Silicone Material Solutions for LED Packages and Assemblies
The growth of optoelectronic devices and LEDs in segments such as handheld devices, mobile phones, display backlights, automotive, and electronic signs, has led to an increase in demand for enhanced performance and long-term reliability. Designers of LEDs and optoelectronic devices will ? nd a range of silicone material solutions from Momentive, that are excellent candidates to address a wide array of challenges facing the LED industry.
LED dot matrix potting materials are available in room temperature and heat-accelerated alternatives. The low viscosities of these potting materials make them great materials of choice for potting applications in intricate Dot Matrix applications and LED Assemblies. (p.8)
Dot Matrix and LED Assembly Materials
LED Packaging and Assembly Solutions
from Momentive Performance Materials
1
Momentive's Glob Top encapsulants exhibit good light transmittance, and are formulated to provide consistent dispensing performance and material ? ow to form a dome shape for COB (chip on board) encapsulation. Component designers with chip-mounting and wire-bonding capabilities can bene? t from the process simplicity that these materials offer in LED COB packaging applications. (p.5)
Glob Top Encapsulants
Silicone Lens Materials
For optical lens fabrication Momentive offers a series of products engineered to provide high transparency and mechanical strength. These moldable silicone materials are excellent candidates
for injection molding systems
of LIM processing.
(p.6)
Silicones for
LED Die Attach
alternative to conventional
silicone materials are characterized by minimal yellowing, and c o n t r i b u t e t o l o n g -t e r stability of light
(p.7)
InvisiSil* LED Encapsulants
Momentive's InvisiSil series of silicone encapsulants exhibit unique optical efficiencies and a high-refractive index, while providing long-term resistance a g a i n s t t h e ye l l o w i n g a n d d e l a m i n a t i o n t y p i c a l o f conventional epoxy-based materials. (p.3-4)
Momentive's thermal management silicone materials help dissipate heat generated from power and high-brightness LEDs. Products includes silicone grease, and heat-cure and condensation cure adhesives. (p.9)
Thermal Management Silicones
Silicone Advantages
The chemical structure of silicone provides several advantages over conventional materials used in optoelectronic applications. The backbone structure of polydimethylsiloxane consists of silicon (Si) and oxygen (O). The siloxane bond (Si-O) is inorganic and has a higher bond energy of (444kJ/mol) than either carbon (C) - carbon (C) bond (356kJ/mol), or carbon (C) - oxygen (O) bond (339kJ/mol). This bond energy difference is ascribed as one of the contributing factors to the better thermal stability of silicone over that of epoxy resin.
2
Performance Comparison
Thermal Resistance UV Resistance Hardness
Adhesion Strength Thermal Expansion Moisture Absorption Moisture Permeability
Silicone
Excellent Excellent Good Good Fair Good Fair
Epoxy Fair Poor Excellent Excellent Good Fair Good
The inorganic siloxane bond of silicone materials and its resultant bond energy, contributes to stable performance under harsh operating conditions. This is manifest in performance advantages to epoxy resins under some usage conditions.
R R R R R R O R
-Si
-Si
-Si
-Si
-Si
-Si
-Si
-O R R R R O R
O O
-O
-O
-O
-O
-O
-l l l l l l l l l l l l l l
Si
-R
-R l O
l Inorganic Organic
IVS46322 Part Heat Cure Rubber
Transparent 7.51.4100:100
3.2
1.41
150/11
-64
9.0
80
1.051.5
2.8x10
-4
3
InvisiSil* LED Encapsulants
InvisiSil series, silicone encapsulants deliver high refractive index & light transmittance to effectively transmit light emitted from LEDs. They help contribute to durability and reliability of devices through their long-term resistance to yellowing and delamination of encapsulant from the substrate, and provide low viscosities that make them candidates for a wide variety of LED packages.
Key features:. Selection from a range of refractive index
up to 1.53 (n D 25)
. High light transmittance (>95%, 400-800nm). Good workability . High purity
. Adhesion to PPA, LCP
IVS5332
2 Part Heat Cure Rubber Transparent
5.62.0100:1003.31.53150/11
-300.3501.120.32.5x10-4
XE14-C2860
2 Part Heat Cure Gel Transparent
0.90.6100:1000.81.5180/135------
IVS5022
2 Part
Heat Cure Gel Transparent
2.42.0100:1002.21.51150/11
34---1.06--
Components Cure Type Property Appearance
Viscosity:
(A) Pa .s (B) Pa .s Mixing Ratio (A:B)Viscosity (mixed) @23o C Pa .s
Refractive Index (n D 25) Curing Condition o C/h
Penetration
Hardness (Type A)Tensile Strength
MPa Elongation
%Speci? c Gravity @23o C Adhesion Strength (PPA)
MPa CTE
1/K
High Refractive Index
Packaging: 500g Bottles 1
Step cure (80o C@90min, 150o C@1h) recommended for package dispensing applications Typical property values should not be used as speci? cations
Product Details
V i s c o s i t y (P a .S )
Hardness (Type A)
IVS46222 Part Heat Cure Rubber Transparent 4.21.5100:1002.41.41150/11-557.21001.043.22.8x10-4IVS40122 Part Heat Cure Gel Transparent 0.80.7100:1000.81.4070/0.557---0.98--IVS43122 Part Heat Cure Rubber Transparent 1.20.8100:1001.01.41150/11-290.81100.990.33.3x10-4IVS45422 Part Heat Cure Rubber Transparent 5.73.2100:1003.81.41150/11-486.61101.033.7
2.8x10-4IVS45462 Part Heat Cure Rubber Transparent 6.1
3.3100:100
4.21.41150/11-497.11301.033.22.8x10-4Components Cure Type Property Appearance
Viscosity:
(A) Pa .s
(B) Pa .s Mixing Ratio (A:B)Viscosity (mixed) @23o C Pa .s
Refractive Index (n D 25) Curing Condition o C/h
Penetration
Hardness (Type A)Tensile Strength
MPa Elongation
%Speci? c Gravity @23o C Adhesion Strength (PPA)
MPa CTE
1/K
Packaging: 500g Bottles 1
Step cure (80o C@90min, 150o C@1h) recommended for package dispensing applications
Typical property values should not be used as speci? cations Normal Refractive Index
XE14-C2042
2 Part Heat Cure Rubber Transparent
6.24.4100:1004.91.41150/11-436.01701.023.02.8x10-4
4
InvisiSil Encapsulants Technical Data
InvisiSil LED Encapsulants help contribute to long-term thermal stability of LEDs. This is represented in thermal stability tests conducted using IVS4542 and LED grade epoxy resins. Tests were performed by exposing both
materials, sandwiched between glass plates, to 180o C temperatures. While the transmittance of IVS4542 remained stable under prolonged periods of heat exposure, epoxy resins demonstrated deterioration in transmittance over time accompanied by yellowing of the encapsulant material.
Thermal Stability
Test Conditions: IVS4542 and epoxy resin cured in glass sandwich specimens and exposed to 180o C temperatures for speci?ed time intervals
UV Stability
-30-25-20-15-5
05350
400
450
500
550
600
650
700
750
800
Wavelength (nm)T r a n s m i t t a n c e C h a n g e R a t i o %
24h 46h 117h 208h
IVS4542
-10Test Conditions: IVS4542 and epoxy resin cured in glass sandwich specimens and exposed to UV lamp: Black light, 100mJ/cm 2/min at 365nm detector
-30-25-20-15-10-505350
400450500550600650700750800
Wavelength (nm)
T r a n s m i t t a n c e C h a n g e R a t i o %
24h 46h 117h 208h
Epoxy for LED
707580859095100300
350
400
450
500550600650
700
750
800
IVS5022IVS5332
IVS4012IVS4312IVS4542IVS4632XE14-C2860XE14-C2042IVS4546IVS4622InvisiSil Series Transmittance
Wavelength (nm)
T r a n s m i t t a n c e %
Transparency Performance 1
InvisiSil LED Encapsulants also help contribute to long-term UV stability of LEDs. This is represented in UV stability tests conducted using IVS4542 and LED grade epoxy resins. Tests were performed by exposing both materials, sandwiched between glass plates, to black lamp UV light. Change in transmittance against initial spectra
values were measured. IVS4542 silicone encapsulant demonstrated stable performance, while LED epoxy resins generated results suggesting lower UV stability.
IVS4542 @ 180O
C
020
40
6080100
350400
450
500
550
600
650
700
750
800
Wavelength (nm)T r a n s m i t t a n c e %
Initial 1 Day 4 Days 7 Days 14 Days
Epoxy for LED @ 180O
C
020
40
60
80
100
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
T r a n s m i t t a n c e %
Initial 1 Day 4 Days 7 Days 14 Days
1
Transmittance measured using 1mm liquid ?lm
5
Glob Top Encapsulants
Momentive's Glob Top encapsulants exhibit good light transmittance, and are excellent candidates to provide consistent dispensing performance and material ? ow to form a dome shape for COB (chip on board) encapsulation. Component designers with chip-mounting and wire-bonding capabilities can bene? t from the process simplicity that these materials offer in LED COB packaging applications.
Transparency Performance
1
T ypical property values should not be used as speci? cations
XE14-B3445
2 Part Heat Cure Rubber Translucent
7055100:10063721.41150/11.1070--3.50.202.7x10-41x107242.8
0.001<2, <2, <5
XE14-B5778
2 Part Heat Cure Rubber Translucent
5.55.0100:1001481.4180/21.02160.51900.30.172.3x10-42x105242.70.001<2, <2, <5
Components Cure Type Property Appearance
Viscosity:
(A) Pa .s (B)
Pa .s Mixing Ratio
(A:B)Viscosity (mixed) @23o C Pa .s Pot Life @23o C
h
Refractive Index (n D 25)Curing Condition o C/h
Speci? c Gravity @23o C Hardness (Type A)Tensile Strength
MPa Elongation
%Adhesive Strength (Al) MPa Thermal Conductivity
W/m .K CTE
1/K Volume Resistivity M ?.m
Dielectric Strength
kV/mm
Dielectric Constant (60Hz)Dielectric Loss (60Hz)Ionic Content (Na, K, Cl)
ppm
Product Details
XE13-C0810
1 Part Heat Cure Rubber Translucent
---14-1.41150/11.0224-1700.60.183.0x10-42x107212.60.003<2, <2, <5
60
0204080100400
500600
700800
Wavelength (nm)
T r a n s m i t t a n c e %
Glob Top Series Transmittance
XE14-B3445XE14-B5778
XE13-C0810
1
Transmittance measured using 0.5mm liquid ? lm
Packaging
6
Lens Fabrication Materials
For optical lens fabrication Momentive offers a series of products engineered to provide high transparency and mechanical strength. These
moldable silicone materials are excellent candidates for injection molding systems that maximize the bene? ts of LIM processing.
Transparency Performance
1
IVSM4500
2 Part Heat Cure Resin Transparent
35050100:1003024150/11.4293.9, 94.6
50804.7<52.2x10-4
2.5
IVSM42001
2 Part
Heat Cure Rubber Transparent
400250100:1003003150/11.4291.3, 93.9
16107.2802.8x10-4
2.8
Components Cure Type Property Appearance
Viscosity: (A) Pa .s
(B) Pa .s
Mixing Ratio
(A:B)Viscosity (mixed) @23o C Pa .s
Pot Life @23o C
h Curing Condition o C/h Refractive Index (n D 25)
Transmittance (1.4~2mm: 400nm, 800nm) %Hardness (Shore D)Young's Modulus MPa Tensile Strength MPa
Elongation
%CTE
1/K Shrinkage %
1
Experimental grade Typical property values should not be used as speci? cations
Product Details
40300
500700800
Wavelength (nm)
T r a n s m i t t a n c e %
4006001
Transmittance measured using 1.4~2.0mm liquid ? lm
XE14-C25081
2 Part Heat Cure Resin Transparent
90500100:1010024180/11.5387.8, 91.3
68-----
Packaging
representative for package availability
Momentive's die attach silicones offer a high
heat and UV resistant alternative to conventional epoxy based die attach materials. These silicone materials are characterized by minimal yellowing, and contribute to long-term stability of light output.
7
Die Attach Silicones
SDC5003 Electro-Conductive
1 Part
Heat Cure
Rubber Yellow Metallic
33
150/1
3.1
3.80
66
150
1.0
3.0x10-4*
-
<10, <2, <5
XE13-C2476 Electro-Insulative
1 Part
Heat Cure
Rubber
Translucent
30
150/1
0.2
1.15
58 (Type D)
-
-
-
1.42
-Characteristic
Components
Cure Type
Property
Appearance
Viscosity @23o C Pa.s
Curing Condition o C/h
Thermal Conductivity W/m.K
Speci? c Gravity@23o C
Hardness (Type A)
Elongation %
Adhesive Strength (Al)MPa
Volume Resistivity M?.m
Refractive Index(n D25)
Ionic Content (Na, K, Cl)ppm
*?.cm Typical property values should not be used as speci? cations Product Details
TSE3282-G
Thermally Conductive
1 Part
Heat Cure
Rubber
Gray
20
150/1
2.0
2.70
80
50
2.5
5x106
-
-
Packaging
8
Dot Matrix and Assembly Materials
LED dot matrix potting materials are available in
room temperature and heat-accelerated alternatives. The low viscosities of these potting materials make them excellent materials of choice for intricate Dot Matrix applications and LED Assemblies for a variety of industries ranging from signage, automotive, to lighting. These silicone materials provide enchanced weatherablility performance, especially in locations with high salt air concentrations, and represent a smart alternative to conventional epoxy or urethane materials.
Packaging
XE12-B2543
2 Part Room Temp.Rubber Black 1.8-100:2-223/721.11280.81300.42 (Al)
XE14-C0447
2 Part Heat Cure Rubber Black 1.91.7100:1001.7280/10.9915 (Type E)
--adhesive
Components Cure Type Property Appearance
Viscosity:
(A) Pa .s (B)
Pa .s Mixing Ratio
(A:B)Viscosity (mixed) @23o C Pa .s Pot Life @23o C h
Curing Condition o C/h
Speci? c Gravity @23o C Hardness (Type A)Tensile Strength
MPa Elongation
%Adhesion Strength
MPa
Typical property values should not be used as speci? cations
Product Details
TSE3032
2 Part Heat Cure Rubber Transparent
4.20.7100:104.04100/11.02354.5210-
TSE3033
2 Part Heat Cure Rubber Transparent
1.10.8100:1000.96150/0.51.01301.01300.3 (glass)
RTV615
2 Part Heat Cure Rubber Transparent
4.3-100:104.04100/11.02446.3120-
Dot Matrix Materials
LED Assembly Materials
Typical property values should not be used as speci?cations
XE13-C1862PT
1 Part
Flowable Gray 64150/12.425 (50μm)2.85641.6801.7130-1205.0x106
20each <5<0.6
9
TIG210BX
Gray Paste
2.120 (45μm)2.903452500.0*<0.11x106
3.0<1002.0, 0.0, 0.0
1Bulk sample measurement (hot wire method), 2Laser ?ash analysis on a Si-Si sandwiched material
3JIS K 2220, 4MIL-S-8660B,
5
Ion chromotography analysis on water extracts, *Measurement limit
Typical property values should not be used as speci?cations
TIG830SP
Gray Paste
4.18
(30μm)2.883103000.0*0.31x1044.5<1000.5, 0.0, 0.1
Property / Color
Thermal Conductivity 1 W/m .K Thermal Resistance 2 (BLT) mm 2.K / W Speci?c Gravity @23o C Penetration 3 @23o C
Viscosity @23o C
Pa .s Bleed 3 @150o C/24h
wt%Evaporation @150o C/24h wt%
Volume Resistivity 4
M ?.m Dielectric Strength
kV/0.25mm Volatile Siloxane (D 3-D 10) ppm Ionic Content *5 (Na, K, Cl) ppm
Low Thermal Resistance
Thermal Management Silicones
SilCool* Silicone Grease
TSE3282-G
1 Part Flowable Gray 20150/12.033 (50μm)2.70804.0502.5140-1204.8x106
23each <10<0.6
Type
Property (uncured)Color
Viscosity @23o C
Pa .s Curing Condition
o C/h Thermal Conductivity 1 W/m .K Thermal Resistance 2 (BLT) mm 2.K / W Speci?c Gravity @23o C Hardness (Type A)
Tensile Strength
MPa Elongation
%Adhesion (Lap Shear)4 MPa
CTE
ppm/K Glass Transition Temp o C
Volume Resistivity 3
M ?.m Dielectric Strength
kV/mm Ionic Content 5 (Na, K, Cl) ppm
Moisture Absorption
wt%1
Bulk sample measurement (hot wire method), 2Laser ?ash analysis on a Si-Si sandwiched
material, 3
ASTM E 14561, 4Aluminum lap shear , 5Ion chromatography analysis
Typical property values should not be used as speci?cations SilCool Silicone Adhesive - Heat Cure
TIA0260
1 Part Semi-Flowable Light Gray 180102.63.00936.5402.61007.0x106
2010
XE11-B5320
1 Part Non-Flowable
White -51.32.59803.6401.31202.0x107
17100
Type
Property (uncured)Color
Viscosity @23o C Pa .s Tack Free Time
Min Thermal Conductivity W/m .K
Speci?c Gravity @23o C Hardness (Type A)Tensile Strength
MPa Elongation
%Adhesive Strength (Al) MPa CTE ppm/K Volume Resistivity M ?.m Dielectric Strength
kV/mm Volatile Siloxane (D 3-D 10)
ppm
Condensation Cure Silicone Adhesives
Packaging
1
representative for package availability
Low Oil Bleed
1 Contact a Momentive Performance Materials sales representative for availability in countries and regions not listed
Product Availability by Region1
Other Electronic Solutions from Momentive Performance Materials
12-page brochure provides detailed information on silicone materials used for thermal management applications in electronics and micro-electronics. Includes SilCool* grease &a d h e s i v e s,a n d conventional grades for adhesion, encapsulation and https://www.doczj.com/doc/2712620529.html,prehensive package of adhesion, sealing, coating, and encapsulation / potting solutions for a wide range of silicone applications in electric and electronic devices and component
assemblies.
10
SIL-852-REV3-1008
Copyright 2005-2008 Momentive Performance Materials Inc. All rights reserved *InvisiSil and SilCool are trademarks of Momentive Performance Materials Inc.
DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively “SUPPLIERS”), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS’ STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT , PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST . ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS’ PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS’ STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN.
Each user bears full responsibility for making its own determination as to the suitability of Suppliers’ materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its ?nished parts incorporating Suppliers’ products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter , vary, supersede, or waive any provision of Suppliers’ Standard Conditions of Sale or this Disclaimer , unless any such modi?cation is speci?cally agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or af?liates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.
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