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品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商) ECO Engineering Change Order 工程改动要求(客户) PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序? SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size UmLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable制造业常用英文缩写ATO——按订单装配（Assemble……A）MTO——按订单生产（Make to Order）ETO——按订单设计MTS——库存生产（Make-to-Stock）PAPC——生产和流程控制（Production and Process Control）DHR——器械历史文件（Device History Record）NCR——不合格（Non-conformance）CAPA——纠正和预防措施（Corrective And Preventive Activity）NPV——净现值（Net Present Value）IRR——内部收益率（Internal Rate of Return）PP——回收期（Payback Period）SPC——统计过程控制（Statistic process control）BOM——物料清单（Bill of Material）OBOM——订单BOMMBOM——生产制造物料清单EBOM——工程设计BOMPBOM——工艺规划BOMSBOM——销售BOMPLM——产品生命周期管理（Product Lifecycle Management）PDM——产品数据管理（Product Data Management）CAD——计算机辅助设计（Computer Added Design）CAPP——计算机辅助工艺设计（Computer Aided Process Planning）KPI——关键绩效指标（Key Performance Index）SOA——面向服务架构（Service Oriented Architecture）WAN——广域网（Wide Area Network）LAN——局域网（Local Area Network）MAN——城域网（Metropolitan Area Network）TCP——传输控制协议（Transfer Control Protocol）IP——网际协议（Internet Protocol）ASN——预先发货通知（Advanced Shipment Notice）MHE——物料处理设备（Material Handling Equipment）EMEA——欧洲、中东和非洲CRM——客户关系管理（Customer Relationship Management）SCM——供应链管理（Supply Chain Management）BI——商业智能（Business Intelligence）LDAP——轻量级目录访问协议（Lightweight Directory Access Protocol）MRP——生产资源规划（Manufacturing Resource Planning）SFA——自动销售（Sales Force Automation）SCV——供应链可见性（Supply Chain Visibility）MDM——制造数据管理（Manafacturing Data Management）APS——高级计划系统（Advanced Planning System）CMMS——一体化维护管理系统CMMS——电脑化维修管理系统（computerized maintenance management system）HMI——人机界面（Human Machine Interface）OEM——原始设备制造商（Original Equipment Manafacturer）MES——制造执行系统（Manufacturing Execution System）CPG——消费包装产品（Customer Packaged Goods）Time to Market——即时上市/及时切入生产Time to Volume——即时量产/及时大量生产Time to Money——即时变现/及时大量交货AIT——自动验证技术（Automated IDentification Technologies）TAV——全部资产可视化（Total Assets Visualization）SCADA——数据采集和监视控制（Supervisory Control and Data Acquisition）OPC——用于过程控制的对象链接和嵌入（OLE for Process Control）ASRS——自动存贮与检索系统（Automatic Storage and Retrieval System ）BTO——订单生产（Build-to-Order）CTO——（Configuration-to-Order）VMI——供货商免费存放（Vendor Managed Inventory）MCT——制造周期时间（Manufacturing Cycle Time）ABC——作业制成本制度 (Activity-Based Costing)ABB——实施作业制预算制度 (Activity-Based Budgeting)ABM——作业制成本管理 (Activity-Base Management)APS——先进规画与排程系统 (Advanced Planning and Scheduling) ASP——应用程序服务供货商（Application Service Provider）ATP——可承诺量 (Available To Promise)AVL——认可的供货商清单(Approved Vendor List)BPR——企业流程再造 (Business Process Reengineering)BSC——平衡记分卡 (Balanced ScoreCard)BTF——计划生产 (Build To Forecast)CPM——要径法 (Critical Path Method)CPM——每一百万个使用者会有几次抱怨(Complaint per Million) CRM——客户关系管理 (Customer Relationship Management)CRP——产能需求规划 (Capacity Requirements Planning)CTO——客制化生产 (Configuration To Order)DBR——限制驱导式排程法 (Drum-Buffer-Rope)DMT——成熟度验证(Design Maturing Testing)DVT——设计验证(Design Verification Testing)DRP——运销资源计划 (Distribution Resource Planning)DSS——决策支持系统 (Decision Support System)EC——设计变更／工程变更 (Engineer Change)EC——电子商务 (Electronic Commerce)ECRN——原件规格更改通知(Engineer Change Request Notice)EDI——电子数据交换 (Electronic Data Interchange)EIS——主管决策系统 (Executive Information System)EMC——电磁相容(Electric Magnetic Capability)EOQ——基本经济订购量 (Economic Order Quantity)ERP——企业资源规划 (Enterprise Resource Planning)FAE——应用工程师(Field Application Engineer)FCST——预估(Forecast)FMS——弹性制造系统 (Flexible Manufacture System)FQC——成品质量管理 (Finish or Final Quality Control)IPQC——制程质量管理 (In-Process Quality Control)IQC——进料质量管理 (Incoming Quality Control)ISO——国际标准组织 (International Organization for Standardization) ISAR——首批样品认可(Initial Sample Approval Request)JIT——实时管理 (Just In Time)KM ——知识管理 (Knowledge Management)L4L——逐批订购法 (Lot-for-Lot)LTC——最小总成本法 (Least Total Cost)LUC——最小单位成本 (Least Unit Cost)MES——制造执行系统 (Manufacturing Execution System) MO——制令(Manufacture Order)MPS——主生产排程 (Master Production Schedule)MRO——请修(购)单(Maintenance Repair Operation)MRP——物料需求规划 (Material Requirement Planning) MRPII——制造资源计划 (Manufacturing Resource Planning) NFCF——更改预估量的通知Notice for Changing Forecast OEM——委托代工 (Original Equipment Manufacture)ODM——委托设计与制造 (Original Design & Manufacture) OLAP——在线分析处理 (On-Line Analytical Processing) OLTP——在线交易处理 (On-Line Transaction Processing) OPT——最佳生产技术 (Optimized Production Technology) OQC——出货质量管理 (Out-going Quality Control) PDCA——PDCA管理循环 (Plan-Do-Check-Action)PDM——产品数据管理系统 (Product Data Management) PERT——计划评核术 (Program Evaluation and Review Technique) PO——订单(Purchase Order)POH——预估在手量 (Product on Hand)PR——采购申请Purchase RequestQA——品质保证(Quality Assurance)QC——质量管理(Quality Control)QCC——品管圈 (Quality Control Circle)QE——品质工程(Quality Engineering)RCCP——粗略产能规划 (Rough Cut Capacity Planning) RMA——退货验收Returned Material ApprovalROP——再订购点 (Re-Order Point)SCM——供应链管理 (Supply Chain Management) SFC——现场控制 (Shop Floor Control)SIS——策略信息系统 (Strategic Information System) SO——订单(Sales Order)SOR——特殊订单需求(Special Order Request) SPC——统计制程管制 (Statistic Process Control) TOC——限制理论 (Theory of Constraints)TPM——全面生产管理Total Production Management TQC——全面质量管理 (Total Quality Control) TQM——全面品质管理 (Total Quality Management) WIP——在制品 (Work In Process)。
品保知识品保知识QC quality control 品质管理人员 FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 5.# t8 K8 o+ f- i6 Q6 \5 R& s紅線首件確認系統之落實及功能的發揮 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员 OQA output quality assurance 出货质量保证人员QE quality engineering 质量工程人员质量保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier qualityaudit 合格供货商质量评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收质量水平S/S Sample size 抽样检验样本大小 ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的 MIN Minor 轻微的Q/R/S Quality/Reliability/Service 质量/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece InspectionReport 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它质量术语类QIT Quality Improvement Team 质量改善小组ZD Zero Defect 零缺点QI Quality Improvement 质量改善 QP Quality Policy 目标方针TQM Total Quality Management 全面质量管理RMA Return Material Audit 退料认可 7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard InspectionProcedure 制程检验标准程序SOP Standard OperationProcedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范 SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准 CGOO China General PCE龙华厂文件 IWS International WorkmanStandard 工艺标准ISO International StandardOrganization 国际标准化组织GS General Specification 一般规格部类PMC Production & MaterialControl 生产和物料控制PCC Product controlcenter 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 质量工程(部) QA Quality Assurance 质量保证(处) QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程 R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单 D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original EquipmentManufacture 原设备制造PC Personal Computer 个人计算机 CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to 6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源)SQA Strategy Quality Assurance 策略质量保证DQA Design Quality Assurance 设计质量保证MQA Manufacture QualityAssurance 制造质量保证SSQA Sales and service Quality Assurance 销售及服务质量保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱 DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一 TPM Total ProductionMaintenance 全面生产保养MRP Material RequirementPlanning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical MagneticInterference 电子干扰RFI Read Frequency Input 读频输入 MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeLED lighting-emitting diode 发光二极管 QBR Quarter Business RecordCIP Continuous improvement process FGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable专业词汇 通用类president董事长operator作业员position职务general manager总经理special assistant 特助deputy manager |'depjuti| =vice manager副理 deputy supervisor =vice supervisor副课长 group leader组长line leader线长supervisor 课长responsible department负责单位Human Resources Department人力资源部Head count 人头数production department生产部门planning department企划部QC Section品管课stamping factory冲压厂painting factory烤漆厂molding factory成型厂administration/general affairs dept./总务部 production unit生产单位meeting minutes会议记录distribution department分发单位subject主题conclusion结论decision items决议事项pre-fixed finishing date预定完成日Color management 颜色管理Visual management 目视管理production capacity生产力first count初盘first check初盘复棹second count 复盘second check复盘复核quantity of physical inventory second count 复盘点数量physical inventory盘点数量physical count quantity账面数量difference quantity差异量spare parts physical inventory list备品盘点清单cause analysis原因分析waste materials废料description品名specification 规格model机种work order工令revision版次remark备注registration登记registration card登记卡to control管制application form for purchase请购单 consume, consumption消耗to notify通知to fill in填写to collect, to gather收集statistics统计cosmetic inspection standard 外观检验规范computer case 计算机外壳(组件)personal computer enclosure 计算机机箱产品front plate前板rear plate后板chassis |'∫æsi| 基座bezel panel面板Hood 上盖base pan 基座bezel 面板riser card 扩充卡flat cable 排线TOP driver cage 上磁架bottom driver cage 下磁架resin film 树脂膜raw materials原料materials物料steel plate钢板roll/coil material卷料spare parts =buffer备品plastic parts塑料件sheet metal parts/stamping parts 冲件 material check list物料检查表 finished product成品semi-finished product半成品good product/accepted goods/ acceptedparts/good parts良品defective product/non-good parts不良品 disposed goods处理品warehouse/hub仓库packing material包材basket蝴蝶竺plastic basket胶筐flow chart流程窗体production tempo生产进度现状lots of production生产批量manufacture procedure制程to revise, modify修订to switch over to, switch—to, switching over 切换engineering bottleneck, project difficulty工程瓶颈glove(s)手套glove(s) with exposed fingers割手套Band-Aid创可贴Industrial alcohol工业酒精broom扫把mop拖把vacuum cleaner吸尘器rag 抹布garbage container灰箕garbage can垃圾箱garbage bag垃圾袋liaison联络单rags抹布lamp holder灯架to mop the floor拖地to clean a table擦桌子air pipe 气管delivery deadline交货期die worker模工production, to produce生产equipment设备resistance电阻beacon警示灯coolant冷却液crusher破碎机club car高尔夫球车plate电镀power button电源按键reset button重置键forklift叉车Workshop traveler 天车trailer =long vehicle拖板车Hydraulic trolley手压车hydraulic hand jack油压板车casing = containerization装箱velocity速度 patent专利coordinate坐标supply and demand供求career card履历卡barricade隔板carton box纸箱to pull and stretch拉深work cell/work shop工作间sub-line支线bottleneck 瓶颈模具工程类plain die简易模pierce die冲孔模forming die成型模progressive die连续模stage die工程模compound die复合模shearing die剪边模riveting die铆合模feature die公母模male die公模female die母模cavity型控 母模core模心 公模die change 换模to fix a die装模to repair a die修模punch set上模座punch pad上垫板punch holder上夹板stripper pad脱料背板 up stripper上脱料板upper plate上模板lower plate下模板die pad下垫板die holder下夹板die set下模座bottom block下垫脚bottom plate下托板(底板)upper supporting blank上承板upper padding plate blank上垫板top plate上托板（顶板）top block上垫脚stripping plate内外打(脱料板)outer stripper外脱料板inner stripper内脱料板lower stripper下脱料板punch冲头insert入块(嵌入件)deburring punch压毛边冲子groove punch压线冲子stamped punch字模冲子round punch圆冲子special shape punch异形冲子bending block折刀roller滚轴baffle plate挡块located block定位块supporting block for location定位支承块air cushion plate气垫板air-cushion eject-rod气垫顶杆trimming punch切边冲子stiffening rib punch = stinger 加强筋冲子 ribbon punch压筋冲子reel-stretch punch卷圆压平冲子guide plate定位板sliding block滑块sliding dowel block滑块固定块die locker锁模器pressure plate =plate pinch压板thickness gauge厚薄规cutting die, blanking die冲裁模die block模块folded block折弯块sliding block滑块location pin定位销lifting pin顶料销die plate, front board模板padding block垫块stepping bar垫条panel board镶块to load a die装上模具to unload a die 御模具active plate活动板lower sliding plate下滑块板upper holder block上压块upper mid plate上中间板spring box弹簧箱spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板 bushing block衬套cover plate盖板guide pad导料块pilot导正筒trim剪外边pierce剪内边pocket for the punch head挂钩槽slug hole废料孔radius半径shim/wedge/heel/pad/spacer/gasket楔子 torch-flame cut火焰切割set screw止付螺丝form block折刀round pierce punch =die button圆冲子 shape punch =die insert异形子stock located block定位块metal plate钣金miller铣床grinder磨床tolerance公差score =groove压线sliding block滑块lathe车active plate活动板baffle plate挡块cover plate盖板groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板 capability能力 parameter参数factor系数driller钻床set up die架模height of die setting up架模高度analog-mode device类模器inner guiding post内导柱inner hexagon screw内六角螺钉dowel pin固定销coil spring弹簧lifter pin顶料销eq-height sleeves =spool等高套筒pin销lifter guide pin浮升导料销guide pin导正销wire spring圆线弹簧outer guiding post外导柱stop screw止付螺丝located pin定位销outer bush外导套press specification冲床规格die height闭模高度flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝stripper plate脱料板piston活塞handle mold手持式模具flash mold溢流式模具positive mold挤压式模具split mold分割式模具die lifter举模器top stop上死点bottom stop下死点one stroke一行程to continue, cont.连动to grip(material)吸料location lump, locating piece, location block 定位块reset复位to file burr 锉毛刺embedded lump |in'bed| mp|镶块Ù|l stamping-missing漏冲to tight a bolt拧紧螺栓to loosen a bolt拧松螺栓punched hole冲孔to cut edge =side cut =side scrap 切边 to bending折弯to pull, to stretch拉伸engraving, to engrave刻印stamping 油印to stake铆合designing, to design设计design modification 设计修改成 gauge(or jig)治具pedal踩踏板stopper阻挡器flow board流水板torque扭矩spline =the multiple keys花键 quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的forming成型(抽凸,冲凸)draw hole抽孔bending折弯emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线stamp letter冲字(料号)tick-mark nearside正面压印tick-mark farside反面压印冲压类punch, press冲punching machine 冲床 hydraulic machine油压机jack升降机decoiler整平机manufacture management制造管理 stamping, press冲压feeder送料机rack, shelf, stack料架taker取料机to reverse material 翻料to load material上料to unload material卸料to return material/stock to退料 scraped |'skræpid|报废 scrape ..v.刮;削robot机械手production line流水线packaging tool打包机packaging打包成型类well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器 spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleeve套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板 guide pin导销eject rod (bar)（成型机）顶业捧 subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口，直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆)slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口film gate薄膜浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口submarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口runner less无浇道sprue less 无射料管方式long nozzle延长喷嘴方式spur浇口;溶waste废料board广告牌sliding rack滑料架to impose lines压线to compress, compressing压缩character die字模to feed, feeding送料material change, stock change材料变更 feature change 特性变更prepare for, make preparations for 准备 rotating speed, revolution转速abnormal handling异常处理组装类Assembly line组装线Layout布置图Conveyer流水线运输带Rivet machine拉钉机Rivet gun拉钉枪 Screw driver起子Electric screw driver电动起子Hydraulic machine 液压机Pneumatic screw driver气动起子automation自动化to stake, staking, riveting铆合add lubricant oil加润滑油argon welding氩焊cylinder油缸robot机械手conveying belt输送带transmission rack输送架to draw holes抽孔bolt螺栓nut 螺母screw 螺丝identification tag标示单screwdriver plug起子插座automatic screwdriver电动启子to move, to carry, to handle搬运be put in storage入库packing包装staker = riveting machine铆合机fit together组装在一起fasten锁紧(螺丝)fixture 夹具(治具)pallet/skid栈板barcode条形码barcode scanner条形码扫描仪fuse together熔合fuse machine/heat stake热熔机processing, to process加工delivery, to deliver 交货to return delivery to. to send delivery back to return of goods退货easily damaged parts易损件standard parts标准件to lubricate润滑spring 弹簧spare tools location/buffer手工备品仓spare molds location模具备品仓tox machine自铆机烤漆类phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂main manifold主集流脉organic solvent有机溶剂 demagnetization去磁;消磁high-speed transmission高速传递 heat dissipation热传rack上料volatile挥发性degrease脱脂rinse水洗alkaline etch龄咬desmot剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔scraped products报放品disposed products处理品dismantle the die折模auxiliary function辅助功能heater band 加热片thermocouple热电偶derusting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response =reaction =interaction感应 ram连杆edge finder巡边器concave凸convex凹cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线grit沙砾granule =pellet =grain细粒sand blasting喷沙grit maker抽粒机 cushion缓冲fillet镶;嵌边roller pin formality滚针形式cam driver铡楔shank摸柄crank shaft曲柄轴品质类qualified products, up-to-grade products良品 defective products, not up-to-grade products 不良品defective product box不良品箱poor processing 制程不良poor incoming part来件不良exposed metal/bare metal金属裸露excessive defect过多的缺陷critical defect极严重缺陷major defect主要缺陷minor defect次要缺陷not up to standard不合规格cosmetic defect外观不良lack of painting烤漆不到位slipped screw head/slippery slipped thread滑丝missing part漏件wrong part错件oxidation氧化defective threading抽芽不良poor staking铆合不良deficient purchase来料不良deficient manufacturing procedure制程不良 cosmetic inspection外观检查inner parts inspection内部检查blister 气泡angular offset 角度偏差dent 压痕scratch 刮伤deformation 变形filings 铁削defective label 不良标签abrasion 磨损Breaking. (be)broken,(be)cracked 断裂short射料不足nick缺口speck瑕疪shine亮班splay 银纹gas mark焦痕delaminating起鳞speckle斑点mildewed =moldy = mouldy发霉 deformation变形burr(金属)flash(塑件)毛边poor staking铆合不良excessive gap间隙过大grease/oil stains油污inclusion杂质shrinking/shrinkage缩水mixed color杂色fold of packaging belt打包带折皱 painting make-up补漆discoloration羿色water spots水渍impurity 杂质Mismatch 错位failure, trouble 故障 deformation 变形rust 生锈peel 脱漆Shrink 缩水Contamination 脏污water spots 水渍Gap 间隙label error 标签错误Missing label 漏贴rejection criteria 拒收标准 Suspected rejects 可疑庇 abrasion 损伤、磨损Texture surface 印花纹表面 Streak 条纹stains 污点Blotch 斑点discoloration 脱色Inclusion 杂质slug mark 压痕dirt grime 灰尘blush 毛边薄膜 sink 下凹Hickey 漏漆labels and logos 贴纸与商标Configuration labels 组合贴纸corrugated container 瓦摆纸箱Delaminating 脱层splattering 散点Gouge 锉孔puckering 折痕品管七大手法层别法：stratification直方图：histogram柏拉图：plato diagram查检表：check sheet特性要因图：charateristic diagram散布图：scatter diagram管制图：control diagram一.產品1.Memory Socket: 記憶體插槽DIMM: Dual In Line Memory Module Socket 雙向記憶體擴充槽結構: Housing 塑膠Contact 端子---carrier 沿邊料+Bellow + tail + V-cutM.H.D. : Metal Hold Down 金屬卡勾Ejector2.H/D: Header結構: housing, contact, four wall, key, mating, stand off, tail, kink, pin, post3.F/C: Flat Cable扁平排線結構: IDC: Insulation Displacing Connector 絕緣刺破連接器Cover, S/R (Strain Relief), Cable二.制程1.Stranding wire: 絞線2.Cable extrusion: 線纜押出3.Stamping: 沖壓---Stretching wire 抽線4.Plating: 電鍍5.Molding: 成型---cavity, die /mold, core pin(公模,模仁), cavity pin (母模)6.Assembly: 裝配三.檢測與設備1.open-short test: 導通測試2.Hi-pot: 耐高壓測試3.Projector: 投影機4.callipers: 卡尺5.microscope: 顯微鏡6.multimeter: 萬用電表7.oven: 高溫爐8.salt spray tester: 鹽水噴霧機9.voltage resistant : 耐電壓測試10.e longation test: 伸長率測試11.s team aging: 蒸氣老化試驗12.w eight: 砝碼13.b alance: 天平四.Terms:Check檢查Inspect檢驗Sampling抽樣dimension (DIM)尺寸tolerance公差true position真位度revision (Rev.)版次quantity(Q’ty)數量quality質量work in process在制品specification (Spec.)規格normal正常tightened加嚴reduced減量critical defect (CRI.)嚴重缺點major defect (MAJ.)主要缺點minor defect (MIN.)次要缺點accept允收reject拒收waive特采scrap報廢rework重工sort挑選scale比例location位置reference (REF.)參考marking標記Appearance Inspection外觀檢驗Lead time (L/T)前置時間Line down斷線Warehouse倉庫Inventory庫存Pallet棧板Carton紙箱Packing包裝Gold金Nickel鎳Tin錫Lead鉛五.縮寫1.B/M: Board Mount2.PBG: Products Business Group3.3C: Computer, Communication, Consumer4.ZD: Zero Defect5.VP: Vice President6.MGR: Manager7.QC: Quality Control8.QA: Quality Assurance9.TQC: Total Quality Control10.TQA: Total Quality Assurance11.IPQA: In Process Quality Audit12.IPQC: In Process Quality Control13.FQC: Final Quality Control14.OBA: Out of Box Audit15.IQC: Incoming Quality Control16.OQC: Outgoing Quality Control17.QE: Quality Engineer18.PQE: Process Quality Engineer19.FAE: Field Application Engineer20.PM: Product Market21.C/N: Customer Number22.P/N: Part Number23.SOP: Standard Operation Procedure24.PMP: Product Management Plan25.ECN: Engineering Change Notice26.VDCS: Vendor Defects Correction Sheet27.SWR: Special Work Request28.FAR: Failure Analysis Report29.CAR: Corrective Action ReportTF: Customer Complaint Track Form31.CSTF: Customer Service Track Form32.FMEA: Failure Mode & Effect Analysis33.QAN: Quality Alarm Notice34.AVL: Approved Vendor List35.BOM: Bill of Material36.WDR: Weekly Delivery Requirement37.TIP: Tip Innovation Plan38.QCC: Quality Control Circle39.QIT: Quality Improvement Team40.5W1H: When, Where, Who, What, Why,How41.5M: Man, Machine, Material, Method,Measurement42.FAI: First Article Inspection43.AQL: Accept Quality Level44.SPC: Statistical Process Control45.LRR: Lot Reject Rate46.DPM: Defect Per Million47.PPM: Parts Per Million48.GRR: Gauge Repeatability andReproducibility49.ISO: International Standard Organization50.UL: Underwriters Laboratories Inc.美國保險協會51.CSA: Canadian Standards Association加拿大標準協會52.ANSI: American National StandardInstitute 美國標准協會53.QMC: Quick Measurement Center54.MRB: Material Review Board55.IE: Industry Engineering56.ME: Mechanical Engineering57.FYI: For Your Information58.TBA: To Be assigned59.ETD: Estimated Time Of Delivery60.ETA: Estimated Time Of Arrival61.PCB: Printed Circuit Board62.SMT: Surface Mount Technology63.PC: Personal Computer64.HDD: Hard Disk Drive65.FDD: Floppy Disk Drive66.CPU: Central Processing Unit67.CD: Compact Disk68.CD-ROM: Compact Disk Read Only Memory六.藍圖英語1.DIMM (take 318-0000-075 as an example) Notes: Unless otherwise specified1)Interpret drawings per ANSIY14.5M-19822)Dimensions marked ▼to be checkedby QC.Dimensions marked ▽to be checked by process control and QC.3)Solder tail true positions should bechecked using PCB gage No.850-0841-4914)Ejectors should be securely mountedonto the housing.5)The top section of the contacts shouldtouch the housing preload stopper.6)Retention force: 0.34kg min per contact.7)The lot identification code is marking bylaser coding and the location isapproximately as shown with a height1.2mm. This lot identification code isspecified as follows:Week / The last two digit A.D year8)The lot identification code is marking bylaser coding and the location at rightejector. (only for AT0841*-K8F)9)Dimension marked: DIM.F ▼waschanged from 1.00+0.10/-0.15 to1.00+0.10/-0.20 for product which HSG is002-2203-232 or 002-3203-232.1)Name (Intended use): DIMM 168 T/HFORMING TYPE2)These drawings and specification are theproperty of Hon Hai Precision Ind. Co.,Ltd. and shall not be reproduced, copiedor used in any manner without the priorwritten consent of Hon Hai Precision Ind.Co., Ltd.2.Contact (take 050-0000-897 as an example)1)Material: phosphor bronze (磷青銅)C5210R-SH, per spec.904-****-104,0.25 mm thick.2)Camber (扇形)allowable: 5 mm /1000mm max.3)Twist (扭/翹曲)allowable: 90°/ 1000mm max.4)Allowable burr(毛頭): 0.03mm max5)Accumulative tolerance for 92 pinsshould be within +/-0.20mm.6)Per tool maker’s option.7)True position spec.8)No burrs or stamping marks are allowedin the coining area.10) The maximum deviation per 8 continuous bellows when taking carrier asthe datum is 0.08mm.3.Housing (take 002-0000-232 as an example)1)Material:P/N: 901-0212-016, LCP L140, black, for 002-0***-2322)Dimensions shall be interpreted per ANSIY14.5M-2323)Draft angles (拔模角度)can’t be greaterthan 1.0°per side.4)Max. allowable flash 0.03mm thick by0.1mm.5)The “FOXCONN” logo is specified on thehousing as shown with 0.05mm max. inheight above surface.6)All sharp corners have RADII (半徑)ofR0.10mm max.7)The cavity No. is located approx. asshown, with a maximum height of0.05mm above the surface.8)PIN No.: Depth below surface 0.15mmmax., and 1.5mm in height.9)Suggest drafting angle: 0.5°max.10)V oltage marking: depth below surface0.15mm max. with 1.5mm height,3.3V or 5.0V refer to part No.11)R AM marking: depth below surface0.15mm max., with 1.5mm height, “DRAM” or “SDRAM” refer to part No.12)T he mark alphabet “L” or “A” is locatedapprox. as shown with amaximum height of 0.05m above the surface.13)H ousing P/N: 002-4***-232 remove the“U” appearance gap. So the dimension was changed from 1.27+0.03/-0.05 to 1.45+/-0.08. Others still keep original.4.F/C (take 315-0700-855 as an example)1)G: Refer to common ground2)Denotes wire position NO. 1 with redstrip mark on flat cable.3)Printing with ink on this approximatearea, characters to be 3.0 mm. heightwith color blue.4)YY present the year, WW present week ofthe year.5)“*” present the manufacturing locationcode.Blue/Black/gray/equivalent vendor P/N/stranded/solid/conductor/insulator/pin 28 removed/key no. 20 molded /SYS BRD/DRIVE1/CABLE POS.67 CUT-OFF5.Cable (take 701-3200-001 as an example)1)Wire no.1 is in red color.2)UL style: 26783)Pitch tolerance is non-cumulative.4)Minimum insulation to be 0.15mm at anypoint.5)Finish to be smooth and free of voids.6)Rated at 150v, 105℃, vw-1, FT1.7)Items of inspection:Dielectric test(耐電壓測試): 1.5kv 1 minute without any breakdown.DC resistance of conductor(直流導體阻抗): max. 589/km at 20℃.Spark test(火花測試): 1.5kvElongation (伸長率)100% min., retention 65% min. (136℃, 168hr)Cold bend(冷彎試驗): -20℃no crackDeformation(熱變形測試): max. 50% at 121℃Flame test(耐燃性測試): vw-18)Marking:It must be listed in one row near the red strip with text length 2-3mm, at every 300mm. Where “********”is a code of expressing the line no. and date when the cable is made.。
Rev. 0.1–27.10.20231®2GBIGBT M7 ModulesSKM200GB12M7Target Data Features*•V CE(sat) with positive temperature coefficient•High overload capability•Low loss high density IGBT´s•Fast & soft switching inverse CAL diodes•Large clearance (10 mm) and creepage distances (20 mm)•Insulated copper baseplate using DBC Technology (Direct Bonded Copper) •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Electronic welders •Wind power •Public transportRemarks•Max. case temperature limited to T C = T S = 125 °C•Product reliability results are valid for T j = 150 °C (recommended T j,op = -40...+150 °C)•For storage and case temperature with TIM see document: ″Technical Explanations Thermal Interface Materials ″Absolute Maximum Ratings SymbolConditions Values UnitIGBT V CES 1200V I C T j =175°CT c =25°C 282A T c =80°C214A I Cnom 200A I CRM400A V GES -20 (20)V t psc V CC =800V V GE ≤ 15V V CES ≤ 1200 VT j =150°C8µs T j -40...175°C Inverse diodeV RRM T j =25°C 1200V I F T j =175°CT c =25°C 217A T c =80°C163A I FRM 400A I FSM t p =10ms, sin 180°, T j =25°C1180A T j -40...175°C Module I t(RMS)200A T stg module without TIM -40...125°C V isolAC sinus 50 Hz, t =1min4000VCharacteristics SymbolConditionsmin.typ.max.UnitIGBT V CE(sat)I C =200A V GE =15V chiplevel T j =25°C 1.55 1.88V T j =150°C 1.85V V CE0chiplevel T j =25°C 0.85 1.02V T j =150°C 0.75V r CE V GE =15V chiplevelT j =25°C 3.5 4.3m ΩT j =150°C5.5m ΩV GE(th)V CE = 10 V, I C =20mA5.466.6V I CES V GE =0V,V CE =1200V, T j =25°C 2.0mA C ies V CE =10V V GE =0Vf =1MHz 37.0nF C oes f =1MHz 1.18nF C res f =1MHz0.42nF Q G V GE =-8V ... + 15V 1780nC R Gint T j =25°C 2.0Ωt d(on)V CC =600V I C =200AV GE =+15/-15VT j =150°C t.b.d.ns t r T j =150°C t.b.d.ns E on T j =150°C 21mJ t d(off)T j =150°C t.b.d.ns t f T j =150°C t.b.d.ns E off T j =150°C 22mJR th(j-c)per IGBT0.195K/W R th(c-s)per IGBT, P12 (reference)t.b.d.K/W R th(c-s)per IGBT, HP-PCMt.b.d.K/W2Rev. 0.1–27.10.2023© by SEMIKRON®2GBIGBT M7 ModulesSKM200GB12M7Target Data Features*•V CE(sat) with positive temperature coefficient•High overload capability•Low loss high density IGBT´s•Fast & soft switching inverse CAL diodes•Large clearance (10 mm) and creepage distances (20 mm)•Insulated copper baseplate using DBC Technology (Direct Bonded Copper) •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Electronic welders •Wind power •Public transportRemarks•Max. case temperature limited to T C = T S = 125 °C•Product reliability results are valid for T j = 150 °C (recommended T j,op = -40...+150 °C)•For storage and case temperature with TIM see document: ″Technical Explanations Thermal Interface Materials ″Characteristics SymbolConditionsmin.typ.max.UnitInverse diodeV F = V EC I F =200AV GE =0V chiplevelT j =25°C 2.21 2.59V T j =150°C 2.31V V F0chiplevel T j =25°C 1.33 1.53V T j =150°C 1.03V r Fchiplevel T j =25°C 4.4 5.3m ΩT j =150°C 6.4m ΩI RRM I F =200A V GE =-15V V CC =600V T j =150°C t.b.d.A Q rr T j =150°C t.b.d.µC E rr T j =150°C15mJR th(j-c)per diode0.245K/W R th(c-s)per diode, P12 (reference)t.b.d.K/W R th(c-s)per diode, HP-PCMt.b.d.K/W Module L CE 30nH R CC'+EE'measured per switchT C =25°C 0.65m ΩT C =125°C1.09m ΩR th(c-s)1calculated without thermal coupling t.b.d.K/W R th(c-s)2including thermal coupling,T s underneath module, P12 (reference)t.b.d.K/W R th(c-s)2including thermal coupling,T s underneath module, HP-PCM -K/WM s to heat sink M635Nm M t to terminals M52.55Nm -Nm w160g© by SEMIKRON Rev. 0.1–27.10.20233GBIMPORTANT INFORMATION AND WARNINGSThis is an electrostatic discharge sensitive device (ESDS) according to international standard IEC 61340.*The specifications of Semikron Danfoss products may not be considered as any guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of Semikron Danfoss products describe only the usual characteristics of Semikron Danfoss products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Resulting from this, application adjustments of any kind may be necessary. Any user of Semikron Danfoss products is responsible for the safety of their applications embedding Semikron Danfoss products and must take adequate safety measures to prevent the applications from causing any physical injury, fire or other problem, also if any Semikron Danfoss product becomes faulty. Any user is responsible for making sure that the application design and realization are compliant with all laws, regulations, norms and standards applicable to the scope of application. Unless otherwise explicitly approved by Semikron Danfoss in a written document signed by authorized representatives of Semikron Danfoss, Semikron Danfoss products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Semikron Danfoss does not convey any license under its or a third party’s patent rights, copyrights, trade secrets or other intellectual property rights, neither does it make any representation or warranty of non-infringement of intellectual property rights of any third party which may arise from a user’s applications.4。
分式的混合运算1.约分把一个分式的分子与分母的公因式约去，叫做约分．约分的依据是分式的基本性质. 若分式的分子、分母是多项式,必须先把分子、分母分解因式，然后才能约去公因式．分子与分母没有公因式的分式,叫做最简分式，又叫做既约分式．分式的运算结果一定要化为最简分式.2.分式的乘法3.分式的除法 4．分式的乘方求n 个相同分式的积的运算就是分式的乘方,用式子表示就是(ba ）n． 分式的乘方,是把分子、分母各自乘方.用式子表示为:例1、下列分式a bc 1215，a b b a --2)(3,)(222b a b a ++,ba b a +-22中最简分式的个数是( ).Ａ.1 Ｂ.2 Ｃ．3 D.4例2.计算:3234)1(x y y x • aa a a 2122)2(2+⋅-+ x y xy 2263)3(÷41441)4(222--÷+--a a a a a 例3、 若432zy x ==,求222z y x zx yz xy ++++的值．例4、计算（1）3322）（c b a - （2）43222)()()(x y x y y x -÷-⋅- （３）2332)3()2(cb a bc a -÷- (4）232222)()()(xy xy xy x y y x -⋅+÷-例6.计算:2018119171531421311⨯+⨯++⨯+⨯+⨯例7、已知21)2)(1(12++-=+-+x Bx A x x x ,求A ． B 的值。
计算下列各题：（1）2222223223x y yx y x y x y x y x ----+--+ (２）1111322+-+--+a a a a ．（3)29631a a --+ (４) 21x x -－x -1 （5)3a a -－263a a a +-＋3a，(６)xy yy x x y x xy --++-222 ⑺b a b b a ++-22 ⑻293261623x x x -+--+⑼xy y x y x y x 2211-⋅⎪⎪⎭⎫ ⎝⎛+-- ⑽ 222x x x +-－2144x x x --+(11）a a a a a a 4)22(2-⋅+--.２．已知x 为整数，且918232322-++-++x x x x 为整数，求所有的符合条件的x 的值的和.3、混合运算:⑴2239(1)x x x x ---÷ ⑵232224xx x x x x ⎛⎫-÷ ⎪+--⎝⎭⑶ a a a a a a 112112÷+---+⑷ 444)1225(222++-÷+++-a a a a a a ⑸ )1x 3x 1(1x 1x 2x 22+-+÷-+-⑹ )252(23--+÷--x x x x ⑺221111121x x x x x +-÷+--+⑻2224421142x x x x x x x -+-÷-+-+ ⑼2211xy x y x y x y ⎛⎫÷- ⎪--+⎝⎭⑽ （ab b a 22+＋2）÷b a b a --22 ⑾22321113x x x x x x x +++-⨯--+（12) xx x x x x x x x 416)44122(2222+-÷+----+ (13）、22234()()()x y y y x x -⋅-÷-(14))252(423--+÷--m m m m (15)、x x x x xx x --+⋅+÷+--36)3(446222（１6）、 ()3212221221------⎪⎭⎫ ⎝⎛ba cb b a (１7)、⎪⎭⎫ ⎝⎛---÷⎪⎪⎭⎫ ⎝⎛+--x x x x x 23441823224．计算：x xx x x x x x -÷+----+4)44122(22,并求当3-=x 时原式的值．5、先化简，x x x x x x11132-⋅⎪⎭⎫ ⎝⎛+--再取一个你喜欢的数代入求值:6、有这样一道题:“计算22211x x x -+-÷21x x x-+-x 的值，其中x ＝2 004”甲同学把“x=2 ００4”错抄成“x=2 040”，但他的计算结果也正确,你说这是怎么回事? 7、计算、)1(1+a a ＋)2)(1(1++a a +)3)(2(1++a a ＋…+)2006)(2005(1++a a 。
