IXSH16N60U1中文资料

The ultimate in personal productivityThe ultimate in personal productivityGives you even more time backFor those with a need for speed, the next generation iX1600 offers the ultimate in personal productivity. Busy teams can digitise and organise all your documents with one touch, and enjoy all the benefits you’d expect from ScanSnap within the fastest possible times.Flexible and intuitivePowerful, efficient performanceUltra-fast set-up and start-upScanners should make your life easier, not slow you down. Offering the ultimate in time-saving performance, theScanSnap iX1600’s simple setup will have you converting your papers into useful digital files in no time. Once set up, simply open the cover and your ScanSnap is ready to go.Maximum productivityDesigned for busy people, the iX1600 makes your working day a breeze. In addition to scanning at a fast 40 pages perminute, the two-sided (Duplex) scanning function will have you digitising paperwork in half the time.The large Automatic Document Feeder holds up to 50sheets, freeing you from the tedious job of manually inputting individual pages, so you can speed through your work even faster. Professional grade feeding technology and ultrasonicsensors mean the iX1600 handles multi-page documents with ease.PC-free scanningNot everyone works from a desk these days. As long asthere’s a Wi-Fi connection, ScanSnap Cloud functionality willautomatically recognise up to four different document types and scan them to your pre-defined cloud storage locations. Even with no PC, ScanSnap Cloud will conduct imageprocessing and optimisation along the way. Simply place the scanner in the most convenient location for you, and scan away.Automated, intuitive operationQuickly and easily convert the papers you have into the applications you use. The 4.3-inch intuitive touchscreen lets you carry out pre-programmed scans, all at the touch of a button.Whether you’re creating searchable PDFs, editable Word, Excel or Powerpoint files, or extracting information fromreceipts or business cards, the iX1600 will automatically scan and save your documents to the pre-defined destination of your choice.Total document managementIntuitive ScanSnap Home softwareScanSnap Home software allows you to easily manage, edit, and utilise scanned data from documents, receipts, business cards, photos and more.For more ScanSnap related information, visit our website at : It can be hard work keeping a business in shape, and everyone can do with a bit more time back at the end of the day. The ScanSnap iX1600 was designed to help anyone achieve maximum productivity, with advanced organisational features that give you greater control, effortlessly.Plus, you can quickly set up and use the iX1600 anywhere you have Wi-Fi without the need for a PC. Scan straight to your cloud services using ScanSnap Cloud. And a streamlined scanning process lets you scan batches of different document types with no need to prep and sort, turning lengthy choresinto quick, even enjoyable jobs.The all-in-one ScanSnap Home software brings together all your favourite functions to help you power through your scanning in no time. By making your paperwork effortless, you can finally focus your day on what matters most.Wherever you call your desk, the iX1600 offers next generation scanning performance and the ultimate in personal productivity to connect your worlds with one-touch.Documents are automatically recognised and grouped according to document type (receipts, photographs, business cards etc.) while folders, tags, and keywords allow you to organise, search and find information more easily than ever before.The scanner can be set to alert you if two or more pages are fed through the scanner at once, delivering peace of mind that not a single page of your documents will get lost along the way.And the iX1600 Receipt Guide will also save you time otherwise spent prepping and feeding individualreceipts and business cards. After all, everyone has better things to do with their day.Flexibility at your fingertipsFor small teams, the ability to share a single device among 4 users will be a game-changer for your productivity. Each can have their own set of colour-coded scanning profile buttons.Wi-Fi or USB provide flexible deployment options, or alternatively, you can scan a PDF directly to your mobile device via Wi-Fi in Direct Connect mode.Quick Menu for instant scanningWhen using a PC or laptop, activating the Quick Menu function allows you to scan first and then decide which application you want to send your document to, which comes in handy for ad-hoc scanning. Y ou’ll find most of the applications you know and use ready for you in ScanSnap Home, and can always add more to the Quick Menu if required.The iX1600’s 4.3-inch LCDtouchscreen delivers the future of scanning now.Instead of choosing what you want to do each time you scan a document, with one touch, the pre-defined profile buttons willautomatically create the required file type and save it to your preferred destination – even if it’s in your cloud. The touchscreen also allows for colour-coded button sets for up to 4 teammates, making it the smarter way to work together using the same device.For more ScanSnap related information, visit our website at : For more ScanSnap related information, visit our website at :PFU (EMEA) Limited 4th Floor, Belmont Belmont RoadUxbridge, UB8 1HE United KingdomPFU (EMEA) Limited T ower 2Mies-van-der-Rohe Straße 880807 München GermanyPFU (EMEA) Limited Viale Monza, 25920126 Milano (MI)ItalyPFU (EMEA) LimitedCamino Cerro de los Gamos, 128224 Pozuelo de Alarcón Madrid SpainT el: +44 (0)20 8573 4444T el: +49 (0)89 32378 0Tel: +39 02 26294 1Detailed specifications and minimum system requirements can be found at ©2021 PFU Limited. All rights reserved. ScanSnap, ScanSnap Home, ScanSnap Manager and their logos are trademarks or registered trademarks of PFU Limited in Japan. ©2021 Fujitsu Limited. All rights reserved. Fujitsu, the Fujitsu logo and Infinity symbol are registered trademarks or trademarks of Fujitsu Limited in Japan and/or other countries. ©2021 ABBYY Software Ltd. All rights reserved. ABBYY and FineReader are trademarks of ABBYY Software, Ltd. which may be registered in some jurisdictions. ©2021 Microsoft Corporation. All rights reserved. Windows ®, Word ®, Excel ®, PowerPoint ® and their logos are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries. ©2021 OpenText Corporation. All rights reserved. ISIS™ and its logo are registered trademarks of OpenText Corporation in the United States and/or other countries.©2021 Kofax Inc. All rights reserved. Kofax, Power PDF Standard and Power PDF Standard for Mac and their logos are trademarks or registered trademarks of Kofax Inc. Wi-Fi and Wi-Fi Protected Setup are trademarks of the Wi-Fi Alliance. Other company names and product names are the registered trademarks or trademarks of their respective companies。

Dimensions: [mm]Scale - 1:1Marking7843643201078436432010784364320107843643201078436432010T e m p e r a t u r eT pT L78436432010Cautions and Warnings:The following conditions apply to all goods within the product series of WE-HCFA ofWürth Elektronik eiSos GmbH & Co. KG:General:•This electronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.•Strong forces which may affect the coplanarity of the components’ electrical connection with the PCB (i.e. pins), can damage the part, resulting in avoid of the warranty.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.•Using a brush during the cleaning process may break the wire due to its small diameter. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:•If the product is potted in the customer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•Applying currents with audio-frequency signals may result in audible noise due to the magnetostrictive material properties.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODPaC002.0012020-03-24DIN ISO 2768-1mDESCRIPTIONWE-HCFA High Current Flat WireInductor ORDER CODE78436432010SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODPaC002.0012020-03-24DIN ISO 2768-1mDESCRIPTIONWE-HCFA High Current Flat WireInductor ORDER CODE78436432010SIZE/TYPE BUSINESS UNIT STATUS PAGE。

Symbol Test Conditions Maximum RatingsV DSS T J = 25︒C to 150︒C500V V DGR T J = 25︒C to 150︒C, R GS = 1M Ω 500V V GSS Continuous ±30V V GSM Transient ±40V I D25T C = 25︒C112A I DM T C = 25︒C, Pulse Width Limited by T JM330A I A T C = 25︒C 66A E AS T C = 25︒C 2J dv/dt I S ≤ I DM , V DD ≤ V DSS , T J ≤ 150︒C 35V/ns P D T C = 25︒C1500W T J -55 ... +150︒C T JM 150︒C T stg -55 ... +150︒CV ISOL 50/60 Hz, RMS, t = 1minute 2500 V~I ISOL ≤ 1mA, t = 1s3000 V~M d Mounting Torque for Base Plate 1.5/13 Nm/lb.in Terminal Connection Torque1.3/11.5 Nm/lb.inWeight30gSymbol Test Conditions Characteristic Values (T J = 25︒C Unless Otherwise Specified) Min. Typ. Max.BV DSS V GS = 0V, I D = 3mA 500VV GS(th)V DS = V GS , I D = 8mA 3.0 5.0 V I GSS V GS = ±30V, V DS = 0V±200 nA I DSS V DS = V DSS , V GS = 0V50μA T J = 125︒C 3 mAR DS(on)V GS = 10V, I D = 66A, Note 139 m ΩIXFN132N50P3V DSS = 500V I D25= 112A R DS(on)≤ 39m Ωt rr≤ 250nsN-Channel Enhancement Mode Avalanche RatedFast Intrinsic RectifierPolar3TM HiPerFET TM Power MOSFETminiBLOCE153432GDSSG = Gate D = DrainS = SourceEither Source Terminal S can be used as the Source Terminal or the Kelvin Source (Gate Return) Terminal.Features●International Standard Package ●miniBLOC with Aluminum Nitride Isolation●Avalanche Rated●Low Package Inductance ●Fast Intrinsic Rectifier ●Low R DS(on) and Q GAdvantages●Easy to Mount ●Space SavingsApplications●DC-DC Converters ●Battery Chargers ●Switch-Mode and Resonant-Mode Power Supplies ●Uninterrupted Power Supplies ●AC Motor Drives ●High Speed Power Switching ApplicationsSSDGIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.(M4 screws (4x) supplied)SOT-227B (IXFN) OutlineSource-Drain DiodeSymbol Test Conditions Characteristic ValuesIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.。

1.了解键盘、菜单系统和显示USN60是超声波探伤仪和测厚仪。

它能够在数据库里存储A-扫描，操作参数和各种各样的测厚数据。

在本章中你将了解USN60的菜单和功能。

仔细阅读本章的内容将帮助你更好的使用本手册在阅读完这一章后，你将能够：1. 在仪器上安装电池（1.1节）2. 开启仪器（1.2节）3. 了解键盘上每一个键的功能（1.3节）4. 使用内置菜单系统进入USN60的所有功能（1.4节）5. 解释显示中最常出现的符号（1.5节）6. 列出USN6的特性（1.6节）7. 找出本手册中所包含内容的章节（1.7节）8. 确定哪一种可选特性被安装在你的仪器中（1.8节）1.1 电池的安装USN60通过安装在防护外壳后部的六个D 型电池或可选的交流电源适配器工作（见图1-1）。

要打开电池盒盖首先应松开四颗螺钉。

建议使用9.0安的镍氢充电电池，也可用碱性或镍镉充电电池。

如果使用碱性或镍镉电池，一定要按照本手册第二章第一节所讲述的步骤正确安装。

无论你使用哪一种电池，一定要按照电池盒中标明的电极方向并参照图1-1所示正确的安装。

充电电池必须从仪器中取出充电。

电池电量的多少通过图标显示（见图1-2）。

安装新电池后，图标将显示电量充足；随着电量的消耗，图标逐渐显示出电量不足。

需要注意的是此图标只正确的显示本手册第2章第1节中所要求使用的电池的电当图标显示电池电量仅剩四分之一时，应尽快更换新电池。

若因电池电量太弱导致仪器不能正将自动关闭。

当USN60重新启动时，所有设置将被保存并恢复。

采用遥控定位检测时，应备有备用电池或电池包。

可通过带有交流/直流电源适配器的交流电电源进行工作。

适配器通过电源适配器端口与所示。

1.2 仪器的电源开关按下 三秒钟即可开或关仪器。

1.3 键盘和旋钮的特性USN60的设计方便操作者快速进入仪器的所有功能。

通过易于操作的菜单系统，只需不超过3个键的按压即可进入任何一种功能（如图1-2）。

要进入任何一种功能你只需：● 按下七个菜单键 选择菜单，在显示底部的菜单将迅速被所选菜单中的子菜单所替代。

IXYS reserves the right to change limits, test conditions and dimensions.Symbol ConditionsMaximum RatingsV CES T J = 25°C to 150°C600 V V CGR T J = 25°C to 150°C; R GE = 20 k Ω 600 V V GES Continuous ±20 V V GEM T ransient ±30 V I C25 T C = 25°C 60 A I C90 T C = 90°C35 A I CM T C = 90°C, t p =1 ms70A RBSOA V GE = ±15 V , T J = 125°C, R G = 10 Ω I CM = 110 AClamped inductive load, L = 30 µH V CEK < V CESt SCV GE = ±15 V , V CE = 600 V , T J = 125°C 10 µs (SCSOA) R G = 10 Ω, non repetitive P C T C = 25°C IGBT 250 W Diode 80W T J -55 ... +150 °C T stg-40 ... +150°C Maximum lead temperature for soldering 300 °C 1.6 mm (0.062 in.) from case for 10 s M d Mounting torque TO-220 0.4 - 0.6 Nm TO-247 0.8 - 1.2Nm Weight6gV CES = 600 V I C25 = 60 A V CE(sat) typ = 2.1 VFeatures● NPT IGBT technology ● low switching losses ● low tail current ● no latch up● short circuit capability● positive temperature coeffi cient for easy paralleling● MOS input, voltage controlled ● optional ultra fast diode●International standard packageAdvantages● Space savings●High power densityTypical Applications● AC motor speed control ● DC servo and robot drives ● DC choppers● Uninteruptible power supplies (UPS)●Switch-mode and resonant-mode power suppliesIGBTwith optional DiodeHigh Speed,Low Saturation VoltageSymbol Conditions Characteristic Values(T J = 25°C, unless otherwise specifi ed) min. typ. max.V (BR)CES V GE = 0 V 600 V V GE(th) I C= 0.7 mA, V CE = V GE3 5 V I CES V CE = V CES T J = 25°C 0.1 mAT J = 125°C 1 mA I GES V CE = 0 V , V GE = ± 20 V ± 500 nA V CE(sat)I C= 35 A, V GE = 15 V2.22.7 VGCEG ate, E mitter, C ollector, T AB = C ollectorG EC C (TAB)TO-247 ADIXYS reserves the right to change limits, test conditions and dimensions.Symbol Conditions Characteristic Values(T J = 25°C, unless otherwise specifi ed)min. typ. max.C ies 1600 pF C oes V CE = 25 V , V GE = 0 V , f = 1 MHz150 pF C res 90 pF Q g I C = 35 A, V GE = 15 V , V CE = 480 V120 nC t d(on)30 ns t r45 ns t d(off) 320 ns t f 70 nsE on 1.6 mJ E off 0.8 mJ R thJC0.5 K/W R thCH TO 247 Package with heatsink compound0.25 K/W R thCHTO 220 Package with heatsink compound0.5K/WInductive load, T J = 125°C I C = 35 A, V GE = ±15 V , V CE = 300 V , R G = 10 ΩReverse Diode (FRED) [D1 version only] Characteristic Values (T J = 25°C, unless otherwise specifi ed)Symbol Conditions min. typ. max.V F I F = 35 A, V GE = 0 V 2.1 2.4 V I F = 35 A, V GE = 0 V , T J = 125°C 1.6 V I F T C = 25°C45 A T C = 90°C25 A I RM I F = 15 A, -di F /dt = 400 A/µs, V R = 300 V13 A t rr V GE = 0 V , T J = 125°C90 ns t rr I F = 1 A, -di F /dt = 100 A/µs, V R = 30 V , V GE = 0 V40nsR thJC1.6 K/WTO-247 AD OutlineSym.Inches Millimeter min.max.min.max.A 0.1850.209 4.70 5.30A10.0870.102 2.21 2.59A20.0590.098 1.50 2.49D 0.8190.84520.7921.45E 0.6100.64015.4816.24E20.1700.216 4.31 5.48e 0.215 BSC 5.46 BSC L 0.7800.80019.8020.30L1 -0.177 - 4.49ØP 0.1400.144 3.55 3.65Q 0.2120.244 5.38 6.19S 0.242 BSC 6.14 BSC b 0.0390.0550.99 1.40b20.0650.094 1.65 2.39b40.1020.135 2.59 3.43c 0.0150.0350.380.89D10.515 -13.07 -D20.0200.0530.51 1.35E10.530 -13.45 -Ø P1 -0.29-7.39IXYS reserves the right to change limits, test conditions and dimensions.012320406080100120V CEV CEI CVV V GEV FI CI F nCQ G-di/dtV GEI RMt rrnsFig. 1 T yp. output characteristics Fig. 2 T yp. output characteristicsFig. 3 T yp. transfer characteristicsFig. 4 T yp. forward characteristics offree wheeling diodeFig. 5 T yp. turn on gate chargeFig. 6 T yp. turn off characteristics of free wheeling diodeIXYS reserves the right to change limits, test conditions and dimensions.Fig. 7 T yp. turn on energy and switching Fig. 8 T yp. turn off energy and switching times versus collector currenttimes versus collector currentFig. 9 T yp. turn on energy and switching Fig.10 T yp. turn off energy and switchingtimes versus gate resistor times versus gate resistorFig. 11 Reverse biased safe operating area Fig. 12 T yp. transient thermal impedanceRBSOA1020304050601020304050600100200300400500600700I CI CAE off E onttR GR GV CEts E on E off nsttI CMZ thJCVA ns ns mJ。

16n60参数及管脚
16N60是一种N沟道增强型功率MOSFET。

以下是16N60的一些参数和管脚说明：
参数：
- 额定电压（VDS）：600V
- 额定电流（ID）：16A
- 静态最大电阻（RDS(on)）：0.45Ω
- 动态输入电容（Ciss）：1000pF
- 动态输出电容（Coss）：300pF
- 共源漏电流（IDSS）：1μA
- 置通电阻（Rg）：4Ω
- 热阻（RθJC）：2.5°C/W
管脚：
1. 栅极（Gate）：用于控制MOSFET的导通和截止。

2. 源极（Source）：MOSFET的电流输出端，连接到负载。

3. 漏极（Drain）：MOSFET的电流输入端，连接到电源。

4. 漏极（Drain）：与漏极（Drain）引脚相连。

需要注意的是，以上参数和管脚说明仅适用于16N60型号，其他型号的MOSFET可能会有不同的参数和管脚配置。

在使用MOSFET时，建议查阅其数据手册以获取准确的参数和管脚信息。

Fast IGBT in NPT-technology with soft, fast recovery anti-parallel EmCon diode• 75% lower E off compared to previous generationcombined with low conduction losses• Short circuit withstand time – 10 µs • Designed for:- Motor controls - Inverter• NPT-Technology for 600V applications offers:- very tight parameter distribution- high ruggedness, temperature stable behaviour - parallel switching capability• Very soft, fast recovery anti-parallel EmCon diode• Complete product spectrum and PSpice Models : /igbt/Type V CE I C V CE(sat )T j Package Ordering Code SKP15N60600V15A2.3V150°CTO-220AB Q67040-S4251SKB15N60TO-263AB Q67040-S4252SKW15N60TO-247ACQ67040-S4243Maximum Ratings ParameterSymbol Value Unit Collector-emitter voltage V C E 600V DC collector current T C = 25°C T C = 100°CI C3115Pulsed collector current, t p limited by T jmax I C p u l s 62Turn off safe operating area V CE ≤ 600V, T j ≤ 150°C -62Diode forward current T C = 25°C T C = 100°CI F3115Diode pulsed current, t p limited by T jmax I F p u l s 62AGate-emitter voltage V G E ±20V Short circuit withstand time 1)V GE = 15V, V CC ≤ 600V, T j ≤ 150°Ct S C 10µs Power dissipation T C = 25°CP t o t139WOperating junction and storage temperatureT j , T s t g-55...+150°C1)Allowed number of short circuits: <1000; time between short circuits: >1s.P-TO-220-3-1(TO-220AB)P-TO-263-3-2 (D²-PAK)(TO-263AB)P-TO-247-3-1(TO-247AC)Thermal Resistance Parameter Symbol ConditionsMax. ValueUnit CharacteristicIGBT thermal resistance,junction – caseR t h J C 0.9Diode thermal resistance,junction – case R t h J C D 1.7Thermal resistance,junction – ambientR t h J A TO-220AB TO-247AC 6240SMD version, device on PCB1)R t h J ATO-263AB40K/WElectrical Characteristic, at T j = 25 °C, unless otherwise specified ValueParameterSymbol Conditionsmin.Typ.max.UnitStatic CharacteristicCollector-emitter breakdown voltage V (B R )C E S V G E =0V, I C =500µA 600--Collector-emitter saturation voltageV C E (s a t )V G E = 15V, I C =15A T j =25°C T j =150°C1.7-22.3 2.42.8Diode forward voltageV FV G E =0V, I F =15A T j =25°C T j =150°C1.2- 1.41.25 1.81.65Gate-emitter threshold voltage V G E (t h )I C =400µA,V C E =V G E 345VZero gate voltage collector currentI C E SV C E =600V,V G E =0V T j =25°C T j =150°C----402000µAGate-emitter leakage current I G E S V C E =0V,V G E =20V --100nA Transconductance g f s V C E =20V, I C =15A 310.9-S Dynamic Characteristic Input capacitance C i s s -800960Output capacitanceC o s s -84101Reverse transfer capacitance C r s s V C E =25V,V G E =0V,f =1MHz-5262pFGate chargeQ G a t e V C C =480V, I C =15A V G E =15V -7699nC Internal emitter inductancemeasured 5mm (0.197 in.) from case L E TO-220AB TO-247AC--713--nH Short circuit collector current2)I C (S C )V G E =15V,t S C ≤10µs V C C ≤ 600V,T j ≤ 150°C-150-A 1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2(one layer, 70µm thick) copper area for collector connection. PCB is vertical without blown air.2)Allowed number of short circuits: <1000; time between short circuits: >1s.Switching Characteristic, Inductive Load, at T j =25 °C ValueParameterSymbolConditionsmin.typ.max.UnitIGBT Characteristic Turn-on delay time t d (o n )-3238Rise timet r -2328Turn-off delay time t d (o f f )-234281Fall time t f -4655nsTurn-on energy E o n -0.300.36Turn-off energy E o f f -0.270.35Total switching energyE t sT j =25°C,V C C =400V,I C =15A,V G E =0/15V,R G =21Ω,L σ1)=180nH,C σ1)=250pFEnergy losses include “tail” and diode reverse recovery.-0.570.71mJ Anti-Parallel Diode Characteristic Diode reverse recovery timet r r t S t F---27928254---ns Diode reverse recovery charge Q r r -390-nC Diode peak reverse recovery current I r r m - 5.0-A Diode peak rate of fall of reverse recovery current during t bdi r r /dtT j =25°C,V R =200V, I F =15A,di F /dt =200A/µs-180-A/µs Switching Characteristic, Inductive Load, at T j =150 °C ValueParameterSymbolConditionsmin.typ.max.UnitIGBT Characteristic Turn-on delay time t d (o n )-3138Rise timet r -2328Turn-off delay time t d (o f f )-261313Fall time t f -5465nsTurn-on energy E o n -0.450.54Turn-off energy E o f f -0.410.53Total switching energyE t sT j =150°CV C C =400V,I C =15A,V G E =0/15V,R G =21Ω,L σ1)=180nH,C σ1)=250pFEnergy losses include “tail” and diode reverse recovery.-0.861.07mJ Anti-Parallel Diode Characteristic Diode reverse recovery timet r r t S t F---36040320---nsDiode reverse recovery charge Q r r -1020-nC Diode peak reverse recovery current I r r m -7.5-A Diode peak rate of fall of reverse recovery current during t bdi r r /dtT j =150°CV R =200V, I F =15A,di F /dt =200A/µs-200-A/µs 1)Leakage inductance L σ and Stray capacity C σ due to dynamic test circuit in Figure E.I C , C O L L E C T O R C U R R E N T10Hz100Hz 1kHz 10kHz 100kHz0A10A 20A 30A40A 50A 60A70A 80AI C , C O L L E C T O R C U R R E N T1V10V100V1000V0.1A1A10A100Af , SWITCHING FREQUENCYV CE , COLLECTOR -EMITTER VOLTAGE Figure 1. Collector current as a function of switching frequency(T j ≤ 150°C, D = 0.5, V CE = 400V,V GE = 0/+15V, R G = 21Ω)Figure 2. Safe operating area (D = 0, T C = 25°C, T j ≤ 150°C)P t o t , P O W E R D I S S I P A T I O N25°C50°C75°C100°C125°C0W 20W 40W 60W 80W 100W 120W 140WI C , C O L L E C T O R C U R R E N T25°C50°C 75°C 100°C 125°C0A5A 10A 15A 20A 25A 30A35AT C , CASE TEMPERATURET C , CASE TEMPERATUREFigure 3. Power dissipation as a function of case temperature (T j ≤ 150°C)Figure 4. Collector current as a function of case temperature(V GE ≤ 15V, T j ≤ 150°C)I C , C O L L E C T O R C U R R E N T0V1V 2V 3V 4V 5V0A 5A 10A 15A 20A 25A 30A 35A 40A45A 50AI C , C O L L E C T O R C U R R E N T0V1V 2V 3V 4V 5V0A 5A10A 15A 20A 25A 30A 35A 40A45A 50AV CE , COLLECTOR -EMITTER VOLTAGEV CE , COLLECTOR -EMITTER VOLTAGEFigure 5. Typical output characteristics (T j = 25°C)Figure 6. Typical output characteristics (T j = 150°C)I C , C O L L E C T O R C U R R E N T0V2V4V6V8V 10V0A 5A 10A 15A 20A 25A 30A 35A 40A45A50A V C E (s a t ), C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E-50°C 0°C 50°C 100°C 150°C1.0V1.5V2.0V2.5V3.0V3.5V4.0VV GE , GATE -EMITTER VOLTAGET j , JUNCTION TEMPERATUREFigure 7. Typical transfer characteristics(V CE = 10V)Figure 8. Typical collector-emittersaturation voltage as a function of junction temperature (V GE = 15V)t , S W I T C H I N G T I M E S5A10A 15A 20A 25A 30A10ns100nst , S W I T C H I N G T I M E S0Ω20Ω40Ω60Ω10ns100nsI C , COLLECTOR CURRENTR G , GATE RESISTORFigure 9. Typical switching times as a function of collector current(inductive load, T j = 150°C, V CE = 400V,V GE = 0/+15V, R G = 21Ω,Dynamic test circuit in Figure E)Figure 10. Typical switching times as a function of gate resistor(inductive load, T j = 150°C, V CE = 400V,V GE = 0/+15V, I C = 15A,Dynamic test circuit in Figure E)t , S W I T C H I N G T I M E S0°C50°C 100°C 150°C10ns100nsV G E (t h ), G A T E -E M I T T E R T H R E S H O L D V O L T A G E-50°C0°C50°C100°C150°C 2.0V2.5V3.0V 3.5V4.0V 4.5V5.0V 5.5VT j , JUNCTION TEMPERATURET j , JUNCTION TEMPERATUREFigure 11. Typical switching times as a function of junction temperature(inductive load, V CE = 400V, V GE = 0/+15V,I C = 15A, R G = 21Ω,Dynamic test circuit in Figure E)Figure 12. Gate-emitter threshold voltage as a function of junction temperature (I C = 0.4mA)E , S W I T C H I N G E N E R G Y L O S S E S0A5A 10A 15A 20A 25A 30A 35A0.0mJ0.2mJ 0.4mJ 0.6mJ 0.8mJ 1.0mJ 1.2mJ 1.4mJ 1.6mJ1.8mJE ,S W I T C H I N G E N E R G Y L O S S E S0Ω20Ω40Ω60Ω80Ω0.0mJ0.2mJ 0.4mJ 0.6mJ 0.8mJ1.0mJ 1.2mJ1.4mJI C , COLLECTOR CURRENTR G , GATE RESISTORFigure 13. Typical switching energy losses as a function of collector current(inductive load, T j = 150°C, V CE = 400V,V GE = 0/+15V, R G = 21Ω,Dynamic test circuit in Figure E)Figure 14. Typical switching energy losses as a function of gate resistor(inductive load, T j = 150°C, V CE = 400V,V GE = 0/+15V, I C = 15A,Dynamic test circuit in Figure E)E , S W I T C H I N G E N E R G Y L O S S E S0°C50°C 100°C 150°C0.0mJ0.2mJ0.4mJ0.6mJ0.8mJ1.0mJZ t h J C , T R A N S I E N T T H E R M A L I M P E D A N C E1µs10µs 100µs 1ms 10ms 100ms 1s10-4K/W10-3K/W10-2K/W10-1K/W100K/WT j , JUNCTION TEMPERATUREt p , PULSE WIDTHFigure 15. Typical switching energy losses as a function of junction temperature (inductive load, V CE = 400V, V GE = 0/+15V,I C = 15A, R G = 21Ω,Dynamic test circuit in Figure E)Figure 16. IGBT transient thermalimpedance as a function of pulse width (D = t p / T )V G E , G A T E -E M I T T E R V O L T A G E0nC25nC 50nC 75nC 100nC0V 5V10V15V20V25VC , C A P A C I T A N C E0V10V 20V 30V10pF100pF1nFQ GE , GATE CHARGEV CE , COLLECTOR -EMITTER VOLTAGE Figure 17. Typical gate charge (I C = 15A)Figure 18. Typical capacitance as a function of collector-emitter voltage (V GE = 0V, f = 1MHz)t s c , S H O R T C I R C U I T W I T H S T A N D T I M E10V11V 12V 13V 14V 15V0µs 5µs10µs15µs20µs25µsI C (s c ), S H O R T C I R C U I T C O L L E C T O R C U R R E N T10V12V 14V16V 18V 20V0A 50A100A150A200A250AV GE , GATE -EMITTER VOLTAGEV GE , GATE -EMITTER VOLTAGEFigure 19. Short circuit withstand time as a function of gate-emitter voltage (V CE = 600V, start at T j = 25°C)Figure 20. Typical short circuit collector current as a function of gate-emitter voltage (V CE ≤ 600V, T j = 150°C)t r r , R E V E R S E R E C O V E R Y T I M E100A/µs300A/µs 500A/µs 700A/µs 900A/µs0ns100ns200ns300ns400ns500nsQ r r , R E V E R S E R E C O V E R Y C H A R G E100A/µs300A/µs 500A/µs 700A/µs 900A/µs0nC500nC1000nC1500nC2000nCdi F /dt , DIODE CURRENT SLOPEdi F /dt , DIODE CURRENT SLOPEFigure 21. Typical reverse recovery time as a function of diode current slope (V R = 200V, T j = 125°C,Dynamic test circuit in Figure E)Figure 22. Typical reverse recovery charge as a function of diode current slope (V R = 200V, T j = 125°C,Dynamic test circuit in Figure E)I r r , R E V E R S E R E C O V E R Y C U R R E N T100A/µs300A/µs 500A/µs 700A/µs 900A/µs0A4A8A12A16A 20Ad i r r /d t , D I O D E P E A K R A T E O F F A L LO F R E V E R S E R E C O V E R Y C U R R E N T100A/µs300A/µs 500A/µs 700A/µs 900A/µs0A/µs200A/µs400A/µs600A/µs800A/µs1000A/µsdi F /dt , DIODE CURRENT SLOPEdi F /dt , DIODE CURRENT SLOPEFigure 23. Typical reverse recovery current as a function of diode current slope (V R = 200V, T j = 125°C,Dynamic test circuit in Figure E)Figure 24. Typical diode peak rate of fall of reverse recovery current as a function of diode current slope (V R = 200V, T j = 125°C,Dynamic test circuit in Figure E)I F , F O R W A R D C U R R E N T0.0V0.5V 1.0V 1.5V 2.0V0A 5A10A15A20A25A30AV F , F O R W A R D V O L T A G E-40°C 0°C 40°C 80°C 120°C1.0V1.5V2.0VV F , FORWARD VOLTAGET j , JUNCTION TEMPERATUREFigure 25. Typical diode forward current as a function of forward voltage Figure 26. Typical diode forward voltage as a function of junction temperatureZ t h J C D , T R A N S I E N T T H E R M A L I M P E D A N C E1µs10µs 100µs 1ms 10ms 100ms 1s10-2K/W10-1K/W100K/Wt p , PULSE WIDTHFigure 27. Diode transient thermalimpedance as a function of pulse width (D = t p / T )dimensionssymbol[mm][inch]minmax minmax A 9.7010.300.38190.4055B 14.8815.950.58580.6280C 0.650.860.02560.0339D 3.55 3.890.13980.1531E 2.60 3.000.10240.1181F 6.00 6.800.23620.2677G 13.0014.000.51180.5512H 4.35 4.750.17130.1870K 0.380.650.01500.0256L 0.951.320.03740.0520M 2.54 typ.0.1 typ.N 4.30 4.500.16930.1772P 1.17 1.400.04610.0551T2.302.720.09060.1071TO-220ABdimensionssymbol[mm][inch]minmax minmax A 9.8010.200.38580.4016B 0.70 1.300.02760.0512C 1.00 1.600.03940.0630D 1.03 1.070.04060.0421E 2.54 typ.0.1 typ.F 0.650.850.02560.0335G 5.08 typ.0.2 typ.H 4.30 4.500.16930.1772K 1.17 1.370.04610.0539L 9.059.450.35630.3720M 2.30 2.500.09060.0984N 15 typ.0.5906 typ.P 0.000.200.00000.0079Q 4.20 5.200.16540.2047R 8° max 8° maxS 2.40 3.000.09450.1181T 0.400.600.01570.0236U 10.800.4252V 1.150.0453W 6.230.2453X 4.600.1811Y 9.400.3701TO-263AB (D 2Pak)Z16.150.6358dimensionssymbol[mm][inch]minmax minmax A 4.78 5.280.18820.2079B 2.29 2.510.09020.0988C 1.78 2.290.07010.0902D 1.09 1.320.04290.0520E 1.73 2.060.06810.0811F 2.67 3.180.10510.1252G 0.76 max 0.0299 maxH 20.8021.160.81890.8331K 15.6516.150.61610.6358L 5.21 5.720.20510.2252M 19.8120.680.77990.8142N 3.560 4.9300.14020.1941∅P3.610.1421Q6.126.220.24090.2449TO-247ACFigure A. Definition of switching times Figure B. Definition of switching lossesIr r m90% Ir r m10% Ir r mdi/dtFtr rIFi,vtQSQFtStFVRdi/dtr rQ=Q Qr r S F+t=t tr r S F+Figure C. Definition of diodesswitching characteristicsτ1τ2nτr r rFigure D. Thermal equivalentcircuitFigure E. Dynamic test circuitLeakage inductance Lσ=180nHand Stray capacity Cσ=250pF.Published byInfineon Technologies AG,Bereich KommunikationSt.-Martin-Strasse 53,D-81541 München© Infineon Technologies AG 2000All Rights Reserved.Attention please!The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved.We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.Infineon Technologies is an approved CECC manufacturer.InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.。

644Features•NPT 3 IGBT- low saturation voltage- positive temperature coefficient for easy paralleling - fast switching- short tail current for optimized performance in resonant circuits•ISOPLUS 247TM package - isolated back surface- low coupling capacity between pins and heatsink - high reliability- industry standard outline Applications•single switchesand with complementary free wheeling diodes •choppers•phaselegs, H bridges, three phase bridges e.g. for- power supplies, UPS - AC, DC and SR drives - induction heatingIGBT Symbol Conditions Maximum RatingsV CES T VJ = 25°C to 150°C1200VV GES ± 20V I C25T C = 25°C 95A I C90T C = 90°C 60At SCV CE = 900 V; V GE = ±15 V; R G = 22 Ω; T VJ = 125°C 10µs (SCSOA)non-repetitiveP totT C = 25°C375W Symbol ConditionsCharacteristic Values(T VJ = 25°C, unless otherwise specified)min.typ.max.I C25=95AV CES=1200V V CE(sat) typ.= 2.1VNPT 3 IGBTin ISOPLUS 247TMG C EG = GateC = CollectorE = EmitterIsolated BacksideISOPLUS 247TME153432a su644Component Symbol ConditionsMaximum Ratings T VJ -55...+150°C T stg -55...+125°C V ISOL I ISOL ≤ 1 mA; 50/60 Hz 2500V~F Cmounting force with clip 20 (120)NSymbol ConditionsCharacteristic Values min.typ.max.C p coupling capacity between shorted 30pF pins and mounting tab in the case Weight6gEquivalent Circuits for SimulationConductionIGBT (typ. at V GE = 15 V; T J = 125°C)V 0 = 0.99 V; R 0 = 25 m ΩThermal ResponseIGBT (typ.)C th1 = 0.13 J/K; R th1 = 0.06 K/W C th2 = 0.32 J/K; R th2 = 0.27 K/Wp h a se - o ut644012340204060801001200123420406080100120V CEV I CV CEA V A4681012144080120160V V GEA I CV GE 01002003004005005101520nC Q GVV GEFig. 1Typ. output characteristics Fig. 2Typ. output characteristicsFig. 3Typ. transfer characteristicsFig. 4Typ. turn on gate chargeph- out64420400481216200.00010.0010.010.1110200400600800100012001400E onV CEts VmJE onFig. 5Typ. turn on energy and switching times versus collector currentFig. 9Reverse biased safe operating area Fig. 10Typ. transient thermal impedanceRBSOA分销商库存信息: IXYSIXER60N120。

«=NVVV=fuvp=^ää=êáÖÜíë=êÉëÉêîÉÇG = Gate, C = Collector,E = Emitter,TAB = CollectorSymbol Test Conditions Maximum RatingsV CES T J = 25°C to 150°C600V V CGR T J = 25°C to 150°C; R GE = 1 M Ω600V V GES Continuous ±20V V GEM Transient±30V I C25T C = 25°C, limited by leads 75A I C90T C = 90°C 50A I CMT C = 25°C, 1 ms200A SSOA V GE = 15 V, T VJ = 125°C, R G = 22 Ω I CM = 100A(RBSOA)Clamped inductive load, L = 30 µH@ 0.8 V CESt SCV GE= 15 V, V CE = 360 V, T J = 125°C 10µs (SCSOA)R G = 22 Ω, non repetitive P C T C = 25°C250W T J -55 ... +150°C T JM 150°C T stg -55 ... +150°CM d Mounting torque1.13/10Nm/lb.in.WeightTO-247 SMD 4g TO-2476g Maximum lead temperature for soldering 300°C1.6 mm (0.062 in.) from case for 10 sIGBT High SpeedV `bp = 600 V I `OR= 75 A Short Circuit SOA CapabilityV `bEë~íF= 2.5 VSymbolTest ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.BV CES I C = 250 µA, V GE = 0 V 600V V GE(th)I C= 4 mA, V CE = V GE48V I CES V CE = 0.8 • V CES T J = 25°C 200µA V GE = 0 VT J = 125°C1mA I GES V CE = 0 V, V GE = ±20 V ±100nA V CE(sat)I C= I C90; V GE = 15 V2.22.5VVTROQ_=EQLVVFmêÉäáãáå~êó=Ç~í~=ëÜÉÉíTO-247 ADE`=Eq^_FFeaturesInternational standard package JEDEC TO-247 AD, andTO-247 SMD for surface mount Guaranteed Short Circuit SOA capabilityHigh frequency IGBTLatest generation HDMOS TM processLow V CE(sat)-for minimum on-state conduction lossesMOS Gate turn-on -drive simplicityApplicationsAC motor speed control DC servo and robot drives DC choppersUninterruptible power supplies (UPS)Switch-mode and resonant-mode power suppliesAdvantagesEasy to mount with 1 screw (isolated mounting screw hole) Reduces assembly time and costHigh power densityIXSH 50N60Bfuvp=jlpcbqp=~åÇ=fd_që=~êÉ=ÅçîÉêÉÇ=Äó=çåÉ=çê=ãçêÉ=çÑ=íÜÉ=ÑçääçïáåÖ=rKpK=é~íÉåíëWQIUPRIRVO QIUUNINMS RIMNTIRMU RIMQVIVSN RINUTINNT RIQUSITNR QIURMIMTOQIVPNIUQQRIMPQITVSRIMSPIPMTRIOPTIQUNRIPUNIMORIXYS reserves the right to change limits, test conditions, and dimensions.SymbolTest ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.g fs I C = I C90; V CE = 10 V,1623SPulse test, t ≤ 300 µs, duty cycle ≤ 2 %I C(on)V GE = 15 V, V CE = 10 V160A C ies 3850pF C oes V CE = 25 V, V GE = 0 V, f = 1 MHz440pF C res 50pF Q g 167nC Q ge I C = I C90, V GE = 15 V, V CE = 0.5 V CES45nC Q gc 88nC t d(on)70ns t ri 70ns t d(off)150300ns t fi 150300nsE off 3.3 6.0mJt d(on)70ns t ri 70ns E on0.6mJ t d(off)230ns t fi 230ns E off 4.8mJ R thJC 0.5K/WR thCK0.25K/WInductive load, T J = 25°C I C = I C90, V GE = 15 V, L = 100 µH,V CE = 0.8 V CES , R G = 2.7 ΩRemarks: Switching times may increase for V CE (Clamp) > 0.8 • V CES , higher T J or increased R GInductive load, T J = 125°C I C = I C90, V GE = 15 V, L = 100 µH V CE = 0.8 V CES , R G = 2.7 ΩRemarks: Switching times may increase for V CE (Clamp) > 0.8 • V CES , higher T J or increased R G«=NVVV=fuvp=^ää=êáÖÜíë=êÉëÉêîÉÇFigure 1. Saturation Voltage CharacteristicsFigure 2. Extended Output CharacteristicsFigure 3. Saturation Voltage CharacteristicsFigure 4. Temperature Dependence of V CE(sat)Figure 5. Admittance CurvesFigure 6. Capacitance CurvesV GE - Volts46810121416I C - A m p e r e s020406080100V CE -Volts0510152025303540C a p a c i t a n c e - p F10100100010000T J - Degrees C255075100125150V C E (s a t ) - N o r m a l i z e d0.40.60.81.01.21.41.6V CE - Volts0246810I C - A m p e r e s20406080100V CE - Volts048121620I C - A m p e r e s4080120160V CE - Volts0246810I C - A m p e r e s20406080100fuvp=jlpcbqp=~åÇ=fd_që=~êÉ=ÅçîÉêÉÇ=Äó=çåÉ=çê=ãçêÉ=çÑ=íÜÉ=ÑçääçïáåÖ=rKpK=é~íÉåíëWQIUPRIRVO QIUUNINMS RIMNTIRMU RIMQVIVSN RINUTINNT RIQUSITNR QIURMIMTOQIVPNIUQQRIMPQITVSRIMSPIPMTRIOPTIQUNRIPUNIMORIXYS reserves the right to change limits, test conditions, and dimensions.Figure 9. Gate ChargeFigure 10. Turn-off Safe Operating AreaFigure 11. Transient Thermal ResistanceFigure 7. Dependence of E ON and E OFF on I C .Figure 8. Dependence of E ON and E OFF onR G .Pulse Width - Seconds0.000010.00010.0010.010.11Z t h J C (K /W )0.0010.010.11V CE - Volts0100200300400500600I C - A m p e r e s0.1110100Q g - nanocoulombs25507510012515017548121620R G - Ohms010********60E (OFF) - millijoules05101520E (O N ) - m i l l i j o u l e s1234I C - Amperes20406080100E (OFF) - milliJoules04812162024E (O N ) - m i l l i j o u l e s0.00.51.01.52.02.53.0600分销商库存信息: IXYSIXSH50N60B。

© 2005 IXYS All rights reservedV CES =1700V I C25= 16A V CE(sat)= 5.0V t fi(typ)= 70nsIXGH 16N170A IXGT 16N170A IXGH 16N170AH1IXGT 16N170AH1C (TAB)G = Gate C = Collector,E = EmitterTAB =CollectorTO-247 (IXGH)FeatureszHigh blocking voltage zHigh current handling capability zMOS Gate turn-on -drive simplicity zRugged NPT structure zMolding epoxies meet UL 94 V-0flammability classification zSONIC-FRD TM fast recovery copack diode zInternational standard packages JEDEC TO-268and JEDEC TO-247 ADApplications zCapacitor discharge & pulser circuits zAC motor speed control zDC servo and robot drives zDC choppers zUninterruptible power supplies (UPS)zSwitched-mode and resonant-mode power suppliesAdvantages zHigh power density zSuitable for surface mounting zEasy to mount with 1 screw,(isolated mounting screw hole)DS99235A(06/05)Symbol Test ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.BV CES I C = 250 μA, V GE = 0 V 1700V V GE(th)I C = 250 μA, V CE = V GE3.05.0V I CESV CE = 0.8 • V CES 16N170A 50μA V GE = 0 V, Note 116N170AH1100μA T J = 125°C 16N170A750μA 16N170AH1 1.5mA I GES V CE = 0 V, V GE = ±20 V ±100nA V CE(sat)I C= I C90, V GE = 15 V4.05.0V T J = 125°C4.8VSymbol Test Conditions Maximum RatingsV CES T J = 25°C to 150°C1700V VCGRT J = 25°C to 150°C; R GE = 1 M Ω1700V V GES Continuous ±20V V GEM Transient ±30V I C25T C = 25°C 16A I C90T C = 90°C 11A I F90T C = 90°C, Diode 17A I CMT C = 25°C, 1 ms40A SSOA V GE = 15 V, T VJ = 125°C, R G = 10Ω I CM = 40A (RBSOA)Clamped inductive load@ 0.8 V CESt SC T J = 125°C, V CE = 1200 V; V GE = 15 V, R G = 22Ω 10μs P C T C = 25°C190W T J -55 ... +150°C T JM 150°C T stg -55 ... +150°C M dMounting torque (M3)TO-247 1.13/10Nm/lb.in.Maximum lead temperature for soldering 300°C 1.6 mm (0.062 in.) from case for 10 s Plastic body for 10s 260°CWeightTO-2476g TO-2684gTO-268 (IXGT)GEHigh Voltage IGBTH1Preliminary Data SheetIXYS reserves the right to change limits, test conditions, and dimensions.SymbolTest ConditionsCharacteristic Values(T J = 25°C unless otherwise specified)min.typ. max.g fs I C = I C25; V CE = 10 V 713S Note 2C ies 1620pF C oes V CE = 25 V, V GE = 0 V, f = 1 MHz16N170A 83pF 16N170AH1110pF C res 31pF Q g 83nC Q ge I C = I C90, V GE = 15 V, V CE = 0.5 V CES10nC Q gc 31nC t d(on)36ns t ri 57ns t d(off)160300ns t fi 70150nsE off 0.851.5mJt d(on)38ns t ri 59ns E on 16N170A 1.5mJ 16N170AH12.5mJ t d(off)175ns t fi 155ns E off 2.0mJ R thJC 0.65K/WR thCK(TO-247)0.25K/WInductive load, T J = 125°C I C = I C25, V GE = 15 V, R G = 10 ΩV CE = 0.5 V CES ,Note 3Inductive load, T J = 25°C I C = I C25, V GE = 15 V, R G = 10 ΩV CE = 0.5 V CES ,Note 3Notes:1.Device must be heatsunk for high temperature leakage current measurements to avoid thermal runaway.2.Pulse test, t ≤ 300 μs, duty cycle ≤ 2 %3.Switching times may increase for V CE (Clamp) > 0.8 • V CES , higher T J or increased R G .IXYS MOSFETs and IGBTs are covered by 4,835,5924,931,8445,049,9615,237,4816,162,6656,404,065 B16,683,3446,727,585 one or moreof the following U.S. patents:4,850,0725,017,5085,063,3075,381,0256,259,123 B16,534,3436,710,405B26,759,6924,881,1065,034,7965,187,1175,486,7156,306,728 B16,583,5056,710,4636771478 B2Reverse Diode (FRED)Characteristic Values Symbol Test Conditionsmin.typ. max. (T J = 25°C unless otherwise specified)V F I F = 20A, V GE = 0 V, Note 22.5 2.9V T J = 125°C2.5V t rr I F = 20A, V GE = 0 V, -di F /dt = 450 A/μs 230ns V R = 1200 VT J = 125°C400ns I RM23A T J = 125°C27AR thJC0.9K/W© 2005 IXYS All rights reservedPRELIMINARY T ECHNICAL I NFORMATIONThe product presented herein is under development. The Technical Specifications offeredare derived from data gathered during objective characterizations of preliminary engineer-ing lots; but also may yet contain some information supplied during a subjective pre-production design evaluation. IXYS reserves the right to change limits, test conditions, anddimensions without notice.IXYS reserves the right to change limits, test conditions, and dimensions.分销商库存信息:IXYSIXGH16N170A IXGH16N170AH1IXGT16N170AH1。

CES I C110= 10A V CE(sat) ≤ 2.50V t fi(typ)= 23nsExtreme Light Punch Through IGBT for 20-60kHz SwitchingFeatures●Optimized for 20-60kHz Switching ●Square RBSOA ●Avalanche Rated●Short Circuit Capability●International Standard PackageAdvantages●High Power Density ●Extremely Rugged●Low Gate Drive RequirementApplications●Power Inverters ●UPS●Motor Drives ●SMPS●PFC Circuits ●Battery Chargers ●Welding Machines ●Lamp Ballasts●High Frequency Power InvertersSymbol Test Conditions Characteristic Values (T J = 25︒C, Unless Otherwise Specified) Min. Typ. Max.BV CES I C = 250μA, V GE = 0V 650 VV GE(th)I C= 250μA, V CE = V GE3.56.0VI CES V CE = V CES , V GE = 0V10μA T J = 150︒C 100 μA I GES V CE = 0V, V GE = ±20V±100 nAV CE(sat)I C = 10A, V GE = 15V, Note 12.27 2.50 V T J = 150︒C2.54 VSymbol Test ConditionsMaximum Ratings V CES T J = 25°C to 175°C650V V CGR T J = 25°C to 175°C, R GE = 1M Ω 650V V GES Continuous ±20V V GEM Transient±30V I C25T C = 25°C 30A I C110T C = 110°C 10A I CM T C = 25°C, 1ms 54AI A T C = 25°C 5 A E AST C = 25°C 50 mJSSOA V GE = 15V, T VJ = 150°C, R G = 50Ω I CM = 20A(RBSOA) Clamped Inductive Load @V CE ≤ V CES t scV GE = 15V, V CE = 360V, T J = 150°C 8 μs (SCSOA)R G = 150Ω, Non Repetitive P C T C = 25°C160W T J -55 ... +175°C T JM 175°C T stg -55 ... +175°CT LMaximum Lead Temperature for Soldering 300°CT SOLD 1.6 mm (0.062in.) from Case for 10s 260 °C M d Mounting Torque1.13/10Nm/lb.in.Weight3gXPT TM 650V IGBT GenX3TMG = GateC = Collector E = Emitter Tab = CollectorGC ETO-220TabIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Notes:1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.2. Switching times & energy losses may increase for higher V CE (clamp), T J or R G .Symbol Test Conditions (T J = 25°C Unless Otherwise Specified)fs I C = 10A, V CE = 10V, Note 1 3.8 6.2C ie sC oes V CE = 25V, V GE C resQ g(on)Q ge I C = 10A, V GE = 15V, V Q gc d(on)TO-220 (IXYP) OutlinePins:1 - Gate2 - Collector3 - EmitterPRELIMANARY TECHNICAL INFORMATIONThe product presented herein is under development. The Technical Specifications offered are derived from a subjective evaluation of the design, based upon prior knowledge and experi-ence, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right to change limits, test conditions, and dimensions without notice.Fig. 1. Output Characteristics @ T 8101214161820I C - A m p e r e sFig. 7. Transconductance3456789g f s - S i e m e n sV CE = 10VFig. 13. Inductive Switching Energy Loss vs.Gate Resistance0.20.30.40.50.6E o f f - M i l l i J o u l e sE off E on - - - - T J = 150ºC , V GE = 15V V CE = 400VI C = 20AIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 19. Inductive Turn-on Switching Times vs.Gate Resistance6080100120140160r i - N a n o s e c o n d st r i t d(on) - - - -T J = 150ºC, V GE = 15V V CE = 400Vi Ri (°C/W ) Ci (J/°C )1 0.314390 0.000972762 0.289260 0.009818203 0.090928 0.07681600。

Operating Instructions XGS 116(w)/126(w)/136(w)ForewordWe are pleased to welcome you as a new customer of our Sophos XGS appliances.To install and configure the hardware appliance you can use the following documents:Hardware Quick Start Guide: Connection to the system peripherals in a few stepsOperating Instructions: Notes on the security and commissioning of the hardware applianceSophos Firewall How-To Library: Installing and configuring the software applianceThe Hardware Quick Start Guide and the Safety Instructions are also delivered in printed form together with the hardware appliance. The instructions must be read carefully prior to using the hardware and should be kept in a safe place.You may download all user manuals and additional documentation from the support webpage at: /supportSecurity SymbolsThe following symbol and its meaning appears in the Hardware Quick Start Guide, Safety Instructions and in these Operating Instructions.Caution and Important Note. If these notes are not correctly observed:ÌThis is dangerous to life and the environmentÌThe appliance may be damagedÌThe functions of the appliance will be no longer guaranteedÌSophos shall not be liable for damages arising from afailure to comply with the Safety InstructionsDesigned UseThe hardware appliances are developed for use in networks. The XGS116(w)/126(w)/136(w) models may be operated as a standalone appliance. The hardware appliance can be used in commercial, industrial and residential environments.The XGS 116(w)/126(w)/136(w) models belongs to the appliance group B.The hardware appliance must be installed pursuant to the current installation notes. Otherwise failure-free and safe operation cannot be guaranteed. The EU declaration of conformity is available at the following address:Sophos Technology GmbHGustav-Stresemann-Ring 165189 WiesbadenGermanyCE Labeling, FCC and ApprovalsThe XGS 116(w)/126(w)/136(w) appliance comply with CB, CE, UL, FCC Class B, ISED, VCCI, CCC, KC, BSMI, RCM, NOM, Anatel.Important Note: For computer systems to remain CE and FCC compliant, only CE and FCCcompliant parts may be used. Maintaining CE and FCC compliance also requires proper cable and cabling techniques.Operating Elements and ConnectionsXGS 116(w)Status LEDs (w-model has additional WiFi LED)1 x USB 2.01 x COM Micro USB 2 x external antenna (XGS 116w only)6 x GbE copper port F1 1 x SFP fiber port 1 x COM (RJ45)1 x USB 3.0Power supply Connector for optional 2 redundant power supply Optional module expansion bay 1 x GbE PoE port 1 x GbE copper portXGS 126(w)/136(w)Status LEDs (w-model has additional WiFi LED)1 x USB 2.01 x COM Micro USB 3 x external antenna (XGS 126w/136w only)10 x GbE copper port F1–F2 2 x SFP fiber ports 1 x COM (RJ45)1 x USB 3.0Power supply Optional module expansion bay 2 x 2.5 GbE PoE port (136(w)) 2 x GbE PoE port (126(w))Connector for optional 2 redundant power supplyTechnical SpecificationsInterfacesLED StatusPutting into OperationCaution: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.Scope of SupplyThe supplied parts are indicated in the Hardware Quick Start Guide.Mounting InstructionsThe XGS 116/126/136 appliance can be placed on a stable horizontal surface or canbe mounted to a rack or you can hang it on the wall by using the optionally available rackmount kit.Warnings and PrecautionsThe appliance can be operated safely if you observe the following notes and the notes on the appliance itself.Rack PrecautionsÌEnsure that the leveling jacks on the bottom of the rack are fully extendedto the floor with the full weight of the rack resting on them.ÌIn single rack installation, stabilizers should be attached to the rack.ÌIn multiple rack installations, the racks should be coupled together.ÌAlways make sure the rack is stable before extending a component from the rack.ÌYou should extend only one component at a time—extending two ormore simultaneously may cause the rack to become unstable.General Server PrecautionsÌReview the electrical and general safety precautions that camewith the components you are adding to your appliance.ÌDetermine the placement of each component in the rack before you install the rails.ÌInstall the heaviest server components on the bottom of the rack first, and then work up.ÌAllow the hot plug hard drives and power supply modules to cool before touching them.ÌAlways keep the rack‘s front door, all panels and server componentsclosed when not servicing to maintain proper cooling.Rack Mounting ConsiderationsÌAmbient operating temperature: If installed in a closed or multiunit rack assembly,the ambient operating temperature of the rack environment may be greater than the ambient temperature of the room. Therefore, you should install the equipment in an environment compatible with the manufacturer’s maximum rated ambient temperature.ÌReduced airflow: Equipment should be mounted into arack with sufficient airflow to allow cooling.ÌMechanical loading: Equipment should be mounted into a rack so that ahazardous condition does not arise due to uneven mechanical loading.ÌCircuit overloading: Consideration should be given to the connection of the equipment to the power supply circuitry and the effect that any possible overloading of circuits might have on overcurrent protection and power supply wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing this concern.ÌReliable ground: Reliable grounding must be maintained at all times.To ensure this, the rack itself should be grounded. Particular attentionshould be given to power supply connections other than the directconnections to the branch circuit (i.e., the use of power strips, etc.).Connection and ConfigurationHow to connect the appliance is described in the Hardware Quick Start Guide. For configuration you can follow the initial setup wizard described in the Web Admin Quick Start Guide or cancel it and perform a manual setup (see the Sophos Firewall How-To Library).Serial ConsoleYou can connect a serial console to either of the COM ports of the Sophos XGS hardware appliances. You can use, for instance, the Hyperterminal terminal program which is included with most versions of Microsoft Windows to log on to the appliance console. Use an RJ45 to DB9 adapter cable or the provided USB cable to connect the console to your hardware appliance.The required connection settings are:ÌBits per second: 38,400ÌData bits: 8ÌParity: N (none)ÌStop bits: 1Access via the serial console is activated by default on ttyS0. The connections of the appliances and the respective functionality are listed in chapter ‘Operating Elements and Connections’.Please Note: If you are connecting to the Micro USB port and it doesn’t show up as COM port but as unknown hardware in your system, please download a Micro USB Driver from https:///drivers/d2xx-drivers/.United Kingdom and Worldwide Sales Tel: +44 (0)8447 671131Email:****************North American SalesToll Free: 1-866-866-2802Email:******************Australia and New Zealand SalesTel: +61 2 9409 9100Email:****************.auAsia SalesTel: +65 62244168Email:********************© Copyright 2021. Sophos Ltd. All rights reserved.Registered in England and Wales No. 2096520, The Pentagon, Abingdon Science Park, Abingdon, OX14 3YP, UK Sophos is the registered trademark of Sophos Ltd. All other product and company names mentioned are trademarks or registered trademarks of their respective owners.。

Connect your worlds with one touch.Ease into a whole new world of digitalization and unlocking seamless flow of informationScanSnap Home – All-in-one software to optimize your productivity ScanSnap iX1600 and iX1400 –The next-generation ScanSnap experience A software specially designed for ScanSnap scanners,assisting users to easily manage, edit, and utilize various types of scanned data. Combining all your favorite functions, it allows users to organize your documents, receipts, business cards, photos and much moreall in one application. A brand new experience to digitize, augment, organize, and share information to fuel your business growth and innovation with the fastest models in the ScanSnap Series.Able to load up 50 sheets at a time and scan at a speedy 40 pages per minute, both models produce superior, high-quality images. Simply open the document chute, and ScanSnap is ready to go. Fast start-up and stable feeding performance provide you with a peace of mind while you carry out your tasks.ScanSnap iX1600 – Ultimate efficiency and flexibilityScan anywhere, whenever you want - Connects via Wi-Fi. Works without a computer. - Scans on any smart device or popular cloud service 1, desktop or document management application.Intuitive user experience The iX1600 comes equipped with a 4.3-inch touch screen, providing an easy to use interface with simple icons and intuitive user experience.Keeping documents in order is a breeze, whetherat the office or home. Select which device you would like to scan to, and share between multiplemembers and devices anytime.1 Available services vary by region.Ease into a whole new world of digitalization and unlocking se ScanSnap Home – All-in-one software to optimize your p ScanSnap iX1600 and iX1400 –The next-generation ScanSnap experience A software specially designed for ScanSnap scanners,assisting users to easily manage, edit, and utilize various types of scanned data. Combining all your favorite functions, it allows users to organize your documents, receipts, business cards, photos and much more all in one application. A brand new experience to digitize, augment, organize, and share information to fuel your business growth and innovation with the fastest models in the ScanSnap Series.Able to load up 50 sheets at a time and scan at a speedy 40 pages per minute, both models produce superior, high-quality images. Simply open the document chute, and ScanSnap is ready to go. Fast start-up and stable feeding performance provide you with a peace of mind while you carry out your files fasterFind files easily ScanSnap Home uses the text, found on your scanned documents to identify file names.Accuracy is heightened with increased use.Finding documents can never be easier. ScanSnap Home comes with functions to re-organize and perform searches on document types using folders, tags, and keywords.ScanSnap iX1600 – Ultimate efficiency and flexibility Scan anywhere, whenever you want - Connects via Wi-Fi. Works without a computer. - Scans on any smart device or popular cloud service 1, desktop or document management application.Intuitive user experience The iX1600 comes equipped with a 4.3-inch touch screen, providing an easy to use interface with simple icons and intuitive user experience. Keeping documents in order is a breeze, whether at the office or home. Select which device you would like to scan to, and share between multiple members and devices anytime.1 Available services vary by region.g seamless flow of information r productivity DocumentsQuickly find that recipe or meeting agendathat you stored last week with easy tagging features.ReceiptsKeep track of your spending habits each month so that you can check back wheneveryou desire.Easy to install, configure and start.Just for anyone - Personal, SOHO,Remote Office/Work from home,Small businesses, New to ScanSnap, New to scanning.Business CardsScanSnap Home’s intelligent auto correction makes managing business card contacts asimple and seamless process with less manual work for you. Organize your contacts with powerful search features.Satisfaction Can be used in conjunction with ScanSnap Manager software.ScanSnap iX1400 – Simple one-button scanning Simple no fuss operation The iX1400 refines simplicity and offers the signature, one-touch experience that ScanSnap users have come to love. Scan with a single touch of the button, with no compromises on performance and image quality.Leave behind the worry of Wi-FiConnectivity- Scans to PC with secure USB connection so that there is no need to worry about network availability.- USB connection dedicated model perfect for environments where Wi-Fi use is restricted.amless flow of information oductivity EaJus Re Sm NeSaCanS SimThesign use tou perSpecifications are subject to change without notice.Be sure to carefully read all safety precautions prior to using this product and use this device as instructed.For more ScanSnap related information, visit our website at :Do not place this device in wet, moist, steamy, dusty or oily areas. Using this product under such conditions may result in electrical shock, fire or damage to this product.Safety Precautions*1 Available only when connecting to a computer. *2 Scanning speeds may vary due to the system environment used.*3 Scans will be made in "Best mode" if shorter sides are less than 105 mm and in "Better mode" if not. *4 A3 scans are possible with use of A3 carrier sheets. *5 Available in all modes except for "Excellent mode". *6 Indicated specifications apply when using ScanSnap Home. *7 Maximum capacity varies, depending upon paper weight. *8 Some computers do not recognize the ScanSnap when it is connected to a USB 3.2 Gen1/3.0 port. In this case, please use a USB 2.0 cable. *9 Availability of 5 GHz Wi-Fi may vary depending on region. *10 Access Point Connect Mode requires a Wi-Fi access point or router. *11 5 GHz Wi-Fi is not available with Direct Connect Mode. *12 Excluding the stacker and other external attachments.*1 The ScanSnap device may not work if the connected computer does not meet these requirements. *2 The ScanSnap device also operates with Apple Silicon-based Mac computers. Please visit the ScanSnap website for latest support information. *3 Scanning speeds may drop if the recommended CPU, memory capacity and USB 1.1 requirements are not met. *Compatibility may differ depending on software versions. Please visit the ScanSnap website for latest information on driver and application support. *The system requirements may change depending on the support policies of the above system and third-party software.*1 ScanSnap scanners do not run with Windows® 10 ARM-based PCs.*2 Operate Windows in desktop mode. *3 The ScanSnap device may not work if the connected computer does not meet these requirements. *4 Scanning speeds may drop if the recommended CPU, memory capacity and USB 1.1 requirements are not met. *5 Indicated disk capacity requirements apply when downloading ScanSnap Home. *6 .NET Framework 4.7 or later must be installed. If it is not installed, it is installed with ScanSnap Home. Up to 4.5 GB of disk space is required for the installation.*Please refer to the ScanSnap website for the latest support information of the driver and applications. Compatibility may differ depending on the software's version. *The system requirements may change depending on the support policies of the above system and third-party software.iX1600 (White/Black)iX1400 (White)Product name Scanner type Scanning color modeScanning speed *(A4 portrait)Document sizeADF (Automatic Document Feeder)/Manual Feed, DuplexADF (Automatic Document Feeder)/ DuplexColor, Grayscale, Monochrome,Automatic (Color/Grayscale/Monochrome * detection)Color CIS x 2 (Front x 1, Back x 1)3 Color LED (Red/Green/Blue)Image sensor Light source600 dpiOptical resolutionSimplex/Duplex: 40 ppmSimplex/Duplex: 40 ppm(Color/Grayscale: 150 dpi, Monochrome: 300 dpi)Simplex/Duplex: 40 ppm(Color/Grayscale: 200 dpi, Monochrome: 400 dpi)Simplex/Duplex: 40 ppm(Color/Grayscale: 300 dpi, Monochrome: 600 dpi)Simplex/Duplex: 10 ppm(Color/Grayscale: 600 dpi, Monochrome: 1,200 dpi)Auto mode (Default)*Normal modeBetter mode Best mode Operating systemsWindows 10 (32-bit / 64-bit)**Windows 8.1 (32-bit / 64-bit)*Windows 7 (32-bit / 64-bit)Hardware requirements *Intel Celeron 1.8 GHz (2core) or higher(Recommended: Intel Core™ i5 2.5 GHz or higher)2 GB or more (Recommended: 4 GB or more)1,024 x 768 pixels or more3.8 GB or more of free hard disk spaceCPU *Memory capacity *Display resolution Disk capacity **Excellent mode *Minimum: 50.8 x 50.8 mm (2 x 2 in.)Maximum: 216 x 360 mm (8.5 x 14.17 in.) A3, B4,279 x 432 mm (11 x 17 in.) -*3,000 mm(863 mm in 32-bit) *3,000 mm (863 mm in 32-bit) Smart Device: 863 mm (Duplex), 1,726 mm (Simplex)40 to 209 g/m (11 to 56 lb)A8 size or less: 128 to 209 g/m (34 to 56 lb)Cards: 0.76 mm or less (Compliant with the ISO7810 ID-1 type)(Includes embossed cards in landscape orientation)Normal scan *Manual scan Long paper scanning *Paper weight (Thickness)50 sheets (A4, 80 g/m or 20 lb)ADF capacity *InterfaceWi-Fi InterfaceUSB 3.2 Gen1x1 / USB 2.0 / USB 1.1(Connector Type: Type-B)*IEEE802.11a/b/g/nFrequency band: 2.4 GHz *USBWi-FiAccess Point Connect Mode (Infrastructure mode)*Direct Connect Mode (Ad-hoc mode)*4.3 in. color TFT touch screen AC 100 to 240 V , 50/60 Hz 17 W or less 1.5 W or less 1.6 W or lessOperating Sleep mode(USB connected)Sleep mode(Wi-Fi connected)LCDPower requirementPowerconsumptionOverlap detection (Ultrasonic sensor), Length detection ScanSnap Home (ScanSnap specific driver) •Windows : Does not support TWAIN/ISIS™ •macOS: Does not support TWAINMultifeed detection DriverT emperature: 5 to 35 °C (41 to 95 °F)Relative humidity: 20 to 80% (Non-condensing) Operation environment 292 x 161 x 152 mm (11.5 x 6.3 x 6.0 in.) 3.4 kg (7.5 lb) 3.2 kg (7.1 lb)Dimensions (W x D x H)*Device weightENERGY STAR /RoHSEnvironmental compliance General SpecificationsScanSnap iX1600, iX1400 System Requirements•Windows®Operating systemsmacOS v.10.12.4 or laterHardwarerequirements *Intel Core i5 1.4 GHz or higher(Recommended: Core i5 2.5 GHz or higher)2 GB or more (Recommended: 8 GB or more)1,024 x 768 pixels or more2.0 GB or more of free hard disk spaceCPU **Memory capacity * Display resolution Disk capacity•Mac*1 ScanSnap Home installation requires a computer and Internet. Activation is also necessary for software use. Please visit the company website for download information. https:///g-support/en. *2 ScanSnap Manager V7.1 and later is required. *3 Please refer to the included license certificate to download the software. *4 Kofax Power PDF is not included with the iX1400.Kofax Power PDF Standard **Kofax Power PDF Standard for Mac **ScanSnap Home * ScanSnap Manager *Windows MacABBYY FineReader for ScanSnap™•Software*1 Although ScanSnap Carrier Sheets have a listed lifespan of 500 scans, the lifespan may vary with usage. ScanSnap Carrier sheets are intended to scan paper documents with weights of 127 g/m or less. They also support the scanning of folded documents that are as large as 216 x 297 mm.Carrier Sheets *DescriptionPhoto Carrier Sheets ScanSnap BagPart number RemarksPA03360-0013 PA03770-0015PA03951-0651Contains 5 sheets supporting photographs and various document sizesFor ScanSnap iX1600, iX1400, iX1500, iX500, iX100, S1100i ScanSnap Home Additional License (1 License)PA43404-B0431 additional license for ScanSnap HomeContains 3 sheets supporting photographs(E-size, L-size, King-size), postcards, and business cards Stores the ScanSnap iX1600, iX1400, iX1500, iX500 and accessoriesOptions*1 These recommended lifetimes are for 80 g/m (20 lb) A4 sized documents. Therefore, appropriate replacement lifetimes may vary for other document types.Roller Set Description Cleaner F1Cleaning Wipe Part number RemarksPA03656-0001PA03950-0352PA03950-0419Lifetime: Every 200,000 sheets or one year *(For ScanSnap iX1600, iX1400, iX1500 or iX500)100 ml bottleFor use on the Brake roller and Pick roller 24 packetsFor use on the Brake roller and Pick roller Cleaning PaperCA99501-001210 sheetsUse this non-woven sheet with Cleaner F1Consumables*It is recommended to use original or approved accessories for consumables, options and cleaning kits, specially designed for your device. Device failures, troubles and damages arising from use of OEM or 3rd Party accessories may render your warranty invalid and incur charges for repair even during the warranty period.©2021 PFU Limited Printed in some country 2021.01 U-208 SZX 50SPFU Limited, a Fujitsu company, has determined that this product meets the ENERGY STAR ® guidelines for energy efficiency. ENERGY STAR ® is a registered trademark of the United States.----This scanner is designed to digitize materials that can be reproduced lawfully, in accordance with applicable copyright regulations and other laws. ScanSnap users are responsible for how they use this scanner. It is imperative that ScanSnap users comply with all applicable local rules and laws, including, without limitation, copyright laws when using this scanner.*ABBYY™ FineReader™ Engine © ABBYY. OCR by ABBYY. ABBYY and FineReader are trademarks of ABBYY Software, Ltd. which may be registered in some jurisdictions. *Intel, Pentium, and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. *ISIS™ is a trademark of Open Text. *Mac, macOS, and the Mac logo are trademarks of Apple Inc. *Kofax and Power PDF are trademarks or registered trademarks of Kofax Limited in the United States and other countries. *ScanSnap, the ScanSnap logo and ScanSnap Home are registered trademarks or trademarks of PFU Limited in Japan. *Other company names and product names are the trademarks or registered trademarks of the respective companies.Accessories•Safety Precautions •AC Cable •AC Adapter •USB Cable •Receipt Guide。

34HM | MOTOR PROTECTORSHermetically Sealed On-Winding, 3-Phase SPECIFICATIONSFProduct DescriptionLine Break Operation• Protect WYE (Star) wound 3-phase motors from 1 to 6HP. Used in refrigeration compressors, submersible pumps and other restrictive environments.shape allows for close coupling to motor windings.• Hermetic reliability designed for leakage rates less than 1 x 10-9 cc per second of air with 1 atmosphere pressure differential.• Klixon® snap-action discs assure positive make and break action and controlled temperature differential.• Designed for low and high side pressure applications.Klixon® 16HM motor protectors are line break automatic reset controls which are wired in series with the motor windings. These protectors are designed to track winding temperatures and to respond to changes in line current. When properly applied, the 16HM can provide protection againstmotor overheating under the following conditions:This protector is designed to protect 3-phase refrigeration and air conditioning compressor motors from excessive winding temperature; however, device to be installed directly on motor windings for closely coupled temperature monitoring, thus enhancing over-temperature protection against loss of refrigeration charge, low voltage locked rotor, and secondary single-phasing (loss of phase). The 34HM is designed to reduce installation costs by replacing pilot control systems with a simple, economical, compact device.The basic element of the 34HM is the famous Klixon® Snap ActMaximum Recommended Locked Rotor CurrentCurrent ratings are based on life test data which has demonstrated high reliability at 5K cycles (standard series) and 2K cycles (high capacity series) at 0.7 ower factor on Sensata life test boards. These capacities are intended as a guide for application work.Standard Operating TemperaturesDIAGRAMS34HM Hermetic Motor ProtectorElectrical SchematicWUnitInsmmW0.67017.0H1.14029.0P10.55614.1L1.17029.7P20.0892.3P30.2506.4A0.58514.9B1.08027.4Standard / High Capacity DeviceProtector ShellCompressorMotorWindings34HM CODE SYSTEMQuick ConnectsWire LeadsSleeves, etc.When making an inquiry on Klixon® hermetically sealed motor protectors, be certain to specify the entire part number for your application,AGENCY APPROVALS & CERTIFICATIONSPage 5CONTACT USSensata Technologies, Inc. (“Sensata”) data sheets are solely intended to assist designers (“Buyers”) who are developing systems thatincorporate Sensata products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains responsiblefor using its independent analysis, evaluation and judgment in designing Buyer’s systems and products. Sensata data sheets havebeen created using standard laboratory conditions and engineering practices. Sensata has not conducted any testing other than thatspecifically described in the published documentation for a particular data sheet. Sensata may make corrections, enhancements,improvements and other changes to its data sheets or components without notice.Buyers are authorized to use Sensata data sheets with the Sensata component(s) identified in each particular data sheet. HOWEVER, NOOTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER SENSATA INTELLECTUAL PROPERTY RIGHT, ANDNO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN. SENSATA DATA SHEETSARE PROVIDED “AS IS”. SENSATA MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE DATA SHEETS OR USEOF THE DATA SHEETS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR COMPLETENESS. SENSATA DISCLAIMSANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, QUIETENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARDTO SENSATA DATA SHEETS OR USE THEREOF.All products are sold subject to Sensata’s terms and conditions of sale supplied at SENSATA ASSUMES NO LIABILITYFOR APPLICATIONS ASSISTANCE OR THE DESIGN OF BUYERS’ PRODUCTS. BUYER ACKNOWLEDGES AND AGREES THAT IT IS SOLELYRESPONSIBLE FOR COMPLIANCE WITH ALL LEGAL, REGULATORY AND SAFETY-RELATED REQUIREMENTS CONCERNING ITS PRODUCTS,AND ANY USE OF SENSATA COMPONENTS IN ITS APPLICATIONS, NOTWITHSTANDING ANY APPLICATIONS-RELATED INFORMATIONAmericas+1 (508) 236-2551electrical-protection-sales@sensata.comEurope, Middle East & Africa+1 (760) 597 7042*****************************************************.comChina +86 (21)2306 1651Japan +81 (45)277 7104Korea +82 (53) 644 9685India +91 (40)4033 9611Rest of Asia +886 (2) 27602006ext 2808。