0+ Local service: Chrome 57.0+, Firefox 52.0+Mobile CommunicationSIM Card Type MicroSIMFrequency LTE-TDD: Band38/40/41LTE-FDD: Band1/3/5/7/8/20/28 WCDMA: Band1/5/8GSM: 850/900/1800 MHzStandard LTE-TDD/LTE-FDD/WCDMA/GSM ImageWide Dynamic Range (WDR) 120 dBDay/Night Switch Day, Night, Auto, Schedule, Video Trigger Image Enhancement BLC, HLC, 3D DNR, DefogImage Parameters Switch YesImage Settings Saturation, brightness, contrast, sharpness, gain, white balance, adjustable by client software or web browserSNR ≥ 52 dBPrivacy Mask 4 programmable polygon privacy masks InterfaceAudio 1 input (line in), max. input amplitude: 3.3 Vpp, input impedance: 4.7 KΩ, interface type: non-equilibrium,1 output (line out), max. output amplitude: 3.3 Vpp, output impedance: 100 Ω, interface type: non-equilibriumAlarm 1 input, 1 output (max. 12 VDC, 1 A)On-Board Storage Built-in memory card slot, support microSD card, up to 256 GB, Built-in 8 GB eMMC storageReset Key YesEthernet Interface 1 RJ45 10 M/100 M self-adaptive Ethernet portWiegand 1 Wiegand (CardID 26bit, SHA-1 26bit, Hik 34bit, NEWG 72 bit) EventBasic Event Motion detection, video tampering alarm, exception (network disconnected, IP address conflict, illegal login, HDD error)Smart Event Line crossing detection, intrusion detection, region entrance detection, region exiting detection, unattended baggage detection, object removal detection, scene change detection, face detectionLinkage Upload to FTP/NAS/memory card, notify surveillance center, send email, trigger recording, trigger capture, trigger alarm output, audible warningDeep Learning FunctionRoad Traffic and Vehicle Detection Blocklist and allowlist: up to 10,000 records Support license plate recognition License plate recognition rate ≥95%GeneralPower 12 VDC ± 20%, 4-pin M8 waterproof connector1. Standby power consumption: 45 mW2. The average power consumption of 24 hours:3.5 W (4G transmission is excluded).3. The max. power consumption: 7 WMaterial Front cover: metal, body: metal, bracket: metalDimension 816.2 mm × 735.9 mm × 760 mm (32.1" × 28.9" × 29.9") (Max. size of the camera after it is completely assembled)Package Dimension 862 mm × 352 mm × 762 mm (33.9" × 13.9" × 30.0")Weight Approx. 31.885 kg (70.3 lb.)With Package Weight Approx. 25.650 kg (56.5 lb.)Storage Conditions -20 °C to 60 °C (-4 °F to 140 °F). Humidity 95% or less (non-condensing) Startup and OperatingConditions-20 °C to 60 °C (-4 °F to 140 °F). Humidity 95% or less (non-condensing)Language 33 languages: English, Russian, Estonian, Bulgarian, Hungarian, Greek, German, Italian, Czech, Slovak, French, Polish, Dutch, Portuguese, Spanish, Romanian, Danish, Swedish, Norwegian, Finnish, Croatian, Slovenian, Serbian, Turkish, Korean, Traditional Chinese, Thai, Vietnamese, Japanese, Latvian, Lithuanian, Portuguese (Brazil), UkrainianGeneral Function Anti-banding, heartbeat, mirror, flash log, password reset via email, pixel counter BatteryBattery Type LithiumCapacity 360 Wh (90 Wh for each battery)Max. Output Voltage 12.6 V Battery Voltage 10.8 VOperating Temperature Charging: -20 °C to 45 °C (-4 °F to 113 °F) Discharging: -20 °C to 60 °C (-4 °F to 140 °F)Cycle Lifetime Performance mode: 5 days, Proactive mode: 8 days, Standby mode: 80 days *in cloudy/rainy days (25 °C)Battery Life More than 500 cyclesBattery Weight Approx. 2.74 kg (6.0 lb.) (0.685 kg (1.5 lb.) for each battery) ApprovalEMC CE-EMC/UKCA (EN 55032:2015+A11:2020+A1:2020, EN 50130-4:2011+A1:2014); RCM (AS/NZS CISPR 32: 2015);IC (ICES-003: Issue 7)RF CE-RED/UKCA (EN 301908-1, EN 301908-2, EN 301908-13, EN 301511, EN 301489-1, EN 301489-52, EN 62133);ICASA: same as CE-RED;IC ID (RSS-132 Issue 3, RSS-133 Issue 6, RSS-139 Issue 3, RSS-130 Issue 2, RSS-102 Issue 5);MIC (Article 49-6-4 and 49-6-5 the relevant articles and MIC Notice No. 1299 of the Ordinance Regulating Radio Equipment)Safety CB (IEC 62368-1:2014+A11)CE-LVD/UKCA (EN 62368-1:2014/A11:2017) LOA (IEC/EN 60950-1)Environment CE-RoHS (2011/65/EU);WEEE (2012/19/EU);Reach (Regulation (EC) No 1907/2006)Protection Camera: IP66 (IEC 60529-2013)Wind resistance 12 level, up to 40 m/s wind speed resistance⏹Typical ApplicationHikvision products are classified into three levels according to their anti-corrosion performance. Refer to the following description to choose for your using environment.This model has NO SPECIFIC PROTECTION.Level DescriptionTop-level protection Hikvision products at this level are equipped for use in areas where professional anti-corrosion protection is a must. Typical application scenarios include coastlines, docks,chemical plants, and more.Moderate protection Hikvision products at this level are equipped for use in areas with moderate anti-corrosion demands. Typical application scenarios include coastal areas about 2kilometers (1.24 miles) away from coastlines, as well as areas affected by acid rain. No specific protection Hikvision products at this level are equipped for use in areas where no specific anti-corrosion protection is needed.⏹Available ModelDS-2XS6A46G1/P-IZS/C36S80 (2.8-12mm)DS-2XS6A46G1/P-IZS/C36S80 (8-32mm)Dimension。

August 20071For more information visit: PG.05E.07.T.E55 SeriesPhotoelectric SensorsContentsOverview . . . . . . . . . . . . . . . . . . . . . . 1 Model Selection, Sensors. . . . . . . . 2 Model Selection, CompatibleConnector Cables. . . . . . . . . . . . . .4Model Selection, Accessories. . . . . .5Wiring Diagrams . . . . . . . . . . . . . . . .6Specifications. . . . . . . . . . . . . . . . . . .7Dimensions. . . . . . . . . . . . . . . . . . . .7Cutler-Hammer ® 55 Series Photo-electric Sensors are identical toEaton’s 50 Series except without the interchangeable outputs or logic functions. They offer durability and high optical performance in a cost-effective, self-contained package. The 55 Series features sensors with AC and DC operation in a single unit. A relay option is available on these models that provides a 3 Amp SPDT relay output for high current switching.Sensors are available that in thru-beam, reflex, polarized reflex, dif-fuse reflective and fiber optic sens-ing modes. Each sensor features a built-in swivel bracket for easy mounting and to allow preciseadjustment of the sensor alignment.Approvals■ UL Listed ■CSA CertifiedHigh Optical Performance and a Built-In Swivel Bracket for Easy and Precise AlignmentProduct Features■ High optical performance includes 100-foot (30.5m) thru-beam range and 6-foot (1.8m) diffuse reflective range■ Both AC and DC operation in a single unit■ Short circuit protected solid-state outputs on AC/DC and DC-only versions (except thru-beam)■ Relay output option provides 3 Amp current switching on AC/DC models ■ Thru-beam models feature an infrared sensing beam along with a visible red LED behind the lens in the source unit to aid in sensor alignment■ Fiber optic sensors operate in thru-beam or diffuse reflective mode depend-ing on the fiber optic cable selected■Glass fiber optic cables plug into NEMA 4 rated sockets on the front of the sensor. Sockets are leakproof even when the fiber optic cables are not plugged in■Fully potted construction for use in areas subject to washdown, high shock and/or vibration■ Choice of pre-wired power cable or built-in mini-connector versions. Stan-dard pre-wired cable length is 6 feet (1.8m)■Built-in, patented, 360° rotation 10° tilt ball-swivel baseFor Customer Service in the U.S. call 1-877-ETN CARE (386-2273) ,in Canada call 1-800-268-3578 .For Application Assistance in the U.S. and Canadacall 1-800-426-9184.Glass Fiber Optic ModelsOutput IndicatorLEDChoose from Cable or Built-InMini-ConnectorHighPerformanceOpticsBuilt-In Ball-Swivel BracketAugust 2007For more information visit: 2Model Selection — SensorsRanges based on 3-inch retroreflector for reflex sensors, 90% reflectance white card for diffuse reflective sensors. ᕄSee Excess Gain graphs on Page 4 .See listing of compatible connector cables on Page 4 .SourceDetectorMinimum object size is 0.4 x 0.7 Inches (10 x 18 mm)Retroreflector (Not Included)SensorFor a complete system,order Sensor and Retroreflector (See PG.05E.17.T.E )3For more information visit: August 2007Model Selection — Sensors (Continued)Ranges based on 3-inch retroreflector for reflex sensors, 90% reflectance white card for diffuse reflective sensors.ᕄ See Excess Gain graphs on Page 4.ᕅ Polarized sensors may not operate with retroreflective tape. Test selected tape before installation.ᕆRanges using standard 0.125-inch diameter fiber optic cable.See listing of compatible connector cables on Page 4.Relay output option for AC/DC Models only (built-to-order, contact factory for delivery lead times). For a 3 Amp, SPDT relay output replace A in Catalog Number with R . (AC/DC Models only — not available in Thru-Beam).SensorFor a complete system,order Sensor and Retroreflector (See PG.05E.17.T.E )Retroreflector (Not Included)Glass Fiber Optic CablesNot Included (See PG.05E.15.T.E )For more information visit: 4August 2007Excess GainModel Selection — Compatible Connector Cables ᕃFor a full selection of connector cables, see PG.05.05.T.E .1.1255A detectors using 1155A sources2.1256A detectors using 1155A sources(90% reflective white card)1.1357A 2.1356A 3.1355A(3-inch diameter retroreflector)1.1455A 2.1456Afiber optic cable shown)1.Thru-Beam mode2.Diffuse reflective mode (90% reflective white card)Current Rating @ 600V 3-pin: 13AMini StyleStraight Female5For more information visit: August 2007Model Selection — AccessoriesAdapter Plate1.00 (25.4)Typ.BCA 0.30(7.6)6 August 2007Wiring Diagrams (Pin numbers are for reference only, rely on pin location when wiring)For more information visit: August 20077For more information visit: SpecificationsApproximate Dimensions in Inches (mm)Thru-Beam All Other Models 115V AC Models230V AC Models10 – 30V DC ModelsAC/DC Models10 – 30V DC ModelsInput Voltage90 – 132V AC, 60 Hz 100 – 132V AC, 50 Hz 180 – 264V AC, 60 Hz 200 – 264V AC, 50 Hz10 – 30V DC, 35 mA 20 – 264V AC, 50/60 Hz or 15 – 30V DC 10 – 30V DC, 35 mA Power Dissipation 2W 2W1W2W1WOperating Temperature -22° to +158°F (-30° to +70°C)-40° to +158°F (-40° to +70°C)Output:VMOS, 50 mA maximum resistive or relay-load; Off-Stage leakage is 0.1 mA maximum Sink/source/TTL,open collectortransistor, 50 mAmaximum load currentStandard Versions:VMOS, 300 mA max./NPN, 300 mA max.Relay Output Versions:3A SPDT relay NPN: 250 mA max., 1.8V drop max.PNP: 100 mA max., 2.6V drop max. (not TTL compatible)Optional Relay Models: SPDT 3A contact Response Times Dark-to-Light: 5 mS Light-to-Dark: 11 mS10 mS1 mSShort Circuit Protection—Sensor will turn off immediately when a short or overload is detected (indicator LED will flash). Turn power OFF and back ON to reset. IMPORTANT: Duringinstallation, correct power connections must be made first to ensure fail-safe short circuit protection of the outputs.Sensor will turn off immediately when a short or overload is detected (indicator LED will flash). Sensor will reset when short is removed.Sunlight Immunity 100 foot Thru-Beam models: 6,000 foot-candlesAll other models: 10,000 foot-candlesHumidity 95% relative humidity, non-condensingCase Material Noryl ® (avoid exposing to chlorinated, halogenated, or aromatic hydrocarbons)Lens Material NylonVibration 15g or 0.06 inch displacement, whichever is less, over 10 Hz to 2 kHz (relay models: 10g over 10 – 55 Hz)Shock40g for 10 mS and 500g for 2 mS, 1/2 sine wave pulse (20g for relay models)Enclosure RatingsNEMA 1, 3, 4, 6, 12 and 13ᕃᕃNOTE: Our products conform to NEMA tests as indicated, however, some severe washdown applications can exceed these NEMA test specifications. If you have questions about a specific application, contact Eaton’s Cutler-Hammer Sensor Applications Department at 1-800-426-9184.Sensors。

Helios 5 FX DualBeamEnabling breakthrough failure analysis for advanced technology nodesThe Helios 5 Dual Beam platform continues to serve the imaging, analysis, and S/TEM sample preparation applications in the most advanced semiconductor failure analysis, process development and process control laboratories.The Thermo Scientific ™ Helios 5 FX ™ DualBeam continues the Helios legacy to the fifth generation combining the innovative Elstar ™ with UC+ technology electron column for high-resolution and high materials contrast imaging, in-lens S/TEM 4 for 3Å in-situ low kV S/TEM imaging and the superior low kV performing Phoenix ™ ion column for fast, precise and sub-nm damagesample preparation. In addition to the industry leading SEM and FIB columns, the Helios 5 FX incorporates a suite of state-of-the-art technologies which enable simple and consistent sample preparation (for high resolution S/TEM imaging and/or Atom Probe microscopy) on even the most challenging samples.High quality imaging at all landing energiesThe ultra-high brightness electron source on the Helios 5 FX System is equipped with 2nd generation UC technology (UC+) to reduce the beam energy spread below 0.2 eV for beam currents up to 100 pA. This enables sub-nanometer resolution and high surface sensitivity at low landing energies. The highly efficient Mirror Detector and In-Column Detector in the Helios 5 FX System come with the ability to simultaneously acquire and mix TLD-SE, MD-BSE and ICD-BSE signals to produce the best overall ultra-high resolution images. Low-loss MD-BSE provides excellent materials contrast with an improvement of up to 1.5x in Contrast-to-Noise ratio, while No-loss ICD-BSE provides materials contrast with maximum surface sensitivity.Shorten time to useable dataThe Helios 5 FX System is the world’s first DualBeam toincorporate a TEM-like CompuStage for TEM lamella sample preparation and combine it with an all new In-lens STEM 4 detector to drastically reduce the time to high quality useable data. The integrated CompuStage is independent of the bulk stage and comes with separate X, Y, Z, eucentric 180° alpha tilt and 200° beta tilt axes enabling SEM endpointing on both sides of S/TEM lamella. The accompanying S/TEM rod is compatible with standard 3 mm TEM grids and enables fast grid exchange without breaking vacuum. In addition, the system is equippedDATASHEETHigh-performance Elstar electron column with UC+monochromator technology for sub-nanometer SEM and S/TEM image resolutionExceptional low kV Phoenix ion beam performance enables sub-nm TEM sample preparation damageSharp, refined, and charge-free contrast obtained from up to 5 integrated in-column and below-the-lens detectors MultiChem Gas Delivery System provides the most advanced capabilities for electron and ion beam induced deposition and etching on DualBeamsEasyLift EX Nanomanipulator enables precise, site-specific preparation of ultra-thin TEM lamellae all while promoting high user confidence and yieldSTEM 4 detector provides outstanding resolution and contrast on thin TEM samplesBacked by the Thermo Fisher Scientfic world class knowledge and expertise in advanced failure analysis forDualBeam applicationsFigure 1. TEM sample preparation using the Thermo Scientific iFAST automation software package and extracted using the EasyLift Nanomanipulator.Figure 2. HRSTEM Bright Field image of a 14 nm SRAM Inverter thinned to 15 nm showing both nFET and pFET structures connected with a metal gate.For current certifications, visit /certifications. © 2020 FEI Company. All rights reserved.All trademarks are the property of Thermo Fisher Scientific and its subsidiaries unless otherwise specified. DS0283-EN-07-2020Find out more at /EM-Saleswith a retractable, annular STEM 4 detector which can be used either in standard mode for real-time STEM endpointing (6Å resolution) or in the new In-lens mode for ultimate imaging performance (3Å resolution). Both modes support improved materials contrast through the use of Bright Field, Dark Field annular and HAADF segments collecting transmitted electrons simultaneously. A new STEM detector enables diffraction imaging and zone axis alignment (automated or manual), enabling highest resolution and contrast on STEM samples. Extreme high resolution, high contrast imaging of ultra-thin lamella is now possible using 30 kV electrons. Having the ability to complete failure analysis work in the DualBeam without exposing the finished sample to ambient air shortens the time to data and reduces the need for standalone S/TEM systems.High quality ultra-thin TEM sample preparationPreparing high quality, ultra-thin TEM samples requires polishing the sample with very low kV ions to minimize damage to the sample. The Thermo Scientific most advanced Phoenix Focused Ion Beam (FIB) column not only delivers high resolution imaging and milling at 30 kV but now expands unmatched FIB performance down to accelerating voltages as low as 500 V enabling the creation of 7 nm TEM lamella with sub-nm damage layers.Enabling flexibilitySmart Alignments actively maintain the system for optimum performance, ready to deliver the highest performance for all users. Patterning improvements ensure the highest quality depositions at any condition, and an extensive automation suite make the Helios 5 the most advanced DualBeam ever assembled—all backed by the Thermo Fisher expert application and service support. Specifications • Electron source–Schottky thermal field emitter, over 1 year lifetime • Ion source–Gallium liquid metal, 1000 hours • Landing Voltage –20 V – 30 kV SEM –500 V – 30 kV FIB • STEM resolution –6Å Standard mode –3Å In-len mode • SEM resolution–Optimal WD0.6 nm @ 2–15 kV 0.7 nm @ 1 kV1.0 nm @ 500 V with beam deceleration –Coincident WD 0.8 nm @ 15 kV 1.2 nm @ 1 kV• Ion beam resolution at coincident point –4.0 nm @ 30 kV using preferred statistical method –2.5 nm @ 30 kV using selective edge method–500 nm @ 500 V using preferred statistical method • EDS resolution–< 30 nm on thinned samples • Gas Delivery–Integrated MultiChem Gas Delivery System –Up to 6 chemistries can be installed –Up to 2 external gasses can be installed • In situ TEM sample liftout –EasyLift EX Nanomanipulator • Stage–5 axis CompuStage with S/TEM holder, equipped with automated insert/retract mechanism and air lock for fast TEM grid exchange without breaking system vacuum –5 axis all piezo motorized bulk stage with automated Loadlock • Sample types–Wafer pieces, packaged parts, grids • Maximum sample size–70 mm diameter with full travel• Application software–iFAST Developers Kit Professional automation software • User interface–Windows ® 10 GUI with integrated SEM, FIB, GIS, simultaneous patterning and imaging mode –Local language support: Check with your local Thermo Fisher sales representatives for available language packs –Two 24-inch widescreen LCD monitors Key options• MultiChem gas chemistries –Range of deposition and etch chemistries • Software–Auto Slice & View ™ software, Magma CAD Navigation • Hardware –EDS and WDS。

Data SheetCisco Firepower 9300 Security ApplianceThe Cisco Firepower™ 9300 is a scalable, carrier-grade platform designed for service providers and others requiring low latency and exceptional throughput, such as high-performance computing centers and high-frequency transactional environments. With tightly integrated, threat-centric security services from Cisco and its partners, Firepower 9300 lowers integration costs and supports the realization of highly secure, open, and programmable networks.Product OverviewCisco Firepower 9300, the appliance component of Cisco’s scalable and agile security services portfolio, offers a highly secure platform to deliver integrated security services. Cisco’s vision is that consistent security policies should be applied to workloads and data flows across physical, virtual, and cloud environments. This approach tightly integrates leading Cisco and complementary partner security services to facilitate intelligent andhigh-performance security. It is specifically designed to protect the Cisco® Evolved Programmable Network, Cisco Evolved Services Platform and Cisco Application Centric Infrastructure architectures.The Firepower 9300 solution for open and programmable networks eliminates much of the costly integration that organizations have had to do themselves.The Firepower 9300 includes Cisco ASA firewalling and VPN. Application-based distributed denial-of-service (DDoS) mitigation capability with Radware DefensePro and additional best-in-class Cisco and partner security services, including Cisco Firepower Threat Defense: Next-Generation IPS (NGIPS) and Cisco Advanced Malware Protection (AMP), Application Visibility and Control (AVC) and URL Filtering will be made available going forward. Each capability is integrated to ensure cons istent security policy is maintained across the network fabric, with dynamic and automated provisioning of security services.Major Features and BenefitsModularity●Configurable connectivity with modular I/O●Expandable capacity with hot-pluggable security modules●Automated and consistent template-based security policiesCarrier Grade●Low-latency and large flow handling with intelligent flow-offloading capabilities●Best-in-class performance density with high throughput●Optional NEBS-ready security modules●Programmatic orchestration and management of security services with RESTful APIsMultiservice Security●Integrate multiple Cisco and partner security services into a single platform to provide intelligent andscalable security●Stitch services dynamically based on traffic classification to apply only the necessary security services*●Provide visibility and correlation of policy, traffic, and events across multiple services*Firepower includes a hardware chassis that accommodates up to three security modules and offers the following features:●Cisco ASA Software (Stateful Firewall plus VPN)●Firepower Threat Defense comprising Advanced Malware Protection (AMP), Next-Generation IPS (NGIPS),and URL filtering*●Cisco partner ecosystem security services (including Radware DefensePro DDoS attack mitigation)** Available in an upcoming release.Performance SpecificationsTable 1 summarizes the capabilities of the Firepower 9300 appliance along with those of the Firepower 9000 Series security modules.Table 1. Capabilities and Capacities1 Maximum throughput w ith User Datagram P rotocol (UDP) traffic measured under ideal test conditions.2“Multiprotocol” refers to a traffi c profile consisting primarily of TCP-based protocols and applications like HTTP, SMTP, FTP, IMAP v4, BitTorrent, and DNS.3 Available for the firew all feature set.Hardware SpecificationsTable 2 summarizes the specifications for the Firepower 9300 appliance. Table 3 summarizes regulatory standards compliance.Table 2. Firepow er 9300 Hardw are Specifications** Scheduled to be supported in Q3 CY2015Table 3. Regulatory Standards Compliance: Safety and E MCOrdering InformationTable 4. P roduct Component Ordering GuideWarranty InformationFind warranty information on at the Product Warranties page.Cisco ServicesCisco offers a wide range of service programs to accelerate customer success. These innovative services programs are delivered through a unique combination of people, processes, tools, and partners, resulting in high levels of customer satisfaction. Cisco Services help you protect your network investment, optimize network operations, and prepare your network for new applications to extend network intelligence and the power of your business. For more information about Cisco services for security, visit /go/services/security.Cisco CapitalFinancing to Help You Achieve Your ObjectivesCisco Capital® can help you acquire the technology you need to achieve your objectives and stay competitive. We can help you reduce CapEx. Accelerate your growth. Optimize your investment dollars and ROI. Cisco Capital financing gives you flexibility in acquiring hardware, software, services, and complementary third-party equipment. And there’s just one predictable payment. Cisco Capital is available in more than 100 countries. Learn more.For More InformationFor more information about the Cisco Firepower 9000 Series Security Platform visit●/c/en/us/solutions/enterprise-networks/service-provider-security-solutions/。

3GPP TS 36.331 V13.2.0 (2016-06)Technical Specification3rd Generation Partnership Project;Technical Specification Group Radio Access Network;Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Resource Control (RRC);Protocol specification(Release 13)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2016, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationBluetooth® is a Trade Mark of the Bluetooth SIG registered for the benefit of its membersContentsForeword (18)1Scope (19)2References (19)3Definitions, symbols and abbreviations (22)3.1Definitions (22)3.2Abbreviations (24)4General (27)4.1Introduction (27)4.2Architecture (28)4.2.1UE states and state transitions including inter RAT (28)4.2.2Signalling radio bearers (29)4.3Services (30)4.3.1Services provided to upper layers (30)4.3.2Services expected from lower layers (30)4.4Functions (30)5Procedures (32)5.1General (32)5.1.1Introduction (32)5.1.2General requirements (32)5.2System information (33)5.2.1Introduction (33)5.2.1.1General (33)5.2.1.2Scheduling (34)5.2.1.2a Scheduling for NB-IoT (34)5.2.1.3System information validity and notification of changes (35)5.2.1.4Indication of ETWS notification (36)5.2.1.5Indication of CMAS notification (37)5.2.1.6Notification of EAB parameters change (37)5.2.1.7Access Barring parameters change in NB-IoT (37)5.2.2System information acquisition (38)5.2.2.1General (38)5.2.2.2Initiation (38)5.2.2.3System information required by the UE (38)5.2.2.4System information acquisition by the UE (39)5.2.2.5Essential system information missing (42)5.2.2.6Actions upon reception of the MasterInformationBlock message (42)5.2.2.7Actions upon reception of the SystemInformationBlockType1 message (42)5.2.2.8Actions upon reception of SystemInformation messages (44)5.2.2.9Actions upon reception of SystemInformationBlockType2 (44)5.2.2.10Actions upon reception of SystemInformationBlockType3 (45)5.2.2.11Actions upon reception of SystemInformationBlockType4 (45)5.2.2.12Actions upon reception of SystemInformationBlockType5 (45)5.2.2.13Actions upon reception of SystemInformationBlockType6 (45)5.2.2.14Actions upon reception of SystemInformationBlockType7 (45)5.2.2.15Actions upon reception of SystemInformationBlockType8 (45)5.2.2.16Actions upon reception of SystemInformationBlockType9 (46)5.2.2.17Actions upon reception of SystemInformationBlockType10 (46)5.2.2.18Actions upon reception of SystemInformationBlockType11 (46)5.2.2.19Actions upon reception of SystemInformationBlockType12 (47)5.2.2.20Actions upon reception of SystemInformationBlockType13 (48)5.2.2.21Actions upon reception of SystemInformationBlockType14 (48)5.2.2.22Actions upon reception of SystemInformationBlockType15 (48)5.2.2.23Actions upon reception of SystemInformationBlockType16 (48)5.2.2.24Actions upon reception of SystemInformationBlockType17 (48)5.2.2.25Actions upon reception of SystemInformationBlockType18 (48)5.2.2.26Actions upon reception of SystemInformationBlockType19 (49)5.2.3Acquisition of an SI message (49)5.2.3a Acquisition of an SI message by BL UE or UE in CE or a NB-IoT UE (50)5.3Connection control (50)5.3.1Introduction (50)5.3.1.1RRC connection control (50)5.3.1.2Security (52)5.3.1.2a RN security (53)5.3.1.3Connected mode mobility (53)5.3.1.4Connection control in NB-IoT (54)5.3.2Paging (55)5.3.2.1General (55)5.3.2.2Initiation (55)5.3.2.3Reception of the Paging message by the UE (55)5.3.3RRC connection establishment (56)5.3.3.1General (56)5.3.3.1a Conditions for establishing RRC Connection for sidelink communication/ discovery (58)5.3.3.2Initiation (59)5.3.3.3Actions related to transmission of RRCConnectionRequest message (63)5.3.3.3a Actions related to transmission of RRCConnectionResumeRequest message (64)5.3.3.4Reception of the RRCConnectionSetup by the UE (64)5.3.3.4a Reception of the RRCConnectionResume by the UE (66)5.3.3.5Cell re-selection while T300, T302, T303, T305, T306, or T308 is running (68)5.3.3.6T300 expiry (68)5.3.3.7T302, T303, T305, T306, or T308 expiry or stop (69)5.3.3.8Reception of the RRCConnectionReject by the UE (70)5.3.3.9Abortion of RRC connection establishment (71)5.3.3.10Handling of SSAC related parameters (71)5.3.3.11Access barring check (72)5.3.3.12EAB check (73)5.3.3.13Access barring check for ACDC (73)5.3.3.14Access Barring check for NB-IoT (74)5.3.4Initial security activation (75)5.3.4.1General (75)5.3.4.2Initiation (76)5.3.4.3Reception of the SecurityModeCommand by the UE (76)5.3.5RRC connection reconfiguration (77)5.3.5.1General (77)5.3.5.2Initiation (77)5.3.5.3Reception of an RRCConnectionReconfiguration not including the mobilityControlInfo by theUE (77)5.3.5.4Reception of an RRCConnectionReconfiguration including the mobilityControlInfo by the UE(handover) (79)5.3.5.5Reconfiguration failure (83)5.3.5.6T304 expiry (handover failure) (83)5.3.5.7Void (84)5.3.5.7a T307 expiry (SCG change failure) (84)5.3.5.8Radio Configuration involving full configuration option (84)5.3.6Counter check (86)5.3.6.1General (86)5.3.6.2Initiation (86)5.3.6.3Reception of the CounterCheck message by the UE (86)5.3.7RRC connection re-establishment (87)5.3.7.1General (87)5.3.7.2Initiation (87)5.3.7.3Actions following cell selection while T311 is running (88)5.3.7.4Actions related to transmission of RRCConnectionReestablishmentRequest message (89)5.3.7.5Reception of the RRCConnectionReestablishment by the UE (89)5.3.7.6T311 expiry (91)5.3.7.7T301 expiry or selected cell no longer suitable (91)5.3.7.8Reception of RRCConnectionReestablishmentReject by the UE (91)5.3.8RRC connection release (92)5.3.8.1General (92)5.3.8.2Initiation (92)5.3.8.3Reception of the RRCConnectionRelease by the UE (92)5.3.8.4T320 expiry (93)5.3.9RRC connection release requested by upper layers (93)5.3.9.1General (93)5.3.9.2Initiation (93)5.3.10Radio resource configuration (93)5.3.10.0General (93)5.3.10.1SRB addition/ modification (94)5.3.10.2DRB release (95)5.3.10.3DRB addition/ modification (95)5.3.10.3a1DC specific DRB addition or reconfiguration (96)5.3.10.3a2LWA specific DRB addition or reconfiguration (98)5.3.10.3a3LWIP specific DRB addition or reconfiguration (98)5.3.10.3a SCell release (99)5.3.10.3b SCell addition/ modification (99)5.3.10.3c PSCell addition or modification (99)5.3.10.4MAC main reconfiguration (99)5.3.10.5Semi-persistent scheduling reconfiguration (100)5.3.10.6Physical channel reconfiguration (100)5.3.10.7Radio Link Failure Timers and Constants reconfiguration (101)5.3.10.8Time domain measurement resource restriction for serving cell (101)5.3.10.9Other configuration (102)5.3.10.10SCG reconfiguration (103)5.3.10.11SCG dedicated resource configuration (104)5.3.10.12Reconfiguration SCG or split DRB by drb-ToAddModList (105)5.3.10.13Neighbour cell information reconfiguration (105)5.3.10.14Void (105)5.3.10.15Sidelink dedicated configuration (105)5.3.10.16T370 expiry (106)5.3.11Radio link failure related actions (107)5.3.11.1Detection of physical layer problems in RRC_CONNECTED (107)5.3.11.2Recovery of physical layer problems (107)5.3.11.3Detection of radio link failure (107)5.3.12UE actions upon leaving RRC_CONNECTED (109)5.3.13UE actions upon PUCCH/ SRS release request (110)5.3.14Proximity indication (110)5.3.14.1General (110)5.3.14.2Initiation (111)5.3.14.3Actions related to transmission of ProximityIndication message (111)5.3.15Void (111)5.4Inter-RAT mobility (111)5.4.1Introduction (111)5.4.2Handover to E-UTRA (112)5.4.2.1General (112)5.4.2.2Initiation (112)5.4.2.3Reception of the RRCConnectionReconfiguration by the UE (112)5.4.2.4Reconfiguration failure (114)5.4.2.5T304 expiry (handover to E-UTRA failure) (114)5.4.3Mobility from E-UTRA (114)5.4.3.1General (114)5.4.3.2Initiation (115)5.4.3.3Reception of the MobilityFromEUTRACommand by the UE (115)5.4.3.4Successful completion of the mobility from E-UTRA (116)5.4.3.5Mobility from E-UTRA failure (117)5.4.4Handover from E-UTRA preparation request (CDMA2000) (117)5.4.4.1General (117)5.4.4.2Initiation (118)5.4.4.3Reception of the HandoverFromEUTRAPreparationRequest by the UE (118)5.4.5UL handover preparation transfer (CDMA2000) (118)5.4.5.1General (118)5.4.5.2Initiation (118)5.4.5.3Actions related to transmission of the ULHandoverPreparationTransfer message (119)5.4.5.4Failure to deliver the ULHandoverPreparationTransfer message (119)5.4.6Inter-RAT cell change order to E-UTRAN (119)5.4.6.1General (119)5.4.6.2Initiation (119)5.4.6.3UE fails to complete an inter-RAT cell change order (119)5.5Measurements (120)5.5.1Introduction (120)5.5.2Measurement configuration (121)5.5.2.1General (121)5.5.2.2Measurement identity removal (122)5.5.2.2a Measurement identity autonomous removal (122)5.5.2.3Measurement identity addition/ modification (123)5.5.2.4Measurement object removal (124)5.5.2.5Measurement object addition/ modification (124)5.5.2.6Reporting configuration removal (126)5.5.2.7Reporting configuration addition/ modification (127)5.5.2.8Quantity configuration (127)5.5.2.9Measurement gap configuration (127)5.5.2.10Discovery signals measurement timing configuration (128)5.5.2.11RSSI measurement timing configuration (128)5.5.3Performing measurements (128)5.5.3.1General (128)5.5.3.2Layer 3 filtering (131)5.5.4Measurement report triggering (131)5.5.4.1General (131)5.5.4.2Event A1 (Serving becomes better than threshold) (135)5.5.4.3Event A2 (Serving becomes worse than threshold) (136)5.5.4.4Event A3 (Neighbour becomes offset better than PCell/ PSCell) (136)5.5.4.5Event A4 (Neighbour becomes better than threshold) (137)5.5.4.6Event A5 (PCell/ PSCell becomes worse than threshold1 and neighbour becomes better thanthreshold2) (138)5.5.4.6a Event A6 (Neighbour becomes offset better than SCell) (139)5.5.4.7Event B1 (Inter RAT neighbour becomes better than threshold) (139)5.5.4.8Event B2 (PCell becomes worse than threshold1 and inter RAT neighbour becomes better thanthreshold2) (140)5.5.4.9Event C1 (CSI-RS resource becomes better than threshold) (141)5.5.4.10Event C2 (CSI-RS resource becomes offset better than reference CSI-RS resource) (141)5.5.4.11Event W1 (WLAN becomes better than a threshold) (142)5.5.4.12Event W2 (All WLAN inside WLAN mobility set becomes worse than threshold1 and a WLANoutside WLAN mobility set becomes better than threshold2) (142)5.5.4.13Event W3 (All WLAN inside WLAN mobility set becomes worse than a threshold) (143)5.5.5Measurement reporting (144)5.5.6Measurement related actions (148)5.5.6.1Actions upon handover and re-establishment (148)5.5.6.2Speed dependant scaling of measurement related parameters (149)5.5.7Inter-frequency RSTD measurement indication (149)5.5.7.1General (149)5.5.7.2Initiation (150)5.5.7.3Actions related to transmission of InterFreqRSTDMeasurementIndication message (150)5.6Other (150)5.6.0General (150)5.6.1DL information transfer (151)5.6.1.1General (151)5.6.1.2Initiation (151)5.6.1.3Reception of the DLInformationTransfer by the UE (151)5.6.2UL information transfer (151)5.6.2.1General (151)5.6.2.2Initiation (151)5.6.2.3Actions related to transmission of ULInformationTransfer message (152)5.6.2.4Failure to deliver ULInformationTransfer message (152)5.6.3UE capability transfer (152)5.6.3.1General (152)5.6.3.2Initiation (153)5.6.3.3Reception of the UECapabilityEnquiry by the UE (153)5.6.4CSFB to 1x Parameter transfer (157)5.6.4.1General (157)5.6.4.2Initiation (157)5.6.4.3Actions related to transmission of CSFBParametersRequestCDMA2000 message (157)5.6.4.4Reception of the CSFBParametersResponseCDMA2000 message (157)5.6.5UE Information (158)5.6.5.1General (158)5.6.5.2Initiation (158)5.6.5.3Reception of the UEInformationRequest message (158)5.6.6 Logged Measurement Configuration (159)5.6.6.1General (159)5.6.6.2Initiation (160)5.6.6.3Reception of the LoggedMeasurementConfiguration by the UE (160)5.6.6.4T330 expiry (160)5.6.7 Release of Logged Measurement Configuration (160)5.6.7.1General (160)5.6.7.2Initiation (160)5.6.8 Measurements logging (161)5.6.8.1General (161)5.6.8.2Initiation (161)5.6.9In-device coexistence indication (163)5.6.9.1General (163)5.6.9.2Initiation (164)5.6.9.3Actions related to transmission of InDeviceCoexIndication message (164)5.6.10UE Assistance Information (165)5.6.10.1General (165)5.6.10.2Initiation (166)5.6.10.3Actions related to transmission of UEAssistanceInformation message (166)5.6.11 Mobility history information (166)5.6.11.1General (166)5.6.11.2Initiation (166)5.6.12RAN-assisted WLAN interworking (167)5.6.12.1General (167)5.6.12.2Dedicated WLAN offload configuration (167)5.6.12.3WLAN offload RAN evaluation (167)5.6.12.4T350 expiry or stop (167)5.6.12.5Cell selection/ re-selection while T350 is running (168)5.6.13SCG failure information (168)5.6.13.1General (168)5.6.13.2Initiation (168)5.6.13.3Actions related to transmission of SCGFailureInformation message (168)5.6.14LTE-WLAN Aggregation (169)5.6.14.1Introduction (169)5.6.14.2Reception of LWA configuration (169)5.6.14.3Release of LWA configuration (170)5.6.15WLAN connection management (170)5.6.15.1Introduction (170)5.6.15.2WLAN connection status reporting (170)5.6.15.2.1General (170)5.6.15.2.2Initiation (171)5.6.15.2.3Actions related to transmission of WLANConnectionStatusReport message (171)5.6.15.3T351 Expiry (WLAN connection attempt timeout) (171)5.6.15.4WLAN status monitoring (171)5.6.16RAN controlled LTE-WLAN interworking (172)5.6.16.1General (172)5.6.16.2WLAN traffic steering command (172)5.6.17LTE-WLAN aggregation with IPsec tunnel (173)5.6.17.1General (173)5.7Generic error handling (174)5.7.1General (174)5.7.2ASN.1 violation or encoding error (174)5.7.3Field set to a not comprehended value (174)5.7.4Mandatory field missing (174)5.7.5Not comprehended field (176)5.8MBMS (176)5.8.1Introduction (176)5.8.1.1General (176)5.8.1.2Scheduling (176)5.8.1.3MCCH information validity and notification of changes (176)5.8.2MCCH information acquisition (178)5.8.2.1General (178)5.8.2.2Initiation (178)5.8.2.3MCCH information acquisition by the UE (178)5.8.2.4Actions upon reception of the MBSFNAreaConfiguration message (178)5.8.2.5Actions upon reception of the MBMSCountingRequest message (179)5.8.3MBMS PTM radio bearer configuration (179)5.8.3.1General (179)5.8.3.2Initiation (179)5.8.3.3MRB establishment (179)5.8.3.4MRB release (179)5.8.4MBMS Counting Procedure (179)5.8.4.1General (179)5.8.4.2Initiation (180)5.8.4.3Reception of the MBMSCountingRequest message by the UE (180)5.8.5MBMS interest indication (181)5.8.5.1General (181)5.8.5.2Initiation (181)5.8.5.3Determine MBMS frequencies of interest (182)5.8.5.4Actions related to transmission of MBMSInterestIndication message (183)5.8a SC-PTM (183)5.8a.1Introduction (183)5.8a.1.1General (183)5.8a.1.2SC-MCCH scheduling (183)5.8a.1.3SC-MCCH information validity and notification of changes (183)5.8a.1.4Procedures (184)5.8a.2SC-MCCH information acquisition (184)5.8a.2.1General (184)5.8a.2.2Initiation (184)5.8a.2.3SC-MCCH information acquisition by the UE (184)5.8a.2.4Actions upon reception of the SCPTMConfiguration message (185)5.8a.3SC-PTM radio bearer configuration (185)5.8a.3.1General (185)5.8a.3.2Initiation (185)5.8a.3.3SC-MRB establishment (185)5.8a.3.4SC-MRB release (185)5.9RN procedures (186)5.9.1RN reconfiguration (186)5.9.1.1General (186)5.9.1.2Initiation (186)5.9.1.3Reception of the RNReconfiguration by the RN (186)5.10Sidelink (186)5.10.1Introduction (186)5.10.1a Conditions for sidelink communication operation (187)5.10.2Sidelink UE information (188)5.10.2.1General (188)5.10.2.2Initiation (189)5.10.2.3Actions related to transmission of SidelinkUEInformation message (193)5.10.3Sidelink communication monitoring (195)5.10.6Sidelink discovery announcement (198)5.10.6a Sidelink discovery announcement pool selection (201)5.10.6b Sidelink discovery announcement reference carrier selection (201)5.10.7Sidelink synchronisation information transmission (202)5.10.7.1General (202)5.10.7.2Initiation (203)5.10.7.3Transmission of SLSS (204)5.10.7.4Transmission of MasterInformationBlock-SL message (205)5.10.7.5Void (206)5.10.8Sidelink synchronisation reference (206)5.10.8.1General (206)5.10.8.2Selection and reselection of synchronisation reference UE (SyncRef UE) (206)5.10.9Sidelink common control information (207)5.10.9.1General (207)5.10.9.2Actions related to reception of MasterInformationBlock-SL message (207)5.10.10Sidelink relay UE operation (207)5.10.10.1General (207)5.10.10.2AS-conditions for relay related sidelink communication transmission by sidelink relay UE (207)5.10.10.3AS-conditions for relay PS related sidelink discovery transmission by sidelink relay UE (208)5.10.10.4Sidelink relay UE threshold conditions (208)5.10.11Sidelink remote UE operation (208)5.10.11.1General (208)5.10.11.2AS-conditions for relay related sidelink communication transmission by sidelink remote UE (208)5.10.11.3AS-conditions for relay PS related sidelink discovery transmission by sidelink remote UE (209)5.10.11.4Selection and reselection of sidelink relay UE (209)5.10.11.5Sidelink remote UE threshold conditions (210)6Protocol data units, formats and parameters (tabular & ASN.1) (210)6.1General (210)6.2RRC messages (212)6.2.1General message structure (212)–EUTRA-RRC-Definitions (212)–BCCH-BCH-Message (212)–BCCH-DL-SCH-Message (212)–BCCH-DL-SCH-Message-BR (213)–MCCH-Message (213)–PCCH-Message (213)–DL-CCCH-Message (214)–DL-DCCH-Message (214)–UL-CCCH-Message (214)–UL-DCCH-Message (215)–SC-MCCH-Message (215)6.2.2Message definitions (216)–CounterCheck (216)–CounterCheckResponse (217)–CSFBParametersRequestCDMA2000 (217)–CSFBParametersResponseCDMA2000 (218)–DLInformationTransfer (218)–HandoverFromEUTRAPreparationRequest (CDMA2000) (219)–InDeviceCoexIndication (220)–InterFreqRSTDMeasurementIndication (222)–LoggedMeasurementConfiguration (223)–MasterInformationBlock (225)–MBMSCountingRequest (226)–MBMSCountingResponse (226)–MBMSInterestIndication (227)–MBSFNAreaConfiguration (228)–MeasurementReport (228)–MobilityFromEUTRACommand (229)–Paging (232)–ProximityIndication (233)–RNReconfiguration (234)–RNReconfigurationComplete (234)–RRCConnectionReconfiguration (235)–RRCConnectionReconfigurationComplete (240)–RRCConnectionReestablishment (241)–RRCConnectionReestablishmentComplete (241)–RRCConnectionReestablishmentReject (242)–RRCConnectionReestablishmentRequest (243)–RRCConnectionReject (243)–RRCConnectionRelease (244)–RRCConnectionResume (248)–RRCConnectionResumeComplete (249)–RRCConnectionResumeRequest (250)–RRCConnectionRequest (250)–RRCConnectionSetup (251)–RRCConnectionSetupComplete (252)–SCGFailureInformation (253)–SCPTMConfiguration (254)–SecurityModeCommand (255)–SecurityModeComplete (255)–SecurityModeFailure (256)–SidelinkUEInformation (256)–SystemInformation (258)–SystemInformationBlockType1 (259)–UEAssistanceInformation (264)–UECapabilityEnquiry (265)–UECapabilityInformation (266)–UEInformationRequest (267)–UEInformationResponse (267)–ULHandoverPreparationTransfer (CDMA2000) (273)–ULInformationTransfer (274)–WLANConnectionStatusReport (274)6.3RRC information elements (275)6.3.1System information blocks (275)–SystemInformationBlockType2 (275)–SystemInformationBlockType3 (279)–SystemInformationBlockType4 (282)–SystemInformationBlockType5 (283)–SystemInformationBlockType6 (287)–SystemInformationBlockType7 (289)–SystemInformationBlockType8 (290)–SystemInformationBlockType9 (295)–SystemInformationBlockType10 (295)–SystemInformationBlockType11 (296)–SystemInformationBlockType12 (297)–SystemInformationBlockType13 (297)–SystemInformationBlockType14 (298)–SystemInformationBlockType15 (298)–SystemInformationBlockType16 (299)–SystemInformationBlockType17 (300)–SystemInformationBlockType18 (301)–SystemInformationBlockType19 (301)–SystemInformationBlockType20 (304)6.3.2Radio resource control information elements (304)–AntennaInfo (304)–AntennaInfoUL (306)–CQI-ReportConfig (307)–CQI-ReportPeriodicProcExtId (314)–CrossCarrierSchedulingConfig (314)–CSI-IM-Config (315)–CSI-IM-ConfigId (315)–CSI-RS-Config (317)–CSI-RS-ConfigEMIMO (318)–CSI-RS-ConfigNZP (319)–CSI-RS-ConfigNZPId (320)–CSI-RS-ConfigZP (321)–CSI-RS-ConfigZPId (321)–DMRS-Config (321)–DRB-Identity (322)–EPDCCH-Config (322)–EIMTA-MainConfig (324)–LogicalChannelConfig (325)–LWA-Configuration (326)–LWIP-Configuration (326)–RCLWI-Configuration (327)–MAC-MainConfig (327)–P-C-AndCBSR (332)–PDCCH-ConfigSCell (333)–PDCP-Config (334)–PDSCH-Config (337)–PDSCH-RE-MappingQCL-ConfigId (339)–PHICH-Config (339)–PhysicalConfigDedicated (339)–P-Max (344)–PRACH-Config (344)–PresenceAntennaPort1 (346)–PUCCH-Config (347)–PUSCH-Config (351)–RACH-ConfigCommon (355)–RACH-ConfigDedicated (357)–RadioResourceConfigCommon (358)–RadioResourceConfigDedicated (362)–RLC-Config (367)–RLF-TimersAndConstants (369)–RN-SubframeConfig (370)–SchedulingRequestConfig (371)–SoundingRS-UL-Config (372)–SPS-Config (375)–TDD-Config (376)–TimeAlignmentTimer (377)–TPC-PDCCH-Config (377)–TunnelConfigLWIP (378)–UplinkPowerControl (379)–WLAN-Id-List (382)–WLAN-MobilityConfig (382)6.3.3Security control information elements (382)–NextHopChainingCount (382)–SecurityAlgorithmConfig (383)–ShortMAC-I (383)6.3.4Mobility control information elements (383)–AdditionalSpectrumEmission (383)–ARFCN-ValueCDMA2000 (383)–ARFCN-ValueEUTRA (384)–ARFCN-ValueGERAN (384)–ARFCN-ValueUTRA (384)–BandclassCDMA2000 (384)–BandIndicatorGERAN (385)–CarrierFreqCDMA2000 (385)–CarrierFreqGERAN (385)–CellIndexList (387)–CellReselectionPriority (387)–CellSelectionInfoCE (387)–CellReselectionSubPriority (388)–CSFB-RegistrationParam1XRTT (388)–CellGlobalIdEUTRA (389)–CellGlobalIdUTRA (389)–CellGlobalIdGERAN (390)–CellGlobalIdCDMA2000 (390)–CellSelectionInfoNFreq (391)–CSG-Identity (391)–FreqBandIndicator (391)–MobilityControlInfo (391)–MobilityParametersCDMA2000 (1xRTT) (393)–MobilityStateParameters (394)–MultiBandInfoList (394)–NS-PmaxList (394)–PhysCellId (395)–PhysCellIdRange (395)–PhysCellIdRangeUTRA-FDDList (395)–PhysCellIdCDMA2000 (396)–PhysCellIdGERAN (396)–PhysCellIdUTRA-FDD (396)–PhysCellIdUTRA-TDD (396)–PLMN-Identity (397)–PLMN-IdentityList3 (397)–PreRegistrationInfoHRPD (397)–Q-QualMin (398)–Q-RxLevMin (398)–Q-OffsetRange (398)–Q-OffsetRangeInterRAT (399)–ReselectionThreshold (399)–ReselectionThresholdQ (399)–SCellIndex (399)–ServCellIndex (400)–SpeedStateScaleFactors (400)–SystemInfoListGERAN (400)–SystemTimeInfoCDMA2000 (401)–TrackingAreaCode (401)–T-Reselection (402)–T-ReselectionEUTRA-CE (402)6.3.5Measurement information elements (402)–AllowedMeasBandwidth (402)–CSI-RSRP-Range (402)–Hysteresis (402)–LocationInfo (403)–MBSFN-RSRQ-Range (403)–MeasConfig (404)–MeasDS-Config (405)–MeasGapConfig (406)–MeasId (407)–MeasIdToAddModList (407)–MeasObjectCDMA2000 (408)–MeasObjectEUTRA (408)–MeasObjectGERAN (412)–MeasObjectId (412)–MeasObjectToAddModList (412)–MeasObjectUTRA (413)–ReportConfigEUTRA (422)–ReportConfigId (425)–ReportConfigInterRAT (425)–ReportConfigToAddModList (428)–ReportInterval (429)–RSRP-Range (429)–RSRQ-Range (430)–RSRQ-Type (430)–RS-SINR-Range (430)–RSSI-Range-r13 (431)–TimeToTrigger (431)–UL-DelayConfig (431)–WLAN-CarrierInfo (431)–WLAN-RSSI-Range (432)–WLAN-Status (432)6.3.6Other information elements (433)–AbsoluteTimeInfo (433)–AreaConfiguration (433)–C-RNTI (433)–DedicatedInfoCDMA2000 (434)–DedicatedInfoNAS (434)–FilterCoefficient (434)–LoggingDuration (434)–LoggingInterval (435)–MeasSubframePattern (435)–MMEC (435)–NeighCellConfig (435)–OtherConfig (436)–RAND-CDMA2000 (1xRTT) (437)–RAT-Type (437)–ResumeIdentity (437)–RRC-TransactionIdentifier (438)–S-TMSI (438)–TraceReference (438)–UE-CapabilityRAT-ContainerList (438)–UE-EUTRA-Capability (439)–UE-RadioPagingInfo (469)–UE-TimersAndConstants (469)–VisitedCellInfoList (470)–WLAN-OffloadConfig (470)6.3.7MBMS information elements (472)–MBMS-NotificationConfig (472)–MBMS-ServiceList (473)–MBSFN-AreaId (473)–MBSFN-AreaInfoList (473)–MBSFN-SubframeConfig (474)–PMCH-InfoList (475)6.3.7a SC-PTM information elements (476)–SC-MTCH-InfoList (476)–SCPTM-NeighbourCellList (478)6.3.8Sidelink information elements (478)–SL-CommConfig (478)–SL-CommResourcePool (479)–SL-CP-Len (480)–SL-DiscConfig (481)–SL-DiscResourcePool (483)–SL-DiscTxPowerInfo (485)–SL-GapConfig (485)。

Product informationISOFLEX NBU 15,Prod. 004026,enEdition 16.07.2016 [replaces edition 26.12.2015]Benefits for your application–Tried and tested over many years especially in high-speed applications–Longer component life due to optimized wear protection and good pressure absorption capacity–Excellent resistance to water and media as well as above-average anticorrosive additives protect bearings against premature failure, thus helping to minimize repair costs–Low intrinsic bearing heat due to low lubricant friction enabling longer service life–Uninterrupted machine operation due to good pumpability and metering in customary centralized lubricating systemsDescriptionISOFLEX NBU 15 is a high-speed grease with a good pressure absorption capacity.It consists of a combination of ester oil, synthetic hydrocarbon oil and mineral oil and a barium complex soap. It offers good protection against wear and corrosion and is resistant to water,media and oxidation.ApplicationISOFLEX NBU 15 is primarily used for spindle bearings and high-speed plain bearings, e.g. in machine tools and textile machines. Further applications are in threaded spindles, ball screws operating under high loads, running gear bearings, as a long-term grease in cableway bearings and in precision engineering. It may also be used for the lubrication of tooth flanks in precision gears (e.g. bevel gears in milling machines,electromechanical valve actuators).Application notesThe lubricant is applied by brush, spatula, grease gun or grease cartridge. Owing to the many elastomer and plastic compositions, we recommend checking the grease'scompatibility prior to series application with elastomers or plastics.Material safety data sheetsMaterial safety data sheets can be requested via our website . You may also obtain them through your contact person at Klüber Lubrication.Product information。

Programmable Frequency ScanWaveform GeneratorAD5932Rev. 0Information furnished by Analog Devices is believed to be accurate and reliable. However , noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, N orwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.FEATURESGENERAL DESCRIPTIONProgrammable frequency profileThe AD59321 is a waveform generator offering a programmable frequency scan. Utilizing embedded digital processing that allows enhanced frequency control, the device generates synthesized analog or digital frequency-stepped waveforms. Because frequency profiles are preprogrammed, continuous write cycles are eliminated, thereby freeing up valuableDSP/microcontroller resources. Waveforms start from a known phase and are incremented phase-continuously, which allows phase shifts to be easily determined. Consuming only 6.7 mA, the AD5932 provides a convenient low power solution to waveform generation.No external components necessary Output frequency up to 25 MHz Burst-and-listen capabilityPreprogrammable frequency profile minimizes number of DSP/microcontroller writesSinusoidal/triangular/square wave outputsAutomatic or single pin control of frequency stepping Power-down mode: 20 μA Power supply: 2.3 V to 5.5 VAutomotive temperature range: −40°C to +125°C 16-lead, Pb-free TSSOPThe AD5932 outputs each frequency in the range of interest for a defined length of time and then steps to the next frequency in the scan range. The length of time the device outputs a particular frequency is preprogrammed, and the device increments the frequency automatically; or, alternatively, the frequency is incremented externally via the CTRL pin. At the end of the range, the AD5932 continues to output the last frequency until the device is reset. The AD5932 also offers a digital output via the MSBOUT pin.APPLICATIONSFrequency scanning/radarNetwork/impedance measurements Incremental frequency stimulus Sensory applications Proximity and motion(continued on Page 3)FUNCTIONAL BLOCK DIAGRAMMCLKCTRLSYNCOUTMSBOUTVOUTCOMP05416-001Figure 1.1Protected by U.S. patent number 6747583; other patents pending.AD5932Rev. 0 | Page 2 of 28TABLE OF CONTENTSFeatures..............................................................................................1 Applications.......................................................................................1 General Description.........................................................................1 Functional Block Diagram..............................................................1 Revision History...............................................................................2 Specifications.....................................................................................4 Specifications Test Circuit...........................................................5 Timing Specifications..................................................................6 Master Clock and Timing Diagrams.........................................6 Absolute Maximum Ratings............................................................8 ESD Caution..................................................................................8 Pin Configuration and Function Descriptions.............................9 Typical Performance Characteristics...........................................10 Terminology....................................................................................14 Theory of Operation......................................................................15 Frequency Profile........................................................................15 Serial Interface............................................................................15 Powering up the AD5932..........................................................15 Programming the AD5932........................................................16 Setting Up the Frequency Scan.................................................17 Activating and Controlling the Scan.......................................18 Outputs from the AD5932........................................................19 Applications.....................................................................................20 Grounding and Layout..............................................................20 AD5932 to ADSP-21xx Interface.............................................20 AD5932 to 68HC11/68L11 Interface.......................................21 AD5932 to 80C51/80L51 Interface..........................................21 AD5932 to DSP56002 Interface...............................................21 Evaluation Board............................................................................22 Schematics...................................................................................23 Outline Dimensions.......................................................................25 Ordering Guide.. (25)REVISION HISTORY4/06—Revision 0: Initial VersionAD5932Rev. 0 | Page 3 of 28GENERAL DESCRIPTION(continued from Page 1)To program the AD5932, the user enters the start frequency, the increment step size, the number of increments to be made, and the time interval that the part outputs each frequency. The fre-quency scan profile is initiated, started, and executed by toggling the CTRL pin.The AD5932 is written to via a 3-wire serial interface that operates at clock rates up to 40 MHz. The device operates with a power supply from 2.3 V to 5.5 V . Note that the AVDD and DVDD are independent of each other and can be operated from different voltages. The AD5932 also has a standby function that allows sections of the device that are not in use to be powered down.The AD5932 is available in a 16-lead, Pb-free TSSOP .AD5932Rev. 0 | Page 4 of 28SPECIFICATIONSAVDD = DVDD = 2.3 V to 5.5 V; AGND = DGND = 0 V; T A = T MIN to T MAX , unless otherwise noted. Table 1.Y Grade 1 Parameter Min Typ Max Unit Test Conditions/Comments SIGNAL DAC SPECIFICATIONS Resolution 10 Bits Update Rate 50 MSPS VOUT Peak-to-Peak 0.58 V Internal 200 Ω resistor to GND VOUT Offset 56 mV From 0 V to the trough of the waveform V MIDSCALE 0.32 V Voltage at midscale output VOUT TC 200 ppm/°C DC Accuracy Integral Nonlinearity (INL) ±1.5 LSB Differential Nonlinearity (DNL) ±0.75 LSB DDS SPECIFICATIONS Dynamic Specifications Signal-to-Noise Ratio 53 60 dB f MCLK = 50 MHz, f OUT = f MCLK /4096 Total Harmonic Distortion −60 −53 dBc f MCLK = 50 MHz, f OUT = f MCLK /4096 Spurious-Free Dynamic Range (SFDR) Wide Band (0 to Nyquist) −56 −52 dBc f MCLK = 50 MHz, f OUT = f MCLK /50 Narrow Band (±200 kHz) −74 −70 dBc f MCLK = 50 MHz, f OUT = f MCLK /50 Clock Feedthrough −50 dBc Up to 16 MHz out Wake-Up Time 1.7 ms From standby OUTPUT BUFFER VOUT Peak-to-Peak 0 DVDD V Typically, square wave on MSBOUT and SYNCOUT Output Rise/Fall Time 2 12 ns VOLTAGE REFERENCE Internal Reference 1.15 1.18 1.26 V Reference TC 2 90 ppm/°CLOGIC INPUTS 2Input Current 0.1 ±2 μA Input High Voltage, V INH 1.7 V DVDD = 2.3 V to 2.7 V 2.0 V DVDD = 2.7 V to 3.6 V 2.8 V DVDD = 4.5 V to 5.5 V Input Low Voltage, V INL 0.6 V DVDD = 2.3 V to 2.7 V 0.7 V DVDD = 2.7 V to 3.6 V 0.8 V DVDD = 4.5 V to 5.5 V Input Capacitance, C IN 3 pF LOGIC OUTPUTS 2 Output High Voltage, V OH DVDD − 0.4 V V I SINK = 1 mA Output Low Voltage, V OL 0.4 V ISINK = 1 mA Floating-State O/P Capacitance 5 pF POWER REQUIREMENTS f MCLK = 50 MHz, f OUT = f MCLK /7 AVDD/DVDD 2.3 5.5 V I AA 3.8 4 mA I DD 2.4 2.7 mA I AA + I DD 6.2 6.7 mAAD5932Rev. 0 | Page 5 of 28Y Grade 1Parameter Min Typ Max Unit Test Conditions/Comments Low Power Sleep Mode Device is reset before putting into standby 20 85 μA All outputs powered down, MCLK = 0 V,serial interface active140 240 μA All outputs powered down, MCLK active,serial interface active1 Operating temperature range is as follows: Y version: −40°C to +125°C; typical specifications are at +25°C. 2Guaranteed by design, not production tested.SPECIFICATIONS TEST CIRCUIT05416-002Figure 2. Test Circuit Used to Test the SpecificationsAD5932Rev. 0 | Page 6 of 28TIMING SPECIFICATIONSAll input signals are specified with t R = t F = 5 ns (10% to 90% of V DD ) and are timed from a voltage level of (V IL + V IH )/2 (see Figure 3 to Figure 6). DVDD = 2.3 V to 5.5 V; AGND = DGND = 0 V; all specifications T MIN to T MAX , unless otherwise noted. Table 2.Parameter Limit at T MIN , T MAX Unit Conditions/Comments 1t 1 20 ns min MCLK period t 28 ns min MCLK high duration t 3 8 ns min MCLK low duration t 4 25 ns min SCLK period t 5 10 ns min SCLK high time t 6 10 ns min SCLK low time t 7 5 ns min FSYNC to SCLK falling edge setup time t 8 10 ns min FSYNC to SCLK hold time t 9 5 ns min Data setup time t 10 3 ns min Data hold time t 11 2 × t 1 ns min Minimum CTRL pulse width t 120 ns min CTRL rising edge to MCLK falling edge setup time t 13 10 × t 1 ns typ CTRL rising edge to VOUT delay (initial pulse, includes initialization) 8 × t 1 ns typ CTRL rising edge to VOUT delay (initial pulse, includes initialization) t 14 1 × t 1 ns typ Frequency change to SYNC output, each frequency increment t 15 2 × t 1 ns typ Frequency change to SYNC output, end of scan t 1620 ns max MCLK falling edge to MSBOUT1Guaranteed by design, not production tested.MASTER CLOCK AND TIMING DIAGRAMS05416-003Figure 3. Master ClockSCLKFSYNCSDATA05416-004Figure 4. Serial TimingAD5932Rev. 0 | Page 7 of 2805416-005Figure 5. CTRL TimingFigure 6. SYNCOUT TimingAD5932Rev. 0 | Page 8 of 28ABSOLUTE MAXIMUM RATINGST A = 25°C, unless otherwise noted. Table 3.Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Parameter Rating AVDD to AGND −0.3 V to +6.0 V DVDD to DGND −0.3 V to +6.0 V AGND to DGND −0.3 V to +0.3 V CAP/2.5 V to DGND −0.3 V to +2.75 V Digital I/O Voltage to DGND −0.3 V to DVDD + 0.3 V Analog I/O Voltage to AGND −0.3 V to AVDD + 0.3 V Operating Temperature Range Automotive (Y Version) −40°C to +125°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature +150°C TSSOP (4-Layer Board) θJA Thermal Impedance 112°C/W θJC Thermal Impedance 27.6°C/W Reflow Soldering (Pb-Free) 300°C Peak Temperature 260(+0/−5)°C Time at Peak Temperature 10 sec to 40 secESD CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.AD5932Rev. 0 | Page 9 of 28PIN CONFIGURATION AND FUNCTION DESCRIPTIONS05416-007AVDD DVDD CAP/2.5VSYNCOUT MCLK DGND COMP AGNDSTANDBY FSYNC CTRL MSBOUTINTERRUPTSDATA SCLK VOUTFigure 7. Pin ConfigurationTable 4. Pin Function DescriptionsPin No. Mnemonic Description 1 COMP DAC Bias Pin. This pin is used for decoupling the DAC bias voltage to AVDD. 2 AVDD Positive Power Supply for the Analog Section. AVDD can have a value from 2.3 V to 5.5 V. A 0.1 μF decouplingcapacitor should be connected between AVDD and AGND.3 DVDD Positive Power Supply for the Digital Section. DVDD can have a value from 2.3 V to 5.5 V. A 0.1 μF decouplingcapacitor should be connected between DVDD and DGND.4 CAP/2.5V Digital Circuitry. Operates from a 2.5 V power supply. This 2.5 V is generated from DVDD using an on-boardregulator. The regulator requires a decoupling capacitor of typically 100 nF, which is connected from CAP/2.5V to DGND. If DVDD is equal to or less than 2.7 V, CAP/2.5V can be shorted to DVDD.5 DGND Ground for All Digital Circuitry.6 MCLK Digital Clock Input. DDS output frequencies are expressed as a binary fraction of the frequency of MCLK.The output frequency accuracy and phase noise are determined by this clock.7 SYNCOUT Digital Output for Scan Status Information. User-selectable for end of scan (EOS) or frequency increments throughthe control register (SYNCOP bit). This pin must be enabled by setting the SYNCOUTEN bit in the control register to 1.8 MSBOUT Digital Output. The inverted MSB of the DAC data is available at this pin. This output pin must be enabled bysetting the MSBOUTEN bit in the control register to 1.9 INTERRUPT Digital Input. This pin acts as an interrupt during a frequency scan. A low-to-high transition is sampled by theinternal MCLK, which resets internal state machines. This results in the DAC output going to midscale.10 CTRL Digital Input. Triple function pin for initialization, start, and external frequency increments. A low-to-high transition,sampled by the internal MCLK, is used to initialize and start internal state machines, which then execute the pre-programmed frequency scan sequence. When in auto-increment mode, a single pulse executes the entire scan sequence. When in external increment mode, each frequency increment is triggered by low-to-high transitions.11 SDATA Serial Data Input. The 16-bit serial data-word is applied to this input with the register address first, followed bythe MSB to LSBs of the data.12 SCLK Serial Clock Input. Data is clocked into the AD5932 on each falling SCLK edge. 13 FSYNC Active Low Control Input. This is the frame synchronization signal for the serial data. When FSYNC is taken low,the internal logic is informed that a new word is being loaded into the device.14 STANDBY Active High Digital Input. When this pin is high, the internal MCLK is disabled, and the reference DAC and regulatorare powered down. For optimum power saving, it is recommended that the AD5932 be reset before it is put into standby, as this results in a shutdown current of typically 20 μA.15 AGND Ground for All Analog Circuitry. 16 VOUT Voltage Output. The analog outputs from the AD5932 are available here. An external resistive load is not required,because the device has a 200 Ω resistor on board. A 20 pF capacitor to AGND is recommended to act as a low-pass filter and to reduce clock feedthrough.AD5932Rev. 0 | Page 10 of 28TYPICAL PERFORMANCE CHARACTERISTICSMCLK FREQUENCY (MHz)9876435210–40–45–50–55–60–65–70–75–80–85–9005416-011S F D R (d B c )05416-008I D D (m A )MCLK FREQUENCY (MHz)Figure 8. Current Consumption (I DD) vs. MCLK FrequencyFigure 11. Wide-Band SFDR vs. MCLK FrequencyMCLK FREQUENCY (MHz)–60–65–70–75–80–85–9005416-012S F D R (d B c )F OUT (Hz)7643521025MHz 20MHz15MHz 10MHz 5MHz 2MHz 1MHz 500kHz 100kHz 10kHz 1kHz 500kHz 05416-009I D D (m A)Figure 12. Narrow-Band SFDR vs. MCLK FrequencyFigure 9. I DD vs. F OUT for Various Digital Output ConditionsF OUT (MHz)–30–40–50–60–70–80–9005416-013S F D R (d B c )CONTROL OPTION (See Legend)3.53.02.01.52.51.00.50342105416-010I D D (m A )Figure 13. Wideband SFDR vs. F OUT for Various MCLK FrequenciesFigure 10. I DD vs. Output Waveform Type and ControlAD5932MCLK FREQUENCY (MHz)7065605550454050M40M 30M 20M 10M 005416-014S N R (d B )V p-p (mV)05416-017N U M B E R O F D E V I C ES102030405060708090565566567568569570571572573574575576577578579580581582583584585586587588589590591592593594595596597Figure 14. SNR vs. MCLK FrequencyFigure 17. Histogram of VOUT Peak-to-PeakV OFFSET (mV)807060504030102005416-018N U M B E R O F D E V I C ES766666666665555555555TEMPERATURE (°C)1.251.231.211.191.171.15120100806040200–40–2005416-015V R E F (V )Figure 15. V REF vs. TemperatureFigure 18. Histogram of VOUT OffsetMODULATING FREQUENCY (Hz)–10–20–30–40–50–70–60–80101M100k10k1k10005416-019A T T E N U A T I O N (dB )TEMPERATURE (°C)2.01.81.91.71.61.51.31.41.205416-016W A K E -U P T I M E (m s )Figure 16. Wake-up Time vs. TemperatureFigure 19. PSSRAD5932FREQUENCY (Hz)0–10–20–30–40–50–60–70–80–90–100–110–120–130–140–150–160–170100k 10k 1k 10005416-020PH A S E N O I S E0–10–20–30–50–60–40–70–80–90–1000505416-023(d B )VWB 300RWB 1KST 50 SECMFREQUENCY (Hz)Figure 23. f MCLK = 10 MHz, f OUT = 3.33 MHz = f MCLK /3,Frequency Word = 5555555Figure 20. Output Phase Noise0–10–20–30–50–60–40–70–80–90–100160k05333-017(d B )VWB 30RWB 100ST 200 SECFREQUENCY (Hz)0–10–20–30–50–60–40–70–80–90–100100k05416-021(d B )VWB 30RWB 100ST 100 SECFREQUENCY (Hz)Figure 24. f MCLK = 50 MHz, f OUT = 12 kHz,Frequency Word = 000FBA9Figure 21. f MCLK = 10 MHz, f OUT = 2.4 kHz,Frequency Word = 000FBA90–10–20–30–50–60–40–70–80–90–10005M0–10–20–30–50–60–40–70–80–90–1001.6M05416-025(d B )VWB 300RWB 100ST 200 SEC05416-022(d B )VWB 300RWB 1KST 50 SECFREQUENCY (Hz)FREQUENCY (Hz)Figure 25. f MCLK = 50 MHz, f OUT = 120 kHz,Frequency Word = 009D496Figure 22. f MCLK = 10 MHz, f OUT = 1.43 MHz = f MCLK /7,Frequency Word = 2492492AD59320–10–20–30–50–60–40–70–80–90–100025M0–10–20–30–50–60–40–70–80–90–100025M05416-028(d B )VWB 300RWB 1KST 200 SEC05416-026(d B )VWB 300RWB 1KST 200 SECFREQUENCY (Hz)FREQUENCY (Hz)Figure 26. f MCLK = 50 MHz, f OUT = 1.2 MHz,Frequency Word = 0624DD3Figure 28. f MCLK = 50 MHz, f OUT = 7.143 MHz = f MCLK /7,Frequency Word = 24924920–10–20–30–50–60–40–70–80–90–100025M05416-027(d B )VWB 300RWB 1KST 200 SEC0–10–20–30–50–60–40–70–80–90–100025M05416-029(d B )VWB 300RWB 1KST 200 SECFREQUENCY (Hz)FREQUENCY (Hz)Figure 29. f MCLK = 50 MHz, f OUT = 16.667 MHz = f MCLK /3,Frequency Word = 5555555Figure 27. f MCLK = 50 MHz, f OUT = 4.8 MHz,Frequency Word = 189374CAD5932 TERMINOLOGYIntegral Nonlinearity (INL)Integral nonlinearity is the maximum deviation of any code from a straight line passing through the endpoints of the transfer function. The endpoints of the transfer function are zero scale and full scale. The error is expressed in LSBs. Total Harmonic Distortion (THD)Total harmonic distortion is the ratio of the rms sum of harmonics to the rms value of the fundamental. For the AD5932, THD is defined as:165432VVVVVVTHD22222log20)dB(++++=Differential Nonlinearity (DNL)Differential nonlinearity is the difference between the measuredand ideal 1 LSB change between two adjacent codes in the DAC.A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. where:V1 is the rms amplitude of the fundamental.V2, V3, V4, V5, and V6 are the rms amplitudes of the second through the sixth harmonic.Spurious-Free Dynamic Range (SFDR)Along with the frequency of interest, harmonics of the fundamental frequency and images of these frequencies are present at the output of a DDS device. The SFDR refers to the largest spur or harmonic that is present in the band of interest. The wideband SFDR gives the magnitude of the largest harmonic or spur relative to the magnitude of the fundamental frequency in the 0 to Nyquist bandwidth. The narrow-band SFDR gives the attenuation of the largest spur or harmonic in a bandwidth of ±200 kHz about the fundamental frequency. Signal-to-Noise Ratio (SNR)The signal-to-noise ratio is the ratio of the rms value of the measured output signal to the rms sum of all other spectral components below the Nyquist frequency. The value for SNR is expressed in dB.Clock FeedthroughThere is feedthrough from the MCLK input to the analog output. Clock feedthrough refers to the magnitude of the MCLK signal relative to the fundamental frequency in theAD5932 output spectrum.AD5932THEORY OF OPERATION05416-031The AD5932 is a general-purpose, synthesized waveform generator capable of providing digitally programmablewaveform sequences in both the frequency and time domain. The device contains embedded digital processing to provide a scan of a user-programmable frequency profile allowing enhanced frequency control. Because the device is preprogrammable, it eliminates continuous write cycles from a DSP/microcontroller in generating a particular waveform.FREQUENCY PROFILEFigure 31. Frequency ScanThe frequency profile is defined by the start frequency (F START ), the frequency increment (Δf) and the number of increments per scan (N INCR ). The increment interval between frequency increments, t INT , is either user-programmable with the interval automatically determined by the device (auto-increment mode), or externally controlled via a hardware pin (external increment mode). For automatic update, the interval profile can be for either a fixed number of clock periods or a fixed number of output waveform cycles.SERIAL INTERFACEThe AD5932 has a standard 3-wire serial interface that is compatible with SPI®, QSPI™, MICROWIRE™, and DSP interface standards.Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCLK. The timing diagram for this operation is shown in Figure 4.The FSYNC input is a level-triggered input that acts as a frame synchronization and chip enable. Data can be transferred into the device only when FSYNC is low. To start the serial data transfer, FSYNC should be taken low, observing the minimum FSYNC to SCLK falling edge setup time, t 7. After FSYNC goes low, serial data is shifted into the device's input shift register on the falling edges of SCLK for 16 clock pulses. FSYNC may be taken high after the 16th falling edge of SCLK, observing the minimum SCLK falling edge to FSYNC rising edge time, t 8. Alternatively, FSYNC can be kept low for a multiple of 16 SCLK pulses and then brought high at the end of the data transfer. In this way, a continuous stream of 16-bit words can be loaded while FSYNC is held low. FSYNC should only go high after the 16th SCLK falling edge of the last word is loaded.In the auto-increment mode, a single pulse at the CTRL pin startsand executes the frequency scan. In the external-increment mode, the CTRL pin also starts the scan, but the frequency increment interval is determined by the time interval between sequential 0/1 transitions on the CTRL pin.An example of a 2-step frequency scan is shown in Figure 30. Note the frequency swept output signal is continuously available and is, therefore, phase continuous at all frequency increments.05416-03021NUMBER OF STEP CHANGESThe SCLK can be continuous, or, alternatively, the SCLK can idle high or low between write operations.Figure 30. Operation of the AD5932POWERING UP THE AD5932When the AD5932 completes the frequency scan from frequency start to frequency end, that is, from F STARTincrementally to (F START + N INCR × Δf), it continues to output the last frequency in the scan (see When the AD5932 is powered up, the part is in an undefined state and, therefore, must be reset before use. The seven registers (control and frequency) contain invalid data and need to be set to a known value by the user. The control register should be the first register to be programmed, as this sets up the part. Note that a write to the control register automatically resets the internal state machines and provides an analog output of midscale, because it performs the same function as the INTERRUPT pin. Typically, this is followed by a serial loading of all the required scan parameters. The DAC output remains at midscale until a frequency scan is started using the CTRL pin. Figure 31). Note that the frequency scan time is given by (N INCR + 1) × t INT .AD5932PROGRAMMING THE AD5932The AD5932 is designed to provide automatic frequency scanswhen the CTRL pin is triggered. The scan is controlled by a set of registers, the addresses of which are given in Table 5. The function of each register is described in more detail in the Setting Up the Frequency Scan section.The Control RegisterThe AD5932 contains a 12-bit control register that sets up the operating modes, as shown in the following bit map.D15 D14 D13 D12 D11 to D0 0 0 0 0 Control bitsThis register controls the different functions and the variousoutput options from the AD5932. Table 6 describes the individual bits of the control register.To address the control register, D15 to D12 of the 16-bit serial word must be set to 0.Table 5. Register AddressesRegister AddressD15 D14 D13 D12 Mnemonic Name0 0 0 0 C REG Control bits 0 0 0 1 N INCR Number of increments 0 0 1 0 Δf Lower 12 bits ofdelta frequency0 0 1 1 Δf Higher 12 bits ofdelta frequency0 1 t INT I ncrement interval 1 0 Reserved 1 1 0 0 F START Lower 12 bits ofstart frequency1 1 0 1 F START Higher 12 bits ofstart frequency1 1 1 0 Reserved 1 1 1 1 ReservedTable 6. Description of Bits in the Control RegisterBit Name Function D15 to D12 ADDR Register address bits. D11 B24 Two write operations are required to load a complete word into the F START register and the Δf register.When B24 = 1, a complete word is loaded into a frequency register in two consecutive writes. The first write contains the 12 LSBs of the frequency word and the next write contains the 12 MSBs. Refer to Table 5 for the appropriate addresses. The write to the destination register occurs after both words have been loaded,so the register never holds an intermediate value. When B24 = 0, the 24-bit F START /Δf register operates as two 12-bit registers, one containing the 12 MSBs and the other containing the 12 LSBs. This means that the 12 MSBs of the frequency word can be altered independently of the 12 LSBs and vice versa. This is useful if the complete 24-bit update is not required.To alter the 12 MSBs or the 12 LSBs, a single write is made to the appropriate register address. Refer to Table 5 for the appropriate addresses.D10 DAC ENABLE When DAC ENABLE = 1, the DAC is enabled.When DAC ENABLE = 0, the DAC is powered down. This saves power and is beneficial when using only the MSB of the DAC input data (available at the MSBOUT pin).D9 SINE/TRI The function of this bit is to control what is available at the VOUT pin.When SINE/TRI = 1, the SIN ROM is used to convert the phase information into amplitude information, resulting in a sinusoidal signal at the output.When SINE/TRI = 0, the SIN ROM is bypassed, resulting in a triangular (up-down) output from the DAC.D8 MSBOUTEN When MSBOUTEN = 1, the MSBOUT pin is enabled.When MSBOUTEN = 0, the MSBOUT is disabled (three-state).D7 Reserved This bit must be set to 1. D6 Reserved This bit must be set to 1. D5 INT/EXT INCR When INT/EXT INCR = 1, the frequency increments are triggered externally through the CTRL pin.When INT/EXT INCR = 0, the frequency increments are triggered automatically.D4 Reserved This bit must be set to 1. D3 SYNCSEL This bit is active when D2 = 1. It is user-selectable to pulse at end of scan (EOS) or at each frequencyincrement. When SYNCSEL = 1, the SYNCOUT pin outputs a high level at end of scan and returns to 0 at the start of the subsequent scan.When SYNCSEL= 0, the SYNCOUT outputs a pulse of 4 × T CLOCK only at each frequency increment.D2 SYNCOUTEN When SYNCOUTEN = 1, the SYNC output is available at the SYNCOUT pin.When SYNCOUTEN = 0, the SYNCOP pin is disabled (three-state).D1 Reserved This bit must be set to 1. D0 Reserved This bit must be set to 1.。