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您与运动和控制技术领域的先行者合作，就是希望促进您的业务发展和全球的发展。
从微型电磁阀到高集成型自动化系统，我们的产品对于用于药物研发和病原体检测的救生医疗设备和科学仪器至关重要。
并且对于缩短上市时间和降低总体拥有成本也十分关键。
因此，请与派克合作，准备改变这一切吧！/precisionfluidics 1 603 595-1500目录页T2-05Helix124高效和紧凑型 13.5mm 宽泵 – 高达 800 mLPM高压泵 – 超过5.5 LPM 和高达100 PSI 的压力T2-0320高性能与尺寸比率泵 – 高达2.5 LPMLTC 系列76液体系列传送泵 – 高达 650 mLPMEZ 底座92振动隔离安装系统小型活塞泵（空气）微型泵（空气/气体）微型泵（液体）T2-0494超紧凑型、高效泵 – 高达 7.5LPMBTC-IIS 系列62应用广泛的多功能双头泵系列产品 – 高达 11 LPMBTC 系列52应用广泛的多功能泵系列产品 – 高达6 LPMLTC-IIS 系列84液体系列双头传送泵 – 高达1.5 LPMCTS 系列BTX-Connect 2836高性能紧凑型 20 mm 宽泵 – 高达 2.5 LPM多功能双头和单头泵系列，适合多种应用-高达10 LPMTTC 系列74紧凑、高效、低压泵 – 高达 6 LPMTTC-IIS 系列84紧凑、高效、低压双头泵 - 高达 11 LPM附件4Helix 微型高压泵高达100 PSI (6.9 bar)压力Parker Helix 是一款紧凑型高压泵，旨在实现小型即时临床护理仪器。
Helix 可在挑战性的高海拔环境和无法使用外部压缩空气的应用中实现高压操作。
Helix 泵可提供5.5 LPM 以上的流量和高达100 PSI (6.9 bar)的压力，为性能至关重要且空间有限的台式诊断设备提供了出色的解决方案。
• 集成了用于卸荷的X 阀，可实现高压重启• 内部飞轮可在高压下低速运行• 无油活塞• 简单的安装特性• 带有推入式接头的快速流体连接• 符合RoHS 指令和REACH 标准产品特性• 液上空气• 气动驱动•微流控芯片• 即时临床护理检验• 分子诊断• 核酸纯化•基因组学典型应用典型市场产品规格物理特性电子5微型隔Helix 微型高压泵典型流量曲线• 曲线展示了0.080"偏移泵的流量性能• 使用5.0 Vdc 控制输入时，泵将以大约4400 RPM 的转速和高达8.5 LPM的流量的状态运行，但不建议连续工作。
中泰两国学历互认的泰国高校名录Private Higher Education Institutions (68 Institutions) （私立大学按英文字母顺序排列）Arsom Silp Institute of the Arts and Development9/9 Moo 5, Rama II Road, Soi 33, Bangkham, Bangkuntean,Bangkok 10150 THAILANDTel: (66 2) 870 7512-3Fax: (66 2) 870 7514Website: www.arsomsilp.ac.thAssumption University (AU)682 Ramkhamhaeng 24 Road, Hua Mak, Bangkapi, Bangkok 10240 THAILAND Tel: (66 2) 300 4553-62Fax: (66 2) 300 4563Website: Bangkok Thonburi College (BTC)16/10 Moo 2, Taweewattana,Bangkok 10160 THAILANDTel: (66 2) 800 6800-5Fax: (66 2) 800 6806Website: www.bkkthon.ac.thBundit Boriharnthurakit College (BBC) 311/1 Ban Tum, Muang,Khon Kaen 40000 THAILANDTel: (66 43) 255 461-2Fax: (66 43) 312 762Website: www.bbc.ac.th Asian University (Asian U)89 Moo 12, Highway 331, Huay Yai Banglamung, Chonburi 20260 THAILAND Tel: (66 38) 754 450Fax: (66 38) 754 460Website: nust.ac.thBangkok Suvarnabhumi College (BSC)489 Prachapatthana Road, Tubyaow, Ladkrabang, Bangkok 10520 THAILAND Tel: (66 2) 327 0156-8Fax: (66 2) 327 0159Website: www.bsc.ac.thBangkok University (BU) (曼谷大学）40/4 Rama IV Road, Klong Toey Bangkok 10110 THAILANDTel: (66 2) 350 3500-99, 350 3635 Fax: (66 2) 249 6274, 240 1819 Website: www.bu.ac.thChalermkanchana College (CKC)999 Moo 6, Ubon-Si Sa Ket Road, Muang, Si Sa Ket 33000 THAILAND Tel: (66 45) 617 971-2Website: www.ckc.ac.thChaopraya University (CPU)Chalermkanchana Rayong College333/3 Moo 3, Sukhumvit Road, Wangwa, Kleang,Rayong 21110 THAILAND Tel: (66 38) 672 898Website: www.ckc.ac.th/rayongChiang Rai College (CRC)199 Moo 6, Paoadonchai, Muang. Chiang Rai 57000 THAILANDTel: (66 53) 710 081-4Fax: (66 53) 710 081Website: www.crc.ac.thC hulabhorn Graduade Institute (CGI)54 Moo 4, Vibhavadee-Rangsit Highway, Laksi, Bangkok 10210 THAILANDTel: (66 2) 574 0662Fax: (66 2) 574 1490Website: www.cgi.ac.thDhurakij Pundit University (DPU)110/1-4 Prachachuen Road,Laksi, Bangkok 10210 THAILANDTel: (66 2) 954 7300-29 ext.271Fax: (66 2) 589 9606, 954 7904 Website: www.dpu.ac.thEastern Asia University (EAU)200 Rangsit-Nakornnayok Road, 13/1 Moo 6, Paholyothin Road, Muang, Nakhon Sawan 60240 THAILANDTel: (66 56) 334 714, 334 236Fax: (66 56) 334 719Website: www.cpu.ac.thChristian University of Thailand (CTU)144 Moo 7, Phra Praton-Ban Paew Road Don Yai Horm, MuangNakhon Pathom 73000 THAILANDTel: (66 34) 229 480-7Fax: (66 34) 229 499Website: www.christian.ac.thCollege of Asian Scholars (CAS)179/137 Prachasamosorn Road, Muang, Khon Kaen 40000 THAILANDTel: (66 43) 246 536-8Fax: (66 43) 246 539Website: www.cas.ac.thDusit Thani College (DTC)900 Moo 6, Srinakarin Road, Nongbon, Pravet, Bangkok 10250 THAILANDTel: (66 2) 361 7805, 361 7811-3 Fax: (66 2) 361 7806Website: www.dtc.ac.thThe Far Eastern University (FEU)Rangsit (Klong 5),Thanyaburi,Pathum Thani 12110 THAILANDTel: (66 2) 577 1028-31Fax: (66 2) 577 1023Website: www.eau.ac.thHatyai University (HU)125/502 Polpichai Road, Hat Yai, Songkhla 90110 THAILANDTel: (66 74) 425 000, 425 464-6Fax: (66 74) 425 467Website: www.hu.ac.thInstitute of Technology Ayothaya (ITA)109 Moo 5, Wattum,Phra Nakhon Si Ayutthaya 13000 THAILAND Tel: (66 35) 713 563-4Fax: (66 35) 713 563-4Website: www.ayothaya.ac.thKasem Bundit University (KBU)1761 Pattanakarn Road, Suanluang, Bangkok 10250 THAILANDTel: (66 2) 320 2777Fax: (66 2) 321 4444Website: www.kbu.ac.thLampang Inter-tech College (LIT)173 Paholyothin Road, 120 Mahidol Road, Muang,Chiang Mai 50200 THAILANDTel: (66 53) 201 800-4Fax: (66 53) 201 810Website: www.feu.ac.thHuachiew Chalermprakiet University (HCU)18/18 Bang Na-Trad Road, Bangplee, Samutprakan 10540 THAILANDTel: (66 2) 312 6300-73Fax: (66 2) 312 6237Website: www.hcu.ac.thInternational Buddhist College (IBC)88 Moo 2, Thung Mo, Sadao,Songkhla 90240 THAILANDTel: (66 74) 318 345Fax: (66 74) 318 346E-mail: info@ibc.ac.thWebsite: www.ibc.ac.thKrirk University (KRU)43/1111 Ram-indra Road, KM. 1,Bang Khen, Bangkok 10220 THAILANDTel: (66 2) 552 3500-9, 970 5820Fax: (66 2) 552 3511Website: www.krirk.ac.thLumnamping College (LPC)Chompoo Sub-District, Muang,Lampang 52100 THAILANDTel: (66 54) 352 399-401Fax: (66 54) 251 209Website: www.lit.ac.thMahanakorn University of Technology (MUT)51 Cheum-Sampan Road, Nong Chok, Bangkok 10530 THAILANDTel: (66 2) 988 3655, 988 3666Fax: (66 2) 988 4040Website: www.mut.ac.thNakhon Ratchasima College (NMC)290 Moo 2, Friendship Road, Muang Nakhon Ratchasima 30000 THAILANDTel: (66 44) 466 111, 466 049-52Fax: (66 44) 465 668Website: www.nmc.ac.thNorth-Chiang Mai University (NCU)169 Moo 3, Nong Keaw, HangdongChiang Mai 50230 THAILANDTel: (66 53) 819 999Fax: (66 53) 819 998Website: www.northcm.ac.thNorth-Eastern University (NEU)199/19 Mitraphap Road, Muang 290 Moo 2, Paholyothin Highway,Nong Bua-Tai, Muang, Tak 63000 THAILAND Tel: (66 55) 514 406, 511 844Fax: (66 55) 511 330Website: Mission College (MC)195 Muak Lek-Wangmuang Road,Muak Lek, Saraburi 18181 THAILANDTel: (66 36) 344 758-9Fax: (66 36) 344 080, 341 629Website: North Bangkok College (NBC)6/999 Soi Phaholyothin 52, Saimai Bangkok 10220 THAILANDTel: (66 2) 972 7200Fax: (66 2) 972 7751Website: www.northbkk.ac.thNorth Eastern Polytechnic College (NPC)749/1 Chayangkul Road, MuangUbon Ratchathani 34000 THAILANDTel: (66 45) 283 770-3Fax: (66 45) 283 773Website: www.polytechnic.ac.th Panyapiwat Institute of Technology (PIT) 85/1 Moo 2, Chaengwattana, Pakkred,Khon Kaen 40000 THAILAND Tel: (66 43) 222 959-61 Fax: (66 43) 226 823-24 Website: www.neu.ac.thPathumthani University (PTU)140 Moo 4 Tiwanon Road, Ban Klang, Muang, Pathum Thani 12000 THAILAND Tel: (66 2) 975 6999, 979 9724 Fax: (66 2) 979 6728 Website: www.ptu.ac.thPhanomwan College of Technology (PCT)198 Mitraphap Road, Muang Nakhon Ratchasima 30000 THAILAND Tel: (66 44) 415 222 Fax: (66 44) 415 044Website: www.phanomwan.ac.thRajapark College (RPC)68 Soi Navasari 10, Ramkhamhaeng 21 Road, Bangkok 10310 THAILAND Tel: (66 2) 319 8201-3 Fax: (66 2) 319 6710 Website: www.rajapark.ac.thRatchaphruek College (RC)9 Moo 1, Nakhon-in Road, Bangkhanoon, Bang Kruai,Nonthaburi 11120, THAILAND Tel: (66 2) 832 2190 Fax: (66 2) 832 2191Payap University (PYU)Superhighway Chiang Mai-Lampang, Road, Muang, Chiang Mai 50000 THAILANDTel: (66 53) 241 255, 851 478-86 Fax: (66 53) 241 983 Website: www.payap.ac.thPhitsanulok College (PLC)693 Mitraphap Road, Muang, Phitsanulok 65000 THAILAND Tel: (66 55) 252 111 Fax: (66 55) 259 565 Website: www.plc.ac.thRangsit University (RSU)52/347 Phaholyothin Road, Muang-Ake, Pathum Thani 12000 THAILANDTel: (66 2) 997 2200-30 Fax: (66 2) 997 2200 Website: www.rsu.ac.thRatchatani University (RTU)487 Moo 4, Chayangkul Road, Muang, Ubon Ratchathani 34000 THAILANDTel: (66 45) 312 176-7Nonthaburi 11130 THAILAND Tel: (66 2) 432 6111 Fax: (66 2) 432 6107-8 Website: www.rc.ac.thRattana Bundit University (RBU)306 Soi 107, Lad Phrao Road, Bangkapi, Bangkok 10240 THAILANDTel: (66 2) 375 4480-6, 377 8800 Fax: (66 2) 375 4489 Website: www.rbac.ac.thSaint John’s University (SJU)1110/5 Vipavadee-Rangsit Road, Chatuchak, Bangkok 10900 THAILAND Tel: (66 2) 938 7058-65 Fax: (66 2) 512 2275 Website: www.stjohn.ac.thSantapol College (SP)299/1 Moo 4, Nong Bua, Muang Udon Thani 41000 THAILAND Tel: (66 42) 223 105, 242 489 Fax: (66 42) 248 070 Website: www.santapol.ac.thSiam Technology College46 Jaransanitwongse Road,Bangkok Yai, Bangkok 10600 THAILANDFax: (66 45) 312 178 Website: www.rtu.ac.thSaengtham College (STC)20 Moo 6, Phetkasem Road,Sam Phran, Nakhon Pathom 73110 THAILAND Tel: (66 2) 429 0100-2 Fax: (66 2) 429 0819Website: www.saengtham.ac.thSaint Louis College (SLC)215/4 South Sathorn Road Bangkok 10120 THAILAND Tel: (66 2) 675 5304-12Fax: (66 2) 675 5313Website: slc.saintlouis.or.thShinawatra University (SIU)99 Moo 10, Bangtoey, Samkok Pathum Thani 12160 THAILAND Tel: (66 2) 599 0000 Fax: (66 2) 599 3350-1 Website: www.shinawatra.ac.thS iam University (SU)235 Phetkasem Road, Phasi Charoen Bangkok 10163 THAILANDTel: (66 2) 457 0068, 457 0478-9 Fax: (66 2) 457 3982Tel: (66 2) 878 5000, 878 5005Fax: (66 2) 864 1707Website: www.siamtech-college.ac.th South-East Asia University (SAU)19/1 Phetkasem Road, Nong Khaem Bangkok 10160 THAILANDTel: (66 2) 807 4500-27Fax: (66 2) 807 4528-30Website: www.sau.ac.thSouthern College of Technology (SCT)124/1 Thungsong-Huay Yod Road, Teewang, Tungsong,Nakhon Si Thammarat 80110 THAILAND Tel: (66 75) 538 030-3Fax: (66 75) 538 030-3 ext. 102 Website: www.sct.ac.thSrisophon College (SSC)3/3 Moo 5, Mamoang-Songton, Muang, Nakhon Si Thammarat 80000 THAILAND Tel: (66 75) 356 000, 344 037Fax: (66 75) 346 142Website: www.ssc.ac.thSt. Theresa Inti College (STIC)34th Floor, Sakulthai-Surawong Tower, Surawong Road, Website: Southeast Bangkok College (SBC)290 Sapavuth Road, Bang NaBangkok 10260 THAILANDTel: (66 2) 398 1352-4Fax: (66 2) 398 1356Website: Sripatum University (SPU)61 Phahon Yothin Road, Chatuchak, Bangkok 10900 THAILANDTel: (66 2) 579 1111, 561 2222Fax: (66 2) 561 1721Website: www.spu.ac.thStamford International University (STIU)1458 Petchkasem Road, Cha-Am, Petchaburi 76120 THAILANDTel: (66 32) 250 789Website: Tapee College (TPC)8/151 Soi Si Wichai 59, Muang,Surat Thani 84000 THAILANDTel:/Fax: (66 77) 264 225, 204 431-2 Website: www.tapee.ac.thBangrak,Bangkok 10500 THAILAND Tel: (66 2) 233 2455, 233 1506 Fax: (66 2) 233 1752 Website: www.stic.ac.thThai-Nichi Institute of Technology (TNI)1771/1 Soi Pattanakarn 37,Pattanakarn Road, Lanluang, Suanluang, Bangkok 10250 THAILAND Tel: (66 2) 673 2600 Fax: (66 2) 673 2700 Website: www.tni.ac.thThonburi University (TRU)29 Moo 3 Phetkasem Soi 10,Nong Khaem, Bangkok 10160 THAILAND Tel: (66 2) 809 0823-7 Fax: (66 2) 809 0832Website: www.thonburi-u.ac.thUniversity of the Thai Chamber of Commerce (UTCC)126/1 Vibhavadirangsit Road, Bangkok 10320 THAILAND Tel: (66 2) 697 6000 Fax: (66 2) 276 2126 Website: www.utcc.ac.thWebster University (Thailand) (WUT)The University of Central Thailand (UCT)(Formerly known as Phakklang University) 932/1 Moo 9 Asia Road, P.O. Box1,Sawanvithee,Muang, Nakhon Sawan 60001 THAILANDTel: (66 56) 221 688, 223 578-9 Fax: (66 56) 221 690 Website: www.tuct.ac.thThongsook College (TSC)99/79 Boromrajchonnee RoadChimplee, Taling Chan Bangkok 10170 THAILANDTel: (66 2) 448 0005-6, 885 1421-4 Fax: (66 2) 885 1428Website: www.thongsook.ac.thVongchavalitkul University (VU)12 Mitraphap Highway, Naimuang, Muang, Nakhon Ratchasima 30000 THAILAND Tel: (66 44) 203 778-84 Fax: (66 44) 203 785 Website: www.vu.ac.thWestern University (WTU)600 Sralongrua, Huai KrachaoKanchanaburi 71170 THAILAND Tel: (66 35) 651 000 Fax: (66 35) 651 144518/5 Box 40, 7th Floor, Maneeya Center, Ploenchit Road, Bangkok 10330 THAILAND Tel: (66 2) 652 0705-7Fax: (66 2) 652 0708Website: /thailand/Yala Islamic University (YIU)203 Moo 7, Muang,Yala 95000 THAILANDTel: (66 73) 288 080-1Fax: (66 73) 288 011Website: www.yiu.ac.th Website: www.western.ac.th Yonok University (YNU)444 Lampang-Denchai Road, Lampang 52000 THAILAND Tel: (66 54) 265 170-6 Fax: (66 54) 265 184 Website: www.yonok.ac.thPublic Higher Education Institutions (78)（公立大学按英语字母顺序排列）Limited Admission Universities and Institutions (65)Bansomdej Chaopraya Rajabhat University (BSRU)1061 Isaraparp Road, HiranrujiThon Buri, Bangkok 10600 THAILANDTel: (66 2) 473 7000Fax: (66 2) 466 6539Website: www.bsru.ac.thBuriram Rajabhat University (BRU)Jira Road, Muang, Rajamangala University of Technology Phra Nakhon (RMUTP)Thewet Campus (President’s Office)399 Samsen Road, Dusit,Bangkok 10300 THAILANDTel: (66 2) 282 9009-15Fax: (66 2) 281 0075Website: www.thewes.rit.ac.thBangkok Commercial Campus86 Pitsanulok Road, Jitladda, Dusit, Bangkok 10300 THAILANDBuriram 31000 THAILANDTel: (66 44) 611 221, 617 588Fax: (66 44) 612 858Website: www.bru.ac.thChaiyaphum Rajabhat University (CPRU)167 Chaiyaphum-Tadton Road, Nafai, Muang, Chaiyaphum 36000 THAILANDTel: (66 44) 815 111Fax: (66 44) 815 113Website: www.cpru.ac.thChandrakasem Rajabhat University (CRU)39/1 Rachadapisek Road, Chatuchak, Bangkok 10900 THAILANDTel: (66 2) 942 6900-99, 541 6060 Fax: (66 2) 541 7113Website: www.chandra.ac.thChiang Mai Rajabhat University (CMRU)202 Changpuek Road, Muang,Chiang Mai 50300 THAILANDTel: (66 53) 412 526-45Fax: (66 53) 412 307Website: www.cmru.ac.thChiang Rai Rajabhat University (CRU)Pahonyothin Road, Muang,Chiang Rai 57100 THAILAND Tel: (66 2) 281 1842-3, 282 9101-2 Fax: (66 2) 281 0093Website: www.bcc.rit.ac.thChotiwet Campus168 Sri Ayutthaya Road, Dusit, Bangkok 10300 THAILANDTel: (66 2) 281 0545, 282 8531-2 Fax: (66 2) 282 4490E-mail: chtwc@rit.ac.thWebsite: www.chtwc.rit.ac.thChumphon Khet Udomsak Campus517 Nakhonsawan Road, Dusit, Bangkok 10300 THAILANDTel: (66 2) 629 9153-7Fax: (66 2) 282 3718Website: www.ckus.rit.ac.thNorth Bangkok Campus1381 Piboonsongkram Road, Bangsue, Bangkok 10800 THAILANDTel: (66 2) 913 2424Fax: (66 2) 585 0690Website: www.nbk.rit.ac.thRajamangala University of Technology Rattanakosin (RMUTR)Salaya Campus (President’s Office) 96 Moo 3, Salaya, Phuttamonthon, Nakhon Pathom 73170 THAILANDTel: (66 2) 889 4585-7 press 3001 Fax: (66 2) 889 5014Website: www.salaya.rit.ac.thTel: (66 53) 776 000, 776 007 Fax: (66 53) 776 001Website: www.cru.in.thDhonburi Rajabhat University (DRU)172 Isaraparp Road, Thonburi, Bangkok 10600 THAILANDTel: (66 2) 890 1801-8Fax: (66 2) 466 6776Website: www.dru.ac.thMaejo University (MJU)63 Moo 4, Chiang Mai-Phrao Road, Sansai, Chiang Mai 50290 THAILAND Tel: (66 53) 498 130Fax: (66 53) 498 861Website: www.mju.ac.thMahachulalongkornrajavidyalaya University (MCU)3 Wat Mahathat, Phrachan Road,Phra Nakhon, Bangkok 10200 THAILAND Tel: (66 2) 225 8686, 222 1867 Fax: (66 2) 221 6950Website: www.mcu.ac.thMahamakut Buddhist University (MBU)248 Phra Sumen Road,Phra Nakhon Bovorniwes, Bophit Phimuk Chakkawat Campus264 Chakkrawat Road, Sampanthawong, Bangkok 10100 THAILANDTel: (66 2) 226 5925-6, 221 2896Fax: (66 2) 226 4879Website: www.bpc.rit.ac.thPoh-Chang Campus86 Triphet Road, Pranakorn,Bangkok 10200 THAILANDTel: (66 2) 623 8790-9Fax: (66 2) 223 4014Website: www.pohchang.rit.ac.thKalasin Rajabhat University (KSU)13 Moo 14, Songplei, Namon,Kalasin 46230 THAILANDTel: (66 43) 860 218?Fax: (66 43) 860 219Website: www.ksu.ac.thKamphaeng Phet Rajabhat University (KPRU)Nakhonchoom-Wangyang Road, Muang, Kamphaeng Phet 62000 THAILANDTel: (66 55) 706 555Fax: (66 55) 706 518Website: www.kpru.ac.thKanchanaburi Rajabhat University (KRU)Bangkok 10200 THAILANDTel: (66 2) 282 8303, 281 6427Fax: (66 2) 281 0294Website: www.mbu.ac.thMahasarakham University (MSU)41/20 Tambon Kamriang, Kantarawichai Maha Sarakham 44150 THAILANDTel: (66 43) 754 321-40,Fax: (66 43) 754 322-40Website: www.msu.ac.thMuban Chombueng Rajabhat University (MCRU)46 Moo 3 Chombung Road, Chombung, Ratchaburi 70150 THAILANDTel: (66 32) 261 790-7Fax: (66 32) 261 078Website: www.mcru.ac.thNakhon Pathom Rajabhat University (NPRU)85 Malaiman Road, Muang,Nakhon Pathom 73000 THAILANDTel: (66 34) 261 021-36Fax: (66 34) 261 048Website: www.npru.ac.thNakhon Phanom University (NPU)330 Apibarnbancha Road,Muang, Nakhon Phanom 48000 Kanchanaburi-Shaiyoke Road, Muang, Kanchanaburi 71000 THAILANDTel: (66 34) 633 227-30Fax: (66 34) 633 224Website: www.kru.ac.thKasetsart University (KU)50 Phaholyothin RoadChatuchak, Bangkok 10900 THAILAND Tel: (66 2) 942 8200-45?Fax: (66 2) 942 8170Website: www.ku.ac.thKhon Kaen University (KKU)123 Friendship Road, Muang,Khon Kaen 40002 THAILANDTel: (66 43) 202 222-41, 203 333-51 Fax: (66 43) 202 216Website: www.kku.ac.thLampang Rajabhat University (LPRU)119 Moo 9 Lampang-Maeta Road, Muang, Lampang 52100 THAILANDTel: (66 54) 241 012-4, 241 016 Fax: (66 54) 241 018-9Website: www.lpru.ac.thLoei Rajabhat University (LRU)234 Loei-Chiangkhan Road,Tel: (66 42) 513 729, 512 511Fax: (66 42) 513 613Website: www.npu.ac.thNakhon Ratchasima Rajabhat University (NRRU)340 Suranarai Road, Muang,Nakhon Ratchasima 30000 THAILANDTel: (66 44) 254 000, 355 321-2Fax: (66 44) 244 739Website: www.nrru.ac.thNakhon Sawan Rajabhat University (NSRU)398 Moo 9 Sawanwithi Road, Muang, Nakhon Sawan 60000 THAILANDTel: (66 56) 219 100-29Fax: (66 56) 221 554Website: www.nsru.ac.thNakhon Si Thammarat Rajabhat University (NSTRU)1 Moo 4, Tambon Tha-ngew, Muang, Nakhon Si Thammarat 80280 THAILANDTel: (66 75) 377 440, 377 426Fax: (66 75) 377 440Website: www.nstru.ac.thNaresuan University (NU)Muang, Loei 42000 THAILANDTel: (66 42) 835 233-8, 814 669-75Fax: (66 42) 811 143Website: www.lru.ac.thWang Klai Kangwon CampusPetchakasem 242 Road, Nongkae,Hua Hin, Prachuap Khirikhan 77110 THAILAND Tel: (66 32) 572 284-6, 532 552-3?Fax: (66 32) 536 299, 532 511Website: www.kkw.rit.ac.thRajamangala University of Technology Srivijaya (RMUTSV)Southern Campus1 Ratchadamneon Nok Road, Bhoyang, Muang, Songkhla 90000 THAILANDTel: (66 74) 316 260-3Fax: (66 74) 324 245Website: www.south.rit.ac.thNakhon Si Thammarat Campus109 Moo 2, Thung Song,Nakhon Si Thammarat 80110 THAILANDTel: (66 75) 411 144, 420 558-9Fax: (66 75) 411 745Website: 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Journal of Hazardous Materials 181 (2010) 535–542Contents lists available at ScienceDirectJournal of HazardousMaterialsj o u r n a l h o m e p a g e :w w w.e l s e v i e r.c o m /l o c a t e /j h a z m atAdsorptive removal of methyl orange from aqueous solution with metal-organic frameworks,porous chromium-benzenedicarboxylatesEnamul Haque a ,Ji Eun Lee a ,In Tae Jang b ,Young Kyu Hwang b ,Jong-San Chang b ,Jonggeon Jegal c ,Sung Hwa Jhung a ,∗aDepartment of Chemistry,Kyungpook National University,Daegu 702-701,Republic of KoreabResearch Center for Nanocatalysts,Korea Research Institute of Chemical Technology,P.O.Box,107,Yusung,Daejeon 305-600,Republic of Korea cMembrane and Separation Research Center,Korea Research Institute of Chemical Technology,P.O.Box 107,Yusung,Daejeon 305-600,Republic of Koreaa r t i c l e i n f o Article history:Received 8February 2010Received in revised form 8May 2010Accepted 10May 2010Available online 16 May 2010Keywords:Porous chromium-benzenedicarboxylates MOFsMethyl orange DyeAdsorption Removala b s t r a c tTwo typical highly porous metal-organic framework (MOF)materials based on chromium-benzenedicarboxylates (Cr-BDC)obtained from Material of Institute Lavoisier with special structure of MIL-101and MIL-53have been used for the adsorptive removal of methyl orange (MO),a harmful anionic dye,from aqueous solutions.The adsorption capacity and adsorption kinetic constant of MIL-101are greater than those of MIL-53,showing the importance of porosity and pore size for the adsorption.The performance of MIL-101improves with modification:the adsorption capacity and kinetic constant are in the order of MIL-101<ethylenediamine-grafted MIL-101<protonated ethylenediamine-grafted MIL-101(even though the porosity and pore size are slightly decreased with grafting and further protonation).The adsorption capacity of protonated ethylenediamine-grafted MIL-101decreases with increasing the pH of an aqueous MO solution.These results suggest that the adsorption of MO on the MOF is at least partly due to the electrostatic interaction between anionic MO and a cationic adsorbent.Adsorption of MO at various temperatures shows that the adsorption is a spontaneous and endothermic process and that the entropy increases (the driving force of the adsorption)with MO adsorption.The adsorbent MIL-101s are re-usable after sonification in water.Based on this study,MOFs can be suggested as potential re-usable adsorbents to remove anionic dyes because of their high porosity,facile modification and ready re-activation.© 2010 Elsevier B.V. All rights reserved.1.IntroductionRecently,considerable amount of waste water having color has been generated from many industries including textile,leather,paper,printing,dyestuff,plastic and so on [1].Removal of dye mate-rials from water is very important because water quality is greatly influenced by color [1]and even small amount of dyes is highly visible and undesirable.Moreover,many dyes are considered to be toxic and even carcinogenic [1–3].It is difficult to degrade dye materials because they are very sta-ble to light and oxidation [3].For the removal of dye materials from contaminated water,several methods such as physical,chemical and biological methods have been investigated [1,3].Among the proposed methods,removal of dyes by adsorption technologies is regarded as one of the competitive methods because adsorption does not need a high operation temperature and several color-ing materials can be removed simultaneously [1].The versatility∗Corresponding author.Fax:+82539506330.E-mail address:sung@knu.ac.kr (S.H.Jhung).of adsorption,especially with activated carbons,is due to its high efficiency,economic feasibility and simplicity of design [3].Methyl orange (MO)is one of the well-known acidic/anionic dyes,and has been widely used in textile,printing,paper,food and pharmaceutical industries and research laboratories [2].The struc-ture of MO is shown in Scheme 1and the removal of MO from water is very important due to its toxicity [2,3].Harmful MO is selected in this study as a representative acidic dye.Several adsorbents such as ammonium-functionalized MCM-41and layered double hydroxides (LDH)have been studied for the removal of MO dye [4,5].Adsorbents,including activated carbon,made from wastes attract attention to decrease the cost of adsorp-tion [2,6].Agricultural wastes such as lemon [7],banana and orange peel [8]and biopolymers [9]like alginate have also been used.Functionalized adsorbents such as hyper-crosslinked polymers [10]and diaminoethane sporollenin [11]have also been studied.For efficient separation of adsorbent from liquid after adsorption,magnetic particles have also been dispersed/incorporated in the adsorbent [9,12].The thermodynamics parameters of MO adsorption have been studied over various adsorbents [2,5–7,10].In every case,the G0304-3894/$–see front matter © 2010 Elsevier B.V. All rights reserved.doi:10.1016/j.jhazmat.2010.05.047536 E.Haque et al./Journal of Hazardous Materials181 (2010) 535–542Scheme1.is negative for spontaneous adsorption;however H depends on adsorbents[2,5–7,10]and S is generally positive[2,5–7]. The adsorption kinetics has been interpreted with various models [2–10]and the adsorption of MO over MCM-41illustrates that the adsorption process is composed of complex processes like diffusion in surface or mesopore and adsorption on mesopore[4].Moreover, the kinetic constants vary widely depending on the adsorbents [2–10].Metal-organic frameworks(MOFs)are crystalline porous mate-rials which are well known for their various applications[13–20]. The particular interest in MOF materials is due to the easy tunability of their pore size and shape from a microporous to a mesoporous scale by changing the connectivity of the inorganic moiety and the nature of organic linkers[13–15].MOFs are especially inter-esting in thefield of adsorption,separation and storage of gases and vapors[16,19].For example,the storage of hydrogen[16]and carbon dioxide/methane[21]using MOFs has been extensively investigated.The removal of hazardous materials such as sulfur-containing materials has also been studied[22,23].Among the numerous MOFs reported so far,two of the most topical solids are the porous chromium-benzenedicarboxylates (Cr-BDCs)namely MIL-53[24](MIL stands for Material of Insti-tute Lavoisier)and MIL-101[25,26],which are largely studied for their potential -53with a chemical formula of Cr(OH)[C6H4(CO2)2]·n H2O,has an orthorhombic structure and pore volume of0.6cc/g[24].MIL-101,Cr3O(F/OH)(H2O)2[C6H4(CO2)2], has a cubic structure and huge pore volume of1.9cc/g[25,26].The pore sizes of MIL-53and MIL-101are around0.85and2.9–3.4nm, respectively[24–26].MIL-53is very interesting due to the breath-ing effect[27],and has been widely studied for adsorption[23]and drug delivery[20,28].MIL-101is a very important material due to its mesoporous structure and huge porosity,and is widely studied for adsorption[29],catalysis[30]and drug delivery[20,28].However,so far,there has been no report of the use of MOFs including Cr-BDCs in the removal of dye materials.In this work,we report,for thefirst time,the results of the adsorption of MO over MOFs,especially well-studied Cr-BDCs,to understand the charac-teristics of adsorption and possibility of using MOFs as adsorbents for the removal of dye materials from waste water.2.ExperimentalThe Cr-BDCs such as MIL-53and MIL-101were prepared follow-ing the reported methods[24–26,31,32].Ethylenediamine-grafted MIL-101(ED-MIL-101)was obtained by grafting ethylenediamine according to the method reported earlier[26,30].The protonated ED-MIL-101(PED-MIL-101)was obtained by acidification of ED-MIL-101with0.1M HCl solution at room temperature for6h. Activated carbon was purchased from Duksan chemical company (granule,size:2–3mm).The textural properties of the adsor-bents were analyzed with a surface area and porosity analyzer (Micromeritics,Tristar II3020)after evacuation at150◦C for12h. The surface area,pore volume and average pore size were calcu-lated using the nitrogen adsorption isotherms.An aqueous stock solution of MO(1000ppm)was prepared by dissolving MO(molecular formula:C14H14N3NaO3S,molecu-lar weight:327.34,Daejung Chemicals co.Ltd.,Korea)in deionized water.Aqueous MO solutions with different concentrations of MO (5–200ppm)were prepared by successive dilution of the stock solution with water.The MO concentrations were determined using the absorbance(at464nm)of the solutions after getting the UV spectra of the solution with a spectrophotometer(Shimadzu UV spectrophotometer,UV-1800).The calibration curve was obtained from the spectra of the standard solutions(5–50ppm)at a specific pH5.6.Before adsorption,the adsorbents were dried overnight under vacuum at100◦C and were kept in a desiccator.An exact amount of the adsorbents(∼10mg)was put in the aqueous dye solutions (50mL)havingfixed dye concentrations from20ppm to200ppm. The MO solutions(pH:5.6)containing the adsorbents were mixed well with magnetic stirring and maintained for afixed time(10min to12h)at25◦C.After adsorption for a pre-determined time,the solution was separated from the adsorbents with a syringefil-ter(PTFE,hydrophobic,0.5m),and the dye concentration was calculated,after dilution(if necessary),with absorbance obtained using UV spectra.The adsorption rate constant was calculated using pseudo-second or pseudo-first order reaction kinetics[33–35]and the maximum adsorption capacity was calculated using the Lang-muir adsorption isotherm[33,36]after adsorption for12h.To get the thermodynamic parameters of adsorption such as G(free energy change), H(enthalpy change)and S(entropy change) the adsorption was further carried out at35and45◦C.To determine the adsorption capacity at various pHs,the pH of the MO solution was adjusted with0.1M HCl or0.1M NaOH aqueous solution.The used adsorbent was activated with deion-ized water(0.05g adsorbent in25ml water)under ultrasound (Sonics and Materials,USA;Model:VC X750,power:750W,ampli-tude;35%)at room temperature for60min(temperature raised to 65◦C–70◦C after sonification).After separation,the adsorbent was dried and reused for the next adsorption.3.Result and discussion3.1.Adsorption kineticsTo understand the adsorption kinetics,MO was adsorbed at var-ious times up to12h,and the quantity of adsorbed MO is displayed in Fig.1when the initial MO concentration is30-50ppm.As shown in Fig.1,the adsorbed quantity of MO is in the order of acti-vated carbon<MIL-53<MIL-101<ED-MIL-101<PED-MIL-101for the whole adsorption time from any initial MO concentration.The adsorbed MO slightly increases with the initial MO concentration, showing the favorable adsorption at high MO concentration.The adsorption time needed for saturation of the adsorbed amount is in the order of activated carbon>MIL-53>MIL-101>ED-MIL-101>PED-MIL-101(Supplementary data Fig.S1).The adsorption over modified MIL-101s is practically completed in2h,showing the rapid adsorption of MO over the modified MIL-101s.However, the adsorbed amount increases steadily with time over the acti-vated carbon.To compare the adsorption kinetics precisely,the changes of adsorption amount with time are treated with the versa-tile pseudo-second-order kinetic model[33–35]because the whole data during adsorption time can be treated successfully:dq tdt=k2(q e−q t)2(1) or,tq t=1k2q2e+1q et(2)where q e:amount adsorbed at equilibrium(mg/g);q t:amount adsorbed at time t(mg/g);t:adsorption time(h).E.Haque et al./Journal of Hazardous Materials181 (2010) 535–542537Fig.1.Effect of contact time and initial MO concentration on the adsorption of MO over thefive adsorbents:(a)C i=30ppm;(b)C i=40ppm;(a)C i=50ppm.Therefore,the second-order kinetic constant(k2)can be calcu-lated byk2=slope2int erceptwhen the t/q t is plotted against t.Fig.2shows the plots of the pseudo-second-order kinetics of the MO adsorption over thefive adsorbents at threeinitial Fig.2.Plots of pseudo-second-order kinetics of MO adsorption over thefive adsor-bents:(a)C i=30ppm;(b)C i=40ppm;(a)C i=50ppm.dye concentrations.The calculated kinetic constants(k2)and cor-relation coefficients(R2)are shown in Table1.The adsorption kinetic constants for MO adsorption are in the order of activated carbon<MIL-53<MIL-101<ED-MIL-101<PED-MIL-101,similar to the adsorbed quantity(Fig.1).Therefore,PED-MIL-101is the most effective adsorbent for MO removal in the viewpoint of adsorption amount and rate.538 E.Haque et al./Journal of Hazardous Materials181 (2010) 535–542 The adsorption kinetic constants over activated carbon and Cr-BDCs are larger than those over crosslinked polymer[10]andactivated carbon(obtained from agricultural product,Phragmitesaustralis)[3].On the contrary the constants are smaller than theconstants over NH3+-MCM-41,activated carbon(entrapping mag-netic cellulose bead)[12],lemon peel[7]and alginate bead[9].The kinetic constants over activated carbon and Cr-BDCs increaseslightly with increasing the initial MO concentration,showingrapid adsorption in the presence of MO in high concentration.Theincrease of the kinetic constant with increasing initial adsorbateconcentration has been reported too[33,37,38].The kinetic con-stants of adsorption over Cr-BDCs show that the adsorption overPED-MIL-101is the fastest and the adsorption kinetics increaseswith modification of virgin MIL-101.The kinetic constant over PED-MIL-101is around10times greater than that of the activated carbonunder the experimental conditions.The adsorption data were also analyzed using the pseudo-first-order kinetic model[33]:ln(q e−q t)=ln q e−k1t(3)Therefore,thefirst order kinetic constant(k1)can be calculatedbyk1=−slope when the ln(q e−q t)is plotted against t.The plots of the pseudo-first-order kinetics of the dye adsorp-tions over thefive adsorbents at the initial MO concentrations of30–50ppm are shown in Fig.S2(adsorption time is only0–1hfor good linearity[33])and the kinetic constants are displayed inTable S1.Similar to the second-order kinetic constants,the rateconstant generally increases in the order of activated carbon<MIL-53<MIL-101<ED-MIL-101<PED-MIL-101,confirming once againthe most rapid adsorption over PED-MIL-101.However,the lin-earity of thefirst order kinetics is relatively poor(low correlationcoefficients R2).The fast adsorption of MO over MIL-101,compared with theadsorption over MIL-53,is probably due to the large pore size ofMIL-101as the kinetic constant of adsorption generally increaseswith the increasing pore size of a porous material not only inliquid-phase adsorption[39,40]but also in gas phase adsorption[41].However,the kinetic constants of the MIL-101s show that thepore size of the MIL-101s(Table1)does not have any effect on thekinetics of adsorption,suggesting the presence of a specific inter-action between PED-MIL-101or ED-MIL-101and MO because theadsorption kinetic constant increases with increasing pore size ifthere is no specific interaction between adsorbate and adsorbent[39–41].3.2.Adsorption thermodynamicsThe adsorption isotherms were obtained after adsorption forsufficient time of12h,and the results are compared in Fig.3a.Theamount of adsorbed dye is in the order of PED-MIL-101>ED-MIL-101>MIL-101>MIL-53>activated carbon for the experimentalconditions,suggesting the efficiency of the Cr-BDCs,especially PED-MIL-101.As shown in Fig.3b,the adsorption isotherms have beenplotted to follow the Langmuir equation[33,36]:C e q e =C eQ0+1Q0b(4)where C e:equilibrium concentration of adsorbate(mg/L) q e:the amount of adsorbate adsorbed(mg/g)Q0:Langmuir constant(maximum adsorption capacity)(mg/g) b:Langmuir constant(L/mg or L/mol)So,the Q0can be obtained from the reciprocal of the slope of a plot of C e/q e against C e.The Q0for all of the samples is determined from Fig.3b and the values are summarized in Table1.Generally the Q0increases inthe Fig.3.(a)Adsorption isotherms for MO adsorption over thefive adsorbents and(b) Langmuir plots of the isotherms(a).The arrows in(b)show that the y-axis scale of activated carbon is different to that of MOFs.order of activated carbon<MIL-53<MIL-101<ED-MIL-101<PED-MIL-101,and the adsorption capacity of PED-MIL-101is194mg/g. The large adsorption capacity of MIL-101for MO,compared to that of MIL-53,is probably due to the large porosity of MIL-101as the adsorption capacity generally increases with increasing the poros-ity of adsorbents[42,43].So far many adsorbents have been evaluated as candidates for the removal of MO from water and their adsorption capacities have varied widely from2.1to about366mg/g depending on the adsor-bent[1–12].Even though the adsorption capacity of Cr-BDCs is less than that of NH3+-MCM-41[4],LDH[5]and activated carbon(made from an agricultural product,Phragmites australis)[3],its capacity is relatively greater than that of the most adsorbents[1,2,6–12].To shed light on the MO adsorption over Cr-BDCs,the adsorp-tion free energy,enthalpy and entropy change were calculated from the adsorption of MO over PED-MIL-101at various temperatures. Fig.4a shows the adsorption isotherms at the temperature of25, 35and45◦C,and the Langmuir plots are displayed in Fig.4b.The adsorption capacity increases with increasing adsorption temper-ature,suggesting endothermic adsorption.The Gibbs free energy change G can be calculated by the fol-lowing Eq.(5)[5,6,10,35]:G=−RT ln b(5)(where R is the gas constant)The Langmuir constant b(dimension:L/mol)can be obtained from the slope/intercept of the Langmuir plot of Fig.4b.The negative free energy change( G)shown in Table2suggests spontaneous adsorption under the adsorption conditions.E.Haque et al./Journal of Hazardous Materials181 (2010) 535–542539Fig.4.(a)Adsorption isotherms for MO adsorption over PED-MIL-101at25,35and45◦C;and(b)Langmuir plots of the isotherms(a);(c)Adsorption isotherms for MO adsorption over MIL-101at25,35and45◦C;and(d)Langmuir plots of the isotherms(c).The enthalpy change H can be obtained by using the van’t Hoffequation[5,44]:ln b= SR− HRT(6)The calculated H,obtained from the(−slope×R)of the van’tHoff plot(Fig.5),is29.5kJ/mol,confirming endothermic adsorp-tion in accord with the increasing adsorption capacity associatedwith increasing adsorption temperature(Fig.4a).The endothermicTable1Textural properties,the pseudo-second-order kinetic constants(k2)with correlation constants(R2)at various MO concentrations and the maximum adsorption capacities (Q0)of thefive adsorbents.Adsorbent(pore size,nm)BET surfacearea(m2/g)Total porevolume(cm3/g)Pseudo-second-order kinetics constants k2(g/(mg min))Maximum adsorptioncapacity,Q o(mg/g) 30ppm40ppm50ppmk2R2k2R2k2R2Activated carbon(<1.0)10680.50 2.17×10−40.987 2.34×10−40.981 2.59×10−40.97811.2MIL-53(<1.0)14380.557.23×10−40.9997.70×10−40.9997.84×10−40.99957.9MIL-101(1.6,2.1)3873 1.709.01×10−40.9999.19×10−40.9969.29×10−40.998114ED-MIL-101(1.4,1.8)3491 1.37 1.06×10−30.998 1.19×10−30.999 1.27×10−30.999160PED-MIL-101(1.4,1.8)3296 1.18 2.75×10−3 1.00 2.95×10−3 1.00 3.04×10−30.999194Table2The maximum adsorption capacity and thermodynamic parameters of MO adsorption over PED-MIL-101and MIL-101at different temperatures.Adsorbent Temp.(◦C)Q o(mg/g) G(kJ/mol) H(kJ/mol) S(J/mol/K)PED-MIL-10125194−32.535219−34.529.520945241−36.6MIL-10125114−31.935121−33.1 4.0012045140−34.3540 E.Haque et al./Journal of Hazardous Materials 181 (2010) 535–542Table 3The equilibrium adsorbed amount (q e )and pseudo-second-order kinetic constant (k 2)of fresh and reused PED-MIL-101s and ED-MIL-101s (Temperature:25◦C,C i :50ppm).Adsorbent Items Fresh 1st reuse 2nd reuse PED-MIL-101q e (mg/g)187186181k 2(g/mg min) 3.04×10−3 1.87×10−3 1.18×10−3ED-MIL-101q e (mg/g)130127123k 2(g/mg min)1.27×10−31.07×10−37.62×10−4Fig.5.van’t Hoff plots to get the H and S of the MO adsorption over the MIL-101and PED-MIL-101.adsorption may be due to a stronger interaction between pre-adsorbed water and the adsorbent than the interaction between MO and the adsorbent.However,further work is necessary to clarify this suggestion.The entropy change S can be obtained from the (intercept ×R )of the vant’t Hoff plot (Fig.5),and the obtained entropy change S is 208J/(mol K).The positive S means the increased randomness with adsorption of MO probably because the number of desorbed water molecule islarger than that of the adsorbed MO molecule (MO is very bulky compared with water;therefore several water may be desorbed by adsorption of a MO molecule).Therefore,the driving force of MO adsorption (negative G )on PED-MIL-101is due to an entropy effect (large positive S )rather than an enthalpy change ( H is positive).Fig.6.Effect of pH of MO solution on the adsorbed amount of MO over activated carbon and PED-MIL-101(C i :50ppm,adsorption time:4h).The thermodynamic properties were also determined for the case of MIL-101using the adsorption isotherms (Fig.4c)and the Langmuir plots at different temperatures (Fig.4d).Generally,the isotherms and Langmuir plots are similar to those of PED-MIL-101(Fig.4a and b).However,it should be mentioned that the adsorbed amount of MO over PED-MIL-101is high at very low concentra-tion (especially at 45◦C),which is very helpful to remove MO even at a low concentration.The adsorption free energy,enthalpy and entropy change over MIL-101,obtained from Fig.4d and Fig.5,are displayed in Table 2.Similar to PED-MIL-101,the adsorption of MO over MIL-101is a spontaneous process (negative G ).However,the absolute value of H is very small for the case of MIL-101.This may be due to a physical adsorption of MO and little desorption of pre-adsorbed water.The small free energy change ( S )sup-ports this assumption (small number of desorbed water molecules).However,a more detailed study will be necessary to understand the difference between MIL-101and PED-MIL-101in terms of the adsorption enthalpy and entropy changes.3.3.Effect of pH and regeneration of MOFsThe adsorption of a dye usually highly depends on the pH of the dye solution [2,6].MO adsorption at various pH values was mea-sured after equilibration withPED-MIL-101and activated carbon.As shown in Fig.6,the adsorbed amounts decrease with increas-ing the pH of the MO solution,which is quite similar to previously reported results [2,6].The decreasing of adsorbed MO with increas-ing pH might be due to the fact that the concentration of positive charge of adsorbents is decreased with increasing pH.Scheme 2.E.Haque et al./Journal of Hazardous Materials181 (2010) 535–542541Fig.7.(a)Effect of contact time on the MO adsorption and(b)Pseudo-second-order plots to show the re-usability of the spent PED-MIL-101.Even though more detailed work is necessary to clearly under-stand the mechanism of MO adsorption on Cr-BDCs,the mechanism may be explained with electrostatic interaction between MO and adsorbents(as proposed in Scheme2).MO usually exists in the sulfate form;therefore,there will be a strong electrostatic inter-action with an adsorbent having a positive charge.The positive charge distribution increases in the order of MIL-101<ED-MIL-101<PED-MIL-101as suggested in Scheme2.On the other hand the positive charge of PED-MIL-101will be decreased with increasing the pH of the solution due to the deprotonation of the proto-nated adsorbent.Therefore,the increase of adsorption capacity and kinetic constant with modification(MIL-101<ED-MIL-101<PED-MIL-101)or increasing acidity may be explained with the increased positive charge of the adsorbent,especially PED-MIL-101in a low pH condition.A similar adsorption mechanism of anionic dyes via electrostatic interaction has been reported in the case of chitosan [44]and NH3+-MCM-41[4].Facile regeneration of an adsorbent is very important for commercial feasibility.The re-usability of spent adsorbent(PED-MIL-101)is shown in Fig.7a.Even though the adsorption kinetic constants(shown in Table3which are derived from Fig.7b) decrease noticeably with the cycle of adsorption,the amount of adsorbed MO does not decrease much,suggesting the applicabil-ity of Cr-BDCs in the adsorptive removal of anionic dye materials from waste water.Similar re-usability of ED-MIL-101has also been observed(Table3,Supporting Fig.3).4.ConclusionThe liquid-phase adsorption of MO over MOF-type materials has been studied to understand the characteristics of dye adsorption on these materials.The adsorption capacity and adsorption kinetic constant of MIL-101are greater than those of MIL-53,showing the importance of porosity and pore size for adsorption,which is sim-ilar to reported -101,after being modified to have a positive charge,can be efficiently used to remove MO via liquid-phase adsorption.Based on the rate constant(pseudo-second or pseudo-first-order kinetics for adsorption)and adsorption capac-ity,it can be suggested that there is a specific interaction like electrostatic interaction between MO and the adsorbent for rapid and high uptake of the dye.The adsorption of MO over PED-MIL-101 at various temperatures shows that the adsorption is spontaneous and endothermic and the randomness increases with the adsorp-tion of MO.The driving force of MO adsorption over PED-MIL-101 is mainly due to an entropy effect rather than an enthalpy change. From this study,it can be suggested that the MOF-type materials may be applied in the regenerable adsorptive removal of anionic dye materials from contaminated water.AcknowledgementsThis work was supported by the National Research Founda-tion of Korea(NRF)grant funded by the Korea Government(MEST) (2008-0055718,2009-0083696).Appendix A.Supplementary dataSupplementary data associated with this article can be found,in the online version,at doi:10.1016/j.jhazmat.2010.05.047. References[1]G.Crini,Non-conventional low-cost adsorbents for dye removal:a review,Bioresour.Technol.97(2006)1061–1085.[2]A.Mittal,A.Malviya,D.Kaur,J.Mittal,L.Kurup,Studies on the adsorptionkinetics and isotherms for the removal and recovery of Methyl Orange from wastewaters using waste materials,J.Hazard.Mater.148(2007)229–240. [3]S.Chen,J.Zhang,C.Zhang,Q.Yue,Y.Li,C.Li,Equilibrium and kinetic studies ofmethyl orange and methyl violet adsorption on activated carbon derived from Phragmites australis,Desalination252(2010)149–156.[4]Q.Qin,J.Ma,K.Liu,Adsorption of anionic dyes on ammonium-functionalizedMCM-41,J.Hazard.Mater.162(2009)133–139.[5]Z.-M.Ni,S.-J.Xia,L.-G.Wang,F.-F.Xing,G.-X.Pan,Treatment of methyl orangeby calcined layered double hydroxides in aqueous solution:adsorption prop-erty and kinetic studies,J.Colloid Interface Sci.316(2007)284–291.[6]K.P.Singh,D.Mohan,S.Sinha,G.S.Tondon,D.Gosh,Color Removal fromWastewater Using Low-Cost Activated Carbon Derived from Agricultural Waste Material,Ind.Eng.Chem.Res.42(2003)1965–1976.[7]A.Bhatnagar,E.Kumar,A.K.Minocha,B.-H.Jeon,H.Song,Y.-C.Seo,Removalof anionic dyes from water using Citrus limonum(lemon)peel:equilibrium studies and kinetic modeling,Sep.Sci.Technol.44(2009)316–334.[8]G.Annadurai,R.-S.Juang,D.-J.Lee,Use of cellulose-based wastes for adsorptionof dyes from aqueous solutions,J.Hazard.Mater.92(2002)263–274.[9]V.Rocher,J.-M.Siaugue,V.Cabuil,A.Bee,Removal of organic dyes by magneticalginate beads,Water Res.42(2008)1290–1298.[10]J.-H.Huang,K.-L.Huang,S.-Q.Liu,A.-T.Wang,C.Yan,Adsorption of rhodamineB and methyl orange on a hypercrosslinked polymeric adsorbent in aqueoussolution,Colloid Surf.A:Physicochem.Eng.Aspects330(2008)55–61. [11]A.Ayar,O.Gezici,M.Küc¸ükosmano˘g lu,Adsorptive removal of methyleneblue and methyl orange from aqueous media by carboxylated diaminoethane sporopollenin:on the usability of an aminocarboxilic acid functionality-bearing solid-stationary phase in column techniques,J.Hazard.Mater.146(2007) 186–193.[12]X.Luo,L.Jhang,High effective adsorption of organic dyes on magnetic cellulosebeads entrapping activated carbon,J.Hazard.Mater.171(2009)340–347. [13]G.Férey,Hybrid porous solids:past,present,future,Chem.Soc.Rev.37(2008)191–214.[14]S.Kitagawa,R.Kitaura,S.-I.Noro,Functional porous coordination polymers,Angew.Chem.Int.Ed.43(2004)2334–2375.[15]O.M.Yaghi,M.O’Keeffe,N.W.Ockwig,H.K.Chae,M.Eddaoudi,J.Kim,Reticularsynthesis and the design of new materials,Nature423(2003)705–714.。
ProcessesStick, TIGProduct NumberK2619-1K2619-2K2620-1K2618-1 Ready-Pak®Package See back for complete specs© Lincoln Global, Inc. All Rights Reserved.275TIG WELDERSInput Power (Voltage/Phase/Hertz)K2619-1/K2618-1:208/230/460/1/60K2619-2:460/575/1/60K2620-1:220-230/380-400/415/1/50/60Input Current at Rated Output208V:104460V:47220-230V:95575V:38230V:94380-400V:55415V:50Rated Output: Current/Voltage/Duty Cycle275A/31V/40%Weight/Dimensions (H x W x D)397 lbs. (180 kg)31 x 22 x 26 in.(787 x 559 x 660 mm)INPUT OUTPUTK2618-1 Includes:K2619-1Under-Cooler Cart Water Cooler –PH: +1.216-481-8100 • LI NC OL N E L E C TR ICShown K2619-1[ 2]|Precision TIG ®275What Is It?Pulse welding systems vary weld current between peak (high heat) and background current (low heat) levels. Adjusting the pulse frequency controls the level of heat input applied to the weld relative to the weld travel speed.ResultsBetter control of heat input in the weld, resulting in:•Reduced warping and burnthrough on thin materials. •Smaller heat-affected zone – good for thin material.•Smaller bead profile without compromising proper penetration.Easy “Set It/See It” Operation:•Flashing indicator light lets you see the pulse rate before you strike an arc.W e l d i n g C u r r e ntTimePulsed TIG Weld (at 60 amps)Standard TIG Weld (at 60 amps) Smaller HeatAffected ZoneSmaller Bead ProfileMicro-Start ™II Technology aids arc stabilityTHROUGHOUT THE WELD CYCLE – even at the lowest amperage! Micro-Start ™II Technologycontrolled ramp down helps precisely fill the weld crater for quality results.Micro-Start ™II Technology minimizes high frequency and ‘hot starts’ to deliver soft arc starts without arc wandering for AC and DC welding. Arc PerformanceMicro-Start ™Stable, Focused Arc Precise Crater Fill“Set It/See It” Pulse Control — Make attractive and consistent welds!N O WIN C L U D ESf o r A L UM IN U MW E L D INGA CPrecision TIG ®275| [ 3]AC Auto Balance ®Controls —Automatically sets the optimal cleaning vs. penetration level for aluminum welding!What Is It?When aluminum welding, the positive (+) portion of the AC weldingamperage cleans the oxides from the aluminum surface. The negative (-)portion delivers more heat input, increasing penetration level.Patented AC Auto Balance ®automatically sets the ratio of cleaning action (+) versus penetration (-) based on amperage.Manual balance control provides the flexibility to customize the arc to your preference.Easy Operation:•Set it and forget it or override when you choose to customize the settings.More Cleaning (+)Less Cleaning (+)Less Penetration(-)More Penetration (-)W E L D I N G W E L D I N G TIMETIMEMaximum Cleaning SettingMaximum Penetration SettingAuto Balance Setting•Fan-As-Needed (F.A.N.)™minimizes repeated heating and cooling of internal components, keeps dust and dirt build-up to a minimum and saves on electricity costs. •Engineered cooling air routing brings clean air in from the top and exhausts at the bottom to draw and collect less dirt in the machine. •Compare these reliability enhancing design features: — Crimped and soldered power connections.— Wound and varnished electrical coils do not require coil spacers used on competitive models. — Locking tabs on PC board connectors eliminates loose connections.•Tough testing cycles ensure long service — dropping, jerking,rolling, shipping, vibration, resistance to real world extreme conditions, and extended in-service life testing. •CSA C/US certified.•Lincoln three-year warranty on parts and labor.Clean, cool air route shown.Snap-action durable switches make positive mechanical contact to reduce chances ofintermittent contact failure.[ 4]| Precision TIG ®275Shown: K2618-1Water-Cooled Ready-Pak ®PackageTorch Parts Storage Compartment.Optional TIG pulsing helps you make great welds.Water-cooled torch connections with no adapters — side mounted to keep out of the way and protected.Neat/organized cable management with integratedtorch holster.Separate output studs for stick and TIG keep both stick electrode holder and TIG torch connected at the same time — eliminates set-up changeover when switching processes.Easily accessible input voltagereconnect panel.Low-Lift ™ Shielding Gas Bottle Platform.Lockable Undercarriage Storage and Water Cooler Drawers.Reliable Pro-Con Pump.Optional Features:(standard with K2618-1 Water-Cooled Ready-Pak ®Package)Precision TIG ®275| [ 5]Large, well-spaced controls make it easy to view and set upwith gloved hands.SET-UP MENUPress and hold the menu button to display up to seven programmable parameters. The setting of the desired level is displayed, and increasing or decreasing the level setting is easy.The Set-Up Menu includes:Standard•DC TIG Start Modes: High Frequency, Scratch Start, and Touch Start TIG ®.•Adjustable Preflow Time.•Adjustable Start Pulse for Soft or Forceful Starts.With Optional Advanced Control Panel •Adjustable TIG Hot Start.•Adjustable Upslope Time.•Adjustable Stick Hot Start.•Adjustable Stick Arc Force.A)Minimum Output Control & Display Switch (Also displays output voltage)B)Set-Up Menu (see below)C)Digital MeterD)Local/Remote Current Control Switch E)Maximum Output Control F)Post Flow Time G)Thermal Shutdown Light H)Optional Advanced Control Panel 1)Trigger Switch (2-step/4-step)2)Pulse/Spot Time Mode Switch 3)Pulse Frequency Control 4)Pulse % On Time Control 5)Pulse Background Current Control 6)Downslope Time, In Seconds 7)Spot Time I)Polarity Switch J)Power Switch K)AC Balance Control L)Mode SwitchH123 4 & 756BCDEAF G HI J KLC U S T O M E R A S S I S T A N C E P O L I C YThe business of The Lincoln Electric Company ®is manufacturing and selling high quality welding equipment, consumables, and cutting equipment. Our challenge is to meet the needs of our customers and to exceed their expectations. On occasion, purchasers may ask Lincoln Electric for information or advice about their use of our products. Our employees respond to inquiries to the best of their ability based on information provided to them by the customers and the knowledge they may have concerning the application. Our employees, however, are not in a position to verify the information provided or to evaluate the engineering requirements for the particular weldment. Accordingly, Lincoln Electric does not warrant or guarantee or assume any liability with respect to such information or advice. Moreover, the provision of such information or advice does not create, expand, or alter any warranty on our products. Any express or implied warranty that might arise from the information or advice, including any implied warranty of merchantability or any warranty of fitness for any customers’ particular purpose is specifically disclaimed.Lincoln Electric is a responsive manufacturer, but the selection and use of specific products sold by Lincoln Electric is solely within the control of, and remains the sole responsibility of the customer. Many variables beyond the control of Lincoln Electric affect the results obtained in applying these types of fabrication methods and service requirements.Subject to Change – This information is accurate to the best of our knowledge at the time of printing. Please refer to for any updated information.For best welding results with Lincoln Electric equipment,always use Lincoln Electric consumables. Visit for more details.GENERAL OPTIONSAdvanced Control Panel Provides 2/4-step trigger with adjustable Pulser controls and Downslope timer for TIG welding.Also includes adjustable Hot Start and Arc Force internal panel controls for stick welding, and other user selectable features.Order K2621-1Under-Cooler Cart Water Cooler Includes “cooler-in-a-drawer” with hoses and a lockable storage drawer on a dual bottle undercarriage. Two gallon (7.5 ltrs.) capacity.Order K1828-1UndercarriageIncludes a dual bottle rack with chain and front casters, rear wheels and a handle. Order K1869-1Harris ®Argon Flowmeter RegulatorDeluxe flowmeter/regulator. Includes 10 ft. (3.0 m) hose. Order 3100211Work Clamp & Cable Assembly 15 ft. 2/0 cable with 1/2 in. stud lug and work clamp. Order K2150-1STICK OPTIONSAccessory KitFor stick welding. Includes 35 ft.(10.7 m) 2/0 electrode cable with lug, 30 ft. (9.1 m) 2/0 work cable with lugs, headshield, filter plate,work clamp and electrode holder.400 amp capacity.Order K704Accessory KitFor stick welding. Includes 20 ft. (6.1 m) #6 electrode cable with lug,15 ft. (4.6 m) #6 work cable with lugs, headshield, filter plate, work clamp, electrode holder and sample pack of mild steel electrode. 150amp capacity.Order K875Remote Output ControlConsists of a control box with choice of two cable lengths. Permits remote adjustment of output. 6 pin connection.Order K857for 25 ft. (7.6 m)Order K857-1for 100 ft. (30.5 m) TIG OPTIONSMagnum®Pro-Torch™TIG TorchesA full line of air-cooled and water-cooled torches available.Request publication E12.150PTA-26 One-Cable AdapterAdapts the 7/8 in. PTA-26 fitting tothe 5/8 in. gas and powerconnection on machine. Order K2166-1PTA-9, -17 One-Cable Adapter Adapts the 3/8 in. PTA-9 or -17fitting to the 5/8 in. gas and power connection on machine.Order K2166-3PTA-9, PTA-17, PTA-26 Two-Cable AdapterConverts the 7/8 in. water andpower connection on the machine to a 1/2 in. output stud for use with a two-cable air-cooled TIG torch.Order K2166-2Foot Amptrol ™Varies current for making critical TIG welds. Depress pedal to increase current. Depressing pedal fullyachieves maximum set current. Fully raising the pedal finishes the weld and starts the afterflow cycle.Includes 25 ft. (7.6 m) control cable.6-pin plug connection.Order K870Hand Amptrol ™Provides 25 ft. (7.6 m) of remote current control for TIG welding (6 pin plug connection). Velcro straps secure torch.Order K963-3(One size fits all Pro-Torch ™TIG Torches.)Arc Start SwitchNeeded if an Amptrol ™is not used when TIG welding. Comes with a 25ft. (7.6 m) cable. Attaches to the TIG torch for convenient finger control. 6-pin plug connection. Order K814Cut Length Consumables TIG welding filler metals are available for welding stainless steel, mild steel, aluminum and copper alloys.See publication C1.10。
RVN4126 3.59100-386-9100-386/T DEVICERVN41772-CD2-3.5MCS/MTSRVN41821-CD2-3.5XTS3000/SABER PORTABLE YES RKN4046KHVN9085 3.51-20 R NO HLN9359 PROG. STAND RVN4057 3.532 X 8 CODEPLUG NO3080385B23 & 5880385B30 MDVN4965 3.59100-WS/T CONFIG KITRVN4053 3.5ASTRO DIGITAL INTERFACE NO3080385B23RVN41842-CD RKN4046A (Portable) 2-3.5ASTRO PORTABLE /MOBILE YES3080369B73 or0180300B10 (Mobile) RVN41831-CD3080369B732-3.5ASTRO SPECTRA MOBILE YES(Low / Mid Power)0180300B10 (High Power) RVN4185CD ASTRO SPECTRA PLUS MOBILE NO MANY OPTIONS; SEESERVICE BRIEF#SB-MO-0101RVN4186CD ASTRO SPECTRA PLUS MANY OPTIONS;MOBILE/PORTABLE COMB SEE SERVICE BRIEF#SB-MO-0101RVN4154 3.5ASTROTAC 3000 COMPAR.3080385B23RVN5003 3.5ASTROTAC COMPARATORS NO3080399E31 Adpt.5880385B34RVN4083 3.5BSC II NO FKN5836ARVN4171 3.5C200RVN4029 3.5CENTRACOM SERIES II NO VARIOUS-SEE MANUAL6881121E49RVN4112 3.5COMMAND PLUS NORVN4149 3.5COMTEGRA YES3082056X02HVN6053CD CT250, 450, 450LS YES AAPMKN4004RVN4079 3.5DESKTRAC CONVENTIONAL YES3080070N01RVN4093 3.5DESKTRAC TRUNKED YES3080070N01RVN4091 3.5DGT 9000 DESKSET YES0180358A22RVN4114 3.5GLOBAL POSITIONING SYS.NO RKN4021AHVN8177 3.5GM/GR300/GR500/GR400M10/M120/130YES3080070N01RVN4159 3.5GP60 SERIES YES PMLN4074AHVN9128 3.5GP300 & GP350RVN4152 3.5GP350 AVSRVN4150 3.5GTX YES HKN9857 (Portable)3080070N01(Mobile) HVN9025CD HT CDM/MTX/EX SERIES YES AARKN4083/AARKN4081RiblessAARKN4075RIBLESS NON-USA RKN4074RVN4098H 3.5HT1000/JT1000-VISAR YES3080371E46(VISAR CONV)RVN4151 3.5HT1000 AVSRVN4098 3.5HT1000/ VISAR CONV’L.YES RKN4035B (HT1000) HVN9084 3.5i750YES HLN-9102ARVN4156 3.5LCS/LTS 2000YES HKN9857(Portable)3080070N01(Mobile) RVN4087 3.5LORAN C LOC. RECV’R.NO RKN4021ARVN4135 3.5M100/M200,M110,M400,R100 includesHVN9173,9177,9646,9774YES3080070N01RVN4023 3.5MARATRAC YES3080070N01RVN4019 3.5MAXTRAC CONVENTIONAL YES3080070N01RVN4139 3.5MAXTRAC LS YES3080070N01RVN4043 3.5MAXTRAC TRK DUPLEX YES3080070N01RVN4178CD MC SERIES, MC2000/2500DDN6124AW/DB25 CONNECTORDDN6367AW/DB9 CONNECTOR RVN41751-CD Rib to MIC connector 1-3.5MCS2000 RKN4062BRVN41131-3.5MCS2000RVN4011 3.5MCX1000YES3000056M01RVN4063 3.5MCX1000 MARINE YES3000056M01RVN4117 3.5MDC/RDLAP DEVICESRVN4105 3.5MOBILE PROG. TOOLRVN4119 3.5MOBITEX DEVICESRVN4128 3.5MPT1327-1200 SERIES YES SEE MANUALRVN4025 3.5MSF5000/PURC/ANALOG YES0180355A30RVN4077 3.5MSF5000/10000FLD YES0180355A30RVN4017K 3.5MT 1000YES RTK4205CRVN4148 3.5MTR 2000YES3082056X02RVN4140 3.5MTRI 2000NORVN41761-CD MTS2000, MT2000*, MTX8000, MTX90001-3.5*programmed by DOS which is included in the RVN4176RVN4131 3.5MTVA CODE PLUG FIXRVN4142 3.5MTVA DOCTOR YES3080070N01RVN4131 3.5MTVA3.EXERVN4013 3.5MTX800 & MTX800S YES RTK4205CRVN4097 1-CD MTX8000/MTX9000,MTS2000,MT2000*,* programmed by DOS which is included in the RVN4176HVN9067CD MTX850/MTX8250MTX950,MTX925RVN4138 3.5MTX-LS YES RKN4035DRVN4035 3.5MX 1000YES RTK4203CRVN4073 3.5MX 800YES RKN4006BHVN9395 P100, P200 LB, P50+, P210, P500, PR3000RVN4134 3.5P100 (HVN9175)P200 LB (HVN9794)P50+ (HVN9395)P210 (HVN9763)P500 (HVN9941)PR3000 (HVN9586)YES RTK4205HVN9852 3.5P110YES HKN9755A/REX1143 HVN9262 3.5P200 UHF/VHF YES RTK4205RVN4129 3.5PDT220YVN4051 3.5PORTABLE REPEATER Portable rptr.P1820/P1821AXRVN4061C 3.5PP 1000/500NO3080385B23 & 5880385B30 RVN5002 3.5QUANTAR/QUANTRO NO3O80369E31RVN4135 3.5R100 (HVN9177)M100/M200/M110/M400YES0180358A52RVN4146 3.5RPM500/660RVN4002 3.5SABER YES RTK4203CRVN4131 3.5SETTLET.EXEHVN9007 3.5SM50 & SM120YESRVN4039 3.5SMART STATUS YES FKN5825AHVN9054 3.5SOFTWARE R03.2 P1225YES3080070N01HVN9001 3.5SOFTWARE R05.00.00 1225LS YES HLN9359AHVN9012 3.5SP50RVN4001N 3.5SPECTRA YES3080369B73 (STANDARD)0180300B10 (HIGH POWER) RVN4099 3.5SPECTRA RAILROAD YES3080369B73RVN4110 3.5STATION ACCESS MODULE NO3080369E31RVN4089A 3.5STX TRANSIT YES0180357A54RVN4051 3.5SYSTEMS SABER YES RTK4203BRVN4075 3.5T5600/T5620 SERIES NO3080385B23HVN9060CD TC3000, TS3000, TR3000RVN4123 3.5VISAR PRIVACY PLUS YES3080371E46FVN4333 3.5VRM 100 TOOLBOX FKN4486A CABLE &ADAPTORRVN4133 3.5VRM 500/600/650/850NORVN4181CD XTS 2500/5000 PORTABLES RKN4105A/RKN4106A RVN41002- 3.5XTS3000 ASTRO PORTABLE/MOBILERVN4170 3.5XTS3500YES RKN4035DRIB SET UPRLN4008E RADIO INTERFACE BOX (RIB)0180357A57RIB AC POWER PACK 120V0180358A56RIB AC POWER PACK 220V3080369B71IBM TO RIB CABLE (25 PIN) (USE WITH XT & PS2)3080369B72IBM TO RIB CABLE (9 PIN)RLN443825 PIN (F) TO 9 PIN (M) ADAPTOR (USE W/3080369B72 FOR AT APPLICATION) 5880385B308 PIN MODULAR TO 25 PIN ”D” ADAPTOR (FOR T5600 ONLY)0180359A29DUPLEX ADAPTOR (MOSTAR/TRAXAR TRNK’D ONLY)Item Disk Radio RIB Cable Number Size Product Required Number Item Disk Radio RIB Cable Number Size Product Required NumberUtilizing your personal computer, Radio Service Software (RSS)/Customer Programming Software (CPS)/CustomerConfiguration Software (CCS) enables you to add or reprogram features/parameters as your requirements change. RSS/CPS/CCS is compatible with IBM XT, AT, PS/2 models 30, 50, 60 and 80.Requires 640K RAM. DOS 3.1 or later. Consult the RSS users guide for the computer configuration and DOS requirements. (ForHT1000, MT/MTS2000, MTX838/8000/9000, Visar and some newer products —IBM model 386, 4 MEG RAM and DOS 5.0 or higher are recommended.) A Radio Interface Box (RIB) may be required as well as the appropriate cables. The RIB and cables must be ordered separately.Licensing:A license is required before a software (RVN) order is placed. The software license is site specific (customer number and ultimate destination tag). All sites/locations must purchase their own software.Be sure to place subsequent orders using the original customer number and ship-to-tag or other licensed sites; ordering software without a licensed customer number and ultimate tag may result in unnecessary delays. To obtain a no charge license agreement kit, order RPX4719. To place an order in the U.S. call 1-800-422-4210. Outside the U.S., FAX 847-576-3023.Subscription Program:The purchase of Radio ServiceSoftware/Customer Programming/Customer ConfigurationSoftware (RVN & HVN kits) entitles the buyer/subscriber to three years of free upgrades. At the end of these three years, the sub-scriber must purchase the same Radio Service Software kit to receive an additional three years of free upgrades. If the sub-scriber does not elect to purchase the same Radio Service Software kit, no upgrades will be sent. Annually a subscription status report is mailed to inform subscribers of the RSS/CPS/CCS items on our database and their expiration dates.Notes:1)A subscription service is offered on “RVN”-Radio Service Software/Customer Programming/Customer Configuration Software kits only.2)“RVN” software must only be procured through Radio Products and Services Division (RPSD). Software not procured through the RPSD will not be recorded on the subscription database; upgrades will not be mailed.3)Upgrades are mailed to the original buyer (customer number & ultimate tag).4)SP software is available through the radio product groups.The Motorola General Radio Service Software Agreement is now available on Motorola Online. If you need assistance please feel free to submit a “Contact Us” or call 800-422-4210.SMART RIB SET UPRLN1015D SMART RIB0180302E27 AC POWER PACK 120V 2580373E86 AC POWER PACK 220V3080390B49SMARTRIB CABLE (9 PIN (F) TO 9 PIN (M) (USE WITH AT)3080390B48SMARTRIB CABLE (25 PIN (F) TO 9 PIN (M) (USE WITH XT)RLN4488ASMART RIB BATTERY PACKWIRELESS DATA GROUP PRODUTS SOFTWARERVN4126 3.59100-386/9100T DEVICES MDVN4965 3.59100-WS/T CONFIG’TN RVN41173.5MDC/RDLAP DEVICESPAGING PRODUCTS MANUALS6881011B54 3.5ADVISOR6881029B90 3.5ADVISOR ELITE 6881023B20 3.5ADVISOR GOLD 6881020B35 3.5ADVISOR PRO FLX 6881032B30 3.5BR8506881032B30 3.5LS3506881032B30 3.5LS5506881032B30 3.5LS7506881033B10 3.5LS9506881035B20 3.5MINITOR III8262947A15 3.5PAGEWRITER 20008262947A15 3.5PAGEWRITER 2000X 6881028B10 3.5TALKABOUT T3406881029B35 3.5TIMEPORT P7308262947A15 3.5TIMEPORT P930NLN3548BUNIVERSAL INTERFACE KITItem Disk Radio NumberSize Product。
2018年第37卷第6期 CHEMICAL INDUSTRY AND ENGINEERING PROGRESS·2347·化 工 进展平衡磷酸烯醇式丙酮酸节点通量强化筑波链霉菌合成他克莫司吕蒙蒙1，2，刘蛟1，2，刘欢欢1，2，陈红1，2，王成1，2，闻建平1，2（1天津大学化工学院系统生物工程教育部重点实验室，天津 300072；2天津大学天津化学化工协同创新中心，天津 300072）摘要：他克莫司（FK506）是最重要的免疫抑制剂之一，然而前体代谢供应不足制约着工业化生产。
通过优化平衡磷酸烯醇式丙酮酸（PEP ）节点支路通量可提高FK506产量。
本文首先在S. tsukubaensis D852中过表达基因fkb O （编码分支酸水合还原酶）和 fkb L （编码赖氨酸环化酶）得到S. tsukubaensis -OL1，FK506的产量仅从158.7mg/L 提高到163.9mg/L 。
随后调节PEP 节点支路回补途径和莽草酸途径通量强化FK506的合成：先分别将不同菌株中编码磷酸烯醇式丙酮酸羧化酶（PPC ）和3-脱氧-D-阿拉伯糖基-heptulosonate-7-磷酸合酶（DAHPS ）的基因在S. tsukubaensis -OL1中过表达，FK506的产量分别提高40%（ppc ，S. tsukubaensis ）和47%（dah P ，S. roseosporus ）；然后采用4个不同强度的组成型启动子（P ermE *，P sco 4503，P sco 3410 and P sco 5768）平衡ppc 和dah P 的表达水平获得9株工程菌，最终使FK506的产量由163.9mg/L 显著提高到350.3mg/L 。
这个结果说明优化平衡PEP 节点竞争支路通量是提高FK506产量的有效策略。
关键词：他克莫司；回补途径；莽草酸途径；组成型启动子；筑波链霉菌中图分类号：Q591 文献标志码：A 文章编号：1000–6613（2018）06–2347–07 DOI ：10.16085/j.issn.1000-6613.2017-1482Balancing carbon flux rebalancing around phosphoenolpyruvate node forenhancement of FK506 production in Streptomyces tsukubaensisLÜ Mengmeng 1，2，LIU Jiao 1，2，LIU Huanhuan 1，2，CHEN Hong 1，2，WANG Cheng 1，2，WEN Jianping 1，2（1Key Laboratory of System Bioengineering （Tianjin University ），Ministry of Education ，Tianjin 300072，China ；2SynBio Research Platform ，Collaborative Innovation Center of Chemical Science and Engineering (Tianjin)，School ofChemical Engineering and Technology ，Tianjin University ，Tianjin 300072，China ）Abstract ：Tacrolimus （FK506），as one of the widely used immunosuppressants produced by Streptomyces species ，has drawn much attention on clinic application. However ，the low FK506 fermentation titer restricts its industrial production ，which is mainly due to the insufficient precursor metabolism of the producing strain. In this work ，balancing carbon flux rebalancing around phosphoenolpyruvate （PEP ）node for enhancement of FK506 production were carried on. Firstly ，the genes fkb O and fkb L were overexpressed in S. tsukubaensis D852，achieving S. tsukubaensis -OL1，of which FK506 production changed only slightly from 158.7mg/L to 163.9mg/L. Then ，two precursor metabolic pathways ，the anaplerotic and shikimate pathways emanating from PEP node ，were fine-tuned for eliminating the inefficient supply of precursors of DHCHC and pipecolate. The genes encoding PPC and DAHPS were cloned from various species and expressed in S. tsukubaensis -OL1，自然科学基金项目（21376171）。
Freescale Semiconductor User’s Guide1OverviewThe Freescale Freedom development platform is a set of software and hardware tools for evaluation and development. It’s ideal for the rapid prototyping ofmicrocontroller-based applications. The Freescale Freedom KL26Z hardware (FRDM-KL26Z) is a capable and cost-effective design featuring a Kinetis L seriesmicrocontroller, the industry’s first microcontroller built on the ARM® Cortex™-M0+ core.FRDM-KL26Z can be used to evaluate the KL16 and KL26 Kinetis L series devices. It features a KL26Z128VLH4, a device boasting a maximum operating frequency of 48MHz, 128KB of flash, a full-speed USB controller, and numerous analog and digital peripherals. The FRDM-KL26Z hardware is form-factor compatible with the Arduino™ R3 pin layout, providing a broad range of expansion board options. The on-board interfaces include an RGB LED, a 6-axis digital sensor (combining a 3D accelerometer and 3Dmagnetometer), ambient light sensor, and a capacitive touch slider.The FRDM-KL26Z features the Freescale open standard embedded serial and debug adapter known as OpenSDA.Doc Number:FRDMKL26ZUGRev. 0, 10/2013Contents1.Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . 23.Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24.FRDM-KL26Z hardware overview . . . . . . . . . . . . . . 25.FRDM-KL26Z hardware description . . . . . . . . . . . . . 5FRDM-KL26Z User’s GuidebyFreescale Semiconductor, Inc.Reference documentsThis circuit offers several options for serial communications, flash programming and run-control debugging.2Reference documentsThe table below provides a list of reference documents for the FRDM-KL26Z hardware. All of these documents are available online at /FRDM-KL26Z.Table1. FRDM-KL26Z reference documentsFilename DescriptionFRDM-KL26Z Quick Start Package Quick Start Guide and supporting files for getting started with the FRDM-KL26Z FRDM-KL26Z User’s Guide This document—overview and detailed information for the FRDM-KL26ZhardwareFRDM-KL26Z Pinouts Spreadsheet of pin connections for all MCU pins. Includes pinout for the I/Oheaders, Arduino R3 compatibility chart, and OpenSDA MCU pinout.FRDM-KL26Z Schematics PDF schematics for the FRDM-KL26Z hardwareFRDM-KL26Z Design Package Zip file containing all design source files for the FRDM-KL26Z hardware OpenSDA User’s Guide Overview and instructions for use of the OpenSDA embedded debug circuit3Getting startedSee the FRDM-KL26Z Quick Start Package for step-by-step instructions to get started with the FRDM-KL26Z. See the Jump Start Your Design section on /FRDM-KL26Z for the Quick Start Package and software lab guides.4FRDM-KL26Z hardware overviewThe features of the FRDM-KL26Z include:•MKL26Z128VLH4 in a 64 LQFP package•Capacitive touch slider•FXOS8700CQ accelerometer and magnetometer•Tri-color (RGB) LED•Ambient light sensor•User push button•Flexible power supply options – USB, coin cell battery, external source•Battery-ready, power-measurement access points•Easy access to MCU I/O via Arduino™ R3 compatible I/O connectors•Programmable OpenSDA debug interface with multiple applications available including:—Mass storage device flash programming interface—P&E Debug interface provides run-control debugging and compatibility with IDE toolsFRDM-KL26Z hardware overview—CMSIS-DAP interface: new ARM standard for embedded debug interface—Data logging applicationFigure1 shows a block diagram of the FRDM-KL26Z design. The primary components and their placement on the hardware assembly are pointed out in Figure2.Figure1. FRDM-KL26Z block diagramFRDM-KL26Z hardware overview! (Figure2. FRDM-KL26Z feature call-outsFRDM-KL26Z hardware description5FRDM ‐KL26Z hardware description5.1Power supplyThere are multiple power supply options on the FRDM-KL26Z. It can be powered from either of the USB connectors, the VIN pin on the I/O header, an on-board coin cell battery, or an off-board 1.71-3.6V supply from the 3.3V pin on the I/O header. The USB and VIN supplies are regulated on-board using a 3.3V linear regulator to produce the main power supply. The other two sources are not regulated on-board. Table 2 provides the operational details and requirements for the power supplies.Table 2.Power supply requirementsNote that the OpenSDA circuit is only operational when a USB cable is connected and supplying power to J10. However, protection circuitry is in place to allow multiple sources to be powered at once.Figure 3 shows the schematic drawing for the power supply inputs and the on-board voltage regulator.Figure 3. Power supply schematicIn addition, regulated power can be supplied to J3 pin 10 from an external source through P5-9V_VIN by populating the board with an optional voltage regulator, e.g. a 7805 style regulator in a TO-220 package, thus providing a high current supply to external devices. To prevent voltage sag under a high load, C23,Supply Source Valid RangeOpenSDA Operational?Regulated on-board?OpenSDA USB (J7)5V Yes Yes KL26Z USB (J5)5V No Yes V in 4.3-9V No Yes 3.3V pin 1.71-3.6V No No Coin cell battery1.71-3.6VNoNoFRDM-KL26Z hardware descriptionC24, C25 & C28 should be populated with appropriately sized capacitors to match the regulator chosen. See Figure4.Figure4. Optional voltage regulator schematicTable3. FRDM-KL26Z power suppliesPowerDescriptionSupply NameP5-9V_VIN Power supplied from the V in pin of the I/O headers (J3 pin 16)P5V_SDA Power supplied from the OpenSDA USB connector (J10). A Schottky diode provides back drive protection.P5V_KL26Z Power supplied from the KL26Z USB connector (J6). A Schottky diode provides back drive protection P3V3_VREG Regulated 3.3V supply. Sources power to the P3V3 supply rail with an optional back drive protection Schottky diode.12P3V3_BATT Coin cell battery supply voltage. Sources power to the P3V3 supply rail with the option of adding a back drive protection Schottky diode.3P3V3Main supply rail for the FRDM-KL26Z assembly. May be sourced from P3V3_VREG, P3V3_BATT, or directly from the I/O headers (J3 pin 8).P3V3_KL26Z KL26Z MCU supply. Header J5 provides a convenient means for energy consumption measurements.4 P3V3_SDA OpenSDA circuit supply. Header J15 provides a convenient means for energy consumptionmeasurements.4P5V_USB Nominal 5V supplied to the I/O headers (J3 pin 10). Sourced from either the P5V_KL26Z or P5V_SDA supply through a back drive protection Schottky diode.FRDM-KL26Z hardware description5.2Serial and debug adapter (OpenSDA)OpenSDA is an open standard serial and debug adapter. It bridges serial and debug communications between a USB host and an embedded target processor as shown in Figure 5. The hardware circuit is based on a Freescale Kinetis K20 family microcontroller (MCU) with 128 KB of embedded flash and anintegrated USB controller. OpenSDA features a mass storage device (MSD) bootloader, which provides a quick and easy mechanism for loading different OpenSDA applications such as flash programmers, run-control debug interfaces, serial-to-USB converters, and more. See the OpenSDA User’s Guide for more details.Figure 5. OpenSDA high-level block diagramOpenSDA is managed by a Kinetis K20 MCU built on the ARM® Cortex™-M4 core. The OpenSDA circuit includes a status LED (D8) and a pushbutton (SW2). The pushbutton asserts a reset signal to the KL26Z target MCU. It can also be used to place the OpenSDA circuit into Bootloader mode. OpenSDA MCU RESET can be isolated from SW2 by cutting the trace between pins on J13. SPI and GPIO signals1By default the linear regulator, U1, is a 3.3V output regulator. However, this is a common footprint that would allow the user to modify the assembly to utilize an alternative device such as a 1.8V or 2.5V regulator. The KL26Z microcontroller has an operating range of 1.71V to 3.6V.2D2 is bypassed by J14. By default, the pins of J14 are shorted together, to reduce the voltage drop across D2. To use D2, cut the trace between the pins of J14.3If a coin cell battery is to be used, add a small amount of solder to the coin cell ground pad before adding the battery holder. Also, it is recommended to populate D1 as a protection diode when using a coin cell battery.4J5 and J15 are not populated by default. The two pins of these headers are in parallel with 0 Ω resistors. In addition, J5 is also in parallel with a 10 Ω resistor. To measure the energy consumption of the KL26Z, either a voltmeter or an ammeter may be used. To use a voltmeter, R3 (0 Ω) must be removed before connecting the voltmeter probes to the pins of J5. Both R3 and R2 (10 Ω) must be removed to measure current with an ammeter. For the OpenSDA MCU, energy consumption can be measured by removing R4 (0 Ω) and connecting ammeter probes to the pins of J15.FRDM-KL26Z hardware descriptionprovide an interface to the SWD debug port of the KL26Z. Additionally, signal connections are available to implement a UART serial channel. The OpenSDA circuit receives power when the USB connector J10 is plugged into a USB host.5.2.1Debug interfaceSignals with SPI and GPIO capability are used to connect directly to the SWD of the KL26Z. These signals are also brought out to a standard 10-pin (0.05”) Cortex Debug connector (J7). It is possible to isolate the KL26Z MCU from the OpenSDA circuit and use J7 to connect to an off-board MCU. To accomplish this, cut the trace on the bottom side of the PCB that connects J8 pin 1 to J8 pin 2. This will disconnect the SWD_CLK pin to the KL26Z so that it will not interfere with the communications to an off-board MCU connected to J7.Figure6. SWD debug connectorNote that J7 is not populated by default. A Samtec FTSH-105-02-F-D or compatible connector can be added to the J7 through-hole connector. A mating cable, such as a Samtec FFSD IDC cable, can then be used to connect from the OpenSDA of the FRDM-KL26Z to an off-board SWD connector.5.2.2Virtual serial portA serial port connection is available between the OpenSDA MCU and pins PTA1 and PTA2 of the KL26Z. Several of the default OpenSDA Applications provided by Freescale, including the MSD Flash Programmer and the P&E Debug Application, provide a USB communications device class (CDC) interface that bridges serial communications between the USB host and this serial interface on the KL26Z.5.3KL26Z microcontrollerThe target microcontroller of the FRDM-KL26Z is the KL26Z128VLH4, a Kinetis L series device in a 64 LQFP package. The KL26Z MCU features include:FRDM-KL26Z hardware description•32-bit ARM Cortex-M0+ core—Up to 48 MHz operation—Single-cycle fast I/O access port•Memories—128 KB flash—16 KB SRAM•System integration—Power management and mode controllers—Low-leakage wakeup unit—Bit manipulation engine for read-modify-write peripheral operations—Direct memory access (DMA) controller—Computer operating properly (COP) Watchdog timer•Clocks—Clock generation module with FLL and PLL for system and CPU clock generation—4 MHz and 32 kHz internal reference clock—System oscillator supporting external crystal or resonator—Low-power 1kHz RC oscillator for RTC and COP watchdog•Analog peripherals—16-bit SAR ADC w/ DMA support—12-bit DAC w/ DMA support—High speed comparator•Communication peripherals—Two 16-bit Serial Peripheral Interfaces (SPI)—USB dual-role controller with built-in FS/LS transceiver—USB voltage regulator—Two I2C modules—One low-power UART and two standard UART modules—One I2S module•Timers—One 6-channel Timer/PWM module—T wo 2-channel Timer/PWM modules—2-channel Periodic Interrupt Timer (PIT)—Real time clock (RTC)—Low-power Timer (LPTMR)—System tick timer•Human-Machine Interfaces (HMI)—General purpose input/output controllerFRDM-KL26Z hardware description—Capacitive touch sense input interface hardware module5.3.1Clock sourceThe Kinetis KL26 microcontrollers feature an on-chip oscillator compatible with three ranges of input crystal or resonator frequencies: 32-40 kHz (low freq. mode), 3-8 MHz (high frequency mode, low range) and 8-32 MHz (high frequency mode, high range). The KL26Z128 on the FRDM-KL26Z is clocked from an 8 MHz crystal.5.3.2USB interfaceThe Kinetis KL26 microcontrollers feature a dual-role USB controller with on-chip full-speed andlow-speed transceivers. The USB interface on the FRDM-KL26Z is configured as a full-speed USB device. J6 is the USB connector for this interface.Figure7. USB connector schematicIn order to enable USB host functionality on the FRDM-KL26Z, it is necessary to populate J9 and R8 as shown in Figure7. However, there is no electrical protection provided. Use the USB host functionality at your own risk.FRDM-KL26Z hardware description 5.3.3Serial portThe primary serial port interface signals are PTA1 and PTA2. These signals are connected to both the OpenSDA and to the J1 I/O connector. Note that the OpenSDA connection can be isolated from J1 by removing R13 & R14, if required.5.3.4ResetThe PTA20/RESET signal on the KL26Z128 is connected externally to a pushbutton, SW2, and also to the OpenSDA circuit. However, J13 has been provided to isolate the OpenSDA MCU from SW2. Isolating the RESET line allows a more accurate measurement of the target device’s power consumption in low-power modes. The reset button can be used to force an external reset event in the target MCU. The reset button can also be used to force the OpenSDA circuit into bootloader mode. See Section5.2, “Serial and debug adapter (OpenSDA), for more details.5.3.5DebugThe sole debug interface on all Kinetis L Series devices is a serial wire debug (SWD) port. The primary controller of this interface on the FRDM-KL26Z is the onboard OpenSDA circuit (see Section5.2, “Serial and debug adapter (OpenSDA)). However, an unpopulated 10-pin (0.05”) Cortex Debug connector, J7, provides access to the SWD signals. The Samtec FTSH-105-02-F-D or compatible connector can be added to the J7 through-hole debug connector to allow for an external debug cable to be connected.5.4Capacitive touch sliderTwo Touch Sense Input (TSI) signals, TSI0_CH9 and TSI0_CH10, are connected to capacitive electrodes configured as a touch slider. Freescale’s Touch Sense Software (TSS) provides a software library for implementing the capacitive touch slider.5.56-axis accelerometer and magnetometerA Freescale FXOS8700CQ low-power, six-axis accelerometer and magnetometer is interfaced through an I2C bus and two GPIO signals as shown in Table4. By default, the I2C address is 0x1D (SA0 pulled high).Table4. Accelerometer signal connectionsFX0S8700CQ KL26Z128SCL PTE24SDA PTE25INT1PTD0INT2PTD1FRDM-KL26Z hardware descriptionFigure 8. FXOS8700CQ schematic diagram5.6RGB LEDThree PWM-capable signals are connected to a red, green, blue LED, D7. The signal connections are shown in Table 5.Table 5. RGB LED signal connectionsFigure 9. RGB LED schematic diagramRGB LEDKL26Z128Red cathodePTE29Green cathodePTE31Blue cathodePTD511PTD5 is also connected to the I/O header on J2 pin 10 (also known as D13).FRDM-KL26Z hardware description5.7Ambient light sensorAn ambient light sensor is connected to ADC0_SE3 (PTE22). This sensor may be isolated from PTE22 by removing R36.5.8Input/Output connectorsThe KL26Z128VLK4 microcontroller is packaged in a 64-pin LQFP. Some pins are utilized in on-board circuitry, but many are directly connected to one of four I/O headers.The pins on the KL26Z microcontroller are named for their general purpose input/output port pin function. For example, the 1st pin on Port A is referred to as PTA1. The I/O connector pin names are given the same name as the KL26Z pin connected to it, where applicable.FRDM-KL26Z hardware descriptionNote that all pinout data is available in spreadsheet format in FRDM-KL26Z Pinouts. See Section2, “Reference documents” for details.5.9Analog reference voltageThe onboard ADC of the KL26Z128VLH4 MCU uses the Reference V oltage High (VREFH) and Reference V oltage Low (VREFL) pins to set high and low voltage references for the analog modules. On the FRDM-KL26Z, by default VREFH is attached to P3V3_KL26Z (3.3V Supply). VREFL is connected to GND. Figure10 illustrates this circuitry.Figure10. FRDM-KL26Z VREFH circuit schematicIf desired, VREFH can use a VDDA independent reference by adding R11 and a Zener diode (D6). R10 (0 Ω resistor) must be removed when implementing this option. Alternatively, VREFH can be attached to an external source through AREF by removing R10 and populating R9 with a 0 Ω resistor.5.10Arduino compatibilityThe I/O headers on the FRDM-KL26Z are arranged to allow compatibility with peripheral boards (known as shields) that connect to Arduino™ and Arduino-compatible microcontroller boards. The outer rows of pins (the even numbered pins) on the headers share the same mechanical spacing and placement as the I/O headers on the Arduino Revision 3 (R3) standard.FRDM-KL26Z hardware descriptionRefer to the FRDM-KL26Z Pinouts spreadsheet for a compatibility chart showing how all the functions of the KL26Z signals on the I/O connectors map to the pin functions available on the Arduino Uno R3.Document Number:FRDMKL26ZUG Rev. 010/2013Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document.Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: /SalesTermsandConditions.How to Reach Us:Home Page:Web Support:/supportFreescale, the Freescale logo, and Kinetis are trademarks of FreescaleSemiconductor, Inc., Reg. U.S. Pat. & Tm. Off. ARM is the registered trademark ofARM Limited. ARM Cortex-M0+ is the trademark of ARM Limited. All other product orservice names are the property of their respective owners.© 2013 Freescale Semiconductor, Inc.。
Key Features:᭤JBL’s exclusive conical Radiation Boundary Integrator ®(RBI) technology provides consistent and wide 120°coverage of the listening area.᭤Coaxial design featuring 130 mm (5¼ in)woofer and 20 mm (¾in) soft-dome tweeter.᭤Hanging hardware with 4.5 m (15 foot)galvanized steel cable and easy to adjust clamp.᭤Stylish design, available in black or white (-WH).᭤UL listed (speaker and hanging cable system).᭤8 ohm and 70V/100V operation.Applications:The Control 65P/T is a compact full-range,two-way pendant-type loudspeaker that provides superb sound reproduction and very consistent,wide coverage for rooms with open architecture ceilings and other locations where a pendant form factor is desired.JBL’s patent-pending Radiation Boundary Integrator ®(RBI) technology, adapted from the groundbreaking V ER T EC ™ Series of line array loudspeakers, delivers consistent coverage of the listening area. Combining a large 200 mm (8 in)diameter waveguide with low-frequencyprojection apertures, the two coaxially-mounted drivers provide a seamless integration ofcoverage, resulting in extremely even pattern control and coverage where all listeners hear a consistent, high-fidelity sound quality. The wide 120°coverage pattern allows for the use of fewer speakers, reducing the cost of theinstalled system without sacrificing performance.Excellent sound quality coupled with stylish design and easy installation makes the Control 65P/T ideal for a wide variety of applications including retail, restaurants, hotels, casinos,fitness centers, convention centers, exhibit spaces, conference rooms, atriums, museums,transit centers and other open-ceiling applications.The Control 65P/T includes a single-pointmounting system for easy and secure suspension in open-ceiling applications. Two complete hanging cable systems are included, providing both main and safety suspension cables. Include are extra-long 4.5 m (15 foot) high tensile galvanized steel wire rope having spring clips for the loudspeaker end of the cable and UL listed cable fasteners for infinitely adjustable suspension height.The system’s 130 mm (5¼in) low-frequency driver features a polypropylene-coated cone and 25 mm (1 in) copper voice coil with vented fiberglass resin coil-former for high powerhandling and improved long-term reliability. The coaxially-mounted 20 mm (¾in) textile soft-dome high frequency driver features internal damping for smooth extended response, along with an aluminum voice coil former andneodymium magnet assembly with ferro-fluid cooling, for high-fidelity sound quality with enhanced long-term sound level capability.The Control 65P/T contains a high-quality 60Watt multi-tap transformer for use on 70V/100V distributed loudspeaker lines, and is switchable for 8-ohm voice-coil direct operation.Euro-style clip-in connectors allow for easySpecifications:System:Frequency Response (-10 dB)1:55 Hz – 20 kHzFrequency Range (±3 dB)1:78 Hz – 18 kHzPower Capacity 2:75 Watts Continuous Pink Noise Power (with 300 Watts peaks)150 Watts Continuous Program PowerNominal Sensitivity:86 dBNominal Coverage Angle3:120°(+20°/-10°)Directivity (Q)3: 5.3Directivity Index (DI)3:7.2 dBRated Maximum SPL @ 1m:105 dB continuous pink noise, 111 dB peakRated Impedance:8 ohmsTransformer Taps:70V: 60W, 30W, 15W & 7.5W100V: 60W, 30W, 15WTransformer Insertion Loss:**********,0.5dB@15W,0.6dB@30W,0.7dB@60WTransducer:LF Driver:130 mm (5¼in) polypropylene-coated paper with pure butyl rubbersurround, 25 mm (1 in) copper voice coil, vented fiberglass resin voice coil-formerHF Driver:20 mm (¾in) textile soft-dome, neodymium magnet assembly,ferro-fluid cooling, aluminum voice coil formerEnclosure:Enclosure Material:High impact polystyreneGrille:Zinc-plated steel grille with powder-coat finish, foam backing(removable for painting)Environmental:Exceeds Mil Spec 810 for humidity, salt spray, temperature & UV.IP44 capability per IEC 529 – splashproof rating.Termination:Two removable locking euro-block 2-pin connectors with screw-down terminals for bare wire. Connectors paralleled for input and loop-thru. Max. wire 12 AWG (2.5 mm2). Rubber terminal covers included.Suspension:Two identical suspension systems (one as main suspension cableand the other as safety cable), each consisting of 4.5 m (15 ft) long 2 mm (0.077 in) high-tensile galvanized-steel wire rope suspension cable with spring-clips for clipping onto the loudspeaker bracket and Gripple™ brand adjustable-height cable fasteners for infinitely adjustable height. Cables have SWL rating of 45 kg (99 lb).Safety Agency Ratings:Speaker listed per UL1480, transformer registered per UL1876. Inaccordance with IEC60849/EN60849. Suspension system andGripple ®-brand cable fastener listed per UL1598 and UL2239, TUV,and CSA Class 3426-01 & Class 3426-81.Dimensions:234 mm (9.3 in) diameter x 259 mm (10.2 in) height to top ofcabinet. 279 mm (11.0 in) to top of suspension bracket.Net Weight (ea): 3.7 kg (8 lbs)Shipping Weight (pair):8.7 kg (19 lbs)IIncluded Accessories:Two suspension cable systems (see “Suspension”, above), two 2-pinremovable locking euro-block connectors, two rubber covers for euro-block connectors.Optional Accessories:MTC-PC60 top panel / terminal coverColors:Available in black or white (-WH). Paintable.Full-space (suspended)Continuous Pink Noise rating is IEC-shaped pink noise with a 6 dB peak-to-average crest factor for 100 hoursCompact Full-Range Pendant Loudspeaker with RBIProfessional SeriesControl ®65P/TShown with included grille removedSS C65᭤Control 65P/T Compact Full-Range Pendant Loudspeaker with RBI Beamwidth:-6 dB coverage by frequencyFrequency Response:Full-space, 8 ohm, 10°off-axis (typical for coverage area)Off-Axis Frequency Response:JBL Professional8500 Balboa Boulevard, P.O. Box 2200Northridge, California 91329 U.S.A.©Copyright 2010 JBL Professional。
高中理科物理公式归纳冲量与动量1.动量：p=mv {p:动量kg/s，m:质量kg，v:速度m/s，方向与速度方向相同｝3.冲量：I=Ft {I:冲量N?s，F:恒力N，t:力的作用时间s，方向由F决定｝4.动量定理：I=Δp或Ft=mvt–mv0 {Δp:动量变化Δp=mvt–mv0，是矢量式}5.动量守恒定律：p前总=p后总或p=p’′也可以是m1v1+m2v2=m1v1′+m2v2′6.弹性碰撞：Δp=0;ΔEk=0 {即系统的动量和动能均守恒}7.非弹性碰撞Δp=0;0<ΔEK<ΔEKm {ΔEK：损失的动能，EKm：损失的最大动能}8.完全非弹性碰撞Δp=0;ΔEK=ΔEKm {碰后连在一起成一整体}9.物体m1以v1初速度与静止的物体m2发生弹性正碰: V1′=m1-m2v1/m1+m2v2′=2m1v1/m1+m210.由9得的推论-----等质量弹性正碰时二者交换速度动能守恒、动量守恒11.子弹m水平速度v0射入静止置于水平光滑地面的长木块M，并嵌入其中一起运动时的机械能损失E损=mv02/2-M+mvt2/2=fs相对 {vt:共同速度，f:阻力，s相对子弹相对长木块的位移}功和能1.功：W=Fscosα定义式{W:功J，F:恒力N，s:位移m，α:F、s间的夹角｝2.重力做功：Wab=mghab {m:物体的质量，hab：a与b高度差hab=ha-hb}3.电场力做功：Wab=qUab {q:电量C，�4.电功：W=UIt普适式 {U：电压V，I:电流A，t:通电时间s｝5.功率：P=W/t定义式 {P:功率[瓦W]，W:t时间内所做的功J，t:做功所用时间s｝6.汽车牵引力的功率：P=Fv;P平=Fv平 {P:瞬时功率，P平:平均功率}7.汽车以恒定功率启动变加速、以恒定加速度启动变功率、汽车最大行驶速度vmax=P 额/f8.电功率：P=UI普适式 {U：电路电压V，I：电路电流A｝9.焦耳定律：Q=I2Rt {Q:电热J，I:电流强度A，R:电阻值Ω，t:通电时间s｝10.纯电阻电路中I=U/R;P=UI=U2/R=I2R;Q=W=UIt=U2t/R=I2Rt11.动能：EK=mv2/2 {EK:动能J，m：物体质量kg，v:物体瞬时速度m/s｝12.重力势能：EP=mgh {EP :重力势能J，g:重力加速度，h:竖直高度m从零势能面起｝13.电势能：EA=qφA {EA:带电体在A点的电势能J，q:电量C，φA:A点的电势V从零势能面起｝14.动能定理对物体做正功,物体的动能增加：W合=mvt2/2-mv02/2或W合=ΔEK {W合:外力对物体做的总功，ΔEK:动能变化ΔEK=mvt2/2-mv02/2｝15.机械能守恒定律：ΔE=0或EK1+EP1=EK2+EP2也可以是mv12/2+mgh1=mv22/2+mgh216.重力做功与重力势能的变化重力做功等于物体重力势能增量的负值WG=-ΔEP电场1.两种电荷、电荷守恒定律、元电荷：e=1.60×10-19C;带电体电荷量等于元电荷的整数倍2.库仑定律：F=kQ1Q2/r2在真空中{F:点电荷间的作用力N，k:静电力常量k=9.0×109Nm2/C2，Q1、Q2:两点电荷的电量C，r:两点电荷间的距离m，方向在它们的连线上，作用力与反作用力，同种电荷互相排斥，异种电荷互相吸引｝3.电场强度：E=F/q定义式、计算式{E：电场强度N/C，是矢量电场的叠加原理，q：检验电荷的电量C｝4.真空点源电荷形成的电场E=kQ/r2 {r：源电荷到该位置的距离m，Q：源电荷的电量｝5.匀强电场的场强E=UAB/d {�6.电场力：F=qE {F:电场力N，q:受到电场力的电荷的电量C，E:电场强度N/C｝7.电势与电势差：UAB=φA-φB，UAB=WAB/q=-ΔEAB/q8.电场力做功：WAB=qUAB=Eqd{WAB:带电体由A到B时电场力所做的功J，q:带电量C，UAB:电场中A、B两点间的电势差V电场力做功与路径无关,E:匀强电场强度,d:两点沿场强方向的距离m｝9.电势能：EA=qφA {EA:带电体在A点的电势能J，q:电量C，φA:A点的电势V｝10.电势能的变化ΔEAB=EB-EA {带电体在电场中从A位置到B位置时电势能的差值｝11.电场力做功与电势能变化ΔEAB=-WAB=-QuAb 电势能的增量等于电场力做功的负值12.电容C=Q/U定义式,计算式 {C:电容F，Q:电量C，U:电压两极板电势差V｝13.平行板电容器的电容C=εS/4πkdS:两极板正对面积，d:两极板间的垂直距离，ε：介电常数14.带电粒子在电场中的加速V0=0：W=ΔEK或qU=mVt2/2，Vt=2qU/m1/215.带电粒子沿垂直电场方向以速度V0进入匀强电场时的偏转不考虑重力作用的情况下类平抛运动;垂直电场方向:匀速直线运动L=V0t，平行电场方向:初速度为零的匀加速直线运动d=at2/2，a=F/m=qE/m强调:1两个完全相同的带电金属小球接触时,电量分配规律:原带异种电荷的先中和后平分,原带同种电荷的总量平分;2电场线从正电荷出发终止于负电荷,电场线不相交,切线方向为场强方向,电场线密处场强大,顺着电场线电势越来越低,电场线与等势线垂直;3常见电场的电场线分布要求熟记,见课本。
INSTALLATION GUIDENI TB-2709PXI Terminal Block for S Series DevicesThis installation guide describes how to install and connect signals to the NI TB-2709 terminal block for use with PXI-6123/6133 S Series devices. The TB-2709 can also be used with the PXI-6122/6132 devices to access the first four AI channels.IntroductionThe TB-2709 is a terminal block assembly consisting of nine SMB connectors and a 14-pin I/O connector. The terminal block assembly connects directly to the front panel of National Instruments PXI-6122, PXI-6123, PXI-6132, and PXI-6133 devices, eliminating the need for an external cable.Figure 1. TB-2709 Device View1Access Door to Configuration Switches 214-Pin I/O Connector (Digital Signals)3SMB Connectors (Analog Signals)NI TB-2709 Installation Guide The nine SMB connectors on the TB-2709 allow you to easily connect analog input signals to your National Instruments device. The 14-pin I/O connector located on the bottom of the TB-2709 allows access to digital signals.CautionThe TB-2709 is not designed for input voltages greater than 42V pk /60VDC,even if you install a voltage divider that reduces the voltage to within the input range of the DAQ device. Input voltages greater than 42V pk /60VDC can damage the TB-2709, any device connected to it, and the host computer. Overvoltage also can cause an electric shock hazard for the operator. National Instruments is not liable for damage or injury resulting from such misuse.What You Need to Get StartedYou need the following to set up and use your terminal block:❑NI TB-2709 Terminal Block Assembly ❑NI TB-2709 Installation Guide ❑One of the following:–NI PXI-6122–NI PXI-6123–NI PXI-6132–NI PXI-6133❑S Series User Manual ❑Number 1 Phillips screwdriverSafety InformationCautions Do not operate the device in an explosive atmosphere or where there may beflammable gases or fumes.Do not operate damaged equipment. The safety protection features built into this device can become impaired if the device becomes damaged in any way. If the device is damaged, turn the device off and do not use it until service-trained personnel can check its safety. If necessary, return the device to National Instruments for service and repair to ensure that its safety is not compromised.Do not operate this equipment in a manner that contradicts the information specified in thisdocument. Misuse of this equipment could result in a shock hazard.© National Instruments Corporation 3NI TB-2709 Installation GuideDo not substitute parts or modify equipment. Because of the danger of introducing additional hazards, do not install unauthorized parts or modify the device. Return the device to National Instruments for service and repair to ensure that its safety features are not compromised.You must insulate all of your signal connections to the highest voltage with which the TB-2709 can come in contact.Connections, including power signals to ground and vice versa, that exceed any of the maximum signal ratings on the terminal block can create a shock or fire hazard, or can damage any or all of the boards connected to the host computer and the terminal block. National Instruments is not liable for any damages or injuries resulting from incorrect signal connections.Clean the module and accessories by brushing off light dust with a soft non-metallic brush. Remove other contaminants with a stiff non-metallic brush. The unit must be completely dry and free from contaminants before returning it to service.InstallationThe TB-2709 connects directly to the front panel of the PXI DAQ device, as shown in Figure 2.Figure 2. Connecting the TB-2709 to an S Series Device1Terminal Block Mounting Screws 2PXI Chassis368-Pin I/O Connector on PXI DeviceNI TB-2709 Installation Guide To connect the terminal block to the PXI module I/O connector, refer to Figure 2 as you complete the following steps:1.Install the PXI module into the chassis and tighten the two module screws. You must install the PXI device before connecting theTB-2709. Refer to the DAQ Getting Started Guide for instructions on installing your PXI device.2.Guide the terminal block onto the PXI module connector.CautionDo not force the terminal block when inserting it into or removing it from the PXImodule I/O connector.3.Tighten the two terminal block mounting screws.Signal DescriptionsFigure 3 shows the front panel of the TB-2709, and Figure 4 shows the TB-2709 block diagram. Refer to Table 1 for a brief description of each signal available on the TB-2709.Figure 3.NI TB-2709 Front PanelFigure 4. NI TB-2709 Block DiagramTable 1. TB-2709 Signal DescriptionsSignal Name Reference Direction DescriptionAI<0..7>AI GND Input Analog Input channels 0 through 7.PFI0/AI Start Trig D GND Input As an input, this pin is a programmablefunction input (PFI).Output As an output, this pin is the AI StartTrigger signal.For more detailed descriptions of these signals, refer to the S Series UserManual.Additional signal configuration information is available in Measurement &Automation Explorer (MAX). To access this information in MAX, selectyour device under Devices and Interfaces, and click the Device Routestab.Measuring Floating SignalsYou can use the TB-2709 to measure floating and ground-referencedanalog input signals. To measure floating signal sources, move the switchlocated under the rubber-sealed door on the enclosure cover for the AIchannel you are using to the ON (floating source) switch position. In thefloating source switch position, the amplifier negative terminal connects toground through a 5kΩresistor in parallel with a 0.1 μF capacitor. Table2shows the TB-2709 switch configuration options.© National Instruments Corporation5NI TB-2709 Installation GuideTable 2. Configuration SummaryMeasuring Ground-Referenced SignalsIt is possible to set the switch on the TB-2709 to either the floating orground-referenced source position to measure ground-referenced signals.However, for best results, use the OFF (ground-referenced source) switchposition to avoid ground loops. Refer to the S Series User Manual for moreinformation on measuring floating and ground-referenced signals. Cabling OptionsThis section describes the cabling options for accessing digital signals onthe TB-2709.A 14-pin connector on the bottom of the TB-2709 provides access todigital I/O signals. Use the MFIT-Pigtail Cable Assembly (part number194123-01) to access digital signals on the TB-2709. The MFIT-PigtailCable Assembly features a 14-pin I/O connector on one end and pigtail NI TB-2709 Installation conductors on the other end. The pigtail conductors on the cable assemblycan be used to terminate digital signals to the connector(s) your applicationrequires. Figure5 and Table3 list the pin assignments and wiringinformation necessary for connecting the TB-2709 to DIO signals.Figure 5. 14-Pin Digital I/O ConnectorTable 3. TB-2709 Wiring Information for 14-Pos MFIT-PigtailCable Assembly(Part Number194123-01)Pin Number Wire Color Signal Name1Black D GND1Brown D GND2Red P0.03Orange P0.14Yellow P0.25Green P0.36Blue CTR 0 OUT7Violet D GND7Gray D GND8White P0.4© National Instruments Corporation7NI TB-2709 Installation GuideNI TB-2709 Installation Guide Table 4 lists the National Instruments cables available for connecting the TB-2709 to both analog and digital user signals.SpecificationsThis section lists the specifications of the TB-2709. These specifications are typical at 25 °C unless otherwise specified.Input/OutputRefer to the documentation for your PXI-6123/6133 or PXI-6122/6132 S Series device to determine the input/output specifications for your application.CautionDo not apply an input voltage greater than 42V pk /60VDC to the TB-2709. Inputvoltages greater than 42V pk /60VDC can damage the TB-2709 and any device connected to it, including the host computer. Overvoltage can also cause an electric shock hazard for the operator. National Instruments is not liable for damage or injury resulting from such misuse.9White/Black P0.510White/Brown P0.611White/Red P0.712Drain Wire CHASSIS GND 13White/Orange CTR 1 OUT 14White/YellowPFI 9Table 4. TB-2709 Cabling OptionsCableLength Part Number SMB-100, SMB Female to BNC Female Coaxial, 50Ω0.6 m 763389-01SMB110, SMB to BNC Male Coaxial, 50Ω1 m 763405-0114-Pos MFIT-Pigtail Cable Assembly1 m194123-01Table 3. TB-2709 Wiring Information for 14-Pos MFIT-Pigtail Cable Assembly (Part Number 194123-01) (Continued)Pin NumberWire Color Signal NamePhysicalDimensionsHeight..............................................10.7 × 8.6 × 2.0 cm(4.2 × 3.4 × 0.8 in.)Weight.............................................144.6 g (5.1oz)I/O connectors68-position SCSI-II type.................1, femaleSMB jacks (9)14-pin auxiliary connector..............One, Molex 14-pin microfitconnectorShock and VibrationOperational shock..................................30 g peak, half-sine, 11 ms pulse(Tested in accordance withIEC-60068-2-27. Test profiledeveloped in accordance withMIL-PRF-28800F.)Random vibrationOperating........................................5 to 500 Hz, 0.3 g rmsNonoperating..................................5 to 500 Hz, 2.4 g rms(Tested in accordance withIEC-60068-2-64. Nonoperatingtest profile exceeds therequirements ofMIL-PRF-28800F, Class 3.)EnvironmentThe NI TB-2709 is intended for indoor use only.Operating temperature............................0 to 55 °CStorage temperature...............................–20 to 70 °CRelative humidity...................................10 to 90% noncondensingPollution Degree (2)© National Instruments Corporation9NI TB-2709 Installation GuideNI TB-2709 Installation Guide SafetyThis product is designed to meet the requirements of the following standards of safety for electrical equipment for measurement, control, and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1, CSA 61010-1Note For UL and other safety certifications, refer to the product label, or visit /certification , search by model number or product line, and click the appropriate linkin the Certification column.Waste Electrical and Electronic Equipment (WEEE)EU Customers At the end of their life cycle, all products must be sent to a WEEE recyclingcenter. For more information about WEEE recycling centers and National Instruments WEEE initiatives, visit /environment/weee.htm .Where to Go for SupportThe National Instruments Web site is your complete resource for technical support. At /support you have access to everything fromtroubleshooting and application development self-help resources to email and phone assistance from NI Application Engineers.A Declaration of Conformity (DoC) is our claim of compliance with the Council of the European Communities using the manufacturer’sdeclaration of conformity. This system affords the user protection for electronic compatibility (EMC) and product safety. You can obtain the DoC for your product by visiting /certification . If your product supports calibration, you can obtain the calibration certificate for your product at /calibration .National Instruments corporate headquarters is located at 11500North Mopac Expressway, Austin, Texas, 78759-3504.National Instruments also has offices located around the world to help address your support needs. For telephone support in the United States, create your service request at /support and follow the calling instructions or dial 5127958248. For telephone support outside the United States, contact your local branch office:Australia 1800300800, Austria 43662457990-0, Belgium 32(0)27570020, Brazil 551132623599, Canada 8004333488, China 862150509800,Czech Republic 420224235774, Denmark 4545762600,Finland385(0)972572511, France33(0)148142424,Germany49897413130, India918041190000, Israel97236393737,Italy3902413091, Japan81354722970, Korea820234513400,Lebanon961(0)1332828, Malaysia1800887710,Mexico018000100793, Netherlands31(0)348433466,New Zealand0800553322, Norway47(0)66907660,Poland48223390150, Portugal351210311210, Russia74957836851,Singapore180********, Slovenia38634254200,South Africa270118058197, Spain34916400085,Sweden46(0)858789500, Switzerland41562005151,Taiwan8860223772222, Thailand6622786777,Turkey902122793031, United Kingdom44(0)1635523545© National Instruments Corporation11NI TB-2709 Installation GuideNational Instruments, NI, , and LabVIEW are trademarks of National Instruments Corporation.Refer to the Terms of Use section on /legal for more information about NationalInstruments trademarks. Other product and company names mentioned herein are trademarks or tradenames of their respective companies. For patents covering National Instruments products, refer to theappropriate location: Help»Patents in your software, the patents.txt file on your CD, or/patents.© 2006–2007 National Instruments Corporation. All rights reserved.374268B-01Apr07。
User Manual V F D-LVARIABLE SPEED AC MOTOR DRIVE115V/230V 25W – 100WHIGH PERFORMANCE / EASY CONTROL AC DRIVEASIADELTA ELECTRONICS, INC. TAOYUAN Plant/31-1, SHIEN PAN ROAD,KUEI SAN INDUSTRIAL ZONE TAOYUAN 333, TAIWAN TEL: 886-3-362-6301FAX: 886-3-362-7267/acdrives NORTH/SOUTH AMERICADELTA PRODUCTSCORPORATIONSales Office/P.O. BOX 121735101 DAVIS DRIVERTP, NC 27709 U. S. A.TEL: 1-919-767-3813FAX: 1-919-767-3969/acdrivesEUROPEDELTRONICS (Netherlands) B.V.Sales Office/Industriegebied Venlo Nr. 9031Columbusweg 20NL-5928 LC VenloThe NetherlandsTEL: 31-77-324-1930FAX: 31-77-324-1931PrefaceThank you for choosing Delta’s high-performance VFD-L Series. VFD-L Series are manufactured by adopting high-quality components, material and incorporating the latest microprocessor technology available.This manual will be helpful in the installation, parameter setting, troubleshooting, and daily maintenance of the AC motor drives. To guarantee safe operation of the equipment, read the following safety guidelines before connecting power to the AC motor drives. Keep this operating manual handy and distribute to all users for reference.Receiving and InspectionThis VFD-L AC drive has gone through rigorous quality control tests at the factory before shipment. After receiving the AC motor drive, please check for the following:ReceivingCheck to make sure that the package includes an AC drive and the User Manual.Inspect the unit to insure it was not damaged during shipment.Make sure that the part number indicated on the nameplate corresponds with the part number of your order.Nameplate Information:VFD 001 L 21 AVersion TypeVFD-L SeriesApplicable motor capacity001:60/100(W)40W:25/40(W)Series NameInput VoltageT 2 01 007Production numberProduction weekProduction year 2002Production factory (Taoyuan)o C (158o F), during the operation. Do notStorage and InstallationsStorage:The AC drive should be kept in the shipping carton before installation. In order to retain the warranty coverage, the AC drive should be stored properly when it is not to be used for an extended period of time. Ambient Conditions:OperationAir Temperature:Atmosphere pressure:Installation Site Altitude:Vibration:-10o C to +40o C (14o F to 122o F)86 to 106 kPabelow 1000mMaximum 9.86 m/s2 (1G) at less than 20HzMaximum 5.88 m/s2 (1G) at 20Hz to 50HzStorageTemperature:Relative Humidity:Atmosphere pressure:-20o C to + 60o C (-4o F to 140o F)Less than 90%, no condensation allowed86 to 106 kPaTransportationTemperature:Relative Humidity:Atmosphere pressure:Vibration:-20o C to +60o C (-4o F to 140o F)Less than 90%, no condensation allowed86 to 106 kPaMaximum 9.86 m/s2 (1G) at less than 20HzMaximum 5.88 m/s2 (1G) at 20Hz to 50HzInstallations and Connection:Any Electrical or mechanical modification to this equipment without prior written consent of Delta Electronics, Inc. will void all warranties and may result in a safety hazard in addition to voiding the UL listing.Short Circuit Withstand:Suitable for use on a circuit capable of delivering not more than 5,000 rms symmetrical amperes, for 230V Models, the maximum is 240 Volts.Improper installation of the AC drive will greatly reduce its life. Be sure to observe the following precautions when selecting a mounting location. Failure to observe these precautions may void the warranty!Do not mount the AC drive near heat-radiating elements or in direct sunlight.Do not install the AC drive in a place subjected to high temperature, high humidity, excessive vibration, corrosive gases or liquids, or airborne dust or metallic particles.Mount the AC drive vertically and do not restrict the airflow to the heat sink fins.The AC drive generates heat. Allow sufficient space around the unit for heat dissipation as shown in the figure shown next page:310cm10cm5cm 5cm5cmConnections:Installations intended to meet UL and CUL requirements must follow the instructions provided in “Wiring Notes” section below as a minimum standard. Where local codes exceed these requirements, they must also be followed. Refer to the technical data label affixed to the AC drive and the motor nameplate for electrical data.Basic Wiring DiagramUsers must connect wiring according to the following circuit diagram shown below.L/L1N/L2U/T1V/T2W/T3IMRS-485 Serial Interface1EV 2GND 3SG 4SG+PIN 1 & 2 are the power source for the digital keypad and should not be used while using RS-485communication.：＋：：－：FWD/REV RUN/STOPDigital SignalCommon TerminalFault Output(Open Collector)Wire Gauge: 22-14 AWG Torque: 10kgf-cm(8.7 in-lbf)*NOTE*: Do not plug a Modem or telephone line to the RS-485 communication port,permanent damage may result. Terminals 2 & 5 are the power sources for the optional copy keypad and should not be used while using RS-485 communication.Control Circuit Wiring: wire gauge 22-14AWG, torque 10kgf-cm (8.7 in-lbf)Terminal symbolsTerminal namesRemarks M0 RUN/STOPNormally Open contact, AC drive startsoperation when closes.M1 FWD/REVNormally Open contact, AC drive startsreverse motion when closes.MO1 Fault Indication When error is detected, MO1 will close.RS-485Serial Communication Port When DIP Switch 7 is ON, the drive is controlled by RS-485.DCM Digital Signal Common Ground for M0, M1 and M01Front Panel Control DiagramGREEN POWER LED RED ERROR LED (Please refer totroubleshooting & Fault Information)0.05510305Accel/Decel Time(Sec)UnitAccel/Decel Time Knob (sec.)0110100Output frequency (%)9Unit Output Frequency Knob (Hz)Switch Setting Descriptions:The DIP Switches can only be changed when AC drive is in a stopped mode. Indicates the position of the switch (ON/OFF).CommunicationThere is three control modes: RS-485 communication, AC drive front panel, and external terminals. Only one mode can be used at a time and is selected by DIP Switch 6 and 7. Programming can only be done when the AC drive is in stopped mode.DIP switch settings for controlDIP Switch 6 determines if control is via the AC drives front panel or external terminals. Set DIP switch6 to OFF for AC drive front panel control and ON for external terminal controlDIP Switch 7 determines if control is local or via RS-485 communication. When DIP Switch 7 is OFF, the AC drive front panel or external terminals control the drive.Note: The parameters set via RS-485 communication will remain in memory. Users can still read the status of the AC drive via RS-485 communication, but cannot send any control commands.When DIP Switch 7 is ON, the drive is controlled by RS-485 communication. Please verify the AC drive is fully stopped prior to turn DIP Switch 7 ON. If DIP Switch 7 is turned ON during operation, the error LED will illuminate.Computer ControlsEach VFD-L AC Drive has a pre-assigned communication address specified by DIP Switch pins 1 to 6 (Refer to the description of setting up address). VFD-L type Communication agreement: Modbus ASCII mode, protocol <7, N, 2>, Baud rate 9600. The computer then controls each AC Drive according to its communication address.ASCII Modes:Each 8-bit data is the combination of two ASCII characters. For example, a 1-byte data: 64 Hex, shown as ‘64’ in ASCII, consists of ‘6’ (36Hex) and ‘4’ (34Hex).Character ‘0’ ‘1’ ‘2’ ‘3’ ‘4’ ‘5’ ‘6’ ‘7’ASCII code 30H 31H 32H 33H 34H 35H 36H 37HCharacter ‘8’ ‘9’ ‘A’ ‘B’ ‘C’ ‘D’ ‘E’ ‘F’ASCII code 38H 39H 41H 42H 43H 44H 45H 46HData Format10-bit character frame (For 7-bit character): (7, N, 2)Startbit0123456Stop bit7-data bits10-bits character frame Stop bitAC Drive Addresses for RS-485 CommunicationVFD-L series communication addresses are 1 to 63, since 0 means broadcast to all AC drives. A DIP Switch sets to ON for equal to 1 and OFF for equal to 0.If DIP Switch 7 is OFF during power up, the communication address for the drive is 0008H, this is address 1 (factory default).If DIP Switch 7 is ON during power up, the address settings are determined by the ON/OFF positions of DIP Switches 1 to 6. Address 1 is when all switches are set to the OFF position. Switch “1” is the upper bit and switch 6 is the lower bit.(A) The addresses will remain in memory when the control mode changes to AC drive panel or externalterminals.(B) The addresses will remain in memory when parameters are reset.To save new addresses, remove power from the drive, set DIP switch 7 to ON and reapply power to the drive, at this time the new addresses will be read.Communication ProtocolCommunication Data Frame:STX Start character ‘:’ (3AH) ADR 1ADR 0 Communication address: 8-bit address consists of 2 ASCII codesCMD 1CMD 0Command code: 8-bit command consists of 2 ASCII codesDATA (n-1) ToDATA 0Contents of data:n ×8-bit data consist of 2n ASCII codes. n<=25, maximum of 50 ASCII codes LRC CHK 1LRC CHK 0 LRC check sum: 8-bit check sum consists of 2 ASCII codesEND 1 End characters: END1 = CR (0DH), END0 = LF (0AH) END 0ADR (Communication Address)Valid communication addresses are in the range of 1 to 63. Communication address equal to 0, means broadcast to all AC drives. In this case, the AMD will not reply any message to the master device. CMD (Command code) and DATA (data characters)The format of data characters depends on the command code. The available command codes are described as followed:Command code: 03H, read N words. The maximum value of N is 12. For example, reading continuous 2 words from starting address 2102H of AMD with address 01HCommand code: 06H, write 1 word For example, writing 6000 (1770H) to address 2001H of AMD with address 01H. Command message: Response message: Command message: Response message:STX ‘:’ STX ‘:’ STX ‘:’ STX ‘:’ ‘0’ ‘0’ ‘0’ ‘0’ ADR 1 ADR 0 ‘1’ ADR 1 ADR 0 ‘1’ ADR 1 ADR 0 ‘1’ ADR 1 ADR 0 ‘1’ ‘0’ ‘0’ ‘0’ ‘0’ CMD 1 CMD 0‘3’CMD 1 CMD 0‘3’CMD 1 CMD 0 ‘6’ CMD 1 CMD 0 ‘6’‘2’‘0’‘2’‘2’ ‘1’ Number of data (byte)‘4’ ‘0’‘0’‘1’ ‘0’ ‘7’‘0’ ‘0’ ‘7’ Starting data address ‘2’ Content of starting data address 2102H ‘0’Data address ‘1’ Data address ‘1’ ‘0’ ‘0’ ‘1’ ‘1’ ‘0’ ‘0’ ‘7’‘7’ ‘0’‘0’ ‘7’ ‘7’ Number of data (Count by word) ‘2’ Content of data address 2103H ‘0’ Data content ‘0’ Data content‘0’ ‘D’ ‘7’ “5’‘5’ LRC CHK 1 LRC CHK 0 ‘7’LRC CHK 1 LRC CHK 0 ‘1’ LRC CHK 1 LRC CHK 0 ‘1’LRC CHK 1 LRC CHK 0 ‘1’ CR CR CRCR END 1 END 0 LF END 1 END 0 LF END 1 END 0 LFEND 1 END 0 LFCHK (check sum)LRC (Longitudinal Redundancy Check) is calculated by summing up the values of the bytes from ADR1 to last data character then calculating the hexadecimal representation of the 2’s-complement negation of the sum. For example, using the command message of above:STX ‘:’ ‘0’ ADR 1 ADR 2 ‘1’ ‘0’ CMD 1 CMD 2 ‘3’‘2’‘1’ ‘0’STARTING DATA ADDRESS ‘2’‘0’‘0’‘0’NUMBER OF DATA ‘2’‘D’ LRC CHK 1 LRC CHK 0 ‘7’ CR END 1 END 0 LF01H+03H+21H+02H+00H+02H=29H, the2’s-complement negation of 29H is D7H.Parameters (saved in the EEPROM) : the parameter can be set during the operation.ParameterParameter Function Parameter SettingFactory SettingCustomer Setting 0 Identity code of Drive Depend on drive Read only1 Rating current Depend on drive 1 Read/Write2 Parameter Reset 10: Reset 0 Read/Write3 Max. Operation Freq. 0: 50 Hz 1: 60 Hz2: 100 Hz 3: 120 Hz1Read Only 4 Accel/Decel Time 0.05 to 30.00 sec 5.00 Read/Write 5 Reverse Inhibit 0: Reverse disable1: Reverse enable1Read/Write 6 Torque Increase 0: High Torque1: Low Torque 1Read/Write 7 Electronic Thermal 0: 25/60 w1: 40/100 w 1Read/Write 8 Communication Addresses 01 to 63 1 Read/Write 9Software VersionRead only #.#Read OnlyAddress List:The contents of available addresses are shown as below:Content: Address: Function:AC driveParametersnnnnH nnnn means parameter number, for example, the address of 0004 is 0004H. When reading parameter by command code 03H, only oneparameter can be read at one time.Bit 0 to 100B: No function 01B: Stop10B: Run11B: No functionBit 2 to 3 ReservedBit 4 to 500B: No function 01B: FWD 10B: REV11B: Change direction2000HBit 6 to 15 Reversed2001H Frequency commandBit 0 1: ReversedBit 1 1: ResetCommand Write only 2002H Bit 2-15 ReservedContent:Address:Function:2100HError Codes00: No error occurred 01: Over-current (oc) 02: Over-voltage (ov) 03: Overheat (oH) 04: Overload (oL) 05, 06: Reserved 07: CPU failure (cF3) 08 to 13: Reserved 14: Low voltage (Lv) 15: CPU failure 1 (cF1) 16: CPU failure 2 (cF2) 17 to 19: Reserved 20: Software protection 21: Operation error22: OH Hardware failure cF3.1 23: OV Hardware failure cF3.2 24: LV Hardware failure cF3.326: Hardware failure cF3.5 (current detection) 30: Hardware failure hpf.2 31: Hardware failure hpf.3Bit 0 to 100: STOP01: Ramp stop10: Zero speed 11: OperationBit 2 ReservedBit 3 to 400: Forward motion01: from Reverse to Forward motion10: from Forward to Reverse motion 11: Reverse motionBit 5 to 9 ReservedBit 101: Operation commands are controlledby communication interface.2101HBit 11 to 15 Reserved2102H Frequency Command F (XXX.XX) 2103H Output Frequency H (XXX.XX) 2104H Output Current A (X.XX) 2105H DC-BUS Voltage (XXX) Status monitor (Read only)2106HOutput Voltage E (XXX.X)Exception Responses:Except for broadcast messages, the AC drive is been expected to return a normal response after receiving command messages from the master device. The following depicts the conditions that no normal response is replied to the master device.The AC drive does not receive the messages due to a communication error; thus, the AC drive has no response. The master device will eventually process a timeout condition.The AC drive receives the messages without a communication error, but cannot handle it, an exception response will return to the master device. In the exception response, the most significant bit of the original command code is set to 1, and an exception code explains the condition that caused the exception is returned. An example of exception response of command code 06H and exception code 02H:STX ‘:’ 3AH‘0’ 30HADDRESS 1ADDRESS 0 ‘1’ 31HFUNCTION(CMD) 1 ‘8’ 38HFUNCTION(CMD) 0 ‘6’ 36H‘0’ 30HEXCEPTIONCODE ‘2’ 32H‘7’ 43HLRC CHK 1LRC CHK 0 ‘7’ 46HCR 0DHEND 1END 0 LF 0AHThe explanation of exception codes:Exception codes: Explanation01 Illegal command code:The command code received in the command message is not available for the AC drive.02 Illegal data address:The data address received in the command message is not available for the AC drive.03 Illegal data value:The data value received in the command message is over range for the AC drive.04 Slave device failure:The AC drive is unable to perform the requested action.09 Check Sum Error: Check if the Check Sum is correct.20 Watchdog Timer: The timer will reset to 0 after each valid MODBUScommunication message is received.12Maintenance and InspectionsModern AC drives are based on solid state electronics technology, preventive maintenance is required to operate this AC drive in its optimal condition, and to ensure a long life. It is recommended to perform a monthly check up of the AC drive by a qualified technician. Before the check up, always turn off the AC Input Power to the unit. Wait at least 2 minutes after all display lamps have gone out, and then confirm that the capacitors have fully discharged.Periodic Inspection:Basic check up items to detect if there were any abnormality during the operation.1. Whether the motors are operating as expected.2. Whether the installation environment is abnormal.3. Whether the cooling system is operating as expected.4. Whether any irregular vibration or sound occurred during the operation.5. Whether the motors are overheated during the operation.6. Always check the input voltage of the AC drive with Voltmeter.Periodic Maintenance:It is necessary to stop the motor operation during the check up.1. Tighten and reinforce the screws of the AC drive if necessary, cause it may loose due tothe vibration or changing of temperatures.2. Whether the conductors or insulators were corroded and damaged.3. Check the resistance of the insulation with Megaohmeter.4. Often check and change the capacitors and relays.5. If use of the AC drive is discontinued for a long period of time, turn the power on at leastonce every two years and confirm that it still functions properly. To confirm functionality, disconnect the motor and energize the AC drive for 5 hours or more before attempting to run a motor with it.6. Clean off any dust and dirt with a vacuum cleaner. Place special emphasis on cleaningthe ventilation ports and PCBs. Always keep these areas clean, as adherence of dust and dirt can cause unforeseen failures.Fuse and Fuse Breaker (NFB) Specifications:Model Ampere Rating (A)Manufacturer (Reference)40W 115V 6.0A Busmann - JJN-6 300V40W 230V 3.0A Busmann - JJN-3 300V100W 115V 10.0A Bssmann - JJN-10 300V100W 230V 6.0A Bssmann - JJN-6 300VTroubleshooting and Fault InformationThe AC drive has a comprehensive fault diagnostic system that includes several different alarms and fault message. Once a fault is detected, the corresponding protective functions will be activated to shut down the AC drive output. Below are the fault descriptions, for a fault shown on the AC drive digital keypad. After fault has been cleared, switch theRun/Stop key to stop mode to reset the drive.Fault Display Fault Descriptions Corrective ActionsAlarm LED lighten afterpower on Hardware failure Return to the factoryAlarm LED flashes once in every two seconds The AC drivedetects anabnormal increasein current(Over-current)1. Increase the acceleration time2. Check whether the motor output powercorresponds to the AC drive outputpower3. Check the wiring connection between theAC drive and motor for possible shortcircuit4. Check for possible over loadingconditions at the motorAlarm LED flashes twice in every two seconds (Over-voltage) The AC drivedetects that theDC-BUS voltagehas exceeded itsmaximumallowable value1. Check whether the input voltage fallswithin the rated AC Drive input voltage.2. Check for possible voltage transients.3. Bus over-voltage may be caused bymotor regeneration, increase theaccel/decel time.Alarm LED flash thrice in every two seconds (Overload) Motor overload1. Check for possible motor overload.2. Adjust torque detection setting of the DIPSW4 to an appropriate setting.3. Increase the AC Drive’s output capacity.Alarm LED flashes four times in every two seconds(Over-heating) The AC drivetemperaturesensor detectsexcessive heat.1. Ensure that the ambient temperaturefalls within the specified temperaturerange.2. Make sure that the ventilation holes arenot obstructed.3. Provide enough spacing for adequateventilation.Alarm LED flashes five times in every two seconds(Low voltage) The AC drivedetects that theDC Bus Voltagehas fallen belowits minimum value.Check whether the input voltage falls withinthe rated AC Drive input voltage.Alarm LED flashes Change DIP SWwhile drive isrunningSwitch the Run/Stop key to Stop mode toreset the AC drive.Standard Specifications。
Nonionic surfactantsLutensol®A 4 N C12C14-Fatty alcohol+ 4 EO ca. 62/ELutensol®A 7 N+7 EO ca. 56/A Lutensol®A 79 N+7 EO90 %,ca. 56/A Lutensol®A 8+8 EO90 %,ca. 52/ALutensol®AT 11C16C18-Fatty alcohol+11 EO ca. 87/ALutensol®AT 18+18 EO ca. 92/B Lutensol®AT 18 Solution+18 EO20 %,ca. 92/B Lutensol®AT 25 Powder+25 EO ca. 95/B Lutensol®AT 25 E+25 EO ca. 95/B Lutensol®AT 25 Flakes+25 EO ca. 95/B Lutensol®AT 50 Powder+50 EO ca. 92/B Lutensol®AT 50 Flakes+50 EO ca. 92/B Lutensol®AT 80 Powder+80 EO ca. 87/B Lutensol®AT 80 E+80 EO ca. 87/B Lutensol®AT 80 Flakes+80 EO ca. 87/BLutensol®AO 3C13C15-Oxo alcohol+ 3 EO ca. 45/ELutensol®AO 4+ 4 EO ca. 57/E Lutensol®AO 5+ 5 EO ca. 62/E Lutensol®AO 7+7 EO ca. 43/A Lutensol®AO 79+7 EO90 %,ca. 43/A Lutensol®AO 8+8 EO ca. 52/A Lutensol®AO 89+8 EO90 %,ca. 52/A Lutensol®AO 109+10 EO90 %,ca. 80/A Lutensol®AO 11+11 EO ca. 86/A Lutensol®AO 30+30 EO ca. 91/B Lutensol®AO 3109+3/+10EO 90 %,ca. 73/ELutensol®TO 2C13-Oxo alcohol+ 2 EO ca. 37/DLutensol®TO 3+ 3 EO ca. 40/E Lutensol®TO 5+ 5 EO ca. 62/E Lutensol®TO 6+ 6 EO ca. 67/E Lutensol®TO 65+6,5 EO ca. 68/D Lutensol®TO 7+7 EO ca. 70/E Lutensol®TO 79+7 EO90 %,ca. 70/E Lutensol®TO 8+8 EO ca. 60/A Lutensol®TO 89+8 EO90 %,ca. 60/A Lutensol®TO 10+10 EO ca. 70/A Lutensol®TO 109+10 EO85 %,ca. 70/A Lutensol®TO 11+11 EO ca. 70/B Lutensol®TO 12+12 EO ca. 75/B Lutensol®TO 129+12 EO85 %,ca. 75/B Lutensol®TO 15+15 EO ca. 80/B Lutensol®TO 20+20 EO ca. 86/B Lutensol®TO 389+3 /+8EO90 %,ca. 70/E Unless otherwise indicated, the product concentration is 100% Cloud point in °C according to EN 1890Method A: 1 g of surfactant + 100 g of dist. WaterMethod B: 1 g of surfactant + 100 g of NaCl solution (c = 50 g/l) Method C: 1 g of surfactant + 100 g of NaCl solution (c = 100 g/l) Method D: 5 g of surfactant + 45 g of butyldiglycol solution(c = 250 g/l)Method E: 5 g of surfactant + 25 g of butyldiglycol solution(c = 250 g/l)Lutensol®XP 30C10-Guerbet alcohol+ 3 EO ca. 31/ELutensol®XP 40+ 4 EO ca. 44/E Lutensol®XP 50+ 5 EO ca. 56/E Lutensol®XP 60+ 6 EO ca. 62/E Lutensol®XP 69+ 6 EO85 %,ca. 62/E Lutensol®XP 70+7 EO ca. 68/E Lutensol®XP 79+7 EO85 %,ca. 68/E Lutensol®XP 80+8 EO ca. 56/A Lutensol®XP 89+8 EO85 %,ca. 56/A Lutensol®XP 90+9 EO ca. 69/A Lutensol®XP 99+9 EO85 %,ca. 69/A Lutensol®XP 100+10 EO ca. 80/A Lutensol®XP 140+14 EO ca. 78/BLutensol®XL 40C10-Guerbet alcohol+ 4 EO ca. 43/ELutensol®XL 50alkoxylate+ 5 EO ca. 58/E Lutensol®XL 60+ 6 EO ca. 65/E Lutensol®XL 70+7 EO ca. 68/E Lutensol®XL 79+7 EO85 %,ca. 68/E Lutensol®XL 80+8 EO ca. 56/A Lutensol®XL 89+8 EO85 %,ca. 56/A Lutensol®XL 90+9 EO ca. 69/A Lutensol®XL 99+9 EO ca. 69/A Lutensol®XL 100+10 EO ca. 80/A Lutensol®XL 140+14 EO ca. 78/BLutensol®ON 30C10-Oxo alcohol+ 3 EO ca. 53/ELutensol®ON 50+ 5 EO ca. 67/E Lutensol®ON 60+ 6 EO ca. 36/A Lutensol®ON 66+6,5 EO ca. 53/A Lutensol®ON 70+7 EO ca. 60/A Lutensol®ON 80+8 EO ca. 80/A Lutensol®ON 110+11 EO ca. 78/B Lutensol®AP 6Alkylphenol+ 6 EO ca. 61/E Lutensol®AP 7+7 EO ca. 62/E Lutensol®AP 8+8 EO ca. 34/A Lutensol®AP 9+9 EO ca. 51/A Lutensol®AP 10+10 EO ca. 60/A Lutensol®AP 14+14 EO ca. 76/B Lutensol®AP 20+20 EO ca. 85/B Lutensol®FA 12Oleyl amine+12 EO ca. 86/B Lutensol®FA 12 K Coco amine+12 EO ca. 92/B Lutensol®FA 15 T Tallow amine+15 EO ca. 97/B Lutensol®FSA 10Oleic acid amine+10 EO ca. 85/E Lutensol®GD 70Alkyl polyglucoside70 %,>100/BLow-foaming nonionic surfactantsPlurafac®LF 120Fatty alcohol alkoxylate ca. 28/A Plurafac®LF 22095 %,ca. 42/A Plurafac®LF 22195 %,ca. 33/A Plurafac®LF 22398 %,ca. 33/E Plurafac®LF 224ca. 27/E Plurafac®LF 226ca. 28/A Plurafac®LF 300ca. 22/A Plurafac®LF 301ca. 32/E Plurafac®LF 303ca. 29/E Plurafac®LF 305ca. 38/E Plurafac®LF 400ca. 33/A Plurafac®LF 401ca. 74/A Plurafac®LF 403ca. 41/E Plurafac®LF 404ca. 45/E Plurafac®LF 40595 %,ca. 55/E Plurafac®LF 500ca. 32/E Plurafac®LF 600ca. 55/A Plurafac®LF 711ca. 45/E Plurafac®LF 1300ca. 21/E Plurafac®LF 1430Amine alkoxylate ca. 35/A Plurafac®SLF-18B4590 % Fatty alcohol alkoxylate 90 %,ca. 21/E Plurafac®LF 131Fatty alcohol alkoxylate, end-capped ca. 35/E Plurafac®LF 132ca. 30/E Plurafac®LF 231ca. 28/E Plurafac®LF 431ca. 39/E Pluronic®PE 3100PO–EO-block polymer10 % EO ca. 41/E Pluronic®PE 350050 % EO ca. 68/A Pluronic®PE 430030 % EO ca. 61/E Pluronic®PE 610010 % EO ca. 23/A Pluronic®PE 612012 % EO ca. 41/E Pluronic®PE 620020 % EO ca. 33/A Pluronic®PE 640040 % EO ca. 60/A Pluronic®PE 680080 % EO ca. 88/B Pluronic®PE 740040 % EO ca. 60/A Pluronic®PE 810010 % EO ca. 36/E Pluronic®PE 920020 % EO ca. 49/E Pluronic®PE 940040 % EO ca. 80/E Pluronic®PE 1010010 % EO ca. 35/E Pluronic®PE 1030030 % EO ca. 71/E Pluronic®PE 1040040 % EO ca. 81/A Pluronic®PE 1050050 % EO ca. 75/B Pluronic®PE 10500 Solution50 % EO,18 %,ca. 75/B Pluronic®RPE 1720EO-PO-block polymer20 % EO ca. 37/E Pluronic®RPE 174040 % EO ca. 51/E Pluronic®RPE 203535 % EO ca. 41/E Pluronic®RPE 252020 % EO ca. 31/E Pluronic®RPE 252525 % EO ca. 38/E Pluronic®RPE 311010 % EO ca. 25/E Tetronic®RED 9040Ethylene diamineEO- PO- block polymer40 % EO ca. 48/A AminopolyolQuadrol®L Ethylene diamine + 4 POPolyalkylene glykolsPluriol®A 010 R Allyl alcohol ethoxylatePluriol®A 11 RE Allyl alcohol alkoxylatePluriol®A 13 RPluriol®A 22 RPluriol®A 23 RPluriol®A 308 R Butyne-1,4-diol ethoxylatePluriol®A 350 E Methylpolyethylene glycol M 350 Pluriol®A 500 E M 500 Pluriol®A 750 E1)M 750 Pluriol®A 760 E M 750 Pluriol®A 1000 E M 1000 Pluriol®A 1020 E1)M 1000 Pluriol®A 2000 E M 2000 Pluriol®A 3010 E1)M 3000 Pluriol®A 5010 E1)M 5000 Pluriol®A 1000 PE Alkyl polyalkylene glykol M 1000 Pluriol®A 1320 PE1)M 1400 Pluriol®A 2000 PE M 2000 Pluriol®A 2020 PE1)M 2000 Pluriol®A 1350 P Alkyl polypropylene glykol M 1350 Pluriol®A 2000 P M 2000 Pluriol®A 3 TE Modified polyglycol ether M 275 Pluriol®A 15 TE M 800 Pluriol®A 15 TERC M 800 Pluriol®A 18 TERC M 900 1)non filtratedPluriol®E 200Polyethylene glycol M 200 Pluriol®E 2052)M 200 Pluriol®E 300M 300 Pluriol®E 3052)M 300 Pluriol®E 400M 400 Pluriol®E 4052)M 400 Pluriol®E 600M 600 Pluriol®E 6052)M 600 Pluriol®E 1000M 1000 Pluriol®E 1500 E M 1500 Pluriol®E 1500 Powder M 1500 Pluriol®E 1500 Flakes M 1500 Pluriol®E 1505 Flakes2)M 1500 Pluriol®E 3400 E M 3400 Pluriol®E 3400 Powder M 3400 Pluriol®E 3400 Flakes M 3400 Pluriol®E 3405 E2)M 3400 Pluriol®E 3405 Flakes2)M 3400 Pluriol®E 4000 E M 4000 Pluriol®E 4000 Powder M 4000 Pluriol®E 4000 Flakes M 4000 Pluriol®E 4005 E2)M 4000 Pluriol®E 4005 Flakes2)M 4000 Pluriol®E 6000 E M 6000 Pluriol®E 6000 Powder M 6000 Pluriol®E 6000 Flakes M 6000 Pluriol®E 6005 E2)M 6000 Pluriol®E 6005 Flakes2)M 6000 Pluriol®E 8000 E M 8000 Pluriol®E 8000 Flakes M 8000Pluriol®E 8005 E2)M 8000 Pluriol®E 8005 Flakes2)M 8000 Pluriol®E 9000 Powder M 9000 Pluriol®E 9000 Fine Powder M 9000 Pluriol®E 9000 Flakes M 9000 Pluriol®P 400Polypropylene glycol M 430 Pluriol®P 600M 600 Pluriol®P 900M 900 Pluriol®P 2000M 2000 Pluriol®P 4000M 4000 2)Care - QualityReactive SolventsPluriol®BP 30 E Bisphenol A+ 3 EOPluriol®BP 40 E+ 4 EOPluriol®BP 60 E+ 6 EOPluriol®BP 100 E+ 10 EOEmulsifiersEmulan®A Oleic acid ethoxylate ca. 52/E Emulan®AF Fatty alcohol ethoxylate ca. 65/E Emulan®AT 9ca. 68/A Emulan®EL Castor oil ethoxylate97 %,ca. 71/B Emulan®EL 40ca. 72/E Emulan®ELH 6090 %,ca. 85/B Emulan®EL 200 Powder> 100/A Emulan®ELP ca. 51/E Emulan®LVA Oxo alcohol ethoxylate85 %,ca. 56/A Emulan®NP 3070Alkylphenol ethoxylate70 %,ca. 90/B Emulan®OC Fatty alcohol ethoxylate ca. 90/B Emulan®OC Solution30 %,ca. 90/B Emulan®OG ca. 92/B Emulan®OK 5ca. 62/E Emulan®OP 25Alkylphenol ethoxylate ca. 88/B Emulan®OU Fatty alcohol ethoxylate ca. 90/B Emulan®P ca. 52/E Emulan®PO Alkylphenol ethoxylate ca. 46/EEmulan®TO 2080C13-Oxo alcohol ethoxylate80 %,ca. 93/BEmulan®TO 307070 %,ca. 91/B Emulan®TO 407070 %,ca. 91/B Emulan®XCA 23Polyisobutene derivative70 % Emulphor®OPS 25Alkylphenol ether sulfate, sodium salt34 % Emulphor®NPS 2531 % Emulphor®FAS 30Fatty alcohol ether sulfate, sodium salt30 % SolubilizerEmulan®HE 50Alcohol ethoxylate ca. 72/B Emulan®EL S104Fatty alcohol alkoxylate ca. 56/E Ionic surfactantsLutensit®A-BO Dioctylsulphosuccinate, sodium salt60 % Lutensit®A-EP Acid phosphoric esterLutensit®A-ES Alkylphenol ether sulphate, 40 %sodium saltLutensit®A-FK Fatty acid condensation product,sodium salt55 % Lutensit®A-LBA Dodecylbenzenesulphonate, amine salt55 % Lutensit®A-LBS Dodecylbenzenesulphonic acid98 % Lutensit®A-PS Alkylsulphonate, sodium salt60 %Lutensit®AN 10Anionic/nonionic surfactant combinationbased on an alkylphenol ethoxylateLutensit®AN 30Anionic/nonionic surfactant combinationbased on a fatty alcohol ethoxylateLutensit®AN 40Mixture of nonionic surfactants andalkylcarboxylic acids70 % Lutensit®AN 45Mixture of nonionic surfactants andalkylcarboxylic acids80 % Lutensit®AN 50Anionic/nonionic surfactant combinationbased on a fatty alcohol ethoxylateNekal®BX Dry Alkylnaphthalenesulfonate, sodium salt68 %Nekal®BX Dry Paste60 %Nekal®BX Conc. Paste 40 %34 %Nekal®BX 30%22 %Nekal®BX Conc. Paste60 %Nekal®SBC Alkylnaphthalenesulphonic acid72 %Foam suppressorsDegressal®SD 20Fatty alcohol alkoxylateDegressal®SD 21Degressal®SD 22Degressal®SD 23Alkohol alkoxylateDegressal®SD 30Carbonylic esterDegressal®SD 40Phosphoric esterDispersing agentsPolycarboxylateSokalan®CP 5Maleic acid/Acrylic acid copolymer,sodium salt M 70 00040 % Sokalan®CP 5 Granules M 70 00092 % Sokalan®CP 5 Powder G M 70 00092 % Sokalan®CP 453)M 70 00045 % Sokalan®CP 45 Granules3)M 70 00092 % Sokalan®CP 7M 50 00040 % Sokalan®CP 7 Granules NL M 50 00092 % Sokalan®CP 9Maleic acid/olefin copolymer,sodium salt M 12 00025 % Sokalan®CP 9 Granules87 % Sokalan®CP 10Modified Polyacrylic acid,sodium salt M 4 00045 % Sokalan®CP 10 S Modified Polyacrylic acid M 4 00050 % Sokalan®CP 12 S M 3 00050 % Sokalan®CP 13 S M 20 00025 % Sokalan®PA 15Polyacrylic acid, M 1 20045 %sodium saltSokalan®PA 15 CL M 1 20045 % Sokalan®PA 20M 2 50045 % Sokalan®PA 20 PN3)M 2 50054 % Sokalan®PA 25 CL M 4 00045 % Sokalan®PA 25 CL Granules M 4 00092 % Sokalan®PA 25 CL PN3)M 4 00049 % Sokalan®PA 30M 8 00045 % Sokalan®PA 30 CL M 8 00045 % Sokalan®PA 30 CL Granules M 8 00092 % Sokalan®PA 30 CL PN48 % Sokalan®PA 30 CL PN Granules93 %please turn overSokalan®PA 40M 15 00035 % Sokalan®PA 40 Powder M 15 00092 % Sokalan®PA 70 PN3)M 70 00030 % Sokalan®PA 80 S Polyacrylic acid M 100 00035 % Sokalan®PA 110 S M 250 00035 % Special polymersSokalan®HP 22 G Nonionic copolymer M 24 00020 % Sokalan®HP 25Modified polycarboxylate M 3 00045 % Sokalan®HP 165Polyvinylpyrrolidone M 9 00030 % Sokalan®HP 50M 40 00095 % Sokalan®HP 53M 40 00030 % Sokalan®HP 53 K M 40 00030 % Sokalan®HP 56Vinylpyrrolidon/Vinylimidazolcopolymer M 70 00030 % Sokalan®HP 56 Granules M 70 00095 % Sokalan®HP 59Polyvinylpyrrolidon M 500 00045 % Sokalan®HP 60M 1 000 00020 % Sokalan®HP 66Vinylpyrrolidon/VinylimidazolCopolymer modified41 % Sokalan®AF PolyetherSokalan®DCS Mixture of dicarboxylic acidsSokalan®PM 10 I Maleic acid copolymer, M 4 00044 %sodium saltSokalan®PM 15 I Modified polycarboxylate, 40 %sodium saltSokalan®PM 70M 4 00040 % Sokalan®SR 100Esterified polyether3)= partly neutralizedSulphonic acid condensation product/Sulfonates Tamol®NH 7519Naphthaline sulphonic acid condensation 95 % Tamol®NN 2406product, sodium salt21 % Tamol®NN 290131 % Tamol®NN 450145 % Tamol®NN 771895 % Tamol®NN 890695 % Tamol®NN 910495 % Tamol®NN 940195 % Tamol®PP Phenol sulphonic acid condensation,95 % Tamol®DN product, sodium salt95 % PolyethyleneiminesLupasol®FG Polyethylenimine M 80099 % Lupasol®FC M 80050 % Lupasol®G 20 waterfree M 1 30099 % Lupasol®G 20M 1 30050 % Lupasol®PR 8515M 2 00099 % Lupasol®G 35M 2 00050 % Lupasol®G 100M 5 00050 % Lupasol®WF M 25 00099 % Lupasol®HF M 25 00056 % Lupasol®G 500M 25 00040 % Lupasol®P M 750 00050 % Lupasol®PS M 750 00033 % Lupasol®PO 100M 5 00050 % Lupasol®HEO 1M 13 00080 % Lupasol®PN 50M 1 000 00050 % Lupasol®SK M 2 000 00024 %Chelating agentsTrilon®AS Nitrilotriacetic acid (NTA)99 %Trilon®A 92 R Trisodium salt of NTA92 %Trilon®A liquid40 %Trilon®BS Ethylenediaminetetraacetic acid (EDTA)99 %Trilon®B-A-T liquid Triammonium salt of EDTA50 %Trilon®B Powder Tetrasodium salt of EDTA87 %Trilon®BX Powder83 %Trilon®B liquid40 %Trilon®BX liquid40 %Trilon®BD Disodium salt of EDTA89 %Trilon®BVT Chelating agent with highspecification for iron (III)21 %Trilon®C liquid Pentasodium salt ofDiethylenetriaminepentaacetic acid (DTP)40 %Trilon®C liquid 50%50 %Trilon®D liquid Trisodium salt of Hydroxyethyl-ethylenediaminetriacetic acid (HEDTA)40 %Trilon®M liquid Trisodium salt of Methylglycinediacetic 40 %acid (MGDA)Trilon®M Powder83 %Trilon®M Granules73 %Trilon®P Liquiol Modified anionic Polyamine40 % Biocide% Protectol®BN2-Bromo-2-nitropropane-1,3-diol 99(Bronopol)Protectol®BN 3030 % Protectol®BN 1818 % Protectol®GA 50Glutaraldehyde50 % Protectol®GA 2424 % Protectol®PE Phenoxyethanol99 % Protectol®PE S99 % Protectol®PP Phenoxypropanol99 % Protectol®GL Glyoxal40 % Protectol®HT Hexahydrotriazine derivate76 % Protectol®TD Tetramethylolacetylene diurea47 % Protectol®DF Dimethoxytetrahydrofurane99 % Protectol®DZ Thiadiazin derivate99 % Protectol®DZ P99 % Protectol®DA2,4-Dichlorbenzyl alkohol98 % Protectol®DA S98 % Corrosion inhibitorsKorantin®BH solid2-Butine-1,4-diol> 98 % Korantin®BH 50> 50 % Korantin®LUB Acid phosphoric ester of a polyetherKorantin®MAT Alkanolamine salt of a nitrogenious, organic acidKorantin®PAT80 % Korantin®PM Propargylalcohol alkoxylate99,5 % Korantin®PP67 % Korantin®SMK Phosphoric monoesterWaxesPolyethylene waxesLuwax®A Ethylene homopolymer waxes withLuwax®AH 3different densities and molar massesLuwax®AH 6Luwax®AL 3Luwax®AL 61Luwax®AM 3Luwax®AM 6Luwax®AF 29Micronized polyethylene waxes withLuwax®AF 30different particle size distributionLuwax®AF 31Luwax®AF 32Luwax®PE 10 MLuwax®OA Oxidized polyethylene waxes, emulsifiableLuwax®OA 2Luwax®OA 3Luwax®OA 5Luwax®ES 9696Luwax®ES 9698Luwax®EVA 1Copolymer polyethylene waxesLuwax®EVA 3Luwax®EAS 3Luwax®EAS 4Luwax®EAS 5Polyether waxLuwax®V Polyvinyl ether waxMontanwaxesLuwax®S Montanic acid waxesLuwax®LSLuwax®E Montanic ester waxesLuwax®LGLuwax®LGE Montanic ester waxes, contains emulsifierLuwax®OP Partially saponified montanic ester waxWax emulsionsPoligen®WE 1Polyethylene wax emulsions35 % Poligen®WE 325 % Poligen®WE 421 % Poligen®WE 635 % Poligen®WE 739 % Poligen®WE 8 BW35 % Poligen®ES 9100235 % Poligen®ES 9100540 % Poligen®ES 9100920 %Specialty chemicals for the electroplatingand electronics industriesEspecially for formulators of the electroplating and printed circuit board industry the following products are offered:Golpanol®ALS Allyl sulfonate25 % Golpanol®ALS 3535 % Golpanol®ATPN Carboxyethylisothiuronium betaine> 98 % Golpanol®BEO Butyne diol ethoxylateGolpanol®BMP Butyne diol propoxylateGolpanol®BOZ Crystals Butyne diol> 98 % Golpanol®DEP Diethylaminopropyne97,5 % Golpanol®HD Hexyne diol80 % Golpanol®MPA Dimethylpropinylamine89 % Golpanol®PA Propargyl alcohol99,3 % Golpanol®PAP Propargyl alcohol propoxylate67 % Golpanol®PME Propargyl alcohol ethoxylateGolpanol®PS Propyne sulphonate20 % Golpanol®VS Vinyl sulphonate25,5 % Lugalvan®ANA Anisaldehyde> 98,5 % Lugalvan®BNO 12ß-Naphtol ethoxylate99 % Lugalvan®BNO 2475 % Lugalvan®BPC 48Benzylpyridinium carboxylate48 % Lugalvan®DC Aqueous dispersion of an ethylene copolymer21 % Lugalvan®EH 158Ethylhexanol ethoxylate80 % Lugalvan®G 15000Polyethyleneimine50 % Lugalvan®G 2050 % Lugalvan®G 3550 % Lugalvan®HS 1000Thiodiglykol ethoxylate> 98 % Lugalvan®IMZ Imidazole> 99,5 % Lugalvan®IZE Reaction product of imidazole45 %and epichlorohydrineLugalvan®NES Sodium salt of a sulphonatedalkylphenol ethoxylate40 % Basotronic®PVI Polyvinylimidazole, quarternized44 % Basotronic®PYR Pyrrole (electronic grade)> 99,9 % Lutron®HF 1Modified polyglykol etherLutron®HF 3Lutron®HF 8Mixture of varous alkoxylates, stabilizedLutron®KS 1Modified PolyglykoletherLutron®WF 20 DLutron®WF 21Lutron®WF 21 D Modified Polyglykolether, stabilizedLutropur®FEG 28Formaldehyde (electronic grade)28 % Lutropur®MSA Methanesulfonic acid (electronic grade)70 % Lutropur®Q 75Ethylendiamine + 4 PO75 % Lutropur®Q Ethylendiamine + 4 PO。
SEMITRANS ®3IGBT4 ModulesSKM200GAL17E4Features•IGBT4 = 4. generation medium fast trench IGBT (Infineon)•CAL4 = Soft switching 4. Generation CAL-Diode•Insulated copper baseplate using DBC Technology (Direct Copper Bonding) •With integrated Gate resistor•For switching frequenzies up to 8kHz •UL recognized, file no. E63532Typical Applications*•DC/DC – converter •Brake chopper•Switched reluctance motorRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°CAbsolute Maximum Ratings SymbolConditions Values UnitIGBT V CES T j =25°C 1700V I C T j =175°CT c =25°C 321A T c =80°C248A I Cnom 200A I CRMI CRM = 3xI Cnom 600A V GES -20...20V t psc V CC =1000V V GE ≤ 15V V CES ≤ 1700VT j =150°C10µs T j-40...175°C Inverse diode I F T j =175°CT c =25°C 213A T c =80°C 157A I Fnom200A I FRM I FRM = 2xI Fnom400A I FSM t p =10ms, sin 180°, T j =25°C1170A T j-40 (175)°C Freewheeling diode I F T j =175°CT c =25°C 213A T c =80°C157A I Fnom 200A I FRM I FRM = 2xI Fnom400A I FSM t p =10ms, sin 180°, T j =25°C1170A T j -40...175°C Module I t(RMS)500A T stg -40 (125)°C V isolAC sinus 50 Hz, t =1min4000VCharacteristics SymbolConditions min.typ.max.UnitIGBT V CE(sat)I C =200A V GE =15V chiplevel T j =25°C 1.90 2.20V T j =150°C 2.30 2.60V V CE0chiplevel T j =25°C 0.80.9V T j =150°C 0.70.8V r CE V GE =15V chiplevelT j =25°C 5.50 6.50m ΩT j =150°C8.009.00m ΩV GE(th)V GE =V CE , I C =8mA 5.25.86.4V I CES V GE =0V V CE =1700V T j =25°C 2.7mA T j =150°C mA C ies V CE =25V V GE =0Vf =1MHz 18nF C oes f =1MHz 0.68nF C res f =1MHz0.58nF Q G V GE =- 8 V...+ 15 V 1600nC R GintT j =25°C3.8Ωt d(on)VCC =1200V I C=200AV GE =+15/-15V R G on =2ΩR G off =2Ωdi/dt on =6830A/µs di/dt off =1120A/µs du/dt =5250V/µs T j =150°C 259ns t r T j =150°C 35ns E on T j =150°C 69mJ t d(off)T j =150°C 712ns t f T j =150°C 149ns E offT j =150°C79mJR th(j-c)per IGBT0.122K/W Inverse diodeV F = V EC I F =200AV GE =0V chiplevelT j =25°C 2.00 2.40V T j =150°C 2.15 2.57V V F0chiplevel T j =25°C 1.32 1.56V T j =150°C 1.08 1.22V r FchiplevelT j =25°C 3.4 4.2m ΩT j =150°C 5.4 6.8m ΩI RRM I F =200A di/dt off =5910A/µs V GE =±15VV CC =1200VT j =150°C 272A Q rr T j=150°C63µC E rr T j =150°C 45mJ R th(j-c)per diode0.276K/W Freewheeling diode V F = V EC I F =200AV GE =0V chiplevelT j =25°C 2.00 2.40V T j =150°C 2.15 2.57V V F0chiplevel T j =25°C 1.32 1.56V T j =150°C 1.08 1.22V r F chiplevelT j =25°C 3.4 4.2m ΩT j =150°C5.46.8m ΩI RRM I F =200A di/dt off =5910A/µs V GE =±15VV CC =1200VT j =150°C 272A Q rr T j=150°C63µC E rr T j =150°C 45mJ R th(j-c)per Diode0.276K/W Module L CE 15nH R CC'+EE'terminal-chip T C =25°C 0.55m ΩT C =125°C0.85m ΩR th(c-s)per module 0.020.038K/W M s to heat sink M635Nm M t to terminals M62.55Nm Nm w325gCharacteristics SymbolConditionsmin.typ.max.UnitSEMITRANS ® 3IGBT4 ModulesSKM200GAL17E4Features•IGBT4 = 4. generation medium fast trench IGBT (Infineon)•CAL4 = Soft switching 4. Generation CAL-Diode•Insulated copper baseplate using DBC Technology (Direct Copper Bonding) •With integrated Gate resistor•For switching frequenzies up to 8kHz •UL recognized, file no. E63532Typical Applications*•DC/DC – converter •Brake chopper•Switched reluctance motorRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°CThis is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.。
USER MANUALNI USB-7856R OEMR Series for USB Multifunction RIO with Kintex-7 160T FPGA Français Deutsch日本語한국어简体中文/manualsThis document provides dimensions, connectivity information, and pinouts for the National Instruments USB-7856R OEM device.Caution National Instruments makes no product safety, electromagneticcompatibility (EMC), or CE marking compliance claims for NI USB-7856R OEMdevice. The end-product supplier is responsible for conformity to any and allcompliance requirements.Caution Do not operate the NI USB-7856R OEM device in a manner notspecified in this user manual. Product misuse can result in a hazard. You cancompromise the safety protection built into the product if the product is damaged inany way. If the product is damaged, return it to National Instruments for repair.Hardware OverviewThe following high-level block diagram represents the NI USB-7856R OEM device.Figure 1. NI USB-7856R OEM Device Block DiagramUSBC O N N E C T O R 1C O N N E C T O R 2C O N N E C T O R 3C O N N E C T O R 02 | NI USB-7856R OEM User Manual | Parts LocatorB Connector2.Power Supply Connector3.Power Switch4.External LED Attachments5.Connector 0 (Analog)6.Connector 1 (Digital)7.Connector 2 (Digital)8.Connector 3 (Digital)NI USB-7856R OEM Device ComponentsThe following table lists the interfacing components on the NI USB-7856R OEM device and the component manufacturers.The following table lists and describes the I/O connectors on the NI USB-7856R OEM device. Refer to the connector manufacturer for information about using and matching these connectors.NI USB-7856R OEM User Manual | © National Instruments | 34 | NI USB-7856R OEM User Manual | Dimensions2X .175 (4.45)2X 2.863 (72.72)2X 6.055 (153.81)6.263 (159.08)2X 6.675 (169.55).119 (3.02).000 (0)2X 6.435 (163.46)3X .285 (7.24)3X 6.115 (155.32)6.400 (162.56)2.055 (52.19)3.797 (96.44)2X 5.838 (148.29).000 (0)0.285 (7.24)NI USB-7856R OEM User Manual | © National Instruments | 5Note Visit /dimensions for more information about the dimensions ofthe NI USB-7856R OEM device, including two-dimensional drawings and three-dimensional models.Note The NI USB-7856R OEM device has plated mounting holes that can act aschassis ground.Connecting the NI USB-7856R OEM DeviceThe NI USB-7856R OEM device provides connections for eight analog input (AI) channels, eight analog output (AO) channels, and forty-eight digital input/output (DIO) channels, as shown in Figure 2.6 | NI USB-7856R OEM User Manual | Figure 2. NI USB-7856R OEM Device PinoutAnalog InputThe NI USB-7856R OEM device provides connections for eight AI channels. Each channel has an AI+ pin, AI- pin, and AIGND pin to which you can connect both single-ended or differential voltage signals. Use the AISENSE pin to connect non-referenced single-ended signals.Connecting Single-Ended Voltage SignalsTo connect referenced single-ended voltage signals to the NI USB-7856R OEM device, you must connect the voltage ground signal to AI GND in order to keep the common-mode voltage in the specified range, as shown in Figure 3.Figure 3. Connecting Referenced Single-Ended Signals to the NI USB-7856R OEM DeviceV NI USB-7856R OEM User Manual | © National Instruments | 7To connect non-referenced single-ended voltage signals to the NI USB-7856R OEM device, you must connect the voltage ground signal to AI SENSE in order to keep the common-mode voltage in the specified range, as shown in Figure 4.Figure 4. Connecting Non-Referenced Single-Ended Signals to the NI USB-7856R OEM DeviceVConnecting Differential Voltage SignalsYou can connect grounded or floating differential signal sources to the NI USB-7856R OEM device. Connect the positive voltage signal to the AI+ and the negative voltage signal to AI-. To connect grounded differential signals to the NI USB-7856R OEM device, you must also connect the signal reference to AI GND.Figure 5. Connecting Grounded Differential Signals to the NI USB-7856R OEM DeviceVTo connect floating differential signals to the NI USB-7856R OEM device, you must connect the negative and positive signals to AI GND through 1 MΩ resistors to keep the voltage within the common-mode voltage range. If the voltage source is outside the common-mode voltage range, the NI USB-7856R OEM device does not read data accurately.8 | NI USB-7856R OEM User Manual | Figure 6. Connecting Floating Differential Signals to the NI USB-7856R OEM DeviceV Analog OutputThe NI USB-7856R OEM device provides connections for eight analog output channels. Each channel has an AO pin and AOGND pin to which you can connect a load.Figure 7. Connecting a LoadLOADDigital I/OThe NI USB-7856R OEM device provides connections for 48 digital input/output (DIO)channels. Connector 1, Connector 2, and Connector 3 contains 16 low-speed channels that can run up to 10 MHz signal frequencies. Each connector has selectable logic levels that you can configure as 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. You can configure each channel as input or output.NI USB-7856R OEM User Manual | © National Instruments | 9Figure 8. Connecting to the DIO Channels1.Low-speed signal frequencies up to 10 MHz with logic levels configured as 1.2 V, 1.5 V, 1.8 V,2.5 V, or3.3 V. Connectors 1 and 2 share the same voltage settings.2.LEDThe DIO channels connect to the FPGA through buffers, which have overvoltage and undervoltage protection as well as over current protection. Refer to theNI USB-7856R OEM device Specifications for more information about the maximum voltage and current.When the system powers on, the DIO channels are set as input low with pull-down resistors.To set another power-on state, you can configure the NI USB-7856R OEM device to load a VI when the system powers on. The VI can then set the DIO lines to any power-on state.National Instruments recommends performing signal integrity measurements to test the effect of signal routing with the cable and connection accessory for your application.LEDsIf you are putting the NI USB-7856R OEM device in an enclosure, you can either seat the optional lightpipes on the device or attach external LEDs, as described in the Attaching External LEDs section. When the lightpipes are attached, the top row is Error, USB Ready,and POWER LEDs, and the bottom row has the User LEDs.The NI USB-7856R OEM device has six LEDs which reflect the device state.10 | NI USB-7856R OEM User Manual | NI USB-7856R OEM User Manual | © National Instruments | 11Figure 10. Attaching External LEDsLEDExternalResistorPower SwitchUse the power switch to power the NI USB-7856R OEM device on and off. The following figure shows the pins on the power switch and power circuitry.Figure 11. Power Switch (Shown in the On Position)Device The following table lists the pin locations and signal descriptions.12 | NI USB-7856R OEM User Manual | +5 V Power SourceUse the +5 V terminals on the I/O connector supply +5 V referenced to DGND to power external circuitry.Caution Never connect the +5 V power terminals to analog or digital ground orany other voltage source on the NI USB-7856R OEM device or any other device.Doing so can damage the device and the computer. National Instruments is not liablefor damage resulting from such a connection.The power rating is 4.75 to 5.1 VDC at 0.5 A.Autonomous ModeYou can run the NI USB-7856R OEM device without a USB connection to a host computer using Autonomous Mode. To collect data the NI USB-7856R OEM device acquires in Autonomous Mode, you must reconnect the NI USB-7856R OEM device to a host computer.Caution Data is lost and is not recoverable upon reconnection if a DMA FIFOoverflows while the NI USB-7856R OEM device is disconnected from the hostcomputer or if the NI USB-7856R OEM device loses power at any point. Autonomous Mode includes the following capabilities.NI USB-7856R OEM User Manual | © National Instruments | 13Worldwide Support and ServicesThe National Instruments website is your complete resource for technical support. At / support you have access to everything from troubleshooting and application development self-help resources to email and phone assistance from NI Application Engineers.Visit /services for NI Factory Installation Services, repairs, extended warranty, and other services.Visit /register to register your National Instruments product. Product registration facilitates technical support and ensures that you receive important information updates from NI.National Instruments corporate headquarters is located at 11500 North Mopac Expressway, Austin, Texas, 78759-3504. National Instruments also has offices located around the world. For telephone support in the United States, create your service request at /support or 1The Host VI errors out if you do not call the Close FPGA VI Reference Function without aborting or resetting the FPGA VI.14 | NI USB-7856R OEM User Manual | dial 512 795 8248. For telephone support outside the United States, visit the Worldwide Offices section of /niglobal to access the branch office websites, which provide up-to-date contact information, support phone numbers, email addresses, and current events.NI USB-7856R OEM User Manual | © National Instruments | 15Refer to the NI Trademarks and Logo Guidelines at /trademarks for information on National Instruments trademarks. Other product and company names mentioned herein are trademarks or trade names of their respective companies. For patents covering National Instruments products/technology, refer to the appropriate location: Help»Patents in your software, the patents.txt file on your media, or the National Instruments Patent Notice at /patents. You can find information about end-user license agreements (EULAs) and third-party legal notices in the readme file for your NI product. Refer to the ExportCompliance Information at /legal/export-compliance for the National Instruments global trade compliance policy and how to obtain relevant HTS codes, ECCNs, and other import/export data.© 2013 National Instruments. All rights reserved.374230A-01Nov13。
金融企业会计-形考任务3（阶段性学习测验，权重25%）--00945国开-参考资料
请认真阅读一下说明然后下载：题库有可能会换，不保证全部都有！请仔细核对是不是您需要的题目再下载！！！！
本文档的说明：如果题目顺序和你的试卷不一样，按CTRL+F在题库中逐一搜索每一道题的答案，预祝您取得好成绩百！
第1题
中间业务是指不构成表内资产、表内负债，形成银行（）的业务。
A. 非利息收入
B. 主营业务收入
C. 利息收入
D. 营业外收入
参考答案是：非利息收入
第2题
金融理财所追求的第一层次的目标是（）。
A. 财务自由
B. 财务安全
C. 投资收益
D. 利息
参考答案是：财务安全
第3题
国库单一账户体系中的国库单一账户和预算外资金财政专户按（）账户管理。
A. 临时存款
B. 一般存款
C. 专用存款
D. 基本存款
参考答案是：专用存款
第4题
委托贷款收回的会计分录为（）。
A. 借：手续费收入贷：委托贷款
B. 借：委托贷款贷：吸收存款-
C. 借：吸收存款---活期存款--**借款人户贷：委托贷款--**委托贷款----**借款人户
D. 借：委托贷款贷：活期存款
参考答案是：借：吸收存款---活期存款--**借款人户贷：委托贷款--**委托贷款----**借款人户
第5题
代理国库集中支付业务是指商业银行作为办理国库集中支付业务的代理银行，按照与
（）签订的代理协议，根据支付指令，通过国库单一账户体系，办理财政资金的支付与清算，协助管理财政资金银行账户的行为。
A. 税务部门
B. 财政部门
C. 地方政府
D. 人民银行
参考答案是：财政部门
第6题
以下关于代理基金业务的基本规定表述正确的是（）。
A. 总行与各分行清算基金申购、赎回资金时不能采取全额清算方式。
B. 代理基金业务必须经商业银行法人代表授权，由总行与基金管理人签订相应的业务代理协议，确定代理业务种类、范围与手续费收入标准。
C. 基金投资人必须为中华人民共和国境内合法投资人（法律、法规及有关规定禁止购买者除外）。
D. 基金发行期间，投资人必须在发行期内办理认购手续，发行期结束后，营业网点立即停止接收认购申请。
在基金存续期内，投资人必须在规定的基金开放日内，提交基金交易申请。
参考答案是：基金投资人必须为中华人民共和国境内合法投资人（法律、法规及有关规定禁止购买者除外）。
, 代理基金业务必须经商业银行法人代表授权，由总行与基金管理人签订相应的业务代理协议，确定代理业务种类、范围与手续费收入标准。
, 基金发行期间，投资人必须在发行期内办理认购手续，发行期结束后，营业网点立即停止接收认购申请。
在基金存续期内，投资人必须在规定的基金开放日内，提交基金交易申请。
第7题
国库单一账户体系由一些专用账户构成，包括（）。
A. 预算单位在商业银行开设的预算单位零余额账户
B. 财政部门在中国人民银行开设的国库单一账户
C. 经政府批准或政府授权财政部门批准，为预算单位开设的特殊过渡性财政专户（简称特设专户）
D. 财政部门在商业银行开设的预算外资金专户
E. 财政部门在商业银行开设的财政零余额账户
参考答案是：财政部门在中国人民银行开设的国库单一账户, 财政部门在商业银行开设的财政零余额账户, 预算单位在商业银行开设的预算单位零余额账户, 财政部门在商业银行开设的预算外资金专户, 经政府批准或政府授权财政部门批准，为预算单位开设的特殊过渡性财政专户（简称特设专户）
第8题
理财业务按照理财结构的不同，分为（）。
A. 信用联结理财产品
B. 综合理财服务
C. 代理理财产品
D. 结构性理财产品
参考答案是：结构性理财产品, 代理理财产品, 信用联结理财产品
第9题
对公代理理财产品会计科目一般使用（）进行核算。
A. 存放中央银行款项
B. 代理单位理财投资
C. 代理对公理财基金
D. 系统内理财资金存放
参考答案是：代理单位理财投资, 代理对公理财基金, 存放中央银行款项, 系统内理财资金存放
第10题
衍生金融工具是从传统金融工具中派生出来的创新的金融工具。
衍生金融工具包括（）。
A. 权益工具。
