LSYT676-Q+Q中文资料

如需产品安装、维护或支持信息，请参考本文档末的信息。

1.0 产品描述供货尺寸：• 1 – 12"/DN25 – DN300• 14 – 24"/DN350 – DN600 的尺寸，请参考 20.02 号技术文件: Victaulic （唯特利）W07 型 AGS ™ 刚性卡箍 最大工作压力：• 支持的压力额定值从真空（29.9 in Hg/760 mm Hg ）到750 psi/5171 kPa/52 Bar • 工作压力视管道材料、壁厚和尺寸而定应用：• 连接 Victaulic （唯特利）原始沟槽系统(OGS)辊槽管和切槽管、阀门、管件及配件• 提供刚性管道连接，可限制轴向或角向移动。

如需抗扭强度的相关信息，请与 Victaulic （唯特利）联系。

管道材料：• 碳钢• 关于不锈钢管的用途，请参考17.09 号技术文件：用于不锈钢管道的 Victaulic （唯特利）沟槽卡箍性能数据。

• 有关例外情况，请参阅第 6.0 节“通知”管道制备• 切槽或辊槽，依照25.01号技术文件：Victaulic （唯特利）标准沟槽规格规范要求：• 支撑和悬挂要求符合 ASME B31.1 电力管道规范和 ASME B31.9 建筑服务管道规范和 NFPA 13 喷淋系统要求2.0 认证/列名EN 10311CPR (EU)No. 305/2011BS EN 10311CPR (UK)2019 No. 465注• 如需消防认证/列名参考指南，请下载10.01号技术文件。

•有关适用的饮用水认证，请参见02.06号技术文件：Victaulic （唯特利）饮用水认证 ANSI/NSF 。

Victaulic ®（唯特利™）Zero-Flex ™刚性卡箍07 型06.02-CHI3.0 规格 – 材料壳体：符合 ASTM 之 65-45-12 等级要求的球墨铸铁。

根据特殊要求，可提供符合 ASTM A395 之 65-45-15 等级要求的球墨铸铁。

Serial Transceiver Channels by Device/PackageTable 1-3 lists the quantity of GTX serial transceiver channels for most of the Zynq-7000SoC devices. In all devices, a serial transceiver channel is one set of MGTRXP, MGTRXN, MGTTXP, and MGTTXN pins. The XC7Z012S and XC7Z015, in the CLG485 package, have four GTP serial transceiver channels.Table 1-4 shows the number of available SelectIO resources (SIO), the number of differential SIO pairs, and the number of available PS I/Os for each Zynq-7000SoC device/package combination. When applicable, it also lists the number of SIOs in the 3.3V-capablehigh-range (HR) banks and the number of 1.8V-capable high-performance (HP) banks.Vivado Design Suite report_ssn tool. See the Simultaneous Switching Outputs section of the 7Series FPGAs SelectIO Resources User Guide (UG471) [Ref 8] for more information.Table 1-3:Serial Transceiver Channels by Device/PackageDeviceGTX (or GTP) Channels by PackageCL/CLG225CL/CLG400CL/CLG484CL/CLG485FB/FBG/FBV484SBG/SBV485RB484FB/FBG/FBV676FF/FFG/FFV676RF/RFG676FF/FFG/FFV900RF900FF/FFG/FFV1156RF1156XC7Z007S ––––––XC7Z010XA7Z010––––––XC7Z012S – 4 (GTP)––––XC7Z015– 4 (GTP)––––XC7Z014S ––––––XC7Z020XA7Z020––––––XC7Z030––44––XA7Z030––4–––XC7Z035–––816–XC7Z045–––816–XC7Z100––––1616XQ7Z020––––––XQ7Z030––44––XQ7Z045–––816–XQ7Z100––––1616Table 1-4:Available SIO and PS I/O Pins by Device/Package CombinationDevice I/O PinsCL225CLG225CL400CLG400CL484CLG484CLG485FB484FBG484FBV484RB484SBG485SBV485FB676FBG676FBV676FF676FFG676FFV676RF676RFG676FF900FFG900FFV900RF900FF1156FFG1156FFV1156RF1156SIO PSI/OSIO PSI/OSIO PSI/OSIO PSI/OSIO PSI/OSIO PSI/OSIO PSI/OSIO PSI/O HR HP HR HP HR HP HR HP HR HP HR HP HR HP HR HPXC7Z007S User I/O540861000128––––––––––––––––––Differential270–480–––––––––––––––––––XC7Z010 XA7Z010User I/O540861000128––––––––––––––––––Differential270–480–––––––––––––––––––XC7Z012S User I/O––––––1500128–––––––––––––––Differential––––––720––––––––––––––––XC7Z015User I/O––––––1500128–––––––––––––––Differential––––––720––––––––––––––––XC7Z014S User I/O–––12501282000128–––––––––––––––Differential–––600–960––––––––––––––––XC7Z020 XA7Z020User I/O–––12501282000128–––––––––––––––Differential–––600–960––––––––––––––––XC7Z030User I/O–––––––––1006312850100128100150128––––––Differential–––––––––4829–2448–4872–––––––XA7Z030User I/O–––––––––10063128––––––––––––Differential–––––––––4829–––––––––––––XC7Z035User I/O–––––––––––––––100150128212150128–––Differential–––––––––––––––4872–10272––––XC7Z045User I/O–––––––––––––––100150128212150128–––Differential–––––––––––––––4872–10272––––XC7Z100User I/O––––––––––––––––––212150128250150128 Differential––––––––––––––––––10272–12072–XQ7Z020User I/O–––12501282000128–––––––––––––––Differential–––600–960––––––––––––––––XQ7Z030User I/O–––––––––10063128–––100150128––––––Differential–––––––––4829––––4872–––––––XQ7Z045User I/O–––––––––––––––100150128212150128–––Differential–––––––––––––––4872–10272––––XQ7Z100User I/O––––––––––––––––––212150128250150128 Differential––––––––––––––––––10272–12072–VRN(8)Multi-function N/A This pin is for the DCI voltage reference resistor of N transistor (per bank, to be pulled High with reference resistor).VRP(8)Multi-function N/A This pin is for the DCI voltage reference resistor of P transistor (per bank, to be pulled Low with reference resistor).DXP_0, DXN_0(9)Dedicated N/A Temperature-sensing diode pins (Anode: DXP; Cathode: DXN). The thermal diode is accessed by using the DXP and DXN pins in bank 0. When not used, tie to GND.To use the thermal diode an appropriate external thermal monitoring IC must be added.The recommended temperature monitoring solution for Zynq-7000SoC devices uses the temperature sensor in the XADC block.T0, T1, T2, or T3Multi-function N/A This pin belongs to the memory byte group 0-3.T0_DQS, T1_DQS,T2_DQS, or T3_DQS Multi-function Bidirectional The DDR DQS strobe pin that belongs to the memory byte group T0–T3.Table 1-5:Zynq-7000SoC Pin Definitions (Cont’d)Pin Name Type Direction DescriptionPackage Pin Compatible DevicesCL225/CLG2257Z007S7Z010CL400/CLG4007Z007S7Z0107Z014S7Z020CL484/CLG4847Z014S7Z020SB/SBG/SBV485 or7Z012S7Z0157Z030CL/CLG485FB/FBG/FBV484 or RB4847Z030FB/FBG/FBV676 or7Z0307Z0357Z045 FF/FFG/FFV676 or RF/RFG676FF/FFG/FFV900 or RF9007Z0357Z0457Z100FF/FFG/FFV1156 or RF11567Z100。

Hyper Multi SIDELED ®Hyper-Bright LEDLSY A676Besondere Merkmaleq Gehäusefarbe: weißq als optischer Indikator einsetzbarq zur Hintergrundbeleuchtung, Lichtleiter- und Linsenein-kopplungq hohe Signalwirkung durch Farbwechsel der LED möglich q bei geeigneter Ansteuerung, Farbwechsel von grün über gelb und orange bis super-rot möglichq für alle SMT-Bestück- und Löttechniken geeignet qgegurtet (12-mm-Filmgurt)Featuresq color of package: white q for use as optical indicatorq for backlighting, optical coupling into light pipes and lenses q high signal efficiency possible by color change of the LED qwith appropriate controlling it is possible to change color from green to yellow and orange to super-redq suitable for all SMT assembly and soldering methods q available taped on reel (12 mm tape)TypTypeEmissions-farbe Color of EmissionFarbe der Lichtaus-trittsfläche Color of the Light Emitting Area Lichtstärke Luminous Intensity I F = 20 mA I V (mcd)BestellnummerOrdering Codesuper-red yellow LSY A676LSY A676-P+P LSY A676-P+Q LSY A676-P+R LSY A676-Q+Q LSY A676-Q+Rsuper-red /yellowcolorless clear≥ 4040...8040...8040...8063...12563 (125)≥ 4040...8063...125100...20063...125100 (200)Q62703-Q3374v p l 06880Grenzwerte Maximum RatingsBezeichnung Parameter SymbolSymbolWertValueEinheitUnitS YBetriebstemperatur Operating temperature range Top– 55 ... + 100˚CLagertemperaturStorage temperature range Tstg– 55 ... + 100˚CSperrschichttemperatur Junction temperature Tj+ 100˚CDurchlaßstrom Forward current IF3020mAStoßstromSurge currentt≤10µs,D = 0.005IFMto be defined AVerlustleistung Power dissipation Ptot8055mWWärmewiderstand Thermal resistance Sperrschicht / Umgebung Junction / airMontage auf PC-Board* (Padgröße≥ 16 mm 2) mounted on PC board* (pad size≥ 16 mm 2)Rth JA530K/W*PC-board: FR4NotesDie angegebenen Grenzdaten gelten für den Chip, für den sie angegeben sind, unabhängig vom Betriebszustand des anderen.The stated maximum ratings refer to the specified chip, regardless of the other one’s operating status.Kennwerte (T A = 25 ˚C)Characteristics Bezeichnung ParameterSymbol SymbolWert ValueEin-heit Unit SY Wellenlänge des emittierten Lichtes (typ.)Wavelength at peak emission (typ.)I F = 10 mAλpeak 645591nmDominantwellenlänge (typ.)Dominant wavelength (typ.)I F = 10 mAλdom 632587nmSpektrale Bandbreite bei 50 %I rel max (typ.)Spectral bandwidth at 50 %I rel max (typ.)I F = 10 mA∆λ1615nmAbstrahlwinkel bei 50 %I V (Vollwinkel)Viewing angle at 50 %I V2ϕ120120Grad deg.Durchlaßspannung (typ.)Forward voltage (max.)I F = 20 mAV F V F 2.02.6 2.02.6V V Temperaturkoeffizient von λdom (I F = 20 mA)Temperature coefficient of λdom (I F = 20 mA)TC λ0.0140.096nm/K Temperaturkoeffizient von λpeak ,I F = 20 mA(typ.)Temperature coefficient of λpeak ,I F = 20 mA(typ.)TC λ0.140.13nm/KTemperaturkoeffizient von V F ,I F = 20 mA(typ.)Temperature coefficient of V F ,I F = 20 mA(typ.)TC V – 1.95–2.51mV/KRelative spektrale Emission I rel=f (λ),T A = 25 ˚C,I F= 10 mA Relative spectral emissionV (λ) =spektrale AugenempfindlichkeitStandard eye response curveAbstrahlcharakteristik I rel=f (ϕ)Radiation characteristicDurchlaßstrom I F =f (V F )Forward current T A = 25 ˚CRelative Lichtstärke I V /I V(20 mA) =f (I F )Relative luminous intensity T A= 25 ˚C Maximal zulässiger Durchlaßstrom I F =f (T A )Max. permissible forward currentRelative Lichtstärke I V /I V(25 ˚C)=f (T A )Relative luminous intensity I F= 10 mAMaßzeichnung (Maße in mm, wenn nicht anders angegeben)Package Outlines (Dimensions in mm, unless otherwise specified)G P L 06950L SYA676LEDEmission color 1Emission color 2PackageCathode: pin 1Cathode: pin 2。

Continental Device India LimitedAn IS/ISO 9002 and IECQ Certified ManufacturerPNP EPITAXIAL PLANAR SILICON TRANSISTORCSA952(9AW)TO-92BCEMARKING : AS BELOWAudio Frequency Power plementary CSC2001ABSOLUTE MAXIMUM RATINGS(Ta=25deg C unless otherwise specified)DESCRIPTION SYMBOL VALUEUNIT Collector -Base VoltageBVCBO 30V Collector Emitter VoltageBVCEO 25V Emitter Base VoltageBVEBO 5.0V Collector Current (DC)IC 700mA Collector Current (Peak)ICP** 1.0A Collector Power DissipationPtot 600mW Operating And Storage JunctionTj, Tstg -55 to +150deg CTemperature Range**PW=10ms, duty cycle=50%ELECTRICAL CHARACTERISTICS (Ta=25 deg C Unless Otherwise Specified)DESCRIPTION SYMBOL TEST CONDITION MINTYP MAX UNIT Collector Cut off CurrentICBO VCB=30V, IE=0--100nA ICEO VCE=25V, IB=0-- 1.0uA Emitter Cut off CurrentIEBO VEB=5V, IC=0--100nADC Current GainhFE (1)VCE=1V, IC=100mA*90-400hFE (2)VCE=1V, IC=700mA*50--Base Emitter VoltageVBE(on)IC=10mA, VCE=6V*0.6-0.7V Collector Emitter Saturation Voltage VCE(Sat) IC=700mA,IB=70mA*--0.6V Base Emitter Saturation VoltageVBE(Sat)IC=700mA, IB=70mA*-- 1.2V Dynamic CharacteristicsTransition Frequencyft VCE=6V, IC=10mA,50--MHz Collector Output CapacitanceCob VCB=6V, IE=0--40pFf=1MHzhFE(1) Classification : M : 90-180; L : 135-270; K : 200-400Marking CSA CSA CSA952952952M L K*PW=350us, duty cycle=2% pulsedIS/ISO 9002Lic# QSC/L- 000019.2IS / IECQC 700000IS / IECQC 750100TO-92 Transistors on Tape and Ammo PackTO-92 Plastic PackageTO-92 Bulk TO-92 T&A1K/polybag 2K/ammo box200 gm/1K pcs 645 gm/2K pcs3" x 7.5" x 7.5"12.5" x 8" x 1.8"5.0K 2.0K17" x 15" x 13.5"17" x 15" x 13.5"80.0K 32.0K23 kgs 12.5 kgsPACKAGENet Weight/Qty DetailsSTANDARD PACKINNER CARTON BOXQty OUTER CARTON BOXQty Gr Wt SizeSizePacking Detail1. M AX IM UM A LIG NM E NT D EV IATIO N B ETW EEN LE ADS NOT TO B E G RE ATER TH AN 0.2 m m.2. M AX IM UM NO N-CU M ULATIV E VAR IATIO N BETW EE N TAP E FE ED HO LE S SH ALL NO T EX CE ED 1 m m IN 20 PIT CH ES.3. H OLD D OW N TAP E NO T TO E XC EE D B EY OND T HE ED G E(S) O F CA RR IER TA PE AND T HE RE S H ALL BE NO EX PO SU R E O F AD H ESIV E.4. NO M O R E TH AN 3 C ONSE CU TIV E M ISS ING C O M PO NE NT S AR E PER M ITTE D.5. A TA PE TR A ILE R, H AVING AT LEA ST TH R EE F EED H OLE S A RE RE QU IR ED AFTE R T HE LAST CO M PO NENT.6. SP LICE S S HA LL NO T INTE RFE RE W ITH TH E SP R OC KE T FEE D H OLE S.A l l d i m i n s i o n s i n m m .DIM MIN.MAX.A 4.32 5.33B 4.45 5.20C 3.18 4.19D 0.410.55E 0.350.50F 5 DEG G 1.14 1.40H 1.14 1.53K12.70—PIN CONFIGURATION 1. BASE2. COLLECTOR3. EMITTERNotesDisclaimerThe product information and the selection guides facilitate selection of the CDIL's Discrete Semiconductor Device(s)best suited for application in your product(s)as per your requirement.It is recommended that you completely review our Data Sheet(s)so as to confirm that the Device(s)meet functionality parameters for your application.The information furnished on the CDIL Web Site/CD is believed to be accurate and reliable.CDIL however,does not assume responsibility for inaccuracies or incomplete information.Furthermore,CDIL does not assume liability whatsoever,arising out of the application or use of any CDIL product; neither does it convey any license under its patent rights nor rights of others.These products are not designed for use in life saving/support appliances or systems.CDIL customers selling these products(either as individual Discrete Semiconductor Devices or incorporated in their end products),in any life saving/support appliances or systems or applications do so at their own risk and CDIL will not be responsible for any damages resulting from such sale(s).CDIL strives for continuous improvement and reserves the right to change the specifications of its products without prior notice.CDIL is a registered Trademark ofContinental Device India LimitedC-120 Naraina Industrial Area, New Delhi 110 028, India.Telephone + 91-11-579 6150 Fax + 91-11-579 9569, 579 5290e-mail sales@ 。

LG T672, LP T672Super TOPLED ®High-Current LED Abgek ündigt nach PD_078_02 - werden durch LG_LP T676 ersetzt werdenObsolete acc. to PD_078_02 - will be replaced by LG_LP T6762003-09-041Besondere Merkmale•Geh äusetyp: wei ßes P-LCC-2 Geh äuse, farbloser klarer Verguss•Besonderheit des Bauteils: extrem breite Abstrahlcharakteristik, ideal f ürHinterleuchtungen und Einkopplungen in Lichtleiter; h öherer zul ässiger Betriebsstrom •Wellenl änge: 570 nm (gr ün), 560nm (pure green)•Abstrahlwinkel: Lambertscher Strahler (120°)•Technologie: GaAsP (gr ün), GaP (pure green)•optischer Wirkungsgrad: 1,5lm/W (gr ün), 0,6lm/W (pure green)•Gruppierungsparameter: Lichtst ärke •Verarbeitungsmethode: f ür alle SMT-Best ücktechniken geeignet •L ötmethode: IR Reflow L öten und Wellenl öten (TTW)•Vorbehandlung: nach JEDEC Level 2•Gurtung: 8-mm Gurt mit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Anwendungen•optischer Indikator•Hinterleuchtung (LCD, Handy, Schalter, Tasten, Displays)•Innenbeleuchtung im Automobilbereich (z.B.Instrumentenbeleuchtung u. ä.)Features•package: white P-LCC-2 package, colorless clear•feature of the device: extremely wide viewing angle, ideal for backlighting and coupling in light guides; higher permissible current •wavelength: 570nm (green), 560nm (pure green)•viewing angle: Lambertian Emitter (120°)•technology: GaAsP (green), GaP (pure green)•optical efficiency: 1.5lm/W (green), 0.6lm/W (pure green)•grouping parameter: luminous intensity •assembly methods: suitable for all SMT assembly methods•soldering methods: IR reflow soldering and TTW soldering•preconditioning: acc. to JEDEC Level 2•taping: 8mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mmApplications•optical indicators•backlighting (LCD, cellular phones, switches, keys, displays)•interior automotive lighting (e.g. dashboard backlighting)2003-09-042s Abgek ündigt nach PD_078_02 - werden durch LG_LP T676 ersetzt werden Obsolete acc. to PD_078_02 - will be replaced by LG_LP T676Letzte Bestellung / Last Order: 30.09.2003Letzte Lieferung / Last Delivery: 31.03.2004Anm.:-1 gesamter Farbbereich (siehe Seite 4)Die Standardlieferform von Serientypen beinhaltet eine untere bzw. obere Familiengruppe. Diese besteht aus 3bzw.4Helligkeitshalbgruppen. Einzelne Helligkeitshalbgruppen sind nicht bestellbar.In einer Verpackungseinheit /Gurt ist immer nur eine Helligkeitshalbgruppe enthalten.Note:-1 Total color tolerance range (see page 4)The standard shipping format for serial types includes a lower or upper family group of 3or 4individual luminous intensity half groups. Individual luminous intensity half groups cannot be ordered.No packing unit /tape ever contains more than one luminous intensity half group.TypTypeEmissions-farbe Color of EmissionLichtst ärkeLuminous Intensity I F = 50mA I V (mcd)LichtstromLuminous Flux I F = 50mA ΦV (mlm)BestellnummerOrdering Codes LG T672-P1Q1-1s LG T672-Q1R2-1green 45.0 ...90.071.0 ...180.0190 (typ.)350 (typ.)Q62703Q5014Q62703Q5015s LP T672-L2M2-1s LP T672-M2P1-1pure green14.0 ...28.022.4 ...56.062 (typ.)110 (typ.)Q65110Q0325Q65110Q03262003-09-043GrenzwerteMaximum Ratings Bezeichnung ParameterSymbol Symbol Wert Value Einheit Unit BetriebstemperaturOperating temperature range T op – 40 … + 100°C LagertemperaturStorage temperature range T stg – 40 … + 100°C Sperrschichttemperatur Junction temperature T j + 100°C DurchlassstromForward current (T A =25°C)I F 50mA Sto ßstrom Surge currentt ≤ 10 µs, D = 0.005, T A =25°C I FM1ASperrspannung 1)Reverse voltage (T A =25°C)V R 12V LeistungsaufnahmePower consumption (T A =25°C)P tot160mWW ärmewiderstand Thermal resistanceSperrschicht/Umgebung 2)Junction/ambient 2)Sperrschicht/L ötpad Junction/solder pointR th JA R th JS30080K/W K/W1)f ür kurzzeitigen Betrieb geeignet / suitable for short term application 2)Montage auf PC-Board FR 4 (Padgr öße ≥ 16mm 2)mounted on PC board FR 4 (pad size ≥ 16mm 2)2003-09-044Kennwerte (T A = 25 °C)Characteristics Bezeichnung ParameterSymbol SymbolWerte ValuesEinheit Unit LGLP Wellenl änge des emittierten Lichtes (typ.)Wavelength at peak emission I F = 50mAλpeak572557nmDominantwellenl änge 1)Dominant wavelength I F = 50mAλdom570560nmSpektrale Bandbreite bei 50 % I rel max (typ.)Spectral bandwidth at 50 % I rel max I F = 50mA∆λ2522nmAbstrahlwinkel bei 50 % I V (Vollwinkel)(typ.) Viewing angle at 50 % I V (typ.) 2ϕ120120Grad deg.Durchlassspannung 2)(typ.)Forward voltage (max.)I F = 50mA V F V F 2.63.5 2.62.7V VSperrstrom(typ.)Reverse current (max.)V R = 12 VI R I R 0.01100.0110µA µATemperaturkoeffizient von λpeak (typ.)Temperature coefficient of λpeak I F = 50mA; –10°C ≤ T ≤ 100°C TC λpeak0.110.11nm/KTemperaturkoeffizient von λdom (typ.)Temperature coefficient of λdom I F = 50mA; –10°C ≤ T ≤ 100°C TC λdom0.070.05nm/KTemperaturkoeffizient von V F (typ.)Temperature coefficient of V F I F = 50mA; –10°C ≤ T ≤ 100°C TC V– 2.0– 2.0mV/KOptischer Wirkungsgrad (typ.)Optical efficiency I F = 50mAηopt1.50.6lm/W1)Wellenl ängen werden mit einer Stromeinpr ägedauer von 25ms und einer Genauigkeit von ±1nm ermittelt.Wavelengths are tested at a current pulse duration of 25ms and a tolerance of ±1nm.2)Spannungswerte werden mit einer Stromeinpr ägedauer von 1ms und einer Genauigkeit von ±0,1V ermittelt.Voltages are tested at a current pulse duration of 1ms and a tolerance of ±0.1V.2003-09-045Helligkeitswerte werden mit einer Stromeinpr ägedauer von 25ms und einer Genauigkeit von ±11% ermittelt.Luminous intensity is tested at a current pulse duration of 25ms and a tolerance of ±11%.Helligkeits-Gruppierungsschema Luminous Intensity Groups LichtgruppeLuminous Intensity Group Lichtst ärkeLuminous Intensity I V (mcd)Lichtstrom Luminous Flux ΦV (mlm)L2M1M2N1N2P1P2Q1Q2R1R214.0 …18.018.0 …22.422.4 …28.028.0 …35.535.5 …45.045.0 …56.056.0 …71.071.0 …90.090.0 …112.0112.0 …140.0140.0 …180.050 (typ.)60 (typ.)75 (typ.)95 (typ.)120 (typ.)150 (typ.)190 (typ.)240 (typ.)300 (typ.)380 (typ.)480 (typ.Relative spektrale Emission I rel = f (λ), T A = 25 °C, I F = 50mA Relative Spectral EmissionV(λ) = spektrale AugenempfindlichkeitStandard eye response curveAbstrahlcharakteristik I rel = f (ϕ)2003-09-046Durchlassstrom I F = f (V F)Forward CurrentMaximal zulässiger Durchlassstrom I F = f (T) Max. Permissible Forward Current Relative Lichtstärke I V/I V(50mA) = f (I F) Relative Luminous IntensityMaximal zulässiger Durchlassstrom I F = f (T)Max. Permissible Forward Current2003-09-047Relative Lichtstärke I V/I V(25 °C) = f (T A) Relative Luminous IntensityZulässige Impulsbelastbarkeit I F = f (t p) Permissible Pulse Handling Capability2003-09-048MaßzeichnungPackage OutlinesMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Kathodenkennung:abgeschrägte EckeCathode mark:bevelled edgeGewicht / Approx. weight:35mg2003-09-049Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil(nach IPC 9501)IR Reflow Soldering Profile(acc. to IPC 9501)2003-09-0410Wellenlöten (TTW)(nach CECC 00802)TTW Soldering(acc. to CECC 00802)2003-09-0411Empfohlenes Lötpaddesign IR-Reflow LötenRecommended Solder Pad IR Reflow SolderingMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat2003-09-0412Empfohlenes Lötpaddesign verwendbar für TOPLED® und Power TOPLED®IR Reflow LötenRecommended Solder Pad useable for TOPLED® and Power TOPLED®IR Reflow SolderingMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2003-09-0413Gurtung / Polarität und Lage Verpackungseinheit2000/Rolle, ø180 mmoder 8000/Rolle, ø330 mmMethod of Taping / Polarity and Orientation Packing unit2000/reel, ø180 mmor 8000/reel, ø330 mmMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).Anm.:Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten.Note:Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC.2003-09-04142003-09-0415Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved.Attention please!The information describes the type of component and shall not be considered as assured characteristics.All typical data and graphs are basing on representative samples, but don ’t represent the production range. If requested,e.g. because of technical improvements, these typ. data will be changed without any further notice.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the Internet.PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.1A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system.2Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.Revision History:2003-09-04Date of changePrevious Version:2003-08-04Page Subjects (major changes since last revision)9change of weight from 40mg to 35mg 2002-06-2814annotations2002-07-2313recomm. solder pad for TOPLED ® and Power TOPLED ® (OHLPY440)2002-08-053, 4value (reverse voltage from 5V to 12V)2002-09-182Ordering Code 2002-09-16all nor for new designs 2002-11-181, 2Obsolete 2003-08-0414note: dry pack 2003-09-043ambient temperature2003-09-04。

IntroductionThe Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL)V CCINT/V CCBRAM=0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges.All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.The available device/package combinations are outlined in:•Zynq-7000SoC Overview (DS190)•Defense-grade Zynq-7000Q SoC Overview (DS196)•XA Zynq-7000SoC Overview (DS188)This Zynq-7000SoC data sheet, which covers the specifications for the XC7Z030, XA7Z030, XQ7Z030,XC7Z035, XC7Z045, XQ7Z045, XC7Z100, and XQ7Z100 complements the Zynq-7000SoC documentation suite available on the Xilinx website at .DC CharacteristicsDS191 (v1.18.1) July 2, 2018Product Specification Table 1:Absolute Maximum Ratings(1)Symbol Description Min Max Units Processing System (PS)V CCPINT PS internal logic supply voltage–0.5 1.1VV CCPAUX PS auxiliary supply voltage–0.5 2.0VV CCPLL PS PLL supply–0.5 2.0VV CCO_DDR PS DDR I/O supply–0.5 2.0VV CCO_MIO(2)PS MIO I/O supply–0.5 3.6VV PREF PS input reference voltage–0.5 2.0VV PIN(2)(3)(4)(5)PS MIO I/O input voltage–0.40V CCO_MIO+0.55V PS DDR I/O input voltage–0.55V CCO_DDR+0.55V Programmable Logic (PL)V CCINT PL internal supply voltage–0.5 1.1VV CCBRAM PL supply voltage for the block RAM memories–0.5 1.1VV CCAUX PL auxiliary supply voltage–0.5 2.0VV CCO PL output drivers supply voltage for HR I/O banks–0.5 3.6V PL output drivers supply voltage for HP I/O banks–0.5 2.0VV CCAUX_IO(4)Auxiliary supply voltage–0.5 2.06VTable 61:OLOGIC Switching CharacteristicsSymbol DescriptionSpeed GradeUnits -3E-2E/-2I/-2LI-1C/-1I-1Q/-1LQSetup/HoldT ODCK/T OCKD D1/D2 pins setup/hold with respect to CLK0.45/–0.130.50/–0.130.58/–0.130.58/–0.13nsT OOCECK/T OCKOCE OCE pin setup/hold with respect to CLK0.28/0.030.29/0.030.45/0.030.45/0.03nsT OSRCK/T OCKSR SR pin setup/hold with respect to CLK0.32/0.180.38/0.180.70/0.180.70/0.18nsT OTCK/T OCKT T1/T2 pins setup/hold with respect to CLK0.49/–0.160.56/–0.160.68/–0.160.68/–0.13nsT OTCECK/T OCKTCE TCE pin setup/hold with respect to CLK0.28/0.010.30/0.010.45/0.010.45/0.06ns CombinatorialT ODQ D1 to OQ out or T1 to TQ out0.730.810.970.97ns Sequential DelaysT OCKQ CLK to OQ/TQ out0.410.430.490.49nsT RQ_OLOGICE2SR pin to OQ/TQ out (HP I/O banks only)0.630.700.830.83nsT GSRQ_OLOGICE2Global set/reset to Q outputs (HP I/O banks only)7.607.6010.5110.51nsT RQ_OLOGICE3SR pin to OQ/TQ out (HR I/O banks only)0.630.700.830.83nsT GSRQ_OLOGICE3Global set/reset to Q outputs (HR I/O banks only)7.607.6010.5110.51ns Set/ResetT RPW_OLOGICE2Minimum pulse width, SR inputs (HP I/O banks only)0.540.540.630.63ns, Min T RPW_OLOGICE3Minimum pulse width, SR inputs (HR I/O banks only)0.540.540.630.63ns, Min质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工业级IC，军级二三极管，功率管等;应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通信网络、电力工业以及大型工业设备祝您:工作顺利，生活愉快!以赛灵思半导体（深圳）有限公司提供的参数为例，以下为XC7Z045-1FFG676C的详细参数，仅供参考Table 84:Clock-Capable Clock Input Setup and Hold With MMCMSymbolDescriptionDeviceSpeed GradeUnits-3E -2E -2I -2LI -1C -1I -1Q -1LQ Input Setup and Hold Time Relative to Global Clock Input Signal for SSTL15 Standard.(1)T PSMMCMCC / T PHMMCMCC No delay clock-capable clockinput and IFF (2) with MMCMXC7Z030 2.41/–0.23 2.68/–0.23 2.68/–0.23 2.68/–0.23 2.95/–0.23 2.95/–0.23N/A N/A ns XC7Z035 2.73/–0.09 3.00/–0.09 3.00/–0.09 3.00/–0.09 3.32/–0.09 3.32/–0.09N/A N/A ns XC7Z045 2.73/–0.09 3.00/–0.09 3.00/–0.09 3.00/–0.09 3.32/–0.09 3.32/–0.09N/A N/A ns XC7Z100N/A N/A 3.00/–0.10 3.00/–0.09N/A 3.32/–0.10N/A N/A ns XA7Z030N/A N/A N/A N/A N/A 2.95/–0.23 2.95/–0.23N/A ns XQ7Z030N/A N/A 2.68/–0.23 2.68/–0.23N/A 2.95/–0.23 2.95/–0.23N/A ns XQ7Z045N/A N/A 3.00/–0.09 3.00/–0.09N/A 3.32/–0.09 3.32/–0.09 3.32/–0.09ns XQ7Z100N/AN/A3.00/–0.103.00/–0.09N/A3.32/–0.10N/AN/Ans。

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676VG3变频器参数表参数说明出厂设定备注参数说明出厂设定备注SN01 变频器容量AN01 给定频率1 0SN02 V/F曲线0FFF AN02 给定频率2 46SN03 初始化0000 1001 AN03 给定频率3 30SN04 运行模式1 0011 0001 AN04 给定频率4 3SN05 运行模式2 0000 0000 AN05 给定频率5 0SN06 运行模式3 0000 0000 AN06 给定频率6 0SN07 运行模式4 0010 0001 AN07 给定频率7 0SN08 运行模式5 0000 1011 AN08 给定频率8 0SN09 运行模式6 0111 1001 AN09 检修频率10SN10 保护机能1 0000 0000 BN01 加速时间1 2.5 SN11 保护机能2 0100 0000 BN02 减速时间1 1.8 SN12 保护机能3 0101 0000 BN03 加速时间2 0SN13 保护机能4 1101 0000 BN04 减速时间2 0SN14 保护机能5 0000 BN05 ASR P（高速）SN15 输入端子机能选择1 03 BN06 ASR ISN16 输入端子机能选择2 04 BN07 正转矩限幅SN17 输入端子机能选择3 05 BN08 反转矩限幅SN18 输入端子机能选择4 06 BN09 再生转矩限幅SN19 多功能端子机能选择0F BN10 额定速度SN20 9，10端子00 BN11 传送用SN21 25，27端子01 BN12 非常停车时间SN22 26，27端子02 BN13 电源上电显示SN23 28，27端子06 BN14 PG分频比SN24 29，27端子0D BN15 模拟口偏置SN25 AI-14B功能选择0000 BN16 电压调整SN26 DI-16H功能选择BN17 多功能输出选择1SN27 D0-08功能选择BN18 多功能输出选择1SN28 其它功能选择BN19 S曲线时间1SN29 传送功能BN20 电流指令SN30 传送功能选择1 BN21 不使用SN31 传送功能选择2 BN22 A0-12 CH1输出选择SN32 传送功能选择3 BN23 A0-12 CH1输出选择SN33 传送功能选择4 BN24 A0-12 CH2输出选择SN34 传送功能选择5 BN25 A0-12 CH2输出选择SN37 整定选择BN26 多功能输出选择1SN38 其它功能选择2 BN27 多功能输出选择1SN42 其它功能选择3SN44 其它功能选择4SN50 DI-08功能选择参数说明出厂设定备注参数说明出厂设定备注CN01 零速基准CN27 电流指令延时时间CN02 速度一致检测CN28 电机温度上升时间CN03 速度一致检测幅CN29 电机温度传送选择CN04 速度偏差过大检测幅CN30 A1 I-14B CH1输入CN05 速度指令输入限制CN31 A1 I-14B CH2输入CN06 最低速度指令CN32 A1 I-14B CH3输入CN07 ASR 滤波时间CN33 任意电流检出幅1CN08 初期励磁时间CN34 任意电流检出幅2CN09 PG 量CN36 异常再启动数CN10 力矩控制速度控制CN37 启动时力矩补偿时间CN11 力矩补偿CN41 运行指令最小ON时间（正转）CN12 显示速度单位CN42 运行指令最小ON时间（反转）CN13 电机电抗CN43 最小速度定时器CN14 电机OL检出电流CN44 最小速度基准CN15 电机OL动作时间CN46 下降补偿增益CN16 超速检出CN47 下降补偿延时CN17 主回路低电压检出CN48 转矩检测定时1CN18 PG断线检出时间CN49 转矩检测定时2CN19 瞬间停电补偿时间CN52 载波频率CN20 异常再启动次数CN53 模拟口输入增益CN21 停止时间CN54 多功能输入口增益辅助CN22 ASR P （低速）CN56 力矩补偿延时时间CN23 ASR P 切换频率CN57 输入口延时时间CN24 零速伺服增益CN58 S时间3CN25 零速偏差伺服CN59 S时间4CN26 S时间2电机参数参数说明出厂设定备注参数说明出厂设定备注DN01 额定转速DN41 CEFM补偿DN02 最高转速DN42 电气阻抗DN03 极数DN43DN04 无负载电压DN44DN05 额定两次电流DN45DN06 额定频率DN46DN07 励磁电流指令DN47DN08 一次电抗DN48DN09 漏感系数DN49DN10 电机铁损DN50DN11 电机机械损耗DN51 电机功率DN12 二次回路时定数DN52 额定转速DN13 漏感饱和系数DN53 最高转速DN14 热敏电阻系数DN54 极数DN15 热敏电阻温度DN55 电机电压DN16 铁心饱和系数1 DN56 电机电流DN17 铁心饱和系数2 DN57 绝缘等级DN18 电机过热温度DN58 输入电压DN21—DN47 第二电机用DN21 额定转速DN22 最高转速DN23 极数DN24 无负载电压DN25 额定两次电流DN26 额定频率DN27 励磁电流指令DN28 一次电抗DN29 漏感系数DN30 电机铁损DN31 电机机械损耗DN32 二次回路时定数DN33 漏感饱和系数DN34 热敏电阻系数DN35 热敏电阻温度DN36 铁心饱和系数1DN37 铁心饱和系数2DN38 电机过热温度DN39 PG参数ON01 控制参数1 ON15 TRQ-A电流ON02 控制参数2 0010 ON16 版本号ON03 控制参数3 ON17 AD转换UON04 控制参数4 ON18 AD转换UON05 变频器OL ON19 AD转换WON06 变频器OL时降低载波频率ON20 AD转换W ON07 低载波频率制动时幅度ON21 ON DELAY 补偿ON08 电流下垂特点ON22 多功能输出1D/AON09 ASR输出延时ON10 CEFM补偿ON24 电流控制器PON11 AΦR时定数ON25 电流控制器PON12 AFR （PG使用）ON26ON13 AFR参数（PG使用）ON27ON14 磁场恢复676VG3说明VS676G3运转出厂设定及调整有五种1．AN--** 频率出厂设定2．BN--** 运行方式出厂设定参数3．SN--** 系统常数4．CN--** 控制常数5．ON--** 命令常数6．UN--** 监控参数。

OSRAM Opto Semiconductors-奥伟斯科技OSRAM欧司朗半导体领域的创新推动者OSRAM欧司朗汽车仪表背光源无论是在技术研发领域，还是在优质产品制造方面，欧司朗光电半导体都是当之无愧的“标兵”。

近四十年来，这家高科技公司一直致力于不断研发技术领先的新产品，为照明、可视化和传感器技术领域设立了多项国际标准。

欧司朗光电半导体的专业范畴从半导体基础技术一直延伸到个人客户应用，为传感器技术、激光系统等诸多领域打造最优质的解决方案。

产品组合包括面向汽车照明、普通照明等应用的高性能发光二极管 (LED)、指示灯用微型 LED 以及红外发光二极管 (IRED)、半导体激光器和检测器。

作为全球参与者，欧司朗光电半导体立足于多年来打下的坚实专业基础，全力为客户提供专业、全面的支持。

它专注于推动未来发展，多年来积极参与高端技术合作，与商界和院校均保持着密切的合作关系。

此外，它非常重视公司内部的持续发展，已经孵化出许多创新项目，产品组合也得到了优化。

所有这些，使得欧司朗光电半导体已经成为当今全球光电半导体市场的重要参与者。

KWHJL531.TE KWHKL531.TE KWHLL531.TE LUWCEUN.CE LUWCEUP.CE LEUWU1A5 05 LUWCEUN.CE LUWCEUP.CE LUWHWQP LEUWU1A201 LEUWU1A401 LEUWU1A301 LEUWU1A501 KWHJL531.TE KWHKL531.TE KWHLL531.TE LUWHWQP LUWCVBP.CE KBDMLN31.13 KWDMLQ31.SG KWDMLS31.SG KW DMLN31.SG LUWCEUN.CE LUWCEUP.CE KYDMLN31.FY KYDMLQ31.FY KYDMLS31.FY KYDMLN31.23 KYDMLQ31.23 KYDMLS31.23 LYB6SP LCYCEUP LCYH9PP LUWH9GP.CE LAB6SP LRB6SP KSDMLQ31.23 KRDMLQ31.23 KRDMLS31.23 LEUWQ9WP LExQ8WP PL450B PL520 LUWCEUP.HD SFH3410 SFH2430 SFH5711 SFH3711 SFH4650 SFH4258 SFH4258S SFH4259 SFH4259S SFH4715S SPLLL903 SFH4715S SFH4770SA01 SFH4725S SFH4726S LUWCEUN.CE LUWCEUP.CE LCYCEUP KWH2L531.TE KWH3L531.TE KWH4L531.TE KWH5L531.TE KWHJL531.TE KWHKL531.TE KWHLL531.TE KYDMLN31.FY KYDMLQ31.FY KYDMLS31.FY KYDMLN31.23 KYDMLQ31.23 KYDMLS31.23 KWDMLN31.SG KWDMLQ31.SG KWDMLS31.SG LEUWQ9WP LRA67F LSA67F LAE6SF LRE6SF LSE6SF LAETSF LAE65F LAE63F LSE63F LSH9PP LYH9PP LCYH9PP LYCN5M LUWCN7M LYG6SP LAA67F LAT67F LRT67F LST67F LYE67F LYE6SF LYETSF LAE67FLRE67F LSE67F LUWHWQP LAH9PP LRH9PP LUWCN7N LUWGVCP LWG6CP LAG6SP LRG6SP LSG6SP LCYG6SP深圳市奥伟斯科技有限公司是一家专注触摸芯片,单片机,电源管理芯片,语音芯片,场效应管,显示驱动芯片,网络接收芯片,运算放大器,红外线接收头及其它半导体产品的研发,代理销售推广的高新技术企业。

IntroductionThe Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL)V CCINT/V CCBRAM=0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges.All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.The available device/package combinations are outlined in:•Zynq-7000SoC Overview (DS190)•Defense-grade Zynq-7000Q SoC Overview (DS196)•XA Zynq-7000SoC Overview (DS188)This Zynq-7000SoC data sheet, which covers the specifications for the XC7Z030, XA7Z030, XQ7Z030,XC7Z035, XC7Z045, XQ7Z045, XC7Z100, and XQ7Z100 complements the Zynq-7000SoC documentation suite available on the Xilinx website at.DC CharacteristicsDS191 (v1.18.1) July 2, 2018Product Specification Table 1:Absolute Maximum Ratings(1)Symbol Description Min Max Units Processing System (PS)V CCPINT PS internal logic supply voltage–0.5 1.1VV CCPAUX PS auxiliary supply voltage–0.5 2.0VV CCPLL PS PLL supply–0.5 2.0VV CCO_DDR PS DDR I/O supply–0.5 2.0VV CCO_MIO(2)PS MIO I/O supply–0.5 3.6VV PREF PS input reference voltage–0.5 2.0VV PIN(2)(3)(4)(5)PS MIO I/O input voltage–0.40V CCO_MIO+0.55V PS DDR I/O input voltage–0.55V CCO_DDR+0.55V Programmable Logic (PL)V CCINT PL internal supply voltage–0.5 1.1VV CCBRAM PL supply voltage for the block RAM memories–0.5 1.1VV CCAUX PL auxiliary supply voltage–0.5 2.0VV CCO PL output drivers supply voltage for HR I/O banks–0.5 3.6V PL output drivers supply voltage for HP I/O banks–0.5 2.0VV CCAUX_IO(4)Auxiliary supply voltage–0.5 2.06VSD/SDIO InterfacesTable 39:SD/SDIO Interface High Speed Mode Switching Characteristics (1)Symbol DescriptionMin Typ Max Units T DCSDHSCLK SD device clock duty cycle –50–%T SDHSCKO Clock to output delay, all outputs 2.00–12.00ns T SDHSDCK Input setup time, all inputs 3.00––ns T SDHSCKD Input hold time, all inputs 1.05––ns F SD_REF_CLK SD reference clock frequency––125MHz F SDHSCLK High speed mode SD device clock frequency–50MHzNotes:1.Test conditions: LVCMOS33, slow slew rate, 8mA drive strength, 15pF loads.Figure 8:SD/SDIO Interface High Speed Mode Timing DiagramTable 40:SD/SDIO Interface Switching Characteristics (1)Symbol DescriptionMin Typ Max Units T DCSDSCLK SD device clock duty cycle –50–%T SDSCKO Clock to output delay, all outputs 2.00–12.00ns T SDSDCK Input setup time, all inputs 4.00––ns T SDSCKD Input hold time, all inputs 3.00––ns F SD_REF_CLK SD reference clock frequency ––125MHz F SDIDCLK Clock frequency in identification mode ––400KHz F SDSCLK Standard mode SD device clock frequency–25MHzNotes:1.Test conditions: LVCMOS33, slow slew rate, 8mA drive strength, 15pF loads.Figure 9:SD/SDIO Interface Standard Mode Timing DiagramTable 12:Differential SelectIO DC Input and Output LevelsI/O StandardV ICM(1)V ID(2)V OCM(3)V OD(4)V, Min V, Typ V, Max V, Min V, Typ V, Max V, Min V, Typ V, Max V, Min V, Typ V, MaxBLVDS_250.300 1.200 1.4250.100––– 1.250–Note5MINI_LVDS_250.300 1.200V CCAUX0.2000.4000.600 1.000 1.200 1.4000.3000.4500.600 PPDS_250.2000.900V CCAUX0.1000.2500.4000.5000.950 1.4000.1000.2500.400 RSDS_250.3000.900 1.5000.1000.3500.600 1.000 1.200 1.4000.1000.3500.600 TMDS_33 2.700 2.965 3.2300.1500.675 1.200V CCO–0.405V CCO–0.300V CCO–0.1900.4000.6000.800Notes:1.V ICM is the input common mode voltage.2.V ID is the input differential voltage (Q–Q).3.V OCM is the output common mode voltage.4.V OD is the output differential voltage (Q–Q).5.V OD for BLVDS will vary significantly depending on topology and loading.6.LVDS_25 is specified in Table14.7.LVDS is specified in Table15.Table 33:DDR2 Interface Switching Characteristics (800Mb/s)(1)Symbol Description Min Max Units T DQVALID(2)Input data valid window500–ps T DQDS(3)Output DQ to DQS skew147–ps T DQDH(4)Output DQS to DQ skew376–ps T DQSS Output clock to DQS skew–0.070.08T CK T CACK(5)Command/address output setup time with respect to CLK732–ps T CKCA(6)Command/address output hold time with respect to CLK938–ps质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工业级IC，军级二三极管，功率管等;应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通信网络、电力工业以及大型工业设备祝您:工作顺利，生活愉快!以赛灵思半导体（深圳）有限公司提供的参数为例，以下为XC7Z030-1FBG676I的详细参数，仅供参考。

如需产品安装、维护或支持信息，请参考文档末的信息。

1.0 产品描述供货尺寸：• 14 – 24 英寸/DN350 – DN600最大工作压力：• 可达300 psi/2068 kPa/21 bar 应用：• 提供直通流道，压降更低管道材料：• 碳钢管道制备：• 辊槽，依照25.09号技术文件：先进沟槽系统（AGS ）滚槽规格。

2.0 认证/列名产品的设计和制造依照 Victaulic （唯特利）质量管理体系进行（根据 ISO-9001:2015 获得 LPCB 认证）。

Victaulic三通型过滤器W730系列20.11-CHI系统编号位置提交人日期规格部分段落批准人日期3.0 规格 – 材料本体（14 – 24英寸/DN350 – DN600）：• 分段焊接碳钢，ANSI标准壁厚，符合ASTM A53，E型或S型，等级：B• 可选：镀锌管端盲板（14 – 24英寸/DN350 – DN600）：• 碳钢T型螺栓铰链盖，300-TB级• 可选：镀锌滤篮：不锈钢， 304 型，框架和孔目。

• 14 – 16 英寸/DN350 – DN400：6 x 6 孔目 (0.041英寸金属丝)，开口为 0.126英寸• 18 – 24 英寸/DN450 – DN600：4 x 4 孔目 (0.047英寸金属丝)，开口为 0.203英寸• 可选：可提供其他尺寸和材质的孔目，详情请联系Victaulic（唯特利）磁体：磁体，特别用于可在工厂添加的润滑油应用和其他情况。

如需详细信息，请联系Victaulic（唯特利）。

其他：可满足特殊需求。

如在推荐、可用性和交付上有特别需求，请联系Victaulic（唯特利）。

注• 进出口之间最大压差不得超过 10 psi/69 kPa。

装配间隙拆除过滤器滤篮所要求的推荐最小清洗间隙1该尺寸为拆除过程中测得中心线至滤篮顶部的尺寸数值5.0 性能W730系列三通型过滤器+60°F/+16°C的水流C V值如下表所示。