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Native defect properties and p-type doping efficiency in group-IIA doped wurtzite AlN

Native defect properties and p-type doping efficiency in group-IIA doped wurtzite AlN
Native defect properties and p-type doping efficiency in group-IIA doped wurtzite AlN

Native defect properties and p-type doping ef?ciency in group-IIA doped wurtzite AlN

Yong Zhang,1,2Wen Liu,2and Hanben Niu2,*

1Institute of Optoelectronics Science and Engineering,Huazhong University of Science and Technology,Wuhan430074,China

2Institute of Optoelectronics and Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education,Shenzhen University,

Shenzhen518060,China

?Received18April2007;published2January2008?

Using the?rst-principles full-potential linearized augmented plane-wave?FPLAPW?method based on den-

sity functional theory?DFT?,we have investigated the native defect properties and p-type doping ef?ciency in

AlN doped with group-IIA elements such as Be,Mg,and Ca.It is shown that nitrogen vacancies?V N?have low

formation energies and introduce deep donor levels in wurtzite AlN,while in zinc blende AlN and GaN,these

levels are reported to be shallow.The calculated acceptor levels??0/??for substitutional Be?Be Al?,Mg

?Mg Al?,and Ca?Ca Al?are0.48,0.58,and0.95eV,respectively.In p-type AlN,Be interstitials?Be i?,which act

as donors,have low formation energies,making them a likely compensating center in the case of acceptor

doping.Whereas,when N-rich growth conditions are applied,Be i are energetically not favorable.It is found

that p-type doping ef?ciency of substitutional Be,Mg,and Ca impurities in w-AlN is affected by atomic size

and electronegativity of dopants.Among the three dopants,Be may be the best candidate for p-type w-AlN.

N-rich growth conditions help us to increase the concentration of Be Al,Mg Al,and Ca Al.

DOI:10.1103/PhysRevB.77.035201PACS number?s?:61.72.Bb,61.72.J?,61.72.uj,71.15.Nc

I.INTRODUCTION

Group-III nitrides?III-N,III=Ga,Al,and In?are wide-gap semiconductors and have attracted researcher’s attention for more than two decades due to their promising applica-tions for the blue-ultraviolet?UV?optoelectronics.1–5Among all III-V nitrides,wurtzite AlN has the widest direct gap?var-ies from6.28eV at5K to6.2eV at room temperature?.6 Thus,to push the optical emission and/or detection wave-length to the deep UV region???200nm?,AlN is of great interest.

In spite of the recognition of the importance of AlN,the report of light emitting directly from AlN is rare due to the lack of high-quality?lms.Recently,Taniyasu et al.have re-ported a light emitter with210nm made of AlN doped with Si and Mg,which is the shortest wavelength emitted by light-emitting diode at present,7whereas the internal quan-tum ef?ciency is still low due to low p-type doping ef?-ciency.So the fabrication of p-type doped layers is essential for all of these devices.However,similar to GaN,the growth of highly conductive p-type AlN layers has so far proven to be dif?cult.The main reasons have been proposed to be the formation of donor defects,such as nitrogen vacancies,lim-ited dopant solubility,and deep acceptor energy levels.Fol-lowing the“doping limit rule,”8it will be much more dif?-cult to achieve p-type AlN than to achieve p-type GaN.

To exploit fully the potential of AlN,systematic studies of native defects and impurities in AlN are required.While there have been several theoretical and experimental studies of crystal defects in GaN,9–11little work has been done on AlN.Magnesium is commonly used as p-type dopant for nitride semiconductors,but the Mg low doping ef?ciency is due to the deep acceptor level introduced by Mg.It would be desirable to?nd an alternative dopant that would exhibit higher solubility and lower ionization energy.In Ref.7, group-II and-IV elements have been proposed to be poten-tial candidates for Mg.However,group-IV elements are likely to become donors when incorporated in the cation sites,which will result in severe self-compensation.12Thus, group-II elements may be better candidates than group-IV elements for p-type AlN doping.In GaN,it has been reported that the acceptor level of Be Ga is shallower than that of Mg Ga.However,the behavior of doping Be in w-AlN is still unclear.To improve p-type doping ef?ciency,systemic stud-ies of doping properties of group-IIA elements in AlN are important.

In this work,theoretical studies are performed to under-stand the con?gurations of native defects and substitutional Be,Mg,and Ca impurities in wurtzite AlN.By comparing the formation energies and transition levels of Be-,Mg-,and Ca-related defects,the p-type doping ef?ciency of these dop-ants is examined.The organization of this paper is as fol-lows.In Sec.II,the computational methods are introduced. Section III gives some discussion and results.Section IV summarizes the paper and contains some suggestions for fu-ture experimental work.

II.METHODS

The calculations are performed using the FPLAPW method implemented in WIEN2K package.13The generalized gradient approximation of Perdew-Burke-Ernzerhof96?Ref. 14?is employed for the exchange-correlation potential.Cal-culations were done with R MT K max=9?where R MT is the av-erage radius of the muf?n-tin spheres and K max is the maxi-mum modulus for the reciprocal lattice vector?.The iteration process was repeated until the calculated total energy differ-ence between succeeding iterations is less than0.1mRy and the force on each atom is less than1.0mRy/a.u.To simulate isolated defects,a72-atom AlN supercell consisting of 3?3?2primitive wurtzite cells is used as it was found to be adequate in earlier work on similar systems.15The 4?4?3k-point mesh produces converged results.The lat-tice parameters of supercell are?xed and are described by

PHYSICAL REVIEW B77,035201?2008?

the theoretical value of pure AlN.The theoretical band gap

derived from the band structure is?4.1eV and about2.0eV

below the experimental gap.To?nd a realistic description of

both defect levels and band edges,we obtain them both from

electron addition and removal calculations.The theoretical

band gap evaluated from E??R????+E+?R?+???2E0?R?0???Ref.16?is5.98eV,in acceptable agreement with the ex-perimental value of6.12eV.17

At equilibrium and in the dilute limit,the concentration of

a defect in a crystal depends upon its formation energy E f.

Following Van de Walle and Neugebauer,18the formation

energy of a defect or impurity X?X=Be,Mg,and Ca in

present work?in charge state q is calculated from

E f?X q?=E tot?X q??E tot?AlN,bulk?

??n i?i+q?E F+E V+?V?,?1?where E tot?X q?is the total energy of the defect-containing AlN supercell and E tot?AlN,bulk?is the total energy of the equivalent supercell of AlN containing no defects.Here,n i indicates the number of atoms that have been added to ?n i?0?or removed from?n i?0?the supercell and?i are the corresponding chemical potentials of these species.E F is the Fermi level,referenced to the valence-band maximum E V in the bulk.A correction term?V is used to align the reference potential in our defect supercell with that in the bulk.

The chemical potentials?depend on growth process.19 To determine the bound of?Al and?X,we compute the enthalpy of formation of AlN and X3N2assuming the formation from metallic Al,X,and gaseous N2??H f?AlN?=?2.06eV,?H f?X3N2?=?5.0,?3.36,and ?2.63eV for X=Be,Mg,and Ca,respectively?.Chemical potentials are calculated using the following relationships:?Al+?N=?AlN=?Al?bulk?+?N?N

2

?+?H f?AlN?,?2?

3?X+2?N=?X

3N2

=3?X?bulk?+2?N?N

2

?+?H f?X3N2?.

?3?

By combining Eqs.?2?and?3?,the chemical potential of Al and impurity X are therefore

?Al=?Al?bulk?,?4?

?X=?X?bulk?+1

3?H f?X3N2??2

3

?H f?AlN?,?5?

for Al-rich limit,and

?Al=?Al?bulk?+?H f?AlN?,?6?

?X=?X?bulk?+1

3

?H f?X3N2?,?7?for N-rich limit.

III.RESULTS AND DISCUSSION

A.Native defects

In order to?nd the possibility of compensation,we per-form a comprehensive study on the native point defects in AlN.Figure1shows the formation energies of native defects

in w-AlN as a function of the Fermi level under the two

extreme conditions:the Al-rich limit and the N-rich limit.

Here,E F spans the theoretical band gap?5.98eV?.

Moreover,V N behave as donors that can donate one,two, or three electrons,but only the V N+and V N3+charge states are stable.The V N2+state is unstable,thus presenting a

negative-U effect.The similar behavior of V N has been found in GaN.20The V N3+has very low formation energy under

p-type conditions?E F close to the top of the valence band?.

Taking no account of ionization level,nitrogen vacancies,

therefore,are likely to play an important role in compensat-

ing acceptors in p-type AlN.Under n-type conditions ?E F close to the bottom of the conduction band?,however, the formation energy of V N is actually quite high.In

thermodynamic equilibrium,the concentration of nitrogen

vacancies should therefore be quite low.On the other hand,

V N act as deep donors and the transition level locates at ??1+/0?=1.75eV blow the conduction-band minimum.This conclusion is different from what was reported about V N in zinc blend e AlN in Van de Walles’work,21where V N act as a shallow donor.Because of deep transition energy and high formation energy under n-type conditions,V N should not be responsible for the observed n-type conductivity in as-grown AlN.It is more possible that unintentional impurities lead to n-type conductivity other than native defects do.It has been reported that unintentional impurities such as oxygen and silicon are the cause of the observed unintentional n-type doping in GaN.22As shown in Fig.1,the formation energies of V N can be changed signi?cantly depending on growth conditions?Al rich or N rich?.

Our calculations reveal that V Al are the lowest-energy de-

fects in n-type AlN,where they behave as triple acceptors.

These defects are likely to act as compensating centers for

shallow donors.The calculated transition energy??0/??for V Al is0.95eV above the valence-band maximum?VBM?. Additionally,for p-type AlN,our results show that Al N3+has a low formation energy in Al rich,but in N rich,it is

very FIG.1.Defect formation energies for native point defects in wurtzite AlN as a function of the Fermi level?E F?under aluminum-rich?left panel?and nitrogen-rich?right panel?conditions.E F is de?ned to be zero at the valence-band edge.

ZHANG,LIU,AND NIU PHYSICAL REVIEW B77,035201?2008?

high,which indicate that Al N3+concentration is affected by growth conditions of AlN strongly.The other native defects, such as Al i and N Al,possess high formation energies both in Al rich and N rich,so they cannot be the dominant defects in w-AlN.

B.p-type doping

In this section,we study the doping behavior of Be,Mg, and Ca impurities in AlN.The main information about the geometry and stability of substitutional impurities is given in Table I.

1.Mg dopant in AlN

In wurtzite AlN,a substitutional impurity has four nearest neighbors.One of them located along the c axis relative to the impurity?forming X-N?I?bond?is nonequivalent by symmetry to the three remaining neighbors?forming X-N?II?bonds?.For substitutional Mg,we?nd that Mg atom is lo-cated very close to the lattice site of the Al atom that it https://www.doczj.com/doc/1a1210739.html,ttice relaxation increases the length of Mg-N bonds and releases elastic energies for both neutrally and negatively charged states?listed in Table I?.This outward relaxation can be attribute to that of the atomic radius of a substitutional impurity?Mg?which is larger than that of re-placed host atom?Al?.15Large relaxation of the surrounding host atoms will raise the formation energy.Very similar re-sults are obtained for substitutional Mg in zinc blend e AlN.21Magnesium on the Al site induces the acceptor level ??0/1??=0.58eV above the VBM,which is close to the experimental value of0.51eV.23The large acceptor level of Mg Al may has relation to the electronegativity of Mg atom

?for detailed analysis,see below Be dopant in AlN?.As can be seen in Fig.2,Mg Al has a high formation energy.This high formation energy stems from the strict solubility limit imposed by the formation of Mg3N2.The formation energy of Mg Al is affected by the growth conditions:by moving from Al-rich to N-rich conditions,the formation energy of

Mg Al decreases by1

3??H f?AlN??.

In contrast to the Mg Al,Mg N induces a deep donor level.

For Al rich,our calculations indicate that incorporation of

Mg on nitrogen site is energetically favorable in p-type con-

ditions,which can result in self-compensation effect,but this

is not true under N-rich conditions.Therefore,N-rich growth

conditions can restrict Mg N concentration in AlN.Mg on

interstitial site behaves as donor,but both in Al-and N-rich

conditions,Mg i is unfavorable due to the large atom size of

Mg.

2.Be dopant in AlN

For a substitutional Be Al acceptor,the Be-N bonds show

inward relaxation for both neutrally and negatively charged

states for Al atom that has larger atomic radius than that of

Be.A similar inward relaxation for this complex is also re-

ported in GaN,19but percentage change of Be-N bond length

is larger than that of Be impurity in AlN due to even larger

atomic radius?1.30???Ref.24?of Ga atom.The relaxation

energy E rel of Be Al is lower than that of Mg Al both in neu-

trally and negatively charged states,showing that Be re-

places Al in AlN with less perturbation of the lattice.Our

formation energy calculations reveal that Be occupying Al

site creates a single acceptor state above the VBM of AlN.

The calculated transition energy of Be Al is0.48eV which is

shallower than that of Mg Al by?0.1eV.By using effective-

mass theory,Mireles and Ulloa estimated this value to be

0.22–0.45eV,25but their computation is semiempirical and

results are affected by computational parameters strongly.In

GaN,Latham et al.had reported that the acceptor level of

Mg Ga was about0.09eV higher than that of Be Ga,19which is

in good agreement with our result.Different transition ener-

gies between Be Al and Mg Al can be understood as follows:

The acceptor level of Mg Al and Be Al consists mostly of p

https://www.doczj.com/doc/1a1210739.html,paring with Mg,Be atom has lower p orbital

energy for it is more electronegative;26thus,electron can be

excited from the VBM to acceptor level with less energy.As

can be seen from Fig.2,the formation energy of Be Al is

about0.2eV lower than that of Mg Al.So the concentration

TABLE I.Atomic radius R a of X and Al,Pauling electronega-tivity?of X,percentage change of bond lengths with respect to bulk AlN,lattice relaxation energy E rel,optimal formation energy ?N-rich conditions?for different charge states q,and ionization lev-els??0/?1?for substitutional Be,Mg,and Ca at Al site in AlN.

AlN:X R a

????q

X-N?I?

?%?

X-N?II?

?%?

E rel

?eV?

E f

?eV?

?

?eV?

X=Be 1.05a 1.5b0?4.1?0.00.18 2.390.48

?1

?2.6?3.90.28?3.08

X=Mg 1.50a 1.2b0 6.88.40.68 2.560.58

?1 6.57.80.78?2.82

X=Ca 1.81a 1.0b013.512.0 3.44 3.730.95

?114.917.4 3.73?1.27

X=Al 1.25aˉˉˉˉˉˉˉ

See Ref.23.

b See Ref.25.

FIG.2.Formation energy as a function of Fermi level for Mg, Be and Ca in AlN under aluminum-rich?left panel?and nitrogen-rich?right panel?conditions.

NATIVE DEFECT PROPERTIES AND p-TYPE DOPING…PHYSICAL REVIEW B77,035201?2008?

of substitutional Be in AlN is expected to be higher than that

of Mg.Similarly to substitutional Mg,the formation energy

of Be Al is affected by growth conditions.

It is reported that Be Ga acceptor is strongly compensated

by interstitial defects,19so we pay more attention to Be i for

Be in AlN.According to total energy computation,we?nd

that the lowest-energy structure is that Be atom lies in the

center of the hexagonal channel as viewed along the c axis.

Be i behaves as donor and can occur in1+and2+charge

states,while only2+charge state is stable for Be i in GaN.19

This difference is due to the fact that AlN has larger band gap than GaN does.For N-rich conditions,Be i2+has a low

formation energy in p-type AlN,E f?0eV for E F at the VBM.So holes may be compensated by interstitial defects

Be i,which is consistent with Be i in GaN.However,under

N-rich conditions,Be i is energetically unfavorable due to a

positive formation energy?E f=1.30eV for E F=0?;it is pos-

sible to select N-rich growth conditions to restrict the com-

pensation by Be i in p-type AlN.

Since Be N defect has a high formation energy both in Al-

and N-rich conditions,and is thus unlikely to occur in sig-

ni?cant concentration,we do not discuss it in detail here.

3.Ca dopant in AlN

Finally,the behaviors of Ca in AlN are discussed.Cal-

cium has the largest atomic radius and is the least electrone-

gative among the three dopants,so it is expected that calcium

on a substitutional Al site will produce the most signi?cant

outward relaxation with large relaxation energy,highest for-

mation energy,and deepest acceptor level.Our calculations

con?rm these predictions perfectly.The surrounding N atoms

undergo a signi?cant outward relaxation,increasing the

Ca-N distance to2.16?.This distance is very close to the

Ca-N distance in the compound Ca3N2.27Similar to Be and

Mg,Ca Al behaves as a single acceptor,but the transition level between0and?1charge states occurs around0.95eV above the VBM,becoming a deep acceptor.The formation energy of Ca Al is higher than that of both Be Al and Mg Al.So the doping ef?ciency of Ca is lowest comparing with Be and Mg.

IV.CONCLUSIONS

DFT generalized gradient approximation is used to study the native and group-IIA elements related defects in wurtzite AlN.Both V N and Be i act as donor with a low formation energy,making them a likely compensating center in the case of acceptor doping.However,V N do not account for the observed n-type conductivity of as-grown AlN for its high ionization levels and high formation energy in n-type AlN. Under Al-rich growth conditions,Mg N and Be i will compen-sate hole severely,whereas this problem can be improved by N-rich growth conditions.Our calculations revealed that atomic size and electronegativity of group-IIA impurity are important factors for p-type doping ef?ciency:an impurity with similar atomic radius as Al atom can achieve a higher concentration;an impurity with more electronegative prop-erties can produce a lower ionization level.Among the three elements,Be may be the best candidate for producing p-type AlN.In order to achieve high doping ef?ciency,restricting the concentration of V N and Be i is essential and N-rich growth conditions are expected.

ACKNOWLEDGMENTS

This work was supported by the National Natural Science Foundation of China under Project No.60532090.The au-thors would like to thank the Supercomputer Center of Shen-zhen University for the computation support.The authors also thank R.S.Zheng for useful discussions.

*hbniu@https://www.doczj.com/doc/1a1210739.html,

1R.J.Molnar,R.Singh,and T.D.Moustakas,Appl.Phys.Lett.

66,268?1995?.

2S.Nakamura,M.Senoh,and S.Nagahama,Jpn.J.Appl.Phys., Part235,L74?1995?.

3B.W.Lim,Q.C.Chen,J.Y.Yang,and M.Asif Khan,Appl.Phys.

Lett.68,3761?1996?.

4K.B.Nam,M.L.Nakarmi,J.Li,J.Y.Lin,and H.X.Jiang,Appl.

Phys.Lett.83,2787?2003?.

5E.Kuokstis,J.Zhang,Q.Fareed,J.W.Yang,G.Simin,and M.

Asif Khan,Appl.Phys.Lett.81,2755?2002?.

6I.Vurgaftman and J.R.Meyer,J.Appl.Phys.89,5815?2001?. 7Y.Taniyasu,M.Kasu,and T.Makimoto,Nature?London?441, 325?2006?.

8S.B.Zhang,S.H.Wei,and A.Zunger,J.Appl.Phys.83,3192?1998?.

9C.Liu and J.Y.Kang,Opt.Mater.23,169?2003?.

10Z.H.Xiong,F.Y.Jiang,Q.X.Wang,and J.P.Rao,Trans.

Nonferrous Met.Soc.China16,s854?2006?.

11S.Nakamura,T.Mukai,and M.Senoh,Jpn.J.Appl.Phys.,Part2

31,L139?1992?.

12L.E.Ramos,J.Furthmuller,J.R.Leite,L.M.R.Scolfaro,and F.

Bechstedt,Phys.Rev.B68,085209?2003?.

13P.Blaha,K.Schwarz,G.K.H.Madsen,D.Kvasnicka,and J.

Luitz,computer code WIEN2K,Vienna University of Technology, 2002,improved and updated UNIX version of the original;P.

Blaha,K.Schwarz,P.Sorantin,and S.B.Trickey,Comput.

https://www.doczj.com/doc/1a1210739.html,mun.59,399?1990?.

14J.P.Perdew,K.Burke,and M.Ernzerhof,Phys.Rev.Lett.77, 3865?1996?.

15W.J.Lee,J.Kang,and K.J.Chang,Phys.Rev.B73,024117?2006?.

16S.Petit,R.Jones,M.J.Shaw,P.R.Briddon,B.Hourahine,and T.Frauenheim,Phys.Rev.B72,073205?2005?.

17J.Li,K.B.Nam,M.L.Nakarmi,J.Y.Lin,and H.X.Jiang,Appl.

Phys.Lett.83,5163?2003?.

18C.G.Van de Walle and J.Neugebauer,J.Appl.Phys.95,3851?2004?.

https://www.doczj.com/doc/1a1210739.html,tham,R.M.Nieminen,C.J.Fall,R.Jones,S.?berg,and P.R.Briddon,Phys.Rev.B67,205206?2003?.

ZHANG,LIU,AND NIU PHYSICAL REVIEW B77,035201?2008?

20C.H.Park and D.J.Chadi,Phys.Rev.B55,12995?1997?.

21C.Stamp?and C.G.Van de Walle,Phys.Rev.B65,155212?2002?.

22C.G.Van de Walle,C.Stamp?,and J.Neugebauer,J.Cryst.

Growth189/190,505?1998?.

23K.B.Nam,M.L.Nakarmi,J.Li,J.Y.Lin,and H.X.Jiang,Appl.

Phys.Lett.83,878?2003?.24https://www.doczj.com/doc/1a1210739.html,/webelements/elements/text/ periodic-table/radii.html

25F.Mireles and Sergio E.Ulloa,Phys.Rev.B58,3879?1998?. 26A.García and M.L.Cohen,Phys.Rev.B47,4221?1993?.

27J.Neugebauer and C.G.Van de Walle,J.Appl.Phys.85,3003?1999?.

NATIVE DEFECT PROPERTIES AND p-TYPE DOPING…PHYSICAL REVIEW B77,035201?2008?

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英文求职信及简历

常考应用文 应用文主要指各种书信, 如求职信、投诉信、申请信、邀请信、推荐信和感谢信等。按文体,书信 可分为私人信件和事务信件 , 考试中涉及到的大都为事务信件。考生应注意书信的格式及重要书信体 的写法。 一、事务信件的格式 英文书信的格式, 尤其是正式的事务信件的格式与汉语的同类书信格式不同。就形式而言 , 英语 的事务信件可分为三种样式 : 现代常用格式 (modified form ) 、齐头式 (blocked form ) 和缩进式(indented form ) 。 1. 现代常用格式 : William Scott ( 写信人姓名 ) College of Education( 写信人地址 ) 5284University of Oregon U.S.A. March 20,2003( 写信日期 ) Mr.John Smith ( 收信人姓名 ) 235Wall Street ( 收信人地址 ) New York 5.N.Y. 16432 U.S.A. Dear Mr.John Smith:( 称呼 ) ( 正文 ) Yours truly,( 套语 ) Signature ( 手写签名 ) William Scott( 打字签名 ) Director of Admissions and Student Affairs ( 职务 ) Enclosure:( 附件 )

2. 齐头式 : William Scott( 写信人姓名 ) College of Education( 写信人地址 ) 5284 University of Oregon U.S.A. March 20,2003( 写信日期 ) Mr.John Smith ( 收信人姓名 ) 235Wall Street ( 收信人地址 ) New York 5.N.Y. 16432 U.S.A. Dear Mr. John Smith:( 称呼 ) ( 正文 ) Yours truly,( 套语 ) Signature ( 手写签名 ) DirectorofAdmissions and Student Affairs ( 职务 ) Enclosure:( 附件 ) 3. 缩进式 : William Sc 。 "( 写信人姓名 ) College of Education( 写信人地址 ) 5284University of Oregon U.S.A. March 20,2003( 写信日期 ) Mr.John Smith ( 收信人姓名 ) 235Wall Street ( 收信人地址 ) New York 5.N.Y. 16432 U.S.A. Dear Mr. John Smith:( 称呼 ) ( 正文 ) Yours sincerely,( 套语 ) Signature ( 手写签名 )

(完整版)电气图纸符号大全

配电箱符号

配电箱符号

常用电气元件文字符号表

电缆型号 NH是耐火,YJV是交联聚乙烯绝缘,聚氯乙烯护套铜芯电缆 4*150是4芯150平方毫米 E70是接地用线为70平方毫米。 你学习一下下面的电缆基础知识就知道了! 一、电缆型号由下面字母属性组成 (1)类别: H——市内通信电缆 HP——配线电缆 HJ——局用电缆 (2)绝缘: Y——实心聚烯烃绝缘 YF——泡沫聚烯烃绝缘 YP——泡沫/实心皮聚烯烃绝缘 (3)内护层:

A——涂塑铝带粘接屏蔽聚乙烯护套 S——铝,钢双层金属带屏蔽聚乙烯护套 V——聚氯乙烯护套 (4)特征: T——石油膏填充 G——高频隔离 C——自承式 (5)外护层: 23——双层防腐钢带绕包销装聚乙烯外被层 33——单层细钢丝铠装聚乙烯被层 43——单层粗钢丝铠装聚乙烯被层 53——单层钢带皱纹纵包铠装聚乙烯外被层 553——双层钢带皱纹纵包铠装聚乙烯外被层 常用电缆规格型号 一、铜(铝)芯聚氯乙烯绝缘聚氯乙烯绝缘及护套固定敷设用电缆(电线) BV -铜芯聚氯乙烯绝缘电缆(电线) BLV-铝芯聚氯乙烯绝缘电缆(电线) BVR-铜芯聚氯乙烯绝缘电缆(电线) BVV-铜芯聚氯乙烯绝缘聚氯乙烯护套圆形电缆(电线) BLVV-铝芯聚氯乙烯绝缘聚氯乙烯护套圆形电缆(电线) BVVB-铜芯聚氯乙烯绝缘聚氯乙烯护套平形电缆(电线) BLVVB-铝芯聚氯乙烯绝缘聚氯乙烯护套平形电缆(电线) BV-90-铜芯耐热90℃聚乙烯绝缘电线 本产品适用于交流额定电压U/U450/750V及以下的动力、照明、日用电器、仪器仪表及电信设备用铜芯或铝芯聚氯乙烯绝缘电缆(电线) 二、低烟无卤系列产品 低烟无卤阻燃系列电缆电线,WDZ-(加普通型号的电缆电线代号)注:阻燃一般分A、B、C、D四类, 例如:WDZD-VY WDZA-YJY WDZB-YJV23 WDZC-BY WDZ-BVY WDZB-KYJY WDZC-KVV23等供固定(软电缆为移动式)敷设在额定交流电压U0/U为35kV及以下的室内、电缆桥架、电缆管道等固定场合的输配电力线路用,主要应用于高层建筑、医院、剧场、电站、地铁、隧道、舰船、海上石油平台、广播电视中心、计算机中心等人员密集、空间封闭的场所,电缆的额定电压应不低于供电系统的标称电压。

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