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RU30L15H

RU30L15H
RU30L15H

RU30L15H

P-Channel Advanced Power MOSFET

MOSFET Features Pin Description

Applications

Symbol Parameter Rating Unit Common Ratings(T A=25°C Unless Otherwise Noted)

V DSS Drain-Source Voltage-30

V GSS Gate-Source Voltage±20

V T J Maximum Junction Temperature150°C

T STG Storage Temperature Range-55 to 150°C

I S Diode Continuous Forward Current T C=25°C-14.5A Mounted on Large Heat Sink

I DP300μs Pulse Drain Current Tested T

C

=25°C-58①A

T C=25°C-14.5

I D Continuous Drain Current

T C=70°C-11

A

T C=25°C 3.1

P D Maximum Power Dissipation

T C=70°C 2.0

W RθJA

②Thermal Resistance-Junction to Ambient40°C/W ?-30V/-14.5A,

R DS (ON)=13m? (Type)@V GS=-10V

R DS (ON)=22m? (Type)@V GS=-4.5V

?Super High Dense Cell Design

?Reliable and Rugged

?ESD Protected

?Lead Free and Green Available

?Load Switching.

?PWM Applications.

Absolute Maximum Ratings

SOP-8

P-Channel MOSFET

Electrical Characteristics

(T A =25°C Unless Otherwise Noted)

RU30L15H Symbol

Parameter Test Condition Min.

Typ.

Max.

Unit

Static Characteristics BV DSS Drain-Source Breakdown Voltage V GS =0V, I DS =-250μA -30

V V DS =-30V, V GS =0V

-1I DSS Zero Gate Voltage Drain Current T J =85°C

-30

μA V GS(th)Gate Threshold Voltage V DS =V GS , I DS =-250μA -1

-1.8

-2.5V I GSS Gate Leakage Current

V GS =±20V, V DS =0V ±10

μA V GS =-10V, I DS =-14A 1315m ?R DS(ON)

Drain-Source On-state Resistance

V GS =-4.5V, I DS =-10A

22

28

m ?

Notes:

Pulse width limited by safe operating area.

②When mounted on 1 inch square copper board, t ≤10sec. The value in any given application depends on the user's specific board design.

③Pulse test ;Pulse width ≤300μs, duty cycle ≤2%.

④Guaranteed by design, not subject to production testing.

Diode Characteristics V SD

Diode Forward Voltage I SD =-1A, V GS =0V

-1V t rr Reverse Recovery Time 30ns Q rr

Reverse Recovery Charge

I SD =-14A, dl SD /dt=100A/μs

24

nC Dynamic Characteristics

R G Gate Resistance

V GS =0V,V DS =0V,F=1MHz 1.5?C iss Input Capacitance 2300C oss Output Capacitance

250C rss Reverse Transfer Capacitance V GS =0V,V DS =-15V,

Frequency=1.0MHz

160pF

t d(ON)Turn-on Delay Time 12

t r Turn-on Rise Time 20t d(OFF)Turn-off Delay Time 38t f

Turn-off Fall Time

V DD =-15V, R L =30?,I DS =-14A, V GEN =-10V,R G =6?

18

ns

Gate Charge Characteristics

Q g Total Gate Charge 3950

Q gs Gate-Source Charge 8Q gd

Gate-Drain Charge

V DS =-24V, V GS =10V,

I DS =-14A

12

nC

Typical Characteristics

Power Dissipation Drain Current

P t

o

t

-

P

o

w

e

r

(

W

)

-

I

D

-

D

r

a

i

n

C

u

r

r

e

n

t

(

A

)

T j- Junction Temperature(°C)T j- Junction Temperature(°C) Safe Operation Area Thermal Transient Impedance

-

I

D

-

D

r

a

i

n

C

u

r

r

e

n

t

(

A

)

N

o

r

m

a

l

i

z

e

d

E

f

f

e

c

t

i

v

e

T

r

a

n

s

i

e

n

t

-V DS- Drain-Source Voltage(V)Square Wave Pulse Duration(sec)

Typical Characteristics

Output Characteristics

Drain-Source On Resistance

-I D - D r a i n C u r r e n t (A )

R D S (O N )- O n R e s i s t a n c e (m Ω)

-V DS - Drain-Source Voltage (V)

-I D -Drain Current (A)

Drain-Source On Resistance Gate Threshold Voltage

R D S (O N )- O n - R e s i s t a n c e (m )

N o r m a l i z e d T h r e s h o l d V o l t a g e

-V GS -Gate-Source Voltage (V)

T j - Junction Temperature (°C)

Typical Characteristics

Drain-Source On Resistance

Source-Drain Diode Forward

N o r m a l i z e d O n R e s i s t a n c e

-I S - S o u r c e C u r r e n t (A )

T j - Junction Temperature (°C)

-V SD - Source-Drain Voltage (V)

Capacitance

Gate Charge

C - C a p a c i t a n c e (p F )

-V G S - G a t e -S o u r c e V o l t a g e (V )

-V DS - Drain-Source Voltage (V)

Q G - Gate Charge (nC)

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

Ordering and Marking Information

RU30L15

Package (Available)

H :SOP-8

Operating Temperature Range

C :-55 to 150 oC

Assembly Material

G : Green & Lead Free

Packaging

T : TUBE

TR : Tape & Reel

Package Information

SOP-8

ALL DIMENSIONS REFER TO JEDEC STANDARD DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS

MM INCH

MM INCH SYMBOL

MIN MAX MIN

MAX SYMBOL

MIN MAX MIN MAX A 1.350 1.7500.0530.069E 3.800 4.0000.1500.157A10.1000.2500.0040.010E1 5.800 6.2000.2280.244A2 1.350 1.5500.0530.061e 1.270 (BSC)0.050 (BSC)

b 0.3300.5100.0130.020L 0.400 1.2700.0160.050

c 0.1700.2500.0060.010θ

D

4.700

5.100

0.185

0.200

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