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热固性树脂基复合材料结构电阻焊接研究

热固性树脂基复合材料结构电阻焊接研究

作者:刘洪波, 谢磊, 段玉岗, 李涤尘, LIU Hong-bo, XIE Lei, DUAN Yu-gang, LI Di-chen

作者单位:西安交通大学机械制造系统工程国家重点实验室,西安,710054

刊名:

玻璃钢/复合材料

英文刊名:Fiber Reinforced Plastics/Composites

年,卷(期):2015(10)

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引用本文格式:刘洪波.谢磊.段玉岗.李涤尘.LIU Hong-bo.XIE Lei.DUAN Yu-gang.LI Di-chen热固性树脂基复合材料结构电阻焊接研究[期刊论文]-玻璃钢/复合材料 2015(10)

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