M7R31FAJ-R中文资料

Product DescriptionOrdering InformationTypical Applications FeaturesFunctional Block DiagramRF Micro Devices, Inc.7628 Thorndike RoadGreensboro, NC 27409, USATel (336) 664 1233Fax (336) 664 0454Optimum Technology Matching® AppliedSi BJT GaAs MESFET GaAs HBTSi Bi-CMOS SiGe HBTSi CMOSInGaP/HBTGaN HEMTSiGe Bi-CMOSDCS/PCS INBAND SELECT TX ENABLE VRAMP VBATT GSM IN VBATT TRI-BAND GSM900/DCS/PCSPOWER AMP MODULE•3V Tri-Band GSM Handsets •Commercial and Consumer Systems •Portable Battery-Powered Equipment •EGSM900/DCS/PCS Products •GPRS Class 12 Compatible •Power Star TM ModuleThe RF3147 is a high-power, high-efficiency power ampli-fier module with integrated power control that provides over 50dB of control range. The device is a self-contained 7mmx7mmx0.9mm lead frame module (LFM) with 50Ωinput and output terminals. The device is designed for use as the final RF amplifier in EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands. With the integration of a V RAMP limiting circuit, the RF3147 can regulate the V RAMP voltage to ensure minimum switching transients.The V RAMP limiter function is fully integrated into the CMOS controller and requires no additional inputs from the user.•Integrated V BATT Tracking Circuit •Complete Power Control Solution •+35dBm GSM Output Power at 3.5V•+33dBm DCS/PCS Output Power at 3.5V •60% GSM and 55% DCS/PCS EFF •7mmx7mmx0.9mm Package SizeRF3147Tri-Band GSM900/DCS/PCS Power Amp Module RF3147 SB Power Amp Module 5-Piece Sample Pack RF3147PCBA-41XFully Assembled Evaluation BoardShaded lead is pin 1.0.600.24Package Style: LFM, 48-Pin, 7mm x7mmx0.9mm99Absolute Maximum RatingsParameterRatingUnitSupply Voltage-0.3 to +6.0V DC Power Control Voltage (V RAMP )-0.3 to +1.8V Input RF Power +10dBm Max Duty Cycle50%Output Load VSWR10:1Operating Case Temperature -20 to +85°C Storage Temperature-55 to +150°CParameterSpecification Unit ConditionMin.Typ.Max.Overall Power Control V RAMPPower Control “ON” 2.1V Max. P OUT , Voltage supplied to the input Power Control “OFF”0.20.25V Min. P OUT , Voltage supplied to the input V RAMP Input Capacitance 1520pF DC to 2MHz V RAMP Input Current 10µA V RAMP =2.1VT urn On/Off Time 2µs V RAMP =0.2V to 2.1VTX Enable “ON” 1.9V TX Enable “OFF”0.5V GSM Band Enable0.5V DCS/PCS Band Enable1.9V Overall Power SupplyPower Supply Voltage 3.5V SpecificationsV Nominal operating limitsPower Supply Current1µA P IN <-30dBm, TX Enable=Low, Temp=-20°C to +85°CmAV RAMP =0.2V , TX Enable=HighOverall Control SignalsBand Select “Low”000.5V Band Select “High”1.92.03.0V Band Select “High” Current 2050µA TX Enable “Low”000.5V TX Enable “High”1.92.03.0V TX Enable “High” Current12µAESD sensitive device.RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).ParameterSpecificationUnit Condition Min.Typ.Max.Overall (GSM900 Mode)Temp=+25°C, V BATT=3.5V,V RAMP=2.1V, P IN=3dBm, Freq=880MHz to 915MHz,25% Duty Cycle, Pulse Width=1154µsOperating Frequency Range880 to 915MHzMaximum Output Power+34.2dBm Temp = 25°C, V BATT=3.5V,V RAMP=2.1V+32.0dBm Temp=+85°C, V BATT=3.0V,V RAMP =2.1VT otal Efficiency58%At P OUT MAX, V BATT=3.5VInput Power Range0+3+5dBm Maximum output power guaranteed at mini-mum drive levelOutput Noise Power-86dBm RBW=100kHz, 925MHz to 935MHz,P OUT > +5dBm-88dBm RBW=100kHz, 935MHz to 960MHz,P OUT > +5dBmForward Isolation 1-45-30dBm TXEnable=Low, P IN=+5dBmForward Isolation 2-30-15dBm TXEnable=High, V RAMP=0.2V, P IN=+5dBm Cross Band Isolation 2f0 -17dBm V RAMP=0.2V to V RAMP_R PSecond Harmonic-15-6dBm V RAMP=0.2V to V RAMP_R PThird Harmonic-25-9dBm V RAMP=0.2V to V RAMP_R PAll OtherNon-Harmonic Spurious-36dBm V RAMP=0.2V to 2.1VInput Impedance50ΩInput VSWR 2.5:1V RAMP=0.2V to 2.1VOutput Load VSWR Stability8:1Spurious<-36dBm, RBW=3MHzSet V RAMP where P OUT<34.2dBm into 50ΩloadOutput Load VSWR Ruggedness10:1Set V RAMP where P OUT<34.2dBm into 50Ωload. No damage or permanent degradationto part.Output Load Impedance50ΩLoad impedance presented at RF OUT pad Power Control V RAMPPower Control Range50dB V RAMP=0.2V to 2.1VNotes:V RAMP_R P=V RAMP set for 34.2dBm at nominal conditions.ParameterSpecificationUnit Condition Min.Typ.Max.Overall (DCS Mode)Temp=25°C, V BA TT=3.5V,V RAMP=2.1V, P IN=3dBm,Freq=1710MHz to 1785MHz,25% Duty Cycle, pulse width=1154µsOperating Frequency Range1710 to 1785MHzMaximum Output Power+32.0dBm Temp=25°C, V BA TT=3.5V,V RAMP =2.1V+30.0dBm Temp=+85°C, V BA TT=3.0V,V RAMP=2.1VT otal Efficiency50%At P OUT MAX, V BA TT=3.5VInput Power Range0+3+5dBm Maximum output power guaranteed at mini-mum drive levelOutput Noise Power-85dBm RBW=100kHz, 1805MHz to 1880MHz,P OUT > 0dBm,V BA TT=3.5VForward Isolation 1-50-30dBm TXEnable=Low, P IN=+5dBmForward Isolation 2-25-15dBm TXEnable=High, V RAMP=0.2V, P IN=+5dBm Second Harmonic-15-5dBm V RAMP=0.2V to V RAMP_R PThird Harmonic-20-10dBm V RAMP=0.2V to V RAMP_R PAll OtherNon-Harmonic Spurious-36dBm V RAMP=0.2V to 2.1VInput Impedance50ΩInput VSWR 2.5:1V RAMP=0.2V to 2.1VOutput Load VSWR Stability8:1Spurious<-36dBm, RBW=3MHzSet V RAMP where P OUT<32dBm into 50ΩloadOutput Load VSWR Ruggedness10:1Set V RAMP where P OUT<32dBm into 50Ωload. No damage or permanent degradationto part.Output Load Impedance50ΩLoad impedance presented at RF OUT pin Power Control V RAMPPower Control Range50dB V RAMP=0.2V to 2.1V, P IN=+5dBmNotes:V RAMP_R P=V RAMP set for 32dBm at nominal conditions.ParameterSpecificationUnit Condition Min.Typ.Max.Overall (PCS Mode)Temp=25°C, V BA TT=3.5V,V RAMP =2.1V, P IN=3dBm, Freq=1850MHz to 1910MHz,25% Duty Cycle, pulse width=1154µsOperating Frequency Range1850 to 1910MHzMaximum Output Power+32.0dBm Temp=25°C, V BA TT=3.5V,V RAMP=2.1V, 1850MHz to 1910MHz+30.0dBm Temp=+85°C, V BA TT=3.0V,V RAMP=2.1VT otal Efficiency52%At P OUT MAX, V BA TT=3.5VInput Power Range0+3+5dBm Full output power guaranteed at minimumdrive levelOutput Noise Power-85dBm RBW=100kHz, 1930MHz to 1990MHz,P OUT > 0dBm,V BA TT=3.5VForward Isolation 1-40-28dBm TX_ENABLE=Low, P IN=+5dBmForward Isolation 2-20-15dBm TXEnable=High, V RAMP=0.2V, P IN=+5dBm Second Harmonic-15-8dBm V RAMP=0.2V to V RAMP_R PThird Harmonic-20-10dBm V RAMP=0.2V to V RAMP_R PAll OtherNon-Harmonic Spurious-36dBm V RAMP=0.2V to 2.1VInput Impedance50ΩInput VSWR 2.5:1V RAMP=0.2V to 2.1VOutput Load VSWR Stability8:1Spurious<-36dBm, RBW=3MHzSet V RAMP where P OUT<32dBm into 50ΩloadOutput Load VSWR Ruggedness10:1Set V RAMP where P OUT<32dBm into 50Ωload. No damage or permanent degradationto part.Output Load Impedance50ΩLoad impedance presented at RF OUT pin Power Control V RAMPPower Control Range50dB V RAMP=0.2V to 2.1V, P IN=+5dBmNotes:V RAMP_R P=V RAMP set for 32dBm at nominal conditions.Pin Out123456789101112131415161718192021222324252627282930313233343536373839404142434445464748GSM900 OUT NC VCC2 GSM NC GND GND GND NC NC NC NC NC N CN CN CN CN CV C C 3 G S MV C C O U TV C C O U TV C C 3D C S /P C SN CN CN CNCNC NC NC NC NC GND GNDGND GND DCS/PCS OUT D C S /P C S I N VCC2 DCS/PCS G N DG N D 1 G S M B A N D S E LT X E N A B L EV B A T TV B A T TN CV R A M Pv c c 1 G S MG S M 900 I NV C C 1D C S /P C SApplication SchematicEvaluation Board SchematicEvaluation Board LayoutBoard Size 2.0” x 2.0”Board Thickness 0.032”, Board Material FR-4, Multi-LayerTheory of OperationOverviewThe RF3147 is a tri-band EGSM900, DCS1800, and PCS1900 power amplifier module that incorporates an indirect closed loop method of power control. This simplifies the phone design by eliminating the need for the complicated control loop design. The indirect closed loop appears as an open loop to the user and can be driven directly from the DAC output in the baseband circuit.Theory of OperationThe indirect closed loop is essentially a closed loop method of power control that is invisible to the user. Most power con-trol systems in GSM sense either forward power or collector/drain current. The RF3147 does not use a power detector. A high-speed control loop is incorporated to regulate the collector voltage of the amplifier while the stage are held at a con-stant bias. The V RAMP signal is multiplied by a factor of 2.75 and the collector voltage for the second and third stages are regulated to the multiplied V RAMP voltage. The basic circuit is shown in the following diagram.By regulating the power, the stages are held in saturation across all power levels. As the required output power is decreased from full power down to 0dBm, the collector voltage is also decreased. This regulation of output power is demonstrated in Equation 1 where the relationship between collector voltage and output power is shown. Although load impedance affects output power, supply fluctuations are the dominate mode of power variations. With the RF3147 regu-lating collector voltage, the dominant mode of power fluctuations is eliminated.(Eq. 1)There are several key factors to consider in the implementation of a transmitter solution for a mobile phone. Some of them are:•Current draw and system efficiency •Power variation due to Supply Voltage •Power variation due to frequency •Power variation due to temperature •Input impedance variation •Noise power •Loop stability•Loop bandwidth variations across power levels •Burst timing and transient spectrum trade offs •HarmonicsVV P dBm102V CC V SAT –⋅()28R LOAD 103–⋅⋅-------------------------------------------log ⋅=Output power does not vary due to supply voltage under normal operating conditions if V RAMP is sufficiently lower than V BA TT . By regulating the collector voltage to the PA the voltage sensitivity is essentially eliminated. This covers most cases where the PA will be operated. However, as the battery discharges and approaches its lower power range the maximum output power from the PA will also drop slightly. In this case it is important to also decrease V RAMP to prevent the power control from inducing switching transients. These transients occur as a result of the control loop slowing down and not regulating power in accordance with V RAMP .The switching transients due to low battery conditions are regulated by the V RAMP limiter circuit. The V RAMP limiter, a new feature for the RF3147, consists of a feedback loop that detects FET saturation. As the FET approaches saturation,the limiter adjusts the V RAMP voltage in order to ensure minimum switching transients. The V RAMP limiter is integrated into the CMOS controller and requires no additional input from the user.Due to reactive output matches, there are output power variations across frequency. There are a number of components that can make the effects greater or less. Power variation straight out of the RF3147 is shown in the tables below.The components following the power amplifier often have insertion loss variation with respect to frequency. Usually, there is some length of microstrip that follows the power amplifier. There is also a frequency response found in directional cou-plers due to variation in the coupling factor over frequency, as well as the sensitivity of the detector diode. Since the RF3147 does not use a directional coupler with a diode detector, these variations do not occur.Input impedance variation is found in most GSM power amplifiers. This is due to a device phenomena where C BE and C CB (C GS and C SG for a FET) vary over the bias voltage. The same principle used to make varactors is present in the power amplifiers. The junction capacitance is a function of the bias across the junction. This produces input impedance variations as the Vapc voltage is swept. Although this could present a problem with frequency pulling the transmit VCO off frequency, most synthesizer designers use very wide loop bandwidths to quickly compensate for frequency variations due to the load variations presented to the VCO.The RF3147 presents a very constant load to the VCO. This is because all stages of the RF3147 are run at constant bias. As a result, there is constant reactance at the base emitter and base collector junction of the input stage to the power amplifier.Noise power in PA's where output power is controlled by changing the bias voltage is often a problem when backing off of output power. The reason is that the gain is changed in all stages and according to the noise formula (Equation 2),(Eq. 2)the noise figure depends on noise factor and gain in all stages. Because the bias point of the RF3147 is kept constantthe gain in the first stage is always high and the overall noise power is not increased when decreasing output power.Power control loop stability often presents many challenges to transmitter design. Designing a proper power control loop involves trade-offs affecting stability, transient spectrum and burst timing.In conventional architectures the PA gain (dB/V) varies across different power levels, and as a result the loop bandwidth also varies. With some power amplifiers it is possible for the PA gain (control slope) to change from 100dB/V to as high as 1000dB/V. The challenge in this scenario is keeping the loop bandwidth wide enough to meet the burst mask at low slope regions which often causes instability at high slope regions.The RF3147 loop bandwidth is determined by internal bandwidth and the RF output load and does not change with respect to power levels. This makes it easier to maintain loop stability with a high bandwidth loop since the bias voltage and collector voltage do not vary.F TOT F 1F 21–G 1---------------F 31–G 1G 2⋅-------------------++=An often overlooked problem in PA control loops is that a delay not only decreases loop stability it also affects the burst timing when, for instance the input power from the VCO decreases (or increases) with respect to temperature or supply voltage. The burst timing then appears to shift to the right especially at low power levels. The RF3147 is insensitive to a change in input power and the burst timing is constant and requires no software compensation.Switching transients occur when the up and down ramp of the burst is not smooth enough or suddenly changes shape. If the control slope of a PA has an inflection point within the output power range or if the slope is simply too steep it is diffi-cult to prevent switching transients. Controlling the output power by changing the collector voltage is as earlier described based on the physical relationship between voltage swing and output power. Furthermore all stages are kept constantly biased so inflection points are nonexistent.Harmonics are natural products of high efficiency power amplifier design. An ideal class “E” saturated power amplifier will produce a perfect square wave. Looking at the Fourier transform of a square wave reveals high harmonic content. Although this is common to all power amplifiers, there are other factors that contribute to conducted harmonic content as well. With most power control methods a peak power diode detector is used to rectify and sense forward power. Through the rectification process there is additional squaring of the waveform resulting in higher harmonics. The RF3147 address this by eliminating the need for the detector diode. Therefore the harmonics coming out of the PA should represent the maximum power of the harmonics throughout the transmit chain. This is based upon proper harmonic termination of the transmit port. The receive port termination on the T/R switch as well as the harmonic impedance from the switch itself will have an impact on harmonics. Should a problem arise, these terminations should be explored.PCB Design RequirementsPCB Surface FinishThe PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. T ypical thickness is 3µinch to 8µinch gold over 180µinch nickel.PCB Land Pattern RecommendationPCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.PCB Metal Land PatternA = 0.64 x 0.28 (mm) Typ.B = 0.28 x 0.64 (mm) Typ.C = 5.65 (mm) Sq.Figure 1. PCB Metal Land Pattern (Top View)PCB Solder Mask PatternLiquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.A = 0.74 x 0.38 (mm) Typ.B = 0.38 x 0.74 (mm) Typ.C = 5.65 x 2.20 (mm)Figure 2. PCB Solder Mask Pattern (Top View)Thermal Pad and Via DesignThermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies.The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.。

•Rugged electrical and mechanical design •Outputs individually controlled with excellent dynamic properties•Operating ambient temperature range –40...71°CWide input voltage from 8...372 V DC1, 2 or 3 isolated outputs up to 48 V DC 4 kV AC I/O electric strength test voltageSelection chartLGACM, DM and LM types available as CMZ, DMZ and LMZ class II equipment2/12.2000Input voltage 6 wide-input ranges (1:5)refer to selection chartOutputEfficiency U i nom, I o nom up to 83%i nom o nom±0.6% U o nom Output voltage switching noise IEC/EN 61204, total typ. 50 mV ppi min i max o nom o nom Load regulation U i nom, 0...I o nom, each output regulated typ. 0.15% U o nom Minimum load not required0 A Current limitation main output rectangular U/I characteristic typ. 110% I o nomo nom Operation in parallel by current limitation, only main outputsi nom o nomU i nom, I o nom, A/B/C/D/FM with ext. diode in input line up to 7 msProtectionInput reverse polarity built-in fusei min Input overvoltage lockout typ. 110% U i maxOutput no-load, overload and short circuit proofo nom Overtemperature switch-off with auto restart T C typ. 100°CControlOutput voltage adjustment single output types0...110% U o nom Status indication LEDs: OK, inhibit, overloadSafetyApprovals EN 60950, UL 1950, CSA C22.2 No. 950Class of equipment AM, BM, CM, DM, FM, LM class I Protection degree units without options IP 40class I, I/O 4 kV ACO/case 1 kV ACElectrostatic discharge IEC/EN 61000-4-2, level 4 (8/15 kV)criterion B Electromagnetic field IEC/EN 61000-4-3, level x (20 V/m)criterion A/B Electr. fast transients/bursts IEC/EN 61000-4-4, input, level 3/4 (2/4 kV)criterion A/B Surge IEC/EN 61000-4-5, input, level 3/4 (2/4 kV)criterion A Electromagnetic emissions CISPR 22/EN 55022, conducted class BEnvironmentalOperating ambient temperature U i nom, I o nom, convection cooled–25...71°C Operating case temperature C i nom, o nom–25...95°C Storage temperature non operational–40...100°C Damp heat IEC/EN 60068-2-3, 93%, 40°C56 daysn Shock IEC/EN 60068-2-27, 6 ms100 g nn Random vibration IEC/EN 60068-2-64, 20...500 Hz 4.9 g n rms MTBF MIL-HDBK-217E, G B, 40°C, single output types320'000 h OptionsExtended temperature range–40...71°C, ambient, operating-9 Electronic inrush current limitation Eo nomInput and/or output undervoltage monitoring, excludes option V D0...D9 Test sockets for check of output voltage A Enhanced electric strength test 2 kV AC H Fuse not user accessible FPin allocationMechanical data ArrayTolerances ±0.3 mm (0.012") unless otherwise indicated.AccessoriesFront panels 19” (Schroff/Intermas)Mating H11 connectors with screw, solder, fast-on or press-fit terminalsConnector retention facilities and code key system for connector codingFlexible PCB for connecting the converter via an H11 connector, if mounted on a PCB Chassis or wall mounting plates for frontal accessUniversal mounting brackets for chassis or DIN-rail mounting。

The M7 VHF data transceiver is a rugged ½ - 5 wattVHF data radio modem with an RS-232 or optional422/485 serial interface, perfect for SCADA andtelemetry applications. Additional options includeIP65-rated (“weatherproof”) enclosure and/or GPS.Product O verviewLong-Range OperationOperating in the VHF 136-155MHz frequency band (other bands available), the RV-M7-VA radio modem works over 60 miles point-to-point and many miles with omni-directional antennas. All RV-M7 modems support store-and-forward repeating for wide-area coverage.Fast PollingThe M7 transceiver has a 5mS PLL in it, making it one of the fastest telemetry radios available, especially well suited for polled, DNP and MODBUS applications. Its can send up to 50 transmissions per second.High Speed and High EfficiencyThe RV-M7 operates with user-selectable over-the air data rates of 800 to 19200bps. Faster rates for higher efficiency or lower-speed for increased communication range.GPS OptionThe optional internal GPS allows the RV-M7 to be a powerful Automatic Vehicle Locating (AVL) system or Time Space Position Information (TSPI) reporting device.Fully ProgrammableIt is configured with a serial connection using industry-standard AT commands. Parameters such as network IDs, unit ID and transmission rate are easily configured. The M7 is easily configured through the included PC program “Radio Manager”. Digital Base BandData rate, modulation, and IF bandwidth are digitally programmed. Wide (25kHz) and Narrow (12.5kH) IF bandwidths may be user-configured. The over-the-air data rate may be adjusted to suit a particular application.Real-time diagnostics and statisticsChannel performance, RSSI, RF power, packet counters, and radio configuration are easily accessed via the serial port or remotely over-the-air.Very Low Power ConsumptionThe advanced VHF transceiver is integrated with a 32-bit microprocessor-based modem in one easy-to mount package. It has very low power consumption, and sleep modes that allow it to be active and consume a minimum amount of resources.Rugged and “Weatherproof”The RV-M7 is available with optional IP65-rated “weatherproof”connections and enclosure. All models include protection against damage from over-temperature, high VSWR, and reverse voltage.Flexible Addressing and Error CorrectionThe RV-M7 uses a 16 bit address with a 16 bit network mask, allowing for many devices to be co-located without receiving each other, as well as the creation of sophisticated network topologies.For More InformationFor more information about this or any other Raveon product, call in the U.S.A. 1-760-444-5995.RV-M7-V ATechnical Specifications are subject to change without notice.Raveon Technologies Corporation2461 Impala DriveCarlsbad, CA 92010Copyright Raveon Technologies Corp, 2012Phone: +1-760-444-5995All rights reservedFax: +1-760-444-5997Email:****************Version C3. Printed in the USAGeneral SpecificationsModel:RV-M7-Vx-oo (x=band) (oo=options) RV-M7-VM (MURS model) Size: 4.60” X 2.60” X .956 (11.7cm X 6.6cm X 2.43cm) Weight:6 ozInput Voltage: 10 – 16 VDC Current draw:Receiving data: <65mA (55mA typ. at 12VDC)Transmitting data: (1.8A @ 5w, 1.1A @ 2W typical) Frequency Band:Band Frequency A 136-155MHz Available Frequencies: B 150-174MHz SRS-M7-VBMURS 5 MURS chan. SRS-M7-VM Serial Port Baud Rates (programmable)1.2k,2.4k, 4.8k, 9.6k, 19.2k, 38.4k, 57.6k, 115.2k Over-the-air baud rates (programmable) Narrow IF: 800, 1200, 2000, 2400, 4.8k, 5142, 8K, 9.6kWide IF: 1200, 2000, 2400, 4.8k, 8k, 9.6k, 19.2k Operating ModeSimplex or Half-duplex Full Spec Operating Temperature range -30°C to +60°CTX-RX and RX-TX turn-around time <5mS Wake-up time<500mS from OFF <5mS from Sleep Front Panel LEDsPower , Status (Carr Det, TX, mode…) RF I/O ConnectorBNC (Female) Power CableRaveon P/N: RT-CB-H1 AddressingIndividual address: 65,536 Groups: 254Transmitter SpecificationsRF Power Output 500mW – 5.0 W programmable (2W max for MURS model)Maximum Duty Cycle 100% @ 2W to 40C, 25% @5W (100% w/ optional heatsink) Frequency Deviation± 2.2kHz (N) ± 3.3kHz (W)RF BandwidthFull-band without tuning Occupied bandwidth 11 kHz (-N) 16kHz(-W)TX Spurious outputs < -70dBc TX Harmonic outputs < -80dBc Occupied BandwidthPer FCCFCC Emissions Designator 11K0F1D (narrowband mode) 15K0F1D (wideband mode) Frequency Stability Better than ±2.5ppmReceiver SpecificationsRX sensitivity (1% PER, N) ................... 9600bps < -108dBm4800bps < -114dB 1200bps < -118dBRF No-tune bandwidth ......................... Full-band without tuning Adjacent Channel Selectivity ................ -70dB (1200bps Wide) Adjacent Channel Selectivity ................ -65dB (1200bps Narrow) Adjacent Channel Selectivity ................ -60dB (4800bps Narrow) Alternate Channel Selectivity ............... -70dB Blocking and spurious rejection ........... -80dBRX intermodulation rejection ............... -75dB (4800bps Narrow) RX intermodulation rejection ............... -80dB (1200bps Narrow)Interface SpecificationsSerial Interface PortConnector Type DB-9IO Voltage Levels RS-232, RS-485, RS-422(user selectable) Word length7 or 8 bits, N, O, or E Modem handshake signalsRTS, CTS, CDAT Commands OverviewChannel Number, Operating Frequency, IF bandwidth Modem StatisticsPower-savings modesUnit Address and Destination address Network Address Mask ARQ error correction on/off Baud Rate, parity, stop bitsSelect Packet or Streaming mode of data transmission Store-and-forward Repeating configurationHardware flow control operation LEDs operation or disabledFor a complete feature list see the technical manual here:/support.html。

法国尚飞管状电机技术参数
下面将详细介绍法国尚飞管状电机的技术参数：
1.输入电源参数：
2.功率参数：
法国尚飞管状电机的功率参数包括额定功率和峰值功率。

额定功率是指电机在额定负载条件下工作的功率，峰值功率是指电机在短时间内能够承受的最大功率。

不同型号的管状电机具有不同的功率参数，可以根据具体应用需求选择合适的型号。

3.转速参数：
法国尚飞管状电机的转速参数包括空载转速和额定转速。

空载转速是指电机在无载荷情况下的转速，额定转速是指电机在额定负载条件下的转速。

不同型号的管状电机具有不同的转速范围，可以根据具体应用需求选择合适的型号。

4.扭矩参数：
法国尚飞管状电机的扭矩参数包括额定扭矩和峰值扭矩。

额定扭矩是指电机在额定负载条件下的输出扭矩，峰值扭矩是指电机在短时间内能够输出的最大扭矩。

不同型号的管状电机具有不同的扭矩参数，可以根据具体应用需求选择合适的型号。

5.效率参数：
6.控制方式：
法国尚飞管状电机支持多种控制方式，包括开环控制和闭环控制。

开环控制是指电机输出转矩和速度的控制不依赖于反馈信号，闭环控制是指电机输出转矩和速度的控制依赖于反馈信号。

闭环控制可以提高系统的稳定性和精度，常用于对转矩和速度要求较高的应用。

总结：
以上是法国尚飞管状电机的一些主要技术参数，包括输入电源参数、功率参数、转速参数、扭矩参数、效率参数和控制方式。

这些参数可以根据具体的应用需求进行选择和配置，以实现最佳的性能和效果。

法国尚飞管状电机以其先进的技术和优良的性能受到广泛的应用和认可。

RQA0008NXAQSSilicon N-Channel MOS FETREJ03G1569-0100Rev.1.00Jul 04, 2007Features• High Output Power, High Gain, High EfficiencyPout = +36 dBm, Linear Gain = 18 dB, PAE = 65% (f = 520 MHz)• Compact package capable of surface mountingOutline*UPAK is a trademark of Renesas Technology Corp.Absolute Maximum Ratings(Ta = 25°C)UnitRatingsItem SymbolDrain to source voltage V DSS 16 V Gate to source voltage V GSS ±5 V Drain current I D 2.4 A Channel dissipation Pch note 10 W Channel temperature Tch 150 °CStorage temperature Tstg –55 to +150 °CNote: Value at Tc = 25°CThis device is sensitive to electro static discharge. An adequate careful handling procedure is requested.Electrical Characteristics(Ta = 25°C)Item Symbol Min. Typ Max. Unit Test ConditionsZero gate voltage drain current I DSS — — 10 µA V DS = 16 V, V GS = 0 Gate to source leak current I GSS — — ±2 µA V GS = ±5 V, V DS = 0 Gate to source cutoff voltage V GS(off) 0.15 0.4 0.8 V V DS = 6 V, I D = 1 mA Forward Transfer Admittance |yfs| — 2.4 — S V DS = 6 V, I D = 1.2 A Input capacitance Ciss — 44 — pF V GS = 5 V, V DS = 0, f = 1 MHz Output capacitance Coss — 25 — pF V DS = 6 V, V GS = 0, f = 1 MHz Reverse transfer capacitance Crss — 6.0 — pF V DG = 6 V, V GS = 0, f = 1 MHz — 36 — dBm Output Power Pout — 3.98 — WPower Added Efficiency PAE — 65 — % V DS = 6 V, I DQ = 400 mAf = 520 MHz, Pin = +20 dBmMain CharacteristicsEvaluation Circuit (f = 520 MHz)S Parameter(V DS = 6 V, I DQ = 400 mA, Zo = 50 Ω)S11 S21 S12 S22(deg.) MAG ANG(deg.)(deg.)MAG ANGf(MHz) MAG ANG(deg.) MAG ANG100 0.883 -170.0 8.48 84.9 0.021 -3.0 0.867 -175.4 150 0.904 -175.7 5.46 80.1 0.021 -5.3 0.879 -177.3 200 0.902 -178.2 4.13 72.6 0.021 -12.0 0.872 -178.5 250 0.900 179.6 3.30 67.1 0.021 -16.5 0.872 -179.7 300 0.898 177.8 2.75 61.6 0.021 -19.8 0.873 179.5 350 0.898 176.2 2.34 56.2 0.020 -24.2 0.873 178.8 400 0.897 174.8 2.04 50.9 0.020 -27.7 0.874 178.4 450 0.898 173.4 1.80 45.7 0.020 -31.3 0.873 177.8 500 0.899 172.3 1.61 40.7 0.020 -34.4 0.873 177.4 550 0.900 171.2 1.46 35.5 0.019 -38.2 0.875 176.8 600 0.900 170.1 1.33 30.5 0.019 -41.5 0.876 176.5 650 0.899 169.0 1.22 25.5 0.019 -45.0 0.876 176.0 700 0.899 167.9 1.13 20.5 0.019 -47.8 0.878 175.6 750 0.899 166.9 1.04 15.6 0.018 -51.2 0.878 175.2 800 0.898 165.8 0.97 10.6 0.018 -54.8 0.880 174.9 850 0.899 164.7 0.91 5.7 0.018 -57.4 0.878 174.4 900 0.901 163.7 0.85 0.9 0.018 -60.9 0.880 173.9 950 0.903 162.7 0.80 -3.9 0.017 -63.5 0.882 173.5 1000 0.903 161.8 0.75 -8.7 0.017 -66.5 0.883 173.1 1050 0.903 160.8 0.71 -13.4 0.017 -69.3 0.884 172.6 1100 0.905 159.8 0.68 -18.1 0.016 -71.9 0.883 172.1 1150 0.906 158.8 0.64 -22.8 0.016 -74.8 0.886 171.6 1200 0.907 157.8 0.61 -27.3 0.016 -76.8 0.888 171.2 1250 0.909 156.8 0.58 -32.0 0.015 -79.6 0.891 170.8 1300 0.911 155.8 0.55 -36.6 0.015 -81.9 0.893 170.4 1350 0.912 154.9 0.52 -41.2 0.015 -84.1 0.896 170.0 1400 0.912 154.0 0.50 -45.8 0.015 -86.2 0.897 169.5 1450 0.912 153.1 0.48 -50.3 0.014 -88.6 0.898 169.1 1500 0.913 152.1 0.46 -54.8 0.014 -90.2 0.900 168.7 1550 0.914 151.2 0.44 -59.2 0.014 -92.6 0.900 168.4 1600 0.915 150.3 0.42 -63.8 0.014 -94.1 0.902 167.8 1650 0.916 149.4 0.40 -68.3 0.013 -95.9 0.903 167.4 1700 0.915 148.5 0.39 -72.6 0.013 -97.6 0.904 167.0 1750 0.914 147.6 0.38 -76.9 0.013 -99.0 0.904 166.4 1800 0.913 146.7 0.36 -81.1 0.013 -100.8 0.906 165.8 1850 0.915 145.7 0.35 -85.3 0.013 -102.2 0.909 165.5 1900 0.920 144.5 0.34 -89.5 0.013 -103.9 0.909 165.0 1950 0.923 143.3 0.33 -93.6 0.013 -105.8 0.910 164.5 2000 0.925 142.3 0.31 -97.9 0.013 -107.2 0.911 163.9 2050 0.926 141.4 0.30 -102.1 0.013 -108.7 0.913 163.5 2100 0.928 140.5 0.29 -106.3 0.013 -109.9 0.914 163.0 2150 0.929 139.6 0.28 -110.6 0.013 -112.2 0.916 162.4 2200 0.930 138.7 0.27 -114.7 0.013 -112.8 0.917 161.8 2250 0.932 137.8 0.27 -118.9 0.013 -114.9 0.921 161.5 2300 0.931 137.1 0.26 -123.0 0.013 -116.5 0.921 161.0 2350 0.930 136.3 0.25 -127.1 0.013 -118.5 0.921 160.5 2400 0.926 135.5 0.24 -131.2 0.013 -120.2 0.924 159.9 2450 0.922 134.4 0.24 -135.4 0.014 -121.9 0.923 159.5 2500 0.920 133.3 0.23 -139.5 0.014 -123.7 0.921 159.0Package DimensionsOrdering InformationPart Name Quantity Shipping Containerφ178 mm reel, 12 mm emboss tapingRQA0008NXTL-E 1000pcs.Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.Refer to "/en/network " for the latest and detailed information.Renesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900Renesas Technology (Shanghai) Co., Ltd.Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898Renesas Technology Hong Kong Ltd.7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001Renesas Technology Korea Co., Ltd.Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145Renesas Technology Malaysia Sdn. BhdUnit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510RENESAS SALES OFFICES。

Vishay SemiconductorsVLMF31..High Intensity SMD LEDFEATURES•SMD LED with exceptional brightness •Luminous intensity categorized•Compatible with automatic placement equipment•EIA and ICE standard package•Compatible with IR Reflow, vapor phase and wave solder processes acc. to CECC 00802 and J-STD-020C•Available in 8 mm tape •Low profile package•Non-diffused lens: excellent for coupling to light pipes and backlighting •Low power consumption •Luminous intensity ratio in one packaging unit I Vmax /I Vmin ≤ 1.6•Lead (Pb)-free device-RoHS compliant •Preconditioning: acc. to JEDEC Level 2a •ESD-withstand voltage:up to 2 kV according to JESD22-A114-B19225DESCRIPTIONThis device has been designed to meet the increasing demand for AlInGaP technology.The package of the VLMF31.. is the PLCC-2.It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy.APPLICATIONS •Automotive: Backlighting in dashboards and switches•Telecommunication: Indicator and backlighting in telephone and fax•Indicator and backlight for audio and video equip-ment•Indicator and backlight in office equipment •Flat backlight for LCDs, switches and symbols •General usePARTS TABLEPARTCOLOR, LUMINOUS INTENSITY ANGLE OF HALF INTENSITY (± ϕ)TECHNOLOGY VLMF31Q2T1-GS08Soft Orange, I V = (90 to 355) mcd 60°AllnGaP on GaAs VLMF31Q2T1-GS18Soft Orange, I V = (90 to 355) mcd 60°AllnGaP on GaAs VLMF31R1S2-GS08Soft Orange, I V = (112 to 280) mcd 60°AllnGaP on GaAs VLMF31R1S2-GS18Soft Orange, I V = (112 to 280) mcd 60°AllnGaP on GaAs VLMF31S1T1-GS08Soft Orange, I V = (180 to 355) mcd 60°AllnGaP on GaAs VLMF31S1T1-GS18Soft Orange, I V = (180 to 355) mcd60°AllnGaP on GaAsVishay Semiconductors VLMF31..Note:1) Tamb = 25°C unless otherwise specified2) Driving the LED in reverse direction is suitable for a short term application Note:1) Tamb = 25°C unless otherwise specified2) in one Packing Unit IVmax/I Vmin≤ 1.6Note:Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %.The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel).In order to ensure availability, single brightness groups will not be or-derable.In a similar manner for colors where wavelength groups are mea-sured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable.Note:Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm.ABSOLUTE MAXIMUM RATINGS1), VLMF31..PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage2)V R5V DC Forward current T amb≤ 85°C I F30mA Surge forward current t p≤ 10 µs I FSM0.1A Power dissipation P V80mW Junction temperature T j125°C Operating temperature range T amb- 40 to + 100°C Storage temperature range T stg- 40 to + 100°CThermal resistance junction/ ambient mounted on PC board(pad size > 16 mm2)R thJA400K/WOPTICAL AND ELECTRICAL CHARACTERISTICS1), VLMF31.., SOFT ORANGEPARAMETER TEST CONDITION PART SYMBOL MIN TYP.MAX UNIT Luminous intensity2)I F = 20 mA VLMF31Q2T1I V90355mcdVLMF31R1S2I V112280mcdVLMF31S1T1I V180355mcd Dominant wavelength I F = 20 mAλd598605611nm Peak wavelength I F = 20 mAλp610nm Angle of half intensity I F = 20 mAϕ± 60deg Forward voltage I F = 20 mA V F 2.0 2.6V Reverse voltage I R = 10 µA V R5V Junction capacitance V R = 0, f = 1 MHz C j15pFLUMINOUS INTENSITY CLASSIFICATIONGROUP LIGHT INTENSITY [MCD]STANDARD OPTIONAL MIN MAXP 14556 25671Q 17190 290112R 1112140 2140180S 1180224 2224280T 12803552355450CROSSING TABLEVISHAY OSRAMVLMF31Q2T1LOT676-Q2T1VLMF31R1S2LOT676-R1S2VLMF31S1T1LOT676-S1T1COLOR CLASSIFICATIONGROUP SOFT ORANGEDOM. WAVELENGTH (NM)MIN. MAX.159860126006033602605460460756066096608611Vishay SemiconductorsVLMF31..TYPICAL CHARACTERISTICST amb = 25°C unless otherwise specifiedFigure 1. Forward Current vs. Ambient TemperatureFigure 3. Rel. Luminous Intensity vs. Angular Displacement 05101520253035400102030405060708090100T am b - Am b ient Temperat u re (°C)16615I - F o r w a r d C u r r e n t (m A )F0.40.200.20.40.695 103190.60.90.80°30°10°20°40°50°60°70°80°0.71.0I v r e l -R e l a t i v e L u m i n o u s I n t e n s i t yFigure 4. Relative Intensity vs. WavelengthFigure 5. Forward Current vs. Forward VoltageFigure6. Relative Luminous Intensity vs. Forward Current1101001.01.52.0 2.53.0V F -For w ard V oltage (V )95 10878F I -F o r w a r d C u r r e n t (m A )Vishay SemiconductorsVLMF31..PACKAGE DIMENSIONS IN MMFigure7. Rel. Luminous Intensity vs. Ambient Temperature Figure8. Forward Voltage vs. Ambient TemperatureVishay SemiconductorsVLMF31..METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES)Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component inser-tion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape.TAPING OF VLM.3..REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08(= 1500 PCS.)REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18(= 8000 PCS.) PREFEREDFigure9. Tape dimensions in mm for PLCC-2Figure 10. Reel dimensions - GS08Figure 11. Reel dimensions - GS18Vishay SemiconductorsVLMF31..SOLDERING PROFILEBARCODE-PRODUCT-LABEL EXAMPLE:A)Type of component B)Manufacturing PlantC)SEL - Selection Code (Bin):e.g.: Q2 = Code for Luminous Intensity Group 1 = Code for Color Group D)Date Code year/weekE)Day Code (e.g. 3: Wednesday)F)Batch No.G)Total quantity H)Company CodeFigure 12. Vishay Leadfree Reflow Soldering Profile(acc. to J-STD-020C)Figure 13. Double wave soldering of opto devices (all packages)V ISHAYAHBC D E F GVishay SemiconductorsVLMF31..DRY PACKINGThe reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transpor-tation and storage.FINAL PACKINGThe sealed reel is packed into a cardboard box. A sec-ondary cardboard box is used for shipping purposes.RECOMMENDED METHOD OF STORAGEDry box storage is recommended as soon as the alu-minium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available:• Storage temperature 10°C to 30°C • Storage humidity ≤ 60 % RH max.After more than 672 hours under these conditions moisture content will be too high for reflow soldering.In case of moisture absorption, the devices will recover to the former condition by drying under the following condition:192 hours at 40°C + 5°C/ - 0°C and < 5 % RH (dry air/nitrogen) or96 hours at 60°C + 5°C and < 5 % RH for all device containers or24 hours at 100°C + 5°C not suitable for reel or tubes.An EIA JEDEC Standard JESD22-A112 Level 2a label is included on all dry bags.Example of JESD22-A112 Level 2a labelESD PRECAUTIONProper storage and handling procedures should be fol-lowed to prevent ESD damage to the devices espe-cially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warn-ing labels are on the packaging.VISHAY SEMICONDUCTORS STANDARD BAR-CODE LABELSThe Vishay Semiconductors standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.VLMF31..Vishay SemiconductorsOZONE DEPLETING SUBSTANCES POLICY STATEMENTIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor G mbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or deathassociated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyLegal Disclaimer NoticeVishayNoticeSpecifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.。

CN77000 R300和R500控制器,图片中含RHS-43孔锯, 易于钻圆孔。

有关订购信息, 请参见最后一页。

CN77333-A2 NEMA 12款方形开孔。

CN77533 NEMA 4方形开孔。

图片为实际尺寸。

1⁄16 DIN MICROMEGA ®自动调谐PID温度/过程控制器U 高精度：±0.5°C (0.9°F), 读数的0.03% U品质优秀, 还有5年保修支持 U 通用输入—过程电压/电流、热电偶、RTD U 双4位数字LED 显示屏和指示器, 用于显示输出和报警状态 U 可选RS232或RS485, OMEGA ® 协议U 继电器、SSR 、DC 脉冲、0 ~ 10 V, 以及 0 ~ 20 mA 输出类型 U 斜坡到设定值功能 U 通用电源, 90 ~ 250 Vac 或Vdc U 双输出和双报警功能U 隔离模拟输出或远程设定值可选将方形控制器放置于圆孔中！高精度、高品质MICROMEGA ®控制器在过程控制中提供无与伦比的灵活性。

每台设备均允许用户从10个热电偶类型（J 、K 、T 、E 、R 、S 、B 、C 、N 和JDIN ）、Pt RTD （100、500或1000 Ω, 385或392曲线）或者模拟电压或电流输入中选择输入类型。

 电压/电流输入可完全扩展到各工程单位，可选择小数点，是压力、流量或其他过程输入的理想之选。

MICROMEGA ®控制器具有大型双LED 显示屏，采用前面板配置，可选温度/过程输入，并接受90 ～ 250 Vac 或Vdc 通用电源。

提供单和双输入配置，CN77000系列适用于继电器、SSR 、DC 脉冲或模拟电压或电流输出。

单报警是标准配置。

可选项包括第二报警、 RS232、RS485、模拟输出以及远程设定值可选。

“300”系列控制器有许多特色，更大，紧凑型1⁄4 DIN 控制器，1⁄16 DIN 尺寸。

97535C (Rev. F - 11/03)HALSEY TAYLOR OWNERS MANUALUSES HFC-134A REFRIGERANTFIG. 12, 34SEE FIG. 51, 3214,158,9,10,1137,3819620163413291272128355,18SEE FIG. 6SEE FIG. 43330, 31, 4139403697535C (Rev. F - 11/03)F IG . 2E = I N S U R E P R O P E R V E N T I L A T I O N B Y M A I N T A I N I N G 4" (102m m ) M I N . C L E A R A N C EF R O M C A B I N E T L O U V E R S T O W A L L .A S EG U R E U N A V E N T I L A C I ÓN A D E C U A D A M A N T E N I E N D O U N E S P A C I O E 4" (102m m ) M ÍN . D EH O L G U R A E N T R E L A R E JI L L A D E V E N T I L A C I ÓN D E L M U E B L E Y L A P A R E D A S S U R E Z -V O U S U N E B O N N E V E N T I L A T I O N E N G A R D A N T 4" (102m m ) M I N . E N T R E L E S ÉV E N T S D E L E N C E I N T E E T L E M U R .F = P O W E R C O R D 4' (1219m m ) L O N G C A B L E E L ÉC T R I C O D E 4' (1219m m ), D E L A R G O C O R D O N D A L I M E N T A T I O N 4' (1219m m )G = 1/4" (6m m ) S C R E W H O L E S I N M O U N T I N G P L A T E A G UJ E R O S D E T O R N I L L O 1/4" (6m m ) E N L A P L A C A D E M O N T A J E T R O U S D E V I S 1/4" (6m m ) D A N S L A P L A Q U E D E M O N T A G EL E G E N D /L E Y E N D A /L ÉG E N D E A = R E C O M M E N D E D W A T E R S U P P L Y L O C A T I O N 3/8 O .D . U N P L A T E D C O P P E R T U B E C O N N E C T S T U B O U T 1-1/2 I N .(38m m ) F R O M W A L L S H U T O F F B Y O T H E R S S E R E C O M I E N D A U B I C A R E L T U B O C O R T O D E C O N E X I ÓN A L T U B O D E C O B R E S I N C H A P A R D E 3/8" D E D I ÁM .E X T . A 1-1/2" (38 m m ) F U E R A D E L A L L A V E D E P A S O E N L A P A R E D C O L O C A D A P O R T E R C E R O S . E M P L A C E M E N T R E C O M M A N D É D 'A L I M E N T A T I O N E N E A U P A R T U B E E N C U I V R E N O N P L A Q U É D E 3/8 P O . (9,5m m ) D .E . C O N N E C T A N T U N E T U Y A U T E R I E D E 1-1/2 P O . (38 m m ) D E P U I S L E R O B I N E T D 'A R R ÊT F O U R N I P A R D 'A U T R E S .B = R E C O M M E N D E D L O C A T I O N F O R W A S T E O U T L E T 1-1/4 O .D . D R A I N U B I C A C I ÓN R E C O M E N D A D A P A R A E L D R E N A J E D E S A L I D A D E A G U A , D E 1¼ D E D I ÁM E T R O .E M P L A C E M E N T R E C O M M A N D É P O U R L E D R A I N D E D .E . 1-1/4" D E S O R T I E D E A U .C = 1-1/4 T R A P N O T F U R N I S H E D P U R G A D O R D E 1¼ N O P R O P O R C I O N A D O S I P H O N 1-1/4 N O N F O U R N I D = E L E C T R I C A L O U T L E T L O C A T I O N U B I C A C I ÓN D E L A T O M A D E E L E C T R I C I D A D E M P L A C E M E N T D E L A P R I S E D E C O U RA N T97535C (Rev. F - 11/03)PUSH BUTTON VALVE ADJUSTMENTFIG. 3FIG. 4CORRECT STREAM HEIGHTFIG. 5STREAM HEIGHTADJUSTMENT SCREW1723252422,26,271ADJUST THIS SCREW TO ELIMINATE VALVE LEVER "FREE PLAY" OR CONTINUOUS FLOW FROM BUBBLERITEMIZED PARTS LIST ITEM NO.P ART NO.DESCRIPTION51544C 102639931640 16027050864028340C75561C66506C31513C35775C35840C 19424390155035766C45696C 601418151550 101453431640 10150753155075494C55860C40136C66203C66257C31517C15005C26860C26861C26862C50986C61314C55996C45670C75588C55913C56159C70682C See Color Table See Color Table56092C35843C35844C70683C See Color Table75589C 400660943730BubblerDrain PlugStrainer PlateBasinFitting-Elbow 3/8 x 3/8 NPT x 90 EvaporatorCold ControlCompressor Serv. Pak OverloadElectrical ShieldRelay CoverTailpipe AssyCondenserCap Push ButtonPush Button StemCheck ValveRegulator BracketWater Temperature ValveDrierHeat ExchangerPower CordRegulator Retaining Nut Regulator LeverPivot BracketRegulator Retaining Bracket Regulator HolderRegulatorStrainerVacuum BreakNut - Slip Joint 1-1/4Adaptor - DrainNipple - BubblerT ee - 1/4Side Panel - RightSide Panel - LeftPoly Tubing (Cut T o Length) RelayCapacitorUnion - 1/4Front PanelGasketHanger Bracket1 2 3 4 5 6 7 8* 9 10 11 12** 13 14 15 16 17 18 19 20 21 22 23242526272829303132333435363738394041-*INCLUDES RELAY & OVERLOAD. IF UNDER WARRANTY, REPLACE WITH SAME COMPRESSOR USED IN ORIGINAL ASSEMBLY. NOTE: All correspondence pertaining to any of the above water coolers or orders for repair parts MUST include Model No. and Serial No. of cooler, name and part number of replacement part.2222 CAMDEN COURTOAK BROOK, IL 60523630.574.3500PRINTED IN U.S.A.CONDENSER WATER VALVE ADJUSTMENT The conde nse r wate r valve is factory pre se t for a conde nse r wate r outlet temperature of 95° to 105° F.If actual te mpe rature varie s gre atly from this, re adjust wate r flow rate at the valve using the following proce dure s.1. ST ART UP COMPRESSORThis can be accomplished by depressing the cooler push button(See Fig. 1 - Item 14). Keep water running during the entirereadjustment procedure.2. ADJUSTMENT CONDENSER WATER VALVEAdjust valve by rotating adjustment stem. Rotating stem clockwise will de cre ase wate r flow. Counte rclockwise rotation will incre ase wate r flow. Increasing water flow will result in a lower condenser outlettemperature, while decreasing water flow will result in a higher outlet temperature. Proper adjustment is attained when condenser outlettemperature is 95° to 105° F.WIRING DIAGRAMThis drawing is merely for illustrating thecomponents of the electrical system.FIG. 6COLOR ITEM 35Platinum (PV) Stainless Steel (SS)401432248410401432242830ITEM 40401483948410401483942830ITEM 34401484048410401484042830**Includes items 30, 31 & 41 800-518-538897535C (Rev. F - 11/03)。

Eaton 199047Eaton Moeller® series Rapid Link - Speed controllers, 8.5 A, 4 kW, Sensor input 4, Actuator output 2, 400/480 V AC, PROFINET, HAN Q4/2, with manual override switch, with fanGeneral specificationsEaton Moeller® series Rapid Link Speed controller1990474015081971053195 mm 270 mm 220 mm 3.81 kg CE RoHS UL approval UL 61800-5-1 IEC/EN 61800-5-1Product NameCatalog NumberEANProduct Length/Depth Product Height Product Width Product Weight Certifications Catalog Notes 3 fixed speeds and 1 potentiometer speedcan be switched over from U/f to (vector) speed control Connection of supply voltage via adapter cable on round or flexible busbar junction Diagnostics and reset on the device and via PROFINETInternal and on heat sink, temperature-controlled Fan Parameterization: KeypadParameterization: FieldbusParameterization: drivesConnect mobile (App) Parameterization: drivesConnectKey switch position HANDThermo-click with safe isolationControl unitInternal DC linkKey switch position OFF/RESET2 Actuator outputsFanManual override switchSelector switch (Positions: REV - OFF - FWD)PC connectionIGBT inverterPTC thermistor monitoringTwo sensor inputs through M12 sockets (max. 150 mA) for quick stop and interlocked manual operationKey switch position AUTO3 fixed speeds1 potentiometer speedFor actuation of motors with mechanical brake NEMA 12IP651st and 2nd environments (according to EN 61800-3)IIISpeed controllerPROFINET IOC2, C3: depending on the motor cable length, the connected load, and ambient conditions. External radio interference suppression filters (optional) may be necessary.C1: for conducted emissions only2000 VAC voltagePhase-earthed AC supply systems are not permitted.Center-point earthed star network (TN-S network)Vertical15 g, Mechanical, According to IEC/EN 60068-2-27, 11 ms, Half-sinusoidal shock 11 ms, 1000 shocks per shaftResistance: According to IEC/EN 60068-2-6Resistance: 6 Hz, Amplitude 0.15 mmResistance: 10 - 150 Hz, Oscillation frequencyResistance: 57 Hz, Amplitude transition frequency on accelerationFeatures Fitted with:Functions Degree of protectionElectromagnetic compatibility Overvoltage categoryProduct categoryProtocolRadio interference classRated impulse withstand voltage (Uimp) System configuration typeMounting positionShock resistanceVibrationAbove 1000 m with 1 % performance reduction per 100 m Max. 2000 m-10 °C40 °C-40 °C70 °CIn accordance with IEC/EN 50178< 95 %, no condensation Adjustable, motor, main circuit0.8 - 8.5 A, motor, main circuit< 10 ms, Off-delay< 10 ms, On-delay98 % (η)7.8 A3.5 mA120 %Maximum of one time every 60 seconds 380 V480 V380 - 480 V (-10 %/+10 %, at 50/60 Hz)BLDC motorsSensorless vector control (SLV)PM and LSPM motorsSynchronous reluctance motorsU/f control0 Hz500 HzFor 60 s every 600 sAt 40 °C12.7 AAltitudeAmbient operating temperature - min Ambient operating temperature - max Ambient storage temperature - min Ambient storage temperature - max Climatic proofing Current limitationDelay timeEfficiencyInput current ILN at 150% overload Leakage current at ground IPE - max Mains current distortionMains switch-on frequencyMains voltage - minMains voltage - maxMains voltage toleranceOperating modeOutput frequency - minOutput frequency - maxOverload currentOverload current IL at 150% overload45 Hz66 Hz4 kW480 V AC, 3-phase400 V AC, 3-phase0.1 Hz (Frequency resolution, setpoint value)200 %, IH, max. starting current (High Overload), For 2 seconds every 20 seconds, Power section50/60 Hz8 kHz, 4 - 32 kHz adjustable, fPWM, Power section, Main circuitAC voltagePhase-earthed AC supply systems are not permitted.Center-point earthed star network (TN-S network)5 HP≤ 0.6 A (max. 6 A for 120 ms), Actuator for external motor brakeAdjustable to 100 % (I/Ie), DC - Main circuit≤ 30 % (I/Ie)400/480 V AC -15 % / +10 %, Actuator for external motor brake10 kAType 1 coordination via the power bus' feeder unit, Main circuit400/480 V AC (external brake 50/60 Hz)24 V DC (-15 %/+20 %, external via AS-Interface® plug)PROFINET, optionalPlug type: HAN Q4/2Max. total power consumption from AS-Interface® power supply unit (30 V): 250 mASpecification: S-7.4 (AS-Interface®)Number of slave addresses: 31 (AS-Interface®)C1 ≤ 1 m, maximum motor cable length C3 ≤ 25 m, maximum motor cable length C2 ≤ 5 m, maximum motor cable lengthMeets the product standard's requirements.Rated frequency - minRated frequency - maxRated operational power at 380/400 V, 50 Hz, 3-phase Rated operational voltageResolutionStarting current - maxSupply frequencySwitching frequencySystem configuration type Assigned motor power at 460/480 V, 60 Hz, 3-phase Braking currentBraking torqueBraking voltageRated conditional short-circuit current (Iq)Short-circuit protection (external output circuits) Rated control voltage (Uc)Communication interfaceConnectionInterfacesCable length10.2.2 Corrosion resistanceMeets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Rapid Link 5 - brochureDA-SW-drivesConnect - installation helpDA-SW-USB Driver PC Cable DX-CBL-PC-1M5DA-SW-Driver DX-CBL-PC-3M0DA-SW-drivesConnect - InstallationshilfeDA-SW-USB Driver DX-COM-STICK3-KITDA-SW-drivesConnectMaterial handling applications - airports, warehouses and intra-logisticseaton-bus-adapter-rapidlink-speed-controller-dimensions-003.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-005.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-004.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-002.epsETN.RASP5-8424PNT-412R001S1.edzIL034093ZUramo5_v32.dwgrasp5_v32.stpGeneration Change RA-SP to RASP5Generation change RAMO4 to RAMO5Generation change from RA-MO to RAMO 4.0Configuration to Rockwell PLC for Rapid LinkGeneration Change RASP4 to RASP5Generation change from RA-SP to RASP 4.0DA-DC-00004508.pdfDA-DC-00003964.pdfDA-DC-00004514.pdfDA-DC-00004184.pdf10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies10.4 Clearances and creepage distances10.5 Protection against electric shock10.6 Incorporation of switching devices and components10.7 Internal electrical circuits and connections10.8 Connections for external conductors10.9.2 Power-frequency electric strength10.9.3 Impulse withstand voltage10.9.4 Testing of enclosures made of insulating material BrochureDisegnieCAD modelIstruzioni di installazione mCAD modelNote per l'applicazione Report di certificazioneEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. Tutti i diritti riservati. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility10.13 Mechanical function。

用于Peltier模块的集成温度控制器概论MAX1978 / MAX1979是用于Peltier热电冷却器（TEC）模块的最小, 最安全, 最精确完整的单芯片温度控制器。

片上功率FET和热控制环路电路可最大限度地减少外部元件, 同时保持高效率。

可选择的500kHz / 1MHz开关频率和独特的纹波消除方案可优化元件尺寸和效率, 同时降低噪声。

内部MOSFET的开关速度经过优化, 可降低噪声和EMI。

超低漂移斩波放大器可保持±0.001°C的温度稳定性。

直接控制输出电流而不是电压, 以消除电流浪涌。

独立的加热和冷却电流和电压限制提供最高水平的TEC保护。

MAX1978采用单电源供电, 通过在两个同步降压调节器的输出之间偏置TEC, 提供双极性±3A输出。

真正的双极性操作控制温度, 在低负载电流下没有“死区”或其他非线性。

当设定点非常接近自然操作点时, 控制系统不会捕获, 其中仅需要少量的加热或冷却。

模拟控制信号精确设置TEC 电流。

MAX1979提供高达6A的单极性输出。

提供斩波稳定的仪表放大器和高精度积分放大器, 以创建比例积分（PI）或比例积分微分（PID）控制器。

仪表放大器可以连接外部NTC或PTC热敏电阻, 热电偶或半导体温度传感器。

提供模拟输出以监控TEC温度和电流。

此外, 单独的过热和欠温输出表明当TEC温度超出范围时。

片上电压基准为热敏电阻桥提供偏置。

MAX1978 / MAX1979采用薄型48引脚薄型QFN-EP 封装, 工作在-40°C至+ 85°C温度范围。

采用外露金属焊盘的耐热增强型QFN-EP封装可最大限度地降低工作结温。

评估套件可用于加速设计。

应用光纤激光模块典型工作电路出现在数据手册的最后。

WDM, DWDM激光二极管温度控制光纤网络设备EDFA光放大器电信光纤接口ATE特征♦尺寸最小, 最安全, 最精确完整的单芯片控制器♦片上功率MOSFET-无外部FET♦电路占用面积<0.93in2♦回路高度<3mm♦温度稳定性为0.001°C♦集成精密积分器和斩波稳定运算放大器♦精确, 独立的加热和冷却电流限制♦通过直接控制TEC电流消除浪涌♦可调节差分TEC电压限制♦低纹波和低噪声设计♦TEC电流监视器♦温度监控器♦过温和欠温警报♦双极性±3A输出电流（MAX1978）♦单极性+ 6A输出电流（MAX1979）订购信息* EP =裸焊盘。

ARM®Cortex TM-M032位微处理器SWM150系列MCU数据手册华芯微特科技有限公司Synwit Technology Co., Ltd.目录1概述 (5)2特性 (5)3选型指南 (6)4功能方框图 (7)5管脚配置 (8)5.1TQFP48 (8)5.2LQFP64 (9)5.3管脚描述 (9)6功能描述 (13)6.1存储器映射 (13)6.2中断控制器 (15)6.3系统定时器 (20)6.4系统控制器 (21)6.5系统管理（SYSCON） (23)6.6通用I/O（GPIO） (49)6.7通用型定时器（TIMER） (55)6.8专用定时器（TIMERSE） (58)6.9看门狗定时器（WDT） (64)6.10UART接口控制器（UART） (67)6.11串行外设接口（SPI）控制器 (75)6.12脉冲宽度调制（PWM）发生器 (89)6.13模拟数字转换器（ADC） (101)6.14正交编码器（QEI） (110)6.15比较器/放大器（CMP） (119)6.16ISP及FLASH操作 (123)7典型应用电路 (125)8电气特性 (125)8.1绝对最大额定值 (125)8.2DC电气特性 (125)8.3AC电气特性 (126)8.4模拟器件特性 (127)9封装信息 (128)9.1TQFP48 (128)9.2LQFP64 (129)10版本记录 (130)图目录图4-1功能方框图 (7)图5-1 LQFP64封装管脚配置 (8)图5-2 LQFP64封装管脚配置 (9)图6-2 I/O引脚示意图 (26)图6-3 FLASH接口示意图 (27)图6-4 端口E滤波示意图 (50)图6-5 脉冲捕捉示意图 (59)图6-6 占空比捕捉示意图 (60)图6-7 UART结构图 (67)图6-8 串行数据格式 (68)图6-9 UART配置流程 (68)图6-10 SPI单个数据传输帧格式（SCPH=0） (77)图6-11 SPI连续数据传输帧格式（SCPH=0） (77)图6-12 SPI单个数据传输帧格式（SCPH=1） (78)图6-13 SPI连续数据传输帧格式（SCPH=1） (78)图6-14 Microwire不连续数据传输帧格式（不连续读数据） (79)图6-15 Microwire连续数据传输帧格式（连续读数据） (79)图6-16 Microwire单个数据传输帧格式（写数据） (80)图6-17 SSP单个数据传输帧格式 (80)图6-18 SSP多个数据连续传输帧格式 (80)图6-19 PWM结构示意图 (90)图6-20 死区发生示意图 (91)图6-21 PWM普通模式波形示意图 (91)图6-22 未开启死区的互补模式 (92)图6-23 开启死区的互补模式 (92)图6-24 中心对称模式 (93)图6-25 ADC结构示意图 (102)图6-26 ADC中断示意图 (104)图6-27 增量式正交编码盘示意图 (110)图6-28 三相信号正向/反向旋转时序关系 (111)图6-29 QEI结构示意图 (111)图6-30 x4计数模式 (112)图6-31 x2计数模式 (112)图6-32 可编程数字噪声滤波器结构框图 (113)图6-33 信号通过滤波器传播 (113)图6-34 索引复位模式 (113)图6-35 计数匹配复位模式 (114)图6-36 比较器/放大器结构示意图 (119)图7-1 典型应用电路图 (125)图9-1 TQFP48封装 (128)图9-2 LQFP64封装 (129)表格目录表格3-1 SWM240系列MCU选型表 (6)表格6-2 中断编号及对应外设 (15)表格8-1绝对最大额定值 (125)表格8-2 DC电气特性( Vdd-Vss = 3.3V, Tw =25℃) (125)表格8-3 内部振荡器特征值 (126)表格8-4 SAR ADC特征值 (127)表格8-5 比较器/放大器特性 (127)1概述SWM150系列MCU是基于ARM® Cortex TM-M0的32位微控制器。

CH+/-CONNECTION FUNCTIONDISH IN Connect to satellite antenna cableLOOP OUT RF loop through output to another receiverRS-232Connects to PC for software updatesCOAXIAL Phono socket digital stereo output to TV or HiFi audio VCR SCART Connect to recording device (VCR/DVD) using SCART cable TV SCART Connect to TV using SCART cableAERIAL IN Signal input from local CATV network or outdoor TV antenna TO TV UHF RF output to TV set’s antenna inPOWER ON/OFF Power on/off the receiver2.1 Connection to Dish and TV via SCART Connect the SCART lead supplied to theand to either of the SCARTsockets on the back of the TV marked2.2 VCR SCART Connection3. Menu InformationAfter completing all your connections switch on the receiver,the main menu will be displayed, which consists of the4 menu items listed below.Channel ManagerPreferencesDuring installation the OK Keys confirms a selection and theKeys shows the menu options. You can also use thenumeric Keys on the RCU to select a channel while watching TV.Keys to move up or down from one line to another line. Use the/Keys to move the cursor up or down in the sub-menu. To quit the menu system at anytime, press the EXIT Key on the RCU.search multiple satellites in one operation. If you have a fixed dishIf quality is sufficient press the Blue Key. A sub-menu will appear giving two options.. NIT stands for Network Information Table and is a table of service information included in the data stream from the transponder if you wish to search this informationset the NIT search to On, usually we would advise you to leave this set to NIT Off .Option 2 allows you to choose the type of channels to search for:: Only searches the Free to air (Unencrypted) TV and Radio Channels: Only searches the Conditional Access Channels/Encrypted Channels (not available on this receiver).A window will open to show when the search is complete, press EXIT to quit the menu.5. Polarization: Enter the correct polarization for transponder HOR for Horizontal Polarization,VER for Vertical polarization, if you select the wrong polarization the Signal Quality will show Zero.: Only searches for the Free to air (Unencrypted) TV and Radio ChannelsOnly searches for the Conditional Access Channels/Encrypted Channels (not available on this receiver).: Includes both of the above. We advise you to set the Search Type to FREE .. NIT stands for Network Information Table and is a table of service information included in the data stream from the transponder if you wish to search this information set the NIT searchWhen you have made all your settings press the Blue Function Key to start the channel search.Red Function Key: To switch to the LNB Settings. Green Function Key: To Delete an Unwanted or Inactive TP (Transponder) from the default TP list. Yellow Function Key: Allows the user to input the Audio, Video and PCR PID’s with the numeric Keys on the RCU these can again be found in the channel information atStart Frequency: set to 10700 for a Universal LNB. End Frequency: set to 12750 for a Universal LNB.Start Symbol: Set to the Lowest Symbol rate you wish to search normally 1000End Symbol: Set to the Highest Symbol rate you wish to search normally 45000Polarization: Set to All to search both Horizontal and Vertical Transponders this is the default setting, Select HOR to search for Horizontal Polarization Transponders only or VER to search for Vertical PolarizationKeys to select the transponder you want to set, you can also press the OK Key to activate a transponder list, the parameters (settings) of the transponder can be found on or , some dish motor manuals come with a preferred transponder setting for each satelliteKey to turn the dish further East.This function automatically calculates and sets all the pre-programmed satellites positions with reference toYou can move channels to a better or more logical place in the channel list. Select the channel(s)Keys and then the OK Key if you wish to move a block of channels thenRed Function Key to confirm the selection, Keys to move your selection to the required place in the channel list and then press the OK KeyChoose the channel you want to rename some channels are listed as TV Ch in the channel list these can be renamed to make identification easier. Press the OK Key, a Keyboard will be displayed on the Keys to edit the channel name when you have finished move the cursor to the OKYou can sort the channels by Alphabet, Satellite, FTA/CAS Channels or Favorite channels.Press TV/Radio Key to change between TV and Radio channels. Radio channel management is the sameKeys on the front panel of the receiver or the /Keys or the numeric keys on the remote control unit (RCU). Also while listening to a Radio Channel or Watching a TV channel press the OK key this will display a channel list on the right hand side of the screen to select a on the RCU when you have selected the desired channel press the OK key to watch or listen. Pressing the EXIT key removes the channel list from the screen.on the RCU to move to the channel you watched previously.Press the TV/Radio key on the RCU to toggle between TV and Radio channel modeswill show any sub-title information available for the satellite channel selected.If a satellite channel is transmitting Teletext information this can be viewed by pressing the TXT (Red) Key , some providers use a specific coded signal on there transmissions these will not be able to be viewed on thisTetris Box ManCanvas Gobang9.EPG(ElectronicProgramGuide)The receiver provides an EPG function this provides the information from the channel or network like program titles, times, Satellite, Transponder etc, some European satellite networks provide a 7/10/14 day guide, while others only provide Now and Next program informationRed Function Key Shows yesterdays guideGreen Function Key Shows tomorrows guideShows a more detailed guide to the program informationPress the OK to activate the Timer function; use the / / Keys to change the Timer number as required and Timer Status to either Once, Daily, Weekly or Off, then select either OK or cancel and then press the OK。

RF Power Field Effect TransistorsN-Channel Enhancement-Mode Lateral MOSFETsDesigned for GSM and GSM EDGE base station applications with frequencies from 1800 to 2000 MHz. Can be used in Class AB and Class C for all typical cellular base station modulations.GSM Application•Typical GSM Performance: V DD = 28 Volts, I DQ = 1100 mA, P out =125Watts CW, f = 1930 MHz.Power Gain — 16.5 dB Drain Efficiency — 55%GSM EDGE Application•Typical GSM EDGE Performance: V DD = 28 Volts, I DQ = 1100 mA,P out = 57 Watts Avg., Full Frequency Band (1930-1990 MHz).Power Gain — 17 dB Drain Efficiency — 39%Spectral Regrowth @ 400 kHz Offset = -60 dBc Spectral Regrowth @ 600 kHz Offset = -74 dBc EVM — 2.6% rms•Capable of Handling 5:1 VSWR, @ 28 Vdc, 1960 MHz, 125 Watts CW Output Power•Typical P out @ 1 dB Compression Point ] 140 Watts CW Features•Characterized with Series Equivalent Large-Signal Impedance Parameters •Internally Matched for Ease of Use •Integrated ESD Protection •RoHS Compliant•In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel .Table 1. Maximum RatingsRatingSymbol Value Unit Drain-Source Voltage V DSS -0.5, +65Vdc Gate-Source Voltage V GS -6.0, +10Vdc Operating VoltageV DD 32, +0Vdc Storage Temperature Range T stg -65 to +150°C Case Operating Temperature T C 150°C Operating Junction Temperature (1,2)T J225°CTable 2. Thermal CharacteristicsCharacteristicSymbol Value (2,3)Unit Thermal Resistance, Junction to Case Case Temperature 81°C, 125 W CW Case Temperature 81°C, 71 W CWR θJC0.310.35°C/W1.Continuous use at maximum temperature will affect MTTF.2.MTTF calculator available at /rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product.3.Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to /rf. Select Documentation/Application Notes - AN1955.Document Number: MRF7S18125BHRev. 0, 11/2008Freescale Semiconductor Technical DataMRF7S18125BHR3 MRF7S18125BHSR3Table 3. ESD Protection CharacteristicsTest MethodologyClass Human Body Model (per JESD22-A114)1B (Minimum)Machine Model (per EIA/JESD22-A115) A (Minimum)Charge Device Model (per JESD22-C101)IV (Minimum)Table 4. Electrical Characteristics (T C = 25°C unless otherwise noted)CharacteristicSymbolMinTypMaxUnitOff CharacteristicsZero Gate Voltage Drain Leakage Current (V DS = 65 Vdc, V GS = 0 Vdc)I DSS ——10μAdc Zero Gate Voltage Drain Leakage Current (V DS = 28 Vdc, V GS = 0 Vdc)I DSS ——1μAdc Gate-Source Leakage Current (V GS = 5 Vdc, V DS = 0 Vdc)I GSS——1μAdcOn CharacteristicsGate Threshold Voltage(V DS = 10 Vdc, I D = 316 μAdc)V GS(th) 1.2 1.9 2.7Vdc Gate Quiescent Voltage(V DS = 28 Vdc, I D = 1100 mAdc)V GS(Q)— 2.7—Vdc Fixture Gate Quiescent Voltage (1)(V DD = 28 Vdc, I D = 1100 mAdc, Measured in Functional Test)V GG(Q)4 5.37Vdc Drain-Source On-Voltage(V GS = 10 Vdc, I D = 3.16 Adc)V DS(on)0.10.20.3VdcDynamic Characteristics (1)Reverse Transfer Capacitance(V DS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V GS = 0 Vdc)C rss — 1.15—pF Output Capacitance(V DS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V GS = 0 Vdc)C oss —673—pF Input Capacitance(V DS = 28 Vdc, V GS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)C iss—309—pFFunctional Tests (In Freescale Test Fixture, 50 ohm system) V DD = 28 Vdc, I DQ = 1100 mA, P out = 125 W CW, f = 1930 MHzPower Gain G ps 1516.518dB Drain Efficiency ηD 5155—%Input Return LossIRL—-12-7dB1.V GG = 2 x V GS(Q). Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit schematic.2.Part internally matched both on input and output.(continued)MRF7S18125BHR3 MRF7S18125BHSR3Table 4. Electrical Characteristics (T C = 25°C unless otherwise noted) (continued)CharacteristicSymbol Min Typ Max Unit Typical Performances (In Freescale Test Fixture, 50 ohm system) V DD = 28 Vdc, I DQ = 1100 mA, 1930-1990 MHz BandwidthP out @ 1 dB Compression PointP1dB —140—W IMD Symmetry @ 125 W PEP , P out where IMD Third Order Intermodulation ` 30 dBc(Delta IMD Third Order Intermodulation between Upper and Lower Sidebands > 2 dB)IMD sym—10—MHzVBW Resonance Point(IMD Third Order Intermodulation Inflection Point)VBW res —35—MHz Gain Flatness in 60 MHz Bandwidth @ P out = 125 W CW G F — 1.02—dB Average Deviation from Linear Phase in 60 MHz Bandwidth @ P out = 125 W CWΦ— 3.3—°Average Group Delay @ P out = 125 W CW, f = 1960 MHz Delay — 2.49—ns Part-to-Part Insertion Phase Variation @ P out = 125 W CW, f = 1960 MHz, Six Sigma Window ΔΦ— 6.7—°Gain Variation over Temperature (-30°C to +85°C)ΔG —0.016—dB/°C Output Power Variation over Temperature (-30°C to +85°C)ΔP1dB—0.01—dBm/°CTypical GSM EDGE Performances (In Freescale GSM EDGE Test Fixture, 50 ohm system) V DD = 28 Vdc, I DQ = 1100 mA, P out = 57 W Avg., 1930-1990 MHz EDGE Modulation Power Gain G ps —17—dB Drain Efficiency ηD —39—%Error Vector MagnitudeEVM — 2.6—% rms Spectral Regrowth at 400 kHz Offset SR1—-60—dBc Spectral Regrowth at 600 kHz OffsetSR2—-74—dBcMRF7S18125BHR3 MRF7S18125BHSR3Figure 1. MRF7S18125BHR3(HSR3) Test Circuit SchematicZ80.200″ x 0.083″ Microstrip Z9 1.045″ x 0.083″ Microstrip Z100.071″ x 0.083″ Microstrip Z110.227″ x 0.083″ Microstrip Z121.280″ x 0.080″ Microstrip Z13, Z140.760″ x 0.080″ MicrostripPCBTaconic TLX-8 RF35, 0.031″, εr = 2.55Z10.227″ x 0.083″ Microstrip Z20.697″ x 0.083″ Microstrip Z30.618″ x 0.083″ Microstrip Z40.568″ x 1.000″ Microstrip Z50.092″ x 1.000″ Microstrip Z60.095″ x 1.000″ Microstrip Z70.565″ x 1.000″ MicrostripTable 5. MRF7S18125BHR3(HSR3) Test Circuit Component Designations and ValuesPartDescriptionPart NumberManufacturer C11 μF, 50 V Chip Capacitor 12065G105AT2A AVX C2, C3, C4, C5 4.7 μF, 50 V Chip CapacitorsGRM55ER71H475KA01L Murata C6220 μF, 63 V Electrolytic Chip Capacitor 2222 136 68221Vishay C7, C8, C9, C10, C11 6.8 pF Chip Capacitors ATC100B6R8BT500XT ATC C12, C131 pF Chip Capacitors ATC100B1R0BT500XT ATC C14, C15, C16, C17, C180.2 pF Chip Capacitors ATC100B0R2BT500XT ATC R1, R210 k Ω, 1/4 W Chip Resistors CRCW12061001FKEA Vishay R310 Ω, 1/4 W Chip ResistorCRCW120610R1FKEAVishayFigure 2. MRF7S18125BHR3(HSR3) Test Circuit Component LayoutMRF7S18125BHR3 MRF7S18125BHSR3MRF7S18125BHR3 MRF7S18125BHSR3TYPICAL CHARACTERISTICSP out , OUTPUT POWER (WATTS) CW100131817151410300Figure 5. Power Gain versus Output PowerG p s , P O W E R G A I N (d B )161000.110TWO−TONE SPACING (MHz)Figure 6. Intermodulation Distortion Productsversus Two-Tone Spacing1MRF7S18125BHR3 MRF7S18125BHSR3TYPICAL CHARACTERISTICS60P in , INPUT POWER (dBm)53515034373552363839Figure 7. Pulsed CW Output Power versusInput PowerP o u t , O U T P U T P O W E R (d B c )54555657404142433001815103020P out , OUTPUT POWER (WATTS) CWFigure 8. Power Gain and Drain Efficiencyversus Output PowerG p s , P O W E R G A I N (d B )17.51710040585916.51615.51514.51413.51325354550556065E V M , E R R O R V E C T O R M A G N I T U D E (% r m s )063142)P out , OUTPUT POWER (WATTS)20Figure 11. Spectral Regrowth at 400 kHzversus Output Power S P E C T R A L R E G R O W T H @ 400 k H z (d B c )4020060801001201401601803350P out , OUTPUT POWER (WATTS)20Figure 12. Spectral Regrowth at 600 kHzversus Output Power402006080100120140160180ηD , D R A I N E F F I C I E N C Y (%)MRF7S18125BHR3 MRF7S18125BHSR3TYPICAL CHARACTERISTICSP out , OUTPUT POWER (WATTS) AVG.500122420160101820604030010Figure 13. EVM and Drain Efficiency versusOutput PowerE V M , E R R O R V E C T O R M A G N I T U D E (% r m s )141918171615f, FREQUENCY (MHz)Figure 14. Power Gain versus FrequencyG p s , P O W E R G A I N (d B )41005025010990T J , JUNCTION TEMPERATURE (°C)Figure 15. MTTF versus Junction TemperatureThis above graph displays calculated MTTF in hours when the device is operated at V DD = 28 Vdc, P out = 125 W CW, and ηD = 55%.MTTF calculator available at /rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product.107106105110130150170190M T T F (H O U R S )2102301081930194019501960197019801990ηD , D R A I N E F F I C I E N C Y (%)MRF7S18125BHR3 MRF7S18125BHSR3GSM TEST SIGNALFigure 16. EDGE Spectrum−10−20−30−40−50−60−70−80−90−100200 kHzSpan 2 MHzCenter 1.96 GHz−110(d B )MRF7S18125BHR3 MRF7S18125BHSR3Z o = 5ΩZ loadZ sourcef = 2040MHzf = 1880MHzf = 1880MHzf = 2040MHzV DD = 28 Vdc, I DQ = 1100 mA, P out = 125 W CWfMHzZ sourceWZ loadW1880 1.31 - j3.61 1.32 - j3.061900 1.25 - j3.061.30 - j2.921920 1.21 - j3.30 1.28 - j2.791940 1.17 - j3.17 1.26 - j2.671960 1.13 - j3.06 1.23 - j2.551980 1.10 - j2.92 1.20 - j2.422000 1.06 - j2.83 1.18 - j2.3020200.99 - j2.75 1.16 - j2.1820400.91 - j2.66 1.12 - j2.07Z source=Test circuit impedance as measured fromgate to ground.Z load=Test circuit impedance as measuredfrom drain to ground.Figure 17. Series Equivalent Source and Load ImpedanceZ source Z loadOutputMatchingNetwork分销商库存信息:FREESCALEMRF7S18125BHR3MRF7S18125BHR5MRF7S18125BHSR3 MRF7S18125BHSR5。

SummaryThe SAMV71Q21RT is a radiation tolerant microcontroller (MCU) providing the best combination of connectivity interfaces along with highest processing levels. The SAMV71Q21RT is designed for enhanced radiation performances, extreme temperature and high reliability in aerospace application. It takes advantage of the powerful M7 core coupled with high-bandwidth communication interfaces such as CAN FD and Ethernet TSN.SAMV71Q21RT ARM ®MicrocontrollerKey FeaturesCore• ARM ® Cortex ®-M7 Core running up to 300 MHz, delivering 600 DMIPS• 16 Kbytes of ICache and 16 Kbytes of DCache with Error Code Correction (ECC)• Single- and double-precision hardware Floating Point Unit (FPU)• Memory Protection Unit (MPU) with 16 zones • DSP Instructions, Thumb ®-2 Instruction Set• Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU)Memory• 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data• 384 Kbytes embedded Multi-port SRAM• Tightly Coupled Memory (TCM) interface with four configu -rations (disabled, 2 x 32 Kbytes, 2 x 64 Kbytes, 2 x 128 Kbytes)• 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines• 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash with on-the-fly scrambling• 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and with on-the-fly scramblingSystem• Embedded voltage regulator for single-supply operation• Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation• Quartz or ceramic resonator oscillators: 3 to 20 MHz main oscillator with failure detection, 12 MHz or 16 MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock.• RTC with Gregorian calendar mode, waveform generation in low-power modes• RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations• 32-bit low-power Real-Time Timer (RTT)• High-precision main RC oscillator with 12 MHz defaultfrequency for device startup. In-application trimming access for frequency adjustment. 8/12 MHz are factory-trimmed.• 32.768 kHz crystal oscillator or slow RC oscillator as source of low-power mode device clock (SLCK)• One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations • Temperature sensor•One dual-port 24-channel central DMA Controller (XDMAC)The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated. All Rights Reserved. 5/18DS00002650ASpace Environment• Full wafer lot traceability• 144-lead hermetic ceramic package • Space-grade screening and qualification• Total ionizing dose: dose at least 20 Krad, QML and ESCC • Heavy ions and protons test• Single event latch-up LET > 62 Mev•SEU full characterization at SEU full caracterization for all functional block• Estimated SER: 1 event every 1400 days (Core measure on LEO)Other Aerospace Application• Full wafer lot traceability • 144-lead plastic package• Extended temperature range –55°C/125°C • QML-N/AQEC/AEC-Q100 equivalent• Unitary burn-in and temperature cycling (opt.)• Neutrons latch-up immune •SEU full characterizationSAMV71Q21RT Tools GuideProduct Selection GuideMemorySystemCortex -M7300 MHzConnectivitySecurity User Interface Control System Performance• Deterministic code execution using TCM • Complex calculation and coprocessing (FPU)• Communication threads parallelism (Hmatrix architecture)• Low latency memories access • Scalable power saving modes•Operating system free RTOS supportedOngoing Port: RTEMS and Xstratum。

Walker, Michigan, U.S.A. 49534-7564USER’S OPERATING AND INSTRUCTION MANUALMODEL 738MINI CHIP SLICER0738S20000-CVINDEXSection Description Document No.Page No.SAFETY INSTRUCTIONS -------------------------------------- 0738S20002 --------------------------- 1-1 DESCRIPTION/SPECIFICATIONS --------------------------- 0738S20016---------------------------- 2-1 INSTALLATION INSTRUCTIONS ---------------------------- 0738S20004 --------------------------- 3-1 OPERATING INSTRUCTIONS -------------------------------- 0738S20017 --------------------------- 4-1 TROUBLESHOOTING ------------------------------------------- 0758S20006 --------------------------- 5-1 CLEANING AND MAINTENANCE -----------------------------0758S20018 --------------------------- 6-1 Removing the Blade Cartridge------------------------------------------------------------------------- 6-16-4Cleaning---------------------------------------------------------------------------------------------------- Replacing the Blade Frames --------------------------------------------------------------------------- 6-5Changing the Blades ------------------------------------------------------------------------------------- 6-7 ------------------------------------------------------------------------------------------------- 6-8LubricationGeneral Cleaning ------------------------------------------------------------------------------------------ 6-8 REPLACEMENT PARTS SECTIONMAIN FRAME ------------------------------------------------------ 0758S20019 --------------------------- 7-17-2 Drawing------------------------------------------------------------------------------------------------- ELECTRICAL--------------------------------------------------------0758S20020 --------------------------- 8-18-1 -------------------------------------------------------------------------------------------------DrawingParts List ------------------------------------------------------------------------------------------------8-2 DRIVE COMPONENTS-------------------------------------------0758S20021 --------------------------- 9-1 SLICE PARTS/COVERS -----------------------------------------0758S20022---------------------------10-110-1 Drawing----------------------------------------------------------------------------------------------- Parts List ---------------------------------------------------------------------------------------------- 10-2 WIRING DIAGRAM 1-60-120----------------------------------- 0738S20013 -------------------------- 12-1 WARRANTY ------------------------------------------------------- GEN 040225WARRANTY PROCEDURE------------------------------------ GEN 040226RETURNED PARTS POLICY --------------------------------- GEN 040227THIS PAGE WAS INTENTIONALLYLEFT BLANK.SAFETY INSTRUCTIONSWARNINGVARIOUS SAFETY DEVICES AND METHODS OF GUARDING HAVE BEEN PROVIDED ON THIS MACHINE. IT IS ESSENTIAL HOWEVER THAT THE MACHINE OPERATORS AND MAINTENANCE PERSONNEL OBSERVE THE FOLLOWING SAFETY PRECAUTIONS. IMPROPER INSTALLATION, MAINTENANCE, OR OPERATION OF THIS EQUIPMENT COULD CAUSE SERIOUS INJURY OR DEATH.1. Read this manual before attempting to operate your machine. Never allow anuntrained person to operate or service this machine.2. Connect the machine to a properly grounded electrical supply that matches therequirements shown on the electrical specification plate and follow all specifications of local electrical codes.3. Disconnect and lock-out the machine from the power supply before cleaning orservicing.4. Check and secure all guards before starting the machine.5. Observe all caution and warning labels affixed to the machine.6. Use only proper replacement parts.7. Do not wear loose fitting clothing or loose hair when working near this machine.Shirt tails should be tucked in.8. Wear proper, personal, protective, safety equipment.9. Keep Hands away from the moving parts of this machine while it is in operation.10. In addition to these general safety instructions, please follow the more specific safetyinstructions as specified in the operating instruction manual.11. The on/off switch is marked with international symbols for on and off. See below.ON OFFDESCRIPTION/SPECIFICATIONSDescriptionThe Model 738 Mini Chip Slicer is a compact, countertop slicer designed to reprocess shrink - specifically bagels and baguettes - into a marketable bakery/foodservice product. Designed with reciprocating blade technology, the Mini Chip Slicer easily slices through day-old bagels and baguettes.The Model 738 Mini Chip Slicer is constructed of stainless and painted steel. Easy to clean, the Mini Chip Slicer food contact surfaces - infeed cover, pusher, handle, and blade cartridge - can be removed without the use of tools for cleaning and sanitizing in a dishwasher. Blade changes are simple: simply remove the blade cartridge, replacing it with an OEM cartridge. No tools or service company required.SpecificationsSpace Requirements:Model 738 (All Dimensions are Approximate)Product Capacities:Length 6 inchesWidth 6 inches2inchesHeightStandard Electrical Options: (Others consult factory)1 phase, 60 Hz, 120VAC,2 Amps.Shipping Weight:100 lbs. (approximate)Net Weight:80 lbs. (approximate)INSTALLATION INSTRUCTIONSBefore starting the Installation process make sure you observe the following caution notes.CAUTIONTHE SLICER IS HEAVY, USE PROPER TECHNIQUE WHEN LIFTING OR MOVING. Select a location for your slicer which has a substantial mounting surface and which has electrical service compatible with the load the machine will place on it as indicated on the electrical data plate of the machine. Position the machine while it is still in its packaging as close as possible to the desired end location.OPERATING INSTRUCTIONSWARNINGALWAYS USE CARE WHENEVER WORKING NEAR THE CUTTING KNIVES. To operate the slicer, follow these simple steps:1. Power unit on and lift the handle. The unit will automatically shut off.2. Place the product atop the blades towards the front of the cutting area.3. Using the handle, apply slight pressure in a downward motion until the handlecomes to a stop. Repeat steps 1-3.4. When finished, power the unit off.NOTETHE UNIT WILL CONTIUE TO RUN UNLESS THE HANDLE IS LIFTED TO THE STARTING POSITION. PLEASE REMEMBER TO POWER OFF THE UNIT WHENSLICING IS COMPLETE.STEP 1 STEP 2 STEP 3THIS PAGE WAS INTENTIONALLYLEFT BLANK.TROUBLE SHOOTINGWARNINGALWAYS DISCONNECT THE SLICER FROM THE POWER SUPPLY BEFORE ATTEMPTING ANY TYPE OF MAINTENANCE TASK, INCLUDINGTROUBLESHOOTING.Slicer will not start•The machine is not plugged in.•There is no power at the outlet.•The cover is not on correctly. The cover has an interlocking mechanism that allows the unit to operate only if the cover is on.•Broken wire or disconnected terminals.•The switch actuator cam is not contacting the switch. Lift the cover and adjust the screw with a flat head screw driver.Pusher interference when slicing product•Loosen pusher and adjust side to side to make sure there is no interference.•Blade frame is not correctly placed on slide blocks.•Pusher blades are bent or damaged. Contact dealer or factory.Extreme effort needed to slice product•Blades are dull. Contact dealer or factory for replacements.•Product is too stale or old. The slicer is designed to be most efficient with slicing fresh or day old product.CLEANING AND MAINTENANCEWARNINGALWAYS UNPLUG THE SLICER BEFORE PERFORMINGANY TYPE OF MAINTENANCE TASK.To prepare your unit for cleaning please refer to the pictorial below for step by step instructions.REMOVING THE BLADE CARTRIDGE1. Loosen the (2) two thumb screws on the outside of the machine, tip the coverassembly back as shown in figure A. Lift the cover props on each side of the frame securely hold the cover open as shown in figure B.Figure AFigure B2. Loosen and remove the (4) thumbscrews atop the post hold down blocks (Fig. A)and adjust the drive assembly so that the blade frame cartridge is in the closedposition as shown below (Fig. B). This is done by turning the knob on the driveassembly so that the channels on the blade frames are close together.NOTE: The protective blade cover will only fit on the cartridge when it is in the closed configuration. This helps with the cleaning and re-assembly processes.Figure AFigure BCAUTIONUSE CAUTION WHILE ADJUSTING THE DRIVE ASSEMBLY. THE BLADES AREEXPOSED AND VERY SHARP.3. Place the protective blade cover atop the blade cartridge by hooking the coveraround the pin plate near the drive assembly.4. Lay the cover down on top of the blade cartridge and fasten with the thumbscrew to the blade cartridge by threading the thumb screw into the hole provided.5. To remove the protected blade frame cartridge simply grip the front of theassembly and the tab provided on the cover and pull up.WARNINGNEVER REMOVE BLADE FRAME ASSEMBLY WITHOUT PROTECTIVE GUARD.BLADES ARE EXTREMELY SHARP AND IF HANDLED INCORRECTLY MAYRESULT IN SERIOUS INJURY.CLEANINGNow that the blade frames have been safely removed you can now proceed with removing any crumb deposits within the machine. A brush, compressed air, or a vacuum are helpful tools for this task.REPLACING THE BLADE CARTRIDGE6. Make sure that the drive assembly is in the correct position as shown below. NOTE: The blade cartridge will only fit back into the machine with the drive assembly in the correct configuration below. The Bearing holes need to be at the position nearest each other.CORRECTINCORRECT7. With the protective blade guard in place locate the center of the bearings in thedrive assembly with the pin plates attached to the blade cartridge.8. Once the drive assembly has been located, place the blade cartridge posts in thetracks on the base assembly. Apply slight pressure to the front and rear of theblade cartridge to ensure the proper fit in to the drive assembly and slide blocks.You can now replace the post hold down blocks that you set aside in step 5.9. Remove the protective blade cover by loosening the thumb screw and unhookingfrom the pin plate.NOTE: The cover assembly will not fit on the unit if the protective blade cover is left in place.10. Lower the cover assembly by placing one hand on the front of the cover andplacing both of the cover props in their closed position. Gently lower the coverassembly until it stops.11. Lastly, after the cover has been lowered into position firmly tighten all thumbscrews around the perimeter of the unit.CHANGING THE BLADESOliver Packaging and Equipment suggests that blades not be changed in the field due to the potential for injury. We offer a blade frame cartridge exchange program for when blades become dull. Please contact your dealer or the Oliver service department.LUBRICATIONWARNINGALWAYS DISCONNECT THE SLICER FROM THE POWER SUPPLY BEFORE ATTEMPTING ANY TYPE OF MAINTENANCE TASK.Oliver suggests a vegetable based aerosol product be used to gently coat the blades on occasion. Once a month put a drop of a food approved lubricant on the plastic slide blocks on the inside of the unit. This will increase the longevity of the internal parts of your slicer.NOTENEVER OIL OR GREASE THE MOTOR.GENERAL CLEANINGUse a mild detergent solution to clean the exterior surfaces. Periodically remove all covers and brush or blow, (if compressed air is available), all foreign material from all surfaces, especially moving parts.MAIN FRAMEMAIN FRAME PARTS LISTITEM NO PART DESCRIPTION PART NUMBER 001 Base 0738-0002-1 002 Grommet-Rubber 5767-1207 003* Nut-10-24 Stainless Acorn 5832-0585004* Washer-#10 Spring Lock Stainless 5851-9355005 Bumper-Rubber w/ Screw 5902-0035006 Block-Guide 0738-0003-1 007 Screw-10-24 x 3/8 Stainless Truss 5843-5384008 Bracket-RH Cover Attachment 0738-0004-0001 009* Bracket-LH Cover Attachment 0738-0004-0002 010 Screw-10-24 x 1/4 Stainless Truss 5843-5383011 Plate-Prop 0738-0005-1 012 Nut-1/4-20 Stainless Locking 5831-9087013 Washer-1/4 Flat Stainless 5851-9304*Items not shownELECTRICAL PARTSELECTRICAL PARTS LISTITEM NO PART DESCRIPTION PART NUMBER 101 Assembly-Motor Cord 0738-25505K 102 Plate-Motor Mount 0738-0045103 Spacer 0738-0046 106 Screw-5/16-18 x ¾ Stainless Hex 5843-1028107 Screw-5/16-18 x 3 1/2 Stainless Hex 5843-1039108 Screw-8-32 x 5/16 Stainless Pan 5843-5552109 Washer-#8 Shake Proof Stainless 5851-9130110 Washer-5/16 Lock Stainless 5851-9358111 Mount-Switch 0738-0008 112 Screw-8-32 x ¼ Stainless Pan 5843-5551113 Washer-#8 Flat Stainless 5851-8108114 Switch-SM Basic w/ Roller 5757-8002115 Screw-4-40 x 1/2 Stainless Pan 5843-5524116 Washer-#4 Shake Proof Stainless 5851-9127117 Switch-SM Basic 5757-8001 122 Block-Terminal 8 Row 5770-7451131 Strip-Marker 8 Row 5770-7328133 Screw-M3.5 x 16mm Stainless Pan 8843-2265134 Relay 5749-8027135 Switch-Rocker 5757-3314 136 Bushing-Strain Relief 90° 5765-1010137 Nut-PG-11 Plastic Lock 5766-7786 138 Counter-5 Digit Mini 5712-9080139 Screw-6-32 x 1/4 Stainless Truss 5843-5360140 Screw-6-32 x 3/8 Green Grounding 5841-9501142 Washer-#6 Shake Proof Stainless 5851-9129FOR SERVICE PARTS CALL OLIVER PACKAGING & EQUIPMENT @ 800-253-3893THIS PAGE WAS INTENTIONALLYLEFT BLANK.DRIVE COMPONENTSDRIVE COMPONENTS PARTS LISTITEM NO PART DESCRIPTION PART NUMBER 200* Assembly-Drive 0738-25012K 206 Clip-Bearing 0738-0049 207 Bearing-10mm Spherical Flange Mount 5251-3591208 Screw-10-24 x 3/8 Stainless Pan 5843-5384209 Screw-6-32 x 1/4 Stainless Pan 5843-5541210 Washer-#6 Lock Stainless 5851-9353212 Knob 0738-0051 213 Screw-6-32 x 1 ¼ Stainless Pan 5843-5547 Replacements for 200 are ordered assembled with fasteners. Parts may not be substituted within the assembly other than those called out.FOR SERVICE PARTS CALL OLIVER PACKAGING & EQUIPMENT @ 800-253-3893SLICE PARTS/COVERSREV 4-28-15SLICE PARTS/COVERS PARTS LISTITEM NO PART DESCRIPTION PART NUMBER 301 Cartridge-Blade Frame 0738-25XXXK 302 Assembly-Pusher 0738-25XXXK 303 Cover-Blade Frame Safety 0738-0024K 401 Cover-Motor 0738-0033-1 402 Screw-10-24 x 3/8 Stainless Truss 5843-5384403 Washer-#10 Shake Proof Stainless 5851-9394404 Cover-Base 0738-0034-1 406 Knob-1/4-20 4 Prong Plastic 5911-7034407 Block-Top Guide 0738-0052408 Screw-8-32 x 1 Stainless Thumb 0738-25504K 411 Handle Assembly 0738-25037K 413 Block-Handle Hinge 0738-0040414 Screw-10-24 x 3/8 Stainless Truss 5843-5384415 Plate-Pusher Centering 0738-0041416 Screw-10-32 x 1/4 Stainless Truss 5843-5390417 Washer-#10 Fender Stainless 5851-9324418 Plate-LH Cover Cam 0738-0042-0002 419 Plate-RH Cover Cam 0738-0042-0001 420 Screw-8-32 x 1/4 Stainless Round 5843-5232422 Washer-#8 Spring Lock Stainless 5851-9354423 Bumper-Press In 5902-0023*Items 301 and 302 are replaced fully assembled. Specify slice thickness when ordering.**Item 303 is provided with each blade frame assembly and is used for safe handling. Not Shown.FOR SERVICE PARTS CALL OLIVER PACKAGING & EQUIPMENT @ 800-253-3893REV 1-26-18WARRANTYPARTSOliver Packaging & Equipment Company warrants that if any part of the equipment (other than a part not manufactured by Oliver Packaging & Equipment ) proves to be defective (as defined below) within one year after shipment, and if Buyer returns the defective part to Oliver Packaging & Equipment within one year, Freight Prepaid to Oliver Packaging & Equipment plant in Grand Rapids, MI, then Oliver Packaging & Equipment , shall, at Oliver Packaging & Equipment option, either repair or replace the defective part, at Oliver Packaging & Equipment expense.LABOROliver further warrants that equipment properly installed in accordance with our special instructions, which proves to be defective in material or workmanship under normal use within one (1) year from installation or one (1) year and three (3) months from actual shipment date, whichever date comes first, will be repaired by Oliver Packaging & Equipment or an Oliver Packaging & Equipment Authorized Service Dealer, in accordance with Oliver Packaging & Equipment published Service Schedule.For purposes of this warranty, a defective part or defective equipment is a part or equipment which is found by Oliver Packaging & Equipment to have been defective in materials workmanship, if the defect materially impairs the value of the equipment to Buyer. Oliver Packaging & Equipment has no obligation as to parts or components not manufactured by Oliver Packaging & Equipment, but Oliver Packaging & Equipment assigns to Buyer any warranties made to Oliver Packaging & Equipment by the manufacturer thereof.This warranty does not apply to:1. Damage caused by shipping or accident.2. Damage resulting from improper installation or alteration.3. Equipment misused, abused, altered, not maintained on a regular basis, operated carelessly, orused in abnormal conditions.4. Equipment used in conjunction with products of other manufacturers unless such use is approvedby Oliver Packaging & Equipment Company in writing.5. Periodic maintenance of equipment, including but not limited to lubrication, replacement of wearitems, and other adjustments required due to installation, set up, or normal wear.6. Losses or damage resulting from malfunction.The foregoing warranty is in lieu of all other warranties expressed or implied AND OLIVER PACKAGING & EQUIPMENT COMPANY MAKES NO WARRANTY OF MERCHANTABILITY OR FITNESS FOR PURPOSE REGARDING THE EQUIPMENT COVERED BY THIS WARRANTY. Oliver Packaging & Equipment Company neither assumes nor authorizes any person to assume for it any other obligations or liability in connection with said equipment. OLIVER PACKAGING & EQUIPMENT COMPANY SHALL NOT BE LIABLE FOR LOSS OF TIME, INCONVENIENCE, COMMERCIAL LOSS, INCIDENTAL OR CONSEQUENTIAL DAMAGES.WARRANTY PROCEDURE1. If a problem should occur, either the dealer or the end user must contact the Parts andService Department and explain the problem.2. The Parts and Service Manager will determine if the warranty will apply to this particularproblem.3. If the Parts and Service Manager approves, a Work Authorization Number will begenerated, and the appropriate service agency will perform the service.4. The service dealer will then complete an invoice and send it to the Parts and ServiceDepartment at Oliver Packaging & Equipment Company.5. The Parts and Service Manager of Oliver Packaging and Equipment Company willreview the invoice and returned parts, if applicable, and approve for payment.RETURNED PARTS POLICYThis policy applies to all parts returned to the factory whether for warranted credit, replacement, repair or re-stocking.Oliver Packaging and Equipment Company requires that the customer obtain a Return Material Authorization (RMA) number before returning any part. This number should appear on the shipping label and inside the shipping carton as well. All parts are to be returned prepaid. Following this procedure will insure prompt handling of all returned parts.To obtain an RMA number contact the Repair Parts Deptartment toll free at (800) 253-3893. Parts returned for re-stocking are subject to a RE-STOCKING CHARGE.Thank you for your cooperation,Repair Parts ManagerOliver Packaging and Equipment Company。