V6R2013x 64

配套问题专题在实际问题中，我们经常会遇到一些配套组合问题，比如螺钉和螺母的配套，盒身和盒底的配套等。

解决这类问题的方法可以归纳为以下四步：首先，我们需要抓住配套关系，明确哪些物品是需要配对使用的。

其次，我们需要设出未知数，即需要确定需要多少个配对物品。

接着，我们可以根据配套关系列出方程，通过方程求解未知数。

最后，我们可以通过解方程来解决问题，得到需要的答案。

举个例子，我们来看看如何解决一个配套组合问题。

假设一张方桌由1个桌面和4条桌腿组成，如果1立方米木料可以做50个桌面或300条桌腿，现在有5立方米的木料，那么我们需要用多少立方米的木料来做桌面，多少立方米的木料来做桌腿，才能恰好配成若干张方桌呢？此外，我们还需要知道能够配成多少张方桌。

接下来，我们可以按照上述四步来解决这个问题。

首先，我们需要抓住配套关系，即每张方桌需要1个桌面和4条桌腿。

其次，我们设出未知数，假设我们需要用x立方米的木料来做桌面，需要用y立方米的木料来做桌腿，那么我们需要的配对物品数就是50x和300y。

接着，我们可以根据配套关系列出方程：x+4y=5（因为总共有5立方米的木料），50x=300y（因为每1立方米木料可以做50个桌面或300条桌腿）。

最后，我们可以通过解方程来得到x和y的值，从而得到需要的答案：需要用2立方米的木料来做桌面，需要用3立方米的木料来做桌腿，能够配成10张方桌。

除了以上例子，我们还可以通过类似的方法来解决其他配套组合问题，比如生产运动服、加工齿轮、分配书本、分苹果等问题。

只要我们能够抓住配套关系，设出未知数，列出方程，就能够轻松地解决这些问题。

19、一张铝片可以制作16个瓶身或43个瓶底。

一个完整的饮料瓶需要一个瓶身和两个瓶底，即43个瓶底配成一个套。

现有150张铝片，问需要多少张铝片制作瓶身，多少张制作瓶底，才能正好制成整套的饮料瓶。

20、车间共有26名工人，可以生产零件甲和零件乙。

每个工人每天平均可以生产120个零件甲或180个零件乙。

IBMHP服务器报价单
一、IBMHP服务器报价
1、HP ProLiant型号：ML350 G6
配置详情：
服务器平台：2U结构，采用Intel第5代Xeon E5620或E5645处理器，最高可支持两个CPU，支持最大12核处理器；
存储：支持最大10块2.5”LFF热插拔硬盘，可选择SAS、SATA硬盘；
内存：支持最大384GBDDR31866/1600/1333/1066MHz双通道内存；
网卡：支持Intel双口网卡，支持多种网络接口，最大可实现四块网卡。

2、HP ProLiant 型号：DL360 G7
配置详情：
服务器平台：1U结构，采用Intel第5代Xeon E5620或E5645处理器，最高可支持两个CPU，支持最大12核处理器；
存储：支持最大8块2.5”热插拔硬盘，可选择SAS、SATA硬盘；
内存：支持最大192GBDDR31866/1600/1333/1066MHz双通道内存；
网卡：支持Intel双口网卡，支持多种网络接口，最大可实现两块网卡。

二、报价
三、其他说明
1.本报价仅含服务器机箱，不含配件（如硬盘、内存、网卡）等；
2.以上报价中包含国内免费三年保修及远程技术支持服务；
3.我司提供的网卡及硬盘均为原厂正品；
4.服务器质保期为三年，有效期为三个月，从签订合同之日起三个月内有效；
5.支付方式：银行转账。

© 2023 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.SPECIFICATIONSModel Name B450 TOMAHAWKCPU Support Supports AMD ® Ryzen™ 1st and 2nd Generation/ Ryzen™ with Radeon™ Vega Graphics Processors for Socket AM4CPU Socket Socket AM4Chipset AMD ® B450 ChipsetGraphics Interface1 x PCI-E 3.0 x16 slot + 1 x PCI-E 2.0 x16 slot Supports 2-way CrossFireDisplay Interface HDMI™, DVI-D – Requires Processor Graphics Memory Support 4 DIMMs, Dual Channel DDR4 up to 3466 MHz Expansion Slots 3 x PCI-E x1 slotsStorage 1 x M.2 slot, 6 x SATA 6Gb/sUSB ports 2 x USB 3.1 (Gen2) + 4 x USB 3.1 (Gen1) + 6 x USB 2.0LAN Realtek® 8111H Gigabit LANAudio8-Channel(7.1) HD Audio with Audio BoostPowered by AMD, ensure an uninterrupted connection with more stability and fastest USB speeds.Core BoostWith premium layout and fully digital power design to support more cores and provide better performance.EZ Debug LEDEasiest way to troubleshoot.Extended Heatsink DesignMSI extended PWM heatsink and enhanced circuit design ensures even high-end processors to run in full speed.Audio BoostReward your ears with studio grade sound quality for the most immersive audio experience.DDR4 BoostAdvanced technology to deliver pure data signals for the best gaming performance and stability.CONNECTIONS1. Flash BIOS Button 3. USB 3.1 Gen15. HD Audio Connectors 7. DVI-D Port9. USB 3.1 Gen2 Type A+C2. PS/2 Combo Port 4. LAN Port 6. USB 2.0 Port 8. HDMI™ PortG e n e r a t e d 2023-03-30, c h e c k f o r t h e l a t e s t v e r s i o n w w w .m s i .c o m /d a t a s h e e t . T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t i s i n t e n d e d f o r i n f o r m a t i o n a l p u r p o s e s o n l y a n d i s s u b j e c t t o c h a n g e w i t h o u t n o t i c e .。

第五章应用指令5.1 数据传送指令5-15.1.1 MOV, MOVP, DMOV, DMOVP ..................................................... 5-15.1.2 CMOV, CMOVP, DCMOV, DCMOVP .......................................... 5-35.1.3 GMOV, GMOVP .................................................................................. 5-65.1.4 FMOV, FMOVP ................................................................................... 5-85.1.5 BMOV, BMOVP ................................................................................ 5-10 5.2 转换指令5-125.1.1 BCD, BCDP, DBCD, DBCDP ......................................................... 5-125.2.2 BIN, BINP, DBIN, DBINP .............................................................. 5-15 5.3 比拟指令5-185.3.1 CMP, CMPP, DCMP, DCMPP ...................................................... 5-185.3.2 TCMP, TCMPP, DTCMP, DTCMPP .............................................. 5-225.3.3 LD ( =, >, <, >=, <=, <> ) ..................................................... 5-245.3.4 AND ( =, >, <, >=, <=, <>) ................................................... 5-255.3.5 OR ( =, >, <, >=, <=, <>) ...................................................... 5-27 5.4 增加/减少运算5-295.4.1 INC, INCP, DINC, DINCP ............................................................. 5-295.4.2 DEC, DECP, DDEC, DDECP .......................................................... 5-31 5.5 回转指令5-345.5.1 ROL, ROLP, DROL, DROLP .......................................................... 5-345.5.2 ROR, RORP, DROR, DRORP ....................................................... 5-375.5.3 RCL, RCLP, DRCL, DRCLP ............................................................ 5-395.5.4 RCR, RCRP, DRCR, DRCRP .......................................................... 5-425.6 移位指令5-445.6.1 BSFT, BSFTP ...................................................................................... 5-445.6.2 WSFT, WSFTP ................................................................................... 5-465.6.3 SR.......................................................................................................... 5-48 5.7 交换指令5-515.7.1 XCHG, XCHGP, DXCHG, DXCHGP ............................................ 5-51 5.8 BIN 算术指令5-535.8.1 ADD, ADDP, DADD, DADDP ...................................................... 5-535.8.2 SUB, SUBP, DSUB, DSUBP .......................................................... 5-555.8.3 MUL, MULP, DMUL, DMULP ..................................................... 5-575.8.4 MULS, MULSP, DMULS, DMULSP ............................................ 5-605.8.5 DIV, DIVP, DDIV, DDIVP ............................................................... 5-635.8.6 DIVS, DIVSP, DDIVS, DDIVSP .................................................... 5-65 5.9 BCD算术指令5-685.9.1 ADDB, ADDBP, DADDB, DADDBP ........................................... 5-685.9.2 SUBB, SUBBP, DSUBB, DSUBBP ................................................ 5-705.9.3 MULB, MULBP, DMULB, DMULBP ........................................... 5-745.9.4 DIVB, DIVBP, DDIVB, DDIVBP ................................................... 5-76 5.10 逻辑算术指令5-795.10.1 WAND, WANDP, DWAND, DWANDP ..................................... 5-795.10.2 WOR, WORP, DWOR, DWORP ................................................. 5-825.10.3 WXOR, WXORP, DWXOR, DWXORP ....................................... 5-845.10.4 WXNR, WXNRP, DWXNR, DWXNRP ...................................... 5-86 5.11 数据处理指令5-885.11.1 SEG, SEGP ......................................................................................... 5-895.11.2 ASC, ASCP ......................................................................................... 5-925.11.3 BSUM, BSUMP, DBSUM, DBSUMP .......................................... 5-945.11.4 ENCO, ENCOP .................................................................................. 5-975.11.5 DECO, DECOP ................................................................................ 5-1005.11.6 FILR, FILRP, DFILR, DFILRP ....................................................... 5-1025.11.7 FILW, FILWP, DFILW, DFILWP .................................................. 5-1055.11.8 DIS, DISP ......................................................................................... 5-1075.11.9 UNI, UNIP ........................................................................................ 5-1105.11.10 IORF, IORFP .................................................................................... 5-112 5.12 系统指令5-1145.12.1 FALS ................................................................................................... 5-1145.12.2 DUTY ................................................................................................. 5-1155.12.3 WDT, WDTP .................................................................................... 5-1185.12.4 OUTOFF ............................................................................................ 5-1205.12.5 STOP .................................................................................................. 5-121 5.13 跳转指令5-1225.13.1 JMP, JME .......................................................................................... 5-1225.13.2 CALL, CALLP, SBRT, RET ............................................................ 5-124 5.14 循环指令5-1265.14.1 FOR, NEXT ...................................................................................... 5-1275.14.2 BREAK ............................................................................................... 5-128 5.15 标志指令5-1295.15.1 STC, CLC ........................................................................................... 5-1295.15.2 CLE ..................................................................................................... 5-131 5.16 特殊模块指令5-1325.16.1 GET, GETP ........................................................................................ 5-1335.16.2 PUT, PUTP ....................................................................................... 5-135 5.17 数据连接指令5-1375.17.1 READ ................................................................................................. 5-1385.17.2 WRITE ................................................................................................ 5-1415.17.3 RGET .................................................................................................. 5-1435.17.4 RPUT .................................................................................................. 5-1475.17.5 STATUS .............................................................................................. 5-150 5.18 中断指令5-1525.18.1 EI, DI .................................................................................................. 5-1525.18.2 TDINT, IRET ..................................................................................... 5-1535.18.3 INT, IRET .......................................................................................... 5-1555.19 符号反转指令5-1565.19.1 NEG, NEGP, DNEG, DNEGP...................................................... 5-156 5.20 位接触指令5-1595.20.1 BLD, BLDN ....................................................................................... 5-1595.20.2 BAND, BANDN .............................................................................. 5-1605.20.3 BOR, BORN ..................................................................................... 5-1615.20.4 BOUT ................................................................................................. 5-1635.20.5 BSET, BRST ...................................................................................... 5-164 5.21 计算机连接模块指令5-1655.21.1 SND .................................................................................................... 5-1655.21.2 RCV .................................................................................................... 5-166 5.22 高速计数器指令5-1675.22.1 HST ..................................................................................................... 5-1675.22.2 HSC .................................................................................................... 5-170 5.23 RS-485 通讯指令5-1715.23.1 RECV .................................................................................................. 5-1725.23.2 SEND ................................................................................................. 5-1735应用指令5.1.1MOV, MOVP, DMOV, DMOVP1)功能-MOV(P) : 传送在[ S ]中的16位数据至指定的设备[ D ].16 位- DMOV(P) : 传送在指定设备[ S+1, S ]中的32位数据到指定的设备[ D+1, D ].-2) 编程举例在P020检测到一个上升沿，‘h70F3’被传送到P04。

3.20.126ASSEMBLED FRONT VIEWBOTTOM HEATSINK APPLICATION SEE NOTE 26123 CHIP SHOWN HERETHERMAL INTERFACE SEE NOTE 3(A) OR 3(B)OPTION:SCREW (40578)INSTALLED FROM BOTTOM SIDE OF PCB.TORQUE TO 3 IN-LBS.(2) PL.SEE NOTE 2OPTION:LOCATING/GROUNDINGPIN (40249)SOLDERED TO PCB(2) PL.SEE NOTE 2TOP HEATSINK APPLICATION SEE NOTES 2 & 3PUSH-PINS SEE NOTE 3,4AND SELECTION TABLEGROUNDING TABS SOLDERED TO PCB SEE NOTE 3NOTES:FOR PCB LAYOUT SEE VICOR APPLICATION DRAWING 40483.1.OPTION: SOLDERED LOCATING/GROUNDING PIN 40249 CAN BE USED IN CONJUNCTION OR2.AS ALTERNATIVE TO SCREW 40578 INSTALLED FROM BACK OF PCB.THE SOLDERING METHOD USED FOR CHIPS (AND OPTIONAL HEATSINK GROUNDING) 3.IS IMPORTANT WHEN SELECTING A THERMAL INTERFACE MATERIAL (TIM).THE PHASE-CHANGE TIM SHOWN IN THESE ILLUSTRATIONS MAY BE DAMAGED BYTEMPERATURES OVER 125C, SO TWO ASSEMBLY PROCEDURES ARE DESCRIBED BELOW: (A) FOR HAND-SOLDERING ONLY,(B) FOR WAVE-SOLDERING AND/OR HAND-SOLDERING.(A) PLACE BOTTOM-SIDE HEATSINK (WITH PRE-ATTACHED PHASE-CHANGE TIM) ON PCB.PLACE CHIP AND TOP-SIDE HEATSINK (WITH PRE-ATTACHED TIM AND GROUNDING TABS).WHILE SUPPORTING PCB, INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB.(SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)IMPORTANT: TO SET FINAL THICKNESS OF PHASE-CHANGE TIM ENSURE THAT THE ENTIRE ASSEMBLY IS RAISED ABOVE 65C FOR SEVERAL MINUTES.HAND-SOLDER ALL CHIP AND GROUNDING PINS. ADDITIONAL SOLDERING IRON HEATMAY BE REQUIRED TO COMPENSATE FOR LOSSES TO THE HEATSINKS.(B) WAVE SOLDERING TEMPERATURES ARE UNSUITABLE FOR PLASTIC PUSH-PINS ANDPHASE-CHANGE TIM, SO VICOR TIM 40325 (PARKER CHOMERICS GEL8010) IS RECOMMENDED.APPLY A UNIFORM .003” (.076MM) LAYER OF TIM 40325 TO THE TOP AND BOTTOM SURFACE OF THE CHIP, OR TO THE CORRESPONDING HEATSINK SURFACES.PLACE BOTTOM-SIDE HEATSINK, CHIP, AND TOP-SIDE HEATSINK ON PCB.WITH A CUSTOM FIXTURE (OR VICOR WAVESOLDER FIXTURE 40416, 40417) APPLY APPROX. 10 LBS LOAD TO THE TOP-SIDE HEATSINK AND THEN WAVE-SOLDER ALL PINS.REMOVE FIXTURE AND INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB. (SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)CARE SHOULD BE TAKEN TO AVOID FULLY COMPRESSING THE 4.PUSH-PIN SPRING DURING INSTALLATION AS THIS WOULD EXPOSE THE CHIP TO FORCES GREATER THAN THE RECOMMENDED LIMIT OF 3.1 LBF (13.8 N) PER PUSH-PIN.ROHS COMPLIANT PER CST-0001 LATEST REVISION.5.PUSH-PIN SELECTIONHEATSINK OPTIONSREV.DESCRIPTIONINTL DATE APVD 1RELEASE PER E140060REJH01/17/14REWPUSH-PINS W/ SPRINGS (100/BAG)COLORPCB THK NOMINALRANGE PCB THK MINIMUM PCB THK MAXIMUM 32436BLUE1.143 MM TO 1.854 MM[.045"] TO [.073"] 1.041 MM [.041"] 2.057 MM [.081"]32437GRAY1.880 MM TO2.438 MM[.074"] TO [.096"]1.676 MM [.066"]2.692 MM [.106"]HEATSINK TYPEP/N ASSY HEATSINKS, TIM AND GROUND TAB P/N ASSY HEATSINK W/GROUND TAB ONLY SOLDERING METHOD (SEE NOTE 2)-2(A) HAND SOLDERONLY2(B) WITH VICOR 40325THERMAL GEL4623DUAL 11MM 4051940526DUAL 19MM 40408-6123DUAL 11MM 4052040528DUAL 19MM40409-2F72F73B846C84A53CDAVICOR CONFIDENTIAL5ED6B1E1THIS DOCUMENT AND THE DATA DISCLOSED HEREIN OR HEREWITH IS NOT TO BE REPRODUCED, USED ORDISCLOSED IN WHOLE OR IN PART TO ANYONE WITHOUT THE PERMISSION OF VICOR CORP.SCALE TOLERANCES ARE:DECIMALS ANGLES X.XX [X.X] = ±0.01 [0.25] ±1°X.XXX [X.XX] = ±0.005 [0.127]SHEET OFSIZE67131CAGE CODE40191DWG NO1REVDRAWN BYDATE Robert Wasik7/12/2013APP DWG, DUAL HEATSINK,6123, 4623SWDVICORTHIRD ANGLE PROJECTIONDO NOT SCALE DRAWING113:1UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE : INCH / [MM]D。

131133Shown for Reference in Outline Form Pad Mount 2600-264Callout = PM (PM includes parts also used in Post Mount 2600-263)PMPMPMPMPM111127121113115117119123125Not Shown2XShown for Reference Pad Mount 2600-264121Ref1162XEOREV DESCRIPTION Drawn APPR ---N Added Item 116; Items 151, 153, 180, 211 Was: 2616-016, 2904-002, 2620-019,2902-007,2340-065; Deleted 166 Was: 2620-019.Sal 09/22/08 D.C.09/22/08N IPB-Model 6300-089,1/2HP,230 V, Primary,Convenient Open PROPRIETARY AND CONFIDENTIAL COMMENTS:SHEET 1 OF 6CHECKED DRAWN DATENAME REV A DWG. NO.SIZE Scale: None 6300-889Sal 06/23/082. Items 200-211 Not Shown for Clarity.1. See attached reference sheet for BOM; Reference Movex 6300-089 Rev N.Notes: Unless Otherwise Specified.THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF Door King. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF Door King IS PROHIBITED.Item Part Number Qty UM Description Rev 16300-8891EA IPB-230V 1/2HP, Convenient Open, Swing Gate Optr N 32600-7051EA Bracket Panel Base Model 63052600-8691EA Motor Base 610/605 Battery Bk62600-1241EA Motor Assembly 1/2 HP Dual Pul81215-0182EA Wire Nut #71B92600-6881EA Belt - 17" 4L170 Cogged102600-1971EA Motor 24VDC For BB112600-5691EA Pulley 10" Cast Iron AC100X5/8131601-0191EA Keyway 3/16 x 3/16 x 1152600-4281EA Belt-Cogged, AX-34192600-4691EA Marker Strip 230V 1Phase213130-0081EA Terminal Block 5 pin233129-0051EA Terminal Block Cover 5 Position252600-8301EA Jumper- Ring Tongue272599-0141EA Decal Copper Wire Only292600-4391EA Washer Cup - Brass312599-0061EA Decal SUPPLY GND322600-6192EA Wire Clp-5/8" Concord 770-1209332600-6651EA Battery Tray 610351801-0092EA Battery 12V 3.0 AmpHour PS1230372600-6381EA Bracket Radio 610 Battery Bkup396300-0421EA Housing Assembly 6300412600-6131EA Bracket Magnetic Ctr Potted433004-0101EA Magnetic Counter Threaded453004-0512EA Nut Panel 1/4-18472600-7791EA Swing Crank Arm Extended492600-0611EA Collar 2 OD x 1 1/4 ID x 5/8 L572600-1741EA Main Shaft Assy Model 630592630-0101EA Snap Ring 1.25"612600-0731EA Magnet Counter Ring632600-6812EA Clutch Plate 9" Die Cast652801-0032EA Clutch Pad 9" OD620/25,630,630672600-6441EA Worm Gear 100 Teeth Delrin712600-7731EA Bracket Board Mtg Panel 630722600-8751EA Capacitor Mounting Clamp732600-5331EA Switch Cover Doorking Lockable742600-1021EA Capacitor 50uf 370VAC752600-7311EA Gasket Switch Cover771506-0711EA Tone Generator Loud791812-0051EA Switch Push Button N.O.811601-0411EA Switch Toggle SPST 2POS831601-1401EA Switch Toggle 2 Pole On-Off852599-0081EA Label Patent871200-0282EA Outlet Snap-In Leviton 1306882600-7492EA Wire Connector STA-KON RC6892600-82012EA Bushing 1/2914001-0961EA Transformer 460/230/208-115V932340-0101EA PCB Battery Backup954502-0101EA PCB Gate Operator974001-0201EA Terminal 20 Pin992600-8402EA Jumper- Ring Tongue #8 Screw 1012600-9451EA Cover Plastic Insulator1112600-7251EA Cover-Model 63001132600-7321EA Nameplate Plastic DKS1152802-0402EA Washer Push on Clamp1161897-0522EA Gasket, Microphone Support 1171702-5071EA Cam "J" Hook1194001-0351EA Lock N16058BDxSFx2K Key 16120 1212600-7201EA Crank Arm Joint Assembly Blk 1232600-6301EA Joint Cover Swinger Left1252600-6311EA Joint Cover Swinger Right 1272600-7111EA Bracket 3/16 x 2 x 121312599-0341EA Label Gate Operator1332599-1991EA Label Universal1402615-0523EA Bolt Hex Head 3/8-16 x 1 1412615-0081EA Bolt Hex Head 1/4-20 x 1 1/2 1502616-0194EA Screw Phillips Head 8-32 x 3/4 1512616-0181EA Screw Phillips Head 8-32 x 1/2 1522616-0175EA Screw Phillips Head 8-32 x 3/8 1532616-0012EA Screw Phillips Head 6-32 x 3/8 1542616-0512EA Screw Phillips 10-32 x 3/8 1552616-0526EA Screw Phillips Head 10-32 x1/2 1562616-0017EA Screw Phillips Head 6-32 x 3/8 1572600-8872EA Screw Nylon Phillips 6-32 x 1/4 1582616-0032EA Screw Phillips Head 6-32 x 3/4 1602620-2202EA Washer 1.25 x 2 x .06251612620-1312EA Washer 1 7/8 OD x 1/2 ID 1/8 T 1622620-0442EA Lockwasher #81632600-1838EA Washer Bellville 1.5 OD x .5 ID 1642620-0212EA Washer 1/2 SAE1652620-0024EA Washer 1/4 USS1702620-0104EA Washer #10 SAE1802620-4118EA Nut Hex Flange Lock 5/16-18 1812902-0086EA Nut Keps 1/4-201822620-3201EA Nut Center Lock 1/2-131832620-4202EA Nut Hex 1/2-131842620-4091EA Nut Hex Flange Lock 1/4-20 1852620-4011EA Nut Hex 8-322001804-03115EA Tie Wrap 4"2012600-6981EA Wire Set Model 6050,6100,6300 2032340-1641EA Wire Set BB 6100,6300,9150 2057082-0521EA Wire 8" Green 16 AWG Stranded 2077082-1371EA Wire 5" Green Stranded 14AWG 2092599-1002EA Sign Warning2116300-0651EA Manual Installation。

RDXL6SD-USB-CAL-3RDXL6SD-USB1Six Channel Handheld Temperature Data LoggerWith Touch Screen and Built-In Rechargeable BatteryRDXL6SD-USBRDXL6SD-USB shown smaller than actual size.Thermocouples not included.U F our Thermocouple Inputs and Two Pt100 RTD Inputs U D isplay and Log All 6 Channels Simultaneously or Individually U U SB Interface with Free Software U M ODBUS Protocol for Integration Into 3rd Party Software U B uilt-In Stand U S cheduled and Manual Logging Start/StopU4 GB SD Card Stores Up to 2 Years of Data U D isplay Maximum, Minimum, Average and Standard Deviation U D isplay Temperature Difference Between Any 2 ChannelsU U SB or Mains Powered (With Adaptor)U A larm Indication for Each ChannelSpecificationsInputs: 4x thermocouple inputs for use with miniaturethermocouple connectors, and 2 x spring clamp terminals for 2 or 3-wire RTDs, 28 to 16 AWG Input Temperature Range: Type J: -200 to 1200°C Type K: -200 to 1372°C Type T: -200 to 400°C Type R: 0 to 1768°C Type S: 0 to 1768°C Type N: 0 to 1300°C Type E: -200 to 1000°C RTD: -200 to 850°C Temperature Accuracy:For Thermocouples: ±0.1% or 0.8°C For RTD: ±1.0% or 1.0°CTemperature Resolution: 0.1° for temperatures below 1000°C or °F , 1° for temperatures above 1000°C or °F Display: 72 mm (2.83") resistive touch TFT, 320 x 240 pixels, backlitConfigurable Parameters: Temperature units, alarms, signal processing, date and time, data logging, power options, graph channelsTemperature Units: °F or °CAlarm Configuration: 12 x alarms (2 per channel) with adjustable level, individually configurable as HI or LOSignal Processing: Average, minimum, maximum, standard deviation, 2-channel temperature difference Display Response Time: 1 secondOperating Temperature: 0 to 50°C (32 to 122°F)Power Supplies: Built-in rechargeable battery, USB, or 5 Vdc adaptor (included)Battery Life: 32 hour logging with full display brightness; up to 96 hours while logging in power saving mode Weight: 200 g (7 oz) without thermocouplesDimensions: 136 W x 71 H x 32 D mm (5.35 x 2.8 x 1.25")Data Logging SpecificationsData Logging Interval: 1 to 86,400 seconds (1 day)Maximum SD Card Capacity:32 GB SD Card (4 GB included)Variables Logged: Measured temperature, cold junction temperature, alarm eventsFile Format: .csv (can be imported to Excel)Configurable Parameters: Sample period, number of samples, scheduled start date and timeThe RDXL6SD-USB is a six-channel touch screen data logger that accepts four thermocouple and two RTD inputs. Each channel has individually configurable HI/LO alarms. The intuitive touch screen interface allows each channel to be configured separately for input type, math, alarm and display options. All six channels can be displayed and logged simultaneously or individually. Data can be logged as fast as once a second and is strored on the included 4 GB SD card in Excel ® compatible format.2Intuitive Touch Screen InterfaceFully configurable, no additional hardware is required for configuration. Each channel is configurable separatelyfor input type, maths, alarms and display options.Temperature GraphTwo selectable channels are displayed. Scroll back intime to view chart history and data logging points.RDXL6SD-USB-CAL-3RDXL6SD-USB。

Sim-Office 油藏数值模拟办公软件v1.34 1CDTransvalor.Forge.v2011-ISO 1DVDV erdi3 2012.10 Linux32_64 1DVDV ero Machining Strategist 14.0 357 Win32_64 2CDV oluMill Nexion v5.0 Win32_64 2CDV oluMill Universal v4.1 1CDV oluMill V5.0.1640 for NX8.0.2 Win32_64 2CDV oluMill V5.0.1640 for NX 8.5 Win32_64 2CDADP 2012.07 Linux32_64 & SOL7 & SOLARIS2 & Symbol & Xlib 1CDLaker 2012.07 Linux32_64 & SOL7 & SOLARIS2 & Symbol 1DVDMentor Graphics PADS 9.5 2.4 GB(Mentor Graphics 是电子设计自动化技术的领导产商，它提供完整的软件和硬件设计解决方案，让客户能在短时间内，以最低的成本，在市场上推出功能强大的电子产品。

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Think3 公司的ThinkDesign 是机械领域业内丶计算机辅助设计丶3D 解决方案方面的一次令人兴奋的革命！是一次在数百万束缚於单调的线条概念的3D 用户面前，展示其广阔而崭新的3D 世界的革命。

IBM小型机内存FC 适用于IBM 1930 1GB(2x512 MB) DDR2 DIMMS P51A,P52A,P55A,P561,P570IBM 1931 FRU：15R7168 2 GB (2x1 GB) DDR2 DIMMS P51A,P52A,P55A,P561,P570IBM 1932 FRU：15R7170 4GB(2x2GB) DDR2 DIMMS P51A,P52A,P55A,P561,P570IBM 1934 FRU：15R7172 8 GB (2x4 GB) DDR2 DIMMS P51A,P52A,P55A,P561,P570IBM 4100 1GB (2x512 MB) F80,M80,F85(P620),P660IBM 4120 512MB(2x 256MB) 170,265,270,P610,P640IBM 4121 1G(2 x512MB) 170,265,270,P610,P640IBM 4137 2GB (2x1GB) DIMMSIBM 4444 1GB (4x 256MB) P510,P520,P550IBM 4445 FRU:00P5769 4GB (4x1GB) DDR1 DIMMS，266 MHz P510,P520,P550IBM 4446 1GB (4x 256MB) P615,P510,P520,P550IBM 4447 2GB (4x512MB)DDR1 DIMMS P615,P510,P520,P550IBM 4448 4GB (4x1GB)DDR1 DIMMS P615IBM 4449 FRU:12R9257 8GB(4x2GB) DDR1 DIMMS, 266 MHz 00P5773 P615,P510,P520,P550IBM 4451 FRU:77P6498 2G(2*1GB) P520,P550 P560IBM 4452 2GB (4x512 MB) DDR1 DIMMS P630 P650 P520 P550 P560 P570IBM 4453 4GB (4x1GB) DDR1 DIMMS P630 P650 P520 P550 P560 P570IBM 4454 FRU:12R9259 8GB (4x2GB) DDR1 DIMMS, 266 MHz P630 P650 P520 P550 P560 P570IBM 4468 FRU:80P3274 64GB Memory Card ,633MHZ Inward Facing P670 P690 P670 P690 IBM 4482 FRU:97P2241 8GB Memory Card ,567MHZ Inward Facing P670 P690 P670 P690 IBM 4484 FRU:53P4252 16GB Memory Card ,567MHZ Inward Facing P670 P690 P670 P690 IBM 4486 FRU:00P5206 32GB Memory Card ,567MHZ Inward Facing P670 P690 P670 P690 IBM 4490 4GB (4x1GB) DDR1 DIMMS P630 P650 P520 P550 P560 P570IBM 4521 FRU:77P6498 2G(2*1GB) P6 P520,P550 P560IBM 4522 FRU:77P6499 4G(2*2GB) P6 P520,P550 P560IBM 4523 FRU:77P6500 8G(2*4GB)DDR2 memory DIMM, 667 MHz P6 520,P550 P560IBM光纤硬盘FAST（DS4300 DS4700）系列IBM 5205 2GB 36GB FC 10000转FAST（DS4300）光纤硬盘IBM 5206 2GB 73GB FC 10000转FAST（DS4300）光纤硬盘IBM 5207 32P0765 2GB 146GB FC 10000转FAST（DS4300）光纤硬盘IBM 5208 73P8022 2GB 300GB FC 10000转FAST（DS4300）光纤硬盘IBM 5212 49G6458 2GB 36.4GB FC 15000转FAST（DS4300）光纤硬盘IBM 5213 2GB 73.4GB FC 15000转FAST（DS4300）光纤硬盘IBM 5214 2GB 146GB FC 15000转FAST（DS4300）光纤硬盘IBM 5222 146G 2Gb FC 10K DS4700IBM 5223 300G 2GB FC 10K DS4700IBM 5233 146G 2GB FC 15K DS4700IBM 5413 73G 4GB FC 15K DS4700IBM 5414 146G 4GB FC 15K DS4700IBM 5415 300G 4GB FC 15K DS4700IBM小型机光纤卡（HBA卡）IBM 1910/5759 4GB 双口HBA光纤通道卡FC:1910/5759 P51A,P52A,P55A,P561,P570，P510,P520,P550,P560,P570IBM 2104/2340 光纤卡HBA卡24p0960 24p0961 2GB光纤道通卡IBM 2765 2G HBA光纤卡FRU: 80P4384IBM 5716 2GB 单口HBA光纤通道卡HBA卡FRU:03N7067 03N7069 RS6000专用P630,P650,P510,P520,P550,P570IBM 5758/1905 4GB 单口HBA光纤通道卡FC:1905/5758 P51A,P52A,P55A,P561,P570，P510,P520,P550,P560,P570IBM 5773 4GB PCI-E 单口HBA光纤通道卡FC:5773 全新，9117-MMA P570IBM 6228 1GB 单口HBA光纤通道卡FC:6228全新，P615，P630,P650,P670,P690IBM小型机其他卡SCSI/网卡SCSI卡IBM 1912 PCI-X 双口SCSI卡P51A,P52A,P55A,P561,P570IBM 5736 PCI-X 双口SCSI卡P510,P520,P550,P560,P570网卡IBM 5700 Gbit 单口光纤网卡P51A,P52A,P55A,P561,P570，P510,P520,P550,P560,P570 IBM 5701 10/100/1000MB 电口网卡P51A,P52A,P55A,P561,P570，P510,P520,P550,P560,P570IBM 5706IBM小型机电源IBM 6273 AC Power Supply 645W Base/R P630 小型机电源IBM 6282 RS6000 H80/H85 645W FRU:41L5448/00P3601/97P4025IBM 7889 P550 P55A 39J5638 39J2576 RS6000 电源IBM P590/P595 Motor Drive Assembly (MDA) FRU:41U0341,12R9038IBM P595 DCA 16R1062 41V0943 15R6710 电源IBM P595 DCA 44p4672 电源IBM 7888 AC Power Supply,240V,1400W FRU:39J2779/97P5676 P570电源模块IBM小型机硬盘IBM 1968 73GB/73.4GB 10Krpm 小型机内置硬盘全新原包P51A,P52A,P55A,P561,P570 IBM 1968 146GB/146.8GB 15Krpm 小型机内置硬盘P51A,P52A,P55A,P561,P570IBM 1969 146GB/146.8GB 10Krpm 小型机内置硬盘P51A,P52A,P55A,P561,P570IBM 1970 36GB 15k SCSI 小型机硬盘RS6000IBM 1971 73GB/73.4GB 15Krpm 小型机内置硬盘P51A,P52A,P55A,P561,P570IBM 1972 146GB 15,000 RPM 小型机硬盘RS6000IBM 1973 300GB 10K 小型机内置硬盘P51A,P52A,P55A,P561,P570IBM 3102 67G0535/34L7391 18.2GB ULTRA 10k RS6000 SCSI H80/6H1/6M1/M80/170IBM 3104 06H9389/07N3674 18.2GB ULTRA SCSI RS6000 SCSI F40/F50/H50/H70/S70/S7A IBM 3129 00P1519/07N7070/08K0283/09P4444/09p4439 36.4GB ULTRA3 10000转SCSI硬盘F80/6F1/B80 7025-6F0, 7025-6F1, 7025-F80, 7026-B80IBM 3158 36.4GB Ultra3 10000转RS6000 SCSI硬盘, U3 80p p630 7026-6C4,7038-6M2,7039-651,7040-61DIBM 3159 09P3924 73.4GB Ultra3 SCSI Disk Drive 10000转68 and 80 Pin (160MB/s) RS6000硬盘6F0,6F1,F80,B80,6C4,7038-6M2,7039-651,7040-61DIBM 3264 36.4GB Ultra3 10000转RS6000SCSI硬盘80p 7026-6C1IBM 3274 82G3274/00p2648/00P3811 73.4GB Ult320 10000转RS6000 SCSI硬盘U320 7029-6C3,7038-6M2,7039-651,7029-6E3IBM 3275 146GB Ult320 10000转RS6000 SCSI硬盘U320 6E4/6C4IBM 3276 146.8GB 10000转UITRA3 DISK RS6000 SCSI硬盘IBM 3277 82G3277 36.4GB Ult320 15000转RS6000 SCSI硬盘U320 6E4/6C4 p650IBM 3278 00p5260/00p2685/72.8GB Ult320 15000转RS6000 SCSI硬盘U320 7026-6C4,7029-6C3,7038-6M2,7039-651,7040-61D,7029-6E3IBM 3279 146GB Ult320 15000转RS6000 SCSI硬盘U320 6E4/6C4IBM 3280 36GB 15k SCSI 小型机硬盘RS6000IBM 3281 15k 73GB SCSI 小型机硬盘RS6000IBM 3578 300GB Ult320 10000转RS6000 SCSI硬盘P630 P650IBM 3585 300GB 15K 小型机内置硬盘P51A,P52A,P55A,P561,P570IBM小型机CPUIBM 5122 小型机CPU,2-way 1.2GHz Power4+ Processor Card P650IBM 5208 小型机CPU,2-way 1.65GHz Power4+ Processor Card P650IBM磁带机/磁带库IBM外置磁带机IBM 7206-336 36/72GB 4mm DDS5外置磁带机P51A,P52A,P55A,P561,P570，P510,P520,P550,P560,P570IBM 7206-220 20/40GB 4mm DDS4外置磁带机P520,P550,P560,P570IBM内置磁带机IBM 1991 36/72GB 4mm DDS5内置磁带机P52A,P55A,P520,P55A IBM 6185 20/40GB 4mm DDS4置磁带机P615,P630,P650,P670,P690IBM数据磁带IBM 59H4456 20/40GB 150M 4mm DDS4磁带/数据带IBM 18P7912 36/72GB 170M 4mm DDS5磁带/数据带IBM DS系列控制器/电池 DS4300控制器24P8206 IBM FAStT600/DS4300控制器，256MB Cache24P8225 IBM FAStT600/DS4300控制器，1GB Cache24P8062 IBM FAStT600/DS4300控制器电池，原装全新24P0953 IBM FAStT700/DS4400/FAStT900/DS4500电池battery。

DS-2XS6A46G1/P-IZS/C36S804 MP ANPR Bullet Solar Power 4G Network Camera KitIt can be used in the areas that are not suitable for laying wired network and electric supply lines, or used for the scenes that feature tough environment and have high demanding for device stability. It can be used for monitoring the farms, electric power cables, water and river system, oil pipelines and key forest areas.It also can be used in the temporary monitoring scenes, such as the large-scale competitions, the sudden public activity, the temporary traffic control and the city construction.Empowered by deep learning algorithms, Hikvision AcuSense technology brings human and vehicle targets classification alarms to front- and back-end devices. The system focuses on human and vehicle targets, vastly improving alarm efficiency and effectiveness.⏹ 80 W photovoltaic panel, 360 Wh chargeable lithium battery⏹ Clear imaging against strong back light due to 120 dB trueWDR technology⏹ Focus on human and vehicle targets classification based ondeep learning⏹Support battery management, battery display, batteryhigh-low temperature protection, charge-dischargeprotection, low-battery sleep protection and remotewakeup ⏹ LTE-TDD/LTE-FDD/WCDMA/GSM 4G wireless networktransmission, support Micro SIM card⏹Water and dust resistant (IP66) *The Wi-Fi module of this product only supports AP mode on Channel 11, and does not support other modes and channels.FunctionRoad Traffic and Vehicle DetectionWith embedded deep learning based license plate capture and recognition algorithms, the camera alone can achieve plate capture and recognition. The algorithm enjoys the high recognition accuracy of common plates and complex-structured plates, which is a great step forward comparing to traditional algorithms. Blocklist and allowlist are available for plate categorization and separate alarm triggering.SpecificationCameraImage Sensor 1/1.8" Progressive Scan CMOSMax. Resolution 2560 × 1440Min. Illumination Color: 0.0005 Lux @ (F1.2, AGC ON), B/W: 0 Lux with light Shutter Time 1 s to 1/100,000 sLensLens Type Auto, Semi-auto, ManualFocal Length & FOV 2.8 to 12 mm, horizontal FOV 107.4° to 39.8°, vertical FOV 56° to 22.4°, diagonal FOV 130.1° to 45.7°8 to 32 mm, horizontal FOV 40.3° to 14.5°, vertical FOV 22.1° to 8.2°, diagonal FOV 46.9° to 16.5°Iris Type Auto-irisLens Mount All In One LensAperture 2.8 to 12 mm: F1.2, 8 to 32 mm: F1.6 DORIDORI 2.8 to 12 mm:Wide: D: 60.0 m, O: 23.8 m, R: 12.0 m, I: 6.0 m Tele: D: 149.0 m, O: 59.1 m, R: 29.8 m, I: 14.9 m 8 to 32 mm:Wide: D: 150.3 m, O: 59.7 m, R: 30.1 m, I: 15.0 m Tele: D: 400 m, O: 158.7 m, R: 80 m, I: 40 mIlluminatorSupplement Light Type IRSupplement Light Range 2.8 to 12 mm: Up to 30 m 8 to 32 mm: Up to 50 mSmart Supplement Light Yes VideoMain Stream Performance mode:50 Hz: 25 fps (2560 × 1440, 1920 × 1080, 1280 × 720) 60 Hz: 30 fps (2560 × 1440, 1920 × 1080, 1280 × 720) Proactive mode:50 Hz: 12.5 fps (2560 × 1440, 1920 × 1080, 1280 × 720) 60 Hz: 15 fps (2560 × 1440, 1920 × 1080, 1280 × 720)Sub-Stream Performance mode:50 Hz: 25 fps (640 × 480, 640 × 360) 60 Hz: 30 fps (640 × 480, 640 × 360) Proactive mode:50 Hz: 12.5 fps (640 × 480, 640 × 360) 60 Hz: 15 fps (640 × 480, 640 × 360)Third Stream 50 Hz: 1 fps (1280 × 720, 640 × 480) 60 Hz: 1 fps (1280 × 720, 640 × 480)Video Compression Main stream: H.264/H.265Sub-stream: H.264/H.265/MJPEGThird Stream: H.265/H.264*Performance mode: main stream supports H.264+, H.265+Video Bit Rate 32 Kbps to 8 MbpsH.264 Type Baseline Profile, Main Profile, High ProfileH.265 Type Main ProfileBit Rate Control CBR/VBRScalable Video Coding (SVC) H.264 and H.265 encodingRegion of Interest (ROI) 4 fixed regions for main streamAudioAudio Compression G.711/G.722.1/G.726/MP2L2/PCM/MP3/AAC-LCAudio Bit Rate 64 Kbps (G.711ulaw/G.711alaw)/16 Kbps (G.722.1)/16 Kbps (G.726)/32 to 192 Kbps (MP2L2)/8 to 320 Kbps (MP3)/16 to 64 Kbps (AAC-LC)Audio Sampling Rate 8 kHz/16 kHz/32 kHz/44.1 kHz/48 kHzEnvironment Noise Filtering YesNetworkSimultaneous Live View Up to 6 channelsAPI Open Network Video Interface (Profile S, Profile G, Profile T), ISAPI, SDK, ISUP, OTAPProtocols TCP/IP, ICMP, HTTP, HTTPS, FTP, DHCP, DNS, DDNS, RTP, RTSP, RTCP, NTP, UPnP, SMTP, SNMP, IGMP, 802.1X, QoS, IPv6, UDP, Bonjour, SSL/TLS, WebSocket, WebSocketsUser/Host Up to 32 users3 user levels: administrator, operator, and userSecurity Password protection, complicated password, HTTPS encryption, 802.1X authentication (EAP-TLS, EAP-LEAP, EAP-MD5), watermark, IP address filter, basic and digest authentication for HTTP/HTTPS, WSSE and digest authentication for Open Network Video Interface, RTP/RTSP over HTTPS, control timeout settings, TLS 1.2, TLS 1.3Network Storage NAS (NFS, SMB/CIFS), auto network replenishment (ANR)Together with high-end Hikvision memory card, memory card encryption and health detection are supported.Client Hik-Connect (proactive mode also supports), Hik-central ProfessionalWeb Browser Plug-in required live view: IE 10+Plug-in free live view: Chrome 57.0+, Firefox 52.0+ Local service: Chrome 57.0+, Firefox 52.0+Mobile CommunicationSIM Card Type MicroSIMFrequency LTE-TDD: Band38/40/41LTE-FDD: Band1/3/5/7/8/20/28 WCDMA: Band1/5/8GSM: 850/900/1800 MHzStandard LTE-TDD/LTE-FDD/WCDMA/GSM ImageWide Dynamic Range (WDR) 120 dBDay/Night Switch Day, Night, Auto, Schedule, Video Trigger Image Enhancement BLC, HLC, 3D DNR, DefogImage Parameters Switch YesImage Settings Saturation, brightness, contrast, sharpness, gain, white balance, adjustable by client software or web browserSNR ≥ 52 dBPrivacy Mask 4 programmable polygon privacy masks InterfaceAudio 1 input (line in), max. input amplitude: 3.3 Vpp, input impedance: 4.7 KΩ, interface type: non-equilibrium,1 output (line out), max. output amplitude: 3.3 Vpp, output impedance: 100 Ω, interface type: non-equilibriumAlarm 1 input, 1 output (max. 12 VDC, 1 A)On-Board Storage Built-in memory card slot, support microSD card, up to 256 GB, Built-in 8 GB eMMC storageReset Key YesEthernet Interface 1 RJ45 10 M/100 M self-adaptive Ethernet portWiegand 1 Wiegand (CardID 26bit, SHA-1 26bit, Hik 34bit, NEWG 72 bit) EventBasic Event Motion detection, video tampering alarm, exception (network disconnected, IP address conflict, illegal login, HDD error)Smart Event Line crossing detection, intrusion detection, region entrance detection, region exiting detection, unattended baggage detection, object removal detection, scene change detection, face detectionLinkage Upload to FTP/NAS/memory card, notify surveillance center, send email, trigger recording, trigger capture, trigger alarm output, audible warningDeep Learning FunctionRoad Traffic and Vehicle Detection Blocklist and allowlist: up to 10,000 records Support license plate recognition License plate recognition rate ≥95%GeneralPower 12 VDC ± 20%, 4-pin M8 waterproof connector1. Standby power consumption: 45 mW2. The average power consumption of 24 hours:3.5 W (4G transmission is excluded).3. The max. power consumption: 7 WMaterial Front cover: metal, body: metal, bracket: metalDimension 816.2 mm × 735.9 mm × 760 mm (32.1" × 28.9" × 29.9") (Max. size of the camera after it is completely assembled)Package Dimension 862 mm × 352 mm × 762 mm (33.9" × 13.9" × 30.0")Weight Approx. 31.885 kg (70.3 lb.)With Package Weight Approx. 25.650 kg (56.5 lb.)Storage Conditions -20 °C to 60 °C (-4 °F to 140 °F). Humidity 95% or less (non-condensing) Startup and OperatingConditions-20 °C to 60 °C (-4 °F to 140 °F). Humidity 95% or less (non-condensing)Language 33 languages: English, Russian, Estonian, Bulgarian, Hungarian, Greek, German, Italian, Czech, Slovak, French, Polish, Dutch, Portuguese, Spanish, Romanian, Danish, Swedish, Norwegian, Finnish, Croatian, Slovenian, Serbian, Turkish, Korean, Traditional Chinese, Thai, Vietnamese, Japanese, Latvian, Lithuanian, Portuguese (Brazil), UkrainianGeneral Function Anti-banding, heartbeat, mirror, flash log, password reset via email, pixel counter BatteryBattery Type LithiumCapacity 360 Wh (90 Wh for each battery)Max. Output Voltage 12.6 V Battery Voltage 10.8 VOperating Temperature Charging: -20 °C to 45 °C (-4 °F to 113 °F) Discharging: -20 °C to 60 °C (-4 °F to 140 °F)Cycle Lifetime Performance mode: 5 days, Proactive mode: 8 days, Standby mode: 80 days *in cloudy/rainy days (25 °C)Battery Life More than 500 cyclesBattery Weight Approx. 2.74 kg (6.0 lb.) (0.685 kg (1.5 lb.) for each battery) ApprovalEMC CE-EMC/UKCA (EN 55032:2015+A11:2020+A1:2020, EN 50130-4:2011+A1:2014); RCM (AS/NZS CISPR 32: 2015);IC (ICES-003: Issue 7)RF CE-RED/UKCA (EN 301908-1, EN 301908-2, EN 301908-13, EN 301511, EN 301489-1, EN 301489-52, EN 62133);ICASA: same as CE-RED;IC ID (RSS-132 Issue 3, RSS-133 Issue 6, RSS-139 Issue 3, RSS-130 Issue 2, RSS-102 Issue 5);MIC (Article 49-6-4 and 49-6-5 the relevant articles and MIC Notice No. 1299 of the Ordinance Regulating Radio Equipment)Safety CB (IEC 62368-1:2014+A11)CE-LVD/UKCA (EN 62368-1:2014/A11:2017) LOA (IEC/EN 60950-1)Environment CE-RoHS (2011/65/EU);WEEE (2012/19/EU);Reach (Regulation (EC) No 1907/2006)Protection Camera: IP66 (IEC 60529-2013)Wind resistance 12 level, up to 40 m/s wind speed resistance⏹Typical ApplicationHikvision products are classified into three levels according to their anti-corrosion performance. Refer to the following description to choose for your using environment.This model has NO SPECIFIC PROTECTION.Level DescriptionTop-level protection Hikvision products at this level are equipped for use in areas where professional anti-corrosion protection is a must. Typical application scenarios include coastlines, docks,chemical plants, and more.Moderate protection Hikvision products at this level are equipped for use in areas with moderate anti-corrosion demands. Typical application scenarios include coastal areas about 2kilometers (1.24 miles) away from coastlines, as well as areas affected by acid rain. No specific protection Hikvision products at this level are equipped for use in areas where no specific anti-corrosion protection is needed.⏹Available ModelDS-2XS6A46G1/P-IZS/C36S80 (2.8-12mm)DS-2XS6A46G1/P-IZS/C36S80 (8-32mm)Dimension。

Datasheet for 76650-02253, 4 and 6 Circuits Product HighlightsWire size:28-22 AWG(1.5 - 3) Amps depending on AWG 250 Volts Voltage:Current:Features and BenefitsApplications • Data communication equipment • Printers and faxes • PCs and monitors • Automotive • Friction lock provides good matingretention• Box-style contact protects contact area• Polarizing features ensures propermating• Guide rails and molded ledgesfacilitates mating and unmating Receptacle and Header Vertical General InformationMolex / Waldom Wire-to-Board 2.50mm (.098")Kit assembled in U.S.A.Description:Product Family:Pitch:Mini-Latch connectors provide a reliable interface for industry-standard 2.50mm(.098" ) wire-to-board applications. The system includes a box-style contactdesign and housing-side terminal latch to provide protection to the contact areaduring and after assembly. The durable housing also includes guide rails andmolded tabs to facilitate mating and unmating.Manufacturer:Country of Origin:Mini-Latch™Certificates:Friction Lock Vertical Header and Receptacle (Molex parts within this kit) - EU and China RoHS Compliant, UL and CSA Circuit Sizes:MountingOrientation:Connector Type:SpecificationsPart Number:DesignConfiguration:76650-0225Title:Mini-Latch Connector KitDatasheet for 76650-0225Molex Part No.Quantity in Kit 50802-91016551191-0300551191-0400551191-0600522-04-1031522-04-1041522-04-10615Molex Part No.63811-5200 *Japan Bill of Materials for Part No. 76650-0225Mini-Latch™ Female Crimp Terminals 28-22 AWG Countryof OriginDescription 2.50mm (.098") Pitch Mini-Latch™ Receptacles, 6 Circuits 2.50mm (.098") Pitch Vertical Header 3 Circuits 2.50mm (.098") Pitch Vertical Header 6 Circuits Japan 2.50mm (.098") Pitch Vertical Header 4 Circuits 2.50mm (.098") Pitch Mini-Latch™ Receptacles, 4 Circuits China Japan *Tool(s) not included in kit. Tool(s) ordered separately.Recommended Molex Tool(s) for Part No. 76650-0225*Countryof OriginDescriptionHand Crimp Tool Germany China 2.50mm (.098") Pitch Mini-Latch™ Receptacles, 3 Circuits Japan China。

This document lists both new and enhanced product functionality for the current release.SystemsDynamic Behavior ModelingState Logic ModelingShapeGenerative Shape DesignNatural SketchImagine & ShapeFreeStyle Shaper, Optimizer & ProfilerICEM Shape DesignShape SculptorRealistic Shape OptimizerDigitized Shape EditorQuick Surface ReconstructionSTL Rapid PrototypingMechanicalLive ShapeSketcherPart DesignFunctional Modeling PartHealing AssistantLive ComposeAssembly DesignKinematics Mechanism DesignComponent FamilyInteractive DraftingGenerative Drafting2D Layout for 3D Design3D Functional Tolerancing & AnnotationBend Part DesignGenerative Sheetmetal DesignAerospace Sheetmetal DesignTooling DesignCore & Cavity DesignStructure Functional DesignStructure Detailed DesignComposites DesignFastener DesignWeld DesignWeight and Center of GravityEquipmentElectrical Logical EditorElectrical 3D InstallationElectrical LibraryElectrical Conductor RoutingElectrical Harness FlatteningFlexible Circuit BoardFluid Systems Logical EditorFluid Systems DesignKnowledgewareKnowledge BasicsKnowledge AdvisorKnowledge ExpertKnowledge TemplateProduct Engineering OptimizerAutomated Design ProcessApplicative PortfolioKnowledge Modeling LanguageSimulationKinematics SimulationSystem ExperimentModel Highlighting of Modelica Models using the Messages Reporting Window SupportedTo facilitate debugging, clicking messages that contain a Modelica class name in the Messages Reporting window displays corresponding classes that will be highlighted if selected.Submodel CreationTo facilitate reuse and organisation of parts of models, submodels can be created.Support for Enforcing Compliance of Modelica ModelsTo ensure that models created are in compliance with the Modelica Language Specification, a pedantic flag can be set to turn all warnings corresponding to semantic errors in the Modelica code into errors instead of warnings; forcing the user to correct them. OPC Communication to DymosimYou can use OPC to establish a connection between a client and the Dymosim application; enabling external applications to control and monitor a simulation as OPC clients.Enhanced FunctionalityImproved Organization of Messages in the Messages Reporting WindowMessages in the Messages Reporting window are now displayed in a tree structure, making them more readable.Support for Contextual Search in Class SelectorsWhen selecting a class, the contextual menu can be used to search for matching classes when the user has typed in a part of a class name.C-code Export simplifiedModels can be exported to C code for usage in other environments. Previously this could only be done using a library. Now C code export can also be done using a command in the Tools menu.Virtual ExecutionModify Abscissa: By default, the value of the abscissa variable used in a plot is Time. You can modify this default value.Create a Curve: You can create a curve from existing data.Synchronize Charts: When multiple charts are open in the same plot, you can synchronize the axes if they all have thesame units. When axes are synchronized, the value range for all axes is the same, and view manipulations performed onone axis are applied to the other axes as well.Customizing SettingsVisual Studio 2010 for SimulationIn the ToolsOptions> Dynamic Behavior ModelingCompiler tab, you can choose the new version of Visual Studio for Modelica simulation.Function LanguageA complete set of instructions such as variables declaration, loops and arrays is now available to edit functions.Enhanced FunctionalityDebugger EnhancementFew modifications have been done to improve the debugger usability. The windows position, the breakpoints and the content of the watch lists are kept between two simulations. You can now define breakpoints on expressions.Time ManagementThe new SimulationLib library offers to the user a set of functions to access the simulation time at each step.Creating Mid SurfacesYou can now create a mid-surface from a pair of faces.Creating a Curve from EquationsYou can now define a parametric curve from three Cartesian equations.Axis System Constructors FunctionsYou can now create and valuate an axis system using rules or formulas.Enhanced FunctionalityDefining an Axis SystemYou can now create an axis system according to a robot definition.Deforming Elements According to Shape MorphingYou can now shape morph a wireframe using a limiting element.Creating Adaptive Swept SurfacesYou can now use a freely positioned sketch for creating adaptive swept surfaces.Creating Multiple Points and PlanesYou can now edit instances and spacing of points or planes created using the repetition command. Isolating Geometric ElementsYou can now apply the Isolate contextual command on certain surfacic and volumic Part Design features. Wireframe Constructors FunctionsYou can now create and valuate the isoparametric curves using rules or formulas.Sketching PrimitivesThis new functionality lets you sketch primitives, such as circles, open circles or lines.Modifying Control PointsThis new functionality lets you modify existing curves by moving their control points.Working with the Auto-Clean CommandThis new functionality lets you deburr intersecting curves before generating a surface.Erasing Using a RubberThis new functionality lets you erase a curve or part of it using a rubber.Importing Images onto PlanesThis new functionality lets you select and drop images onto specific planes.Enhanced FunctionalityTracing OverYou can now modify the curve in a plane different from the creation plane, thanks to combine operations.OptionsNew visualization options let you specify how you want to visualize the symmetry.Manipulating the ViewpointNew navigation pads have been added to let you move, rotate or zoom in the viewpoint.Tracing Over / Modifying Points on Curves / Modifying Control Points / Extrapolating CurvesYou can now freeze a selection by clicking the curve and unfreeze a selection by clicking another curve or clicking anywhere in the geometry area.Keyboard ShortcutsYou can double-click the 3D manipulator plane to snap onto the nearest canonical plane.Customizing SettingsGeneralThe General options let you customize the display of the navigation pads and view types.Creating a BevelThis new functionality lets you create bevels by defining the shape, number of internal cuts and weight.Managing Character LinesThis new functionality lets you manage the creation and deletion of character lines defined on a selected subdivision surface. Enhanced FunctionalityCreating a Net SurfaceYou can define whether you want to create a net surface or a subdivision surface.Performing Soft Mirror AnalysisA new Soft Mirror, Hide Original command is available to hide an original element while creating its mirror element.More about Breaking SurfacesA new Assemble contextual command temporarily joins the selected limiting elements.The Propagate contextual command allows you to select all the elements which are connected to the current selectedlimiting element.Enhanced FunctionalityMatch Constraint Dialog BoxA slider is now available in the Modification Ratio area to specify a ratio for displaying a result between the original and last applied status.More about Creating a Matching ConstraintThe Apply Constraint and Update Netw ork contextual commands are now available on the constraint node in the tree.The Limits area is now available to set the limiting points on the target surface.Analyzing Using Cutting PlanesYou can now select solid for cutting plane analysis.Selecting Control PointsYou can now select multiple control points in the 3D area using the Selection Trap above Geometry command.More about Deforming a Shape Using Control PointsYou can create a separate 3D NURBs curve from the surface edge which is selected as an input element for manipulation by the Control Points command. This curve can be manipulated using the control points without affecting the underlying surface.Styling Fillet Dialog BoxThe Output Result area gives the geometric information of the fillet ribbon at the time of fillet creation.Connect Checker Analysis Dialog BoxYou can now use the Ignore Small Free Edges option to ignore the connections involving free edges of length less than the maximum specified gap.Customizing SettingsManipulatorsYou can select the Transparent background check box to display the 3D tags with a transparent background and the tagged text with the background color.GeneralYou can select the Border 3D Curve Mode check box to create a separate 3D NURBs curve from a surface edge which is selected as an input element for the Control Points command.Enhanced FunctionalityApply ModesA preview can now be displayed while the original geometry remains unchanged.Multi-Output capabilityThis function is now also available in the following commands:Curve Creation > Curve ProjectionCurve Creation > Curve OffsetExpert > Shape MappingMoveThis menu offers an optional preview mode to allow dynamic modifications.Extrapolation (Feature)This command contains a Reset option now.Curve ProjectionTangent projection on the curve endpoints is now optional.Blend CurveBlend curves can now be created on supports.FlangeOn the Approximation tab, an option has been added for computing the flange cell by cell and order-wise. The order in V direction of each flange subsurface is taken from the generating guide. The corner computation has been extended by manual opening options. Advanced FilletIn the Analysis area, the maximum G1, G2, and G3 deviation between the different created fillet surfaces is displayed now. Surface OffsetThere is now an option to crop the underlying base surfaces.Customizing SettingsDisplay ModesIn Shading w ith Material mode, Back and front mode displays meshes with different front and back colors.Enhanced FunctionalityDigitized MorphingThe command has been enhanced to accept a curve and its support as an Element to deform. Displacement OptimizationThe command has been enhanced to accept a Deviation Analysis with a mesh as reference. Digitized Morphing and Vectors Field FilterBoth commands propose a PLM Chooser to select a vector file.Enhanced FunctionalityDeviation AnalysisThe command has been enhanced to support both Flat and Smooth display modes.Customizing SettingsDisplay ModesIn Shading w ith Material mode, Back and front mode displays meshes with different front and back colors.New FunctionalitySegmentation by ColorThis new command uses color information to perform a segmentation of clouds of points or meshes. Enhanced FunctionalityDeviation Analysis and Curvature MappingThese commands have been enhanced to support both Flat and Smooth display modes.Curves NetworkThe command has been enhanced to create a network from a set of 3D curves, with or without a Support mesh. Customizing SettingsDisplay ModesIn Shading w ith Material mode, Back and front mode displays meshes with different front and back colors.Customizing SettingsDisplay ModesIn Shading w ith Material mode, Back and front mode displays meshes with different front and back colors.New FunctionalityEditing Linear and Circular PatternsYou can now edit linear and circular patterns to add or delete elements and make other changes.Three-Point Arc toolYou can now draw an arc by defining three points.Deform a Face Globally Along Surface NormalsYou can now deform faces along the surface normal at each edit point of an isoparametric curve.New tools accessible from EraseThree new tools are now available letting you choose whether you want to reconstruct the shape based on existing geometry (Replace Mode ), delete the selected geometry (Remove Mode ) or hollow out a solid shape (Shell Mode ).Enhanced FunctionalityAbout snap features inIn Draw in 3D, automatic snapping is now available. To snap to existing geometry, prefer to encourage snapping.In Draw on the grid and Draw in 3D, one new snap is available: when using the Spacebar to specify and lock line length, snap automatically aligns to points of intersection with other lines.Modifying shapesYou can now make basic geometric modifications to a multi-selection of elements in different Live Shape features.Mirror toolMirror is now accessible from Robot, and no longer from Select.Snapping and smart positioning 3D partsWhen snapping and smart positioning 3D parts, constraint symbols now appear after you validate your move letting you edit the constraint directly to, for example, change the constraint mode or orientation. The behavior is now the same as when creating engineering connections. See Snapping 3D Parts into Position and Smart Positioning 3D Parts.Support of non-V6 CAD formatsLive Compose now supports CATIA V5, SolidWorks, ProE® and Nx™ CAD data, letting you compose multi-CAD projects with mixed CAD data formats.Greater visibility for 3D design - turntable switchA 3D design-turntable switch is permanently displayed in the lower-right corner of the document, letting you switch between 3D design and turntable views. It replaces the Work on structure tooltip that appeared when pausing over the South quadrant of the Compass. Collaborative review and designThe following leader commands and actions are now replicated in the observer's session: display short data tips, preview at center of the turntable view, smart selection ladder and 3D bounding box, Orient objects on tables and Size linearization factor settings, and display of the Immersive Search results window. See Availability of Commands and Actions in Co-ReviewA warning message is now displayed in the Message Board if leader and observer sessions do not share the same content. This may be due to different security privileges.Customizing SettingsEngineering connection user interfaceA new option lets you display callouts and balloon tools when editing engineering connections: Display in geometry area in ToolsOptionsMechanical DesignCATIA Live Shape. Callouts identify connected 3D parts to help you visualize the engineering connection.ConstraintsA new option lets you visualize the entire constraint system for selected objects: select Show the constraints netw ork for selected objects in ToolsOptionsMechanical DesignCATIA Live Shape. This option lets you see the network of objects that may be impacted if you move selected objects.Editing a SplineYou can now manage the tangency angle and curvature for a given control point of a spline.Breaking ElementsYou can now visualize the broken entity when using the Break command.Converting Standard into Construction ElementsYou can now define whether the current element in edition is to be treated as a construction element or a standard one.OutputYou can now create:A plane from a selected line of the sketcher.A 3D line from a selected point of the sketcher.About SmartPicking Background ElementsYou can now directly use the background elements like existing geometry of a sketch to position the future geometry to create. This way you can now manage the selection of background entities to define their inputs.Creating Equidistant PointsYou can now create an equivalent dimension for all the rounds/equidistance values instead of creating many individually modifiable formulae. With this, you can modify multiple distance values by modifying only one of the parameters.Creating a Curvilinear Distance ConstraintYou can now create a curvilinear distance constraint like any other dimensional constraint of a sketch.Creating Remove Face FeaturesNew Fillet Propagation contextual command is available to get the tangent continuous filleted faces of the selected face.The blue arrow remains available on the limiting element even after closing the Face to Limit dialog box. Thus, you canchange the orientation of the limiting element without editing it.Creating Circular PatternsYou can create the specific staggered pattern configurations by rotating the alternate circles of the crown with certain angle. Creating Mirror FeaturesNew Keep specifications check box is available in the Mirror Definition dialog box.More about Variable Radius FilletsYou can click at different points on the closed edge and apply the desired radius values to create a variable radius fillet. Customizing SettingsColorsNew check box is available in the Hide/ Show for Review area to prevent the model from any modifications while hiding or showing its parts.CompatibilityNew check box is available in the Compatibility area to create a data compatible with V5-6R2012 version.More about Cutout FeaturesA new Protected volume check box is available to add material inside the cavity (unprotected area) created by the cutout feature. More about Pushing BodiesA new Protected volume check box is available to add material inside the cavity (unprotected area) created by the push feature.Compare & ReviewA new button lets you preview the differences found:They are highlighted in the authoring window.An animation is accessible from the Play button of the Compass. The dialog box is now an immersive one.For mechanical architects, engineers and designers, Live Compose lets you create, edit and navigate structures as well as compose your designs, then position and assembly 3D products in a variety of ways.Live Compose provides the following key capabilities:Rapidly search for and combine existing products into a new product structure and design.Immersive search from within your Live Compose session.Move, position and assemble 3D parts and products in a variety of ways, including engineering connections and 3D bounding boxes.Intuitively navigate through the assembly structure in a turntable view, or alternatively use a smart selection ladder in the 3D view.Collaboratively design and review projects to build consensus through peer-to-peer collaboration and reach users beyond the design office.You can customize how various components will appear in Live Compose by setting options in Tools > Options > Mechanical Design > Live Compose.Enhanced FunctionalityAvailable Constraints from Selected GeometriesYou can create a Tangency constraint between a plane and a surface.Constraint SymbolsDepending on the selected Constraint Mode, constraint values can appear with or without brackets:Creating an Assembly CutThe Cut dialog box of the Part Design workbench has been replaced by a dialog box specific to the Assembly Design workbench. Engineering Connections BalloonsThe new Offset Orientation section describes the two new commands to modify the offset orientation.Engineering Connection Definition Dialog BoxOptions and tooltips in the Engineering Connection Orientation have been reworded.Engineering Connections BalloonsThe new Offset Orientation section describes the new Flip Face and Reverse Offset Direction commands that let you modify the offset orientation.Instantiating Assembly Features in a PatternBased on Technological Results capabilities, all components affected by the primary product containing Assembly Features are also impacted by the pattern components.PLM Update and Engineering ConnectionsThe PLM Update now handles the minor version management in the engineering connection status.Customizing SettingsUpdate behavior on errors and warningsYou can now include warning information in the Update Report dialog box.Engineering connectionFor clarity purposes, several options have been reworded.DocumentationMeasuring Inertia in Product ContextThe Measure Inertia description is now included in this guide.3D Manipulators for CommandsWhen using the Mechanism Player, you can now access 3D manipulators that let you modify command values using rulers. You can retrieve commands directly in the 3D, handle them with accuracy and switch from one command to the other quickly.Rapid Application Configured Environment Support for Kinematics Mechanism DesignThe Kinematics Mechanism Design product is compatible with the .Enhanced FunctionalityAssembly of mechanisms on Rigid Product StructuresYou can now assemble sub-mechanisms that belong to a rigid product structure in a multilevel mechanism.Mechanism Manager EnhancementsThe Mechanism Manager provides a new check box to optimize the exclusion or inclusion of connections and mechanisms in the table. The transparency effect in the 3D allows you to visualize only the parts involved in the mechanism; the dressup parts are also included. A detailed status for each engineering connection (Joints tab) and mechanism (Assembly tab): included, indirectly included, cannot be included is provided. The Mechanism Manager dialog box that displays information for the mechanism highlighted in the tree, can be accessed directly by double-clicking the Joints node in the tree.More about DressupYou can now dressup products that are referenced by macro mechanisms.Dressup Dialog Box EnhancementsYou can now use the center graph contextual command on products, the smooth reframe on, and launch the Dressup command by double-clicking a dressup node in the tree.Animating MechanismsYou can now take advantage of the new PLM Player.DocumentationThe V6R2012x enhancements are documented in V6R2013 Mechanism Design User's GuideInstantiating a Component Using the Immersive PLM Chooser IntegrationYou can instantiate Family items using the immersive PLM Chooser which proves useful if you want to use Component Families without catalogs.Enhanced FunctionalityCreating a Component FamilyIf a root product containing a design table or a product table is loaded in session, this product is displayed in the Generic Model field of the Component Family Model tab and the design or the product table name is displayed in the Table field.Inserting a Picture in a Table CellYou can now insert a picture directly in a table cell easing creation of legends, title blocks etc. You can also crop a picture interactively regardless of its location without using the in the Properties dialog box.Enhanced FunctionalityEditing a SplineYou can now manage the tangency angle and curvature for a given control point of a spline.Breaking ElementsYou can now visualize the broken entity when using the Break command.Converting Standard into Construction ElementsYou can now define whether the current element in edition is to be treated as a construction element or a standard one.Generating BalloonsYou can now generate all the balloons in a generative view in a single click.Enhanced FunctionalityGenerating a Bill of MaterialYou can now create a bill of material filtering the products which are phantom products or which have no real existence in the real life product.Managing Persistent Product Graphic PropertiesYou can now have the view which will inherit the persistent product graphic properties.Creating Annotations in Assembly ContextYou can now annotate/dimension a product from a layout, creating dedicated links and checking the level of assembly actually annotated/dimensioned.Inserting a Picture in a Table CellYou can now insert a picture directly in a table cell easing creation of legends, title blocks etc. You can also crop a picture interactively regardless of its location without using the Properties tab.Creating a 3D AxisYou can now create a 3D line from a selected point in a 2D layout view.Enhanced FunctionalityEditing a SplineYou can now manage the tangency angle and curvature for a given control point of a spline.Breaking ElementsYou can now visualize the broken entity when using the Break command.Converting Standard into Construction ElementsYou can now define whether the current element in edition is to be treated as a construction element or a standard one.Enhanced FunctionalityProduct Data Filtering WorkbenchIn Product Data Filtering workbench:Product Filtering & Merging has been enhanced to process 3D Functional Tolerancing & Annotations.Product Filtering and Product Filtering & Merging commands let you filter the 3D Functional Tolerancing & Annotations captures to process by a name criterium.Customizing SettingsTolerancing StandardThe default annotation set ratio can be defined.New FunctionalityCreating GroupsYou can now create a group of faces in order to position more than one face using constraints.Enhanced FunctionalityCreating a Wall on EdgeYou can now create a wall on edge with linear or tangent bend extremities.Adding 3D ConstraintsIf you edit a constraint by direct manipulation of its extremities, you can now decide which side of the constraint has to move to verify the new value.Modifying a WallYou can now chose between normal and tangent extrapolation in the offset option.Modifying an EdgeYou can now translate or copy an edge.Modifying a BendYou can now choose to edit both extremities of a bend or only selected extremities.Modifying a CutoutYou can now pattern and mirror a cutout without using the Ctrl key.Generating an Order ProcessYou can now create order processes for cutouts and holes. You can also visualize the maximum area required by the process. Creating a Punch with a Die / Creating a Punch with Opening FacesYou can now use a Sheetmetal Catalog containing User Defined Features (UDF) or power copies in the User Stamp command.Defining the Compensations and RunoutYou can now define the the joggle runout and clearance measure direction when the joggle plane is not perpendicular to the OML.New FunctionalityPrepare Tooling ResourcesAssociated to ToolingMigration, this new tool:helps you select the data to import using ToolMigration,gives a quick view of all the available ToolingComponents according to suppliers and types.Delete AnchorThis new contextual menu item lets you delete an Anchor or an Anchor Pattern with their associated data.Enhanced FunctionalityDefault Catalogs for Tooling Design and Mold Tooling DesignThey have been updated.ToolMigration (Tooling Design)If the Part Number of the V5 CATPart migrated contains a string corresponding to a recognized type, the V6 type name is proposed automatically.A check box has been added to create a new catalog for each ToolingComponent, with a new chapter added to thiscatalog.ToolingComponentsThe ToolStructureLayoutFamily has been renamed into ToolUnitElementFamily.The functional type HotRunnerBlock has been added to the InjectionFamily.The functional types Block and DateStamp have been added to the MiscFamily.The ElectrodeFamily has been created.Typed Parts (Tooling Design)The command has been enhanced to create ConceptMoldSkeleton.Mold Tooling DesignYou now have to start working with a ProjectUnit instead of an InsertUnit.A LayoutUnit can then be created in this ProjectUnit, instead of in the InsertUnit.Naming of Tooling Products (Mold Toolign Design)The name of Tooling products created by the commands below now includes the type of the product. These commands are: MobileUnit,LayoutUnit,MoldBase,ToolingMigration.Define Anchors (Mold Toolign Design)The command has been enhanced to let you create points within the command.GatesThe command has been renamed into InjectionPoints.Ejection Wizard (Mold Toolign Design)The command has been enhanced to:populate the activated PrintCavity or PrintCore of a MobileUnit.compute automatically the cuts made on the inserted ToolingComponents,compute automatically the impacts made by the inserted ToolingComponents.Define MoldedPart (Mold Toolign Design)The command has been enhanced with diagnostics and help messages.Drilling Hole TableFor an easier manipulation, labels have shorter arrows.。

随着制造业的发展，投入设计、生产的新技术复杂度日益增加，产品开发阶段需要验证的物理现象的范围正逐步扩大，困难程度也在不断提高。

为了充分应对这些挑战，CAE已经在各行各业中广泛应用。

今天，CAE已经是产品生命周期中不可或缺的一环。

尤其是在世界发达国家，CAE更是在各行各业中被活学活用。

ANSYS是一家多物理域CAE仿真公司。

ANSYS的软件在世界各地的公司和研究机构广泛应用于结构、振动、热传导、电磁场、压电、声学等物理现象的研究。

上述物理现象的组合就是耦合问题，ANSYS软件能够根据不同的设计目的来灵活地实现这样的耦合分析。

ANSYS提供了名为ANSYS Workbench的集成环境，它把前后处理器和各个领域的求解器集成在其中。

用户可以在统一的环境下运行多物理仿真分析。

这是ANSYS的一大优势。

在产品开发方面，现在的市场竞争需要先进的技术和知识。

为了开发具有竞争力的产品，借助ANSYS的产品优势可以让您事半功倍。

功能对应表ANSYS 的操作环境前处理器各种分析功能多物理场解决方案提高计算效率不同行业的分析案例优化数据管理其它相关产品2 定制后处理器ANSYS Workbench 环境对应的功能。

ANSYS Mechanical APDL 环境对应的功能。

此目录中的产品名称侧重于ANSYS 的功能介绍。

有关每个产品可用许可的功能的更多信息，请参见附录的功能对应表。

相应的运行环境，用以下图标标识。

关于该目录的产品名称Workbench Mechanical APDL ANSYS DesignSpace 线性结构分析、传热分析ANSYS Professional NLS 线性、非线性结构分析、稳态传热分析ANSYS Professional NLT 线性、非线性传热分析、线性结构分析ANSYS Structural ANSYS Multiphysics 所有的分析功能仿真产品学术版线性、非线性结构分析ANSYS Fluent 热流体分析ANSYS CFX 热流体分析ANSYS CFD 热流体分析软件ANSYSLS-DYNA PC Windows 专用跌落、冲击分析ANSYS LS-DYNA 跌落・冲击分析ANSYS Explicit STR ANSYS Workbench 专用冲击分析ANSYS HFSS 高频电磁场分析ANSYS Maxwell 低频电磁场分析ANSYS Icepak 电子设备专用热流体分析ANSYS Academic Teaching 网格划分产品ANSYS Extended Meshing ANSYS Fatigue Module 扩展网格划分器学术版ANSYS Autodyn 爆炸、冲击分析ANSYS Mechanical 结构、传热分析ANSYS CFD-Flo 热流体分析ANSYS Emag 低频电磁场分析ANSYS 产品结构功能扩展选项分析能力※需要单独购买许可证方可使用。

Qualified Vendors List (QVL) Standard table for user manualProject Name:A*B*C*256MB Kingston KVR333X64C25/256N/A Kingston SS D3208DH1T-6256MB Kingston KVR333X64C25/256N/A Hynix SS HY5DU56822BT-J Pass Fail 512MB Kingston KVR333X64C25/512N/A Hynix DS HY5DU56822BT-J Pass Pass 512MB Kingston KVR400X643A/512N/A Hynix DS HY5DU56822BT-D43PassPass512MB Kingston KVR400X64C3A/512N/A Kingston DS D3208DL3T-5256MB Kingston KVR400X64C3A/256N/A Hynix SS HY5DU56822BT-D43256MB Infineon HYS64D64320GU-5-C 3Infineon SS HYB25D256800CE-5C Pass Pass 512MB Infineon HYS64D32300GU-5-C 3Infineon DS HYB25D256800CE-5C Pass Pass256MB Infineon HYS64D64320GU-5-C N/A Infineon SS HYB25D256800CE-5C Fail 512MB Infineon HYS64D64320GU-6-CN/A Infineon DS HYB25D256800CE-6C Pass Pass 256MB HY DDR400-256N/A Hynix SS HY5DU56822BT-D43PassFail256MB HY DDR266-256N/A Hynix SS HY5DU56822AT-H 256MB HY DDR333-256N/A Hynix SS HY5DU56822BT-J Pass Pass 512MB HY DDR333-512N/A Hynix DS HY5DU56822BT-J 256MB Corsair VS256MB400N/A Value select SS VS32M8-5 2B0409Pass Pass 512MB Corsair VS512MB400N/A Value select DS VS32M8-5 2B0402Pass Fail 256MB Corsair VS256MB333N/A SAMSUNG SS K4H5608380-TCB3Pass Pass 512MB Corsair VS512MB333N/A Value select DS VS32M8-6 2B0412Pass Pass 512MB Micron MT16VDDT6464AG-335GB N/A MICRON DS MT46V32M8-G Pass Pass 256MB Micron MT8VDDT3264AG-335GB 2.5MICRON SS MT46V32M8-G Pass Pass 256MB Micron MT8VDDT3264AG-40BGB 3MICRON SS MT46V32M8-G Pass Pass 512MB Micron MT16VDDT6464AG-40BGB 3MICRON DS MT46V32M8-G 256MB Samsung M368L3223FTN-CCC 3SAMSUNG SS K4H560838F-TCCC Pass Pass 512MB Samsung M368L6423FTN-CCC N/A SAMSUNG DS K4H560838F-TCCC Pass Fail 256MB Samsung M368L3223FTN-CB3 2.5SAMSUNG SS K4H560838F-TCB3Pass Pass 512MB Samsung M368L6423FTN-CB3 2.5SAMSUNG DS K4H5608838F-TCB3Pass Pass 256MB Winbond U24256ADWBG6H20N/A Winbond SS W942508CH-5Pass Pass 256MB Winbond U24256AAWBG6H20N/A Winbond SS W942508CH-6Pass Fail 512MB Winbond DDR333-512N/A Winbond DS W942508BH-6Pass Pass 512MB Winbond U24512ADWBG6H20N/A Winbond DS W942508CH-5Pass Pass 256MB Elpida U24256AD1PG6H20N/A Elpida SS DD2508AKTA-5C Pass Fail 512MB Elpida U24512AD1PG6H20N/A Elpida DS DD2508AMTA Pass Pass 256MB Transcend DDR400-256N/A SAMSUNG SS K4H560838F-TCCC Pass Pass 256MB Transcend DDR400-256N/A Mosel SS V58C2256804SAT5B PassPass512MB Transcend DDR400-512N/A Mosel DS V58C2256804SAT5B 512MB Transcend DDR400-512N/A SAMSUNG DS K4H560838F-TCCC 512MB TranscendDDR333-512N/A Hynix DS HY5DU56822CT-J Pass Pass256MB Pmi 3208GATA07-04A7N/A Pmi SS PM4D328D50406EU 512MB Pmi 3208GATA01-04A4N/A Pmi DS PM4D328S50403DU 256MB Kingmax MPMB62D-38LT3R N/A Mosel SS V58C2256804SAT6Pass Fail 512MB Kingmax MPMC22D-38HT3R N/A Hynix DS HY5DU56822BT-J Pass Pass 256MB Kingmax MPMB62D-38KT3R N/A KINGMAX SS KDL388P4LA-50Pass Pass 512MB Kingmax MPXC22D-38KT3R N/A KINGMAX DS KDL388P4EA-50Pass Pass 256MB Mosel V826632K24SATG-D33Mosel SS V58C2256804SAT5Pass Pass 512MB Mosel V826664K24SATG-D33Mosel DS V58C2256804SAT5Pass Fail 256MB Nanya NT256D64S88B1G-5T 3Nanya SS NT5DS32M8BT-5T Pass Fail 512MB Nanya NT512D64S8HB1G-5T3Nanya DS NT5DS32M8BT-5T 256MB Apacer 77.10628.10A 2.5Apacer SS AM3A5608AIT-6B Pass Pass 512MB Apacer 77.90728.U1G 2.5Apacer DS AM3A568AJT-6B Pass Pass 512MB Apacer 77.10736.464 3SAMSUNG DS K4H560838E-TCCC 512MB Apacer 77.90739.U1G 2.5Apacer DS AM3A568AJT-5A Pass Pass 256MB Apacer 77.10636.46G 3SAMSUNG SS K4H560838E-TCCC 256MB Apacer 77.10636.56G3Mosel SS V58C2256804SAT5B Pass Fail 512MB Apacer 77.10736.11G 3Infineon DS HYB25D256800BT-5B Pass Fail 256MB Smart U24256ADSRG6H20N/A Smart SS D32M8XS50H3X4AMV Pass Fail 512MB Smart U24512ADSRG6H20N/A Smart DS D32M8XS50H3X4AMV Pass Pass 512MB Smart U24512ADSKG6H20N/A Smart DS D32M8XS60HBX4AMV1G Twinmos M2S5016AJAMC5G0811A-J N/A TWINMOS DS 46V64M8Pass Pass 512MB Twinmos M2S9J18BGAPS9F0811A-T 2.5PSC DS A2S56D30ATP 256MB A Data MDOSS1F3G3X10BZL0Z N/A SAMSUNG SS K4H560838E-TCC5PassPass512MBA DataMDOSS1F3H4X10BZL0ZN/ASAMSUNGDSK4H560838E-TCC5BrandSS/DSComponentDIMM socket support (Optional)SizeVendorModelCL512MB Promos V826662K24SCTG-D0 2.5Promos DS5B Pass Pass Note:A* : Supports one module inserted in any slot as Single-channel memory configurationB* : Supports one pair of modules inserted into eithor the blue slots or the black slots as one pair of Dual-channel memory configuration C* : Supports 4 modules inserted into both the blue and black slots as two pairs of Dual-channel memory configuration。

Eaton 120663Eaton Moeller series xPole - mRB4/6 RCBO - residual-current circuit breaker with overcurrent protection. RCD/MCB, 13A, 100mA, C-LS-Char, 3N pole, FI-Char: AGeneral specificationsEaton Moeller series xPole - mRB4/6 RCBO - residual-current circuit breaker with overcurrent protection120663401508118493480 mm 75.5 mm 70 mm 0.446 kg CE Marked RoHS conformCE mRB6-13/3N/C/01-AProduct NameCatalog Number EANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications Model CodeSwitchgear for residential and commercial applicationsmRB6Combined RCD/MCB devicesSwitchgear for industrial and advanced commercial applications Three-pole + N44CC13 A6 - 25 Ampere0.1 AType A, pulse-current sensitiveRCBO AC400 V230 V / 400 V400 V500 V4 kV30, 100, 300 MilliAmpere Partly surge-proof, 250 A 50 HzA6 kA6 kA6 kA0.5 x I∆n0 kA6 kA6 kAApplicationProduct rangeBasic functionProduct applicationNumber of polesNumber of poles (protected) Number of poles (total) Tripping characteristic Release characteristicRated currentRated current of product range Fault current rating Sensitivity typeType Voltage typeVoltage ratingVoltage rating at ACRated operational voltage (Ue) - maxRated insulation voltage (Ui)Rated impulse withstand voltage (Uimp)Rated fault currents of product rangeImpulse withstand currentFrequency ratingLeakage current typeRated switching capacityRated switching capacity (IEC/EN 60947-2)Rated switching capacity (IEC/EN 61009)Rated non-tripping currentRated short-circuit breaking capacity (EN 60947-2) Rated short-circuit breaking capacity (EN 61009) Rated short-circuit breaking capacity (EN 61009-1) Rated short-circuit breaking capacity (IEC 60947-2)0 kA 0.25 kAUndelayed Non-delayed 100 Ampere gL 3III245 mm480 mm70 mmTri-stable slide catch - enables removal from existing busbar combinationIP20IP40Twin-purpose1 - 25 Square MillimeterBusbar tag shroud to VBG41 mm²25 mm²1 mm²25 mm²2 mmIEC 68-2: 25 °C - 55 °C at 90 % - 95 % humiditySurge current capacityDisconnection characteristic TrippingBack-up fuseSelectivity class Overvoltage category Pollution degree FrameWidth in number of modular spacingsDevice heightBuilt-in depthMounting styleDegree of protectionDegree of protection (built in)Terminals (top and bottom)Solid terminal capacitiesTerminal protectionConnectable conductor cross section (solid-core) - min Connectable conductor cross section (solid-core) - max Connectable conductor cross section (multi-wired) - min Connectable conductor cross section (multi-wired) - max Material thicknessClimatic proofing13 A 0 W 9.4 W 45 W 0 W -25 °C 40 °C Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Rated operational current for specified heat dissipation (In) Heat dissipation per pole, current-dependentEquipment heat dissipation, current-dependentStatic heat dissipation, non-current-dependentHeat dissipation capacityAmbient operating temperature - minAmbient operating temperature - max 10.2.2 Corrosion resistance10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies10.4 Clearances and creepage distances10.5 Protection against electric shock10.6 Incorporation of switching devices and components10.7 Internal electrical circuits and connections10.8 Connections for external conductors10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Is the panel builder's responsibility.The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.3Concurrently switching N-neutralIEC/EN 61009eaton-xpole-mrb6-rcbo-catalog-ca019057en-en-us.pdfeaton-xpole-mrb4-rcbo-catalog-ca019058en-en-us.pdfDA-DC-03_mRB-3N03_mRB-3N_28111803_mRB-3p_200416eaton-xeffect-frbm6/m-characteristic-curve-002.jpgeaton-mcb-xpole-mrb4-6-characteristic-curve.epsDimensions xPole mRB4/mRB6 3Neaton-xeffect-frbm6/m-dimensions-004.jpgeaton-mcb-xpole-mrb4-6-dimensions.eps3D Drawing xPole mRB4/mRB6 3NIL019140ZUeaton-xpole-combined-mcb-rcd-device-rcbo-packaging-manual-multilingual.pdfDA-CD-faz_3pn_4pDA-CS-faz_3pn_4pCharacteristics xPole mRB4/mRB6 3Neaton-xeffect-frbm6/m-wiring-diagram-002.jpgContact Sequence xPole mRB4/mRB6 3N10.9.3 Impulse withstand voltage10.9.4 Testing of enclosures made of insulating material 10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility10.13 Mechanical function Current limiting class FeaturesStandards Catalogues Certification reports Characteristic curve DrawingsInstallation instructions mCAD modelTime/current curves Wiring diagramsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All rights reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaeaton-mcb-xpole-mrb4-6-wiring-diagram.eps。