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STV60NE06-16中文资料

STV60NE06-16

N -CHANNEL 60V -0.013?-60A PowerSO-10

STripFET ?POWER MOSFET

PRELIMINARY DATA

s TYPICAL R DS(on)=0.013?

s EXCEPTIONAL dv/dt CAPABILITY s 100%AVALANCHE TESTED s LOW GATE CHARGE 100o C s

APPLICATION ORIENTED CHARACTERIZATION

DESCRIPTION

This Power Mosfet is the latest development of STMicroelectronics unique ”Single Feature Size ?”strip-based process.The resulting transistor shows extremely high packing density for low on-resistance,rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.

APPLICATIONS

s HIGH CURRENT,HIGH SPEED SWITCHING s SOLENOID AND RELAY DRIVERS

s MOTOR CONTROL,AUDIO AMPLIFIERS s DC-DC &DC-AC CONVERTERS

s AUTOMOTIVE ENVIRONMENT (INJECTION,ABS,AIR-BAG,LAMPDRIVERS,Etc.)

?

INTERNAL SCHEMATIC DIAGRAM

May 2000

1

10

PowerSO-10

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter

Value Unit V DS Drain-source Voltage (V GS =0)60V V DGR Drain-gate Voltage (R GS =20k ?)60V V GS Gate-source Voltage

±20V I D Drain Current (continuous)at T c =25o C 60A I D Drain Current (continuous)at T c =100o C 42A I DM (?)Drain Current (pulsed)

240A P tot Total Dissipation at T c =25o C 150W Derating Factor

1W/o C dv/dt Peak Diode Recovery voltage slope 6V/ns

T s tg Storage Temperature

-65to 175

o C T j

Max.Operating Junction Temperature

175

o

C (?)Pulse width limited by safe operating area

(1)I SD ≤60A,di/dt ≤300A/μs,V DD ≤V (BR)DSS ,T j ≤T JMAX

TYPE V DSS R DS(on)I D STV60NE06-16

60V

<0.016?

60A

1/6

THERMAL DATA

R thj-case Rthj-amb R thc-sink

T l Thermal Resistance Junction-case Max

Thermal Resistance Junction-ambient Max

Thermal Resistance Case-sink Typ

Maximum Lead Temperature For Soldering Purpose

1

62.5

0.5

300

o C/W

oC/W

o C/W

o C

AVALANCHE CHARACTERISTICS

Symbol Parameter Max Value Unit

I AR Avalanche Current,Repetitive or Not-Repetitive

(pulse width limited by T j max,δ <1%)

60A

E AS Single Pulse Avalanche Energy

(starting T j=25o C,I D=I AR,V DD=25V)

350mJ

ELECTRICAL CHARACTERISTICS(T J=-40to150o C unless otherwise specified)

OFF

Symbol Parameter Test Conditions Min.Typ.Max.Unit V(BR)DSS Drain-source

Breakdown Voltage

I D=250μA V GS=060V

I DSS Zero Gate Voltage

Drain Current(V GS=0)V DS=Max Rating

V DS=Max Rating T c=125o C

1

10

μA

μA

I GSS Gate-body Leakage

Current(V DS=0)

V GS=±20V±100nA ON(?)

Symbol Parameter Test Conditions Min.Typ.Max.Unit V GS(th)Gate Threshold Voltage V DS=V GS I D=250μA234V R DS(on)Static Drain-source On

Resistance

V GS=10V I D=40A0.0130.016?

I D(o n)On State Drain Current V DS>I D(o n)x R DS(on)ma x

V GS=10V

60A DYNAMIC

Symbol Parameter Test Conditions Min.Typ.Max.Unit

g f s(?)Forward

Transconductance

V DS>I D(o n)x R DS(on)ma x I D=30A2035S

C iss C os s C rss Input Capacitance

Output Capacitance

Reverse Transfer

Capacitance

V DS=25V f=1MHz V GS=04600

580

140

pF

pF

pF

STV60NE06-16 2/6

ELECTRICAL CHARACTERISTICS(continued)

SWITCHING ON

Symbol Parameter Test Conditions Min.Typ.Max.Unit

t d(on) t r Turn-on Time

Rise Time

V DD=30V I D=30A

R G=4.7?V GS=10V

(see test circuit,figure3)

40

125

60

180

ns

ns

Q g Q gs Q gd Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

V DD=48V I D=60A V GS=10V115

25

40

160nC

nC

nC

SWITCHING OFF

Symbol Parameter Test Conditions Min.Typ.Max.Unit

t r(Voff) t f t c Off-voltage Rise Time

Fall Time

Cross-over Time

V DD=48V I D=60A

R G=4.7 ?V GS=10V

(see test circuit,figure5)

15

150

180

25

210

260

ns

ns

ns

SOURCE DRAIN DIODE

Symbol Parameter Test Conditions Min.Typ.Max.Unit

I SD I SDM(?)Source-drain Current

Source-drain Current

(pulsed)

60

320

A

A

V SD(?)Forward On Voltage I SD=60A V GS=0 1.5V

t rr Q rr I RRM Reverse Recovery

Time

Reverse Recovery

Charge

Reverse Recovery

Current

I SD=60A di/dt=100A/μs

V DD=30V T j=150o C

(see test circuit,figure5)

100

0.4

8

ns

μC

A

(?)Pulsed:Pulse duration=300μs,duty cycle1.5%

(?)Pulse width limited by safe operating area

STV60NE06-16

3/6

Fig.1:Unclamped Inductive Load Test Circuit Fig.3:Switching Times Test Circuits For Resistive Load Fig.2:Unclamped Inductive Waveform Fig.4:Gate Charge test Circuit

Fig.5:Test Circuit For Inductive Load Switching And Diode Recovery Times

STV60NE06-16

4/6

DIM.mm

inch MIN.TYP.

MAX.MIN.TYP.

MAX.A 3.35 3.650.1320.144A10.000.100.0000.004B 0.400.600.0160.024c 0.350.550.0130.022D 9.409.600.3700.378D17.407.600.2910.300E 9.309.500.3660.374E17.207.400.2830.291E27.207.600.2830.300E3 6.10 6.350.2400.250E4 5.90

6.10

0.232

0.240

e 1.27

0.050

F 1.25 1.350.0490.053H 13.80

14.40

0.543

0.567

h 0.50

0.002

L 1.20

1.80

0.047

0.071

q 1.70

0.067

α

0o 8o

DETAIL ”A”

PLANE

SEATING

α

L

A1F A1

h

A

D

D1====

=

=

E4

0.10A E1

E3C

Q

A

=

=

B

B

DETAIL ”A”

SEA TING PLANE

==

=

=

E26

10

5

1

e

B

H E M

0.25

=

=

==0068039-C

PowerSO-10MECHANICAL DATA

STV60NE06-16

5/6

STV60NE06-16

Information furnished is believed to be accurate and reliable.However,STMicroelectronics assumes no responsibility for the consequence s of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics.Specification mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a trademark of STMicroelectronics

?2000STMicroelectronics–Printed in Italy–All Rights Reserved

STMicroelectronics GROUP OF COMPANIES

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