FEATURES
D, NS, OR PW PACKAGE
(TOP VIEW)RGY PACKAGE (TOP VIEW)1A 1Y G 2Y 2A 2B 3G N C C B DESCRIPTION/ORDERING INFORMATION
AM26LV32E
https://www.doczj.com/doc/5e8406907.html, ...............................................................................................................................................................SLLS849A–APRIL 2008–REVISED MAY 2008
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE RECEIVER
WITH ±15-kV IEC ESD PROTECTION
?Meets or Exceeds Standard TIA/EIA-422-B and
ITU Recommendation V.11
?Operates From a Single 3.3-V Power Supply
?ESD Protection for RS422Bus Pins
–±15-kV Human-Body Model (HBM)
–±8-kV IEC61000-4-2,Contact Discharge
–±15-kV IEC61000-4-2,Air-Gap Discharge
?Switching Rates up to 32MHz
?Low Power Dissipation:27mW Typ
?Open-Circuit,Short-Circuit,and Terminated
Fail-Safe
?±7-V Common-Mode Input Voltage Range With
±200-mV Sensitivity
?Accepts 5-V Logic Inputs With 3.3-V Supply
(Enable Inputs)
?Input Hysteresis:35mV Typ
?Pin-to-Pin Compatible With AM26C32,
AM26LS32
?I off Supports Partial-Power-Down Mode
Operation
?Package Options:SOP,SOIC,TSSOP,QFN The AM26LV32E consists of quadruple differential line receivers with 3-state outputs.These differential receivers have ±15-kV ESD (HBM and IEC61000-4-2,Air-Gap Discharge)and ±8-kV ESD (IEC61000-4-2,Contact Discharge)protection for RS422bus pins.
This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11drivers with reduced supply voltage.The device is optimized for balanced bus transmission at switching rates up to 32MHz.The 3-state outputs permit connection directly to a bus-organized system.
The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage signal at the receiver outputs.In the open fail-safe,shorted fail-safe,and terminated fail-safe,a high state is produced at the respective output.
This device is supported for partial-power-down applications using I off .I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
The AM26LV32EI is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
4Y
3Y 2Y 1Y
4B 4A 3B 3A 2B 2A 1B 1A G
G AM26LV32E SLLS849A–APRIL 2008–REVISED MAY https://www.doczj.com/doc/5e8406907.html,
ORDERING INFORMATION
T A
PACKAGE (1)(2)ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC –D
Tape and reel AM26LV32EIDR AM26LV32EI SOP –NS
Tape and reel AM26LV32EINSR 26LV32EI –40°C to 85°C TSSOP –PW
Tape and reel AM26LV32EIPWR SB32QFN –RGY
Tape and reel AM26LV32EIRGYR SB32(1)
Package drawings,thermal data,and symbolization are available at https://www.doczj.com/doc/5e8406907.html,/packaging .(2)For the most current package and ordering information,see the at the end of this document,or see the TI
website at https://www.doczj.com/doc/5e8406907.html, .
FUNCTION TABLE (1)
(each receiver)
ENABLES DIFFERENTIAL
OUTPUT INPUT
G G H X H V ID ≥0.2V
X L H H X ?–0.2V X L ?H X L V ID ≤–0.2V X L L H X H Open,shorted,or terminated X L H X L H Z (1)H =high level,L =low level,X =irrelevant, Z =high impedance (off),?=indeterminate LOGIC DIAGRAM (POSITIVE LOGIC) ABSOLUTE MAXIMUM RATINGS (1)(2)AM26LV32E https://www.doczj.com/doc/5e8406907.html, ...............................................................................................................................................................SLLS849A–APRIL 2008–REVISED MAY 2008 SCHEMATIC All resistor values are nominal. over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (3)–0.56V A or B inputs –1414V V I Input voltage range Enable Inputs –0.56V V ID Differential input voltage (4)–1414V V O Output voltage range –0.56V I IK Input clamp current range V I <0–20mA I OK Output clamp current range V O <0–20mA l O Maximum output current ±20mA T J Operating virtual junction temperature 150°C D package 73NS package 64θJA Package thermal impedance (5)(6)°C/W PW package 108RGY package 39T A Operating free-air temperature range –4085°C T stg Storage temperature range –65150°C (1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) This device is designed to meet TIA/EIA-422-B and ITU.(3) All voltage values except differential input voltage are with respect to the network GND.(4) Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input.(5) Maximum power dissipation is a function of T J(max),θJA ,and T A .The maximum allowable power dissipation at any allowable ambient temperature is P D =(T J(max)–T A )/θJA .Selecting the maximum of 150°C can affect reliability. (6)The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS AM26LV32E SLLS849A–APRIL 2008–REVISED MAY https://www.doczj.com/doc/5e8406907.html, MIN NOM MAX UNIT V CC Supply voltage 3 3.3 3.6V V IH Enable high-level input voltage 2 5.5V V IL Enable low-level input voltage 00.8V V IC Common-mode input voltage –77mA V ID Differential input voltage –77mA I OH High-level output current –5mA I OL Low-level output current 5mA T A Operating free-air temperature –4085°C over recommended ranges of common-mode input,supply voltage,and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1)MAX UNIT Positive-going input threshold voltage,V IT+ 0.2V differential input Negative-going input threshold voltage,V IT– –0.2V differential input V hys Input hysteresis (V IT+–V IT–)35mV V IK Input clamp voltage,G and G I I =–18mA –1.5V V ID =200mV,I OH =–5mA 2.4 3.2V OH High-level output voltage V V CC –V ID =200mV,I OH =–100μA 0.1V ID =–200mV,I OL =5mA 0.170.5V OL Low-level output voltage V V ID =–200mV,I OL =100μA 0.1I OZ High-impedance state output current V O =V CC or GND ±50μA I off Output current with power off V CC =0V,V O =0or 5.5V ±100μA V I =10V 1.5I I Line input current Other input at 0V mA V I =–10V –2.5I I Enable input current,G and G V I =V CC or GND ±1μA r i Input resistance V IC =–7V to 7V,Other input at 0V 417k ?I CC Supply current (total package)G,G =V CC or GND,No load,Line inputs open 817mA C pd Power dissipation capacitance (2)One channel 150pF (1) All typical values are at V CC =3.3V,T A =25°C. (2)C pd determines the no-load dynamic current consumption:I S =C pd ×V CC ×f +I CC SWITCHING CHARACTERISTICS ESD PROTECTION AM26LV32E https://www.doczj.com/doc/5e8406907.html,...............................................................................................................................................................SLLS849A–APRIL2008–REVISED MAY2008 over recommended operating free-air temperature range(unless otherwise noted) (1)All typical values are at V CC=3.3V,T A=25°C. (2)t sk(p)is|t pLH–t pHL|of each channel of same device. (3)t sk(o)is the maximum difference in propagation delay times between any two channels of same device switching in the same direction. (4)t sk(pp)is the maximum difference in propagation delay times between any two channels of any two devices switching in the same direction. PARAMETER TEST CONDITIONS TYP UNIT HBM±15 Receiver input IEC61000-4-2,Air-Gap Discharge±15kV IEC61000-4-2,Contact Discharge±8 PARAMETER MEASUREMENT INFORMATION C L = 15 pF (see Note A)A B Input Output 2V 1V V OH V OL O Input V OH V off ≈00V V CC Output = 15 pF V O V AM26LV32E SLLS849A–APRIL 2008–REVISED MAY https://www.doczj.com/doc/5e8406907.html, A. C L includes probe and jig capacitance.B. The input pulse is supplied by a generator having the following characteristics:PRR =10MHz,duty cycle =50%,t r =t f ≤2ns.C.To test the active-low enable G,ground G and apply an inverted waveform G. Figure 1.Test Circuit and Voltage Waveforms,t PLH and t PHL A. C L includes probe and jig capacitance.B. The input pulse is supplied by a generator having the following characteristics:PRR =10MHz,duty cycle =50%,t r =t f ≤2ns.C.To test the active-low enable G,ground G and apply an inverted waveform G. Figure 2.Test Circuit and Voltage Waveforms,t PZH and t PHZ Input V OL 0V V CC Output V CC V off ≈V CC V O V AM26LV32E https://www.doczj.com/doc/5e8406907.html, ...............................................................................................................................................................SLLS849A–APRIL 2008–REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) A. C L includes probe and jig capacitance.B. The input pulse is supplied by a generator having the following characteristics:PRR =10MHz,duty cycle =50%,t r =t f ≤2ns.C.To test the active-low enable G,ground G and apply an inverted waveform G. Figure 3.Test Circuit and Voltage Waveforms,t PZL and t PLZ PACKAGING INFORMATION Orderable Device Status(1)Package Type Package Drawing Pins Package Qty Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3) AM26LV32EIDR ACTIVE SOIC D162500Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIDRG4ACTIVE SOIC D162500Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EINSR ACTIVE SO NS162000Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EINSRG4ACTIVE SO NS162000Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIPWR ACTIVE TSSOP PW162000Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIPWRG4ACTIVE TSSOP PW162000Green(RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIRGYR ACTIVE VQFN RGY163000Green(RoHS& no Sb/Br) CU NIPDAU Level-2-260C-1YEAR AM26LV32EIRGYRG4ACTIVE VQFN RGY163000Green(RoHS& no Sb/Br) CU NIPDAU Level-2-260C-1YEAR (1)The marketing status values are defined as follows: ACTIVE:Product device recommended for new designs. LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect. NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design. PREVIEW:Device has been announced but is not in production.Samples may or may not be available. OBSOLETE:TI has discontinued the production of the device. (2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check https://www.doczj.com/doc/5e8406907.html,/productcontent for the latest availability information and additional product content details. TBD:The Pb-Free/Green conversion plan has not been defined. Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above. Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material) (3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature. 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OTHER QUALIFIED VERSIONS OF AM26LV32E: ?Enhanced Product:AM26LV32E-EP NOTE:Qualified Version Definitions: ?Enhanced Product-Supports Defense,Aerospace and Medical Applications TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant AM26LV32EIDR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1AM26LV32EINSR SO NS 162000330.016.48.210.5 2.512.016.0Q1AM26LV32EIPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1AM26LV32EIRGYR VQFN RGY 163000 330.012.4 3.8 4.3 1.58.012.0Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) AM26LV32EIDR SOIC D162500346.0346.033.0 AM26LV32EINSR SO NS162000346.0346.033.0 AM26LV32EIPWR TSSOP PW162000346.0346.029.0 AM26LV32EIRGYR VQFN RGY163000346.0346.029.0 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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