UC62LV2048中文资料
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CM602基础知识MicrosoftWord文档CM602基础知识1.CPU BOX卡说明:(位于机器AF下部下方,是机器的控制核心)SCVE1X——CPU卡,主要功能是控制机器的OS. HUB及数据的前后传送。
ELV1EX——内存卡1,FDD. 触摸屏. 及操作的控制。
ELV3EX——内存卡2,机器系统. 生产数据储存。
PRV4EA——识别控制卡1 , A STAGE的HEAD部PCB CAMERA 与CHIP CAMEAR的识别图像处理及给PE1ACX卡:LED LAMP CONNTROLLER(照明灯光控制卡)发送信号控制固定相机与PCB相机的LED灯光,AF .AR X轴驱动箱内马达编码器信号的接收图像处理。
PRV4EB——识别控制卡2,B STAGE的HEAD CAMERA与CHIP CAMEAR的识别控制,图像处理,及给PE1ACX卡:LED LAMP CONNTROLLER(照明灯光控制卡)发送信号控制固定相机与PCB相机的LED灯光(PRV4EA与PRV4EB两张卡型号一样,交换时注意SW 开关设置), BF .BR X轴驱动箱内编码器信号的接收3401P3——轴控制卡,X Y轴的控制NFV2CE——总I/O信息卡,包括HEAD的轴信息SLM-1200B——LED控制卡,包括其DC24V的供给,此卡有相同的两张,分布在AF 与BF的下方并控制相应的STAGE的LED。
NF2ACX——SSR卡,RING I/O此卡有两张A STAGE的是NF2ACX-5 B STAGE的是NF2ACX-2RING I/O #5卡控制: A stage vacuum pump , 1.控制 A stage 的width adjust Drive(调宽驱动箱,及调宽马达及相应感应器), 2. 前后紧急停止开关, 3.A stage 前后安全门插销开关。
4.A stage 工作台1与工作台2的PCB Support change,pcb support lower limit(PCB支撑平台下降极限), pcb Support upper limit 感应器及信号控制。
《网络设计》实训报告课题名称:网络设计专业:计算机网络技术班级:网G101学号:10姓名:王晶指导教师:刘悦2012年06 月24 日目录1课程设计目的……………………………………………………………3页2课程设计题目描述和要求………………………………………………3页3.课程设计报告内容……………………………………………………3页3.1设计任务.......................................................5页3.2设计要求及设计步骤…………………………………………………………5页3.3设计概述………………………………………………………………8页3.4设计方案的论证………………………………………………………………11页3.5设计代码……………………………………………………………12页.4.结论…………………………………………………………………15页.5.结束语………………………………………………………………15页6.参考书…………………………………………………………………16页课程设计目的课程设计是教学的一个重要环节,本次课程设计的主要目的:1.进一步加深、巩固学生对所学网络的基础知识的掌握,对《思科网络技术》的基本概念的了解。
2.通过实训,达到让学生能够将书本的知识与实际操作相结合的目的,提理论的实践应用能力、提高高动手能力。
3.在设计的过程中,对于出现的新问题,有新的思路,能够使用更适合的方法处理,并且是自己自学能力和一学期学习效果的检验。
二、课程设计题目描述和要求学生能够自己设计一个中小型网络的拓扑,能够熟练配置思科的交换和路由设备,完成网络的建设和日常维护工作。
组建一个局域网络首先需要分析,调查研究,分析设计,硬件购买,布线施工,管理维护等。
1.作为客户的使者首先要明确的了解DNS名称的解析方法。
2.DNS服务器的类型。
3.DNS名称解析过程4.配置DNS客户端并测试主DNS服务器,以及创建正向,反向主要区域。
CV206LGQ工厂菜单调试说明如何进入工厂菜单:先按下INPUT SOURCE ,在INPUT SOURCE 菜单未消失时按数字键“2580”可以进入工厂菜单,如下图:各个选项的具体说明如下:1.VERSION光标在VERSION,按OK/ENTER按键,进入显示信息的子页面。
子页面共计11项:1.Tob Lable 2.Producer(制作人) 3.Panel(屏型号)4.AREA OPTION(出口区域)5.Board(板卡名称)6.DDR TYPE(DDR型号)7.FLASH TYPE(FLASH型号) 8.TUNER TYPE(高频头型号)9.Software Version(软件版本号)10.Produce Date(制作日期)11.Produce Time(制作时间)这11项时不可选择的,只是给客户提供软件和板卡的相关信息。
2.ADC Adjust此项是针对YPbPr、VGA端口进行处理的,在三路R/G/B或者Y/Pb/Pr信号输入到芯片时候,由于存在硬件上的偏差,导致信号和标准信号存在偏差,需要对信号进行ADC校正。
光标在ADC Ajust上按OK/ENTER按键,进入子页面,子页面共有R/G/B GAIN和R/G/B OFFSET六个参数,按AUTO ADC就可以进行自动校正。
a.YPbPr ADC 校正必须选择有红(red),绿(green),蓝(blue),黑(black),白(white)的图片来做,黑白是给Y做calibration用的,红,绿,蓝是给Pb/Pr做calibraion用的,目前我们用100%的color bar 做Auto ADC校正即Y Level: 16-235; Pb/Pr:16-240.标清(SD)信号下100%color bar 图片可以用Fluke 54200的color bar “100-0-100-25”选择产生。
高清(HD)信号下100%color bar图片可以用VG859等高清信号仪器产生。
TL H 11490ADC12062 12-Bit1 MHz 75 mW A D Converter with Input Multiplexer and Sample HoldDecember1994 ADC1206212-Bit 1MHz 75mW A D Converterwith Input Multiplexer and Sample HoldGeneral DescriptionUsing an innovative multistep conversion technique the12-bit ADC12062CMOS analog-to-digital converter digitizessignals at a1MHz sampling rate while consuming a maxi-mum of only75mW on a single a5V supply TheADC12062performs a12-bit conversion in three lower-res-olution‘‘flash’’conversions yielding a fast A D without thecost and power dissipation associated with true flash ap-proachesThe analog input voltage to the ADC12062is tracked andheld by an internal sampling circuit allowing high frequencyinput signals to be accurately digitized without the need foran external sample-and-hold circuit The multiplexer outputis available to the user in order to perform additional exter-nal signal processing before the signal is digitizedWhen the converter is not digitizing signals it can be placedin the Standby mode typical power consumption in thismode is100m WFeaturesY Built-in sample-and-holdY Single a5V supplyY Single channel or2channel multiplexer operationY Low Power Standby modeKey SpecificationsY Sampling rate1MHz(min)Y Conversion time740ns(typ)Y Signal-to-Noise Ratio f IN e100kHz69 5dB(min)Y Power dissipation(f s e1MHz)75mW(max)Y No missing codes over temperature GuaranteedApplicationsY Digital signal processor front endsY InstrumentationY Disk drivesY Mobile telecommunicationsY Waveform digitizersBlock DiagramTL H 11490–1 Ordering InformationIndustrial(b40 C s T A s a85 )PackageADC12062BIV V44Plastic Leaded Chip CarrierADC12062BIVF VGZ44A Plastic Quad Flat PackageADC12062CIV V44Plastic Leaded Chip CarrierADC12062CIVF VGZ44A Plastic Quad Flat PackageADC12062EVAL Evaluation BoardTRI-STATE is a registered trademark of National Semiconductor CorporationC1995National Semiconductor Corporation RRD-B30M75 Printed in U S AAbsolute Maximum Ratings(Notes1 2)If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage(V CC e DV CC e AV CC)b0 3V to a6V Voltage at Any Input or Output b0 3V to V CC a0 3V Input Current at Any Pin(Note3)25mA Package Input Current(Note3)50mA Power Dissipation(Note4)875mW ESD Susceptibility(Note5)2000V Soldering Information(Note6)V Package Infrared 15seconds a300 C VF PackageVapor Phase(60seconds)a215 C Infrared(15seconds)a220 C Storage Temperature Range b65 C to a150 C Maximum Junction Temperature(T JMAX)150 C Operating Ratings(Notes1 2)Temperature Range T MIN s T A s T MAX ADC12062BIV ADC12062CIVADC12062BIVF ADC12062CIVF b40 C s T A s a85 C Supply Voltage Range(DV CC e AV CC)4 5V to5 5VConverter Characteristics The following specifications apply for DV CC e AV CC e a5V V REF a(SENSE)e a4 096V V REF b(SENSE)e AGND and f s e1MHz unless otherwise specified Boldface limits apply for T A e T J from T MIN to T MAX all other limits T A e T J e a25 CSymbol Parameter ConditionsTyp Limit Units (Note7)(Note8)(Limit)Resolution12BitsDifferential Linearity Error T A e25 C g0 4g0 8LSB(max)T MIN to T MAX g0 95LSB(max)Integral Linearity Error T MIN to T MAX(BIV Suffix)g0 4g1 0LSB(max) (Note9)TA e a25 C(CIV Suffix)g0 4g1 0LSB(max)T MIN to T MAX(CIV Suffix)g1 5LSB(max) Offset Error T MIN to T MAX(BIV Suffix)g0 3g1 25LSB(max)T A e a25 C(CIV Suffix)g0 3g1 25LSB(max)T MIN to T MAX(CIV Suffix)g2 0LSB(max) Full Scale Error T MIN to T MAX(BIV Suffix)g0 2g1 0LSB(max)T A e a25 C(CIV Suffix)g0 2g1 0LSB(max)T MIN to T MAX(CIV Suffix)g1 5LSB(max) Power Supply Sensitivity DV CC e AV CC e5V g10%g1 0LSB(max) (Note15)R REF Reference Resistance750500X(min) 1000X(max)V REF(a)V REF a(SENSE)Input Voltage AV CC V(max)V REF(b)V REF b(SENSE)Input Voltage AGND V(min)V IN Input Voltage Range To V IN1 V IN2 or ADC IN AV CC a0 05V V(max)AGND b0 05V V(min) ADC IN Input Leakage AGND to AV CC b0 3V0 13m A(max) C ADC ADC IN Input Capacitance25pFMUX On-Channel Leakage AGND to AV CC b0 3V0 13m A(max)MUX Off-Channel Leakage AGND to AV CC b0 3V0 13m A(max) C MUX Multiplexer Input Cap7pFMUX Off Isolation f IN e100kHz92dB2Dynamic Characteristics(Note10)The following specifications apply for DV CC e AV CC e a5V V REF a(SENSE)e a4 096V V REF b(SENSE)e AGND R S e25X f IN e100kHz 0dB from fullscale and f s e1MHz unless otherwise specified Boldface limits apply for T A e T J from T MIN to T MAX all other limits T A e T J e a25 CSymbol Parameter ConditionsTyp Limit Units (Note7)(Note8)(Limit)SINAD Signal-to-Noise Plus T MIN to T MAX7168 0dB(min) Distortion RatioSNR Signal-to-Noise Ratio T MIN to T MAX7269 5dB(min) (Note11)THD Total Harmonic Distortion T A e a25 C b82b74dBc(max) (Note12)T MIN to T MAX b70dBc(max) ENOB Effective Number of Bits T MIN to T MAX11 511 0Bits(min) (Note13)IMD Intermodulation Distortion f IN e102 3kHz 102 7kHz b80dBc DC Electrical Characteristics The following specifications apply for DV CC e AV CC e a5V V REF a(SENSE)e a4 096V V REF b(SENSE)e AGND and f s e1MHz unless otherwise specified Boldface limits apply for T A e T J from T MIN to T MAX all other limits T A e T J e a25 CSymbol Parameter ConditionsTyp Limit Units (Note7)(Note8)(Limit)V IN(1)Logical‘‘1’’Input Voltage DV CC e AV CC e a5 5V2 0V(min)V IN(0)Logical‘‘0’’Input Voltage DV CC e AV CC e a4 5V0 8V(max) I IN(1)Logical‘‘1’’Input Current0 11 0m A(max) I IN(0)Logical‘‘0’’Input Current0 11 0m A(max)V OUT(1)Logical‘‘1’’Output Voltage DV CC e AV CC e a4 5VI OUT e b360m A2 4V(min)I OUT e b100m A4 25V(min) V OUT(0)Logical‘‘0’’Output Voltage DV CC e AV CC e a4 5V0 4V(max)I OUT e1 6mAI OUT TRI-STATE Output Pins DB0–DB110 13m A(max)Leakage CurrentC OUT TRI-STATE Output Capacitance Pins DB0–DB115pFC IN Digital Input Capacitance4pFDI CC DV CC Supply Current23mA(max) AI CC AV CC Supply Current1012mA(max) I STANDBY Standby Current(DI CC a AI CC)PD e0V20m A3AC Electrical Characteristics The following specifications apply for DV CC e AV CC e a5V V REF a(SENSE)e a4 096V V REF b(SENSE)e AGND and f s e1MHz unless otherwise specified Boldface limits apply for T A e T J from T MIN to T MAX all other limits T A e T J e a25 CSymbol Parameter ConditionsTyp Limit Units (Note7)(Note8)(Limits)f s Maximum Sampling Rate1MHz(min)(1 t THROUGHPUT)t CONV Conversion Time740600ns(min) (S H Low to EOC High)980ns(max)t AD Aperture Delay20ns (S H Low to Input Voltage Held)t S H S H Pulse Width5ns(min)550ns(max)t EOC S H Low to EOC Low9560ns(min) 125ns(max)t ACC Access Time C L e100pF1020ns(max) (RD Low or OE High to Data Valid)t1H t0H TRI-STATE ControlR L e1k C L e10pF2540ns(max) (RD High or OE Low to Databus TRI-STATE)t INTH Delay from RD Low to INT High C L e100pF3560ns(max)t INTL Delay from EOC High to INT Low C L e100pFb25b35ns(min) b10ns(max)t UPDATE EOC High to New Data Valid515ns(max)t MS Multiplexer Address Setup Time50ns(min) (MUX Address Valid to EOC Low)t MH Multiplexer Address Hold Time50ns(min) (EOC Low to MUX Address Invalid)t CSS CS Setup Time20ns(min) (CS Low to RD Low S H Low or OE High)t CSH CS Hold Time20ns(min) (CS High after RD High S H High or OE Low)t WU Wake-Up Time1m s (PD High to First S H Low)Note1 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur Operating Ratings indicate conditions for which the device is functional These ratings do not guarantee specific performance limits however For guaranteed specifications and test conditions see the Electrical Characteris-tics The guaranteed specifications apply only for the test conditions listed Some performance characteristics may degrade when the device is not operated under the listed test conditionsNote2 All voltages are measured with respect to GND(GND e AGND e DGND) unless otherwise specifiedNote3 When the input voltage(V IN)at any pin exceeds the power supply rails(V IN k GND or V IN l V CC)the absolute value of current at that pin should be limited to25mA or less The50mA package input current limits the number of pins that can safely exceed the power supplies with an input current of25mA to twoNote4 The maximum power dissipation must be derated at elevated temperatures and is dictated by T JMAX i JA and the ambient temperature T A The maximum allowable power dissipation at any temperature is P D e(T JMAX b T A) i JA or the number given in the Absolute Maximum Ratings whichever is lower i JA for the V (PLCC)package is55 C W i JA for the VF(PQFP)package is62 C W In most cases the maximum derated power dissipation will be reached only during fault conditions4Note5 Human body model 100pF discharged through a1 5k X resistor Machine model ESD rating is200VNote6 See AN-450‘‘Surface Mounting Methods and Their Effect on Product Reliability’’or the section titled‘‘Surface Mount’’found in a current National Semiconductor Linear Data Book for other methods of soldering surface mount devicesNote7 Typicals are at a25 C and represent most likely parametric normNote8 Tested limits are guaranteed to National’s AOQL(Average Outgoing Quality Level)Note9 Integral Linearity Error is the maximum deviation from a straight line between the measured offset and full scale endpointsNote10 Dynamic testing of the ADC12062is done using the ADC IN input The input multiplexer adds harmonic distortion at high frequencies See the graph in the Typical Performance Characteristics section for a typical graph of THD performance vs input frequency with and without the input multiplexerNote11 The signal-to-noise ratio is the ratio of the signal amplitude to the background noise level Harmonics of the input signal are not included in its calculation Note12 The contributions from the first nine harmonics are used in the calculation of the THDNote13 Effective Number of Bits(ENOB)is calculated from the measured signal-to-noise plus distortion ratio(SINAD)using the equation ENOB e(SINAD b 1 76) 6 02Note14 The digital power supply current takes up to10seconds to decay to its final value after PD is pulled low This prohibits production testing of the standby current Some parts may exhibit significantly higher standby currents than the20m A typicalNote15 Power Supply Sensitivity is defined as the change in the Offset Error or the Full Scale Error due to a change in the supply voltageTRI-STATE Test Circuit and WaveformsTL H 11490–2TL H 11490–3TL H 11490–4TL H 11490–55Typical Performance CharacteristicsReference VoltageError Change vs Offset and Fullscale vs Reference VoltageLinearity Error Change Input VoltageMux ON Resistance vs vs Temperature Digital Supply Current vs TemperatureAnalog Supply Current on Digital Input PinsStandby Mode vs Voltage Current Consumption in vs Temperature Conversion Time (t CONV )vs TemperatureEOC Delay Time (t EOC )Spectral Response(ADC IN)SINAD vs Input Frequency (ADC IN)SNR vs Input Frequency (ADC IN)THD vs Input Frequency TL H 11490–276Typical Performance Characteristics(Continued)(Through Mux)SINAD vs Input Frequency (Through Mux)SNR vs Input Frequency (Through Mux)THD vs Input Frequency Impedance SNR and THD vs Source Reference VoltageSNR and THD vs TL H 11490–28Timing DiagramsTL H 11490–9FIGURE 1 Interrupt Interface Timing (MODE e 1 OE e 1)7Timing Diagrams (Continued)TL H 11490–10FIGURE 2 High Speed Interface Timing (MODE e 1 OE e 1 CS e 0 RD e 0)TL H 11490–11FIGURE 3 CS Setup and Hold Timing for S H RD and OEConnection DiagramsTL H 11490–13Top ViewTL H 11490–29Top View8Pin DescriptionsAV CC These are the two positive analog supplyinputs They should always be connectedto the same voltage source but arebrought out separately to allow for sepa-rate bypass capacitors Each supply pinshould be bypassed to AGND with a0 1m F ceramic capacitor in parallel with a10m F tantalum capacitorDV CC This is the positive digital supply input Itshould always be connected to the samevoltage as the analog supply AV CC Itshould be bypassed to DGND2with a0 1m F ceramic capacitor in parallel with a10m F tantalum capacitorAGND These are the power supply ground pins DGND1 There are separate analog and digital DGND2ground pins for separate bypassing of theanalog and digital supplies The groundpins should be connected to a stablenoise-free system ground All of theground pins should be returned to thesame potential AGND is the analogground for the converter DGND1is theground pin for the digital control linesDGND2is the ground return for the outputdatabus See Section6 0LAYOUT ANDGROUNDING for more informationDB0–DB11These are the TRI-STATE output pins en-abled by RD CS and OEV IN1 V IN2These are the analog input pins to the mul-tiplexer For accurate conversions no in-put pin(even one that is not selected)should be driven more than50mV belowground or50mV above V CCMUX OUT This is the output of the on-board analoginput multiplexerADC IN This is the direct input to the12-bit sam-pling A D converter For accurate conver-sions this pin should not be driven morethan50mV below AGND or50mV aboveAV CCS0This pin selects the analog input that willbe connected to the ADC12062during theconversion The input is selected based onthe state of S0when EOC makes its high-to-low transition Low selects V IN1 highselects V IN2MODE This pin should be tied to DV CCCS This is the active low Chip Select controlinput When low this pin enables the RDS H and OE inputs This pin can be tiedlowINT This is the active low Interrupt outputWhen using the Interrupt Interface Mode(Figure1) this output goes low when aconversion has been completed and indi-cates that the conversion result is avail-able in the output latches This output isalways high when RD is held low(Figure2)EOC This is the End-of-Conversion control out-put This output is low during a conversion RD This is the active low Read control inputWhen RD is low(and CS is low) the INToutput is reset and(if OE is high)data ap-pears on the data bus This pin can be tiedlowOE This is the active high Output Enable con-trol input This pin can be thought of as aninverted version of the RD input(see Fig-ure6) Data output pins DB0–DB11areTRI-STATE when OE is low Data appearson DB0–DB11only when OE is high andCS and RD are both low This pin can betied highS H This is the Sample Hold control input Theanalog input signal is held and a new con-version is initiated by the falling edge ofthis control input(when CS is low) PD This is the Power Down control input Thispin should be held high for normal opera-tion When this pin is pulled low the devicegoes into a low power standby mode V REF a(FORCE) These are the positive and negative volt-V REF b(FORCE)age reference force inputs respectivelySee Section4 REFERENCE INPUTS formore informationV REF a(SENSE) These are the positive and negative volt-V REF b(SENSE)age reference sense pins respectivelySee Section4 REFERENCE INPUTS formore informationV REF 16This pin should be bypassed to AGND witha0 1m F ceramic capacitorTEST This pin should be tied to DV CC9Functional DescriptionThe ADC12062performs a12-bit analog-to-digital conver-sion using a3step flash technique The first flash deter-mines the six most significant bits the second flash gener-ates four more bits and the final flash resolves the two least significant bits Figure4shows the major functional blocks of the converter It consists of a2 -bit Voltage Estimator a resistor ladder with two different resolution voltage spans a sample hold capacitor a4-bit flash converter with front end multiplexer a digitally corrected DAC and a capacitive volt-age dividerThe resistor string near the center of the block diagram in Figure4generates the6-bit and10-bit reference voltages for the first two conversions Each of the16resistors at the bottom of the string is equal to of the total string resist-ance These resistors form the LSB Ladder and have a voltage drop of of the total reference voltage(V REF a b V REF b)across each of them The remaining resistors form the MSB Ladder It is comprised of eight groups of eight resistors each connected in series(the lowest MSB ladder resistor is actually the entire LSB ladder) Each MSB Ladder section has of the total reference voltage across it Within a given MSB ladder section each of the eight MSB resistors has of the total reference voltage across it Tap points are found between all of the resistors in both the MSB and LSB ladders The Comparator MultipIexer can connect any of these tap points in two adjacent groups of eight to the sixteen comparators shown at the right of Figure4 This function provides the necessary reference voltages to the comparators during the first two flash con-versionsThe six comparators seven-resistor string(Estimator DAC ladder) and Estimator Decoder at the left of Figure4form Note The weight of each resistor on the LSB ladder is actually equivalent to four12-bit LSBs It is called the LSB ladder because it has thehighest resolution of all the ladders in the converter the Voltage Estimator The Estimator DAC connected be-tween V REF a and V REF b generates the reference volt-ages for the six Voltage Estimator comparators The com-parators perform a very low resoIution A D conversion to obtain an‘‘estimate’’of the input voltage This estimate is used to control the placement of the Comparator Multiplex-er connecting the appropriate MSB ladder section to the sixteen flash comparators A total of only22comparators(6 in the Voltage Estimator and16in the flash converter)is required to quantize the input to6bits instead of the64that would be required using a traditional6-bit flashPrior to a conversion the Sample Hold switch is closed allowing the voltage on the S H capacitor to track the input voItage Switch1is in position1 A conversion begins by opening the Sample Hold switch and latching the output of the Voltage Estimator The estimator decoder then selects two adjacent banks of tap points aIong the MSB ladder These sixteen tap points are then connected to the sixteen flash converters For exampIe if the input voltage is be-tween and of V REF(V REF e V REF a b V REF b) the estimator decoder instructs the comparator multiplexer to select the sixteen tap points between and ( and )of V REF and connects them to the sixteen comparators The first flash conversion is now performed producing the first6MSBs of dataAt this point Voltage Estimator errors as large as of V REF will be corrected since the comparators are connect-ed to ladder voltages that extend beyond the range speci-fied by the Voltage Estimator For example if( )V REF k V IN k( )V REF the Voltage Estimator’s comparators tied to the tap points below( )V REF will output‘‘1’’s (000111) This is decoded by the estimator decoder to‘‘10’’ The16comparators will be placed on the MSB ladderTL H 11490–14FIGURE4 Functional Block Diagram10Functional Description(Continued)tap points between( )V REF and( )V REF This overlap of ( )V REF will automatically cancel a Voltage Estimator er-ror of up to256LSBs If the first flash conversion deter-mines that the input voltage is between( )V REF and (( )V REF b LSB 2) the Voltage Estimator’s output code will be corrected by subtracting‘‘1’’ resulting in a corrected value of‘‘01’’for the first two MSBs If the first flash conver-sion determines that the input voltage is between( )V REF b LSB 2)and( )V REF the voltage estimator’s output code is unchangedThe results of the first flash and the Voltage Estimator’s output are given to the factory-programmed on-chip EEPROM which returns a correction code corresponding to the error of the MSB ladder at that tap This code is convert-ed to a voltage by the Correction DAC To generate the next four bits SW1is moved to position2 so the ladder voltage and the correction voltage are subtracted from the input voltage The remainder is applied to the sixteen flash con-verters and compared with the16tap points from the LSB ladderThe result of this second conversion is accurate to10bits and describes the input remainder as a voltage between two tap points(V H and V L)on the LSB ladder To resolve the last two bits the voltage across the ladder resistor(between V H and V L)is divided up into4equal parts by the capacitive voltage divider shown in Figure5 The divider also creates 6LSBs below V L and6LSBs above V H to provide overlap used by the digital error correction SW1is moved to posi-tion3 and the remainder is compared with these16new voltages The output is combined with the results of the Voltage Estimator first flash and second flash to yield the final12-bit resultBy using the same sixteen comparators for all three flash conversions the number of comparators needed by the multi-step converter is significantly reduced when compared to standard multi-step techniquesApplications Information1 0MODES OF OPERATIONThe ADC12062has two interface modes An interrupt read mode and a high speed mode Figures1and2show the timing diagrams for these interfacesIn order to clearly show the relationship between S H CS RD and OE the control logic decoding section of the ADC12062is shown in Figure6Interrupt InterfaceAs shown in Figure1 the falling edge of S H holds the input voltage and initiates a conversion At the end of the conver-sion the EOC output goes high and the INT output goes low indicating that the conversion results are latched and may be read by pulling RD low The falling edge of RD re-sets the INT line Note that CS must be low to enable S H or RDHigh Speed InterfaceThis is the fastest interface shown in Figure2 Here the output data is always present on the databus and the INT to RD delay is eliminatedTL H 11490–15FIGURE5 The Capacitive Voltage Divider11Applications Information (Continued)TL H 11490–16FIGURE 6 ADC Control Logic2 0THE ANALOG INPUTThe analog input of the ADC12062can be modeled as two small resistances in series with the capacitance of the input hold capacitor (C IN ) as shown in Figure 7 The S H switch is closed during the Sample period and open during Hold The source has to charge C IN to the input voltage within the sample period Note that the source impedance of the input voltage (R SOURCE )has a direct effect on the time it takes to charge C IN If R SOURCE is too large the voltage across C IN will not settle to within 0 5LSBs of V SOURCE before the conversion begins and the conversion results will be incor-rect From a dynamic performance viewpoint the combina-tion of R SOURCE R MUX R SW and C IN form a low pass filter Minimizing R SOURCE will increase the frequency re-sponse of the input stage of the converterTypical values for the components shown in Figure 7are R MUX e 100X R SW e 100X and C IN e 25pF The set-tling time to n bits ist SETTLE e (R SOURCE a R MUX a R SW ) C IN n ln (2) The bandwidth of the input circuit isf b 3dB e 1 (2 3 14 (R SOURCE a R MUX a R SW ) C IN )For maximum performance the impedance of the source driving the ADC12062should be made as small as possible A source impedance of 100X or less is recommended A plot of dynamic performance vs source impedance is given in the Typical Performance Characteristics sectionIf the signal source has a high output impedance its output should be buffered with an operational amplifier capable of driving a switched 25pF 100X load Any ringing or instabili-ties at the op amp’s output during the sampling period can result in conversion errors The LM6361high speed op amp is a good choice for this application due to its speed and its ability to drive large capacitive loads Figure 8shows the LM6361driving the ADC IN input of an ADC12062 The 100pF capacitor at the input of the converter absorbs some of the high frequency transients generated by the S H switching reducing the op amp transient response require-ments The 100pF capacitor should only be used with high speed op amps that are unconditionally stable driving ca-pacitive loadsTL H 11490–17FIGURE 7 Simplified ADC12062Input Stage12Applications Information (Continued)TL H 11490–18FIGURE 8 Buffering the Input with an LM6361High Speed Op AmpAnother benefit of using a high speed buffer is improved THD performance when using the multiplexer of the ADC12062 The MUX on-resistance is somewhat non-linear over input voltage causing the RC time constant formed by C IN R MUX and R SW to vary depending on the input voltage This results in increasing THD with increasing frequency Inserting the buffer between the MUX OUT and the ADC IN terminals as shown in Figure 8will eliminate the loading on R MUX significantly reducing the THD of the multiplexed sys-temCorrect converter operation will be obtained for input volt-ages greater than AGND b 50mV and less than AV CC a50mV Avoid driving the signal source more than 300mV higher than AV CC or more than 300mV below AGND If an analog input pin is forced beyond these voltages the cur-rent flowing through that pin should be limited to 25mA or less to avoid permanent damage to the IC The sum of all the overdrive currents into all pins must be less than 50mA When the input signal is expected to extend more than 300mV beyond the power supply limits for any reason (un-known uncontrollable input voltage range power-on tran-sients fault conditions etc )some form of input protection such as that shown in Figure 9 should be usedTL H 11490–19FIGURE 9 Input Protection13Applications Information(Continued)3 0ANALOG MULTIPLEXERThe ADC12062has an input multiplexer that is controlled by the logic level on pin S0when EOC goes low as shown in Figures1and2 Multiplexer setup and hold times with re-spect to the S H input can be determined by these two equationst MS(wrt S H)e t MS b t EOC(min)e50b60e b10ns t MH(wrt S H)e t MH a t EOC(max)e50a125e175ns Note that t MS(wrt S H)is a negative number this indicates that the data on S0must become valid within10ns after S H goes low in order to meet the setup time requirements S0must be valid for a length of(t MH a t EOC(max))b(t MS b t EOC(min))e185ns Table I shows how the input channels are assignedTABLE I ADC12062InputMultiplexer ProgrammingS0Channel0V IN11V IN2The output of the multiplexer is available to the user via the MUX OUT pin This output allows the user to perform addi-tional signal processing such as filtering or gain before the signal is returned to the ADC IN input and digitized If no additional signal processing is required the MUX OUT pin should be tied directly to the ADC IN pinSee Section9 0(APPLICATIONS)for a simple circuit that will alternate between the two inputs while converting at full speed4 0REFERENCE INPUTSIn addition to the fully differential V REF a and V REF b refer-ence inputs used on most National Semiconductor ADCs the ADC12062has two sense outputs for precision control of the ladder voltage These sense inputs compensate for errors due to IR drops between the reference source and the ladder itself The resistance of the reference ladder is typically750X The parasitic resistance(R P)of the package leads bond wires PCB traces etc can easily be0 5X to 1 0X or more This may not be significant at8-bit or10-bit resolutions but at12bits it can introduce voltage drops causing offset and gain errors as large as6LSBsThe ADC12062provides a means to eliminate this error by bringing out two additional pins that sense the exact voltage at the top and bottom of the ladder With the addition of two op amps the voltages on these internal nodes can be forced to the exact value desired as shown in Figure10TL H 11490–20FIGURE10 Reference Ladder Force and Sense Inputs14。
FUTABA 6EXP固定翼/直升机两用版中文说明书目录一、发射器电池电压 (1)二、遥控器有关注意事项 (2)三、发射器程序设定 (3)(一)模型选择/数据重新设定/编码方式/模型类型/模型名称 (3)(二)REVR舵机反向 (5)(三)D/R双重比率/指数设定 (5)(四)EPA舵角调整功能 (6)(五)TRIM微调设定功能 (7)(六)PMIX1、2可编程混控设定功能(仅固定翼模式) (8)(七)FLPR副翼有襟翼设定功能(仅固定翼模式) (9)(八)FLTR襟翼微调功能(仅固定翼模式) (9)(九)V-TL V形混控设定功能(仅固定翼模式) (9)(十)ELVN飞翼混控设定功能(仅固定翼模式) (9)(十一)N-TH 常规飞行油门曲线功能(仅直升机模式) (9)(十二)N-PI常规螺距曲线功能(仅直升机模式) (10)(十三)I-TH惰速提高油门曲线(上空特技油门曲线)功能(仅直升机模式) (10)(十四)I-PI惰速提高螺距曲线功能(仅直升机模式) (11)(十五)HOLD油门保持功能(仅直升机模式) (11)(十六)REVO螺距--方向舵混控功能(仅直升机模式) (11)(十七)GYRO陀螺仪控制功能(仅直升机模式) (12)(十八)SW-T倾斜状态到油门混控(仅直升机模式) (13)(十九)SWSH十字盘模式选择& 十字盘模式最大舵角调整(仅直升机模式) (14)(二十)F/S安全控制(仅PCM模式下有效) (15)(二十一)油门关闭功能 (16)(二十二)改变6EXAP的控制杆模式 (16)(二十三)6EXP固定翼操作模式图解 (17)(二十四)6EXP直升机操作模式图解 (18)一、发射器电池电压除了模型的序号,LCD荧屏也显示发射器电池电压。
当电压低于8.5V 时,"电池"的图标将会以闪烁的状态出现在荧屏上,伴随着闪烁,发射机还会发出"哔哔。
Entry-level Arm-based 64-bit ComputersDual-core, 2-GB RAMCompact Dual-core, 2-GB RAM Built-in LTEValue-added Arm-based 64-bit ComputersQuad-core, 4-GB RAMQuad-core, 4-GB RAM5G/CAN/serial IsolationBuilt-in LTEMoxa Industrial LinuxMoxa's Debian-based industrial-grade stable Linux distribution for long-term projectsFeatures and Benefits5Debian-based distribution that can use all standard Debian packages5Developed as per IEC 62443-4-1 and compliant with IEC 62443-4-2 industrialcybersecurity standards (Moxa Industrial Linux 3 Secure)5Long-term support until 2027 for Moxa Industrial Linux 1 and 2031 for MoxaIndustrial Linux 35Wireless connection management utility with automatic network keep alive andfailover5Ready-to-use APIs and library to ease access to hardware and I/O interfaces5Crash-free robust file system5Over-the air (OTA) software updatesWireless-ready Arm-based 32-bit Computers Built-in cellular or Wi-Fi module, RF type approvals, and carrier approvalsBuilt-in LTE Cat.1Built-in LTECat.1 and Wi-FiBuilt-in LTECat.1 and Wi-FiBuilt-in LTECat.4 with Wi-Fi expansion1. Wireless module is built-in. Refer to the Wireless Connection and Expansion Modules section for details.2. Wireless module must be purchased separately. Refer to the Wireless Connection and Expansion Modules section for details.1 mPCIe for cellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe for cellular 1mPCIe for Wi-Fi1 mPCIe forcellular/Wi-FiArm-based 32-bit Computers With Wireless Options Flexibility to add cellular or Wi-Fi capability when needed1. Wireless module must be purchased separately. Refer to the Wireless Connection and Expansion Modules section for details.1 LAN,1 serial2 LAN 2 LAN,2 serial2 LAN,2 serial2 LAN,4 serial2 LAN,4 serial2 LAN,1 serial2 LAN,2 serial3 LAN,8 serialStandard Arm-based 32-bit Computers Low power consumption and small form factorWireless Connectivity and Expansion Modules* Details of cellular and Wi-Fi support with a list of wireless accessory models* Antennas must be purchased separatelyLast updated: Aug. 15, 2023. All specifications are subject to change without notice.。
BS62LV1600FI55中⽂资料Very Low Power CMOS SRAM 2M X 8 bitBS62LV1600Pb-Free and Green package materials are compliant to RoHSn FEATURESWide V CC operation voltage : 2.4V ~ 5.5V Very low power consumption : V CC = 3.0V Operation current : 46mA (Max.) a t 55ns 2mA (Max.) at 1MHz Standby current : 1.5uA (Typ.) at 25 O C V CC = 5.0V Operation current : 115mA (Max.) a t 55ns 10mA (Max.) a t 1MHz Standby current : 6.0uA (Typ.) at 25O C ? High speed access time : -55 55ns (Max.) at V CC :3.0~5.5V -70 70ns (Max.) at V CC : 2.7~5.5V ? Automatic power down when chip is deselected ? Easy expansion with CE1, CE2 and OE options ? Three state outputs and TTL compatible ? Fully static operation ? Data retention supply voltage as low as 1.5V n DESCRIPTIONThe BS62LV1600 is a high performance, very low power CMOS Static Random Access Memory organized as 2048K by 8 bits and operates form a wide range of 2.4V to 5.5V supply voltage.Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical CMOS standby current of 1.5uA at 3.0V/25O C and maximum access time of 55ns at 3.0V/85O C.Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state output drivers.The BS62LV1600 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS62LV1600 is available in JEDEC standard 44-pin TSOP II and 48-ball BGA package.n POWER CONSUMPTIONPOWER DISSIPATIONSTANDBY(I CCSB1, Max)Operating(I CC , Max)V CC =5.0V V CC =3.0V PRODUCT FAMILYOPERATING TEMPERATUREV CC =5.0V V CC =3.0V1MHz10MHzf Max. 1MHz10MHzf Max.PKG TYPEBS62LV1600EC TSOP II-44 BS62LV1600FC Commercial +0O C to +70O C 50uA 8.0uA 9mA 48mA 113mA 1.5mA 19mA 45mABGA-48-0912 BS62LV1600EITSOP II-44 BS62LV1600FIIndustrial -40O C to +85O C100uA 16uA 10mA 50mA 115mA 2mA 20mA 46mABGA-48-0912n PIN CONFIGURATIONSn BLOCK DIAGRAMBrilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.G H F E D C B A 1 2 3 4 5 6 A9 A11 A10 A19A12 A14 A13 A15 WE NC NC NC DQ7 A17 A16 A7 VSS VCC DQ2 DQ1 DQ6 DQ5 NC A5 OE A3 A0 A6 A4 A1A2CE2 NC NC NCCE1 DQ4 NC 48-ball BGA top view NC NC DQ0 VSS VCC DQ3 NC A18 A20 A8n TRUTH TABLEn ABSOLUTE MAXIMUM RATINGS (1)SYMBOL PARAMETER RATING UNITSV TERM Terminal Voltage withRespect to GND-0.5(2) to 7.0 VT BIAS Temperature UnderBias-40 to +125 O CT STG Storage Temperature -60 to +150 O CP T Power Dissipation 1.0 WI OUT DC Output Current 20 mA1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.2. –2.0V in case of AC pulse width less than 30 ns. n OPERATING RANGERANGAMBIENTTEMPERATUREV CC Commercial 0O C to + 70O C 2.4V ~ 5.5VIndustrial -40O C to + 85O C 2.4V ~ 5.5Vn CAPACITANCE (1) (T A = 25O C, f = 1.0MHz) SYMBOL PAMAMETER CONDITIONS MAX. UNITS C INInputCapacitanceV IN = 0V 10 pFC IOInput/OutputCapacitanceV I/O = 0V 12 pF1. This parameter is guaranteed and not 100% tested.n DC ELECTRICAL CHARACTERISTICS (T A =-40O C to +85OC)1. Typical characteristics are at T A =25O C and not 100% tested.2. Undershoot: -1.0V in case of pulse width less than 20 ns.3. Overshoot: V CC +1.0V in case of pulse width less than 20 ns.4. F MAX =1/t RC.5. I CC(MAX.) is 45mA/113mA at V CC =3.0V/5.0V and T A =70O C.6. I CCSB1(MAX.) is 8.0uA/50uA at V CC =3.0V/5.0V and T A =70O C.n DATA RETENTION CHARACTERISTICS (T A = -40O C to +85OC)1. V CC =1.5V, T A =25O C and not 100% tested.2. t RC = Read Cycle Time.3. I CCRD(Max.) is4.0uA at T A =70O C.n LOW V CC DATA RETENTION WAVEFORM (1) (CE1 Controlled)Data Retention Mode V CCt CDRV CC t RV IHV IHCE1≧V CC - 0.2V V DR ≧1.5V CE1V CCn LOW V CC DATA RETENTION WAVEFORM (2) (CE2 Controlled)n AC TEST CONDITIONS (Test Load and Input/Output Reference)Input Pulse Levels Vcc / 0V Input Rise and Fall Times 1V/ns Input and Output Timing Reference Level 0.5Vcc t CLZ , t OLZ , t CHZ , t OHZ , t WHZ C L = 5pF+1TTL Output LoadOthersC L = 30pF+1TTL1. Including jig and scope capacitance.n KEY TO SWITCHING WAVEFORMSn AC ELECTRICAL CHARACTERISTICS (T A = -40O C to +85OC)READ CYCLECE2 Data Retention Mode V CC t CDR V CC t R V ILV IL V CCV DR ≧1.5V CE2≦0.2V 1 TTL ALL INPUT PULSES→← 90%V CC GND Rise Time : 1V/ns Fall Time : 1V/ns90%→← 10%10%n SWITCHING WAVEFORMS (READ CYCLE)READ CYCLE 1 (1,2,4)READ CYCLE 2 (1,3,4)READ CYCLE 3 (1, 4)NOTES:1. WE is high in read Cycle.2. Device is continuously selected when CE1 = V IL and CE2= V IH .3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high.4. OE = V IL .5. Transition is measured ± 500mV from steady state with C L = 5pF. The parameter is guaranteed but not 100% tested. t RC t OHt AA D OUT ADDRESS t OHD OUTCE2 CE1D OUTCE2 CE1 OE ADDRESSn AC ELECTRICAL CHARACTERISTICS (T A = -40OC to +85OC)WRITE CYCLEn SWITCHING WAVEFORMS (WRITE CYCLE)WRITE CYCLE 1 (1)t WCt WR1(3)t CW(11)t CW(11)t WP(2)t AWt OHZ(4,10)t AS t WR2(3)t DHt DWD IND OUTWECE2CE1OEADDRESS(5)(5)WRITE CYCLE 2 (1,6)NOTES:1. WE must be high during address transitions.2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write.3. t WR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle.4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied.5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state.6. OE is continuously low (OE = V IL ).7. D OUT is the same phase of write data of this write cycle. 8. D OUT is the read data of next address.9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. T ransition is measured ± 500mV from steady state with C L = 5pF. The parameter is guaranteed but not 100% tested. 11. t CW is measured from the later of CE1 going low or CE2 going high to the end of write.D IND OUTWE CE2 CE1ADDRESSn ORDERING INFORMATIONBSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.n PACKAGE DIMENSIONSTSOP II-44n PACKAGE DIMENSIONS (continued)3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.N EDNOTES:4812.09.0E1D1e3.755.250.75 48 mini-BGA (9mm x 12mm)n Revision HistoryRevision No. History Draft Date Remark2.2 Add Icc1 characteristic parameter Jan. 13, 2006Improve Iccsb1 spec.I-grade from 220uA to 100uA at 5.0V20uA to 16uA at 3.0VC-grade from 110uA to 50uA at 5.0V10uA to 8.0uA at 3.0V2.3 Change I-grade operation temperature range May. 25, 2006 - from –25O C to –40O C。
win7注册码大全第一篇:win 7 注册码大全序列号大全Windows 7 UltimateProfessionalHome OEM KeyGen DELL->Ultimate OEM->342DG-6YJR8-X92GV-V7DCV-P4K27 Lenovo->Ultimate OEM->22TKD-F8XX6-YG69F-9M66D-PMJBM Acer->Ultimate OEM->FJGCP-4DFJD-GJY49-VJBQ7-HYRR2 SAMSUNG->Ultimate OEM->49PB6-6BJ6Y-KHGCQ-7DDY6-TF7CDAcer->Professional OEMYKHFT-KW986-GK4PY-FDWYH-7TP9F DELL->Professional OEM32KD2-K9CTF-M3DJT-4J3WC-733WD HP->Professional OEM74T2M-DKDBC-788W3-H689G-6P6GT SAMSUNG ->Professional OEMGMJQF-JC7VC-76HMH-M4RKY-V4HX6 Packard Bell-> Home OEM->VQB3X-Q3KP8-WJ2H8-R6B6D-7QJB7 DELL->Home OEM->6RBBT-F8VPQ-QCPVQ-KHRB8-RMV82 ASUS->Home OEM->7JQWQ-K6KWQ-BJD6C-K3YVH-DVQJG SAMSUNG ->Home OEMCQBVJ-9J697-PWB9R-4K7W4-2BT4JUltimate OEMNONSLP->7YWX9-W3C2V-D46GW-P722P-9CP4D ProfessionalGVLK-> FJ82H-XT6CR-J8D7P-XQJJ2-GPDD449CGJ-4MTTF-WCM4W-K8WMG-3G2VT ProfessionalNGVLK->MRPKT-YTG23-K7D7T-X2JMM-QY7MG VolumeCSVLK-> FKJQ8-TMCVP-FRMR7-4WR42-3JCD7 ->->->3XJCJ-QWXCJ-QJVBX-3V7XF-X48TJ VolumeMAK->7RWBY-WT9KY-3BDJ2-9PYWC-GXKTP EnterpriseGVLK->33PXH-7Y6KF-2VJC9-XBBR8-HVTHH EnterpriseEGVLK->C29WB-22CC8-VJ326-GHFJW-H9DH4 EnterpriseNGVLK->YDRBP-3D83W-TY26F-D46B2-XCKRJ ServerWebGVLK->6TPJF-RBVHG-WBW2R-86QPH-6RTM4 ServerStandardGVLK->YC6KT-GKW9T-YTKYR-T4X34-R7VHC ServerDataCenterGVLK->74YFP-3QFB3-KQT8W-PMXWJ-7M648ServerEnterpriseGVLK->489J6-VHDMP-X63PK-3K798-CPX3YServerEnterpriseIA64 GVLK->GT63C-RJFQ3-4GMB6-BRFB9-CB83V下面的“序列号”可能是由 Windows 7 的专用算号器算出来的,建议用 W7 序列号测试软件测试其可用性ProfessionalXJBR4-M42Q4-QPJ9C-BRDRJ-KHPVYTTY4D-RDKK9-TYB2T-68WJW-M69KJTF3Q7-YYP8R-D78R7-W9Q9M-DXVBK RGM4T-3VT6B-GTYPY-3FHP2-HV2YJP3H89-V3P2R-JVBTF-YM2J2-FTMT3J8D39-J2WM3-6368H-JV8G9-BYJJQ HWRFF-2FFYX-XFXP2-DYFC3-BX3B7C3X7Y-R6WWH-BRXRD-FY84C-FXWHKYT9K9-4R938-3TVXX-3Q3QT-9HBXMHome PremiumTWF78-W7H8T-KXD8C-YDFCQ-HK4WGRHVHB-VYF67-9FT4M-2WXR8-P3C6RQ8JXJ-8HDJR-X4PXM-PW99R-KTJ3H PPBK3-M92CH-MRR9X-34Y9P-7CH2FMVW82-3R7QW-Y4QDM-99M3V-C4QW3BFTWY-X2PJR-VJP8V-KGBPJ-FWBMP 86GG2-DBVT6-KYQQ6-XFK9R-896MF8489X-THF3D-BDJQR-D27PH-PJ3HC4CBPF-W7GXG-J4J8F-GHG79-Q9YT8 38CGD-Q6RHB-37BVW-Y3XK7-3CJVCHome BasicWXM3Y-H2GDY-TKFQH-6GQQF-7VG8PV6V3G-9DB2T-BD4VC-44JVQ-6BVR2P4DBR-8YPT6-KHRB8-6T7RW-GMXGV GV7X4-92M4D-6F69V-RFGP9-3FBBDGDK6B-87QP9-F9WYK-PP327-BQ622FGTCF-8JBG2-4BK4G-36JWB-PFQXB CW4KD-MK47X-JYQ7Y-DKKTR-86TH772C8D-KQ9Y4-FGBCD-WY9WG-BD92C4JCWB-FVHJJ-XCPKC-CTWDP-QQQ9M 37X8Q-CJ46F-RB8XP-GJ6RK-RHYT7Starter OEM:NONSLPBG2KW-D62DF-P4HY6-6JDPD-DYK3WC7KYW-CBKVC-DPC82-7TPKD-Y8T2CGXRHM-CGB6Y-4WRD9-KFD7C-QXQ2B PKRD7-K8863-WY28P-3YQGW-BP2CYPKRHK-6622Q-T49PV-CC3PX-TRX2YPR93X-CRDGQ-D83PK-VYFC6-86TW2 V2Q3D-V8VXJ-YQVW6-F2CRQ-4JH64YDMGR-MYQ3R-4XKRK-VHPDK-H7BY2YRDY3-MPVD4-GYRVY-QKBGP-M7Y3Y 绝对行第二篇:2005注册码2005注册码大全/所有软件序列号/注册码杀毒软件/FTP注册码/工具注册码/系统软件/最新最全注册码大集合!请使用Ctrl+f查找你所需注册码NetCaptor V7.50 RC2 简体中文注册信息:Fo20qUUzANs+SNUIgsVXwFG4wCUZN7ef9jsQkSvdArn LVyfWzt3ep+RglGj7BMh3rXRdtmxmvbcbNDkjN6Rfi9 wbGJoksQEn8xoMPyQ=YiZd=vR7YEgK5jTnbF9YwFhrkvSE6QlJdzeQzB3AzqZuPacM0zkb2RonG7GdWeGHlqo DVD Mate Deluxe v2.5.11.28 简繁英日注册版Name: TEAM CAT 2004 Serial : CMAA0EA775TAAwindows XP 序列号[分享] windows XP 专业版8XBXH-B6RJD-BP82Y-4XG84-JTQMM V8BF3-WWJDW-FGXR8-WMCDB-FWHYX 6HV6T-T2HCR-QQ6DH-7WHWM-QHVYD M7HXD-TCCF8-HFMKG-RDMF4-KDCVT H4FP7-BRV2C-P74GD-QVFXR-CXM8XGR3MD-PRMY6-3CQJP-2R2VH-KRJHV JKJT2-BDKW6-6T7J4-QGYYB-8RBRF R4TH4-2KF4Y-H4WGT-DMWKX-6PDH2 HM7DT-JBWJ3-QVBJM-RDV34-PP9VK MBTB3-8HCMJ-YPXJD-FCTJM-YJ87Y 66PH2-4J3VQ-4TXJC-CQTCK-XK8BD D7BMY-GKQ3H-MTBJ7-KFHMP-QKWYK PM3P6-8JV48-J7GRD-PXXG2-VDMDBwindows XP 企业版CTTC3-J8QWX-JRF2P-YQYF8-4HW7M R4F3T-2QWKG-33M4V-8MJCF-Y6XV7 TDW2D-WXGW2-VWB4H-FCDRM-X6K7P 67YF6-2JX6P-CXMQT-F3MW2-FC6RY B2PB4-T6CGC-YWRCF-TDPCK-2F8HG VCFM8-XPDHK-44J7M-23W7C-JMFPV XJTBM-WTYV7-YHV22-QGKWB-3XT9B HKWFJ-QDXTP-82QFW-2RFC8-PGHBG Kugle RegEditer v3.0 多国语言Name:crskyCode:KGL-CRSKYS-EFAN-IZ7711Kerio Personal Firewall v4.0.10 英文Code:30411-A1TV9-54C96白金手册 2004贺岁完美版身份证号码:***678 注册码:4***477704TurboFTP v4.00 Build 338 英文Name:chensifeiCode:AEE16628-D5UCDU26ZC-52740EZ MP3 Creator v1.2.6 Build 170 英文Code:83F1078E39797378Save Flash v2.4.00 注册版英文Name:wswdddy Serial:SF2444G2Y3NGWave Audio Editor v2.1.20031208 注册版英文Serial:wswdddyCode:184D-B626-8A7F-26B2-31MP3 Burner 2004 v6.10 注册版英文Name:wswdddyCustomer:339243220 Serial:6A97F311B800K-MP3 V5.1.1.35 注册版英文Name:Code1:******32093087 Code2:******69093078DVD CD Data Burner 2004 v6.10 注册版英文Name:wswdddy Custome:320289636 Serial:7EEFA5DFD800 AceReader Pro Deluxe Network v3.0e 注册版英文Name:wswdddy Serial:JQnn6a9rFc还原精灵2003零售版注册码:YUAN-VRT5-TQ3Q-V8W8-N36SGetDataBack for FAT v2.22 Name:crskyCode:COYMTLPGBQYXBK02服务器50客户端安装序列号:WS1H3W-PLWWU9-JL1D3Q-SF9108 WS1H3W-PLWUU9-JL1D3Q-SF910820服务器60客户端安装许可号:3PVQNT-5JP184-9R8IJB-1F910863服务器,281客户端序列号:G72V3S-PW6PW9-JL1D3Q-SF9108115服务器,106客户端序列号:P28FLA-L0VCQL-BB8NM7-HJA108限时安装序列号是:L2B79E-IWUAQA-VIMT74-3L6108 8ACDK6-L5C4QQ-Q5GJ9G-W9910820服务器300客户端--限时安装WN1I3S-PANWS7-QHCI1G-VQ6108 49N5P5-EUAI4L-RV9LW3-I59108 2RE9VM-NHC1QA-51MA0T-DR9108 XX网络安装ID号第二组修改得到例:20服务器300客户端--限时安装2RE9VM-NHC1QA-51MA0T-DR9108 改为:24个服务器端,16736个客户端2RE9VM-WUC1QA-51MA0T-DR9108豪杰解霸3000英雄版用户名:JV9SMVC6P7 注册码:E51Y-WKNM-9DQS-JN11起名向导注册码:72421015721 winxpcdkey: CCC64-69Q48-Y3KWW-8V9GV-TVKRMTouchNet(特好用的浏览器,相信我)用户名:logroll 注册码:295416435575作者: 61.236.10.* 2005-8-11 21:56回复此发言------------------注册码用户名:Guhong注册码:291625486646集成了sp1的俄罗斯破界版BX6HT-MDJKW-H2J4X-BX67W-TVVFG集成了sp1的XP22DVC-GWQW7-7G228-D72Y7-QK8Q3windows优化大师6.1 姓名 shenwei申请码 526707(随机产生的)注册码 4FC39E95-EAE23FF1-B76EE75E-2AFB9754flashget 1.60注册码:fgf-ujvcyqehnsrricyifuuczetqdezhsapqehqjtwkvDreamweaver MX 2004:WPD700-52206-61494-40475超级解霸3000:Name:C-TQEMJ-JKLHW-EMJOQ-TQEMJ美萍VOD视频点播系统 v6.2序列号:逸凡-霏凡软件-美萍-注册-码注册码:58482新新网页特效 2003 build 07.11 注册版Code:20030711-rege01极光IE保护 V2.2 注册版Name:crsky[BCG]eMail:*************Code:53A8835D-E25A193D系统优化大师 2003 build 07.11 注册版Code:20030711-text12天舟无痕 v1.3a Name:crskyCode:0A2E-AED6-D5FE木马克星(iparmor)V5.42 Build 0705完美版======Register Info====== name: code:1538880069Trojan Remover V6.03 正式版注册码user: paul smithkey: 2F07-91F2-D305-F05A-0636-E6DC-678E-AF5D-1995-7EDC-55A7-9C72-4AB8-BE05-014B立体画梦工厂 v2.11 特别版用户名:LJWBH 注册码:1961912081超级网络邻居(IPBook)V0.36 注册码name:注册码: 338560000易商外贸业务管理系统注册码安装序列号: CCU-168-99999999 注册名: exky[CCU]注册码: 2722734***281724lg9696英语选择题学语法 V2.1 注册码用户名:ljwbhddddd ID号;PEZPFljdhlDizNfo NFO文档浏览工具v3.42 Name:C-TQEMJ-JKLHW-EMJOQ-TQEMJ 电脑万能加锁专家 V7.4 注册版软件类型系统安全注册名:woyao 注册码************魔法转换V3.0 国际注册版注册名:TEAM BLZ 注册码:MC35CC1***000Web Album Creator v3.01name : C-DTTBE-XOGKT-VJFMR-INELC WinPoET v6注册码:89MF19JN-00706974江民2004注册码:KV000-38764-VP67A-C2QD8-GX6PP KV000-38764-VP67A-C2QD8-HVX5V金山快译2005专业版安装序列号: HXM7D-WBT7C-YBG3G-WC6YR-KQJKY金山词霸2005专业版安装序列号:QRPDJ-7K68C-Y2GWJ-MBMQM-V8TW3诗词快车 2004 V3.6 注册码:ID: Zeror[CZG][D.4s]SN: HHIDE-CWFCYYRRHW-S77FS豪杰解霸3000英雄版用户名:JV9SMVC6P7注册码:E51Y-WKNM-9DQS-JN113DMark 99 MAX Pro[eGIS!'2000] REFLJ-ADSVP-TGFAG3dmark2000 ID: MANU147code: MU6SF-R99PZ-VRVV5 名称:3dinfo密码:SYX4R-HN5XA-T7SDZ第三篇:注册码注册码大全这个注册信息是原来2005年1月份霏凡网站提供的黄金内存注册信息,偶只是原创发现其能用于最新发布的白金内存,特此说明!!在这里偶还要说明的是,最新版本的黄金内存早已经不存在单独版本了,是集成在完美卸载中发布的,只有这个白金内存才是最新单独发布的内存软件版本!!硬件追捕 v1.6(2005年10月11日发布)密钥:DG8FV-B9TKY-FRT9J-6CRCC-XPQ4G(GT原创提供)注:单位全称和文书简称(文书号)请在最初启动软件的时候设置第四篇:注册码象棋桥2000注册码:CCB2000R-12345键盘幽灵key ghost(版本3.2)注册码:opq98-4953589共享文件夹解密器Share Crack(版本1.1)注册名:opq98 注册码:78032超级网络监视器SuperNetWatch(版本1.0)注册名:opq98 注册码:78032文件切割机file do(版本1.1)注册名:opq98 注册码:78032key ghost(版本3.2)注册码:opq98-4953589汇声拼字(版本3.0)注册方法删除HKEY_CLASSES_ROOTMsxmls键值Cute Page Cool Button(版本1.5)注册地址:**************注册码:15B2A308CE985948Cute Page Cool Menu(版本2.5)注册地址:**************注册码:FFE04B4005641FEBCute Page Cool Text(版本1.5)注册地址:**************注册码:7F4F64CCF4A15CB6Cute Page Sliding Menu(版本1.5)注册地址:**************注册码:CFA39FF52BB7BF17计划生育管理信息系统(版本2.0)注册码:2391396000餐饮管理(版本1.2)注册码:2731377600trace boy(版本1.10)注册名:opq98 注册码:opq98-979923网路通(版本1.87)注册名:opq98注册码:12e221fd55e4icon cool(版本1.56N)注册名:opq98注册码:CL15-FBFB-11FF-7878(后面四位可以随意)金数龙仿真物理实验室(版本1.01)学校:希望小学注册名:梦晖注册码:0.596311956金数龙光学实验室学校:hope school 注册名:mssoft注册码:0.32335550mouse lock鼠标锁(版本2.5)注册名:wenling 注册码:15553400 文字录入速度测试系统(版本3.0网络版)用户代号:1111-1111-1111 注册码:9211-1156-0161Arctic Security+(版本2.4.43)注册名:opq98注册码:77678781D-7357D7F1D-73707D7F1C-607B7512冬威记事本编辑器(版本1.0B)注册名:opq98 公司名:sex注册码:111211311756易经八卦占卜程序注册名:opq98 注册码:IzzT万能五笔(新潮电子特别版注册名:opq98 注册码:9936-707006-4331SetupBuilder Professional(版本1.50)注册名:opq98注册码:Fxh2ii1VFx-Zn4JqsX22e-5I9eRxAGB6-AgZ11LT+4U-0Fhm+aPxCb登录奇兵(版本1.0)注册名:opq98 注册码:PDQ53FR4R5RZMiniCards海量名片专家(版本 1.6)注册名:opq98 注册码:NQ24ML1ZJ9MiniClocker定时专家(版本4.8)注册码注册名:opq98 注册码:CXX9MMENYYNetAngel网络天使(版本1.62)注册码注册名:opq98注册码:3STSK2PPNX云雕多媒体播放器(版本2.2.56)注册名:opq98 注册码:WtsqUT Arctic Security+(版本2.4.43)注册名:opq98注册码:77678781D-7357D7F1D-73707D7F1C-607B7512冬威记事本编辑器(版本1.0B)注册名:opq98 公司名:sex注册码:111211311756易经八卦占卜程序注册名:opq98 注册码:IzzT万能五笔(新潮电子特别版)注册名:opq98 注册码:9936-707006-4331SetupBuilder Professional(版本1.50)注册名:opq98注册码:Fxh2ii1VFx-Zn4JqsX22e-5I9eRxAGB6-AgZ11LT+4U-0Fhm+aPxCb登录奇兵(版本1.0)注册名:opq98注册码:PDQ53FR4R5RZ古今大战80分(版本2.7)序列号:1 注册码:GBCMiniCards海量名片专家(版本 1.6)注册名:opq98 注册码:NQ24ML1ZJ9 MiniClocker定时专家(版本4.8)注册码注册名:opq98注册码:CXX9MMENYYNetAngel网络天使(版本1.62)注册码注册名:opq98注册码:3STSK2PPNXwordslover(版本1.0 beta6)注册名:opq98 D类[站长级别]北京,大学,其他,*************注册码:91696593侠客系统修改器(版本1.21)(注册名:wenling注册码:b2Wt23W0x3X2v2CoolSysHold(版本3.0)注册码:0A0-00000000000极点词汇大突破(版本1.1)注册名:opq98 注册码:6295310单词抓取器(版本1.0)注册名:wenling注册码:SUP5-KRNQ-1J0Y-L2GL鼠标锁(版本2.4)注册名:opq98 注册码:8363610超级记事本(版本2.0)注册名:opq98注册码:6***9625斗地主(版本1.1)注册名:文岭邮件地址:*************注册码:AT1Y2XP2T3JXG08M网络快剑(版本1.0)注册码:1B1-11222222222 网巢(版本3.0)注册码:IMUGAG-UUOIWE-111111-111111 注册密码:OMAMMY心弈(版本1.0)注册名:opq98 注册码:404b7461万能五笔(版本2000a+)注册名:opq98注册码:9936-305732-0318上网小管家(世纪2000版)注册码:1a2b3czbokswxgj2000呼吸小秘书主页特效篇(版本0.8)注册名:opq98 注册码:BSJG08SN12345五子棋(版本3.2)注册名:opq98 注册码:XQJF=9推箱子(版本1.54)注册名:opq98 注册码:ZSLH?2UltraPad(版本2.0)code:12345678 key:18518394万码无忧(版本1.51)注册名:opq98 注册码:14097即时语音提示&校对软件InsTalk(版本2.71)注册名:opq98 公司名:sex注册码:1684B1400DA36142CDAFA7E53话费清单(版本1.3.2.0)把用户编号改为00000000 注册名:opq98 注册码:85853sasa轻松制单注册名:opq98注册码:3260776873windows cracker(版本2.0c)注册名:opq98注册码:12b17b535161免费传真之星(版本2.1)注册名:opq98注册码:ZYYDCDDDDDDCCBAA方才天地彩色名片设计系统(版本1.2)注册码:***6补丁专家1.0 注册名:wenling公司名:注册码:197202-OWL35539414新人类pc showin站序列号:H87-25-00005enotebook注册码注册名:opq98注册码:12e41be369c4webghost(版本2.15)注册名:opq98注册码:h[iBLPMMGliT11Zupdaterob 注册名:opq98注册码:12d60fc6aab2网上UFO-互连网导航注册名:opq98 注册码:910124734可视化剪贴板(v1.0)在可视话剪贴板.exe中找0f84000400,改为0f85000400.注册时随便输入注册码.你可以打开软件目录下的IsClip.ini文件, 找SN=,后面就是你真正的注册码了.超级保镖oem版序列号:75818task v0.6(软件下载)注册码:opq98-14848Iamgodk TTS 99b 中英文打字训练系统注册码:i_am_jl1016&lovetww(最后有一个空格)WorldWatch(版本3.1)注册码:123-4567891LanExpert注册码:123-4567890扬志显示集成控制系统(版本3.4.0003)注册码:constantwinboy注册码:1976-YHD-02-24winpro注册码:opq98-17988keyGhost注册码:opq98-21090电脑屋游戏记录管理系统(电脑报配套光盘99春节特刊)注册码:0319000010System Mechanic多功能系统维修师注册名:opq98注册码:66656-ND756-8656269565攻略博士(版本2.0)HKEY_CLASSES_ROOTeiji Reg=1DialWatcher拨号管家用户名:opq98 公司名:sex注册码:5396-236264av98 for windos95/98/nt workstation 注册名:opq98公司: 注册码:266B9AF893F7小苏中国象棋2000!测试版注册名:opq98注册码:PD43HFT6N2DRnettime2000中文网络记时器注册名opq98,序列号378507注册后作者的另一作品M&T 智能鼠标也成了注册版的了,不知道怎么回事.超级电话通(版本3.0)注册名opq98,序列号779842.greentea注册名:opq98 注册号:189205476文鼎科技动态字酷(1.0中文版)过期破解在Anifont.exe中找84c07520,改为84c0eb20.网际传真2000(测试第一版)安装和使用时间在HKEY_CURRENT_USERSoftwareiFax2reg和HKEY_CURRENT_USERSoftwareMicrosoftStartSetupTime1.把这两项删除了就又有30天可用了.晴窗中文大侠2000II演示版在安装目录下SunWin98目录SunWin98.exe文件中找85c9744d,改为85c9eb4d.苦丁香智能课表管理系统先运行注册表文件,注册时选择北京,北京,苦丁香学校,***353.soyou软件智慧小子、飞越代理、幽默小子(这三个软件每次运行时都会提示你是否把所有网站作为浏览器首页, 如果你是把所有网站作为首页的话,当然就不用改了.修改方法:在各自的exe文件中找85c0750e8bc6,改为85c0740e8bc6.我爱背单词2000在wabdc.exe中找6685f60f84cb0000,改为6685f60f85cb0000, 输入序列号时随便输入.vrv2000(win95/98版)安装文件把文件解压缩到根目录下,不能是目录下.就是说在根目录下只要有Netvrv.95目录,下有Vrv2000目录(Vrvup和setup.exe文件都可以不用), Vrvdoc目录,下有文件边防.doc,南京信源.doc.vrv2000就可以安装了!运行Netvrv.95目录下的setup文件,初次安装或者升级安装都是选择初次安装,插入vrv2000安装软盘按提示操作就可以了.vrv2000安装软盘晴窗中文大侠2000 II代(试用版这个软件只能试用99次,试用次数标记在HKEY_LOCAL_MACHINESoftwareMicrosoftcode view.可以用删除或者导出注册表分支然后运行的方法.奔腾网计(版本99.6.12)(奔腾网计安装目录下有个main.dat文件, 第三行改为用户类型,爱心用户envelope 3.0信封打印软件软件序列号:EN95-1000-20000 软件密码:20212249248大五笔(2.0版)(在windows目录system目录下的regdwb.exe 中找0f84ec020000,改为0f85ec020000.注册时随便输入注册码.声音输入法在windows目录下system目录的regsym.exe文件找0f84df010000,改为0f85df010000, 注册的时候随便输入注册码.拼音之星2000 for win95/98/nt beta2找83F9317D12,改为83F9317D12(让软件在月份为二十几月的时候提示过期),找83FA347F09,改为83FA407F09(让软件比较月份第二个数字的编码是否大于40), 找83F839741B,改为83F839EB1B.拼音加加破解方法输入万码通(版本2.01)姓名:梦晖地址:**************密码:V20-***431Mybase 通用资料管理器(版本2.1)(注册名:mssoft注册码:1vi1-mbs-0y3bh454电脑保护神(版本2.0)通用序列号:WuYue-_-Wang程序猎人v1.0 注册名:mssoft 注册码:14616326pc-cillin(版本2000 for win98)注册码:PCEW-0011-4881-2059-1555友情强档注册名:picker注册码:166320-XOOEEL开门见山(版本1.0)(电脑爱好者配套光盘5)注册码:A0-0G41236-T94e-book(版本1.98)注册名:我爱e-BOOK注册码:0123456789ABCDEFICounter(版本1.98)注册码:icounteruser超级保镖2000黄金版2000 软件序列号:JP991029理正结构计算工具箱3.03破解法tool_*.exe 找85 c0 75 07 c7 45.........75 0f 83 7d 改 ed (90)90 找83 b8 c4 01 00 00 00 75 05 e9 改 90 90tkshell.dll找c2 18 00 cc cc cc 改40 c2 18 00tktools.dll找cd 13(两个)改90 90iwatch注册码:yuejiahxh12345个人电脑图书馆v1.10名字: mENTALs 地区: mSoft注册码: IYfjyg^z=`@pbK容创达公司的建筑软件TARCH和装修软件ADORN(适用与试用版、正式版的各个版本,且建筑、装修破解法相同)在AEC.ARX中全段(建议用UltraEdit)找3A 16 75 1C 84 C9 74 14 ^^ ^^ 换 90 90找CA 3A 56 01 75 0E ^^ ^^ 换 90 90在改之前,先备份AEC.ARX,改完后运行, 随便填入注册码,注册成功后将备份恢复.(共有500多行需改!要有耐心和细心哟!)徳赛装修ARCHT14 注册码:812B8倪建华的工资系统4.0-5.0注册器(象棋桥(电脑报PC世界第6期配套光盘)序列号:37844622心理自测V1.0(电脑报PC世界(第6期)配套光盘)注册名:KONGJKD 序列号:654909轻轻松松背单词在bdc.exe中找0ee893085959 改为0e9090905959开天辟地背单词find 3d 00 00 74 03 e9 0a 00 edit 3d 00 07 74 03 e9 0a 00 find 3d 2a 23 75 03 e9 9e edit 3d 2a 23 74 03 e9 9e上面这个在有的机型可能不能成功, 可以试试按下面的方法: find 3d 00 00 74 03 e9 0a 00 edit 3d 00 00 90 90 e9 0a 00 find 3d 2a 23 75 03 e9 9e edit 3d 2a 23 90 90 e9 9e或者修改human.ini[Energe] SampleFrequence=11025 [KTPDBDC]PATH=d:HUMANKTPDBDC [System]KTPDBDC=<>?;=B>=l>CnoAnAooo>mlk=n@lACmpn@>A: :==>Cmmnl=如果不行的话,可以把这一行改为:KTPDBDC=n;m?Blk@oCl::@=Clp>l?oo>=>mBmml@医圣在windows目录下找human.ini文件,改动如下: [SYSTEM]yisheng=0x2bff49ff297641ff畅通无阻在win.ini的[Compatibility],加上以下几句之一.ZIPVIEW= 后面的密码是跟随月份而发生变化.ZIPVIEW=0x2465634110 ZIPVIEW=0x5546059220 ZIPVIEW=0x3627273620 ZIPVIEW=0x4511569280 七月份的代码如下:ZIPVIEW=0x5557259150 ZIPVIEW=0x6681781520 ZIPVIEW=0x9475232060 八月份的代码如下:ZIPVIEW=0x3476439020 ZIPVIEW=0x0558658210开天辟地II解密程序破解方法:在windows目录下找human.ini文件, 加上以下两行[System]ktpd=f1f1f1f111116***f0f0f0f0这些内容在每台机器上都是不一样的,但是无论是什么标记码,在每台机器上都可以用, 您如果从别的输入密码后的机器上拷来这个文件也是可以的.KILL98(正版光盘版)运行时免读光盘CAV.EXE下:F:85 C0 75 11 43 83 FB M:75 13 74-----------就OK了.如此一来就不用安装后还得次次插光盘的麻烦了.听力超人及耳目一新读英语在windows目录下找human.ini文件,改动如下: [System]Superma=21411191f1f1f1f1f1f010d0f0f0f0f0novel1=41e1f1f1f1f1f1f1f1f0f0f0f0f00010 [novel]savepath=C:HUMANNOVEL 听霸将listen.exe中8B 4D E0 8B 56 34 改为8B 4E 34 8B 56 34注册时随便输入什么便可进入。
常见IC卡型号来源:迈德金卡作者:青青禾更新时间:2010-04-12IC卡(INTEGRATED CIRCUITCARD)又称集成电路卡,它是一个塑料卡片,其大小与磁卡一样,但比磁卡要厚且硬。
在卡片的正面可以看到一块小金属片,在金属片的下面是一块半导体芯片。
这种芯片可以是存储器或是一微处理器(CPU)。
带着存储器的IC卡又称存储卡,带着CPU的IC卡又称智能卡或CPU。
1、ATMEL 24CO1A存储容量:1Kbit,无密码,只有读写两种操作制作标准:ISO 7816应用范围:数据存储2、ATMEL 24C16存储容量:16Kbit,无密码,只有读写两种操作制作标准:ISO 7816应用范围:数据存储3、ATMEL 24C64存储容量:64Kbit,无密码,只有读写两种操作制作标准:ISO 7816应用范围:数据存储4、AT88SC102存储容量:加密存储卡,1Kbit特点:2个应用区,容量均为512Kbit,密码计数器值为4,卡片总密码2字节,一区擦除密码6字节,二区擦除密码4字节制作标准:ISO 7816应用范围:医疗保险、数据存储、网吧收费、身份认证、电子钱包5、AT88SC1604A存储容量:加密存储卡,16Kbit特点:1个公用区和4个应用区,四个应用区中,各个分区都有各自的密码和擦除密码,且各个分区中均有各自的密码计数器,密码均为2字节,密码计数器值为8制作标准:ISO 7816应用范围:医疗保险、数据存储、网吧收费、身份认证、电子钱包6、SLE 4428存储容量:加密存储卡,1K字节特点:卡始终可读,写卡必须通过密码校验,2字节可编程密码,密码错误计数值为8,可对整张卡片写保护制作标准:ISO 7816应用范围:医疗保险、数据存储、网吧收费、高速公路收费、电子钱包7、SLE 5542(SLE4442升级)存储容量:加密存储卡,256字节特点:卡始终可读,写卡必须通过密码校验,3字节可编程密码,密码错误计数值为3,可对卡片前32字节写保护制作标准:ISO 7816应用范围:医疗保险、数据存储、网吧收费、高速公路收费、电子钱包8、Philips Mifare 1 S50存储容量:8Kbit,16个扇区,每区4块,每块16字节,以块为存取单位,每个扇区有独立的一组密码及访问控制,有32位全球唯一序列号工作频率:13.56MHZ通讯速度:106kbps读写距离:2.5-10CM制作标准:ISO 14443应用范围:企业/校园一卡通、公交一卡通、高速公路收费、停车场、小区管理、电子钱包9、Philips Mifare S70存储容量:32Kbit,40个扇区,其中32个扇区每扇区64个字节容量,分为4块,每块16字节;8个扇每扇区256个字节,分为16块,每块16个字节,以块为存取单位,每个扇区有独立的一组密码及访问控制,有32位全球唯一序列号码工作频率:13.56MHZ通讯速度:106Kbps读写距离:2.5-10CM制作标准:ISO 14443应用范围:高容量要求的校园一卡通、城市一卡通、电子钱包10、Mifare Ultra Light存储容量:512bit,16块,每块4字节,唯一的7字节序列号,32位用户可定义的一次性编程区域,384位用户读、写区域工作频率:13.56MHZ通讯速度:106Kbps读写距离:在100MM以内(与天线有关)制作标准:ISO 14443应用范围:一次性票卡,如地铁、城际高铁11、Ti 2048存储容量:2Kbit,分为64×32个区段,唯一64位序列号工作频率:13.56MHZ通讯速度:106Kbps制作标准:ISO 15693应用范围:公交,泊车,身份认证,考勤管理,门票,一卡通付费,产品标识12、ATMEL T5567(原T5557升级版)存储容量:330bit, 10分区,每个分区33bit,8位密码工作频率:125KHZ读写距离:3-10CM制作标准:应用范围:感应式智能门锁、企业一卡通系统、门禁、通道系统13、EM4001 ID卡工作频率:125KHZ读写距离:2—15CM应用范围:身份识别、考勤系统、门禁系统、财物标识14、SLE 4442存储容量:加密存储卡,256bit,特点:卡始终可读,写卡必须通过密码校验,3字节可编程密码,密码错误计数值为3,可对卡片前32字节写保护制作标准:ISO 7816应用范围:医疗保险、数据存储、网吧收费、高速公路收费、电子钱包15、CPU卡存储容量:8K、16K、32K等特点:自带芯片操作系统(COS),安全性能高,可自定义卡片文件结构、容量大、速度快、支持一卡多用。
UC-2100-W SeriesArm-based wireless-enabled palm-sized industrial computerFeatures and Benefits•Armv7Cortex-A81000MHz processor•Integrated LTE Cat.M1/NB1module with global band support•Dual-SIM slots•Moxa Industrial Linux with10-year long-term support•Dual auto-sensing Ethernet ports(10/100Mbps and10/100/1000Mbps)•Dual CAN ports with industrial CAN2.0A/B protocol supported•microSD socket for storage expansion•Programmable LEDs and a programmable button for easy installation andmaintenance•-40to75°C operating temperature rangeCertificationsIntroductionThe UC-2100-W Series computing platform is designed for embedded data acquisition and processing applications.The computer comes with up to two software selectable RS-232/422/485full-signal serial ports and single or dual LAN ports.This palm-sized series of Arm-based computing platforms includes a variety of models for a wide range of interface requirements,such as serial and LAN ports,and wireless connections.The versatile communication capabilities allow users to efficiently adapt the UC-2100-W Series for a variety of complex communications solutions running on a compact palm-sized computer.The UC-2100-W Series has a built-in Cortex-A8Arm-based processor that has been optimized for a variety of industrial solutions.With flexible interface options,this tiny embedded computer is a reliable and secure gateway for data acquisition and processing at field sites and is a useful communication platform for many other large-scale deployments.Models designed for wide-temperature applications are available for extreme environments such as those found in the Oil and Gas industry.Furthermore,all models use Moxa’s industrial-grade Linux platform,which provides optimized software features and superior long-term support.AppearanceUC-2114UC-2116SpecificationsComputerCPU Armv7Cortex-A81GHz DRAM512GB DDR3Storage Pre-installed8GB eMMCPre-installed OS Moxa Industrial Linux(Debian9,Kernel4.4)Computer InterfaceStorage Slot Micro SD Slot x1Ethernet Ports Auto-sensing10/100Mbps ports(RJ45connector)x1Auto-sensing10/100/1000Mbps ports(RJ45connector)x1Serial Ports RS-232/422/485ports x2,software-selectable(terminal block)CAN Ports CAN2.0A/B x2(5-pin terminal block)Cellular Antenna Connector SMA x1GPS Antenna Connector SMA x1Number of SIMs2SIM Format NanoConsole Port RS-232(TxD,RxD,GND),4-pin header output(115200,n,8,1)Buttons Reset buttonEthernet InterfaceMagnetic Isolation Protection 1.5kV(built-in)Serial InterfaceBaudrate50bps to921.6kbpsData Bits5,6,7,8Stop Bits1,1.5,2Parity None,Even,Odd,Space,MarkPull High/Low Resistor for RS-4851kilo-ohm,150kilo-ohmsESD Protection4kV,for all signalsFlow Control RTS/CTS,XON/XOFF,ADDC®(automatic data direction control)for RS-485,RTSToggle(RS-232only)Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDCAN InterfaceIndustrial Protocols CAN2.0A,CAN2.0BBaudrate10to1000kbpsSignals GND,CAN_L,CAN_SHLD,CAN_H,CAN_V+Isolation2kV(built-in)Cellular InterfaceBand Options LTE Bands:Band1(2100MHz)/Band2(1900MHz)/Band3(1800MHz)/Band4(1700MHz)/Band5(850MHz)/Band8(900MHz)/Band12(700MHz)/Band13(700MHz)/Band18(850MHz)/Band19(850MHz)/Band20(800MHz)/Band25(1900MHz)/Band26(850MHz)/Band28(700MHz)Carrier Approval:Verizon,AT&TLED IndicatorsSystem Power x1Programmable x1LAN2per port(10/100Mbps)Serial2per port(Tx,Rx)Wireless Signal Strength3CAN2per port(Tx,Rx)Power ParametersInput Voltage9to48VDCPower Consumption 5.8WInput Current0.6A@9VDC,0.12A@48VDCReliabilityAlert Tools External RTC(real-time clock)Automatic Reboot Trigger External WDT(watchdog timer)Physical CharacteristicsHousing MetalDimensions(with ears)111x99x34.5mm(4.37x3.90x1.36in)Weight396g(0.87lb)Installation Wall-mounting,DIN-rail mounting(with optional kit)Environmental LimitsOperating Temperature-40to75°C(-40to167°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsSafety EN62368-1,UL62368-1EMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:4kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:3V/mIEC61000-4-4EFT:Power:1kV;Signal:0.5kVIEC61000-4-5Surge:Power:0.5kV;Signal:1kVIEC61000-4-6CS:3VIEC61000-4-8PFMFShock IEC60068-2-27Vibration2Grms@IEC60068-2-64,random wave,5-500Hz,1hr per axis(without any USBdevices attached)Hazardous Locations Class I Division2,ATEX,IECEx1Green Product RoHS,CRoHS,WEEEMTBFTime UC-2114-T-LX:533,149hrsUC-2116-T-LX:496,650hrsStandards Telcordia(Bellcore)StandardWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x UC-2100-W Series computerInstallation Kit1x power jackCable1x console cableDocumentation1x quick installation guide1x warranty card1.Class1Division2,ATEX,and IECEx certifications are underway.Please contact a Moxa sales representative for details.DimensionsUC-2114UC-2116Ordering InformationModel Name CPU RAM Storage Serial Ethernet CAN Cellular GPS Operating Temp.UC-2114-T-LX 1000MHz512MB8GB22(1Giga LAN)2BN-IoT/Cat.M1–-40to75°CUC-2116-T-LX 1000MHz512MB8GB22(1Giga LAN)2BN-IoT/Cat.M1Yes-40to75°CAccessories(sold separately)Power AdaptersPWR-24270-DT-S1Power adapter,input voltage90to264VAC,output voltage24V with2.5A DC load Power CordsPWC-C7US-2B-183Power cord with United States(US)plug,10A/125V,1.83mPWC-C7EU-2B-183Power cord with Continental Europe(EU)plug,2.5A/250V,1.83mPWC-C7UK-2B-183Power cord with United Kingdom(UK)plug,2.5A/250V,1.83mPWC-C7AU-2B-183Power cord with Australian(AU)plug,2.5A/250V,1.83mPWC-C7CN-2B-183Power cord with two-prong China(CN)plug,1.83mCablesCBL-F9DPF1x4-BK-100Console cable with4-pin connector,1mAntennasANT-LTEUS-ASM-01GSM/GPRS/EDGE/UMTS/HSPA/LTE,omni-directional rubber duck antenna,1dBiANT-GPS-OSM-05-3M BK Active GPS antenna,26dBi,1572MHz,L1band antenna for GPSANT-LTE-ASM-04BK LTE Stick antenna that covers704-960/1710-2620MHz providing omnidirectional radiation with a gainof4.5dBi.ANT-LTE-OSM-06-3m BK MIMO Multi-band antenna that covers700-2700/2400-2500/5150-5850MHz frequencies.Screw-fastenedmounting and full IP67waterproofing are available.ANT-LTE-OSM-03-3m BK Multi-band antenna that covers700-2700MHz.Specially designed for2G,3G,and4G applications.Magnetic mounting is availableANT-LTE-ASM-05BK LTE stick antenna that covers704-960/1710-2620MHz with a gain of5dBi.DIN-Rail Mounting KitsDK35A DIN-rail mounting brackets x2,screws x4©Moxa Inc.All rights reserved.Updated Nov05,2019.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
ICC UNIFORM CUSTOMS AND PRACTICE FOR DOCUMENTARYCREDITSUCP 600英文FOREWORD (4)INTRODUCTION (6)ARTICLE 1 APPLICATION OF UCP (12)ARTICLE 2 DEFINITIONS (13)ARTICLE 3 INTERPRETATIONS (15)ARTICLE 4 CREDITS V。
CONTRACTS (17)ARTICLE 5 DOCUMENTS V。
GOODS, SERVICES OR PERFORMANCE (17)ARTICLE 6 AV AILABILITY,EXPIRY DATE AND PLACE FOR PRESENTATION (18)ARTICLE 7 ISSUING BANK UNDERTAKING (18)ARTICLE 8 CONFIRMING BANK UNDERTAKING (20)ARTICLE 9 ADVISING OF CREDITS AND AMENDMENTS (22)ARTICLE 10 AMENDMENTS (23)ARTICLE 11 TELETRANSMITTED AND PRE—ADVISED CREDITS AND AMENDMENTS (24)ARTICLE 12 NOMINATION (25)ARTICLE 13 BANK-TO—BANK REIMBURSEMENT ARRANGEMENTS (26)ARTICLE 14 STANDARD FOR EXAMINATION OF DOCUMENTS (27)ARTICLE 15 COMPLYING PRESENTATION (30)ARTICLE 16 DISCREPANT DOCUMENTS, W AIVER AND NOTICE (31)ARTICLE 17 ORIGINAL DOCUMENTS AND COPIES (33)ARTICLE 18 COMMERCIAL INVOICE (34)ARTICLE 19 TRANSPORT DOCUMENT COVERING AT LEAST TWO DIFFERENT MODES OF TRANSPORT (35)ARTICLE 20 BILL OF LADING (37)ARTICLE 21 NON-NEGOTIABLE SEA W AYBILL (40)ARTICLE 22 CHARTER PARTY BILL OF LADING (43)ARTICLE 23 AIR TRANSPORT DOCUMENT (44)ARTICLE 24 ROAD,RAIL OR INLAND W ATERWAY TRANSPORT DOCUMENTS (46)ARTICLE 25 COURIER RECEIPT, POST RECEIPT OR CERTIFICATE OF POSTING (48)ARTICL E 26 "ON DECK", ”SHI PPER'S LOAD AND COUN T”,“SAID BY SHIPPER TO CONTAIN”AND CHARGES ADDITIONAL TO FREIGHT (49)ARTICLE 27 CLEAN TRANSPORT DOCUMENT (50)ARTICLE 28 INSURANCE DOCUMENT AND COVERAGE (50)ARTICLE 29 EXTENSION OF EXPIRY DATE OR LAST DAY FOR PRESENTATION (52)ARTICLE 30 TOLERANCE IN CREDIT AMOUNT,QUANTITY AND UNIT PRICES (53)ARTICLE 31 PARTIAL DRA WINGS OR SHIPMENTS (54)ARTICLE 32 INSTALMENT DRA WINGS OR SHIPMENTS (55)ARTICLE 33 HOURS OF PRESENTATION (55)ARTICLE 34 DISCLAIMER ON EFFECTIVENESS OF DOCUMENTS (55)ARTICLE 35 DISCLAIMER ON TRANSMISSION AND TRANSLATION (56)ARTICLE 36 FORCE MAJEURE (57)ARTICLE 37 DISCLAIMER FOR ACTS OF AN INSTRUCTED PARTY (57)ARTICLE 38 TRANSFERABLE CREDITS (58)ARTICLE 39 ASSIGNMENT OF PROCEEDS (62)UCP600中文版UCP600第一条UCP的适用范围 (62)第二条定义 (63)第三条解释 (64)第四条信用证与合同 (65)第五条单据与货物、服务或履约行为 (65)第六条兑用方式、截止日和交单地点 (65)第七条开证行责任 (66)第八条保兑行责任 (66)第九条信用证及其修改的通知 (67)第十条修改 (68)第十一条电讯传输的和预先通知的信用证和修改 (69)第十二条指定 (69)第十三条银行之间的偿付安排 (69)第十四条单据审核标准 (70)第十五条相符交单 (71)第十六条不符单据、放弃及通知 (72)第十七条正本单据及副本 (73)第十八条商业发票 (73)第十九条涵盖至少两种不同运输方式的运输单据 (74)第二十条提单 (75)第二十一条不可转让的海运单 (76)第二十二条租船合同提单 (78)第二十三条空运单据 (79)第二十四条公路、铁路或内陆水运单据 (80)第二十五条快递收据、邮政收据或投邮证明 (81)第二十六条“货装舱面”、“托运人装载和计数”、“内容据托运人报称”及运费之外的费用. (81)第二十七条清洁运输单据 (81)第二十八条保险单据及保险范围 (82)第二十九条截止日或最迟交单日的顺延 (83)第三十条信用证金额、数量与单价的伸缩度 (83)第三十一条部分支款或部分发运 (83)第三十二条分期支款或分期发运 (84)第三十三条交单时间 (84)第三十四条关于单据有效性的免责 (84)第三十五条关于信息传递和翻译的免责 (84)第三十六条不可抗力 (85)第三十七条关于被指示方行为的免责 (85)第三十八条可转让信用证 (86)第三十九条款项让渡 (88)FOREWORDThis revision of the Uniform Customs and Practice for Documentary Credits (commonly called “UCP”) is the sixth revision of the rules since they were first promulgated in 1933.It is the fruit of more than three years of work by the International Chamber of Commerce’s (ICC)Commission on Banking Technique and Practice。
COM90C66Data Sheet with Erratas forRev. B and Rev. D devices ARCNET® Controller/Transceiver withAT® Interface and On-Chip RAMFEATURES• ARCNET LAN Controller/Transceiver/ Support Logic/Dual-Port RAM• Integrates SMSC COM90C65 with 16-Bit Data Bus, Dual-Port RAM, and EnhancedDiagnostics Circuitry• Includes IBM® PC/AT® Bus Interface Circuitry• Supports 8- and 16-Bit Data Buses• Full 2K x 8 On-Chip Dual-Port Buffer RAM • Zero Wait State Arbitration for Most AT Buses• SMSC COM90C26 Software Compatible • Command Chaining Enhances Performance • Supports Memory Mapped and Sequential I/O Mapped Access to the Internal RAMBuffer • Compatible with the SMSC HYC9058/68/ 88 (COAX and Twisted Pair Drivers)• Token Passing Protocol with SelfReconfiguration Detection• Variable Data Length Packets• 16 Bits CRC Check/Generation• Includes Address Decoding Circuitry for On-Chip RAM, PROM and I/O• Supports up to 255 Nodes• Contains Software Accessible Node ID Register• Compatible with Various Topologies (Star, Tree, Bus, ...)• On-Board Crystal Oscillator and Reset Circuitry• Low Power CMOS, Single +5V SupplyGENERAL DESCRIPTIONThe SMSC COM90C66 is a special purpose communications controller for interconnecting processors and intelligent peripherals using the ARCNET Local Area Network. The COM90C66 is unique in that it integrates the core ARCNET logic found in Standard Microsystems' original COM90C26 and COM90C32 with an on-chip 2K x 8 RAM, as well as the 16-bit data bus interface for the IBM PC/AT. Because of the inclusion of the RAM buffer in the COM90C66, a complete ARCNET node can be implemented with only one or two additional ICs (8- or 16-bit applications, respectively) and a media driver circuit. The ARCNET core remains functionally untouched, eliminating validation and compatibility concerns. The enhancements exist in the integration and the performance of the device. Maximum integration has been achieved by including the 2K x 8 RAM buffer on the chip, providing the immediate benefits of a lower device pin count and less board components. The performance is enhanced in four ways: a 16-bit data bus for operation with the IBM PC/AT;a zero wait state arbitration mechanism, due partly to the integration of the RAM buffer on-chip; the ability of the device to do consecutive transmissions and receptions via the Command Chaining operation; and improved diagnostics, allowing the user to control the system more efficiently. For most AT compatibles, the device handles zero wait state transfers.ARCNET is a registered trademark of Datapoint Corporation IBM, AT, PC/AT and Micro Channel are registered trademarks ofInternational Business Machines Corporation1TABLE OF CONTENTS FEATURES (1)GENERAL DESCRIPTION (1)PIN CONFIGURATION (3)DESCRIPTION OF PIN FUNCTIONS (4)PROTOCOL DESCRIPTION (9)NETWORK PROTOCOL (9)NETWORK RECONFIGURATION (9)BROADCAST MESSAGES (10)EXTENDED TIMEOUT FUNCTION (10)LINE PROTOCOL (10)SYSTEM DESCRIPTION (12)MICROPROCESSOR INTERFACE (12)TRANSMISSION MEDIA INTERFACE (13)FUNCTIONAL DESCRIPTION (13)MICROSEQUENCER (13)ADDRESS DECODING (19)INTERNAL REGISTERS (22)INTERNAL RAM (29)SOFTWARE INTERFACE (29)SOFTWARE COMPATIBILITY CONSIDERATIONS (31)COMMAND CHAINING (32)RESET DETAILS (34)READ AND WRITE CYCLES (35)NODE ID LOGIC (43)TRANSMIT/RECEIVE LOGIC (43)IMPROVED DIAGNOSTICS (43)OSCILLATOR (45)OPERATIONAL DESCRIPTION (46)MAXIMUM GUARANTEED RATINGS (46)DC CHARACTERISTICS (46)TIMING DIAGRAMS (49)Please see Addendum 1 entitled Data Sheet Errata for Revision B COM90C66, which discusses changes to this data sheet which apply to the Revision B device, on Page 62.Please see Addendum 2 entitled Data Sheet Errata for Revision D COM90C66, which discusses changes to this data sheet which apply to the Revision D device, on Page 64.80 Arkay DriveHauppauge, NY 11788(516) 435-6000FAX (516) 273-31232For other machines, the IOCHRDY signal may be briefly negated to give the device the extra time necessary to support the faster machines. Aside from the implementation of a 16-bit data bus interface, the remaining bus interface logic is identical to that found in the SMSC COM90C65, which contains all the support logic circuitry.The ARCNET Local Area Network is a token passing network which operates at a 2.5 Mbps data rate. A token passing protocol provides predictable response times because each network event occurs within a known time interval. Throughput can be reliably predeter-mined based upon the number of nodes and their expected traffic.The COM90C66 establishes the network configuration and automatically reconfigures the token passing order as new nodes are added or deleted from the network.The COM90C66 performs address recognition, CRC checking and generation, packet acknowledgement, and other network management functions. The C0M90C66 interfaces directly to the IBM PC/AT or compatibles. The internal 2K x 8 RAM buffer is used to hold up to four data packets with a maximum length of 508 bytes each.DESCRIPTION OF PIN FUNCTIONSPLCCPIN SYMBOL DESCRIPTIONPROCESSOR INTERFACE75-84, 2-11Address 0-19A0-A19Input. These signals are connected to the address linesof the host processor and are used to access memoryand I/O locations of the COM90C66, as well as to accessthe external ROM through the COM90C66.13-20, 22-29Data 0-15D0-D15Input/Output. These signals are used by the host totransmit data to and from the internal registers and buffermemory of the COM90C66 and are connected to weakinternal pull-up resistors.63, 62nTransceiverDirectionControl nTOPL,nTOPHOutput. These active low signals control the data bustransceiver. When these signals are high, data gets sentfrom the PC to the COM90C66. When these signals arelow, data gets sent from the COM90C66 to the PC, orfrom the PROM to the PC if the PROM signal is also low.71I/O ChannelReady IOCHRDY Output. This signal, when low, is optionally used by the COM90C66 to extend host cycles. This is an open-drainsignal. An external pull-up resistor is typically providedby the system.12AddressEnable AEN Input. This signal, when low, acts as a qualifier for I/O Address Selection. When the signal is high, I/Odecoding is disabled. This signal has no effect onMemory Address Selection.74Address LatchEnable BALE Input. The falling edge of this signal is used by the COM90C66 to latch the A0-A19 lines and the nSBHEsignal via an internal transparent latch. This signal isconnected to a weak internal pull-up resistor.64nI/O Read nIOR Input. This active low signal is issued by the hostmicroprocessor to indicate an I/O Read operation. A lowlevel on this pin when the COM90C66 is accessedenables data from the internal registers of theCOM90C66.65nI/O Write nIOW Input. This active low signal is issued by the hostmicroprocessor to indicate an I/O Write operation. A lowpulse on this pin when the COM90C66 is accessedenables data from the Data Bus into the internal registersof the COM90C66.4DESCRIPTION OF PIN FUNCTIONSPLCCPIN SYMBOL DESCRIPTION 66nMemory Read nMEMR Input. This active low signal is issued by the hostmicroprocessor to indicate a Memory Read operation. Alow level on this pin when the COM90C66 is accessedenables data from the internal RAM of the COM90C66 orthe PROM onto the data bus to be read by the host.67nMemoryWrite nMEMW Input. This active low signal is issued by the host microprocessor to indicate a Memory Write operation. Alow pulse on this pin when the COM90C66 is accessedenables data from the data bus into the internal RAM ofthe COM90C66.52Reset In RESETIN Input. This active high signal is the power on reset signalfrom the host. It is used to activate the internal resetcircuitry within the COM90C66.53nROM Enable nENROM Input. This active low signal enables the decoding of theexternal PROM. This signal also affects the timing ofIOCHRDY and the number of address lines used todecode nMEMCS16. This signal is connected to a weakinternal pull-up resistor.54nROM Select nPROM Output. This active low signal is issued by theCOM90C66 to enable the external 8-bit wide PROM orthe external register of the COM90C66.30InterruptRequest INTR Output. This active high signal is generated by the COM90C66 when an enabled interrupt condition occurs.INTR returns to its inactive state when the interruptstatus condition or the corresponding interrupt mask bitis reset.72nZero WaitState n0WS Output. This active low signal is used to force zero wait state access cycles on the IBM PC Bus. This is an open-drain signal. An external pull-up resistor is typicallyprovided by the system.70nMemory16-Bit ChipSelect nMEMCS16Output. This active low signal is used to indicate that the present data transfer is a 16-bit memory cycle. TheCOM90C66 can be configured to use A19-A17 or A19-A11 to generate nMEMCS16. This is an open-drainsignal. An external pull-up resistor is typically providedby the system.5DESCRIPTION OF PIN FUNCTIONSPLCCPIN SYMBOL DESCRIPTION69nI/O 16-BitChip Select nIOCS16Output. This active low signal is used to indicate that the present data transfer is a 16-bit I/O cycle. A15-A2 areused to generate nIOCS16. This is an open-drain signal.An external pull-up resistor is typically provided by thesystem.73nSystem BusHigh Enable nSBHE Input. This active low signal is used to enable the COM90C66 to transfer data on D8-D15 of the Data Bus. TRANSMISSION MEDIA INTERFACE56, 55nPulse 2,nPulse 1nPULSE 2,nPULSE 1Output. These active low signals carry the transmit datainformation, encoded in pulse format, from theCOM90C66 to the LAN Driver.57Receive In RXIN Input. This signal carries the receive data informationfrom the LAN Driver to the COM90C66.MISCELLANEOUS51-47Memory BaseAddress Select MS0-MS4Input. These signals are generated by external switches.They are used by the memory decoder to select a blockof memory. These signals are connected to weakinternal pull-up resistors.46-44I/O BaseAddress Select IOS0-IOS2Input. These signals are generated by external switches.They are used by the I/O decoder to select a block of 16I/O locations. These signals are connected to weakinternal pull-up resistors.35-42Node ID Select NID0-NID7Input. These signals are generated by external switches.The Node ID code represents the node identification ofthis particular COM90C66. These signals are connectedto weak internal pull-up resistors.32nTransmitActivity LED nTXLED Output. This active low signal is used for direct connection to an LED through a resistor to V cc to indicatetransmit activity. This signal has 12mA sink capability.31nBoard SelectActivity LED nnBSLED Output. This active low signal is used for direct connection to an LED through a resistor to V cc to indicateboard activity. This signal has 12mA sink capability.6DESCRIPTION OF PIN FUNCTIONSPLCCPIN SYMBOL DESCRIPTION33, 34CrystalOscillator XTAL1,XTAL2An external parallel resonant 20 MHz crystal should beconnected to these pins. If an external 20 MHz TTL clockis used instead, it must be connected to XTAL1 with a390Ω pull-up resistor and XTAL2 should be left floating.59CA Clock CACLK Output. This is the start/stop CA clock and should be leftfloating for typical operation.58Clock CLK Output. This is a general purpose 5 MHz clock andshould be left floating for typical operation.1, 43Power Supply V cc+5 Volt Power Supply pin.21, 68Ground GND Ground pins.60-61No Connect NC Make no connection to these pins.7FIGURE 1 - COM90C66 OPERATION8PROTOCOL DESCRIPTIONNETWORK PROTOCOLCommunication on the network is based on a token passing protocol. Establishment of the network configuration and management of the network protocol are handled entirely by the COM90C66's internal microcoded sequencer. A processor or intelligent peripheral transmits data by simply loading a data packet and its destination ID into the RAM buffer and issuing a command to enable the transmitter. When the COM90C66 next receives the token, it verifies that the receiving node is ready by first transmitting a FREE BUFFER ENQUIRY message. If the receiving node transmits an ACKnowledge message, the data packet is transmitted followed by a 16-bit CRC. If the receiving node cannot accept the packet (typically its receiver is inhibited), it transmits a Negative AcKnowledgement message and the transmitter passes the token. Once it has been established that the receiving node can accept the packet and transmission is complete, the receiving node will verify the packet. If the packet is received successfully, the receiving node transmits an ACKnowledge message (or nothing if it is received unsuccessfully) allowing the transmitter to set the appropriate status bits to indicate successful or unsuccessful delivery of the packet. An interrupt mask permits the COM90C66 to generate an interrupt to the processor when selected status bits become true. Figure 1 is a flow chart illustrating the internal operation of the COM90C66.NETWORK RECONFIGURATIONA significant advantage of the COM90C66 is its ability to adapt to changes on the network. Whenever a new node is activated or deactivated, a NETWORK RECONFIGURATION is performed. When a new COM90C66 is turned on (creating a new active node on the network), or if the COM90C66 has not received an INVITATION TO TRANSMIT for 840 mS, or if a software reset occurs, the device causes aNETWORK RECONFIGURATION by sending a RECONFIGURE BURST consisting of eight marks and one space repeated 765 times. The purpose of this burst is to terminate all activity on the network. Since this burst is longer than any other type of transmission, the burst will interfere with the next INVITATION TO TRANSMIT, destroy the token and keep any other node from assuming control of the line.When any COM90C66 senses an idle line for greater than 82 µS, which will only occur when the token is lost, each COM90C66 starts an internal timeout equal to 146 µS times the quantity 255 minus its own ID. It also sets the internally-stored NID (next ID representing the next possible ID node) equal to its own ID. If the timeout expires with no line activity, the COM90C66 starts sending INVITATION TO TRANSMIT with the Destination ID (DID) equal to the currently-stored NID. Within a given network, only one COM90C66 will timeout (the one with the highest ID number). After sending the INVITATION TO TRANSMIT, the COM90C66 waits for activity on the line. If there is no activity for 74.7µS, the COM90C66 increments the NID value and transmits another INVITATION TO TRANSMIT using the NID equal to the DID. If activity appears before the 74.7µS timeout expires, the COM90C66 releases control of the line. During NETWORK RECONFIGURATION, INVITATIONS TO TRANSMIT will be sent to all 256 possible IDs. Each COM90C66 on the network will finally have saved a NID value equal to the ID of the COM90C66 that it released control to. At this point, control is passed directly from one node to the next with no wasted INVITATIONS TO TRANSMIT being sent to IDs not on the network until the next NETWORK RECONFIGURATION occurs. When a node is powered off, the previous node will attempt to pass it the token by issuing an INVITATION TO TRANSMIT. Since this node will not respond, the previous node will timeout and transmit another INVITATION TO TRANSMIT to an incremented ID and eventually a response will be received.9The time required to do a NETWORK RECONFIGURATION depends on the number of nodes in the network, the propagation delay between nodes, and the highest ID number on the network, but will be in the range of 24 to 61 mS.BROADCAST MESSAGESBroadcasting gives a particular node the ability to transmit a data packet to all nodes on the network simultaneously. ID zero is reserved for this feature and no node on the network can be assigned ID zero. To broadcast a message, the transmitting node's processor simply loads the RAM buffer with the data packet and sets the DID equal to zero. Figure 9 illustrates the position of each byte in the packet with the DID residing at address 01 HEX of the current page selected in the TRANSMIT command. Each individual node has the ability to ignore broadcast messages by setting the most significant bit of the ENABLE RECEIVE TO PAGE nn command (see Table 7) to logic "0".EXTENDED TIMEOUT FUNCTIONThere are three timeouts associated with the COM90C66 operation:Response TimeThe Response Time is equal to the round trip propagation delay between the two furthest nodes on the network plus the maximum turn around time (the time it takes a particular COM90C66 to start sending a message in response to a received message), which is approximately 12.7 µS. The round trip propagation delay is a function of the transmission media and network topology. For a typical system using RG62 coax in a baseband system, a one-way cable propagation delay of 31µS translates to a distance of about four miles. The flow chart in Figure 1 uses a value of 74.7µS (31 + 31 + 12.7) to determine if any node will respond.Idle TimeThe Idle Time is associated with a NETWORK RECONFIGURATION. Figure 1 illustrates that during a NETWORK RECONFIGURATION, one node will continually transmit INVITATIONS TO TRANSMIT until it encounters an active node.Every other node on the network must distinguish between this operation and an entirely idle line.During NETWORK RECONFIGURATION, activity will appear on the line every 82 µS. This82 µS is equal to the Response Time of 74.7 µSplus the time it takes the COM90C66 to retransmit another message (usually another INVITATION TO TRANSMIT).Reconfiguration TimeIf any node does not receive the token within the Reconfiguration Time, the node will initiate a NETWORK RECONFIGURATION.The ET2 and ET1 bits (bits 3 and 4 of the Configuration Register) allow the network to operate over longer distances than the four miles stated earlier. The logic levels on these bits control the maximum distances over which the COM90C66 can operate by controlling the three timeout values described above. See the description of the ET1 and ET2 bits, found in Table 8, for the table containing the combinations of these bits. It should be noted that for proper network operation, all COM90C66s connected to the same network must have the same Response Time, Idle Time, and Reconfiguration Time.LINE PROTOCOLThe ARCNET line protocol can be described as isochronous because each byte is preceded by a start interval and ended with a stop interval.Unlike asynchronous protocols, there is a constant amount of time separating each data byte. Each byte takes up exactly 11 clock intervals with a single clock interval being 400 nS in duration. As a result, one byte is10transmitted every 4.4 µS and the time to transmit a message can be precisely determined. The line idles in a spacing (logic "0") condition. A logic "0" is defined as no line activity and a logic "1" is defined as a negative pulse of 200 nS duration.A transmission starts with an ALERT BURST consisting of six unit intervals of mark (logic "1"). Eight-bit data characters are then sent with each character preceded by two unit intervals of mark and one unit interval of space. Five types of transmission can be performed as described below:Invitations To TransmitAn Invitation To Transmit is used to pass the token from one node to another and is sent by the following sequence:• An ALERT BURST• An EOT (End Of Transmission--ASCII code04 HEX)• Two (repeated) DID (Destination IDentification) charactersALERTBURST EOT DID DIDFree Buffer EnquiriesA Free Buffer Enquiry is used to ask another node if it is able to accept a packet of data and is sent by the following sequence:• An ALERT BURST• An ENQ (ENQuiry--ASCII code 85 HEX)• Two (repeated) DID (Destination IDentification) charactersData PacketsA Data Packet consists of the actual data being sent to another node and is sent by the following sequence:• An ALERT BURST• An SOH (Start Of Header--ASCII code 01 HEX)• An SID (Source IDentification) character • Two (repeated) DID (Destination IDentification) characters• A single COUNT character which is the 2's complement of the number of data bytes to follow if a short packet is being sent or 00 HEX followed by a COUNT character which is the 2's complement of the number of data bytes to follow if a long packet is being sent • N data bytes where COUNT = 256-N (or 512-N for a long packet)• Two CRC (Cyclic Redundancy Check) characters. The CRC polynomial used is X16 + X15 + X2 + 1.ALERTBURST ENQ DIDDID11AcknowledgementsAn Acknowledgement is used to acknowledge reception of a packet or as an affirmative response to FREE BUFFER ENQUIRIES and is sent by the following sequence:• An ALERT BURST• An ACK (ACKnowledgement--ASCII code86 HEX) character Negative AcknowledgementsA Negative Acknowledgement is used as a negative response to FREE BUFFER ENQUIRIES and is sent by the following sequence:• An ALERT BURST• A NAK (Negative AcKnowledgement--ASCII code 15 HEX) characterSYSTEM DESCRIPTIONThe System Block Diagram shown in Figure 2 illustrates a typical implementation of an ARCNET node using the COM90C66. The only external components required to complete an ARCNET node design are one or two bus transceivers (for 8-bit or 16-bit applications, respectively) and the LAN Driver, making the COM90C66 the most highly-integrated ARCNET solution. The COM90C66 provides for simple interfacing to both sides of the ARCNET system, namely the microprocessor and the transmission media.MICROPROCESSOR INTERFACEThe left half of Figure 2 illustrates a typical COM90C66 interface to the PC. The sections outlined in dotted lines represent the portion which distinguishes the 16-bit interface, while the remaining interface exists for both 8-bit and 16-bit applications. The interface consists of a 20-bit address bus, a 16-bit data bus and a control bus. All accesses to the internal RAM, the optional PROM and the internal registers are controlled by the COM90C66.The microprocessor's address lines are directly connected to the COM90C66. The address decoding circuitry of the COM90C66 monitors the address bus to determine valid accesses to the device.Figure 2 shows octal bus transceivers utilized as the interface between the microprocessor's data lines and the COM90C66. The transceivers are only necessary when interfacing to a high current drive data bus such as the IBM PC data bus, and may otherwise be omitted. The COM90C66 provides the nTOPL and nTOPH signals which control the direction of the external transceiver(s). The nTOPL signal is also activated during PROM Read Cycles.The microprocessor's control bus is directly connected to the COM90C66 and is used in access cycle communication between the device and the microprocessor. All accesses support zero wait state arbitration in most machines. The Control Bus has been optimized to support the intricacies of the IBM AT Bus and the EISA Bus.ALERTBURST ACK ALERTBURST NAK12TRANSMISSION MEDIA INTERFACEThe right half of Figure 2 illustrates the COM90C66 interface to the transmission media used to connect the node to the network. The HYC9058/68/88 may be used to drive the media. During transmission, the COM90C66 transmits a logic "1" by generating two 100 nS non-overlapping negative pulses, nPULSE1 and nPULSE2. These signals are sent to the LAN Driver, which in turn creates a 200 nS dipulse signal on the media. A logic "0" is transmitted by the absence of the two negative pulses, that is, the nPULSE1 and nPULSE2 outputs remain high, therefore there is an absence of a dipulse. During reception the 200 nS dipulse appearing on the media is coupled through the RF transformer of the LAN Driver. A positive pulse at the RXIN pin of the COM90C66 is interpreted as a logic "1". Again, if no dipulse is present, the COM90C66 interprets a logic "0".Typically, RXIN pulse occur at multiples of 400 nS. The COM90C66 can tolerate distortion of plus or minus 100 nS and still correctly capture the RXIN pulses.During Reset, the transmitter portion of the COM90C66 is disabled and the nPULSE1 and nPULSE2 pins are inactive high.The COM90C66 includes the nTXLED and nBSLED signals which, when tied to LEDs, provide indication of transmit and board access activity. In addition, it is possible for the user to completely disable the transmitter through software. These two unique features represent two of the improvements made in the diagnostics of the device. Please see the Improved Diagnostics section of this document for further detail.FUNCTIONAL DESCRIPTIONMICROSEQUENCERThe COM90C66 contains an internal microsequencer which performs all of the control operation necessary to carry out the ARCNET protocol. It consists of a clock generator, a 554 x 8 ROM, a program counter, two instruction registers, an instruction decoder, a no-op generator, jump logic, and reconfiguration logic.The COM90C66 derives a 5 MHz and a 2.5 MHz clock from the external crystal. These clocks provide the rate at which the instructions are executed within the COM90C66. The 5 MHz clock is the rate at which the program counter operates, while the 2.5 MHz clock is the rate at which the instructions are executed. The microprogram is stored in the ROM and theinstructions are fetched and then placed into the instruction registers. One register holds the op code, while the other holds the immediate data.Once the instruction is fetched, it is decoded by the internal instruction decoder, at which point the COM90C66 proceeds to execute the instruction. When a no-op instruction is encountered, the microsequencer enters a timed loop, in which case the program counter is temporarily stopped until the loop is complete.When a jump instruction is encountered, the program counter is loaded with the jump address from the ROM. The COM90C66 contains an internal reconfiguration timer which interrupts the microsequencer if it has timed out.At this point the program counter is cleared, after which the MYRECON bit of the Diagnostic Status Register is set.13FIGURE 2 - SYSTEM BLOCK DIAGRAM14FIGURE 3 - INTERNAL BLOCK DIAGRAM15FIGURE 4 – MEMORY SELECTORFIGURE 5 – PROM SELECTORFIGURE 6 – I/O SELECTOR16FIGURE 9 – RAM BUFFER PACKET CONFIGURATION17Table 1 – User Configuration of Memory Map18ADDRESS DECODINGThe COM90C66 includes address decoding circuitry that compares the value of the Address Bus to the address range selected by the Memory Select (MS0-MS4) and I/O Select (IOS0-IOS2) pins in order to determine processor accesses to the on-board PROM, the on-chip RAM, and I/O locations. By placing switches on the MS0-MS4 and the IOS0-IOS2 pins, the user configures the Memory Map and I/O Map according to the possible address ranges shown in Tables 1 and 2.Table 2 - User Configuration of I/O Map IOS2I0S1IOS0I/O ADDRESS RANGE 0000260-026F 0010290-029F 01002E0-02EF 01102F0-02FF 1000300-030F 1010350-035F 1100380-038F 11103E0-03EFMemory Address DecodingThe Memory Address Decoding circuitry is used to select a block from the memory map of the processor for PROM and RAM accesses. Figure 4 illustrates how the memory selection works. The MS4-MS0 pins are decoded through a 5 to 9 Decoder to generate a 9-bit value. These nine bits are compared to the A19-A11 lines of the Address Bus in order to select a particular 16K memory segment. Figure 7 illustrates a 16K block of memory that has been selected by the MS4-MS0 pins. The PROM occupies the upper 8K area of the selected 16K segment and is accessed when A13 = 1. The RAM occupies one of four selectable 2K areas of the selected 16K segment and is accessed when A13 = 0. A11 and A12 are used to determine which 2K segment of the lower 8K area will be used for the RAM buffer.Figure 5 illustrates how the external PROM selection works. The MS4-MS0 pins aredecoded through a 5 to 7 Decoder to generate a 7-bit value. These seven bits are compared to the A19-A13 lines of the Address Bus in order to select an 8K memory range. Figure 7 illustrates an 8K block of memory for the PROM. In I/O 16K x 8 Mode only a 16K memory range is selected for the PROM. Figure 8 illustrates a 16K block of memory for the PROM.The nENROM pin is used to enable decoding for the on-board PROM. If nENROM is connected to a logic "1", the COM90C66 will not generate the nPROM signal, the nTOPL signal, or the IOCHRDY signal for accesses to the PROM. In this configuration, the COM90C66 will only occupy a 2K segment of memory.I/O Address DecodingThis section is used to select a block of 16 I/O locations from the I/O map of the processor.Figure 6 illustrates how the I/O selection19。
Features:• Vcc operation voltage : 1.5 V~ 3.6V • Low power consumption :15mA (Max.) operating current 1uA (Typ.) CMOS standby current• High Speed Access time :70ns (Max.) at Vcc = 1.5V• Automatic power down when chip is deselected • Three state outputs and TTL compatible• Data retention supply voltage as low as 1.2V • Easy expansion with CE\ and OE\ optionsDescriptionThe UC62LV2048 is a high performance, low power CMOS Static Random Access Memory organized as 131,072 words by 16 and operates from 1.5 V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 1uA and maximum access time of 70ns in 1.5V operation.Easy memory expansion is provided enable (CE\), and active LOW output enable (OE\) and three-state output drivers.The UC62LV2048 has an automatic power down feature, reducing the power consumption significantly when chip is deselected.The US62LV2048 is available in the JEDEC standard 44 pin TSOP (Type II) and 48 ball BGA(6*8mm).PRODUCT FAMILYPower ConsumptionSpeed(ns)STANDBY Operating Product FamilyOperating TempatureVcc RangeVcc=1.5V(Max.)Vcc=3.3V(Typ.)Vcc=3.6V(Max.)PackageTypeUC62LV2048JC TSOPII-44 UC62LV2048KC BGA-48 UC62LV2048AC 0 ~ 70JJ 1.5V ~ 3.6V 55/701uA15mADICE UC62LV2048JI TSOPII-44 UC62LV2048KIBGA-48 UC62LV2048AI-40 ~ J 85¢J 1.5V ~ 3.6V 55/70 1uA 15mADICEPIN CONFIGURATIONSBLOCK DIAGRAMPIN DESCRIPTIONName TypeFunctionA0 – A16 Input Address inputs for selecting one of the 131,072 x 16 bit words in the RAM CE\ InputCE\ is active LOW. Chip enable must be active when data read from or write to the device. If chipenable is not active, the device is deselected and not in a standby power down mode. The DQpins will be in high impedance state when the device is deselected.WE\ InputThe Write enable input is active LOW and controls read and write operations. With the chipselected, when WE\ is HIGH and OE\ is LOW, output data will be present on the DQ pins, whenWE\ is LOW, the data present on the DQ pins will be written into the selected memory location.OE\ InputThe output enable input is active LOW. If the output enable is active while the chip is selectedand the write enable is inactive, data will be present on the DQ pins and they will be enabled.The DQ pins will be in the high impedance state when OE\ is inactive.UB\ and LB\ Input Lower byte and upper byte data input/output control pins.DQ0 – DQ15 I/O These 16 bi-directional ports are used to read data from or write data into the RAM.Vcc PowerPower SupplyGnd PowerGroundTRUTH TABLEMode WE\ CE\ OE\ LB\ UB\ I/O 0 ~ 7 I/O 8 ~ 15 Vcc Current Not Selected X H X X X High Z High Z I SB,I SB1H L H X XOutput DisabledX L X H HHigh Z High Z I CCH L L L H D OUT HighZH L L H L HighZ D OUTReadH L L L L D OUT D OUTI CCL L X L H D IN HighZL L X H L HighZ D INWriteL L X L L D IN D INI CCABSOLUTE MAXIMUM RATINGS(1)SYMBOL PARAMETER RATING UNITV TERM Terminal Voltage withRespect to GND-0.5 to V CC+0.5VT BIAS Temperature Under Bias -40 to 125 JT STG Storage Temperature -50 to 150 JPT PowerDissipation 0.5 WI OUT DC Output Current 10 mA1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OPERATING RANGERANGE AMBIENTTEMPERATUREV CC Commercial 0¢J to 70¢J 1.5V ~ 3.6V Industrial -40¢J to 85¢J 1.5V ~ 3.6VCAPACITANCE(1)(TA=25¢J,f=1.0MHz) SYMBOLPARAMETERCONDITIONS MAX. UNIT CINInputCapacitanceVIN=0V 6 pF CDQInput/OutputCapacitanceVDQ 8 pF 1. This parameter is guaranteed and not 100% tested.Low Power CMOS SRAM 128K X 16 UC62LV2048 -55/-70DC ELECTRICAL CHARACTERISTICS (TA=0¢J to 70¢J)Symbol Comment Test Condition MIN. TYP.(1) MAX. UNITSV IL Guaranteed Input LowVoltage(2)V CC=2.4V -0.5 - 0.8 VV IH Guaranteed Input HighVoltage(2)V CC=3.6V 2.0 - Vcc-0.2VI L Input Leakage Current V CC=MAX V IN=0V to V CC- - 1 uAI OL Output Leakage Current V CC=MAX CE\=V IH or OE\=V IHV IO=0V t V CC- - 1 uAV OL Output Low Voltage V CC=3.6V, I OL=2mA - - 0.4 V V OH Output High Voltage V CC=3.0V, I OH=-1mA 2.4 - - VI CC Operating Power SupplyCurrentCE\=V IL,I DQ=0mA, F=Fmax(3)- - 15mAI SB1TTL Standby Current CE\=V IH, V IN=V IH to V IL- - 1 mAI SB2CMOS Standby Current CE\¡V CC-0.2V, V IN=V CC-0.2Vor 0.2V , F=0(4)- 1 5 uA1. Typical characteristics are at TA = 25o C.2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included.3. Fmax = 1/tRC .4. F=0 means input signals must be keep in static state.DATA RETENTION CHARACTERISTICS ( TA=0¢J to 70¢J)Symbol Comment TestCondition MIN. TYP.(1) MAX. UNITSV DR VCC to Data Retention CE\¡V CC - 0.2VV IN V CC-0.2V or V IN0.2V1.2 - - VI CCDR Data Retention Current CE\¡V CC - 0.2VV IN V CC-0.2V or V IN0.2V- 0.05 0.5 uAt DR Chip Deselect to DataRetention Time0 - - nst R Operation Recovery Time See Retention WaveformT RC(2) - - ns1. V CC = 1.5V, TA = 25¢J.2. t RC = Read Cycle TimeLOW VCC DATA RETENTION WAVEFORM(1) (CE\ Controlled) VccCEAC TEST CONDITIONSInput Pulse LevelsInput Rise and Fall TimesInput and Output Timing Reference LevelVCC to 0V1 V/ns 0.5V CCAC TEST LOADS AND WAVEFORMS3.3V1269Ω1404ΩJIG AND SCOPEFIGURE 1A3.3V1269Ω1404ΩJIG AND SCOPEFIGURE 1BTERMINAL EQUIVALENTOUTPUTGNDV CCALL INPUT PULSESAC ELECTRICAL CHARACTERISTICS (TA=0¢J to 70¢J , V CC =1.5V~3.6V)READ CYCLEUC62LV2048-55 UC62LV2048-70JEDEC PARAMETERNAMEPARAMETERNAMEDESCRIPTIONMin TypMax Min Typ MaxUNITt AVAX t RC Read Cycle Time 55- - 70 - - nst AVQV t AA Address Access Time - - 55 - - 70ns t ELQV t CE Chip Select Access Time - - 55 - - 70ns t BA t BA Data Byte Control Access Time 30 35ns t GLQV t OE Output Enable to Output Valid - - 30 - - 35ns t ELQX t CLZ Chip Select to Output Low Z 10- - 10 - - ns t GLQX t OLZ Output Enable to Output Low Z 5 - - 5 - - ns t BE t BE Data Byte Control To Output Low Z 10 10 ns t EHQZ t CHZ Chip Deselect to Output in High Z - - 20 - - 20ns t GHQZ t OHZ Output Disable to Output in High Z - - 20 - - 20ns t BDO t BDO Data Byte Control To Output High Z - 20 - 20ns t AXOXt OHAddress Chang to Output Change10--10--nsSWITCHING WAVEFORMS (READ CYCLE)READ CYCLE1 (1,2,4)ADDRESSD OUTREAD CYCLE2 (1,3,4)CED OUTREAD CYCLE3(1,4)ADDRESSCED OUTOEUB/LBNOTES: 1. WE\ is high in read cycle.2. Device is continuously selected when CE\ = VIL3. Address valid prior to or coincident with CE\ transition low.4. OE\ = VIL.5.Transition is measured ±500mV from steady state with CL=5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested.AC ELECTRICAL CHARACTERISTICS (TA=0¢J to 70¢J , VCC=1.5V~3.6V)WRITE CYCLEUC62LV2048-55 UC62LV2048-70JEDEC PARAMETERNAMEPARAMETERNAMEDESCRIPTIONMin Typ Max Min Typ Max UNITt AVAX t WC Write Cycle Time55- - 70 - - ns t E1LWH t CW Chip Select to END of Write 40--50--nst AVWL t AS Address Setup Time 0 - - 0 - - ns t AVWH t AW Address valid to End of Write 40- - 50 - - ns t BW t BW Data Byte Control End of Write 40 50 Ns t WLWH t WP Write Pulse Width40--50--nst WHAX t WR Write Recovery Time 0 - - 0 - - ns t WLOZ t WHZ Write to Output in High Z - - 20 - - 20ns t DVWH t DW Data to Write Time Overlap 35- 40 - ns t WHDX t DH Data Hold Time for Write End 0 - - 0 - - ns t GHOZ t OHZ Output Disable to Output In High Z - - 20 - - 20ns t WHQXt OWEnd of Write to Output Active10--10--nsSWITCHING WAVEFORMS (WRITE CYCLE)WRITECYCLE1(1)ADDRESSWED OUTOECED INUB/LBWRITE CYCLE2(1,6)ADDRESSCEWEDOUTDINNOTES:1. WE\ must be high during address transitions.2. The internal write time of the memory is defined by the overlap of CE\ and WE\ low. All signalsmust be active to initiate a write and any one can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write.3. T WR is measured from the earlier of CE\ or WE\ going high at the end of write cycle.4. During this period, DQ pins are in the output state so that the input signals of opposite phase tothe outputs must not be applied.5. If the CE\ low transition occurs simultaneously with the WE\ low transitions or after the WE\transition, output remain in a high impedance state.6. OE\ is continuously low (OE\ = V IL).7. D OUT is the same phase of write data of this write cycle.8. D OUT is the read data of next address.9. If CE\ is low during this period, DQ pins are in the output state. Then the data input signals ofopposite phase to the outputs must not be applied to them.10. Transition is measured 500mV from steady state with C L = 5pF as shown in Figure 1B. Theparameter is guaranteed but not 100% tested.11. TCW is measured from the later of CE going low to the end of write.ORDERING INFORMATIONUC62LV2048 AB -- YYA => GRADEmil-400J :44pinTSOP(II)6*8mm-BGAK :48BallA :DICE=>GRADEB70¢J)~(0C :COMMERCIAL85¢J)~(-40I :INDUSTRIAL=>SPEEDYY55ns55:70ns70:PACKAGE DIMENSIONSSECTION A-AFig. A48 M ini-B G A 6*8m m。