Preparation and dielectric properties of highly preferred-(100
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尖晶石型陶瓷材料的结构,性质及应用探究摘要:分析了尖晶石的晶体结构,几种不同的类型以及其的性质,重点就尖晶石型陶瓷材料的介电、磁性能以及半导性质进行了阐述,并对其应用做了简单表述。
关键词:尖晶石型结构特征性质与应用1.序言从广义上讲,尖晶石是指所有属于尖晶石族的矿物,它们多是由熔融的岩浆侵入到不纯的灰岩或白云岩中,经过接触变质作用而形成,化学通式是AO·B2O3或AB2O4,其中,A 代表二价金属离子,例如镁、铁、镍、锌,B代表三价金属离子[1],例如铝、铁、铬、锰。
人们通常以B位离子来命名,如铝尖晶石、铁尖晶石、铬尖晶石。
而习惯于把铝镁尖晶石称为尖晶石。
2.尖晶石的晶体结构特征尖晶石的晶体结构属于七大晶系中的等轴晶系,六八面体晶类Oh-m3m(3L44L36L29PC)。
常呈八面体晶形,有时与菱形十二面体和立方体成聚形。
常依(111)为双晶面和接合面构成尖晶石律双晶。
基本结构是四面体与八面体层相间,四面体与八面体数之比为1:2。
氧原子为立方紧密堆积,即氧按ABC的顺序在垂直于(111)晶面的方向紧密堆积。
三价金属阳离子占据六次配位的八面体空隙,二价金属阳离子占据四次配位的四面体空隙。
这种结构称为正常尖晶石型结构。
若二价金属阳离子和半数三价金属阳离子占据八面体空隙,另半数三价金属阳离子占据四面体空隙,则构成反尖晶石型结构[1]。
如TiMg2O4,TiZn2O4,TiMn2O4。
除此之外还有混合型中间状态的存在。
最后使每个晶胞中的8/64的四面体间隙和16/32的八面体间隙被填充。
根据经验数据可将大部分二、三价离子的优先顺序排出:Zn2+,Cd2+,Ga2+,In3+,Mn2+,Fe3+,Mn3+,Fe2+,Mg2+,Cu2+,Co2+,Ti3+,Ni2+,Cr3+,越往前倾向于四面体填隙,反之则倾向于八面体填隙[2]。
尖晶石族矿物有很多种固溶体,这是因为尖晶石中类质同象替代现象很普遍,在晶体结构不改变或晶格没有任何变形的情况下,其中的组分可以被这组矿物中的其他组分大量的代替。
《聚合物基复合材料》课程介绍与修读指导建议课程中英文名称:聚合物基复合材料(Polymer Based Composites Materials)课程编号:B03080100课程性质:专业课开设学期及学时分配:第五学期, 32学时,每周2学时。
适用专业及层次:复合材料与工程专业,本科生先行课程:高分子物理,高分子化学后续课程:复合材料原理,复合材料工艺与设备;高性能纤维;聚合物基体教材:《聚合物基复合材料》王汝敏, 郑水蓉, 郑亚萍。
科学出版社; 第2版(2011年4月1日) 推荐参考书1.《复合材料学》。
张以河。
化学工业出版社。
2011年2月1日。
2.《聚合物基复合材料》。
陈宇飞。
化学工业出版社。
2010年7月。
3.《复合材料学》。
周祖福主编。
武汉理工大学出版社,2008年。
课程目的与内容:通过学习,能够掌握聚合物基复合材料的概念、特性、应用与进展,初步了解聚合物基复合材料的基体、增强体的结构与性能,以及基体与增强体之间的界面结合原理,复合材料的制备工艺和流程,能够按照产品性能要求设计并制备一些简单的聚合物基复合材料,并对复合材料的结构、性能进行科学研究分析,初步掌握半成品制备与复合材料的成型原理,固化工艺参数制定和质量控制;并能够用细观力学方法分析复合材料的基本力学性能,复合材料的各向异性及其层板的力学性能;了解复合材料的断裂与损伤、冲击、疲劳、蠕变等性能及其影响因素。
课程学习内容是聚合物基复合材料的基本概念、聚合物基体、增强体的结构与性能,以及材料复合原理、破坏原理、复合材料成型方法与工艺,以及聚合物基复合材料的力学性能与应用。
课程修读指导建议:掌握聚合物基复合材料的基本概念、特性、应用和进展;熟悉聚合物基体和增强体的种类、结构与性能特点;初步掌握聚合物基体与增强体之间的界面复合原理,以及聚合物基复合材料的成型工艺特点,特别是不同成型方法的特点;了解聚合物基复合材料的力学性能、高频介电等性能及其应用。
CHEMICAL INDUSTRY AND ENGINEERING PROGRESS 2011年第30卷第8期·1800·化工进展纳米银/环氧树脂复合材料的制备及其介电性能苏丽,马寒冰,杨莉,李秀云(西南科技大学材料科学与工程学院,四川绵阳 621010)摘要:以硝酸银为原料,用聚乙烯吡咯烷酮(PVP)作保护剂,在N,N-二甲基甲酰胺(DMF)溶液中,通过光化学反应法分别合成了平均粒径为80 nm、100 nm、120 nm的银胶,并用扫描电子显微镜及激光粒度仪测试了其分散程度和粒径正态分布;采用溶液-超声法制备了纳米Ag/环氧树脂复合材料;采用XRD、FTIR表征了纳米Ag对环氧树脂的改性结果,并详细讨论了纳米Ag粒径及含量对复合材料介电性能的影响。
结果表明:一定尺寸和分布的纳米金属粒子能够提高聚合物的击穿强度,纳米Ag的粒径越小,击穿强度的提升越明显;并且在固定粒径时,聚合物的击穿强度随着Ag的含量提高出现先增加又降低的趋势,介电常数和介电损耗却出现了先降低后增加的趋势,这种特殊的现象可以用库伦阻塞效应限制电荷运动的理论来解释。
关键词:纳米银;环氧树脂;库伦阻塞效应;电性能中图分类号:TQ 32 文献标志码:A 文章编号:1000–6613(2011)08–1800–06 Preparation and dielectric properties of nano-silver/epoxy compositesSU Li,MA Hanbing,YANG Li,LI Xiuyun(School of Materials Science and Engineering,Southwest University of Science and Technology,Mianyang 621010,Sichuan,China)Abstract:Using silver nitrate(AgNO3)as raw material and polyvinylpyrrolidone(PVP)as protective agent,nano-silver with average size of 80 nm,100 nm,120 nm was prepared by UV chemical reaction in N,N-dimethylformamide(DMF)solution. Scanning electron microscopy and laser particle size analyzer were used to investigate the degree of dispersion and particle size of nano-silver. Nano Ag/epoxy composite was prepared by solution-ultrasonic method and was characterized with XRD,FT-IR spectroscopy. The effects of nanoparticle size and content of Ag on the electrical properties of composite were discussed. A specific size and distribution of nano-silver could increase the breakdown strength of the epoxy. The smaller the particle size of nano-Ag was,the more obvious enhancement of breakdown strength was observed. The dielectric strength of epoxy increased with increasing Ag content at first,and then decreased. Dielectric constant and dielectric loss of the composite had little change. It was assumed that the silver did not increase the system dielectric loss. These particular phenomena could be explained by “Coulomb blockade effect”. A theoretical and experimental basis for the dielectric properties of modified epoxy resin was provided.Key words:nano-silver;epoxy resin;Coulomb blockade effect;electrical properties环氧树脂作为一种良好的绝缘材料被广泛应用,然而,随着电力设备向大容量、高电压发展,击穿强度也成为了考察材料绝缘性能的重要参数。
锶掺杂的钛酸钡陶瓷制备及介电性能巩晓阳;李允令;李伟杰【摘要】钛酸钡作为一种高介电材料,在相变温度120℃附近具有较大的介电常数,为了更好应用于电子陶瓷材料中,需添加锶、锆、硅等掺杂物降低其相变温度至室温附近。
本文用固相反应法制备了多种比例锶掺杂的钛酸钡陶瓷(Ba1-xSrxTiO3)。
在不同频率下对其介电性能与相变温度做了对比研究。
研究结果表明:一定比例锶掺杂能提高钛酸钡陶瓷的有效介电常数,同时随着掺杂比例增加可使相变温度向低温方向移动。
x=0.3的锶掺杂比例使钛酸钡的相变温度移至室温附近,介电常数高于6000,满足了一般电容器的工作环境要求。
【期刊名称】《河南科技大学学报(自然科学版)》【年(卷),期】2014(000)004【总页数】4页(P92-95)【关键词】钛酸钡;钛酸锶钡陶瓷;介电性能;固相法【作者】巩晓阳;李允令;李伟杰【作者单位】河南科技大学物理工程学院,河南洛阳 471023; 河南科技大学洛阳市光电功能材料重点实验室,河南洛阳 471023;河南科技大学物理工程学院,河南洛阳 471023; 河南科技大学洛阳市光电功能材料重点实验室,河南洛阳471023;河南科技大学物理工程学院,河南洛阳 471023; 河南科技大学洛阳市光电功能材料重点实验室,河南洛阳 471023【正文语种】中文【中图分类】O484钛酸钡作为一种高介电材料,是电子陶瓷中使用最广泛的材料之一[1-6]。
但纯钛酸钡陶瓷的相变温度(居里点)约为120℃,此时具有最大的介电常数,而室温时介电常数较小,同时其较高的温度系数及随电压和频率的变化具有不稳定性,使其应用受到极大的局限,通常通过添加锶、锆、硅等掺杂物可以有效地改善它的性质[4-9]。
钛酸锶钡陶瓷因具有较高的电容率,低介电损耗,优良的铁电、压电、耐压和绝缘性能,广泛应用于体积小而容量大的微型电容器、热敏电阻、超大规模动态随机存储器、调谐微波器件等,是一种重要的电子陶瓷材料。
344电子显微学报J.Chin.Eleetr.Microsc.Soc第28卷4000EX型)在原子尺度研究BT纳米粉体的表面结构。
利用GatanCCD(Model794)记录TEM、HRTEM和选区电子衍射花样(SAED)。
裹1水热合成BaTi03纳米晶体所用的原料和反应介质Table1St*rangmaterialsandreadivemⅨliausedforhydrothermalsynthesisofBaTiOjnanocrystalsNo.竺竺竺!竺[Ba,_ri]一R。
帆media.————”~一艮∞6”BapreetmⅡTiplec㈣molⅡratio’volumeratioofl:1,EG:ethyleneglycol2结果与讨论2.1BT纳米晶的尺寸和形貌SEM和TEM的结果表明BT纳米晶的尺寸和形貌不仅与水热反应前驱体的Ba/Ti摩尔比有关,而且与水热反应介质也相关。
首先讨论水热反应前驱体的B“Ti摩尔比对BT纳米晶的尺寸和形貌的影响。
图1为采用不同Ba/Ti摩尔比的前驱体水热合成BT纳米晶体的TEM照片。
从图1a和lb可以看到,在前驱体的Ba/Ti摩尔比较小时,BT纳米晶呈现多面体形状,而不是球状;纳米晶尺寸分布呈现双峰分布(大的和小的多面体形状)。
随着前驱体Ba/Ti摩尔比的增加,BT纳米晶的形貌逐渐变为长方体,立方体,晶粒的平均尺寸也增大(图1a一1d中的晶粒平均尺寸分别为170,180,190,260nm)。
这种现图l采用不同Ba/Ti摩尔比的前驱体水热合成BaTi03纳米晶体的TEM照片(Bar=200nm)。
样品a:BTl(I:1);b:81"2(2:1);c:BT3(3:1);d:BT4(4:1)Fig.1TEMimagesofthehydrothermalBaTi03(BT)nanocrystalssynthesizedatdifferentBa/Timolarrati06iIItheprecursors(Bar--200ilnl).a.-BTI(1:1);b:BT2(2:1);c:BT3(3:1);d:B'r4(4:1)第4期朱信华等:水热反应条件对BaTiO,纳米晶形成的影响及其原子尺度表面结构345图2不同水热反应介质条件下合成BaTiq纳米晶体的SEM(a—e)和TEM(d—f)照片(前驱体的B“Ti摩尔比固定为3:1)。
溶胶-凝胶法制备氧化铝绝缘薄膜及其电性能研究单威;姚曼文;胡保付;杨鹏飞;姚熹【摘要】以乙二醇乙醚为溶剂,异丙醇铝为前驱物,乙酰丙酮为螯合剂,采用溶胶-凝胶法和旋转涂覆工艺,在不同衬底上制备了氧化铝薄膜.通过X射线衍射仪(XRD)、场发射扫描电子显微镜(FESEM)和金相显微镜等手段对薄膜的微观结构和表面形貌进行了表征.结果表明,溶胶-凝胶法制得的薄膜为无定形结构,表面均匀、致密、无裂纹.通过对薄膜电流密度与电场和时间(J-E和J-t)曲线的测量,对薄膜的电学性能进行了研究.薄膜击穿场强约为2.0~3.0MV/cm,在电场强度为0.5MV/cm时,漏电流密度约为9.0×10-6 A/cm2.%Aluminum oxide thin films were prepared on various substrates by the sol-gel spin-coating process from a stable coating sol using 2-ethoxyethanol as solvent, aluminum isopropoxide as precursor and acetylace-tone as chelating agent. The microstructure and the surface morphology of sol-gel films were characterized by X-ray diffraction (XRD), field emission scanning electron microscope (FESEM) and metallurgical microscope. The results indicate that the thin films obtained are uniform, dense,crack-free and amorphous in structure. The J-E and J-t curves were measured to study the electrical properties of the films. When electric field strength is 0. 5 MV/cm, the leakage current density is about 9.0 × 10-6A/cm2. The breakdown electric field Eb of the films is in the range of 2. 0-3. 0 MV/cm.【期刊名称】《功能材料》【年(卷),期】2013(044)004【总页数】4页(P581-584)【关键词】氧化铝薄膜;溶胶-凝胶法;无定形;J-E曲线【作者】单威;姚曼文;胡保付;杨鹏飞;姚熹【作者单位】同济大学功能材料研究所,上海200092【正文语种】中文【中图分类】TB3211 引言随着无线通信技术的飞速发展,电子器件越来越朝着微型化、薄膜化、集成化的方向发展,而介质薄膜是许多新型元器件和各种集成电路的主要材料之一。
工 程 塑 料 应 用ENGINEERING PLASTICS APPLICATION第49卷,第3期2021年3月V ol.49,No.3Mar. 20211doi:10.3969/j.issn.1001-3539.2021.03.001P(VDF–HFP)/BST 纳米复合薄膜的制备及介电、储能性能梅文臣1,2,3,魏金栋2,柯振瑜2,胡静1,3,4(1.常州大学材料科学与工程学院,江苏省材料表面科学与技术重点实验室,江苏常州 213164; 2.奥本大学材料研究与教育中心,美国奥本 36849;3.常州大学材料科学与工程国家实验示范中心,江苏常州 213164;4.常州大学江苏省光伏科学与工程协同创新中心,江苏常州 213164)摘要:采用溶液铸造法,以聚(偏氟乙烯–六氟丙烯) [P(VDF–HFP)]为基体、钛酸钡锶(BST)为填料制备了纳米薄膜材料。
对薄膜的物相组成和微观形貌进行了表征,研究了BST 含量对薄膜介电性能和储能性能的影响。
结果表明,随着BST 含量的增大,薄膜的介电常数显著上升,介电损耗在中、高频区域有所下降,击穿强度逐渐减小,薄膜的充电能量密度显著增大;介电常数的实测值与Maxwell-Wagner 理论模型计算值基本吻合,表明填料和基体结合良好,薄膜材料内部组织均匀,无明显缺陷。
此外,从实际应用的角度讲,外加电场强度低于800 kV /cm 或介于800~2 100 kV /cm 时,为了获得最大的放电能量密度,应分别选用BST 体积分数为30%或20%的P(VDF–HFP)/BST 复合薄膜材料。
关键词:纳米复合薄膜;溶液铸造;聚(偏氟乙烯–六氟丙烯);钛酸钡锶;介电性能;储能性能中图分类号:TQ325.4 文献标识码:A 文章编号:1001-3539(2021)03-0001-06Preparation ,Dielectric Properties and Energy-storage Properties of P(VDF–HFP)/BST Nanocomposite FilmsMei Wenchen 1, 2, 3, Wei Jindong 2, Ko Zhen-Yu 2, Hu Jing 1,3, 4(1. Jiangsu Key laboratory of Material Surface Science and Technology , School of Material Science and Engineering , Changzhou University ,Changzhou 213164, China ; 2. Materials Research and Education Centre , Auburn University , Auburn , AL 36849, USA ;3. National Experimental Demonstration Centre for Materials Science and Engineering , Changzhou University , Changzhou 213164, China ;4. Jiangsu Collaborative Innovation Centre of Photovoltaic Science and Engineering , Changzhou University ,Changzhou 213164, China)Abstract :Nanocomposite films were prepared by solution casting method with poly(vinylidene fluoride-hexafluoropropylene) [P(VDF–HFP)] as matrix and barium strontium titanate (BST) as filler. The phase composition and micro-structure of the films were characterized ,and the effects of BST content on the dielectric properties and energy-storage properties of the films were investigated. The results show that with the increase of BST content ,the dielectric constant (εr ) of the film increases significantly ,the dielectric loss (tan δ) decreases in the middle and high frequency region ,the breakdown strength (E b ) decreases gradually and the charge energy density (U charge ) increases greatly. The measured values of εr are in good agreement with calculated value of Maxwell-Wagner theo-retical model ,which indicates that the combination of the filler and matrix is good ,the microstructure of films is uniform ,and there is no obvious defect. In addition ,from the perspective of practical application ,when the applied electric field intensity (E ) is lower than 800 kV /cm or between 800 kV /cm and 2 100 kV /cm ,in order to obtain the maximal discharge energy density (U discharge ),the P(VDF–HFP)/BST composite with BST content of 30 vol% or 20 vol% should be selected respectively.Keywords :nanocomposite film ;solution casting ;poly(vinylidene fluoride-hexafluoropropylene);barium strontium titanate ;dielectric property ;energy-storage property基金项目:江苏省第三期优势学科建设项目(PAPD-3),江苏高校品牌专业建设工程项目(TAPP)通信作者:胡静,博士后,教授,主要从事材料表面工程研究 E-mail:***************收稿日期:2021-01-13引用格式:梅文臣,魏金栋,柯振瑜,等. P(VDF–HFP)/BST 纳米复合薄膜的制备及介电、储能性能[J].工程塑料应用,2021,49(3):1–6.Mei Wenchen ,Wei Jindong ,Ko Zhen-Yu ,et al. Preparation ,dielectric properties and energy-storage properties of P(VDF–HFP)/BST nanocomposite films[J]. Engineering Plastics Application ,2021,49(3):1–6.蓬勃发展的电子工业,对电子材料的性能要求越来越高,提高应用于储能元器件的介电材料的储能密度(U )一直是人们研究的重点[1–2]。
ORIGINAL PAPERPreparation and dielectric properties of highly preferred-(100)orientation (Pb,La)(Zr,Ti)O 3antiferroelectric thick films by sol–gel processingXiujian Chou •Maoxiang Guo •Yating Zhang •Jun Liu •Wendong ZhangReceived:2July 2011/Accepted:13September 2011ÓSpringer Science+Business Media,LLC 2011Abstract Pb 0.97La 0.02Zr 0.95Ti 0.05O 3(PLZT)antiferro-electric thick films of highly preferred-(100)orientation with different thickness were successfully deposited on Pt(111)/Ti/SiO 2/Si(100)substrates depending on the sol–gel process technique.The effects of the PLZT thick films in the preparation and electric properties are investigated.The films show polycrystalline perovskite structure with a (100)preferred orientation by X-ray diffractometer analy-ses.The antiferroelectric nature of the thick films is demonstrated by P (polarization)–E (electric field).The temperature dependence of the dielectric constant and dielectric loss displays the similar behavior in both cases at 100kHz while the values of polarization characteristic are decreased with the increase of the film thickness.The phase switching current are studied as a function of a gradually change dc electric field and the voltage depen-dent current density of the most highly (100)-oriented PLZT film is 1.49910-8A/cm 2over electric field range from 0to ±261kV/cm.The film at 2,498nm exhibits excellent dielectric properties and highly preferred-(100)orientation.Keywords Antiferroelectric thick films ÁDifferentthickness ÁSol–gel process ÁDielectric properties ÁHighly preferred-(100)-orientation1IntroductionLead zirconate (PbZrO 3)of perovskite structure was the primal compound identified as an antiferroelectric in 1950s [1].Because of their unique properties and different electric-field inducted phase,such as under dc electric field,antiferroelectric materials have remarkable change of polar-ization,strains and current during the AFE-FE switching,the Pb-based antiferroelectric ceramics as well as thick films,for example,(Pb,La)(Zr,Ti)O 3(PLZT)[2],Pb(Zr,Sn,Ti)O 3(PZST)[3]and Pb(Nb,Zr,Sn,Ti)O 3(PNZST)[4]would be researched extensively in energy storage,high-strain trans-ducers/actuators and pyroelectric thermal sensors.(Pb,La)(Zr,Ti)O 3antiferroelectric materials have high potential utility for devices in microelectronic applications due to their unique dielectric,piezoelectric and electro-optical proper-ties.Nowadays,along with the fast development of the fabrication technology,PLZT materials show highly potential for microelectromechanical systems (MEMS)[5].PLZT thick films could be deposited through various methods,such as metallorganic chemical vapour deposition MOCVD [6],sol–gel [7],sputtering [8],pulsed laser depo-sition PLD [9]and so on.Sol–gel technique is the convenient and low cost method.Particularly due to the molecular lever of all of the starting chemicals in the solution,the compo-sition of the multicomponent system is easily controlled and a high degree of homogeneity of the thick films of antifer-roelectric can be expected.Therefore,the most antiferro-electric films for heterogenous integration are prepared by sol–gel processing.In this paper,(Pb,La)(Zr,Ti)O 3thick films of different thickness were deposited on Pt(111)/Ti/SiO 2/Si(100)sub-strates by sol–gel process.The combination of antiferro-electric thick films with silicon micromachining technology laid a good foundation for further study in microactuators.X.Chou (&)ÁM.Guo ÁY.Zhang ÁJ.Liu ÁW.Zhang Key Laboratory of Instrumentation Science and DynamicMeasurement,North University of China,Ministry of Education,Taiyuan,Chinae-mail:chouxiujian@J Sol-Gel Sci TechnolDOI 10.1007/s10971-011-2591-8The dielectric properties of PLZT antiferroelectric thick films with different thickness including phase switching strains,the temperature-dependent characteristics and so on were studied systematically.2Experimental detailThe Pb0.97La0.02(Zr0.95Ti0.05)O3antiferroelectric thick films were processed by sol–gel deposition process from Fig.1showing.Raw materials were lead acetate trihydrate [Pb(CH3COO)2Á3H2O],lanthanum acetate[La(CH3COO)3], zirconium propoxide[Zr(OC3H7)4],and titanium isoprop-oxide[Ti[OCH(CH3)2]4].Acetate was chosen as a solvent. At the beginning of step,on the basis of the predetermined number,lead acetate trihydrate with15%excess,lanthanum acetate hydrate,and acetic acid were mixed in a ratio.The solution was distilled at110°C for1h in order to clear up water.Following pulsing titanium isopropoxide and zirco-nium propoxide into the above the solution and would be mixed for30min until the above mixed solution was cooled to room temperature.Distilled water was put into the pro-portion of20mol of distilled water to1mol of lead during the mixing process as so to stabilize the solution.How-ever,because this solution which was produced was not very stable,the solution became gel after a few days.For removing this phenomenon and making the solution stable better,needed adding lactic acid as the function of catalyzerand chelation into the solution in the proportion of1mol of lactic acid to1mol of lead.To improve the mechanical properties of the gelfilm as researching of the properties of Antiferroelectric PLZT,ethylene glycol was mixed into the solution in the proportion of1mol of ethylene glycol to 1mole of lead.Finally,in order to gain the solution about 0.4mol/L the solution,there must be added into acetic acid and2-methoxyethanol.The goal of addition of2-meth-oxythanol was that the2-methoxythano could improve the wetability and lower the surface tension of the solution.PLZT thickfilms,leaved24h,were also fabricated on the substrates of Pt(100)/Ti/SiO2/Si(100)by spin-coating method.Each PLZT layer was spin coated at5,000rpm for20s,in order to get the best properties of the Pb0.97La0.02(Zr0.95Ti0.05)O3,there must be adapted two temperature of pyrolyzed which one was30°C for10min, the other was600°C for10min,to heat treatment.Then the spin coatings were repeated several times to obtain desired thickness.In order to prevent the losing of a large of lead in thefilm when thefilm was processing anneal at hyperther,a capping layer of0.4mol/L PbO precursor solution will be prepared from lead acetate trihydrate,was added in the end before thefilm went through afinal anneal at700°C for30min to produce the perovskite phase. Finally,severalfilm samples(sample A,B and C)with thickness between1and4l m had been posed.Gold pads of0.5mm in diameter were covered on thefilm surface as top electrodes by dc sputtering.The crystal orientation of PLZT thickfilms is researched by X-ray diffractometer(XRD).And the microstructures of PLZT thickfilms are examined by the atomic force microscope(AFM).The leakage current–electricfield characteristic of the PLZT antiferroelectric thickfilms is examined at room temperature by a Keithley6517A elec-trometer.Thefield-induced hysteresis loops of the PLZT thickfilms are demonstrated by a modified Sawyer–Tower circuit.The temperature andfield dependence dielectric constant and dielectric loss are obtained using an Agilent 4284A LCR meter.3Results and discussionCross-section SEM images for PLZT thickfilms with dif-ferent thickness are shown in Fig.2.It can be seen that all thefilms have smooth and uniform thickness and the thicknesses of the PLZT thickfilms are1,215,2,498and 3,817nm at sample A,B and C,respectively.The average thickness of one coating layer is0.12lm.Fig.1Flow diagram of sol–gel processing for PLZT thickfilmsJ Sol-Gel Sci TechnolThe surface morphology of the PLZT thick films with different thickness are analyzed through scanning electron microscopy (SEM).Figure 3expresses a typical film microstructure,free of cracks and having fairly homoge-neous morphology.As can we have known from Fig.3that the film is smooth,dense,and uniform with average grain sizes of about 522,630,and 829nm at sample A,B and C,respectively,which suggest that the grain sizes and the density of the film grow with the increasing of film thickness.The distributing of grain sizes of sample B is the more uniform and homogeneous than others.However,the film of sample B is the ones with the highest crystallinity.It can be seen,those characteristics are highly important for the application of PLZT as electrooptic material.Using the Software which name is The Image post-processing software of 4.5,we can get the data of the average grain size and roughness.They would be deter-mined from surface analyses though AFM are seen in Table 1and in Fig.4which illustrate the influence of thickness on grain size and roughness.It can be seen that the sample B is better smooth on surface than others,because of the uniform for the distributing of grain sizes lead to have the smallest roughness [10].The X-ray diffraction patterns of the PLZT antiferro-electric thick films are given in Fig.5and are recorded with a step of 0.02°/min within the 2h range from 20to60°C.It can be seen that all the film are a pure poly-crystalline perovskite structure with (100),(111),(110),(200)and present a higher (100)orientation.The (100)-preferred orientation of the film is formed by the presence of (001)-oriented PbO buffer layer.The (001)-oriented PbO crystals on the surface of the platinum electrode provide nucleation sites for the overlaid PLZT films and enhance the formation of their (100)orientation [11].In order to research the effect of different thickness of the PLZT thick films on the (100)orientation,we use the flowing formula to calculate the orientation factor of (100),Orientation factor ðF Þ¼I ð100Þ=½I ð100ÞþI ð110ÞþI ð111Þ ð1ÞAccording to the Eq.1[12],the (100)-orientation factor for films at sample A,B and C were 0.10,0.73and 0.57,respectively.Obviously,The PLZT thick film of sample B shows more highly preferred-(100)orientation (at 2h =22°,Fig.5)than others.Higher (100)-preferred ori-entation implies that the nucleation of the PLZT films are weakly controlled by the substrate effect [13].Considering the distributing of grain sizes at different thickness,an uniform and cracked of grain sizes matching with the films and the substrates may lead to enhance (100)–preferred orientation in thefilms.Fig.2Cross-section SEM images for PLZT thick films with different thicknessJ Sol-Gel Sci TechnolIn order to research the effects of which properties of PLZT film,Hysteresis loops (P–E)of PLZT thick films are measured in Fig.6at room temperature and 100kHz.As well known that PLZT thick films clearly show the double hystersis loops under the action of the applied electric field.It is better presented the AFE nature of the PLZT films with respective thicknesses and translated into the ferroelectric phase in electric field.According to increase of the electric field,the polarization shows a gradual adding and decreasing,and it also indicates a diffused phase switching between AFE and FE Phases.The double hysteresis loops also demonstrate that the field dependant phase of the films of ‘‘slanted’’is gradually changing,and it is also gradually completing between the antiferroelectric and the ferro-electric phase.According as the Fig.6,the values of maximum polarization of the PLZT thick films of sample A,B and C are 38,43and 45l C/cm 2,respectively.Thenthe hysteresis loops go through a change from the slanted to the square form with the addition of thickness content for samples.As clearly seen that,with the increasing of thickness of PLZT film,the maximum polarization of the film is enhancing.The forward (AFE-FE)phase switching field and backward (FE-AFE)phase switching field are 70,205kV/cm,74,211kV/cm and 82,223kV/cm for sample A,B and C,respectively.Obviously,AFE-FE (E F )and FE-AFE(E A )phase switching fields is gradually increasing with the increase of thickness of film.This can be attrib-uted to the higher film thickness [14].And also this difference is attributed to the crystalline orientation.Meanwhile,unlike antiferroelectric ceramic blocks (the residual polarization are zero).A small amount of remnant polarization (P r )in the samples which are due to the leakage and the influence of stress of substrates,are decreasing with increasing thickness.The increasing of P max and the reducing P r may be result from combinative effects of (100)-preferred orientation and grain sizes [13].Figure 7shows the dielectric constant and dielectric loss of PLZT thick films at sample A,B and C,respectively,as a function of temperature under the frequency 100kHz.It can be seen that following the increasing of temperature,the dielectric constant and the dielectric losses also can increase until getting the Curie temperature which are 221,220,and 215°C,respectively,and it can influencetheFig.3AFM images of PLZT antiferroelectric thick films at different thicknessTable 1Variation of grain size and roughness in function of dif-ferent thickness Thickness (nm)Roughness (nm)Average drain size (nm)1,215 6.415222,498 6.246303,8176.77829J Sol-Gel Sci Technolstability of antiferroelectric.It leads to happen tiny shift of the Curie temperature.Then the dielectric constant and the dielectric losses are gradually reducing due to the phase transformation of AFE-to-PE,and the temperature will continue to increase.As greatly seen from Fig.6that the PLZT film of sample B have higher dielectric constant and lower dielectric loss at the low frequency (less than 100kHz)contrast to sample A and C owing to enhancing the (100)-preferred orientation and the grain sizes of film.In order to observe the change of current owing to transformating phase,the current density–field (J–E)curves of different thickness of PLZT thick films are measured in Fig.8.The electric field is worked following the measurement mode is from 0to ?Emax,then ?Emax to -Emax and -Emax to 0,which is stepped with a time lag of 1s.As well known,the leakage current (denoted as I l )and the induced current (denoted as Ip)make up of the overall current (denoted as I)that result from the AFE-FE phase transformation or the FE-to-AFE phase transforma-tion.During polarization and depolarization,the leakage current and current are caused by turn of dipole.Owing to having the high quality of the film in all samples,the leakage current is very small,compared with the current causing by polarization and depolarization in the mea-surement range.It is shown from the Fig.8that the leakage current and induced current are both produced during the AFE-FE phase transformation or the FE-AFE phase transformation,however,the maximum current canbeFig.43D -AFM result of PLZT thick films of differentthicknessFig.5XRD patterns of PLZT thick films of different thickness grown on the Pt(111)/Ti/SiO 2/SisubstrateFig.6The hysteresis loops of PLZT antiferroelectric thick films at different thicknessJ Sol-Gel Sci Technolappeared,because the same direction with the leakage current and induced current cause and the induced current is more than leakage current by phase switching from AEF to FE.The maximum current density are 4.4910-9A/cm 2at 170kV/cm 2,1.49910-8A/cm 2at 180kV/cm 2and 5.2910-9A/cm 2at 176kV/cm 2at sample A,B and C,respectively.The differences in the maximum current density have connection with the amount of the polarized unit area and the phase switching procedure of the film.On the contrary,during the phase switching from FE to AFE,the maximum reverse current would be caused due to the reason that is the opposite direction with the leakage cur-rent and the induced current.It also can be found from the maximum current density that the induced current is gradually decreasing in the phase switching and the prop-erties of PLZT is gradually decreasing.At the same time,the phase transition current is higher than the leakage current.Hence,under the FE-to-AFE phase transformation,the measured current is negative and has a smaller value in contrast to the current density gained from the AFE-FE process.The film of sample B has the best steady than others,because of having the maximum current density in the FE-to-AFE phase transformation.4ConclusionPb 0.97La 0.02Zr 0.95Ti 0.05O 3(PLZT)antiferroelectric thick films at different thickness are fabricated on Pt(111)/Ti/SiO 2/Si(100)substrates by sol–gel process.The film of sample B,whose orientation factor is 0.73,has the higher preferred-(100)orientation (at 2h =22°)and better grain sizes than sample A and C.The hysteresis loops are changed from slanted to square,and the maximum polar-ization are 38,43and 45l C/cm 2at sample A,B and C,respectively.The dielectric constant of the sample B is higher than others,but the dielectric loss is the lowest.The Curie temperature of the film at different thickness are 221,220,and 215°C,respectively.The J–E curves explained that the maximum current density are 4.4910-9A/cm 2at 170kV/cm 2, 1.49910-8A/cm 2at 180kV/cm 2and 5.2910-9A/cm 2at 176kV/cm 2for the PLZT film at sample A,B and C in the phasetransformation,Fig.7Temperature dependence of the dielectric constant and dielectric loss of the PLZT thick films at differentthicknessJ Sol-Gel Sci Technolrespectively.The PLZT thickfilm of sample B has the best steady.In conclusion,the PLZT thickfilms of2,498nm have the best electric property of all,which are helpful for the application of thesefilms in MEMS devices. 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