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DSO5012A + FREE PROBE N2863A DSO5052A + FREE PROBE N2863AAgilent 5000 SeriesPortable OscilloscopeData SheetThe Next Generation ofPortable Oscilloscopes2• 100 MHz, 300 MHz, and500-MHz bandwidths• 2 or 4 channels• MegaZoom III memory anddisplay technology • Up to 1-Mpts acquisition memory (page 4)• Up to 100,000 waveforms per second real-time update rate (page 5)• High-definition XGA (1024 x 768) display with 256 levels of intensity grading• Up to 12 bits of vertical resolution,even in single-shot acquisitions (page 7)• Complete connectivity – standard(page 6)• USB (3 ports)• LAN • GPIB• XGA display out• Full remote control, including web browser • LXI- compliant• Manuals and in-scope helplocalized in 11 languages• Secure environment optionThe new standard for the everyday scopeTraditional bench scopes are great for charac-terizing things that you know about. Agilent’sMegaZoom III deep memory and fast update ratehelp you find the bugs that you don’t know about.If you haven’t purchased an Agilent oscilloscope lately, why should you consider one now?Leading-edge technology for all scope usersThe 5000 Series oscilloscopes leverage the same third generation MegaZoom III technology blocks used in our higher performance benchand lab oscilloscopes – responsive deep memory, fast update rates with minimal “dead time”, and analog-like display systems – and deliver them in a compact package, at a price similar to oscilloscopes with older technology blocks.Industry-leading customer supportAs the world’s leading Test andMeasurement vendor, Agilentmaintains the largest network of salesengineers, application engineers,support engineers and technicians.From pre-sales collaboration, tocalibration, to training and consulting,to repair and servicing, Agilent standswith you throughout the life of yourproduct. It’s no accident that Agilenthas such loyal customers.Don’t take our word for itCompare the 5000 series with yourcurrent bench scope. Or compare itto one of our competitors’ newestscopes. You’ll see why Agilent hasbeen the fastest-growing oscilloscopesupplier since 2001 (source: PrimeData 2005 Test Instrument IndustryService Market Share Analysis).3Why does deep memory matter?Inflection occurs atFigure 2.45Why does a fast update rate matter?This is a question that we hear frequently. If the human eye has trouble discerning above 30-50 frames per second, is there really a difference between 3,600 and 100,000 waveforms per second? If you know what you’re looking for the answer is probably “no”. However, if you are hunting for unknown signal anomolies or characterizing jitter, the answer is “yes”.Figure 3. Reducing the dead time between acquisitions …Figure 4. … improves your chances offinding random events like glitchesFigure 5. Update rates of popular oscilloscopes using their default real-time time acquisition modeCatch problems sooner and cover more of your debug checklist – our 100,000 waveform per second update rate helps you find intermittent problems more than 25x faster than comparable scopesIf you know that there is a glitch in your system , it’s easy to capture it using a pulse-width trigger. However, if you are just browsing through your design, your chances of finding a glitch increase as the update rate increases. If a glitch occurs during the “dead time” between sample, you miss it (Figure 3). With MegaZoom III technology, the dead time is much smaller (Figure 5). A scope with a slower update rate will capture the glitch eventually (if it recurs), but most engineers and technicians don’t have the time or patience to wait for their tools to catch up.If you are characterizing signal jitter , a fast update rate gives you accurate results sooner. And when the fast update rate is combined with the 5000 Series’ XGA high-definition display (1024 x 768, 256 intensity levels),subtle differences in these acquisitions become obvious.And like all other aspects of MegaZoom III technology, this is a real-time acquisition mode. It’s always fast, always on.Learn more about the benefits of a fast update rate by readingApplication Note 1551 - Improve Your Ability to Capture Elusive Events: Why Oscilloscope Waveform Update Rates are Important.ConnectivityOur customers tell us that oscilloscope connectivity is an increasingly important feature of their test instruments. That’s why the 5000 Series scopes come with the most comprehensive hardware and software connectivitity tools in their class. Hardware connectivityStandard ports include:• 2 x USB host ports (for external storage and printing devices), oneon the front and one on the rear• 1 x USB device port for high-speed PC connectivity• 10/100 Mbit LAN for Internet/ Intranet connectivity• GPIB to allow easy migration into existing test systems• XGA Out for external monitors and projectors LXI Class CLAN eXtensions for Instrumentation (LXI) is a standards-based architecture for test systems. By specifying the interaction of system components, LXI enables fast and efficient test system creation and reconfiguration. The 5000 Series oscilloscopes follow specified LAN protocols, and adhere to LXI requirements such as a built-in Web control server, IVI-COM driver, and easy-to-use SCPI commands. The standard Agilent I/O Library Suite makes it easy to configure and integrate instruments in your system.IntuiLink toolbarsIntuilLink gives you a quick way tomove screenshots and data intoMicrosoft® Word and Excel. Thesetoolbars can be installed from/find/intuilink.Scope View logic analyzer andoscilloscope correlationScope View enables simpletime-correlated measurementsbetween a 5000 Series oscilloscopeand an Agilent 1680/90 or 16800/900logic analyzer. Scope and logicwaveforms are integrated into a singlelogic analyzer waveform display foreasy viewing analysis – all with asimple point-to-point LAN connection.You can also cross-trigger theinstruments, automatically de-skewthe waveforms, and maintain markertracking between the instruments.Figure 6. Agilent Remote Front Panelrunning in a web browserFigure 7. OK, so the 5000 Series doesn’t have RS-232. But it does have just aboutany other connection you might need – standard.Figure 8. Combine best-in-classinstruments with a simple connection6Other nice featuresHigh resolution modeOffers up to 12 bits of veritcal resolution in real-time, single-shot mode. This is accomplished by serially filtering sequential data points and mapping the filtered results to the display when operating at base settings greater than 10-µs/div.Help is at your fingertipsAn embedded help system – available in 11 languages – gives you quick answers if you don’t understand a feature. Simply press and hold the corresponding front-panel key, and a screen pops up to explain its function (Figure 9).Waveform math with FFTAnalysis functions include subtract, multiply, integrate, and differentiate, as well as Fast Fourier Transforms (FFT). Peak detect250-ps on 500-MHz models, 500-ps on 300-MHz models and 1-ns on 100-MHz models helps you find narrow glitches.AutoProbe interfaceAutomatically sets probe attenuationfactors and provides power forselected Infiniium active probes,including the award-winning 1130A1.5-GHz InfiniiMax differential activeprobe and 1156A 1.5-GHz single-endedactive probe systems.5-digit hardware counterMeasures frequency up to thebandwidth of the scope.Trig OutProvides an easy way to synchronizeyour scope to other instruments.Use the Trig Out port to connect yourscope to a frequency counter for moreaccurate frequency measurements orto cross trigger other instruments.AutoscaleDisplays all active signals, andautomatically sets the vertical,horizontal and trigger controls.23 automatic measurementswith QuickMeasPressing [QuickMeas] brings up thelast four measurements selected.Cursors automatically track the mostrecently selected measurement.HDTV TriggerThe 5000 Series supports analogHDTV/EDTV triggering for standardslike 1080i, 1080p, 720p and 480p aswell as standard video triggering onany line within a field, all lines, allfields, odd or even fields for NTSC,SECAM, PAL and PAL-M video signals.Easy software upgradesSystem software is stored in FlashROM that can be upgraded from thescope’s built-in USB port or LAN.You can find the latest system andIntuiLink Data Capture software at/find/DSO5000sw. Figure 9. Press and hold a key forinstant helpFigure 10. FFT allows you to view thespectral content of this unfilteredsine wave7ProbingTo get the most out of your scope, you need the right probes and accessories for your application. That’s why Agilent Technologies offers a complete family of innovative passive and active probes for the 5000 Series scopesto get your job done easily. For more comprehensive information, referto the Agilent 6000 and 5000 Series Oscilloscope Probes and Accessories Data Sheet (Agilent publication number 5968-8153EN/ENUS) or visit /find/scope_probes.8Probing (continued)9OptionsOption SEC – Secure Environment ModeProvides compliance with National Industrial Security Program Operating Manual (NISPOM) Chapter 8 requirements, which allows you to move the instrument out of a secure area with confidence. Option SEC offers the highest level of security by ensuring that internal memory is clear of all setup and trace settings. When this option is installed, it will store setups and traces to internal volatile memory only. To permanently store data, you can save it to an external memory device via the oscilloscope’s front-panel USB port.E2690B Oscilloscope ToolsThe E2690B Oscilloscope’s Tools, licensed by Agilent Technologies from Amherst Systems Associates (ASA), are the most powerful suites of analysis, debug, collaboration and automation tools available for Agilent real-time oscilloscopes. These tools make it easy to perform in-depth analysis of captured signals. More information can be found in the Oscilloscope Tools data sheet (Agilent publication number 5989-3525EN).Figure 12. E2690B Oscilloscope Tools allows in-depth analysis of captured signals.10Performance characteristics111213141517Ordering informationOrdering information (continued)19/find/openAgilent Open simplifies the process of connecting and programming test systems to help engineers design, validate and manufacture electronic products. Agilent offers open connectivity for a broad range of system-ready instruments, open industry software, PC-standard I/O and global support, which are combined to more easily integrate test system development.Windows ® is a U.S. registered trademark of Microsoft Corporation.For more information on Agilent Technologies’ products, applications or services, please contact your local Agilent office. The complete list is available at:/find/contactus Phone or Fax United States:(tel) 800 829 4444(fax) 800 829 4433Canada:(tel) 877 894 4414(fax) 800 746 4866China:(tel) 800 810 0189(fax) 800 820 2816Europe:(tel) 31 20 547 2111Japan:(tel) (81) 426 56 7832(fax) (81) 426 56 7840Korea:(tel) (080) 769 0800(fax) (080) 769 0900Latin America:(tel) (305) 269 7500Taiwan:(tel) 0800 047 866 (fax) 0800 286 331Other Asia Pacific Countries:(tel) (65) 6375 8100 (fax) (65) 6755 0042Email:*****************Revised: February 5, 2007Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2007Printed in USA, March 7, 20075989-6110EN/find/emailupdates Get the latest information on the products and applications you select./find/agilentdirect Quickly choose and use your test equipment solutions with confidence.Agilent E m ail UpdatesAgilent DirectAgilent OpenRemove all doubtOur repair and calibration services will get your equipment back to you, performing like new, when promised. You will get full value out of your Agilent equipment throughout its lifetime. Your equipment will be serviced by Agilent-trained technicians using the latest factory calibration procedures, automated repair diagnostics and genuine parts. You will alwayshave the utmost confidence in your measurements.Agilent offers a wide range of additional expert test and measurement services for your equipment, including initial start-up assistance onsite education and training, as well as design, system integration, and project management. For more information on repair and calibration services, go to/find/removealldoubtDSO5012A + FREE PROBE N2863A DSO5052A + FREE PROBE N2863A。
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REVISION HISTORYDECLARATIONTABLE OF CONTENTS5.3. DC Electrical Characteristics2.6.Memory Subsystem&Touch G-SENSORSPI1_CLK UART3_RX42 DDR3_D743 VCC3_DRAM79 AGND80 VRPSDC0_CMD 111PF3PE9 CSI_D6LCD_D10 141PD10PC19 163 VCC4function 0);3)Type: signal directionPC7 Input PC8 InputPE4 Input PE5 InputSignal Name DescriptionOthersVRP Reference voltageV IH High-Level Input Voltage V IL Low-Level Input VoltageFigure 5-1. Power Up Sequence5.5.2.Power Up Reset Sequence RequirementsThe device has a system reset signal to reset the board. When asserted, the following steps give an example of power up reset sequence supported by the R8 device.•AVCC ,VDD_CPU and VCC_DRAM can be powered up simultaneously.•VDD_INT can be powered up after VDD_CPU is powered up, the time difference is T1ms.•VCC can be powered up after VDD_INT is powered up, the time difference is T2ms.Figure 5-2. Power Up Reset Sequence5.5.3.Resume Power Up Sequence from Super Standby ModeTo resume a power up sequence when the device is in Super Standby mode:•VCC_DRAM and AVCC remains powered up always.•VDD_CPU can be powered up firstly.•VDD_INT can be powered up after VDD_CPU is powered up, the time difference is T1ms.•VCC can be powered up after VDD_INT is powered up, the time difference is T2ms.Figure 5-3. Exit Super Standby and Resume Power Up Sequence5.5.4.Power Down Sequence RequirementsTo reduce power consumption,the R8 can be partially powered down.The section lists the power down requirements in each mode.In Super Standby mode,•VCC_DRAM and AVCC must be kept powered up.•VDD_CPU,VDD_INT and VCC are powered down simultaneously.•VCC voltage fall time is more longer than VDD_INT.VDD_CPUVDD_CPU6.PIN ASSIGNMENT6.2.PACKAGE DIMENSIONThe following diagram shows the package dimension of R8.。
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DN与英寸对照表-dn和英寸
DN与英寸是两种不同的长度单位,DN是法兰连接的标准尺寸,而英寸则是常用的长度单位。
下面是DN与英寸的对照表:
DN15对应1/2英寸
DN20对应3/4英寸
DN25对应1英寸
DN32对应1 1/4英寸
DN40对应1 1/2英寸
DN50对应2英寸
DN65对应2 1/2英寸
DN80对应3英寸
DN100对应4英寸
DN125对应5英寸
DN150对应6英寸
DN200对应8英寸
DN250对应10英寸
DN300对应12英寸
这个对照表是根据国际标准ISO 6708制定的,可以方便地将DN和英寸进行转换。
在工业管道系统中,DN尺寸是非常重要的,因为它决定了管道系统的流量
和压力等级。
而英寸则是在日常生活中常用的长度单位,例如测量房间大小、电视屏幕尺寸等。
标准:LMN50-2颁布时间:2012-11取代LMN50-2:2008-02金属表面保护电镀涂层1 总要求1.1应用范围如果ZF技术文件或其它文件里有规定“电镀涂层”按LMN50,那么就适用于本ZF公司标准。
1.2目的本标准描述了不含六价铬的镀锌涂层和含六价铬的涂层以及图纸里的规范。
对于新设计所要求的实验等级规定,见第7部分及表2。
一个测试,如按DIN EN ISO 9227-NSS, 能够足以满足简单零件、标准零件和同类零件的要求,见本标准的表2和第8部分。
目录:1、总要求1.1应用范围1.2目的2、一般要求2.1 颜色符号2.2 零件的清洁2.3 基体金属腐蚀(红锈)2.4 锌腐蚀(白锈)3、电镀涂层3.1 电镀锌(GAL ZN)3.2 电镀锌铁合金(GAL ZNFE)3.3 电镀锌镍合金(GAL ZNNI)4、钝化处理4.1 厚层钝化处理4.2 薄层钝化处理5、密封/后续密封(NV)6、涂层厚度6.1 重要区域7、涂层的试验等级7.1 图纸里的规范8、电镀涂层的单项测试8.1 图纸里的规范9、带螺纹的零件9.1 功能面的摩擦系数9.2 带螺纹零件的涂层厚度10、参考标准2、一般要求电镀涂层最好由锌或锌合金涂层和钝化处理组成。
由于其目视外观(彩虹色的)原因,还应进行额外的密封处理。
电镀涂层是在桶里或架子上生成的。
通常,桶比较耐锌腐蚀。
2.1 颜色符号表面保护简写的颜色规范只适用于钝化处理/铬镀层并带有以下其中一个简写:按LMN50,零件在涂层之前必须彻底清洁。
2.3 基体金属腐蚀(红锈)当涂层不再提供保护时,带有电镀涂层的钢基和铁基将产生基体金属腐蚀(红锈=RR)。
2.4 锌腐蚀(白锈)在试验箱里喷盐雾几小时后,锌层将产生锌腐蚀(白锈=WR)。
为防止锌腐蚀,要对锌层进行钝化处理和后续的密封。
这些成分抑制了锌外观腐蚀。
电镀涂层在经过规定的实验周期后不会产生锌腐蚀。
但是,少量的微弱的目视变化(灰色雾霾)是允许的。
12Releasedate:216-4-1417:39Dateofissue:216-4-14129854_eng.xml 13421 BN2 WH3 BU4 BKWire colors in accordance with EN 60947-5-2(brown)(white)(blue)(black)3R e l e a s e d a t e : 2016-04-14 17:39D a t e o f i s s u e : 2016-04-14129854_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 3G (nA) for use in hazardous areas with gas, vapour and mist Certificate of ComplianceCE marking ATEX marking ¬ II 3G Ex nA IIC T6 GcThe Ex-related marking can also be printed on the enclosed label.Directive conformity 94/9/EGStandards EN 60079-0:2012+A11:2013, EN 60079-15:2010 Ignition protection category "n"Use is restricted to the following stated conditionsG eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The data stated in the data sheet are restricted by this operating instruction! The special conditions must be observed!Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. If the Ex-related marking is printed only on the supplied label, then this must be attached in the immediate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indel-ible, including in the event of possible chemical corrosion.MaintenanceNo changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMaximum operating current I L The maximum permissible load current must be restricted to the values given in the fol-lowing list. High load currents and load short-circuits are not permitted.Maximum operating voltage U BmaxThe maximum permissible operating voltage UB max is restricted to the values in the following list. T olerances are not permissible.Maximum permissible ambient temperature T Umax dependant of the load current I L and the max. operating voltage U rmation can be taken from the following list. at U Bmax =30 V , I L =200 mA 49 °C (120.2 °F) at U Bmax =30 V , I L =100 mA 54 °C (129.2 °F) at U Bmax =30 V , I L =50 mA55 °C (131 °F)Protection from mechanical danger The sensor must not be exposed to ANY FORM of mechanical danger.Protection from UV light The sensor and the connection cable must be protected from damaging UV-radiation. This can be achieved when the sensor is used in internal areas.Protection against transients Ensure transient protection is provided and that the maximum value of the transient pro-tection (140% of 85 V) is not exceeded.Electrostatic chargeElectrostatic charges must be avoided on the mechanical housing components. Dan-gerous electrostatic charges on the mechanical housing components can be avoided by incorporating these in the equipotential bonding.Material selection accessories When selecting accessories, ensure that the material allows the temperature of the enclosure to rise to up to 70 °C.Plug connectorThe plug connector must not be withdrawn under voltage. The proximity switch is identi-fied as follows: "WARNING - DO NOT SEPARATE WHEN ENERGIZED". With the plug connector disconnected, soiling of the internal area must be prevented.(i.e. the area that is inaccessible when the connector is inserted)4Releasedate:216-4-1417:39Dateofissue:216-4-14129854_eng.xml Note This instruction is only valid for products according to EN50281-1-1, valid until 30-September-2008Note the ex-marking on the sensor or on the enclosed adhesive labelInstruction Manual electrical apparatus for hazardous areasDevice category 3DCE markingATEX marking ¬ II 3D IP67 T 91 °C (195.8 °F) XThe Ex-significant identification is on the enclosed adhesive labelDirective conformity 94/9/EGStandards EN50281-1-1Protection via housingUse is restricted to the following stated conditionsG eneral The apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual.The data stated in the data sheet are restricted by this operating instruction! The special conditions must be adhered to! Installation, commissioning Laws and/or regulations and standards governing the use or intended usage goal must be observed.The adhesive label provided must be affixed in the immediate vicinity of the sensor! The surface to which the label is appliedmust be clean, flat and free from grease! The affixed adhesive label must be readable and durable, taking account of the possi-bility of chemical corrosion!Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMaximum operating current I L The maximum permissible load current must be restricted to the values given in the following list.High load currents and load short-circuits are not permitted.Maximum operating voltage U Bmax The maximum permissible operating voltage UBmax must be restricted to the values given in the following list. T olerances arenot permitted.Maximum heating (T emperature rise) dependant of the load current I L and the max. operating voltage U Bmax.Information can be taken from the following list. The maximum surface temperature at maximum ambient temperature is givenin the Ex identification of the apparatus.at U Bmax=30 V, I L=200 mA 21 Kat U Bmax=30 V, I L=100 mA 16 Kat U Bmax=30 V, I L=50 mA 14 KProtection from mechanical danger The sensor must not be mechanically damaged.Electrostatic charge Electrostatic charges must be avoided on the mechanical housing components. Dangerous electrostatic charges on themechanical housing components can be avoided by incorporating these in the equipotential bonding.Plug connector The plug connector must not be disconnected under voltage. The proximity switch is marked as follows: "DO NOT DISCON-NECT UNDER VOLTAGE!" When the plug connector is disconnected the ingress of dirt into the inner areas (i.e. the areas,which are not accessible in the plugged-in condition) must be prevented.The plug connection can only be separated using a tool. This is achieved by using the locking protection V1-Clip (Mountingaccessory from Pepperl + Fuchs).5R e l e a s e d a t e : 2016-04-14 17:39D a t e o f i s s u e : 2016-04-14129854_e n g .x m lNote This instruction is only valid for products according to EN 61241-0:2006 and EN 61241-1:2004 Note the ex-marking on the sensor or on the enclosed adhesive label InstructionManual electrical apparatus for hazardous areas Device category 3DCE marking ATEX marking ¬ II 3D Ex tD A22 IP67 T80°C XThe Ex-relevant identification may also be printed on the accompanying adhesive label.Directive conformity 94/9/EGStandards EN 61241-0:2006, EN 61241-1:2004 Protection via housing "tD"Use is restricted to the following stated conditionsG eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual.The maximum surface temperature has been determined in accordance with method A without a dust layer on the equipment.The data stated in the data sheet are restricted by this operating instruction!The special conditions must be adhered to!Installation, commissioningThe statutory requirements, directives and standards applicable to the intended use and application must be observed.The adhesive label provided must be affixed in the immediate vicinity of the sensor! The surface to which the label is applied must be clean, flat and free from grease! The affixed adhesive label must be readable and durable, taking account of the possi-bility of chemical corrosion!MaintenanceNo changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMaximum operating current I L The maximum permissible load current must be restricted to the values given in the following list.High load currents and load short-circuits are not permitted.Maximum operating voltage U Bmax The maximum permissible operating voltage UBmax must be restricted to the values given in the following list. T olerances are not permitted.Maximum permissible ambient tempera-ture T Umaxdependant of the load current I L and the max. operating voltage U rmation can be taken from the following list. at U Bmax =30 V , I L =200 mA 49 °C (120.2 °F) at U Bmax =30 V , I L =100 mA 54 °C (129.2 °F) at U Bmax =30 V , I L =50 mA55 °C (131 °F)Protection from mechanical danger The sensor must not be exposed to ANY FORM of mechanical danger.Protection from UV light The sensor and the connection cable must be protected from damaging UV-radiation. This can be achieved when the sensor is used in internal areas.Electrostatic charge Electrostatic charges must be avoided on the mechanical housing components. Dangerous electrostatic charges on the mechanical housing components can be avoided by incorporating these in the equipotential bonding.Plug connectorThe plug connector must not be withdrawn under voltage. The proximity switch is identified as follows: "WARNING - DO NOT SEPARATE WHEN ENERGIZED". With the plug connector disconnected, soiling of the internal area must be prevented.(i.e. the area that is inaccessible when the connector is inserted) The plug connection can only be separated using a tool.This is achieved by using the locking protection V1-Clip (Mounting accessory from Pepperl + Fuchs).6Releasedate:216-4-1417:39Dateofissue:216-4-14129854_eng.xml Instruction Manual electrical apparatus for hazardous areasDevice category 3D for use in hazardous areas with combustible dustCertificate of ComplianceCE markingATEX marking ¬ II 3D Ex tc IIIC T80°C DcThe Ex-related marking can also be printed on the enclosed label.Directive conformity 94/9/EGStandards EN 60079-0:2012+A11:2013, EN 60079-31:2014Protection by enclosure "tc" Some of the information in this instruction manual is morespecific than the information provided in the datasheet.G eneral The corresponding datasheets, declarations of conformity, EC-type examination certifi-cates, certifications, and control drawings, where applicable (see datasheets), form anintegral part of this document. These documents can be found at www.pepperl-. The maximum surface temperature of the device was determined without alayer of dust on the apparatus. Some of the information in this instruction manual is morespecific than the information provided in the datasheet.Installation, commissioning Laws and/or regulations and standards governing the use or intended usage goal mustbe observed. If the Ex-relevant identification is printed exclusively on the adhesive labelprovided, this label must be affixed in the immediate vicinity of the sensor! The back-ground surface to which the adhesivelabel is to be applied must be clean and free fromgrease! The applied label must be durable and remain legible, with due consideration ofthe possibility of chemical corrosion!Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMaximum operating current I L The maximum permissible load current must be restricted to the values given in the fol-lowing list.High load currents and load short-circuits are not permitted.Maximum operating voltage U Bmax The maximum permissible operating voltage UBmax must be restricted to the valuesgiven in the following list. T olerances are not permitted.Maximum permissible ambient temperature T Umax dependant of the load current I L and the max. operating voltage U Bmax.Information can be taken from the following list.at U Bmax=30 V, I L=200 mA 49 °C (120.2 °F)at U Bmax=30 V, I L=100 mA 54 °C (129.2 °F)at U Bmax=30 V, I L=50 mA 55 °C (131 °F)Protection from mechanical danger The sensor must not be exposed to ANY FORM of mechanical danger.Protection from UV light The sensor and the connection cable must be protected from damaging UV-radiation.This can be achieved when the sensor is used in internal areas.Electrostatic charge Electrostatic charges must be avoided on the mechanical housing components. Dan-gerous electrostatic charges on the mechanical housing components can be avoided byincorporating these in the equipotential bonding. Do not attach the nameplate providedin areas where electrostatic charge can build up.Plug connector The plug connector must not be withdrawn under voltage. The proximity switch is identi-fied as follows: "WARNING - DO NOT SEPARATE WHEN ENERGIZED". With the plugconnector disconnected, soiling of the internal area must be prevented.(i.e. the area thatis inaccessible when the connector is inserted)。
Camera Type Medium Format Mirrorless Digital camera with Autofocus, Auto exposure, interchangeable lenses.Construction Machined aluminium. Tripod socket 1/4”.Sensor Type CMOS, 50 megapixels (8272 × 6200 pixels, 5.3 × 5.3 µm).Sensor Dimensions43.8 × 32.9 mmImage Size Stills: 3FR RAW capture 106 MB on average. JPEG: Up to 22 MB, TIFF 8 bit: 154 MB. Video: 2.7K (2720 x 1530) and HD (1920 x 1080), max 29:59 minutes/clip). Video covers the full sensor width in a 16:9 ratio.File Format Hasselblad 3FR RAW, Full size JPEG. Video: H.264 Compressed (29.97 fps). 4:2:0 8 bit color. Shooting Mode Single shot stills, Video. Single and Continuous Drive, Self Timer, Interval Timer, Exposure Brack-eting and Focus Bracketing.Colour Definition16-bit; Dynamic range up to 14 stops.ISO Speed Range ISO Auto, 100, 200, 400, 800, 1600, 3200, 6400, 12800, 25600.Storage Options Dual UHS-II SD cards or tethered to Mac or PC. Max 1 TB. SD Cards can be used in Overflow or Backup mode (images only). Recommended cards are listed below.Colour Management Hasselblad Natural Colour Solution (HNCS)Storage Capacity A 64 GB card holds approximately 600 RAW or 6000 JPEG High Quality images on average.Capture Rate 2.7 frames per second (RAW)User Interface Touch interface including swipe, scroll and pinch/spread to zoom. Camera grip with buttons and Scroll Wheels. Many camera functions and settings can be controlled from a tethered computer or iPad Pro/iPad Air (2019) over Wi-Fi or tethered.Display 3.6-inch TFT type, 24-bit colour, 2.36-million-dot; Touch functionality: Full supportLive View On camera and host computer with high frame rate.Viewfinder OLED, 3.69-million-dot Electronic Viewfinder (EVF). Viewing Area : 100%. Magnification: 0.87x Histogram Feedback Yes, in Browse Mode on rear display and in EVF.IR Filter Mounted in front of sensor.Acoustic Feedback YesSoftware Phocus for Mac and Windows. Compatible with Adobe Photoshop Lightroom® and Adobe Camera Raw®Phocus Mobile 2 for iPad Pro and iPad Air (2019).Platform Support Macintosh: OS X version 10.12.2 or later. PC: XP/Vista/Windows 7 (32 and 64 bit)/ 8 / 10. iOS device Support iPad Pro or iPad Air (2019 or later)Host Connection Type USB 3.0 (5 Gbit/s) Type-C connector.Additional Connec-tions Audio In/Out.Operating Tempera-ture-10 to 45 ˚C. 14 to 113 ˚F.Wi-Fi & GPS802.11 b, g, n, a, ac (a and ac depending on region). GPS built-in.RECOMMENDED MEMORY CARDSFor optimal performance of the X1D II 50C, the following SD memory cards are recommended to use:●UHS-II, 260MB/s or faster Avoid using Micro SD/TF memory cards with SD card sets. Some Sony high-speed SF-G UHS-II SD 300MB/s memory cards might have poor compatibility, and therefore, might not be able to write image data properly.Continued on the next page.Lenses Hasselblad XCD lenses with built in electronically controlled shutter and aperture. Automatic or manual focusing with instant manual focus override. Lens shades can be mounted in reverse for transport.Compatible with all H System lenses and some H System accessories using an XH Lens Adapter. Also compatible with V System and XPan Lenses using a XV or XPan Lens Adapter. Many other lenses via 3rd party lens adapters (E-shutter only).Shutter Electronically controlled lens shutter with speeds up to 1/2000 s. Flash sync at all speeds. Option-al electronic shutterShutter Speed Range68 minutes to 1/2000 s with XCD Lenses. 1/800 s or 1/2000 s with HC/HCD Lenses. Electronic shutter 68 min to 1/10000 s.Flash Sync Speed Flash can be used at all shutter speeds. Mechanical shutter only.Flash Control TTL centre weighted system. Compatible with Nikon TM System flashes. ISO range 100 to 6400. Flash output can be adjusted (-3 to +3 EV) for fill-in purposes independent of ambient light. Sync at all shutter speeds. Mechanical shutter only.Flash Compatibility In TTL-mode, the following Nikon Flash products can be used: SB-300, SB-500, SB-5000, SB-700, SB-900, SB-910.The following Profoto products can be used in TTL-mode: A1, B1 and B2 with Nikon interface.Focusing Automatic and manual focusing. Instant manual focus override. Automatic focusing using contrast detection. 100% zoom or Focus Peaking available in manual focus. Up to 117 selectable autofocus points.Exposure Metering Spot, centre weighted and centre spot.Power Supply Rechargeable Li-ion battery (7.27 VDC/3400 mAh). Compatible with the 3200 mAh battery.Can be charged in camera via USB or with optional external charger.Dimensions Complete camera with XCD 45P lens: 148 x 97 x 102 mm [W x H x D].Camera Body only: 148 x 97 x 70 mmWeight1086 g (Complete camera with XCD 45P lens, Li-ion battery and card).650 g (Camera Body). 766 g (Camera Body with Li-ion battery and SD Card).Specification subject to change without notice.。
US: 1-866-764-5454 CAN: 1-800-265-0502 Copyright 2022 Eaton874FRE and REC reducers,REA adapters and PLG plugsCl. I, Div. 1 & 2, Groups A A , B A , C, D Cl. II, Div. 1, Groups E, F, G Cl. II, Div. 2, Groups F, G Cl. IIIExplosionproof Dust-ignitionproofApplications:• RE and REC reducers are used in threaded heavy wall conduit systems• RE reduces conduit hubs to a smaller size • REC connects two different sizes of conduit together or is used to replace a coupling and reducer in an installation • REA adapters enlarge drilled and tapped openings by one NPT size• PLG plugs are used for closing threaded conduit hubsFeatures:RE reducers have:• Integral bushing which prevents damage to wires• Full, clean cut tapered threads REC reducers have:• Integral bushings in both ends which prevents damage to wires• Funnel shaped interior to guide the wires from large to small conduit, making it easy to pull wireREA adapters have:• Smooth integral bushing to protect wire insulation• Knurled body for easy wrenching PLG plugs:• Have clean tapered threads• Are available in two styles: flush (recessed) or square head typeStandard materials:• RE reducers – RE1108 through RE54: steel; all others: Feraloy iron alloy • REA adapters – steel• REC reducers – REC21 and REC32: steel; all others: Feraloy iron alloy• PLG plugs –Recessed : PLG28 through PLG3: steel; PLG4 through PLG10: gray iron alloy Square head : PLG15 through PLG55: steel; PLG65 through PLG105: gray iron alloyStandard finishes:• Feraloy iron alloy – electrogalvanized and aluminum acrylic paint• Steel – electrogalvanized with chromate treatmentCertifications and compliances:NEC/CEC:• Class I, Divisions 1 & 2, Groups A, B, C, D(see listings for specific catalog numbers suitable for Groups A or B)• Class II, Division 1, Groups E, F, G • Class II, Division 2, Groups F, G • Class III UL standard:• UL1203CSA standard:• C22.2 No. 30RERECREAPLGRecessedSquare headA Suitable for use in Class I, Groups A andB areas.B Not available in aluminum.Options:Description Suffix • Copper-free aluminum ..........................SAOrdering information:Hub sizeCat. #1/” - 1/”B Male hub sizeFemale hub sizeCat. #1/“3/“A 1”1/4“REA34AHub sizeCat. #3/“ - 1/“A Recessed SizeCat. #1/“A 4“PLG10Square head SizeCat. #1/“A。
Features•Built using the advantages and compatibility of CMOS and IXYS HDMOS TM processes •Latch-Up Protected up to 2 Amps •High 2A Peak Output Current•Wide Operating Range: 4.5V to 30V •-55°C t o +125°C Ext ended Operat ing Temperat ure• High Capacitive LoadDrive Capability: 1000pF in <10ns • Matched Rise And Fall Times • Low Propagation Delay Time •Low Out put Impedance •Low Supply Current•Two Drivers in Single ChipApplications•Driving MOSFETs and IGBTs •Mot or Cont rols •Line Drivers•Pulse Generat ors•Local Power ON/OFF Switch•Switch Mode Power Supplies (SMPS)•DC t o DC Convert ers •Pulse Transformer Driver •Class D Switching Amplifiers •Power Charge PumpsGeneral DescriptionThe IXDF502, IXDI502 and IXDN502 each consist of t wo 2-Amp CMOS high speed MOSFET Gate Drivers for driving the latest IXYS MOSFETs & IGBTs. Each of the DualOutputs can source and sink 2 Amps of Peak Current while producing voltage rise and fall times of less than 15ns. The input of each Driver is TTL or CMOS compatible and is virtually immune to latch up. Patented* design innovations eliminate cross conduction and current "shoot-through".Improved speed and drive capabilit ies are furt her enhanced by very quick & matched rise and fall times.The IXDF502 is configured wit h one Gat e Driver Invert ing plus one Gat e Driver Non-Invert ing. The IXDI502 is config-ured as a Dual Inverting Gate Driver, and the IXDN502 is configured as a Dual Non-Invert ing Gat e Driver.The IXDF502, IXDI502 and IXDN502 are each available in the 8-Pin P-DIP (PI) package, the 8-Pin SOIC (SIA) pack-age, and the 6-Lead DFN (D1) package, (which occupies less than 65% of the board area of the 8-Pin SOIC).*United States Patent 6,917,227Ordering InformationDS99573B(03/10)NOTE:All parts are lead-free and RoHS CompliantCopyright © 2007 IXYS CORPORATION All rights reservedIXDF502 / IXDI502 / IXDN5022 Ampere Dual Low-Side Ultrafast MOSFET Drivers2Copyright © 2007 IXYS CORPORATION All rights reservedFigure 3 - IXDN502 Dual 2A Non-Inverting Gate Driver Functional Block DiagramFigure 2 - IXDI502 Dual Inverting 2A Gate Driver Functional Block DiagramFigure 1 - IXDF502 Inverting + Non-Inverting 2A Gate Driver Functional Block Diagram* United States Patent 6,917,2273Unless otherwise noted, 4.5V ≤ V CC ≤ 30V .All voltage measurements with respect to GND. IXD_502 configured as described in Test Conditions . All specifications are for one channel.Electrical Characteristics @ T A = 25 o C (3)Symbol Parameter Test Conditions Min TypMax Units V IH High input voltage CC 3.0 V V IL Low input voltage 4.5V ≤ V CC ≤ 18V 0.8 V V IN Input voltage range-5 V CC + 0.3 V I IN Input current 0V ≤ V IN ≤ V CC -10 10 µA V OH High output voltage V CC - 0.025V V OL Low output voltage0.025 V R OH High state output resistanceV CC = 15V 2.5 4 Ω R OL Low state output resistanceV CC = 15V 2 3 Ω I PEAK Peak output current V CC = 15V 2 A I DC Continuous output current1 A t R Rise time C LOAD =1000pF V CC =15V 7.5 10 ns t F Fall timeC LOAD =1000pF V CC =15V6.5 9 ns t ONDLY On-time propagation delay C LOAD =1000pF V CC =15V 25 32 ns t OFFDLY Off-time propagation delay C LOAD =1000pF V CC =15V 20 30 ns V CC Power supply voltage4.5 15 30 V I CCPower supply currentV IN = 3.5V V IN = 0V V IN = +V CC1 03 15 15mA µA µAAbsolute Maximum Ratings (1)Operating Ratings (2)Parameter Value Supply Voltage 35VAll Ot her Pins-0.3 V to V CC + 0.3V Junct ion Temperat ure 150 °CSt orage Temperat ure-65 °C to 150 °C Lead Temperat ure (10 Sec)300 °CParameter Value Operating Supply Voltage 4.5V to 30V Operat ing Temperat ure Range -55 °C to 125 °C (4) IXYS reserves the right to change limits, test conditions, and dimensions.Package Thermal Resist ance *8-Pin P DIP (PI)θJ-A (typ)125 °C/W 8-Pin S OIC (SIA)θJ-A (t yp)200 °C/W 6-Lead DFN (D1)θJ-A (t yp)125-200 °C/W 6-Lead DFN (D1)θJ-C (max)3.3 °C/W 6-Lead DFN (D1)θJ-S (t yp)7.3 °C/W4Copyright © 2007 IXYS CORPORATION All rights reservedUnless otherwise noted, 4.5V ≤ V CC ≤ 30V , Tj < 150o CAll voltage measurements with respect to GND. IXD_502 configured as described in Test Conditions . All specifications are for one channel.Electrical Characteristics @ temperatures over -55 o C to 125 o C (3)Symbol Parameter Test Conditions Min Typ Max Units V IH High input voltage 4.5V ≤ V CC ≤ 15V 3.1 V V IL Low input voltage 4.5V ≤ V CC ≤ 15V 0.8 V V IN Input voltage range-5 V CC + 0.3 V I IN Input current 0V ≤ V IN ≤ V CC -10 10 µA V OH High output voltage V CC - 0.025V V OL Low output voltage0.025 V R OH High state output resistanceV CC = 15V6 Ω R OL Low state output resistanceV CC = 15V 5 Ω I DC Continuous output current1 A t R Rise time C LOAD =1000pF V CC =15V 11 ns t F Fall timeC LOAD =1000pF V CC =15V 10 ns t ONDLY On-time propagation delay C LOAD =1000pF V CC =15V 40 ns t OFFDLY Off-time propagation delay C LOAD =1000pF V CC =15V 38 ns V CC Power supply voltage4.5 15 30 V I CCPower supply currentV IN = 3.5V V IN = 0V V IN = + V CC1 03 40 40mA µA µANotes:1. Operating the device beyond the parameters listed as “Absolute Maximum Ratings” may cause permanentdamage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.2. The device is not intended to be operated outside of the Operating Ratings.3. Electrical Characteristics provided are associated with the stated Test Conditions.4. Typical values are presented in order to communicate how the device is expected to perform, but not necessarily to highlight any specific performance limits within which the device is guaranteed to function.* The following notes are meant to define the conditions for the θJ-A , θJ-C and θJ-S values:1) The θJ-A (t yp) is defined as junct ion t o ambient . The θJ-A of t he st andard single die 8-Lead PDIP and 8-Lead SOIC are dominat ed by t he resist ance of t he package, and t he IXD_5XX are t ypical. The values for t hese packages are nat ural convect ion values wit h vert ical boards and the values would be lower with forced convection. For the 6-Lead DFN package, the θJ-A value supposes the DFN package is soldered on a PCB. The θJ-A (typ) is 200 °C/W with no special provisions on the PCB, but because the center pad provides a lowthermal resistance to the die, it is easy to reduce the θJ-A by adding connected copper pads or traces on the PCB. These can reduce the θJ-A (typ) to 125 °C/W easily, and potentially even lower. The θJ-A for DFN on PCB without heatsink or thermal management will vary significantly with size, construction, layout, materials, etc. This typical range tells the user what he is likely to get if he does no t hermal management .2) θJ-C (max) is defined as juction to case, where case is the large pad on the back of the DFN package. The θJ-C values are generally not published for t he PDIP and SOIC packages. The θJ-C for t he DFN packages are import ant t o show t he low t hermal resist ance from junct ion t o the die attach pad on the back of the DFN, -- and a guardband has been added to be safe.3) The θJ-S (t yp) is defined as junct ion t o heat sink, where t he DFN package is soldered t o a t hermal subst rat e t hat is mount ed on a heat sink.The value must be t ypical because t here are a variet y of t hermal subst rat es. This value was calculat ed based on easily available IMS in t he U.S. or Europe, and not a premium Japanese IMS. A 4 mil dialect ric wit h a t hermal conduct ivit y of 2.2W/mC was assumed. The result was given as typical, and indicates what a user would expect on a typical IMS substrate, and shows the potential low thermal resistance for the DFN package.5Pin DescriptionCAUTION: Follow proper ESD procedures when handling and assembling this component.10uFAgilent 1147A Current Probe IXYS reserves the right to change limits, test conditions, and dimensions.Pin Configu ration8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDN4028 Pin SOIC (SI) IXDI4028 Pin SOIC (SI) IXDF402(SIA)(SIA)(SIA)6 Lead DFN (D1) 6 Lead DFN (D1)6 Lead DFN (D1)6Copyright © 2007 IXYS CORPORATION All rights reservedFig. 6Fig. 8Fig. 10Fig. 5Fig. 7Fig. 9Rise Time vs. Supply Voltage010203040506070800510152025303540Supply Voltage (V)R i s e T i m e (n s )560pF 1000pF10000pF5400pFFall Time vs. Supply Voltage10203040506070510152025303540Supply Voltage (V)F a l l T i m e (n s )560pF1000pF 10000pF5400pFRise / Fall Time vs. Temperature V SUPPLY = 15V C LOAD = 1000pF024681012-5050100150Temperature (C)R i s e / F a l l T i m e (n s )Rise timeFall timeRise Time vs. Capacitive Load0102030405060708090100100010000Load Capacitance (pF)R i s e T i m e (n s )5V15V 10V20VFall Time vs. Capacitive Load010203040506070100100010000Load Capacitance (pF)F a l l T i m e (n s )20V15V 10V 5VInput Threshold Levels vs. Supply Voltage0.511.522.5010203040Supply Voltage (V)T h r e s h o l d L e v e l (V )P ositive goinginputNegative goinginputFig. 12Fig. 14Fig. 11Fig. 13Input Threshold Levels vs. Temperature00.511.522.53-5050100150Temperature (C)I n p u t T h r e s h o l d L e v e l (V )Positive going inputNegative going inputPropagation Delay vs. Supply VoltageRising Input, C LOAD = 1000pF5101520253035400510152025303540Supply Voltage (V)P r o p a g a t i o n D e l a y T i m e (n s )Non-InvertingInvertingPropagation Delay vs. Supply VoltageFalling Input, C LOAD = 1000pF051015202530354045510152025303540P r o p a g a t i o n D e l a y T i m e (n s )InvertingNon-InvertingPropagation Delay vs. Temperature V SUPPLY = 15V C LOAD = 1000pF510152025303540-50050100150P r o p a g a t i o n D e l a y T i m e (n s )Positve going inputNegative going input8Copyright © 2007 IXYS CORPORATION All rights reservedSupply Current vs. Capacitive LoadV SU PPLY = 15V050100150200250300100100010000Load Capacitance (pF)S u p p l y C u r r e n t (m A )100kH z1M H z2M H zSupply Current vs. Capacitive LoadV SUPPLY = 10V020406080100120140160180200100100010000Load Capacitance (pF)S u p p l y C u r r e n t (m A )100kH z1M H z2M H zSupply Current vs. Capacitive LoadV SU PPLY = 5V0102030405060708090100100100010000Load Capacitance (pF)S u p p l y C u r r e n t (m A )100kH z1M H z2M H zFig. 18Fig. 19Fig. 20Fig. 21Fig. 22Fig. 17Supply C urrent vs. FrequencyV SU PPLY = 5V0102030405060708090100100100010000Frequency (kH z)S u p p l y C u r r e n t (m A )560pF1000pF 10000pF5400pFSupply Current vs. FrequencyV SUPPLY = 10V020406080100120140160180200100100010000Frequency (kHz)S u p p l y C u r r e n t (m A )560pF1000pF 10000pF5400pFSupply Current vs. FrequencyV SU PPLY = 15V050100150200250300100100010000Frequency (kH z)S u p p l y C u r r e n t (m A )560pF1000pF 10000pF5400pF9Fig. 23Fig. 24Fig. 25Fig. 26Fig. 28Fig. 27Supply C urrent vs. C apacitive LoadV SU PPLY = 20V050100150200250300350400100100010000Load Capacitance (pF)S u p p l y C u r r e n t (m A )100kH z1M H z2M H zSupply Current vs. FrequencyV SU PPLY = 20V50100150200250300350400100100010000Frequency (kHz)S u p p l y C u r r e n t (m A )560pF1000pF10000pF5400pFOutput Source Current vs. Supply Voltage012345670510152025303540Supply Voltage (V)S o u r c e C u r r e nt (A )Output Sink Current vs. Supply Voltage-7-6-5-4-3-2-100510152025303540Supply Voltage (V)S i n k C u r r e n t (A )Output Source Current vs. TemperatureV SUPPLY = 15V 00.511.522.533.5-5050100150Temperature (C)O u t p u t S o u r c e C u r r e n t (A )Output Sink Current vs. TemperatureV SUPPLY = 15V-3.5-3-2.5-2-1.5-1-0.5-5050100150Temperature (C)O u t p u t S i n k C u r r e n t (A )10Copyright © 2007 IXYS CORPORATION All rights reservedHigh State Output Resistance vs. Supply Voltage01234565101520253035Supply Voltage (V)O u t p u t R s i s t a n c e (o h m s )Fig. 29Fig. 30Low State Output Resistance vs. Supply Voltage0.511.522.533.544.505101520253035Supply Voltage (V)O u t p u t R e s i s t a n c e (o h m s )Supply Bypassing, Grounding Practices And Output Lead inductanceWhen designing a circuit t o drive a high speed MOSFET ut ilizingt he IXD_502, it is very import ant t o observe cert ain design crit eriain order t o opt imize performance of t he driver. Part icular at t ent ion needs t o be paid t o Su pply Bypassing, Grou nding, and minimizing the Output Lead Inductance.Say, for example, we are using t he IXD_502 t o charge a 1500pF capacitive load from 0 to 25 volts in 25ns.Using the formula: I = C ∆V/∆t, where ∆V=25V C=1500pF &∆t=25ns, we can determine that to charge 1500pF to 25 volts in25ns will t ake a const ant current of 1.5A. (In realit y, t he charging current won’t be const ant, and will peak somewhere around 2A). SUPPLY BYPASSINGIn order for our design to turn the load on properly, the IXD_502 must be able to draw this 1.5A of current from the power supplyin the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is an order of magnit ude larger t han t he load capacit ance. Usually, t his wouldbe achieved by placing t wo different t ypes of bypassing capacit ors, with complementary impedance curves, very close to the driverit self. (These capacit ors should be carefully select ed and should have low inductance, low resistance and high-pulse current-service rat ings). Lead lengt hs may radiat e at high frequency duet o induct ance, so care should be t aken t o keep t he lengt hs of t he leads between these bypass capacitors and the IXD_502 to an absolut e minimum.GROUNDINGIn order for the design to turn the load off properly, the IXD_502 must be able t o drain t his 1.5A of current int o an adequat e grounding syst em. There are t hree pat hs for ret urning current t hat need to be considered: Path #1 is between the IXD_502 and its load. Pat h #2 is bet ween t he IXD_502 and it s power supply. Pat h#3 is bet ween t he IXD_502 and what ever logic is driving it. All t hreeof these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made t o keep t hese t hree ground pat hs dist inct ly separate. Otherwise, the returning ground current from the load may develop a volt age t hat would have a det riment al effect on t he logic line driving t he IXD_502.OUTPUT LEAD INDUCTANCEOf equal importance to Supply Bypassing and Grounding are issues relat ed t o t he Out put Lead Induct ance. Every effort shouldbe made t o keep t he leads bet ween t he driver and it s load as short and wide as possible. If t he driver must be placed fart her t han 0.2”(5mm) from the load, then the output leads should be treated as ransmission lines. In t his case, a t wist ed-pair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin of the driver, and connected directly to the ground terminal of the load.11Copyright © 2007 IXYS CORPORATION All rights reserved IXYS Semiconduct or GmbHEdisonst rasse15 ; D-68623; Lampert heim Tel: +49-6206-503-0; Fax: +49-6206-503627 e-mail: marcom@ixys.deIXYS Corporat ion3540 Bassett St; Santa Clara, CA 95054 Tel: 408-982-0700; Fax: 408-496-0670e-mail: sales@12。