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W7MG21M32SVX90BNI中文资料

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W7MG1M32SVx-BN W7MG21M32SVx-BN

PRELIMINARY*

DESCRIPTION

The W7MG1M32SVx-BN and W7MG21M32SVx-BN are or g a n ized as one and two banks of 1Mx32 re s pec t ive l y. The modules are based on AMDs MirrorBit? AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mount e d on an FR4 sub s trate.Both modules offer access times between 70 and 120ns allowing for operation of high-speed mi c ro p ro c es s ors without wait states.

FEATURES

1Mx32 and 2x1Mx32 Densities

Based on AMD - AM29LV160M Flash Device Spansion? - S29AL016M (optional) High Performance

? Access time as fast as 70ns ? 0.7s typical sector erase time

3V for read, erase, and program operations Flexible, Sector Architecture

? One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors.

? Any combination of sectors can be erased ? Also supports full chip erase

8MB/4MB (2x1Mx32 / 1Mx32) MirrorBit? 3.0V, Boot Sector Flash Memory Module

FIG. 1 – BLOCK DIAGRAMS

Top boot block con? gurations

? Bottom boot block optional. Contact WEDC. Embedded Erase Algorithms

? Automatically preprograms and erases the chip or any combination of sectors Embedded Program Algorithms

? Automatically programs and veri? es data at speci? ed ad d ress

Data Polling and Toggle Bit feature for detection of

pro g ram or erase cycle completion Low Power Dissipation

? 30mA per Device Active Current

? 10μA per Device CMOS Standby Current Single 3.3V ±10% Supply

CMOS and TTL Compatible Inputs and Outputs Commercial and industrial operating temperature

range

? BNC = 0°C to 70°C Commercial ? BNI = -40°C to 85°C Industrial Package

? 80 Pin SIMM (JEDEC) Standard

* T his product is under development, is not quali? ed or characterized and is subject to change without notice.

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY.

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY FIGURE 3 – W7MG1M32SVxxxBNX & W7MG21M32SVxxxBNX PIN CONFIGURATION

Pin Symbol Pin Symbol Pin Symbol Pin Symbol

1GND21CE341A1161DQ9

2V CC22CE242A1062DQ8

3NC23CE143A963DQ7

4OE#24CE044A864DQ6

5WE0#25GND45A765DQ5

6NC26DQ2946A666DQ4

7NC*27DQ3047A567DQ3

8DQ1628DQ3148A468DQ2

9DQ1729WE2#49A369DQ1

10DQ1830NC50A270DQ0

11DQ1931NC51A171NC

12DQ2032NC52A072V CC

13DQ2133A1953NC73PD1

14DQ2234A1854GND74PD2

15DQ2335A1755DQ1575PD3

16DQ2436A1656DQ1476PD4

17DQ2537A1557DQ1377PD5

18DQ2638A1458DQ1278PD6

19DQ2739A1359DQ1179PD7

20DQ2840A1260DQ1080GND Notes:

Unless otherwise speci? ed.

1. P opulation Con? guration for 1M x 32 Version

Part Number Con?guration Component W7MG1M32SVxxxBNX 1M x 32 1M x 8

2. P opulation Con? guration for 2 x 1M x 32 Version

Part Number Con?guration Component W7MG21M32SVxxxBNX 2 x 1M x 32 1M x 8

xx = Speed: 70, 90, 120ns

X = Temerature Range

Please refer to part number matrix pg. 8 or 9

NC* = P in 7 can offer custom module options. For optional "Reset" or "Ready Busy." Contact WEDC.

PIN NAMES

A0 - A19Address DQ0 - DQ31Data Input/Output CE1#, CE2#Chip Enable WE0#, WE2#Write Enable OE#Output Enable

V CC Power Supply

NC No Connection

PD Presence Detect

GND Ground

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY

PRESENCE DETECT TRUTH TABLE

Module Organization PD1PD2PD3PD4 1M x 321010

2 x 1M x 320100

MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN

Speed PD5PD6PD7

70 ns001

90 ns110

120 ns010

LEGEND: 0 = Connected to GND

1 = Open circuit (no connection)

CAPACITANCE

f = 1.0MH Z, V IN = V CC or V SS

Parameter Symbol 1Meg2x1Meg

Unit Max Max

Address Lines CA3570pF Data lines CDQ1530pF Chip & Write Enable Lines CC1530pF Output Enable lines CG3570pF

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY

Storage Temperature

Plastic Packages .................................–65°C to +150°C Ambient Temperature

with Power Applied ...............................–65°C to +125°C Voltage with Respect to Ground

V CC (Note 1) ......................................–0.5 V to +4.0 V A9, OE#, and RESET# (Note 2) ......–0.5 V to +12.5 V All other pins (Note 1) ..................–0.5 V to V CC+0.5 V Output Short Circuit Current (Note 3) .................200 mA ABSOLUTE MAXIMUM RATINGS

Notes:

1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions,

input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See

Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20

ns. See Figure 8.

2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During

voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for

periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is

+12.5 V which may overshoot to 14.0 V for periods up to 20 ns.

3. No more than one output may be shorted to ground at a time. Duration of the

short circuit should not be greater than one second.

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.OPERATING RANGES

Commercial (C) Devices

Ambient Temperature (TA) ........................0°C to +70°C Industrial (I) Devices

Ambient Temperature (TA) ....................–40°C to +85°C V CC Supply Voltages

V CC for all devices ....................................2.7 V to 3.6 V Operating ranges de? ne those limits between which the functionality of the device is guaranteed.

White Electronic Designs

W7MG1M32SVx-BN W7MG21M32SVx-BN

PRELIMINARY

ORDERING IN F OR M A T ION FOR W7MG1M32SVx

PACKAGE NO. 346: 80 PIN SIMM (JEDEC)

COMMERCIAL

Part Num ber

Speed (ns)

Pack age T A Commercial Range

Height*W7MG1M32SVx70BNC 703460°C to +70°C 21.59 (0.850")W7MG1M32SVx90BNC 903460°C to +70°C 21.59 (0.850")W7MG1M32SVx120BNC

120

346

0°C to +70°C

21.59 (0.850")

INDUSTRIAL

Part Num ber

Speed (ns)

Pack age T A Industrial Range Height*W7MG1M32SVx70BNI 70346-40°C to +85°C 21.59 (0.850")W7MG1M32SVx90BNI 90346-40°C to +85°C 21.59 (0.850")W7MG1M32SVx120BNI

120

346

-40°C to +85°C

21.59 (0.850")

* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)

White Electronic Designs

W7MG1M32SVx-BN W7MG21M32SVx-BN

PRELIMINARY

ORDERING IN F OR M A T ION FOR W7MG21M32SVx

PACKAGE NO. 361: 80 PIN SIMM (JEDEC)

COMMERCIAL

Part Num ber

Speed (ns)

Pack age T A Commercial Range

Height*W7MG21M32SVx70BNC 703610°C to +70°C 21.59 (0.850")W7MG21M32SVx90BNC 903610°C to +70°C 21.59 (0.850")W7MG21M32SVx120BNC

120

361

0°C to +70°C

21.59 (0.850")

INDUSTRIAL

Part Num ber

Speed (ns)

Pack age T A Industrial Range Height*W7MG21M32SVx70BNI 70361-40°C to +85°C 21.59 (0.850")W7MG21M32SVx90BNI 90361-40°C to +85°C 21.59 (0.850")W7MG21M32SVx120BNI

120

361

-40°C to +85°C

21.59 (0.850")

* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY

FLASH PART NUMBER MATRIX

W 7 M G 1M 32 S V X XX BN X

White Electronics Design

Flash

MirrorBit?

FR4 with gold contacts

Module Address depth: 1M

Module Bus width: x32

Component width: x16

Voltage: 3.3V

T = Top / B = Bottom Boot Block

Speed: 70, 90, 120

Package: 80 Pin SIMM

Temperature range:

C = 0?C to 70?C Commercial

I = -40?C to 85?C Industrial

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY

FLASH PART NUMBER MATRIX

W 7 M G 2 1M 32 S V X XX BN X

White Electronics Design

Flash

MirrorBit?

FR4 with gold contacts

Bank

Module Address depth: 1M

Module Bus width: x32

Component width: x16

Voltage: 3.3V

T = Top / B = Bottom Boot Block

Speed: 70, 90, 120

Package: 80 Pin SIMM

Temperature range:

C = 0?C to 70?C Commercial

I = -40?C to 85?C Industrial

White Electronic Designs W7MG1M32SVx-BN

W7MG21M32SVx-BN

PRELIMINARY

Document Title

8MB/4MB (2x1Mx32 / 1Mx32) CMOS, MirrorBit? 3.0V, Boot Sector Flash Memory

Revision History

Rev #History Release Date Status

Rev 0Created5-04Advanced Rev 1Added T/B (top or bottom boot block option)6-04Advanced Rev. 2Changed status from advanced to preliminary6-04Preliminary

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