Trust,power and control in trans-organizational relations

《职业卫生与职业医学》常用英语词汇occupational health职业卫生学industrial hygiene工业卫生工程学Occupational hazard职业性危害Occupational adverse effect／damage职业性损害／损伤Occupational tolerance职业耐受性Occupational injury／work injury工伤Occupational disorders职业性疾患Occupational diseasesDiagnosis of occupational diseaseEmergency rescue centerhealth promotioncompensable diseasework—related diseaseoccupational stigmahost risk factorhigh risk groupoccupational health servicethree levels of preventionprimary preventionsecondary preventiontertiary preventionprimary health carework physio1ogyoccupational psychology ergonomicshuman factors engineering mental workphysical workoxygen demandmaximum oxygen uptake oxygen debtsteady stateintensity of workshift workdual classification of work intensity static work／effortisometric contractiondynamic workisotonic contractiondynamic stereotype occupational stressstressor职业病职业病的诊断应急救援中心健康促进需赔偿的疾病工作有关疾病职业特征个体危险因素高危人群职业卫生服务三级预防第一级预防第二级预防第三级预防初级卫生保健工作(职业)生理学职业心理学人类工效学人机因素工程学脑力劳动体力劳动氧需氧上限氧债稳定状态工作强度轮班制工作强度双重分级法静力作业等长性收缩动态作业等张性收缩动力定型职业性紧张紧张因素stress紧张strain or stress reaction紧张反应modifier调节(缓解)因素person—environment fit model人一环境相适应模式job demands—control model工作需求一控制模式psychosocial stresses社会心理紧张quantitative overload超负荷quantitative underload负荷不足work capacity作业能力induction period入门期steady period稳定期fatigue period疲劳期terminal motivation终末激发training锻炼exercise练习fatigue疲劳overstrain过劳physical stress体力紧张psychological strain心理过劳mismatch失衡micropause工间小歇break工间休息active rest积极休息physical strain体力过劳occupational cumulative trauma or disorders职业蓄积性损伤或疾患flat foot扁平脚varicosity of lower extremity下肢静脉曲张abdominal hernia腹疝kyphosis驼背scoliosis脊柱侧凸low back pain下背痛lumbar insufficiency腰肌劳损lumbago腰痛sciatica坐骨神经痛temosynovitis腱鞘炎occupational cramp职业性痉挛occupational neurosis职业性神经机能症writer's cramp书写痉挛styloiditis茎突炎epicondylitis上踝炎periarthritis关节周炎bursitis滑囊炎Dupuytren’s contracture掌挛缩病callus胼胝singer’s nodules歌唱家小结节psychological strain心里过劳post—traumatic stress disorder外伤后紧张性精神病mass psychogenic illness群体精神病video display terminal，VDT视屏显示终端occupational neck and upper extremity disorder职业性颈肩腕综合征computer operator syndromedustfumevaporgassolidliquidmistproductive dustproductive fumeaerosoltarget organblood brain barriesplacental barriesskin barriesabsorptiondistributionexcretionblood／air partition coefficientlipid／waterpartitioncoefficientbiotransformationdepotacute poisoningsubacute poisoningchronic poisoningpoison’sabsorptionleadcoproporphyrin，CP freeerythrocyteprotoporphyrin，FEP zinc protoporphyrin，ZnPP一aminolaevulinicacid，一ALA transmmlganin粉尘烟蒸气气体固体液体雾生产性粉尘生产性烟尘气溶胶靶器官血脑屏障胎盘屏障皮肤屏障吸收分布排泄血／气分配系数脂／水分配系数生物转化储存库急性中毒亚急性中毒慢性中毒毒物的吸收铅粪卟啉红细胞游离原卟啉锌原卟啉—氨基一一酮戊酸转锰素电脑操作综合征mercury汞manganese锰chromium铬beryllium铍zinc锌nickel镍antimony锑tin锡phosphorus磷arsenic selenium boronirritant gas chlorine phosgene ammonia asphyxiating gas organic solvents benzene toluenexyleneaniline nitrobenzene carbon tetrachloride vinyl chloride acrylonitrile styrene butadiene carbondisulfide phenols compound hippuric acid methyl hippuric acid Heinz body trinitrotoluene anilineplasticssynthetic fiber synthetic rubber polymer monomer pesticide砷硒硼刺激性气体氯光气氨窒息性气体有机溶剂苯甲苯二甲苯苯胺硝基苯四氯化碳氯乙烯丙烯腈苯乙烯丁二烯二硫化碳酚类化物马尿酸甲基马尿酸赫恩滋小体三硝基甲苯阿尼林(苯胺)塑料合成纤维合成橡胶聚合物单体农药insecticide杀虫剂acaricide杀螨剂nematocide杀线虫剂molluscacide杀软体动物剂rodenticide杀鼠剂fungicide杀菌剂herbicide除草剂defoliant脱叶剂plant growth regulator organophosphorus pesticide organophosphatesthio--organophosphatescholinesterase，ChE acetylcholine，Ach neurotoxicesterase，NTE carbamatescarbarylpneumoconiosisinorganic dustorganic dustmixed dust aerodynamicequivalentdiameter，AED non—inhalable dustinhalable dustrespirable dustimpactionsedimentationdiffusioninterceptionsilicosissilicatosis植物生长调节剂有机磷农药有机磷酸酯类硫代有机磷酸酯类胆碱酯酶乙酰胆碱神经毒酯酶氨基甲酸酯类西维因(胺甲奈)尘肺无机粉尘有机粉尘混合性粉尘空气动力学直径非吸入性粉尘可吸人性粉尘呼吸性粉尘撞击沉降弥散截留矽肺硅酸盐肺carbon black pneumoconiosis碳黑尘肺mixeddustpneumoconiosis混合性尘肺metallic pneumoconiosis金属尘肺byssinosis棉尘症occupational allergic alveolitis职业性变应性肺泡炎chronic obstructive pulmonary非特异性慢性阻塞性肺病quartzacute silicosisdelayed silicosissilanol grouphydrogen bondasbestosdustandasbestosischrysotileamphibole groupcrocidoliteamositeanthophyllitethemoliteactinolitehornblendeferruginous bodycoalworker'spneumoconiosisprogressive massive fibrosis，PMFfarmer’s lungheat stressheat load physiological heat strain hyperthermiaheat acclimatization heatstressprotein，HSP heat strokesun stroke石英速发型矽肺晚发型矽肺硅烷醇基团氢键石棉粉尘和石棉肺温石棉闪石类青石棉铁石棉直闪石透闪石阳闪石角闪石含铁小体煤工尘肺进行性大块纤维化农民肺热应激热负荷生理性热应激反应过热热适应热应激蛋白热射病日射病heat cramp热痉挛heat exhaustion热衰竭evaporation蒸发radiation辐射naturalventilation自然通风mechanical ventilation机械通风bends屈肢症acclimatizationnoisesound pressurethreshold of hearingthreshold of painingsound intensitysound leveldecibel，dBsound frequencyinfrasonicsultrasonicsoctave bandloudnessloudness level equalloudnesscontoursweighted sound level speechinterferencelevelimpulsive noisesteady state noise auditoryadaptationauditory fatigue temporaryhearingthresholdshift，TTS permanent hearing threshold shift，PTS hearing impairment习服噪声声压听阈痛阈声强声级分贝声频次声超声频带响度响度级等响曲线计权声级语言干扰级脉冲噪声稳态噪声听觉适应听觉疲劳暂时性听闻位移永久性听同位移听力损伤noise—induceddeafness噪声性耳聋explosivedeafness暴震性耳聋vibration振动vibrationalfrequency振动频率displacement位移amplitude振幅velocityaccelerationpeak valuepeak--to—peakvalueaverage valuenatural frequencyresonanceresonant frequency frequencyweightedacceleration whole—bodyvibration segmentalvibration hand—transmittedvibration hand—armvibrationmotion sicknessRaynaud'sphenomenonSegmentalvibrationaldiseaseRaynaud's phenomenon of occupational origin Vibrationalwhitefinger，VWFhand—arm vibrational syndrome，HAV vibrationadisease reducedcomfortboundary速度加速度峰值峰一峰值平均值固有频率共振共振频率频率计权加速度全身振动局部振动手传振动手臂振动运动病雷诺氏现象局部振动病职业性雷诺氏现象振动性白指手臂振动综合征振动性疾病舒适界限降低fatigue—decreasedproficiency疲劳减效界限boundary exposure limit承受极限nonionizingradiation非电离辐射electromagnetic radiation电磁辐射electromagnetic radiation spectrum电磁辐射谱high frequency electromagnetic field高频电磁场microwaveinfrared radiationultraviolet radiationelectro--ophthalmitislaserionizing radiationdecompressal sicknessmountain sicknessoccupationaltumorsoccupationally carcinogenic factorschloro--methyl--methyl--ether environmental monitoringbiologicalmonitoringexternal exposureinternal exposure healthsurveillance pre—employmentexamination periodical examinationscreening occupationalepidemiology associationcausal relationship exposure—response relationship微波红外辐射紫外辐射电光性眼炎激光电离辐射减压病高空病高山病职业肿瘤职业致癌因素氯甲甲醚环境监测生物学监测外接触内接触健康监护就业前检查定期检查筛检职业流行病学联系因果关系接触一反应关系exposure—effectrelationship接触一效应关系analytic epidemiologic study分析性流行病学调查cross—sectional study断面调查cohort study队列调查prospective study前瞻性调查historicalprospectivestudyretrospective cohort studyfollow—upstudy／longitudinalstudycase—control studyretrospective studyrelativerisk，RRattributable risk，ARodds ratio，ORstandardizedmortalityratio，SMRstandardized incidence ratio，SIRproportional mortality ratio，PMRtoxicityriskrisk assessmentacceptable riskhazard identificationqualitative risk assessmentdose—response assessmentquantitative risk assessment历史性前瞻调查回顾性队列调查纵向性随访研究病例一对照调查回顾性调查相对危险度归因危险度比数比标化死亡比标化发病比比例死亡比毒性危险性危险度评定可接受的危险度危害识别危险度的定性评定剂量一反应评定危险度的定量评定response反应effect效应uncertainty factor不肯定因素exposure assessment接触评定exposureestimation接触估测riskcharacterization危险度特征分析risk management generally regarded as safe levelvirtually safe dose，VSDhealthstandardexposurelimitmaximum allowable concentration，MAC thresholdlimitvalue，TLVthreshold limit value--timeweighted average, TLV-TWAthreshold limit value—shortterm exposure limit, TLV-STELthreshold limit value ceiling，TLV--Cpermissible exposure limit，PELhealth—based occupational exposure limit maximum allowable biological concentration，MABC biologicalexposurelimitbiological exposure index，BEIadverseeffecttechnological feasibility危险度管理一般认为安全的水平实际上安全剂量卫生标准接触限量最高容许浓度阈限值时间加权干均阈限值短时间接触阈限值上限值容许接触限值保证健康的职业接触限值最高容许生物浓度生物学接触限值生物接触指数有害效应技术上可行性economic feasibility经济上可行性industrial ventilation工业通风heat pressure热压air dynamic pressure风压fan普通风扇sprayingfan喷雾风扇lightingilluminationluminous fluxbrightnesslighting coefficient，Cprotective clothingregulation for occupational healthpreventive health inspectionroutinehealthinspectionoccupational health of working womenextrinsic allergic alveolitissmall scale industryconfounding effectsmaximumoxygenintakeheart rate，HRstepping testmaximumpermissiblelimit pneumonometervalidationdiscriminant analysis stepwiseregressionanalysis Average Batch CV，ABCV Reference value采光照明光通量亮度采光系数防护服劳动卫生法规预防性卫生监督经常性卫生监督妇女劳动卫生外源性变压性肺泡炎小工业混杂效应最大摄氧量心率阶梯试验最大容许限值肺通气量仪验证判别分析逐步回归分析方法平均批变异系数参考值Critical Value临界值Equivalent continuous A—weighted sound pressure level等效连续A声级31/ 31。

TMS320VC5402AFixed-Point Digital Signal Processor Data ManualPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.Literature Number:SPRS015FSeptember2001–Revised October2008Revision HistoryTMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER 2001–REVISED OCTOBER 2008NOTE:Page numbers for previous revisions may differ from page numbers in the current version.This data sheet revision history highlights the technical changes made to the SPRS015E device-specific data sheet to make it an SPRS015F revision.Scope:This document has been reviewed for technical accuracy;the technical content is up-to-date as of the specified release date with the following corrections.2Revision History Submit Documentation FeedbackContentsTMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER 2001–REVISED OCTOBER 2008Revision History ...........................................................................................................................1TMS320VC5402ADSP...........................................................................................................1.1Features.......................................................................................................................2Introduction.......................................................................................................................2.1Description..................................................................................................................2.2Pin Assignments............................................................................................................2.2.1Terminal AssignmentsfortheGGUPackage...............................................................2.2.2Pin Assignmentsfor the PGE Package ......................................................................2.3Signal Descriptions .........................................................................................................3Functional Overview ...........................................................................................................3.1Memory ......................................................................................................................3.1.1Data Memory .....................................................................................................3.1.2Program Memory ...............................................................................................3.1.3Extended Program Memory ...................................................................................3.2On-Chip ROM With Bootloader ...........................................................................................3.3On-Chip RAM ...............................................................................................................3.4On-Chip Memory Security .................................................................................................3.5Memory Map ................................................................................................................3.5.1Relocatable Interrupt Vector Table ............................................................................3.6On-Chip Peripherals .......................................................................................................3.6.1Software-Programmable Wait-State Generator .............................................................3.6.2Programmable Bank-Switching ................................................................................3.6.3Bus Holders ......................................................................................................3.7Parallel I/O Ports ...........................................................................................................3.7.1Enhanced 8-/16-Bit Host-Port Interface (HPI8/16)..........................................................3.7.2HPI Nonmultiplexed Mode ......................................................................................3.8Multichannel Buffered Serial Ports (McBSPs)..........................................................................3.9Hardware Timer ............................................................................................................3.10Clock Generator ............................................................................................................3.11Enhanced External Parallel Interface (XIO2)...........................................................................3.12DMA Controller .............................................................................................................3.12.1Features ..........................................................................................................3.12.2DMA External Access ..........................................................................................3.12.3DMPREC Issue .................................................................................................3.12.4DMA Memory Map ..............................................................................................3.12.5DMA Priority Level ...............................................................................................3.12.6DMA Source/Destination Address Modification .............................................................3.12.7DMA in Autoinitialization Mode ...............................................................................3.12.8DMA Transfer Counting .........................................................................................3.12.9DMA Transfer in Doubleword Mode ..........................................................................3.12.10DMA Channel Index Registers ..............................................................................3.12.11DMA Interrupts ................................................................................................3.12.12DMA Controller Synchronization Events ....................................................................3.13General-Purpose I/O Pins .................................................................................................3.13.1McBSP Pins as General-Purpose I/O .........................................................................3.13.2HPI Data Pins as General-Purpose I/O ......................................................................3.14Memory-Mapped Registers ...............................................................................................3.15McBSP Control Registers and Subaddresses ..........................................................................3.16DMA Subbank Addressed Registers ....................................................................................Contents3TMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER2001–REVISED 3.17Interrupts....................................................................................................................4Support.............................................................................................................................4.1Documentation Support...................................................................................................4.2Device and Development-Support Tool Nomenclature................................................................5Specification......................................................................................................................5.1Absolute Maximum Ratings...............................................................................................5.2Recommended Operating Conditions...................................................................................5.3Electrical Characteristics Over Recommended Operating Case TemperatureRange(Unless Otherwise Noted)........................................................................................5.3.1Test Load Circuit...........................................................................................................5.3.2Timing Parameter Symbology............................................................................................5.3.3Internal Oscillator With External Crystal.................................................................................5.3.4Clock Options...............................................................................................................5.3.4.1Divide-By-Two and Divide-By-Four Clock Options.........................................................5.3.4.2Multiply-By-N Clock Option(PLL Enabled)..................................................................5.3.5Memory and Parallel I/O Interface Timing..............................................................................5.3.5.1Memory Read..................................................................................................5.3.5.2Memory Write..................................................................................................5.3.5.3I/O Read........................................................................................................5.3.5.4I/O Write.........................................................................................................5.3.6Ready Timing for Externally Generated Wait States..................................................................5.3.7HOLD and HOLDA Timings...............................................................................................5.3.8Reset,Interrupt,and Timings.............................................................................5.3.9Instruction Acquisition and Interrupt Acknowledge Timings..........................................5.3.10External Flag(XF)and TOUT Timings.................................................................................5.3.11Multichannel Buffered Serial Port(McBSP)Timing...................................................................5.3.11.1McBSP Transmit and Receive Timings...................................................................5.3.11.2McBSP General-Purpose I/O Timing.......................................................................5.3.11.3McBSP as SPI Master or Slave Timing....................................................................5.3.12Host-Port Interface Timing...............................................................................................5.3.12.1HPI8Mode.....................................................................................................5.3.12.2HPI16Mode....................................................................................................6Mechanical Data.................................................................................................................6.1Package Thermal Resistance Characteristics..........................................................................4Contents Submit Documentation FeedbackTMS320VC5402AFixed-Point Digital Signal Processor SPRS015F–SEPTEMBER2001–REVISED OCTOBER2008List of Figures2-1144-Ball GGU MicroStar BGA™(Bottom View)..............................................................................2-2144-Pin PGE Low-Profile Quad Flatpack(Top View)........................................................................3-1TMS320VC5402A Functional Block Diagram.................................................................................3-2Program and Data Memory Map................................................................................................3-3Extended Program Memory Map...............................................................................................3-4Processor Mode Status Register(PMST).....................................................................................3-5Software Wait-State Register(SWWSR)[Memory-Mapped Register(MMR)Address0028h]....................................................................................................................3-6Software Wait-State Control Register(SWCR)[MMR Address002Bh]...................................................3-7Bank-Switching Control Register(BSCR)[MMR Address0029h]..........................................................3-8Host-Port Interface—Nonmultiplexed Mode.................................................................................3-9HPI Memory Map.................................................................................................................3-10Pin Control Register(PCR)......................................................................................................3-11Multichannel Control Register1x(MCR1x)....................................................................................3-12Multichannel Control Register2x(MCR2x)....................................................................................3-13Receive Channel Enable Registers Bit Layout for Partitions A to H.......................................................3-14Transmit Channel Enable Registers Bit Layout for Partitions A to H.......................................................3-15Nonconsecutive Memory Read and I/O Read Bus Sequence..............................................................3-16Consecutive Memory Read Bus Sequence(n=3reads)...................................................................3-17Memory Write and I/O Write Bus Sequence...................................................................................3-18Transfer Mode Control Register(DMMCRn)..................................................................................3-19DMA Channel Enable Control Register(DMCECTL).........................................................................3-20On-Chip DMA Memory Map for Program Space(DLAXS=0and SLAXS=0)..........................................3-21On-Chip DMA Memory Map for Data and IO Space(DLAXS=0and SLAXS=0)......................................3-22DMPREC Register................................................................................................................3-23General-Purpose I/O Control Register(GPIOCR)[MMR Address003Ch]................................................3-24General-Purpose I/O Status Register(GPIOSR)[MMR Address003Dh].................................................3-25IFR and IMR.......................................................................................................................5-1Tester Pin Electronics............................................................................................................5-2Internal Divide-By-Two Clock Option With External Crystal.................................................................5-3External Divide-By-Two Clock Timing..........................................................................................5-4Multiply-By-One Clock Timing...................................................................................................5-5Nonconsecutive Mode Memory Reads.........................................................................................5-6Consecutive Mode Memory Reads.............................................................................................5-7Memory Write(MSTRB=0).....................................................................................................5-8Parallel I/O Port Read(IOSTRB=0)...........................................................................................5-9Parallel I/O Port Write(IOSTRB=0)...........................................................................................5-10Memory Read With Externally Generated Wait States.......................................................................5-11Memory Write With Externally Generated Wait States.......................................................................5-12I/O Read With Externally Generated Wait States.............................................................................List of Figures5TMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER2001–REVISED 5-13I/O Write With Externally Generated Wait States.............................................................................5-14HOLD and HOLDA Timings(HM=1)..........................................................................................5-15Reset and BIO Timings...........................................................................................................5-16Interrupt Timing....................................................................................................................5-17MP/MC Timing.....................................................................................................................5-18Instruction Acquisition(IAQ)and Interrupt Acknowledge(IACK)Timings.................................................5-19External Flag(XF)Timing........................................................................................................5-20TOUT Timing......................................................................................................................5-21McBSP Receive Timings.........................................................................................................5-22McBSP Transmit Timings........................................................................................................5-23McBSP General-Purpose I/O Timings..........................................................................................5-24McBSP Timing as SPI Master or Slave:CLKSTP=10b,CLKXP=0.....................................................5-25McBSP Timing as SPI Master or Slave:CLKSTP=11b,CLKXP=0.....................................................5-26McBSP Timing as SPI Master or Slave:CLKSTP=10b,CLKXP=1.....................................................5-27McBSP Timing as SPI Master or Slave:CLKSTP=11b,CLKXP=1.....................................................5-28HPI-8Mode Timing,Using HDS to Control Accesses(HCS Always Low)................................................5-29HPI-8Mode Timing,Using HCS to Control Accesses.......................................................................5-30HPI-8Mode,HINT Timing.......................................................................................................5-31GPIOx Timings....................................................................................................................5-32HPI-16Mode,Nonmultiplexed Read Timings.................................................................................5-33HPI-16Mode,Nonmultiplexed Write Timings.................................................................................5-34HPI-16Mode,HRDY Relative to CLKOUT....................................................................................6List of Figures Submit Documentation FeedbackTMS320VC5402AFixed-Point Digital Signal Processor SPRS015F–SEPTEMBER2001–REVISED OCTOBER2008List of Tables2-1Terminal Assignments...........................................................................................................2-2Signal Descriptions...............................................................................................................3-1Standard On-Chip ROM Layout................................................................................................3-2Processor Mode Status Register(PMST)Field Descriptions...............................................................3-3Software Wait-State Register(SWWSR)Field Descriptions................................................................3-4Software Wait-State Control Register(SWCR)Field Descriptions.........................................................3-5Bank-Switching Control Register(BSCR)Field Descriptions...............................................................3-6Bus Holder Control Bits..........................................................................................................3-7Sample Rate Generator Clock Source Selection.............................................................................3-8Receive Channel Enable Registers for Partitions A to H Field Descriptions..............................................3-9Transmit Channel Enable Registers for Partitions A to H Field Descriptions.............................................3-10Clock Mode Settings at Reset...................................................................................................3-11DMD Section of the DMMCRn Register........................................................................................3-12DMA Channel Enable Control Register(DMCECTL)Descriptions.........................................................3-13DMA Reload Register Selection................................................................................................3-14DMA Interrupts....................................................................................................................3-15DMA Synchronization Events....................................................................................................3-16DMA Channel Interrupt Selection...............................................................................................3-17CPU Memory-Mapped Registers................................................................................................3-18Peripheral Memory-Mapped Registers for Each DSP Subsystem.........................................................3-19McBSP Control Registers and Subaddresses.................................................................................3-20DMA Subbank Addressed Registers...........................................................................................3-21Interrupt Locations and Priorities................................................................................................5-1Input Clock Frequency Characteristics.........................................................................................5-2Clock Mode Pin Settings for the Divide-By-2and Divide-By-4Clock Options............................................5-3Divide-By-2and Divide-By-4Clock Options Timing Requirements........................................................5-4Divide-By-2and Divide-By-4Clock Options Switching Characteristics....................................................5-5Multiply-By-N Clock Option Timing Requirements............................................................................5-6Multiply-By-N Clock Option Switching Characteristics.......................................................................5-7Memory Read Timing Requirements...........................................................................................5-8Memory Read Switching Characteristics.......................................................................................5-9Memory Write Switching Characteristics.......................................................................................5-10I/O Read Timing Requirements.................................................................................................5-11I/O Read Switching Characteristics.............................................................................................5-12I/O Write Switching Characteristics.............................................................................................5-13Ready Timing Requirements for Externally Generated Wait States.......................................................5-14Ready Switching Characteristics for Externally Generated Wait States..................................................5-15HOLD and HOLDA Timing Requirements.....................................................................................5-16HOLD and HOLDA Switching Characteristics.................................................................................List of Tables7TMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER2001–REVISED 5-17Reset,BIO,Interrupt,and MP/MC Timing Requirements...................................................................5-18Instruction Acquisition(IAQ)and Interrupt Acknowledge(IACK)Switching Characteristics............................5-19External Flag(XF)and TOUT Switching Characteristics....................................................................5-20McBSP Transmit and Receive Timing Requirements.......................................................................5-21McBSP Transmit and Receive Switching Characteristics...................................................................5-22McBSP General-Purpose I/O Timing Requirements.........................................................................5-23McBSP General-Purpose I/O Switching Characteristics.....................................................................5-24McBSP as SPI Master or Slave Timing Requirements(CLKSTP=10b,CLKXP=0)..................................5-25McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=10b,CLKXP=0).............................5-26McBSP as SPI Master or Slave Timing Requirements(CLKSTP=11b,CLKXP=0)..................................5-27McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=11b,CLKXP=0).............................5-28McBSP as SPI Master or Slave Timing Requirements(CLKSTP=10b,CLKXP=1)..................................5-29McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=10b,CLKXP=1).............................5-30McBSP as SPI Master or Slave Timing Requirements(CLKSTP=11b,CLKXP=1)..................................5-31McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=11b,CLKXP=1).............................5-32HPI8Mode Timing Requirements...............................................................................................5-33HPI8Mode Switching Characteristics..........................................................................................5-34HPI16Mode Timing Requirements.............................................................................................5-35HPI16Mode Switching Characteristics.........................................................................................6-1Thermal Resistance Characteristics............................................................................................8Submit Documentation Feedback List of Tables1TMS320VC5402A DSP1.1FeaturesTMS320VC5402AFixed-Point Digital Signal ProcessorSPRS015F–SEPTEMBER 2001–REVISED OCTOBER 2008•Arithmetic Instructions With Parallel Store and •Advanced Multibus Architecture With Three Parallel LoadSeparate 16-Bit Data Memory Buses and One Program Memory Bus•Conditional Store Instructions •40-Bit Arithmetic Logic Unit (ALU)Including a •Fast Return From Interrupt 40-Bit Barrel Shifter and Two Independent •On-Chip Peripherals40-Bit Accumulators–Software-Programmable Wait-State •17-×17-Bit Parallel Multiplier Coupled to a Generator and Programmable 40-Bit Dedicated Adder for Non-Pipelined Bank-SwitchingSingle-Cycle Multiply/Accumulate (MAC)–On-Chip Programmable Phase-Locked OperationLoop (PLL)Clock Generator With Internal Oscillator or External Clock Source (1)•Compare,Select,and Store Unit (CSSU)for the –Two 16-Bit TimersAdd/Compare Selection of the Viterbi Operator –Six-Channel Direct Memory Access (DMA)•Exponent Encoder to Compute an Exponent ControllerValue of a 40-Bit Accumulator Value in a –Three Multichannel Buffered Serial Ports Single Cycle(McBSPs)•Two Address Generators With Eight Auxiliary –8/16-Bit Enhanced Parallel Host-Port Registers and Two Auxiliary Register Interface (HPI8/16)Arithmetic Units (ARAUs)•Power Consumption Control With IDLE1,•Data Bus With a Bus Holder FeatureIDLE2,and IDLE3Instructions With •Extended Addressing Mode for 8M ×16-Bit Power-Down ModesMaximum Addressable External Program •CLKOUT Off Control to Disable CLKOUT Space•On-Chip Scan-Based Emulation Logic,IEEE •16K ×16-Bit On-Chip RAM Composed of:Std 1149.1(JTAG)Boundary Scan Logic (2)–Two Blocks of 8K ×16-Bit On-Chip •144-Pin Ball Grid Array (BGA)[GGU Suffix]Dual-Access Program/Data RAM•144-Pin Low-Profile Quad Flatpack •16K ×16-Bit On-Chip ROM Configured for (LQFP)(PGE Suffix)Program Memory• 6.25-ns Single-Cycle Fixed-Point Instruction •Enhanced External Parallel Interface (XIO2)Execution Time (160MIPS)•Single-Instruction-Repeat and Block-Repeat • 3.3-V I/O Supply Voltage Operations for Program Code•1.6-V Core Supply Voltage•Block-Memory-Move Instructions for Better Program and Data Management(1)The on-chip oscillator is not available on all 5402A devices.For applicable devices,see the TMS320VC5402A Digital •Instructions With a 32-Bit Long Word Operand Signal Processor Silicon Errata (literature number SPRZ018).•Instructions With Two-or Three-Operand (2)IEEE Standard 1149.1-1990Standard-Test-Access Port and ReadsBoundary Scan Architecture.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.TMS320C54x,BGA,C54x,TMS320C5000,C5000,TMS320are trademarks of Texas Instruments.All other trademarks are the property of their respective owners.PRODUCTION DATA information is current as of publication date.Copyright ©2001–2008,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.。

英语的healthy diet小作文1. A healthy diet is essential for overall well-being.2. It is important to consume a balanced mix of nutrients for optimal health.3. Fresh fruits and vegetables should form a significant part of a healthy diet.4. Whole grains are a great source of fiber and should be included in daily meals.5. Lean proteins, such as chicken and fish, provide essential amino acids.6. Dairy products, like milk and yogurt, are rich in calcium for strong bones.7. Limiting the intake of processed foods and sugary drinks is crucial for a healthy diet.8. Drinking plenty of water helps maintain proper hydration and aids digestion.9. Snacking on nuts and seeds is a nutritious option fora healthy diet.10. Including a variety of colors in your meals ensures a wide range of nutrients.11. Eating smaller portions and chewing food slowly can prevent overeating.12. Cooking meals at home with fresh ingredients allows better control over the preparation.13. A healthy diet can improve concentration andcognitive functions.14. Regular physical activity is essential to complementa healthy diet.15. Avoiding excessive alcohol consumption is important for maintaining a healthy lifestyle.16. Incorporating regular meals and avoiding irregular eating patterns is beneficial.17. A diet rich in antioxidants can help reduce the risk of chronic diseases.18. Consuming moderate amounts of fats and oils is necessary for the body's functions.19. Choosing healthier cooking methods, like steaming or baking, is advisable.20. Paying attention to portion sizes can help maintain a healthy weight.21. Regularly consuming probiotics, like yogurt, can contribute to gut health.22. A balanced diet promotes proper growth and development in children.23. Including sources of omega-3 fatty acids, such as fish, improves heart health.24. Limiting the intake of saturated and trans fats is crucial for cardiovascular health.25. Incorporating vegetarian or vegan options into your diet can be beneficial.26. Consuming less sodium can help lower the risk of high blood pressure.27. A healthy diet can improve the quality of sleep and overall mood.28. Maintaining a healthy diet can help prevent or manage chronic conditions, such as diabetes.29. Regularly consuming fiber-rich foods promotes a healthy digestive system.30. Eating a variety of proteins, including plant-based sources, supports muscle growth.31. A well-balanced diet can boost the immune system.32. Including fermented foods, like kimchi or sauerkraut, supports gut health.33. Limiting the consumption of processed meats reduces the risk of certain cancers.34. Consuming a variety of herbs and spices adds flavor and nutritional benefits to meals.35. A healthy diet can contribute to reduced inflammation in the body.36. Adequate vitamin and mineral intake supports overall health and well-being.37. Avoiding excessive sugary snacks helps prevent dental cavities.38. Choosing organic and locally sourced produce can minimize exposure to pesticides.39. Limiting the consumption of sugary beverages reduces the risk of obesity.40. A healthy diet can improve skin health and contribute to a youthful appearance.41. Adequate calcium intake supports bone health and prevents osteoporosis.42. Consuming foods rich in vitamin C strengthens the immune system.43. Including sources of vitamin D, such as fortified dairy products, promotes bone health.44. Regularly consuming iron-rich foods supports the production of red blood cells.45. A healthy diet can improve fertility and reproductive health.46. Including healthy fats, such as avocados and nuts, supports brain function.47. Regularly consuming legumes provides a good source of protein and fiber.48. Eating breakfast regularly kick-starts the metabolism and prevents overeating later in the day.49. Drinking green tea provides antioxidants and promotes weight management.50. A healthy diet can reduce the risk of developing metabolic syndrome.51. Regularly consuming low-fat dairy products supports weight management.52. Including sources of vitamin A, such as carrots and sweet potatoes, promotes eye health.53. Avoiding excessive caffeine intake helps maintain a healthy sleep pattern.54. Consuming foods rich in antioxidants can slow down the aging process.55. Limiting the consumption of processed snacks and desserts promotes a healthy weight.56. A healthy diet can improve insulin sensitivity and prevent type 2 diabetes.57. Including sources of folate, such as leafy greens, supports healthy pregnancies.58. Regularly consuming fermented foods supports a healthy gut microbiome.59. Eating a well-balanced diet can reduce the risk of kidney stones.60. Limiting the consumption of high-sodium foods helps maintain healthy blood pressure levels.61. Consuming adequate amounts of potassium supports heart health.62. Including probiotic-rich foods, like yogurt, supports natural gut bacteria balance.63. Regularly consuming citrus fruits provides a good source of vitamin C.64. Eating a rainbow of fruits and vegetables provides a diverse range of nutrients.65. A healthy diet can improve energy levels and reduce fatigue.66. Consuming foods rich in vitamin E promotes healthy skin and hair.67. Limiting the intake of added sugars helps prevent tooth decay.68. Including whole eggs in moderation can provide essential nutrients.69. Regularly consuming fish, like salmon, promotes heart health due to omega-3 fatty acids.70. Avoiding excessive consumption of fried foods reduces the risk of heart disease.71. A healthy diet can support liver health by reducing the burden on this organ.72. Including sources of zinc, like lean meats and nuts, improves immune function.73. Consuming foods rich in B vitamins, such as whole grains, supports brain health.74. Eating fermented foods, like kefir, provides beneficial probiotics for gut health.75. Limiting the consumption of sugary cereals promotes a healthy breakfast routine.76. Including sources of magnesium, such as leafy greens, supports muscle and nerve function.77. Regularly consuming dark chocolate in moderation provides antioxidants for heart health.78. A healthy diet can reduce the risk of developing gallstones.79. Consuming foods rich in fiber improves satiety and aids in weight management.80. Drinking herbal teas, like chamomile or peppermint, supports digestion and relaxation.81. Including sources of selenium, like Brazil nuts and sardines, supports thyroid function.82. Avoiding excessive intake of added sugars reduces the risk of fatty liver disease.83. A healthy diet can improve lung function and reduce the risk of respiratory illnesses.84. Consuming foods rich in lycopene, such as tomatoes, supports prostate health.85. Eating a variety of whole fruits is preferable to consuming fruit juices for fiber intake.86. Regularly consuming high-fiber foods aids in maintaining regular bowel movements.87. A well-balanced diet can lower the risk of developing heart disease.88. Including sources of vitamin K, like leafy greens, promotes blood clotting.89. Limiting the consumption of high-mercury fish is important for overall health.90. Consuming foods rich in antioxidants supports eye health and reduces the risk of macular degeneration.91. Drinking unsweetened herbal tea can help with hydration and provide health benefits.92. A healthy diet can reduce the risk of developing certain types of cancer.93. Including sources of iodine, such as seaweed and iodized salt, supports thyroid health.94. Eating slowly and mindfully promotes better digestion and prevents overeating.95. Limiting the intake of processed snacks and desserts reduces the risk of obesity and diabetes.96. Consuming foods rich in phosphorus, such as lean meat and dairy, supports bone health.97. Regularly consuming cruciferous vegetables, like broccoli and cauliflower, supports liver detoxification.98. A healthy diet can improve hormonal balance and reduce the risk of reproductive disorders.99. Including sources of vitamin B12, such as fortified cereals or nutritional yeast, supports nerve function.100. Limiting the consumption of high-sugar foods helps maintain stable blood sugar levels.101. Consuming foods rich in iron, such as lentils and spinach, prevents iron deficiency anemia.102. Eating a well-balanced diet can reduce the risk of developing Alzheimer's disease.103. Regularly consuming foods rich in antioxidants supports cardiovascular health.104. A healthy diet can improve joint health and reduce the risk of arthritis.105. Including sources of vitamin B6, such as bananas and poultry, supports brain health.106. Avoiding excessive consumption of processed meats reduces the risk of colon cancer.107. Consuming foods rich in fiber supports a healthy gut microbiome.。

Unit 8 Every‎b ody Can Help the Envir‎o nmen‎tPart 1 A1.Green‎p eace‎i s an indep‎enden‎t globa‎l campa‎i gnin‎g organ‎i zati‎o n that acts to chang‎e attit‎u desand behav‎i or, to prote‎ct and conse‎rve the envir‎o nmen‎t and to promo‎t e peace‎.2.WWF World‎Wildl‎i f e Found‎a tion‎was born into the world‎i n 1961. Its ultim‎a te goal is tobuild‎ a futur‎e where‎peopl‎e live in harmo‎n y with natur‎e.3.SOS is the ongoi‎n g messa‎g i ng campa‎i gn and large‎r movem‎e nt behin‎d Live Earth‎. The messa‎ge of SOS is that every‎o ne, every‎where‎ can must Answe‎r the Call to solve‎the clima‎te crisi‎s.4.Green‎Schoo‎l Proje‎ct is an organ‎i zati‎o n that helps‎schoo‎l s acros‎s the US with their‎ budge‎t sin order‎to reduc‎e the amoun‎t of waste‎ that goes to the landf‎i ll.5.On Decem‎b er 10, 2007, the Inter‎g over‎n ment‎a l Panel‎ on Clima‎t e Chang‎e and Al Gore Jr.were award‎e d the Nobel‎ Peace‎Prize‎for “their‎effor‎t s to build‎up and disse‎m i nat‎e great‎e r knowl‎e dge about‎ man-made clima‎t e chang‎e, and to lay the found‎a tion‎s for the measu‎res that are neede‎d to count‎e ract‎ such chang‎e.”6.Frien‎d s of the Earth‎Inter‎n atio‎nal is the world‎’s large‎s t grass‎roots‎envir‎o nmen‎t al netwo‎rk,uniti‎n g 70 natio‎n al membe‎r group‎s and some 5,000 local‎activ‎i st group‎s on every‎conti‎n ent.It campa‎i gns on today‎’s most urgen‎t envir‎o nmen‎t al and socia‎l issue‎s.7.EEB Europ‎ean Envir‎o nmen‎t al Burea‎u is a non-gover‎n ment‎a l organ‎i zati‎o n with 143 membe‎rorgan‎i zati‎o ns in 31 count‎ri es. Its speci‎fi c missi‎o n is to promo‎t e envir‎o nmen‎t al polic‎i es and susta‎i nabl‎e polic‎i es on the Europ‎e an Union‎level‎.8.The Surfr‎i der Found‎a tion‎i s a non-profi‎t grass‎roots‎ organ‎i zati‎o n dedic‎a ted to the prote‎cti on‎and enjoy‎m ent of the world‎’s ocean‎s, waves‎and beach‎e s. Found‎e d in 1984 in Calif‎o rnia‎, it now maint‎a ins over 50,000 membe‎r s world‎wi de.GBC‎The U.S. Green‎B uild‎i ng Counc‎i l is a non-profi‎t organ‎i zati‎o n commi‎t ted totrans‎f ormi‎n g the way build‎i ngs and commu‎ni tie‎s are desig‎n ed, built‎and opera‎t ed, enabl‎i ng and envir‎o nmen‎t ally‎and socia‎l ly respo‎n sibl‎e, healt‎h y, and prosp‎e rous‎ envir‎o nmen‎t that impro‎v es the quali‎t y of life.10.Found‎e d in 1977, the Allia‎n ce to Save Energ‎y i s a non-profi‎t organ‎i zati‎o n that suppo‎rts energ‎y effic‎i ency‎and advoc‎a tes energ‎y-effic‎i ency‎polic‎i es that minim‎i ze costs‎to socie‎t y and indiv‎i dual‎ consu‎m ers, and that lesse‎n green‎h ouse‎gas emiss‎i ons and their‎i mpac‎t on the globa‎l clima‎t e.11.The Earth‎Organ‎i zati‎o n i s a grass‎roots‎ inter‎n atio‎n al non-profi‎t, conse‎rvati‎o n andenvir‎o nmen‎t al organ‎i zati‎o n, with new solut‎i ons, commi‎t ted to the creat‎i ve, respo‎n sibl‎e rehab‎ilita‎ti on of Plane‎t Earth‎and the plant‎ and anima‎l kingd‎o ms.12.TWP Trees‎, Water‎ & Peopl‎e i s a nonpr‎o fi t organ‎i zati‎o n found‎e d in 1998, helpi‎n g commu‎ni tie‎s prote‎ct, conse‎rve, and manag‎e the natur‎a l resou‎r ces upon which‎their‎l ong-term well-bei ng‎depen‎d s.13.Ameri‎c an Fores‎t s is Ameri‎c a’s oldes‎t nonpr‎o fit citiz‎e ns’ conse‎r vati‎o n organ‎i zati‎o n found‎e d in1875. It works‎ to prote‎ct, resto‎re and enhan‎ce the natur‎a l capit‎a l of trees‎and fores‎t s. Heal t‎h y fores‎t s filte‎r water‎, remov‎e air pollu‎t ion, seque‎ster carbo‎n, and provi‎d e homes‎ for wildl‎i fe. 14.GAA The Globa‎l Amphi‎b i an Asses‎sment‎i s the first‎-ever compr‎e hens‎i ve asses‎sment‎ of theconse‎rvati‎o n statu‎s of the world‎’s 5,918known‎speci‎e s of frogs‎, toads‎, salam‎ander‎s, and caeci‎l ians‎. Almos‎t600 scien‎t i sts‎from 60 count‎ries have now contr‎i bute‎d to the proje‎ct.15.ASES The Ameri‎c an Solar‎Energ‎y Socie‎t y, found‎e d in 1954, is a non-profi‎t organ‎i zati‎o ndedic‎a ted to incre‎a sing‎the use of solar‎energ‎y, energ‎y effic‎i ency‎, and other‎ susta‎i nabl‎e techn‎ol ogi‎e s in the U.S.B1.Buy fresh‎food that doesn‎’t need a lot of packa‎g i ng.2.Try to buy “organ‎i c” fruit‎ and veget‎a bles‎from farme‎rs who don‘t use chemi‎c al s.3.Save as much water‎ a s possi‎b l e.e produ‎cts that won’t stay forev‎e r in the earth‎o r sea when you throw‎then away.e bottl‎e s more than once or take them to a bottl‎e bank.6.Try to save paper‎. Also, buy and use recyc‎l ed paper‎a s often‎as possi‎b l e.7.A void‎“throw‎-away” produ‎ct s.8.Make sure that your famil‎y and frien‎d s use unlea‎d ed petro‎l in their‎ cars.9.Don’t buy produ‎cts (fur or ivory‎, for examp‎l e) made from rare or prote‎cted speci‎e s.e publi‎c trans‎p orta‎ti on as often‎as possi‎b l e.11.If you’re buyin‎g wood, don’t choos‎e hardw‎o od form tropi‎c al rainf‎o rest‎s.12.Look for aeros‎o l s which‎haven‎’t got any CFCs in them.13.Don’t buy hambu‎r gers‎or pizza‎s in plast‎i c boxes‎ whi ch‎conta‎i n CFCs.e batte‎ries as littl‎e as possi‎b l e. It takes‎50times‎ more energ‎y to make them than theyprodu‎ce.15.Don’t leave‎on elect‎ri c light‎s, TV, hi-fi, etc., if you’re not using‎them.16.Find out more about‎conse‎rvati‎o n i ssue‎s in your area. Are there‎any woods‎or field‎s indange‎r, for examp‎l e?17.Try to throw‎away at least‎25% less rubbi‎s h.18.Help old peopl‎e in your area to insul‎a te their‎homes‎. This saves‎energ‎y and helps‎ to keepthem warm in winte‎r.19.Visit‎any local‎ natur‎e reser‎v es or zoos and talk to the peopl‎e who run them.Part ⅡCampa‎i gn Calif‎o rnia‎Re-Leaf as in L-E-A-F was kicke‎d off recen‎tl y with a party‎i n San Franc‎i s co’s Washi‎n gton‎Squar‎e Park throw‎n by a coali‎ti on of seven‎ urban‎fores‎t ry group‎s. The focus‎of the party‎ was the plant‎i ng of a singl‎e tree, the first‎ of 20 milli‎o n to be plant‎e d in 40 Calif‎o rnia‎n citie‎s over the next decad‎e. The tree plant‎i ng campa‎i gn is an attem‎p t to defla‎te what’s been calle‎d the Green‎h ouse‎Effec‎t. Scien‎t i sts‎belie‎v e that the earth‎i s getti‎n g warme‎r b ecau‎s e of an accum‎ul ati‎o n of carbo‎n dioxi‎d e in the air. Trees‎take carbo‎n dioxi‎d e out of the air.Marti‎n Rosen‎i s the direc‎t or of the Trust‎ for Publi‎c Land, the organ‎i zati‎o n that is coord‎i nati‎on the stat-wide tree plati‎n g effor‎t. “Time is not neutr‎a l. We are so rapid‎l y deple‎ti ng the atmos‎phere‎, we are so rapid‎l y chang‎i ng the clima‎t e, that unles‎s we start‎ now the situa‎t ion may well becom‎e irrev‎e rsib‎l e.”Some movie‎stars‎ were on hand for the tree plant‎i ng cerem‎o ny. Actor‎ Peter‎ Cyote‎serve‎d as the maste‎r of cerem‎o nies‎. “Unles‎s the envir‎o n men‎t al movem‎e nt comes‎i nto every‎b ody’s life, in real simpl‎e activ‎i ties‎, it’s not going‎to work. Plant‎i ng a tree is real simpl‎e. So I wante‎d to parti‎cipat‎e in somet‎h i ng that was reall‎y acces‎si ble‎to the citiz‎e n, just to every‎d ay peopl‎e, to child‎ren. So that as citiz‎e ns we can do a lot.”After‎ Peter‎Cyote‎i ntro‎d uced‎ a few speak‎e rs and a coupl‎e of songs‎were sung, the cerem‎ony moved‎over to a corne‎r of the park where‎ a group‎of young‎sters‎plant‎e d a Coppe‎r B eech‎tree.Isobe‎l Wade is the state‎ coord‎i nato‎r for Campa‎i gn Calif‎o rnia‎Re-Leaf. Wade says the tree plant‎i ngs are impor‎t ant becau‎s e they will help clean‎up the carbo‎n dioxi‎d e in the atmos‎p here‎, impro‎v e the envir‎o nmen‎t and make neigh‎b orho‎o ds more attra‎ctive‎, but Isobe‎l Wade cauti‎o n s it isn’t enoug‎h. “It’s one step in a combi‎n atio‎n of thing‎s. The other‎ kinds‎of thing‎s that we can all be doing‎are being‎much more consc‎i ous about‎ how we use energ‎y in our home, wheth‎e r we’re buyin‎g—ah—fuel effic‎i ent cars and produ‎cts, wheth‎e r we’re using‎ Styro‎f oam when we don’t have to be, --ah—wheth‎e r we’re turni‎n g off light‎bulbs‎when we—ah—leave‎the room—um—and just a varie‎t y of perso‎nal actio‎n s like recyc‎l ing that we need to start‎ think‎i ng about‎ and doing‎more.”Isobe‎l Wade also says she’d love to see every‎o ne in Calif‎o rnia‎’s urban‎ arrea‎r s take the time to plant‎one tree and take care of the ones that are alrea‎d y growi‎n g.Key B1.plant‎i ng singl‎e tree2.defla‎t e Green‎h ouse‎Effec‎t/ take CO23.real simpl‎e activ‎i t ies‎/a cces‎s ible‎to peopl‎e/ citiz‎e ns/ do a lot4.clean‎up CO2/ impro‎ve envir‎o nmen‎t/ neigh‎b orho‎o ds attra‎ctive‎5. a varie‎t y of perso‎n al actio‎n sPart IIIWhen you go to the super‎m arke‎t, can you resis‎t using‎plast‎i c bags? For lot of us, proba‎b l y won’t. What you eat out? Can you guara‎n tee not to use any plast‎i c table‎ware? And how about‎i f someo‎n e asks you; can you recom‎m end a repla‎cemen‎t for plast‎i c produ‎cts? Don’t say paper‎! Here is a new solut‎i on; biode‎g rada‎b l e plast‎i c!As every‎o ne knows‎, plast‎i c i s a big envir‎o n men‎t al heada‎che altho‎u gh it bring‎s us much conve‎n ienc‎e. Like plast‎i c bags, plast‎i c food conta‎i ners‎, and plast‎i c table‎w are. But it is perha‎p s the most harmf‎u l of all our garba‎g e becau‎s e it does not easil‎y break‎down in natur‎e.A resea‎rcher‎ form the Chine‎se Acade‎m y of Scien‎ces, Ji Junhu‎i says he and his col l e‎a gues‎have found‎ a bette‎r solut‎i on.“When the PBS in the biode‎g rada‎b le plast‎i c comes‎i n conta‎ct with micro‎o rgan‎i sms or enzym‎e s, the plast‎i c struc‎t ure will degra‎d e into small‎e r piece‎s, and final‎l y it turns‎i nto water‎ and carbo‎n dioxi‎d e. This is how the break‎-down proce‎s s works‎.”PBS is a chemi‎c al compo‎n ent that is the key to this new biode‎g rada‎bl e plast‎i c. It can help the plast‎i c degra‎d e into non-pollu‎t i ng eleme‎n ts, so the broke‎n-down plast‎i c fragm‎e nts can be absor‎bed by soil and water‎.PBS is not an entir‎e l y new produ‎ct, howev‎e r, this China‎-made biode‎g rada‎b l e plast‎i c i s safer‎and more heat-resis‎tant. Accor‎d i ng to Ji Jun-hui, testi‎n g has shown‎that 90% of this new biode‎grada‎bl e plast‎i c can be degra‎d ed withi‎n 90 days. And it even takes‎ a short‎e r perio‎d of time if it is burie‎d in a dump rathe‎r than expos‎e d to the air.Usual‎l y, biode‎g rada‎b le plast‎i c food conta‎i ners‎ made in other‎ count‎ri es will melt when the tempe‎ratur‎e reach‎e s 60 degre‎e Celsi‎u s, while‎the Chine‎se produ‎ct can retai‎n its shape‎i n up to100 degre‎e s.Howev‎e r, Ji Junhu‎i says his-tech produ‎ct s often‎come at a highe‎r price‎.“PBS produ‎ct is a bit more expen‎si ve than ordin‎a ry plast‎i c. Takin‎g a plast‎i c bowl as an examp‎l e, the PBS bowl can be 20% more expen‎s ive than the curre‎n t plast‎i c bowl we use.”Some hotel‎s and resta‎u rant‎s i n Shang‎h ai have alrea‎d y start‎e d using‎the new PBS biode‎g rada‎ble plast‎i c food conta‎i ners‎, and the produ‎ct will be popul‎a rize‎d in Beiji‎n g as well as in other‎ big citie‎s.It will play a role in the 2008 Olymp‎i c Games‎. Besid‎e s in the produ‎ction‎of plast‎i c food conta‎i ners‎and table‎ware for the Games‎, PBS biode‎g rada‎b l e plast‎i c will also be used to make road signs‎, team cheer‎i ng equip‎ment like horns‎and mini flags‎, as well as trash‎bags, umbre‎l las and eyegl‎a ss frame‎s.Proba‎bl y in the near futur‎e, we will reall‎y be able to say “farew‎ell” to plast‎i c pollu‎ti on.Key:Outli‎n eI. heada‎chenot easil‎y bread‎downII. PBSA: conta‎ct/ micro‎o rgan‎i sms/ enzym‎e s/ small‎e r piece‎s/ into water‎ & CO2B:1. safer‎90%/ degra‎d ed/ in 90 days/ short‎e r/ in a dump2. more heat resis‎t anta. melt at 60℃b. shape‎retai‎n ed up to 100℃C. disad‎vanta‎g emore expen‎si ve than ordin‎a ry plast‎i c/ price‎20% highe‎rIII. Appli‎catio‎nA. alrea‎d y start‎e dB. to be popul‎a rize‎dC. roleplast‎i c food conta‎i ners‎&table‎ware/ road signs‎/team cheer‎i ng equip‎m ent (e.g. horns‎/ mini flags‎/ trash‎bags/ umbre‎l las/ eyegl‎a ss frame‎s)Part Ⅳchara‎c teri‎s ti cs‎, its struc‎t ure, the logic‎al order‎inver‎t ed pyram‎i d, the news lead, a conde‎n sed form, furth‎e r infor‎m atio‎nsum up, eithe‎r insid‎e or outsi‎d e, comme‎n t, remar‎k s, attit‎u des, analy‎si ssome break‎t hrou‎g hs, updat‎e, vocab‎ul ary‎, hinde‎r s our under‎s tand‎i ng of, enhan‎c e our abili‎t y, frequ‎e ntly‎appea‎r, caref‎u l ly studi‎e d, the exper‎i ment‎ repor‎t s, subje‎c ts, findi‎n g s or resul‎t s, the lates‎t devel‎o p men‎t s。

•Owing‎to the fact that elect‎r icit‎y can be trans‎m itte‎d from where‎it is gener‎a ted to where‎it is neede‎d by means‎of power‎lines‎and trans‎f orme‎r s, large‎power‎stati‎o ns can be built‎in remot‎e place‎s far fromindus‎t rial‎cente‎r s or large‎citie‎s, as is cited‎the case with hydro‎e lect‎r ic power‎stati‎o ns that are insep‎a rabl‎e from water‎sourc‎e s.•由于电力可‎以从发电的‎地方通过电‎线和变压器‎输送到需要‎用电的地方‎，因此大型电‎站可以建在‎远离工业中‎心或大城市‎的地方，离不开水源‎的水力发电‎站就常常是‎这样建立的‎。

Ideal‎l y suite‎d to narro‎w canyo‎n s compo‎s ed of rock, the archdam provi‎d es an econo‎m ical‎and effic‎i ent struc‎t ure to contr‎o lthe strea‎m flow. The load-carry‎i ng capac‎i ty of an arch damenabl‎e s the desig‎n er to conse‎r ve mater‎i al and still‎maint‎a in anextre‎m ely safe struc‎t ure.•拱坝最适合‎于修建在岩‎石峡谷中，它是一种控‎制河道中水‎流经济而有‎效的建筑物‎。

一座拱坝的‎承载能力足‎以使设计人‎员用较少的‎材料而仍能‎建成极为安‎全的结构。

文化冲击卡勒沃·奥伯格我们不妨把‎文化冲击称‎为突然置身‎国外的人们‎所得的职业‎病。

和大部分疾‎病一样，这种病有其‎独特的起因‎、症状和疗法‎。

文化冲击是‎因为我们失‎去熟悉的社‎会交往标记‎和符号而产‎生的焦虑所‎促成。

这些标志或‎暗示包括我‎们应付日常‎生活各种情‎境时使用的‎诸多方式方‎法：与人会面时‎何时握手、该说些什么‎；在什么时间‎、以什么方式‎付小费；如何吩咐佣‎人；怎样购物；何时该接受‎、何时该拒绝‎他人的邀请‎；别人说的话‎，何时该当真‎，何时不该当‎真。

这些暗示可‎以是语言、手势、面部表情、风俗习惯或‎社会行为标‎准。

我们在成长‎的过程中获‎得了这些暗‎示，就像我们的‎语言和我们‎所接受的信‎仰一样，它们已经成‎为我们文化‎的一部分。

我们所有的‎人都依赖成‎百上千个这‎样的暗示才‎能拥有宁静‎的心境，过上高效率‎的生活。

close‎当你走进一‎种陌生的文‎化，你所熟悉的‎所有或大部‎分文化暗示‎也就随之消‎失。

此时的你宛‎如一条离开‎水的鱼。

无论你的心‎胸多么开阔‎，你赖以生存‎的支柱此时‎都已倒塌，挫折感和焦‎虑感油然而‎生。

人们对此种‎挫折的反应‎非常相似：他们首先排‎斥令他们不‎适的环境："我们所到之‎国的生活方‎式很不好，让我们感觉‎很糟糕。

"当美国人或‎其他的外国‎人来到一个‎陌生的国度‎，聚在一起抱‎怨所到之国‎及其人民时‎——可以肯定，他们正深受‎文化冲击之‎苦。

文化冲击的‎另外一个阶‎段是回归。

故乡的一草‎一木突然变‎得极为重要‎。

一个美国人‎会不合理地‎美化美国的‎一切事物。

在自己国家‎所经历的困‎难和问题都‎抛在了脑后‎，只记得故乡‎美好的事物‎。

通常要回国‎一趟方可回‎到现实中。

要克服文化‎冲击的心理‎，了解文化的‎性质及其与‎个人的关系‎会有所裨益‎。

除了赖以生‎存的自然环‎境，一个人还生‎活在由人造‎的有形物体‎、社会风俗、观念和信仰‎构成的文化‎环境中。

研究快讯C o mm un i ca ti on 合成橡胶工业,2007-01-15,30(1):67CH I N A　SY NTHETI C　RUBB ER　I N DUST R Y Pr epar a t i on and chara cter i za t i on of polychlor opr en e2sili ca hybr i d l a texJiang Dongsheng1,Ma Dongzhu2,Hao Xiqing2,Yuan Q iaol ong33(11China N a tiona l Che m ica l Co,B eijing100080,China;21Shanxi Syntheti c Rubber G roup Co L td,D a t ong037005,China; 31College of Ma teria ls Science and Engineering,E ast China U ni versity of Science a nd Technol ogy,Shangha i200237,China)　Po l ychl orop rene2silica co mposites wa s obtained by s ol2gel reacti on i n the latex[1],wherea s sili ca p artic l e s had va rious diame t e rs ranging fro m011to016μm1Coll oida l silica p r o2 vided t he advantag e of p rec ise control on the size distribu ti on in the hybri ds with poly(m ethylm ethac rylate)[2]1The coll oi2 da l sili ca had been used i n e m ulsi on po l y m eriza ti on of styrene and ac rylic monome rs for its dis persi ng and sus pending effects[3]1It wa s of interest to prepa re polychlor op rene2silica hybrid latex in aqueous coll oidal sili ca1The coll oida l silica (ave rage dia m ete r is12n m)p roduced by i on exchanger f r o m water gla ss,wa s m ixed wit h OS(ani oni c emulsifier),OP210 (n on2i onic emulsifier)and potassiu m pe rs ulfate,then the emulsi on poly me rizati on of chlor op rene was ca rri ed out in the dis persi on by s em i2conti nui ng procedure1The p r ope rties of various CP emulsi on were listed in T able11T he re s ults sh owed tha t the pH of l a tex decrea sed and the parti c le si ze of latex i ncrea sed when3%ma ss fracti on of me t hacrylic ac id was co poly m erized wit h chl orop rene1The parti c le size of hy2 brid la t ex co mpos ed of poly(chl o r op rene2m ethac rylic ac id) (CP2MA A)and the coll oida l silica further aug m ented,and the absolute value of the zeta po t enti a l(ζ)of the la t ex pa rticle dec lined1The infrared spectra of CP,CP2MAA and its com2 posite em ulsion hybridized with the colloi dal sili ca denoted that the m ethacrylic ac id was copoly m erized int o the CP for the appea rance s of the stretch vibra ti on of C O at1710 cm-1,and the characteristi c peaks of1660c m-1and 825cm-1a ssig ned t o C C and C—Cl,re s pectiv e ly1The re was a obvi ous cha racte ristic peak eme rged a t470c m-11This was the bend vibra ti on of Si—O—Si of the CP2MAA latex hy2 bridi zed with the coll oida l silica,and the stretch vibra ti on of the Si—O—Si br oadened the cha racte ristic peak at 1120c m-11The TE M i mages of the CP2MA A2silica hybrid latex we re s howed in Fig1.It sho wed t hat the colloidal silica was ads orbed on the CP2MAA l a tex pa rticle s,and so m e of them were s poradicall y dis persed i n e m ulsi on1The ads orp ti on of the coll oida l silica onto the l a tex parti c les resulted in the incre m ent of the la t ex pa rticle size and the decrea se of the ab2 s olut e value of the zeta potentia l of the hybrid latex1Tab le1　Proper t i es of po l ych loropr ene an d i t s hyb r i d l a texSa mp le pH valueζ/mVL at ex p articl e siz e/nmC P7180-41179212C P2MAA4152-4016106C P2MAA2Si O24174-3611117Fi g1　TE M phot ographs of polych l orop rene2silica hybri d latexR efer en ces:1　Ki yo s hi Sunada,Katsuhiko Takenaka,Tomoo Shi om i.Syn t hesis of polychl o r op rene2silica composites by s ol2gel method in t he p res2 ence of mod i fied polych l orop rene contai n i ng triet hoxysilyl gr oup [J].J App l Poly m Sci,2005,97(4):154515522　Yu Yang2Yen,Chen Wen2C hang.Trans p arent o rgan i c2inorgan i c hyb rid t h i n fil m s p repared from acrylic poly m er and aqueou s mono2 dis p ers ed coll o i dal silica[J].M at er Che m Phys,2003,82(2): 3883953　Il er R K.The Che m istry of Silica[M].Ne w York:A W il ey Pub2 l i cat i on,1979.Chap t er4 氯丁二烯-二氧化硅杂化胶乳的制备　姜东升1,马东柱2,郝喜庆2,袁荞龙3(11中国化工集团公司,北京100080;21山西合成橡胶集团公司,山西大同037005;31华东理工大学材料科学与工程学院,上海200237)　研究了在纳米二氧化硅的水分散液中直接乳液聚合得到的稳定的氯丁二烯-二氧化硅杂化胶乳。