SH-WI-TT-002_焊片

1.类别气保焊机(自动编号:350)产品名称NB (KR) 熔化极气体保护焊型号NB(KR)-500, NB(KR)-630产品简介采用晶闸管模块控制的半自动熔化极气体保护焊机；适用于低碳钢、低合金钢、不锈钢、铝及铝合金等材料的焊接；（焊铝和使用药芯焊丝配用双驱动送丝机,焊枪导丝管要配用尼龙管）；可用于实芯、药芯焊丝气体保护焊，具有电流、电压分别调整/简易一元化转换机能；可进行半自动熔化极气体保护焊（适用于CO2、MAG和MIG各种气体保护焊）。

产品说明实用文档手机：133 **** ****2.类别气保焊机(自动编号:350)产品名称NBC二氧化碳气体保护焊机（抽头分体式）型号NBC-350, NBC-500, NBC-315产品简介可专门从事薄板及中厚板的焊接；适用于各种低碳钢、低合金钢的气体保护焊接；外置式送丝机构，具有良好的机动性；生产率高，质量好，无渣、明弧，能见度高；实用文档焊接热影响区小，变形小，焊缝成形美观。

产品说明NBC-350NBC-500NBC-315380V380V380V3相3相3相350A500A315A31.5V39V30V60~350A80~500A50~315A18~40V19~50V16~36V60％60％60％3~15m/min3~15m/min3~15m/min0.2~5s0.2~5s0.2~5s0.2~5s0.2~5s0.2~5s138Kg170Kg132Kg×408×756（mm）754×436×814（mm）663×395×766（mm）手机：133 **** ****3.类别埋弧焊机(自动编号:351)实用文档产品名称MZ 自动埋弧焊机型号MZ-1000产品简介采用大功率可控硅电源，在焊剂层下作自动焊接用焊机；可焊接位于水平面或与水平面成10°角的斜面上开坡口或不开坡口的对接焊缝或角焊缝；焊接电流调节范围大，电流稳定，噪声小；设有双传动送丝功能，送丝力强；送丝速度和焊接速度可无级调节，保证焊接稳定；可直焊、环焊、角焊、对焊、搭接焊、及船状位置和角焊接。

焊材标识焊材类别：碳钢焊丝焊材牌号：CHG-56 焊材规格：Φ2.5 焊材批号：11-6117 入库时间：焊材标识焊材类别：碳钢焊丝焊材牌号：CHG-56 焊材规格：Φ3.2 焊材批号：入库时间：焊材标识焊材类别：不锈钢焊丝焊材牌号：CHG-308L 焊材规格：Φ2.5 焊材批号：12-6013 入库时间：焊材标识焊材类别：不锈钢焊丝焊材牌号：CHG-308L 焊材规格：Φ1.6 焊材批号：11-6129 入库时间：焊 材 标 识 焊材类别：氩弧焊丝 焊材牌号： CHG-309L 焊材规格： Φ2.5 焊材批号： 11-6165 入库时间： 焊材 标 识 焊材类别：不锈钢焊丝 焊材牌号： CHG-308L 焊材规格：Φ3.2 焊材批号： 11-6095 入库时间：焊材 标 识 焊材类别：20+Gr 焊丝 焊材牌号： ER70S-G 焊材规格： Φ2.4 焊材批号： 8825208 入库时间：焊材标识焊材类别：碳钢焊条焊材牌号：CHE507 焊材规格：Φ3.2 焊材批号：11-4981 入库时间：焊材标识焊材 标 识 焊材类别：碳钢焊条 焊材牌号： CHE507 焊材规格： Φ4.0 焊材批号： 入库时间：焊材标识焊材类别：20+Gr焊条焊材牌号：E7018-G 焊材规格：Φ4.0 焊材批号：8102142 入库时间：焊材标识焊材标识焊材类别：WB36CN1焊条焊材牌号：E9018-G 焊材规格：Φ4.0 焊材批号：8102369入库时间：焊材标识焊材类别：P22焊丝焊材牌号：ER62-B3焊材标识焊材类别：P22 焊条焊材牌号：CHH407 焊材规格：Φ4.0 焊材批号：113260 入库时间：焊材标识焊材类别：P22 焊条焊材牌号：CHH407。

表格编号：TWB-WPQ-06北京泰来华顿低温设备有限公司焊接作业指导书编号20170612产品编号BT系列非CO2产品图号名称低温贮罐接头编号表(以10立方为例) 共27页第1页焊接材料汇总表共27页第3页埋弧焊，背面清根，清根方式：等离子气刨埋弧焊，背面清根，清根方式：等离子气刨接头焊接工艺卡共27页第6页埋弧焊，背面清根，清根方式：等离子气刨氩弧焊打底，埋弧焊填充盖面。

氩弧焊打底，埋弧焊填充盖面。

氩弧焊打底，埋弧焊填充盖面。

接头焊接工艺卡共27页第10页接头焊接工艺卡共27页第11页埋弧焊，背面清根，清根方式：等离子气刨埋弧焊，背面清根，清根方式：等离子气刨接头焊接工艺卡共27页第14页埋弧焊，背面清根，清根方式：等离子气刨接头焊接工艺卡共27页第15页埋弧焊，背面清根，清根方式：等离子气刨接头焊接工艺卡共27页第16页埋弧焊，背面清根，清根方式：等离子气刨接头焊接工艺卡共27页第17页埋弧焊，背面清根，清根方式：等离子气刨埋弧焊，背面清根，清根方式：等离子气刨埋弧焊，背面清根，清根方式：等离子气刨焊接位置——插口型接头焊接位置——层道施焊技术手工焊预热温度（℃）室温 1 1 层间温度（℃）≤150 2 1 焊后热处理——后热——焊接位置——层道施焊技术手工焊预热温度（℃）室温 1 1 层间温度（℃）≤150 2 1 焊后热处理——后热——接头焊接工艺卡共27页第23页焊接位置——层道施焊技术手工焊预热温度（℃）室温 1 1层间温度（℃）≤150 2 1焊后热处理——后热——接头焊接工艺卡共27页第24页接头焊接工艺卡共27页第27页。

3 QTIICold Shrink Three Core Indoor / Outdoor Terminations94-EB6x-4 Series for 19/33(36) kV CablesApplication3M™ QTII Cold Shrink Series Kits are designed for 36kV Umax voltage class, three core polymeric power cable systems according to HD 620 (IEC60502).Kit Content3M™ 94-EB6x-4 Series Terminations include the Cold Shrink QTII Silicone Termination body with integrated stress control device, and silicone elastomeric insulation. Silicone tape is included for moisture sealing. Scotchcast Resin is included for sealing the cable crutch. Also included are all armour continuity components, re-jacketing tubes, and three core cold shrink breakout boots.Skirts are integrated for faster & easier installation.Product Features• The versatile design of the prefabricated one-piece cold shrink termination body allowsinstallation on a wide range of cable sizes andtypes and a fast and easy installation attemperatures ranging from - 20°C to + 50°C.• No heat or flame is needed during installation.• Solderless earth connection using ConstantForce springs.• No special tools needed during installation.Installation3M™ Cold Shrink technology ensures quick, easy andsafe installation of the QTII Termination Body bypulling and unwinding the plastic support core incounter clockwise direction. Use of special tools is notnecessary.Detailed instructions for installing the 3M™ QTIISeries Terminations are included in each kit.Product Identification3M™ QTII Series Termination kits are marked with supplier name, cable cross section ranges, voltage class and cable type, storage conditions and manufacturing codes for product traceability.Performance Tests3M™ QTII 94-EB6x-4 Series Terminations meet and exceed the requirements of the European standard CENELEC HD 629.1 as well as IEC 60502-4.See Test Report No; TbaStorageThe shelf life of 3M™ QTII Series Terminations is specified as 3 years.Temperature: - 40°C to +50°C.Page 1 of 2Issue 13M and Scotchcast are trademarks of 3M CompanyImportant NoticeAll statements, technical information and recommendations related to the Seller’s products are based on information believed to be reliable, but the accuracy or completeness thereof is not guaranteed. Before utilizing the product, the user should determine the suitability of the product for its intended use. The user assumes all risks and liability whatsoever in connection with such use.Any statements or recommendations of the Seller which are not contained in the Seller’s current publications shall have no force or effect unless contained in an agreement signed by an authorized office of the Seller.The statements contained herein are made in lieu of all warranties, expressed or implied, including but not limited to the implied warranties of merchantability and fitness for a particular purpose which warranties are hereby expressly disclaimed. SELLER SHALL NOT BE LIABLE TO THE USER OR ANY OTHER PERSON UNDER ANY LEGAL THEORY; INCLUDING BUT NOT LIMITED TO NEGLIGENCE OR STRICT LIABILITY; FOR ANY INJURY OR FOR ANY DIRECT; INDIRECT; INCIDENTAL OR CONSEQUENTIAL DAMAGES SUSTAINED OR INCURRED BY REASON OF THE USE OF ANY OF THE SELLER’S PRODUCTS.Electrical Markets Division3M United Kingdom PLC3M Ireland Ltd 3M United Kingdom PLC Sales OfficeSales Office Head Office PO Box 393The Iveagh Building, The Park, 3M Centre, Cain Road Bedford MK41 0YECarrickmines, Dublin 18, Ireland Bracknell, Berkshire RG12 8HT Telephone************Telephone: (01) 800 812 732 Telephone: 01344 858 000 Fax: 01234 229 433 Fax: 353 1 280 3509 Fax: 01344 858 758Page 2 of 2 Issue 1 Product Selection Kit Reference Application Range Guide (mm²) Diameter over primary insulation (mm) Max. Lug diameter accepted (mm) 94-EB63-425 – 150 21.3 – 35.0 35 94-EB64-495 – 240 27.4 – 45.7 45Product Stewardship3M has a fundamental concern for all who make, distribute and use its products, and for theenvironment in which we live. This concern is the basis of our philosophy and policies by which we assess the health and environmental information on our products and then take the appropriate steps to protect employee, the public health and the environment.Customer Notice3M encourages its customers and potential users of 3M products to review their applications for such products from the standpoint of human health and environmental quality. To help ensure that 3M products are not used in ways for which they were not intended or tested. 3M personnel are available to assist customers in dealing with ecological and product safety considerations. Your 3M sales representative can arrange for the proper contacts.Regulatory Status3M™ QTII Series Terminations are not subject of the European WEEE and RoHS Directives but meet their requirements.。

文件批准A p p r o v a l R e c o r d文件修订记录Revision Record:1、目的Purpose:建立PCBA外观检验标准，为生产过程的作业以及产品质量保证提供指导。

2、适用范围Scope:2.1本标准通用于本公司生产任何产品PCBA的外观检验（在无特殊规定的情况外）。

包括公司内部生产和发外加工的产品。

2.2 特殊规定是指：因零件的特性，或其它特殊需求，PCBA的标准可加以适当修订，其有效性应超越通用型的外观标准。

3、定义Definition:3.1标准【允收标准】 (Accept Criterion)：允收标准为包括理想状况、允收状况、拒收状况等三种状况。

【理想状况】 (Target Condition)：此组装情形接近理想与完美的组装结果。

能有良好组装可靠度，判定为理想状况。

【允收状况】 (Accept Condition)：此组装情形未符合接近理想状况，但能维持组装可靠度故视为合格状况，判定为允收状况。

【拒收状况】(Reject Condition)：此组装情形未能符合标准，其有可能影响产品的功能性，但基于外观因素以维持本公司产品的竞争力，判定为拒收状况。

3.2 缺陷定义【致命缺陷】(Critical Defect)：指缺陷足以造成人体或机器产生伤害，或危及生命财产安全的缺陷，称为致命缺陷，以CR表示的。

【主要缺陷】(Major Defect)：指缺陷对制品的实质功能上已失去实用性或造成可靠度降低，产品损坏、功能不良称为主要缺陷，以MA表示的。

【次要缺陷】(Minor Defect)：系指单位缺陷的使用性能，实质上并无降低其实用性，且仍能达到所期望目的，一般为外观或机构组装上的差异，以MI表示的。

3.3焊锡性名词解释与定义：【沾锡】(Wetting) :系焊锡沾覆于被焊物表面，沾锡角愈小系表示焊锡性愈良好。

【沾锡角】 (Wetting Angle) 被焊物表面与熔融焊锡相互接触的各接线所包围的角度(如附件)，一般为液体表面与其它被焊体或液体的界面，此角度愈小代表焊锡性愈好。

常用各种焊丝型号一、一般常用焊丝1、DY-YJ502（Q）钛型渣系的药芯焊丝。

工艺、力学性能优良，能够进行全位置焊接，特别是优良的低温韧性，以达到船级社3y 级认证。

广泛用于造船、钢结构、桥梁等。

2、DY-YJ507（Q）碱型渣系的药芯焊丝。

力学性能优良，扩散氢含量低，具有优良的低温抗裂性能。

-40度冲击功可达到80以上。

用于机械制造、水电、石油化工设备等。

3、DY-YJ607（Q）碱型渣系的药芯焊丝。

力学性能优良，扩散氢含量低，适用于60公斤级高强高韧性钢的焊接。

4、YJ502CrNiCu（Q）钛型全位置焊接药芯焊丝。

用于耐大气腐蚀钢的焊接。

如海洋平台的焊接用。

5、YJ502Ni（Q）钛型全位置焊接药芯焊丝。

低温冲击吸收功高，满足-40度气温下金属结构的使用。

二、耐热钢系列药芯焊丝1、DY-YR302（Q）钛型渣系的药芯焊丝，适用于1Cr-0.5Mo和1.25Cr-0.5Mo耐热钢的焊接用，广泛用于锅炉压力容器行业。

2、DY-YR312（Q）适用于12CrMoV珠光体耐热钢的焊接，广泛用于锅炉压力容器行业。

3、DY-YR317（Q）碱性渣系药芯焊丝。

适用于12CrMoV珠光体耐热钢的焊接，具有优良的低温冲击性能。

4、DY-YR402（Q）用于2.25Cr-1Mo耐热钢焊接。

三、不锈钢用气保护焊药性焊丝1、DY-YA308（Q）18％Cr-8％Ni不锈钢焊接用。

2、DY-YA308L（Q）超低碳18％Cr-8％Ni不锈钢焊接用。

3、DY-YA309（Q）异种钢焊接或复合钢板及堆焊不锈钢时过渡层焊接用。

4、DY-YA316（Q）18％Cr-12％Ni不锈钢焊接用。

四、气保护堆焊药芯焊丝1、DY-YD350（Q）广泛用于堆焊金属间磨损部件和轻度的土砂磨损的部件，HRC35.2、DY-YD450（Q）适于堆焊耐土砂磨损和耐金属间磨损的部件，HRC45.3、DY-YD600（Q）广泛用于耐土砂磨损的部件，HRC55-60.五、埋弧堆焊药芯焊丝1、DY-YD14（M）主要用于碳钢和低合金钢零部件的修复或作其它堆焊材料的过渡层，HRC26±2.2、DY-YD224B（M）主要用于热轧辊和其它耐磨损件的堆焊和修复，HRC59.3、DY-YD420（M）含铬13％的马氏体型堆焊药芯焊丝，耐腐蚀，耐磨损。

2021年3月电子工艺技术Electronics Process Technology第42卷第2期113作者简介：樊融融，男，研究员，中兴通讯股份有限公司终身荣誉专家。

摘　要：针对当前国内高可靠性微电子装备用焊膏完全受制于国外，国内尚无一品牌产品可以替代的问题，分析了这一隐患的严重性，对高可靠性微电子装备国产焊膏研制工程的立项背景、实施路线和研制工程试验大纲等进行了详实介绍。

研制工程团队历时两年多先后完成了摸底试验和定型认证试验，积累了海量数据，并进行了归纳处理。

对近千幅分析图像判读和比较，不断浓缩迭代，最终获得受试的１１种焊膏（有铅焊膏国内３种，国外２种；无铅焊膏国内和国外各３种）的全部测试数据项（有铅焊膏５７项、无铅焊膏６３项），并逐项按其性能的优劣进行排序，最后再按获得优项的次数和权重，对受测试的公司再排序，从而获得了对高可靠性微电子装备国产焊膏研制工程成果的评价结论。

关键词：焊膏；互连可靠性；应用工艺性；成果评价；微电子装备中图分类号：ＴＮ６０４　文献标识码：Ａ　文章编号：１００１－３４７４（２０２１）０２－０１１３－０７Abstract: In view of the problem that the domestic solder paste for high reliability microelectronic equipment is completely controlled by foreign countries, and there is no domestic brand product to replace, the seriousness of this hidden danger is analyzed, and the project background, implementation route and test program of domestic solder paste for high reliability microelectronic equipment is introduced in detail. It took more than two years for the research and development and engineering team to complete the thorough test高可靠性微电子装备国产焊膏研制工程Research and Development of Domestic Solder Paste with High Reliability forMicroelectronic Equipment樊融融FAN Rongrong（中兴通讯股份有限公司，广东　深圳　５１８０５７）( Zhongxing Telecommunication Equipment Corporation, Shenzhen 518057, China )高可靠性微电子装备国产焊膏研制工程ｄｏｉ：　１０．１４１７６／ｊ．ｉｓｓｎ．１００１－３４７４．２０２１．０２．０１５【编者按】　当前国内高可靠性微电子装备用焊膏完全受制于国外，国内尚无一品牌产品可以替代。

DKBA华为技术有限公司技术规范DKBA 6295-2013.08终端PCBA制造标准2013年8月15日发布2013年8月30日实施华为技术有限公司Huawei Technologies Co., Ltd.版权所有侵权必究All rights reserved修订声明Revision declaration本规范拟制与解释部门：终端研发管理部产品工程与验证部本规范的相关系列规范或文件：《终端工艺材料选用规范（EMS版）》、《XXX单板工艺特殊说明文件》、《终端产品手工焊接工艺规范》相关国际规范或文件一致性：替代或作废的其它规范或文件：《华为终端辅料清单（EMS版）V300R001》《终端PCBA装联通用工艺规范》1生产与存储环境及工艺辅料选择通用要求 ......................................................................1.1概述 ...............................................................................................................................1.2PCBA工艺辅料清单及辅料变更申请管理要求........................................................1.3物料规格及存储使用通用要求 ...................................................................................1.3.1通用物料存储及使用要求.....................................................................................1.3.2PCB存储及使用要求 ............................................................................................1.3.3锡膏规格及存储使用要求.....................................................................................1.3.4焊锡丝规格及存储使用要求.................................................................................1.3.5POP Flux规格及存储使用要求 ............................................................................1.3.6Underfill胶水规格及存储使用要求 .....................................................................1.3.7波峰焊助焊剂规格及存储使用要求.....................................................................1.3.8波峰焊锡条规格及存储使用要求.........................................................................1.3.9涂覆材料规格及存储使用要求.............................................................................硅胶材料规格及存储使用要求.............................................................................1.4PCBA生产环境通用要求............................................................................................1.5PCB与PCBA生产过程停留时间要求 ...................................................................... 2锡膏印刷工序规范 ..............................................................................................................2.1锡膏印刷设备能力要求 ...............................................................................................2.2印刷工序工具要求 .......................................................................................................2.2.1印锡刮刀规格要求.................................................................................................2.2.2印锡钢网规格要求.................................................................................................2.2.3印锡工装规格要求.................................................................................................2.3锡膏印刷工序作业要求 ...............................................................................................2.3.1锡膏存储和使用要求.............................................................................................2.3.2印刷工序作业要求................................................................................................. 3SPI（Solder Printing Inspection）工序规范 ......................................................................3.1SPI检测要求.................................................................................................................3.2SPI设备能力要求.........................................................................................................3.2.1在线SPI设备能力要求.........................................................................................3.2.2SPI设备编程软件系统..........................................................................................3.3检测频率要求 ...............................................................................................................3.3.1离线SPI检测频率要求.........................................................................................3.3.2在线SPI检测要求.................................................................................................3.4锡膏印刷规格要求 .......................................................................................................3.4.1印锡偏位规格要求.................................................................................................3.4.2锡量规格要求.........................................................................................................3.5过程报警管制要求 ....................................................................................................... 4贴片工序工艺要求 ..............................................................................................................4.1贴片工序通用要求 .......................................................................................................4.2贴片机设备能力要求 ...................................................................................................4.2.1贴片机设备处理能力.............................................................................................4.2.2贴片机基准点识别能力.........................................................................................4.3吸嘴规格要求 ...............................................................................................................4.3.1吸嘴与器件对应关系.............................................................................................4.3.2吸嘴材质与贴片器件封装体材质对应关系.........................................................4.3.3吸嘴吸取方式.........................................................................................................4.4Feeders规格要求..........................................................................................................4.4.1Feeders与Tray的使用场景定义..........................................................................4.4.2Feeders宽度与可选元器件尺寸对应关系 ...........................................................4.5贴片工艺过程要求 .......................................................................................................4.5.1设备保养点检要求.................................................................................................4.5.2作业要求.................................................................................................................4.5.3编程要求................................................................................................................. 5Dipping flux规范和操作要求 ............................................................................................5.1Dipping Station设备能力要求.....................................................................................5.2Dipping Station厚度测量要求.....................................................................................5.3Dipping Flux工艺操作要求......................................................................................... 6AOI工序规范......................................................................................................................6.1AOI工序通用要求 .......................................................................................................6.2AOI设备能力要求 .......................................................................................................6.3AOI检测频率要求 .......................................................................................................6.4器件贴片检验标准 .......................................................................................................6.4.1偏位规格标准.........................................................................................................6.4.2阻容元件和小型器件.............................................................................................6.4.3翼形引脚器件.........................................................................................................6.4.4BGA/CSP等面阵列器件 ....................................................................................... 7无铅回流工序规范 ..............................................................................................................7.1通用要求 .......................................................................................................................7.2回流炉测温板要求 .......................................................................................................7.2.1产品测温板制作要求.............................................................................................7.2.2产品测温板使用要求.............................................................................................7.3炉温曲线定义和要求 ...................................................................................................7.4回流炉稳定性测试方法 ............................................................................................... 8PCBA分板要求...................................................................................................................8.1工具设备要求 ...............................................................................................................8.2分板作业要求 ............................................................................................................... 9X-ray Inspection 规范 .........................................................................................................9.1范围定义 .......................................................................................................................9.2设备能力要求 ...............................................................................................................9.3X-ray检测频率要求 .....................................................................................................9.4焊点X-ray品质检测要求 ............................................................................................ 10Underfill 工艺规范和操作要求 ......................................................................................10.1Underfill 胶水回温要求...............................................................................................10.2Underfill胶水使用要求................................................................................................10.3Underfill工序设备能力要求........................................................................................10.3.1点胶设备.................................................................................................................10.3.2固化设备.................................................................................................................10.4Underfill工序操作要求................................................................................................10.5Underfill工序测温板要求............................................................................................ 11插件工艺规范和操作要求...............................................................................................11.1插件剪角要求 ...............................................................................................................11.2插件引脚成型要求 .......................................................................................................11.3手工插件要求 ............................................................................................................... 12波峰焊工艺规范和操作要求...........................................................................................12.1波峰焊辅料存储及使用要求 .......................................................................................12.1.1波峰焊锡条使用要求.............................................................................................12.1.2SAC305无铅焊料槽中焊料的更换与锡的添加..................................................12.1.3SACx0807无铅焊料槽中焊料的更换与锡的添加..............................................12.1.4波峰焊助焊剂存储和使用要求.............................................................................12.2波峰焊设备能力要求 ...................................................................................................12.3波峰焊测温板要求 .......................................................................................................12.4波峰焊曲线定义和要求 ............................................................................................... 13手工焊工艺规范和操作要求...........................................................................................13.1手工焊工艺辅料使用要求 ...........................................................................................13.1.1手工焊锡丝使用要求.............................................................................................13.1.2手工焊清洗剂存储及使用要求.............................................................................13.2工具设备要求 ...............................................................................................................13.3手工焊作业要求 ........................................................................................................... 14PCBA涂覆 .......................................................................................................................14.1PCBA涂覆材料使用要求............................................................................................14.2工具设备要求 ...............................................................................................................14.3涂覆作业要求 ............................................................................................................... 15硅胶固定...........................................................................................................................15.1工具设备要求 ...............................................................................................................15.1.1有机硅固定胶的使用.............................................................................................15.2硅胶固定作业要求 ....................................................................................................... 16散热片安装.......................................................................................................................16.1导热垫使用要求 ...........................................................................................................16.1.1导热垫的适用性.....................................................................................................16.1.2导热垫的贴装方法.................................................................................................16.1.3导热垫的返修.........................................................................................................16.1.4注意事项.................................................................................................................16.2导热双面胶带使用要求 ...............................................................................................16.2.1导热双面胶带的适用性.........................................................................................16.2.2导热双面胶带的贴装步骤：.................................................................................16.2.3导热双面胶带的返修：.........................................................................................16.2.4注意事项.................................................................................................................16.3散热器安装 ...................................................................................................................16.3.1Push Pin固定散热器..............................................................................................16.3.2Push Pin固定散热器的返修..................................................................................16.3.3散热器安装过程应力控制要求.............................................................................16.3.4带散热器的电压调整器安装................................................................................. 17PCBA焊点检验要求 .......................................................................................................17.1PCBA焊点外观目检要求............................................................................................17.2PCBA焊点检验标准....................................................................................................17.3对位丝印判定规则： ...................................................................................................表目录List of Tables表1 华为终端SMT工序PCBA辅料清单 ............................................................................. 表2 华为终端波峰焊工序PCBA辅料清单 ........................................................................... 表3 PCB有效存储期限 ............................................................................................................ 表4 生产过程停留时间规定.................................................................................................... 表5 锡膏印刷机设备能力要求表............................................................................................ 表6 PCB洗板要求 .................................................................................................................... 表7 在线SPI设备能力要求.................................................................................................... 表8 印锡厚度测量点选点要求................................................................................................ 表9 印锡体积与印锡面积规格要求表.................................................................................... 表10 印锡厚度预警阀值要求表.............................................................................................. 表11 贴片机设备处理能力指标表.......................................................................................... 表12 贴片机基准点识别能力表.............................................................................................. 表13 某系列贴片机吸嘴与器件对应关系表.......................................................................... 表14 吸嘴材质与器件封装体材质对应关系表...................................................................... 表15 Feeders宽度与可选元器件尺寸对应关系 ..................................................................... 表16 Dipping station设备能力要求表..................................................................................... 表17 Dipping station膜厚测量规对比表................................................................................. 表18 AOI设备能力要求表....................................................................................................... 表19 AOI对各类器件缺陷的整体测试能力表....................................................................... 表20 华为终端产品无铅回流曲线要求.................................................................................. 表21 华为终端POP产品无铅回流曲线要求 ........................................................................ 表22 X-ray设备能力要求表 .................................................................................................... 表23 Underfill自动点胶设备能力要求表 ............................................................................... 表24 Underfill点胶针头要求表 ............................................................................................... 表25 Underfill胶水烘箱固化参数表 ....................................................................................... 表26 波峰焊插件元器件出脚长度和引脚长度要求.............................................................. 表27 SAC305无铅焊料槽中杂质控制.................................................................................... 表28 SACx0807无铅焊料槽中杂质控制................................................................................ 表29 华为终端产品无铅波峰焊曲线要求.............................................................................. 表30 PCBA焊点外观目检放大倍率与焊盘宽度对应关系表 ............................................... 图目录List of Figures图1 钢网张力测试位置示意图................................................................................................ 图2 可吸附面积示意图............................................................................................................ 图3 Dipping flux深度示意图 ................................................................................................... 图4 热电偶选择位置示意图.................................................................................................... 图5 华为终端典型无铅回流曲线示意图................................................................................ 图6 轨道平行度偏差测试治具/仪表示意图（推荐）........................................................... 图7 Underfill胶水回温操作示意图 ......................................................................................... 图8 针头颜色示意图................................................................................................................ 图9 Underfill回流炉固化曲线示意图 ..................................................................................... 图10 常规点胶路径示意图...................................................................................................... 图11 针嘴距器件边缘距离示意图.......................................................................................... 图12 针嘴距PCBA高度距离示意图 ..................................................................................... 图13 引脚长度&出脚长度定义示意图................................................................................... 图14 卧插器件成型示意图......................................................................................................图15 华为终端产品无铅波峰焊曲线示意图.......................................................................... 图16 1 导热垫保护纸撕开方法示意图................................................................................... 图17 导热垫放置示意图.......................................................................................................... 图18 散热器平面图.................................................................................................................. 图19 硅片凸出的器件缓冲垫装配示意图.............................................................................. 图20 金属Push Pin散热器固定效果图.................................................................................. 图21 塑料Push Pin散热器固定效果图.................................................................................. 图22 金属PUSH PIN扣具安装散热器的返修 ...................................................................... 图23 塑料PUSH PIN扣具安装散热器的返修 ...................................................................... 图24 带散热器电压调整器立式安装示意图..........................................................................错误！未找到引用源。

焊丝(药芯焊丝-实心焊丝-氩弧焊丝-耐磨焊丝)-药芯焊丝-实心焊丝-氩弧焊丝-耐磨焊丝镍和镍基合金焊丝Techalloy 55 (AWS 无对应) Techalloy 99(AWS A5.15ERNiCL)Techalloy 208FM61( AWSA5.14ERNi-1)Techalloy 276(AWSA5.14ERNiCrMo-4)Techalloy 413 FM67(AWS A5.7 ERCuNi) Techalloy418FA60(AWSA5.14ERNiCu-7)Techalloy 606FM82(AWS A5.14ERNiCr-3)Techalloy 617AWS A5.14ERNiCrCoMo-1Techalloy 622 AWSA5.14 ERNiCrMo-10Techalloy625(AWSA5.14ERNiCrMo-3)Techalloy 718(AWS A5.14ERNiFeCr-2)Techalloy 725(AWS 无对应)Techalloy 825AWSA5.14 ERNiFeCr-1镍和镍基合金焊条Tech-Rod 55 (AWSA5.15 ENiFe-Cl) Tech-Rod 99(AWS A5.15ENi-Cl)Tech-Rod 112(AWS A5.11ENiCrMo-3)Tech-Rod 117AWS A5.11ENiCrCoMo-1Tech-Rod 122 AWS A5.11 ENiCrMo-10 Tech-Rod 135(AWS 无对应)Tech-Rod 141(AWS A5.11 ENi-1)Tech-Rod 182(AWS A5.11ENiCrFe-3)Tech-Rod 187 (AWS A5.6ECuNi) Tech-Rod 190(AWS A5.11ENiCu-7)Tech-Rod 276(AWS A5.11ENiCrMo-4)Tech-Rod WeldAAWS A5.11ENiCrFe-2不锈钢焊丝Techalloy307L (AWS 无对应)Techalloy308/308H(AWS 5.9ER308/308H)Techalloy308/308L(AWS 5.9 ER308L)Techalloy308LHS(AWSA5.9ER308LSi)Techalloy 309 (AWS A5.9ER309) Techalloy309/309L(AWS A5.9ER309L)Techalloy 309LHS(AWS A5.9ER309Lsi)Techalloy309MoL(AWS A5.9ER309LMo)Techalloy 310 (AWS A5.9ER310) Techalloy312(AWS A5.9ER312)Techalloy316/316L(AWS A5.9 ER316L)Techalloy316LHS(AWS A5.9ER316L Si)Techalloy317L (AWS A5.9 ER317L) Techalloy320(AWS A5.9ER320)Techalloy 320LR(AWS A5.9 ER320LR)Techalloy330(AWS A5.9ER330)Techalloy347 (AWS A5.9 ER347) Techalloy385(AWS A5.9ER385)Techalloy 409Cb(AWS A5.9 ER409Cb)Techalloy410(AWS A5.9ER410)Techalloy410NiMo AWS A5.9 ER410NiMo Techalloy430(AWS A5.9ER430)Techalloy 430 LCb(AWS 无对应)Techalloy 630(AWS ER630)Techalloy2209 (AWS ER2209)Techalloy2594 (AWS ER2594)不锈钢焊条Tech-Rod 308/308L (AWS A5.4 E308L-16) (AWS A5.4 E308L-17) Tech-Rod309/309L(AWS A5.4E309L-16)(AWS A5.4E309L-17)Tech-Rod 310(AWS A5.4 E310-16)Tech-Rod 312(AWS A5.4E312-16)Tech-Rod 316/316L (AWS A5.4 E316L-16) (AWS A5.4 E316-17) Tech-Rod317L(AWS A5.4E317L-16)Tech-Rod 320(AWS A5.4 E320-16)Tech-Rod320LR(AWS A5.4E320LR-16)Tech-Rod 330 (AWS A5.4E330-16) Tech-Rod 347(AWS A5.4E347-16)Tech-Rod 385(AWS A5.4 E385-16)Tech-Rod 410(AWS A5.4E410-16)Tech-Rod410NiMo AWS A5.4 E410NiMo-16 Tech-Rod 430(AWS A5.4E430-16)Tech-Rod 630(AWS A5.4 E630-16)Tech-Rod 2209(AWS A5.4E2209-16)(DuplexGrade)Tech-Rod Tech-RodWeld-All (AWS 无对应)2594 (AWS 无对应)不锈钢和镍基合金药芯焊丝Techalloy 308LFCE308LTO-1 E308LTO-4 Techalloy308LFCAE308LTO-1E308LTO-4Techalloy 309LFCE309LTO-1E309LTO-4Techalloy309LFCAE309LTO-1E309LTO-4Techalloy 316LFCE316LTO-1 E316LTO-4 Techalloy316LFCAE316LTO-1E316LTO-4Techalloy 625FCA(AWS 无对应)低合金钢焊丝Techalloy80S-B2 (AWS A5.28 ER80S-B2)Techalloy515(AWS A5.23EB2)Techalloy 90S-B3(AWS A5.28ER90S-B3)Techalloy 521(AWS A5.23EB3)Techalloy80S-B6 (TechalloyTechalloy80S-B8(TechalloyTechalloy 90S-B9(AWS A5.28ER90S-B9)Techalloy110S-1(AWS A5.28502) (AWSA5.287 ER80S-B6)505)(AWS A5.28ER80S-B8)ER110S-1)Techalloy120S-1 (AWS A5.28 ER120S-1) Techalloy4130(AWS 无对应)Techalloy AK-10*(AWS A5.28ER100S-G)EALEG SG 6500焊条产品描述这是一种通用焊条可以在各种位置焊接所有低碳钢和杂类钢，可以接触式焊接，焊条按在工件上走直线。