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TGA1073A中文资料

TGA1073A中文资料
TGA1073A中文资料

26- 34 GHz Medium Power Amplifier TGA1073A-SCC

SYMBOL

V+POSITIVE SUPPLY VOLTAGE

I+POSITIVE SUPPLY CURRENT

P IN INPUT CONTINUOUS WAVE POWER

P D POWER DISSIPATION

T CH OPERATING CHANNEL TEMPERATURE T M MOUNTING TEMPERATURE

NOTE TEST 1/SMALL-SIGNAL

GAIN MAGNITUDE

TGA1073A - RF Probe Data Summary - S parameters and P1dB

s11

Chip Assembly and Bonding Diagram

Reflow process assembly notes:

?=AuSn (80/20) solder with limited exposure to temperatures at or above 300

?=alloy station or conveyor furnace with reducing atmosphere

?=no fluxes should be utilized

?=coefficient of thermal expansion matching is critical for long-term reliability

?=storage in dry nitrogen atmosphere

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