SmartFusion Evaluation Kit
User’s Guide
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Board Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1Installation and Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Software Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Jumpers, Switches, and LED Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Description and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 I/O Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SmartFusion Hard ARM Cortex-M3 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Power Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3Component Descriptions and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 VAREF Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Current Sensing Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PWM Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Push-Button System Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Push-Button Switches and User LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 User I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 OLED Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
20 MHz Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
32.768 KHz (low power) Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
USB-to-UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ethernet Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 RealView Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Integrated Low-Cost Programmer (LCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Temperature Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Mixed Signal Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Pinout Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4Pin List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5Board Stackup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Board Stack-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6Demo Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Jumper Settings for Demo Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Running the Demo Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Multimeter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Webserver Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Real Time Data Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 LED Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7Manufacturing Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 A2F-EVAL-KIT Board Testing Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Running the A2F-EVAL-KIT Board Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 A2F-EVAL-KIT Board Failures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
A List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
B Product Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Customer Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Customer Technical Support Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Website . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Contacting the Customer Technical Support Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 ITAR Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Introduction
The RoHS-compliant SmartFusion ? Evaluation Kit (A2F-EVAL-KIT) enables designers to develop applications that involve one or more of the following:
?
Microcontroller applications ?Embedded ARM ? Cortex?-M3 processor–based systems
Kit Contents
Table 1 lists the contents of the SmartFusion Evaluation Kit.Figure 1 ? A2F-EVAL-KIT
10/100 Ethernet Interface Regulators USB Program &
Debug Interface SmartFusion Device User SW2USB Power &USB-UART Interface
Potentiometer
Reset Switch
J22 – Debug I/Os
JP8 – UART Header
JP9 – I2C Header
JP11 – LED
JP12 – LED
JP13 – LED
JP14 – LED
JP7 – Debug Select
JP10 – JTAG Select
8 User LEDs
OLED Display
RVI – Header SPI-Flash Memory J23 – SPI Header
PU_N Switch
JP 6 – VRPSM Voltage Option
20 MHz Crystal 32.768 KHz Crystal J24 –
VAREFOUT/VAREF Header
User SW1Mixed Signal
Header Table 1 ? A2F-EVAL-KIT Contents
Quantity
Description 1
SmartFusion Evaluation Board with SmartFusion A2F200M3F-FGG484 device 2
USB 2.0 A to mini-B cable 1Quickstart card
Introduction
6Revision 6
Board Description
The SmartFusion Evaluation Kit board is designed to provide a development platform for users to evaluate all the features of the world’s only customizable system-on-chip with a hard ARM Cortex-M3 processor powered microcontroller subsystem (MSS) along with programmable analog.
The board supports a SmartFusion cSoC in an FG484 package to enable the MSS, analog, and features for evaluation.
The board includes the following:
?Ethernet and USB-to-UART interface for communication with the Ethernet and UART peripherals of the SmartFusion MSS
?SPI flash that interfaces with the SPI peripherals of the SmartFusion MSS
?Organic light-emitting diode (OLED) display that interfaces with the I 2C peripheral of the SmartFusion MSS ?I 2C Interface
?Current monitoring and temperature monitoring circuits
?
RVI header for application programming and debug from either Keil ? U-LINK ? or IAR J-Link, integrated low-cost programmer to enable programming and debugging from Microsemi design tools, FlashPoint and Soft Console.
Table 2 describes the SmartFusion Evaluation Kit board components.Table 2 ? SmartFusion Evaluation Kit Board Components Name
Description
A2F200M3F-FGG484Microsemi SmartFusion cSoC with hard ARM Cortex-M3 processor OLED DISPLAY Organic 96×16 pixel blue OLED PMO13701 with option to interface either with I2C0 port of SmartFusion MSS
SPI FLASH 8 MByte SPI flash Atmel AT25DF641-MWH-T connected to SPI port 0 of the SmartFusion MSS
OSC-2020 MHz / 20 PPM clock oscillator OSC-3232.768 KHz low power oscillator
USB/UART USB-to-UART adapter chip CP2102 and connector interfacing with UART port 0 of the SmartFusion MSS
ETHERNET
RJ45 connector (Ethernet jack with magnetics) interfacing with National Semiconductor 10/100 PHY chip DP83848C in RMII mode interfacing with Ethernet port of SmartFusion MSS (on-chip MAC and external PHY)CURRENT Current monitoring using thumbwheel POT (RV1)TEMP Temperature monitoring with temperature diode
RVI HEADER RVI header for application programming and debug from Keil U-LINK or IAR J-Link
FP3_PROG Integrated low-cost programmer
PUSH-BUTTON SWITCHES Two push-button switches connected to GPIOs, which can be used as test and navigation switches
LEDS Eight active low LEDs that can be connected to user I/O for debug to power on the board
USER I/Os
Five general purpose user I/Os that can be used for Direct-C signaling, interfacing and debugging purposes
PUSH-BUTTON RESET Push-button system reset for SmartFusion cSoC system MIXED_CONN100
Mixed signal header
Revision 6
7
1 – Installation and Settings
Software Installation
Download and install the latest release of Microsemi Libero ? System-on-Chip (SoC) (v10.0 or later) from the Microsemi SoC Products Group website and register for your free Gold license. For instructions on how to install Libero SoC and SoftConsole, refer to the Libero SoC Installation and Licensing Guide,available at https://www.doczj.com/doc/1a1980327.html,/soc/documents/libero_ug.pdf.
Refer to the Installing IP Cores and Drivers User’s Guide for downloading and installing Microsemi DirectCores, SGCores, and Driver firmware cores that must be localized on the personal computer where Libero SoC is installed when designing with Microsemi devices.
Microsemi has partnered with key industry leaders in the microcontroller space to provide a robust SmartFusion ecosystem . SmartFusion cSoCs are supported by the latest IAR Systems ? release, IAR Embedded Workbench ? for ARM. Refer to Designing SmartFusion with IAR Systems for more information.
The SmartFusion cSoC is also supported by Keil’s latest release, MDK-ARM Microcontroller Development Kit. Refer to SmartFusion Designing with Keil for more information.
Jumpers, Switches, and LED Settings
The recommended default jumpers, switches, LEDs, and DIP switch settings are defined in Table 1-1through Table 1-4 on page 8. Connect the jumpers with the default settings to enable the pre-programmed demonstration design to function correctly.
The available headers and their usage are detailed in Table 1-5 and Table 1-6 on page 9.Table 1-1 ? SmartFusion Evaluation Kit Jumper Settings Jumper Function
Default Settings
Notes
J6Jumper to select second 3.3 V (V3P3_F2) power supply for board
Closed
JP6
Jumper to select either 1.5 V external regulator or SmartFusion 1.5 V internal regulator
Pin 1–2 = 1.5 V internal Closed Pin 2–3 = 1.5 V external
Open JP7
Jumper to select between RVI header or LCP header for application debug
–Pin 1–2 = USB programming and SoftConsole Closed Pin 2–3 = RVI for Keil U-LINK/IAR J-ink
Open
JP10
Jumper to select JTAGSEL
Allows selection of
A2F200 programming or Cortex-M3 processor debug with integrated low-cost programmer
Pin 1–2 = FPGA, allows A2F200 programming Closed Pin 2–3 = M3, allows Cortex-M3 processor debug
Open
Installation and Settings
8Revision 6
Table 1-2 ? SmartFusion Evaluation Kit Push-Button Switches Push-Button Switch SmartFusion Pin
Comments
SW1G19Test and navigation switch SW2G20Test and navigation switch
SW3
W7 (PU_N)
Push-button switch for PUB. This negative active switch is connected to the PUB pin, which is a digital input to the FPGA fabric. PUB is the connection for the external momentary switch used to turn on the 1. 5 V voltage regulator.
SW4R1 (MSS_SYSRESET)
System Reset for DUT
Table 1-3 ? SmartFusion Evaluation Kit LED LED SmartFusion
Pin
Comment
D1B19Test LED for user application D2B20Test LED for user application D3C19Test LED for user application D4H17Test LED for user application D5H20Test LED for user application D6C21Test LED for user application D7D21Test LED for user application D8G21Test LED for user application D11N/A UART over USB link indicator LED D14N/A Programmer activity indicator LED D15N/A Programmer ON indicator LED
D16N/A SPEED LED. The LED is ON when device is in 100 Mbps mode and OFF when in 10 Mbps mode.
LED1
N/A
USB power supply indicator LED. This GREEN LED is ON when the board is powered on.
Table 1-4 ? LED Table Jumper LED Comment
JP11D5Controls LED access for LED5JP12D6Controls LED access for LED6JP13D7Controls LED access for LED7JP14
D8
Controls LED access for LED8
Table 1-5 ? Test Point Pin FPGA I/O TP7, TP8Digital ground (GND)
TP11
3.3 V supply for SmartFusion cSoC
SmartFusion Evaluation Kit User’s Guide
Revision 69
Never put a jumper on these headers. These are provided to measure and monitor VAREF0 and VAREF1.TP12 1.5 V for SmartFusion cSoC TP13
Analog ground (AGND)
Table 1-6 ? J22 Header Strip – User I/Os Pin FPGA I/O 1J192J203J214
J22Table 1-7 ? Header for VAREF Monitoring Jumper Description
J5Used to monitor VAREF0 driven from VAREFOUT output of the SmartFusion device J8Used to monitor VAREF1 driven from VAREFOUT output of the SmartFusion device J24
Header for VAREFOUT/VAREF output of the SmartFusion Device
Table 1-8 ? JP8 UART Header
Pin MSSIO/GPIO 128 - UART_1_TXD1229 - UART_1_RXD1
3
GND
Table 1-9 ? JP9 I2C Header
Pin MSSIO/GPIO 130 - I2C_1_SDA1231 - I2C_1_SCL1
3
GND
Table 1-10 ? J23 SPI Header
Pin MSSIO/GPIO 124 - SPI_1_DO 225 - SPI_1_DI 326 - SPI_1_CLK 427 - SPI_1_SS
5
GND
Table 1-5 ? Test Point (continued)Pin FPGA I/O
分销商库存信息: MICROSEMI DUAL-MOTOR-
CONTROL-KIT
Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure.................................... (5) 4.0 Marking…….…………………………………… ………………………. ..… …………… 6~7 5.0 Derating Curve................................................... .. (8) 6.0 Performance Specification …………………………………………….……………..........8~9 7.0 Explanation of Part No. System ………………………………….…………………………9~10 8.0 Ordering Procedure (10) 9.0 Standard Packing ………………………………………………….…………………………11~12 10.0 Note Matter.................................................................. . (12)
File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2013.12.20 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by
Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure (5) 4.0 Marking…….……………………………………… ………………………..… …………..…6~7 5.0 Derating Curve................................................ .. (8) 6.0 Performance Specification …………………………………………………………..............8~9 7.0 Explanation of Part No. System (10) 8.0 Ordering Procedure (11) 9.0 Packing ………………….…………………………………………………………………..…11~13 10.0 Note Matter (14)
File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2015.02.04 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by
This specification for approve relates to the Lead-Free Thick Film Chip Resistors manufactured by ROYALOHM. 2.0 Ratings & Dimension: 01005、0201、0402 0603、0805、1206、1210、1812、2010、2512 2.1 Dimension & Resistance Range ： Type 70℃ Power Dimension(mm) Resistance Range L W H A B 0.5% 1.0% 2.0% 5.0% 01005 1/32W 0.40±0.02 0.20±0.02 0.13±0.02 0.10±0.050.10±0.03-- 10Ω-10M Ω 10Ω-10M Ω10Ω-10M Ω 0201 1/20W 0.60±0.03 0.30±0.03 0.23±0.03 0.10±0.050.15±0.05-- 1Ω-10M Ω 1Ω-10M Ω1Ω-10M Ω 0402 1/16W 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.100.25±0.101Ω-10M Ω0.1Ω~22M Ω 0.1Ω~22M Ω0.1Ω~22M Ω 0603 1/16W 1/10WS 1.60±0.10 +0.15 0.80 -0.10 0.45±0.10 0.30±0.20 0.30±0.20 1Ω-10M Ω 0.1Ω~33M Ω 0.1Ω~33M Ω 0.1Ω~100M Ω 0805 1/10W 1/8WS 2.00±0.15 +0.15 1.25 -0.10 0.55±0.10 0.40±0.200.40±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~100M Ω 1206 1/8W 1/4WS 3.10±0.15 +0.15 1.55 -0.10 0.55±0.10 0.45±0.200.45±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~100M Ω 1210 1/4W 1/3WS 1/2WSS 3.10±0.10 2.60±0.20 0.55±0.10 0.50±0.250.50±0.201Ω-10M Ω0.1Ω~10M Ω 0.1Ω~22M Ω0.1Ω~100M Ω 1812 1/2W 3/4WS 4.50±0.20 3.20±0.20 0.55±0.20 0.50±0.200.50±0.201Ω-10M Ω0.1Ω-10M Ω 0.1Ω-10M Ω0.1Ω-10M Ω 2010 1/2W 3/4WS 5.00±0.10 2.50±0.20 0.55±0.10 0.60±0.250.50±0.201Ω-10M Ω0.1Ω~22M Ω 0.1Ω~22M Ω0.1Ω~22M Ω 2512 1W 6.35±0.10 3.20±0.20 0.55±0.10 0.60±0.250.50±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~33M Ω
DHR01-3035型 高分子高分子湿敏电阻湿敏电阻湿敏电阻规格规格规格说明说明说明书书 一、原理 阻抗型高分子湿度传感器（湿敏电阻）, 采用功能高分子膜涂敷在带有导电电极陶瓷衬底上，形成阻抗随相对湿度变化成对数变化的敏感部件，导电机理为水分子的存在影响高分子膜内部导电离子的迁移率。 二、应用 适合电气电力设备、仪器仪表、除湿加湿设备、电子温湿表、制冷、干燥、气象等需湿度测量的场所。 三、特性 高精度，高可靠，高耐水性，高、低湿适应性； 稳定，低漂移，反应快速。 四、电气规格 工作电压 1V AC（50Hz ～ 2 K Hz） 检测范围 20%～ 95% RH 检测精度 ±5% 储存温度 -20℃～﹢60℃ 95%RH 以下（无结露） 工作温度范围 -20℃～﹢80℃ 95%RH 以下（无结露） 特征阻抗 30 KΩ (60%RH, 25℃) 响应时间 ≤12 s (20%～ 90%) 湿度飘移（/年） ≤±2% RH 湿滞 ≤ 1.5% RH 五、外型尺寸及内部结构示意图如下：
六、型号命名 D HR HR 010101 —— XXXX XXXX 公司代号公司代号 湿敏电阻湿敏电阻湿敏电阻 编号编号编号 阻值阻值阻值((30-35KΩ) ) 备注： 1、标称阻值是指在温度为25℃，相对湿度为60%RH 下所测量阻抗值 2、本规格书所有参数均由LCR 数字电桥在（1K Hz，1V）下所测阻抗 3、基本参数:温度为25℃下,特征阻抗值 (单位：KΩ) 型号 湿度rh 30% 40% 50% 60% 70% 80% 90% DHR01-3035 阻值KΩ 352.8 166.6 60.6 29.9 15.4 9.13 4.6 4、各温度下，不同湿度/阻抗数据表 见表1 5、各温度下，不同湿度/阻抗3D 图 见图3 七、可靠性测试： 1、热测试：放置在50℃，30%RH 环境1000小时后，在通常环境下1小时后，阻抗变化不超过初始值对应湿度的±5%RH； 2、冷测试：放置在-10℃环境1000小时后，在通常环境下1小时后，阻抗变化不超过初始值对应湿度的±5%RH。 八、应用电路建议 1、如使用模拟电路，建议将湿度信号变为电压信号输出，请向厂家索取； 2、可采用555时基或RC 振荡电路，将湿度传感器等效为阻抗值，测量振荡频率输出，振荡频率在1K Hz 左右，（在60%RH，25℃）（建议串联电容采用温度系数低，精度在±5% J 级有机聚合物电容，例如涤纶或聚丙烯类电容）； 3、对于采用单片机电路采集信号，可参考厂家提供的《湿度传感器单片机应用指南》 。 九、引用标准 GB/T15768-95 电容式湿敏元件及湿度传感器总规范； SJ/T10431-93 湿敏元件用湿度发生器和湿度测试方法； SJ20760-99 高分子湿度传感器总规范。 十、注意事项 1.不要对元件使用直流电源，检测时请使用电桥阻抗（LCR）测试设备； 2.避免硬物或手指直接接触元件表面，以免划伤或污染感湿膜； 3.焊接时温度不能过高（<180℃，2S 膜表面），使用低温烙铁或用镊子保护； 4.尽量避免在以下环境中直接使用： 盐雾，腐蚀性气体：强酸（硫酸，盐酸），强碱，有机溶剂（酒精，丙酮）等； 5.推荐储存条件：温度：10℃～40℃ 湿度：20%RH --60%RH 。
Page 4 ? Small size and lightweight ? Suitable for both flow and reflow soldering ? Reduction of assembly costs and matching with placement machines 2007 - 2008 Standard: 2%, 5%, 10%---E 24 series 1%---E 96 series
2007 - 2008 Page 5
Marking on the Resistors Body: ?For 0402 size, no marking on the body due to the small size of the resistor. ?±5% tolerance product. (Including resistance values less than 1?; both 1% and 5%) The marking is 3 digits, the first 2 digits are the significant figures of the resistance and the 3rd digit denotes number of zeros. 153 = 15000? = 15K?; 120 = 12? Below 10? shown as this: 6R8 = 6.8? 0.1?~0.99? shown as this: R33 = 0.33? ?±1% tolerance marking of case size 0805 and bigger is 4 digits, the first 3 digits are the significant figures of the resistance and the 4th digit denotes number of zeros. 2372 = 23700? = 23.7K?; 1430 = 143? Below 10? shown as this: 3R24 = 3.24?0.1?~0.99? shown as this: R33 = 0.33? Page 6 2007 - 2008
Approval Sheet for Thick Film Chip Resistor RL series 1% 2% 5% YAGEO CORPORATION Factory: No.11, Min Chuan Rd., Ta Sheh, Kaohsiung, Taiwan, R.O.C. Tel: 886-7-351-4117 Fax: 886-7-352-6475 Headquarters: 3F, No.233-1, Pao Chiao Rd., Hsin Tien, Taipei, Taiwan, R.O.C. Tel: 886-2-2917-7555 Fax: 886-2-2917-4286 https://www.doczj.com/doc/1a1980327.html, RL Series Version 2000-3 Page-1
RL Series Version 2000-3 Page-2 1. SUBJECT : This specification describes of RL series chip resistors made of YAGEO Corporation by thick film process. 2. PART NUMBER : Part number of the chip resistor is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. Example : RL 1206 F R - 07 0R02 Series Size Resistance Packing Temperature Special Resistance Name Code Tolerance Style Coefficient Type Value of Resistance (1) Size : (unit: inches) 0603=0.063×0.033 1210=0.122×0.102 0805=0.083×0.051 2010=0.197×0.098 1206=0.122×0.063 2512=0.250×0.126 (2) Tolerance : F=±1%, G=±2%, J=±5% (3) Packaging Style : R =Paper Taping Reel. K =Embossed Plastic Tape Reel. C =Bulk Cassette. (4) T .C .R.: “-“Base on Spec. (5) Special Type : 07= 7 inch Dia. Reel 10=10 inch Dia. Reel 13=13 inch Dia. Reel (6) Resistance Value : 10m ?、20 m ?、51 m ?、100 m ?、330 m ?、470 m ?…… (7) Resistance Series : E24 (E48/96 on request)
RoHS Compliant Type 02010402060308051206121020102512 Max. Working Voltage 25V 50V 50V 150V 200V 200V 200V 200V Max. Overload Voltage 50V 100V 100V 300V 400V 400V 400V 400V Dielectric withstanding Voltage - 100V 300V 500V 500V 500V 500V 500V Operating Temperature -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+ 155°C Type 02010402060308051206121020102512Power Rating at 70°C 1/20W 1/16W 1/16W (1/10W-S)1/10W (1/8W-S)1/8W (1/4W-S)1/4W (1/3W-S) *1/2W (3/4W-S)1W L (mm)0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.10 2.00 ± 0.15 3.10 ± 0.15 3.10 ± 0.10 5.00 ± 0.10 6.35 ± 0.10W (mm) 0.30 ± 0.030.50 ± 0.050.80 +0.15 -0.10 1.25 +0.15 -0.10 1.55 +0.15 -0.10 2.60 +0.15 -0.10 2.50 +0.15 -0.10 3.20 +0.15 -0.10 Dimension H (mm)0.23 ± 0.030.35 ± 0.050.45 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.10A (mm)0.10 ± 0.050.20 ± 0.100.30 ± 0.200.40 ± 0.200.45 ± 0.200.50 ± 0.250.60 ± 0.250.60 ± 0.25B (mm) 0.15 ± 0.050.25 ± 0.100.30 ± 0.200.40 ± 0.200.45 ± 0.200.50 ± 0.200.50 ± 0.200.50 ± 0.20Resistance Value of Jumper <50m?<50m?<50m?<50m?<50m?<50m?<50m?<50m?Rated Current of Jumper 0.5A 1A 1A 2A 2A 2A 2A 2A Max. Current of Jumper 1A 2A 2A 5A 10A 10A 10A 10A Resistance Range of 0.5% (E-96)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 1% (E-96)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 2% (E-24)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 5% (E-24) 1? ~ 1M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? * 1210 size in 1/2W could be provided specially (1210U2) ? Small size & light weight ? Reduction of assembly costs and matching with placement machine ? Suitable for both flow & re-flow soldering ? Applications: Navigator (GPS), Mobile Phone,Telecom, PDA, Setbox, Meter. Feature Figures Derating Curve & Specification Thick Film Chip Resistors P e r c e n t r a t e d l o a d (%) Ambient termperature(°C ) 2 UniOhm
RESISTORS SHALL HAVE A RATED DIRECT-CURRENT (DC) CONTINUOUS WORKING VOLTAGE OR AN APPROXIMATE SINE-WAVE ROOT-MEAN-SQUARE (RMS)
TYPE L W H l1 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.10 0.25 1.60±0.10 + 0.15 0.80 0.45±0.10 0.30±0.20 0.30 STRUCTURE: 1: HIGH PURITY ALUMINA SUBSTRATE 0.3±0.1%CaO、1.0±0.3%MgO、2.1±0.05%SiO2)
33000 2700
: 1.96K?=196×10?------29B 12.4?=124×10?-----10X STANDARD E-96 VALUES AND 0603 RESISTANCE CODE
CHARACTERISTIC LIMITS TEST METHOD (JIS-C-5201) 4.19 RESISTANCE CHANGE AFTER CONTINUOUS FIVE CYCLES FOR DUTY CYCLE SPECIFIED BELOW: STEP TEMPERATURE TIME ±0.5% ±1% ±(0.5%+0.05 ?)MAX 1 -55℃±3℃ 30 MINS 2 ROOM TEMP . 10 --- 15 MINS 3 +155℃±2℃ 30 MINS TEMPERATURE CYCLING ±2% ±5% ±(1.0%+0.05 ?) MAX. 4 ROOM TEMP . 10 --- 15 MINS 95% COVERAGE MIN. WAVE SOLDER: TEST TEMPERATURE OF SOLDER: 245℃±3℃ DIPPING TIME IN SOLDER: 2-3 SECONDS. SOLDERABILITY GO UP TIN RATE BIGGER THAN HALF OF END POLE REFLOW: ±0.5% ±1% ±(0.5%+0.1?) MAX. HUMIDITY ( STEADY STATE ) ±2% ±5% ±(3.0%+0.1?) MAX. 4.24 TEMPORARY RESISTANCE CHANGE AFTER 240 HOURS EXPOSURE IN A HUMIDITY TEST CHAMBER CONTROLLED AT 40±2℃ AND 90-95% RELATIVE HUMIDITY , RESISTANCE CHANGE RATE IS: ±0.5% ±1% ±(1%+0.1?)MAX. LOAD LIFE IN HUMIDITY ±2% ±5% ±(3%+0.1?)MAX. 7.9 RESISTANCE CHANGE AFTER 1,000 HOURS (1.5 HOURS “ON”,0.5 HOUR “OFF”) AT RCWV IN A HUMIDITY CHAMBER CONTROLLED AT 40℃±2℃ AND 90 TO 95% RELATIVE HUMIDITY . RESISTANCE CHANGE RATE IS: ±0.5% ±1% ±(1%+0.1?)MAX. LOAD LIFE ±2% ±5% ±(3%+0.1?)MAX. 4.2 5.1 PERMANENT RESISTANCE CHANGE AFTER 1,000 HOURS OPERATING AT RCWV WITH DUTY CYCLE 1.5 HOURS “ON”, 0.5 HOUR “OFF” AT 70℃±2℃ AMBIENT. RESISTANCE TO DISSOLUTION OF METALLIZATION TEST INSPECT FOR ANY DISSOLUTION OF METALLIZATION ON COMPONENT ELECTRODES WITH MAGNIFIER OF ABOUT 20-30 MAGNIFICATION TEST CONDITION: SOLDER TEMPERATURE 260±3IMMERSION ℃℃TIME 30±1 SECOND IMMERSION DEPTH 2.0-2.5MM
Page-1 Approval Sheet for Carbon Film Resistors CFR series ±2% & ±5% YAGEO CORPORATION Headquarters: 3F, No.233-1, Pao Chiao Rd., Shin Tien, Taipei, Taiwan, R.O.C. Tel: 886-2-2917-7555 Fax: 886-2-2917-4286 URL: https://www.doczj.com/doc/1a1980327.html,
Page-2
Page-3 1. PRODUCT : CARBON FILM RESISTORS (Normal & Miniature Style) 2. PART NUMBER : Part number of the carbon film resistor is identified by the name, power, tolerance, packing, temperature coefficient, special type and resistance value. Example ： CFR -12 J T J 52 100R Series Size Resistance Packing Temperature Special Resistance Name Code Tolerance Style Coefficient Type Value of Resistance (1) Style: CFR SERIES (2) Power Rating: -12=1/6W 、25S=1/4WS 、-25=1/4W 、50S=1/2WS 、-50=1/2W 、 1WS=1WS 、100=1W 、2WS=2WS 、200=2W (3) Tolerance: G=±2% J=±5% (4) Packaging Type : R ＝Paper Taping Reel T ＝Tape on Box Packing B ＝Bulk Packing (5) T .C .R : J=±350ppm/℃ — =lgnore (6) Special Type : 26＝26mm 、52=52.4mm 、73=73mm 、 PN ＝PANAsert AV ＝AVlsert (7) Resistance Value: 1R 、10R 、100R 、10K 、100K 、330K 、1M………
贴片电阻规格书(0201 0402 0603 0805 1206 1210 1812 2010 2512 PADS 9.3 的功能亮点,主要亮点如下： 1）DxDesigner 和Symbol Editor 已经完全支持公制单位的设计和符号创建。 2）PADS ES suite 增加了DxDataBook 功能。 3）PADS Logic, Layout, Router 新增PADS Archiver 项目归档功能。 4）PADS Logic 完全开放智能PDF功能，不需额外购买。 5）PADS Layout 新增Update from Library。 6）PADS Decal Wizard （封装向导）功能加强，更准确高效的建立各种封装。 7）PADS Layout 输出智能PDF 文档，可查看各种属性。 8）新增Net Bridging 功能。 9 ) 支持单面板设计的检查. 10）新增ODB++, IPC-D-356, Flat DXF 等….输出或输入接口。 11) Layout 的Verify Design 可显示错误的实际间距。 12) Decal Wizard增强了创建热焊盘的能力,并能够基于IPC-7351A 标准创建合适的封装,大大提高准确性和省时间。 13) 新增及加强的差分线和蛇形功能(包括蛇形线禁止区,支持弧形等),大大提高布线效率。 14) 新增Modeless Commands(显示,定原点,转换单位等....),方便省时,使工作更便利方便省时,使工作。 15) PADS Layout 已可设定显示网络和管脚名称。 16) PADS Router 能使用Miters 作自动布线,使自动布线后不需再大量修改90度线。 17) 基本功能强化包括ECO 对比,DFF检查,过孔矩阵,检查优化,针对RF 设计优化, 单面板的DRC 校验,灌铜可覆盖组件焊盘和自定义热焊盘等… 18) 3D 浏览器 19) PADS Layout 支持visECAD 和CAMCAD Professional 流程 20) 新增ECAD/MCAD Collaborator,使协作处理底板外框及禁区设定等更便利 21) Dxdesginer 强化包括, Navigator: 单击, Navigator: 拖拉页面, 传播层次化的属性, Ripped Net Spacing, 动态排列空间调整等等……. 22) PADS Layout/Logic/Dxdesigner 分别已能读入不同的CAD 文件,包括Expedition,Portel,P-CAD,CADSTAR,Orcad 破解方法，9.2的破解与安装与9.0一致： Mentor Graphics PADS9 运行Crack\MentorKG.exe，生成LICENSE.TXT。 附： WIN2000,winXP中环境变量的使用。 “我的电脑”，“属性”，“高级”，“环境变量” 系统变量 PowerPCB 变量名：MGLS_LICENSE_FILE: K! T1 u. E) 变量值：D:\PADS2007\Crack\LICENSE.TXT 请把路径设置对，如果安装有pads2007，就不需要设置。 拷贝MGLS.DLL至
Prepared
Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure.................................... (5) 4.0 Marking…….…………………………………… ………………………. ..… …………… 6~7 5.0 Derating Curve................................................... .. (8) 6.0 Performance Specification …………………………………………….……………..........8~9 7.0 Explanation of Part No. System ………………………………….…………………………9~10 8.0 Ordering Procedure (10) 9.0 Standard Packing ………………………………………………….…………………………11~12 10.0 Note Matter.................................................................. . (12)
File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2014.05.23 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by