GENERAL FINITE ELEMENT SOFTWARE EXAMPLE SOLUTIONS
a) Automotive System Analysis
b) Wagon System Analysis
Analysis
System
c)
Aircraft
d) Other Mechanical Systems Analysis
e) Large Strain Analysis
f) Fluid-Structure Interaction
g) Dam Analysis
Analysis
h) Semiconductor
i) Numerical Simulation of Single Crystal Growth
j) Rod Growth During Solid Freeform Fabrication
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a) Automotive System Analysis
Car body FE model (shells and beams)
Car body (beams) and windshield (shells) model
Bending of the car body (experimental and FEM analysis)
Nonlinear static and dynamic structural analysis of car body
Impact into the door panel (elastic-plastic buckling analysis)
Analysis of internally acting brake (contact problem)
Analysis of Hertz contact problem for roller bearing
Heat transfer and thermal stress analysis of piston
b) Wagon System Analysis
Static structural analysis of wagon-cistern (experimental and FEM analysis)
Wagon-chassis frame member with field of effective stress
Modal analysis of wagon bogie frame (first eigen mode)
Dynamic structural analysis of wagon bogie frame with life prediction (experimental and FEM analysis)
c) Aircraft System Analysis
Lever of lending gear (Static and Dynamic structural analysis)
Fixed part of lending gear (Static and Dynamic structural analysis)
d) Other Mechanical Systems Analysis
Thermo-elasto-plastic analysis and life prediction of steam boiler
Thermo-elasto-plastic and creep analysis of outer wall of nuclear reactor
Modal analysis of rotational excavation (second eigen mode)
Dynamic analysis of rotational excavation (experimental and FEM analysis)
A part supporting structure of bridge under torsion
(experimental and FEM post-buckling elastic-plastic analysis)
A part supporting structure of bridge under bending (elastic-plastic analysis)
e) Large Strain Analysis
Necking of rectangular bar
Necking of circular bar
f) Fluid-Structure Interaction
Distribution of pressure field in a collapsed tube
Distribution of stress field on a collapsed tube
g) Dam Analysis
Nonlinear analysis of joint behaviour under thermal and hydrostatic loads for an arch dam
Computed head distribution of dam (underground seepage)
h) Semiconductor Analysis
Oxide
Wafer
Tensile strain exx beneath a 2.5 μm wide stripe window
Oxide
Wafer
Tensile strain exx beneath a 20 μm wide stripe window
Tensile stress σxx beneath a 20 μm wide stripe window at depth 1, 2 and 4 μm
Tensile stress σyy beneath a 20 μm wide stripe window at depth 1, 2 and 4 μm
i) Numerical Simulation of Single Crystal Growth
Auxiliary heater
Melt
Submerged heater
GaAs
Alumina
Silica
Temperature field in the hot zone (without the guarding heater)
Auxiliary heater
Melt
Submerged heater
Guarding heater
GaAs
Alumina
Silica
Temperature field in the hot zone (with the guarding heater)
j) Analysis of Rod Growth During Solid Freeform Fabrication
Deposit
Substrate
Transient Simulation, Time Step Two
Deposit
Substrate
Transient Simulation, Time Step Four